Backlight unit and display device including the same

Abstract

A backlight unit and a display device including the same are provided. The backlight unit includes a substrate, a plurality of light sources disposed on a first surface of the substrate, a side mold having a closed loop shape and fixed on the substrate, the side mold surrounding the light sources, a resin layer filling an area defined by the side mold, and an optical member disposed on the resin layer in the area defined by the side mold.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefits to Korean Patent Application No. 10-2020-0022747, filed on February 25, 2020, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to a backlight unit and a display device including the backlight unit, and more specifically, to a backlight unit in which a side mold is fixed on a substrate having a plurality of light sources arranged thereon, and a resin layer and optical components are disposed on the substrate in a region defined by the side mold. Background Technology

[0004] Liquid crystal display (LCD) devices receive light from a backlight unit to display images. The backlight unit includes multiple light sources. Light emitted from the light sources is incident on the LCD panel via optical films and the like.

[0005] Recent research has focused on the application of wavelength conversion sheets to improve the display quality of LCD devices, such as color reproduction. Typically, a blue light source is used as the light source for the LCD device, and a wavelength conversion sheet is positioned in the path of the light from the light source to convert the emitted light into white light. With the increasing demand for large-scale display devices, the size of the substrates and backlight units used in these devices is also increasing. Summary of the Invention

[0006] Embodiments of this disclosure provide a backlight unit in which a side mold is fixed on a substrate having a plurality of light sources disposed thereon, and a resin layer and optical components are disposed on the substrate in a region defined by the side mold.

[0007] Embodiments of this disclosure also provide a backlight unit in which multiple substrates having multiple light sources disposed thereon are connected to each other.

[0008] Embodiments of this disclosure also provide a display device including a backlight unit in which multiple substrates having multiple light sources disposed thereon are connected to each other.

[0009] However, the embodiments of this disclosure are not limited to those described herein. The above and other embodiments of this disclosure will become more apparent to those skilled in the art from the following detailed description of this disclosure.

[0010] According to an embodiment of the present disclosure, a backlight unit includes: a substrate; a plurality of light sources disposed on a first surface of the substrate; a side mold having a closed-loop shape and fixed to the substrate, the side mold surrounding the plurality of light sources; a resin layer filling a region defined by the side mold; and an optical component disposed on the resin layer in the region defined by the side mold.

[0011] In an example embodiment, the backlight unit includes an adhesive layer inserted between a substrate and a side mold, wherein the side mold is disposed on a first surface of the substrate and fixed to the first surface of the substrate by the adhesive layer.

[0012] In the example embodiment, the side surface of the optical component is aligned with the side surface of the resin layer.

[0013] In an example embodiment, the substrate includes a plurality of grooves disposed on a second surface of the substrate opposite to a first surface of the substrate. The side mold includes a partition wall configured to surround a side surface of the substrate and a plurality of fastening portions protruding from the partition wall and corresponding to the plurality of grooves. The side mold is fastened and fixedly attached to the substrate by means of the fastening portions.

[0014] In the example embodiment, the side surfaces of the substrate, the optical components, and the resin layer are aligned with each other and in direct contact with the inner surface of the partition wall.

[0015] In the example embodiment, the height of the side mold is greater than the height of the resin layer.

[0016] In an example embodiment, the backlight unit includes a reflective layer disposed on a first surface of the substrate and a plurality of openings exposing a plurality of light sources are formed in the reflective layer.

[0017] In the example embodiment, the reflective layer and the multiple light sources do not overlap in the thickness direction of the substrate.

[0018] In an example embodiment, the backlight unit includes a reflective coating disposed on the inner surface of the side mold.

[0019] In the example embodiment, the light source is a light-emitting diode (LED) or an LED chip.

[0020] In the example embodiment, the substrate is a printed circuit board (PCB).

[0021] According to an embodiment of the present disclosure, a backlight unit includes: a light source component including a plurality of light source units arranged in a matrix and disposed adjacent to each other; a side mold disposed along the edge of the light source component; a resin layer filling the area defined by the side mold to cover the light source component; and an optical component disposed on the resin layer in the area defined by the side mold, wherein each of the plurality of light source units includes a substrate and a plurality of light sources disposed on the substrate, and the substrates of each pair of adjacent light source units are connected to each other.

[0022] In an example embodiment, the plurality of light source units include: a first light source unit and a second light source unit disposed on a first side of the first light source unit, and the first substrate of the first light source unit and the second substrate of the second light source unit are coupled to each other.

[0023] In an example embodiment, the first side surface of the first substrate on the first side of the first light source unit is in direct contact with the second side surface of the second substrate on the second side of the second light source unit, which is opposite to the first side of the first light source unit.

[0024] In an example embodiment, the first side surface of the first substrate of the first light source unit on the first side of the first light source unit and the second side surface of the second substrate of the second light source unit on the second side opposite to the first side of the first light source unit include a pair of complementary raised and recessed patterns.

[0025] In an example embodiment, a side mold is disposed on the first light source unit and the second light source unit to surround a plurality of light sources in each of the first light source unit and the second light source unit.

[0026] In an example embodiment, the optical component includes a wavelength filter layer disposed on a resin layer, a diffuser disposed on the wavelength filter layer, and a wavelength conversion plate disposed on the diffuser.

[0027] In the example embodiment, the side surface of the resin layer is aligned with the side surface of the wavelength filter layer, the side surface of the diffuser, and the side surface of the wavelength conversion sheet.

[0028] According to an embodiment of the present disclosure, a display device includes a backlight unit and a display panel disposed on the backlight unit. The backlight unit includes: a light source member comprising a plurality of light source units arranged in a matrix and disposed adjacent to each other; a side mold configured to surround the light source member; a resin layer filling an area defined by the side mold to cover the light source member; and an optical member disposed on the resin layer in the area defined by the side mold. Each of the plurality of light source units includes a substrate and a plurality of light sources disposed on the substrate. The substrates of each pair of adjacent light source units are connected to each other, and the side mold is fixed to the substrates of the plurality of light source units.

[0029] In the example embodiment, the height from the top surface of the substrate to the top surface of the side mold is greater than the height from the top surface of the substrate to the top surface of the optical component.

[0030] According to the foregoing and other embodiments of this disclosure, a backlight unit can be provided in which a side mold is fixed to a printed circuit board (PCB) and a resin layer and optical components are disposed in an area defined by the side mold. During the molding process for forming the resin layer, the side mold can guide the material used to form the resin layer and can adjust the height of the resin layer. After the molding process, the side mold can fix other components of the backlight unit, and thus the manufacturing efficiency of the backlight unit can be improved.

[0031] Furthermore, since the backlight unit is formed by connecting multiple PCBs, the number of light sources provided per unit area can become uniform, and as a result, a display device with uniform brightness can be provided.

[0032] Other features and embodiments may be apparent from the following detailed description, drawings, and claims. Attached Figure Description

[0033] The above and other embodiments and features of this disclosure will become more apparent from the detailed description of the embodiments with reference to the accompanying drawings, wherein:

[0034] Figure 1 This is an exploded perspective view of a display device according to an embodiment of the present disclosure;

[0035] Figure 2 It is along Figure 1 A cross-sectional view taken from line II-II';

[0036] Figure 3 This is a plan view of a light source component according to an embodiment of the present disclosure;

[0037] Figure 4 This is a layout diagram showing the relative positions of the light source component, the reflective layer, and the side mold according to an embodiment of the present disclosure;

[0038] Figure 5 It is along Figure 4 Example cross-sectional view of line V-V';

[0039] Figure 6 It is along Figure 4 Example cross-sectional view taken from line VI-VI';

[0040] Figure 7 It is along Figure 4 Another example cross-sectional view taken from line V-V';

[0041] Figure 8 This is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure;

[0042] Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 and Figure 14 This is a plan view or cross-sectional view illustrating a method of manufacturing a display device according to an embodiment of the present disclosure;

[0043] Figure 15 This is a plan view of a light source component according to another embodiment of the present disclosure;

[0044] Figure 16 This is a plan view of a light source component according to another embodiment of the present disclosure;

[0045] Figure 17 This is a layout diagram showing the relative positions of the light source component and the side mold according to another embodiment of the present disclosure;

[0046] Figure 18 It is shown Figure 17 A magnified exploded perspective view of region A;

[0047] Figure 19 It is along Figure 17 Example cross-sectional view taken from line XIX-XIX';

[0048] Figure 20 It is along Figure 17 Another example cross-sectional view taken from line XIX-XIX'; and

[0049] Figure 21 This is a plan view of a light source component according to another embodiment of the present disclosure. Detailed Implementation

[0050] This disclosure will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the disclosure are illustrated. However, this disclosure may be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art.

[0051] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on another layer or substrate, or there may be an intermediate layer. Conversely, when an element is referred to as being "directly" on another element, there is no intermediate element.

[0052] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0053] Figure 1 This is an exploded perspective view of a display device according to an embodiment of the present disclosure. Figure 2 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0054] refer to Figure 1 and Figure 2 The display device 1 can be applied to various electronic devices, such as televisions (TV), billboards, monitors, personal computers (PCs), laptops, tablets, smartphones, car navigation systems, cameras, car center information displays (CIDs), watch-type electronic devices, personal digital assistants (PDAs), portable multimedia players (PMPs), or game consoles, but this disclosure is not limited thereto. Obviously, the display device 1 can also be applied to other electronic devices besides those described herein.

[0055] As shown in the attached figures, a first direction X, a second direction Y, and a third direction Z are defined. Specifically, the first direction X and the second direction Y can be directions perpendicular to each other in the same plane. The third direction Z can be a direction perpendicular to the plane including the first direction X and the second direction Y. The third direction Z can be perpendicular to each of the first direction X and the second direction Y. The third direction Z refers to the thickness direction of the display device 1.

[0056] Unless otherwise stated, as used herein, the terms "above" and "top" refer to the third direction Z (or one side in the thickness direction of the display device 1), and as used herein, the term "top surface" refers to the surface pointing in the third direction Z. Additionally, unless otherwise stated, as used herein, the terms "below" and "bottom" refer to the opposite direction Z (or the other side in the thickness direction of the display device 1), and as used herein, the term "bottom surface" refers to the surface pointing in the opposite direction Z. Furthermore, unless otherwise stated, as used herein, the terms "left," "right," "up," and "down" refer to their respective directions in a plan view. For example, the term "right" refers to the first direction X, the term "left" refers to the opposite direction X, the term "up" refers to the second direction Y, and the term "down" refers to the opposite direction Y.

[0057] In the plan view, the display device 1 may have a rectangular shape that is longer in the first direction X than in the second direction Y. The angle where the long and short sides of the display device 1 intersect may be a right angle, but this disclosure is not limited thereto. Alternatively, the angle where the long and short sides of the display device 1 intersect may be rounded. However, there is no particular limitation on the planar shape of the display device 1. The display device 1 may have various shapes other than a rectangular shape, such as a square, a circle, an ellipse, or other polygonal shapes. The display surface of the display device 1 may be disposed on one side of the display device 1 in the thickness direction.

[0058] The display device 1 may include a display panel 70, a backlight unit 10 disposed below the display panel 70 and providing light to the display panel 70, and a housing 80 that houses the display panel 70 and the backlight unit 10.

[0059] Display panel 70 can receive light emitted from backlight unit 10 to display images. Display panel 70 can be a light-receiving display panel such as, for example, a liquid crystal display (LCD) panel, an electrowetting display panel, or an electrophoretic display panel. For convenience, display panel 70 will be described below as an LCD panel, but this disclosure is not limited thereto.

[0060] The display panel 70 may include an upper substrate 710, a lower substrate 720 facing the upper substrate 710, and a liquid crystal layer 730 disposed between the upper substrate 710 and the lower substrate 720 (see [reference]). Figure 2 The display panel 70 may further include a plurality of pixels. The pixels of the display panel 70 may be arranged in rows and columns. The display panel 70 may include a switching element and a pixel electrode in each of the pixels, and may further include a common electrode facing the pixel electrode. The switching element and pixel electrode may be disposed on the lower substrate 720, and the common electrode may be disposed on the upper substrate 710. However, this disclosure is not limited thereto. Alternatively, the common electrode may also be disposed on the lower substrate 720. Sealing member 92 (see...) Figure 2 The liquid crystal molecules can be disposed along the edge of each of the upper substrate 710 and the lower substrate 720 to confine the liquid crystal molecules in the liquid crystal layer 730.

[0061] The backlight unit 10 is disposed below the display panel 70. The backlight unit 10 may include a light source component 100, a reflective layer 300, and a resin layer 400 (see [link to documentation]). Figure 2 ), side mold 510 and optical component 600.

[0062] The light source component 100 may include a first substrate 110 and a plurality of light sources 120 disposed on the first substrate 110.

[0063] Light source 120 emits light to provide light to display panel 70. The light emitted from light source 120 can be incident on optical component 600 via resin layer 400 above light source 120. Light source 120 can be a point light source or a surface light source. In one embodiment, light source 120 can be a light-emitting diode (LED) or an LED chip, but this disclosure is not limited thereto. Light source 120 can emit light substantially in an upward direction.

[0064] Light source 120 can emit light within a specific wavelength range. For example, light source 120 can emit blue light with a wavelength range from approximately 420 nm to approximately 470 nm. In some embodiments, light source 120 can emit light with two or more peak wavelengths. For example, light source 120 can emit near-ultraviolet (NUV) light and blue light.

[0065] A reflective layer 300 may be disposed on the first substrate 110 to surround at least one light source 120. That is, the reflective layer 300 and the light source 120 are disposed on the same layer and between two adjacent light sources 120. The reflective layer 300 may reflect at least a portion of the light emitted from the light source 120 through the resin layer 400 toward the optical component 600 but reflected by the optical component 600 rather than transmitted through it, such that the reflected light can enter the optical component 600.

[0066] A resin layer 400 can be stacked on the light source component 100 and the reflective layer 300. The resin layer 400 can be disposed on the light source component 100 and the reflective layer 300 to completely cover the light source 120 and the reflective layer 300. The resin layer 400 can diffuse light emitted from the light source 120. When emitted light enters the optical component 600, the resin layer 400 can prevent the light emitted from the light source 120 from converging.

[0067] The light source component 100, the reflective layer 300, and the resin layer 400 will be described in detail later.

[0068] Optical component 600 may be stacked on resin layer 400. Optical component 600 may include optical sheet, optical film and / or optical plate. In one embodiment, optical component 600 may include wavelength filter layer 610, light guide film 620, diffuser 630 and wavelength conversion sheet 640.

[0069] The wavelength filter layer 610, the light guide film 620, the diffuser 630, and the wavelength conversion sheet 640 are shown arranged sequentially in the third direction Z.

[0070] A wavelength filter layer 610 may be superimposed on the resin layer 400. The wavelength filter layer 610 allows a portion of the light incident on it from the light source 120 to pass through the resin layer 400, while reflecting the remaining light. The light reflectivity of the wavelength filter layer 610 can be varied depending on the wavelength and the angle of incidence of the light on the wavelength filter layer 610.

[0071] The light guide film 620 can be disposed on the wavelength filter layer 610. The light guide film 620 guides light incident on it from the light source 120 through the resin layer 400 and the wavelength filter layer 610 toward the display panel 70.

[0072] The light output pattern 625 can be further disposed on the top surface of the light guide film 620. The light output pattern 625 can be formed to protrude from the top surface of the light guide film 620. The light output pattern 625 can refract or reflect light propagating through the light guide film 620, so that the light can travel toward the display panel 70.

[0073] A diffuser 630 can be superimposed on the light guide film 620 and the light output pattern 625. The diffuser 630 can be positioned spaced apart from the light guide film 620 and the light output pattern 625 in the third direction Z. The diffuser 630 can be positioned at a predetermined distance from the light guide film 620 and the light output pattern 625 to disperse the light emitted from the light source 120 and thus prevent light convergence. The diffuser 630 diffuses the light emitted from the light guide film 620 and the light output pattern 625 toward the display panel 70, allowing the light to be provided to the display panel 70 with uniform brightness.

[0074] The diffuser 630 may include a material that allows light to pass through it. The diffuser 630 may include materials such as, for example, polymethyl methacrylate (PMMA), polypropylene (PP), polyethylene terephthalate (PET), or polycarbonate (PC).

[0075] A wavelength conversion plate 640 may be superimposed on a diffuser plate 630. The wavelength conversion plate 640 converts at least a portion of the wavelength of the light emitted from the diffuser plate 630 toward the display panel 70.

[0076] The wavelength conversion sheet 640 may include an adhesive layer and wavelength conversion particles dispersed in the adhesive layer. The wavelength conversion sheet 640 may further include scattering particles also dispersed in the adhesive layer.

[0077] The adhesive layer, which serves as the medium for dispersing wavelength conversion particles, can be formed from various resin compositions, but this disclosure is not limited thereto. Any type of medium in which wavelength conversion particles and / or scattering particles can be dispersed can be referred to as an adhesive layer, regardless of its actual name, any additional functions, or its composition.

[0078] Wavelength-converting particles, which are particles that convert the wavelength of light incident upon them, can be, for example, quantum dots (QDs), fluorescent materials, or phosphorescent materials. For convenience, wavelength-converting particles are described hereinafter as QDs, but this disclosure is not limited thereto.

[0079] Quantum luminescence (QD), a material with a crystal structure of a few nanometers in size, consists of hundreds to thousands of atoms and exhibits a quantum confinement effect due to its small size, resulting in an increased band gap. When light with a wavelength higher than the band gap is incident on a QD, the QD absorbs the light, becomes excited, emits light of a specific wavelength, and falls back to its ground state. The light emitted from the QD has a value corresponding to the band gap. By adjusting the size and composition of the QD, the luminescence properties generated by the quantum confinement effect can be controlled.

[0080] QD may include at least one of, for example, group II-VI compounds, group II-V compounds, group III-VI compounds, group III-V compounds, group IV-VI compounds, group II-IV-VI compounds, and group II-IV-V compounds.

[0081] Each of the QDs may include a core and a shell covering the core. The core may be, but is not limited to, at least one of, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InP, InAs, InSb, SiC, Ca, Se, In, P, Fe, Pt, Ni, Co, Al, Ag, Au, Cu, FePt, Fe2O3, Fe3O4, Si, and Ge. The shell may include, but is not limited to, at least one of, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, HgS, HgSe, HgTe, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, GaSe, InN, InP, InAs, InSb, TlN, TlP, TlAs, TlSb, PbS, PbSe, and PbTe.

[0082] Wavelength conversion particles may include multiple wavelength conversion particles that convert the wavelength of incident light into different wavelengths. For example, wavelength conversion particles may include a first wavelength conversion particle that converts the wavelength of incident light into a first wavelength and a second wavelength conversion particle that converts the wavelength of incident light into a second wavelength. In one embodiment, the light incident on the wavelength conversion particles from the light source 120 may be blue wavelength light, the first wavelength may be green wavelength light, and the second wavelength may be red wavelength light. The blue wavelength may have a peak wavelength from about 420 nm to about 470 nm, the green wavelength may have a peak wavelength from about 520 nm to about 570 nm, and the red wavelength may have a peak wavelength from about 620 nm to about 670 nm. However, there are no particular limitations on the blue, green, and red wavelengths, but it should be understood that they cover all wavelength ranges that can be perceived as blue, green, and red, respectively.

[0083] Although not specifically shown, at least one optical sheet may be further disposed on the wavelength conversion sheet 640. The optical sheet can perform optical functions such as convergence, refraction, diffusion, reflection, polarization, and phase retardation. Examples of optical sheets include prism sheets, microlenses, biconvex lenses, polarizers, reflective polarizers, retardation sheets, and protective sheets. In some embodiments, the optical sheet may have multiple layers with multiple optical functions incorporated therein.

[0084] A side mold 510 may be disposed on the first substrate 110. The side mold 510 may be disposed along the outer edge of the first substrate 110 to surround the light source 120 disposed on the first substrate 110. The side mold 510 may be disposed on the first substrate 110 in a closed-loop shape (i.e., a cylindrical shape) with an opening in the middle. A reflective layer 300, a resin layer 400, and an optical component 600 may be disposed in the area defined by the side mold 510. The optical component 600 may be fixed to the inner surface of the side mold 510 by an adhesive component.

[0085] The side mold 510 will be described in detail later.

[0086] The housing 80 houses the backlight unit 10 and the display panel 70. The housing 80 may include a bottom rack or bracket. Although not specifically shown, the housing 80 may further include a top rack.

[0087] The housing 80 may have a bottom surface 81 and side walls 82. The side walls 82 may be connected to the bottom surface 81 and bend vertically from the bottom surface 81. The light source component 100 of the backlight unit 10 is disposed on the bottom surface 81 of the housing 80. The backlight unit 10 and the display panel 70 may be fixedly attached to the side walls 82 of the housing 80 by tape 91, but this disclosure is not limited thereto. Alternatively, the backlight unit 10 and the display panel 70 may be mounted on another mounting structure of the housing 80, or may be mounted on or attached to a molded frame provided in the housing 80.

[0088] Figure 3 This is a plan view of a light source component according to an embodiment of the present disclosure.

[0089] refer to Figure 3 The light source component 100 may have a planar shape similar to that of the display panel 70. For example, if the display panel 70 has a rectangular shape in a plan view, the light source component 100 may have a similar rectangular shape in a plan view. In a plan view, the dimensions of the light source component 100 may be substantially the same as those of the display panel 70, but this disclosure is not limited thereto.

[0090] The light source component 100 may include one or more light source units. The light source units may be arranged in a matrix. The light source units may be arranged adjacent to each other. That is, pairs of adjacent light source units may be arranged to be adjacent to each other.

[0091] In one embodiment, the light source component 100 may include a first light source unit UT1 and a second light source unit UT2.

[0092] Apart from their positions, the first light source unit UT1 and the second light source unit UT2 can be substantially the same (e.g., in terms of function and structure). In the following, the common features of the first light source unit UT1 and the second light source unit UT2 will be described using the first light source unit UT1 as an example.

[0093] The first light source unit UT1 may include a first substrate 110 and a plurality of light sources 120 disposed on the first substrate 110.

[0094] The first substrate 110 may have a square shape in a plan view. In the plan view, the length Ax of the first substrate 110 in the first direction X and the length Ay of the first substrate 110 in the second direction Y may be the same. For example, lengths Ax and Ay may be in the range of approximately 280 mm to approximately 320 mm, or lengths Ax and Ay may be approximately 300 mm. In the following description, the first substrate 110 will be depicted as having a square shape in a plan view, but this disclosure is not limited thereto. Alternatively, the first substrate 110 may have various other shapes in the plan view, such as a rectangular shape or a circular shape. That is, the first substrate 110 may have any polygonal shape.

[0095] The light source 120 may have a square shape in a planar view. In the planar view, both the length Lx of the light source 120 in the first direction X and the length Ly of the light source 120 in the second direction Y may be in the range of approximately 100 μm to approximately 500 μm. In the following description, the light source 120 will be depicted as having a square shape in a planar view, but this disclosure is not limited thereto. Alternatively, the light source 120 may have various other shapes in the planar view, such as a rectangular shape or a circular shape. That is, each of the light sources 120 may have any polygonal shape.

[0096] Multiple light sources 120 can be arranged in a matrix on the first substrate 110. The light sources 120 can be arranged at regular intervals to be spaced apart from each other in the first direction X and the second direction Y in a plan view. That is, the light-emitting portions of the light sources 120 are spaced apart from each other. Therefore, if the light-emitting portions of the light sources 120 are spaced apart from each other, then the light sources 120 can be interpreted as spaced apart not only when the illumination components of the light sources 120 are spaced apart from each other, but also when the illumination components of the light sources 120 are adjacent to or even connected to each other. The number of light sources 120 disposed on the first substrate 110 can be, but is not limited to, approximately 900.

[0097] The orientation of the light source 120 is shown to be consistent with the direction in which the long and short sides of the display device 1 extend, but this disclosure is not limited thereto. Alternatively, the orientation of the light source 120 may be tilted relative to the direction in which the long and short sides of the display device 1 extend.

[0098] The distance dx between two horizontally adjacent light sources 120 in the first direction X and the distance dy between two vertically adjacent light sources 120 in the second direction Y can be the same, but this disclosure is not limited thereto. Alternatively, the distance dx between two adjacent light sources 120 in the first direction X and the distance dy in the second direction Y can be different. The light sources 120 are shown as arranged in rows and columns extending in a straight line, but this disclosure is not limited thereto. Alternatively, the light sources 120 can be arranged in staggered rows and staggered columns.

[0099] Each of the first substrates 110 of the light source unit may have a first side, a second side, a third side, and a fourth side in a plan view. The first side may refer to the right side in the plan view (i.e., one side in the first direction X), the second side may refer to the left side in the plan view (i.e., another side in the first direction X), the third side may refer to the top side in the plan view (i.e., one side in the second direction Y), and the fourth side may refer to the bottom side in the plan view (i.e., another side in the second direction Y).

[0100] As described above, the light source units can be arranged in a matrix. The first light source unit UT1 and the second light source unit UT2 can be aligned side by side in the first direction X. That is, the second light source unit UT2 can be set to be adjacent to the first light source unit UT1 in the first direction X.

[0101] In the plan view, the upper edges of the first substrate 110 of the first light source unit UT1 and the first substrate 110 of the second light source unit UT2 can be aligned side-by-side. Similarly, in the plan view, the lower edges of the first substrate 110 of the first light source unit UT1 and the lower edges of the first substrate 110 of the second light source unit UT2 can be aligned side-by-side. The right side of the first substrate 110 of the first light source unit UT1 and the left side of the first substrate 110 of the second light source unit UT2 can be adjacent to each other. That is, the first light source unit UT1 and the second light source unit UT2, which are adjacent to each other, can be set to be adjacent to each other.

[0102] Figure 4 This is a layout diagram showing the relative positions of the light source component, the reflective layer, and the side mold according to an embodiment of the present disclosure.

[0103] refer to Figure 3 and Figure 4 The reflective layer 300 can be disposed on the first light source unit UT1 and the second light source unit UT2. Specifically, the reflective layer 300 can be disposed on the entire first surface of the first substrate 110 of the first light source unit UT1 and the second light source unit UT2, excluding the portion where the light source 120 is disposed, but this disclosure is not limited thereto. The reflective layer 300 can be configured to correspond to each of the first light source unit UT1 and the second light source unit UT2.

[0104] The reflective layer 300 may have a planar shape similar to that of the display panel 70. For example, if the display panel 70 has a rectangular shape in a planar view, the reflective layer 300 may have a similar rectangular shape in a planar view. In the planar view, the size of the reflective layer 300 may be smaller than the size of the first substrate 110 of the light source member 100, but this disclosure is not limited thereto.

[0105] like Figure 4 As depicted, one or more openings 310H may be defined in the reflective layer 300. The opening 310H may be formed to completely penetrate the reflective layer 300 in the third direction Z (or in the thickness direction). The opening 310H may have a cylindrical shape having a predetermined width W1 and a predetermined height h2.

[0106] The height h2 of the opening 310H can be equal to the height of the reflective layer 300 along the third direction Z.

[0107] In the plan view, the openings 310H may all have the same circular shape with the same area, but this disclosure is not limited thereto. Alternatively, in the plan view, the openings 310H may have various other shapes, such as square, elliptical, or rectangular shapes, and may have different dimensions from each other.

[0108] The openings 310H can be formed to be spaced apart from each other by a predetermined distance. The openings 310H can be formed to be spaced apart from each other by a predetermined distance in a first direction X and a second direction Y. A reflective layer 300 can be provided so that each of the openings 310H exposes at least one light source 120 in a third direction Z (or in the thickness direction). In one embodiment, the openings 310H can be formed to correspond one-to-one with the light source 120.

[0109] An opening 310H formed in the reflective layer 300 can be configured to surround at least one light source 120. That is, the opening 310H can completely expose the light source 120 in the third direction Z. In one embodiment, each of the openings 310H can have a larger area than each of the light sources 120, such that the light source 120 can be completely exposed in the direction of the display surface of the display device 1.

[0110] Return to reference Figure 2 The side mold 510 can be disposed in a closed-loop shape on the outer edge of each of the first substrates 110 of the light source member 100. The side mold 510 can be disposed on the edge of each of the first substrates 110 of the light source member 100 where the reflective layer 300 and the light source 120 are disposed. The side mold 510 can be configured to surround the light source 120 and the reflective layer 300. The side mold 510 can be configured to be spaced apart from the light source 120 by a predetermined distance and can be configured to be adjacent to the reflective layer 300, but this disclosure is not limited thereto. Alternatively, the side mold 510 can be configured to be spaced apart not only from the light source 120 but also from the reflective layer 300 by a predetermined distance.

[0111] In one embodiment, the outer edge of the light source component 100 can be formed by the upper, lower, and left sides of the first substrate 110 of the first light source unit UT1 and the upper, lower, and right sides of the first substrate 110 of the second light source unit UT2. In this embodiment, the side mold 510 can be disposed on the outer edge of the light source component 100, that is, disposed on the upper, lower, and left sides of the first substrate 110 of the first light source unit UT1 and the upper, lower, and right sides of the first substrate 110 of the second light source unit UT2, and can be fixed on the first substrate 110 of the first light source unit UT1 and the second light source unit UT2. Thus, the area defined by the side mold 510 can be the area in which the light source 120 and the reflective layer 300 are disposed.

[0112] Figure 5 It is along Figure 4 Example cross-sectional view of line V-V'. Figure 6 It is along Figure 4 Example cross-sectional view taken from line VI-VI'.

[0113] Specifically, Figure 5 yes Figure 4A cross-sectional view of the backlight unit 10 taken along the second direction Y, and Figure 6 yes Figure 4 A cross-sectional view of the backlight unit 10 taken along the first direction X. In the following text, reference will be made to... Figure 5 and Figure 6 Describe the cross-sectional structure of the backlight unit 10.

[0114] refer to Figure 3 , Figure 4 and Figure 5 The first substrate 110 may be a circuit board or an insulating substrate. In one embodiment, the first substrate 110 may be a circuit board. In this embodiment, the first substrate 110 may be a printed circuit board (PCB). When the first substrate 110 is a PCB, a plurality of light sources 120 may be mounted on each of the first substrate 110. The light sources 120 mounted on each of the first substrate 110 may be electrically connected. However, this disclosure is not limited thereto. In another embodiment, the first substrate 110 may be an insulating substrate. In this embodiment, the first substrate 110 may include a transparent material such as glass or quartz or a polymeric material such as polyimide. When the first substrate 110 is an insulating substrate, the light source component 100 may further include a circuit element layer (not shown) for driving the light sources 120. The circuit element layer may be formed on a first surface of the first substrate 110, or may be formed as a PCB to be attached or fixed to the first surface of the first substrate 110. For convenience, the first substrate 110 will be described below as a circuit board.

[0115] The light source 120 may be disposed on a first surface of the first substrate 110 (i.e., the surface of the first substrate 110 pointing in the third direction Z). The light source 120 may include an LED. A diffusion lens (not shown) may be further disposed above the light source 120, but alternatively, as... Figure 5 and Figure 6 As shown, the light source 120 can be directly exposed. Each of the light sources 120 can emit light substantially in an upward direction.

[0116] Each of the 120 light sources can have a rectangular shape in the planar view. That is, as shown below. Figure 3 and Figure 5As depicted, the length Lx of the light source 120 in the first direction X and the length Ly of the light source 120 in the second direction Y can be approximately 100 μm to approximately 500 μm, respectively. The height h1 of the light source 120 can be less than the lengths Lx and Ly of the light source 120, and can be, for example, approximately 250 μm to approximately 300 μm. In one embodiment, each of the light sources 120 can have a square shape in a plan view, the lengths Lx and Ly of the light source 120 can both be approximately 500 μm, and the height h1 of the light source 120 (i.e., the distance from the top surface of the first substrate 110 to the top surface of the light source 120 in the third direction Z) can be approximately 250 μm.

[0117] The reflective layer 300 may be disposed on the portion of the first surface of the first substrate 110 where the light source 120 is not disposed. The reflective layer 300 may reflect light emitted from the light source 120 and then leaking to the side and / or light emitted from the light source 120 and then reflected from the wavelength filter layer 610 instead of being transmitted through the wavelength filter layer 610, so that light can re-enter the wavelength filter layer 610.

[0118] The reflective layer 300 may include a reflective material. The reflective layer 300 may be formed, for example, of a metal or a metallic material, such as silver (Ag), copper (Cu), aluminum (Al), nickel (Ni), lanthanum (La) or alloys thereof, or, for example, indium tin oxide (ITO), indium zinc oxide or indium tin zinc oxide (ITZO).

[0119] In the plan view, the reflective layer 300 can be configured to surround the light source 120. In one embodiment, the reflective layer 300 may not overlap with the light source 120 along the third direction Z. That is, the height h1 of the light source 120 is substantially equal to the height h2 of the reflective layer 300. In another embodiment, the reflective layer 300 may not completely overlap with the light source 120 in the third direction Z. That is, the height h1 of the light source 120 is substantially greater than the height h2 of the reflective layer 300. In yet another embodiment, the light source 120 may not completely overlap with the reflective layer 300 in the third direction Z. That is, the height h1 of the light source 120 is substantially less than the height h2 of the reflective layer 300. In one embodiment, as... Figure 4 As depicted, the reflective layer 300 may include an opening 310H at the location of the light source 120 arranged in a matrix, and may be horizontally and vertically spaced apart from the light source 120 above the first substrate 110. The reflective layer 300 may not overlap with the light source 120 above the first substrate 110 in the third direction Z.

[0120] The reflective layer 300 has a top surface and a bottom surface. The top surface and the bottom surface of the reflective layer 300 are opposite to each other. Each of the top surface and the bottom surface of the reflective layer 300 can lie substantially on a plane, and the planes on which the top surface and the bottom surface of the reflective layer 300 lie can be substantially parallel. Thus, the reflective layer 300 can generally have a uniform thickness. The bottom surface of the reflective layer 300 can be disposed on a first surface of the first substrate 110.

[0121] The reflective layer 300 may include sidewalls exposed by the opening 310H. The sidewalls of the reflective layer 300 may face the light source 120. In one embodiment, the plane containing the sidewalls of the reflective layer 300 may form an angle of approximately 90° with the plane containing the top or bottom surface of the reflective layer 300. The sidewalls of the reflective layer 300 may also form an angle of approximately 90° relative to the plane containing the top surface of the first substrate 110.

[0122] The thickness or height h2 of the reflective layer 300 (i.e., the distance from the first surface of the first substrate 110 to the top surface of the reflective layer 300 in the third direction Z) can be substantially equal to the height h1 of the light source 120. In one embodiment, when the height h1 of the light source 120 is about 250 μm to about 300 μm, the height h2 of the reflective layer 300 can be about 250 μm to about 300 μm, but this disclosure is not limited thereto.

[0123] The side mold 510 can be disposed on the portion of the first substrate 110 where the reflective layer 300 and the light source 120 are not disposed. During the formation of the resin layer 400, the side mold 510 can guide the material layer used to form the resin layer 400 to be properly positioned, and the height of the resin layer 400 can be adjusted. Even after the resin layer 400 has been formed, the side mold 510 can still be disposed on the first substrate 110 to fix the optical component 600.

[0124] The side mold 510 may include at least one of polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), and glass fiber (GF). In one embodiment, the side mold 510 may include a mixture of polycarbonate resin and glass fiber (e.g., PC GF 10%).

[0125] The side mold 510 may have a top surface, a bottom surface, and side surfaces. The bottom surface of the side mold 510 may be disposed on the top surface of the first substrate 110. The top surface of the side mold 510 may be opposite to the bottom surface of the side mold 510. Each of the top and bottom surfaces of the side mold 510 may lie substantially on a plane, and the planes on which the top and bottom surfaces of the side mold 510 lie may be substantially parallel. Thus, the side mold 510 may generally have a uniform height.

[0126] like Figure 5 As depicted, the height h4 of the side mold 510 (i.e., the distance from the first surface of the first substrate 110 to the top surface of the side mold 510 in the third direction Z) can be greater than the height h2 of the reflective layer 300, the height h3 of the resin layer 400 and / or the height h5 of the optical component 600 from the first substrate 110.

[0127] The side mold 510 can be fixed to the top surface of the first substrate 110 by an adhesive layer 530. The adhesive layer 530 can be inserted between the side mold 510 and the first substrate 110. The adhesive layer 530 may include, for example, a heat dissipation strip, double-sided tape, resin, polyurethane, and various other adhesives, but this disclosure is not limited thereto. The top surface of the adhesive layer 530 can contact the bottom surface of the side mold 510, and the bottom surface of the adhesive layer 530 can contact the top surface of the first substrate 110. The side surfaces of the adhesive layer 530 can be formed parallel to the side surfaces of the side mold 510.

[0128] A resin layer 400 can be disposed in the area defined by the side mold 510. The resin layer 400 can be configured to completely cover the light source 120 and the reflective layer 300 disposed in the area defined by the side mold 510. Therefore, the resin layer 400 can fill the gap between the reflective layer 300 and the light source 120. The resin layer 400 can be configured to cover the top and side surfaces of each of the light sources 120 and the top and side surfaces of the reflective layer 300.

[0129] The thickness or height h3 of the resin layer 400 (i.e., the distance from the first surface of the first substrate 110 to the top surface of the resin layer 400 in the third direction Z) can be greater than the height h1 of the light source 120. In one embodiment, the height h3 of the resin layer 400 can be approximately 25 mm to approximately 27 mm, but this disclosure is not limited thereto.

[0130] The resin layer 400 can protect the light source 120 by covering the top and side surfaces of each of the light sources 120. Furthermore, the resin layer 400 can prevent deformation of the optical component 600 by blocking a portion of the heat from the light emitted from the light source 120. Moreover, the resin layer 400 can be disposed above the light source 120 to diffuse the light emitted from the light source 120 without the need for additional lenses. Therefore, the resin layer 400 can improve brightness uniformity by preventing the light emitted from the light source 120 from converging only at the top of the light source 120.

[0131] The resin layer 400 may include a light-transmitting material. The resin layer 400 may include optically transparent resin (OCR), epoxy resin, or silicone resin, but this disclosure is not limited thereto. There are no particular limitations on the material of the resin layer 400, as long as it allows light to pass through it without damaging the light source 120.

[0132] Optical component 600 may be disposed on resin layer 400. Optical component 600 may be disposed in the area defined by side mold 510. Although not specifically shown, optical component 600 may be fixed to the side surface of side mold 510 by adhesive component.

[0133] Specifically, the wavelength filtering layer 610, light guide film 620, diffuser 630, and wavelength conversion layer 640 can be sequentially disposed on the resin layer 400 along the third direction Z. The wavelength filtering layer 610, light guide film 620, diffuser 630, and wavelength conversion layer 640 can be spaced apart from each other in the third direction Z. The wavelength filtering layer 610, light guide film 620, diffuser 630, and wavelength conversion layer 640 can be spaced apart from each other by a predetermined distance in the third direction Z, thereby diffusing light emitted from the light source 120 and preventing light convergence. At least one of the wavelength filtering layer 610, light guide film 620, diffuser 630, and wavelength conversion layer 640 can be fixed to the side surface of the side mold 510 by an adhesive member. The side surfaces of the wavelength filtering layer 610, light guide film 620, diffuser 630, and wavelength conversion layer 640 can be substantially aligned with each other.

[0134] refer to Figure 6 The first light source unit UT1 and the second light source unit UT2 can be arranged adjacent to each other. The first substrates 110 of the first light source unit UT1 and the second light source unit UT2 can be arranged adjacent to each other along the first direction X. The right side of the first substrate 110 of the first light source unit UT1 and the left side of the first substrate 110 of the second light source unit UT2 can be adjacent to each other. Therefore, the first substrates 110 of the first light source unit UT1 and the second light source unit UT2 can be connected to each other.

[0135] The reflective layer 300 may be disposed on the portion of the first substrate 110 exposed to the light source 120. The reflective layer 300 may be disposed on the first light source unit UT1 and the second light source unit UT2. The reflective layer 300 may be configured to overlap with the opposite side surfaces of the first substrate 110 of the first light source unit UT1 and the second light source unit UT2 that are adjacent to each other in the third direction Z.

[0136] Figure 7 It is along Figure 4 Another example cross-sectional view taken from line V-V'.

[0137] refer to Figure 7 The side mold 510_7 may include a partition wall 511 and a reflective coating 513 disposed on the inner surface of the partition wall 511.

[0138] Specifically, the partition wall 511 can have the same characteristics as... Figure 5The side mold 510 has a substantially the same shape. A reflective coating 513 is disposed at least on some portions of the inner surface of the partition wall 511. The reflective coating 513 may cover some portions of the inner surface of the partition wall 511. The reflective coating 513 may be disposed on the inner surface of the partition wall 511 up to the height of the resin layer 400. The reflective coating 513 may contact the side surfaces of the resin layer 400 and the reflective layer 300. However, this disclosure is not limited thereto. Alternatively, the reflective coating 513 may be configured to cover the entire inner surface of the partition wall 511.

[0139] The reflective coating 513 may comprise a material with high reflectivity, such as a metal. In one embodiment, the reflective coating 513 may be formed, for example, of a metallic material, such as silver (Ag), copper (Cu), aluminum (Al), nickel (Ni), lanthanum (La), or alloys thereof, or, for example, indium tin oxide (ITO), indium zinc oxide, or indium tin zinc oxide (ITZO), but this disclosure is not limited thereto. The reflective coating 513 may be deposited or coated directly onto the inner surface of the partition wall 511. In another embodiment, the reflective coating 513 may be attached to the inner surface of the partition wall 511 via an adhesive layer.

[0140] The reflective coating 513 can reflect at least a portion of the light emitted from the light source 120 through the resin layer 400 toward the wavelength filter layer 610, but reflected from the wavelength filter layer 610 instead of being transmitted through it, and thus propagating toward the inner surface of the partition wall 511. As described above, the reflective coating 513 disposed on the inner surface of the partition wall 511 can recirculate light that fails to strike the wavelength filter layer 610 and is reflected toward the inner surface of the side module 510_7, so that it can re-enter the wavelength filter layer 610. Thus, the reflective coating 513 can minimize light leakage and diversify the angle of incidence of light on the wavelength filter layer 610.

[0141] Figure 8 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure. Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 and Figure 14 This is a plan view or cross-sectional view illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0142] refer to Figure 8A method for manufacturing a display device according to an embodiment of the present disclosure includes: preparing one or more light source units, namely a first light source unit UT1 and a second light source unit UT2 (step S100); forming a light source component 100 by connecting the first light source unit UT1 and the second light source unit UT2 (step S200); forming a reflective layer 300 on the light source component 100 (step S300); forming a side mold 510 on the outer edge of the light source component 100 (step S400); forming a resin layer 400 on the light source component 100 in the region defined by the side mold 510 (step S500); and forming an optical component 600 on the resin layer 400 in the region defined by the side mold 510 (step S600).

[0143] First, such as Figure 9 As shown, multiple light source units are prepared ( Figure 8 Step S100).

[0144] Specifically, refer to Figure 8 and Figure 9 Prepare a first light source unit UT1 and a second light source unit UT2. Each of the first light source unit UT1 and the second light source unit UT2 may include a first substrate 110 and a plurality of light sources 120 disposed on the first substrate 110. The first substrate 110 and the light sources 120 of each of the light source units are as described above. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The description is as described, and therefore its detailed description will be omitted.

[0145] Secondly, such as Figure 10 As shown, a light source component 100 is formed by connecting light source units. Figure 8 Step S200).

[0146] Specifically, refer to Figure 8 and Figure 10 A light source component 100 is formed by connecting a first light source unit UT1 and a second light source unit UT2. The first light source unit UT1 and the second light source unit UT2 can be aligned side-by-side in a first direction X. In this case, in a plan view, the first light source unit UT1 and the second light source unit UT2 can be connected such that the right side of the first substrate 110 of the first light source unit UT1 and the left side of the first substrate 110 of the second light source unit UT2 can be adjacent to each other. As described above, the upper edges of the first substrates 110 of the first light source unit UT1 and the second light source unit UT2 can be aligned side-by-side to fall on the same line, and the lower edges of the first substrates 110 of the first light source unit UT1 and the second light source unit UT2 can be aligned side-by-side to fall on the same line.

[0147] The first substrates 110 of the first light source unit UT1 and the second light source unit UT2 can be connected by a pair of complementary fastening patterns formed on the first substrates 110 of the first light source unit UT1 and the second light source unit UT2, which will be described in detail later.

[0148] Third, such as Figure 11 As shown, a reflective layer 300 is formed on the light source component 100. Figure 8 Step S300).

[0149] Specifically, refer to Figure 8 and Figure 11 A reflective layer 300 is formed on a light source member 100 formed by connecting a first light source unit UT1 and a second light source unit UT2, and a plurality of openings 310H are formed in the reflective layer 300. The reflective layer 300 can be formed to overlap with both the first light source unit UT1 and the second light source unit UT2. The openings 310H of the reflective layer 300 can be configured to correspond one-to-one with the light source 120 of either the first light source unit UT1 or the second light source unit UT2.

[0150] Fourth, such as Figure 12 As shown, a side mold 510 is formed on the outer edge of the light source component 100. Figure 8 Step S400).

[0151] Specifically, refer to Figure 8 and Figure 12 A side mold 510 can be formed on the portion of the reflective layer 300 exposed in the third direction Z at the outer edge of the first substrate 110 of the light source component 100. In one embodiment, the side mold 510 can be fixedly attached to the top surface of the first substrate 110 of the light source component 100 by means of an adhesive member 530 inserted between the top surface of the first substrate 110 of the light source component 100 and the bottom surface of the side mold 510.

[0152] Fifth, such as Figure 13 As shown, a resin layer 400 is formed on the light source member 100 in the region defined by the side mold 510. Figure 8 Step S500).

[0153] Specifically, refer to Figure 8 and Figure 13The material for forming the resin layer 400 can be applied in the area defined by the side mold 510. The material for forming the resin layer 400 can be a liquid material. The liquid material for forming the resin layer 400 can be guided by the side mold 510, which is disposed along the outer edge of the light source member 100 to form an enclosed space, and therefore can be applied in the area defined by the side mold 510. In this case, since the side mold 510 is formed to a greater height than the resin layer 400, the height h3 of the resin layer 400 can be controlled by the side mold 510 (e.g., h3). Figure 5 (As shown in the diagram). After the liquid material for forming the resin layer 400 is applied to the light source component 100, UV curing or thermal curing can be performed to cure the resin layer 400.

[0154] Sixth, such as Figure 14 As shown, an optical component 600 is formed on a resin layer 400 in the region defined by the side mold 510. Figure 8 Step S600).

[0155] Specifically, refer to Figure 8 and Figure 14 An optical component 600 is formed on a resin layer 400 in the region defined by the side mold 510. The optical component 600 can be fixedly attached to the side surface of the side mold 510 by an optically transparent adhesive (OCA) or an optically transparent resin (OCR). The side surface of the optical component 600 can be fixed to and substantially aligned with the side surface of the side mold 510. Therefore, the side surface of the optical component 600 can be substantially aligned with the side surface of the resin layer 400 disposed in the region defined by the side mold 510.

[0156] In the following description, other embodiments of this disclosure will be described with a focus on the differences from the embodiments described above.

[0157] Figure 15 This is a plan view of the light source component 100_15 according to another embodiment of the present disclosure. Figure 16 This is a plan view of the light source component 100_16 according to another embodiment of the present disclosure.

[0158] Figure 15 and Figure 16 Implementation examples and Figure 3 The difference in the embodiment is that a pair of complementary fastening patterns are formed at the first substrate of the first light source unit and the second light source unit. That is, a pair of complementary fastening patterns are formed at the boundary between the first light source unit and the second light source unit.

[0159] refer to Figure 15 and Figure 16 A pair of complementary fastening patterns that can lock onto each other can be formed on the right side surface of the first substrate of the first light source unit and the left side surface of the first substrate of the second light source unit.

[0160] First, refer to Figure 15 The right side surface of the first substrate 110_15 of the first light source unit UT1_15 may be uneven. A regular repeating pattern of protrusions and depressions may be formed on the right side surface of the first substrate 110_15 of the first light source unit UT1_15. The protrusions and depressions formed on the right side surface of the first substrate 110_15 of the first light source unit UT1_15 may be substantially trapezoidal in shape.

[0161] The left side surface of the first substrate 110_15 of the second light source unit UT2_15, which is in contact with and connected to the right side surface of the first substrate 110_15 of the first light source unit UT1_15, may also be uneven. A regular repeating pattern of protrusions and depressions may also be formed on the left side surface of the first substrate 110_15 of the second light source unit UT2_15. The pattern formed on the left side surface of the first substrate 110_15 of the second light source unit UT2_15 may be complementary to the pattern formed on the right side surface of the first substrate 110_15 of the first light source unit UT1_15. Therefore, the protrusions and depressions formed on the left side surface of the first substrate 110_15 of the second light source unit UT2_15 may also be substantially trapezoidal in shape.

[0162] When the pattern on the right side surface of the first substrate 110_15 of the first light source unit UT1_15 is complementary to the pattern on the left side surface of the first substrate 110_15 of the second light source unit UT2_15, the right side surface of the first substrate 110_15 of the first light source unit UT1_15 and the left side surface of the first substrate 110_15 of the second light source unit UT2_15 can be locked together, allowing the first light source unit UT1_15 and the second light source unit UT2_15 to be fixedly connected. In this case, the first light source unit UT1_15 and the second light source unit UT2_15 can be connected without the aid of additional adhesive members. Furthermore, since the first light source unit UT1_15 and the second light source unit UT2_15 are connected by locking the first substrate 110_15 of the first light source unit UT1_15 and the second light source unit UT2_15 together, alignment errors can be reduced, and the bonding between the first light source unit UT1_15 and the second light source unit UT2_15 can be improved.

[0163] refer to Figure 16In the plan view, the first substrate 111 of the first light source unit UT1_16 and the first substrate 112 of the second light source unit UT2_16 can have different shapes. Specifically, multiple recesses can be formed on the right side surface of the first substrate 111 of the first light source unit UT1_16. Multiple protrusions can be formed on the left side surface of the first substrate 112 of the second light source unit UT2_16. The recesses on the right side surface of the first substrate 111 of the first light source unit UT1_16 can complement the protrusions on the left side surface of the first substrate 112 of the second light source unit UT2_16. Therefore, since the first light source unit UT1_16 and the second light source unit UT2_16 can be fixedly connected by locking the first substrates 111 and 112 of the first light source unit UT1_16 and the second light source unit UT2_16 to each other, alignment errors can be reduced and the bonding between the first light source unit UT1_16 and the second light source unit UT2_16 can be improved.

[0164] Figure 17 This is a layout diagram showing the relative positions of the light source component and the side mold according to another embodiment of the present disclosure. Figure 18 It is shown Figure 17 A magnified exploded perspective view of region A. Figure 19 It is along Figure 17 Example cross-sectional view taken from line XIX-XIX'.

[0165] Figure 17 , Figure 18 and Figure 19 Implementation examples and Figure 5 The difference in this embodiment is that the side mold 510_17 is directly fastened to the bottom surface of the first substrate 110_17. (See reference...) Figure 17 , Figure 18 and Figure 19 The side mold 510_17 may include a partition wall 511_17 and a plurality of fastening portions 512_17 protruding from the partition wall 511_17. The fastening portions 512_17 of the side mold 510_17 formed in the first substrate 110_17 will be fastened to the plurality of grooves 110HM therein.

[0166] The partition wall 511_17 has the same Figure 5 The side mold 510 has a substantially the same shape. The partition wall 511_17 can be configured to surround the outer surface of the light source member 100_17. Specifically, the partition wall 511_17 can be configured to surround the outer surface of the first substrate 110_17 of the light source member 100_17. Therefore, the inner surface of the partition wall 511_17 can be at least partially configured to adjoin the outer surface of the first substrate 110_17. Figure 17 , Figure 18 and Figure 19In the embodiment, since the partition wall 511_17 is configured to surround the side surface of the first substrate 110_17, the side surface of the first substrate 110_17, the side surface of the reflective layer 300, the side surface of the resin layer 400 and the side surface of the optical component 600 can be aligned with the inner surface of the partition wall 511_17.

[0167] The fastening portion 512_17 may protrude from a portion of the inner surface of the partition wall 511_17 into the area defined by the partition wall 511_17. The fastening portions 512_17 may be arranged at regular intervals to protrude in a direction perpendicular to the direction in which the partition wall 511_17 extends, but this disclosure is not limited thereto. The fastening portion 512_17 may be formed such that the lower portion of the inner surface of the partition wall 511_17 protrudes. The fastening portion 512_17 may be integrally formed with the partition wall 511_17. The thickness of the fastening portion 512_17 in the third direction Z may be less than the thickness of the first substrate 110_17.

[0168] One or more fasteners 512_17 may be formed on each of the inner surfaces of the partition walls 511_17. The fasteners 512_17 formed on each of the inner surfaces of the partition walls 511_17 may be spaced apart from each other. Figure 17 It is shown that eight fastening portions 512_17 are formed on each of the inner surfaces of the partition wall 511_17 extending in the first direction X, and four fastening portions 512_17 are formed on each of the inner surfaces of the partition wall 511_17 extending in the second direction Y. However, there is no particular limitation on the number of fastening portions 512_17 formed on each of the inner surfaces of the partition wall 511_17.

[0169] A groove 110HM can be formed in the first substrate 110_17 to couple the first substrate 110_17 and the side mold 510_17. Specifically, the groove 110HM can be formed on the bottom surface of the first substrate 110_17 to correspond to the fastening portion 512_17 of the side mold 510_17. When the fastening portion 512_17 of the side mold 510_17 is inserted into the groove 110HM formed on the bottom surface of the first substrate 110_17, the side mold 510_17 can be fixedly attached to the first substrate 110_17.

[0170] The number of grooves 110HM formed on the first substrate 110_17 can be the same as the number of fastening portions 512_17 formed on the side mold 510_17, but this disclosure is not limited thereto. In order to couple the first substrate 110_17 and the side mold 510_17 by inserting the fastening portions 512_17 into the grooves 110HM, the fastening portions 512_17 and the grooves 110HM can have substantially the same size and shape, but this disclosure is not limited thereto. In order to tightly fix the side mold 510_17 to the first substrate 110_17, the grooves 110HM can be formed to be smaller in size than the fastening portions 512_17.

[0171] Figure 17 and Figure 18 The fastening portions 512_17 shown have the same shape and size, but this disclosure is not limited thereto. The fastening portions 512_17 protruding from the inner surface of the side mold 510_17 can have different shapes and sizes. Therefore, the grooves 110HM formed in the first substrate 110_17 corresponding to the fastening portions 512_17 can also have different shapes and sizes. In this case, the fastening portions 512_17 can only be inserted into their corresponding grooves 110HM. Therefore, by changing the size and shape of the fastening portions 512_17 and the grooves 110HM, the accuracy of fastening the first substrate 110_17 and the side mold 510_17 can be improved.

[0172] Figure 20 It is along Figure 17 Another example cross-sectional view taken from the line XIX-XIX'.

[0173] refer to Figure 20 The side mold 510_20 may further include a reflective coating 513_20 disposed on the inner surface of the partition wall 511_17.

[0174] Specifically, the reflective coating 513_20 is disposed on at least some portions of the inner surface of the partition wall 511_17. The reflective coating 513_20 may cover these portions of the inner surface of the partition wall 511_17. The reflective coating 513_20 may be disposed on the inner surface of the partition wall 511_17, extending from the top surface of the first substrate 110 to the top surface of the resin layer 400. The reflective coating 513_20 may be in direct contact with the side surfaces of the resin layer 400 and the side surfaces of the reflective layer 300. However, this disclosure is not limited thereto. Alternatively, the reflective coating 513_20 may be configured to cover the entire inner surface of the partition wall 511_17.

[0175] The reflective coating 513_20 may include a material with high reflectivity, such as a metal. In one embodiment, the reflective coating 513_20 may be formed, for example, of a metallic material, such as silver (Ag), copper (Cu), aluminum (Al), nickel (Ni), lanthanum (La) or alloys thereof, or, for example, indium tin oxide (ITO), indium zinc oxide or indium tin zinc oxide (ITZO), but this disclosure is not limited thereto.

[0176] Figure 21 This is a plan view of a light source component according to another embodiment of the present disclosure.

[0177] refer to Figure 21 The light source component 100_21 may include first to sixth light source units UT1, UT2, UT3, UT4, UT5, and UT6. The first to sixth light source units UT1, UT2, UT3, UT4, UT5, and UT6 may be arranged in a matrix. Specifically, the first to third light source units UT1, UT2, and UT3 may be arranged side-by-side in a first row in the first direction X, and the fourth to sixth light source units UT4, UT5, and UT6 may be arranged side-by-side in a second row in the first direction X. A pair of opposite edges of the first substrate 110 of each pair of adjacent light source units may be configured to be adjacent, allowing connection of corresponding pairs of adjacent light source units. The light source component 100_21 is shown as including only six light source units, but this disclosure is not limited thereto. The light source component 100_21 may include more than six light source units, even in which case each pair of adjacent light source units may be configured to be adjacent.

[0178] In concluding this detailed description, those skilled in the art will understand that many changes and modifications can be made to the preferred embodiments without substantially departing from the principles of this disclosure. Therefore, the preferred embodiments of this disclosure are used in a general and descriptive sense only, and not for limiting purposes.

Claims

1. A backlight unit, comprising: substrate; Multiple light sources disposed on the first surface of the substrate; A side mold having a closed-loop shape and fixed to the substrate, the side mold surrounding the plurality of light sources; A resin layer that fills the area defined by the side mold; as well as An optical component disposed on the resin layer in the region defined by the side mold. Wherein, the first height of the side mold, measured from the first surface of the substrate, is greater than the second height of the resin layer, measured from the first surface of the substrate to the opposite surface of the resin layer, such that the optical component is disposed in the region defined by the side mold and the resin layer, and The substrates are provided in multiple forms, and each substrate includes a fastening pattern capable of locking with another substrate of the backlight unit.

2. The backlight unit according to claim 1, further comprising: An adhesive layer inserted between the substrate and the side mold. in: The side mold is disposed on the first surface of the substrate and is fixed to the first surface of the substrate by the adhesive layer.

3. The backlight unit according to claim 1, wherein, The side surface of the optical component is aligned with the side surface of the resin layer.

4. The backlight unit according to claim 1, wherein, The substrate further includes a plurality of grooves on a second surface of the substrate opposite to the first surface of the substrate. The side mold includes: A partition wall configured to surround the side surface of the substrate; and Multiple fastening portions protruding from the partition wall and corresponding to the plurality of grooves, and The side mold is fastened and fixedly attached to the substrate by the fastening part.

5. The backlight unit according to claim 4, wherein, The side surfaces of the substrate, the optical components, and the resin layer are aligned with each other and in direct contact with the inner surface of the partition wall.

6. The backlight unit according to claim 1, further comprising: A reflective layer disposed on the first surface of the substrate. Multiple openings exposing the multiple light sources are formed in the reflective layer.

7. The backlight unit according to claim 6, wherein, The reflective layer and the plurality of light sources do not overlap in the thickness direction of the substrate.

8. The backlight unit according to claim 1, further comprising: A reflective coating is applied to the inner surface of the side mold.

9. The backlight unit according to claim 1, wherein, The light source is a light-emitting diode or a light-emitting diode chip.

10. The backlight unit according to claim 1, wherein, The substrate is a printed circuit board.

11. A backlight unit, comprising: The light source component includes multiple light source units arranged in a matrix and positioned adjacent to each other. Side molds are provided along the edges of the light source component; A resin layer is filled in the area defined by the side mold to cover the light source component; as well as An optical component disposed on the resin layer in the region defined by the side mold. in: Each of the plurality of light source units includes a substrate and a plurality of light sources disposed on a first surface of the substrate. The substrates of each pair of adjacent light source units are connected to each other, and The first height of the side mold, measured from the first surface of each of the substrates, is greater than the second height of the resin layer, measured from the first surface of each of the substrates to the opposite surface of the resin layer, such that the optical component is disposed in the region defined by the side mold and the resin layer. The substrate includes a fastening pattern that can be locked to the substrate of another light source unit.

12. The backlight unit according to claim 11, wherein, The plurality of light source units include a first light source unit and a second light source unit disposed on a first side of the first light source unit, and The first substrate of the first light source unit and the second substrate of the second light source unit are coupled to each other.

13. The backlight unit according to claim 12, wherein, The first side surface of the first substrate on the first side of the first light source unit is in direct contact with the second side surface of the second substrate on the second side of the second light source unit, which is opposite to the first side of the first light source unit.

14. The backlight unit according to claim 12, wherein, The first side surface of the first substrate of the first light source unit on the first side of the first light source unit and the second side surface of the second substrate of the second light source unit on the second side opposite to the first side of the first light source unit include a pair of complementary raised and recessed patterns.

15. The backlight unit according to claim 12, wherein, The side mold is disposed on the first light source unit and the second light source unit to surround the plurality of light sources in each of the first light source unit and the second light source unit.

16. The backlight unit according to claim 11, wherein, The optical component includes: A wavelength filter layer disposed on the resin layer; A diffuser sheet disposed on the wavelength filter layer; and A wavelength conversion plate is disposed on the diffuser.

17. The backlight unit according to claim 16, wherein, The side surface of the resin layer is aligned with the side surface of the wavelength filter layer, the side surface of the diffuser, and the side surface of the wavelength conversion sheet.

18. A display device, comprising: A backlight unit includes: a light source component comprising a plurality of light source units arranged in a matrix and disposed adjacent to each other; a side mold configured to surround the light source component; a resin layer filling a region defined by the side mold to cover the light source component; and an optical component disposed on the resin layer in the region defined by the side mold; and The display panel is mounted on the backlight unit. in: Each of the plurality of light source units includes a substrate and a plurality of light sources disposed on a first surface of the substrate. The substrates of each pair of adjacent light source units are connected to each other. The side mold is fixed on the substrate of the plurality of light source units, and The first height of the side mold, measured from the first surface of each of the substrates, is greater than the second height of the resin layer, measured from the first surface of each of the substrates to the opposite surface of the resin layer, such that the optical component is disposed in the region defined by the side mold and the resin layer. The substrate includes a fastening pattern that can be locked to the substrate of another light source unit.

19. The display device according to claim 18, wherein, The first height of the side mold is greater than the third height measured from the first surface of each of the substrates to the top surface of the optical component.

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