Packaging structure and manufacturing method thereof, display component and packaging method

Abstract

The present invention discloses a packaging structure and a manufacturing method thereof, a display assembly and a packaging method, wherein the packaging structure comprises: a substrate; a blocking member arranged on the periphery of the substrate; a glue frame arranged on the substrate and covering the blocking member; and a cover plate arranged opposite to the substrate and connected to the substrate through the glue frame. By arranging the blocking member on the substrate, the diffusion of the glue can be blocked during the packaging process of the light-emitting device, and the width of the glue frame can be reduced, so as to facilitate the preparation of a display screen with a narrow frame.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a packaging structure, a method for preparing a packaging structure, a display component, and a packaging method. Background Art

[0002] Currently, most of the technologies are to encapsulate the light-emitting devices by gluing to prepare displays. In recent years, narrow-framed displays have been popular with consumers because of their larger display area and better visual effects. However, the glue used in the current encapsulation structure occupies a large width, which affects the width of the display frame.

[0003] In particular, the packaging of organic light-emitting diodes (OLEDs) requires sealing with a glue frame to prevent damage to the organic light-emitting diodes by water vapor and air corrosion. However, packaging the organic light-emitting diodes with the current packaging structure will result in a large glue frame width, which is difficult to meet the requirements of narrow-border display screens. Summary of the invention

[0004] The present invention provides a packaging structure, a method for preparing the packaging structure, a display component and a packaging method, which can solve the technical problem that a display screen with a narrow frame is difficult to prepare in the prior art.

[0005] In a first aspect of the present application, a packaging structure includes: a substrate;

[0006] A blocking member, arranged on the periphery of the substrate;

[0007] A plastic frame, disposed on the substrate and covering the enclosure;

[0008] The cover plate is arranged opposite to the base plate and connected to the base plate through the rubber frame.

[0009] In a feasible implementation manner, a surface of the enclosure member facing the inner side of the substrate is provided with an inclined surface, and the inclined surface is inclined upward in a direction from the inner side of the substrate toward the outer side of the substrate.

[0010] In a feasible implementation manner, the inclined surface of the enclosure member is wavy.

[0011] In a feasible embodiment, the cross-section of the enclosure has a right triangle shape, the surface of the enclosure facing the inner side of the substrate corresponds to the hypotenuse of the right triangle, and the surface of the enclosure facing the outer side of the substrate corresponds to one right-angled side of the right triangle.

[0012] In a feasible implementation manner, the packaging structure further includes a filling glue located inside the glue frame and used for packaging the light-emitting device on the substrate.

[0013] In a feasible implementation manner, there is a display area on the substrate, and the distance between the enclosure and the periphery of the display area is 0 mm to 0.5 mm; and / or

[0014] The height of the enclosure is 2 μm to 6 μm, and the width of the bottom surface of the enclosure connected to the substrate is 10 μm to 30 μm.

[0015] A second aspect of the present application provides a method for preparing any of the above-mentioned packaging structures, comprising:

[0016] providing a substrate;

[0017] Arranging a barrier on the periphery of the substrate;

[0018] Glue is applied on the inner side and / or outer side of the enclosure, and the cover plate is connected to the base plate through the glue.

[0019] In a feasible implementation manner, the step of providing a barrier on the periphery of the substrate includes:

[0020] forming a photoresist layer on the substrate;

[0021] The photoresist layer is photoetched by a photolithography process to form the enclosure.

[0022] In a feasible implementation manner, the step of performing photolithography on the photoresist layer by a photolithography process to form the enclosure comprises:

[0023] Disposing a first shielding member above the photoresist layer, projecting etching light vertically onto the photoresist layer via the first shielding member, and obtaining a first enclosure semi-finished product through a first photolithography process;

[0024] A second shielding member is disposed obliquely above the first enclosure semi-finished product, and etching light is obliquely projected onto the photoresist layer through the second shielding member. The enclosure is obtained through a second photolithography process, so that a surface of the enclosure facing the inner side of the substrate is provided with a slope, and the slope is inclined upward in a direction from the inner side of the substrate toward the outer side of the substrate.

[0025] In a feasible implementation manner, the step of performing photolithography on the photoresist layer by a photolithography process to form the enclosure comprises:

[0026] Disposing a third shielding member above the photoresist layer, projecting a strip-shaped etching light vertically onto the photoresist layer via the third shielding member, and forming a second enclosure semi-finished product on the substrate by a third photolithography process, so that the second enclosure semi-finished product has an inclined surface that tilts upward from the inner side of the substrate toward the outer side of the substrate;

[0027] Disposing the fourth shielding member above the second enclosure member semi-finished product;

[0028] Etching light is emitted vertically toward the second enclosure semi-finished product through the fourth shielding member to form the enclosure on the substrate, wherein the enclosure has the inclined surface that is inclined upward from the inner side of the substrate toward the outer side of the substrate.

[0029] In a feasible implementation manner, the step of performing photolithography on the photoresist layer by a photolithography process to form the enclosure comprises:

[0030] Disposing a half-tone mask above the photoresist layer;

[0031] Etching light is emitted vertically toward the photoresist layer through the half-tone mask, and a barrier is formed on the substrate through a photolithography process, so that the barrier has an inclined surface that tilts upward from the inner side of the substrate toward the outer side of the substrate.

[0032] In a third aspect of the present application, a display assembly is provided, comprising:

[0033] Any of the above packaging structures;

[0034] The light emitting device is arranged between the substrate and the cover plate and is located inside the plastic frame.

[0035] A fourth aspect of the present application provides a packaging method of any of the above packaging structures, comprising:

[0036] A glue liquid is arranged on the substrate, and the glue liquid is located on at least one side of the inner side and the outer side of the enclosure to form a glue frame;

[0037] Disposing a light emitting device on the substrate;

[0038] The cover plate is pressed onto the base plate, and the cover plate is bonded to the base plate through the glue frame.

[0039] In a feasible implementation manner, providing glue on the substrate includes:

[0040] A first mixed hardening glue is arranged on the outer side of the enclosure, and a second mixed hardening glue is arranged on the inner side of the enclosure;

[0041] A filling glue is arranged on a side of the second mixed hardening glue away from the enclosure member, so that the light emitting device is bonded to the substrate through the filling glue.

[0042] In a feasible implementation manner, pressing the cover plate onto the substrate includes:

[0043] Pressing the cover plate onto the base plate, so that the second mixed hardening adhesive passes over the enclosure and mixes with the first mixed hardening adhesive to obtain a hardening adhesive mixture;

[0044] The cover plate is bonded to the base plate through the hardening adhesive mixture.

[0045] The packaging structure provided in the embodiment of the present application can block the diffusion of glue during the packaging process of the light-emitting device by setting a blocking member on the substrate, thereby reducing the width of the glue frame and facilitating the preparation of a narrow-frame display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A schematic structural diagram of a packaging structure provided in an embodiment of the present application;

[0047] Figure 2 A schematic structural diagram of the connection relationship between an enclosure member and a cover plate of a packaging structure provided in an embodiment of the present application;

[0048] Figure 3 A schematic diagram of the cross-sectional shape of a side of an enclosure member of a packaging structure provided by an embodiment of the present application that is away from the display area;

[0049] Figure 4 A schematic flow chart of a method for preparing a packaging structure provided in an embodiment of the present application;

[0050] Figure 5 A process flow chart of a preparation method of a fencing member provided in an embodiment of the present application;

[0051] Figure 6 A process flow chart of the preparation of enclosures according to another preparation method provided in an embodiment of the present application;

[0052] Figure 7 A process flow chart of a fencing member preparation method according to another preparation method provided in an embodiment of the present application;

[0053] Figure 8 A schematic structural diagram of a display component provided in an embodiment of the present application;

[0054] Fig. 9 A schematic flow chart of a packaging method provided in an embodiment of the present application;

[0055] Fig.10 A schematic structural diagram of the glue filling state of a packaging method provided in an embodiment of the present application.

[0056] Description of reference numerals:

[0057] 1 substrate, 2 enclosure, 3 cover, 4 light emitting device, 5 glue frame, 6 filling glue, 7 photoresist layer, 8 first enclosure semi-finished product, 9 second enclosure semi-finished product, 10 half-tone mask, 11 first mixed hardening glue, 12 second mixed hardening glue, 13 first shielding member, 14 second shielding member, 15 third shielding member, 16 fourth shielding member. DETAILED DESCRIPTION

[0058] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification are described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0059] In this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the statement "comprise one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. The term "more than two" includes two or more than two situations.

[0060] Currently, most technologies use glue to package light-emitting devices to prepare displays. In recent years, narrow-framed displays have become popular among consumers because of their larger display area and better visual effects. However, the current packaging structure cannot reduce the width of the glue, making it difficult to prepare narrow-framed displays.

[0061] In particular, the packaging of organic light-emitting diodes (OLEDs) requires sealing with a glue frame to prevent damage to the OLEDs by water vapor and air corrosion. However, packaging the OLEDs with the current packaging structure will result in a large glue frame width, which cannot meet the requirements of narrow-border display screens.

[0062] For example, in some examples, a frit packaging method can be used to package the light-emitting device. The frit packaging method is: the light-emitting device is packaged by glass glue, and then during the packaging process, the glass glue will be squeezed by the packaging structure, which will cause the glass glue to flatten and diffuse, making the hardened glue frame wide, which is not conducive to the preparation of a narrow-border display screen.

[0063] In view of this, if Figure 1 and Figure 2 As shown, the embodiment of the present application provides a packaging structure, including: a substrate 1, a blocking member 2, a plastic frame 5 and a cover plate 3;

[0064] The enclosure 2 is arranged on the periphery of the substrate 1 ; the plastic frame 5 is disposed on the substrate 1 and covers the enclosure 2 ; the cover plate 3 is arranged opposite to the substrate 1 and connected to the substrate 1 through the plastic frame 5 .

[0065] like Figure 1 and Figure 8 As shown, the packaging structure provided by the embodiment of the present invention includes a substrate 1, a baffle 2 and a cover plate 3. The baffle 2 is arranged on the substrate 1. In the process of packaging the light-emitting device 4 through the packaging structure, glue can be applied to the area of ​​the substrate 1 located on one side or both sides of the baffle 2, and the light-emitting device 4 is arranged on the substrate 1. The cover plate 3 is pressed on the substrate 1. In the process of pressing the cover plate 3 on the substrate 1, the cover plate 3 can squeeze the glue. Part of the glue will flow to the other side of the baffle 2 due to the squeeze of the cover plate 3. The cover plate 3 is bonded to the substrate 1 through the glue to complete the packaging of the light-emitting device 4. In the process of bonding the cover plate 3 to the substrate 1, the baffle 2 can play a certain blocking role on the glue, limit the diffusion amount and diffusion space of the glue, and at the same time ensure the smooth bonding of the cover plate 3 and the substrate 1, and can greatly shorten the width of the glue frame 5 while ensuring the packaging effect, so that the width of the glue frame 5 used to encapsulate the light-emitting device 4 is reduced, which is convenient for the preparation of a narrow-frame display screen.

[0066] like Figure 1 and Figure 8 As shown, in some examples, one side of the enclosure 2 may be the side of the enclosure 2 facing the inner side of the substrate 1 or the side of the enclosure 2 facing the outer side of the substrate 1. The enclosure 2 may be any shape that can block the glue and limit the amount of glue diffusion and diffusion space. For example, the enclosure 2 may be a retaining wall, and the cross-sectional shape may be rectangular or trapezoidal, and the whole may be ring-shaped or frame-shaped. It is understandable that the shape of the enclosure 2 is adapted to the shape of the light-emitting device 4. For example, if the light-emitting device 4 is rectangular, the enclosure 2 may be frame-shaped.

[0067] In the packaging structure provided by the embodiment of the present invention, during the process of pressing the cover plate 3 onto the substrate 1, the glue liquid will flow over the enclosure 2 to the other side of the enclosure 2, and the finally formed glue frame 5 can wrap the enclosure 2, that is, the enclosure 2 can finally be in the glue frame 5, which can increase the mechanical strength of the glue frame 5, improve the packaging quality, and ensure the packaging strength.

[0068] In some examples, glue can be applied to an area on the substrate 1 located on one side of the enclosure 2, for example, glass glue can be applied to an area on the substrate 1 located on one side of the enclosure 2, and then the light-emitting device 4 is set on the substrate 1. During the process of pressing the cover 3 onto the substrate 1, part of the glass glue can flow over the enclosure 2 to the other side of the enclosure, and the cover 3 is adhered to the substrate 1 by the glass glue. The setting of the enclosure 2 can block the glass glue, reduce the expansion amount and expansion space of the glass glue, and greatly reduce the width of the glue frame 5.

[0069] In some examples, glue can be applied to the areas on both sides of the substrate 1 where the enclosure 2 is located. For example, the first mixed hardening glue is applied to the area on one side of the substrate 1 where the enclosure 2 is located, and the second mixed hardening glue is applied to the area on the other side of the substrate 1 where the enclosure 2 is located. During the process of pressing the cover 3 onto the substrate 1, part of the first mixed hardening glue flows over the enclosure 2 to the second mixed hardening glue, and part of the second mixed hardening glue flows over the enclosure 2 to the first mixed hardening glue. The first mixed hardening glue and the second mixed hardening glue are mixed on both sides of the enclosure 2. The cover 3 can be bonded to the substrate 1 by the mixture of the first mixed hardening glue and the second mixed hardening glue. The setting of the enclosure 2 can block the first mixed hardening glue and the second mixed hardening glue, reduce the expansion amount and expansion space of the first mixed hardening glue and the second mixed hardening glue, and greatly reduce the width of the glue frame 5.

[0070] It is understandable that the first mixed hardening adhesive and the second mixed hardening adhesive can enhance the bonding strength after being mixed. For example, the first mixed hardening adhesive is epoxy adhesive and the second mixed hardening adhesive is modified amine.

[0071] In some examples, the raw materials for preparing the enclosure 2 can be one or more of benzocyclobutene (BCB), photoresist, phenol-based resin, polypropylene-based resin, polyimide-based resin and propylene-based resin. The selection of the raw materials facilitates the setting of the enclosure 2, so that the enclosure 2 has a certain mechanical strength and is easy to bond with the glue.

[0072] In some examples, the packaging structure provided in this embodiment can be used to package a display screen or a lighting device used as a light source, for example, it can be used to package an organic light emitting device 4, which can be an OLED display screen or an OLED lighting device.

[0073] like Figure 1 and Figure 8 As shown, in a feasible embodiment, a surface of the enclosure 2 facing the inner side of the base plate 1 is provided with an inclined surface, and the inclined surface is inclined upward in a direction from the inner side of the base plate 1 toward the outer side of the base plate 1 .

[0074] In this embodiment, a display area is provided on the substrate 1, and the display area is located inside the substrate 1. In the process of packaging the light-emitting device 4 in the packaging structure, the light-emitting device 4 is provided in the display area, and the light emitted by the light-emitting device 4 can be transmitted through the display area. When the light-emitting device 4 is a display screen, the image can be displayed through the display area, and when the light-emitting device 4 is a lighting device, the light for lighting can be emitted through the display area.

[0075] In this embodiment, the enclosure 2 faces the inner side of the substrate 1, that is, the enclosure 2 has an inclined surface on the side facing the display area. In the process of encapsulating the light-emitting device 4 through the encapsulation structure, the light-emitting device 4 is set in the display area, and glue can be set between the enclosure 2 and the light-emitting device 4. The rear cover 3 is pressed on the substrate 1, and the glue flows over the enclosure 2 to the other side of the enclosure 2, so that the glue frame 5 formed by the solidification of the glue is located on the surrounding side of the light-emitting device 4, which can protect the light-emitting device 4. The enclosure 2 has an inclined surface on the side facing the display area, which is conducive to the glue flowing over the enclosure 2 through the display area side to the outside of the enclosure 2, making it convenient to place the glue frame 5 on the surrounding side of the light-emitting device 4, and further reducing the width of the glue frame 5.

[0076] In this embodiment, the cross-section of the surface of the inclined surface away from the side of the substrate 1 along the height direction of the substrate 1 is a curved surface. On the one hand, when glue is coated on the areas of the substrate 1 on both sides of the enclosure 2, the wavy cross-section of the inclined surface is conducive to the mixing of the glue on both sides of the enclosure 2, which can improve the adhesion of the glue and improve the packaging effect. On the other hand, by selecting the cross-section as a curve, the side of the inclined surface away from the substrate 1 has protrusions and depressions, so that part of the glue can be filled on the inclined surface, increasing the contact area between the glue and the inclined surface. After the glue solidifies, the glue frame 5 and the enclosure 2 can have a stronger bonding force, which can improve the mechanical strength of the glue frame 5 and improve the packaging effect.

[0077] like Figure 3 As shown, in a possible implementation manner, the inclined surface of the enclosure 2 is wavy.

[0078] In this embodiment, the inclined surface of the enclosure 2 is wavy. On the one hand, when glue is coated on the areas of the substrate 1 on both sides of the enclosure 2, the wavy cross-section of the inclined surface is conducive to the mixing of the glue on both sides of the enclosure 2, which can improve the adhesion of the glue and improve the packaging effect. On the other hand, by selecting the wavy cross-section, the side of the inclined surface facing away from the display area has protrusions and depressions, so that part of the glue can be filled on the inclined surface, increasing the contact area between the glue and the inclined surface. After the glue solidifies, the glue frame 5 and the enclosure 2 can have a stronger bonding force, which can improve the mechanical strength of the glue frame 5 and improve the packaging effect.

[0079] like Figure 1 As shown, in a feasible embodiment, the cross-section of the enclosure 2 has a right triangle shape, the surface of the enclosure 2 facing the inner side of the substrate 1 corresponds to the hypotenuse of the right triangle, and the surface of the enclosure 2 facing the outer side of the substrate 1 corresponds to one right-angled side of the right triangle.

[0080] like Figure 1 As shown, the cross section of the enclosure 2 has a right triangle shape, and the hypotenuse of the right triangle faces the inner side of the substrate 1, so that the glue liquid flows from the inner side of the substrate 1 to the outer side of the substrate 1. The right angle side of the right triangle faces the outer side of the substrate 1, so that the enclosure 2 can better block the glue liquid on the outer side of the substrate 1.

[0081] like Figure 1 As shown, in a feasible implementation manner, the packaging structure further includes a filling glue 6 located inside the glue frame 5 and used for packaging the light-emitting device 4 on the substrate 1 .

[0082] like Figure 1 As shown, by setting the filling glue 6, the light-emitting device 4 can be better fixed, the light-emitting device 4 can be prevented from displacement, and external water vapor or dust can be prevented from entering the light-emitting device 4, which is particularly suitable for packaging the organic light-emitting device 4.

[0083] In a feasible embodiment, there is a display area on the substrate 1, and the distance between the enclosure 2 and the periphery of the display area is 0 mm to 0.5 mm; and / or the height of the enclosure 2 is 2 μm to 6 μm, and the width of the bottom surface where the enclosure 2 is connected to the substrate 1 is 10 μm to 30 μm.

[0084] In this embodiment, the distance between the enclosure 2 and the periphery of the display area is 0 mm to 0.5 mm. In the process of encapsulating the light-emitting device 4 through the encapsulation structure, the final formed plastic frame 5 is located on the periphery of the display area, which can control the position of the plastic frame 5, and can further facilitate the preparation of a narrow-frame display screen. When the distance between the enclosure 2 and the display area is less than 0 mm, at least part of the enclosure 2 will be in the display area, and the user can see the plastic frame 5 or the enclosure 2 through the display area, which reduces the display effect. When the distance between the enclosure 2 and the display area exceeds 0.5 mm, it is possible that most of the area of ​​the plastic frame 5 will be between the enclosure 2 and the display area, which will also affect the display effect and is not conducive to shortening the width of the plastic frame 5.

[0085] In this embodiment, the height of the enclosure 2 is 2 μm to 6 μm. By determining the height range, the amount of the glue liquid flowing over the enclosure 2 can be reasonably controlled, thereby ensuring that the glue liquid can encapsulate the light-emitting device 4 while minimizing the width of the glue frame 5. When the height of the enclosure 2 is less than 2 μm, the height of the enclosure 2 is too low, and the enclosure 2 has a weak blocking effect on the glue liquid, which is not conducive to shortening the width of the glue frame 5; when the height of the enclosure 2 is greater than 6 μm, the height of the enclosure 2 is too high, and the enclosure 2 has a strong blocking effect on the glue liquid, and the glue liquid will find it difficult to pass over the enclosure 2, resulting in a poor encapsulation effect.

[0086] In this embodiment, the distance between the enclosure 2 and the periphery of the display area is 0 mm to 0.5 mm; the height of the enclosure 2 is 2 μm to 6 μm, and the width of the bottom surface of the connection between the enclosure 2 and the substrate 1 is 10 μm to 30 μm, which can make the width of the rubber frame 5 finally formed on the substrate 1 less than or equal to 1 mm, facilitating the preparation of narrow-edge display screens.

[0087] like Figure 4 As shown, an embodiment of the present application provides a method for preparing a packaging structure, comprising:

[0088] Step 101: providing a substrate; the substrate may be a glass substrate or a TFT (thin film transistor) substrate.

[0089] Step 102: Setting a blocking member on the periphery of the substrate; the blocking member can be set on the substrate by hot-melt welding or by photolithography. The setting of the blocking member can block the glue liquid to a certain extent during the packaging process, reduce the width of the glue frame, and facilitate the preparation of a narrow-frame display screen.

[0090] Step 103: Apply glue on the inner side and / or outer side of the enclosure, and connect the cover plate to the substrate through the glue. The cover plate can be prepared by injection molding, pressing, etc. The cover plate is used to connect to the substrate to encapsulate the light-emitting device disposed between the cover plate and the substrate.

[0091] The preparation method of the packaging structure provided by the present invention comprises a substrate having an enclosure provided on the prepared packaging structure. In the process of packaging the light-emitting device by means of the packaging structure, glue can be applied to the area of ​​the substrate located on one side or both sides of the enclosure, the light-emitting device is arranged on the substrate, and the cover plate is pressed onto the substrate. In the process of pressing the cover plate onto the substrate, the cover plate can squeeze the glue, and part of the glue will flow over the enclosure to the other side of the enclosure due to the squeezing effect of the cover plate. The cover plate is bonded to the substrate through the glue to complete the packaging of the light-emitting device. In the process of bonding the cover plate to the substrate, the enclosure can play a certain blocking role on the glue, thereby limiting the diffusion amount and diffusion space of the glue, and at the same time ensuring the smooth bonding of the cover plate and the substrate, and can greatly shorten the width of the glue frame while ensuring the packaging effect, so that the width of the glue frame used to package the light-emitting device is reduced, which is convenient for the preparation of narrow-frame display screens.

[0092] like Figures 5 to 7 As shown, in a feasible implementation manner, the step of providing the enclosure 2 on the periphery of the substrate 1 includes: forming a photoresist layer 7 on the substrate 1; and photolithography the photoresist layer 7 through a photolithography process to form the enclosure 2.

[0093] In this embodiment, the enclosure on the substrate is prepared by a photolithography process, which makes it easy to control the height, shape and width of the enclosure, and further to control the amount of glue passing over the enclosure, thereby shortening the width of the glue frame formed on the substrate.

[0094] In some examples, the step of forming a photoresist layer on the substrate may include spin coating a material of the enclosure on the substrate 1. The material of the enclosure includes one or more of benzocyclobutene (BCB), photoresist, phenol-based resin, polypropylene-based resin, polyimide-based resin and propylene-based resin. The photoresist layer formed by this method facilitates the molding of the enclosure and facilitates the bonding of the molded enclosure with the glue on the substrate, which can improve the mechanical strength of the packaging structure.

[0095] In a feasible embodiment, the photoresist layer is photolithographically processed by a photolithography process, and the step of forming an enclosure includes: setting a first shielding member above the photoresist layer, projecting the etching light vertically onto the photoresist layer via the first shielding member, and obtaining the first enclosure semi-finished product by a first photolithography process; setting a second shielding member obliquely above the first enclosure semi-finished product, projecting the etching light obliquely onto the photoresist layer via the second shielding member, and obtaining the enclosure by a second photolithography process, so that the surface of the enclosure facing the inner side of the substrate is provided with a slope, and the slope is inclined upward in a direction from the inner side of the substrate toward the outer side of the substrate.

[0096] like Figure 5 As shown, in this embodiment, the upper part of the photoresist layer 7 is first blocked by the first shielding member 13, and then the photoresist layer 7 is exposed by vertically projected light and then etched to form a first enclosure semi-finished product 8 with a rectangular cross-section, and then the second shielding member 14 is arranged obliquely above the first enclosure semi-finished product 8, and the etching light is emitted obliquely, and the first enclosure semi-finished product 8 can be etched by the etching light, and finally an enclosure 2 with a bevel can be formed. The formation of the beveled enclosure 2 facilitates the glue liquid to pass over the enclosure 2, and during the packaging process, it is convenient for the glue frame 5 to be formed on the substrate 1, which facilitates the bonding of the cover plate 3 and the substrate 1.

[0097] It can be understood that the first shielding member 13 and the second shielding member 14 can be masks, and the etching light can be ultraviolet light.

[0098] In a feasible embodiment, the photoresist layer is photolithographically processed by a photolithography process, and the step of forming an enclosure includes: setting a third shielding member above the photoresist layer, projecting a strip of etching light vertically onto the photoresist layer via the third shielding member, and forming a second enclosure semi-finished product on the substrate via the third photolithography process, so that the second enclosure semi-finished product has an inclined surface inclined upward from the inner side of the substrate toward the outer side of the substrate; setting a fourth shielding member above the second enclosure semi-finished product; emitting an etching light in the direction of the second enclosure semi-finished product via the fourth shielding member, and forming an enclosure on the substrate, the enclosure having an inclined surface inclined upward from the inner side of the substrate toward the outer side of the substrate.

[0099] like Figure 6As shown, in this embodiment, a strip light source can be used as a light source for emitting etching light. During the etching process, the cross section of the etching light emitted by the strip light source is fan-shaped. The shorter the distance from the strip light source, the stronger the etching intensity, and vice versa. By shielding the third shielding member 15 above the photoresist layer 7, the etching light is emitted by the strip light source, so that the area farther away from the photoresist layer 7 from the strip light source, that is, the area obliquely facing the strip light source, can receive less etching light, and the area closer to the strip light source, that is, the area directly facing the light source, can receive more etching light, and finally a second enclosure semi-finished product 9 with an inclined surface can be formed on the photoresist layer 7. Then, the fourth covering member 16 is used to cover the second enclosure member semi-finished product 9, and the etching light is emitted again for photolithography to form an enclosure member 2 with a bevel. The formation of the beveled enclosure member 2 facilitates the glue to pass over the enclosure member 2, and facilitates the formation of the glue frame 5 on the substrate 1 during the packaging process, which facilitates the bonding of the cover plate 3 and the substrate 1.

[0100] It can be understood that in the process of emitting etching light through a strip light source so that the second enclosure component semi-finished product has an inclined surface inclined upward from the inner side of the substrate toward the outer side of the substrate, the intensity of the etching light emitted by the strip light source can be gradually reduced. On the one hand, it can avoid the etching light intensity being too strong to directly etch the entire photoresist layer, resulting in the failure to form the second enclosure component semi-finished product with an inclined surface; on the other hand, by gradually reducing the intensity of the etching light emitted by the strip light source, the difference in light intensity at different positions away from the strip light source can be made more significant, which is conducive to the formation of the inclined surface; on the other hand, through the difference in etching intensity, the inclined surface of the second enclosure component can be made wavy.

[0101] It can be understood that the third shielding member 15 and the fourth shielding member 16 can be masks, and the etching light can be ultraviolet light.

[0102] In a feasible embodiment, the above-mentioned photoresist layer is photolithographically processed by a photolithography process, and the step of forming an enclosure includes: setting a halftone mask template above the photoresist layer; emitting etching light in the direction of the photoresist layer through the halftone mask template, and forming an enclosure on the substrate by a photolithography process, so that the enclosure has an inclined surface inclined upward from the inside of the substrate toward the outside of the substrate.

[0103] like Figure 7As shown, in this embodiment, the photoresist layer 7 can be shielded by a half-tone mask 10, and then etching light is emitted to the photoresist layer 7. Since the half-tone mask 10 has partial light transmittance, the enclosure 2 with a bevel can be formed by one etching by adjusting the thickness of the half-tone mask 10, which simplifies the steps of the etching process and improves the production efficiency of the enclosure 2. The formation of the beveled enclosure 2 facilitates the glue liquid to pass over the enclosure 2, facilitates the formation of the glue frame 5 on the substrate 1 during the packaging process, and facilitates the bonding of the cover plate 3 and the substrate 1.

[0104] like Figure 7 As shown, in some examples, the height of one side of the cross section of the halftone mask 10 along the height direction of the substrate 1 is higher than the height of the other side. For example, the cross section of the halftone mask along the height direction may be a triangle, and the etching light may be ultraviolet light.

[0105] like Figure 8 As shown, an embodiment of the present application provides a display assembly, including: any one of the above-mentioned packaging structures; a light-emitting device 4, which is arranged between the substrate 1 and the cover plate 3 and located inside the rubber frame 5.

[0106] The display assembly provided in the embodiment of the present application includes any of the above-mentioned packaging structures and the light-emitting device 4. The light-emitting device 4 is arranged between the cover plate 3 and the substrate 1, and the upper and lower sides of the light-emitting device 4 can be blocked by the cover plate 3 and the substrate 1. The plastic frame 5 is arranged on the peripheral side of the light-emitting device 4 to block the peripheral side of the light-emitting device 4. The plastic frame 5 can be connected to the substrate 1 and the cover plate 3, so that the light-emitting device 4 can be in a closed space, which can prevent external water vapor or dust from entering the light-emitting device 4, and can ensure the use effect and service life of the light-emitting device 4.

[0107] In some examples, when the packaging component includes a filling glue 6, the filling glue 6 is filled in the glue frame 5 to further fill the enclosed space, so that the surrounding side of the light-emitting device 4 is wrapped by the filling glue, which can prevent the display component from being vibrated by external forces and causing the light-emitting device 4 to move, thereby ensuring the stability of the positioning of the light-emitting device 4 and further improving the display effect.

[0108] The display assembly provided in the embodiment of the present application encapsulates the light emitting device 4 through the glue frame 5 and the filling glue 6, and has the characteristics of good encapsulation effect, simple production process, large size, high light transmittance, etc. It is particularly suitable for encapsulating organic light emitting devices.

[0109] The display component provided in the embodiment of the present application has a packaging structure including a substrate 1, a blocking member 2 and a cover plate 3. The blocking member 2 is arranged on the substrate 1. In the process of packaging the light-emitting device 4 through the packaging structure, glue can be applied to the area of ​​the substrate 1 located on one side or both sides of the blocking member 2, and the light-emitting device 4 is arranged on the substrate 1, and the cover plate 3 is pressed onto the substrate 1. In the process of pressing the cover plate 3 onto the substrate 1, the cover plate 3 can squeeze the glue, and part of the glue will flow over the blocking member 2 to the other side of the blocking member due to the squeezing effect of the cover plate 3. The cover plate 3 is bonded to the substrate 1 through the glue to complete the packaging of the light-emitting device 4. In the process of bonding the cover plate 3 to the substrate 1, the blocking member 2 can play a certain blocking role on the glue, limit the diffusion amount and diffusion space of the glue, and at the same time ensure the smooth bonding of the cover plate 3 and the substrate 1, and can greatly shorten the width of the glue frame while ensuring the packaging effect, so that the width of the glue frame used to package the light-emitting device 4 is reduced, the frame of the display component is narrowed, the display effect of the display component is improved, and the user experience can be improved.

[0110] like Fig. 9 As shown, an embodiment of the present application provides a packaging method based on any one of the above packaging structures, including:

[0111] Step 201: Glue is disposed on the substrate, and the glue is located on at least one side of the inner side and the outer side of the enclosure to form a glue frame; the glue is coated on at least one side of the enclosure, and the enclosure can have a certain barrier effect on the glue and reduce the area of ​​the glue diffusion, thereby reducing the width of the glue frame.

[0112] Step 202: Dispose a light-emitting device on a substrate; a display area may be provided on the substrate, and the light-emitting device is disposed on the display area.

[0113] Step 203: Press the cover plate onto the substrate, and bond the cover plate to the substrate via a glue frame. The light emitting device can be sealed by pressing and bonding the cover plate to the substrate, thus completing the packaging of the light emitting device.

[0114] The packaging method provided by the embodiment of the present application, during the packaging process, glue is set on the substrate, the light-emitting device is set on the substrate, the cover plate is pressed on the substrate, and the cover plate is bonded to the substrate through the glue to complete the packaging of the light-emitting device. In the process of pressing the cover plate to the substrate, the cover plate can squeeze the glue, and part of the glue will flow over the enclosure to the other side of the enclosure due to the squeezing of the cover plate. The cover plate is bonded to the substrate through the glue to complete the packaging of the light-emitting device. In the process of bonding the cover plate to the substrate, the enclosure can play a certain blocking role on the glue, limiting the diffusion amount and diffusion space of the glue, and at the same time can ensure the smooth bonding of the cover plate and the substrate, and can greatly shorten the width of the glue frame while ensuring the packaging effect, so that the width of the glue frame used to encapsulate the light-emitting device is reduced, which is convenient for the preparation of narrow-frame display screens.

[0115] In some examples, after the step of pressing the cover plate onto the substrate and bonding the cover plate to the substrate via glue, the packaging method further includes: irradiating at least one of the cover plate, the substrate and the glue via ultraviolet light to solidify the glue. Such a configuration can improve the efficiency of glue solidification and improve packaging efficiency.

[0116] In some examples, after the step of pressing the cover plate onto the substrate and bonding the cover plate to the substrate via glue, the packaging method further includes: heating the glue between the cover plate and the substrate to solidify the glue. Such a setting can improve the efficiency of glue solidification and improve packaging efficiency.

[0117] In some examples, a display area is disposed on the substrate, the enclosure is located around the display area, and the light-emitting device is disposed in the display area.

[0118] In a feasible embodiment, setting the glue on the substrate includes: setting a first mixed hardened glue on the outer side of the enclosure, and setting a second mixed hardened glue on the inner side of the enclosure; setting a filling glue on the side of the second mixed hardened glue away from the enclosure, so that the light-emitting device is bonded to the substrate through the filling glue.

[0119] like Fig.10 As shown, in this embodiment, the step of setting glue on the substrate 1 includes: setting a first mixed hardening glue 11 on one side of the enclosure 2, and setting a second mixed hardening glue 12 on the other side; and setting a filling glue 6 on the side of the second mixed hardening glue 12 away from the enclosure 2. With such a setting, on the one hand, when the cover plate 3 is pressed onto the substrate 1, the cover plate 3 squeezes the filling glue 6, and the filling glue 6 can push the second mixed hardening glue 12 to move over the enclosure 2 to the side of the first mixed hardening glue 11. The first mixed hardening glue 11 and the second mixed hardening glue 12 are mixed to quickly bond the cover plate 3, while the filling glue 6 is blocked by the enclosure 2, the mixture of the first mixed hardening glue 11 and the second mixed hardening glue 12, and cannot cross the enclosure 2, further reducing the diffusion amount and diffusion range of the glue; on the other hand, the first mixed hardening glue 11 and the second mixed hardening glue 12 are separated by the enclosure 2, and the first mixed hardening glue 11 and the second mixed hardening glue 12 are mixed only when the cover plate 3 is bonded, which can prevent the glue from hardening prematurely. Among them, Fig.10 The direction of the middle arrow indicates the direction in which the filling glue 6 is displaced when the cover plate 3 is pressed onto the substrate 1 .

[0120] like Fig.10 As shown, in some examples, the coating height of the filling glue 6 is higher than the coating height of the second mixed hardening glue 12 .

[0121] like Fig.10As shown, in this embodiment, the step of setting glue on the substrate 1 includes: setting a first mixed hardening glue 11 on one side of the enclosure 2, and setting a second mixed hardening glue 12 on the other side. In this way, when the cover plate 3 is pressed on the substrate 1, the first mixed hardening glue 11 and the second mixed hardening glue 12 can pass over the enclosure 2, and the first mixed hardening glue 11 and the second mixed hardening glue 12 are mixed to obtain a hardening glue mixture, thereby increasing the hardness and viscosity, which is convenient for the cover plate 3 to be bonded to the substrate 1.

[0122] In some examples, one of the first mixed hardening adhesive and the second mixed hardening adhesive includes epoxy adhesive, and the other includes modified amine.

[0123] In this embodiment, one of the first mixed hardening glue and the second mixed hardening glue includes epoxy glue, and the other includes modified amine. After the first mixed hardening glue and the second mixed hardening glue are mixed, the epoxy glue can react with the modified amine to increase the hardness and viscosity of the hardening glue mixture, thereby facilitating the cover plate to be bonded to the substrate.

[0124] In some examples, one of the first mixed hardening glue and the second mixed hardening glue includes a modified epoxy glue, and the other includes a modified amine, so that the first mixed hardening glue and the second mixed hardening glue are hardened within 5 minutes after mixing, and the viscosity reaches 1000000 mPa·s within 1 minute. The packaging efficiency can be improved, and the rapid prototyping of the first mixed hardening glue and the second mixed hardening glue is conducive to shortening the width of the glue frame.

[0125] In some examples, a display area is formed on the substrate, the light-emitting device is disposed in the display area, the second mixed hardened glue and the filling glue are located between the display area and the enclosure, and the first mixed hardened glue is located on a side of the enclosure away from the display area.

[0126] In some examples, the first mixed hardening glue has a coating width of 20 μm to 50 μm and a height of 5 μm to 20 μm, and the second mixed hardening glue has a coating width of 20 μm to 50 μm and a height of 5 μm to 20 μm; wherein the filling glue includes UV-curable resin glue and / or thermal-curable resin glue. Such an arrangement enables the first mixed hardening glue and the second mixed hardening glue to be mixed and solidified, and the glue frame width is less than 1 mm, and a narrow-frame display screen can be prepared.

[0127] like Fig.10 As shown, in this embodiment, a filling glue 6 is provided on a side of the second mixed hardened glue 12 away from the enclosure 2 , and the filling glue 6 can play a role in positioning and fixing the light-emitting device 4 to avoid displacement of the light-emitting device 4 during the packaging process.

[0128] In some examples, the filling glue can be applied in a linear or dotted manner on a side of the second mixed hardening glue away from the enclosure to facilitate positioning of the light-emitting device.

[0129] In some examples, the filling glue may be a UV-curable resin glue or a thermal-curable resin glue, so that the viscosity of the filling glue is relatively low and the curing of the filling glue is facilitated.

[0130] In some examples, the filling glue may include one or more of epoxy resin, glycidyl acrylate, glycidyl methacrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, 6,7-epoxyheptyl methacrylate, 2-hydroxyethyl methacrylate and other monomers, melamine formaldehyde resin, unsaturated polyester resin, silicone resin, furan resin, and the viscosity of the filling glue is between 10mPa·s and 2000mPa·s to ensure the packaging effect of the light-emitting device.

[0131] In a feasible embodiment, pressing the cover plate onto the substrate includes: pressing the cover plate onto the substrate, allowing the second mixed hardening glue to pass through the enclosure and mix with the first mixed hardening glue to obtain a hardening glue mixture; and bonding the cover plate to the substrate through the hardening glue mixture.

[0132] In this embodiment, the light-emitting device can be preliminarily positioned by setting the filling glue, which can prevent the light-emitting device from being displaced during the packaging process and ensure the packaging accuracy.

[0133] In a feasible embodiment, the cover plate is pressed onto the substrate, and the step of bonding the cover plate to the substrate via glue includes: pressing the cover plate onto the substrate, allowing the second mixed hardening glue to pass through the enclosure and mix with the first mixed hardening glue to obtain a hardening glue mixture; and bonding the cover plate to the substrate via the hardening glue mixture.

[0134] In this embodiment, when the cover plate is pressed on the substrate, the cover plate is pressed on the filling glue and / or the second mixed hardened glue. The second mixed hardened glue can pass through the enclosure and mix with the first mixed hardened glue under the thrust of the filling glue and / or the pressure of the cover plate. After the first mixed hardened glue and the second mixed hardened glue are mixed, they can be quickly solidified to form a glue frame, and the filling glue in the glue frame is difficult to pass through the enclosure under the resistance of the enclosure and the glue frame. The filling glue can be filled in the glue frame to encapsulate the light-emitting device. The diffusion amount and diffusion area of ​​the glue liquid can be greatly reduced, which plays a role in reducing the width of the glue frame, and can prepare a display component with a narrow frame.

[0135] In some examples, the substrate has a display area for arranging the light-emitting device, and the enclosure is formed with an inclined surface, which is arranged toward the display area, so that the glue on the display area side can pass over the enclosure. Furthermore, the outer contour of the block cross section is curved, so as to facilitate repeated mixing of the first mixed hardening glue and the second mixed hardening glue, which can improve the bonding and hardness of the hardening glue mixture, and at the same time, the enclosure can be firmly bonded to the hardening glue mixture, thereby improving the packaging effect.

[0136] In some examples, a cross section of the enclosure along the height direction of the substrate is approximately a right triangle, a display area for arranging the light-emitting device is provided on the substrate, and the hypotenuse of the right triangle faces one side of the display area.

[0137] Although the preferred embodiments of this specification have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of this specification.

[0138] Obviously, those skilled in the art can make various changes and modifications to this specification without departing from the spirit and scope of this specification. Thus, if these modifications and variations of this specification fall within the scope of the claims of this specification and their equivalents, this specification is also intended to include these modifications and variations.

Claims

1. A display component, characterized in that: include: Packaging structure and light emitting device; The packaging structure comprises: substrate; A blocking member, arranged on the periphery of the substrate; A plastic frame, disposed on the substrate and covering the enclosure; A cover plate is arranged opposite to the substrate and connected to the substrate through the plastic frame, and the light emitting device is arranged between the substrate and the cover plate and located inside the plastic frame; The surface of the enclosure member facing the inner side of the substrate is provided with an inclined surface, and the inclined surface is inclined upward in a direction from the inner side of the substrate toward the outer side of the substrate; The cross section of the enclosure has a right triangle shape, the surface of the enclosure facing the inner side of the substrate corresponds to the hypotenuse of the right triangle, and the surface of the enclosure facing the outer side of the substrate corresponds to one right-angled side of the right triangle.

2. The display assembly according to claim 1, characterized in that The inclined surface of the enclosure is wavy.

3. The display assembly according to claim 1, characterized in that: It also includes a filling glue located inside the glue frame and used for packaging the light-emitting device on the substrate.

4. The display assembly according to claim 1, characterized in that: The substrate has a display area, and the distance between the enclosure and the periphery of the display area is 0 mm to 0.5 mm; and / or The height of the enclosure is 2 μm to 6 μm, and the width of the bottom surface of the enclosure connected to the substrate is 10 μm to 30 μm.

5. A method for preparing a display assembly according to any one of claims 1 to 4, characterized in that: include: providing a substrate; Arranging a barrier on the periphery of the substrate; Glue is applied on the inner side and / or outer side of the enclosure, and the cover plate is connected to the base plate through the glue.

6. The preparation method according to claim 5, characterized in that: The step of providing a barrier on the periphery of the substrate comprises: forming a photoresist layer on the substrate; The photoresist layer is photoetched by a photolithography process to form the enclosure.

7. The preparation method according to claim 6, characterized in that: The step of performing photolithography on the photoresist layer by a photolithography process to form the enclosure comprises: Disposing a first shielding member above the photoresist layer, projecting etching light vertically onto the photoresist layer via the first shielding member, and obtaining a first enclosure semi-finished product through a first photolithography process; A second shielding member is disposed obliquely above the first enclosure semi-finished product, and etching light is obliquely projected onto the photoresist layer through the second shielding member. The enclosure is obtained through a second photolithography process, so that a surface of the enclosure facing the inner side of the substrate is provided with a slope, and the slope is inclined upward in a direction from the inner side of the substrate toward the outer side of the substrate.

8. The preparation method according to claim 6, characterized in that: The step of performing photolithography on the photoresist layer by a photolithography process to form the enclosure comprises: Disposing a third shielding member above the photoresist layer, projecting a strip-shaped etching light vertically onto the photoresist layer via the third shielding member, and forming a second enclosure semi-finished product on the substrate by a third photolithography process, so that the second enclosure semi-finished product has an inclined surface that tilts upward from the inner side of the substrate toward the outer side of the substrate; Disposing the fourth shielding member above the second enclosure member semi-finished product; Etching light is emitted vertically toward the second enclosure semi-finished product through the fourth shielding member to form the enclosure on the substrate, wherein the enclosure has the inclined surface that is inclined upward from the inner side of the substrate toward the outer side of the substrate.

9. The preparation method according to claim 6, characterized in that: The step of performing photolithography on the photoresist layer by a photolithography process to form the enclosure comprises: Disposing a half-tone mask above the photoresist layer; Etching light is emitted vertically toward the photoresist layer through the half-tone mask, and a barrier is formed on the substrate through a photolithography process, so that the barrier has an inclined surface that tilts upward from the inner side of the substrate toward the outer side of the substrate.

10. A packaging method for a display assembly according to any one of claims 1 to 4, characterized in that: include: A glue liquid is arranged on the substrate, and the glue liquid is located on at least one side of the inner side and the outer side of the enclosure to form a glue frame; Disposing a light emitting device on the substrate; The cover plate is pressed onto the base plate, and the cover plate is bonded to the base plate through the glue frame.

11. The packaging method according to claim 10, characterized in that: The step of providing glue on the substrate comprises: A first mixed hardening glue is arranged on the outer side of the enclosure, and a second mixed hardening glue is arranged on the inner side of the enclosure; A filling glue is arranged on a side of the second mixed hardening glue away from the enclosure member, so that the light emitting device is bonded to the substrate through the filling glue.

12. The packaging method according to claim 11, characterized in that: The pressing the cover plate onto the substrate comprises: Pressing the cover plate onto the base plate, so that the second mixed hardening adhesive passes over the enclosure and mixes with the first mixed hardening adhesive to obtain a hardening adhesive mixture; The cover plate is bonded to the base plate through the hardening adhesive mixture.

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