Compression and tensile resistant assemblies and cables for oilfield applications

Abstract

Compressibility and tensile strength components and cables for oilfield applications are disclosed. A photoelectric cable may include a photoelectric cable core and a polymer layer surrounding the photoelectric cable core. The photoelectric cable core may include conductors, one or more channels extending longitudinally along the conductors, and one or more optical fibers extending within each channel. The photoelectric cable can be manufactured by a method comprising: providing conductors having channels; providing optical fibers within the channels to form the photoelectric cable core; and applying a polymer layer around the photoelectric cable core. Multi-component cables may include one or more electrical conductor cables arranged in a coaxial, three-core, four-core, or seven-core configuration and one or more photoelectric cables. A deformable polymer may surround the photoelectric cable and the electrical conductor cables.

Description

[0001] Cross-references to related applications

[0002] This application is a partial continuation of U.S. Patent Application Serial No. 16 / 100,423, filed August 10, 2018, entitled "COMPRESSION AND STRETCH RESISTANT COMPONENTS AND CABLES FOR OILFIELD APPLICATIONS," which is a divisional of U.S. Patent Application Serial No. 15 / 177,616, filed June 9, 2016, entitled "COMPRESSION AND STRETCH RESISTANT COMPONENTS AND CABLES FOR OILFIELD APPLICATIONS," the contents of which are incorporated herein by reference in their entirety.

[0003] Domain Technology

[0004] The embodiments of this disclosure generally relate to cables for providing power and telemetry to downhole tools. Background Technology

[0005] Some optoelectronic cables used to power and telemetry downhole tools consist of a tube formed by a semi-circular profile surrounding an optical fiber. Traditionally, such optoelectronic cables are subject to "extrusion" when subjected to longitudinal strain and / or compressive forces, in which the filler adhesive and / or optical fiber inside the tube are extruded from the tube. Manufacturing defects can increase the occurrence of extrusion. Summary of the Invention

[0006] This disclosure provides an optoelectronic cable. The optoelectronic cable includes an optoelectronic cable core and a polymer layer that surrounds the optoelectronic cable core longitudinally and circumferentially. The optoelectronic cable core includes: a conductor; at least one channel formed within the conductor and extending longitudinally along the conductor; and an optical fiber extending longitudinally within each channel.

[0007] This disclosure provides a multi-component cable. The multi-component cable includes an electrical conductor cable and a photoelectric cable. A deformable polymer surrounds the photoelectric cable and the electrical conductor cable longitudinally and circumferentially. The photoelectric cable and the electrical conductor cable are arranged within the deformable polymer in a coaxial, three-core, four-core, or seven-core configuration. Each photoelectric cable includes a photoelectric cable core. Each photoelectric cable core includes: a conductor; at least one channel formed within the conductor and extending longitudinally along the conductor; and an optical fiber extending longitudinally within each channel. A polymer layer surrounds each photoelectric cable core longitudinally and circumferentially.

[0008] This disclosure provides a method. The method includes providing a conductor having at least one channel extending longitudinally within and along the conductor. The method includes providing an optical fiber extending longitudinally within each channel. The conductor and the optical fiber form a photoelectric cable core. The method includes applying a polymer layer longitudinally and circumferentially around the photoelectric cable core to form a photoelectric cable. Attached Figure Description

[0009] This disclosure should be understood in conjunction with the accompanying drawings and the following specific embodiments. It should be emphasized that, according to standard industry practice, various features may not be drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or decreased for clarity of discussion.

[0010] Figure 1 A cross-sectional view of an optoelectronic cable including conductors with a channel and cover configuration, according to certain embodiments of the present disclosure, is depicted.

[0011] Figures 1A to 1F The illustration depicts certain embodiments according to this disclosure. Figure 1 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0012] Figure 2 A cross-sectional view of an optoelectronic cable including conductors having multiple channels, according to certain embodiments of the present disclosure, is depicted.

[0013] Figures 2A to 2D The illustration depicts certain embodiments according to this disclosure. Figure 2 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0014] Figure 3 A cross-sectional view of an optoelectronic cable including a conductor with a single channel, according to certain embodiments of the present disclosure, is depicted.

[0015] Figures 3A to 3D The illustration depicts certain embodiments according to this disclosure. Figure 3 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0016] Figure 4 A cross-sectional view of an optoelectronic cable comprising a conductor having a single channel and a flat base, according to certain embodiments of the present disclosure, is depicted.

[0017] Figures 4A to 4D The illustration depicts certain embodiments according to this disclosure. Figure 4 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0018] Figure 5 A cross-sectional view of an optoelectronic cable including a conductor having a single channel and a C-shaped profile, according to certain embodiments of the present disclosure, is depicted.

[0019] Figures 5A to 5E The illustration depicts certain embodiments according to this disclosure. Figure 5 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0020] Figures 6A to 6D A cross-sectional view of an optoelectronic cable with a complete layer according to certain embodiments of the present disclosure is depicted.

[0021] Figures 7A to 7D An additional cross-sectional view of a photoelectric cable having a complete layer according to certain embodiments of the present disclosure is depicted.

[0022] Figures 8A to 8D An additional cross-sectional view of a photoelectric cable having a complete layer according to certain embodiments of the present disclosure is depicted.

[0023] Figures 9A to 9D An additional cross-sectional view of a photoelectric cable having a complete layer according to certain embodiments of the present disclosure is depicted.

[0024] Figures 10A to 10D An additional cross-sectional view of a photoelectric cable having a complete layer according to certain embodiments of the present disclosure is depicted.

[0025] Figures 11A to 11D A cross-sectional view is depicted illustrating the manufacture of an optoelectronic cable with a complete layer according to certain embodiments of the present disclosure.

[0026] Figure 12 A cross-sectional view of a multi-component cable according to certain embodiments of the present disclosure is depicted.

[0027] Figures 13A to 13C A cross-sectional view of a sheathed multi-component cable with an arched profile, according to certain embodiments of the present disclosure, is depicted.

[0028] Figures 14A to 14H A cross-sectional view depicting the manufacture of a sheathed multi-component cable with an arched profile according to certain embodiments of the present disclosure is shown.

[0029] Figures 15A to 15C A cross-sectional view of a sheathed multi-component cable having a corrugated metal stripe is depicted according to certain embodiments of the present disclosure.

[0030] Figures 16A to 16I A cross-sectional view is depicted illustrating the manufacture of a sheathed multi-component cable having a corrugated metal strip according to certain embodiments of the present disclosure.

[0031] Figures 17A to 17C A cross-sectional view of a sheathed multi-component cable having a single layer of metal sheathing tape, according to certain embodiments of the present disclosure, is depicted.

[0032] Figures 18A to 18H A cross-sectional view is depicted illustrating the manufacture of a sheathed multi-component cable with a layer of metal overlay according to certain embodiments of the present disclosure.

[0033] Figures 19A to 19C A cross-sectional view of a sheathed multi-component cable having a layer of rigid polymer, according to certain embodiments of the present disclosure, is depicted.

[0034] Figures 20A to 20G A cross-sectional view is depicted illustrating the manufacture of a sheathed multi-component cable having a layer of rigid polymer according to certain embodiments of the present disclosure.

[0035] Figure 21 A cross-sectional view of an optoelectronic cable including conductors with a channel and cover configuration, according to certain embodiments of the present disclosure, is depicted.

[0036] Figures 21A to 21F The illustration depicts certain embodiments according to this disclosure. Figure 21 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0037] Figure 22 A cross-sectional view of an optoelectronic cable including conductors with a channel and cover configuration, according to certain embodiments of the present disclosure, is depicted.

[0038] Figures 22A to 22F The illustration depicts certain embodiments according to this disclosure. Figure 22 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0039] Figure 23 A cross-sectional view of an optoelectronic cable including conductors with a channel and cover configuration, according to certain embodiments of the present disclosure, is depicted.

[0040] Figures 23A to 23F The illustration depicts certain embodiments according to this disclosure. Figure 23 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0041] Figure 24 A cross-sectional view of an optoelectronic cable including conductors with a channel and cover configuration, according to certain embodiments of the present disclosure, is depicted.

[0042] Figures 24A to 24F The illustration depicts certain embodiments according to this disclosure. Figure 24 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0043] Figure 25 A cross-sectional view of an optoelectronic cable including a baseline having a stepped mating interface, according to certain embodiments of the present disclosure, is depicted.

[0044] Figures 25A to 25D The illustration depicts certain embodiments according to this disclosure. Figure 25 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0045] Figure 26 A cross-sectional view of an optoelectronic cable including a baseline with a tilted mating interface, according to certain embodiments of the present disclosure, is depicted.

[0046] Figures 26A to 26D The illustration depicts certain embodiments according to this disclosure. Figure 26 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0047] Figure 27 A cross-sectional view of an optoelectronic cable including a baseline having a bonded interface, according to certain embodiments of the present disclosure, is depicted.

[0048] Figures 27A to 27D The illustration depicts certain embodiments according to this disclosure. Figure 27 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0049] Figure 28 A cross-sectional view of an optoelectronic cable including a ring-shaped wire member with multiple arched profiles, according to certain embodiments of the present disclosure, is depicted.

[0050] Figures 28A to 28D The illustration depicts certain embodiments according to this disclosure. Figure 28 A cross-sectional view of the manufacturing process of the optoelectronic cable.

[0051] Figures 29A to 29H A cross-sectional view of an optoelectronic cable with a complete layer according to certain embodiments of the present disclosure is depicted.

[0052] Figures 30A to 30H A cross-sectional view of an optoelectronic cable with a complete layer according to certain embodiments of the present disclosure is depicted.

[0053] Figures 31A to 31HA cross-sectional view of an optoelectronic cable with a complete layer according to certain embodiments of the present disclosure is depicted.

[0054] Figures 32A to 32H A cross-sectional view of an optoelectronic cable with a complete layer according to certain embodiments of the present disclosure is depicted.

[0055] Figures 33A to 33H A cross-sectional view of an optoelectronic cable with a complete layer according to certain embodiments of the present disclosure is depicted. Detailed Implementation

[0056] A detailed description will now be provided. The following disclosure includes specific embodiments, versions, and examples, but this disclosure is not limited to these embodiments, versions, or examples, which are included to enable those skilled in the art to make and use this disclosure when combined with available information and techniques. Additionally, reference numerals and / or letters may be repeated in various examples. Such repetition is for simplicity and clarity and does not, in itself, establish a relationship between the various embodiments and / or configurations discussed.

[0057] The following shows the various terms used herein. Where terms used in the claims are not defined below, the broadest definitions given to them by those skilled in the art as reflected in printed publications and issued patents shall be applied. Furthermore, unless otherwise stated, all compounds described herein may be substituted or unsubstituted, and the list of compounds includes their derivatives.

[0058] Furthermore, various ranges and / or numerical limits may be explicitly stated below. It should be recognized that, unless otherwise stated, the endpoints are interchangeable. Where numerical ranges or limits are explicitly stated, such explicit ranges or limits should be understood to include iterative ranges or limits of similar magnitudes falling within the explicitly stated ranges or limits (e.g., about 1 to about 10 includes 2, 3, 4, etc.; greater than 0.10 includes 0.11, 0.12, 0.13, etc.).

[0059] Embodiments of this disclosure may include optoelectronic cables for providing power, data transmission, distributed sensing capabilities, or combinations thereof. For example, but not limited to, optoelectronic cables may be used to provide power, data transmission, distributed sensing capabilities, or combinations thereof to downhole tools within a wellbore. In some embodiments, the optoelectronic cable may include a stable, durable, tensile-resistant, and compression-resistant optoelectronic cable core suitable for resisting extrusion.

[0060] Figure 1An embodiment of an optoelectronic cable 100a is depicted. The optoelectronic cable 100a may include a baseline 104. The baseline 104 may include a channel 106 formed within the baseline 104 and extending along the longitudinal axis of the baseline. In some embodiments, the baseline 104 has a partially circular profile. The baseline 104 may be a conductive metal wire. For example, but not limited to, the baseline 104 may be copper wire, copper alloy wire, steel wire, or aluminum wire. In some embodiments, the baseline 104 has a baseline mating surface 108a (e.g., a mating surface). The baseline mating surface 108a may extend from the channel edge 109 to the outer circumference 109a of the conductor of the baseline 104. The channel 106 may be formed within the baseline 104 between two portions of the baseline mating surface 108a. In some embodiments, the baseline mating surface 108a is a flat surface. One or more optical fibers 110 may extend longitudinally within the channel 106. In some embodiments, the optical fibers 110 may be composed of acrylate fibers, polyimide fibers, or silicone perfluoroalkoxy (PFA) fibers. In some embodiments, filler 112 may encapsulate optical fiber 110 within channel 106. Filler 112 may provide protective cushioning for optical fiber 110. In some embodiments, filler 112 is a soft gel filler, such as silicone polymer gel. Optoelectronic cable 100a may include cover wire 104a. Cover wire 104a may be formed of the same or different conductive material as baseline 104. In some embodiments, cover wire 104a has a semi-circular outer profile. Cover wire 104a may be mechanically coupled to baseline 104. For example, but not limited to, cover wire 104a may include cover wire mating surface 108b and tabs 114 extending from cover wire mating surface 108b. In some embodiments, tabs 114 extend from cover wire mating surface 108b between two portions of cover wire mating surface 108b. The size and shape of tabs 114 may be configured to fit within channel 106 in baseline 104. Tabs 114 may extend at least partially into channel 106 and extend longitudinally along cover wire 104a. With the optical fiber 110 and filler 112 present within the channel 106, the tab 114 of the cover wire 104a can be mechanically coupled to the channel 106 of the baseline 104. For example, but not limited to, the tab 114 can be a tight fit, a positioning fit, or an interference fit within the channel 106. In some embodiments, the tab 114 can be press-fitted or retracted into the channel 106. When the cover wire 104a is mechanically coupled to the baseline 104, the cover wire mating surface 108b can contact the baseline mating surface 108a. In some embodiments, the cover wire mating surface 108b is a flat surface. The cover wire 104a can encapsulate and / or seal the channel 106. The optoelectronic cable 100a may include one or more polymer layers 118 that encapsulate the baseline 104 and the cover wire 104a. In some embodiments, the polymer layer 118 comprises one or more layers of tape.For example, but not limited to, the tape of polymer layer 118 may be a polyetheretherketone (PEEK) tape. In some embodiments, polymer layer 118 comprises one or more layers of extruded polymer. Polymer layer 118 can hold optical fiber 110 and filler 112 in proper position within channel 106. In some embodiments, opto-cable 100a has a circular profile. In operation, when opto-cable 100a is subjected to compressive forces and / or longitudinal strain, cover line 104a can remain mechanically connected to baseline 104. For example, protrusion 114 can remain mechanically connected within channel 106, thereby preventing or reducing extrusion.

[0061] Figures 1A to 1F The manufacture of the photoelectric cable 100a according to this disclosure is described. (As follows) Figure 1A As shown, a baseline 104 can be provided, having a baseline mating surface 108a and a channel 106. (As shown...) Figure 1B As shown, one or more optical fibers 110 can be placed within channel 106. For example... Figure 1C As shown, filler 112 can be placed in channel 106 to encapsulate optical fiber 110. For example... Figure 1D As shown, a cover wire 104a can be provided, having a tab 114 and a cover wire mating surface 108b. For example... Figure 1E As shown, the cover wire 104a and the baseline 104 can be mechanically connected by the following operation: engaging the tab 114 into the channel 106 and engaging the baseline mating surface 108a with the cover wire mating surface 108b, enclosing the channel 106 and forming the optoelectronic cable core 116a. Figure 1F As shown, one or more polymer layers 118 may be wound around or extruded over the photoelectric cable core 116a to encapsulate the photoelectric cable core 116a and form a photoelectric cable 100a. The polymer layers 118 may surround the photoelectric cable core 116a longitudinally and circumferentially.

[0062] Figure 2 Another embodiment of an optoelectronic cable consistent with this disclosure is depicted. The optoelectronic cable 100b may include a conductor 104b. In some embodiments, the conductor 104b has a circular profile. The conductor 104b may be made of the same or different material as the baseline 104. The conductor 104b may have one or more channels 106, two or more channels 106, or three or more channels 106 formed within the conductor 104b and extending along the longitudinal axis of the conductor. For example, but not limited to, the conductor 104b in… Figure 2The conductor 104b is depicted as having three channels 106. Channels 106 can be formed within the conductor 104b between two portions of the outer circumference 109a of the conductor 104b. In embodiments of the conductor 104b having multiple channels 106, the channels 106 may be uniformly spaced around the outer circumference 109a of the conductor. In other embodiments of the conductor 104b having multiple channels 106, the channels 106 are non-uniformly spaced around the outer circumference 109a of the conductor. In some embodiments, the channels 106 may extend parallel to the longitudinal axis of the conductor 104b along its length. In other embodiments, the channels 106 may spirally coil around the longitudinal axis of the conductor 104b. One or more optical fibers 110 may extend longitudinally within each channel 106 of the conductor 104b. The optical fibers 110 may be composed of… Figure 1 The discussion may involve the same or different materials. In some embodiments, filler 112 may encapsulate optical fiber 110 within channel 106. Filler 112 may be related to... Figure 1 The filler 112 described may be the same as or different from the filler 112. In some embodiments, the filler 112 encapsulates the entire conductor 104b (not shown). In other embodiments, the filler 112 does not encapsulate the entire conductor 104b. The optoelectronic cable 100b may include one or more polymer layers 118 encapsulating the conductor 104b and the channel 106. The polymer layers 118 may be related to... Figure 1 The polymer layer 118 described may be the same or different. The polymer layer 118 may surround the channel 106 and / or the filler 112 within the channel 106. In some embodiments, the optoelectronic cable 100b has a circular profile.

[0063] Figures 2A to 2D The manufacture of the photoelectric cable 100b according to this disclosure is described. (As follows) Figure 2A As shown, a wire 104b with one or more channels 106 can be provided. For example... Figure 2B As shown, one or more optical fibers 110 can be placed in each channel 106 of the conductor 104b. Figure 2C As shown, filler 112 can be placed within each channel 106 to encapsulate optical fiber 110 and form optoelectronic cable core 116b. Figure 2D As shown, one or more polymer layers 118 may be wound around or extruded over the photoelectric cable core 116b to form a photoelectric cable 100b. The polymer layers 118 may surround the photoelectric cable core 116b longitudinally and circumferentially.

[0064] Figure 3Another embodiment of the optoelectronic cable according to this disclosure is depicted. The optoelectronic cable 100c may include a conductor 104c. In some embodiments, the conductor 104c has a circular profile having a circular or arcuate outer circumference 123. The conductor 104c may be made of the same or different material as the baseline 104. The conductor 104c may have a single channel 106. The channel 106 may be formed within the conductor 104c between two portions of the outer circumference 123. The channel 106 may extend along the longitudinal axis of the conductor 104c. In some embodiments, the channel 106 may extend parallel to the longitudinal axis of the conductor 104c along its length. In other embodiments, the channel 106 may spirally coil about the longitudinal axis of the conductor 104c. One or more optical fibers 110 may extend longitudinally within the channel 106 of the conductor 104c. The optical fibers 110 may be made of approximately Figure 1 The discussion may involve the same or different materials. In some embodiments, filler 112 may encapsulate optical fiber 110 within channel 106. Filler 112 may be related to... Figure 1 The filler 112 described may be the same as or different from the filler 112. In some embodiments, the filler 112 encapsulates the entire conductor 104c (not shown). In other embodiments, the filler 112 does not encapsulate the entire conductor 104c. The optoelectronic cable 100c may include one or more polymer layers 118 encapsulating the conductor 104c and the channel 106. The polymer layer 118 may be related to... Figure 1 The polymer layer 118 described may be the same or different. The polymer layer 118 may surround the channel 106 and / or the filler 112 within the channel 106. In some embodiments, the optoelectronic cable 100c has a circular profile.

[0065] Figures 3A to 3D The manufacture of the photoelectric cable 100c according to this disclosure is described. (As follows) Figure 3A As shown, a conductor 104c can be provided, having an outer circumference 123 and a channel 106. For example... Figure 3B As shown, one or more optical fibers 110 can be placed within the channel 106 of the conductor 104c. Figure 3C As shown, filler 112 can be placed inside channel 106 to encapsulate optical fiber 110 and form optoelectronic cable core 116c. For example... Figure 3D As shown, one or more polymer layers 118 may be wound around or extruded over the photoelectric cable core 116c to form a photoelectric cable 100c. The polymer layers 118 may surround the photoelectric cable core 116c longitudinally and circumferentially.

[0066] Figure 4Another embodiment of the optoelectronic cable according to this disclosure is depicted. The optoelectronic cable 100d may include a conductor 104d. In some embodiments, the conductor 104d has a hexagonal or approximately hexagonal profile. The conductor 104d may be made of the same or different material as the baseline 104. The conductor 104d may have a base 120 formed along the circumference of the conductor 104d. In some embodiments, the base 120 is a flat surface formed on one side of the conductor 104d. The base 120 may extend along the longitudinal axis of the conductor 104d. The conductor 104d may have a single channel 106. In some embodiments, the conductor 104d may have multiple channels (not shown). In some embodiments, a channel 106 of the conductor 104d may be formed within the conductor 104d between two portions of the outer circumference 122 of the conductor 104d and the opposite side of the base 120. The channel 106 may extend along the longitudinal axis of the conductor 104d. In some embodiments, channel 106 may extend parallel to the longitudinal axis of conductor 104d along its length. In some embodiments, channel 106 of conductor 104d has a circular or semi-circular profile. In some embodiments, optoelectronic cable 100d has a circular profile. In some embodiments, the side surface of the outer circumference 122 of conductor has a non-circular profile, such that the side surface of conductor 104d is at least partially flattened. One or more optical fibers 110 may extend longitudinally within channel 106 of conductor 104d. Optical fibers 110 may be composed of approximately Figure 1 The discussion may involve the same or different materials. In some embodiments, filler 112 may encapsulate optical fiber 110 within channel 106. Filler 112 may be related to... Figure 1 The filler 112 described may be the same as or different from the filler 112. In some embodiments, the filler 112 encapsulates the entire conductor 104d (not shown). In other embodiments, the filler 112 does not encapsulate the entire conductor 104d. The optoelectronic cable 100d may include one or more polymer layers 118 encapsulating the conductor 104d and the channel 106. The polymer layer 118 may be related to... Figure 1 The polymer layer 118 may be the same as or different from the described polymer layer 118. The polymer layer 118 may surround the channel 106 and / or the filler 112 within the channel 106.

[0067] Figures 4A to 4D The manufacture of the photoelectric cable 100d according to this disclosure is described. (As follows) Figure 4AAs shown, a conductor 104d can be provided having a base 120, a channel 106, and an outer circumference 122 of the conductor. The conductor 104d can be securely held in a desired position and is prevented from moving from that position. For example, but not limited to, the base 120 can be engaged with a surface (not shown) and can hold the sides of the outer circumference 122 of the conductor 104d to secure the conductor 104d in the desired position. Figure 4B As shown, with the conductor 104d fixed in the desired position, one or more optical fibers 110 can be placed within the channel 106 of the conductor 104d. Figure 4C As shown, filler 112 can be placed inside channel 106 to encapsulate optical fiber 110 and form optoelectronic cable core 116d. For example... Figure 4D As shown, one or more polymer layers 118 may be wound around or extruded over the photoelectric cable core 116d to form the photoelectric cable 100d. The polymer layers 118 may surround the photoelectric cable core 116d longitudinally and circumferentially.

[0068] Figure 5 Another embodiment of the optoelectronic cable according to this disclosure is depicted. The optoelectronic cable 100e may include a conductor 104e. In some embodiments, the conductor 104e has a C-shaped profile. The conductor 104e may be formed of the same or different material as the baseline 104. The conductor 104e may have a single channel 106. The channel 106 may be formed within the conductor 104e and extend along the longitudinal axis of the conductor. In some embodiments, the channel 106 may extend parallel to the longitudinal axis of the conductor 104e along its length. In some embodiments, the channel 106 is formed centrally within the conductor 104e, and the channel 106 may be concentrically aligned with the longitudinal axis of the conductor 104e. The channel 106 may have an opening 126 formed between two portions of the outer circumference 127 of the conductor. One or more optical fibers 110 may extend longitudinally within the channel 106 of the conductor 104e. The optical fibers 110 may be formed of approximately Figure 1 The discussion concerns the composition of the same or different materials. Filler 112 can encapsulate optical fiber 110 within channel 106. Filler 112 can be used with... Figure 1The filler 112 described may be the same as or different from the filler 112. The plug 124 may be mechanically coupled to and / or chemically bonded to the wire 104e at the opening 126 of the channel 106. In some embodiments, the plug 124 may be a rigid polymer plug. For example, but not limited to, the plug 124 may be made of a polymer or gel with a viscosity higher than that of the filler 112. The plug 124 may encapsulate and / or seal the filler 112 and / or optical fiber 110 within the channel 106. In some embodiments, a layer of material forming the plug 124 is circumferentially positioned around the wire 104e (not shown). The optoelectronic cable 100e may include one or more polymer layers 118 encapsulating the wire 104e and the plug 124. The polymer layers 118 may be related to... Figure 1 The polymer layer 118 described may be the same or different. The polymer layer 118 may surround the opening 126 of the channel 106 and / or the filler 112 within the channel 106. In some embodiments, the optoelectronic cable 100e has a circular profile.

[0069] Figures 5A to 5E The manufacture of the photoelectric cable 100e according to this disclosure is described. (As follows) Figure 5A As shown, a wire 104e with channel 106 can be provided. (As shown...) Figure 5B As shown, one or more optical fibers 110 can be placed within the channel 106 of the conductor 104e. For example... Figure 5C As shown, filler 112 can be placed inside channel 106 to encapsulate optical fiber 110. For example... Figure 5D As shown, the plug 124 can be mechanically coupled and / or chemically bonded to the conductor 104e at the opening 126 of the channel 106, thereby forming the optoelectronic cable core 116e. For example, but not limited to, the plug 124 can be mechanically coupled and / or chemically bonded to the conductor 104e before the filler 112 (e.g., silicone polymer gel) cures within the channel 106. In operation, when the plug 124 is mechanically coupled and / or chemically bonded to the conductor 104e, the plug 124 can restrict the movement of the optical fiber 110 during and / or after the filler 112 cures within the channel 106, thereby preventing or reducing extrusion. In some embodiments, a large amount of material forming the plug 124 is applied circumferentially in a layer (not shown) surrounding the conductor 104e. Figure 5E As shown, one or more polymer layers 118 may be wound around or extruded over the photoelectric cable core 116e to form the photoelectric cable 100e. The polymer layers 118 may be longitudinally and circumferentially surrounding the photoelectric cable core 116e.

[0070] In some embodiments, the optoelectronic cable core includes a single conductor, such as Figures 2 to 5E As depicted in [the text]. In other embodiments, the optoelectronic cable core includes at least two conductors, such as [examples omitted]. Figures 1 to 1FAs depicted herein. In operation, fiber optic cable 110 can be used to transmit data, while wires (e.g., 104, 104a to 104e) can be used to transmit power and / or data. For example, but not limited to, wires (e.g., 104, 104a to 104e) can supply power to the downhole tool string, and the circuit can be completed using coiled tubing or casing. Fiber optic cable 110 can be used, for example, for telemetry and / or as a sensor to measure distributed temperature, pressure, and longitudinal strain.

[0071] In some embodiments, the polymer layer 118 may provide insulation for the optical fiber 110 and the conductors (e.g., 104, 104a to 104e). In some embodiments, a micro-bundle of the optical fiber 110 may be included within a channel 106 of the conductors (e.g., 104, 104a to 104e), thereby increasing the number of optical fibers 110 within the channel 106 of the conductors (e.g., 104, 104a to 104e). The bundled optical fibers 110 may include single-mode and / or multimode optical fibers. In some embodiments, the optical fibers 110 are laid in a helical configuration, which may increase the longitudinal strain that the optical fibers 110 can withstand. In some embodiments, the optical fiber 110 is an uncoated optical fiber. In other embodiments, the optical fiber 110 is a coated optical fiber.

[0072] Each of the optoelectronic cables 100a to 100e may include one or more complete layers to form a complete optoelectronic cable. Figure 6A , 6B Images 6C and 6D depict complete embodiments of the optoelectronic cable according to this disclosure. Figure 6A As shown, the complete optoelectronic cable 500a may include an optoelectronic cable core 116a surrounded longitudinally and circumferentially by one or more polymer layers 118. For example... Figure 6B As shown, the complete optoelectronic cable 500b may include an optoelectronic cable core 116b surrounded longitudinally and circumferentially by one or more polymer layers 118. Figure 6C As shown, the complete optoelectronic cable 500c may include an optoelectronic cable core 116c surrounded longitudinally and circumferentially by one or more polymer layers 118. Figure 6D As shown, the complete optoelectronic cable 500d may include an optoelectronic cable core 116e surrounded longitudinally and circumferentially by one or more polymer layers 118. See respectively... Figures 6A to 6DAs shown, complete optoelectronic cables 500a to 500d may each include a sheathing layer 130 that surrounds the polymer layer 118 longitudinally and circumferentially. For example, but not limited to, the sheathing layer 130 may be made of a metal such as Zn, Ni, Mo, or Fe. Although complete optoelectronic cables 500a to 500d are shown as having optoelectronic cables 100a, 100b, 100c, and 100e, those skilled in the art will understand with the aid of this disclosure that the sheathing layer 130 may also be applied to optoelectronic cable 100d to form a complete optoelectronic cable.

[0073] Figure 7A , 7B Additional embodiments of the complete optoelectronic cable according to this disclosure are depicted in 7C and 7D. Figure 7A As shown, the complete optoelectronic cable 500e may include an optoelectronic cable core 116a surrounded longitudinally and circumferentially by one or more polymer layers 118. As... Figure 7B As shown, the complete optoelectronic cable 500f may include an optoelectronic cable core 116b surrounded longitudinally and circumferentially by one or more polymer layers 118. Figure 7C As shown, a complete optoelectronic cable 500g may include an optoelectronic cable core 116c surrounded longitudinally and circumferentially by one or more polymer layers 118. For example... Figure 7D As shown, a complete optoelectronic cable 500h may include an optoelectronic cable core 116e surrounded longitudinally and circumferentially by one or more polymer layers 118. (Reference) Figures 7A to 7D Each of the complete optoelectronic cables 500e to 500h may include a sheath layer 132 that surrounds the polymer layer 118 longitudinally and circumferentially. Each sheath layer 132 may include a conductor 134 encapsulated within a polymer 136. The conductor 134 may be a finely wound (served) wire (e.g., a spirally laid cable). The polymer 136 may be composed of the same composition as the polymer layer 118, or it may be composed of a different composition. For example, but not limited to, the sheath layer 132 may be at least partially composed of... Or carbon fiber reinforced Composition. Although complete optoelectronic cables 500e to 500h are shown as having optoelectronic cables 100a, 100b, 100c and 100e, those skilled in the art will understand with the aid of this disclosure that sheath layer 132 may also be applied to optoelectronic cable 100d to form a complete optoelectronic cable.

[0074] Figure 8A , 8B Additional embodiments of the complete optoelectronic cable according to this disclosure are depicted in 8C and 8D. Figure 8A As shown, the complete optoelectronic cable 500i may include an optoelectronic cable core 116a surrounded longitudinally and circumferentially by one or more polymer layers 118. For example... Figure 8B As shown, the complete optoelectronic cable 500j may include an optoelectronic cable core 116b surrounded longitudinally and circumferentially by one or more polymer layers 118. Figure 8C As shown, a complete optoelectronic cable 500k may include an optoelectronic cable core 116c surrounded longitudinally and circumferentially by one or more polymer layers 118. For example... Figure 8D As shown, a complete optoelectronic cable 500l may include an optoelectronic cable core 116e surrounded longitudinally and circumferentially by one or more polymer layers 118. (Reference) Figures 8A to 8D Each complete optoelectronic cable 500i to 500l may include two bow-shaped metal wires 138a and 138b, thereby forming a tube that longitudinally and circumferentially surrounds the polymer layer 118. The bow-shaped metal wires 138a and 138b may be made of the same or different conductive metal as the baseline 104. Each complete optoelectronic cable 500i to 500l may include a second polymer layer 118a that longitudinally and circumferentially surrounds and encloses the bow-shaped metal wires 138a and 138b. The second polymer layer 118a may be made of the same or different composition as the polymer layer 118. In operation, the conductors (e.g., 104, 104a to 104e) can prevent the tube formed by the bow-shaped metal wires 138a and 138b from flattening under compressive force. The seam 140 between the bow-shaped metal wires 138a and 138b can be aligned with the solid portion of the conductors (e.g., 104, 104a to 104e). For example, but not limited to, seam 140 may be aligned with a portion of the conductor (e.g., 104, 104a to 104e) that does not have a channel located on the circumference of the conductor (e.g., 104, 104a to 104e), or seam 140 may be aligned with a portion of the conductor (e.g., 104, 104a to 104e) that does not have a conductor seam, such as conductor seam 141 between baseline 104 and cover wire 104a. Not bound by theory, when seam 140 is aligned with a solid portion of the conductor (e.g., 104, 104a to 104e), displacement of the conductor (e.g., 104, 104a to 104e) can be prevented or reduced, thereby preventing or reducing the occurrence of extrusion. In operation, bow-shaped metal wires 138a and 138b can transmit data, electricity, or combinations thereof. Although complete optoelectronic cables 500i to 500l are shown as having optoelectronic cables 100a, 100b, 100c and 100e, those skilled in the art will understand with the aid of this disclosure that bow-shaped metal wire 138 and second polymer layer 118a may also be applied to optoelectronic cable 100d to form a complete optoelectronic cable.

[0075] Figure 9A , 9B Additional embodiments of the complete optoelectronic cable according to this disclosure are depicted in 9C and 9D. Figure 9A As shown, a complete 500m optoelectronic cable may include an optoelectronic cable core 116a surrounded longitudinally and circumferentially by one or more polymer layers 118. For example... Figure 9B As shown, a complete optoelectronic cable 500n may include an optoelectronic cable core 116b surrounded longitudinally and circumferentially by one or more polymer layers 118. Figure 9C As shown, a complete optoelectronic cable 500o may include an optoelectronic cable core 116c surrounded longitudinally and circumferentially by one or more polymer layers 118. For example... Figure 9D As shown, a complete optoelectronic cable 500p may include an optoelectronic cable core 116e surrounded longitudinally and circumferentially by one or more polymer layers 118. (Reference) Figures 9A to 9D Each complete optoelectronic cable 500m to 500p may include a metal strip 142 that is longitudinally and circumferentially wrapped around a polymer layer 118. The metal strip 142 may have a longitudinally coiled seam 144, wherein after the metal strip 142 is wound around the polymer layer 118, the two ends of the metal strip 142 are coiled together. Each complete optoelectronic cable 500m to 500p may include an additional polymer layer 118b that is longitudinally and circumferentially wrapped around the metal strip 142. The additional polymer layer 118b may be composed of the same or different composition as the polymer layer 118. Although complete optoelectronic cables 500m to 500p are shown as having optoelectronic cables 100a, 100b, 100c, and 100e, those skilled in the art will understand with the aid of this disclosure that the metal strip 142 and the additional polymer layer 118b may also be applied to optoelectronic cable 100d to form a complete optoelectronic cable.

[0076] Figures 10A to 10D Additional embodiments of a complete optoelectronic cable according to this disclosure are described. For example... Figure 10A As shown, a complete optoelectronic cable 500q may include optoelectronic cable 100a. (As...) Figure 10B As shown, a complete optoelectronic cable 500r may include optoelectronic cable 100b. For example... Figure 10C As shown, a complete optoelectronic cable 500s can include optoelectronic cable 100c. (As...) Figure 10D As shown, a complete 500t optoelectronic cable can include 100e optoelectronic cable. (Reference) Figures 10A to 10DEach of the complete optoelectronic cables 500q to 500t may include a flexible polymer layer 200 that is longitudinally and circumferentially surrounding optoelectronic cables 100a, 100b, 100c, and 100e, respectively. For example, but not limited to, the flexible polymer layer 200 may be a silicone polymer layer. Each of the complete optoelectronic cables 500q to 500t may include multiple arched profiles 210 that are longitudinally and circumferentially (e.g., spirally) surrounding the flexible polymer layer 200. The arched profiles 210 may be provided with a solid surface above the joints and / or channels 106 of optoelectronic cables 100a, 100b, 100c, and 100e, respectively. For example, but not limited to, the arched profiles 210 may be made of copper, copper-plated steel, or nickel-plated copper. In some embodiments, a portion of the flexible polymer layer 200a fills the gap spaces between the arched profiles 210. In some embodiments, powder (not shown) may be located on the flexible polymer layer 200. Each of the complete optoelectronic cables 500q to 500t may include a stranded layer 220 encapsulated within one or more additional polymer layers 230 and surrounding an arched profile 210. Each of the complete optoelectronic cables 500q to 500t may have a coaxial cable configuration. The additional polymer layers 230 may be made of the same or different materials as polymer layer 118. In operation, the arched profile 210 may transmit data, power, or a combination thereof.

[0077] Figures 11A to 11D The manufacture of a complete optoelectronic cable 500q according to this disclosure is described. Although the manufacture of a complete optoelectronic cable 500q is described with respect to optoelectronic cable 100a, those skilled in the art will understand with the aid of this disclosure that a complete method for manufacturing optoelectronic cable 500q can be performed with respect to optoelectronic cables 100b, 100c, 100d, and 100e. Figure 11A As shown, a 100a fiber optic cable can be provided. (As indicated...) Figure 11B As shown, a flexible polymer layer 200 can be extruded over the optoelectronic cable 100a to longitudinally and circumferentially surround and encapsulate the polymer layer 118 of the optoelectronic cable 100a. Figure 11CAs shown, multiple arched profile lines 210 can be applied to surround the flexible polymer layer 200 longitudinally and circumferentially. In some embodiments, when the arched profile lines 210 are applied to the flexible polymer layer 200, the arched profile lines 210 can be compressed over the flexible polymer layer 200, resulting in a portion of the flexible polymer layer 200a filling the gaps between the arched profile lines 210. In some embodiments, powder (not shown) can be applied to the flexible polymer layer 200. Without being theoretically constrained, it is believed that the powder on the flexible polymer layer 200 can reduce or prevent metal from the arched profile lines 210 from adhering to the flexible polymer layer 200. Stranded layers 220 encapsulated within one or more additional polymer layers 230 can be applied to encapsulate the arched profile lines 210, thereby forming a complete optoelectronic cable 500q.

[0078] Embodiments of this disclosure may include multi-component cables. Figure 12 Embodiments of a multi-component cable according to this disclosure are depicted. The multi-component cable 300 may include one or more complete optoelectronic cables 500 (e.g., 500a to 500t) and one or more electrical conductor cables 302. The electrical conductor cable 302 may include one or more metal conductor wires (not shown), which may be circumferentially and longitudinally surrounded by one or more insulating layers (not shown), such as one or more polymer layers. The metal conductor wires of the electrical conductor cable 302 may be made of, for example, copper, copper-plated steel, or nickel-plated copper. In operation, the electrical conductor cable 302 may provide power to downhole tools within a wellbore. One or more layers of deformable polymer 304 may be longitudinally and circumferentially surrounded by the complete optoelectronic cable 500 and the electrical conductor cable 302. For example, but not limited to, the deformable polymer 304 may be extruded over the complete optoelectronic cable 500 and the electrical conductor cable 302, thereby encapsulating the complete optoelectronic cable 500 and the electrical conductor cable 302. In some embodiments, the complete optoelectronic cable 500 and electrical conductor cable 302 are arranged in a coaxial configuration, a three-core configuration, a four-core configuration, or a seven-core configuration within a deformable polymer 304. Figure 12 The complete optoelectronic cable 500 and electrical conductor cable 302 are depicted in a seven-core configuration.

[0079] In some embodiments, the multi-component cable 300 is sheathed. Figures 13A to 13C An embodiment of a sheathed multi-component cable according to this disclosure is described. Figure 13A A sheathed multi-component cable 400a with a seven-core configuration is described. Figure 13B A sheathed multi-component cable 400b with a three-core configuration is described. Figure 13C A sheathed multi-component cable 400c with a four-core configuration is depicted. (Reference) Figures 13A to 13CEach of the sheathed multi-component cables 400a to 400c may include multiple arched profiles 310 longitudinally and circumferentially surrounding the multi-component cable 300. That is, the arched profiles 310 may be helically laid around the multi-component cable 300. It should be understood that in some embodiments, the arched profiles 310 may be laid directly around each of the optoelectronic cables discussed herein (e.g., around optoelectronic cables 100a, 100b, 100c, 100d, and / or 100e) (e.g., helically laid). Each of the sheathed multi-component cables 400a to 400c may include one or more layers of reinforcing polymer 314 longitudinally and circumferentially surrounding the arched profiles 310. The reinforcing polymer 314 may be composed of carbon fiber reinforced polymer. For example, during manufacturing and / or deployment (e.g., in a wellbore), the reinforcing polymer 314 may encapsulate the arched profiles 310 and hold the arched profiles 310 in place around the multi-component cable 300. During operation, under the compressive force during the deployment of the multi-component cable 300, the arched profile 310 can form a continuous arch around the circumference of the multi-component cable 300, thereby distributing the compressive force around the circumference of the multi-component cable 300 and preventing or reducing extrusion. The arched profile 310 can be made of, for example, but not limited to, copper, copper-coated steel, or nickel-coated copper. Each of the sheathed multi-component cables 400a to 400c can include one or more layers of armored wire. For example, each of the sheathed multi-component cables 400a to 400c can include an inner layer of armored wire 360 ​​and an outer layer of armored wire 370. In some embodiments, the inner layer of armored wire 360 ​​can be spirally laid over the multi-component cable 300. In some embodiments, the outer layer of armored wire 370 can be spirally laid onto the inner layer of armored wire 360. In some embodiments, the armor wires of the inner layer of armor wire 360 ​​and the outer layer of armor wire 370 may be made of galvanized modified plowshare steel (GIPS) or alloy wires for improved corrosion resistance (such as nickel-cobalt-chromium-molybdenum alloys, for example, ...). ), molybdenum-containing stainless steel alloys (e.g., It is composed of 27-7MO or nickel-containing steel alloys (e.g., HC265).

[0080] Figures 14A to 14H The manufacture of the sheathed multi-part 400a according to this disclosure is depicted. For example... Figure 14A As shown, a multi-component cable 300 is provided, and as... Figure 14B As shown, an arched profile 310 is provided. (As...) Figure 14CAs shown, the arched profile 310 is at least partially embedded in the deformable polymer 304. In some embodiments, a portion of the deformable polymer 304a fills the gap space between the arched profiles 310. After being applied over the deformable polymer 304, the edges 312 of the arched profiles 310 contact each other, thereby forming a compression-resistant barrier over the multi-component cable 300. Figure 14D As shown, the first layer of reinforcing polymer 314a can surround the arched profile 310 longitudinally and circumferentially. For example, but not limited to, the first layer of reinforcing polymer 314a can be extruded over the arched profile 310 to encapsulate the arched profile 310. Figure 14E As shown, the inner layer of the armor wire 360 ​​may surround the reinforcing polymer 314a longitudinally and circumferentially. In some embodiments, the inner layer of the armor wire 360 ​​may be at least partially embedded in the reinforcing polymer 314a. For example, but not limited to, the inner layer of the armor wire 360 ​​may be applied to the reinforcing polymer 314a while it is in a flexible state (such as after extrusion of the reinforcing polymer 314a or after passing the multi-component cable 300 having the reinforcing polymer 314a through the infrared 362 heating source). Figure 14F As shown, the second reinforcing polymer 314b can surround the inner layer of the armored wire 360. For example, but not limited to, the second reinforcing polymer 314b can be extruded over the inner layer of the armored wire 360, thereby encapsulating the inner layer of the armored wire 360. The reinforcing polymer 314b can be bonded to the reinforcing polymer 314a through the gaps between the conductors of the inner layer of the armored wire 360. The reinforcing polymer 314b can surround the inner layer of the armored wire 360 ​​longitudinally and circumferentially. Figure 14G As shown, the outer layer of the armor wire 370 can be partially embedded in the reinforcing polymer 314b. The outer layer of the armor wire 370 can surround the reinforcing polymer 314b longitudinally and circumferentially. For example, but not limited to, the outer layer of the armor wire 370 can be partially embedded in the reinforcing polymer 314b when the reinforcing polymer 314b is in a flexible state. For example, the reinforcing polymer 314b can be in a flexible state after extruding a second layer of reinforcing polymer 314b or after passing the multi-component cable 300 with the reinforcing polymer 314b through the infrared heating source 362. Figure 14H As shown, the third reinforcing polymer 314c can surround the outer layer of the armor line 370 longitudinally and circumferentially. The reinforcing polymer 314c can bond to the reinforcing polymer 314b through the gaps between the armor lines of the outer layer of the armor line 370, thereby encapsulating the outer layer of the armor line 370.

[0081] Figures 15A to 15C Additional embodiments of a sheathed multi-component cable according to this disclosure are depicted. Figure 15A A sheathed multi-component cable 400d with a seven-core configuration is described. Figure 15B The 400e sheathed multi-component cable with a four-core configuration is described. Figure 15C A sheathed multi-component cable 400f with a three-core configuration is depicted. (Reference) Figures 15A to 15C Each of the sheathed multi-component cables 400d to 400f includes one or more layers of corrugated metal strip 320 longitudinally and circumferentially surrounding the multi-component cable 300. The corrugated metal strip 320 may be compression-resistant and may be adapted to bend over a radius, such as a spool or pulley. Each of the sheathed multi-component cables 400d to 400f may include one or more layers of reinforcing polymer 314 longitudinally and circumferentially surrounding the corrugated metal strip layer 320. For example, during manufacturing and / or deployment (e.g., in a wellbore), the reinforcing polymer 314 may encapsulate the corrugated metal strip layer 320 and hold it in place around the multi-component cable 300. In operation, a deformable polymer 304 (not shown) may cushion the multi-component cable 300 against compressive forces, while the reinforcing polymer 314 may cushion the multi-component cable 300 against compressive forces and form a circular profile. In some embodiments, the corrugated metal tape layer 320 protects the multi-component cable 300 from compressive forces and enhances the flexibility of the multi-component cable 300, thereby preventing or reducing extrusion. Each of the sheathed multi-component cables 400d to 400f may include one or more layers of armored wire. For example, each of the sheathed multi-component cables 400d to 400f may include an inner layer of armored wire 360 ​​and an outer layer of armored wire 370. In some embodiments, the inner layer of armored wire 360 ​​may be helically laid over the multi-component cable 300. In some embodiments, the outer layer of armored wire 370 may be anti-helically laid onto the inner layer of armored wire 360.

[0082] Figures 16A to 16I The manufacture of a sheathed multi-part 400d according to this disclosure is depicted. (As follows) Figure 16A As shown, a multi-component cable 300 is provided. Figure 16B As shown, a corrugated metal strip 320 with side surfaces 319 is provided. (As...) Figure 16C and 16D As shown, the corrugated metal strip 320 can be wound longitudinally and circumferentially around the deformable polymer 304. The side 319 of the corrugated metal strip 320 (in...) Figure 16B (As shown in the diagram) They can overlap each other to provide complete or substantially complete coverage over the multi-component cable 300. In some embodiments, the corrugated metal tape layer 320 is at least partially embedded in the deformable polymer 304. In some embodiments, the corrugated metal tape layer 320 is wound around two layers of deformable polymer 304. The corrugated metal tape layer 320 can form a tube around the multi-component cable 300. Figure 16EAs shown, the first reinforcing polymer layer 314a can surround the corrugated metal strip layer 320 longitudinally and circumferentially. For example, but not limited to, the first reinforcing polymer layer 314a can be extruded over the corrugated metal strip layer 320 to encapsulate it. The first reinforcing polymer layer 314a can be formed into a circular profile, which facilitates subsequent manufacturing steps. Figure 16F As shown, the inner layer of the armor wire 360 ​​may surround the reinforcing polymer 314a longitudinally and circumferentially. In some embodiments, the inner layer of the armor wire 360 ​​may be at least partially embedded in the reinforcing polymer 314a. For example, but not limited to, the inner layer of the armor wire 360 ​​may be applied to the reinforcing polymer 314a while it is in a flexible state (such as after extrusion of the reinforcing polymer 314a or after passing the multi-component cable 300 having the reinforcing polymer 314a through the infrared 362 heating source). Figure 16G As shown, the second reinforcing polymer 314b can surround the inner layer of the armored wire 360. For example, but not limited to, the second reinforcing polymer 314b can be extruded over the inner layer of the armored wire 360, thereby encapsulating the inner layer of the armored wire 360. The reinforcing polymer 314b can be bonded to the reinforcing polymer 314a through the gaps between the conductors of the inner layer of the armored wire 360. The reinforcing polymer 314b can surround the inner layer of the armored wire 360 ​​longitudinally and circumferentially. Figure 16H As shown, the outer layer of the armor wire 370 can be partially embedded in the reinforcing polymer 314b. The outer layer of the armor wire 370 can surround the reinforcing polymer 314b longitudinally and circumferentially. For example, but not limited to, the outer layer of the armor wire 370 can be partially embedded in the reinforcing polymer 314b when the reinforcing polymer 314b is in a flexible state. For example, the reinforcing polymer 314b can be in a flexible state after extruding a second layer of reinforcing polymer 314b or after passing the multi-component cable 300 with the reinforcing polymer 314b through the infrared heating source 362. Figure 16I As shown, the third reinforcing polymer 314c can surround the outer layer of the armor line 370 longitudinally and circumferentially. The reinforcing polymer 314c can bond to the reinforcing polymer 314b through the gaps between the armor lines of the outer layer of the armor line 370, thereby encapsulating the outer layer of the armor line 370.

[0083] Figures 17A to 17C Additional embodiments of a sheathed multi-component cable according to this disclosure are depicted. Figure 17A A 400g sheathed multi-component cable with a seven-core configuration is described. Figure 17B A sheathed multi-component cable 400h with a four-core configuration is described. Figure 17C A sheathed multi-component cable 400i with a three-core configuration is depicted. (Reference) Figures 17A to 17CEach sheathed multi-component cable 400g to 400i may include a layer of metal sheathing tape 330 longitudinally and circumferentially surrounding the multi-component cable 300. The metal sheathing tape 330 may form a tube (e.g., a corrugated tube) longitudinally and circumferentially around the multi-component cable 300, said tube being compression-resistant and adapted to bend over a radius, such as a spool and pulley. Each sheathed multi-component cable 400g to 400i may include one or more layers of reinforcing polymer 314 longitudinally and circumferentially surrounding the metal sheathing tape 330. In operation, under compressive forces during the deployment of the multi-component cable 300, the metal sheathing tape 330 may form a compression-resistant tube, thereby distributing the compressive forces circumferentially around the multi-component cable 300, thereby preventing or reducing extrusion. Each of the sheathed multi-component cables 400g to 400i may include one or more layers of armored wire. For example, each of the sheathed multi-component cables 400g to 400i may include an inner layer of armored wire 360 ​​and an outer layer of armored wire 370. In some embodiments, the inner layer of armored wire 360 ​​may be spirally laid over the multi-component cable 300. In some embodiments, the outer layer of armored wire 370 may be spirally laid onto the inner layer of armored wire 360.

[0084] Figures 18A to 18H The manufacture of a sheathed multi-part assembly weighing 400g according to this disclosure is described. For example... Figure 18A As shown, a multi-component cable 300 can be provided. (As shown) Figure 18B and 18C As shown, a metal sheathing tape 330 can be wound around a multi-component cable 300 to longitudinally and circumferentially surround a deformable polymer 304. In some embodiments, the metal sheathing tape 330 can be helically wound over the deformable polymer 304. The deformable polymer 304 can encapsulate the metal sheathing tape 330 and hold the metal sheathing tape 330 in place during the manufacture and / or deployment of the multi-component cable 300 (e.g., in a wellbore). The sides 332 of the metal sheathing tape 330 can overlap, thereby providing complete or substantially complementary coverage of the multi-component cable 300. Figure 18D As shown, the first layer of reinforcing polymer 314a can be longitudinally and circumferentially surrounding the metal sheathing tape 330. For example, but not limited to, the first layer of reinforcing polymer 314a can be extruded over the metal sheathing tape 330, encapsulating the metal sheathing tape 330. For example, during manufacturing and / or deployment (e.g., in a wellbore), the reinforcing polymer 314 can hold the metal sheathing tape 330 in proper position around the multi-component cable 300. Figure 18EAs shown, the inner layer of the armor wire 360 ​​may surround the reinforcing polymer 314a longitudinally and circumferentially. In some embodiments, the inner layer of the armor wire 360 ​​may be at least partially embedded in the reinforcing polymer 314a. For example, but not limited to, the inner layer of the armor wire 360 ​​may be applied to the reinforcing polymer 314a while it is in a flexible state (such as after extrusion of the reinforcing polymer 314a or after passing the multi-component cable 300 having the reinforcing polymer 314a through the infrared 362 heating source). Figure 18F As shown, the second reinforcing polymer 314b can surround the inner layer of the armored wire 360. For example, but not limited to, the second reinforcing polymer 314b can be extruded over the inner layer of the armored wire 360, thereby encapsulating the inner layer of the armored wire 360. The reinforcing polymer 314b can be bonded to the reinforcing polymer 314a through the gaps between the conductors of the inner layer of the armored wire 360. The reinforcing polymer 314b can surround the inner layer of the armored wire 360 ​​longitudinally and circumferentially. Figure 18G As shown, the outer layer of the armor wire 370 can be partially embedded in the reinforcing polymer 314b. The outer layer of the armor wire 370 can surround the reinforcing polymer 314b longitudinally and circumferentially. For example, but not limited to, the outer layer of the armor wire 370 can be partially embedded in the reinforcing polymer 314b when the reinforcing polymer 314b is in a flexible state. For example, the reinforcing polymer 314b can be in a flexible state after extruding a second layer of reinforcing polymer 314b or after passing the multi-component cable 300 with the reinforcing polymer 314b through the infrared heating source 362. Figure 18H As shown, the third reinforcing polymer 314c can surround the outer layer of the armor line 370 longitudinally and circumferentially. The reinforcing polymer 314c can bond to the reinforcing polymer 314b through the gaps between the armor lines of the outer layer of the armor line 370, thereby encapsulating the outer layer of the armor line 370.

[0085] Figures 19A to 19C Additional embodiments of a sheathed multi-component cable according to this disclosure are depicted. Figure 19A A sheathed multi-component cable 400J with a seven-core configuration is described. Figure 19B A 400k sheathed multi-component cable with a four-core configuration is described. Figure 19CA sheathed multi-component cable 400l with a three-core configuration is depicted. Each sheathed multi-component cable 400j to 400l may include a rigid polymer layer 350 that longitudinally and circumferentially surrounds the multi-component cable 300. In some embodiments, the rigid polymer layer 350 may be made of polyetheretherketone (PEEK) or another rigid polymer. In operation, the rigid polymer layer 350 may encapsulate the multi-component cable 300 and protect the multi-component cable 300 from compressive forces during manufacturing processes and deployment operations. Each sheathed multi-component cable 400j to 400l may include one or more reinforcing polymers 314 that longitudinally and circumferentially surround the rigid polymer layer 350. Each of the sheathed multi-component cables 400j to 400l may include one or more armored wires. For example, each of the sheathed multi-component cables 400j to 400l may include an inner layer of armored wire 360 ​​and an outer layer of armored wire 370. In some embodiments, the inner layer of the armored wire 360 ​​may be spirally laid over the multi-component cable 300. In some embodiments, the outer layer of the armored wire 370 may be spirally laid onto the inner layer of the armored wire 360.

[0086] Figures 20A to 20G The manufacture of a sheathed multi-part 400j according to this disclosure is described. For example... Figure 20A As shown, a multi-component cable 300 can be provided. A rigid polymer layer 350 can be extruded over a deformable polymer 304, thereby encapsulating the deformable polymer 304. A first reinforcing polymer layer 314a can be extruded over the rigid polymer layer 350, thereby encapsulating the rigid polymer layer 350. Figure 20D As shown, the inner layer of the armor wire 360 ​​may surround the reinforcing polymer 314a longitudinally and circumferentially. In some embodiments, the inner layer of the armor wire 360 ​​may be at least partially embedded in the reinforcing polymer 314a. For example, but not limited to, the inner layer of the armor wire 360 ​​may be applied to the reinforcing polymer 314a while it is in a flexible state (such as after extrusion of the reinforcing polymer 314a or after passing the multi-component cable 300 having the reinforcing polymer 314a through the infrared 362 heating source). Figure 20E As shown, the second reinforcing polymer 314b can surround the inner layer of the armored wire 360. For example, but not limited to, the second reinforcing polymer 314b can be extruded over the inner layer of the armored wire 360, thereby encapsulating the inner layer of the armored wire 360. The reinforcing polymer 314b can be bonded to the reinforcing polymer 314a through the gaps between the conductors of the inner layer of the armored wire 360. The reinforcing polymer 314b can surround the inner layer of the armored wire 360 ​​longitudinally and circumferentially. Figure 20FAs shown, the outer layer of the armor wire 370 can be partially embedded in the reinforcing polymer 314b. The outer layer of the armor wire 370 can surround the reinforcing polymer 314b longitudinally and circumferentially. For example, but not limited to, the outer layer of the armor wire 370 can be partially embedded in the reinforcing polymer 314b when the reinforcing polymer 314b is in a flexible state. For example, the reinforcing polymer 314b can be in a flexible state after extruding a second layer of reinforcing polymer 314b or after passing the multi-component cable 300 with the reinforcing polymer 314b through the infrared heating source 362. Figure 20G As shown, the third reinforcing polymer 314c can surround the outer layer of the armor line 370 longitudinally and circumferentially. The reinforcing polymer 314c can bond to the reinforcing polymer 314b through the gaps between the armor lines of the outer layer of the armor line 370, thereby encapsulating the outer layer of the armor line 370.

[0087] In operation, the multi-component cable 300 or the sheathed multi-component cables 400a to 400j can provide one or more low-voltage paths via electrical conductor cables 302 and / or wires (e.g., 104, 104a to 104e), one or more telemetry paths via fiber optic cables 110 and / or wires (e.g., 104, 104a to 104e), one or more high-voltage electrical paths via electrical conductor cables 302 and / or wires (e.g., 104, 104a to 104e), or combinations thereof. In some embodiments (such as a four-core configuration), the multi-component cable 300 or the sheathed multi-component cables 400a to 400j can supply AC power to downhole tools.

[0088] In some embodiments, the multi-component cable 300 or sheathed cables 400a to 400j can be used with wellbore equipment to perform operations when the wellbore penetrates geological formations that may contain gas and oil reservoirs. The multi-component cable 300 or sheathed multi-component cables 400a to 400j can be used to interconnect logging tools (such as gamma-ray emitters / receivers, caliper devices, resistivity measuring devices, seismic devices, neutron emitters / receivers, downhole tractors, mechanics tools, etc.) to one or more power and data logging devices outside the well. The multi-component cable 300 or sheathed multi-component cables 400a to 400j can be used for seismic operations, including submarine and subsurface seismic operations. The multi-component cable 300 or sheathed multi-component cables 400a to 400j can be used as a permanent monitoring cable for the wellbore.

[0089] Example

[0090] Having generally described this disclosure, the following examples illustrate specific embodiments of the disclosure. It should be understood that these embodiments are given by way of example and are not intended to limit the specification or claims.

[0091] Example 1 - Manufacturing Process - Channel and Cap Configuration

[0092] The manufacture of an optoelectronic cable with a channel and cover configuration can be carried out as follows:

[0093] 1. A first conductive metal wire having a partially circular profile is provided. One side of the first conductive metal wire is flat, wherein a channel extends longitudinally along the flat side.

[0094] 2. Place one or more optical fibers into the channel.

[0095] 3. Place the soft gel filler into the channel to encapsulate one or more optical fibers and act as a protective pad.

[0096] 4. A second conductive metal wire is provided. The second conductive metal wire has a semi-circular outer profile and tabs, the tabs being sized to fit within a channel in the first conductive metal wire.

[0097] 5. The second conductive metal wire is fitted into the first conductive metal wire to form the core of the optoelectronic cable.

[0098] 6. Apply a layer of tape (e.g., PEEK) over the fiber optic cable core to form a fiber optic cable. Alternatively, extrude a layer of polymer over the fiber optic cable core to form a fiber optic cable.

[0099] Example 2 - Manufacturing Process - Circular Conductor with Multiple Channels

[0100] The manufacture of an optoelectronic cable with conductors having multiple channels can be carried out as follows:

[0101] 1. A conductive metal wire having a circular profile, said circular profile having three or more uniformly spaced channels around the outer diameter of the conductive metal wire.

[0102] 2. Place one or more optical fibers in each channel.

[0103] 3. Place the soft gel filler into each channel to encapsulate the optical fiber and act as a protective pad to form the optoelectronic cable core.

[0104] 4. Apply a layer of tape (e.g., PEEK) or polymer extrusion over the core of the optoelectronic cable to form an optoelectronic cable.

[0105] Example 3 - Manufacturing Process - Circular Conductor with a Single Channel

[0106] The manufacture of an optoelectronic cable with a conductor having a single channel can be carried out as follows:

[0107] 1. A conductive metal wire having a circular profile, the circular profile having a single channel located in the outer diameter of the conductive metal wire.

[0108] 2. Place one or more optical fibers in the channel.

[0109] 3. Place the soft gel filler into the channel to encapsulate the optical fiber and act as a protective pad to form the optoelectronic cable core.

[0110] 4. Apply a layer of tape (e.g., PEEK) or polymer extrusion over the core of the optoelectronic cable to form an optoelectronic cable.

[0111] Example 4 - Manufacturing Process - Hexagonal Conductor with Flat Base and Single Channel

[0112] The manufacture of an optoelectronic cable with a hexagonal conductor having a single channel can be carried out as follows:

[0113] 1. A conductive metal wire having an approximately hexagonal profile, the approximately hexagonal profile having a single channel located in the outer diameter of the conductive metal wire, a flat base opposite the single channel, and at least partially flat side surfaces.

[0114] 2. Optionally, the conductive metal wire is held in the proper position on the flat base by maintaining at least a partially flat side.

[0115] 3. Place one or more optical fibers in the channel.

[0116] 4. Place the soft gel filler into the channel to encapsulate the optical fiber and act as a protective pad to form the optoelectronic cable core.

[0117] 5. Apply a layer of tape (e.g., PEEK) or polymer extrusion over the core of the optoelectronic cable to form an optoelectronic cable and provide an optoelectronic cable with a circular profile.

[0118] Example 5 - Manufacturing Process - C-shaped Conductor with a Single Channel

[0119] The manufacture of an optical cable with a C-shaped conductor having a single channel can be carried out as follows:

[0120] 1. A conductive metal wire having a C-shaped profile and an interior forming a channel extending along the length of the conductive metal wire.

[0121] 2. Place one or more optical fibers in the channel.

[0122] 3. Place the soft gel filler into the channel to encapsulate the optical fiber and act as a protective pad.

[0123] 4. Place the plug into the opening of the channel to seal the soft gel filler within the channel and form the optoelectronic cable core. The gel or other material forming the plug can form a thin layer above the outer surface of the conductive metal wire.

[0124] 5. Apply a layer of tape (e.g., PEEK) or polymer extrusion over the core of the optoelectronic cable to form an optoelectronic cable.

[0125] Example 6 - Manufacturing Process - Core Completion

[0126] To complete any of the photoelectric cables in Examples 1 to 5 to form a complete photoelectric cable, the following steps can be taken:

[0127] 1. Apply a sheathing layer over the optoelectronic cable formed according to any of Examples 1 to 5; or

[0128] 2. Apply a sheath layer over the optical cable formed according to any of Examples 1 to 5. The sheath layer may include an encapsulation of a polymer layer (e.g., or carbon fiber reinforced The fine winding thread in ) or

[0129] 3. Place two semi-circular metal wires (e.g., bow-shaped metal wires) above the optoelectronic cable formed according to any of Examples 1 to 5 to form an outer tube, and then apply an additional polymer layer tube above the tube; or

[0130] 4. Apply a metal strip layer with longitudinally curled seams over the optoelectronic cable formed according to any of Examples 1 to 5, and then apply an additional polymer layer over the metal strip layer.

[0131] Example 7 - Manufacturing Process - Coaxial Core Completion

[0132] To complete any of the photoelectric cables in Examples 1 to 5 to form a complete photoelectric cable, the following steps can be taken:

[0133] 1. Provide an optical cable formed according to any one of Examples 1 to 5.

[0134] 2. Extrude a layer of flexible silicone polymer over the optoelectronic cable. Powder can be placed on top of the silicone to mitigate the possibility of silicone adhering to the metal in subsequent step 3.

[0135] 3. Place numerous arched contour lines above the flexible silicone polymer layer. As the conductors are compressed above the flexible silicone polymer layer, the flexible silicone polymer fills the gaps between the arched contour lines.

[0136] 4. Apply stranded layers encapsulated in polymer layers over the arched profile to form a complete optoelectronic cable with a coaxial cable configuration.

[0137] Example 8 - Manufacturing Process - Arched Profile Wire Socket

[0138] The complete optoelectronic cable formed according to Example 6 or 7 can be arranged in a sheathed multi-component cable as follows:

[0139] 1. A layer of soft, deformable polymer is applied over one or more complete optoelectronic cables and one or more electrical conductor cables formed according to Examples 6 and / or 7 to form a multi-component cable. The complete optoelectronic cables and electrical conductor cables may, for example, have a three-core, four-core, or seven-core configuration.

[0140] 2. Place a number of arched metal wires longitudinally above the multi-component cable, sufficient to cover the circumference of the multi-component cable.

[0141] 3. Embedding arched profiles into a soft, deformable polymer. The shape of the arched profiles is configured to allow the polymer to deform into the gaps between the arched profiles. The outer profiles of the arched profiles contact each other and form a compression-resistant barrier over the multi-component cable.

[0142] 4. Extrude the first layer of carbon fiber reinforced (CFR) polymer above the arc profile to lock the arc profile in place around the multi-component cable.

[0143] 5. While the first layer of CFR polymer is still flexible, or after the multi-component cable has passed through the infrared heating source, the inner layer of the armored wire strength member is spirally laid over and partially embedded in the first layer of CFR polymer.

[0144] 6. The second layer of CFR polymer is extruded onto the inner layer of the armor line strength member and bonded to the first layer of CFR polymer through the gap between the armor line strength members.

[0145] 7. While the second layer of CFR polymer is still flexible, or after the multi-component cable has passed through the infrared heating source, the outer layer of the armored wire strength member is laid in a counter-spiral manner over the inner layer of the armored wire strength member above the second layer of CFR polymer, and partially embedded in the second layer of CFR polymer.

[0146] 8. For additional sealing, the final layer of CFR polymer is extruded over the outer layer of the armored wire strength members and bonded to the second layer of CFR polymer through the gap between the armored wire strength members to form a sheathed multi-component cable.

[0147] Example 9 - Manufacturing Process - Corrugated Metal Strip Sleeve

[0148] The complete optoelectronic cable formed according to either Example 6 or 7 can be arranged in a sheathed multi-component cable as follows:

[0149] 1. A layer of soft, deformable polymer is applied over one or more complete optoelectronic cables and one or more electrical conductor cables formed according to Examples 6 and / or 7 to form a multi-component cable. The complete optoelectronic cables and electrical conductor cables may, for example, have a three-core, four-core, or seven-core configuration.

[0150] 2. A corrugated metal strip is wound longitudinally around and embedded in a soft, deformable polymer to form a corrugated tube. The sides of the corrugated metal strip overlap to ensure complete coverage.

[0151] 3. Extrude the first layer of carbon fiber reinforced (CFR) polymer over the corrugated metal strip to lock the corrugated metal strip in place around the multi-component cable.

[0152] 4. While the first layer of CFR polymer is still flexible, or after the multi-component cable has passed through the infrared heating source, the inner layer of the armored wire strength member is spirally laid over and partially embedded therein on top of the first layer of CFR polymer.

[0153] 5. The second layer of CFR polymer is extruded onto the inner layer of the armor line strength member and bonded to the first layer of CFR polymer through the gap between the armor line strength members.

[0154] 6. While the second layer of CFR polymer is still flexible, or after the multi-component cable has passed through the infrared heating source, the outer layer of the armored wire strength member is laid in a counter-spiral manner onto the inner layer of the armored wire strength member above the second layer of CFR polymer, and partially embedded therein into the second layer of CFR polymer.

[0155] 7. For additional sealing, the final layer of CFR polymer is extruded over the outer layer of the armored wire strength members and bonded to the second layer of CFR polymer through the gap between the armored wire strength members to form a sheathed multi-component cable.

[0156] Example 10 - Manufacturing Process - Corrugated Covering Tape Connection

[0157] The complete optoelectronic cable formed according to either Example 6 or 7 can be arranged in a sheathed multi-component cable as follows:

[0158] 1. A layer of soft, deformable polymer is applied over one or more complete optoelectronic cables and one or more electrical conductor cables formed according to Examples 6 and / or 7 to form a multi-component cable. The complete optoelectronic cables and electrical conductor cables may, for example, have a three-core, four-core, or seven-core configuration.

[0159] 2. A layer of metal-coated tape is spirally wound over the soft, deformable polymer. The sides of the metal-coated tape overlap to ensure complete coverage of the multi-component cable.

[0160] 3. Extrude the first layer of carbon fiber reinforced (CFR) polymer over the metal sheath to lock the metal sheath in place around the multi-component cable.

[0161] 4. While the first layer of CFR polymer is still flexible, or after the multi-component cable has passed through the infrared heating source, the inner layer of the armored wire strength member is spirally laid over and partially embedded therein on top of the first layer of CFR polymer.

[0162] 5. The second layer of CFR polymer is extruded onto the inner layer of the armor line strength member and bonded to the first layer of CFR polymer through the gap between the armor line strength members.

[0163] 6. While the second layer of CFR polymer is still flexible, or after the multi-component cable has passed through the infrared heating source, the outer layer of the armored wire strength member is laid in a counter-spiral manner onto the inner layer of the armored wire strength member above the second layer of CFR polymer, and partially embedded therein into the second layer of CFR polymer.

[0164] 7. In some embodiments, for additional sealing, a final layer of CFR polymer is extruded over the outer layer of the armored wire strength members and bonded to a second layer of CFR polymer through the gaps between the armored wire strength members to form a sheathed multi-component cable.

[0165] Example 11 - Manufacturing Process - PEEK Socket

[0166] The complete optoelectronic cable formed according to either Example 6 or 7 can be arranged in a sheathed multi-component cable as follows:

[0167] 1. A layer of soft, deformable polymer or tape is applied over one or more complete optoelectronic cables and one or more electrical conductor cables formed according to Examples 6 and / or 7 to form a multi-component cable. The complete optoelectronic cable and electrical conductor cable may, for example, have a three-core, four-core, or seven-core configuration.

[0168] 2. Extrude a thick layer of polyetheretherketone (PEEK) or other rigid polymer onto a soft deformable polymer or strip.

[0169] 3. Extrude the first layer of carbon fiber reinforced (CFR) polymer over a thick layer of polyether ether ketone (PEEK) or other rigid polymer.

[0170] 4. While the first layer of CFR polymer is still flexible, or after the multi-component cable has passed through the infrared heating source, the inner layer of the armored wire strength member is spirally laid over and partially embedded therein on top of the first layer of CFR polymer.

[0171] 5. The second layer of CFR polymer is extruded onto the inner layer of the armor line strength member and bonded to the first layer of CFR polymer through the gap between the armor line strength members.

[0172] 6. While the second layer of CFR polymer is still flexible, or after the multi-component cable has passed through the infrared heating source, the outer layer of the armored wire strength member is laid in a counter-spiral manner onto the inner layer of the armored wire strength member above the second layer of CFR polymer, and partially embedded therein into the second layer of CFR polymer.

[0173] 7. In some embodiments, for additional sealing, a final layer of CFR polymer is extruded over the outer layer of the armored wire strength members and bonded to a second layer of CFR polymer through the gaps between the armored wire strength members to form a sheathed multi-component cable.

[0174] Figure 21 Another embodiment of an optoelectronic cable consistent with this disclosure is depicted, referred to herein as optoelectronic cable 100f. As shown in the illustrated embodiment, optoelectronic cable 100f includes a baseline 104f and a cover wire 600f. The baseline 104f and the cover wire 600f may each be formed of the same material as the baseline 104 of the optoelectronic cable 100a discussed above. For example, the baseline 104f and / or the cover wire 600f may be formed of copper, copper alloy, steel, aluminum, aluminum alloy, or any other suitable metallic or non-metallic material. Similar to the baseline 104, the baseline 104f may include a base 120 extending along the length of the baseline 104f.

[0175] Baseline 104f may include a channel 106f formed therein, the channel extending along the longitudinal axis of baseline 104f. Channel 106f is configured to accommodate one or more optical fibers 110. As discussed above, optical fibers 110 may include acrylate fibers, polyimide fibers, perfluoroalkoxy (PFA) siloxane fibers, or any other suitable optical fiber 110. Although in Figure 21 In the illustrated embodiment, the optoelectronic cable 100f includes two optical fibers 110; however, it should be understood that in other embodiments, the optoelectronic cable 100f may include any suitable number of optical fibers 110. For example, the optoelectronic cable 100f may include one, two, three, four, or more optical fibers 110 arranged within the channel 106f and extending along the length of the optoelectronic cable 100f. It should be understood that in some embodiments, the optical fiber 100 may include a sheath, shielding layer, or cladding layer forming the outer circumference of the optical fiber 100.

[0176] In some embodiments, the optical fiber 110 may be in contact (e.g., physical contact) with the baseline 104f and / or the cover line 600f. In this way, compressive forces applied to the baseline 104f and / or the cover line 600f can be transmitted to the optical fiber 110. In other words, the optical fiber 110 may be coupled to the baseline 104f, the cover line 600f, or both, such that compressive forces applied to the opto-cable 100f (e.g., radial forces applied to the opto-cable 100f) are transmitted to the optical fiber 110. In other embodiments, a gap may be maintained between the outer circumference of the optical fiber 110 and the channel 106f and / or the cover line 600f. For example, in some embodiments, a filler 112 may be inserted (e.g., injected) into the channel 106f to encapsulate the optical fiber 110 within the channel 106f. In this way, the filler 112 can provide protective cushioning for the optical fiber 110. That is, in some embodiments, the filler 112 can isolate the optical fiber 110 from direct physical contact with the baseline 104f. In some embodiments, filler 112 may allow optical fiber 110 to contact baseline 104f and / or cover line 600f, while occupying gap space (e.g., void) that may be formed between optical fiber 110, baseline 104f, and / or cover line 600f. It should be understood that in other embodiments, filler 112 may be omitted from channel 106f (e.g., channel 106f may be filled with air). For clarity, it should be understood that any embodiment of the optoelectronic cable 100f discussed herein may include the arrangement of optical fiber 100 discussed above.

[0177] In the illustrated embodiment, baseline 104f includes a pair of baseline mating surfaces 602 (e.g., mating surfaces) that can accommodate cover wire 600f. For example, baseline mating surfaces 602 may extend longitudinally along the length of baseline 104f and may be positioned along opposite sides of channel 106f. Specifically, baseline mating surfaces 602 may be located between opposing protrusions 604 of baseline 104f. Baseline mating surfaces 602 and protrusions 604 may thus define a mating channel 606 that extends longitudinally along the length of baseline 104f and may form part of channel 106f. In some embodiments, baseline mating surfaces 602 are substantially flat surfaces. Cover wire 600f includes mating surfaces 608 (e.g., substantially flat surfaces) that may rest on and / or engage with baseline mating surfaces 602 when cover wire 600f is inserted into mating channel 606. In some embodiments, when cover wire 600f is inserted into mating channel 606, the dimensions of cover wire 600f may be configured to form an interference fit between protrusions 604. Therefore, this interference fit facilitates the attachment of the cover wire 600f to the baseline 104f and retains the cover wire 600f within the mating channel 606. Alternatively, suitable adhesives (e.g., bonding agents) and / or metallurgical processes (e.g., welding, brazing) can be used to attach the cover wire 600f to the baseline 104f. In some embodiments, the cover wire 600f, when installed within the mating channel 606, can form a fluid seal between the channel 106f and the surrounding environment surrounding the optoelectronic cable 100f. Thus, the cover wire 600f can seal the optical fiber 110 and / or filler 112 within the channel 106f and can mitigate or substantially eliminate fluid flow through the interface between the cover wire 600f and the baseline 104f.

[0178] Similar to the embodiments of the optoelectronic cables discussed above, the optoelectronic cable 100f may include one or more polymer layers 118 (e.g., polymer tape layers, extruded polymer sheaths) encapsulating the baseline 104f and the cover wire 600f. In practice, as described above, the polymer layer 118 may include one or more layers of polyetheretherketone (PEEK) tape, which may be wound circumferentially, helically, and / or longitudinally around the assembled baseline 104f and cover wire 600f. In other embodiments, the polymer layer 118 may include a polymer sheath that is extruded around the outside of the baseline 104f and cover wire 600f after the baseline 104f and cover wire 600f are assembled. In some embodiments, the polymer layer 118 may facilitate retaining the cover wire 600f within the mating channel 606. Furthermore, the polymer layer 118 may facilitate the formation of a fluid seal between the channel 106f and the surrounding environment of the optoelectronic cable 100f. For this purpose, the polymer layer 118 may facilitate preventing foreign matter from entering the channel 106f.

[0179] Figures 21A to 21F The various steps involved in manufacturing the optoelectronic cable 100f according to the techniques discussed herein are described. For example, to assemble the optoelectronic cable 100f, such as... Figure 21A As shown, the baseline 104f can first be extruded or otherwise processed to include the features discussed above, such as the base 120, the channel 106f, the baseline mating surface 602, and the protrusion 604. As... Figure 21B As shown, one or more optical fibers 110 can be placed within channel 106f. For example... Figure 21C As shown, filler 112 can be placed (e.g., injected into) channel 106 to encapsulate optical fiber 110 within channel 106f. Figure 21D As shown, the cover line 600f can be extruded or otherwise processed to include the features discussed above, such as the mating surface 608. The cover line 600f can be inserted into the mating channel 606 and joined to the baseline 104f (e.g., via interference fit, adhesive, and / or metallurgical processes) to enclose the channel 106f. That is, as... Figure 21E As shown, the cover wire 600f can encapsulate the optical fiber 110 and the filler 112 within the channel 106f to form the optoelectronic cable core 116f. For clarity, it should be understood that the optoelectronic cable core 116f may include the baseline 104f, the cover wire 600f, one or more optical fibers 110, and the filler 112. Figure 21F As shown, one or more polymer layers 118 may be wrapped around or extruded over the photoelectric cable core 116f, thereby encapsulating the photoelectric cable core 116f and forming the photoelectric cable 100f.

[0180] Figure 22 Another embodiment of an optoelectronic cable consistent with this disclosure is depicted, referred to herein as optoelectronic cable 100g. As shown in the illustrated embodiment, optoelectronic cable 100g includes a baseline 104g and a cover wire 600g. The baseline 104g and the cover wire 600g may each be formed of the same material as the baseline 104f of optoelectronic cable 100f. Similar to the baseline 104f discussed above, the baseline 104g may include a base 120 extending along the length of the baseline 104g.

[0181] The baseline 104g may include a channel 106g formed therein, the channel extending along the longitudinal axis of the baseline 104g. The channel 106g is configured to accommodate one or more optical fibers 110. A filler 112 may be inserted (e.g., injected) into the channel 106g to encapsulate the optical fiber 110 within the channel 106g and to provide protective buffering for the optical fiber 110. That is, as discussed similarly above, the filler 112 can isolate the optical fiber 110 from direct physical contact with the baseline 104g. In some embodiments, the filler 112 may allow the optical fiber 110 to contact the baseline 104g and / or the cover line 600g while occupying a gap space (e.g., a void) that may be formed between the optical fiber 110, the baseline 104g, and / or the cover line 600g. In other embodiments, the filler 112 may be omitted from the channel 106g.

[0182] In the illustrated embodiment, the baseline 104g includes a baseline mating chamfer 620 that can accommodate the cover line 600g. For example, the baseline mating chamfer 620 may extend longitudinally along the length of the baseline 104g and may be positioned along opposite sides of the channel 106g. Specifically, the baseline mating chamfer 620 may extend between a corresponding edge 622 of the channel 106g and a corresponding vertex 624 of the baseline 104g. The baseline mating chamfer 620 may thus define a mating groove 626 that may extend longitudinally along the length of the baseline 104g. In some embodiments, the baseline mating chamfer 620 is a substantially flat surface. The cover line 600g includes an arched profile with a beveled mating surface 628 (e.g., a substantially flat surface), which may rest on and / or engage with the corresponding baseline mating chamfer in the baseline mating chamfer 620 when the cover line 600g is inserted into the mating groove 626. In some embodiments, suitable adhesives (e.g., bonding agents) and / or metallurgical processes (e.g., welding, brazing) can be used to attach the cover wire 600g to the baseline 104g. In some embodiments, the cover wire 600g, when mounted within the mating groove 626, can form a fluid seal between the channel 106g and the surrounding environment surrounding the optoelectronic cable 100g. Thus, the cover wire 600g can seal the optical fiber 110 and / or filler 112 within the channel 106g and can mitigate or substantially eliminate fluid flow through the interface between the cover wire 600g and the baseline 104g.

[0183] Similar to the embodiments of the optoelectronic cable discussed above, the optoelectronic cable 100g may include one or more polymer layers 118 (e.g., polymer tape layers) encapsulating the baseline 104g and the cover wire 600g. The polymer layers 118 may be wound around or extruded over the assembled baseline 104g and cover wire 600g. In some embodiments, the polymer layers 118 may facilitate holding the cover wire 600g within the mating groove 626. Furthermore, the polymer layers 118 may facilitate the formation of a fluid seal between the channel 106g and the surrounding environment surrounding the optoelectronic cable 100g. For this purpose, the polymer layers 118 may facilitate preventing foreign matter from entering the channel 106g.

[0184] Figures 22A to 22F The various steps involved in manufacturing 100g of optoelectronic cable according to the techniques discussed herein are described. For example, to assemble 100g of optoelectronic cable, such as... Figure 22A As shown, the baseline 104g can first be extruded or otherwise processed to include the features discussed above, such as the base 120, the channel 106f, and the baseline mating chamfer 620. For example... Figure 22B As shown, one or more optical fibers 110 can be placed within channel 106f. For example... Figure 22C As shown, filler 112 can be placed in channel 106 to encapsulate optical fiber 110 within channel 106g. For example... Figure 22D As shown, the cover line 600g can be extruded or otherwise processed to include the features discussed above, such as the inclined mating surface 628. The cover line 600g can be inserted into the mating groove 626 and joined to the baseline 104g (e.g., via adhesive and / or metallurgical processes) to enclose the channel 106g. That is, as Figure 22E As shown, the cover wire 600g can encapsulate the optical fiber 110 and the filler 112 to form the optoelectronic cable core 116g. For clarity, it should be understood that the optoelectronic cable core 116g may include the baseline 104g, the cover wire 600g, one or more optical fibers 110, and the filler 112. Figure 22F As shown, one or more polymer layers 118 may be wrapped around or extruded over the photoelectric cable core 116g, thereby encapsulating the photoelectric cable core 116g and forming the photoelectric cable 100f.

[0185] Figure 23Another embodiment of an optoelectronic cable consistent with this disclosure is depicted, referred to herein as optoelectronic cable 100h. As shown in the illustrated embodiment, optoelectronic cable 100h includes a baseline 104h and a cover wire 600h. The baseline 104h and the cover wire 600h may each be formed of the same material as the baseline 104g of optoelectronic cable 100h. In some embodiments, the cover wire 600h may be formed of a metallic material that is softer (e.g., more ductile) than the material used to form the baseline 104g. In some embodiments, the cover wire 600h may comprise a single solid conductor. In other embodiments, the cover wire 600h may comprise a stranded wire made of multiple individual conductors. Similar to the baseline 104g discussed above, the baseline 104h may include a base 120 extending along the length of the baseline 104h.

[0186] The baseline 104h may include a channel 106h formed therein, the channel extending along the longitudinal axis of the baseline 104h. The channel 106h is configured to accommodate one or more optical fibers 110. A filler 112 may be inserted (e.g., injected) into the channel 106h to encapsulate the optical fiber 110 within the channel 106h and provide protective buffering for the optical fiber 110. For this purpose, the filler 112 may isolate the optical fiber 110 from direct physical contact with the baseline 104h. In some embodiments, the filler 112 may allow the optical fiber 110 to contact the baseline 104h and / or the cover line 600h while occupying a gap space (e.g., a void) that may be formed between the optical fiber 110, the baseline 104h, and / or the cover line 600h. In other embodiments, the filler 112 may be omitted from the channel 106h.

[0187] As shown in the illustrated embodiment, baseline 104h includes a pair of curved mating surfaces 630 extending between channel 106h and corresponding vertices 632 of baseline 104h. The curved mating surfaces 630 may extend along the length of baseline 104h and thus define a receiving channel 634 of baseline 104h, which may receive and engage with cover line 600h. For example, in some embodiments, cover line 600h may include a generally circular cross-sectional shape or a generally elliptical cross-sectional shape. The profile or radius of curvature of the curved mating surfaces 630 may be formed to receive and engage with the outer profile of cover line 600h. That is, when cover line 600h is inserted into receiving channel 634, the dimensions of cover line 600h may be configured to engage with receiving channel 634 via an interference fit. Therefore, this interference fit between cover line 600h and receiving channel 634 can facilitate the attachment of cover line 600h to baseline 104h and retention of cover line 600h within receiving channel 634. Alternatively or concurrently, suitable adhesives (e.g., bonding agents) and / or metallurgical processes (e.g., welding, brazing) can be used to join the cover wire 600h to the baseline 104h. In some embodiments, the cover wire 600g, when installed within the receiving channel 634, can form a fluid seal between the channel 106g and the surrounding environment surrounding the optoelectronic cable 100h. Thus, the cover wire 600h can seal the optical fiber 110 and / or filler 112 within the channel 106h and can mitigate or substantially eliminate fluid flow through the interface between the cover wire 600h and the baseline 104h.

[0188] Similar to the embodiments of the optoelectronic cable discussed above, the optoelectronic cable 100h may include one or more polymer layers 118 (e.g., polymer tape layers) encapsulating the baseline 104h and the cover wire 600h. The polymer layers 118 may be wound around or extruded over the assembled baseline 104h and cover wire 600h. In some embodiments, the polymer layers 118 may facilitate holding the cover wire 600h within the receiving channel 634. Furthermore, the polymer layers 118 may facilitate the formation of a fluid seal between the channel 106h and the surrounding environment surrounding the optoelectronic cable 100h. For this purpose, the polymer layers 118 may facilitate preventing foreign matter from entering the channel 106h.

[0189] Figures 23A to 23F The various steps involved in manufacturing the optoelectronic cable 100h according to the technology discussed herein are described. For example, to assemble the optoelectronic cable 100h, as follows... Figure 23A As shown, the baseline 104h can first be extruded or otherwise processed to include the features discussed above, such as the base 120, the channel 106h, and the curved mating surface 630. For example... Figure 23B As shown, one or more optical fibers 110 can be placed within channel 106h. For example... Figure 23CAs shown, filler 112 can be placed in channel 106h to encapsulate optical fiber 110 within channel 106h. For example... Figure 23D As shown, the cover line 600h can be extruded or otherwise processed to include a specific cross-sectional shape or geometry (e.g., a circular cross-sectional shape). The cover line 600h can be inserted into the receiving channel 634 and coupled to the baseline 104h (e.g., via interference fit, adhesive, and / or metallurgical processes) to enclose the channel 106h. That is, as Figure 23E As shown, the cover line 600h can encapsulate the optical fiber 110 and the filler 112 within the channel 106h to form the optoelectronic cable core 116h. For clarity, it should be understood that the optoelectronic cable core 116h may include the baseline 104h, the cover line 600h, one or more optical fibers 110, and the filler 112. Figure 23F As shown, one or more polymer layers 118 may be wrapped around or extruded over the photoelectric cable core 116h, thereby encapsulating the photoelectric cable core 116h and forming the photoelectric cable 100h.

[0190] Figure 24 Another embodiment of an optoelectronic cable consistent with this disclosure is depicted, referred to herein as optoelectronic cable 100i. As shown in the illustrated embodiment, optoelectronic cable 100i includes a baseline 104i and a cover wire 600i. The baseline 104i and the cover wire 600i may each be formed of the same material as the baseline 104i of optoelectronic cable 100i. In the illustrated embodiment, the baseline 104i does not include a base 120. However, it should be understood that in other embodiments, the baseline 104i may include a base 120.

[0191] Baseline 104i may include a channel 106i formed therein, the channel extending along the longitudinal axis of baseline 104i. Channel 106i is configured to accommodate one or more optical fibers 110. Filler 112 may be inserted (e.g., injected) into channel 106i to encapsulate optical fiber 110 within channel 106i and provide protective buffering for optical fiber 110. That is, as discussed similarly above, filler 112 can isolate optical fiber 110 from direct physical contact with baseline 104i. In some embodiments, filler 112 may allow optical fiber 110 to contact baseline 104i and / or cover line 600i while occupying gap space (e.g., void) that may be formed between optical fiber 110, baseline 104i, and / or cover line 600i. In other embodiments, filler 112 may be omitted from channel 106i.

[0192] In the illustrated embodiment, baseline 104i includes a first set of baseline mating surfaces 640 and a second set of baseline mating surfaces 642, which may extend longitudinally along the length of baseline 104i. The first set of baseline mating surfaces 640 may be positioned along opposite sides of channel 106i and may be offset from the second set of baseline mating surfaces 642 (e.g., relative to the central axis of baseline 104i). Specifically, a corresponding intermediate surface 644 may extend between the first set of baseline mating surfaces 640 and the second set of baseline mating surfaces 642. In some embodiments, the first set of baseline mating surfaces 640, the second set of baseline mating surfaces 642, and the intermediate surface 644 may comprise substantially flat surfaces. In some embodiments, the intermediate surface 644 may extend substantially orthogonal to or transverse to the first set of baseline mating surfaces 640 and the second set of baseline mating surfaces 642. In any case, the first set of baseline mating surfaces 642 and the intermediate surface 644 may collectively define a mating groove 646, which may extend longitudinally along the length of baseline 104i. The cover line 600i includes a mating tab 648 having a mating surface 650 (e.g., a substantially flat surface) that rests on and / or engages with a first set of baseline mating surfaces 640 when the mating tab 648 is inserted into a mating groove 646. As shown in the illustrated embodiment, the cover line 600i may include a mating protrusion 652 extending from the mating tab 648 and engaging with a second set of baseline mating surfaces 642 when the mating tab 648 is inserted into the mating groove 646. In this way, the mating tab 648 and the mating protrusion 652 can cooperatively facilitate the transmission of force (e.g., compressive force) to the baseline 104i. In some embodiments, interference engagement between the mating protrusion 648 and the mating groove 646 can facilitate the attachment of the cover line 600i to the baseline 104i. Alternatively or additionally, suitable adhesives (e.g., bonding agents) and / or metallurgical processes (e.g., welding, brazing) can be used to attach the cover line 600i to the baseline 104i. In some embodiments, the cover wire 600i, when mounted on the mating groove 646, can form a fluid seal between the channel 106i and the surrounding environment surrounding the optoelectronic cable 100i. Thus, the cover wire 600i can seal the optical fiber 110 and / or the filler 112 within the channel 106i and can mitigate or substantially eliminate fluid flow through the interface between the cover wire 600i and the baseline 104i.

[0193] Similar to the embodiments of the optoelectronic cables discussed above, the optoelectronic cable 100i may include one or more polymer layers 118 (e.g., polymer tape layers) encapsulating the baseline 104i and the cover wire 600i. The polymer layers 118 may be wound around or extruded over the assembled baseline 104i and cover wire 600i. In some embodiments, the polymer layers 118 may facilitate holding the cover wire 600i in an engaged configuration with the mating groove 646. Furthermore, the polymer layers 118 may facilitate the formation of a fluid seal between the channel 106i and the surrounding environment surrounding the optoelectronic cable 100i. For this purpose, the polymer layers 118 may facilitate preventing foreign matter from entering the channel 106i.

[0194] Figures 24A to 24F The various steps involved in manufacturing the optoelectronic cable 100i according to the techniques discussed herein are described. For example, in order to assemble the optoelectronic cable 100i, such as... Figure 24A As shown, baseline 104i can first be extruded or otherwise processed to include the features discussed above, such as the first set of baseline mating surfaces 640 and the second set of baseline mating surfaces 642, the intermediate surface 644, and the channel 106i. Figure 24B As shown, one or more optical fibers 110 can be placed within channel 106i. For example... Figure 24C As shown, filler 112 can be placed in channel 106i to encapsulate optical fiber 110 within channel 106i. For example... Figure 24D As shown, the cover line 600i can be extruded or otherwise processed to include features discussed above, such as mating tabs 648 and mating protrusions 652. The mating tab 648 can be inserted into the mating groove 646 and engaged with the baseline 104i (e.g., via interference fit, adhesive, and / or metallurgical processes) to enclose the channel 106i. That is, as... Figure 24E As shown, the cover wire 600i can encapsulate the optical fiber 110 and the filler 112 within the channel 106i to form the optoelectronic cable core 116i. For clarity, it should be understood that the optoelectronic cable core 116i may include the baseline 104i, the cover wire 600i, one or more optical fibers 110, and the filler 112. Figure 24F As shown, one or more polymer layers 118 may be wrapped around or extruded over the photoelectric cable core 116i, thereby encapsulating the photoelectric cable core 116i and forming the photoelectric cable 100i.

[0195] Figure 25Another embodiment of an optoelectronic cable consistent with this disclosure is depicted, referred to herein as optoelectronic cable 100j. As shown in the illustrated embodiment, optoelectronic cable 100j includes a first baseline 660 (e.g., a first arcuate baseline) and a second baseline 662 (e.g., a second arcuate baseline), which are joinable to each other at corresponding mating interfaces 664 to form a loop wire member. The first baseline 660 and the second baseline 662 may each be formed of the same material as the baseline 104i of the optoelectronic cable 100i discussed above. In the illustrated embodiment, the first baseline 660 and the second baseline 662 do not include a base 120. However, it should be understood that in other embodiments, the first baseline 660, the second baseline 662, or both may include a corresponding base 120.

[0196] As shown in the illustrated embodiment, the first baseline 660 and the second baseline 662 may each be a generally semi-circular material (e.g., a metal wire) having a channel 666 formed therein. The channel 666 of the first baseline 660 and the second baseline 662 may accommodate one or more optical fibers 110, such that in the assembly configuration of the first baseline 660 and the second baseline 662, the optical fiber 110 is encapsulated within a central tunnel 668 (e.g., a tunnel formed by the channel) of the optoelectronic cable 100j. In the illustrated embodiment, the optoelectronic cable 100j includes three optical fibers 110 that can collectively form an optical micro-bundle 669. In some embodiments, a sleeve or sheath 671 may be disposed around the optical micro-bundle 669 (e.g., extruded around the optical micro-bundle). It should be understood that in other embodiments, the optical micro-bundle 669 may include one, two, three, four, five, or more optical fibers 110.

[0197] Filler 112 may be inserted (e.g., injected) into the central tunnel 668 to enclose the optical fiber 110 within the central tunnel 668 and provide a protective buffer for the optical fiber 110. That is, as discussed similarly above, filler 112 can isolate the optical fiber 110 from direct physical contact with the first baseline 660 and the second baseline 662. In some embodiments, filler 112 may allow the optical fiber 110 to contact the first baseline 660 and the second baseline 662 while occupying a gap space (e.g., a void) that may be formed between the optical fiber 110 and the first baseline 660 and the second baseline 662. In other embodiments, filler 112 may be omitted from the central tunnel 668.

[0198] In the illustrated embodiment, the mating interfaces 664 of the first baseline 660 and the second baseline 662 each include a generally stepped geometry. Specifically, the mating interface 664 of the first baseline 660 (e.g., a first set of mating interfaces) includes a corresponding protrusion 670 that can engage with a corresponding notch 672 formed within the mating interface 664 of the second baseline 662 (e.g., a second set of mating interfaces). However, as discussed below, the mating interfaces 664 of the first baseline 660 and the second baseline 662 may include any other suitable profile or geometry that facilitates engagement between the first baseline 660 and the second baseline 662. It should be understood that in the assembly configuration of the optoelectronic cable 100j, the stepped geometry of the mating interfaces 664 can prevent lateral movement of the first baseline 660 relative to the second baseline 662, and as a result, reduce or substantially eliminate the occurrence of pinching.

[0199] In some embodiments, interference fit between mating interfaces 664 can facilitate the connection of the first baseline 660 and the second baseline 662 to each other. Alternatively, suitable adhesives (e.g., bonding agents) and / or metallurgical processes (e.g., welding, brazing) can be used to connect the first baseline 660 to the second baseline 662 at the mating interfaces 664. In some embodiments, when the first baseline 660 and the second baseline 662 are connected to each other, the mating interfaces 664 can form a fluid seal between the central tunnel 668 and the surrounding environment surrounding the optoelectronic cable 100j. Thus, the first baseline 660 and the second baseline 662 can cooperate to seal the optical fiber 110 and / or filler 112 within the central tunnel 668 and can mitigate or substantially eliminate fluid flow through the interface (e.g., boundary) between the first baseline 660 and the second baseline 662.

[0200] Similar to the embodiments of the optoelectronic cables discussed above, optoelectronic cable 100j may include one or more polymer layers 118 (e.g., polymer tape layers) that may be wound around or extruded over the assembled first baseline 660 and second baseline 662. In some embodiments, polymer layers 118 may facilitate holding the first baseline 660 and second baseline 662 in a configuration where they are engaged with each other (e.g., an assembled configuration). Furthermore, polymer layers 118 may facilitate the formation of a fluid seal between the central tunnel 668 and the surrounding environment of the optoelectronic cable 100j. For this purpose, polymer layers 118 may facilitate preventing foreign matter from entering the central tunnel 668.

[0201] Figures 25A to 25D The various steps involved in manufacturing the optoelectronic cable 100j according to the techniques discussed herein are described. For example, in order to assemble the optoelectronic cable 100j, such as... Figure 25AAs shown, the first baseline 660 and the second baseline 662 can first be extruded or otherwise processed to include the corresponding features discussed above, such as channel 666, protrusion 670, and notch 672. Figure 25B As shown, one or more optical fibers 110 can be placed between the first baseline 660 and the second baseline 662 (e.g., within one of the channels 666). In some embodiments, such as Figure 25C As shown, during the joining of the first baseline 660 and the second baseline 662 (e.g., to form a central tunnel 668), filler 112 can be injected into the central tunnel 668 to encapsulate the optical fiber 110 within the central tunnel 668. The first baseline 660 and the second baseline 662 can encapsulate the optical fiber 110 and the filler 112 within the central tunnel 668 to form an optoelectronic cable core 116j. For clarity, it should be understood that the optoelectronic cable core 116j may include the first baseline 660, the second baseline 662, one or more optical fibers 110, and the filler 112. Figure 25D As shown, one or more polymer layers 118 may be wrapped around or extruded over the photoelectric cable core 116j, thereby encapsulating the photoelectric cable core 116j and forming the photoelectric cable 100j.

[0202] Figure 26 Another embodiment of an optoelectronic cable consistent with this disclosure is depicted, referred to herein as optoelectronic cable 100k. As shown in the illustrated embodiment, optoelectronic cable 100k includes a first baseline 680 (e.g., a first bow-shaped baseline) and a second baseline 682 (e.g., a second bow-shaped baseline), which are mating to each other at corresponding mating interfaces 684. The first baseline 680 and the second baseline 682 may each be formed of the same material as the first baseline 660 and the second baseline 662 of optoelectronic cable 100j discussed above. In the illustrated embodiment, the first baseline 680 and the second baseline 682 do not include a base 120. However, it should be understood that in other embodiments, the first baseline 680, the second baseline 682, or both may include a corresponding base 120.

[0203] As shown in the illustrated embodiment, the first baseline 680 and the second baseline 682 may each be a generally semi-circular material (e.g., a metal wire) having a channel 666 formed therein. The channel 666 of the first baseline 680 and the second baseline 682 may accommodate one or more optical fibers 110 (e.g., optical micro-bundles 669) such that, in the assembly configuration of the first baseline 680 and the second baseline 682, the optical fiber 110 is encapsulated within a central tunnel 668 (e.g., the tunnel formed by the channel 666) of the optoelectronic cable 100k. A filler 112 may be inserted (e.g., injected) into the central tunnel 668 to encapsulate the optical fiber 110 within the central tunnel 668 and provide protective buffering for the optical fiber 110. That is, as discussed similarly above, the filler 112 can isolate the optical fiber 110 from direct physical contact with the first baseline 680 and the second baseline 682. In some embodiments, the filler 112 allows the optical fiber 110 to contact the first baseline 680 and the second baseline 682, while occupying a gap space (e.g., a void) that can be formed between the optical fiber 110 and the first baseline 680 and the second baseline 682. In other embodiments, the filler 112 may be omitted from the central tunnel 668.

[0204] In the illustrated embodiment, the mating interfaces 684 of the first baseline 680 and the second baseline 682 each include a generally inclined or wedge-shaped geometry. Specifically, the mating interface 684 of the first baseline 680 includes a protrusion 690 that can engage with a corresponding downwardly inclined protrusion 692 formed within the mating interface 684 of the second baseline 682. However, as discussed below, the mating interfaces 684 of the first baseline 680 and the second baseline 682 may include any other suitable profile or geometry that facilitates engagement between the first baseline 680 and the second baseline 682. It should be understood that in the assembly configuration of the optoelectronic cable 100k, the wedge-shaped geometry of the mating interface 664 can prevent lateral movement of the first baseline 680 relative to the second baseline 682, and as a result, reduce or substantially eliminate the occurrence of pinching.

[0205] In some embodiments, suitable adhesives (e.g., bonding agents) and / or metallurgical processes (e.g., welding, brazing) can be used to join the first baseline 680 to the second baseline 682 at the mating interface 684. In some embodiments, when the first baseline 680 and the second baseline 682 are joined to each other, the mating interface 684 can form a fluid seal between the central tunnel 668 and the surrounding environment surrounding the optoelectronic cable 100k. Thus, the first baseline 680 and the second baseline 682 can cooperate to seal the optical fiber 110 and / or filler 112 within the central tunnel 668 and can mitigate or substantially eliminate fluid flow through the interface (e.g., boundary) between the first baseline 680 and the second baseline 682.

[0206] Similar to the embodiments of the optoelectronic cables discussed above, the optoelectronic cable 100k may include one or more polymer layers 118 (e.g., polymer tape layers) that may be wound around or extruded over the assembled first baseline 680 and second baseline 682. In some embodiments, the polymer layers 118 may facilitate holding the first baseline 680 and second baseline 682 in a configuration where they are engaged with each other (e.g., an assembled configuration). Furthermore, the polymer layers 118 may facilitate the formation of a fluid seal between the central tunnel 668 and the surrounding environment of the optoelectronic cable 100k. For this purpose, the polymer layers 118 may facilitate preventing foreign matter from entering the central tunnel 668.

[0207] Figures 26A to 26D The various steps involved in manufacturing the 100k optoelectronic cable according to the techniques discussed herein are described. For example, to assemble the 100k optoelectronic cable, such as... Figure 26A As shown, the first baseline 680 and the second baseline 682 can first be extruded or otherwise processed to include the corresponding features discussed above, such as channel 666, inclined protrusion 690, and downward-sloping protrusion 692. Figure 26B As shown, one or more optical fibers 110 can be placed between the first baseline 680 and the second baseline 682 (e.g., within one of the channels 666). In some embodiments, such as Figure 26C As shown, during the joining of the first baseline 680 and the second baseline 682 (e.g., to form a central tunnel 668), filler 112 can be injected into the central tunnel 668 to encapsulate the optical fiber 110 within the central tunnel 668. The first baseline 680 and the second baseline 682 can encapsulate the optical fiber 110 and filler 112 within the central tunnel 668 to form an optoelectronic cable core 116k. For clarity, it should be understood that the optoelectronic cable core 116k may include the first baseline 680, the second baseline 682, one or more optical fibers 110, and filler 112. Figure 26D As shown, one or more polymer layers 118 may be wrapped around or extruded over the photoelectric cable core 116k, thereby encapsulating the photoelectric cable core 116k and forming the photoelectric cable 100k.

[0208] Figure 27Another embodiment of an optoelectronic cable consistent with this disclosure is depicted, referred to herein as optoelectronic cable 100m. As shown in the illustrated embodiment, optoelectronic cable 100m includes a first baseline 700 (e.g., a first arcuate baseline) and a second baseline 702 (e.g., a second arcuate baseline), which are joinable to each other at corresponding mating interfaces 704 (e.g., keyed mating interfaces). The first baseline 700 and the second baseline 702 may each be formed of the same material as the first baseline 680 and the second baseline 682 of optoelectronic cable 100k discussed above. In the illustrated embodiment, the first baseline 700 and the second baseline 702 do not include a base 120. However, it should be understood that in other embodiments, the first baseline 700, the second baseline 702, or both may include a corresponding base 120.

[0209] As shown in the illustrated embodiment, the first baseline 680 and the second baseline 682 can each be a generally semi-circular material (e.g., a metal wire) having a channel 666 formed therein. The channel 666 of the first baseline 680 and the second baseline 682 can accommodate one or more optical fibers 110 (e.g., optical micro-bundles 669) such that, in the assembly configuration of the first baseline 680 and the second baseline 682, the optical fiber 110 is encapsulated within a central tunnel 668 (e.g., the tunnel formed by the channel 666) of the optoelectronic cable 100k. A filler 112 can be inserted (e.g., injected) into the central tunnel 668 to encapsulate the optical fiber 110 within the central tunnel 668 and provide protective buffering for the optical fiber 110. That is, as discussed similarly above, the filler 112 can isolate the optical fiber 110 from direct physical contact with the first baseline 700 and the second baseline 702. In some embodiments, the filler 112 allows the optical fiber 110 to contact the first baseline 700 and the second baseline 702, while occupying a gap space (e.g., a void) that can be formed between the optical fiber 110 and the first baseline 700 and the second baseline 702. In other embodiments, the filler 112 may be omitted from the central tunnel 668.

[0210] In the illustrated embodiment, one of the mating interfaces 704 of the first baseline 700 includes a first protrusion 720 (e.g., a first key), and the other of the mating interfaces 704 of the first baseline 700 includes a first groove 722 (e.g., a first receptacle). One of the mating interfaces 704 of the first baseline 702 includes a second protrusion 724 (e.g., a second key), and the other of the mating interfaces 704 of the second baseline 702 includes a second groove 726 (e.g., a second receptacle). In the assembly configuration of the first baseline 700 and the second baseline 702, the first protrusion 720 and the second protrusion 724 engage with the second groove 726 and the first groove 722, respectively. It should be understood that the interlocking of the first protrusion 720 with the second groove 726 and the interlocking of the second protrusion 724 with the first groove 722 can prevent lateral movement of the first baseline 700 relative to the second baseline 702, and as a result, reduce or substantially eliminate the occurrence of extrusion. Furthermore, it should be understood that in some embodiments, the first baseline 700 and the second baseline 702 may be self-similar, interchangeable components. For example, in such embodiments, the first baseline 700 may be used interchangeably with the second baseline 702, and vice versa. Additionally, in some embodiments, the first baseline 700 may include both a first protrusion 720 and a second protrusion 724, while the second baseline 702 may include both a first groove 722 and a second groove 726.

[0211] In some embodiments, suitable adhesives (e.g., bonding agents) and / or metallurgical processes (e.g., welding, brazing) can be used to join the first baseline 700 to the second baseline 702 at the mating interface 704. In some embodiments, when the first baseline 700 and the second baseline 702 are joined to each other, the mating interface 704 can form a fluid seal between the central tunnel 668 and the surrounding environment surrounding the optoelectronic cable 100m. Thus, the first baseline 700 and the second baseline 702 can cooperate to seal the optical fiber 110 and / or filler 112 within the central tunnel 668 and can mitigate or substantially eliminate fluid flow through the interface (e.g., boundary) between the first baseline 700 and the second baseline 702.

[0212] Similar to the embodiments of the optoelectronic cable discussed above, the optoelectronic cable 100m may include one or more polymer layers 118 (e.g., polymer tape layers) that may be wound around or extruded over the assembled first baseline 700 and second baseline 702. In some embodiments, the polymer layers 118 may facilitate holding the first baseline 700 and second baseline 702 in a configuration where they are engaged with each other (e.g., an assembled configuration). Furthermore, the polymer layers 118 may facilitate the formation of a fluid seal between the central tunnel 668 and the surrounding environment surrounding the optoelectronic cable 100m. For this purpose, the polymer layers 118 may facilitate preventing foreign matter from entering the central tunnel 668.

[0213] Figures 27A to 27D The various steps involved in manufacturing a 100m fiber optic cable according to the techniques discussed herein are described. For example, to assemble the 100m fiber optic cable, such as... Figure 27A As shown, the first baseline 700 and the second baseline 702 can first be extruded or otherwise processed to include the corresponding features discussed above, such as channel 666, first protrusion 720 and second protrusion 724, and first groove 722 and second groove 726. Figure 27B As shown, one or more optical fibers 110 can be placed between the first baseline 700 and the second baseline 702 (e.g., within one of the channels 666). In some embodiments, such as Figure 27C As shown, during the joining of the first baseline 700 and the second baseline 702 (e.g., to form a central tunnel 668), filler 112 can be injected into the central tunnel 668 to encapsulate the optical fiber 110 within the central tunnel 668. The first baseline 700 and the second baseline 702 can encapsulate the optical fiber 110 and the filler 112 within the central tunnel 668 to form an optoelectronic cable core 116m. For clarity, it should be understood that the optoelectronic cable core 116m may include the first baseline 700, the second baseline 702, one or more optical fibers 110, and the filler 112. Figure 27D As shown, one or more polymer layers 118 may be wound around or extruded over the photoelectric cable core 116m, thereby encapsulating the photoelectric cable core 116m and forming the photoelectric cable 100m.

[0214] Figure 28 Another embodiment of the optoelectronic cable consistent with this disclosure is depicted, referred to herein as optoelectronic cable 100n. Optoelectronic cable 100n includes a plurality of arched profile lines 740, which can be joined together to form a loop wire member 742. Specifically, the arched profile lines 740 may be laid spirally along the length of optoelectronic cable 100n. However, in other embodiments, the arched profile lines 740 may extend longitudinally along the length of optoelectronic cable 100n (e.g., substantially parallel to the central axis of optoelectronic cable 100n), or may extend along the length of optoelectronic cable 100n in any other suitable manner. Each of the arched profile lines may be formed of the same material as the first baseline 700 and second baseline 702 of optoelectronic cable 100n discussed above.

[0215] As shown in the illustrated embodiment, in the assembly configuration of the arched profile 740, such as when the arched profile 740 is helically laid together to form a loop member 742, the arched profile 740 defines a tunnel 744 that can extend along the length of the loop member 742. In practice, it should be understood that during the manufacture of the loop member 742, the arched profile 740 can be helically laid around one or more optical fibers 110 (e.g., optical micro-bundles 669) to encapsulate the optical fibers 110 within the tunnel 744. A filler 112 can be inserted (e.g., injected) into the tunnel 744 during or after the helical laying of the arched profile 740. Therefore, the filler 112 can encapsulate the optical fibers 110 within the tunnel 744. Consequently, the filler 112 can provide a protective buffer for the optical fibers 110 and can isolate the optical fibers 110 from direct physical contact with the arched profile 740. In some embodiments, the filler 112 allows the optical fiber 110 to contact the arched profile 740 while occupying a gap space (e.g., a void) that can be formed between the optical fiber 110 and the arched profile 740. In other embodiments, the filler 112 may be omitted from the tunnel 744.

[0216] In some embodiments, suitable adhesives (e.g., bonding agents) and / or metallurgical processes (e.g., welding, brazing) can be used to join the arched profiles 740 together to form a loop wire member 742. In some embodiments, in the assembly configuration of the loop wire member 742, the respective side surfaces 748 of the arched profiles 740 can engage with each other to form a fluid seal between the tunnel 744 and the surrounding environment surrounding the optoelectronic cable 100n. In some embodiments, a layer of filler 112 can be disposed between adjacent sides of the side surfaces 748. Thus, multiple arched profiles 740 can cooperate to seal the optical fiber 110 and / or filler 112 within the tunnel 744 and can mitigate or substantially eliminate fluid flow through the interfaces (e.g., boundaries) between the arched profiles 740.

[0217] Similar to the embodiments of the optoelectronic cables discussed above, the optoelectronic cable 100n may include one or more polymer layers 118 (e.g., polymer tape layers) that may be wound around or extruded over the loop wire member 742. In some embodiments, the polymer layers 118 may facilitate holding the arched profile lines 740 in a configuration where they are engaged with each other (e.g., an assembly configuration). Furthermore, the polymer layers 118 may facilitate the formation of a fluid seal between the tunnel 744 and the surrounding environment surrounding the optoelectronic cable 100n. For this purpose, the polymer layers 118 may facilitate preventing foreign objects from entering the tunnel 744.

[0218] Figures 28A to 28DThe various steps involved in manufacturing the optoelectronic cable 100n according to the techniques discussed herein are described. For example, to assemble the optoelectronic cable 100n, such as... Figure 28A As shown, multiple arched profiles 740 can be extruded or otherwise processed to include generally arched, trapezoidal shapes (e.g., cap shapes). Figure 28B As shown, one or more optical fibers 110 can be placed between each of the arched contour lines 740. That is, as discussed above, as Figure 28C As shown, the arched profile 740 can be helically laid around the optical fiber 110 to form a loop member 742, which encapsulates the optical fiber 110. In some embodiments, during or after the process of helically laying the arched profile 740 around the optical fiber 110, filler 112 can be injected into the tunnel 744 to encapsulate the optical fiber 110 within the tunnel 744. The arched profile 740 can encapsulate the optical fiber 110 and filler 112 within the tunnel 744 to form an optoelectronic cable core 116n. For clarity, it should be understood that the optoelectronic cable core 116n may include the arched profile 740, one or more optical fibers 110, and filler 112. In some embodiments, filler 112 may flow into and occupy gap spaces that may exist between individual arched profiles 740. Thus, filler 112 can seal any gaps between the arched profiles 740. Figure 28D As shown, one or more polymer layers 118 may be wrapped around or extruded over the photoelectric cable core 116n, thereby encapsulating the photoelectric cable core 116n and forming the photoelectric cable 100n.

[0219] As discussed above with respect to optoelectronic cables 100a, 100b, 100c, 100d, and 100e, each of the optoelectronic cables discussed herein may be surrounded by one or more complete layers disposed around the exterior of the optoelectronic cable. For example, each optoelectronic cable may be surrounded by one or more sheathing layers 130 to form a complete optoelectronic cable (e.g., complete optoelectronic cables 500a, 500b, 500c, and 500d). Therefore, it should be understood that one or more sheathing layers 130 may also be disposed longitudinally, circumferentially, and / or helically around the polymer layer 118 of each of optoelectronic cables 100f, 100g, 100h, 100i, 100j, 100k, 100m, and 100n, respectively, as shown below. Figures 29A to 29HThe diagram shows the formation of complete photoelectric cables 800, 802, 804, 806, 808, 810, 812, and 814, respectively. That is, the sheathing layer 130 can be disposed around photoelectric cable 100f to form a complete photoelectric cable 800, around photoelectric cable 100g to form a complete photoelectric cable 802, around photoelectric cable 100h to form a complete photoelectric cable 804, around photoelectric cable 100i to form a complete photoelectric cable 806, around photoelectric cable 100j to form a complete photoelectric cable 808, around photoelectric cable 100k to form a complete photoelectric cable 810, around photoelectric cable 100m to form a complete photoelectric cable 812, and around photoelectric cable 100n to form a complete photoelectric cable 814. As discussed above, the sheathing layer 130 can be made of a metal (such as, for example, zinc, nickel, molybdenum, or iron).

[0220] In some embodiments, such as Figures 30A to 30H As shown, the sheath layer 132 can be provided around each of the optoelectronic cables 100f, 100g, 100h, 100i, 100j, 100k, 100m and 100n respectively to form complete optoelectronic cables 816, 818, 820, 822, 824, 226, 828 and 830 respectively. That is, the sheath layer 132 can be disposed around the optoelectronic cable 100f to form a complete optoelectronic cable 816, around the optoelectronic cable 100g to form a complete optoelectronic cable 818, around the optoelectronic cable 100h to form a complete optoelectronic cable 820, around the optoelectronic cable 100i to form a complete optoelectronic cable 822, around the optoelectronic cable 100j to form a complete optoelectronic cable 824, around the optoelectronic cable 100k to form a complete optoelectronic cable 826, around the optoelectronic cable 100m to form a complete optoelectronic cable 828, and around the optoelectronic cable 100n to form a complete optoelectronic cable 830. As discussed above, the sheath layer 132 may include conductors 134 extending longitudinally, circumferentially, or helically around the polymer layer 118. The conductors 134 may be encapsulated by polymer 136. In some embodiments, the polymer layer 118 and the polymer 136 may include the same polymer material layer.

[0221] In some embodiments, such as Figures 31A to 31HAs shown, the bow-shaped metal wires 138a, 138b and / or the second polymer layer 118a can be arranged around the optoelectronic cables 100f, 100g, 100h, 100i, 100j, 100k, 100m and 100n respectively to form complete optoelectronic cables 832, 834, 836, 838, 840, 842, 844 and 846 respectively. That is, the bow-shaped metal wires 138a, 138b and / or the second polymer layer 118 can be arranged around the photoelectric cable 100f to form a complete photoelectric cable 832, around the photoelectric cable 100g to form a complete photoelectric cable 834, around the photoelectric cable 100h to form a complete photoelectric cable 836, around the photoelectric cable 100i to form a complete photoelectric cable 838, around the photoelectric cable 100j to form a complete photoelectric cable 840, around the photoelectric cable 100k to form a complete photoelectric cable 842, around the photoelectric cable 100m to form a complete photoelectric cable 844, and around the photoelectric cable 100n to form a complete photoelectric cable 846.

[0222] In some embodiments, such as Figures 32A to 32H As shown, the metal strip 142 and / or the second polymer layer 118a can be arranged around the optoelectronic cables 100f, 100g, 100h, 100i, 100j, 100k, 100m and 100n respectively to form complete optoelectronic cables 848, 850, 852, 854, 856, 858, 860 and 862 respectively. That is, the metal strip 142 and / or the second polymer layer 118a can be disposed around the optoelectronic cable 100f to form a complete optoelectronic cable 848, around the optoelectronic cable 100g to form a complete optoelectronic cable 850, around the optoelectronic cable 100h to form a complete optoelectronic cable 852, around the optoelectronic cable 100i to form a complete optoelectronic cable 854, around the optoelectronic cable 100j to form a complete optoelectronic cable 856, around the optoelectronic cable 100k to form a complete optoelectronic cable 858, around the optoelectronic cable 100m to form a complete optoelectronic cable 860, and around the optoelectronic cable 100n to form a complete optoelectronic cable 862. In some embodiments, the metal strip 142 can be spirally wound around any of the optoelectronic cables 100f, 100g, 100h, 100i, 100j, 100k, 100m, and 100n. In some embodiments, the metal strip 142 may include a corrugated metal strip 302.

[0223] It should be understood that, according to the technology discussed above, each of the optoelectronic cable cores 116f, 116g, 116h, 116i, 116j, 116k, 116m, and 116n can be surrounded by a soft polymer layer 200, multiple arched profile lines 210, a stranded layer 220, and / or one or more additional polymer layers 230. For example, respectively as Figures 33A to 33H As shown, the flexible polymer layer 200, multiple arched profile lines 210, stranded layer 220, and one or more additional polymer layers 230 can be arranged around the photoelectric cable core 116f to form a complete photoelectric cable 864, around the photoelectric cable core 116g to form a complete photoelectric cable 866, around the photoelectric cable core 116h to form a complete photoelectric cable 868, around the photoelectric cable core 116i to form a complete photoelectric cable 870, around the photoelectric cable core 116j to form a complete photoelectric cable 872, around the photoelectric cable core 116k to form a complete photoelectric cable 874, around the photoelectric cable core 116m to form a complete photoelectric cable 876, and around the photoelectric cable core 116n to form a complete photoelectric cable 878. It should be understood that in some embodiments, the arched profile lines 210 can be spirally laid over the flexible polymer layer 200 along the length of the photoelectric cable core. Furthermore, it should be understood that, based on the techniques discussed above, any of the embodiments of the completed optoelectronic cables described above can be implemented in the multi-component cable 300.

[0224] Depending on the context, all references to “disclosure” herein may refer only to certain specific embodiments in some cases. In other cases, it may refer to one or more, but not necessarily, the subject matter referenced in all claims. Although the foregoing is directed to embodiments, versions, and examples of this disclosure, which are included to enable a person skilled in the art to make and use this disclosure when combined with the information in this patent and available information and techniques, this disclosure is not limited to these specific embodiments, versions, and examples. Other and additional embodiments, versions, and examples of this disclosure may be contemplated without departing from the basic scope of this disclosure, and the scope of this disclosure is defined by the appended claims.

Claims

1. A cable comprising: A baseline in which channels are formed; One or more optical fibers, wherein the one or more optical fibers are disposed within the channel; as well as A cover wire, configured to encapsulate one or more optical fibers within the channel. The baseline includes a mating channel with a baseline mating surface, and the cover wire includes a mating tab with a mating surface, wherein when the cover wire is coupled to the baseline, the mating surface of the mating tab engages with the baseline mating surface, and wherein one or more optical fibers are in physical contact with the baseline, the cover wire, or both, such that the compressive force applied to the baseline and / or the cover wire is directly transmitted to the one or more optical fibers. The baseline mating surfaces are a first set of baseline mating surfaces, and the mating channel includes a second set of baseline mating surfaces, the second set of baseline mating surfaces being offset from the first set of baseline mating surfaces by a corresponding intermediate distance. The cover line includes a mating protrusion extending from the mating tab and having an additional mating surface, wherein when the cover line is coupled to the baseline, the mating surface of the mating tab engages with the first set of baseline mating surfaces, and the additional mating surface of the mating protrusion engages with the second set of baseline mating surfaces.

2. The cable of claim 1, wherein the baseline includes a mating groove having a baseline mating chamfer extending from a corresponding edge of the channel, wherein the cover wire includes an arched profile geometry having an inclined mating surface, and wherein when the cover wire is coupled to the baseline, the inclined mating surface engages with the baseline mating chamfer and contacts the outer surface of at least one of the one or more optical fibers.

3. The cable of claim 1, wherein the baseline includes a receiving channel having a curved mating surface extending from a respective edge of the channel, wherein the cover wire has a circular cross-sectional geometry, and wherein when the cover wire is coupled to the baseline, the outer contour of the cover wire engages with the curved mating surface.

4. The cable of claim 3, wherein the cover wire engages with the receiving channel via an interference fit.

5. The cable of claim 1, further comprising a filler material within the channel and filling the gap space between the one or more optical fibers.

6. The cable of claim 1, wherein the cover wire forms the cable core of the cable when coupled to the baseline, wherein the cable core is surrounded by one or more polymer sheaths.

7. The cable of claim 6, comprising one or more complete layers disposed around the one or more polymer sheaths, wherein the one or more complete layers comprise a metal cladding layer, a spirally laid wire, a bow-shaped metal wire, a spirally wound metal strip, a spirally wound corrugated metal strip, a spirally laid arched profile, or a combination thereof.

8. The cable of claim 1, wherein the cover wire forms the cable core of the cable when connected to the baseline, wherein a plurality of arched profile lines are spirally laid around the cable core.

9. The cable of claim 1, wherein the cable is configured to be positioned within a multi-component cable having a coaxial, three-core, four-core, or seven-core configuration.

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