Display device

Abstract

A display device is provided, including a thin film transistor layer provided on a substrate and including a thin film transistor, and an emissive material layer provided on the thin film transistor layer. The emissive material layer includes light emitting elements each including a first light emitting electrode, an emissive layer, and a second light emitting electrode, light receiving elements each including a first light receiving electrode, a light receiving semiconductor layer, and a second light receiving electrode, and first banks provided on the first light emitting electrodes and defining an emissive area of each light emitting element. The light receiving elements are provided on the first banks.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2019-0179953, filed on December 31, 2019, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The disclosure relates to a display device. Background Technology

[0003] With the development of an information-driven society, the demand for display devices is constantly increasing. For example, display devices are being used in various electronic devices such as smartphones, digital cameras, laptops, navigation devices, and smart TVs.

[0004] For example, a display device may include a display panel for displaying images, an optical sensor for detecting light, an ultrasonic sensor for detecting ultrasound, and a fingerprint sensor for detecting fingerprints. Because display devices are used in various electronic devices, they may require a variety of designs. For example, a display device is needed that provides a wider display area for displaying images by removing sensor devices such as optical sensors, ultrasonic sensors, and fingerprint sensors.

[0005] It will be understood that this background section is intended to provide, in part, useful background for understanding the technology. However, this background section may also include ideas, concepts, or knowledge that were not part of what was known or understood by a person skilled in the art prior to the corresponding valid date of submission of the subject matter disclosed herein. Summary of the Invention

[0006] The embodiments may provide a display device with a large display area, wherein images can be displayed by incorporating sensor devices (such as optical sensors for detecting light, capacitive fingerprint sensors for recognizing fingerprints, and / or ultrasonic sensors for detecting ultrasound) into the display panel.

[0007] Additional features of the embodiments will be set forth in the following description, and may be apparent in part from the description, or may be learned by practice of the embodiments herein.

[0008] According to an embodiment, the display device may include: a thin-film transistor layer disposed on a substrate and including thin-film transistors; and an emissive material layer disposed on the thin-film transistor layer. The emissive material layer may include: light-emitting elements, each including a first light-emitting electrode, an emissive layer, and a second light-emitting electrode; light-receiving elements, each including a first light-receiving electrode, a light-receiving semiconductor layer, and a second light-receiving electrode; and a first partition disposed on the first light-emitting electrode and defining an emission region for each light-emitting element. The light-receiving elements may be disposed on the first partition.

[0009] The emitting material layer may also include a second barrier disposed on the first barrier and a third barrier disposed on the optical receiving element.

[0010] The first light-receiving electrode can be disposed on the first partition, the light-receiving semiconductor layer can be disposed on the first light-receiving electrode, and the second light-receiving electrode can be disposed on the light-receiving semiconductor layer and the second partition.

[0011] The emitting material layer may also include a light receiving connection electrode, which is disposed on the same layer as the first light emitting electrode and includes the same material. The second light receiving electrode can be electrically connected to the light receiving connection electrode through a contact hole that can penetrate the first and second partitions and expose the light receiving connection electrode.

[0012] The emitting layer can be disposed on the first light-emitting electrode, and the second light-emitting electrode can be disposed on the emitting layer and the third diaphragm.

[0013] The light-receiving semiconductor layer may include: an n-type semiconductor layer electrically connected to a first light-receiving electrode; a p-type semiconductor layer electrically connected to a second light-receiving electrode; and an i-type semiconductor layer disposed between the first light-receiving electrode and the second light-receiving electrode in the thickness direction of the substrate.

[0014] Each of the i-type and n-type semiconductor layers may include amorphous silicon carbide (a-SiC) or amorphous silicon germanide (a-SiGe), and the p-type semiconductor layer may include amorphous silicon (a-Si).

[0015] At least one of the first photoreceiving electrode, the p-type semiconductor layer, the i-type semiconductor layer, the n-type semiconductor layer, and the second photoreceiving electrode may include a non-flat surface.

[0016] The light-receiving semiconductor layer may include: an n-type semiconductor layer electrically connected to a first light-receiving electrode; and a p-type semiconductor layer electrically connected to a second light-receiving electrode.

[0017] The n-type semiconductor layer may include amorphous silicon carbide (a-SiC) or amorphous silicon germanide (a-SiGe), and the p-type semiconductor layer may include amorphous silicon (a-Si).

[0018] The first light-emitting electrode may not be stacked with the first light-receiving electrode, the light-receiving semiconductor layer, and the second light-receiving electrode in the thickness direction of the substrate.

[0019] The second light-emitting electrode can be stacked with the first light-receiving electrode, the light-receiving semiconductor layer, and the second light-receiving electrode in the thickness direction of the substrate.

[0020] The first light-emitting electrode and the first light-receiving electrode may include opaque conductive materials, while the second light-emitting electrode and the second light-receiving electrode may include transparent conductive materials.

[0021] The first light-emitting electrode, the second light-emitting electrode, the first light-receiving electrode, and the second light-receiving electrode may include transparent conductive materials.

[0022] The emitting material layer may also include a reflective electrode disposed on the second emitting electrode and in the emitting region, the reflective electrode may include an opaque material.

[0023] The emitting material layer may include a transmissive region that may not overlap with the emitting region of each light-emitting element in the thickness direction of the substrate.

[0024] The light-receiving area of ​​each light-receiving element can be located in the transmission area.

[0025] The encapsulation layer can be disposed on the emitting material layer; and the reflective layer can be disposed on the encapsulation layer, and can be not superimposed on the emitting region of each light-emitting element and the light-receiving region of each light-receiving element in the thickness direction of the substrate.

[0026] The encapsulation layer can be disposed on the emitting material layer; and the reflective layer can be disposed on the encapsulation layer and can be not superimposed on the emitting region of each light-emitting element in the thickness direction of the substrate, wherein the reflective layer can be superimposed on the light-receiving region of each light-receiving element in the thickness direction of the substrate.

[0027] The reflective layer may include: a first reflective layer that is not superimposed on the light-receiving area of ​​each light-receiving element in the thickness direction of the substrate; and a second reflective layer that is superimposed on the light-receiving area of ​​each light-receiving element in the thickness direction of the substrate.

[0028] The thickness of the first reflective layer can be greater than the thickness of the second reflective layer.

[0029] The display device may further include: an encapsulation layer disposed on the emissive material layer; and a sensor electrode layer disposed on the encapsulation layer and including sensor electrodes.

[0030] The sensor electrode layer may include: a light-blocking electrode disposed on the encapsulation layer; a first sensor insulating layer disposed on the light-blocking electrode; and a second sensor insulating layer disposed on the sensor electrode, wherein the sensor electrode may be disposed on the first sensor insulating layer.

[0031] The display device may further include: a polarizing film disposed on a sensor electrode layer; and a cover window disposed on the polarizing film, wherein the polarizing film may include a light-transmitting region superimposed on a light-receiving element in the thickness direction of the substrate.

[0032] The substrate can be bent at a predetermined curvature.

[0033] The display device may further include: a first roller that can cause the substrate to curl; a housing in which the first roller can be housed; and a transmissive window that is stacked with the first roller in the thickness direction of the substrate.

[0034] The substrate can be rolled up around the first roller, and the light receiving element can be stacked with the transmission window in the thickness direction of the substrate.

[0035] According to an embodiment, the display device may include: a thin-film transistor layer, including thin-film transistors disposed on a substrate; and an emitting material layer disposed on the thin-film transistor layer and including a light-emitting element. The thin-film transistor layer may include: an active layer of the thin-film transistor; a gate insulating layer disposed on the active layer; a gate electrode of the thin-film transistor disposed on the gate insulating layer; a first interlayer dielectric layer disposed on the gate electrode; and a light-receiving element disposed on the first interlayer dielectric layer.

[0036] The thin-film transistor layer may further include: a second interlayer dielectric layer disposed on the first interlayer dielectric layer; and a source electrode and a drain electrode of each thin-film transistor disposed on the second interlayer dielectric layer. Each light-receiving element may include: a first light-receiving electrode disposed on the first interlayer dielectric layer; a light-receiving semiconductor layer disposed on the first light-receiving electrode; and a second light-receiving electrode disposed on the light-receiving semiconductor layer.

[0037] The light-receiving semiconductor layer may include: an n-type semiconductor layer electrically connected to a first light-receiving electrode; a p-type semiconductor layer electrically connected to a second light-receiving electrode; and an i-type semiconductor layer disposed between the first light-receiving electrode and the second light-receiving electrode in the thickness direction of the substrate.

[0038] Each of the active layer and the gate electrode can be stacked with the first photoreceiving electrode, the photoreceiving semiconductor layer, and the second photoreceiving electrode in the thickness direction of the substrate.

[0039] One of the source electrode and the drain electrode can be electrically connected to the second photoreceiving electrode through a contact hole that can penetrate the second interlayer dielectric layer and expose the second photoreceiving electrode.

[0040] The display device may further include a second interlayer dielectric layer disposed on the first interlayer dielectric layer, wherein the light receiving element may be disposed on the second interlayer dielectric layer.

[0041] The thin-film transistor layer may further include: a second interlayer dielectric layer disposed on the first interlayer dielectric layer; and a source electrode and a drain electrode of each thin-film transistor disposed on the second interlayer dielectric layer, wherein each light-receiving element may include: a light-receiving gate electrode disposed on the first interlayer dielectric layer; a light-receiving semiconductor layer disposed on the second interlayer dielectric layer; and a light-receiving source electrode and a light-receiving drain electrode disposed on the light-receiving semiconductor layer.

[0042] The light-receiving semiconductor layer may include an oxide semiconductor material.

[0043] Each of the active layer and the gate electrode can be stacked with the photo-receiving gate electrode and the photo-receiving semiconductor layer in the thickness direction of the substrate.

[0044] According to an embodiment, the display device may include: a display panel, including a substrate and a display layer disposed on one surface of the substrate; and an optical sensor disposed on another surface of the substrate. The display layer may include a first pinhole for transmitting light. The optical sensor may include a light-receiving region superimposed on the first pinhole in the thickness direction of the substrate.

[0045] The display layer may include: a light-blocking layer disposed on a substrate; a buffer layer disposed on the light-blocking layer; an active layer of a thin-film transistor disposed on the buffer layer and stacked with the light-blocking layer in the thickness direction of the substrate; a gate insulating layer disposed on the active layer; a gate electrode of the thin-film transistor disposed on the gate insulating layer; an interlayer dielectric layer disposed on the gate electrode; and a source electrode and a drain electrode of the thin-film transistor disposed on the interlayer dielectric layer, wherein at least one of the light-blocking layer, the gate electrode, the source electrode, and the drain electrode may form a first pin hole.

[0046] The display layer may also include a pressure sensor electrode, which includes a second pin hole that overlaps with the first pin hole in the thickness direction of the substrate.

[0047] The area of ​​the second pin hole can be larger than the area of ​​the first pin hole.

[0048] The pressure sensor electrodes and the light-blocking layer can be disposed on the same layer and can contain the same material.

[0049] The display device may also include a pressure sensing unit that can detect changes in the resistance or capacitance of the pressure sensor electrodes when pressure is applied to them.

[0050] The display layer may also include alignment patterns that do not overlap with the optical sensor in the thickness direction of the substrate.

[0051] The display layer may also include a light-blocking pattern positioned between two adjacent alignment patterns.

[0052] The display layer may also include inspection patterns arranged side by side in one direction.

[0053] Alignment patterns, light-blocking patterns, and inspection patterns can be placed on the same layer as the light-blocking layer and can include the same material.

[0054] One side of the optical sensor can be tilted at an acute angle relative to the side of the substrate along the direction it extends.

[0055] The display device may also include a transparent adhesive layer for attaching an optical sensor to another surface of the substrate.

[0056] The light-blocking layer can form the first pin hole.

[0057] The display device may also include a light-blocking adhesive layer attached to another surface of the substrate, the light-blocking adhesive layer being disposed on the edge of the transparent adhesive layer, wherein the light-blocking adhesive layer may not overlap with the optical sensor in the thickness direction of the substrate.

[0058] The display device may also include a light-blocking resin disposed on the upper surface of the light-blocking adhesive layer.

[0059] The display device may further include: a panel bottom cover disposed on another surface of the substrate and including a cover hole, wherein an optical sensor is disposed in the cover hole; and a sensor circuit board disposed on the lower surface of the optical sensor.

[0060] The sensor circuit board can be stacked with the cover hole.

[0061] The display device may also include a pin hole array disposed between the substrate and the optical sensor and including an opening that overlaps with the first pin hole in the thickness direction of the substrate.

[0062] The display device may also include: a cover window disposed on the display layer; and a light source disposed below the edge of the cover window and illuminating the cover window with light.

[0063] The side surfaces of the window can have a predetermined curvature with rounded edges.

[0064] The lower surface of the cover window may include a light path conversion pattern, which can be superimposed on the light source in the thickness direction of the substrate and can convert the path of light output from the light source.

[0065] The display device may further include a digitizer layer disposed between the substrate and the optical sensor, wherein the digitizer layer may include: a substrate film; a first annular electrode disposed on the surface of the substrate film; and a second annular electrode disposed on the opposite surface of the substrate film, and the first pin hole may not overlap with the first annular electrode and the second annular electrode in the thickness direction of the substrate.

[0066] According to an embodiment, the display device may include: a display panel, including a display area and a sensor area; and a first optical sensor disposed on the surface of the display panel, wherein the first optical sensor may be superimposed on the sensor area in the thickness direction of the display panel. Each of the display area and the sensor area may include an emission area. The number of emission areas per unit area in the display area may be greater than the number of emission areas per unit area in the sensor area.

[0067] The sensor area of ​​the display panel may include the transmissive area within the sensor area that does not have display pixels.

[0068] The sensor region may include transparent emitting regions that can transmit and emit light, and the area of ​​each emitting region in the sensor region may be larger than the area of ​​each transparent emitting region.

[0069] The sensor area of ​​the display panel may include: an optical sensor area superimposed on a first optical sensor in the thickness direction of the display panel; and a light compensation area around the optical sensor area, and the display device may also include a light compensation device superimposed on the light compensation area in the thickness direction of the display panel.

[0070] The light compensation device may include: a light-emitting circuit board; and a light source device disposed on the light-emitting circuit board and surrounding the first optical sensor.

[0071] The light source device may include: a first light source device that emits light of a first color; a second light source device that emits light of a second color; and a third light source device that emits light of a third color.

[0072] The light compensation device may also include a light guide component disposed on the light source device.

[0073] The display device may also include a light-blocking resin disposed on the opposite surface of the light-emitting circuit board.

[0074] The display device may also include a light compensation device disposed on the surface of the display panel and emitting light, wherein the first optical sensor and the light compensation device may be arranged side by side with each other in one direction.

[0075] The display device may further include a movable member that is movable in this direction, wherein the first optical sensor and the light compensation device may be disposed on the movable member, and at least one of the first optical sensor and the light compensation device may be superimposed on the sensor area of ​​the display panel in the thickness direction of the display panel by the movement of the movable member.

[0076] The display device may also include a second optical sensor or light source, which is disposed on the surface of the display panel and superimposed on the sensor area of ​​the display panel in the thickness direction of the display panel.

[0077] The second optical sensor may include a rear electrode, a semiconductor layer, and a front electrode, and the semiconductor layer may include a p-type semiconductor layer, an i-type semiconductor layer, and an n-type semiconductor layer stacked in sequence.

[0078] The second optical sensor may include a light-emitting unit and a light-sensing unit.

[0079] According to an embodiment, the display device may include: a substrate including a top portion and a side portion extending from one side of the top portion; a display layer disposed on a surface of the substrate in the top portion and the side portion of the substrate; a sensor electrode layer including sensor electrodes and disposed on the display layer in the top portion of the substrate; and an optical sensor disposed on an opposing surface of the substrate in the top portion of the substrate.

[0080] The display device may also include a conductive pattern disposed on the display layer in a side portion of the substrate, wherein the conductive pattern may be an antenna.

[0081] The display device may also include a pressure sensor disposed on the opposite surface of the substrate in a side portion of the substrate.

[0082] The pressure sensor may include: a first substrate member and a second substrate member facing each other; a driving electrode and a sensing electrode disposed on the first substrate member; and a ground potential layer disposed on the second substrate member and superimposed on the driving electrode and the sensing electrode in the thickness direction of the substrate.

[0083] The pressure sensor may include: a first substrate member and a second substrate member facing each other; a driving electrode and a sensing electrode disposed on the first substrate member; and a pressure sensing layer disposed on the second substrate member and superimposed on the driving electrode and the sensing electrode in the thickness direction of the substrate, wherein the pressure sensing layer may include a polymer resin having fine metal particles.

[0084] The display device may also include a sound generator disposed on an opposing surface of the substrate in the top portion of the substrate, wherein the sound generator can output sound by causing the substrate to vibrate.

[0085] According to an embodiment, the display device may include: a display panel including a first display area, a second display area, and a folding area disposed between the first display area and the second display area; and an optical sensor disposed on the surface of the display panel. When the display panel is folded at the folding area, the first display area and the second display area can overlap each other. The optical sensor may be disposed in the sensor area of ​​the first display area.

[0086] The optical sensor may include a light-receiving area, which is superimposed on the pinhole or transmission area of ​​the first display area in the thickness direction of the display panel.

[0087] The optical sensor may include a light-receiving area that overlaps with the pin hole or transmission area of ​​the second display area in the thickness direction of the display panel when the display panel is folded at the folding area.

[0088] According to an embodiment, the display device may include: a display layer including a light-emitting element disposed on a substrate; and a sensor electrode layer including a sensor electrode and a fingerprint sensor electrode disposed on the display layer. The sensor electrode may be electrically decoupled from the fingerprint sensor electrode. Each fingerprint sensor electrode may be surrounded by one of the sensor electrodes.

[0089] The fingerprint sensor electrodes can be electrically connected to the fingerprint sensor wire.

[0090] The fingerprint sensor electrode and the sensor electrode can be placed on the same layer and can contain the same material.

[0091] Fingerprint sensor electrodes and sensor electrodes can be placed on different layers.

[0092] The sensor electrodes may include: sensing electrodes electrically connected in a first direction and arranged side by side with each other in a second direction intersecting the first direction; driving electrodes electrically connected in the second direction and arranged side by side with each other in the first direction; and connecting portions that connect the driving electrodes that are adjacent to each other in the second direction.

[0093] The sensor electrode layer may include: a first sensor insulating layer, superimposed on a connection portion disposed on the display layer; and a second sensor insulating layer, superimposed on a driving electrode and a sensing electrode disposed on the first sensor insulating layer, wherein each driving electrode among the driving electrodes adjacent to each other in a second direction can be electrically connected to the connection portion through a touch contact hole penetrating the first sensor insulating layer.

[0094] The fingerprint sensor electrodes can be disposed on the insulating layer of the second sensor.

[0095] The sensor electrode layer may be disposed on the first sensor insulating layer and may include a shielding electrode, and the shielding electrode, driving electrode and sensing electrode may include the same material.

[0096] Each shielding electrode can be stacked with the fingerprint sensor electrode in the thickness direction of the substrate.

[0097] The fingerprint sensor electrodes may include: fingerprint sensing electrodes electrically connected to each other in a first direction; fingerprint driving electrodes electrically connected to each other in a second direction intersecting the first direction; and a fingerprint connection portion located between the fingerprint driving electrodes.

[0098] The fingerprint connector can be disposed on the display layer, and the fingerprint connector and the connector can be made of the same material.

[0099] The fingerprint sensing electrode and the fingerprint driving electrode can be disposed on the first sensor insulating layer, and the driving electrode and the sensing electrode can include the same material.

[0100] The sensor electrode layer may also include a conductive pattern surrounded by another sensor electrode in the sensor electrode.

[0101] The conductive pattern can be disposed on the insulating layer of the first sensor, and the conductive pattern, the driving electrode, and the sensing electrode can be made of the same material.

[0102] The conductive pattern can be set on the insulating layer of the second sensor.

[0103] According to an embodiment, the display device may include: a display layer including a light-emitting element disposed on a substrate; and a sensor electrode layer disposed on the display layer, and including a sensor electrode disposed in a touch sensing region of the sensor electrode layer and a fingerprint sensor electrode disposed in a fingerprint sensing region of the sensor electrode layer. The fingerprint sensor electrode may include a fingerprint driving electrode and a fingerprint sensing electrode. The fingerprint driving electrode and the fingerprint sensing electrode may be disposed on different layers.

[0104] The fingerprint sensing electrode can be stacked with the fingerprint driving electrode in the thickness direction of the substrate.

[0105] The fingerprint driving electrode and the fingerprint sensing electrode can be pre-programmed for a number of times.

[0106] According to an embodiment, the display device may include: a substrate; and an emitting region disposed on the substrate and including light-emitting elements. Each light-emitting element may include an anode electrode, a cathode electrode, and an emitting layer disposed between the anode electrode and the cathode electrode. The cathode electrode may include: a first cathode electrode stacked with a predetermined number of emitting regions; and a second cathode electrode stacked with a predetermined number of other emitting regions.

[0107] During the display period, a first driving voltage can be applied to the first cathode electrode and the second cathode electrode, and during the fingerprint sensing period, a driving pulse can be applied to the first cathode electrode, and then a driving pulse can be applied to the second cathode electrode.

[0108] The display device may further include: a partition defining each emission area; and an auxiliary electrode disposed on a substrate and electrically connected to a first cathode electrode or a second cathode electrode through a connection contact hole penetrating the partition.

[0109] The auxiliary electrode and the anode electrode can be disposed on the same layer and can contain the same material.

[0110] According to an embodiment, the display device may include: a display panel including a substrate and a display layer disposed on one surface of the substrate; and an ultrasonic sensor disposed on an opposite surface of the substrate, wherein the ultrasonic sensor may output sound by vibrating the display panel in a sound output mode, and may output ultrasonic waves or sense ultrasonic waves in an ultrasonic sensing mode.

[0111] An ultrasonic sensor may include a sound transducer that is symmetrically positioned relative to the sensor area where a fingerprint can be placed.

[0112] The sound transducer may include: a first sound transducer disposed on one side of the sensor area; and a second sound transducer disposed on the other side of the sensor area. The first sound transducer can output ultrasonic waves through vibration, and the second sound transducer can sense the ultrasonic waves output from the first sound transducer in an ultrasonic sensing mode.

[0113] The display device may also include a panel bottom cover disposed on an opposing surface of the substrate, and may include a cover hole in which a sound transducer may be disposed.

[0114] According to an embodiment, the display device may include: a display panel including a substrate and a display layer disposed on a surface of the substrate; an ultrasonic sensor disposed on another surface of the substrate, the ultrasonic sensor sensing ultrasonic waves; and a sound generator disposed on another surface of the substrate, the sound generator outputting sound through vibration.

[0115] The display device may also include a panel bottom cover disposed on another surface of the substrate and including a first cover hole and a second cover hole, wherein an ultrasonic sensor may be disposed in the first cover hole and a sound generator may be disposed in the second cover hole.

[0116] The display device may also include a flexible film attached to one side of the display panel, bent and disposed under the display panel, and including a membrane aperture in which an ultrasonic sensor is disposed.

[0117] The display device may further include: a display circuit board attached to one side of the flexible film; and a pressure sensor disposed on the opposite surface of the display circuit board, the opposite surface of the display circuit board being opposite to the surface facing the display panel.

[0118] The pressure sensor may include: a first substrate member and a second substrate member facing each other; a pressure driving electrode disposed on the surface of the first substrate member facing the second substrate member; a sensing driving electrode disposed on the surface of the second substrate member facing the first substrate member; and a buffer layer disposed between the pressure driving electrode and the sensing driving electrode.

[0119] According to an embodiment, the display device may include a display panel comprising: a display layer disposed on one surface of a substrate; a sensor electrode layer including sensor electrodes disposed on the display layer; and an ultrasonic sensor disposed on another surface of the substrate, the ultrasonic sensor being capable of detecting ultrasonic waves, wherein the sensor electrode layer may include a first conductive pattern serving as an antenna.

[0120] The sensor electrodes may include: sensing electrodes electrically connected in a first direction and arranged side by side with each other in a second direction intersecting the first direction; driving electrodes electrically connected in the second direction and arranged side by side with each other in the first direction; and connecting portions that connect the driving electrodes that are adjacent to each other in the second direction.

[0121] The sensor electrode layer may include: a first sensor insulating layer, superimposed on a connection portion disposed on the display layer; and a second sensor insulating layer, superimposed on a driving electrode and a sensing electrode disposed on the first sensor insulating layer, wherein each driving electrode among the driving electrodes adjacent to each other in a second direction can be electrically connected to the connection portion through a touch contact hole penetrating the first sensor insulating layer.

[0122] The first conductive pattern may be disposed on the insulating layer of the first sensor, and the first conductive pattern, the driving electrode, and the sensing electrode may comprise the same material.

[0123] The first conductive pattern can be set on the insulating layer of the second sensor.

[0124] The sensor electrode layer may include: pressure driving electrodes and pressure sensing electrodes, arranged alternately in one direction; a pressure sensing layer, superimposed on the pressure driving electrodes and pressure sensing electrodes disposed on the display layer; and a sensor insulating layer disposed on the pressure sensing layer.

[0125] The first conductive pattern and the sensor electrode can be disposed on the sensor insulating layer and can comprise the same material.

[0126] According to an embodiment, the display device may include: a display panel including a substrate and a display layer disposed on one surface of the substrate; an ultrasonic sensor disposed on another surface of the substrate and sensing ultrasonic waves; and a digitizer layer superimposed on the ultrasonic sensor in the thickness direction of the substrate. The digitizer layer may include: a substrate film; a first annular electrode disposed on one surface of the substrate film; and a second annular electrode disposed on the other surface of the substrate film, wherein the pinhole of the display layer may not be superimposed on the first and second annular electrodes in the thickness direction of the substrate.

[0127] The display panel may include conductive patterns disposed on the display layer, and the conductive patterns may be antennas.

[0128] The display panel may also include a sensor electrode layer, which includes conductive patterns and sensor electrodes disposed on the display layer.

[0129] The conductive pattern and sensor electrodes can be made of the same material.

[0130] According to an embodiment, when a person's finger is placed on the cover window, light emitted from the emitting area can be reflected at the valleys of the fingerprint and absorbed at the ridges of the fingerprint. The light reflected at the fingerprint can be received by a light-receiving element in each light-receiving area. Therefore, a person's fingerprint can be identified by sensor pixels including light-receiving elements disposed in the display panel.

[0131] According to an embodiment, the light-receiving gate electrode and the light-receiving semiconductor layer can be stacked with the gate electrode and active layer of the driving transistor and one of the first to sixth transistors of the display pixel in the thickness direction of the substrate. Therefore, additional space for the light-receiving element, separate from the space for the thin-film transistor, is not required, thus preventing the space where the thin-film transistor can be disposed from being reduced due to the light-receiving element.

[0132] According to an embodiment, the transmissive region or the reflective region may be included in the display panel of the display device, such that the light-receiving region can be disposed in the transmissive region or the reflective region. As a result, additional space for the light-receiving region, separate from the space for the emitting region, may not be required. Therefore, it is possible to prevent the space for the emitting region from being reduced due to the light-receiving region.

[0133] According to an embodiment, the first pin hole of the display pixel, the opening of the pin hole array, and the light-receiving area of ​​the optical sensor are stacked in the thickness direction of the substrate, so that light can pass through the first pin hole of the display pixel and the opening of the pin hole array to reach the light-receiving area of ​​the optical sensor. Therefore, the optical sensor can sense light incident from above the display panel.

[0134] According to an embodiment, the first pin hole of the display pixel, the second pin hole of the pressure sensor electrode, and the light-receiving area of ​​the optical sensor are stacked in the thickness direction of the substrate, so that light can pass through the first pin hole of the display pixel and the second pin hole of the pressure sensor electrode to reach the light-receiving area of ​​the optical sensor. Therefore, the optical sensor can sense light incident from above the display panel.

[0135] According to an embodiment, the short side of the optical sensor is tilted at a first angle relative to one side of the display panel, so that the optical sensor can recognize the fingerprint pattern and the moiré pattern is reduced.

[0136] According to an embodiment, a light compensation device for providing light is included in the sensor region, making it possible to compensate for the reduced brightness of the sensor region due to the transmission region of the sensor region.

[0137] According to an embodiment, one optical sensor of the display device is a solar cell, which enables power to be generated by light incident on the sensor area to drive the display device.

[0138] According to an embodiment, when a pressure sensor is disposed on a side portion extending from the top portion of the display panel, it is possible to sense the pressure applied by the user, and the pressure sensor can also be used to sense the user's touch input. Therefore, the conductive pattern used as an antenna can be formed on the side portion of the display panel, rather than on the sensor electrodes of the sensor electrode layer used for sensing the user's touch input. The conductive pattern can be disposed on the same layer as the sensor electrodes of the sensor electrode layer in the top portion of the display panel and made of the same or similar material as the sensor electrodes of the sensor electrode layer in the top portion of the display panel, allowing the conductive pattern to be formed without any additional processing. Furthermore, even if the wavelength of the electromagnetic waves transmitted or received by the conductive pattern is short, such as the wavelength of 5G mobile communication, it does not need to penetrate the metal layer of the display panel. Therefore, the electromagnetic waves transmitted or received by the conductive pattern can be stably radiated towards the upper side of the display device, or can be stably received by the display device.

[0139] According to an embodiment, the touch sensor area includes fingerprint sensor electrodes, as well as driving electrodes and sensing electrodes. Therefore, it is possible to sense the touch of an object using the mutual capacitance between the driving electrodes and the sensing electrodes, and also to sense a person's fingerprint using the capacitance of the fingerprint sensor electrodes.

[0140] According to an embodiment, a human fingerprint is sensed by applying a driving signal through a fingerprint sensor line to form the self-capacitance of each fingerprint sensor electrode and measuring the change in self-capacitance.

[0141] According to an embodiment, the fingerprint sensor electrode includes a fingerprint driving electrode and a fingerprint sensing electrode. A mutual capacitance is formed between the fingerprint driving electrode and the fingerprint sensing electrode by applying a driving signal, and the change in mutual capacitance is measured to sense a human fingerprint.

[0142] According to an embodiment, q fingerprint sensor lines can be electrically connected to a single main fingerprint sensor line using a multiplexer, thereby reducing the number of fingerprint sensor lines to 1 / q. Therefore, it is possible to avoid increasing the number of sensor pads due to fingerprint sensor electrodes.

[0143] According to an embodiment, the touch sensor area includes a driving electrode, a sensing electrode, a fingerprint sensor electrode, and a pressure sensor electrode. Therefore, it is possible to sense the touch of an object using the mutual capacitance between the driving electrode and the sensing electrode, to sense a person's fingerprint using the capacitance of the fingerprint sensor electrode, and to sense the pressure (force) applied by the user using the resistance of the pressure sensor electrode.

[0144] According to an embodiment, the touch sensor area includes a driving electrode, a sensing electrode, a fingerprint sensor electrode, and a conductive pattern. Therefore, it is possible to use the mutual capacitance between the driving electrode and the sensing electrode to sense the touch of an object, to use the capacitance of the fingerprint sensor electrode to sense a person's fingerprint, and to use the conductive pattern for wireless communication.

[0145] According to an embodiment, fingerprint driving signals are sequentially applied to the second light-emitting electrodes, enabling the self-capacitance of each second light-emitting electrode to be sensed via self-capacitance sensing. By detecting the difference between the self-capacitance value of the second light-emitting electrode at the ridge of a human fingerprint and the self-capacitance value of the second light-emitting electrode at the valley of the fingerprint, a human fingerprint can be identified.

[0146] According to embodiments, fingerprints can be identified by sensing the capacitance of fingerprint sensor electrodes, as well as by using optical or ultrasonic fingerprint sensors. Since fingerprints can be identified through both capacitive and optical or ultrasonic sensing, fingerprint identification can be more accurate.

[0147] According to an embodiment, a first sensor area including fingerprint sensor electrodes is uniformly distributed throughout the entire display area, so that a person's finger can be identified through the first sensor area even if the finger is placed anywhere in the display area. Even if multiple fingers are placed on the display area, fingerprints of the fingers can be identified through the first sensor area. In the case of display devices applied to medium to large-sized display devices such as televisions, laptops, and monitors, in addition to fingerprints, the lines of a person's palm can also be identified through the first sensor area.

[0148] According to an embodiment, the sound transducer of the ultrasonic sensor can output ultrasonic waves to a person's finger placed in the sensor area and sense the ultrasonic waves reflected from the fingerprint of the finger.

[0149] According to embodiments, an ultrasonic sensor can be used to sense a user's fingerprint, and the fingerprint can be determined to be biometric based on blood flow in the finger. In other words, the security level of the display device can be improved by determining blood flow in the finger and fingerprint recognition.

[0150] Other features and embodiments may become clear from the claims, the following detailed description, and the accompanying drawings.

[0151] It will be understood that neither the foregoing description nor the following detailed description should be construed as limiting the embodiments described herein or claimed. Attached Figure Description

[0152] The accompanying drawings illustrate embodiments and are included to provide a further understanding of the disclosure.

[0153] Figure 1 This is a perspective view of a display device according to an embodiment.

[0154] Figure 2 This is an exploded perspective view of a display device according to an embodiment.

[0155] Figure 3 This is a block diagram illustrating a display device according to an embodiment.

[0156] Figure 4 This is a plan view showing the display area, non-display area, and sensor area of ​​the display panel of the display device according to an embodiment.

[0157] Figure 5 This is a plan view showing the display area, non-display area, and sensor area of ​​the display panel of a display device according to another embodiment.

[0158] Figure 6 This is a schematic cross-sectional view showing the cover window and display panel according to an embodiment.

[0159] Figure 7 It is shown Figure 4 An example view of the layout of the emission area of ​​the display pixels in the display area.

[0160] Figure 8 It is shown Figure 4 An example view of the layout of the emitting area of ​​the display pixel and the light receiving area of ​​the sensor pixel in the sensor area.

[0161] Figure 9 It is shown Figure 4An example view of the layout of the emitting area of ​​the display pixel and the light receiving area of ​​the sensor pixel in the sensor area.

[0162] Figure 10 It is shown Figure 4 Another example view of the layout of the emission area of ​​the display pixels in the display area.

[0163] Figure 11 It is shown Figure 4 An example view of the layout of the emitting area of ​​the display pixel and the light receiving area of ​​the sensor pixel in the sensor area.

[0164] Figure 12 It is shown Figure 4 An example view of the layout of the emitting area of ​​the display pixel and the light receiving area of ​​the sensor pixel in the sensor area.

[0165] Figure 13 It is shown Figure 7 An example of an equivalent circuit diagram of the display pixels in the display area.

[0166] Figure 14 It is shown Figure 8 An example equivalent circuit diagram of sensor pixels in the sensor region.

[0167] Figure 15 It is shown Figure 8 A schematic cross-sectional view of an example of the emitting area of ​​a display pixel and the light-receiving area of ​​a sensor pixel in the sensor region.

[0168] Figure 16 It is shown Figure 15 A schematic cross-sectional view of an example of a light-receiving element.

[0169] Figure 17 It is shown Figure 14 A schematic cross-sectional view of another example of a light-receiving element.

[0170] Figure 18 It is shown Figure 14 A schematic cross-sectional view of another example of a light-receiving element.

[0171] Figure 19 It is shown Figure 8 A schematic cross-sectional view of examples of display pixels and sensor pixels in the sensor area.

[0172] Figure 20 It is shown Figure 8 A schematic cross-sectional view of examples of display pixels and sensor pixels in the sensor area.

[0173] Figure 21 It is shown Figure 4An example view of the layout of the transmissive area and the emission area of ​​the display pixels in the display area.

[0174] Figure 22 It is shown Figure 4 An example view of the layout of the transmissive area, the emitting area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0175] Figure 23A It is shown Figure 22 A schematic cross-sectional view of an example of the transmissive area, the emitting area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0176] Figure 23B It is shown Figure 22 A schematic cross-sectional view of another example of the transmissive area of ​​the sensor region, the emitting area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel.

[0177] Figure 23C It is shown Figure 4 An example view of the layout of the emission area of ​​the display pixel, the first light receiving area of ​​the first sensor pixel, and the second light receiving area of ​​the second sensor pixel in the sensor area.

[0178] Figure 24 It is shown Figure 4 An example view showing the layout of the reflective area and the emission area of ​​the display pixels within the display area.

[0179] Figure 25 It is shown Figure 4 An example view of the layout of the reflective area, the emission area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0180] Figure 26 It is shown Figure 25 An example view of the layout of the reflective area, the emission area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0181] Figure 27 It is shown Figure 4 An example view of the layout of the reflective area, the emission area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0182] Figure 28 It is shown Figure 27 A schematic cross-sectional view of an example of the transmissive area, the emitting area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0183] Figure 29 This is a perspective view showing a display device according to another embodiment.

[0184] Figure 30 This is a perspective view showing the display area, non-display area, and sensor area of ​​the display panel of the display device according to an embodiment.

[0185] Figure 31 and Figure 32 This is a perspective view showing a display device according to an embodiment.

[0186] Figure 33 It is shown on the display panel as follows Figure 31 The view shown is an example of the unfolded display panel, panel support cover, first roller, and second roller.

[0187] Figure 34 It is shown on the display panel as follows Figure 32 The view shown is an example of a panel, panel support cover, first roller, and second roller in a curled configuration.

[0188] Figure 35 It is shown Figure 33 and Figure 34 An example view of the layout of display pixels and sensor pixels in the sensor area.

[0189] Figure 36 It is shown Figure 34 A schematic cross-sectional view of examples of display pixels and sensor pixels in the sensor area.

[0190] Figure 37 This is a view showing the layout of display pixels in the display area according to an embodiment.

[0191] Figure 38 This is a view showing the layout of display pixels and sensor pixels in the sensor area according to an embodiment.

[0192] Figure 39 It is shown Figure 37 A magnified view of the layout of the displayed pixels.

[0193] Figure 40 It is shown Figure 38 A magnified view of the sensor pixel layout.

[0194] Figure 41 This is a view showing the layout of display pixels and sensor pixels in a sensor area according to another embodiment.

[0195] Figure 42 This is a view showing the layout of display pixels and sensor pixels in a sensor area according to another embodiment.

[0196] Figure 43 It is shown in detail Figure 39 A perspective view of an example of a light-emitting element.

[0197] Figure 44 It is shown Figure 39 A schematic cross-sectional view showing an example of pixels.

[0198] Figure 45 It is shown Figure 40 A schematic cross-sectional view of an example of sensor pixels.

[0199] Figure 46 and Figure 47 This is a bottom view showing the display panel according to an embodiment.

[0200] Figure 48 This is a schematic cross-sectional view showing the cover window and display panel of the display device according to an embodiment.

[0201] Figure 49 It is shown Figure 46 An enlarged bottom view of an example of the sensor area of ​​the display panel.

[0202] Figure 50 It is shown Figure 46 A magnified bottom view of another example of the sensor area of ​​the display panel.

[0203] Figure 51 It is shown Figure 46 A magnified bottom view of another example of the sensor area of ​​the display panel.

[0204] Figure 52 It is shown Figure 48 A schematic cross-sectional view of an example of a display panel and optical sensor.

[0205] Figure 53 It is shown Figure 52 A schematic cross-sectional view of an example of the substrate, display layer, sensor electrode layer, and light-receiving area of ​​an optical sensor in a display panel.

[0206] Figure 54 It is shown Figure 48 An enlarged schematic cross-sectional view of another example of a display panel and optical sensor.

[0207] Figure 55 It is shown Figure 48 An enlarged schematic cross-sectional view of another example of a display panel and optical sensor.

[0208] Figure 56 It is shown Figure 48 An enlarged schematic cross-sectional view of another example of a display panel and optical sensor.

[0209] Figure 57This is a view showing the display pixels of the sensor area of ​​the display panel according to an embodiment, the opening of the pinhole array, and the light-receiving area of ​​the optical sensor.

[0210] Figure 58 It is shown Figure 57 A schematic cross-sectional view of an example of a display panel's substrate, display layer, sensor electrode layer, pinhole array, and optical sensor.

[0211] Figure 59 This is a bottom view showing a display panel according to another embodiment.

[0212] Figure 60 This is a plan view showing the display area, non-display area, sensor area, and pressure sensing area of ​​the display panel of the display device according to an embodiment.

[0213] Figure 61 It is shown Figure 60 An enlarged schematic cross-sectional view of an example of a display panel and optical sensor.

[0214] Figure 62 This is a view showing the display pixels, pressure sensor electrodes, and light-receiving area of ​​the optical sensor in the sensor area of ​​the display panel.

[0215] Figure 63 It is shown Figure 62 A schematic cross-sectional view of an example of an optical sensor and a display panel, including the substrate, display layer, and sensor electrode layer.

[0216] Figure 64 This is a view showing an example of the layout of the pressure sensor electrodes of the display panel according to an embodiment.

[0217] Figure 65A and Figure 65B This is a layout diagram illustrating other examples of pressure sensor electrodes on a display panel according to an embodiment.

[0218] Figure 65C This is an equivalent circuit diagram showing the pressure sensor electrode and pressure sensing driver according to an embodiment.

[0219] Figure 66 It is shown Figure 62 A schematic cross-sectional view of an example of the substrate, display layer, sensor electrode layer, and light-receiving area of ​​an optical sensor in a display panel.

[0220] Figure 67 This is a view showing the layout of sensor electrodes, emission areas, and pin holes in the sensor area of ​​a display panel according to an embodiment.

[0221] Figure 68 It is shown Figure 67An example view of the light-receiving area, first pin hole, second pin hole, and sensor electrodes of an optical sensor.

[0222] Figure 69 This is a schematic cross-sectional view showing the cover window and display panel according to an embodiment.

[0223] Figure 70 It is shown Figure 69 A schematic cross-sectional view of an example of the edge of a covered window.

[0224] Figure 71 This is a schematic cross-sectional view showing the cover window and display panel according to an embodiment.

[0225] Figure 72 It is shown Figure 71 A schematic cross-sectional view of an example of the edge of a covered window.

[0226] Figure 73 This is a schematic cross-sectional view showing the cover window and display panel according to an embodiment.

[0227] Figure 74 This is a schematic cross-sectional view showing the cover window and display panel according to an embodiment.

[0228] Figure 75 It is shown Figure 74 A perspective view of an example of a digitizer layer.

[0229] Figure 76 It is shown Figure 74 A schematic cross-sectional view of an example of a digitizer layer.

[0230] Figure 77 It is shown Figure 74 A schematic cross-sectional view of an example of a digitizer layer, optical sensor, and display panel substrate, display layer, and sensor electrode layer.

[0231] Figure 78 This is a schematic cross-sectional view showing the cover window and display panel according to an embodiment.

[0232] Figure 79 This is a view showing an example of the layout of the emission areas of the display pixels in the sensor area.

[0233] Figure 80 This is another example view showing the layout of the emission area of ​​the display pixels in the sensor area.

[0234] Figure 81 It is shown Figure 79 A schematic cross-sectional view of the optical sensor and the substrate, display layer and sensor electrode layer of the display panel.

[0235] Figure 82It is shown Figure 79 A schematic cross-sectional view of the optical sensor and the substrate, display layer and sensor electrode layer of the display panel.

[0236] Figure 83 This is another example view showing the layout of the emission area of ​​the display pixels in the sensor area.

[0237] Figure 84 It is shown Figure 83 A schematic cross-sectional view of the optical sensor and the substrate, display layer and sensor electrode layer of the display panel.

[0238] Figure 85A This is another example view showing the layout of the emission areas of the display pixels in the sensor area.

[0239] Figure 85B It is shown Figure 85A An enlarged view of the layout of region AA.

[0240] Figure 86 It is shown Figure 85B A schematic cross-sectional view of the optical sensor and the substrate, display layer and sensor electrode layer of the display panel.

[0241] Figure 87 This is a view showing an example of the layout of the display pixels in the sensor area.

[0242] Figure 88 It is shown Figure 87 A schematic cross-sectional view of the optical sensor and the substrate, display layer and sensor electrode layer of the display panel.

[0243] Figure 89 This is a schematic cross-sectional view showing the cover window and display panel of the display device according to an embodiment.

[0244] Figure 90 It is shown Figure 89 An enlarged schematic cross-sectional view of an example of a display panel, optical sensor, and light compensation device.

[0245] Figure 91 It is shown Figure 90 An example view of the layout of optical sensors and light compensation devices.

[0246] Figure 92 It is shown Figure 90 Another example view of the layout of the optical sensor and light compensation device.

[0247] Figure 93 and Figure 94 This is a schematic cross-sectional view showing the cover window and display panel of the display device according to an embodiment.

[0248] Figure 95 and Figure 96 It is shown Figure 93 and Figure 94 An enlarged schematic cross-sectional view of the display panel and examples of the first and second optical sensors.

[0249] Figure 97 It is shown Figure 95 and Figure 96 An example view of the layout of optical sensors and light compensation devices.

[0250] Figure 98 This is a schematic cross-sectional view showing the cover window and display panel of the display device according to an embodiment.

[0251] Figure 99 It is shown Figure 98 An enlarged schematic cross-sectional view of an example of a display panel, a first optical sensor, and a second optical sensor.

[0252] Figure 100 It is shown Figure 99 One of the first and second optical sensors is a perspective view of an example of a solar cell.

[0253] Figure 101 It is shown in Figure 99 A view showing an example layout of one of the first and second optical sensors in the case of an optical proximity sensor.

[0254] Figure 102 It is shown in Figure 99 The first and second optical sensors are one of the following: an example view of the layout in the case of a flash.

[0255] Figure 103 This is a perspective view of a display device according to an embodiment.

[0256] Figure 104 This is an unfolded view showing the display panel according to an embodiment.

[0257] Figure 105 This is a schematic cross-sectional view showing the cover window and display panel according to an embodiment.

[0258] Figure 106 It is shown Figure 105 A schematic cross-sectional view of the top portion and the fourth side portion of the display panel.

[0259] Figure 107 It is shown Figure 105 A schematic cross-sectional view of an example of a first pressure sensor.

[0260] Figure 108It is shown Figure 105 A schematic cross-sectional view of another example of a first pressure sensor.

[0261] Figure 109 and Figure 110 This is a perspective view showing a display device according to an embodiment.

[0262] Figure 111 This is a schematic cross-sectional view showing an example of the display panel and optical sensor of the display device when the display device according to the embodiment is unfolded.

[0263] Figure 112 This is a side view showing an example of the display panel and optical sensor of the display device when it is folded.

[0264] Figure 113 and Figure 114 This is a perspective view showing a display device according to an embodiment.

[0265] Figure 115 This is a schematic cross-sectional view showing an example of a first display panel, a second display panel, and an optical sensor of a display device when the display device according to an embodiment is unfolded.

[0266] Figure 116 This is a side view showing an example of a first display panel, a second display panel, and an optical sensor of a display device when the display device according to an embodiment is folded.

[0267] Figure 117 This is a view showing the layout of the sensor electrode layer of the display panel according to an embodiment.

[0268] Figure 118 It is shown Figure 117 A view of the layout of the first sensor region of the sensor electrode layer.

[0269] Figure 119 It is shown Figure 118 A view showing an example layout of the driving electrodes, sensing electrodes, and connectors.

[0270] Figure 120 It is shown Figure 118 An example view of the layout of fingerprint sensor electrodes.

[0271] Figure 121 It is shown Figure 119 A schematic cross-sectional view of an example of a driving electrode, a sensing electrode, and a connecting part.

[0272] Figure 122 It is shown Figure 120 A schematic cross-sectional view of an example of a fingerprint sensor electrode.

[0273] Figure 123 It is shown Figure 120 A schematic cross-sectional view of another example of a fingerprint sensor electrode.

[0274] Figure 124 This is a view illustrating a method for identifying fingerprints using fingerprint sensor electrodes driven by self-capacitance sensing.

[0275] Figure 125 It is shown Figure 120 A schematic cross-sectional view of another example of a fingerprint sensor electrode.

[0276] Figure 126 It is shown Figure 117 A view of the layout of the first sensor region of the sensor electrode layer.

[0277] Figure 127 It is shown Figure 126 A view showing an example layout of the driving electrodes, sensing electrodes, and connectors.

[0278] Figure 128 It is shown Figure 126 A view showing an example layout of the fingerprint driving electrode and the fingerprint sensing electrode.

[0279] Figure 129 It is shown Figure 128 A schematic cross-sectional view of an example of a fingerprint driving electrode, a fingerprint sensing electrode, and a fingerprint connector.

[0280] Figure 130 This is a view illustrating an example of a method for identifying fingerprints using fingerprint sensor electrodes driven by mutual capacitance sensing.

[0281] Figure 131 This is a view showing the layout of the sensor electrode layer of the display panel according to an embodiment.

[0282] Figure 132 It is shown Figure 131 A view showing an example of the layout of the fingerprint sensor electrodes in the first sensor area.

[0283] Figure 133 It is shown Figure 131 Another example view of the layout of the fingerprint sensor electrodes in the first sensor area.

[0284] Figure 134A and Figure 134B It is shown Figure 131 A view of another example of the layout of the fingerprint sensor electrodes in the first sensor area.

[0285] Figure 135A and Figure 135B It is shown Figure 134A and Figure 134BA view showing an example layout of the fingerprint driving electrode and the fingerprint sensing electrode.

[0286] Figure 136 It is shown Figure 135A and Figure 135B A schematic cross-sectional view of an example of a fingerprint driving electrode and a fingerprint sensing electrode.

[0287] Figure 137 It is shown Figure 131 Another example view of the layout of the fingerprint sensor electrodes in the first sensor area.

[0288] Figure 138 It is shown Figure 137 A view showing an example layout of the fingerprint driving electrode and the fingerprint sensing electrode.

[0289] Figure 139 It is shown Figure 137 A schematic cross-sectional view of an example of a fingerprint driving electrode and a fingerprint sensing electrode.

[0290] Figure 140 This is a view illustrating an example layout of the fingerprint sensor lines electrically connected to the fingerprint sensor electrodes and the multiplexer according to an embodiment.

[0291] Figure 141 This is a view illustrating an example layout of fingerprint sensor lines electrically connected to the fingerprint sensor electrodes and the multiplexer according to another embodiment.

[0292] Figure 142 This is a plan view showing the display area, non-display area, and sensor area of ​​the display panel of the display device according to an embodiment.

[0293] Figure 143 It is shown Figure 142 The first sensor area and the view of a person's fingerprint.

[0294] Figure 144 It is shown Figure 142 The first sensor area and the view of a person's fingerprint.

[0295] Figure 145 This is a view showing the layout of the sensor electrode layer of the display panel according to an embodiment.

[0296] Figure 146 It is shown Figure 145 A view showing the layout of the sensor electrodes in the sensor electrode layer.

[0297] Figure 147 This is a view showing the layout of the sensor electrode layer of the display panel according to an embodiment.

[0298] Figure 148 It is shown Figure 147 A view showing the layout of the sensor electrodes in the sensor electrode layer.

[0299] Figure 149 This is a view showing the layout of the sensor electrode layer of the display panel according to an embodiment.

[0300] Figure 150 It is shown Figure 149 A schematic cross-sectional view of an example of a fingerprint driving electrode and a fingerprint sensing electrode.

[0301] Figure 151 This is a view showing the layout of the sensor electrode layer of the display panel according to an embodiment.

[0302] Figure 152 This is a schematic cross-sectional view showing the display panel and cover window according to an embodiment.

[0303] Figure 153 This is a schematic cross-sectional view showing the display panel and cover window according to an embodiment.

[0304] Figure 154 It is shown Figure 152 An example view of the layout of the fingerprint sensor layer.

[0305] Figure 155 It is shown Figure 154 An example equivalent circuit diagram of the sensor pixels of the fingerprint sensor layer.

[0306] Figure 156 It is shown Figure 155 An example view of the layout of the sensor pixels in the fingerprint sensor layer.

[0307] Figure 157 It is shown Figure 154 An equivalent circuit diagram of another example of the sensor pixels in the fingerprint sensor layer.

[0308] Figure 158 It is shown Figure 154 An equivalent circuit diagram of another example of the sensor pixels in the fingerprint sensor layer.

[0309] Figure 159 This is a view showing the layout of the emitting area and the second light-emitting electrode of the display panel according to an embodiment.

[0310] Figure 160 and Figure 161 It is shown Figure 159 A schematic cross-sectional view of an example of the emitting area and the second light-emitting electrode of a display panel.

[0311] Figure 162It is a waveform diagram showing the cathode voltage applied to the second light-emitting electrode during the active and passive periods of a single frame.

[0312] Figure 163 This is a view showing the layout of the emitting area and the second light-emitting electrode of a display panel according to another embodiment.

[0313] Figure 164 It is shown Figure 163 A schematic cross-sectional view of an example of the emitting area and the second light-emitting electrode of a display panel.

[0314] Figure 165 This is a view showing the display area and non-display area of ​​the display panel according to an embodiment, as well as the layout of the ultrasonic sensor.

[0315] Figure 166 It shows the use Figure 165 A view of an example of a method for sensing ultrasound using an ultrasonic transducer.

[0316] Figure 167 It is shown Figure 165 A schematic cross-sectional view of the display panel and sound converter.

[0317] Figure 168 It is shown Figure 165 A schematic cross-sectional view of an example of a voice converter.

[0318] Figure 169 It shows how to set Figure 168 A view of an example of a method for vibrating a vibrating layer between the first and second branch electrodes of a sound transducer.

[0319] Figure 170 and Figure 171 This is a bottom view showing the display panel according to an embodiment.

[0320] Figure 172 It is shown Figure 170 and Figure 171 A perspective view of an example sound generator.

[0321] Figure 173 It is shown Figure 170 and Figure 171 A schematic cross-sectional view of an example pressure sensor.

[0322] Figure 174 It is shown Figure 170 and Figure 171 A schematic cross-sectional view of an example display panel.

[0323] Figure 175 It is shown Figure 170 and Figure 171A schematic cross-sectional view of another example of a display panel.

[0324] Figure 176 It is shown Figure 170 and Figure 171 A schematic cross-sectional view of another example of a display panel.

[0325] Figure 177 It is shown Figure 170 and Figure 171 A perspective view of an example ultrasonic sensor.

[0326] Figure 178 It is shown Figure 177 A view showing the arrangement of the vibrating elements of an ultrasonic sensor.

[0327] Figure 179 It shows that Figure 177 A view illustrating an example of a method for vibrating the vibrating element of an ultrasonic sensor.

[0328] Figure 180 It is shown Figure 177 A view of the first ultrasonic electrode, the second ultrasonic electrode, and the vibrating element of an ultrasonic sensor.

[0329] Figure 181 This is a view showing an example of a finger positioned to overlap with an ultrasonic sensor for fingerprint identification.

[0330] Figure 182 and Figure 183 It is a graph showing the impedance of a vibrating element based on the frequencies obtained from the ridges and valleys of a human fingerprint.

[0331] Figure 184 This is a waveform diagram showing the ultrasonic sensing signal sensed by the vibrating element in attenuated voltage mode.

[0332] Figure 185 This is a view showing an example of an ultrasonic sensor in pressure sensing mode.

[0333] Figure 186 This is a waveform diagram showing the ultrasonic sensing signal sensed by the vibrating element in echo mode and Doppler shift mode.

[0334] Figure 187 This is a view showing an example of an ultrasonic sensor in echo mode and the bones of a human finger.

[0335] Figure 188 This is a view showing an example of an ultrasound sensor in Doppler shift mode and a small artery in a human finger.

[0336] Figure 189 It shows including Figure 177A view of an example of a wireless biometric device using an ultrasonic sensor.

[0337] Figure 190 It shows including Figure 177 A view of the application of ultrasonic sensors in wireless biometric devices.

[0338] Figure 191 It is shown Figure 170 and Figure 171 A side view of another example of an ultrasonic sensor.

[0339] Figure 192 It is shown Figure 191 A schematic cross-sectional view of an example of an ultrasonic sensor.

[0340] Figure 193 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0341] Figure 194 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0342] Figure 195 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0343] Figure 196 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0344] Figure 197 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0345] Figure 198 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0346] Figure 199 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0347] Figure 200 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0348] Figure 201 It is shown Figure 191 A schematic cross-sectional view of another example of an ultrasonic sensor.

[0349] Figure 202 It is shown Figure 191A schematic cross-sectional view of another example of an ultrasonic sensor.

[0350] Figure 203 It is shown Figure 170 and Figure 171 A perspective view of another example of an ultrasonic sensor.

[0351] Figure 204 This is a flowchart illustrating a method for identifying fingerprints and sensing blood flow using an ultrasonic sensor according to an embodiment. Detailed Implementation

[0352] The advantages and features disclosed, as well as methods of implementing them, will become clear from the following description of embodiments with reference to the accompanying drawings. However, the disclosure is not limited to the embodiments disclosed herein, but can be implemented in a variety of different ways. Embodiments are provided to make the disclosure thorough and to fully convey the scope of the disclosure to those skilled in the art. It will be noted that the scope of the disclosure is defined by the claims.

[0353] In order to describe the disclosed embodiments, some parts that are not related to the description may be omitted, and the same reference numerals denote the same elements throughout the specification.

[0354] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout the disclosure, the expression “at least one of a, b and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c, or variations thereof.

[0355] The terms “and” and “or” can be used in the sense of combination or separation and can be understood as equivalent to “and / or”. In the specification and claims, for the purposes of their meaning and interpretation, the phrase “at least one of…” is intended to include the meaning of “at least one selected from the group of…”. For example, “at least one of A and B” can be understood to mean “A, B, or A and B”.

[0356] As used herein, the phrase "element A on element B" means that element A can be directly disposed on element B and / or element A can be indirectly disposed on element B via another element C. Throughout this specification, the same reference numerals denote the same elements. The figures, dimensions, ratios, angles, and numbers of elements given in the drawings are illustrative only and not limiting.

[0357] Additionally, in the instruction manual, the phrase "in a plan view" refers to the view of the object from above, while the phrase "in a schematic sectional view" refers to the view of the object from the side as a schematic section obtained by vertically cutting the object.

[0358] Terms such as first, second, etc., are used to arbitrarily distinguish the elements described by these terms, and therefore these terms are not necessarily intended to indicate the time or other priority of these elements. These terms are only used to distinguish one element from another. Therefore, as used herein, within the scope of the disclosed art, a first element may be a second element.

[0359] Additionally, the term "overlay" or "overlay with" indicates that the first object may be above or below the second object, or to the side of the second object, or vice versa. Furthermore, the term "overlay" may include stacking, overlapping, facing, or variations thereof, extending over, covering, or partially covering, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art. The term "facing," or variations thereof, indicates that the first element may be directly or indirectly opposite the second element. In the case where a third element is located between the first and second elements, the first and second elements may be understood as indirectly opposite each other, although still facing each other. When an element is described as "not overlaying" or "not overlapping" with another element, this may include elements spaced apart from each other, offset from each other, or arranged separately from each other, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art.

[0360] For ease of description, the spatial relative terms “below,” “under,” “down,” “above,” “above,” etc., as shown in the accompanying drawings, are used to describe the relationship between one element or component and another element or component. It will be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are intended to include different orientations of the device in use or operation. For example, in the case where the device shown in the drawings is flipped, the device located “below” or “under” another device may be placed “above” the other device. Thus, the exemplary term “below” can include both a lower position and an upper position. The device may also be positioned in other directions, and therefore the spatial relative terms can be interpreted differently depending on the orientation.

[0361] Throughout this specification, when an element is referred to as "connected" or "joined" to another element, the element may be "directly connected" or "directly joined" to the other element, or "electrically connected" or "electrically joined" to the other element with one or more intermediate elements disposed between them. It will also be understood that when the terms "comprising" and / or "including" and variations thereof are used in this specification, they may indicate the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of other features, integers, steps, operations, elements, components, and / or any combinations thereof.

[0362] Furthermore, when a component is referred to as being "in contact" with another component, the component may be in "electrical contact" or "physical contact" with the other component; or it may be in "indirect contact" or "direct contact" with the other component.

[0363] As used herein, unless the context clearly indicates otherwise, the singular forms “a (kind)” and “the” are also intended to include the plural forms.

[0364] Taking into account the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), the terms “approximately” or “roughly” as used herein include the stated values ​​and indicate that the values ​​are within an acceptable range of deviation as determined by one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0365] As used herein, the terms "unit" or "module" refer to structures or elements as shown in the accompanying drawings and described in the specification. However, the disclosure is not limited thereto. The terms "unit" or "module" are not limited to the units or modules shown in the accompanying drawings.

[0366] In the following examples, the X, Y, and Z axes are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X, Y, and Z axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0367] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an ideal or overly formal sense unless expressly defined in the specification.

[0368] The features of the embodiments can be combined in part or in whole. As will be clearly understood by those skilled in the art, various technical interactions and operations are possible. Various embodiments can be practiced individually or in combination.

[0369] In the following description, embodiments will be illustrated with reference to the accompanying drawings.

[0370] Figure 1 This is a perspective view of a display device according to an embodiment. Figure 2 This is an exploded perspective view of a display device according to an embodiment. Figure 3 This is a block diagram illustrating a display device according to an embodiment.

[0371] Reference Figure 1 and Figure 2 The display device 10 according to an embodiment is used to display moving or still images. The display device 10 can be used as a display screen for portable electronic devices (such as mobile phones, smartphones, tablet PCs, mobile communication terminals, e-notebooks, e-readers, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs)) and for various products (such as televisions, laptops, monitors, billboards, and the Internet of Things). The display device 10 according to an embodiment can be applied to wearable devices such as smartwatches, watch phones, glasses-type displays, and head-mounted displays (HMDs). The display device 10 according to an embodiment can be used as a central information display (CID) located in the instrument cluster and central dashboard (or instrument panel) of a vehicle, as an interior mirror display representing the rearview mirror of the vehicle, as a display located on the back of each of the front seats, which can be an entertainment system for passengers in the rear seats of the vehicle.

[0372] exist Figure 1 and Figure 2 In the example shown, for ease of illustration, the display device 10 according to the embodiment is applied to a smartphone. The display device 10 according to the embodiment includes a cover window 100, a display panel 300, a display circuit board 310, a display driver 320, a touch driver 330, a sensor driver 340, a bracket 600, a main circuit board 700, a battery 790, and a bottom cover 900.

[0373] As used herein, the first direction (X-axis direction) may be parallel to the short side of the display device 10, for example, the horizontal direction of the display device 10. The second direction (Y-axis direction) may be parallel to the long side of the display device 10, for example, the vertical direction of the display device 10. The third direction (Z-axis direction) may refer to the thickness direction of the display device 10.

[0374] When viewed from above, the display device 10 can have a generally rectangular shape. For example, in the case of... Figure 1 As shown when the display device 10 is viewed from above, it can have a generally rectangular shape, having a short side in a first direction (X-axis direction) and a long side in a second direction (Y-axis direction). Each corner where the short side in the first direction (X-axis direction) and the long side in the second direction (Y-axis direction) intersect can be rounded with a predetermined curvature or can be a right angle. The shape of the display device 10 when viewed from above is not limited to a generally rectangular shape, but can be formed into other polygonal shapes, circular shapes, or elliptical shapes.

[0375] The display device 10 may include a first region DRA1 and a second region DRA2 extending from the right and left sides of the first region DRA1, respectively. The first region DRA1 may be flat or curved. The second region DRA2 may be flat or curved. When both the first region DRA1 and the second region DRA2 are formed as curved surfaces, the curvature of the first region DRA1 may differ from the curvature of the second region DRA2. When the first region DRA1 is formed as a curved surface, it may have a constant curvature or a variable curvature. When the second region DRA2 is formed as a curved surface, it may have a constant curvature or a variable curvature. When both the first region DRA1 and the second region DRA2 are formed as flat surfaces, the angle between the first region DRA1 and the second region DRA2 may be an obtuse angle.

[0376] Despite Figure 1 The second region DRA2 may extend from both the left and right sides of the first region DRA1, but this is merely illustrative. For example, the second region DRA2 may extend only from one of the right and left sides of the first region DRA1. Alternatively, in addition to the left and right sides, the second region DRA2 may extend from at least one of the upper and lower sides of the first region DRA1. Alternatively, the second region DRA2 may be omitted, and the display device 10 may include only the first region DRA1.

[0377] The cover window 100 can be disposed on the display panel 300 to cover the upper surface of the display panel 300 or to overlap with the upper surface of the display panel 300. The cover window 100 can protect the upper surface of the display panel 300.

[0378] The cover window 100 may be made of a transparent material and may include glass or plastic. For example, the cover window 100 may include ultra-thin glass (UTG) having a thickness of about 0.1 mm or less. The cover window 100 may include a transparent polyimide film.

[0379] The cover window 100 may include a light-transmitting region DA100 and a light-blocking non-transmitting region NDA100. The non-transmitting region NDA100 may include a pattern layer in which a predetermined pattern is formed.

[0380] The display panel 300 can be positioned below or beneath the cover window 100. The display panel 300 can be located within a first area DRA1 and a second area DRA2. Users can view the image displayed on the display panel 300 within both the first area DRA1 and the second area DRA2.

[0381] Display panel 300 may be a light-emitting display panel that includes light-emitting elements. For example, display panel 300 may be an organic light-emitting display panel that uses organic light-emitting diodes that include organic emission layers, a micro light-emitting diode display panel that uses micro LEDs, a quantum dot light-emitting display panel that includes quantum dot light-emitting diodes that include quantum dot emission layers, or an inorganic light-emitting display panel that uses inorganic light-emitting elements that include inorganic semiconductors.

[0382] The display panel 300 can be a rigid display panel or a flexible display panel. A rigid display panel can be rigid so that it is not easily bent, while a flexible display panel can be flexible so that it can be easily bent, folded, or rolled up. For example, the display panel 300 can be a foldable display panel that can be folded and unfolded, a curved display panel with a curved display surface, a curved display panel with a curved area other than the display surface, a rollable display panel that can be rolled up and unfolded, and a stretchable display panel that can be stretched.

[0383] The display panel 300 may be implemented as a transparent display panel, allowing a user to see objects or backgrounds below or beneath the display panel 300 from above. Alternatively, the display panel 300 may be implemented as a reflective display panel capable of reflecting objects or backgrounds onto the upper surface of the display panel 300.

[0384] like Figure 2 As shown, the display panel 300 may include a main area MA and an auxiliary area SBA protruding from one side of the main area MA.

[0385] The main area MA may include a display area DA for displaying the image and a non-display area NDA surrounding the display area DA. The display area DA may occupy most of the main area MA. The display area DA may be located at the center of the main area MA. The non-display area NDA may be located on the outer edge of the display area DA. The non-display area NDA may be defined as the edge of the display panel 300.

[0386] The auxiliary region SBA can protrude from one side of the main region MA in the second direction (Y-axis direction). For example... Figure 2 As shown, the length of the auxiliary region SBA in the first direction (X-axis direction) can be less than the length of the main region MA in the first direction (X-axis direction). The length of the auxiliary region SBA in the second direction (Y-axis direction) can be less than the length of the main region MA in the second direction (Y-axis direction). However, it will be understood that the disclosure is not limited thereto. Figure 6 As shown, the auxiliary region SBA can be bent and disposed on the lower surface of the display panel 300. The auxiliary region SBA can be superimposed on the main region MA in the thickness direction (Z-axis direction).

[0387] The display circuit board 310 can be attached to the auxiliary area SBA of the display panel 300. An anisotropic conductive film can be used to attach the display circuit board 310 to the display pad (or solder pad) in the auxiliary area SBA of the display panel 300. The display circuit board 310 can be a flexible printed circuit board (FPCB), a rigid and inflexible rigid printed circuit board (PCB), or a hybrid printed circuit board comprising both rigid and flexible printed circuit boards.

[0388] The display driver 320 can be disposed on the auxiliary area SBA of the display panel 300. The display driver 320 can receive control signals and supply voltage, and can generate and output signals and voltages for driving the display panel 300. The display driver 320 can be implemented as an integrated circuit (IC).

[0389] Touch driver 330 and sensor driver 340 may be disposed on display circuit board 310. Each of touch driver 330 and sensor driver 340 may be implemented as an integrated circuit. Alternatively, touch driver 330 and sensor driver 340 may be implemented as a single integrated circuit. Touch driver 330 and sensor driver 340 may be attached to display circuit board 310.

[0390] The touch driver 330 can be electrically connected to the sensor electrode of the sensor electrode layer of the display panel 300 through the display circuit board 310. Therefore, the touch driver 330 can output touch driving signals to the sensor electrode and can sense the voltage charged in the mutual capacitance.

[0391] The sensor electrode layer of the display panel 300 can sense the touch of an object using at least one of various touch sensing schemes, such as resistive sensing and capacitive sensing. For example, in the case of sensing the touch of an object by capacitive sensing using the sensor electrode layer of the display panel 300, the touch driver 330 applies a drive signal to the drive electrode in the sensor electrode layer and senses the voltage charged in the mutual capacitance between the drive electrode and the sensing electrode by the sensing electrode in the sensor electrode layer, thereby determining whether the touch of an object exists. Touch input can include physical contact and proximity. Physical contact refers to an object such as a user's finger or pen contacting the cover window 100 disposed on the sensor electrode layer. Proximity refers to an object such as a human finger or pen approaching the cover window 100 but spaced apart from the cover window 100, such as hovering over the cover window 100. The touch driver 330 can send touch data to the main processor 710 based on the sensed voltage, and the main processor 710 can analyze the touch data to calculate the coordinates of the location where the touch input occurs.

[0392] The sensor driver 340 can be electrically connected via the display circuit board 310 to a sensor disposed in the display panel 300 or to a separate sensor attached to the display panel 300. The sensor driver 340 can convert the voltage detected by the light receiving element of the display panel 300 or the sensor attached to the display panel 300 into sensing data as digital data, and can send the sensing data to the main processor 710.

[0393] On the display circuit board 310, a power supply for supplying driving voltages to the display pixels of the display panel 300 and the display driver 320 can be provided. Optionally, the power supply can be integrated with the display driver 320, in which case the display driver 320 and the power supply can be implemented as a single integrated circuit.

[0394] A bracket 600 for supporting the display panel 300 may be disposed below or beneath the display panel 300. The bracket 600 may comprise plastic, metal, or both plastic and metal. For example, the bracket 600 may include a first camera hole CMH1 through which a camera device 731 can be inserted, a battery hole BH through which a battery 790 can be disposed, and a cable hole CAH through which a cable 314 connected to the display circuit board 310 can pass.

[0395] The main circuit board 700 and the battery 790 can be located below or beneath the bracket 600. The main circuit board 700 can be a printed circuit board or a flexible printed circuit board.

[0396] The main circuit board 700 may include a main processor 710, a camera device 731, and a main connector 711. The main processor 710 may be an integrated circuit. The camera device 731 may be disposed on both the upper and lower surfaces of the main circuit board 700, and the main processor 710 and the main connector 711 may be disposed on one of the upper and lower surfaces of the main circuit board 700.

[0397] The main processor 710 can control all functions of the display device 10. For example, the main processor 710 can output digital video data to the display driver 320 via the display circuit board 310, causing the display panel 300 to display an image. The main processor 710 can receive detection data from the sensor driver 340. The main processor 710 can determine whether a user touch is present based on the detection data, and if so, can perform an operation associated with the user's physical contact or proximity. For example, the main processor 710 can calculate the coordinates of the user's touch by analyzing the detection data, and then can run the application indicated by the icon touched by the user or perform that operation. The main processor 710 can be an application processor, a central processing unit, or a system-on-a-chip (SoC) as an integrated circuit.

[0398] Camera device 731 processes image frames, such as still images and videos, acquired by an image sensor in camera mode and outputs them to main processor 710. Camera device 731 may include at least one of a camera sensor (e.g., CCD, CMOS, within the spirit and scope of the disclosure), an optical sensor (or image sensor), and a laser sensor.

[0399] The cable 314, passing through the cable hole CAH of the bracket 600, can be connected to the main connector 711, so that the main circuit board 700 can be electrically connected to the display circuit board 310.

[0400] In addition to the main processor 710, camera device 731, and main connector 711, the main circuit board 700 may include Figure 3 The wireless communication unit 720, at least one input unit 730, at least one sensor unit 740, at least one output unit 750, at least one interface 760, memory 770 and power supply unit 780 are shown.

[0401] For example, the wireless communication unit 720 may include at least one of a broadcast receiving module 721, a mobile communication module 722, a wireless internet module 723, a near-field communication module 724, and a location information module 725.

[0402] The broadcast receiving module 721 receives broadcast signals and / or broadcast-related information from an external broadcast management server via a broadcast channel. The broadcast channel may include satellite channels and terrestrial channels.

[0403] Mobile communication module 722 transmits / receives radio signals to / from at least one of a base station, external terminal, and server in a mobile communication network established according to mobile communication technical standards or communication schemes (e.g., within the spirit and scope of disclosure, Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), Code Division Multiple Access 2000 (CDMA2000), Enhanced Voice Data Optimized or Enhanced Voice Data Only (EV-DO), Wideband CDMA (WCDMA), High-Speed ​​Downlink Packet Access (HSDPA), High-Speed ​​Uplink Packet Access (HSUPA), Long Term Evolution (LTE), Long Term Evolution Upgrade (LTE-A)). Depending on the transmission and reception of text / multimedia messages, the radio signals may include voice call signals, video call signals, or various types of data.

[0404] Wireless Internet module 723 refers to a module used for wireless Internet connectivity. Wireless Internet module 723 can transmit and receive wireless signals in a communication network according to wireless Internet technologies. Examples of wireless Internet technologies, within the spirit and scope of the disclosure, include Wireless LAN (WLAN), Wi-Fi, Wi-Fi Direct, and Digital Living Network Alliance (DLNA).

[0405] Near Field Communication Module 724 is used for near field communication and can support near field communication by using at least one of the following: Bluetooth TM Bluetooth TM The display device 10 can support wireless communication with a wireless communication system, another electronic device, or a network where the display device 10 is located, or where the display device 10 is located, or where another electronic device (or an external server) is located via a wireless local area network. The wireless local area network can be a wireless personal area network. The other electronic device can be a wearable device capable of exchanging (or interoperating) data with the display device 10.

[0406] Location information module 725 is a module used to obtain the location (or current location) of display device 10. Examples of location information module 725 include a Global Positioning System (GPS) module or a Wi-Fi module. For example, display device 10 using a GPS module can obtain its location by using signals transmitted from GPS satellites. By using a Wi-Fi module, display device 10 can obtain its location based on information from a wireless access point (AP) that sends / receives wireless signals to / from the Wi-Fi module. Location information module 725 refers to any module that can be used to obtain the location (or current location) of display device 10, and is not limited to modules that calculate or obtain the location of display device 10 by themselves.

[0407] The input unit 730 may include an image input unit (such as a camera device 731) for inputting image signals, an audio input unit (such as a microphone 732) for inputting audio signals, and an input device 733 for receiving information from a user.

[0408] The camera device 731 processes image frames, such as still images or moving images, acquired by the image sensor in video call mode or recording mode. The processed image frames can be displayed on the display panel 300 or stored in the memory 770.

[0409] Microphone 732 processes external sound signals into electronic voice data. Depending on the function or application performed on display device 10, the processed voice data can be utilized in various ways. Various algorithms for removing different types of noise generated during the process of receiving external sound signals can be implemented in microphone 732.

[0410] The main processor 710 can control the operation of the display device 10 in response to information input via the input device 733. The input device 733 may include, for example, mechanical input devices or touch input devices located on the rear or side surface of the display device 10, such as buttons, dome switches, jog wheels, or jog switches. Touch input devices may be implemented using the sensor electrode layer of the display panel 300.

[0411] Sensor unit 740 may include one or more sensors that sense at least one of information in display device 10, environmental information surrounding display device 10, and user information, and generate associated sensing signals. Main processor 710 may control the driving or operation of display device 10 based on the sensing signals, or may perform data processing, functions, or operations associated with applications installed on display device 10. Sensor unit 740 may include at least one of the following: proximity sensor, illuminance sensor, accelerometer, magnetic sensor, gravity sensor (G-sensor), gyroscope sensor, motion sensor, RGB sensor, infrared sensor (IR sensor), finger scanning sensor, ultrasonic sensor, optical sensor, battery level meter, environmental sensor (e.g., barometer, hygrometer, thermometer, radiation sensor, thermal sensor, gas sensor), and chemical sensor (e.g., electronic nose, health sensor, biometric sensor).

[0412] A proximity sensor can refer to a sensor that can detect the presence of an object approaching or near a predetermined detection surface using, for example, electromagnetic force or infrared light without mechanical contact. Examples of proximity sensors include, for example, transmissive photoelectric sensors, direct reflection photoelectric sensors, specular reflection photoelectric sensors, high-frequency oscillation proximity sensors, capacitive proximity sensors, magnetic proximity sensors, and infrared proximity sensors. A proximity sensor can detect not only proximity touches but also proximity touch patterns such as proximity touch distance, proximity touch direction, proximity touch speed, proximity touch time, proximity touch position, and proximity touch movement state. The main processor 710 can process data (or information) corresponding to the proximity touch operations and proximity touch patterns detected by the proximity sensor and can control the display panel 300 to display visual information corresponding to the processed data. An ultrasonic sensor can use ultrasound to identify the position information of an object. The main processor 710 can calculate the position of the object based on information detected from the optical sensor and the ultrasonic sensor. Because the speed of light is different from the speed of ultrasound, the position of the object can be calculated using the time it takes for light to reach the optical sensor and the time it takes for ultrasound to reach the ultrasonic sensor.

[0413] The output unit 750 is used to generate outputs related to visual effects, auditory effects, tactile effects, etc., and may include at least one of the display panel 300, sound output module 752, tactile module 753, and light output unit 754.

[0414] Display panel 300 displays (outputs) information processed by display device 10. For example, display panel 300 may display information about an application running on the screen of display device 10, or display user interface (UI) information or graphical user interface (GUI) information based on the execution of screen information. Display panel 300 may include a display layer for displaying images and a sensor electrode layer for sensing user touch input. As a result, display panel 300 can be used as one of the input devices 733 providing an input interface between display device 10 and the user, or as one of the output units 750 providing an output interface between display device 10 and the user.

[0415] Within the spirit and scope of the disclosure, the sound output module 752 can output source data received from the wireless communication unit 720 or stored in the memory 770 in call signal receiving mode, speaking or recording mode, voice recognition mode, broadcast receiving mode, etc. The sound output module 752 can also output sound signals associated with functions performed in the display device 10 (e.g., call signal receiving sound, message receiving sound). The sound output module 752 may include a receiver and a speaker. At least one of the receiver and speaker may be a sound generator, which may be attached below or beneath the display panel 300 and may cause the display panel 300 to vibrate to output sound. The sound generator may be a piezoelectric element or piezoelectric actuator that contracts or expands according to the voltage applied thereto, or it may be an exciter that uses a voice coil to generate magnetic force to vibrate the display panel 300.

[0416] The haptic module 753 can generate various tactile effects that can be sensed by the user. The haptic module 753 can provide vibrations as tactile effects to the user. The intensity and mode of the vibrations generated by the haptic module 753 can be controlled by settings of the main processor 710 or by user selection. For example, the haptic module 753 can output different vibrations by synthesizing them or outputting them sequentially. In addition to vibrations, the haptic module 753 can generate various types of tactile effects, such as the effects of pin arrangement moving vertically on the skin, jet or suction through jet or suction holes, gentle rubbing on the skin, contact of electrodes, and electrostatic stimulation, or the effects of cold or heat sensations reproduced by using devices that absorb or generate heat. The haptic module 753 can transmit tactile effects not only through direct contact but also allow the user to feel the tactile effects through muscle sensations such as those in the fingers or arms.

[0417] The light output unit 754 outputs a signal to notify of an event by using light from a light source. Within the spirit and scope of the disclosure, examples of events occurring in the display device 10 may include message reception, call signal reception, missed calls, alarm clock, calendar notifications, email reception, and information reception via an application. The signal is generated from the light output unit 754 when the display device 10 emits monochromatic or multicolor light through its front or rear surface. Once the display device 10 detects that the user has checked the event, it can terminate the signal output.

[0418] Interface 760 serves as a path to various types of external devices connected to display device 10. Interface 760 may include at least one of a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for electrical connection to a device including an identification module, an audio input / output (I / O) port, a video I / O port, and a headphone port. When an external device can be connected to interface 760 of display device 10, appropriate control associated with the connected external device can be performed.

[0419] The memory 770 stores data supporting various functions of the display device 10. The memory 770 may store applications running on the display device 10, as well as data items and instructions for operating the display device 10. At least some or a predetermined number of applications can be downloaded from an external server via wireless communication. The memory 770 may store applications for operating the main processor 710, and may temporarily store input / output data (e.g., phonebooks, messages, still images, moving images). The memory 770 may store tactile data for vibrations in different modes provided to the tactile module 753, and acoustic data about various sounds provided to the sound output module 752. The memory 770 may include at least one of the following: flash memory, hard disk storage, solid-state drive (SSD), silicon disk drive (SDD), multimedia card microstorage, card-type memory (e.g., SD or XD memory), random access memory (RAM), static random access memory (SRMA), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic storage, magnetic disk, and optical disk.

[0420] The power supply unit 780, under the control of the main processor 710, can receive power from both an external and internal power source to supply power to each element included in the display device 10. The power supply unit 780 may include a battery 790. The power supply unit 780 includes a connection port. The connection port may be an example of an interface 760 to which an external charger can be electrically connected for supplying power to charge the battery 790. Optionally, the power supply unit 780 can wirelessly charge the battery 790 without using the connection port. The battery 790 can receive power from an external wireless power transmitter using at least one of inductive coupling based on magnetic induction and magnetic resonance coupling based on electromagnetic resonance. The battery 790 may be configured such that it is not stacked with the main circuit board 700 in the third direction (Z-axis direction). The battery 790 may be stacked with the battery hole BH of the bracket 600.

[0421] The bottom cover 900 may be disposed below or beneath the main circuit board 700 and the battery 790. The bottom cover 900 may be fastened and secured to the bracket 600. The bottom cover 900 may form the appearance of the lower surface of the display device 10. The bottom cover 900 may include plastic, metal, or a combination of plastic and metal.

[0422] The second camera aperture CMH2 can be formed or disposed in the bottom cover 900, and the lower surface of the camera device 731 is exposed through the second camera aperture CMH2. The positions of the camera device 731 and the first camera aperture CMH1 and the second camera aperture CMH2 aligned with the camera device 731 are not limited to... Figure 1 and Figure 2 The location of the embodiment shown in the figure.

[0423] Figure 4 This is a plan view showing the display area, non-display area, and sensor area of ​​the display panel of the display device according to an embodiment. Figure 5 This is a plan view illustrating the display area, non-display area, and sensor area of ​​a display panel of a display device according to another embodiment. Figure 4 and Figure 5 In the plan view, the auxiliary area SBA of the display panel 300 is not bent but unfolded.

[0424] Reference Figure 4 and Figure 5 The display panel 300 may include a main area MA and an auxiliary area SBA. The main area MA may include a display area DA and a non-display area NDA. Display pixels can be set in the display area DA to display images, while the non-display area NDA, as the outer area of ​​the display area DA, may not display the image.

[0425] The main body region MA may include a sensor region SA, in which an optical sensor for sensing light, a capacitive sensor for sensing capacitance changes, or an ultrasonic sensor for sensing ultrasound can be disposed. For example, the optical sensor may be an optical fingerprint sensor, an illuminance sensor, or an optical proximity sensor. Optionally, the optical sensor may be a solar cell. The capacitive sensor may be a capacitive fingerprint sensor. The ultrasonic sensor may be an ultrasonic fingerprint sensor or an ultrasonic proximity sensor.

[0426] To detect a human fingerprint, an optical fingerprint sensor shines light onto a human finger placed in the sensor area SA and detects the light reflected from the valleys of the fingerprint and absorbed by the ridges. An illuminance sensor detects externally incident light to determine the illuminance of the environment in which the display device 10 is located. To determine if an object is positioned close to the display device 10, an optical proximity sensor shines light onto the display device 10 and detects the light reflected from the object. A capacitive fingerprint sensor detects a human fingerprint placed in the sensor area SA by detecting the capacitance difference between the valleys and ridges of the fingerprint.

[0427] An ultrasonic fingerprint sensor outputs ultrasonic waves to the fingerprint of a person's finger placed in the sensor area SA, and detects the ultrasonic waves reflected from the valleys and ridges of the fingerprint to detect the fingerprint. To determine whether an object is positioned close to the display device 10, an ultrasonic proximity sensor shines light onto the display device 10 and detects the light reflected by the object.

[0428] The sensor area SA can be superimposed on the display area DA. The sensor area SA can be defined as at least a portion of the display area DA. For example, as... Figure 4 As shown, the sensor area SA can be a central area of ​​the display area DA located on the side closest to the display panel 300. However, it will be understood that the disclosure is not limited thereto. Alternatively, the sensor area SA can be a portion of the display area DA located on one side of the display panel 300.

[0429] Optionally, such as Figure 5 As shown, the sensor area SA can be substantially the same as the display area DA. In this case, light can be detected at each location in the display area DA.

[0430] The auxiliary region SBA can protrude from one side of the main region MA in the second direction (Y-axis direction). For example... Figure 4 As shown, the length of the auxiliary region SBA in the first direction (X-axis direction) can be less than the length of the main region MA in the first direction (X-axis direction). The length of the auxiliary region SBA in the second direction (Y-axis direction) can be less than the length of the main region MA in the second direction (Y-axis direction). However, it will be understood that the disclosure is not limited thereto. The auxiliary region SBA can be bent and disposed on the lower surface of the substrate SUB. The auxiliary region SBA can overlap with the main region MA in the thickness direction of the substrate SUB (e.g., the third direction (Z-axis direction)).

[0431] The display circuit board 310 and the display driver 320 can be disposed in the auxiliary area SBA. The display circuit board 310 can be disposed on a display pad, which is disposed on one side of the auxiliary area SBA. The display circuit board 310 can be attached to the display pad in the auxiliary area SBA using an anisotropic conductive film.

[0432] Figure 6 This is a schematic cross-sectional view showing the cover window and display panel according to an embodiment. Figure 6 This is a schematic cross-sectional view of the display panel 300, in which... Figure 4 The auxiliary area SBA is bent and set on the lower surface of the display panel 300.

[0433] Reference Figure 6 The display panel 300 may include a substrate SUB, a display layer DISL, a sensor electrode layer SENL, a polarizing film PF, and a panel bottom cover PB.

[0434] The substrate SUB can be made of insulating materials such as glass, quartz, and polymer resin. The substrate SUB can be a rigid substrate or a flexible substrate that can be bent, folded, rolled, etc.

[0435] The display layer DISL can be disposed on the main body region MA of the substrate SUB. The display layer DISL may include display pixels to display images. The display layer DISL may include sensor pixels to sense light incident from the outside. The display layer DISL may include a thin film transistor layer in which thin film transistors are formed, an emitting material layer in which light-emitting elements are formed, and an encapsulation layer for encapsulating the emitting material layer.

[0436] In addition to display pixels, electrical connections such as scan lines, data lines, and power lines that are electrically connected to the display pixels can be provided on the display layer DISL in the display area DA. Similarly, in addition to sensor pixels, electrical connections such as sensing scan lines, lead-out lines, and reset signal lines that are electrically connected to the sensor pixels can be provided on the display layer DISL in the display area DA.

[0437] For example, scan drivers and fan-out lines can be configured on the display layer DISL in the non-display area NDA. The scan driver can apply scan signals to scan lines, sense scan signals to sense scan lines, and apply reset signals to reset signal lines. Fan-out lines can electrically connect data lines to the display driver 320, and fan-out lines can be configured to connect leads to the display pad.

[0438] The sensor electrode layer (SENL) can be disposed on the display layer (DISL). The SENL can include sensor electrodes and can sense the presence of a touch object.

[0439] The sensor electrode layer SENL may include a touch sensing area and a touch peripheral area. In the touch sensing area, sensor electrodes are configured to sense touch input from an object. In the touch peripheral area, no sensor electrodes are disposed. The touch peripheral area may surround or be adjacent to the touch sensing area. The touch peripheral area may be formed on the outside of the touch sensing area to extend to the edge of the display panel 300. Sensor electrodes, connectors, and conductive patterns may be disposed in the touch sensing area. Sensor lines electrically connected to the sensor electrodes may be disposed in the touch peripheral area.

[0440] The touch sensing area of ​​the sensor electrode layer SENL can be overlaid with the display area DA of the display layer DISL. The touch sensing area of ​​the sensor electrode layer SENL can be overlaid with the sensor area SA. The touch peripheral area of ​​the sensor electrode layer SENL can be overlaid with the non-display area NDA of the display layer DISL.

[0441] A polarizing film PF can be disposed on the sensor electrode layer SENL. The polarizing film PF can include a linear polarizer and a phase retardation film such as a λ / 4 (quarter wavelength) plate. The phase retardation film can be disposed on the sensor electrode layer SENL, and the linear polarizer can be disposed on the phase retardation film.

[0442] Cover window 100 can be disposed on polarizing film PF. Cover window 100 can be attached to polarizing film PF by a transparent adhesive member such as optically transparent adhesive (OCA) film.

[0443] The panel bottom cover PB can be disposed below or beneath the substrate SUB. The panel bottom cover PB can be attached to the lower surface of the substrate SUB by means of an adhesive member. The adhesive member can be a pressure-sensitive adhesive (PSA). The panel bottom cover PB can include at least one of the following: a light-blocking member for absorbing light incident from the outside, a buffer member for absorbing external impacts, and a heat dissipation member for effectively releasing heat from the display panel 300.

[0444] A light-blocking component may be disposed below or beneath the substrate SUB. The light-blocking component blocks the transmission of light to prevent components disposed beneath the display panel 300 from being seen from above the display panel 300. The light-blocking component may include light-absorbing materials such as black pigments and black dyes.

[0445] The buffer member can be positioned below or beneath the light-blocking member. The buffer member absorbs external impacts to prevent damage to the display panel 300. The buffer member can be composed of a single layer or multiple layers. For example, the buffer member can be formed from polymer resins such as polyurethane, polycarbonate, polypropylene, and polyethylene, or from elastic materials such as rubber and sponges obtained by foaming polyurethane or acrylic materials.

[0446] The heat dissipation component can be disposed below or beneath the buffer component. The heat dissipation component may include a first heat dissipation layer and a second heat dissipation layer. The first heat dissipation layer includes graphite or carbon nanotubes, and the second heat dissipation layer is formed of a thin metal film (such as copper, nickel, ferrite, and silver) that can block electromagnetic waves and has high thermal conductivity.

[0447] The auxiliary area SBA of the substrate SUB can be bent and correspondingly disposed on the lower surface of the display panel 300. The auxiliary area SBA of the substrate SUB can be attached to the lower surface of the panel bottom cover PB via an adhesive layer 391. The adhesive layer 391 can be a pressure-sensitive adhesive (PSA).

[0448] Figure 7 It is shown Figure 4 A plan view of an example of the emission area of ​​a display pixel in the display area.

[0449] Figure 8 It is shown Figure 4 A plan view of an example of the emitting area of ​​a display pixel and the light-receiving area of ​​a sensor pixel in the sensor region.

[0450] Figure 7 and Figure 8 The diagram shows the first emission region RE of the first display pixel, the second emission region GE of the second display pixel, the third emission region BE of the third display pixel, and the light receiving region LE of the sensor pixel.

[0451] Reference Figure 7 and Figure 8 The sensor area SA may include a first transmitting area RE, a second transmitting area GE, a third transmitting area BE, a light receiving area LE, and a non-transmitting area NEA.

[0452] Each first emission region RE can emit light of a first color, each second emission region GE can emit light of a second color, and each third emission region BE can emit light of a third color. For example, the first color can be red, the second color can be green, and the third color can be blue. However, it will be understood that the disclosure is not limited thereto.

[0453] exist Figure 7 and Figure 8In the example shown, when viewed from above, each of the first emission region RE, the second emission region GE, and the third emission region BE can have a generally rhomboid or generally rectangular shape. However, it will be understood that the disclosure is not limited thereto. When the emission regions RE, GE, and BE can be viewed from above, each of the first emission region RE, the second emission region GE, and the third emission region BE can have a polygonal shape other than a quadrilateral shape, a circular shape, or an elliptical shape. Although in Figure 7 and Figure 8 In the example shown, the third emission region BE has the largest area and the second emission region GE has the smallest area, but the disclosure is not limited to this.

[0454] A first emission region RE, two second emission regions GE, and a third emission region BE can be defined as a single emission group EG used to represent black and white or grayscale. For example, black and white or grayscale can be represented by a combination of light emitted from a first emission region RE, light emitted from the two second emission regions GE, and light emitted from a third emission region BE.

[0455] The second emission regions GE can be set in odd-numbered rows. The second emission regions GE can be arranged side-by-side in the first direction (X-axis direction) or set in each odd-numbered row. For every two adjacent second emission regions GE arranged or set in the first direction (X-axis direction) in each odd-numbered row, one second emission region GE can have a long side in the fourth direction DR4 and a short side in the fifth direction DR5, while the other second emission region GE can have a long side in the fifth direction DR5 and a short side in the fourth direction DR4. The fourth direction DR4 can refer to the direction between the first direction (X-axis direction) and the second direction (Y-axis direction), and the fifth direction DR5 can refer to the direction that intersects or crosses the fourth direction DR4.

[0456] The first transmission region RE and the third transmission region BE can be arranged or set in even-numbered rows. The first transmission region RE and the third transmission region BE can be arranged side by side in each even-numbered row in the first direction (X-axis direction). The first transmission region RE and the third transmission region BE can be arranged or set alternately in each even-numbered row.

[0457] The second transmission region GE can be set in an odd-numbered column. The second transmission regions GE can be arranged side by side in the second direction (Y-axis direction) or set in each odd-numbered column. For every two adjacent second transmission regions GE arranged or set in the second direction (Y-axis direction) in each odd-numbered column, one second transmission region GE can have a long side in the fourth direction DR4 and a short side in the fifth direction DR5, while the other second transmission region GE can have a long side in the fifth direction DR5 and a short side in the fourth direction DR4.

[0458] The first transmission region RE and the third transmission region BE can be arranged or set in even-numbered columns. The first transmission region RE and the third transmission region BE can be arranged side by side in each even-numbered column in the second direction (Y-axis direction). The first transmission region RE and the third transmission region BE can be arranged or set alternately in each even-numbered column.

[0459] The light-receiving area (LE) can sense light incident from the outside rather than emitted light. For example... Figure 8 As shown, the light receiving area LE may be included only in the sensor area SA, and not in the display area DA other than the light receiving area LE.

[0460] The optical receiving region LE can be positioned between the first transmitting region RE and the third transmitting region BE in a first direction (X-axis direction), and can be positioned between the second transmitting regions GE in a second direction (Y-axis direction). Although when in Figure 8 When viewed from above, the light-receiving area LE can have a generally rectangular shape, but the disclosure is not limited to this. The light-receiving area LE can have other polygonal shapes besides quadrilateral shapes, circular shapes, or elliptical shapes. The area of ​​the light-receiving area LE can be smaller than the area of ​​the second emitting area GE, but the disclosure is not limited to this.

[0461] In a sensor region SA capable of sensing externally incident light to identify a human finger's fingerprint, the number of light-receiving areas LE in the sensor region SA can be less than the number of first emitting areas RE, second emitting areas GE, and third emitting areas BE. This is because the fingerprint ridges of a human finger (see RID)... Figure 15 The distance between the emission regions RE, GE, and BE can be in the range of approximately 100 μm to approximately 150 μm, so the light receiving regions LE can be spaced apart from each other by approximately 100 μm to approximately 450 μm in the first direction (X-axis direction) and the second direction (Y-axis direction). For example, if the spacing between the emission regions RE, GE, and BE in the first direction (X-axis direction) can be approximately 45 μm, then the light receiving regions LE can be set every two to ten emission regions in the first direction (X-axis direction).

[0462] The non-emitting area (NEA) can refer to the area excluding the first emitting area (RE), the second emitting area (GE), the third emitting area (BE), and the light-receiving area (LE). Within the NEA, lines electrically connected to the first display pixel to the third display pixel can be configured to allow the first emitting area (RE), the second emitting area (GE), and the third emitting area (BE) to emit light. The NEA can be configured to surround or be adjacent to each of the first emitting area (RE), the second emitting area (GE), the third emitting area (BE), and the light-receiving area (LE).

[0463] like Figure 7 and Figure 8 As shown, in addition to the emission regions RE, GE, and BE, the sensor region SA of the display panel 300 may also include a light receiving region LE. Therefore, light incident on the upper surface of the display panel 300 can be sensed by the light receiving region LE of the display panel 300.

[0464] For example, light reflected from the valleys of a person's fingerprint, positioned or set on the upper surface of the cover window 100, can be sensed in each light-receiving area LE. Therefore, a person's fingerprint can be identified based on the amount of light detected in each light-receiving area LE of the display panel 300. In other words, a person's fingerprint can be identified using sensor pixels, which include light-receiving elements PD (see [reference needed]) built into the display panel 300. Figure 14 ).

[0465] Optionally, light incident on the upper surface of the display panel 300 can be detected in each light-receiving area LE. Therefore, the amount of light incident from the outside of the display device 10 can be determined based on the amount of light detected in each light-receiving area LE of the display panel 300. For example, the illuminance of the environment in which the display device 10 may be located can be determined by sensor pixels, including light-receiving elements PD built into the display panel 300.

[0466] Optionally, light reflected from an object positioned or disposed near the upper surface of the cover window 100 can be detected in each light-receiving area LE. Therefore, it is possible to detect an object placed near the upper surface of the display device 10 based on the amount of light detected in each light-receiving area LE of the display panel 300. For example, it is possible to determine whether an object is disposed near the upper surface of the display device 10 using sensor pixels, which include light-receiving elements PD built into the display panel 300.

[0467] Figure 9 It is shown Figure 4 A plan view of another example of display pixels and sensor pixels in the sensor area.

[0468] Figure 9Implementation examples and Figure 8 The difference in the embodiments is that a second transmission area GE can be removed, and an optical receiving area LE can be set to replace the removed second transmission area GE.

[0469] Reference Figure 9 The optical receiving region LE can be arranged or positioned parallel to the second transmitting region GE in a first direction (X-axis direction) and a second direction (Y-axis direction). For the second transmitting region GE and the optical receiving region LE that are adjacent to each other in the first direction (X-axis direction), one of them can have a long side in the fourth direction DR4 and a short side in the fifth direction DR5, while the other can have a long side in the fifth direction DR5 and a short side in the fourth direction DR4. For the second transmitting region GE and the optical receiving region LE that are adjacent to each other in the second direction (Y-axis direction), one of them can have a long side in the fourth direction DR4 and a short side in the fifth direction DR5, while the other can have a long side in the fifth direction DR5 and a short side in the fourth direction DR4.

[0470] Despite Figure 9 The area of ​​the optical receiving region LE is approximately equal to the area of ​​each second transmitting region GE, but this is not the only possible arrangement. The area of ​​the optical receiving region LE may be larger or smaller than the area of ​​each second transmitting region GE.

[0471] With a light-receiving area LE provided, the second emission area GE can be removed. Therefore, the emission group EG adjacent to the light-receiving area LE can include a first emission area RE, a second emission area GE, and a third emission area BE. For example, the emission group EG adjacent to the light-receiving area LE can include one second emission area GE, while each of the other emission groups EG can include two second emission areas GE. Therefore, compared to the second emission areas GE of each of the other emission groups EG, the second emission area GE of the emission group EG adjacent to the light-receiving area LE can have higher brightness to compensate for its smaller area.

[0472] like Figure 9 As shown, by removing a second emission region GE and replacing it with a light receiving region LE, the area of ​​the light receiving region LE can be increased, thereby increasing the amount of light detected in the light receiving region LE. As a result, the accuracy of the optical sensor in sensing light can be improved.

[0473] Figure 10 It is shown Figure 4 A plan view of another example of the emission area of ​​the display pixels in the display area. Figure 11 It is shown Figure 4Another example plan view of the emitting area of ​​the display pixel and the light receiving area of ​​the sensor pixel in the sensor area.

[0474] Figure 10 and Figure 11 Implementation examples and Figure 7 and Figure 8 The difference in the embodiments may be that the first transmission region RE, the second transmission region GE and the third transmission region BE are arranged or set sequentially and repeatedly in the first direction (X-axis direction), while the first transmission region RE, the second transmission region GE and the third transmission region BE are arranged or set side by side in the second direction (Y-axis direction).

[0475] exist Figure 10 and Figure 11 In the example shown, when the emission regions RE, GE, and BE can be viewed from above, each of the first emission region RE, the second emission region GE, and the third emission region BE can have a generally rectangular shape. For example, when the emission regions RE, GE, and BE can be viewed from above, each of the first emission region RE, the second emission region GE, and the third emission region BE can have a generally rectangular shape, having a short side in a first direction (X-axis direction) and a long side in a second direction (Y-axis direction). Alternatively, when the emission regions RE, GE, and BE can be viewed from above, each of the first emission region RE, the second emission region GE, and the third emission region BE can have a polygonal shape other than a quadrilateral shape, a circular shape, or an elliptical shape. Although the first emission region RE, the second emission region GE, and the third emission region BE can have substantially the same area, the disclosure is not limited thereto.

[0476] A first emission region RE, a second emission region GE, and a third emission region BE can be defined as a single emission group EG used to represent black and white or grayscale. In other words, black and white or grayscale can be represented by a combination of light emitted from a first emission region RE, light emitted from a second emission region GE, and light emitted from a third emission region BE.

[0477] The first transmission region RE, the second transmission region GE, and the third transmission region BE can be arranged or set sequentially and repeatedly in the first direction (X-axis direction). For example, the first transmission region RE, the second transmission region GE, the third transmission region BE, etc., can be arranged or set in the first direction (X-axis direction).

[0478] The first transmission area RE, the second transmission area GE, and the third transmission area BE can all be arranged or set side by side in the second direction (Y-axis direction). For example, the first transmission area RE can be arranged or set side by side in the second direction (Y-axis direction), the second transmission area GE can be arranged or set side by side in the second direction (Y-axis direction), and the third transmission area BE can be arranged or set side by side in the second direction (Y-axis direction).

[0479] For example, the optical receiving region LE can be disposed between adjacent first transmitting regions RE, adjacent second transmitting regions GE, and adjacent third transmitting regions BE in the second direction (Y-axis direction). Optionally, the optical receiving region LE can be disposed at at least in at least one of the regions between adjacent first transmitting regions RE, adjacent second transmitting regions GE, and adjacent third transmitting regions BE in the second direction (Y-axis direction).

[0480] When the light-receiving area LE can be viewed from above, the light-receiving area LE can have a generally rectangular shape. For example, when the light-receiving area LE can be viewed from above, the light-receiving area LE can have a generally rectangular shape, which has a long side in a first direction (X-axis direction) and a short side in a second direction (Y-axis direction). Alternatively, the light-receiving area LE can have a quadrilateral shape other than a generally rectangular shape, a polygonal shape other than a quadrilateral shape, a circular shape, or an elliptical shape. The area of ​​the light-receiving area LE can be smaller than the area of ​​the first emitting area RE, the area of ​​the second emitting area GE, and the area of ​​the third emitting area BE.

[0481] like Figure 10 and Figure 11 As shown, in addition to the emitting regions RE, GE, and BE, the sensor region SA of the display panel 300 may also include a light receiving region LE. Therefore, light incident on the upper surface of the display panel 300 can be sensed by the light receiving region LE of the display panel 300.

[0482] Figure 12 It is shown Figure 4 Another example plan view of the emitting area of ​​the display pixel and the light receiving area of ​​the sensor pixel in the sensor area.

[0483] Figure 12 The embodiments shown are similar to Figure 11The difference in the embodiments may be that the areas of the first emission region RE, the second emission region GE, and the third emission region BE, which may be arranged adjacent to the light receiving region LE in the second direction (Y-axis direction), may be smaller than the areas of the first emission region RE, the second emission region GE, and the third emission region BE, which may be arranged not adjacent to the light receiving region LE in the second direction (Y-axis direction).

[0484] Reference Figure 12 The length of the first emitting region RE, which can be arranged adjacent to the light receiving region LE in the second direction (Y-axis direction), can be less than the length of the first emitting region RE, which can be arranged not adjacent to the light receiving region LE in the second direction (Y-axis direction). To compensate for the smaller area, the first emitting region RE, which can be arranged adjacent to the light receiving region LE in the second direction (Y-axis direction), can emit light with higher brightness compared to the light emitted by the first emitting region RE, which can be arranged not adjacent to the light receiving region LE in the second direction (Y-axis direction).

[0485] The length of the second emitting region GE, which can be arranged adjacent to the light receiving region LE in the second direction (Y-axis direction), can be less than the length of the second emitting region GE, which can be arranged not adjacent to the light receiving region LE in the second direction (Y-axis direction). To compensate for the smaller area, the second emitting region GE, which can be arranged adjacent to the light receiving region LE in the second direction (Y-axis direction), can emit light with higher brightness compared to the light emitted by the second emitting region GE, which can be arranged not adjacent to the light receiving region LE in the second direction (Y-axis direction).

[0486] The length of the third emitting region BE, which can be positioned adjacent to the light receiving region LE in the second direction (Y-axis direction), can be less than the length of the third emitting region BE, which can be positioned without being adjacent to the light receiving region LE in the second direction (Y-axis direction). To compensate for the smaller area, the third emitting region BE, which can be positioned adjacent to the light receiving region LE in the second direction (Y-axis direction), can emit light with higher brightness compared to the light emitted by the third emitting region BE, which can be positioned without being adjacent to the light receiving region LE in the second direction (Y-axis direction).

[0487] Despite Figure 12In this embodiment, the optical receiving region LE is disposed between adjacent first transmitting regions RE, adjacent second transmitting regions GE, and adjacent third transmitting regions BE in the second direction (Y-axis direction), but the disclosure is not limited thereto. For example, the optical receiving region LE may be disposed in at least one of the regions between adjacent first transmitting regions RE, adjacent second transmitting regions GE, and adjacent third transmitting regions BE in the second direction (Y-axis direction). In this case, the area of ​​at least one of the first transmitting regions RE, second transmitting regions GE, and third transmitting regions BE disposed adjacent to the optical receiving region LE in the second direction (Y-axis direction) may be smaller than the area of ​​the first transmitting regions RE, second transmitting regions GE, and third transmitting regions BE disposed not adjacent to the optical receiving region LE in the second direction (Y-axis direction).

[0488] like Figure 12 As shown, since the areas of the first emission region RE, the second emission region GE, and the third emission region BE, which are arranged adjacent to the light receiving region LE in the second direction (Y-axis direction), are reduced, the area of ​​the light receiving region LE can be increased, thereby increasing the amount of light detected by the light receiving region LE. As a result, the accuracy of light sensing by the optical sensor can be improved.

[0489] Figure 13 It is shown Figure 7 An example of an equivalent circuit diagram of the first display pixel in the display area.

[0490] Reference Figure 13 The first display pixel DP1, including the first emission region RE, can be electrically connected to the (k-1)th scan line Sk-1, the kth scan line Sk, and the jth data line Dj, where k is a positive integer equal to or greater than 2, and j is a positive integer. The first display pixel DP1 can be electrically connected to the first power supply voltage line VDDL from which a first power supply voltage is supplied, the initialization voltage line VIL from which an initialization voltage is supplied, and the second power supply voltage line VSSL from which a second power supply voltage is supplied.

[0491] The first display pixel DP1 includes a driving transistor DT, a light-emitting element LEL, at least one switching element, and a first capacitor C1. Although in Figure 13 In the example shown, the at least one switching element includes a first transistor ST1, a second transistor ST2, a third transistor ST3, a fourth transistor ST4, a fifth transistor ST5, and a sixth transistor ST6, but the disclosure is not limited thereto. The at least one switching element may include one or more transistors.

[0492] The driving transistor DT may include a gate electrode, a first electrode, and a second electrode. The drain-source current Ids (hereinafter referred to as the "driving current") flowing between the first and second electrodes of the driving transistor DT is controlled according to the data voltage applied to the gate electrode. The driving current Ids flowing through the channel of the driving transistor DT is proportional to the square of the difference between the gate-source voltage Vsg and the threshold voltage Vth of the driving transistor DT, as shown in Equation 1 below:

[0493] [Equation 1]

[0494] Ids = k′ × (Vgs - Vth) 2

[0495] Where k' represents the scaling factor determined by the structure and physical properties of the driving transistor DT, Vgs represents the gate-source voltage of the driving transistor DT, and Vth represents the threshold voltage of the driving transistor DT.

[0496] When a driving current Ids flows through the light-emitting element LEL, the light-emitting element LEL emits light. The amount of light emitted from the light-emitting element LEL is proportional to the driving current Ids.

[0497] The light-emitting element (LEL) can be an organic light-emitting diode (OLED), which includes an anode electrode, a cathode electrode, and an organic emitting layer disposed between the anode electrode and the cathode electrode. Optionally, the LEL can be an inorganic light-emitting element, which includes an anode electrode, a cathode electrode, and an inorganic semiconductor element disposed between the anode electrode and the cathode electrode. Optionally, the LEL can be a quantum dot light-emitting element, which includes an anode electrode, a cathode electrode, and a quantum dot emitting layer disposed between the anode electrode and the cathode electrode. Optionally, the LEL can be a micro-LED chip. In the following description, for ease of illustration, the anode electrode is the first light-emitting electrode 171 (see...). Figure 15 The cathode electrode is the second light-emitting electrode 173 (see...). Figure 15 ).

[0498] The first light-emitting electrode of the light-emitting element LEL can be electrically connected to the first electrode of the fourth transistor ST4 and the second electrode of the sixth transistor ST6, while the second light-emitting electrode can be connected to the second power supply voltage line VSSL. A parasitic capacitance Cel can be formed between the first and second light-emitting electrodes of the light-emitting element LEL.

[0499] The first transistor ST1 can be a dual transistor comprising a 1-1 transistor ST1-1 and a 1-2 transistor ST1-2. Both 1-1 transistor ST1-1 and 1-2 transistor ST1-2 can be turned on by a scan signal from the k-th scan line Sk, electrically connecting the gate electrode of the driving transistor DT to its second electrode. For example, when both 1-1 transistor ST1-1 and 1-2 transistor ST1-2 are turned on, the gate electrode of the driving transistor DT can be electrically connected to its second electrode, thus the driving transistor DT can function as a diode. The gate electrode of 1-1 transistor ST1-1 can be electrically connected to the k-th scan line Sk, the first electrode of 1-1 transistor ST1-1 can be electrically connected to the second electrode of 1-2 transistor ST1-2, and the second electrode of 1-1 transistor ST1-1 can be electrically connected to the gate electrode of the driving transistor DT. The gate electrode of transistor ST1-2 can be electrically connected to the k-th scan line Sk, the first electrode of transistor ST1-2 can be electrically connected to the second electrode of the driving transistor DT, and the second electrode of transistor ST1-2 can be electrically connected to the first electrode of transistor ST1-1.

[0500] The second transistor ST2 is turned on by the scan signal of the k-th scan line Sk, so as to electrically connect the first electrode of the driving transistor DT to the j-th data line Dj. The gate electrode of the second transistor ST2 can be electrically connected to the k-th scan line Sk, the first electrode of the second transistor ST2 can be electrically connected to the first electrode of the driving transistor DT, and the second electrode of the second transistor ST2 can be electrically connected to the j-th data line Dj.

[0501] The third transistor ST3 can be implemented as a dual transistor comprising a 3-1 transistor ST3-1 and a 3-2 transistor ST3-2. Both transistors ST3-1 and ST3-2 are turned on by a scan signal on the (k-1)th scan line Sk-1 to electrically connect the gate electrode of the driving transistor DT to the initialization voltage line VIL. The gate electrode of the driving transistor DT can discharge to the initialization voltage of the initialization voltage line VIL. The gate electrode of transistor ST3-1 can be electrically connected to the (k-1)th scan line Sk-1, the first electrode of transistor ST3-1 can be electrically connected to the second electrode of the driving transistor DT, and the second electrode of transistor ST3-1 can be electrically connected to the first electrode of transistor ST3-2. Similarly, the gate electrode of transistor ST3-2 can be electrically connected to the (k-1)th scan line Sk-1, the first electrode of transistor ST3-2 can be electrically connected to the second electrode of transistor ST3-1, and the second electrode of transistor ST3-2 can be electrically connected to the initialization voltage line VIL.

[0502] The fourth transistor ST4 is turned on by the scan signal of the k-th scan line Sk to electrically connect the first light-emitting electrode of the light-emitting element LEL to the initialization voltage line VIL. The first light-emitting electrode of the light-emitting element LEL can be discharged to the initialization voltage. The gate electrode of the fourth transistor ST4 can be electrically connected to the k-th scan line Sk, the first electrode of the fourth transistor ST4 can be electrically connected to the first light-emitting electrode of the light-emitting element LEL, and the second electrode of the fourth transistor ST4 can be electrically connected to the initialization voltage line VIL.

[0503] The fifth transistor ST5 is turned on by the emitter control signal of the k-th emitter line Ek, so as to electrically connect the first electrode of the driving transistor DT to the first power supply voltage line VDDL. The gate electrode of the fifth transistor ST5 can be electrically connected to the k-th emitter line Ek, the first electrode of the fifth transistor ST5 can be electrically connected to the first power supply voltage line VDDL, and the second electrode of the fifth transistor ST5 can be electrically connected to the first electrode of the driving transistor DT.

[0504] The sixth transistor ST6 can be electrically connected between the second electrode of the driving transistor DT and the first light-emitting electrode of the light-emitting element LEL. The sixth transistor ST6 is turned on by the emission control signal of the k-th emitter line Ek, thus electrically connecting the second electrode of the driving transistor DT to the first light-emitting electrode of the light-emitting element LEL. The gate electrode of the sixth transistor ST6 can be electrically connected to the k-th emitter line Ek, the first electrode of the sixth transistor ST6 can be electrically connected to the second electrode of the driving transistor DT, and the second electrode of the sixth transistor ST6 can be electrically connected to the first light-emitting electrode of the light-emitting element LEL. When both the fifth transistor ST5 and the sixth transistor ST6 are turned on, the drive current Ids can be supplied to the light-emitting element LEL.

[0505] A first capacitor C1 may be formed between the second electrode of the driving transistor DT and the first power supply voltage line VDDL. One electrode of the first capacitor C1 may be electrically connected to the second electrode of the driving transistor DT, while the other electrode of the first capacitor C1 may be electrically connected to the first power supply voltage line VDDL.

[0506] Each of the first transistor ST1, the second transistor ST2, the third transistor ST3, the fourth transistor ST4, the fifth transistor ST5, the sixth transistor ST6, and the driving transistor DT can be formed as a thin-film transistor layer (TFTL) (see Figure 15The thin-film transistor (TFT). Where the first electrode of each of the first transistor ST1, second transistor ST2, third transistor ST3, fourth transistor ST4, fifth transistor ST5, sixth transistor ST6, and driving transistor DT can be a source electrode, its second electrode can be a drain electrode. Optionally, where the first electrode of each of the first transistor ST1, second transistor ST2, third transistor ST3, fourth transistor ST4, fifth transistor ST5, sixth transistor ST6, and driving transistor DT can be a drain electrode, its second electrode can be a source electrode.

[0507] The active layer of each of the first transistor ST1, the second transistor ST2, the third transistor ST3, the fourth transistor ST4, the fifth transistor ST5, the sixth transistor ST6, and the driving transistor DT can be made of polycrystalline silicon, amorphous silicon, and oxide semiconductor. When the active layer of each of the first transistor ST1 to the sixth transistor ST6 and the driving transistor DT is made of polycrystalline silicon, a low-temperature polycrystalline silicon (LTPS) process can be used.

[0508] Despite Figure 13 The first transistor ST1, the second transistor ST2, the third transistor ST3, the fourth transistor ST4, the fifth transistor ST5, the sixth transistor ST6, and the driving transistor DT are p-type metal-oxide-semiconductor field-effect transistors (MOSFETs), but this is merely illustrative. They could also be n-type MOSFETs.

[0509] The second display pixel DP2, which includes the second emission region GE, and the third display pixel DP3, which includes the third emission region BE, are substantially the same as the first display pixel DP1; therefore, redundant descriptions will be omitted.

[0510] Figure 14 It is shown Figure 8 An example equivalent circuit diagram of sensor pixels in the sensor region. Although in Figure 14 The sensor pixels in the sensor area shown in the example are sensor pixels of an optical fingerprint sensor, but the disclosure is not limited thereto.

[0511] Reference Figure 14 The sensor pixel FP, including the light receiving area LE, may include a light receiving element PD, a first sensing transistor RT1, a second sensing transistor RT2, a third sensing transistor RT3, and a sensing capacitor RC1.

[0512] The first sensing transistor RT1 can be a reset transistor, which resets the voltage V1 at the first electrode of the sensing capacitor RC1 according to the reset signal of the reset signal line RSL. The gate electrode of the first sensing transistor RT1 can be electrically connected to the reset signal line RSL, the source electrode of the first sensing transistor RT1 can be electrically connected to the cathode electrode of the photodetector PD and the first electrode of the sensing capacitor RC1, and the drain electrode of the first sensing transistor RT1 can be electrically connected to the first sensing power supply voltage line RVDDL from which the first sensing power supply voltage is applied.

[0513] The second sensing transistor RT2 can be an amplifying transistor that converts the voltage V1 at the first electrode of the sensing capacitor RC1 into a current signal and amplifies the current signal. The gate electrode of the second sensing transistor RT2 can be electrically connected to the cathode electrode of the photodetector PD and the first electrode of the sensing capacitor RC1. The source electrode of the second sensing transistor RT2 can be electrically connected to the drain electrode of the third sensing transistor RT3. The drain electrode of the second sensing transistor RT2 can be electrically connected to the first sensing power supply voltage line RVDDL.

[0514] The third sensing transistor RT3 can be a select transistor that can be turned on when a sensing scan signal can be applied to the sensing scan line RSCL, so that the voltage V1 at the first electrode of the sensing capacitor RC1 amplified by the second sensing transistor RT2 can be transmitted to the readout line ROL. The gate electrode of the third sensing transistor RT3 can be electrically connected to the sensing scan line RSCL, the source electrode of the third sensing transistor RT3 can be electrically connected to the readout line ROL, and the drain electrode of the third sensing transistor RT3 can be electrically connected to the source electrode of the second sensing transistor RT2.

[0515] A photodiode (PD) can be, but is not limited to, a photodiode, which includes a first photoreceiving electrode corresponding to the anode electrode, a photoreceiving semiconductor layer, and a second photoreceiving electrode corresponding to the cathode electrode. A photodiode (PD) can also be a phototransistor including a gate electrode, an active layer, a source electrode, and a drain electrode.

[0516] The second light-receiving electrode of the light-receiving element PD can be electrically connected to the first electrode of the sensing capacitor RC1, and the first light-receiving electrode can be electrically connected to the second sensing power supply voltage line RVSSL, from which a second sensing power supply voltage lower than the first sensing power supply voltage is applied. The pin semiconductor layer of the light-receiving element PD may include a p-type semiconductor layer electrically connected to the anode electrode, an n-type semiconductor layer electrically connected to the cathode electrode, and an i-type semiconductor layer disposed between the p-type semiconductor layer and the n-type semiconductor layer.

[0517] Despite Figure 14In the example shown, the first sensing transistor RT1, the second sensing transistor RT2, and the third sensing transistor RT3 are n-type metal-oxide-semiconductor field-effect transistors (MOSFETs), but this is merely illustrative. They could also be p-type MOSFETs.

[0518] The following text will describe it in detail. Figure 14 The operation of the sensor pixel FP is shown in the figure.

[0519] First, when the first sensing transistor RT1 is turned on by the reset signal of the reset signal line RSL, the voltage V1 at the first electrode of the sensing capacitor RC1 is reset to the first sensing power supply voltage from the first sensing power supply voltage line RVDDL.

[0520] Secondly, when light reflected from a person's fingerprint is incident on the light-receiving element PD, leakage current can flow through the light-receiving element PD. This leakage current can charge the sensing capacitor RC1.

[0521] When charge is applied to the sensing capacitor RC1, the voltage at the gate electrode of the second sensing transistor RT2, which is electrically connected to the first electrode of the sensing capacitor RC1, increases. When the voltage at the gate electrode of the second sensing transistor RT2 becomes greater than the threshold voltage, the second sensing transistor RT2 can turn on.

[0522] Third, when a sensing scan signal is applied to the sensing scan line RSCL, the third sensing transistor RT3 can be turned on. When the third sensing transistor RT3 is turned on, the current signal flowing through the second sensing transistor RT2 can be transmitted to the readout line ROL due to the voltage V1 at the first electrode of the sensing capacitor RC1. As a result, the voltage R1 of the readout line ROL increases, allowing it to be transmitted to the sensor driver 340. The sensor driver 340 can convert the voltage R1 of the readout line ROL into digital data using an analog-to-digital converter (ADC) and output the digital data.

[0523] The voltage R1 of the readout line ROL is proportional to the voltage V1 at the first electrode of the sensing capacitor RC1 (i.e., the amount of charge charged in the sensing capacitor RC1), and the amount of charge stored in the sensing capacitor RC1 is proportional to the amount of light supplied to the light receiving element PD. Therefore, it is possible to determine the amount of light incident on the light receiving element PD of the sensor pixel FP based on the voltage R1 of the readout line ROL. Since the sensor driver 340 can sense the amount of incident light for each sensor pixel FP, the sensor driver 340 can recognize the fingerprint pattern of a human finger.

[0524] Figure 15 It is shown Figure 8A schematic cross-sectional view of an example of the emitting area of ​​a display pixel and the light-receiving area of ​​a sensor pixel in the sensor region. Figure 16 It is shown Figure 15 A schematic cross-sectional view of an example of a light-receiving element. Figure 17 It is shown Figure 14 A schematic cross-sectional view of another example of a light-receiving element. Figure 18 It is shown Figure 14 A schematic cross-sectional view of another example of a light-receiving element.

[0525] Despite Figure 15 In the example shown, the sensor pixels in the sensor area can be sensor pixels of an optical fingerprint sensor, but the disclosure is not limited thereto. Figure 15 It shows along Figure 8 A schematic cross-sectional view of the first transmitting region RE, the light receiving region LE, and the second transmitting region GE, taken by line I-I'. Figure 15 The diagram shows the sixth transistor ST6 of each of the first display pixel DP1 and the second display pixel DP2, as well as the first sensing transistor RT1 and sensing capacitor RC1 of the sensor pixel FP.

[0526] Reference Figure 15 The display layer DISL, which includes a thin-film transistor layer (TFTL), an emissive material layer (EML), and a packaging layer (TFEL), can be disposed on the substrate (SUB), and the sensor electrode layer (SENL), which includes sensor electrodes (SE), can be disposed on the display layer DISL.

[0527] A first buffer layer BF1 may be disposed on one surface of the substrate SUB, and a second buffer layer BF2 may be disposed on the first buffer layer BF1. The first buffer layer BF1 and the second buffer layer BF2 may be disposed on the substrate SUB (or the surface of the substrate SUB) to protect the thin-film transistor layer (TFTL) and the emitter layer 172 of the emitter material layer (EML) from moisture that may penetrate through the substrate SUB. Buffer layers BF1 and BF2 may comprise multiple inorganic layers alternately stacked on top of each other. For example, each of the first buffer layer BF1 and the second buffer layer BF2 may consist of multiple layers, among which one or more inorganic layers selected from silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide may be alternately stacked on top of each other. The first buffer layer BF1 and / or the second buffer layer BF2 may be removed.

[0528] The first light-blocking layer BML can be disposed on the first buffer layer BF1. The first light-blocking layer BML can be composed of a single layer or multiple layers of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Optionally, the first light-blocking layer BML can be an organic layer containing black pigment.

[0529] The active layer ACT6 of the sixth transistor ST6 of each of the first display pixels DP1 and the second display pixels DP2 can be disposed on the second buffer layer BF2. The active layer RACT1 of the first sensing transistor RT1 of the sensor pixel FP can be disposed on the second buffer layer BF2. The active layers of the driving transistor DT of each of the first display pixels DP1 and the first transistors ST1 to ST5, and the active layers of the second sensing transistor RT2 and the third sensing transistor RT3 of the sensor pixel FP can be disposed on the second buffer layer BF2. The active layers ACT6 and RACT1 can include materials such as polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, and oxide semiconductors. When the active layers ACT6 and RACT1 include materials such as polycrystalline silicon and oxide semiconductors, the ion-doped regions in the active layers ACT6 and RACT1 can be conductive regions with conductivity.

[0530] Each of the active layers ACT6 and RACT1 can be stacked with a first light-blocking layer BML in the third direction (Z-axis direction). Since light incident through the substrate SUB can be blocked by the first light-blocking layer BML, leakage current can be prevented from flowing into each of the active layers ACT6 and RACT1 due to light incident through the substrate SUB.

[0531] The gate insulating layer 130 may be formed or disposed on the active layer ACT6 of the sixth transistor ST6 of each of the first display pixels DP1 and the second display pixels DP2, and on the active layer RACT1 of the first sensing transistor RT1 of the sensor pixel FP. The gate insulating layer 130 may be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0532] The gate electrode G6 of the sixth transistor ST6 in each of the first display pixels DP1 and the second display pixels DP2 can be disposed on the gate insulating layer 130. The gate electrode G6 of the sixth transistor ST6 in each of the first display pixels DP1 and the second display pixels DP2 can be stacked with the active layer ACT6 in the third direction (Z-axis direction). The portion of the active layer ACT6 that is stacked with the gate electrode G6 in the third direction (Z-axis direction) can be the channel region CHA. The gate electrode RG1 of the first sensing transistor RT1 and the first electrode RCE1 of the sensing capacitor RC1 can be disposed on the gate insulating layer 130. The gate electrode RG1 of the first sensing transistor RT1 can be stacked with the active layer RACT1 in the third direction (Z-axis direction). The portion of the active layer RACT1 that is stacked with the gate electrode RG1 in the third direction (Z-axis direction) can be the channel region RCHA. In addition to the driving transistor DT of each of the first display pixel DP1 and the second display pixel DP2, the gate electrodes of the first transistor ST1 to the fifth transistor ST5, and the first electrode of the first capacitor C1, the gate electrodes of the second sensing transistor RT2 and the third sensing transistor RT3 of the sensor pixel FP can also be disposed on the gate insulating layer 130. The gate electrode G6 and the gate electrode RG1, as well as the first electrode RCE1 of the sensing capacitor RC1, can be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0533] The first interlayer dielectric layer 141 can be disposed on the gate electrode G6, the gate electrode RG1, and the first electrode RCE1 of the sensing capacitor RC1. The first interlayer dielectric layer 141 can be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). The first interlayer dielectric layer 141 may include any number of inorganic layers.

[0534] The second electrode RCE2 of the sensing capacitor RC1 can be disposed on the first interlayer dielectric layer 141. The second electrode RCE2 of the sensing capacitor RC1 can be stacked with the first electrode RCE1 of the sensing capacitor RC1 in the third direction (Z-axis direction). The second electrode of the first capacitor C1 can be disposed on the first interlayer dielectric layer 141. The second electrode RCE2 of the sensing capacitor RC1 can be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0535] The second interlayer dielectric layer 142 may be disposed on the first interlayer dielectric layer 141. The second interlayer dielectric layer 142 may be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). The second interlayer dielectric layer 142 may include any number of inorganic layers. The first interlayer dielectric layer 141 and the second interlayer dielectric layer 142 may be collectively referred to as interlayer dielectric layers 141 and 142.

[0536] The first electrode S6 and the second electrode D6 of the sixth transistor ST6 of each of the first display pixels DP1 and the second display pixels DP2 can be disposed on the second interlayer dielectric layer 142. The first electrode RS1 and the second electrode RD1 of the first sensing transistor RT1 of the sensor pixel FP can be disposed on the second interlayer dielectric layer 142. The first electrodes and the first electrodes and the second electrodes of the driving transistor DT and the first transistors ST1 to ST5 of each of the first display pixels DP1 and the second display pixels DP2, as well as the first electrodes and the second electrodes of the second sensing transistor RT2 and the third sensing transistor RT3 of the sensor pixel FP, can be disposed on the second interlayer dielectric layer 142. The first electrode S6, the first electrode RS1, the second electrode D6, and the second electrode RD1 can be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0537] The first electrode S6 of the sixth transistor ST6 can pass through a contact hole penetrating the gate insulating layer 130, the first interlayer dielectric layer 141, and the second interlayer dielectric layer 142 to be electrically connected to a first conductive region COA1 located on one side of the channel region CHA of the active layer ACT6. The second electrode D6 of the sixth transistor ST6 can pass through a contact hole penetrating the gate insulating layer 130, the first interlayer dielectric layer 141, and the second interlayer dielectric layer 142 to be electrically connected to a second conductive region COA2 located on the other side of the channel region CHA of the active layer ACT6. The first electrode RS1 of the first sensing transistor RT1 can pass through a contact hole penetrating the gate insulating layer 130, the first interlayer dielectric layer 141, and the second interlayer dielectric layer 142 to be electrically connected to a first conductive region RCA1 located on one side of the channel region CHA of the active layer RACT1. The second electrode RD1 of the first sensing transistor RT1 can be electrically connected to the second conductive region RCOA2 on the other side of the channel region CHA of the active layer RACT1 through a contact hole that penetrates the gate insulating layer 130, the first interlayer dielectric layer 141 and the second interlayer dielectric layer 142.

[0538] A first organic layer 150 may be disposed on the first electrode S6 and the first electrode RS1, as well as the second electrode D6 and the second electrode RD1, to provide a flat surface over the thin-film transistor. The first organic layer 150 may be formed as an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0539] The first connecting electrode ANDE1 and the second connecting electrode ANDE2 can be disposed on the first organic layer 150. The first connecting electrode ANDE1 can be electrically connected to the second electrode D6 of the sixth transistor ST6 through a contact hole penetrating the first organic layer 150. The second connecting electrode ANDE2 can be electrically connected to the second electrode RD1 of the first sensing transistor RT1 through a contact hole penetrating the first organic layer 150. Each of the first connecting electrode ANDE1 and the second connecting electrode ANDE2 can be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0540] The second organic layer 160 can be disposed on the first connecting electrode ANDE1 and the second connecting electrode ANDE2. The second organic layer 160 can be formed as an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0541] Despite Figure 15 In the example shown, the sixth transistor ST6 of each of the first display pixel DP1 and the second display pixel DP2, and the first sensing transistor RT1 of the sensor pixel FP, can be implemented as a top-gate transistor in which the gate electrode can be located or disposed above the active layer, but the disclosure is not limited thereto. For example, the sixth transistor ST6 of each of the first display pixel DP1 and the second display pixel DP2, and the first sensing transistor RT1 of the sensor pixel FP, can be implemented as a bottom-gate transistor in which the gate electrode can be located or disposed below the active layer, or as a dual-gate transistor in which the gate electrode can be located or disposed above and below the active layer.

[0542] The emissive material layer (EML) can be disposed on the thin-film transistor layer (TFTL). The emissive material layer (EML) may include a light-emitting element (LEL), a light-receiving element (PD), and a spacer 180.

[0543] Each light-emitting element (LEL) may include a first light-emitting electrode 171, an emitting layer 172, and a second light-emitting electrode 173. Each light-receiving element (PD) may include a first light-receiving electrode (PCE), a light-receiving semiconductor layer (PSEM), and a second light-receiving electrode (PAE). The barrier 180 may include a first barrier 181, a second barrier 182, and a third barrier 183.

[0544] In each of the emission regions RE, GE, and BE, the first light-emitting electrode 171, the emission layer 172, and the second light-emitting electrode 173 can be stacked sequentially one on top of the other, such that holes from the first light-emitting electrode 171 and electrons from the second light-emitting electrode 173 can combine with each other in the emission layer 172 to emit light. In this case, the first light-emitting electrode 171 can be an anode electrode, and the second light-emitting electrode 173 can be a cathode electrode.

[0545] In each light-receiving region LE, a photodiode can be formed, wherein a first light-receiving electrode PCE, a light-receiving semiconductor layer PSEM, and a second light-receiving electrode PAE can be stacked sequentially on top of each other. In this case, the first light-receiving electrode PCE can be an anode electrode, and the second light-receiving electrode PAE can be a cathode electrode.

[0546] The first light-emitting electrode 171 may be formed or disposed on the second organic layer 160. The first light-emitting electrode 171 may be electrically connected to the first connection electrode ANDE1 through a contact hole penetrating the second organic layer 160.

[0547] In the top-emitting structure where light is emitted from the emitting layer 172 toward the second light-emitting electrode 173, the first light-emitting electrode 171 can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or it can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and ITO (ITO / APC / ITO) to increase reflectivity. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0548] The first barrier 181 can be used to define each of the emission regions RE, GE, and BE of a display pixel. For this purpose, the first barrier 181 can be formed to expose a portion of the first light-emitting electrode 171 on the second organic layer 160. The first barrier 181 can cover the edge of the first light-emitting electrode 171 or overlap with the edge of the first light-emitting electrode 171. The first barrier 181 can be disposed on the second organic layer 160. As a result, contact holes penetrating the second organic layer 160 may not be filled by the first barrier 181. The first barrier 181 can be formed as an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0549] An emitting layer 172 may be formed or disposed on the first light-emitting electrode 171. The emitting layer 172 may include an organic material and emit light of a specific color. For example, the emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. The organic material layer may include a host and a dopant. The organic material layer may include a material that emits a predetermined light and may be formed using a phosphor or fluorescent material.

[0550] For example, the organic material layer of the emission layer 172 in the first emission region RE emitting light of the first color may include a phosphor that may include a host material and a dopant. The host material may include 4,4'-bis(N-carbazolyl)biphenyl (CBP) or mCP (1,3-bis(carbazolyl-9-yl)benzene), and the dopant may include at least one selected from the group consisting of: PIQIr(acac) (bis(1-phenylisoquinoline)acetylacetonate iridium), PQIr(acac) (bis(1-phenylquinoline)acetylacetonate iridium), PQIr (tris(1-phenylquinoline)iridium), and PtOEP (octaethylporphyrin platinum). Optionally, the organic material layer of the emission layer 172 of the first emission region RE may be, but is not limited to, a fluorescent material including PBD:Eu(DBM)3(Phen) or perylene.

[0551] The organic material layer of the emitting layer 172 of the second emitting region GE, which emits light of the second color, may include a phosphor, which may include a host material containing CBP or mCP and a dopant material containing Ir(ppy)3 (planar tris(2-phenylpyridine)iridium). Optionally, the organic material layer of the emitting layer 172 of the second emitting region GE, which emits light of the second color, may be, but is not limited to, a fluorescent material including Alq3 (tris(8-hydroxyquinoline)aluminum).

[0552] The organic material layer of the emission layer 172 of the third emission region BE that emits light of the third color may include, but is not limited to, a phosphor, which includes a host material containing CBP or mCP and a dopant material containing (4,6-F2ppy)2Irpic.

[0553] The second light-emitting electrode 173 may be formed or disposed on the emitting layer 172. The second light-emitting electrode 173 may be formed to cover the emitting layer 172 or stacked with the emitting layer 172. The second light-emitting electrode 173 may be a common layer that is formed or disposed throughout the display pixels. A cover layer may be formed or disposed on the second light-emitting electrode 173.

[0554] In the top-emitting structure, the second light-emitting electrode 173 can be formed of a transparent conductive material (TCP) (such as ITO and IZO) or a semi-transparent conductive material (such as magnesium (Mg), silver (Ag), and alloys of magnesium (Mg) and silver (Ag)). When the second light-emitting electrode 173 is formed of a semi-transparent conductive material, the light extraction efficiency can be improved by using a microcavity.

[0555] The first photoreceiving electrode PCE can be disposed on the first partition 181. The first photoreceiving electrode PCE can be electrically connected to the second connecting electrode ANDE2 through a contact hole penetrating the second organic layer 160 and the first partition 181. The first photoreceiving electrode PCE can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or it can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0556] The second barrier 182 can be used to define the light-receiving region LE of the sensor pixel FP. For this purpose, the second barrier 182 can be formed to expose a portion of the first light-receiving electrode PCE on the first barrier 181. The second barrier 182 can cover the edge of the first light-receiving electrode PCE or overlap with the edge of the first light-receiving electrode PCE. An emitting layer 172 can be disposed in a contact hole penetrating the first barrier 181. As a result, the contact hole penetrating the first barrier 181 can be filled with the emitting layer 172. In an exemplary embodiment, the emitting layer 172 can be further disposed in a contact hole penetrating the second barrier 182. As a result, at least a portion of the contact hole penetrating the second barrier 182 can be filled with the emitting layer 172. The upper surface of the light-receiving semiconductor layer PSEM and the upper surface of the second barrier 182 can be smoothly or seamlessly connected to each other. The second barrier 182 can be formed as an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0557] A photodetector semiconductor layer (PSEM) can be disposed on the first photodetector electrode (PCE). The PSEM can have a PIN structure in which a p-type semiconductor layer (PL), an i-type semiconductor layer (IL), and an n-type semiconductor layer (NL) can be sequentially stacked one on top of the other. With the PSEM having a PIN structure, the i-type semiconductor layer (IL) can be depleted by the p-type semiconductor layer (PL) and the n-type semiconductor layer (NL), thereby generating an electric field. Holes and electrons, which can be generated by the energy of natural light or sunlight, can migrate through this electric field. Therefore, holes can be collected by the p-type semiconductor layer (PL) to the second photodetector electrode (PAE), while electrons can be collected by the n-type semiconductor layer (NL) to the first photodetector electrode (PCE).

[0558] The p-type semiconductor layer PL can be disposed close to the surface on which external light can be incident, while the n-type semiconductor layer NL can be disposed away from the surface on which external light can be incident. Since the mobility of holes may be lower than that of electrons, it is preferable to form the p-type semiconductor layer PL closer to the surface on which external light can be incident to improve the collection efficiency of incident light.

[0559] like Figure 15 and Figure 16 As shown, an n-type semiconductor layer NL can be disposed on the first photoreceiving electrode PCE, an i-type semiconductor layer IL can be disposed on the n-type semiconductor layer NL, and a p-type semiconductor layer PL can be disposed on the i-type semiconductor layer IL. In this case, the p-type semiconductor layer PL can be formed by doping amorphous silicon (a-Si:H) with a p-type dopant. The i-type semiconductor layer IL can be made of amorphous silicon germanide (a-SiGe:H) or amorphous silicon carbide (a-SiC:H). The n-type semiconductor layer NL can be formed by doping amorphous silicon germanide (a-SiGe:H) or amorphous silicon carbide (a-SiC:H) with an n-type dopant. The p-type semiconductor layer PL and the n-type semiconductor layer NL can be formed to have approximately The thickness of the i-type semiconductor layer IL can be formed to have a thickness of approximately up to approximately The thickness is within the range.

[0560] Optionally, such as Figure 17As shown, an n-type semiconductor layer NL can be disposed on the first photoreceiving electrode PCE, and an i-type semiconductor layer IL can be removed. A p-type semiconductor layer PL can be disposed on the n-type semiconductor layer NL. In this case, the p-type semiconductor layer PL can be formed by doping amorphous silicon (a-Si:H) with a p-type dopant. The n-type semiconductor layer NL can be formed by doping amorphous silicon germanide (a-SiGe:H) or amorphous silicon carbide (a-SiC:H) with an n-type dopant. The p-type semiconductor layer PL and the n-type semiconductor layer NL can be formed to have approximately The thickness.

[0561] like Figure 18 As shown, the upper and lower surfaces of each of the first light-receiving electrode PCE, the p-type semiconductor layer PL, the i-type semiconductor layer IL, the n-type semiconductor layer NL, and the second light-receiving electrode PAE can be textured to have an uneven surface, thereby improving the efficiency of absorbing external light. This texturing process forms an uneven surface on the material. At least one of the upper and lower surfaces of each of the first light-receiving electrode PCE, the p-type semiconductor layer PL, the i-type semiconductor layer IL, the n-type semiconductor layer NL, and the second light-receiving electrode PAE can be textured to have a fabric-like surface shape. This texturing process can be performed via an etching process using photolithography, anisotropic etching using a chemical solution, or a groove-forming process using mechanical scribing. Figure 18 In this embodiment, the upper and lower surfaces of each of the p-type semiconductor layer PL, the i-type semiconductor layer IL, and the n-type semiconductor layer NL are formed to have non-uniformity, but the disclosure is not limited thereto. For example, one of the upper and lower surfaces of at least one of the p-type semiconductor layer PL, the i-type semiconductor layer IL, and the n-type semiconductor layer NL may be formed to have non-uniformity.

[0562] The second light-receiving electrode PAE can be disposed on the p-type semiconductor layer PL and the second barrier 182. The second light-receiving electrode PAE can be electrically connected to the third connection electrode (or light-receiving connection electrode) PCC through contact holes penetrating the first barrier 181 and the second barrier 182. The second light-receiving electrode PAE can be made of a light-transmitting transparent conductive material (TCO) such as ITO and IZO.

[0563] The third connecting electrode PCC can be disposed on the second organic layer 160. The third connecting electrode PCC can be disposed on the same layer as the first light-emitting electrode 171 and made of the same or similar material as the first light-emitting electrode 171. The third connecting electrode PCC can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or it can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO) to increase reflectivity.

[0564] The third barrier 183 can be disposed on the second photoreceiving electrode PAE and the second barrier 182. The third barrier 183 can be formed as an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0565] The emitting layer 172 can be disposed on the upper surface of the first light-emitting electrode 171 and the inclined surface of the first partition 181. The emitting layer 172 can be disposed on the inclined surface of the second partition 182. The second light-emitting electrode 173 can be disposed on the upper surface of the emitting layer 172, the inclined surface of the second partition 182, and the upper surface and inclined surface of the third partition 183. The second light-emitting electrode 173 can be stacked with the first light-receiving electrode PCE, the light-receiving semiconductor layer PSEM, and the second light-receiving electrode PAE in the third direction (Z-axis direction).

[0566] An encapsulation layer TFEL can be formed on the emissive material layer EML. The encapsulation layer TFEL may include at least one inorganic layer to prevent oxygen or moisture from penetrating into the emissive material layer EML. The encapsulation layer TFEL may also include at least one organic layer to protect the emissive material layer EML from foreign substances such as dust.

[0567] Alternatively, a substrate can be disposed on the emitter material layer EML instead of the encapsulation layer TFEL, such that the space between the emitter material layer EML and the substrate can be empty (i.e., vacuum) or filled with a filler film. The filler film can be an epoxy resin filler film or a silicon filler film.

[0568] The sensor electrode layer SENL is disposed on the encapsulation layer TFEL. The sensor electrode layer SENL may include a first reflective layer LSL and sensor electrodes SE.

[0569] The third buffer layer BF3 can be disposed on the encapsulation layer TFEL. The third buffer layer BF3 may include at least one inorganic layer. For example, the third buffer layer BF3 may be composed of multiple layers in which one or more inorganic layers, such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide, are stacked alternately one on top of another. The third buffer layer BF3 can be removed.

[0570] The first reflective layer LSL can be disposed on the third buffer layer BF3. The first reflective layer LSL is not disposed in the emission regions RE, GE, and BE, or the light receiving region LE. The first reflective layer LSL can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or it can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0571] The first sensor insulating layer TINS1 can be disposed on the first reflective layer LSL. The first sensor insulating layer TINS1 can be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0572] The sensor electrode SE can be disposed on the first sensor insulating layer TINS1. The sensor electrode SE is not disposed in the emission regions RE, GE, and BE, or the light receiving region LE. The sensor electrode SE can be stacked with the first reflective layer LSL in the third direction (Z-axis direction). The width of the sensor electrode SE in one direction can be smaller than the width of the first reflective layer LSL in that direction. The sensor electrode SE can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or it can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0573] The second sensor insulating layer TINS2 can be disposed on the sensor electrode SE. The second sensor insulating layer TINS2 can include at least one of an inorganic layer and an organic layer. The inorganic layer can be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer can be an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, or a polyimide resin layer.

[0574] A polarizing film PF can be disposed on the second sensor insulating layer TINS2. The polarizing film PF may include a linear polarizer and a retardation film such as a λ / 4 (quarter wavelength) plate. When the polarizing film PF is disposed in the light-receiving region LE, the amount of light incident on the light-receiving region LE is reduced. Therefore, the polarizing film PF may include a light-transmitting region LTA that is superimposed on the light-receiving region LE in the third direction (Z-axis direction) and transmits light as is. The area of ​​the light-transmitting region LTA can be larger than the area of ​​the light-receiving region LE. Therefore, the light-receiving region LE can be completely superimposed on the light-transmitting region LTA in the third direction (Z-axis direction). A cover window 100 can be disposed on the polarizing film PF.

[0575] like Figure 15 As shown, when a person's finger F is placed on the cover window 100, light emitted from the emitting areas RE, GE, and BE can be reflected at the valleys and ridges (RID) of the fingerprint of finger F. The amount of light reflected from the ridges (RID) of the fingerprint of finger F may differ from the amount of light reflected from the valleys (RID). The light reflected from the valleys and ridges (RID) of the fingerprint can be incident on the light-receiving element PD of each light-receiving area LE. Therefore, the fingerprint of a person's finger F can be identified by the sensor pixel FP, which includes the light-receiving element PD built into the display panel 300.

[0576] like Figure 15 As shown, light reflected at the valley of the fingerprint can pass through the light-transmitting region LTA of the polarizing film PF, which overlaps with the light-receiving region LE in the third direction (Z-axis direction), and incident on the light-receiving element PD of each light-receiving region LE. Therefore, it is possible to avoid the reduction of the amount of light incident on the light-receiving region LE due to the polarizing film PF.

[0577] Figure 19 It is shown Figure 8 A schematic cross-sectional view of examples of display pixels and sensor pixels in the sensor area.

[0578] Figure 19 Implementation examples and Figure 15 The difference in the embodiments may be that the light receiving element PD may be included in the thin film transistor layer TFTL instead of the emissive material layer EML, and the barrier 180 may be composed of a single layer.

[0579] Reference Figure 19The first photodetector electrode PCE can be disposed on the first interlayer dielectric layer 141. The first photodetector electrode PCE can be electrically connected to the second conductive region RCA2 disposed on the other side of the channel region RCHA of the active layer RACT1 through a contact hole penetrating the gate insulating layer 130 and the first interlayer dielectric layer 141. The first photodetector electrode PCE can be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof.

[0580] A photodetector semiconductor layer (PSEM) can be disposed on the first photodetector electrode (PCE). The PSEM can have a PIN structure in which p-type semiconductor layers PL, IL, and NL are sequentially stacked one on top of the other. With the PIN structure, the IL layer can be depleted by the PL and NL layers, thereby generating an electric field. This electric field can cause holes and electrons to migrate. Therefore, holes can be collected by the PL layer to the second photodetector electrode (PAE), while electrons can be collected by the NL layer to the first photodetector electrode (PCE).

[0581] The p-type semiconductor layer PL can be disposed close to the surface on which external light can be incident, and the n-type semiconductor layer NL can be disposed away from the surface on which external light can be incident. Since the mobility of holes may be lower than that of electrons, it is preferable to form the p-type semiconductor layer PL closer to the surface on which external light can be incident, thereby improving the collection efficiency of incident light.

[0582] The second light-receiving electrode PAE can be disposed on the p-type semiconductor layer PL of the light-receiving semiconductor layer PSEM. The second light-receiving electrode PAE can be electrically connected to the third connecting electrode PCC through a contact hole penetrating the second interlayer dielectric layer 142. The second light-receiving electrode PAE can be made of a light-transmitting transparent conductive material (TCO) such as ITO and IZO.

[0583] The third connection electrode PCC can be disposed on the second interlayer dielectric layer 142. The third connection electrode PCC can be electrically connected to the second photoreceiving electrode PAE through a contact hole penetrating the second interlayer dielectric layer 142. The third connection electrode PCC can also be electrically connected to the first electrode RCE1 of the sensing capacitor RC1 disposed on the gate insulating layer 130 through a contact hole penetrating the first interlayer dielectric layer 141 and the second interlayer dielectric layer 142. In this case, the second electrode RCE2 of the sensing capacitor RC1 disposed on the first interlayer dielectric layer 141 can be electrically connected to the second sensing power supply voltage line RVSSL from which the second sensing power supply voltage is applied.

[0584] Optionally, when the first electrode RCE1 of the sensing capacitor RC1 is disposed on the first interlayer dielectric layer 141, the third connection electrode PCC can be electrically connected to the first electrode RCE1 of the sensing capacitor RC1 through a contact hole penetrating the second interlayer dielectric layer 142. In this case, the second electrode RCE2 of the sensing capacitor RC1 disposed on the gate insulating layer 130 can be electrically connected to the second sensing power supply voltage line RVSSL from which the second sensing power supply voltage is applied.

[0585] The third connection electrode PCC can be disposed on the same layer as the first electrode S6 and the second electrode D6 of the sixth transistor ST6 of each of the first display pixels DP1 and the second display pixels DP2, and the first electrode RS1 and the second electrode RD1 of the first sensing transistor RT1 of the sensor pixel FP. It can be made of the same or similar material as the first electrode S6 and the second electrode D6 of the sixth transistor ST6 of each of the first display pixels DP1 and the second electrode RS1 and the second electrode RD1 of the first sensing transistor RT1 of the sensor pixel FP. The third connection electrode PCC can be composed of a single layer or multiple layers of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu).

[0586] like Figure 19 As shown, when a person's finger F is placed on the cover window 100, light emitted from the emission areas RE, GE, and BE can be reflected at the valleys of the fingerprint of finger F and absorbed at the ridges RID of the fingerprint of finger F. The light reflected at the valleys of the fingerprint can be incident on the light receiving element PD of each light receiving area LE. Therefore, the fingerprint of a person's finger F can be identified by the sensor pixel FP, which includes the light receiving element PD built into the display panel 300.

[0587] Figure 20 It is shown Figure 8 A schematic cross-sectional view of examples of display pixels and sensor pixels in the sensor area.

[0588] Figure 20 Implementation examples and Figure 15 The difference in the embodiments may be that the light receiving element PD may be included in the thin film transistor layer TFTL instead of the emissive material layer EML, and the barrier 180 may be composed of a single layer.

[0589] Reference Figure 20 Each optical receiver element PD may include an optical receiver gate electrode PG, an optical receiver semiconductor layer PSEM', an optical receiver source electrode PS, and an optical receiver drain electrode PDR.

[0590] A light-receiving gate electrode PG can be disposed on the first interlayer dielectric layer 141. The light-receiving gate electrode PG can be stacked with the gate electrode RG1 of the first sensing transistor RT1 of the sensor pixel FP and the active layer RACT1 in the third direction (Z-axis direction), but the disclosure is not limited thereto. The light-receiving gate electrode PG can be stacked with the gate electrode and active layer of one of the second sensing transistor RT2 and the third sensing transistor RT3 of the sensor pixel FP in the third direction (Z-axis direction), instead of being stacked with the first sensing transistor RT1. The width of the light-receiving gate electrode PG in one direction can be greater than the width of the gate electrode RG1 of the first sensing transistor RT1 of the sensor pixel FP in that direction. The light-receiving gate electrode PG can be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0591] The second interlayer dielectric layer 142 can be disposed on the photoreceiving gate electrode PG. The photoreceiving semiconductor layer PSEM' can be disposed on the second interlayer dielectric layer 142. The photoreceiving semiconductor layer PSEM' can be stacked with the photoreceiving gate electrode PG in the third direction (Z-axis direction).

[0592] The photodetector semiconductor layer PSEM' may include oxide semiconductor materials. For example, the photodetector semiconductor layer PSEM' may be made of an oxide semiconductor including indium (In), gallium (Ga), and oxygen (O). For example, the photodetector semiconductor layer PSEM' may be made of IGZO (indium (In), gallium (Ga), zinc (Zn), and oxygen (O)), IGZTO (indium (In), gallium (Ga), zinc (Zn), tin (Sn), and oxygen (O)) or IGTO (indium (In), gallium (Ga), tin (Sn), and oxygen (O))).

[0593] Each of the photodetector source electrode PS and the photodetector drain electrode PDR can be disposed on the photodetector semiconductor layer PSEM'. The photodetector source electrode PS and the photodetector drain electrode PDR can be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof.

[0594] like Figure 20 As shown, when a person's finger F is placed on the cover window 100, light emitted from the emission areas RE, GE, and BE can be reflected at the valleys of the fingerprint of finger F and absorbed at the ridges RID of the fingerprint of finger F. The light reflected at the valleys of the fingerprint can be incident on the light receiving element PD of each light receiving area LE. Therefore, the fingerprint of a person's finger F can be identified by the sensor pixel FP, which includes the light receiving element PD built into the display panel 300.

[0595] like Figure 20 As shown, the light-receiving gate electrode PG and the light-receiving semiconductor layer PSEM' can be stacked with the gate electrode and active layer of one of the first sensing transistors RT1 to RT3 of the sensor pixel FP in the third direction (Z-axis direction). Therefore, no additional space is needed for the light-receiving element PD, separate from the space for the thin-film transistor, thus preventing the space for the thin-film transistor from being narrowed due to the light-receiving element PD.

[0596] Figure 21 It is shown Figure 4 A plan view of an example of the transmissive area and the emitting area of ​​the display pixel in the display area. Figure 22 It is shown Figure 4 A plan view of an example of the transmissive area, the emitting area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0597] Figure 21 and Figure 22 The embodiments shown are similar to Figure 10 and Figure 11 The difference in the embodiments may be that the display area DA and the sensor area SA may include the transmission area TA.

[0598] Reference Figure 21 and Figure 22 The display area DA may include a first emitting area RE, a second emitting area GE, a third emitting area BE, a transmission area TA, and a non-emitting area NEA. The sensor area SA may include a first emitting area RE, a second emitting area GE, a third emitting area BE, a light receiving area LE, a transmission area TA, and a non-emitting area NEA.

[0599] The first launch zone (RE), the second launch zone (GE), and the third launch zone (BE) are referenced above. Figure 10 and Figure 11 The descriptions are essentially the same. Therefore, the first launch area (RE), the second launch area (GE), and the third launch area (BE) will no longer be described.

[0600] The transmission region TA transmits light incident on the display panel 300 as is. Because of the transmission region TA, the user can see objects or backgrounds located on the lower side of the display panel 300 from the upper side of the display panel 300. Therefore, the display device 10 can be implemented as a transparent display device. Optionally, because of the transmission region TA, an optical sensor disposed on the lower side of the display panel 300 of the display device 10 can detect light incident on the upper side of the display panel 300.

[0601] Each transmission region TA can be surrounded by a non-emissive region NEA. Although in Figure 21 and Figure 22 In this embodiment, the transmission region TA is arranged or disposed in a first direction (X-axis direction), but the disclosure is not limited thereto. The transmission region TA may be arranged or disposed in a second direction (Y-axis direction). When the transmission region TA is arranged or disposed in the first direction (X-axis direction), the transmission region TA may be disposed between adjacent first emission regions RE, adjacent second emission regions GE, and adjacent third emission regions BE in the second direction (Y-axis direction).

[0602] A light-receiving region LE can be superimposed on a transmission region TA. One light-receiving region LE can be set for every U transmission regions TA in the first direction (X-axis direction), where U is a positive integer equal to or greater than 2. One light-receiving region LE can be set for every V transmission regions TA in the second direction (Y-axis direction), where V is a positive integer equal to or greater than 2.

[0603] The light-receiving region LE can be superimposed on the transmission region TA in a third direction (Z-axis direction). The length of the light-receiving region LE in a first direction (X-axis direction) can be substantially equal to the length of the transmission region TA in a first direction (X-axis direction). However, it will be understood that the disclosure is not limited thereto. In the first direction (X-axis direction), the length of the light-receiving region LE can be less than the length of the transmission region TA. In the second direction (Y-axis direction), the length of the light-receiving region LE can be less than the length of the transmission region TA.

[0604] Figure 23A It is shown Figure 22 A schematic cross-sectional view of an example of the transmissive area, the emitting area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0605] Despite Figure 23A In the example shown, the sensor pixels in the sensor area are sensor pixels of an optical fingerprint sensor, but the disclosure is not limited thereto. Figure 23A It shows along Figure 22 Example of a cross-section of the first emitting region RE, the light receiving region LE, and the transmission region TA taken from line II-II'. Figure 23A Only the sixth transistor ST6 of the first display pixel DP1 and the first sensing transistor RT1 and sensing capacitor RC1 of the sensor pixel FP are shown.

[0606] Figure 23A Implementation examples and Figure 15 The difference in the embodiments may be that the light receiving region LE can be configured to overlap with the transmission region TA in the third direction (Z-axis direction).

[0607] Reference Figure 23A The first light-receiving electrode PCE of the light-receiving element PD in the light-receiving region LE can be made of an opaque conductive material, for example, it can be composed of a single layer or multiple layers of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). In this case, since the light-receiving region LE does not transmit light, some or a predetermined number of portions of the transmission region TA that are superimposed on the light-receiving region LE may also not transmit light.

[0608] The light-transmitting region LTA of the polarizing film PF can be superimposed on the transmission region TA in the third direction (Z-axis). In this way, it is possible to prevent the amount of light passing through the transmission region TA from being reduced due to the polarizing film PF.

[0609] like Figure 23A As shown, when the display panel 300 includes a transmissive region TA, the light-receiving region LE can be configured to overlap with the transmissive region TA in the third direction (Z-axis direction). Therefore, additional space for the light-receiving region LE, separate from the space used for the emitting regions RE, GE, and BE, is not required. Thus, it is possible to prevent the space used for the emitting regions RE, GE, and BE from being reduced due to the light-receiving region LE.

[0610] Figure 23B It is shown Figure 22 A schematic cross-sectional view of another example of the transmissive area of ​​the sensor region, the emitting area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel.

[0611] Figure 23B Implementation examples and Figure 23A The difference in the embodiments may be that at least one electrode and insulating layer can be removed from the transmission region TA.

[0612] Reference Figure 23B The first interlayer dielectric layer 141, the second interlayer dielectric layer 142, the first organic layer 150, the second organic layer 160, the barrier 180, and the second light-emitting electrode 173 can be made of materials with different refractive indices that transmit light. Therefore, by removing the first interlayer dielectric layer 141, the second interlayer dielectric layer 142, the first organic layer 150, the second organic layer 160, the barrier 180, and the second light-emitting electrode 173 from the transmission region TA, the transmittance of the transmission region TA can be further increased.

[0613] Despite Figure 23BIn the example shown, the first buffer layer BF1, the second buffer layer BF2, and the gate insulating layer 130 are not removed from the transmission region TA, but the disclosure is not limited thereto. At least one of the first buffer layer BF1, the second buffer layer BF2, and the gate insulating layer 130 may be removed from the transmission region TA.

[0614] Figure 23C It is shown Figure 4 An example view of the layout of the emission area of ​​the display pixel, the first light receiving area of ​​the first sensor pixel, and the second light receiving area of ​​the second sensor pixel in the sensor area.

[0615] Figure 23C Implementation examples and Figure 22 The difference in the embodiments may be that Figure 23C An embodiment includes a second optical receiving area LE2.

[0616] Reference Figure 23C The sensor region SA may include a first transmitting region RE, a second transmitting region GE, a third transmitting region BE, a first light receiving region LE1, a second light receiving region LE2, a transmission region TA, and a non-transmitting region NEA.

[0617] The second light-receiving region LE2 can be superimposed on a transmission region TA. One second light-receiving region LE2 can be set for every U transmission regions TA in the first direction (X-axis direction), where U is a positive integer equal to or greater than 2. One second light-receiving region LE2 can be set for every V transmission regions TA in the second direction (Y-axis direction), where V is a positive integer equal to or greater than 2.

[0618] The second light-receiving region LE2 can be superimposed on the transmission region TA in the third direction (Z-axis direction). The length of the second light-receiving region LE2 in the first direction (X-axis direction) can be substantially equal to the length of the transmission region TA in the first direction (X-axis direction). However, it will be understood that the disclosure is not limited thereto. In the first direction (X-axis direction), the length of the second light-receiving region LE2 can be less than the length of the transmission region TA. In the second direction (Y-axis direction), the length of the second light-receiving region LE2 can be less than the length of the transmission region TA.

[0619] Despite Figure 23C In the example shown, the first light receiving area LE1 and the second light receiving area LE2 are disposed in different transmission areas TA, but the disclosure is not limited thereto. The first light receiving area LE1 and the second light receiving area LE2 may be disposed in the same transmission area TA.

[0620] The first light-receiving area LE1 can be used as a light-receiving area for one of the following: an optical fingerprint sensor, an illuminance sensor, an optical proximity sensor, and a solar cell. The second light-receiving area LE2 can be used as another light-receiving area for one of the following: an optical fingerprint sensor, an illuminance sensor, an optical proximity sensor, and a solar cell.

[0621] Although Figure 23C In the example shown, the display panel 300 includes a first light-receiving region LE1 and a second light-receiving region LE2 with different characteristics, but the disclosure is not limited thereto. The display panel 300 may include three or more light-receiving regions with different characteristics.

[0622] The cross-section of the second optical receiving area LE2 can be compared with the above. Figure 23A and Figure 23B The cross-sections of the described light receiving region LE are basically the same; therefore, redundant descriptions will be omitted.

[0623] Figure 24 It is shown Figure 4 A plan view of an example of the reflective area and the emission area of ​​the display pixel in the display area. Figure 25 It is shown Figure 4 A plan view of an example of the reflective area, the emission area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0624] Figure 24 and Figure 25 The embodiments shown are similar to Figure 10 and Figure 11 The difference in the embodiments may be that the display area DA and the sensor area SA may include the reflective area RA.

[0625] Reference Figure 24 and Figure 25 The display area DA may include a first emitting area RE, a second emitting area GE, a third emitting area BE, a reflective area RA, and a non-emitting area NEA. The sensor area SA may include a first emitting area RE, a second emitting area GE, a third emitting area BE, a light receiving area LE, a reflective area RA, and a non-emitting area NEA.

[0626] The first launch zone (RE), the second launch zone (GE), and the third launch zone (BE) are referenced above. Figure 10 and Figure 11 The descriptions are essentially the same. Therefore, the first launch area (RE), the second launch area (GE), and the third launch area (BE) will no longer be described.

[0627] The reflective region RA reflects light incident on the upper surface of the display panel 300. Because of the reflective region RA, the user can see objects or backgrounds reflected from the upper side of the display panel 300. Therefore, the display device 10 can be implemented as a reflective display device.

[0628] The reflection region RA can be any region other than the first emission region RE, the second emission region GE, the third emission region BE, and the light receiving region LE. The reflection region RA can surround the emission regions RE, GE, and BE, as well as the light receiving region LE.

[0629] Figure 26 It is shown Figure 25 A schematic cross-sectional view of an example of the reflective area of ​​the sensor region, the emission area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel.

[0630] Despite Figure 26 In the example shown, the sensor pixels in the sensor area are sensor pixels of an optical fingerprint sensor, but the disclosure is not limited thereto. Figure 26 It shows along Figure 25 A schematic cross-sectional view of the first emitting region RE, the light receiving region LE, and the reflecting region RA, taken from line III-III'. Figure 26 Only the sixth transistor ST6 of the first display pixel DP1 and the first sensing transistor RT1 and sensing capacitor RC1 of the sensor pixel FP are shown.

[0631] Figure 26 Implementation examples and Figure 15 The difference in the embodiments may be that a reflective area RA may also be provided.

[0632] Reference Figure 26 The first reflective layer LSL can be disposed in the reflective region RA. The first reflective layer LSL can include a metallic material with high reflectivity, such as silver (Ag).

[0633] The light-transmitting region LTA of the polarizing film PF can be superimposed on the light-receiving region LE in the third direction (Z-axis). In this way, it is possible to prevent the amount of light passing through the light-transmitting region LTA from being reduced due to the polarizing film PF.

[0634] like Figures 24 to 26 As shown, when the display panel 300 includes a reflective area RA, the light-receiving area LE can be configured to overlap with the light-transmitting area LTA in the third direction (Z-axis direction). Therefore, additional space for the light-receiving area LE, separate from the space used for the emitting areas RE, GE, and BE, is not required. Thus, it is possible to prevent the space used for the emitting areas RE, GE, and BE from being reduced due to the light-receiving area LE.

[0635] Figure 27 It is shown Figure 4 A plan view of an example of the reflective area, the emission area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area. Figure 28 It is shown Figure 27 A schematic cross-sectional view of an example of the transmissive area, the emitting area of ​​the display pixel, and the light-receiving area of ​​the sensor pixel in the sensor area.

[0636] Figure 27 and Figure 28 Implementation examples and Figure 25 and Figure 26 The difference in the embodiments may be that the light receiving area LE can be configured to overlap with the reflecting area RA in the third direction (Z-axis direction).

[0637] Reference Figure 27 and Figure 28 The reflective region RA can be configured to surround or be adjacent to the transmitting regions RE, GE, and BE. A portion of the reflective region RA can be superimposed on the light receiving region LE in the third direction (Z-axis direction).

[0638] The reflective layer may include a first reflective layer LSL and a second reflective layer LSL3. The second reflective layer LSL3 may be disposed on the first reflective layer LSL in the reflective region RA. The first reflective layer LSL may not be disposed in the light receiving region LE, but the second reflective layer LSL3 may be disposed on the third buffer layer BF3 in the light receiving region LE.

[0639] The first reflective layer LSL and the second reflective layer LSL3 may comprise a metallic material with high reflectivity, such as silver (Ag). The thickness of the second reflective layer LSL3 may be less than the thickness of the first reflective layer LSL. The thickness of the second reflective layer LSL3 may be equal to or less than approximately 1 / 10 of the thickness of the first reflective layer LSL. For example, the thickness of the first reflective layer LSL may be approximately... In this case, the thickness of the second reflective layer LSL3 can be approximately

[0640] Since the second reflective layer LSL3 can be very thin or relatively thin, a portion of the light traveling to the second reflective layer LSL3 (e.g., approximately 80% of the light traveling to the second reflective layer LSL3) can pass through the second reflective layer LSL3. Therefore, light incident on the upper surface of the display panel 300 can pass through the second reflective layer LSL3 to be detected through the light receiving area LE.

[0641] In the reflective region RA, there are, for example Figure 26In the case of the first reflective layer LSL shown, the user may perceive the moiré pattern due to the opening in the reflective area RA. For example... Figure 28 As shown, when the second reflective layer LSL3 can be disposed in the light receiving region LE to overlap with the opening of the first reflective layer LSL in the reflective region RA in the third direction (Z-axis direction), it is possible to prevent the user from perceiving the moiré pattern.

[0642] The light-transmitting region LTA of the polarizing film PF can be superimposed on the reflective region RA and the light-receiving region LE in the third direction (Z-axis). In this way, it is possible to prevent the amount of light passing through the reflective region RA and the light-receiving region LE from being reduced due to the polarizing film PF.

[0643] Figure 29 This is a perspective view showing a display device according to another embodiment. Figure 30 This is a perspective view showing the display area, non-display area, and sensor area of ​​the display panel of the display device according to an embodiment.

[0644] Figure 29 and Figure 30 Implementation examples and Figure 1 and Figure 4 The difference in the embodiments may be that the display device 10 may be a curved display device with a predetermined curvature.

[0645] Reference Figure 29 and Figure 30 According to another embodiment, the display device 10 is used as a television set. The display device 10 according to this embodiment may include a display panel 300', a flexible film 311, a source driver 312, and a cover frame 910.

[0646] When the display device 10 can be viewed from above, the display device 10 can have a generally rectangular shape, which has a long side in a first direction (X-axis direction) and a short side in a second direction (Y-axis direction). The shape of the display device 10 when it can be viewed from above is not limited to a generally rectangular shape, but can be formed into a quadrilateral shape other than a rectangular shape, a polygonal shape other than a quadrilateral shape, a circular shape, or an elliptical shape.

[0647] As the display device 10 becomes larger, there may be a significant difference between the viewing angle when the user views the center area of ​​the display area DA of the display device 10 and the viewing angle when the user views the left and right ends of the display area DA of the display device 10. The viewing angle can be defined as the angle formed by the user's line of sight and the tangent of the display device 10. To reduce this difference in viewing angle, the display device 10 can be bent at a predetermined curvature in a first direction (X-axis direction). The display device 10 can be bent so that it is concave towards the user.

[0648] The display panel 300' can be a flexible display panel that can be easily bent, folded or rolled up, so that it can be bent at a predetermined curvature in a first direction (X-axis direction).

[0649] The display panel 300' may include a display area DA for displaying images and a non-display area NDA surrounding (or adjacent to) the display area DA. The display panel 300' may include sensor areas FSA1, FSA2, and FSA3 for sensing light incident from the outside.

[0650] Sensor regions FSA1, FSA2, and FSA3 may include a first sensor region FSA1, a second sensor region FSA2, and a third sensor region FSA3. Figure 29 and Figure 30 In this configuration, the first sensor area FSA1 can be located in the central area of ​​the display panel 300', the second sensor area FSA2 can be located in the left side area of ​​the display panel 300', and the third sensor area FSA3 can be located in the right side area of ​​the display panel 300'. Figure 29 and Figure 30 In the example shown, the first sensor area FSA1, the second sensor area FSA2, and the third sensor area FSA3 are positioned closer to the lower edge of the display panel 300' than to the upper edge of the display panel 300'. Figure 29 and Figure 30 In the example shown, the second sensor region FSA2 and the third sensor region FSA3 are symmetrical about the left and right relative to the first sensor region FSA1. However, it will be understood that the positions of the first sensor region FSA1, the second sensor region FSA2, and the third sensor region FSA3 are not limited to those shown in the example. Figure 29 and Figure 30 The location shown in the image.

[0651] The first sensor region FSA1, the second sensor region FSA2, and the third sensor region FSA3 can sense light to perform the same features. For example, to be used as an optical fingerprint sensor for recognizing a human fingerprint, each of the first sensor region FSA1, the second sensor region FSA2, and the third sensor region FSA3 can illuminate light onto the fingerprint of a human finger F placed in the sensor region SA to detect the light reflected at the valleys and ridges of the fingerprint of the human finger F. Optionally, each of the first sensor region FSA1, the second sensor region FSA2, and the third sensor region FSA3 can be used as an illuminance sensor for detecting the illuminance of the environment in which the display device 10 may be positioned or disposed. Optionally, each of the first sensor region FSA1, the second sensor region FSA2, and the third sensor region FSA3 can be used as an optical proximity sensor that detects whether an object is disposed close to the display device 10 by illuminating light onto the display device 10 to sense the light reflected by the object.

[0652] Optionally, the first sensor region FSA1, the second sensor region FSA2, and the third sensor region FSA3 can sense light to perform different features. For example, one of the first sensor region FSA1, the second sensor region FSA2, and the third sensor region FSA3 can be used as an optical fingerprint sensor, another of them can be used as an illuminance sensor, and yet another of them can be used as an optical proximity sensor. Optionally, two of the first sensor region FSA1, the second sensor region FSA2, and the third sensor region FSA3 can be used as one of an optical fingerprint sensor, an illuminance sensor, and an optical proximity sensor, while the third of them can be used as another of an optical fingerprint sensor, an illuminance sensor, and an optical proximity sensor.

[0653] The first sensor area FSA1, the second sensor area FSA2, and the third sensor area FSA3 of the display panel 300' can be referenced above. Figure 8 , Figure 9 , Figure 11 , Figure 12 , Figures 14 to 20 The descriptions are basically the same.

[0654] The flexible film 311 can be attached to the non-display area NDA of the display panel 300'. The flexible film 311 can be attached to the display pad of the non-display area NDA of the display panel 300' using an anisotropic conductive film. The flexible film 311 can be attached to the upper edge of the display panel 300'. Each flexible film 311 can be bent.

[0655] Source drivers 312 can be disposed on the flexible film 311. Each source driver 312 can receive source control signals and digital video data, generate data voltage, and output the data voltage to the data line of the display panel 300'. Each source driver 312 can be implemented as an integrated circuit.

[0656] The cover frame 910 can be configured to surround the side and bottom surfaces of the display panel 300'. The cover frame 910 can form the appearance of the display device 10 on the side and bottom surfaces. The cover frame 910 can include plastic, metal, or both plastic and metal.

[0657] like Figure 29 and Figure 30 As shown, even if the display device 10 is a curved display device with a predetermined curvature in the first direction (X-axis direction), light can still be detected by the sensor areas FSA1, FSA2, and FSA3 of the display panel 300'. Therefore, the sensor areas FSA1, FSA2, and FSA3 of the display panel 300' can be used as at least one of an optical fingerprint sensor, an illuminance sensor, and an optical proximity sensor.

[0658] Figure 31 and Figure 32 This is a perspective view showing a display device according to an embodiment.

[0659] Figure 31 and Figure 32 The embodiments shown are similar to Figure 1 and Figure 4 The difference between the embodiments shown is that the display device 10 can be a rollable display device that can be rolled up or unfolded.

[0660] Reference Figure 31 and Figure 32 According to another embodiment, the display device 10 is used as a television set. The display device 10 according to this embodiment may include a display panel 300", a first roller ROL1 and a roller housing 920.

[0661] When the display panel 300" is unfolded and can be viewed from the top, the display panel 300" can have a generally rectangular shape, which has a long side in a first direction (X-axis direction) and a short side in a second direction (Y-axis direction). The shape of the display device 10 when viewed from the top is not limited to a generally rectangular shape, but can be formed into a quadrilateral shape other than a rectangular shape, a polygonal shape other than a quadrilateral shape, a circular shape, or an elliptical shape.

[0662] The display panel 300" can be a flexible display panel that can be easily bent, folded, or rolled up, allowing it to be rolled up by the first roller ROL1. When the display panel 300" is unfolded rather than rolled up around the first roller ROL1, the display panel 300" can be exposed to the outside from the upper side of the roller housing 920, such as... Figure 31 As shown in the diagram. With the display panel 300" rolled up by the first roller ROL1, the display panel 300" can be housed in the roller housing 920, as shown in the diagram. Figure 32 As shown in the diagram. For example, the display panel 300" can be housed in the roller housing 920 or exposed from the upper side of the roller housing 920, as required by the user. Although in Figure 31 In the example shown, the entire display panel 300" may be exposed from the roller housing 920, but the disclosure is not limited thereto. A portion of the display panel 300" may be exposed from the roller housing 920, and only the exposed portion of the display panel 300" may display an image.

[0663] The first roller ROL1 can be connected to the lower edge of the display panel 300". Therefore, when the first roller ROL1 rotates, the display panel 300" can be rolled around the first roller ROL1 in the direction of rotation of the first roller ROL1.

[0664] The first roller ROL1 can be housed in the roller housing 920. The first roller ROL1 can have a generally cylindrical or generally cylindrical shape. For example, the first roller ROL1 can extend in a first direction (X-axis direction). The length of the first roller ROL1 in the first direction (X-axis direction) can be greater than the length of the display panel 300" in the first direction (X-axis direction).

[0665] The roller housing 920 can be disposed on the lower side of the display panel 300". The roller housing 920 can accommodate the first roller ROL1 and the display panel 300" rolled by the first roller ROL1.

[0666] The length of the roller shell 920 in the first direction (X-axis direction) can be greater than the length of the first roller ROL1 in the first direction (X-axis direction). The length of the roller shell 920 in the second direction (Y-axis direction) can be greater than the length of the first roller ROL1 in the second direction (Y-axis direction). The length of the roller shell 920 in the third direction (Z-axis direction) can be greater than the length of the first roller ROL1 in the third direction (Z-axis direction).

[0667] The roller housing 920 may include a transparent window (or transmission window) TW through which a display panel 300" rolled around the first roller ROL1 can be viewed. The transparent window TW may be disposed on the upper surface of the roller housing 920. The transparent window TW may be opened, thereby allowing access to the interior of the roller housing 920 from the outside. Optionally, a transparent protective member such as glass or plastic may be provided in the transparent window TW to protect the interior of the roller housing 920.

[0668] When the display panel 300" is rolled up around the first roller ROL1, the portion of the display panel 300" visible through the transparent window TW of the roller housing 920 can be defined as the sensor area SA. When the display panel 300" is unfolded, the sensor area SA can be located in the central region of the display panel 300" and adjacent to its upper side.

[0669] Because the sensor area SA includes both display pixels and sensor pixels, it can display images and also sense light from the outside. For example, the sensor area SA can be used as one of an optical fingerprint sensor, an illuminance sensor, and an optical proximity sensor.

[0670] When the lower surface of the display panel 300" is connected to the first roller ROL1, the sensor area SA of the display panel 300" can display an image on the upper surface of the display panel 300" when the display panel 300" is rolled up and unfolded, and light incident on the upper surface of the display panel 300" can be sensed. On the other hand, when the upper surface of the display panel 300" is connected to the first roller ROL1, the sensor area SA of the display panel 300" can display an image on the upper surface of the display panel 300" when the display panel 300" is unfolded, and can sense light incident from the upper surface, while the sensor area SA of the display panel 300" can display an image on the lower surface of the display panel 300" when the display panel 300" is rolled up, and can sense light incident from the lower surface of the display panel 300". For this purpose, the display pixels provided in the sensor area SA of the display panel 300" can emit light toward both the upper and lower surfaces of the display panel 300". In other words, the display panel 300" can be a dual-emission display panel that displays images on both the upper and lower surfaces. The sensor pixels located in the sensor area SA of the display panel 300" can sense light incident from the upper surface of the display panel 300" and light incident from the lower surface.

[0671] Figure 33 It is shown on the display panel as follows Figure 31 The view shown is an example of the unfolded display panel, panel support cover, first roller, and second roller. Figure 34 It is shown on the display panel as follows Figure 32The view shown is an example of a panel, panel support cover, first roller, and second roller in a curled configuration.

[0672] Figure 33 and Figure 34 This is a schematic cross-sectional view of one side of the display device 10, which includes a display panel 300", a panel support cover 400, a first roller ROL1, a second roller ROL2 and a third roller ROL3.

[0673] Reference Figure 33 and Figure 34 The display device 10 may include a panel support cover 400, a second roller ROL2, a third roller ROL3, a connecting rod 410, and a motor 420.

[0674] In order to support the display panel 300" without it being rolled around the first roller ROL1 but exposed on the upper side of the roller housing 920, a panel support cover 400 may be disposed on the lower surface of the display panel 300". For this purpose, the panel support cover 400 may comprise a material that is lightweight and may have high strength. For example, the panel support cover 400 may comprise aluminum or stainless steel.

[0675] The panel support cover 400 can be attached to / separated from the lower surface of the display panel 300". For example, the panel support cover 400 can be attached to the display panel 300" via an adhesive layer disposed on the upper surface of the panel support cover 400 facing the display panel 300". Optionally, a magnet with a first polarity can be disposed on the lower surface of the display panel 300" and a magnet with a second polarity can be disposed on the upper surface of the panel support cover 400, so that the display panel 300" can be attached to the panel support cover 400.

[0676] The second roller ROL2 can be connected to the lower end of the panel support cover 400. Therefore, when the second roller ROL2 rotates, the panel support cover 400 can be rolled up around the second roller ROL2 in the direction of rotation of the second roller ROL2.

[0677] The second roller ROL2 can be housed in the roller housing 920 and can be positioned below the first roller ROL1. The center of the second roller ROL2 can be positioned closer to the bottom surface of the roller housing 920 than the center of the first roller ROL1.

[0678] The second roller ROL2 can have a generally cylindrical or generally cylindrical shape. The second roller ROL2 can extend in the first direction (X-axis direction). The length of the second roller ROL2 in the first direction (X-axis direction) can be greater than the length of the panel support cover 400 in the first direction (X-axis direction). The diameter of the bottom surface of the second roller ROL2 can be smaller than the diameter of the bottom surface of the first roller ROL1.

[0679] The third roller ROL3 is used to separate the display panel 300" from the panel support cover 400, so that the panel support cover 400 and the display panel 300" do not interfere with each other.

[0680] The third roller ROL3 can be housed in the roller housing 920 and can be positioned below the first roller ROL1. The center of the third roller ROL3 can be positioned closer to the lower surface of the roller housing 920 than the center of the first roller ROL1.

[0681] The third roller ROL3 can have a generally cylindrical or generally columnar shape. The third roller ROL3 can extend in the first direction (X-axis direction). The length of the third roller ROL3 in the first direction (X-axis direction) can be, but is not limited to, greater than the length of the panel support cover 400 in the first direction (X-axis direction). The diameter of the bottom surface of the third roller ROL3 can be smaller than the diameter of the bottom surface of the second roller ROL2.

[0682] The force with which the display panel 300" curls around the first roller ROL1 can be greater than the adhesive force between the display panel 300" and the panel support cover 400. The force with which the panel support cover 400 curls around the second roller ROL2 can be greater than the adhesive force between the display panel 300" and the panel support cover 400.

[0683] Link 410 can be raised or lowered when the motor 420 is driven. Since link 410 is connected to the display panel 300" and the panel support cover 400, the display panel 300" and the panel support cover 400 can be raised or lowered together with link 410. For example, link 410 can be connected to the upper surface of the display panel 300" and the upper surface of the panel support cover 400.

[0684] The motor 420 can apply physical force to the connecting rod 410 to raise or lower the connecting rod 410. The motor 420 can be a device that receives electrical signals and converts them into physical force.

[0685] like Figure 34 As shown, with the display panel 300" rolled around the first roller ROL1, the sensor area SA can be seen through the transparent window TW of the roller housing 920. Figure 33 and Figure 34In the example shown, the upper surface of the display panel 300" is connected to the first roller ROL1. In this case, the sensor area SA of the display panel 300" can display an image on the upper surface of the display panel 300" and can sense light incident from the upper surface of the display panel 300" when the display panel 300" is unfolded. On the other hand, the sensor area SA of the display panel 300" can display an image on the lower surface of the display panel 300" and can sense light incident from the lower surface of the display panel 300" when the display panel 300" is rolled up.

[0686] Figure 35 It is shown Figure 33 and Figure 34 A plan view of examples of display pixels and sensor pixels in the sensor area. Figure 36 It is shown Figure 34 A schematic cross-sectional view of examples of display pixels and sensor pixels in the sensor area. Figure 36 It shows along Figure 35 A schematic cross-sectional view of the first transmission region RE, the second transmission region GE, and the third transmission region BE, taken by line V-V'.

[0687] Figure 35 and Figure 36 Implementation examples and Figure 11 and Figure 15 The difference in the embodiments may be that the first transmission region RE may include a first top transmission region TRE and a first bottom transmission region BRE, the second transmission region GE may include a second top transmission region TGE and a second bottom transmission region BGE, and the third transmission region BE may include a third top transmission region TBE and a third bottom transmission region BBE.

[0688] Reference Figure 35 and Figure 36 The first top emitting region (TRE) emits light of a first color toward the upper surface of the display panel 300". The first bottom emitting region (BRE) emits light of a first color toward the lower surface of the display panel 300". The second top emitting region (TGE) emits light of a second color toward the upper surface of the display panel 300". The second bottom emitting region (BGE) emits light of a second color toward the lower surface of the display panel 300". The third top emitting region (TBE) emits light of a third color toward the upper surface of the display panel 300". The third bottom emitting region (BBE) emits light of a third color toward the lower surface of the display panel 300".

[0689] The first light-emitting electrode 171 may include a first auxiliary light-emitting electrode 171a and a second auxiliary light-emitting electrode 171b. The first auxiliary light-emitting electrode 171a may be disposed on the second organic layer 160. A portion of the second auxiliary light-emitting electrode 171b may be disposed on the second organic layer 160, and another portion may be disposed on the first auxiliary light-emitting electrode 171a. The first auxiliary light-emitting electrode 171a may be disposed in each of the first top emitting region TRE, the second top emitting region TGE, and the third top emitting region TBE. The second auxiliary light-emitting electrode 171b may be formed in each of the first top emitting region TRE, the second top emitting region TGE, the third top emitting region TBE, the first bottom emitting region BRE, the second bottom emitting region BGE, and the third bottom emitting region BBE. A partition 180 may be disposed at the edge of the first auxiliary light-emitting electrode 171a and the edge of the second auxiliary light-emitting electrode 171b.

[0690] The first auxiliary light-emitting electrode 171a and the second auxiliary light-emitting electrode 171b may comprise different materials. The first auxiliary light-emitting electrode 171a may be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or may be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and ITO (ITO / APC / ITO) to increase reflectivity. The second auxiliary light-emitting electrode 171b may be made of a transparent conductive material that can transmit light (such as ITO and IZO).

[0691] The emitting layer 172 can be disposed on the second auxiliary light-emitting electrode 171b. The second light-emitting electrode 173 can be disposed on the emitting layer 172. The second light-emitting electrode 173 can be made of a transparent conductive material that can transmit light (such as ITO and IZO).

[0692] The reflective electrode 179 can be disposed on the second light-emitting electrode 173. The reflective electrode 179 can be disposed in each of the first bottom emitting region BRE, the second bottom emitting region BGE, and the third bottom emitting region BBE. The reflective electrode 179 can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO) to increase reflectivity.

[0693] like Figure 35 and Figure 36As shown, in the first top emitting region TRE, the second top emitting region TGE, and the third top emitting region TBE, light emitted from the emitting layer 172 can be reflected by the first auxiliary light-emitting electrode 171a with high reflectivity, can pass through the transparent second light-emitting electrode 173, and can be emitted toward the upper surface of the display panel 300". In the first bottom emitting region BRE, the second bottom emitting region BGE, and the third bottom emitting region BBE, light emitted from the emitting layer 172 can be reflected by the reflective electrode 179 with high reflectivity, can pass through the transparent second auxiliary light-emitting electrode 171b, and can be emitted toward the lower surface of the display panel 300". Therefore, the display panel 300" can be a dual-emitting display panel that outputs light through its upper and lower surfaces.

[0694] exist Figure 15 In this configuration, when the first light-emitting electrode 171 is made of a transparent conductive material (TCO) that transmits light, such as ITO or IZO, light emitted from the emitting layer 172 can pass through the first light-emitting electrode 171 and be emitted toward the lower surface of the display panel 300", and can also pass through the second light-emitting electrode 173 and be emitted toward the upper surface of the display panel 300". In this case, the display panel 300" can be a dual-emitting display panel that outputs light through its upper and lower surfaces.

[0695] Figure 37 This is a plan view showing the display pixels in the display area according to an embodiment. Figure 38 This is a plan view showing the display pixels and sensor pixels in the sensor area according to an embodiment. Figure 39 It is shown Figure 37 A magnified view of the display area. Figure 40 It is shown Figure 38 A magnified view of the sensor area in the image. Figure 41 This is a view showing the layout of display pixels and sensor pixels in a sensor area according to another embodiment. Figure 42 This is a view showing the layout of display pixels and sensor pixels in a sensor area according to another embodiment.

[0696] Figures 37 to 40 The display area and sensor area of ​​an inorganic light-emitting display panel are shown. The inorganic light-emitting display panel uses inorganic light-emitting devices including inorganic semiconductors.

[0697] Reference Figures 37 to 40 The display area DA may include the display pixel group PXG. The sensor area SA may include sensor pixels SP and the display pixel group PXG.

[0698] Each display pixel group PXG may include a first display pixel DP1, a second display pixel DP2, and a third display pixel DP3. The first display pixel DP1 may include a light-emitting element 175 capable of emitting a first light, the second display pixel DP2 may include a light-emitting element 175 capable of emitting a second light, and the third display pixel DP3 may include a light-emitting element 175 capable of emitting a third light.

[0699] like Figure 37 and Figure 39 As shown, in the display area DA, the first display pixel DP1, the second display pixel DP2, and the third display pixel DP3 can be arranged or set sequentially and repeatedly in the first direction (X-axis direction). The first display pixel DP1 can be arranged or set side by side in the second direction (Y-axis direction), the second display pixel DP2 can be arranged or set side by side in the second direction (Y-axis direction), and the third display pixel DP3 can be arranged or set side by side in the second direction (Y-axis direction).

[0700] Figures 37 to 40 It is shown that three sensor pixels SP arranged or positioned in a first direction (X-axis direction) are defined as a single sensor pixel group SXG. However, it will be understood that the disclosure is not limited thereto. The sensor pixel group SXG may include at least one sensor pixel SP. The sensor pixel group SXG may be surrounded by a display pixel group PXG.

[0701] In the case where the sensor region SA is the area that senses externally incident light to identify the fingerprint of a human finger F, the number of sensor pixels SP can be less than the number of first display pixels DP1, second display pixels DP2, and third display pixels DP3 in the sensor region SA. Since the distance between the ridges RID of the fingerprint of a human finger F can be approximately 100 μm to 150 μm, the sensor pixel group SXG can be spaced apart from each other by approximately 100 μm to 450 μm in the first direction (X-axis direction) and the second direction (Y-axis direction).

[0702] like Figures 38 to 40 As shown, the area of ​​each display pixel group PXG can be substantially equal to the area of ​​each sensor pixel group SXG. However, it will be understood that the disclosure is not limited thereto. For example, as Figure 41 As shown, the area of ​​the sensor pixel group SXG can be smaller than the area of ​​the display pixel group PXG. In this case, the compensation display pixel group CPXG can be located in the remaining area besides the sensor pixel group SXG. The area of ​​the compensation display pixel group CPXG can vary depending on the area of ​​the sensor pixel group SXG. As the area of ​​the sensor pixel group SXG increases, the area of ​​the compensation display pixel group CPXG can decrease.

[0703] Each of the display pixels DP1, DP2 and DP3 may include a first light-emitting electrode 171, a second light-emitting electrode 173, a light-emitting contact electrode 174 and a light-emitting element 175.

[0704] The first light-emitting electrode 171 may be a pixel electrode disposed in each of the display pixels DP1, DP2 and DP3, while the second light-emitting electrode 173 may be a common electrode connected throughout the display pixels DP1, DP2 and DP3. Optionally, the first light-emitting electrode 171 may be the anode electrode of the light-emitting element 175, while the second light-emitting electrode 173 may be the cathode electrode of the light-emitting element 175.

[0705] The first light-emitting electrode 171 and the second light-emitting electrode 173 may include: electrode trunks 171S and 173S, extending in a first direction (X-axis direction); and one or more electrode branches 171B and 173B, branching from the electrode trunks 171S and 173S and extending in a second direction (Y-axis direction) intersecting the first direction (X-axis direction).

[0706] The first light-emitting electrode 171 may include: a first electrode trunk 171S extending in a first direction (X-axis direction); and at least one first electrode branch 171B branching from the first electrode trunk 171S and extending in a second direction (Y-axis direction).

[0707] The first electrode backbone 171S of the display pixel can be electrically separated from the first electrode backbone 171S of another display pixel adjacent to the display pixel in the first direction (X-axis direction). The first electrode backbone 171S of the display pixel can be spaced apart from the first electrode backbone 171S of another display pixel adjacent to the display pixel in the first direction (X-axis direction). The first electrode backbone 171S can be electrically connected to the thin-film transistor through the first electrode contact hole CNTD.

[0708] The first electrode branch 171B can be electrically separated from the second electrode main branch 173S in the second direction (Y-axis direction). The first electrode branch 171B can be spaced apart from the second electrode main branch 173S in the second direction (Y-axis direction).

[0709] The second light-emitting electrode 173 may include: a second electrode trunk 173S extending in a first direction (X-axis direction); and a second electrode branch 173B branching from the second electrode trunk 173S and extending in a second direction (Y-axis direction).

[0710] like Figure 38As shown, the second light-emitting electrode 173 of the display pixel group PXG can be configured to bypass the sensor pixel group SXG. The second light-emitting electrode 173 of the display pixel group PXG can be electrically separated from the first light-receiving electrode PCE of the sensor pixel group SXG. The second light-emitting electrode 173 of the display pixel group PXG can be spaced apart from the first light-receiving electrode PCE of the sensor pixel group SXG.

[0711] The second electrode backbone 173S of the display pixel can be electrically connected to the second electrode backbone 173S of another display pixel adjacent to the display pixel in the first direction (X-axis direction). The second electrode backbone 173S can traverse display pixels DP1, DP2 and DP3 in the first direction (X-axis direction).

[0712] The second electrode branch 173B can be spaced apart from the first electrode main branch 171S in the second direction (Y-axis direction). The second electrode branch 173B can also be spaced apart from the first electrode branch 171B in the first direction (X-axis direction). The second electrode branch 173B can be positioned between the first electrode branches 171B in the first direction (X-axis direction).

[0713] although Figures 37 to 40 The diagram shows the first electrode branch 171B and the second electrode branch 173B extending in a second direction (Y-axis direction), but the disclosure is not limited thereto. For example, each of the first electrode branch 171B and the second electrode branch 173B may be partially bent or folded, and as shown... Figure 42 As shown, one electrode can surround another electrode. Figure 42 In the example shown, the second light-emitting electrode 173 may have a generally circular shape, and the first light-emitting electrode 171 surrounds the second light-emitting electrode 173. A generally annular hole HOL may be formed between the first light-emitting electrode 171 and the second light-emitting electrode 173, and the second light-emitting electrode 173 receives the cathode voltage through the second electrode contact hole CNTS. The shapes of the first electrode branch 171B and the second electrode branch 173B are not particularly limited, as long as the first light-emitting electrode 171 and the second light-emitting electrode 173 are at least partially spaced apart from each other, so that the light-emitting element 175 can be disposed in the space between the first light-emitting electrode 171 and the second light-emitting electrode 173.

[0714] The light-emitting element 175 can be disposed between the first light-emitting electrode 171 and the second light-emitting electrode 173. One end of the light-emitting element 175 can be electrically connected to the first light-emitting electrode 171, and the other end can be electrically connected to the second light-emitting electrode 173. The light-emitting elements 175 can be spaced apart from each other. The light-emitting elements 175 can be arranged or disposed substantially parallel to each other.

[0715] Within the spirit and scope of this disclosure, the light-emitting element 175 may have a shape that is, for example, generally a rod, a wire, or a tube. For example, as Figure 39 As shown, the light-emitting element 175 can be formed in a generally cylindrical or generally rod-shaped form. It will be understood that the shape of the light-emitting element 175 is not limited to these. The light-emitting element 175 can have a generally polygonal prism shape such as a cube, cuboid, or hexagonal prism, or it can have a shape that can extend in one direction with a partially inclined outer surface. The length h of the light-emitting element 175 can be in the range of about 1 μm to about 10 μm or in the range of about 2 μm to about 6 μm, for example, in the range of about 3 μm to about 5 μm. The diameter of the light-emitting element 175 can be in the range of about 300 nm to about 700 nm, and the aspect ratio of the light-emitting element 175 can be in the range of about 1.2 to about 100.

[0716] Each light-emitting element 175 of the first display pixel DP1 can emit a first light, each light-emitting element 175 of the second display pixel DP2 can emit a second light, and each light-emitting element 175 of the third display pixel DP3 can emit a third light. The first light can be red light with a center wavelength band in the range of 620nm to 752nm, the second light can be green light with a center wavelength band in the range of 495nm to 570nm, and the third light can be blue light with a center wavelength band in the range of 450nm to 495nm. Optionally, the light-emitting elements 175 of the first display pixel DP1, the second display pixel DP2, and the third display pixel DP3 can emit light of substantially the same color.

[0717] The light-emitting contact electrode 174 may include a first contact electrode 174a and a second contact electrode 174b. The first contact electrode 174a and the second contact electrode 174b may have a shape that extends in a second direction (Y-axis direction).

[0718] The first contact electrode 174a can be disposed on and electrically connected to the first electrode branch 171B. The first contact electrode 174a can contact one end of the light-emitting element 175. The first contact electrode 174a can be disposed between the first electrode branch 171B and the light-emitting element 175. Therefore, the light-emitting element 175 can be electrically connected to the first light-emitting electrode 171 through the first contact electrode 174a.

[0719] The second contact electrode 174b can be disposed on and electrically connected to the second electrode branch 173B. The second contact electrode 174b can contact the other end of the light-emitting element 175. The second contact electrode 174b can be disposed between the second electrode branch 173B and the light-emitting element 175. Therefore, the light-emitting element 175 can be electrically connected to the second light-emitting electrode 173 through the second contact electrode 174b.

[0720] The width (or length in the first direction (X-axis direction)) of the first contact electrode 174a can be greater than the width (or length in the first direction (X-axis direction) of the first electrode branch 171B, and the width (or length in the first direction (X-axis direction)) of the second contact electrode 174b can be greater than the width (or length in the first direction (X-axis direction) of the second electrode branch 173B.

[0721] The outer partition 430 can be disposed between the display pixels DP1, DP2, and DP3 and the sensor pixel SP. The outer partition 430 can extend in a second direction (Y-axis direction). The length of each of the display pixels DP1, DP2, and DP3 in the first direction (X-axis direction) can be defined as the distance between the outer partitions 430.

[0722] Each sensor pixel SP may include a first light-receiving electrode PCE, a second light-receiving electrode PAE, a light-receiving contact electrode 176, and a light-receiving element PD.

[0723] Each of the first optical receiving electrode PCE and the second optical receiving electrode PAE can be a common electrode that extends throughout the sensor pixel SP connection. The first optical receiving electrode PCE and the second optical receiving electrode PAE can each include electrode trunks 171S and 173S and one or more electrode branches 171B and 173B.

[0724] The electrode trunks 171S and 173S of the first light receiving electrode PCE and the second light receiving electrode PAE, as well as the electrode branches 171B and 173B, are basically the same as the electrode trunks 171S and 173S of the first light emitting electrode 171 and the second light emitting electrode 173, as well as the electrode branches 171B and 173B; therefore, redundant descriptions will be omitted.

[0725] Similar to Figure 42In the example shown, the first photoreceiving electrode PCE can have a generally circular shape, and the second photoreceiving electrode PAE surrounds the first photoreceiving electrode PCE. A generally annular hole HOL can be formed between the first photoreceiving electrode PCE and the second photoreceiving electrode PAE, and the first photoreceiving electrode PCE receives the cathode voltage through the second electrode contact hole CNTS. The shapes of the first photoreceiving electrode PCE and the second photoreceiving electrode PAE are not particularly limited, as long as they are at least partially spaced apart from each other, allowing the photoreceiving element PD to be disposed in the space between the first photoreceiving electrode PCE and the second photoreceiving electrode PAE.

[0726] An optical receiver element (PD) can be disposed between a first optical receiver electrode (PCE) and a second optical receiver electrode (PAE). One end of the optical receiver element (PD) can be electrically connected to the first optical receiver electrode (PCE), and the other end can be electrically connected to the second optical receiver electrode (PAE). The optical receiver elements (PDs) can be spaced apart from each other. The optical receiver elements (PDs) can be arranged or disposed substantially parallel to each other.

[0727] The light-receiving contact electrode 176 may include a first contact electrode 176a and a second contact electrode 176b. The first contact electrode 176a and the second contact electrode 176b of the light-receiving contact electrode 176 are the same as the first contact electrode 174a and the second contact electrode 174b of the light-emitting contact electrode 174; therefore, redundant descriptions will be omitted.

[0728] Figure 43 It is shown in detail Figure 39 A perspective view of an example of a light-emitting element.

[0729] Reference Figure 43 Each light-emitting element 175 may include a first semiconductor layer 175a, a second semiconductor layer 175b, an active layer 175c, an electrode layer 175d, and an insulating layer 175e.

[0730] The first semiconductor layer 175a may be, for example, an n-type semiconductor having a first conductivity type. The first semiconductor layer 175a may be one or more of n-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. For example, in the case where the light-emitting element 175 emits light in the blue wavelength band, the first semiconductor layer 175a may comprise a semiconductor material having the following chemical formula: Al x Ga y In 1-x-y N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). The first semiconductor layer 175a may be doped with a dopant of a first conductivity type, such as Si, Ge, and Sn. For example, the first semiconductor layer 175a may be n-GaN doped with n-type Si.

[0731] The second semiconductor layer 175b can be a semiconductor of a second conductivity type, such as a p-type semiconductor. The second semiconductor layer 175b can be one or more of p-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. For example, in the case where the light-emitting element 175 emits light in the blue or green wavelength band, the second semiconductor layer 175b can include a semiconductor material having the following chemical formula: Al x Ga y In 1-x-y N(0≤x≤1, 0≤y≤1, 0≤x+y≤1). The second semiconductor layer 175b may be doped with a dopant of a second conductivity type, such as Mg, Zn, Ca, Se, and Ba. According to an embodiment, the second semiconductor layer 175b may be p-GaN doped with p-type Mg.

[0732] An active layer 175c is disposed between a first semiconductor layer 175a and a second semiconductor layer 175b. The active layer 175c may comprise a material having a single quantum well structure or a multiple quantum well structure. When the active layer 175c comprises a material having a multiple quantum well structure, the quantum layers and well layers may be alternately stacked in this structure. Optionally, the active layer 175c may have a structure in which semiconductor materials with large bandgap energy and semiconductor materials with small bandgap energy are alternately stacked on top of each other, and may include other group III to group V semiconductor materials depending on the wavelength range of the emitted light.

[0733] In response to an electrical signal applied through the first semiconductor layer 175a and the second semiconductor layer 175b, the active layer 175c can emit light when electron-hole pairs recombine therein. The light emitted from the active layer 175c is not limited to light in the blue wavelength band. The active layer 175c can emit light in the red or green wavelength band. For example, in the case where the active layer 175c emits light in the blue wavelength band, the active layer 175c can comprise materials such as AlGaN and AlGaInN. In the case where the active layer 175c has a multi-quantum-well structure in which quantum layers and well layers are alternately stacked on top of each other, the quantum layers can comprise AlGaN or AlGaInN, and the well layers can comprise materials such as GaN and AlGaN. For example, the active layer 175c comprises AlGaInN as a quantum layer and AlInN as a well layer, and as described above, the active layer 175c can emit blue light with a center wavelength band of 450 nm to 495 nm.

[0734] Light emitted from the active layer 175c can not only pass through the outer surface of the light-emitting element 175 in the radial direction, but also exit through both side surfaces. For example, light emitted from the active layer 175c can propagate in a direction not limited to one.

[0735] Electrode layer 175d can be an ohmic contact electrode or a Schottky contact electrode. The light-emitting element 175 may include at least one electrode layer 175d. When the light-emitting element 175 is electrically connected to the first light-emitting electrode 171 or the second light-emitting electrode 173, the resistance between the light-emitting element 175 and the first light-emitting electrode 171 or between the light-emitting element 175 and the second light-emitting electrode 173 can be reduced due to electrode layer 175d. Electrode layer 175d may include at least one of the following: aluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag), indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). Electrode layer 175d may include a semiconductor material doped with n-type or p-type impurities. Electrode layer 175d may include the same or similar materials, or may include different materials. However, it will be understood that the disclosure is not limited thereto.

[0736] An insulating layer 175e is configured to surround the outer surfaces of the first semiconductor layer 175a, the second semiconductor layer 175b, the active layer 175c, and the electrode layer 175d. The insulating layer 175e protects the first semiconductor layer 175a, the second semiconductor layer 175b, the active layer 175c, and the electrode layer 175d. The insulating layer 175e can be formed to expose both ends of the light-emitting element 175 in the longitudinal direction. For example, one end of the first semiconductor layer 175a and one end of the electrode layer 175d may not be covered by or overlapped with the insulating layer 175e, but may be exposed. The insulating layer 175e may cover only a portion of the outer surface of the first semiconductor layer 175a and a portion of the second semiconductor layer 175b, or may overlap only a portion of the outer surface of the first semiconductor layer 175a and a portion of the second semiconductor layer 175b, or may cover only a portion of the outer surface of the electrode layer 175d or overlap only a portion of the outer surface of the electrode layer 175d.

[0737] Insulating layer 175e may include materials with insulating properties, such as silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y The active layer 175c contains aluminum nitride (AlN) and aluminum oxide (Al2O3). Therefore, it is possible to prevent electrical short circuits that may occur when the active layer 175c comes into contact with the first light-emitting electrode 171 and the second light-emitting electrode 173 to which electrical signals are transmitted. Since the insulating layer 175e protects the outer surface of the light-emitting element 175, including the active layer 175c, a reduction in luminous efficiency can be avoided.

[0738] The optical receiving element PD can be substantially the same as the light emitting element 175; therefore, redundant descriptions will be omitted.

[0739] Figure 44 It is shown Figure 39 A schematic cross-sectional view showing an example of pixels. Figure 45 It is shown Figure 40 A schematic cross-sectional view of an example of sensor pixels. Figure 44 It shows along Figure 39 A schematic cross-section of the first display pixel DP1 taken from line VI-VI'. Figure 45 It shows along Figure 40 A schematic cross-section of a portion of the sensor pixel SP, taken by line VII-VII'.

[0740] Reference Figure 44 and Figure 45 The display layer DISL may include a thin film transistor layer (TFTL), an emissive material layer (EML), and an encapsulation layer (TFEL) disposed on a substrate (SUB). Figure 44 and Figure 45 The thin-film transistor layer (TFTL) can be compared with the above reference. Figure 15 The descriptions of thin-film transistor (TFTL) layers are essentially the same.

[0741] The emitting material layer EML may include a first inner septum 410, a second inner septum 420, a first light-emitting electrode 171, a second light-emitting electrode 173, a light-emitting contact electrode 174, a light-emitting element 175, a light-receiving element PD, a first light-receiving electrode PCE, a second light-receiving electrode PAE, a light-receiving contact electrode 176, a first insulating layer 181, a second insulating layer 182, and a third insulating layer 183.

[0742] A first inner dam 410, a second inner dam 420, and an outer dam 430 may be disposed on the second organic layer 160. The first inner dam 410, the second inner dam 420, and the outer dam 430 may protrude from the upper surface of the second organic layer 160. The first inner dam 410, the second inner dam 420, and the outer dam 430 may have, but are not limited to, a generally trapezoidal cross-sectional shape. Each of the first inner dam 410, the second inner dam 420, and the outer dam 430 may include a lower surface in contact with the upper surface of the second organic layer 160, an upper surface opposite to the lower surface, and a side surface between the upper and lower surfaces. The side surfaces of the first inner dam 410, the second inner dam 420, and the outer dam 430 may be inclined.

[0743] The first inner partition 410 may be spaced apart from the second inner partition 420. The first inner partition 410 and the second inner partition 420 may be implemented as organic layers such as acrylic resin layers, epoxy resin layers, phenolic resin layers, polyamide resin layers and polyimide resin layers.

[0744] The first electrode branch 171B can be disposed on the first inner partition 410, and the second electrode branch 173B can be disposed on the second inner partition 420. The first electrode branch 171B can be electrically connected to the first electrode main branch 171S, and the first electrode main branch 171S can be electrically connected to the second electrode D6 of the sixth transistor ST6 in the first electrode contact hole CNTD. Therefore, the first light-emitting electrode 171 can receive voltage from the second electrode D6 of the sixth transistor ST6.

[0745] The first light-emitting electrode 171 and the second light-emitting electrode 173 may comprise conductive materials with high reflectivity. For example, the first light-emitting electrode 171 and the second light-emitting electrode 173 may comprise metals such as silver (Ag), copper (Cu), and aluminum (Al). Therefore, some light emitted from the light-emitting element 175 and traveling toward the first light-emitting electrode 171 and the second light-emitting electrode 173 is reflected by the first light-emitting electrode 171 and the second light-emitting electrode 173, allowing it to travel toward the upper side of the light-emitting element 175.

[0746] The first insulating layer 181 can be disposed on the first light-emitting electrode 171, the second light-receiving electrode PAE, and the second electrode branch 173B. The first insulating layer 181 can cover the first electrode backbone 171S, the first electrode branch 171B disposed on the side surface of the first inner partition 410, and the second electrode branch 173B disposed on the side surface of the second inner partition 420, or can be superimposed on the first electrode backbone 171S, the first electrode branch 171B disposed on the side surface of the first inner partition 410, and the second electrode branch 173B disposed on the side surface of the second inner partition 420. The first electrode branch 171B disposed on the upper surface of the first inner partition 410 and the second electrode branch 173B disposed on the upper surface of the second inner partition 420 may not be covered by the first insulating layer 181 or superimposed on the first insulating layer 181, and can be exposed. The first insulating layer 181 can be disposed on the outer partition 430. The first insulating layer 181 may be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0747] The light-emitting element 175 and the light-receiving element PD can be disposed on the first insulating layer 181 disposed between the first inner partition 410 and the second inner partition 420. One end of the light-emitting element 175 and one end of the light-receiving element PD can be disposed adjacent to the first inner partition 410, while the other end can be disposed adjacent to the second inner partition 420.

[0748] The second insulating layer 182 can be disposed on the light-emitting element 175 and the light-receiving element PD. The second insulating layer 182 can be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0749] The first contact electrode 174a can be disposed on the first electrode branch 171B and can be in electrical contact with one end of the light-emitting element 175. The first electrode branch 171B can be exposed without being covered by the first insulating layer 181 or without being superimposed on the first insulating layer 181. The first contact electrode 174a can also be disposed on the second insulating layer 182.

[0750] The first contact electrode 176a can be disposed on the first electrode branch 171B and can be in electrical contact with one end of the photoreceiving element PD. The first electrode branch 171B can be exposed without being covered by the first insulating layer 181 or without being superimposed on the first insulating layer 181. The first contact electrode 176a can also be disposed on the second insulating layer 182.

[0751] A third insulating layer 183 may be disposed on the first contact electrode 174a and the first contact electrode 176a. The third insulating layer 183 may cover or overlap with the first contact electrode 174a to electrically separate the first contact electrode 174a from the second contact electrode 174b. The third insulating layer 183 may also cover or overlap with the first contact electrode 176a to electrically separate the first contact electrode 176a from the second contact electrode 176b. The third insulating layer 183 may be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0752] The second contact electrode 174b can be disposed on the second electrode branch 173B and can be in electrical contact with the other end of the light-emitting element 175. The second electrode branch 173B can be exposed without being covered by the first insulating layer 181 or without being superimposed on the first insulating layer 181. The second contact electrode 174b can also be disposed on the second insulating layer 182 and the third insulating layer 183.

[0753] The second contact electrode 176b can be disposed on the second electrode branch 173B and can be in electrical contact with the other end of the photoreceiving element PD. The second electrode branch 173B can be exposed without being covered by the first insulating layer 181 or without being superimposed on the first insulating layer 181. The second contact electrode 176b can also be disposed on the second insulating layer 182 and the third insulating layer 183.

[0754] like Figures 37 to 45 As shown, in addition to display pixels DP1, DP2, and DP3, the sensor area SA of the display panel 300 may also include sensor pixels SP. Therefore, light incident on the upper surface of the display panel 300 can be sensed by the sensor pixels SP of the display panel 300.

[0755] Figure 46 and Figure 47 This is a bottom view showing the display panel according to an embodiment. Figure 48 This is a schematic cross-sectional view showing the cover window and display panel of the display device according to an embodiment.

[0756] Figure 46 The bottom view shows the display panel 300 and display circuit board 310 with the auxiliary area SBA of the display panel 300 unfolded instead of bent. Figure 47 The bottom view shows the display panel 300 and display circuit board 310 with the auxiliary area SBA of the display panel 300 bent so that it is positioned below or below the lower surface of the display panel 300. Figure 48 A schematic cross-sectional view shows along Figure 47 Example of the cover window 100 and display panel 300 cut off by line VIII-VIII'.

[0757] Reference Figures 46 to 48 The bottom cover PB of the display panel 300 includes a cover hole PBH that penetrates the bottom cover PB to expose the substrate SUB of the display panel 300. The bottom cover PB may include an opaque material that does not transmit light, such as a heat dissipation unit. Therefore, the optical sensor 510 can be disposed in the cover hole PBH on the lower surface of the substrate SUB, so that light above the display panel 300 can reach the optical sensor 510 disposed below or beneath the display panel 300.

[0758] The optical sensor 510 may include sensor pixels, each sensor pixel including a light-receiving element for detecting light. For example, the optical sensor 510 may be an optical fingerprint sensor, an illuminance sensor, or an optical proximity sensor. The sensor pixels of the optical sensor 510 may be as described above. Figure 14 The sensor pixels described are basically the same.

[0759] exist Figures 46 to 48 In the example shown, when the auxiliary region SBA of the display panel 300 is bent and positioned below or beneath the lower surface of the display panel 300, the optical sensor 510 is stacked with the display circuit board 310 in the thickness direction (Z-axis direction) of the display panel 300. However, it will be understood that the disclosure is not limited thereto. When the auxiliary region SBA of the display panel 300 is bent and positioned below or beneath the lower surface of the display panel 300, the optical sensor 510 may not be stacked with the display circuit board 310 in the thickness direction (Z-axis direction) of the display panel 300. In other words, the position of the optical sensor 510 is not limited to... Figures 46 to 48 The location shown in the figure is not the same, but it can be set anywhere below or under the display panel 300.

[0760] like Figures 46 to 48As shown, when the optical sensor 510 is disposed in the cover hole PBH in the sensor area SA of the panel bottom cover PB of the display panel 300, the light incident on the display panel 300 and passing through it is not blocked by the panel bottom cover PB. Therefore, even if the optical sensor 510 is disposed below or under the display panel 300, the light incident on the display panel 300 and passing through the display panel 300 can be sensed.

[0761] Figure 49 It is shown Figure 46 An enlarged bottom view of an example of the sensor area of ​​the display panel.

[0762] Reference Figure 49 The sensor region SA may include an optical sensor region LSA in which an optical sensor 510 is disposed, and an alignment pattern region AMA disposed around the optical sensor region LSA.

[0763] When viewed from the bottom, the optical sensor region LSA can have a shape substantially consistent with the shape of the optical sensor 510. For example, in... Figure 49 As shown, when viewed from the bottom, the optical sensor 510 has a generally quadrilateral shape, and the optical sensor region LSA can also have a generally quadrilateral shape. Alternatively, when viewed from the bottom, when the optical sensor 510 has a polygonal shape, circular shape, or elliptical shape other than a quadrilateral shape, the optical sensor region LSA can also have a polygonal shape, circular shape, or elliptical shape other than a quadrilateral shape.

[0764] The alignment pattern area (AMA) can be set to surround the optical sensor area (LSA). For example, the alignment pattern area (AMA) can be as follows: Figure 49 The diagram shows a window frame shape. The alignment pattern area AMA may include an alignment pattern AM, a light-blocking pattern LB, and an inspection pattern IL. The alignment pattern AM, light-blocking pattern LB, and inspection pattern IL may be, but are not limited to, opaque metallic patterns.

[0765] The alignment pattern AM can be used to align the optical sensor 510 to attach it to the optical sensor region LSA. For example, the alignment pattern AM can be identified by an alignment detection device such as a camera, so that the alignment pattern AM can accurately align the optical sensor 510 when it is attached to the lower surface of the substrate SUB.

[0766] The alignment pattern AM can be positioned around or adjacent to the optical sensor 510. For example, as... Figure 49As shown, the alignment pattern AM can be set at the corners of the sensor area SA. However, it will be understood that the disclosure is not limited thereto. The alignment pattern AM can be set at both corners of the sensor area SA.

[0767] Each alignment pattern AM may not be superimposed on the optical sensor 510 in the third direction (Z-axis direction), but the disclosure is not limited thereto. For example, a portion of each alignment pattern AM may be superimposed on the optical sensor 510 in the third direction (Z-axis direction).

[0768] exist Figure 49 In this context, each alignment pattern AM can have a roughly cross-shaped form, but the shape of each alignment pattern AM is not limited to this. For example, as... Figure 50 As shown, each alignment pattern AM can have an L-shape that can be bent at least once when viewed from the bottom.

[0769] The light-blocking pattern LB can be disposed between alignment patterns AM in the first direction (X-axis direction) and between alignment patterns AM in the second direction (Y-axis direction). Since the sensor area SA corresponds to the cover hole PBH formed by removing a portion of the panel bottom cover PB, light can pass through the cover hole PBH and be introduced into the display layer DISL of the display panel 300. For example, if light is incident on the alignment pattern area AMA where the optical sensor 510 is not disposed in the cover hole PBH, the optical sensor 510 can be perceived as a stain from above the display panel 300. Therefore, by blocking the light incident on the alignment pattern area AMA with the light-blocking pattern LB, it is possible to prevent the optical sensor 510 from being perceived as a stain from above the display panel 300. Figure 49 As shown, the light blocking pattern LB can be spaced apart from the alignment pattern AM.

[0770] The inspection pattern IL can be used to check whether the optical sensor 510 is properly attached. The inspection pattern IL may include: a long-side inspection pattern extending along the long side of the optical sensor 510 (i.e., in the first direction (X-axis direction)); and a short-side inspection pattern extending along the short side of the optical sensor 510 (i.e., in the second direction (Y-axis direction)). Optionally, the long-side inspection pattern may be arranged or set in the second direction (Y-axis direction), and the short-side inspection pattern may be arranged or set in the first direction (X-axis direction).

[0771] Some or a predetermined number of long-side inspection patterns and some or a predetermined number of short-side inspection patterns can be superimposed on the optical sensor 510 in the third direction (Z-axis direction). Therefore, it is possible to determine whether the optical sensor 510 is correctly attached to the sensor area SA by using a camera inspection module such as a vision inspection module to check the number of long-side inspection patterns not superimposed on the optical sensor 510 and the number of short-side inspection patterns not superimposed on the optical sensor 510.

[0772] For example, after the optical sensor 510 is attached, it can be determined whether the optical sensor 510 is tilted to the left or right by comparing the number of short-side inspection patterns seen on the left side of the optical sensor 510 with the number of short-side inspection patterns seen on the right side of the optical sensor 510. For example, if the number of short-side inspection patterns seen on the left side of the optical sensor 510 is three, while the number of short-side inspection patterns seen on the right side of the optical sensor 510 is one, it can be determined that the optical sensor 510 is tilted to the right.

[0773] After the optical sensor 510 is attached, it can be determined whether the optical sensor 510 is tilted upwards or downwards by comparing the number of long-side inspection patterns seen on the upper side of the optical sensor 510 with the number of long-side inspection patterns seen on the lower side of the optical sensor 510. For example, if the number of long-side inspection patterns seen on the upper side of the optical sensor 510 is three, while the number of long-side inspection patterns seen on the lower side of the optical sensor 510 is one, it can be determined that the optical sensor 510 is tilted downwards.

[0774] Figure 51 It is shown Figure 46 A magnified bottom view of another example of the sensor area of ​​the display panel.

[0775] Reference Figure 51 Each alignment pattern AM may have an L-shape, which may bend at least once when viewed from above. The alignment pattern AM may be disposed on the outer sides of at least two sides of the optical sensor 510.

[0776] like Figure 51 As shown, the alignment pattern AM can cover most of the alignment pattern area AMA or overlap with most of the alignment pattern area AMA, thus blocking light incident on the alignment pattern area AMA. Therefore, it is possible to prevent the optical sensor 510 from being perceived as a spot from above the display panel 300. The alignment patterns AM can be spaced apart from each other.

[0777] Figure 52 It is shown Figure 48 A schematic cross-sectional view of an example of a display panel and optical sensor. Figure 52 It is shown Figure 48 Enlarged schematic cross-sectional view of region C.

[0778] Reference Figure 52 The panel bottom cover PB can be disposed on the lower surface of the base SUB. The panel bottom cover PB may include an adhesive component CTAPE, a gasket component CUS, and a heat dissipation unit HPU.

[0779] The adhesive component CTAPE can be attached to the lower surface of the substrate SUB. The upper surface of the adhesive component CTAPE, facing the lower surface of the substrate SUB, can be as follows: Figure 52 The illustration shows an embossed case where the CTAPE adhesive component can have a damping effect. The CTAPE adhesive component can be a pressure-sensitive adhesive.

[0780] The cushioning member CUS can be disposed on the lower surface of the adhesive member CTAPE. The cushioning member CUS can be attached to the lower surface of the adhesive member CTAPE. The cushioning member CUS can absorb external impacts to prevent damage to the display panel 300. The cushioning member CUS can be formed from polymer resins such as polyurethane, polycarbonate, polypropylene, and polyethylene, or it can be formed from elastic materials such as rubber and sponges obtained by foaming polyurethane or acrylic materials.

[0781] A heat dissipation unit (HPU) can be disposed on the lower surface of the padding member (CUS). The HPU can be attached to the lower surface of the padding member (CUS). The HPU may include a substrate layer (BSL), a first heat dissipation layer (HPL1), and a second heat dissipation layer (HPL2). The substrate layer (BSL) can be made of a plastic film or glass. The first heat dissipation layer (HPL1) may include graphite or carbon nanotubes to block electromagnetic waves. The second heat dissipation layer (HPL2) can be formed as a thin metal film, such as a copper film, nickel film, ferrite film, or silver film, which have excellent thermal conductivity for heat dissipation.

[0782] The panel bottom cover PB may include a cover hole PBH that penetrates the adhesive member CTAPE, the gasket member CUS, and the heat dissipation unit HPU to expose the lower surface of the substrate SUB. An optical sensor 510 may be disposed in the cover hole PBH. Therefore, the optical sensor 510 may not overlap with the panel bottom cover PB in the third direction (Z-axis direction).

[0783] A transparent adhesive member 511 can be disposed between the optical sensor 510 and the substrate SUB to attach the optical sensor 510 to the lower surface of the substrate SUB. The transparent adhesive member 511 can be an optically transparent adhesive (OCA) layer or an optically transparent resin (OCR). If the transparent adhesive member 511 is a transparent adhesive resin, it can be a thermosetting resin that can be coated onto the lower surface of the substrate SUB and then cured by heat curing. Alternatively, the transparent adhesive member 511 can be a UV-curable resin.

[0784] A pin hole array 512 can be formed between the optical sensor 510 and the transparent adhesive member 511. The pin hole array 512 may include pin holes superimposed on the light-receiving areas LE of the optical sensor 510 in the third direction (Z-axis direction). In each light-receiving area LE of the optical sensor 510, a light-receiving element PD of a sensor pixel FP can be provided. The light-receiving area LE of the optical sensor 510 receives light that has passed through the pin holes of the pin hole array 512, thus suppressing noise light incident on the light-receiving area LE of the optical sensor 510. The pin hole array 512 can be removed.

[0785] An optical sensor 510 may be disposed on the lower surface of the pin hole array 512. The optical sensor 510 may be attached to the lower surface of the pin hole array 512, and an adhesive member may be disposed between the pin hole array 512 and the optical sensor 510.

[0786] Sensor circuit board 520 can be disposed on the lower surface of optical sensor 510. Optical sensor 510 can be attached to the upper surface of sensor circuit board 520 and can be electrically connected to the wiring of sensor circuit board 520. Sensor circuit board 520 can be electrically connected to display circuit board 310. Therefore, optical sensor 510 can be electrically connected to sensor driver 340 disposed on display circuit board 310 through sensor circuit board 520. Sensor circuit board 520 can be a flexible printed circuit board.

[0787] Figure 53 It is shown Figure 52 A schematic cross-sectional view of an example of the substrate, display layer, sensor electrode layer, and light-receiving area of ​​an optical sensor in a display panel. Figure 53 It shows along Figure 49 The example shown is taken from line IX-IX', which captures the substrate SUB, display layer DISL, sensor electrode layer SENL, and light receiving area LE of optical sensor 510 of display panel 300.

[0788] Reference Figure 53The alignment pattern AM, inspection pattern IL, and light-blocking pattern LB can be disposed on the same layer and can be made of the same or similar material as the first light-blocking layer BML. For example, the alignment pattern AM, inspection pattern IL, and light-blocking pattern LB can be disposed on the first buffer layer BF1. The alignment pattern AM, inspection pattern IL, and light-blocking pattern LB can be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof. Optionally, the first light-blocking layer BML can be an organic layer including black pigment.

[0789] Each of the alignment pattern AM, inspection pattern IL, and light-blocking pattern LB in the alignment pattern region AMA can be superimposed on the corresponding active layer ACT6 in the third direction (Z-axis direction). Therefore, light incident through the substrate SUB can be blocked by the alignment pattern AM, inspection pattern IL, and light-blocking pattern LB in the alignment pattern region AMA, making it possible to prevent leakage current caused by light incident through the substrate SUB from flowing in the active layer ACT6.

[0790] Optionally, the alignment pattern AM, inspection pattern IL, and light-blocking pattern LB can be disposed on the same layer as one of the first light-blocking layer BML, active layer ACT6, gate electrode G6, first electrode S6, first connecting electrode ANDE1, and first light-emitting electrode 171, and can be made of the same or similar material as one of the first light-blocking layer BML, active layer ACT6, gate electrode G6, first electrode S6, first connecting electrode ANDE1, and first light-emitting electrode 171. Optionally, the alignment pattern AM, inspection pattern IL, and light-blocking pattern LB can be disposed on the substrate SUB, and the first buffer layer BF1 can be disposed on the alignment pattern AM, inspection pattern IL, and light-blocking pattern LB.

[0791] A predetermined voltage can be applied to the first light-blocking layer BML, the alignment pattern AM, the inspection pattern IL, and the light-blocking pattern LB. For example, Figure 13 The first power supply voltage of the first power supply voltage line VDDL shown can be applied to the first light-blocking layer BML, the alignment pattern AM, the inspection pattern IL, and the light-blocking pattern LB. In this case, the voltage applied to the first light-blocking layer BML, the alignment pattern AM, the inspection pattern IL, and the light-blocking pattern LB can be approximately 4.6V.

[0792] like Figure 53As shown, when the alignment pattern AM, inspection pattern IL, and light blocking pattern LB are disposed on the same layer as one of the first light blocking layer BML, active layer ACT6, gate electrode G6, first elect...

Claims

1. A display device, the display device comprising: A thin-film transistor layer disposed on a substrate and comprising thin-film transistors; as well as An emission material layer is disposed on the thin-film transistor layer, wherein, The emitting material layer includes: light-emitting elements, each including a first light-emitting electrode, an emitting layer, and a second light-emitting electrode; light-receiving elements, each including a first light-receiving electrode, a light-receiving semiconductor layer, and a second light-receiving electrode; a light-receiving connection electrode, wherein the light-receiving connection electrode and the first light-emitting electrode are disposed on the same layer and comprise the same material; and a first septum, disposed on the first light-emitting electrode and defining the emission area of ​​each of the light-emitting elements. The optical receiving element is mounted on the first dike.

2. The display device according to claim 1, wherein, The emission material layer further includes: A second dike is constructed on top of the first dike; and The third barrier is installed on the optical receiving element.

3. The display device according to claim 2, wherein, The first light-receiving electrode is disposed on the first dam. The light-receiving semiconductor layer is disposed on the first light-receiving electrode. The second light-receiving electrode is disposed on the light-receiving semiconductor layer and the second spacer, and The second light receiving electrode is electrically connected to the light receiving connection electrode through a contact hole, which penetrates the first and second partitions and exposes the light receiving connection electrode.

4. The display device according to claim 2, wherein, The emitting layer is disposed on the first light-emitting electrode, and The second light-emitting electrode is disposed on the emitting layer and the third barrier.

5. The display device according to claim 1, wherein, The light-receiving semiconductor layer includes: An n-type semiconductor layer is electrically connected to the first light-receiving electrode; A p-type semiconductor layer, electrically connected to the second photoreceiving electrode; and An i-type semiconductor layer is disposed between the first photoreceiving electrode and the second photoreceiving electrode in the thickness direction of the substrate.

6. The display device according to claim 5, wherein, Each of the i-type semiconductor layer and the n-type semiconductor layer comprises amorphous silicon carbide or amorphous silicon germanide, and The p-type semiconductor layer includes amorphous silicon.

7. The display device according to claim 1, wherein, The light-receiving semiconductor layer includes: An n-type semiconductor layer, electrically connected to the first light-receiving electrode; and The p-type semiconductor layer is electrically connected to the second photoreceiving electrode.

8. The display device according to claim 7, wherein, The n-type semiconductor layer comprises amorphous silicon carbide or amorphous silicon germanide, and The p-type semiconductor layer includes amorphous silicon.

9. The display device according to claim 1, wherein, The first light-emitting electrode is not stacked with the first light-receiving electrode, the light-receiving semiconductor layer, and the second light-receiving electrode in the thickness direction of the substrate, and The second light-emitting electrode is stacked with the first light-receiving electrode, the light-receiving semiconductor layer, and the second light-receiving electrode in the thickness direction of the substrate.

10. The display device according to claim 1, wherein, The first light-emitting electrode and the first light-receiving electrode comprise opaque conductive materials. The second light-emitting electrode and the second light-receiving electrode are made of transparent conductive material.

11. The display device according to claim 1, wherein, The first light-emitting electrode, the second light-emitting electrode, the first light-receiving electrode, and the second light-receiving electrode are made of transparent conductive material.

12. The display device according to claim 1, wherein, The emitting material layer also includes a reflective electrode disposed on the second light-emitting electrode and in the emitting region. The reflective electrode comprises an opaque material.

13. The display device according to claim 1, wherein, The emitting material layer includes a transmissive region that does not overlap with the emitting region of each of the light-emitting elements in the thickness direction of the substrate, and The light-receiving region of each of the light-receiving elements is located in the transmission region.

14. The display device according to claim 1, further comprising: An encapsulation layer is disposed on the emissive material layer; as well as A reflective layer is disposed on the encapsulation layer and is not superimposed on the emitting region of each of the light-emitting elements and the light-receiving region of each of the light-receiving elements in the thickness direction of the substrate.

15. The display device according to claim 1, further comprising: An encapsulation layer is disposed on the emissive material layer; as well as A reflective layer is disposed on the encapsulation layer and is not superimposed on the emitting region of each of the light-emitting elements in the thickness direction of the substrate. The reflective layer is stacked with the light-receiving region of each light-receiving element in the thickness direction of the substrate.

16. The display device according to claim 15, wherein, The reflective layer includes: A first reflective layer, which does not overlap with the light-receiving region of each of the light-receiving elements in the thickness direction of the substrate; and The second reflective layer is superimposed on the light-receiving region of each of the light-receiving elements in the thickness direction of the substrate. The thickness of the first reflective layer is greater than the thickness of the second reflective layer.

17. The display device according to claim 1, further comprising: An encapsulation layer is disposed on the emissive material layer; A sensor electrode layer is disposed on the encapsulation layer and includes sensor electrodes; A polarizing film is disposed on the sensor electrode layer; as well as A cover window is installed on the polarizing film. The polarizing film includes a light-transmitting region that is superimposed on the light-receiving element in the thickness direction of the substrate.

18. The display device according to claim 1, further comprising: The first roller causes the substrate to curl; A housing in which the first roller is housed; as well as A transmission window is located within the housing. The substrate is rolled around the first roller, and the light receiving element is stacked with the transmission window in the thickness direction of the substrate.

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