Cutting device and cutting method

Abstract

The present invention provides a cutting device and a cutting method that solve problems occurring in a holding stage made of a porous material by employing a new structure on a holding surface of the holding stage. A cutting device (2) cuts a workpiece (wafer (10)) having a cutting predetermined line (13), and the cutting device (2) has a holding stage (27) that attracts and holds the workpiece and moves the workpiece in a machining feed direction (K), the holding stage (27) having a holding member (74) having a holding surface (74c) formed with an attraction groove (77) for attracting and holding the workpiece, and a cutting unit (46) having a cutting tool (B1) that cuts the workpiece held by the holding stage (27), the attraction groove (77) being set to extend in a direction deviated from the machining feed direction (K) by a prescribed angle (θ).

Description

Technical Field

[0001] This invention relates to a cutting apparatus and a cutting method for cutting a workpiece having a predetermined cutting line using a cutting tool. Background Technology

[0002] Previously, for example as disclosed in Patent Document 1, there were known cutting devices that used a holding table made of a porous material such as alumina ceramic or zirconium oxide as the main component, and used the holding surface of the holding table to attract and hold the workpiece.

[0003] During machining, the lower surface of the workpiece is supported by a retaining surface, and a cutting groove is formed by the cutting tool cutting into the workpiece.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2008-62476

[0005] The holding surface of the holding table, which is made of porous material, has tiny concave and convex portions. Moreover, the holding surface (lower surface) of the workpiece is not supported at the concave portions.

[0006] When a full cut is performed in the thickness direction using a cutting tool under the above conditions, a large notch may be generated on the retained surface of the workpiece in the region corresponding to the concave portion.

[0007] Furthermore, even when performing a half-cutting operation where a cutting tool penetrates the workpiece to a specified depth to form a half-groove, cracks may still occur from the bottom of the half-groove in the area corresponding to the concave portion.

[0008] Furthermore, in a holding table made of porous material, concave portions appear randomly, and the locations of gaps or cracks in the workpiece also become random and unpredictable. Summary of the Invention

[0009] The object of the present invention is to solve the above-mentioned problems arising in a holding stage made of porous material by adopting a new structure on the holding surface of the holding stage.

[0010] According to one aspect of the present invention, a cutting device is provided for cutting a workpiece having a predetermined cutting line, wherein the cutting device comprises: a holding table having a holding member having a holding surface having an attraction groove for attracting and holding the workpiece; a cutting unit having a cutting tool for cutting the workpiece held by the holding table; and a machining feed mechanism for moving the holding table relative to the cutting unit in a machining feed direction, wherein the attraction groove is configured to extend in a direction deviating from the machining feed direction by a predetermined angle.

[0011] In addition, according to one aspect of the invention, the suction groove is configured to include at least two suction grooves that are perpendicular to each other.

[0012] In addition, according to one aspect of the invention, the holding member is made of glass, and the cutting device also has a camera that takes pictures of the held surface of the workpiece through the holding member.

[0013] In addition, according to one aspect of the present invention, a cutting method is provided for cutting a workpiece having a predetermined cutting line using a cutting tool, wherein the cutting method comprises the following steps: a holding step in which the workpiece is held using a holding table having a holding member having a holding surface having an attraction groove for attracting and holding the workpiece; and a cutting step in which the holding table is moved relative to the cutting tool along a machining feed direction, and the predetermined cutting line of the workpiece is cut using the cutting tool, wherein the attraction groove is configured to extend along a direction deviating from the machining feed direction by a predetermined angle.

[0014] In addition, according to one aspect of the invention, the suction groove is configured to include at least two suction grooves that are perpendicular to each other.

[0015] In addition, according to one aspect of the invention, the holding member is made of glass, and the cutting method further includes the following photographing step: after the holding step is performed, the holding surface of the workpiece is photographed using a photographing camera through the holding member.

[0016] According to one aspect of the present invention, a workpiece can be held by a holding member having a flat holding surface. Compared to a holding member made of porous material with randomly distributed concave and convex portions, this reduces the generation of notches and cracks, thereby improving machining quality. Furthermore, the area where the cutting guide line and the suction groove overlap due to non-parallelism can be minimized, thus suppressing deterioration of machining quality in the workpiece.

[0017] Furthermore, according to one aspect of the present invention, the workpiece can be reliably attracted and held over a wide range by means of the suction groove.

[0018] Furthermore, according to one aspect of the present invention, the workpiece can be photographed from below, and the predetermined cutting line can be detected. This can be appropriately implemented, for example, in applications where the device formed on the wafer that is the workpiece is on the bottom side and protected by a strip. Attached Figure Description

[0019] Figure 1 This is a perspective view of one embodiment of the cutting device used in the implementation of the present invention.

[0020] Figure 2 It is an exploded perspective view of the support box and the holding table.

[0021] Figure 3 (A) is a perspective view of the holding table mounted on the support box. Figure 3 (B) is a perspective view of the shooting mechanism and its supporting structure below.

[0022] Figure 4 It is a diagram showing how the cross-sectional shape of the worktable is maintained.

[0023] Figure 5 (A) is a side view schematic diagram showing the structure of the shooting mechanism below. Figure 5 (B) is a diagram showing another embodiment of the prism body.

[0024] Figure 6 This is a top view of the structure of the camera mechanism shown below.

[0025] Figure 7 (A) is a view showing the front side of a wafer as an example of a workpiece. Figure 7 (B) is a diagram showing the back side of a wafer as an example of a workpiece.

[0026] Figure 8 Figure (A) illustrates the suction groove formed in the retaining member. Figure 8 (B) is a diagram illustrating the deviation of the angle between the pre-cutting line of the wafer and the suction groove.

[0027] Figure 9 This diagram illustrates the positional relationship between the worktable and the shooting mechanism below.

[0028] Figure 10 This diagram illustrates the process of taking a picture of the workpiece from below using a camera.

[0029] Figure 11This is a diagram illustrating the cutting steps.

[0030] Figure 12 This is a diagram illustrating the groove confirmation steps and an example of image capture.

[0031] Figure 13 This diagram illustrates one embodiment of the above-mounted camera mechanism.

[0032] Label Explanation

[0033] 2: Cutting device; 10: Wafer; 10a: Front side; 11: Device; 13: Cutting pre-line; 27: Holding table; 46: Cutting unit; 52: Upper imaging mechanism; 60: Display monitor; 74: Holding component; 74a: Holding surface; 77: Suction groove; 80: Controller; 82: Lower imaging mechanism; B1: Cutting tool; C: Camera; K: Machining feed direction; M: Groove; S1: Image capture; T: Belt; θ: Angle. Detailed Implementation

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 This is a perspective view showing a cutting device 2 according to one embodiment of the present invention.

[0035] like Figure 1 As shown, on the base 4 of the cutting device 2, a moving mechanism 23 is used to move the device. Figure 3 The (A) is provided with a holding worktable 27 that moves reciprocally along the X-axis. A waterproof cover 14 is provided around the holding worktable 27, and a pleat 16 is connected to the waterproof cover 14 and the base 4.

[0036] like Figure 1 As shown, a box-holding platform 21 is provided at the front corner of the base 4. The box-holding platform 21 is used to hold the box 20 for storing the workpiece described later.

[0037] Box 20 contains multiple chip units 8 ( Figure 7 (B) The wafer unit 8 is moved from the cassette 20 onto a pair of guide rails 71 by the transfer unit 40. In addition, the wafer unit 8 after processing is moved from the pair of guide rails 71 to the cassette 20 by the transfer unit 40.

[0038] A pair of guide rails 71 are positioned above the holding stage 27 to form a temporary placement area 18 for temporarily mounting the wafer unit 8.

[0039] like Figure 1 As shown, the conveying unit 40 is disposed on the horizontal part 41a, which is disposed on the lower part of the generally L-shaped first arm 41 that moves along the X-axis and Z-axis directions.

[0040] A first transport unit 47 for moving the wafer unit 8 between the guide rail 71 and the holding stage 27 is constructed on the horizontal portion 41a of the first arm 41. This first transport unit 47 is configured to have two arms 47a extending along the X-axis and suction portions 47b provided at both ends of the arms 47a. The suction portions 47b are used to move the wafer unit 8 (… Figure 7 The (B) framework F is used for adsorption and retention.

[0041] like Figure 1 As shown, a gate-shaped column 24 is erected on the base 4, and a pair of guide rails 26 extending along the Y-axis are fixed on the column 24. A Y-axis moving block 28 is movably arranged on the guide rails 26. The Y-axis moving block 28 is guided by the guide rails 26 and moves along the Y-axis direction by a Y-axis moving mechanism 34 composed of a ball screw 30 and a pulse motor 32.

[0042] like Figure 1 As shown, a pair of guide rails 36 extending along the Z-axis direction are fixed on the Y-axis moving block 28. A Z-axis moving block 38 is movably arranged on the guide rails 36. The Z-axis moving block 38 is guided by the guide rails 36 and moves along the Z-axis direction by the Z-axis moving mechanism 44, which is composed of a ball screw 40 and a pulse motor 42.

[0043] like Figure 1 As shown, a cutting unit 46 and an upper imaging mechanism 52 are mounted on the Z-axis moving block 38. Figure 11 As shown, the cutting unit 46 is configured to have a cutting tool B1 mounted in a detachable manner at the front end of a spindle 48 that is driven by a motor (not shown).

[0044] like Figure 1 As shown, a rotary cleaning unit 54 with a rotary worktable 56 is provided on the base 4. The rotary worktable 56 is used to attract and hold the workpiece after cutting and to perform rotary cleaning, and can also be rotary dried.

[0045] like Figure 1 As shown, a second conveying unit 50 is provided on the side of the first conveying unit 47 to move the wafer unit between the holding stage 27 and the rotary cleaning unit 54.

[0046] like Figure 1 As shown, the cutting device 2 has a controller 80 for controlling the operation of various drive units. Additionally, a display monitor 60, consisting of a touch panel or similar component, is provided to display various information, such as captured images described later.

[0047] Figure 2 This is a diagram illustrating the structure of the worktable 27.

[0048] The holding table 27 has an annular base 62 and a disc-shaped holding member 74. The annular base 62 has: a fitting portion 64; a winding portion 66 with a diameter larger than the fitting portion 64; a through portion 65 that passes through the fitting portion 64 axially; and a transparent member 68 that closes the through portion 65.

[0049] like Figure 2 As shown, a mounting area 70 is provided on the upper surface of the annular base 62. The mounting area 70 is used to place and fix the frame portion 74b of the disc-shaped retaining member 74.

[0050] like Figure 2 As shown, the holding member 74 is configured to have a disc-shaped holding portion 74a and a frame portion 74b surrounding the holding portion 74a. The holding portion 74a is made of a transparent component such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, or magnesium fluoride. Furthermore, "transparent" in the context of a transparent component means "allowing at least a portion of the wavelengths of visible light to pass through without absorption or scattering," and it may be colored as long as the peripheral protrusion detection step and the predetermined dividing line detection step described later can be performed. Alternatively, a transparent area may be formed only within a necessary portion of the holding member 74. As described above, a transparent area is formed on the holding stage 27 by the holding portion 74a of the holding member 74.

[0051] like Figure 4 As shown, the upper surface of the holding portion 74a forms a holding surface 74c for holding the wafer W. On the holding surface 74c, a plurality of annular suction grooves 76 (three rows in this embodiment) are concentrically arranged near the outer periphery of the holding portion 74a, in which the tape T is adsorbed and held. The suction grooves 76 are connected to the suction source 89 when the holding member 74 is mounted on the annular base 62.

[0052] like Figure 8 (A) and Figure 8 As shown in (B), the attraction groove 76 is formed at a position closer to the outer periphery of the wafer 10 while holding the wafer 10.

[0053] like Figure 2 and Figure 8 As shown in (A), a straight suction groove 77 is formed on the holding surface 74c of the holding member 74. In this embodiment, two suction grooves 77 are formed that pass through the center of the disc-shaped holding member 74 and are perpendicular to each other.

[0054] like Figure 8As shown in (A), the holding surface 74c of the holding member 74 is configured to be larger than the wafer 10 shown by the imaginary line, and the lengths of the two attraction grooves 77 are respectively configured to be greater than or equal to the diameter of the wafer 10. The attraction grooves 77 communicate with the annular attraction grooves 76 located on the outer periphery of the wafer 10 and are connected to the attraction source 89.

[0055] like Figure 4 As shown, the annular suction grooves 76 are connected to each other by a connecting groove extending in the radial direction of the retaining member 74. This connecting groove can, for example, be configured to extend the suction groove 77 to the suction groove 76 located on the outermost periphery.

[0056] In addition, such as Figure 8 As shown in (A), if two attraction grooves 77 are formed perpendicularly to the center of the holding member 74 as in this embodiment, it is preferred in that the wafer, as the workpiece, can be uniformly attracted and held over a large area, but the number of grooves and their arrangement are not particularly limited.

[0057] like Figure 2 and Figure 4 As shown, frame support portions 72 are provided at four locations on the upper surface of the annular base 62 in a manner that surrounds the retaining member 74. The frame support portions 72 support the annular frame F of the wafer unit 8 from below.

[0058] like Figure 2 and Figure 4 As shown, the frame support portion 72 has: a support block 72a, which forms a support surface for supporting the annular frame F; and an adsorption portion 72b, which adsorbs and holds from the lower side of the annular frame F, and the adsorption portion 72b is connected to the attraction source 89.

[0059] like Figure 2 and Figure 4 As shown, a through portion 65 with approximately the same diameter as the holding portion 74a of the holding member 74 is formed on the annular base 62 of the holding table 27. The lower part of the through portion 65 is closed by a transparent member 68 (e.g., glass). Thus, with the transparent member 68, the through portion 65, and the holding portion 74a of the holding member 74 arranged sequentially from the bottom, it is possible to take pictures from below the holding table 27 by allowing light to pass through these parts (details will be described later). Alternatively, the transparent member 68 may be omitted.

[0060] like Figure 2 As shown, the retaining member 74 is mounted on the mounting area 70 of the annular base 62, such that the annular fitting portion 64 protruding downward from the annular base 62 engages with the circular opening 15a of the support box 15, thereby... Figure 3 As shown in (A), the worktable 27 is kept in a state in which it is rotatably mounted on the support box 15.

[0061] like Figure 3 As shown in (A), a motor 17 is mounted on the connecting plate 15b of the support box 15, and a belt 29 is wound on the pulley 17a connected to the output shaft of the motor 17 and the belt winding portion 66 of the annular base 62. When the motor 17 is driven, the holding table 27 is rotated via the belt 29.

[0062] Figure 3 The motor 17 shown in (A) is, for example, a pulse motor. When the motor 17 is driven with a specified pulse during alignment, the table 27 is rotated by a specified amount (θ rotation), enabling the alignment to be performed. Figure 7 Alignment of the cutting predetermined line (spacer) 13 of the wafer 10 shown in (A).

[0063] like Figure 3 As shown in (A), the support box 15 is slidably mounted on a pair of guide rails 31 that are fixedly extended along the X-axis, and moves along the X-axis via a moving mechanism 23. The moving mechanism 23 is configured to have a ball screw 23a and a pulse motor 23b arranged parallel to each other between the guide rails 31. The X-axis direction in which the support box 15 (holding the worktable 27) moves is the machining feed direction, as shown in (A). Figure 8 As shown in (B), cutting is performed with the machining feed direction K parallel to the cutting predetermined line 13.

[0064] like Figure 3 As shown in (A), the ball screw 23a is screwed into the internal thread portion on the lower surface of the lower plate 15e of the support box 15. The ball screw 23a is rotated by driving the pulse motor 23b, and the support box 15 moves in the X-axis direction.

[0065] like Figure 3 As shown in (A), a lower imaging mechanism 82 is provided near the support box 15. The lower imaging mechanism 82 takes pictures of the workpiece such as the semiconductor wafer held by the holding table 27 from the lower side of the holding member 74.

[0066] like Figure 9 As shown, the support box 15 is formed by an upper plate 15c, a lower plate 15e and a connecting plate 15b in a roughly "ko" shape when viewed from the side. An opening 15g is formed on the opposite side of the connecting plate 15b, which allows the lower shooting mechanism 82 to enter the space between the upper plate 15c and the lower plate 15e.

[0067] like Figure 3 (A) and Figure 3As shown in (B), the lower shooting mechanism 82 is mounted on a column 96 that is vertically mounted on the Y-axis moving block 83. The Y-axis moving block 83 is slidably mounted on a pair of guide rails 81 that are fixedly extended along the Y-axis direction, and is moved along the Y-axis direction by a drive unit 87. The drive unit 87 is configured to have a ball screw 85a and a pulse motor 87b arranged in parallel between the guide rails 81.

[0068] like Figure 3 As shown in (A), the ball screw 85a is screwed into the internal thread portion provided on the lower surface of the Y-axis moving block 83. The ball screw 85a is rotated by driving the pulse motor 87b, and the Y-axis moving block 83 moves along the Y-axis direction.

[0069] like Figure 3 As shown in (B), the lower shooting mechanism 82 is configured to have a prism mechanism P and a shooting camera C.

[0070] like Figure 5 (A) and Figure 6 As shown, the prism mechanism P is configured as having a prism body 90, a light source 92, and a housing 84 for housing the prism body 90 and the light source 92.

[0071] like Figure 5 As shown in (A), the prism body 90 of the prism mechanism P is composed of a so-called right-angle prism (side-view right-angled triangle) which has an inclined reflecting surface 90a at an angle of approximately 45 degrees when viewed from the side.

[0072] like Figure 5 As shown in (A), a first passage 88a is formed in the housing 84 at a position 45 degrees above the reflecting surface 90a, i.e. above the prism body 90. The reflecting surface 90a is positioned opposite the holding stage 27 through the first passage 88a.

[0073] like Figure 5 As shown in (A), a second passage 88b is formed in the housing 84 at a position 45 degrees below the reflecting surface 90a, that is, at a position that is laterally relative to the prism body 90.

[0074] As mentioned above, such as Figure 5 As shown in (A), light H1 entering from the first through-port 88a is reflected and refracted by 90 degrees by the reflecting surface 90a and exits from the second through-port 88b.

[0075] In addition to, besides Figure 5 In addition to directly reflecting light H1 through the reflecting surface 90a, as shown in (A) prism body 90, it can also... Figure 5As shown in (B), the prism body 90A allows light H1 to pass through the prism body 90A and be refracted by the reflecting surface 90b. In this case, the optical path length can be made longer, thereby enabling designs that avoid interference between components.

[0076] like Figure 5 (A) and Figure 6 As shown, a light source 92 composed of LEDs is housed inside the housing 84, and a light transmission port 86 is formed on the upper surface of the housing 84 to allow light from the light source 92 to pass through. In this embodiment, three light sources 92 are arranged on each side of the prism body 90, and a light transmission port 86 is formed at the position corresponding to each light source 92.

[0077] like Figure 6 As shown, light H2 from the light source 92 shines on the lower surface of the wafer W held by the holding stage 27 positioned above, and reflected light H1 enters the prism body 90. Additionally, the light source 92 causes the shone light H2 to illuminate the camera C (…). Figure 5 The focal position of (A) is tilted, and the optical axis of light H2 is tilted.

[0078] like Figure 5 As shown in (A), the camera C is configured to have: a lens barrel 91; an objective lens 93 disposed at one end of the lens barrel 91; and an image capturing element 95 disposed at the other end of the lens barrel 91.

[0079] like Figure 5 As shown in (A), the lens barrel 91 is connected to the second passage 88b, and the objective lens 93 is arranged opposite to the reflecting surface 90a of the prism body 90.

[0080] like Figure 5 As shown in (A), the light H1 passing through the objective lens 93 is received by the imaging element 95 and digitized into image data by an image processing device (not shown).

[0081] like Figure 3 As shown in (B), the prism mechanism P and the camera C constituting the lower shooting mechanism 82 are supported by a support plate 94, the base end of which is fixed to the Z-axis moving block 98. The vertically mounted Y-axis moving block 83... Figure 3 The column 96 of (A) is provided with a Z-axis moving unit 104 consisting of a ball screw 100 and a pulse motor 102. The Z-axis moving block 98 moves along a pair of guide rails 106 in the Z-axis direction (vertical direction). At the same time, the shooting mechanism 82 below also moves in the Z-axis direction (vertical direction).

[0082] Next, a processing example using the above-described device structure will be explained.

[0083] <Workpiece Preparation Steps>

[0084] The workpiece preparation step involves attaching a strip that is transparent to visible light to the front side of the workpiece. Figure 7 (A) and Figure 7 (B) shows a wafer 10 as an example of a workpiece. In addition to the semiconductor wafer described below, other workpieces that can be processed include optical device wafers with optical devices such as LEDs, various ceramic substrates or glass substrates for electronic components, etc.

[0085] Devices 11 are arranged in a grid pattern on the front side 10a of wafer 10, and cutting is performed along the predetermined cutting line 13 (spacer). Wafer 10 is, for example, a SiC wafer with a thickness of 100 μm.

[0086] like Figure 7 As shown in (B), the wafer unit 8 is configured such that the back side 10b of the wafer 10 is exposed to the upper side, and the front side 10a of the wafer 10 is attached to the tape T, so that the annular frame F and the wafer 10 are integrated by means of the tape T.

[0087] By constructing the chip unit 8 as described above, the device 11 with the T-band protects the front side 10a, making the chip 10 ready for processing. Alternatively, protection can be achieved by attaching a tape to the front side 10a of the chip 10 without using the ring frame F.

[0088] In addition, Figure 7 In (B), the strip T has the property of being transparent, meaning that it allows at least a portion of the wavelengths of visible light to pass through without absorption or scattering, and can perform the cutting predetermined line detection step and the groove confirmation step described later. Additionally, the strip T can be colored and can be made of a stretchable resin strip. Alternatively, instead of using the strip T, a rigid plate made of glass or resin can be used to protect and process the front side 10a of the wafer 10.

[0089] <Maintaining Steps>

[0090] like Figure 9 As shown, the holding step is a step of holding the workpiece (wafer 10) on the front side 10a side through the belt T using a holding stage 27 having at least a partially transparent holding member 74.

[0091] First, such as Figure 8 As shown in (B), the straight suction grooves 77 formed on the holding member 74 are set to deviate from the machining feed direction K (X-axis direction) by a specified angle θ.

[0092] Specifically, for Figure 3The electric motor 17 shown is driven to rotate the worktable 27 via the belt 29, thereby, as Figure 8 As shown in (A), the suction groove 77 of the holding member 74 is set to deviate from the machining feed direction K (X-axis direction) by a predetermined angle θ. When the holding member 74 is installed, the angle setting of the holding member 74 that achieves this angle θ is stored in the cutting device 2. Figure 1 ) controller 80 ( Figure 1 In ), for motor 17 ( Figure 3 It can be reproduced by driving the process.

[0093] In this embodiment, the two suction grooves 77 are configured to be offset by 45 degrees relative to the machining feed direction K (X-axis direction). Additionally, in Figure 8 In (B), the part with T is omitted. Figure 9 The illustration is shown.

[0094] Based on the angle of the suction groove 77 of the worktable 27 set as described above, such as Figure 8 As shown in (B), the wafer 10 is placed on the holding member 74. At this time, the cutting predetermined lines 13 formed between the devices 11 of the wafer 10 are placed in a manner parallel to the processing feed direction K (X-axis direction).

[0095] As described above, the wafer 10 is held by the holding stage 27 when the suction groove 77 of the holding component 74 is deviated from the cutting predetermined line 13 of the wafer 10 by an angle θ.

[0096] Furthermore, in this holding step, it is not particularly limited to the above method as long as the relative relationship of the deviation of the angle θ between the attraction groove 77 and the cutting predetermined line 13 is achieved.

[0097] <Cutting Pre-line Inspection Steps (First Shooting Step)>

[0098] like Figure 10 As shown, the cutting predetermined line detection step (first imaging step) is as follows: After the holding step is performed, the workpiece (wafer 10) held by the holding table 27 is imaged from below through the holding member 74 and the belt T using the imaging camera C, and the cutting predetermined line 13 is detected. Figure 7 The position of (A)).

[0099] Specifically, such as Figure 10 As shown, by moving the Y-axis moving block 83, the lower imaging mechanism 82 is positioned below the wafer 10, across the holding member 74 of the holding stage 27 and the T-band, facing the front surface 10a of the wafer 10. Figure 9 The image is captured, and the predetermined cutting line 13 of the wafer 10 is detected based on the captured image. Figure 7(A)). During shooting, it is preferable to shoot the area that is not reflected in the suction groove 77.

[0100] Here, after confirming the detected cutting predetermined line 13 ( Figure 8 (B) and suction groove 77 ( Figure 8 In the case where (B) is roughly parallel, it can also be conveyed by the first conveying unit 47. Figure 1 Temporarily lift the workpiece and hold it above the holding member 74, and after rotating the holding member 74, reposition the workpiece to cut the predetermined line 13. Figure 8 (B)) and suction groove 77 ( Figure 8 The relative angle (angle θ) of (B) is adjusted to the specified angle.

[0101] Furthermore, in the cutting predetermined line detection step described above, while keeping component 74 made of transparent glass, the cutting predetermined line 13 is detected from below using a camera C. Figure 7 (A)), but in addition, while keeping component 74 made of non-transparent raw materials such as metal or ceramic, it is also possible to utilize Figure 1 and Figure 10 The upper imaging mechanism 52 shown detects the cutting predetermined line 13 by photographing the workpiece from above. Figure 7 (A)). In this case, the workpiece is, for example, Figure 7 In the case of a chip 10 like (A), the front side 10a of the device 11 is formed on the substrate. Figure 7 As shown in (B), the T-shaped part is pasted with the side facing upwards.

[0102] <Cutting Steps>

[0103] like Figure 11 As shown, the position of the cutting tool B1 in the cutting unit 46 is aligned with the cutting predetermined line 13 detected by the cutting predetermined line detection step. Figure 7 The positions of (A) are consistent, and the cutting unit 46 is positioned at a specified height, so that the holding table 27 moves along the machining feed direction (X-axis direction) to perform cutting and form a groove along the predetermined cutting line 13.

[0104] like Figure 11 As shown, in a cutting predetermined line 13 ( Figure 7 After the cutting of (A) is performed, the cutting tool B1 is indexed and fed along the Y-axis, and the adjacent cutting predetermined lines are cut in the same way.

[0105] exist Figure 7In (A), after cutting all predetermined cutting lines 13 extending along a first direction (e.g., the X-axis direction), the holding table 27 is... Figure 11 Rotate 90 degrees, in Figure 7 The same cutting process is performed in the second direction (e.g., the Y-axis direction) in (A).

[0106] <Groove Confirmation Steps (Second Shooting Step)>

[0107] like Figure 10 and Figure 12 As shown, the slot confirmation step (second shooting step) is a step of confirming the state of the slot by shooting the slot from above the wafer 10 using the upper shooting mechanism 52, thereby performing a cut inspection.

[0108] like Figure 13 As shown in the example, the upper shooting mechanism 52 is configured to have a shooting element 52S, an objective lens 52L and a light source 52U, and to take pictures by receiving reflected light from the light source 52U.

[0109] Figure 12 In one example of the captured image S1, the area around the groove M appears bright due to reflected light L, while the area around the groove M appears darker. Based on this captured image S1, it is possible to perform cut inspections such as detecting chipped edges or cracks and measuring the width of the groove M.

[0110] Regarding the groove confirmation step, the groove confirmation step is performed by photographing the workpiece (wafer 10) during the machining process of the cutting step, after the completion of a specific cutting machining stage, or after the completion of all cutting machining stages that should be performed.

[0111] like Figure 1 As shown, the captured image S1 is an image displayed on the display monitor 60 by the controller 80 processing the image captured by the upper shooting mechanism 52.

[0112] Here, the controller 80 is configured to detect the presence of an attraction groove 77 at the coordinate position of the captured image. Figure 8 In the case of (A), such as Figure 12 As shown, information about the suction groove 77 can be overlaid on the captured image S1. That is, the controller 80 refers to the pre-stored coordinate position of the suction groove 77 and the coordinate position of the area where the captured image S1 is located, and overlays an imaginary image of the suction groove 77 on the captured image S1. As a result, the operator can recognize that the suction groove 77 exists at the captured area.

[0113] Furthermore, when the suction groove 77 is present in the area being photographed, the holding surface (lower surface) of the wafer is not supported, making it more prone to cracks compared to other areas, and thus unsuitable for cut inspection.

[0114] In view of this, as described above, by imaginarily overlaying the suction groove 77 on the captured image S1, the operator can recognize the presence of the suction groove 77, thereby prompting the operator to perform incision inspection on other parts of the body.

[0115] Additionally, in the above explanation, such as Figure 12 As shown, an image is captured using an upper imaging mechanism 52 positioned above the chip 10 to perform cut inspection, but an image can also be captured using an imaging camera C positioned below the chip 10 to perform cut inspection.

[0116] The present invention can be implemented as described above.

[0117] That is, such as Figure 1 and Figure 8 As shown in (B), a cutting apparatus 2 is provided for cutting a workpiece (wafer 10) having a predetermined cutting line 13. The cutting apparatus 2 includes: a holding table 27 having a holding member 74 having a holding surface 74 having an attraction groove 77 for attracting and holding the workpiece; a cutting unit 46 having a cutting tool B1 for cutting the workpiece held by the holding table 27; and a moving mechanism 23 as a machining feed mechanism that moves the holding table 27 relative to the cutting unit 46 along a machining feed direction K, wherein the attraction groove 77 is set to extend along a direction deviating from the machining feed direction K by a predetermined angle θ.

[0118] Therefore, the workpiece can be held by the holding member 74 with a flat holding surface. Compared with the case where the holding member is made of porous material with randomly distributed concave and convex portions, the generation of notches and cracks can be reduced, thereby improving the machining quality. In addition, the area where the cutting predetermined line 13 and the suction groove 77 overlap due to their non-parallelism can be suppressed, thereby suppressing the deterioration of machining quality in the workpiece.

[0119] In addition, such as Figure 8 As shown in (B), the attraction groove 77 is configured to include at least two attraction grooves 77, 77 that are perpendicular to each other.

[0120] Therefore, the workpiece can be reliably attracted and held over a wide range by means of the suction groove.

[0121] In addition, such as Figure 10 As shown, the holding member 74 is made of glass, and the cutting device 2 also has a camera C, which takes pictures of the held surface of the workpiece through the holding member 74.

[0122] Therefore, it is possible to photograph the workpiece from below and cut the predetermined line 13 ( Figure 7 The detection of (A) can be appropriately implemented, for example, in applications where the device 11 formed on the wafer 10 as the workpiece is on the underside and protected by a band T.

[0123] In addition, such as Figure 1 and Figure 8 As shown in (B), a cutting method is provided in which a cutting tool B1 is used to cut a workpiece having a predetermined cutting line 13, wherein,

[0124] The cutting method has the following steps:

[0125] In the holding step, the workpiece is held using a holding table 27, which has a holding member 74 with a holding surface 74c having an attraction groove 77 for attracting and holding the workpiece; and

[0126] In the cutting step, the holding table 27 is moved relative to the cutting tool B1 along the machining feed direction K, and the cutting tool B1 cuts the workpiece along the predetermined cutting line 13.

[0127] The suction groove 77 is set to extend along a direction that deviates from the machining feed direction K by a specified angle θ.

[0128] Therefore, the workpiece can be held by the holding member 74 with a flat holding surface. Compared with the case where the holding member is made of porous material with randomly distributed concave and convex portions, the generation of notches and cracks can be reduced, thereby improving the machining quality. In addition, the area where the cutting predetermined line 13 and the suction groove 77 overlap due to their non-parallelism can be suppressed, thereby suppressing the deterioration of machining quality in the workpiece.

[0129] In addition, such as Figure 10 As shown, the holding member 74 is made of glass, and the cutting method further includes the following photographing step: after the holding step is performed, the holding surface of the workpiece is photographed through the holding member 74 using a photographing camera C. Furthermore, the "photographing step" referred to here includes any one or both of the aforementioned cutting predetermined line detection step (first photographing step) and groove confirmation step (second photographing step).

[0130] Therefore, it is possible to photograph the workpiece from below and to perform cutting along the predetermined line 13. Figure 7 The detection of (A) can be appropriately implemented, for example, in applications where the device 11 formed on the wafer 10 as the workpiece is on the underside and protected by a band T.

Claims

1. A cutting device for cutting a workpiece having a predetermined cutting line, wherein, The cutting device has the following features: A holding table having a holding member having a holding surface having a straight suction groove for attracting and holding the workpiece. A cutting unit having a cutting tool for cutting the workpiece held by the holding table; and The machining feed mechanism moves the holding table relative to the cutting unit along the machining feed direction. The straight suction groove is configured to extend along a direction that deviates from the machining feed direction by a predetermined angle. The linear suction channel consists of only two perpendicular linear suction channels that pass through the center of the retaining surface. On the holding surface, an annular suction groove is provided at a position outside the workpiece when the workpiece is held. The linear suction groove and the annular suction groove are connected. The straight suction groove and the annular suction groove are concave grooves formed on the surface of the retaining surface and open upwards. The retaining component is made of a transparent component, and the surface of the retaining surface is flat except for the two straight suction grooves and the annular suction groove.

2. The cutting device according to claim 1, characterized in that, The annular suction grooves are arranged in multiple concentric patterns.

3. The cutting device according to claim 1 or 2, characterized in that, The retaining component is made of glass. The cutting device also includes a camera that takes pictures of the held surface of the workpiece through the holding member.

4. The cutting device according to claim 1 or 2, characterized in that, Photographing the grooves in the workpiece after cutting. When the straight groove exists at the captured coordinates, the information of the straight groove is overlaid on the captured image.

5. A cutting method, wherein a cutting tool is used to cut a workpiece having a predetermined cutting line, wherein, The cutting method has the following steps: The holding step involves holding the workpiece using a holding worktable. The holding worktable has a holding component with a holding surface, and the holding surface has a straight suction groove for attracting and holding the workpiece. as well as In the cutting step, the holding table moves relative to the cutting tool along the machining feed direction, and the cutting tool cuts along the predetermined cutting line of the workpiece. The straight suction groove is configured to extend along a direction that deviates from the machining feed direction by a predetermined angle. The linear suction channel consists of only two perpendicular linear suction channels that pass through the center of the retaining surface. On the holding surface, an annular suction groove is provided at a position outside the workpiece when the workpiece is held. The linear suction groove and the annular suction groove are connected. The straight suction groove and the annular suction groove are concave grooves formed on the surface of the retaining surface and open upwards. The retaining component is made of a transparent component, and the surface of the retaining surface is flat except for the two straight suction grooves and the annular suction groove.

6. The cutting method according to claim 5, characterized in that, The annular suction grooves are arranged in multiple concentric patterns.

7. The cutting method according to claim 5 or 6, characterized in that, The retaining component is made of glass. The cutting method also includes the following photographing step: after the holding step is performed, the holding surface of the workpiece is photographed using a camera through the holding member.

8. The cutting method according to claim 5 or 6, characterized in that, The cutting method also includes the following groove confirmation step: after the cutting step is performed, the groove is photographed. In the groove confirmation step, if the straight groove exists at the captured coordinate position, the information of the straight groove is overlaid on the captured image.

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