Display device

Abstract

A display device is provided. The display device includes a plurality of light-emitting regions and a peripheral region adjacent to the light-emitting regions. An encapsulation member is disposed on the display member. The encapsulation member includes a first inorganic encapsulation layer. A plurality of mixed encapsulation patterns are disposed on the first inorganic encapsulation layer. When viewed in a plan view, each mixed encapsulation pattern overlaps a corresponding light-emitting region in the plurality of light-emitting regions. A second inorganic encapsulation layer is disposed on the first inorganic encapsulation layer. When viewed in a cross-sectional view, each mixed encapsulation pattern includes a first segment adjacent to the first inorganic encapsulation layer, a second segment disposed on the first segment, and a third segment disposed on the second segment. The first segment includes an organic material, the second segment includes a mixture of an organic material and an inorganic material, and the third segment includes an inorganic material.

Description

[0001] This application is a divisional application of patent application 201710604995.6, entitled “Display Device”, filed on July 24, 2017. Technical Field

[0002] Exemplary embodiments of the present invention relate to a display device, and more particularly, to a method of manufacturing the display device. Background Art

[0003] The organic light emitting display device may include an organic electroluminescent diode, which includes an anode, an organic light emitting layer, and a cathode. The organic light emitting layer may be easily damaged by moisture or oxygen. In the case where moisture or oxygen penetrates into the organic light emitting display device, the organic light emitting layer may change, and thus various defects such as dark spots or pixel shrinkage may occur. The encapsulation unit may protect the organic electroluminescent diode. Summary of the invention

[0004] Exemplary embodiments of the present invention provide a display device capable of blocking foreign substances such as oxygen or moisture from entering the display device and reducing the formation of cracks caused by external impact.

[0005] Exemplary embodiments of the present invention provide a method of manufacturing a display device having enhanced foreign matter blocking properties by filling an inorganic material into a free volume of a patterned organic material.

[0006] An exemplary embodiment of the present invention provides a display device, which includes a display member including a plurality of light-emitting regions and a peripheral region adjacent to the light-emitting regions. An encapsulation member is disposed on the display member. The encapsulation member includes a first inorganic encapsulation layer. A plurality of hybrid encapsulation patterns are disposed on the first inorganic encapsulation layer. When viewed in a plan view, each hybrid encapsulation pattern overlaps a corresponding light-emitting region in the plurality of light-emitting regions. A second inorganic encapsulation layer is disposed on the first inorganic encapsulation layer. When viewed in a cross-sectional view, each hybrid encapsulation pattern includes a first segment adjacent to the first inorganic encapsulation layer and a second segment disposed on the first segment. The first segment includes an organic material, and the second segment includes a mixture of an organic material and an inorganic material.

[0007] The amount of the inorganic material in the second segment may vary along the thickness direction of the hybrid encapsulation pattern.

[0008] The amount of the inorganic material may decrease as the distance from the first segment decreases.

[0009] Each of the hybrid encapsulation patterns may include a free volume of the organic material defined therein, the inorganic material of the second section filling at least a portion of the free volume.

[0010] The amount of inorganic material in the free volume may decrease with decreasing distance from the first segment.

[0011] When viewed in a plan view, the second inorganic encapsulation layer may not overlap the hybrid encapsulation pattern.

[0012] Each of the hybrid encapsulation patterns may include a third segment disposed on the second segment. The third segment may include an inorganic material and may have a shape integrally formed with the second inorganic encapsulation layer.

[0013] The second inorganic encapsulation layer may include the same inorganic material as the inorganic material included in the second segment in each of the hybrid encapsulation patterns.

[0014] The display member may include a pixel defining layer including a plurality of openings. Each opening may be formed above a corresponding light emitting region in the plurality of light emitting regions. The hybrid encapsulation patterns may each be disposed in one of the plurality of openings, respectively.

[0015] The first inorganic encapsulation layer may be disposed on the pixel defining layer. The second inorganic encapsulation layer may be in direct contact with the first inorganic encapsulation layer.

[0016] The display device may include a plurality of dummy mixing patterns disposed in the peripheral region. Each of the dummy mixing patterns may include an organic material and an inorganic material mixed with the organic material.

[0017] Each dummy hybrid pattern may include a first dummy segment adjacent to the first inorganic encapsulation layer and a second dummy segment disposed on the first dummy segment. The first dummy segment may include an organic material. The second dummy segment may include a mixture of an organic material and an inorganic material.

[0018] At least a portion of the dummy mixing pattern may be connected to the at least one mixing encapsulation pattern.

[0019] The second segment may have a thickness from about 50 angstroms to about 100 angstroms.

[0020] The display device may include a capping layer disposed on the second inorganic encapsulating layer to cover the second inorganic encapsulating layer.

[0021] An exemplary embodiment of the present invention provides a method for manufacturing a display device, the method comprising preparing a display member including a plurality of light-emitting regions and a peripheral region adjacent to the light-emitting regions and forming an encapsulation member on the display member. Forming the encapsulation member comprises depositing an inorganic material on the display member to form a first inorganic encapsulation layer. Forming the encapsulation member comprises depositing an organic material on the first inorganic encapsulation layer and patterning the organic material to form a plurality of organic encapsulation patterns, each of which is overlapped with a corresponding light-emitting region in a plurality of light-emitting regions, respectively. Forming the encapsulation member comprises infiltrating an inorganic material into the organic encapsulation pattern to form a mixed encapsulation pattern, and depositing an inorganic material on the peripheral region to form a second inorganic encapsulation layer. Forming the mixed encapsulation pattern and forming the second inorganic encapsulation layer are performed by the same process.

[0022] The organic encapsulation pattern may be formed by a solution process.

[0023] The forming of the hybrid encapsulation pattern may be performed by infiltrating the inorganic material into the free volume of the organic encapsulation pattern through a sequential vapor infiltration method.

[0024] Forming the hybrid encapsulation pattern may include diffusing a first precursor into a free volume of the organic encapsulation pattern and diffusing a second precursor into the free volume of the organic encapsulation pattern such that the second precursor reacts with the first precursor to form an inorganic material in the free volume.

[0025] The forming of the hybrid encapsulation pattern may be performed by repeatedly performing the diffusion of the first precursor and the diffusion of the second precursor.

[0026] According to the above, penetration of foreign matter such as oxygen or moisture can be reduced or eliminated, and occurrence of cracks that may be caused by external impact can be reduced or prevented.

[0027] In the method of manufacturing a display device according to an exemplary embodiment of the present invention, an inorganic material may be filled into a free volume of a patterned organic material, and thus penetration of foreign matter such as oxygen or moisture into the display device may be reduced or eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other features of the present inventive concept will become more apparent through a detailed description of exemplary embodiments of the present inventive concept with reference to the accompanying drawings, in which:

[0029] Figure 1A is a combined perspective view showing a display device according to an exemplary embodiment of the present invention;

[0030] Figure 1B is an exploded perspective view showing a display device according to an exemplary embodiment of the present invention;

[0031] Figure 2is a circuit diagram showing a pixel included in a display device according to an exemplary embodiment of the present invention;

[0032] Figure 3A is a cross-sectional view showing a display device according to an exemplary embodiment of the present invention;

[0033] Figure 3B It is shown Figure 3A An enlarged cross-sectional view of portion AA;

[0034] Figure 4A is a cross-sectional view showing a display device according to another exemplary embodiment of the present invention;

[0035] Figure 4B It is shown Figure 4A An enlarged cross-sectional view of part AA';

[0036] Figure 5A It is shown Figure 3A A cross-sectional view of a light emitting area and a peripheral area adjacent to the light emitting area of ​​a display device shown in FIG.

[0037] Figure 5B This is a picture taken through a microscope to show Figure 5A An enlarged cross section of part BB;

[0038] Figure 5C This is a picture taken through a microscope to show Figure 5A A magnified cross section of part of CC;

[0039] Fig. 6A and Figure 6B is a cross-sectional view showing a light emitting region and a peripheral region adjacent to the light emitting region of a display device according to an exemplary embodiment of the present invention;

[0040] Figure 7 is a cross-sectional view showing a light emitting region and a peripheral region adjacent to the light emitting region of a display device according to an exemplary embodiment of the present invention;

[0041] FIG. 8A to FIG. 8C is a schematic diagram showing an upper structure of a hybrid encapsulation pattern according to an exemplary embodiment of the present invention;

[0042] Fig. 9 is a flowchart illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention;

[0043] FIG. 10A to FIG. 10D is a cross-sectional view illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention;

[0044] FIG. 11A to FIG. 11E It is shown that the formation Fig. 10D Section DD shows a cross-sectional view of the hybrid encapsulation layer process. DETAILED DESCRIPTION

[0045] It will be understood that when a component such as a layer, film, region, or panel is referred to as being “on” another component, it can be directly on the other component or intervening components may be present.

[0046] Like reference numerals may refer to like elements throughout the specification and drawings.

[0047] It will be understood that, although the terms "first" and "second" may be used herein to describe various components, these components should not be limited by these terms.

[0048] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In this regard, exemplary embodiments may have different forms and should not be construed as limited to the exemplary embodiments described herein.

[0049] Figure 1A is an assembled perspective view illustrating a display device according to an exemplary embodiment of the present invention. Figure 1B is an exploded perspective view illustrating a display device according to an exemplary embodiment of the present invention. Figure 2 1 is a circuit diagram showing a pixel included in a display device according to an exemplary embodiment of the present invention. Figure 1A , Figure 1B and Figure 2 The display device 10 is described in more detail.

[0050] Reference Figure 1A and Figure 1B , the display device 10 may include a display member DM and an encapsulation member EM.

[0051] The display member DM may include a plurality of light emitting regions PXA and a peripheral region NPXA. The light emitting region PXA may be a region that emits light. Light may be emitted in the light emitting region PXA in response to an electrical signal. The display member DM may combine light emitted from the light emitting regions PXA to display an image.

[0052] The peripheral region NPXA may be adjacent to the light emitting region PXA. The peripheral region NPXA may be located at a boundary between adjacent light emitting regions PXA.

[0053] In an exemplary embodiment of the present invention, the light emitting regions PXA may be arranged in a matrix form, and the peripheral region NPXA may have a lattice shape surrounding each light emitting region PXA. However, the exemplary embodiment of the present invention is not limited thereto, and the light emitting regions PXA and the peripheral region NPXA may have various shapes according to the exemplary embodiment of the present invention.

[0054] The display member DM may include a base member BS and a display layer DL disposed on the base member BS.

[0055] The base member BS may be a substrate including an insulating material such as glass, plastic, or a crystalline material.

[0056] The display layer DL includes a plurality of pixels, and each pixel can emit light (eg, emit light in response to an electrical signal applied thereto).

[0057] Reference Figure 2 Each pixel PX may be connected to a line portion including a gate line GL, a data line DAL, and a driving voltage line DVL. Each pixel PX may include thin film transistors TFT1 and TFT2 connected to the line portion, an organic electroluminescent device OEL connected to the thin film transistors TFT1 and TFT2, and a capacitor Cst connected to the thin film transistors TFT1 and TFT2.

[0058] The gate line GL may extend in a first direction DR1. The data line DAL may extend in a second direction DR2 to cross the gate line GL. The driving voltage line DVL may extend in a direction substantially the same as the direction in which the data line DAL extends (e.g., the second direction DR2). The gate line GL may apply a scan signal to the thin film transistors TFT1 and TFT2. The data line DAL may apply a data signal to the thin film transistors TFT1 and TFT2. The driving voltage line DVL may apply a driving voltage to the thin film transistors TFT1 and TFT2.

[0059] The thin film transistors TFT1 and TFT2 may include a driving thin film transistor TFT2 for controlling the organic electroluminescent device OEL and a switching thin film transistor TFT1 for switching the driving thin film transistor TFT2. In an exemplary embodiment of the present invention, each pixel PX may include two thin film transistors TFT1 and TFT2; however, the exemplary embodiment of the present invention is not limited thereto, and the number of thin film transistors included in each pixel PX is not limited to two. As an example, each pixel PX may include one thin film transistor and one capacitor. Alternatively, each pixel PX may include three or more thin film transistors and two or more capacitors.

[0060] The switching thin film transistor TFT1 may include a first gate electrode, a first source electrode, and a first drain electrode. The first gate electrode may be connected to the gate line GL, and the first source electrode may be connected to the data line DAL. The first drain electrode may be connected to the first common electrode through a contact hole. The switching thin film transistor TFT1 may apply a data signal provided through the data line DAL to the driving thin film transistor TFT2 in response to a scan signal provided through the gate line GL.

[0061] The organic electroluminescent device OEL may include a first electrode connected to the driving thin film transistor TFT2 and a second electrode receiving a second power supply voltage. The organic electroluminescent device OEL may include a light emitting pattern disposed between the first electrode and the second electrode.

[0062] The organic electroluminescent device OEL may emit light during the on-time of the driving thin film transistor TFT2. The light generated by the organic electroluminescent device OEL may have a color determined by the material included in the light emitting pattern. For example, red light, green light, blue light or white light may be generated by the organic electroluminescent device OEL.

[0063] Reference Figure 1A and Figure 1B , the encapsulation member EM may be disposed on the display member DM. The encapsulation member EM may substantially cover the display layer DL. The encapsulation member EM may protect the display layer DL from external moisture or contaminants.

[0064] The encapsulation member EM may include a plurality of hybrid encapsulation patterns ENP. The hybrid encapsulation patterns ENP may each overlap the light emitting area PXA.

[0065] Figure 3A is a cross-sectional view showing a display device according to an exemplary embodiment of the present invention. Figure 3B It is shown Figure 3A An enlarged cross-sectional view of portion AA.

[0066] Reference Figure 3A , the display device 10 may include a base member BS, a display layer DL, and an encapsulation member EM.

[0067] The base member BS may include an insulating material such as glass, plastic or a crystalline material. The base member BS may include an organic polymer such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide or polyethersulfone. The organic material included in the base member BS may be selected in consideration of its mechanical strength, thermal stability, transparency, surface smoothness, ease of handling and water resistance.

[0068] The functional layer may be disposed on the base member BS. The functional layer may include a buffer layer or a barrier layer. The buffer layer may increase the bonding force between the base member BS and the display layer DL. The barrier layer may reduce or prevent foreign matter from entering the display layer DL.

[0069] The display layer DL may include a pixel defining layer PDL and an organic electroluminescent device OEL. A plurality of openings may be formed in the pixel defining layer PDL. The openings may define a light emitting area PXA.

[0070] The organic electroluminescent device OEL may include a first electrode EL1 , a second electrode EL2 located over the first electrode EL1 , and a light emitting layer EML disposed between the first electrode EL1 and the second electrode EL2 .

[0071] The first electrode EL1 may be used as a pixel electrode or a positive electrode. The first electrode EL1 may be a transmissive electrode, a transflective electrode or a reflective electrode. When the first electrode EL1 is a transmissive electrode, the first electrode EL1 may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium tin zinc oxide (ITZO). When the first electrode EL1 is a transflective electrode or a reflective electrode, the first electrode EL1 may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a mixture thereof.

[0072] The second electrode EL2 may be used as a common electrode or a negative electrode. The second electrode EL2 may include a transmissive electrode, a transflective electrode or a reflective electrode. When the second electrode EL2 is a transmissive electrode, the second electrode EL2 includes Li, Ca, LiF / Ca, LiF / Al, Al, Mg, BaF, Ba, Ag, a compound thereof, or a mixture thereof (e.g., a mixture of Ag and Mg). As an example, the second electrode EL2 may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). When the second electrode EL2 is a transflective electrode or a reflective electrode, the second electrode EL2 may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, a compound thereof, or a mixture thereof (e.g., a mixture of Ag and Mg). As an example, the second electrode EL2 may have a multi-layer structure including a reflective or transflective layer including the above-mentioned material and a transparent conductive layer including ITO, IZO, ZnO, or ITZO.

[0073] The first electrode EL1 may be a reflective electrode, and the second electrode EL2 may be a transflective electrode or a transmissive electrode. The organic electroluminescent device OEL may be a front surface emitting organic electroluminescent device; however, exemplary embodiments of the present invention are not limited thereto. For example, the organic electroluminescent device OEL may be a rear surface emitting organic electroluminescent device.

[0074] The pixel defining layer PDL may be disposed on the first electrode EL1. As an example, the pixel defining layer PDL may substantially cover a first portion of the first electrode EL1, and a second portion of the first electrode EL1 not covered by the pixel defining layer PDL may be exposed. The pixel defining layer PDL may include a metal fluoride ion compound. For example, the pixel defining layer PDL may include LiF, BaF2 The metal fluoride ion compound may have a predetermined thickness, and the metal fluoride ion compound may have an insulating property.

[0075] The light emitting layer EML may be disposed between the first electrode EL1 and the second electrode EL2. A plurality of common layers may also be disposed between the first electrode EL1 and the second electrode EL2. The light emitting layer EML may overlap the light emitting area PXA. The light emitting layer EML may be disposed in each opening formed in the pixel defining layer PDL.

[0076] The encapsulation member EM may include a first inorganic encapsulation layer IOL1 , a plurality of hybrid encapsulation patterns ENP located over the first inorganic encapsulation layer IOL1 , and a second inorganic encapsulation layer IOL2 disposed on the first inorganic encapsulation layer IOL1 .

[0077] The first inorganic encapsulation layer IOL1 may be disposed on the display member DM. As an example, the first inorganic encapsulation layer IOL1 may be in direct contact with the second electrode EL2. The first inorganic encapsulation layer IOL1 may overlap the light emitting region PXA and the peripheral region NPXA. The first inorganic encapsulation layer IOL1 may include, for example, aluminum oxide (Al 2 O 3 ), silicon oxide (SiO x ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), zinc oxide (ZnO), strontium oxide (SrO), titanium oxide (TiO 2 ), hafnium oxide (HfO 2 ) or tin oxide (SnO 2 ) of inorganic materials.

[0078] The hybrid encapsulation patterns ENP may be disposed on the first inorganic encapsulation layer IOL1. The hybrid encapsulation patterns ENP may each overlap the light emitting areas PXA, respectively. The hybrid encapsulation patterns ENP may each be disposed in an opening formed by the pixel defining layer PDL.

[0079] The second inorganic encapsulation layer IOL2 may be disposed on the first inorganic encapsulation layer IOL1. The second inorganic encapsulation layer IOL2 may overlap with the peripheral area NPXA. When viewed in a plan view, the second inorganic encapsulation layer IOL2 may not overlap with the hybrid encapsulation pattern ENP. However, embodiments of the inventive concept are not limited thereto, and when viewed in a plan view, at least a portion of the second inorganic encapsulation layer IOL2 may overlap with each hybrid encapsulation pattern ENP.

[0080] The second inorganic encapsulation layer IOL2 may include an inorganic material. The second inorganic encapsulation layer IOL2 may include the same inorganic material as that included in the first inorganic encapsulation layer IOL1.

[0081] Reference Figure 3A and Figure 3B , when viewed in a cross-sectional view, each hybrid encapsulation pattern ENP may include a first segment SC1 and a second segment SC2. When viewed in a cross-sectional view, the first segment SC1 may be disposed adjacent to the first inorganic encapsulation layer IOL1. When viewed in a cross-sectional view, the second segment SC2 may be disposed on the first segment SC1 and may be separated from the first inorganic encapsulation layer IOL1.

[0082] The first segment SC1 may include an organic material. The second segment SC2 may include an organic material and an inorganic material mixed with the organic material. The organic material included in the first segment SC1 may be the same as the organic material included in the second segment SC2. For example, the organic material may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene and / or polyarylate.

[0083] The second segment SC2 may include an organic material mixed with an inorganic material. As an example, the second segment SC2 may include an organic material and an inorganic material disposed in the organic material. The organic material included in the second segment SC2 may be the same as the organic material included in the first segment SC1. The inorganic material included in the second segment SC2 may be the same as the inorganic material included in the second inorganic encapsulation layer IOL2.

[0084] The content of the inorganic material in the second segment SC2 may change along the thickness direction of the hybrid encapsulation pattern ENP. The content of the inorganic material may refer to the volume of the inorganic material relative to the total volume of the second segment SC2. The content of the inorganic material in the second segment SC2 may change along the thickness direction of the second segment SC2. The content of the inorganic material in the second segment SC2 may decrease as the distance from the first segment SC1 decreases.

[0085] In the hybrid encapsulation pattern ENP, the second segment SC2 may be disposed on the first segment SC1. The second segment SC2 may have a thickness from about 50 angstroms to about 100 angstroms. When the thickness of the second segment SC2 is less than about 50 angstroms, the barrier property of the second segment SC2 may not be sufficient to block external moisture and oxygen, and when the thickness of the second segment SC2 is about about 100 angstroms, the process time may become longer, thereby increasing the manufacturing cost.

[0086] The hybrid encapsulation pattern ENP may overlap with the light emitting area PXA and may not overlap with the peripheral area NPXA. Although some hybrid encapsulation patterns ENP may be broken due to external impact, since the hybrid encapsulation patterns ENP are separated from each other and do not overlap, such breakage does not propagate to other hybrid encapsulation patterns ENP adjacent to the broken hybrid encapsulation pattern ENP. Therefore, the display device 10 can better withstand external impact.

[0087] The hybrid encapsulation pattern ENP according to an exemplary embodiment of the present invention may include an organic material and an inorganic material mixed with the organic material, and thus the hybrid encapsulation pattern ENP may reduce or prevent external moisture and oxygen from penetrating.

[0088] The hybrid encapsulation pattern ENP according to an exemplary embodiment of the present invention may include an organic material and an inorganic material disposed in the organic material, and thus the hybrid encapsulation pattern ENP may reduce or prevent external moisture and oxygen from penetrating the organic material and entering the organic electroluminescent device OEL. Therefore, damage to the organic electroluminescent device OEL may be reduced or prevented.

[0089] Figure 4A is a cross-sectional view showing a display device according to an exemplary embodiment of the present invention. Figure 4B It is shown Figure 4A The following will refer to the enlarged cross-sectional view of part AA'. Figure 4A and Figure 4B The display device 10-1 is described in more detail. Figure 4A and Figure 4B In the Figure 3A and Figure 3B The same elements are described herein, and thus repeated description may be omitted.

[0090] Reference Figure 4A , the display device 10-1 may include hybrid encapsulation patterns ENP-1 disposed on the first inorganic encapsulation layer IOL1. The hybrid encapsulation patterns ENP-1 may each overlap the corresponding light emitting area PXA. The hybrid encapsulation patterns ENP-1 may each be disposed in an opening in the pixel defining layer PDL.

[0091] Reference Figure 4A and Figure 4B , when viewed in a cross-sectional view, each hybrid encapsulation pattern ENP-1 may include a first segment SC1, a second segment SC2, and a third segment SC3. When viewed in a cross-sectional view, the first segment SC1 may be adjacent to the first inorganic encapsulation layer IOL1. When viewed in a cross-sectional view, the second segment SC2 may be disposed on the first segment SC1 and spaced apart from the first inorganic encapsulation layer IOL1.

[0092] When viewed in a cross-sectional view, each hybrid encapsulation pattern ENP-1 may include a third segment SC3 disposed on the second segment SC2. The third segment SC3 may include an inorganic material. The inorganic material included in the third segment SC3 may be the same as the inorganic material included in the second inorganic encapsulation layer IOL2.

[0093] The third segment SC3 may be connected to the second inorganic encapsulation layer IOL2. The third segment SC3 may be integrally formed with the second inorganic encapsulation layer IOL2. According to an exemplary embodiment of the present invention, the third segment SC3 may have a thickness smaller than that of the second inorganic encapsulation layer IOL2.

[0094] Figure 5A It is shown Figure 3A A cross-sectional view of a light emitting area and a peripheral area adjacent to the light emitting area of ​​a display device is shown. Figure 5B It was photographed through a microscope to show Figure 5A FIG. 1 is an enlarged cross-sectional view of portion BB. Figure 5C It was photographed through a microscope to show Figure 5A FIG. 1 is an enlarged cross-sectional view of a portion CC of FIG. FIG. 5A to FIG. 5C In the same figure, the same reference numerals may represent Figure 3A The same elements are described above, so repeated description may be omitted.

[0095] For ease of explanation, Figure 5A Only the light emitting layer EML and the pixel defining layer PDL are shown, and other layers are omitted. Therefore, the first inorganic encapsulation layer IOL1 of the encapsulation member EM is directly disposed on the pixel defining layer PDL.

[0096] The hybrid encapsulation patterns ENP may be disposed on the first inorganic encapsulation layer IOL1. The hybrid encapsulation patterns ENP may overlap the light emitting areas PXA, respectively. The hybrid encapsulation patterns ENP may be each disposed in an opening formed by the pixel defining layer PDL.

[0097] The second inorganic encapsulation layer IOL2 may be disposed on the first inorganic encapsulation layer IOL1. The second inorganic encapsulation layer IOL2 may overlap the peripheral area NPXA. The second inorganic encapsulation layer IOL2 may directly contact the first inorganic encapsulation layer IOL1 located above the pixel defining layer PDL.

[0098] Reference Figure 5B , the hybrid encapsulation pattern ENP of the display device according to an exemplary embodiment of the present invention may include a first segment SC1 and a second segment SC2. The first segment SC1 may include an organic material, and the second segment SC2 may include an organic material and an inorganic material mixed with the organic material after penetrating into a free volume of the organic material. The inorganic material may penetrate into the organic material from above, so the composition ratio between the inorganic material and the organic material of the second segment SC2 may change along the thickness direction of the second segment SC2.

[0099] Reference Figure 5C, the hybrid encapsulation pattern ENP may not be disposed on the pixel defining layer PDL in the display device according to an exemplary embodiment of the present invention, so the first inorganic encapsulation layer IOL1 and the second inorganic encapsulation layer IOL2 may be sequentially stacked on the pixel defining layer PDL. The second inorganic encapsulation layer IOL2 may be in direct contact with the first inorganic encapsulation layer IOL1.

[0100] Fig. 6A and Figure 6B 1 is a cross-sectional view showing a light emitting region and a peripheral region adjacent to the light emitting region of a display device according to an exemplary embodiment of the present invention. Fig. 6A and Figure 6B In the Figure 5A The same elements are described above, so repeated description may be omitted.

[0101] Reference Fig. 6A and Figure 6B , the display device according to an exemplary embodiment of the present invention may include a dummy mixing pattern ENP-D. The dummy mixing pattern ENP-D may be disposed in the peripheral area NPXA.

[0102] The dummy hybrid pattern ENP-D may be a portion extending from the hybrid encapsulation pattern ENP. As an example, the dummy hybrid pattern ENP-D may be connected to the hybrid encapsulation pattern ENP; however, exemplary embodiments of the present invention are not limited thereto. For example, the dummy hybrid pattern ENP-D may be a hybrid encapsulation pattern separated from the hybrid encapsulation pattern ENP.

[0103] The dummy mixing pattern ENP-D may have various structures. For example, the dummy mixing pattern ENP-D may have a single-layer structure including an organic material and an inorganic material mixed with the organic material. The organic material included in the dummy mixing pattern ENP-D may be the same as the organic material included in the hybrid encapsulation pattern ENP. The inorganic material included in the dummy mixing pattern ENP-D may be the same as the inorganic material included in the second segment SC2 of the hybrid encapsulation pattern ENP.

[0104] As an example, the dummy mix pattern ENP-D may include a plurality of segments. The dummy mix pattern ENP-D may include a first dummy segment SC-D1 adjacent to the first inorganic encapsulation layer IOL1 and a second dummy segment SC-D2 disposed on the first dummy segment SC-D1.

[0105] The first dummy segment SC-D1 may include an organic material. The organic material included in the first dummy segment SC-D1 may be the same as the organic material included in the hybrid encapsulation pattern ENP. The second dummy segment SC-D2 may include an organic material and an inorganic material mixed with the organic material. The organic material included in the second dummy segment SC-D2 may be the same as the organic material included in the hybrid encapsulation pattern ENP, and the inorganic material included in the second dummy segment SC-D2 may be the same as the inorganic material included in the second segment SC2 of the hybrid encapsulation pattern ENP.

[0106] The first common layer CL1 and the second common layer CL2 may correspond to the reference Figure 3A The common layer described. The first common layer CL1 and the second common layer CL2 may both be located above the pixel PX. The first common layer CL1 and the second common layer CL2 may be formed in each pixel PX by a patterning process. Each of the first common layer CL1 and the second common layer CL2 may have a single-layer structure including a single material, a single-layer structure including materials different from each other, or a multilayer structure including multiple layers containing different materials from each other. The first common layer CL1 and the second common layer CL2 may be located in a hole transport region including at least one of a hole transport layer, a hole injection layer, a hole buffer layer, and an electron blocking layer. The first common layer CL1 and the second common layer CL2 may be located in an electron transport region including at least one of an electron transport layer, an electron injection layer, an electron buffer layer, and a hole blocking layer.

[0107] Figure 7 1 is a cross-sectional view showing a light emitting region and a peripheral region adjacent to the light emitting region of a display device according to an exemplary embodiment of the present invention. Figure 7 In the Figure 5A The same elements are described above, so repeated description may be omitted.

[0108] Reference Figure 7 , the display device according to an exemplary embodiment of the present invention may include a capping layer CPL disposed on the second inorganic encapsulation layer IOL2. The capping layer CPL may overlap the light emitting area PXA and the peripheral area NPXA.

[0109] The cover layer CPL may include an inorganic material. The cover layer CPL may include the same material as the first inorganic encapsulation layer IOL1 and may be formed by the same process as the first inorganic encapsulation layer IOL1. In an exemplary embodiment of the present invention, since the second inorganic encapsulation layer IOL2 may be disposed between the first inorganic encapsulation layer IOL1 and the cover layer CPL, which may be formed by the same process, the first inorganic encapsulation layer IOL1 may not be in direct contact with the cover layer CPL, and thus stress applied to the display device may be reduced.

[0110] FIG. 8A to FIG. 8C is a schematic diagram illustrating an upper structure of a hybrid encapsulation pattern according to an exemplary embodiment of the present invention.

[0111] Reference Fig. 8A and Figure 8B The hybrid encapsulation pattern ENP of the display device according to an exemplary embodiment of the present invention may include an organic material and an inorganic material. The organic material may include a plurality of organic particles OLP, and the inorganic material may include a plurality of inorganic particles IOLP.

[0112] The free volume FV can be defined in organic materials. Fig. 8A , the free volume FV is represented by a dotted line. The free volume FV may be the empty space between the organic particles OLP. The inorganic material may substantially fill the free volume FV defined in the organic material. The inorganic particles IOLP of the inorganic material may penetrate between the organic particles OLP and may be trapped in the free volume FV.

[0113] Reference Figure 8C , the second segment SC2 and the third segment SC3 may be located above the hybrid encapsulation pattern ENP.

[0114] Since the inorganic particles IOLP can penetrate from above (e.g., from above the second segment SC2 of the organic material), the amount of the inorganic particles IOLP that penetrate between the organic particles OLP can decrease as the distance from the upper surface of the second segment SC2 increases. Therefore, the filling rate of the inorganic particles IOLP relative to the free volume FV of the organic material can decrease as the distance from the lower surface of the second segment SC2 decreases.

[0115] The inorganic particles IOLP that have not penetrated into the free volume FV may be located in the organic material (e.g., including Fig. 8A Therefore, the third segment SC3 may be formed by the inorganic particles IOLP on the second segment SC2.

[0116] Hereinafter, a method of manufacturing a display device according to an exemplary embodiment of the present invention will be described in more detail.

[0117] Fig. 9 is a flowchart illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention. FIG. 10A to FIG. 10D is a cross-sectional view illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention. FIG. 11A to FIG. 11E It is shown that the formation Fig. 10D Section DD shows a cross-sectional view of the hybrid encapsulation layer process.

[0118] Reference Fig. 9 and Fig. 10A, a method for manufacturing a display device according to an exemplary embodiment of the present invention may include preparing a display member (S100) including a light-emitting area PXA and a peripheral area NPXA adjacent to the light-emitting area PXA. The step of preparing the display member (S100) may include preparing a base member (e.g., a base member BS) (S110) and forming an organic electroluminescent device OEL and a pixel defining layer PDL on the base member BS to form a display layer (e.g., a display layer DL) (S120). The organic electroluminescent device OEL may include a first electrode EL1 and a second electrode EL2 disposed on the first electrode EL1. A first common layer CL1, a second common layer CL2, and a light-emitting layer EML may be disposed between the first electrode EL1 and the second electrode EL2 (see, e.g., Fig. 10B ).

[0119] Reference Fig. 9 and Fig. 10B , the manufacturing method of the display device according to the exemplary embodiment of the present invention may include forming an encapsulation member on the display member (S200). The step of forming the encapsulation member (S200) may include depositing an inorganic material on the display member to form a first inorganic encapsulation layer (e.g., a first inorganic encapsulation layer IOL1) (S210). The first inorganic encapsulation layer IOL1 may be formed by a chemical vapor deposition (CVD) method; however, the exemplary embodiment of the present invention is not limited thereto.

[0120] Reference Fig. 9 and Fig. 10C , the step of forming an encapsulation member (S200) may include patterning an organic material on the first inorganic encapsulation layer IOL1 to form an organic encapsulation pattern (e.g., an organic encapsulation pattern OL-P) (S220). The organic encapsulation pattern OL-P may be formed in an opening formed in or through the pixel defining layer PDL. The organic encapsulation pattern OL-P may be formed by a solution process; however, exemplary embodiments of the present invention are not limited thereto. For example, the organic encapsulation pattern OL-P may be formed by an inkjet printing method.

[0121] Reference Fig. 9 and Fig. 10D , the step of forming an encapsulation member (S200) may include infiltrating an inorganic material into the organic encapsulation pattern to form a hybrid encapsulation pattern (e.g., a hybrid encapsulation pattern ENP) (S230) and depositing an inorganic material on the peripheral area to form a second inorganic encapsulation layer (e.g., a second inorganic encapsulation layer IOL2) (S240).

[0122] The forming of the hybrid encapsulation pattern ENP and the forming of the second inorganic encapsulation layer IOL2 may be performed by the same process. As an example, due to the process of providing the inorganic material to the light emitting area PXA and the peripheral area NPXA, the inorganic material may be infiltrated into the organic encapsulation pattern OL-P overlapping the light emitting area PXA to form the hybrid encapsulation pattern ENP, and the inorganic material may be deposited on the first inorganic encapsulation layer IOL1 on the peripheral area NPXA to form the second inorganic encapsulation layer IOL2.

[0123] The hybrid encapsulation pattern ENP may be formed by a sequential vapor infiltration (SVI) method. The hybrid encapsulation pattern ENP may be formed by infiltrating an inorganic material into a free volume of the organic encapsulation pattern OL-P by the SVI method.

[0124] FIG. 11A to FIG. 11E It is shown that the formation Fig. 10D A cross-sectional view of the process of the hybrid encapsulation layer in part DD. FIG. 11A to FIG. 11E , the step of forming the hybrid encapsulation pattern (S230) may include diffusing the first precursor PC1 into the free volume FV of the organic encapsulation pattern OL-P, and diffusing the second precursor PC2 to react with the first precursor PC1 to form an inorganic material (eg, inorganic particles IOLP) in the free volume FV.

[0125] Reference Fig.11A , the first precursor PC1 may be provided to the organic encapsulation pattern OL-P. The organic encapsulation pattern OL-P may include a plurality of organic particles OLP. A free volume FV may be defined in the organic encapsulation pattern OL-P. The free volume FV may represent a substantially empty space that is not filled with the organic particles OLP. The organic particles OLP may be used to form the organic encapsulation pattern OL-P.

[0126] The first precursor PC1 may be disposed on the organic encapsulation pattern OL-P and may substantially cover the upper surface of the organic encapsulation pattern OL-P. The first precursor PC1 may include trimethylaluminum (TMA), tri-sec-butylaluminum (TTBA), or tert-butyliminotris(diethylamino)tantalum (TBTDET); however, exemplary embodiments of the present invention are not limited thereto.

[0127] Reference Fig. 11B , the first precursor PC1 may penetrate into the free volume FV of the organic encapsulation pattern OL-P. The first precursor PC1 disposed on the upper surface of the organic encapsulation pattern OL-P may penetrate into the organic encapsulation pattern OL-P and may diffuse between the organic particles OLP.

[0128] The diffusing of the first precursor PC1 may be performed for about 200 seconds to about 300 seconds. When the time for diffusing the first precursor PC1 is less than about 200 seconds, the first precursor PC1 may not be sufficiently diffused into the free volume FV to form the organic encapsulation pattern OL-P. When the time for diffusing the first precursor PC1 is greater than about 300 seconds, the process time becomes longer and the preparation method may become relatively inefficient.

[0129] Reference Fig. 11C , the second precursor PC2 may be provided to the organic encapsulation pattern OL-P. The second precursor PC2 may react with the first precursor PC1 to form inorganic particles IOLP. The second precursor PC2 may include water (H 2 Ozone (O 3 ) or ammonia (NH 3 ); however, exemplary embodiments of the present invention are not limited thereto.

[0130] Reference Fig.11D , the second precursor PC2 may penetrate into the free volume FV of the organic encapsulation pattern OL-P. The second precursor PC2 may react with the first precursor PC1 in the free volume FV. The second precursor PC2 may react with the first precursor PC1 penetrated into the free volume FV to form inorganic particles IOLP. As an example, the second precursor PC2 may react with the first precursor PC1, and thus an inorganic material may be formed in the free volume FV.

[0131] The diffusion of the second precursor PC2 may be performed similarly to the diffusion of the first precursor PC1. For example, the diffusion of the second precursor PC2 may be performed for about 200 seconds to about 300 seconds. When the time for diffusing the second precursor PC2 is less than about 200 seconds, the second precursor PC2 may not be sufficiently diffused into the free volume FV to react with the first precursor PC1 to form the organic encapsulation pattern OL-P. When the time for diffusing the second precursor PC2 is greater than about 300 seconds, the process time becomes longer and the preparation method may become relatively inefficient.

[0132] The forming of the hybrid encapsulation pattern (S230) may be performed by repeatedly performing the diffusion of the first precursor PC1 and the diffusion of the second precursor PC2. As an example, the first precursor PC1 may be diffused into the free volume FV, the first precursor PC1 may react with the second precursor PC2 in the free volume FV, and then the diffusion process of the second precursor PC2 may be performed again as desired. When the diffusion of the first precursor PC1 and the diffusion of the second precursor PC2 are repeatedly performed, the inorganic material may be sufficiently infiltrated into the free volume FV of the organic encapsulation pattern OL-P to form a hybrid structure of the hybrid encapsulation pattern ENP.

[0133] Reference Fig.11E When the diffusion of the first precursor PC1 and the diffusion of the second precursor PC2 are repeatedly performed, the inorganic particles IOLP may be sufficiently filled into the free volume FV to form the organic encapsulation pattern OL-P. Since the inorganic particles IOLP are formed in the free volume FV existing between the organic particles OLP, the organic encapsulation pattern OL-P may have a structure in which an organic material is mixed with an inorganic material.

[0134] Reference Fig. 10D , a hybrid encapsulation pattern ENP including a first segment SC1 and a second segment SC2 may be formed. The first segment SC1 may include an organic material, and the second segment SC2 may include an organic material and an inorganic material that permeates into and is mixed with the organic material. The hybrid encapsulation pattern ENP may be formed by inorganic particles IOLP that permeate into the upper portion of the organic encapsulation pattern OL-P. FIG. 11A to FIG. 11E The described process forms the hybrid encapsulation pattern ENP.

[0135] While the invention has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the invention.

Claims

1. A display device, comprising: A display member including a plurality of light emitting regions and a peripheral region adjacent to the plurality of light emitting regions; as well as an encapsulation member disposed on the display member, the encapsulation member comprising: a first inorganic encapsulation layer; a plurality of hybrid encapsulation patterns disposed on the first inorganic encapsulation layer, wherein each of the plurality of hybrid encapsulation patterns overlaps with a corresponding light-emitting region among the plurality of light-emitting regions when viewed in a plan view; and a second inorganic encapsulation layer disposed on the first inorganic encapsulation layer, wherein each of the plurality of hybrid encapsulation patterns comprises a first segment adjacent to the first inorganic encapsulation layer, a second segment disposed on the first segment, and a third segment disposed on the second segment when viewed in a cross-sectional view, wherein the first segment comprises an organic material, wherein the second segment comprises a mixture of an inorganic material and the organic material and does not overlap with the peripheral region, and the third segment comprises an inorganic material, wherein each of the plurality of hybrid encapsulation patterns includes a free volume defined by empty spaces between the organic materials, wherein the inorganic material of the second segment is filled in at least a portion of the free volume by an infiltration method, and wherein each of the first segment and the second segment included in each of the plurality of hybrid encapsulation patterns is spaced apart from the first segment and the second segment included in another adjacent hybrid encapsulation pattern.

2. The display device according to claim 1, wherein: The third segment has a shape integrally formed with the second inorganic encapsulating layer.

3. The display device according to claim 1, wherein: An amount of the inorganic material in the second segment varies along a thickness direction of the hybrid encapsulation pattern.

4. The display device according to claim 1, wherein: The second inorganic encapsulation layer includes the same inorganic material as the inorganic material included in the third segment of each of the plurality of hybrid encapsulation patterns.

5. The display device according to claim 1, wherein: The display member further includes a pixel defining layer including a plurality of openings, Each of the multiple openings is formed above a corresponding light-emitting area among the multiple light-emitting areas, wherein the multiple hybrid encapsulation patterns are respectively arranged in one of the multiple openings, and the first inorganic encapsulation layer is arranged on the pixel defining layer, wherein the second inorganic encapsulation layer is in direct contact with the first inorganic encapsulation layer.

6. The display device according to claim 1, further comprising a plurality of dummy mixing patterns disposed in the peripheral area, wherein: Each of the plurality of dummy mix patterns includes an organic material and an inorganic material mixed with the organic material.

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