System for taking out molded object, and method for taking out molded object

Abstract

The present invention provides a technology for removing a molded object from a molding die by using a vacuum generating device that supplies adsorption pressure by driving compressed air, which can suppress the generation of noise and obtain a larger adsorption pressure. The system for removing the molded object has an adsorption device, a first vacuum generating device, and a second vacuum generating device, wherein the adsorption device keeps the molded object adsorbed by adsorption pressure; the first vacuum generating device supplies the first adsorption pressure to the adsorption device by driving compressed air; the second vacuum generating device supplies the second adsorption pressure to the adsorption device by driving a motor, wherein the second adsorption pressure is supplied to the adsorption device at a specified timing during the period of supplying the first adsorption pressure to the adsorption device, or the first adsorption pressure is supplied to the adsorption device at a specified timing during the period of supplying the second adsorption pressure to the adsorption device, thereby supplying the adsorption pressure for keeping the molded object adsorbed to the adsorption device at a specified timing.

Description

Technical Field

[0001] The present invention relates to a molded object taking-out system and a molded object taking-out method for demolding and conveying a molded object from a molding die. Background Art

[0002] In existing molding processes such as injection molding and stamping molding that use molding dies, the following system is known as a system for removing a molded object from a molding die: the system has an adsorption device that uses an adsorption pressure generated by negative pressure (vacuum) to keep the molded object adsorbed, thereby demolding the molded object (for example, Patent Document 1). As a negative pressure source for supplying adsorption pressure to such an adsorption device, there is a vacuum generating device (hereinafter referred to as an ejector) that generates negative pressure by driving compressed air. The ejector squeezes the compressed air provided from an external compressor through a nozzle and exhausts it at high speed, thereby generating negative pressure through the Venturi effect. The advantages of using the ejector as a negative pressure source are listed as being able to make the entire system relatively cheap and compact.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent No. 4527880

[0006] Patent Document 2: Japanese Patent Application Laid-Open No. 2008-300668 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in the process of removing the molded object, for example, at a specified timing such as when the molded object is demolded, a relatively large adsorption pressure is sometimes required to keep the molded object adsorbed. When an ejector is used as a negative pressure source, the adsorption pressure of the adsorption device can be increased by increasing the pressure of the compressed air supplied to the ejector. However, when the air pressure is increased, the air flow supplied to the ejector also increases. Therefore, the sound of the air discharged from the exhaust hole of the ejector tends to be louder as the pressure increases. Therefore, at the above-mentioned specified timing, if the adsorption pressure for keeping the molded object adsorbed is obtained only by the ejector, it is possible that a large amount of air is discharged from the exhaust port of the ejector, which may generate a large noise.

[0009] The present invention has been made in view of the above problems, and its object is to provide a technology for removing a molded object from a molding die using a vacuum generating device that supplies suction pressure by driving compressed air, which can suppress the generation of noise and obtain a large suction pressure.

[0010] Solutions for solving problems

[0011] In order to solve the above-mentioned problems, the present invention adopts the following scheme. That is, the present invention is a molded object removal system for removing a molded object from a molding die, comprising a suction device, a first vacuum generating device, and a second vacuum generating device; the suction device keeps the molded object adsorbed by suction pressure; the first vacuum device supplies the first suction pressure to the suction device by driving compressed air; the second vacuum generating device supplies the second suction pressure to the suction device by driving a motor, wherein the second suction pressure is supplied to the suction device at a specified timing during the period of supplying the first suction pressure to the suction device, or the first suction pressure is supplied to the suction device at the specified timing during the period of supplying the second suction pressure to the suction device, and the suction pressure for keeping the molded object adsorbed is supplied to the suction device at the specified timing.

[0012] That is, the present invention is configured such that, by applying the first adsorption pressure generated by the first vacuum generating device and the second adsorption pressure generated by the second vacuum generating device at a predetermined timing, the adsorption pressure for maintaining the adsorption of the molded object is supplied to the adsorption device at the predetermined timing. As a result, the air pressure to be supplied to the first vacuum generating device can be reduced compared to the case where only the first vacuum generating device supplies the adsorption pressure required for maintaining the adsorption of the molded object at the predetermined timing. As a result, the adsorption of the molded object can be reliably maintained at the predetermined timing and the generation of loud noise can be suppressed. Furthermore, compared to the case where only the first vacuum generating device supplies the required adsorption pressure at the predetermined timing, the air consumption can be reduced by reducing the air flow rate to be supplied to the first vacuum generating device.

[0013] In addition, as the first vacuum generating device, an ejector can be used as an example, which receives the supply of compressed air and generates vacuum through the Venturi effect to supply adsorption pressure to the adsorption device. In addition, as the second vacuum generating device, a vacuum pump can be used as an example, which drives the motor to rotate the built-in rotor to suck air and provide adsorption pressure to the adsorption device. However, the present invention is not limited to these.

[0014] Furthermore, in the present invention, the predetermined timing may be the timing of demolding the molded object from the molding die. Thus, at the demolding timing of the molded object requiring a relatively large suction pressure, the first suction pressure and the second suction pressure are applied and supplied, thereby reducing the removal error of the molded object.

[0015] In addition, in the present invention, a negative pressure chamber is formed inside the adsorption device, and the negative pressure chamber is a space where the suction path of the first vacuum generating device for supplying the first adsorption pressure is connected to the suction path of the second vacuum generating device for supplying the adsorption pressure to the adsorption device, and the adsorption device may also have a holding surface on which the molded object is held and adsorbed, and a suction hole formed in the holding surface and connected to the negative pressure chamber. Thus, the first adsorption pressure generated by the first vacuum generating device and the second adsorption pressure generated by the second vacuum generating device can act on the molded object from the common suction hole. As a result, the first adsorption pressure and the second adsorption pressure can be applied.

[0016] In addition, in the invention, the adsorption device may further include a groove having the holding surface as a bottom surface and capable of accommodating at least a portion of the molded object. Thus, since the molded object is held and adsorbed in a state where at least a portion of the molded object is accommodated in the groove, the adsorption pressure can be appropriately applied to the molded object to reliably hold the molded object and adsorb it. This is particularly suitable for adsorption and retention of relatively soft molded objects such as resin molded products after molding.

[0017] In addition, the present invention may specifically specify a method for removing a molded object. That is, the present invention is a method for removing a molded object from a molding die by using an adsorption device that keeps the molded object adsorbed by adsorption pressure, and may also be a method for removing a molded object as follows: supplying a second adsorption pressure to the adsorption device by a motor drive at a specified timing during the period when the first adsorption pressure is supplied to the adsorption device by the drive of compressed air, or supplying the first adsorption pressure to the adsorption device at the specified timing during the period when the second adsorption pressure is supplied to the adsorption device, thereby supplying the adsorption pressure for keeping the molded object adsorbed to the adsorption device at the specified timing. Further, in this case, the specified timing may also be the timing for demolding the molded object from the molding die.

[0018] Effects of the Invention

[0019] According to the present invention, there is provided a technique for taking out a molded object from a molding die using a vacuum generating device of a type that supplies suction pressure by driving compressed air, which can suppress the generation of noise and obtain a high suction pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a diagram showing the overall structure of a system for taking out a molded object according to an embodiment.

[0021] Figure 2 A diagram showing a sealing ring.

[0022] Figure 3 It is a three-dimensional diagram of the adsorption device.

[0023] Figure 4 middle, Figure 4 (A) is Figure 3 A-A section diagram, Figure 4 (B) is a front view of the adsorption device in the state of adsorbing the molded object.

[0024] Figure 5 It is a figure which shows the procedure of the method for taking out the molded object according to the embodiment.

[0025] Figure 6 This is a diagram showing the positional relationship between the suction device and the metal mold in the standby process.

[0026] Figure 7 It is a diagram showing the positional relationship between the suction device and the metal mold when the suction device reaches the demolding position in the approach process.

[0027] Figure 8 This is a diagram showing a state of a molded product after demolding in a demolding step.

[0028] Fig. 9 This is a diagram showing valve control by a control device in the molded product removal system according to the embodiment.

[0029] Fig.10 3 is a diagram showing valve control in Comparative Example 1.

[0030] Fig.11 3 is a diagram showing valve control in Comparative Example 2. DETAILED DESCRIPTION

[0031] The removal system of the present invention can remove the molded object from the molding die. The material and shape of the molded object are not particularly limited, and resin molded objects, metal molded objects, etc. can be applied. In addition, there is no particular limitation on the molding method of the molded object, as long as a molding die is used, injection molding and stamping molding can be applied. The preferred embodiment of the molded object removal system of the present invention is described below with reference to the accompanying drawings. In the following embodiment, the removal system of the present invention is suitable for removing an annular resin molded object molded by injection molding from a metal mold (molding mold). However, unless specifically described, the structures described in the following embodiments are not intended to limit the technical scope of the present invention to only these.

[0032] Figure 1 The overall structure of the molded product removal system (hereinafter, the removal system) 100 according to the embodiment is shown. Figure 1 As shown, the removal system 100 includes a suction device 10 , a moving device 20 , an ejector 30 , a compressed air delivery unit 40 , a vacuum breaking device 50 , a vacuum pump 60 , a suction delivery unit 70 and a control device 80 . Figure 1The arrows shown indicate the flow direction of air in the removal system 100. The flow path (path) of the air is formed by an air duct (not shown).

[0033] Figure 2 The figure shows a sealing ring X1 as a removal object of the removal system. The sealing ring X1 is a ring-shaped (circular ring-shaped) resin product with a rectangular cross-section formed by injection molding. Polyetheretherketone (PEEK) is listed as a material of the sealing ring X1. However, the material of the sealing ring X1 is not limited to this. The sealing ring X1 forms a closed structure by being embedded in a mechanical part. Figure 2 As shown, the sealing ring X1 is formed into a discontinuous annular shape, and a counter-port (gap) G1 is formed by the end faces thereof being opposed to each other. The influence of the thermal expansion difference between the sealing ring X1 and the mechanical parts is reduced by the counter-port G1. The sealing ring X1 is an example of a molded product of the present invention. However, the molded product of the present invention is not limited to a sealing ring, and the shape and material of the molded product are not limited to the above examples. The shape of the molded product may be an annular shape without a counter-port, or may not be an annular shape. In addition, the material of the molded product has nothing to do with the shape of the molded product, and may be a resin material, or may not be a resin material.

[0034] The removal system 100 of the embodiment is installed in each molding machine that molds the seal ring X1 in the factory. Figure 1 As shown, the removal system 100 supplies compressed air to the ejector 30 to suck air from the adsorption device 10, and supplies a first adsorption pressure to the adsorption device 10. The removal system 100 further sucks air from the adsorption device 10 through the vacuum pump 60 to supply a second adsorption pressure to the adsorption device 10. The compressor 200 as a supply source of compressed air is arranged at a specified location in the factory, and compressed air is supplied from one compressor 200 to a plurality of removal systems 100 via an air duct. In addition, a compressor 200 may be provided in each removal system 100. The removal system 100 of this embodiment, in addition to the first adsorption pressure, also causes the second adsorption pressure to act on the sealing ring X1, so that the sealing ring X1 can be properly removed from the metal mold of the injection molding machine. The following describes each structure of the removal system 100.

[0035] The adsorption device 10 is a device for keeping the molded object adsorbed by adsorption pressure. Figure 3 FIG. 1 is a three-dimensional diagram of the adsorption device 10. Figure 3 As shown, the adsorption device 10 includes an adsorption box 1 and an adsorption plate 2. Hereinafter, regarding the adsorption device 10, the adsorption plate 2 side is referred to as the front (front side), and the side provided with the first connection hole indicated by reference numeral 11 is referred to as the upper side. Figure 4 (A) is Figure 3 AA section diagram, Figure 4(B) is a front view of the adsorption device 10 in a state where the seal ring X1 is adsorbed.

[0036] like Figure 3 and Figure 4 As shown in (A), the adsorption box 1 is formed into a roughly rectangular box with an opening at the front. A first connection hole 11, which is a hole connected to the ejector 30, is provided on the top of the adsorption box 1, and a second connection hole 12, which is a hole connected to the vacuum pump 60 via the suction conveying unit 70, is provided on the right side of the adsorption box 1. In addition, the adsorption plate 2 is formed in a plate shape, and is arranged in a manner that the adsorption plate 2 covers the front of the adsorption box 1, so that a space surrounded by the adsorption box 1 and the adsorption plate 2, namely a negative pressure chamber S1, is formed inside the adsorption device 10. The negative pressure chamber S1 is connected to the air intake path of the ejector 30 via the first connection hole 11, and is connected to the air intake path of the vacuum pump 60 via the second connection hole 12.

[0037] In addition, if Figure 4 As shown in (B), an annular groove 21 capable of accommodating the sealing ring X1 is formed on the front of the adsorption plate 2. The groove 21 has a depth capable of accommodating the entire sealing ring X1. Figure 3 and Figure 4 The bottom surface of the groove 21 indicated by the symbol 22 in (A) is set as a holding surface for keeping the sealing ring X1 adsorbed. The holding surface 22 is formed with a plurality of suction holes 23, which are holes that connect the negative pressure chamber S1 with the space in the groove 21. The plurality of suction holes 23 are arranged at equal intervals along the circumference of the groove 21. However, the shape of the groove of the present invention, the number and arrangement of the plurality of suction holes are not limited to Figure 3 The shape of the groove, the number and arrangement of the suction holes may be changed according to the form of the molded object to be taken out.

[0038] The moving device 20 is a device for moving the adsorption device 10. The adsorption device 10 is mounted on a movable arm of the moving device 20, and can move in the front-back direction, the up-down direction, and the left-right direction according to the movement direction of the movable arm. The moving device 20 brings the adsorption device 10 close to the metal mold when opening the metal mold, and moves the adsorption device 10 from the metal mold when the adsorption device 10 keeps the sealing ring X1 adsorbed, and transports the sealing ring X1 to a predetermined opening position. As the moving device 20, a known device can be used as appropriate.

[0039] The ejector 30, also called a vacuum generator, supplies the first adsorption pressure to the adsorption device 10 by being driven by compressed air. Figure 1As shown, the ejector 30 has a supply port 301, an exhaust port 302 and an air intake port 303. The compressed air supplied from the outside to the supply port 301 is squeezed by a nozzle (not shown) provided inside and exhausted (discharged) from the exhaust port 302 to the outside at a high speed, and a vacuum is generated inside by the Venturi effect, thereby sucking air from the air intake port 303. The supply port 301 is connected to the compressed air delivery unit 40, and the air intake port 303 is connected to the first connection hole 11 of the adsorption device 10. Therefore, by supplying compressed air from the compressed air delivery unit 40 to the ejector 30, the air in the negative pressure chamber S1 is sucked, thereby generating a vacuum (negative pressure) in the negative pressure chamber S1. Thus, the external air is sucked from the suction hole 23 formed in the adsorption plate 2, and the first adsorption pressure is supplied to the adsorption device 10 through the ejector 30. At this time, the adsorption pressure supplied to the adsorption device 10 by the ejector 30 is related to the pressure of the compressed air supplied to the ejector 30. The ejector 30 is an example of the "first vacuum generating device" of the present invention.

[0040] The compressed air delivery unit 40 supplies the compressed air supplied from the compressor 200 to the ejector 30. More specifically, the compressed air delivery unit 40 has a boost valve 401, an air tank 402, a high pressure regulator (pressure reducing valve) 403, a first high pressure valve 404, a low pressure regulator (pressure reducing valve) 405, and a first low pressure valve 406. The boost valve 401 is arranged at the uppermost stream of the supply path of the compressed air from the compressor 200 to the ejector 30, and boosts the pressure of the compressed air supplied from the compressor 200. The air tank 402 is arranged downstream of the boost valve 401, and averages the pulsation of the air pressure by temporarily storing the compressed air, and prevents a sharp drop in pressure. Here, the supply path of the compressed air is bifurcated into a path from the air tank 402 to the ejector 30 through the high pressure regulator 403 and the first high pressure valve 404, and a path from the air tank 402 to the ejector 30 through the low pressure regulator 405 and the first low pressure valve 406. The high-pressure regulator 403 is provided downstream of the air tank 402, and generates relatively high-pressure high-compressed air by adjusting the pressure of the compressed air. The first high-pressure valve 404 is provided downstream of the high-pressure regulator 403, and is opened and closed according to the control of the air intake and delivery unit 70, thereby switching the supply of high-compressed air to the ejector 30 and stopping the supply. The low-pressure regulator 405 is provided downstream of the air tank 402, and adjusts the pressure of the compressed air to generate relatively low-pressure low-compressed air. The first low-pressure valve 406 is provided downstream of the low-pressure regulator 405, and is opened and closed according to the control of the control device 80, thereby switching the supply of low-compressed air to the ejector 30 and stopping the supply.

[0041] In the present embodiment, compressed air is supplied from the compressor 200 at a pressure of 0.5 MPa, is pressurized to a predetermined pressure by the boost valve 401, and is stored in the air tank 402. The compressed air supplied from the air tank 402 to the high pressure regulator 403 is adjusted to 0.7 MPa. By opening the first high pressure valve 404 while the compressed air is supplied from the compressor 200 to the compressed air delivery unit 40, the high compressed air of 0.7 MPa is supplied to the ejector 30. The compressed air supplied from the air tank 402 to the low pressure regulator 405 is adjusted to 0.2 MPa. By opening the first low pressure valve 406 while the compressed air is supplied from the compressor 200 to the compressed air delivery unit 40, the low compressed air of 0.2 MPa is supplied to the ejector 30. That is, when compressed air is supplied from the compressor 200 to the compressed air delivery unit 40 , at least one of the first high-pressure valve 404 and the first low-pressure valve 406 is opened, so that compressed air is supplied to the ejector 30 and the first adsorption pressure is supplied to the adsorption device 10 .

[0042] The vacuum breaker 50 destroys the vacuum in the ejector 30 under the control of the control device 80. The vacuum breaker 50 is disposed above the exhaust port 302 of the ejector 30 and includes a cylindrical cylinder portion 501 and a piston portion 502 that can slide up and down through the cylinder portion 501. The vacuum breaker 50 lowers the piston portion 502 under the control of the control device 80, blocks the exhaust port 302 through the piston portion 502, and thus cuts off the exhaust of the ejector 30. Thus, the vacuum in the ejector 30 is destroyed.

[0043] The vacuum pump 60 supplies the second adsorption pressure to the adsorption device 10 by being driven by a motor. More specifically, the vacuum pump 60 is a dry pump having a motor 601, an exhaust port 602, and an air intake port 603. The internal rotor (not shown) is driven by the motor 601 to rotate so that the internal air is discharged from the exhaust port 602 and the air is sucked from the air intake port 603. The air intake port 603 is connected to the second connection hole 12 of the adsorption device 10 via the air suction conveying unit 70. The vacuum pump 60 is an example of the "second vacuum generating device" of the present invention. In addition, the second vacuum generating device of the present invention is not limited to a dry pump or a rotary pump, and various devices can be selected as long as the device generates a vacuum by the drive of a motor. The second vacuum generating device can also be a wet pump, such as an oil rotary pump, or a diaphragm pump.

[0044] The air suction conveying unit 70 conveys the air sucked from the adsorption device 10 by the vacuum pump 60. The air suction conveying unit 70 has a second valve 701 and an air tank 702. In the air suction path from the adsorption device 10 to the vacuum pump 60, the second valve 701 is arranged downstream of the adsorption device 10, and is opened and closed by the control of the control device 80, thereby switching the suction and stop of the vacuum pump 60. The air tank 702 is arranged downstream of the second valve 701 to temporarily store air.

[0045] When the vacuum pump 60 is operating, the second valve 701 is opened to suck air into the negative pressure chamber S1 by the vacuum pump 60, thereby generating a vacuum in the negative pressure chamber S1. Thus, external air is sucked in from the suction hole 23 formed in the adsorption plate 2, and the vacuum pump 60 supplies the second adsorption pressure to the adsorption device 10.

[0046] The control device 80 controls the first high-pressure valve 404, the first low-pressure valve 406, the second valve 701, and the vacuum breaker 50. The control device 80 is configured as a programmable logic controller (PLC), and the main processing unit (MPU) executes a predetermined program stored in a memory, and outputs a signal for timing control of the first high-pressure valve 404, the first low-pressure valve 406, the second valve 701, and the vacuum breaker 50. As a result, the first high-pressure valve 404, the first low-pressure valve 406, and the second valve 701 are opened and closed at a predetermined timing, and the vacuum breaker 50 breaks the vacuum of the ejector 30 at a predetermined timing.

[0047] [Method for taking out the molded product]

[0048] Next, a method for taking out the molded product according to the present embodiment will be described. Figure 5 1 is a diagram showing the steps of the method for removing the molded product according to the embodiment. The method for removing the molded product according to the embodiment performs one cycle for one injection molding. When removing the molded product, the injection molded seal ring X1 is removed from the metal mold 300 (see Figure 6 ), the sealing ring X1 is transported to a predetermined opening position separated from the metal mold 300, and the sealing ring X1 is opened at the opening position. In addition, the removal of the molded product described below is performed under the condition that compressed air is supplied from the compressor 200 to the removal system 100 and the vacuum pump 60 is in operation.

[0049] First, in Figure 5In the standby process of step S101 shown in FIG. 1 , the adsorption device 10 is placed on standby until the seal ring X1 is ready to be released from the metal mold 300. Specifically, the adsorption device 10 is placed on standby until the injection molding machine completes the injection molding of the seal ring X1 and opens the metal mold 300. Figure 6 1 is a diagram showing the positional relationship between the adsorption device 10 and the metal mold 300 in the standby process. Figure 6 In the embodiment, the metal mold 300 is in an opened state. Figure 6 As shown, in the standby process, the suction device 10 is arranged at a standby position above the metal mold 300 .

[0050] Next, in the approach process of step S102 , after the metal mold 300 is opened, the suction device 10 is moved to a position (mold release position) where the seal ring X1 can be removable. Figure 7 The figure shows the positional relationship between the suction device 10 and the metal mold 300 when the suction device 10 reaches the demolding position in the approaching process. In the approaching process, the suction device 10 is lowered and then moved forward by the moving device 20, so that the suction device 10 is arranged at Figure 7 As shown in the demoulding position. Figure 7 As shown, when the suction device 10 is in the demolding position, the suction plate 2 (and the holding surface 22 ) of the suction device 10 is opposite to the metal mold 300 .

[0051] Next, in the demoulding process of step S103, the removal system 100 is Figure 7 The suction device 10 is shown in a state where it is at the demolding position, and the seal ring X1 is demolded by supplying suction pressure to the suction device 10 . Figure 8 : is a diagram showing the state of the seal ring X1 after demolding in the demolding process. Figure 8 As shown, the seal ring X1 is separated from the metal mold 300 and is held and sucked on the holding surface 22. At this time, the seal ring X1 is held and sucked in a state where at least a portion of the seal ring X1 is accommodated in the groove 21, so that the suction pressure acts appropriately on the seal ring X1, and the seal ring X1 can be reliably held and sucked.

[0052] Next, in the transfer process of step S104, the suction device 10 that keeps the seal ring X1 in the suction state is transferred from the demolding position to a position (gate cutting position) where the gate of the seal ring X1 can be cut by the gate cutting machine. More specifically, the suction device 10 is moved back and then raised by the moving device 20, so that the suction device 10 is arranged at the gate cutting position.

[0053] Next, in the gate cutting process of step S105 , the gate of the seal ring X1 at the gate cutting position is cut by a gate cutting machine.

[0054] Next, in the opening process of step S106, the suction device 10 is moved to a position (opening position) for opening the seal ring X1, and the suction device 10 releases the suction of the seal ring X1 at the opening position to open the seal ring X1. A shooter or a collecting device is arranged at the opening position to send the opened seal ring X1 to the next machine.

[0055] Next, in the return process of step S107, the moving device 20 moves the adsorption device 10 to the standby position. After step S107, the process returns to step S101, and the adsorption device 10 returned to the standby position stands by until the next injection molding is completed and the metal mold 300 is opened. As described above, the sealing ring X1 is removed for each injection molding.

[0056] Here, Fig. 9 It is a diagram showing valve control of the control device 80 in the taking-out system according to the embodiment. Fig. 9 The opening and closing states of the first high-pressure valve 404 , the first low-pressure valve 406 , and the second valve 701 during the period from the standby process to the standby process of the next cycle are shown. Fig. 9 The "t" in represents time. Fig. 9 As shown, the period of the standby process is set to t1≤t<t2, the period of the approach process is set to t2≤t<t3, the period of the demolding process is set to t3≤t<t5, the period of the transfer process is set to t5≤t<t7, the period of the gate cutting process is set to t7≤t<t8, the period of the opening process is set to t8≤t≤t9, the period of the return process is set to t9<t<t10, and the period of the standby process of the next cycle is set to t10≤t<t11. The sealing ring X1 is demolded from the metal mold 300 at the timing of t=t4 (t3<t4<t5), and is opened from the adsorption device 10 at the timing of t=t9. Hereinafter, refer to Fig. 9 The control and function of the suction pressure in the method of taking out the molded product will be described.

[0057] First, if Fig. 9 As shown, during the period from the start of the standby process to the end of the process (t1≤t<t3), the first high-pressure valve 404, the first low-pressure valve 406, and the second valve 701 are all closed, and the first adsorption pressure and the second adsorption pressure are not supplied to the adsorption device 10.

[0058] Then, during the demolding process (t3≤t<t5), the first high-pressure valve 404 is opened to supply high-compressed air of 0.7 MPa to the ejector 30, and the first adsorption pressure generated by the ejector 30 is supplied to the adsorption device 10. In addition, during the demolding process, the second valve 701 is opened to supply the second adsorption pressure generated by the vacuum pump 60 to the adsorption device 10. That is, at the timing of t=t4 when the seal ring X1 is demolded, both the first high-pressure valve 404 and the second valve 701 are opened, and the first adsorption pressure and the second adsorption pressure are simultaneously supplied to the adsorption device 10. Therefore, sufficient adsorption pressure is obtained at the demolding timing when a relatively large adsorption pressure is required. The first adsorption pressure and the second adsorption pressure act on the seal ring X1 through the suction hole 23, so that the seal ring X1 is separated from the metal mold 300 and is held adsorbed on the holding surface 22.

[0059] The first high-pressure valve 404 is opened after the demolding process is completed until the middle of the transfer process, and is closed at the timing of t=t6 (t5≤t6<t7). That is, the first adsorption pressure generated by the high-compressed air is continuously supplied to the adsorption device 10 from the start of the demolding process until the middle of the transfer process (t3≤t<t6). Then, by opening the first low-pressure valve 406 while closing the first high-pressure valve 404 (t=t6), the compressed air supplied to the ejector 30 is switched from high-compressed air to low-compressed air. After that (t6≤t≤t11), the first high-pressure valve 404 is closed. By switching the pressure of the compressed air supplied to the ejector 30 from high pressure to low pressure, the first adsorption pressure is weakened. The first low-pressure valve 406 is continuously opened from the switching timing until before the end of the opening process (t6≤t<t9), and is closed after the end of the opening process (t9≤t<t11). That is, the first adsorption pressure generated by the low-compression air is continuously supplied from the timing of switching from the high-compression air to the low-compression air until the end of the opening process (t6≤t<t9). As described above, although the first adsorption pressure generated by the ejector 30 is switched from the pressure generated by the high-compression air to the pressure generated by the low-compression air in the middle of the transfer process, it is continuously supplied to the adsorption device 10 from the start of demolding of the seal ring X1 until the seal ring X1 is opened (t3≤t<t9). That is, the first adsorption pressure generated by the ejector 30 is continuously supplied to the adsorption device 10 from the demolding timing to the conveying timing.

[0060] On the other hand, the second valve 701 is closed at a timing (t=t5) after the demolding process is completed. Therefore, when the demolding process is completed, the suction path of the vacuum pump 60 is cut off, and the supply of the second adsorption pressure to the adsorption device 10 is stopped. Thereafter (t5≤t<t11), the second valve 701 is closed. Here, if the seal ring X1 is kept adsorbed, there is a tendency that a larger adsorption pressure is not required to keep the seal ring X1 adsorbed when the seal ring X1 is transported (i.e., when the adsorption device 10 moves) than when the mold is released. Therefore, in the molded product removal method of the present embodiment, when the demolding of the seal ring X1 is completed, when the seal ring X1 is transported (t5≤t≤t9), the supply of the second adsorption pressure is stopped, and the seal ring X1 is kept adsorbed only by the first adsorption pressure. Furthermore, in the middle of the transport (t=t6), the first adsorption pressure is switched from the pressure generated by the high-compression air to the pressure generated by the low-compression air, so that the seal ring X1 is kept adsorbed and the amount of air supplied to the ejector 30 (i.e., the amount of air consumed) is reduced.

[0061] In addition, in the opening process, the first low-pressure valve 406 is closed at the timing of t=t9, thereby stopping the supply of compressed air to the ejector 30. At the same time, the vacuum breaker 50 is controlled by the control device 80, so that the vacuum of the ejector 30 is broken by the vacuum breaker 50. In the opening process, by stopping the supply of compressed air to the ejector 30 and breaking the vacuum of the ejector 30, the supply of the first adsorption pressure to the adsorption device 10 is quickly stopped, and the seal ring X1 is quickly opened.

[0062] [Function and Effect]

[0063] As described above, in the process of removing the molded object, a relatively large adsorption pressure is required to keep the molded object adsorbed at the demolding timing of the molded object. In addition, when an ejector is used as a supply source of the adsorption pressure, the adsorption pressure of the adsorption device can be increased by increasing the pressure of the compressed air supplied to the ejector. However, when the air pressure is increased, the flow rate of air supplied to the ejector also increases. Therefore, the sound of air discharged from the exhaust hole of the ejector tends to be louder as the pressure increases. Therefore, if the adsorption pressure that keeps the molded object adsorbed is obtained only by the ejector at the demolding timing, it is possible that a large amount of air is discharged from the exhaust port of the ejector, which may generate a large noise.

[0064] In addition, as a method of demolding the molded object by a smaller adsorption pressure, it is possible to consider applying a release agent on the metal mold, but in this case, applying the release agent takes time, and the release agent may adhere to the surface of the molded object or enter the inside of the molded object. In addition, as another method of demolding the molded object by a smaller adsorption pressure, reducing the roughness of the metal mold surface can be cited, but for this purpose, the cost of surface treatment of the metal mold becomes high. In addition, as a method of reducing noise, it is possible to consider installing a silencer at the exhaust port of the ejector, but in this case, there is also the disadvantage of reducing the adsorption pressure. Therefore, it is desired to increase the adsorption pressure at the demolding timing and suppress the generation of larger noise.

[0065] In this regard, the removal system 100 of the present embodiment includes a suction device 10, an ejector 30, and a vacuum pump 60, wherein the suction device 10 keeps the seal ring X1 adsorbed, the ejector 30 supplies a first suction pressure to the suction device 10 by driving compressed air, and the vacuum pump 60 supplies a second suction pressure to the suction device 10 by driving a motor 601. The removal system 100 is configured such that, at the demolding timing during which the first suction pressure is supplied to the suction device 10, the second suction pressure is applied to the first suction pressure, thereby supplying the suction device 10 with a suction pressure for keeping the seal ring X1 adsorbed at the demolding timing.

[0066] Therefore, compared with the case where only the necessary adsorption pressure to keep the seal ring X1 adsorbed is supplied by the ejector 30 at the demolding timing, the air pressure to be supplied to the ejector 30 can be reduced. As a result, the seal ring X1 can be reliably adsorbed at the demolding timing, and removal errors can be reduced and the generation of large noise can be suppressed. Furthermore, compared with the case where only the necessary adsorption pressure is supplied by the ejector 30, the air flow rate to be supplied to the ejector 30 is reduced, so that the air consumption can be reduced.

[0067] In addition, in addition to the first adsorption pressure, the timing of supplying the second adsorption pressure is not limited to the demolding timing of the molded object. That is, the molded object removal system of the present invention can also be constructed in the following manner, that is, at a specified timing (the demolding timing in this embodiment) during the supply of the first adsorption pressure to the adsorption device, the second adsorption pressure is supplied to the adsorption device, thereby supplying the adsorption pressure that keeps the molded object adsorbed to the adsorption device at the specified timing. For example, when conveying a molded object, in the case where there is a large inertial force acting on the molded object, the second adsorption pressure can also be applied at this timing. By doing so, the molded object can be properly kept adsorbed during conveyance, and the molded object can be prevented from falling off from the adsorption device. In addition, for example, the second adsorption pressure can also be added at the timing of cutting off the gate of the molded object. By doing so, it is possible to prevent the load applied to the molded object when the gate is cut from causing the molded object to move.

[0068] In this embodiment, the removal system 100 is configured to supply a second suction pressure in addition to the first suction pressure at the time of mold release, especially focusing on the fact that a higher suction pressure is required when the molded object is released from the metal mold than when the molded object is transported. This can reduce removal errors of the seal ring X1.

[0069] In addition, the removal system 100 may be configured in the following manner, that is, at the demolding timing during the period of supplying the second adsorption pressure to the adsorption device 10, by applying the first adsorption pressure to the second adsorption pressure, so that the adsorption pressure for keeping the seal ring X1 adsorbed is supplied to the adsorption device 10 at the demolding timing. For example, the valve control may be performed in the following manner, that is, the second adsorption pressure generated by the vacuum pump 60 is continuously supplied to the adsorption device 10 from the demolding time to the conveying time, and the first adsorption pressure generated by the ejector 30 is added to the second adsorption pressure at the demolding timing. Therefore, compared with the case where only the adsorption pressure required to keep the seal ring X1 adsorbed is supplied by the ejector 30 at the demolding timing, the pressure of the air to be supplied to the ejector 30 can be reduced. As a result, the seal ring X1 can be reliably kept adsorbed at the demolding timing, and the removal error can be reduced and the generation of large noise can be suppressed. That is, the removal system of the present invention may be configured in the following manner, that is, by applying the first adsorption pressure and the second adsorption pressure at the specified timing, so that the adsorption pressure for keeping the molded object adsorbed is supplied to the adsorption device at the specified timing.

[0070] Furthermore, in the present embodiment, a negative pressure chamber S1 is formed inside the adsorption device 10, and the negative pressure chamber S1 is a space where the suction path of the ejector 30 for supplying the first adsorption pressure is connected to the suction path of the vacuum pump 60 for supplying the adsorption pressure to the adsorption device 10. Among them, a suction hole 23 connected to the negative pressure chamber S1 is formed in the holding surface 22 where the sealing ring X1 is held adsorbed. That is, the removal system 100 is constructed so that the suction path of the ejector 30 and the suction path of the vacuum pump 60 are both connected to the negative pressure chamber S1, and the adsorption pressure acts on the sealing ring X1 through the suction hole 23 connected to the negative pressure chamber S1. Thus, the first adsorption pressure generated by the ejector 30 and the second adsorption pressure generated by the vacuum pump 60 can act on the sealing ring X1 from the common suction hole 23. That is, the second adsorption pressure can be added to the first adsorption pressure. In particular, when a plurality of suction holes 23 are formed on the holding surface 22 as in the present embodiment, since each suction hole 23 is connected to the common negative pressure chamber S1, the suction pressure can be uniformly applied to the seal ring X1 from each suction hole 23. As a result, the seal ring X1 can be stably held in suction.

[0071] Furthermore, the adsorption device 10 has a groove 21, and the groove 21 has a holding surface 22 as a bottom surface and can accommodate the sealing ring X1. As a result, the sealing ring X1 is kept adsorbed in a state where the sealing ring X1 is accommodated in the groove 21, so that the adsorption pressure can be appropriately applied to the sealing ring X1, and the sealing ring X1 can be reliably kept adsorbed during demolding and transportation. In addition, the groove of the present invention can also have a depth that can accommodate at least a part of the molded object, and preferably has a depth that can completely accommodate the entire molded object like the groove 21 of the present embodiment. In this way, the molded object can be kept adsorbed more appropriately.

[0072] Here, in the case of a resin molded object, since it tends to be relatively soft after molding, it may be deformed when demolding is performed by excessive adsorption pressure. In addition, in the case of a ring-shaped molded object with a mouth, since the mouth portion tends to be difficult to separate from the mold, the mouth portion may be deformed when demolding is performed by excessive adsorption pressure. By providing a groove that can accommodate at least a part of the molded object on the adsorption device, the adsorption pressure is appropriately applied to the molded object, and thus the appropriate adsorption pressure can demold the resin molded object and the molded object with a mouth, and their deformation can be suppressed.

[0073] In addition, the above-mentioned embodiment is configured so that the first adsorption pressure can be switched by switching the pressure of the compressed air supplied to the ejector, but the present invention is not limited to this. That is, the pressure of the compressed air supplied to the ejector (first vacuum generating device) may not be switched or adjusted. Among them, the removal system 100 of the present embodiment is configured in the following manner, that is, in order to keep the molded object adsorbed, the high adsorption pressure required at the demolding timing is supplied by high compressed air, and high adsorption pressure is not required during transportation compared to the demolding timing, and low compressed air is supplied. As a result, the molded object that has been demolded can also be stably adsorbed during transportation, and the consumption of air supplied to the ejector 30 can be reduced.

[0074] In addition, in the above-mentioned embodiment, the supply of adsorption pressure is controlled by valve control, but the present invention is not limited to this. The supply of adsorption pressure can also be controlled by controlling the operation of the supply source of adsorption pressure. For example, it is also possible to add the second adsorption pressure by starting the suction operation of the vacuum pump at a specified timing without providing a valve in the suction path of the vacuum pump (second vacuum generating device), or by always keeping the valve in an open state.

[0075] Furthermore, the extraction system 100 of the embodiment stores compressed air in the air tank 402 in advance, and controls the supply of compressed air from the air tank 402 to the ejector 30 by valve control, so that the compressed air can be used at a necessary timing. As a result, the air consumption can be reduced.

[0076] [Evaluation test]

[0077] In order to confirm the function and effect of the molded product removal system of this embodiment, a molded product removal test was conducted. Figure 1 The removal system shown, according to Figure 5 The steps shown were performed 10 times Figure 3 The removal test of the resin molded product shown in the figure was carried out. Then, the adsorption success rate, adsorption pressure and noise level were evaluated. The adsorption pressure was evaluated by measuring the adsorption pressure acting on the molded product using a pressure sensor installed in the adsorption device. The noise was evaluated by measuring the noise level using a noise meter.

[0078] [Example]

[0079] As an example, Fig. 9 The adsorption pressure and noise during the valve control shown were evaluated. That is, in the embodiment, high-compression air of 0.7 MPa was supplied to the ejector by opening the first high-pressure valve, and low-compression air of 0.2 MPa was supplied to the ejector by opening the first low-pressure valve.

[0080] [Comparative Example 1]

[0081] Fig.10 The valve control diagram in Comparative Example 1 is shown. Fig.10 The adsorption pressure and noise during the valve control shown in FIG. 1 were evaluated. In Comparative Example 1, the regulator was adjusted to open the first high-pressure valve to supply 0.5 MPa of high-compressed air to the ejector. In Comparative Example 1, from the start of the demolding process until just before the end of the opening process (t3≤t<t9), the first high-pressure valve was set to a continuously open state, and the first low-pressure valve and the second valve were set to a state of being always closed. That is, unlike the embodiment, Comparative Example 1 attempted to demold and transport the molded object by supplying only the first adsorption pressure generated by the ejector through 0.5 MPa of high-compressed air to the adsorption device.

[0082] [Comparative Example 2]

[0083] Fig.11 : is a diagram showing valve control in Comparative Example 2. As Comparative Example 2, Fig.11 The adsorption pressure and noise during the valve control shown in the figure were evaluated. Comparative Example 2 is similar to the embodiment in that 0.7 MPa of high-compressed air is supplied to the ejector by opening the first high-pressure valve. In Comparative Example 2, from the start of the demolding process until before the end of the opening process (t3≤t<t9), the first high-pressure valve is set to a continuously open state, and the first low-pressure valve and the second valve are set to a state of being always closed. That is, unlike the embodiment, Comparative Example 2 attempts to demold and transport the molded object by supplying only the first adsorption pressure generated by the ejector through 0.7 MPa of high-compressed air to the adsorption device.

[0084] [Test results]

[0085] Table 1 shows the test results of adsorption pressure and noise. Table 1 shows the pressure of compressed air supplied to the ejector during demolding (t=t4) and during transportation (t5≤t<t9), the presence or absence of suction by the vacuum pump (i.e., the presence or absence of the second adsorption pressure supply), the adsorption success rate, the average value of adsorption pressure, and the average value of noise level. The "Demolding" item in the "Adsorption Success Rate" is defined as the proportion of the number of times the molded object can be demolded in the total number of removal tests. In addition, the "Transportation" item in the "Adsorption Success Rate" is defined as the proportion of the number of times the molded object can be demolded that the molded object can continue to be adsorbed during transportation. In addition, the noise level shown in Table 1 includes the noise generated by the operation of the molding machine. The noise level when only the molding machine is operated without operating the removal system (no air supply and exhaust) is 70 to 75db.

[0086] Table 1

[0087]

[0088] As shown in Table 1, in the embodiment, the adsorption success rate during demolding and the adsorption success rate during transportation are both 100%. That is, in the embodiment, the molded object can be reliably kept adsorbed during demolding and transportation. In addition, in the embodiment, an adsorption pressure of 41.2kPa is obtained during demolding, and an adsorption pressure of 6.7kPa is obtained during transportation. In addition, in the embodiment, the noise level during demolding is 91db, and the noise level during transportation is 81db. In addition, in Comparative Example 1, the adsorption success rate during demolding is 0%. In other words, the molded object is not adsorbed by the adsorption device, and the molded object cannot be removed from the metal mold. Therefore, the adsorption pressure and noise cannot be measured. In addition, in Comparative Example 2, a demolding error occurs, and the adsorption success rate during demolding is 40%. In addition, the adsorption success rate during transportation of Comparative Example 2 is 100%. In addition, in Comparative Example 2, an adsorption pressure of 34.4kPa is obtained during demolding, and an adsorption pressure of 34.5kPa is obtained during transportation. In addition, in Comparative Example 2, the noise level during demolding is 93db, and the noise level during transportation is 118db.

[0089] By comparing the adsorption success rate during transportation of the embodiment and the adsorption success rate during demolding of Comparative Example 1, it can be understood that, while the molded object can be reliably adsorbed by supplying 0.2 MPa of compressed air to the ejector during transportation, the molded object cannot be adsorbed even if 0.5 MPa of compressed air is supplied to the ejector during demolding. Therefore, it can be confirmed that a higher adsorption pressure is required during transportation than during demolding.

[0090] By comparing the noise levels during transportation of the example and the comparative example 2, it can be confirmed that the higher the pressure of the compressed air supplied to the ejector, the higher the noise level.

[0091] By comparing the adsorption pressures during demolding of the embodiment and comparative example 2, it can be confirmed that a higher adsorption pressure can be obtained by adding the adsorption pressure generated by the vacuum pump to the adsorption pressure generated by the ejector. In addition, by comparing the adsorption success rates during demolding of the embodiment and comparative example 2, it can be confirmed that demolding errors can be reduced and the adsorption success rate can be improved by increasing the adsorption pressure.

[0092] By comparing the noise levels during mold release between Example and Comparative Example 2, it can be confirmed that the noise level does not increase significantly even when the suction pressure generated by the vacuum pump is added to the suction pressure generated by the ejector.

[0093] As described above, by comparing the embodiment with Comparative Example 2, it can be confirmed that by adding the adsorption pressure generated by the vacuum pump to the adsorption pressure generated by the ejector, it is possible to suppress the increase in the noise level, that is, suppress the generation of loud noise and obtain a higher adsorption pressure.

[0094] <Other>

[0095] Preferred embodiments of the present invention have been described above, but the above-described various aspects can be combined as much as possible.

[0096] Explanation of symbols

[0097] 100: Molded product removal system

[0098] 10: Adsorption device

[0099] 1: Adsorption box

[0100] 2: Adsorption board

[0101] 21: Slot

[0102] 22: Keep the face

[0103] 23: Suction hole

[0104] 20: Mobile Devices

[0105] 30: Ejector (an example of the first vacuum generating device)

[0106] 40: Compressed air delivery device

[0107] 50: Vacuum Breaker

[0108] 60: Vacuum pump (an example of the second vacuum generating device)

[0109] 601: Electric motor

[0110] 70: Suction and conveying unit

[0111] 80: Control device

[0112] 200: Compressor

[0113] 300: Metal mold (an example of a molding mold)

[0114] S1: Negative pressure room

Claims

1. A system for removing a molded object, which is a system for removing a molded object from a molding die, wherein: The removal system of the molded object has the following devices: An adsorption device, which adsorbs the molded object by adsorption pressure to release the molded object from the molding die, and moves the molded object while maintaining adsorption by adsorption pressure after demolding, so as to transport the molded object; a first vacuum generating device, driven by compressed air, supplying a first adsorption pressure to the adsorption device; as well as The second vacuum generating device supplies a second adsorption pressure to the adsorption device through the driving of the motor, At the timing of demolding the molded object from the molding die, the first adsorption pressure and the second adsorption pressure are supplied to the adsorption device, thereby supplying the adsorption pressure for demolding the molded object to the adsorption device. During the period of conveying the demolded molded object, only the first adsorption pressure between the first adsorption pressure and the second adsorption pressure is supplied to the adsorption device, thereby supplying the adsorption pressure for maintaining the adsorption of the molded object to the adsorption device.

2. The system for removing a molded object according to claim 1, wherein: A negative pressure chamber is formed inside the adsorption device, and the negative pressure chamber is a space where a suction path for the first vacuum generating device to supply the first adsorption pressure is connected to a suction path for the second vacuum generating device to supply the adsorption pressure to the adsorption device. The adsorption device comprises a holding surface and a suction hole, wherein the holding surface allows the formed object to be held and adsorbed; and the suction hole is formed in the holding surface and connected to the negative pressure chamber.

3. The system for removing a molded object according to claim 2, wherein: The adsorption device further includes a groove having the holding surface as a bottom surface and capable of accommodating at least a portion of the molded object.

4. A method for removing a molded object, wherein the molded object is released from a molding die by adsorption by adsorption pressure, and the molded object is moved while being adsorbed by adsorption pressure after being released, so as to transport the molded object. in, At the timing of demolding the molded object from the molding mold, the first adsorption pressure is supplied to the adsorption device by driving compressed air and the second adsorption pressure is supplied to the adsorption device by driving a motor, so that the adsorption pressure used for demolding the molded object is supplied to the adsorption device. During the period of conveying the molded object after demolding, only the first adsorption pressure between the first and second adsorption pressures is supplied to the adsorption device, so that the adsorption pressure used to maintain the adsorption of the molded object is supplied to the adsorption device.

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