半导体装置制造用片及半导体装置制造用片的制造方法
By employing a composite release film structure and slit design in semiconductor device manufacturing wafers, the problem of winding marks has been solved, manufacturing precision and stability have been improved, and costs have been reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LINTEC CORP
- Filing Date
- 2021-03-26
- Publication Date
- 2026-07-17
AI Technical Summary
In the semiconductor device manufacturing process, semiconductor chips with film-like adhesives are prone to winding marks when wound into rolls, which can lead to misalignment and inaccurate positioning during manufacturing.
A composite release film structure with sequentially stacked release film, second adhesive layer and supporting substrate is adopted to ensure that the thickness of the composite release film is greater than 38μm, and a cut is formed on the release film to control the cut depth and prevent the overlap of steps caused by the difference in layer thickness.
It effectively suppresses the generation of winding marks, improves the precision and stability of the semiconductor device manufacturing process, and reduces manufacturing costs.
Smart Images
Figure CN113451195B_ABST