Display device

Abstract

Disclosed is a display device. The display device includes: a substrate including a display area, a first component area including a first pixel group and a first transmissive area, and a second component area including a second pixel group and a second transmissive area; a main sub-pixel provided in the display area; and an auxiliary sub-pixel provided in the first pixel group, wherein a first distance between adjacent ones of the auxiliary sub-pixels is different from a second distance between adjacent ones of the main sub-pixels.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0009395, filed on January 23, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to a display device including a transmissive region. Background Technology

[0004] In recent years, the applications of display devices have diversified. As display devices become thinner and lighter, their range of uses is gradually expanding.

[0005] As the display area of ​​display devices increases, various functions that can be combined with or associated with display devices have been added. In order to expand the display area while adding various functions, display devices with areas for displaying images while performing various functions are being researched.

[0006] It should be understood that this background section is partly intended to provide useful background for understanding the technology. However, this background section may also include ideas, concepts, or understandings that were not known or understood by a person skilled in the art prior to the corresponding valid filing date of the subject matter disclosed herein. Summary of the Invention

[0007] One or more embodiments include a display device that may include a display panel having a display area and a component area. Specifically, the component area may include a first component area and a second component area, the second component area having a transmittance different from that of the first component area. Thus, one or more embodiments include a display device in which components suitable for transmittance specifications can be arranged.

[0008] Other aspects will be set forth in part in the description which follows and will be apparent in part from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0009] According to one or more embodiments, a display device may include: a substrate; a first component region including a display area, a first component region including a first pixel group and a first transmissive area, and a second component region including a second pixel group and a second transmissive area; a main sub-pixel disposed in the display area; and auxiliary sub-pixels disposed in the first pixel group. A first distance between adjacent auxiliary sub-pixels may differ from a second distance between adjacent main sub-pixels in the main sub-pixels.

[0010] The first distance can be the distance between the centers of neighboring auxiliary sub-pixels in the auxiliary sub-pixel, and the second distance can be the distance between the centers of neighboring principal sub-pixels in the principal sub-pixel.

[0011] The area of ​​the second transmission region can be larger than the area of ​​the first transmission region.

[0012] The first distance can be less than the second distance.

[0013] The ratio of the first transmission region to the first component region can be less than the ratio of the second transmission region to the second component region.

[0014] The display device may further include a first component disposed in a first component area and a second component disposed in a second component area.

[0015] The first component and the second component can be disposed below the substrate.

[0016] The first component may include at least one of a proximity sensor and an ambient light sensor.

[0017] The second component may include at least one of a camera, a dot projector, an infrared (IR) emitter, and a time-of-flight (ToF) sensor.

[0018] The substrate may further include an opening region in which a through-hole is provided, the through-hole passing through the substrate.

[0019] The display device may further include a third component corresponding to the through-hole, the third component being disposed below the substrate.

[0020] According to one or more embodiments, a display device may include: a substrate, including a display area, a first component area including a first transmissive area and a second component area including a second transmissive area; a first component disposed in the first component area; a second component disposed in the second component area; and a sub-pixel disposed on the substrate.

[0021] The first component and the second component can be disposed below the substrate.

[0022] The first component may include at least one of a proximity sensor and an ambient light sensor.

[0023] The second component may include at least one of a camera, a dot projector, an infrared (IR) emitter, and a time-of-flight (ToF) sensor.

[0024] The area of ​​the second transmission region can be larger than the area of ​​the first transmission region.

[0025] A subpixel may include auxiliary subpixels disposed in the first component area and primary subpixels disposed in the display area. The first distance between adjacent auxiliary subpixels may differ from the second distance between adjacent primary subpixels.

[0026] The first distance can be the distance between the centers of neighboring auxiliary sub-pixels in the auxiliary sub-pixel, and the second distance can be the distance between the centers of neighboring principal sub-pixels in the principal sub-pixel.

[0027] The first distance can be less than the second distance.

[0028] The substrate may further include an opening region in which a through-hole is provided, the through-hole passing through the substrate.

[0029] The display device may further include a third component corresponding to the through-hole, the third component being disposed below the substrate and different from the first component.

[0030] The display device may further include: a gate insulating layer and a planarization layer disposed between a substrate and a sub-pixel; a first transmission hole disposed in at least one planarization layer, the first transmission hole corresponding to a first transmission region; and a second transmission hole disposed in the gate insulating layer and the planarization layer, the second transmission hole corresponding to a second transmission region. Attached Figure Description

[0031] The above and other aspects, features, and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1A This is a schematic perspective view of a display device according to an embodiment;

[0033] Figure 1B This is a schematic perspective view of a display device according to another embodiment;

[0034] Figure 2 This is a schematic cross-sectional view of a display device according to an embodiment;

[0035] Figure 3 This is a schematic plan view of the display panel according to an embodiment;

[0036] Figure 4 yes Figure 1A A schematic plan view of a portion of the first component area and the second component area;

[0037] Figure 5A This is a schematic arrangement diagram of the sub-pixels of a display device according to an embodiment;

[0038] Figure 5BThis is a schematic arrangement diagram of the sub-pixels of a display device according to another embodiment;

[0039] Figure 6 yes Figure 1A Enlarged schematic diagrams of regions C and D;

[0040] Figure 7 It is along Figure 6 A schematic cross-sectional view of the display device taken by line E-E';

[0041] Figure 8 It is along Figure 6 A schematic cross-sectional view of the display device taken by line F-F';

[0042] Figures 9A to 9C This is a schematic plan view of an example of a first to a third mask for manufacturing a display device according to an embodiment;

[0043] Figures 10A to 10C This is a schematic plan view illustrating a method for manufacturing a display device using a first mask to a third mask;

[0044] Figure 11 This is a schematic perspective view of a display device according to another embodiment; and

[0045] Figure 12 It is along Figure 11 A schematic cross-sectional view of the display device taken by line G-G'. Detailed Implementation

[0046] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, in which the same reference numerals refer to the same elements throughout. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, the embodiments are described below only with reference to the accompanying drawings to illustrate various aspects of the specification.

[0047] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. For example, “A and / or B” can be understood to mean “A, B, or A and B”. The terms “and” and “or” can be used in a combined or separate sense and can be understood as equivalent to “and / or”. Throughout this disclosure, the expression “at least one of…” is intended to include the meaning of “at least one selected from the group consisting of…”. For example, “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all a, b, and c, or variations thereof.

[0048] Because this disclosure allows for various modifications and numerous embodiments, only some embodiments will be shown in the accompanying drawings and described in detail in the written description. The effects and features of this disclosure, as well as methods for implementing this disclosure, will become apparent and more readily understood from the following description of the embodiments and the accompanying drawings. However, this disclosure is not limited to the embodiments described below and can be implemented in various forms.

[0049] It will be understood that although this document may use terms such as "first," "second," etc., to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0050] As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “the” are intended to include the plural forms as well.

[0051] It will be further understood that terms such as “comprising,” “including,” and “having” as used herein specify the presence of the stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0052] It will be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, it can be formed directly or indirectly on that other layer, region, or component. For example, intermediate layers, regions, or components may exist.

[0053] For ease of illustration, the dimensions of the elements in the accompanying drawings may be exaggerated or reduced. In other words, since the dimensions and thicknesses of the parts in the drawings may be arbitrarily shown for ease of illustration, the following embodiments are not limited thereto.

[0054] When an embodiment can be implemented differently, a particular process can be performed in an order different from the order described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0055] It will be understood that when a layer, region, or component is referred to as being "connected" to another layer, region, or component, it can be "directly connected" to the other layer, region, or component, or it can be "indirectly connected" to the other layer, region, or component, with other layers, regions, or components inserted in between. For example, it will be understood that when a layer, region, or component is referred to as being "electrically connected" to another layer, region, or component, it can be "directly electrically connected" to the other layer, region, or component, or it can be "indirectly electrically connected" to the other layer, region, or component, with other layers, regions, or components inserted in between.

[0056] The term “overlap” may include layering, stacking, facing, extending over, extending under, covering or partially covering, or any other suitable term that a person skilled in the art will recognize and understand.

[0057] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), terms such as “approximately” as used herein include stated values ​​and mean within an acceptable range of deviation from a particular value as determined by one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ±30%, 20%, or 5% of the stated value.

[0058] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an ideal or overly formal sense unless expressly defined in the specification.

[0059] Display device 1 can be a device for displaying images and can include mobile devices such as game consoles, multimedia devices, and ultra-small personal computers (PCs). Display device 1 can include liquid crystal displays, electrophoretic displays, organic light-emitting displays, inorganic light-emitting displays, field emission displays, surface conduction electron emitter displays, quantum dot displays, plasma displays, and cathode ray displays. In the following description, although an organic light-emitting display device may be used to illustrate display device 1 according to an embodiment, embodiments may include the various display devices described above.

[0060] Figure 1A This is a schematic perspective view of the display device 1 according to an embodiment. Figure 1B This is a schematic perspective view of a display device 1 according to another embodiment.

[0061] refer to Figure 1A The display device 1 may include a display area DA and a non-display area NDA. The display area DA displays an image, and the non-display area NDA does not display an image. The display device 1 can display a main image by using light emitted from a group of main pixels Pgm arranged in the display area DA. Specifically, the group of main pixels Pgm may include main sub-pixels. The main sub-pixels can emit light. The group of main pixels Pgm can be arranged in the display area DA.

[0062] The display device 1 may include a first component area CA1 and a second component area CA2. See below for reference. Figure 2 As described, the first component area CA1 and the second component area CA2 may include areas in which components such as sensors using infrared light, visible light, or sound can be arranged.

[0063] In an embodiment, the first component region CA1 may be at least partially surrounded by the display region DA. The first component region CA1 may be at least partially surrounded by the non-display region NDA. Although in Figure 1A The diagram shows a first component region CA1 arranged on one side of the display region DA, but the first component region CA1 can be arranged in various ways within the non-display region NDA. Although in Figure 1A The diagram shows that the first component region CA1 extends at least partially into the second component region CA2, but the first component region CA1 may be separated from the second component region CA2.

[0064] In an embodiment, the second component region CA2 can be arranged similarly to the first component region CA1. Specifically, the second component region CA2 can be at least partially surrounded by the display region DA. The second component region CA2 can also be at least partially surrounded by the non-display region NDA. Although in Figure 1A The diagram shows the second component region CA2 arranged on one side of the display region DA, but the second component region CA2 can be arranged in various ways within the non-display region NDA. Although in Figure 1A The diagram shows that the second component region CA2 extends at least partially into the first component region CA1, but the second component region CA2 may be separated from the first component region CA1.

[0065] The first component region CA1 and the second component region CA2 may each include a first transmission region TA1 and a second transmission region TA2. Light and / or sound emitted from the component to the outside or traveling from the outside to the component can pass through the first transmission region TA1 and the second transmission region TA2. When infrared light passes through the first transmission region TA1, the infrared transmittance of the entire first component region CA1 can be 15% or more, 20% or more, 25% or more, 85% or more, or 90% or more. When infrared light passes through the second transmission region TA2, the infrared transmittance of the entire second component region CA2 can be 15% or more, 20% or more, 25% or more, 85% or more, or 90% or more.

[0066] In an embodiment, the area of ​​the first transmission region TA1 may be different from the area of ​​the second transmission region TA2. When infrared light passes through the first transmission region TA1 and the second transmission region TA2, the infrared transmittance of the entire first component region CA1 may be different from the infrared transmittance of the entire second component region CA2. In an embodiment, the area of ​​the first transmission region TA1 may be smaller than the area of ​​the second transmission region TA2. For example, the width of the first transmission region TA1 in the x-direction may be smaller than the width of the second transmission region TA2 in the x-direction. Similarly, the width of the first transmission region TA1 in the y-direction may be smaller than the width of the second transmission region TA2 in the y-direction. The infrared transmittance of the first component region CA1 may be smaller than the infrared transmittance of the second component region CA2. The following describes the case where the width of the first transmission region TA1 in the x-direction may be smaller than the width of the second transmission region TA2 in the x-direction.

[0067] In an embodiment, a first pixel group Pg1 may be arranged in a first component region CA1. Multiple first pixel groups Pg1 may be arranged in the first component region CA1. Additionally, each of the first pixel groups Pg1 may include a first auxiliary sub-pixel. The first auxiliary sub-pixel can provide an image by emitting light. The image displayed on the first component region CA1 may include an auxiliary image and has a lower resolution than the image displayed on the display region DA. For example, since the first component region CA1 includes a first transmissive region TA1 through which light and / or sound can pass, the ratio of the first pixel group Pg1 to the first component region CA1 may be less than the ratio of the main pixel group Pgm to the display region DA.

[0068] In an embodiment, a second pixel group Pg2 may be arranged in the second component region CA2. Multiple second pixel groups Pg2 may be arranged in the second component region CA2. Each second pixel group Pg2 may include a second auxiliary sub-pixel. The second auxiliary sub-pixel can provide an image by emitting light. Similar to the first component region CA1, the image displayed on the second component region CA2 may include an auxiliary image and has a lower resolution than the image displayed on the display region DA. For example, since the second component region CA2 includes a second transmissive region TA2 through which light and / or sound can pass, the ratio of the second pixel group Pg2 to the second component region CA2 may be less than the ratio of the main pixel group Pgm to the display region DA. In an embodiment, the resolution of the image displayed on the second component region CA2 may be less than the resolution of the image displayed on the first component region CA1.

[0069] In an embodiment, the ratio of the first transmission region TA1 to the first component region CA1 may be less than the ratio of the second transmission region TA2 to the second component region CA2. Specifically, the ratio of the first transmission region TA1 to the first component region CA1 may be defined by the area of ​​the first transmission region TA1 in the xy plane relative to the area of ​​the first component region CA1 in the xy plane. Similarly, the ratio of the second transmission region TA2 to the second component region CA2 may be defined by the area of ​​the second transmission region TA2 in the xy plane relative to the area of ​​the second component region CA2 in the xy plane.

[0070] refer to Figure 1B This illustrates that the first component region CA1 and the second component region CA2 can be completely surrounded by the display region DA. The first component region CA1 can be separated from the second component region CA2.

[0071] In one embodiment, in a plan view, the first component region CA1 may have a circular or elliptical shape. In another embodiment, in a plan view, the first component region CA1 may have a polygonal shape, such as a quadrilateral. In yet another embodiment, the first component region CA1 may include curved portions. Various changes can be made to the position and number of the first component regions CA1.

[0072] In one embodiment, in a plan view, the second component region CA2 may have a circular or elliptical shape. In another embodiment, in a plan view, the second component region CA2 may have a polygonal shape, such as a quadrilateral. In yet another embodiment, the second component region CA2 may include curved portions. Various changes can be made to the position of the second component region CA2 and the number of second component regions CA2.

[0073] Figure 2 It is along Figure 1A A schematic cross-sectional view of the display device 1 according to the embodiment, taken by lines A-A' and B-B'. Figure 2 It shows Figure 1A One of the principal sub-pixels Pm of the principal pixel group Pgm, Figure 1A The first auxiliary sub-pixel Pa1 of the first pixel group Pg1 and Figure 1A The second auxiliary sub-pixel Pa2 of the second pixel group Pg2.

[0074] refer to Figure 2 The display device 1 may include a display panel 10, a first component COM1 and a second component COM2. The display panel 10 includes display elements. The first component COM1 corresponds to the first component area CA1, and the second component COM2 corresponds to the second component area CA2.

[0075] The display panel 10 may include a substrate 100, a display element layer 200, and a thin-film encapsulation layer 300. The display element layer 200 is disposed on the substrate 100, and the thin-film encapsulation layer 300 seals the display element layer 200. Here, a first component region CA1, a second component region CA2, and a display region DA may be defined in the substrate 100. The display panel 10 may further include a bottom protective film 175 disposed under the substrate 100.

[0076] The substrate 100 may include glass or a polymeric resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, cellulose acetate propionate, or combinations thereof.

[0077] The display element layer 200 may include a circuit layer, organic light-emitting diodes OLEDm, OLEDa1 and OLEDa2, an insulating layer IL between the circuit layer and the organic light-emitting diodes OLEDm, OLEDa1 and OLEDa2, and an insulating layer IL' between the substrate 100 and the circuit layer. The circuit layer includes thin-film transistors TFTm, TFTa1 and TFTa2, and the organic light-emitting diodes OLEDm, OLEDa1 and OLEDa2 are used as display elements.

[0078] The first transmission region TA1 may be arranged in the first component region CA1, and the first auxiliary thin-film transistor TFTa1 and the display element may not be arranged in the first transmission region TA1. The first transmission region TA1 may include an area through which light / signal emitted from the first component COM1 or light / signal incident on the first component COM1 can pass.

[0079] The second transmission region TA2 can be arranged in the second component region CA2, and the second auxiliary thin-film transistor TFTa2 and the display element may not be arranged in the second transmission region TA2. The second transmission region TA2 may include an area through which light / signal emitted from the second component COM2 or light / signal incident on the second component COM2 can pass.

[0080] In this embodiment, the area of ​​the first transmission region TA1 may differ from the area of ​​the second transmission region TA2. Specifically, the area of ​​the first transmission region TA1 may be smaller than the area of ​​the second transmission region TA2. In other words, the width of the first transmission region TA1 in the x-direction may be smaller than the width of the second transmission region TA2 in the x-direction.

[0081] A bottom metal layer BML can be disposed in the first component region CA1 and can correspond to the first auxiliary sub-pixel Pa1. For example, the bottom metal layer BML can be disposed below the first auxiliary thin-film transistor TFTa1. The bottom metal layer BML can prevent external light from reaching the first auxiliary sub-pixel Pa1, which includes the first auxiliary thin-film transistor TFTa1. For example, the bottom metal layer BML can prevent light emitted from the first component COM1 from reaching the first auxiliary sub-pixel Pa1. A constant voltage or signal can be applied to the bottom metal layer BML to prevent damage to the pixel circuitry from electrostatic discharge. Although not in Figure 2 As shown, however, the bottom metal layer BML can also be arranged in the second component region CA2. The bottom metal layer BML can correspond to the second auxiliary sub-pixel Pa2.

[0082] A bottom protective film 175 can be attached to the back side of the substrate 100 to support and protect the substrate 100. The bottom protective film 175 may include a first opening 175OP1 and a second opening 175OP2, the first opening 175OP1 corresponding to a first component region CA1, and the second opening 175OP2 corresponding to a second component region CA2. Therefore, the light transmittance of the first component region CA1 and the second component region CA2 can be improved. The bottom protective film 175 may include polyethylene terephthalate, polyimide, or a combination thereof. If the substrate 100 comprises glass, the bottom protective film 175 may be omitted.

[0083] The area of ​​the first component region CA1 can be larger than the area of ​​the region where the first component COM1 can be arranged. Therefore, the area of ​​the first opening 175OP1 provided in the bottom protective film 175 can be different from the area of ​​the first component region CA1. For example, the area of ​​the first opening 175OP1 can be smaller than the area of ​​the first component region CA1. Similarly, the area of ​​the second component region CA2 can be larger than the area of ​​the region where the second component COM2 can be arranged.

[0084] In this embodiment, the thin-film encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Regarding this, Figure 2 An organic encapsulation layer 320 is shown between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330.

[0085] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise at least one inorganic material selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may comprise a polymeric material. The polymeric material may comprise acrylic resins, epoxy resins, polyimides, polyethylene, or combinations thereof. In an embodiment, the organic encapsulation layer 320 may comprise acrylates.

[0086] In another embodiment, the thin-film encapsulation layer 300 may have a structure in which the internal space between the substrate 100 and the top substrate can be sealed when the substrate 100 can be attached to a top substrate, which may be a transparent component, by means of a sealing member. A desiccant or filler material may be disposed in the internal space. The sealing member may include a sealant. In another embodiment, the sealing member may include a material cured by laser. For example, the sealing member may include a glass frit. Specifically, the sealing member may include urethane resins, epoxy resins, or acrylic resins as organic sealants, silicone as an inorganic sealant, or combinations thereof. Urethane resins may include, for example, polyurethane acrylates. Acrylic resins may include, for example, butyl acrylate, ethylhexyl acrylate, or combinations thereof. The sealing member may include a material cured by thermosetting.

[0087] In the following description, the thin-film encapsulation layer 300 is described as including a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330.

[0088] A touch electrode layer (not shown) can be disposed on the thin-film encapsulation layer 300, and an optical functional layer (not shown) can be disposed on the touch electrode layer, the touch electrode layer including touch electrodes. The touch electrode layer can obtain coordinate information corresponding to external input, such as a touch event. The optical functional layer can reduce the reflectivity of light incident on the display device 1 from the outside (external light) and / or increase the color purity of light emitted from the display device 1. In an embodiment, the optical functional layer may include a retarder and a polarizer. The retarder may include a film-type retarder, a liquid crystal-type retarder, or a combination thereof. The retarder may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may include a film-type polarizer, a liquid crystal-type polarizer, or a combination thereof. The film-type polarizer may include a stretchable synthetic resin film, and the liquid crystal-type polarizer may include liquid crystals arranged in an array. The retarder and polarizer may further include a protective film.

[0089] In another embodiment, the optical functional layer may include a black matrix and color filters. The color filters can be arranged to take into account the color of light emitted from the pixels of the display device. Each of the color filters may include a red, green, or blue pigment or dye. As another example, in addition to the aforementioned pigments or dyes, each of the color filters may further include quantum dots. As yet another example, some of the color filters may not include the aforementioned pigments or dyes and may include scattering particles such as titanium dioxide.

[0090] In another embodiment, the optical functional layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light, reflected by the first reflective layer and the second reflective layer respectively, can interfere destructively, thereby reducing the reflectivity of external light.

[0091] An adhesive component can be disposed between the touch electrode layer and the optical functional layer. Common components known in the art can be used without limitation for the adhesive component. The adhesive component may include a pressure-sensitive adhesive (PSA).

[0092] The first component COM1 can be arranged to correspond to the first component region CA1. The first component COM1 may include electronic components that use light or sound. For example, the first component COM1 may include sensors, such as infrared sensors that emit and / or receive light, sensors that output and sense light or sound to measure distance or identify fingerprints, small lights that output light, and / or speakers that output sound. The electronic components that use light can use light in various wavelength bands, including visible light, infrared light, and ultraviolet light.

[0093] In one embodiment, the first component COM1 may include at least one of a proximity sensor and an ambient light sensor. The proximity sensor detects an approaching object. The proximity sensor can be used to identify a moving object approaching within a certain distance. In one embodiment, the proximity sensor may include a Hall element and a permanent magnet. In another embodiment, the proximity sensor may include a lamp or light-emitting diode and a light sensor. In another embodiment, the proximity sensor may detect changes in capacitance. The ambient light sensor can be used to estimate ambient light. In one embodiment, the ambient light sensor may include a semiconductor element that generates an electromotive force by utilizing the photocurrent effect.

[0094] In this embodiment, a plurality of first components COM1 may be provided to the display device 1. The plurality of first components COM1 may be a proximity sensor and an ambient light sensor, respectively.

[0095] The second component COM2 can be arranged to correspond to the second component area CA2. Similar to the first component COM1, the second component COM2 may include electronic components that use light or sound.

[0096] In an embodiment, the second component COM2 may include at least one of a camera (e.g., an infrared (IR) camera), a dot projector, an IR emitter, and a time-of-flight (ToF) sensor. In an embodiment, the IR camera may capture infrared images using a charge-coupled device sensitive to infrared light (e.g., light having a wavelength range from approximately 0.7 μm to approximately 100 μm). The dot projector may uniformly illuminate infrared light in a pattern. The dot projector may include an emitter and a diffraction section, the emitter emitting infrared light and the diffraction section dispersing the infrared light in a pattern. The IR emitter may emit infrared light. Similar to the dot projector, the IR emitter may include an emitter that emits infrared light. The ToF sensor may emit light (e.g., infrared light) toward an object and then measure the time it takes for the light to return after being reflected by the object. The ToF sensor can measure the distance to the object by measuring this time.

[0097] In this embodiment, a second component COM2 may be provided to the display device 1. The second component COM2 may be an infrared emitter, a dot projector, an infrared camera, or a ToF sensor. The infrared emitter emits light towards an object. The light reflected by the object can then be incident on the infrared camera.

[0098] Figure 3 This is a schematic plan view of the display panel 10 according to an embodiment.

[0099] refer to Figure 3 The display panel 10 may include a main pixel group Pgm, a first pixel group Pg1, and a second pixel group Pg2. The main pixel group Pgm is arranged in the display area DA, the first pixel group Pg1 is included in the first component area CA1, and the second pixel group Pg2 is included in the second component area CA2. Here, the substrate 100 can be understood as including the display area DA, the first component area CA1, the second component area CA2, and the non-display area NDA.

[0100] Multiple primary pixel groups (Pgm) can be arranged in the display area (DA). Each primary pixel group (Pgm) can include a primary sub-pixel. Each primary pixel group (Pgm) can emit light, such as red, green, blue, or white light, through its primary sub-pixel. The primary sub-pixel can be defined by the emission area of ​​an organic light-emitting diode (OLED).

[0101] Multiple first pixel groups Pg1 can be arranged in the first component region CA1, and multiple second pixel groups Pg2 can be arranged in the second component region CA2. Similar to the main pixel group Pgm, the first pixel groups Pg1 and the second pixel groups Pg2 can each include a first auxiliary sub-pixel and a second auxiliary sub-pixel. In the specification, the first pixel groups Pg1 and the second pixel groups Pg2 can include pixel groups containing at least one sub-pixel that emits red, green, blue, or white light as described above.

[0102] Since the first component region CA1 and the second component region CA2 respectively include the first transmission region TA1 and the second transmission region TA2, the resolution of the first component region CA1 and the second component region CA2 can be less than the resolution of the display region DA. The resolution of the second component region CA2 can be less than the resolution of the first component region CA1.

[0103] The sub-pixels of pixel groups Pmg, Pg1, and Pg2 can be electrically connected to external circuitry arranged in the non-display area NDA. A first scan drive circuit 110, a second scan drive circuit 120, a terminal 140, a data drive circuit 150, a first power line 160, and a second power line 170 can be arranged in the non-display area NDA.

[0104] The first scan driving circuit 110 can provide a scan signal to each sub-pixel via scan lines SL. The second scan driving circuit 120 can be arranged parallel to the first scan driving circuit 110, with the display area DA located between the second scan driving circuit 120 and the first scan driving circuit 110. Some of the main sub-pixels arranged in the display area DA can be electrically connected to the first scan driving circuit 110, and the remaining main sub-pixels can be electrically connected to the second scan driving circuit 120. In another embodiment, the second scan driving circuit 120 can be omitted.

[0105] Terminal 140 may be disposed on one side of substrate 100. Terminal 140 may be exposed without being covered by an insulating layer and electrically connected to a printed circuit board (PCB).

[0106] The PCB-P terminal of the printed circuit board (PCB) can be electrically connected to the terminal 140 of the display panel 10. The PCB transmits signals or power from the controller (not shown) to the display panel 10. Control signals generated by the controller can be transmitted through the PCB to the first scan drive circuit 110 and the second scan drive circuit 120. The controller can supply a first power voltage and a second power voltage to the first power line 160 and the second power line 170, respectively, via the first connection line 161 and the second connection line 171. The first power voltage can be supplied to each sub-pixel via the drive voltage line PL electrically connected to the first power line 160, and the second power voltage can be supplied to the counter electrode electrically connected to the second power line 170 of each sub-pixel.

[0107] The data driving circuit 150 can be electrically connected to the data line DL. Data signals from the data driving circuit 150 can be provided to each sub-pixel via the connection line 151 electrically connected to terminal 140 and the data line DL electrically connected to the connection line 151. Although in Figure 3 The diagram shows that the data driving circuit 150 can be arranged on a printed circuit board (PCB), but in another embodiment, the data driving circuit 150 can be arranged on the substrate 100. For example, the data driving circuit 150 can be arranged between terminal 140 and the first power line 160.

[0108] The first power line 160 may include a first sub-line 162 and a second sub-line 163, which extend parallel to each other in the x-direction, and the display area DA is between the first sub-line 162 and the second sub-line 163. The second power line 170 may have a ring shape, which has an open side and partially surrounds the display area DA.

[0109] Figure 4 yes Figure 1A A schematic plan view of a portion of the first component region CA1 and the second component region CA2.

[0110] refer to Figure 4 According to an embodiment, a first pixel group Pg1 and a first transmissive region TA1 can be arranged in a first component region CA1 of the display device. Each of the first pixel group Pg1 may include a first auxiliary sub-pixel Pa1. A second pixel group Pg2 and a second transmissive region TA2 can be arranged in a second component region CA2. Each of the second pixel group Pg2 may include a second auxiliary sub-pixel Pa2. The area of ​​the second transmissive region TA2 may be larger than the area of ​​the first transmissive region TA1.

[0111] In an embodiment, the ratio of the first transmission region TA1 to the first component region CA1 can be less than the ratio of the second transmission region TA2 to the second component region CA2. For example, the area of ​​the first transmission region TA1 for each unit area of ​​the first component region CA1 can be less than the area of ​​the second transmission region TA2 for each unit area of ​​the second component region CA2.

[0112] The first pixel group Pg1 may include at least one first auxiliary sub-pixel Pa1. In an embodiment, as shown... Figure 4 As shown, four first auxiliary sub-pixels Pa1 arranged in two columns can be arranged in a first pixel group Pg1. However, in another embodiment, various changes can be made to the number of first auxiliary sub-pixels Pa1 included in a first pixel group Pg1 and the arrangement of the first auxiliary sub-pixels Pa1.

[0113] The second pixel group Pg2 may include at least one second auxiliary sub-pixel Pa2. In an embodiment, as shown... Figure 4 As shown, two second auxiliary sub-pixels Pa2 can be arranged in a second pixel group Pg2. The number of second auxiliary sub-pixels Pa2 arranged in the second pixel group Pg2 can be equal to or less than the number of first auxiliary sub-pixels Pa1 arranged in the first pixel group Pg1. Therefore, the resolution of the second component region CA2 can be less than the resolution of the first component region CA1.

[0114] Figure 5A This is a schematic arrangement diagram of the sub-pixels of a display device according to an embodiment. Figure 5B This is a schematic arrangement of subpixels in a display device according to another embodiment. In this embodiment, the red subpixel Pr, the green subpixel Pg, and the blue subpixel Pb may represent the emission regions of an organic light-emitting diode. The emission regions may be defined by openings in the pixel-defining layer described below.

[0115] refer to Figure 5A Blue subpixels Pb and red subpixels Pr can be arranged alternately in the x-direction on the first row 1N. Similarly, red subpixels Pr and blue subpixels Pb can be arranged alternately in the x-direction on the second row 2N. Between the first row 1N and the second row 2N, green subpixels Pg can be spaced apart from each other in the x-direction. This subpixel arrangement can be repeated to a pre-defined row.

[0116] The green sub-pixel Pg arranged between the first row 1N and the second row 2N can be arranged alternately with the red sub-pixel Pr and the blue sub-pixel Pb arranged in the first row 1N and the second row 2N. Therefore, the blue sub-pixel Pb and the red sub-pixel Pr can be arranged alternately in the y-direction in the first column 1M and the second column 2M, and the green sub-pixel Pg can be spaced apart from each other in the y-direction by a gap. This sub-pixel arrangement can be repeated to a pre-defined column.

[0117] In an embodiment, the area of ​​the blue sub-pixel Pb can be larger than the area of ​​the red sub-pixel Pr or the area of ​​the green sub-pixel Pg. For example, the red sub-pixel Pr or the green sub-pixel Pg can have a rectangular shape including a long side and a short side, and the blue sub-pixel Pb can have a square shape including the long side.

[0118] refer to Figure 5B Green subpixels Pg can be spaced apart from each other in the first row 1N along the x-direction, and red subpixels Pr and blue subpixels Pb can be alternately arranged in the second row 2N adjacent to the first row 1N along the x-direction. Similarly, green subpixels Pg can be spaced apart from each other in the third row 3N along the x-direction, and red subpixels Pr and blue subpixels Pb can be alternately arranged in the fourth row 4N. Such subpixel arrangements can be repeated up to a predetermined number of rows.

[0119] The green subpixel Pg arranged in the first row 1N can be alternated with the red subpixel Pr and the blue subpixel Pb arranged in the second row 2N. Therefore, the red subpixel Pr and the blue subpixel Pb can be alternately arranged in the first column 1M in the y-direction, and the green subpixel Pg can be spaced apart from each other in the second column 2M in the y-direction. Similarly, the red subpixel Pr and the blue subpixel Pb can be alternately arranged in the third column 3M in the y-direction, and the green subpixel Pg can be spaced apart from each other in the fourth column 4M in the y-direction. Such subpixel arrangements can be repeated up to predetermined columns. The area of ​​the blue subpixel Pb and the red subpixel Pr can be larger than the area of ​​the green subpixel Pg. As another example, the area of ​​the blue subpixel Pb can be larger than the area of ​​the red subpixel Pr and the green subpixel Pg.

[0120] In other words, the pixel arrangement structure can be represented as follows: the green sub-pixel Pg can be arranged at the first and third vertices of the virtual quadrilateral VS, facing each other, and the blue sub-pixel Pb and the red sub-pixel Pr can be arranged at the second and fourth vertices, which can be the remaining vertices. For example, the green sub-pixel Pg can be arranged at the vertices of the virtual quadrilateral VS, facing each other relative to the center VSC of the virtual quadrilateral VS. The blue sub-pixel Pb and the red sub-pixel Pr can be arranged at the vertices of the virtual quadrilateral VS, facing each other relative to the center VSC of the virtual quadrilateral VS. Various modifications can be made to the virtual quadrilateral VS, such as rectangles, rhombuses, and squares.

[0121] The extensions of the sides of the virtual quadrilateral VS can be arranged in directions different from the x and y directions. Therefore, the virtual quadrilateral VS can be tilted relative to the x and y directions.

[0122] Subpixels emitting different colors of light can be arranged at the vertices of a virtual quadrilateral (VS). This subpixel arrangement structure can be called a pentile matrix structure. By applying a rendering driver that expresses color through sharing neighboring subpixels, high resolution can be achieved with a small number of subpixels.

[0123] Various modifications can be made to the subpixel arrangement structure according to the embodiments. For example, this disclosure can be applied to subpixel arrangements having a striped arrangement, a tessellated arrangement, or a triangular arrangement. This disclosure can be applied to subpixel arrangements that further include white subpixels emitting white light. Hereinafter, it is described... Figure 5A Subpixel arrangement.

[0124] Figure 6 yes Figure 1A Enlarged schematic diagrams of regions C and D.

[0125] refer to Figure 6 The display device 1 may include a display area DA, a first component area CA1, and a second component area CA2. A first pixel group Pg1 and a first transmissive area TA1 are arranged in the first component area CA1, and a second pixel group Pg2 and a second transmissive area TA2 are arranged in the second component area CA2. Here, the display device 1 may include a substrate, and the substrate can be understood as including the display area DA, the first component area CA1, and the second component area CA2.

[0126] The area of ​​the first transmission region TA1 can be smaller than the area of ​​the second transmission region TA2. For example, the width of the first transmission region TA1 in the x-direction can be smaller than the width of the second transmission region TA2 in the x-direction.

[0127] The primary sub-pixels Pmr, Pmg, and Pmb can be arranged in the display area DA. In another embodiment, the primary sub-pixels Pmr, Pmg, and Pmb can be arranged in a honeycomb matrix structure.

[0128] First auxiliary sub-pixels Par1, Pag1, and Pab1 can be arranged in the first pixel group Pg1. In one embodiment, the green sub-pixel Pag1 of the first auxiliary sub-pixel can be arranged between the red sub-pixels Par1 of adjacent first auxiliary sub-pixels, or between the blue sub-pixels Pab1 of adjacent first auxiliary sub-pixels. In another embodiment, the first auxiliary sub-pixels Par1, Pag1, and Pab1 can be arranged in a honeycomb matrix structure.

[0129] Second auxiliary sub-pixels Par2, Pag2, and Pab2 can be arranged in the second pixel group Pg2. The green sub-pixel Pag2 of the second auxiliary sub-pixel can be arranged between the red sub-pixels Par2 of adjacent second auxiliary sub-pixels, or between the blue sub-pixels Pab2 of adjacent second auxiliary sub-pixels. In another embodiment, the second auxiliary sub-pixels Par2, Pag2, and Pab2 can be arranged in a honeycomb matrix structure.

[0130] In an embodiment, the first distance between the centers of adjacent first auxiliary sub-pixels Par1, Pag1, and Pab1 may differ from the second distance between the centers of adjacent main sub-pixels Pmr, Pmg, and Pmb. For example, the first distance d1 between the centers of the red sub-pixel Par1 and the blue sub-pixel Pab1 of an adjacent first auxiliary sub-pixel may differ from the second distance d2 between the centers of the red sub-pixel Pmr and the blue sub-pixel Pmb of an adjacent main sub-pixel. Similarly, the first distance d3 between the green sub-pixel Pag1 of an adjacent first auxiliary sub-pixel may differ from the second distance d4 between the green sub-pixel Pmg of an adjacent main sub-pixel. Specifically, the first distances d1 and d3 may be smaller than the second distances d2 and d4. Therefore, the first auxiliary sub-pixels Par1, Pag1, and Pab1 in the first component region CA1 may be arranged more densely than the main sub-pixels Pmr, Pmg, and Pmb in the display region DA. This may be because the first component region CA1 has an appropriate resolution while including the first transmission region TA1.

[0131] In one embodiment, the distance between the centers of adjacent second auxiliary sub-pixels Par2, Pag2, and Pab2 may be different from the distance between the centers of adjacent primary sub-pixels Pmr, Pmg, and Pmb. In another embodiment, the distance between the centers of adjacent second auxiliary sub-pixels Par2, Pag2, and Pab2 and the distance between the centers of adjacent primary sub-pixels Pmr, Pmg, and Pmb may be the same.

[0132] Figure 7 It is along Figure 6 A schematic cross-sectional view of the display device taken by line E-E'. Figure 8 It is along Figure 6 A schematic cross-sectional view of the display device taken by line F-F'. Figure 7 As shown, a blue sub-pixel Pmb of the main sub-pixel, a green sub-pixel Pag1 of the first auxiliary sub-pixel, and a first transmission region TA1 can be arranged. Figure 8 As shown, the blue sub-pixel Pmb of the main sub-pixel and the second transmission region TA2 can be arranged.

[0133] refer to Figure 7 The main thin-film transistor (TFT), the main storage capacitor (Cst), and the main blue organic light-emitting diode (OLEDmb) can be arranged in the display area DA. The first thin-film transistor (TFT'), the first storage capacitor (Cst'), and the first auxiliary green organic light-emitting diode (OLEDag1) can be arranged in the first component area CA1.

[0134] The first component COM1 may be disposed below the first component region CA1. The first component COM1 may include an infrared (IR) sensor that transmits / receives infrared light. Specifically, the first component COM1 may include a proximity sensor or an ambient light sensor. Since the first transmission region TA1 may be disposed in the first component region CA1, infrared signals transmitted / received to / from the first component COM1 can pass through the first transmission region TA1. For example, light emitted from the first component COM1 can travel through the first transmission region TA1 in the z-direction, and light generated outside the display device and incident on the first component COM1 can travel through the first transmission region TA1 in the -z-direction.

[0135] In the following description, a structure in which the elements can be stacked on top of each other is described according to an embodiment.

[0136] A buffer layer 111 may be disposed on the substrate 100 to reduce or block the penetration of foreign matter, moisture, or external air from beneath the substrate 100, and to provide a flat surface on the substrate 100. The buffer layer 111 may comprise inorganic materials, organic materials, or organic / inorganic composite materials such as oxides, nitrides, or combinations thereof, and may comprise a single layer or multiple layers containing both inorganic and organic materials. A barrier layer (not shown) may be further included between the substrate 100 and the buffer layer 111 to block the penetration of external air. In embodiments, the buffer layer 111 may comprise silicon oxide (SiO2) or silicon nitride (SiN). x (or a combination thereof). Buffer layer 111 may include a first buffer layer 111a and a second buffer layer 111b that can be stacked on top of each other.

[0137] The bottom metal layer BML can be disposed in the first component region CA1 between the first buffer layer 111a and the second buffer layer 111b. In another embodiment, the bottom metal layer BML can be disposed between the substrate 100 and the first buffer layer 111a. The bottom metal layer BML can be disposed below the first thin-film transistor TFT' to prevent the characteristics of the first thin-film transistor TFT' from being degraded by light emitted from the first component COM1.

[0138] The bottom metal layer (BML) can be electrically connected to the wiring GCL arranged on different layers via contact holes. The BML can receive a constant voltage or signal from the wiring GCL. For example, the BML can receive a drive voltage or a scan signal. Because the BML receives a constant voltage or signal, the possibility of electrostatic discharge (ESD) can be significantly reduced. The BML can include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), neodymium (Nd), iridium (Ir), chromium (Cr), nickel (Ni), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu). The BML can comprise a single layer or multiple layers containing the aforementioned materials.

[0139] The main thin-film transistor (TFT) and the first thin-film transistor (TFT') can be disposed on the buffer layer 111. The main TFT includes a first semiconductor layer A1, a first gate electrode G1, a first source electrode S1, and a first drain electrode D1. The first TFT' includes a second semiconductor layer A2, a second gate electrode G2, a second source electrode S2, and a second drain electrode D2. The main TFT can be electrically connected to the main blue organic light-emitting diode (OLEDmb) in the display area DA to drive the main blue organic light-emitting diode OLEDmb. The first TFT' can be electrically connected to the first auxiliary green organic light-emitting diode (OLEDag1) to drive the first auxiliary green organic light-emitting diode OLEDag1.

[0140] The first semiconductor layer A1 and the second semiconductor layer A2 may be disposed on the buffer layer 111 and may comprise polycrystalline silicon. In another embodiment, the first semiconductor layer A1 and the second semiconductor layer A2 may comprise amorphous silicon. In another embodiment, the first semiconductor layer A1 and the second semiconductor layer A2 may comprise an oxide of at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The first semiconductor layer A1 and the second semiconductor layer A2 may comprise a channel region, a source region, and a drain region, wherein the source region and the drain region are doped with impurities.

[0141] The second semiconductor layer A2 may overlap with the bottom metal layer BML, and the second buffer layer 111b is located between the second semiconductor layer A2 and the bottom metal layer BML. In an embodiment, the width of the second semiconductor layer A2 may be smaller than the width of the bottom metal layer BML. Therefore, when projected from a direction perpendicular to the substrate 100, the second semiconductor layer A2 may completely overlap with the bottom metal layer BML.

[0142] The first gate insulating layer 112 may cover the first semiconductor layer A1 and the second semiconductor layer A2. The first gate insulating layer 112 may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). x Inorganic insulating materials, such as silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO), or combinations thereof. The first gate insulating layer 112 may include a single layer or multiple layers containing inorganic insulating materials.

[0143] The first gate electrode G1 and the second gate electrode G2 may be disposed on the first gate insulating layer 112 to overlap with the first semiconductor layer A1 and the second semiconductor layer A2, respectively. The first gate electrode G1 and the second gate electrode G2 may comprise a single layer or multiple layers containing at least one of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). In an embodiment, the first gate electrode G1 and the second gate electrode G2 may comprise a single Mo layer.

[0144] The second gate insulating layer 113 may cover the first gate electrode G1 and the second gate electrode G2. The second gate insulating layer 113 may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). x The second gate insulating layer 113 may comprise a single layer or multiple layers containing the aforementioned inorganic insulating materials, such as silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO), or combinations thereof.

[0145] The first top electrode CE2 of the main storage capacitor Cst and the second top electrode CE4 of the first storage capacitor Cst' can be arranged on the second gate insulating layer 113.

[0146] In the display area DA, the first top electrode CE2 may overlap with the first gate electrode G1 below the first top electrode CE2. The overlapping first gate electrode G1 and the first top electrode CE2 (with the second gate insulating layer 113 between the first gate electrode G1 and the first top electrode CE2) may constitute the main storage capacitor Cst. The first gate electrode G1 may serve as the first bottom electrode CE1 of the main storage capacitor Cst.

[0147] In the first component region CA1, the second top electrode CE4 may overlap with the second gate electrode G2 below the second top electrode CE4. The overlapping second gate electrode G2 and the second top electrode CE4 (with the second gate insulating layer 113 between the second gate electrode G2 and the second top electrode CE4) may constitute the first storage capacitor Cst'. The first gate electrode G1 may serve as the second bottom electrode CE3 of the first storage capacitor Cst'.

[0148] The first top electrode CE2 and the second top electrode CE4 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may include a single layer or multiple layers containing the above materials.

[0149] The first interlayer insulating layer 115 may cover the first top electrode CE2 and the second top electrode CE4. The first interlayer insulating layer 115 may include silicon oxide (SiO2) and silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO), or combinations thereof.

[0150] The source electrodes (e.g., first source electrode S1 and second source electrode S2) and drain electrodes (e.g., first drain electrode D1 and second drain electrode D2) may be disposed on the first interlayer insulating layer 115. The source electrodes (e.g., first source electrode S1 and second source electrode S2) and drain electrodes (e.g., first drain electrode D1 and second drain electrode D2) may comprise conductive materials comprising molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or combinations thereof, and may comprise a single layer or multiple layers comprising the aforementioned materials. For example, the first source electrode S1 and second source electrode S2, as well as the first drain electrode D1 and second drain electrode D2, may have a Ti / Al / Ti multilayer structure.

[0151] The second interlayer insulating layer 117 may cover the first source electrode S1, the second source electrode S2, the first drain electrode D1, and the second drain electrode D2. The second interlayer insulating layer 117 may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO), or combinations thereof.

[0152] The main connection metal CM and the first auxiliary connection metal CM' can be arranged on the second interlayer insulating layer 117. By contacting the first drain electrode D1 of the main thin-film transistor TFT and the second drain electrode D2 of the first thin-film transistor TFT' through openings formed in the second interlayer insulating layer 117, the main connection metal CM and the first auxiliary connection metal CM' can be electrically connected to the main thin-film transistor TFT and the first thin-film transistor TFT', respectively.

[0153] Wiring (not shown) may be further arranged on the second interlayer insulation layer 117, which is separated from the main connecting metal CM and the first auxiliary connecting metal CM'. The wiring and the main connecting metal CM and the first auxiliary connecting metal CM' may comprise the same material.

[0154] A planarization layer 119 can be disposed on the main connecting metal CM and the first auxiliary connecting metal CM'. The planarization layer 119 can have a flat top surface, so that the main pixel electrode 221m and the first auxiliary pixel electrode 221a can be formed flat.

[0155] The planarization layer 119 may comprise a single layer or multiple layers containing organic or inorganic materials. The planarization layer 119 may comprise general polymers such as benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), polystyrene (PS), or combinations thereof; polymer derivatives having phenolic groups; acrylic polymers; imide polymers; aryl ether polymers; amide polymers; fluorinated polymers; p-xylene polymers; vinyl alcohol polymers; or mixtures thereof. The planarization layer 119 may comprise silicon oxide (SiO2), silicon nitride (SiN), etc. x The materials may include silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO), or combinations thereof. After the planarization layer 119 can be formed, chemical mechanical polishing can be performed to provide a flat top surface.

[0156] The planarization layer 119 may have openings that expose the main connection metal CM and the first auxiliary connection metal CM'. The main pixel electrode 221m can be electrically connected to the main thin-film transistor TFT by contacting the main connection metal CM through the openings. The planarization layer 119 may also include openings that expose the first auxiliary connection metal CM'. The first auxiliary pixel electrode 221a can be electrically connected to the first thin-film transistor TFT' by contacting the first auxiliary connection metal CM' through the openings.

[0157] The main pixel electrode 221m and the first auxiliary pixel electrode 221a may include conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), zinc aluminum oxide (AZO), or combinations thereof. In another embodiment, the main pixel electrode 221m and the first auxiliary pixel electrode 221a may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. In another embodiment, the main pixel electrode 221m and the first auxiliary pixel electrode 221a may further include a layer comprising ITO, IZO, ZnO, In2O3, or combinations thereof on / under the reflective layer. In embodiments, the main pixel electrode 221m and the first auxiliary pixel electrode 221a may have an ITO / Ag / ITO stacked structure.

[0158] The pixel defining layer 121 may cover the edges of the main pixel electrode 221m and the first auxiliary pixel electrode 221a. The pixel defining layer 121 may include a first opening OP1 and a second opening OP2 that overlap with the main pixel electrode 221m and the first auxiliary pixel electrode 221a, respectively defining a blue sub-pixel Pmb of the main sub-pixel and a green sub-pixel Pag1 of the first auxiliary sub-pixel. The pixel defining layer 121 can prevent arcing or the like at the edges of the pixel electrodes (e.g., the main pixel electrode 221m and the first auxiliary pixel electrode 221a) by increasing the distance between the edges of the pixel electrodes (e.g., the main pixel electrode 221m and the first auxiliary pixel electrode 221a) and the counter electrode 223 above the pixel electrodes (e.g., the main pixel electrode 221m and the first auxiliary pixel electrode 221a). The pixel defining layer 121 may include an organic insulating material comprising polyimide, polyamide, acrylic resin, benzocyclobutene, HMDSO, phenolic resin, or combinations thereof, and is formed by spin coating.

[0159] The blue emitting layer 222B and the green emitting layer 222G can be arranged to correspond to the main pixel electrode 221m and the first auxiliary pixel electrode 221a, respectively. The blue emitting layer 222B and the green emitting layer 222G can comprise polymer materials or low molecular weight materials, and emit red light, green light, blue light, or white light.

[0160] Counter electrode 223 can be disposed on blue emitting layer 222B and green emitting layer 222G. Counter electrode 223 may comprise a conductive material having a small work function. For example, counter electrode 223 may comprise a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. As another example, counter electrode 223 may further comprise a layer comprising ITO, IZO, ZnO, In2O3, or combinations thereof on a (semi-)transparent layer comprising the above-described materials. Counter electrode 223 may be formed integrally over display region DA and first component region CA1. A functional layer may be further arranged between the pixel electrode (e.g., main pixel electrode 221m and first auxiliary pixel electrode 221a) and the emission layer (e.g., blue emission layer 222B and green emission layer 222G) and / or between the emission layer (e.g., blue emission layer 222B and green emission layer 222G) and the counter electrode 223. In an embodiment, the counter electrode 223 may not be arranged in the first transmission region TA1. The counter electrode 223 may include a counter electrode opening 223OP corresponding to the first transmission region TA1.

[0161] The layer formed in the display area DA, from the main pixel electrode 221m to the counter electrode 223, can constitute a main blue organic light-emitting diode OLEDmb. The layer formed in the first component area CA1, from the first auxiliary pixel electrode 221a to the counter electrode 223, can constitute a first auxiliary green organic light-emitting diode OLEDag1.

[0162] As described above, the thin film encapsulation layer, optical functional layer, etc., can be arranged on the counter electrode 223.

[0163] In an embodiment, at least one of the second interlayer insulating layer 117, the planarization layer 119, and the pixel defining layer 121 may include a first transmission aperture TAH1 corresponding to the first transmission region TA1. In an embodiment, the first transmission aperture TAH1 may expose the top surface of the first interlayer insulating layer 115. The first transmission aperture TAH1 may include a first aperture H1 of the pixel defining layer 121, a second aperture H2 of the planarization layer 119, and a third aperture H3 of the second interlayer insulating layer 117. The first aperture H1, the second aperture H2, and the third aperture H3 may overlap each other. The first aperture H1 to the third aperture H3 may be formed separately by individual processes or simultaneously by the same process. As another example, the second aperture H2 and the third aperture H3 may be formed simultaneously, and the first aperture H1 may be formed separately. In the case where the first aperture H1 to the third aperture H3 can be formed by individual processes, a step difference may be formed on the side surface of the first transmission aperture TAH1. In an embodiment, the first transmission aperture TAH1 may include only the first aperture H1 to expose the top surface of the planarization layer 119. In another embodiment, the first transmission aperture TAH1 may not correspond to the first transmission region TA1. For example, the first transmission aperture TAH1 may be omitted. Therefore, the second interlayer insulating layer 117, the planarization layer 119, and the pixel defining layer 121 may be continuously disposed in the first transmission region TA1.

[0164] Since the organic and inorganic stacked structures can be omitted on the substrate 100, signal processing of the first component COM1 can be performed more quickly and accurately.

[0165] refer to Figure 8 The second component COM2 can be arranged in the second component region CA2. The second component COM2 can include an infrared sensor that transmits / receives infrared light. Specifically, the second component COM2 can include a camera, an infrared (IR) camera, a dot projector, an infrared (IR) emitter, or a time-of-flight (ToF) sensor. Since the second transmission region TA2 can be arranged in the second component region CA2, infrared signals transmitted / received to / from the second component COM2 can pass through the second transmission region TA2. For example, light emitted from the second component COM2 can travel through the second transmission region TA2 in the z-direction, and light generated outside the display device and incident on the second component COM2 can travel through the second transmission region TA2 in the -z-direction.

[0166] In an embodiment, at least one of the first gate insulating layer 112, the second gate insulating layer 113, the first interlayer insulating layer 115, the second interlayer insulating layer 117, the planarization layer 119, and the pixel defining layer 121 may include a second transmission aperture TAH2 corresponding to the second transmission region TA2. The second transmission aperture TAH2 may expose the top surface of the buffer layer 111. The second transmission aperture TAH2 may include a first aperture H1' of the pixel defining layer 121, a second aperture H2' of the planarization layer 119, a third aperture H3' of the second interlayer insulating layer 117, a fourth aperture H4' of the first interlayer insulating layer 115, a fifth aperture H5' of the second gate insulating layer 113, and a sixth aperture H6' of the first gate insulating layer 112 that overlap with each other. The first aperture H1' to the sixth aperture H6' may be formed separately by a single process or simultaneously by the same process. As another example, the second aperture H2' to the sixth aperture H6' may be formed simultaneously, and the first aperture H1' may be formed separately. If the first aperture H1' to the sixth aperture H6' can be formed by a separate process, a step difference can be formed on the side surface of the second transmission aperture TAH2. In one embodiment, the second transmission aperture TAH2 may include only the first aperture H1' to expose the top surface of the planarization layer 119. In another embodiment, the second transmission aperture TAH2 may include a first aperture H1' and a second aperture H2' for exposing the top surface of the second interlayer insulating layer 117. In another embodiment, the second transmission aperture TAH2 may not correspond to the second transmission region TA2. For example, the second transmission aperture TAH2 may be omitted. Therefore, the first gate insulating layer 112, the second gate insulating layer 113, the first interlayer insulating layer 115, the second interlayer insulating layer 117, the planarization layer 119, and the pixel defining layer 121 may be continuously disposed in the second transmission region TA2.

[0167] Since the organic and inorganic stacked structures can be omitted on the substrate 100, the signal processing of the second component COM2 can be performed more quickly and accurately.

[0168] In embodiments, components (e.g., first component COM1 and second component COM2) may each have different transmittances. For example, the transmittance required by a proximity sensor may differ from that required by an infrared camera. Specifically, the transmittance required for an infrared camera, dot projector, or ToF sensor to perform its appropriate function may be greater than the transmittance required for a proximity sensor or ambient light sensor to perform its appropriate function. By arranging subpixels in an area where components can be arranged while simultaneously satisfying the transmittance required by each component, an image can be displayed and the functions of the components can be performed simultaneously.

[0169] An embodiment may include a first component region CA1 and a second component region CA2. A first transmissive region TA1 is disposed in the first component region CA1, and a second transmissive region TA2 has an area different from that of the first transmissive region TA1 and is disposed in the second component region CA2. The transmittance of the first component region CA1 may be different from that of the second component region CA2. A first component COM1 may be disposed corresponding to the first component region CA1 to satisfy the required transmittance of the first component COM1, and a second component COM2 may be disposed corresponding to the second component region CA2 to satisfy the required transmittance of the second component COM2, which is different from that of the first component COM1. Therefore, since the first component COM1 and the second component COM2 can be disposed in the first component region CA1 and the second component region CA2 respectively according to the required transmittance, a display device in which an image can be displayed in the component region (e.g., the first component region CA1 and the second component region CA2) without degrading the function of the component (e.g., the first component COM1 and the second component COM2) can be realized.

[0170] Figures 9A to 9C This is a schematic plan view of an example of a first mask Mr to a third mask Mb for manufacturing a display device according to an embodiment. Figures 10A to 10C This is a plan view illustrating a method for manufacturing a display device using a first mask Mr to a third mask Mb.

[0171] refer to Figure 9A The first mask Mr may include a first top mask Mr1 and a first bottom mask Mr2. In one embodiment, the first top mask Mr1 and the first bottom mask Mr2 may include mask rods that can be spaced apart from each other and fixed to a mask frame. In another embodiment, the first top mask Mr1 and the first bottom mask Mr2 may be provided as a single unit.

[0172] The first top mask Mr1 may include a first auxiliary opening OPar1 and a second auxiliary opening OPar2 of the first top mask Mr1. ​​The first auxiliary opening OPar1 and the second auxiliary opening OPar2 of the first top mask Mr1 may be spaced apart from each other.

[0173] The first bottom mask Mr2 may include the main opening OPmr of the first bottom mask Mr2. The main openings OPmr of the first bottom mask Mr2 may be arranged at intervals.

[0174] refer to Figure 9BThe second mask Mg may include a second top mask Mg1 and a second bottom mask Mg2. In one embodiment, the second top mask Mg1 and the second bottom mask Mg2 may include mask rods that can be spaced apart from each other and fixed to the mask frame. In another embodiment, the second top mask Mg1 and the second bottom mask Mg2 may be provided as a single unit.

[0175] The second top mask Mg1 may include a first auxiliary opening OPag1 and a second auxiliary opening OPag2 of the second top mask Mg1. The first auxiliary opening OPag1 and the second auxiliary opening OPag2 of the second top mask Mg1 may be spaced apart from each other.

[0176] The second bottom mask Mg2 may include a main opening OPmg of the second bottom mask Mg2. The main openings OPmg of the second bottom mask Mg2 may be arranged at intervals. The interval OPd1 between adjacent first auxiliary openings OPag1 of the second top mask Mg1 may be smaller than the interval OPd2 between adjacent main openings OPmg of the second bottom mask Mg2.

[0177] refer to Figure 9C The third mask Mb may include a third top mask Mb1 and a third bottom mask Mb2 that may be spaced apart from each other. In one embodiment, the third top mask Mb1 and the third bottom mask Mb2 may include mask rods that may be spaced apart from each other and fixed to the mask frame. In another embodiment, the third top mask Mb1 and the third bottom mask Mb2 may be provided as a single unit.

[0178] The third top mask Mb1 may include a first auxiliary opening OPab1 and a second auxiliary opening OPab2. The first auxiliary opening OPab1 and the second auxiliary opening OPab2 of the third top mask Mb1 may be spaced apart from each other.

[0179] The third bottom mask Mb2 may include the main opening OPmb of the third bottom mask Mb2. The main opening OPmb of the third bottom mask Mb2 may be arranged at intervals.

[0180] In an embodiment, the first mask Mr to the third mask Mb may comprise fine metal masks (FMMs) for depositing the emitter layer. The FMM can be manufactured by forming holes in a metal plate and applying tension to the metal plate.

[0181] The openings OPar1, OPar2, and OPmr of the first mask Mr can be used to form a red emission layer, and the sizes of the openings OPar1, OPar2, and OPmr can be equal to or smaller than the size of the red emission layer. The openings OPag1, OPag2, and OPmg of the second mask Mg can be used to form a green emission layer, and the sizes of the openings OPag1, OPag2, and OPmg can be equal to or smaller than the size of the green emission layer. The openings OPab1, OPab2, and OPmb of the third mask Mb can be used to form a blue emission layer, and the sizes of the openings OPab1, OPab2, and OPmb can be equal to or smaller than the size of the blue emission layer.

[0182] In an embodiment, the emission layer can be deposited using a first mask Mr to a third mask Mb. Figure 10A The method of forming a red emission layer 222R by using a first mask Mr is illustrated schematically. Figure 10B The method of forming a green emission layer 222G by using a second mask Mg is illustrated schematically. Figure 10C The method of forming the blue emission layer 222B by using a third mask Mb is illustrated schematically.

[0183] refer to Figure 10A After pixel electrodes can be formed on the substrate, the first top mask Mr1 can be arranged to correspond to the first component region CA1 and the second component region CA2. The first bottom mask Mr2 can be arranged to correspond to the display region DA.

[0184] The red emission layer 222R can be deposited first by ejecting the deposition material to be formed into the red emission layer 222R using a deposition source (not shown). Depending on the arrangement of the openings OPar1, OPar2 and OPmr of the first mask Mr, only a portion of the red emission layer 222R can be formed.

[0185] Secondly, such as Figure 10B As shown, after the second top mask Mg1 is arranged to correspond to the first component region CA1 and the second component region CA2, and the second bottom mask Mg2 is arranged to correspond to the display region DA, a green emission layer 222G can be deposited. Depending on the arrangement of the openings OPag1, OPag2 and OPmg of the second mask Mg, only a portion of the green emission layer 222G can be formed.

[0186] Third, such as Figure 10CAs shown, after the third top mask Mb1 can be arranged to correspond to the first component region CA1 and the second component region CA2, and the third bottom mask Mb2 can be arranged to correspond to the display region DA, a blue emission layer 222B can be deposited. Depending on the arrangement of the openings OPab1, OPab2, and OPmb of the third mask Mb, only a portion of the blue emission layer 222B can be formed.

[0187] Therefore, the distance between the centers of neighboring sub-pixels in the first component region CA1 can be different from the distance between the centers of neighboring sub-pixels in the display region DA.

[0188] Figure 11 This is a schematic perspective view of a display device 1 according to another embodiment. Figure 11 In the middle, due to with Figure 1A Those figures with the same reference numerals represent the same components, therefore their repeated descriptions are omitted.

[0189] refer to Figure 11 The display device 1 may include a display area DA, a first component area CA1, and a second component area CA2. The display area DA includes a main pixel group Pgm, the first pixel group Pg1 and a first transmissive area TA1 are arranged in the first component area CA1, and the second pixel group Pg2 and the second transmissive area TA2 are arranged in the second component area CA2. The area of ​​the first transmissive area TA1 may be different from the area of ​​the second transmissive area TA2.

[0190] The primary pixel group Pgm may include primary sub-pixels, and the first pixel group Pg1 may include first auxiliary sub-pixels. The first distance between the centers of adjacent first auxiliary sub-pixels may be different from the second distance between the centers of adjacent primary sub-pixels.

[0191] In an embodiment, the display device 1 may further include an opening region PA in which a via PH can be disposed, the via PH passing through the substrate. The opening region PA may be disposed within a non-display region NDA and may be adjacent to a first component region CA1 or a second component region CA2. In an embodiment, the opening region PA may be at least partially surrounded by the display region DA.

[0192] Despite Figure 11 The diagram shows that the opening region PA can be arranged between the first component region CA1 and the second component region CA2, but various changes can be made to the positions of the opening region PA, the first component region CA1 and the second component region CA2, as well as the number of the opening region PA, the first component region CA1 and the second component region CA2.

[0193] Figure 12 It is along Figure 11A schematic cross-sectional view of the display device taken by line G-G'. Figure 12 In the middle, due to with Figure 2 Those figures with the same reference numerals represent the same components, therefore their repeated descriptions are omitted.

[0194] refer to Figure 12 The display device 1 may include a display panel 10, a first component COM1, and a second component COM2. The display panel 10 includes display elements. The first component COM1 corresponds to a first component region CA1, and the second component COM2 corresponds to a second component region CA2. The display device 1 may include a first transmission aperture TAH1 and a second transmission aperture TAH2. The first transmission aperture TAH1 corresponds to the first component region CA1, and the second transmission aperture TAH2 corresponds to the second component region CA2. The first transmission aperture TAH1 may be provided as a slot in an insulating layer IL, which corresponds to the first transmission region TA1. Specifically, for example, the first transmission aperture TAH1 may be disposed in a pixel defining layer, a planarization layer, and a second interlayer insulating layer, and the top surface of the first interlayer insulating layer may be exposed. The second transmission aperture TAH2 may be provided in the insulating layer IL, which corresponds to the second transmission region TA2. Specifically, for example, the second transmission aperture TAH2 can be arranged in the pixel defining layer, the planarization layer, the second interlayer insulating layer, the first interlayer insulating layer, the second gate insulating layer, and the first gate insulating layer, and can expose the top surface of the buffer layer.

[0195] In this embodiment, the display device 1 may include an opening region PA in which a via PH can be disposed. Here, the substrate 100 can be understood as including the opening region PA in which the via PH can be disposed. The via PH can pass through the substrate 100. The bottom protective film 175, the display element layer 200, and the thin-film encapsulation layer 300 may include openings corresponding to the via PH.

[0196] In this embodiment, the third component COM3 may be disposed below the substrate 100 to correspond to the via PH. The area of ​​the opening region PA may be larger than the area in which the third component COM3 may be disposed.

[0197] In an embodiment, the third component COM3 may be different from the first component COM1. Specifically, the third component COM3 may include a camera. However, in an embodiment, the third component COM3 may include at least one of an infrared (IR) camera, a dot projector, an infrared (IR) emitter, and a time-of-flight (ToF) sensor.

[0198] In one embodiment, the bottom protective film 175 may include a third opening 175OP3 corresponding to the opening region PA. Therefore, the light transmittance of the opening region PA can be increased.

[0199] The embodiment may include a first component region CA1 and a second component region CA2 with different transmittances, and in particular, an opening region PA with high transmittance. Therefore, for example, a camera requiring the highest transmittance can be arranged corresponding to the opening region PA, an infrared camera requiring high transmittance can be arranged corresponding to the second component region CA2, and a proximity sensor requiring low transmittance can be arranged corresponding to the first component region CA1. Thus, a display device in which the function of the components is not degraded can be realized.

[0200] As described above, according to the embodiment, a first component region in which a first transmission region can be arranged and a second component region in which a second transmission region can be arranged are provided, wherein the area of ​​the first transmission region is different from the area of ​​the second transmission region. Therefore, the transmittance of the first component region may be different from the transmittance of the second component region.

[0201] Since the first component can be arranged in the first component area and the second component can be arranged in the second component area, depending on the required transmittance, an image can be displayed in the first component area and the second component area without degrading the function of the components.

[0202] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope defined by the appended claims, which include any equivalents.

Claims

1. A display device, comprising: The substrate includes: a display area; a first component area including a first pixel group and a first transmissive area; and a second component area including a second pixel group and a second transmissive area. The primary sub-pixel is disposed in the display area; and The auxiliary sub-pixel set in the first pixel group Wherein, the first distance between the centers of the auxiliary sub-pixels that are adjacent to each other along the first direction is less than the second distance between the centers of the main sub-pixels that are adjacent to each other along the first direction.

2. The display device according to claim 1, wherein, The area of ​​the second transmission region is larger than the area of ​​the first transmission region.

3. The display device according to claim 1, wherein, The ratio of the first transmission region to the first component region is less than the ratio of the second transmission region to the second component region.

4. The display device according to claim 1, further comprising: A first component disposed in the first component area; as well as The second component is located in the second component area.

5. The display device according to claim 4, wherein, The first component and the second component are disposed below the substrate.

6. The display device according to claim 4, wherein, The first component includes at least one of a proximity sensor and an ambient light sensor.

7. The display device according to claim 4, wherein, The second component includes at least one of a camera, a dot projector, an infrared emitter, and a time-of-flight sensor.

8. The display device according to claim 1, wherein the substrate further comprises: An opening region is provided where a through-hole passes through the substrate; and The display device further includes a third component corresponding to the through hole, the third component being disposed below the substrate.

9. A display device, comprising: The substrate includes: a display area having a main sub-pixel; a first component area having a first transmissive area and a first pixel group including a first auxiliary sub-pixel; and a second component area having a second transmissive area and a second pixel group including a second auxiliary sub-pixel. The first component disposed in the first component area; and The second component is located in the second component area. Wherein, the area of ​​the second transmission region is larger than the area of ​​the first transmission region, and Wherein, the first distance along the first direction between the centers of the first auxiliary sub-pixels that are adjacent to each other is less than the second distance along the first direction between the centers of the main sub-pixels that are adjacent to each other.

10. The display device according to claim 9, wherein, The first component and the second component are disposed below the substrate.

11. The display device according to claim 9, wherein, The first component includes at least one of a proximity sensor and an ambient light sensor.

12. The display device according to claim 9, wherein, The second component includes at least one of a camera, a dot projector, an infrared emitter, and a time-of-flight sensor.

13. The display device according to claim 9, wherein the substrate further includes an opening region in which a through hole is disposed, the through hole passing through the substrate.

14. The display device according to claim 13, further comprising a third component corresponding to the through hole, the third component being disposed below the substrate and different from the first component.

15. The display device according to claim 9, further comprising: A gate insulating layer and a planarization layer are disposed between the substrate and the sub-pixel; A first transmission hole is disposed in the planarization layer, and the first transmission hole corresponds to the first transmission region; as well as A second transmission aperture is disposed in the gate insulating layer and the planarization layer, the second transmission aperture corresponding to the second transmission region.

Images