Method for manufacturing chip package

Abstract

Embodiments of the present invention relate to methods for manufacturing chip packages. In one embodiment, a method for forming a chip package includes: placing at least one first die over a carrier, the at least one first die having a plurality of first contact pads facing away from the carrier; forming at least one conductive pillar over at least one peripheral contact pad of the plurality of first contact pads; placing at least one second die over the at least one first die and laterally adjacent to the at least one conductive pillar, the at least one second die having a plurality of second contact pads facing away from the carrier; encapsulating the at least one first die, the at least one second die, and the at least one conductive pillar in a molding compound; and forming a redistribution layer over the molding compound, the redistribution layer being electrically connected to the plurality of second contact pads and the at least one conductive pillar.

Images