Joining apparatus

Abstract

Disclosed is a bonding apparatus including a stage that supports a display panel including a first region in which a pad is exposed through the first region, a sensor disposed on the stage and facing the first region, and a processing portion that sets a circuit board on the first region. The processing portion includes a main body that supports the circuit board and a rod connected to the main body and selectively in contact with a second region of the circuit board, the second region overlapping the first region.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0035764, filed on March 24, 2020, which is incorporated herein by reference for all purposes, as fully set forth herein. Technical Field

[0003] The present invention relates to a bonding device. More specifically, the present invention relates to a bonding device capable of more precisely aligning a circuit board on the side surface of a display panel. Background Technology

[0004] Typically, a display device includes a display panel comprising pixels and a driver chip that drives the pixels. The driver chip is disposed on a flexible film, and the flexible film is connected to the display panel. The driver chip is connected to the pixels of the display panel through the flexible film. This connection method is defined as the chip-on-film method.

[0005] Connection pads for the driver chip are disposed on the flexible film, and the display panel includes pads connected to the pixels. Since the pads are respectively connected to the connection pads, the driver chip is connected to the pixels.

[0006] In recent years, a technique has been developed to attach the driver (also referred to as the circuit board below) to the side surface of the display panel to reduce the bezel area.

[0007] The information disclosed in this background section is only for understanding the background technology of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0008] The present invention provides a bonding device that can more accurately align circuit boards on the side surface of a display panel.

[0009] Additional features of the inventive concept will be set forth in the following description, and some of them will be obvious from the description or may be learned by practice of the inventive concept.

[0010] An embodiment of the present invention provides a bonding apparatus comprising: a stage supporting a display panel including a first region, wherein pads are exposed through the first region; a sensor disposed on the stage and facing the first region; and a processing unit for disposing a circuit board on the first region. The processing unit includes a body supporting the circuit board and a rod connected to the body and selectively contacting a second region of the circuit board, wherein the second region overlaps with the first region.

[0011] An embodiment of the present invention provides a joining device comprising: a stage including a support surface extending in a vertical direction; a camera disposed on the stage; and a processing unit disposed between the stage and the camera. The processing unit includes a main body and a contact tip connected to the main body and movable in one direction to be disposed on the stage.

[0012] As described above, the processing unit that places the circuit board on a first area of ​​the display panel includes a lever, which selectively contacts a second area of ​​the circuit board, wherein the second area overlaps with the first area. The lever precisely controls the alignment between the first area of ​​the display panel and the second area of ​​the circuit board.

[0013] It should be understood that both the above general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0014] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the invention and, together with the specification, serve to explain the inventive concept.

[0015] Figure 1 This is a perspective view illustrating a display device according to an embodiment of the concept of the present invention.

[0016] Figure 2 It is shown Figure 1 A cross-sectional view of the display device.

[0017] Figure 3 This is a view showing the display panel of a display device according to an embodiment of the present invention and a circuit board disposed on the side surface of the display panel.

[0018] Figure 4 This is a view illustrating a joining device according to an embodiment of the present invention.

[0019] Figure 5 , Figure 6 , Figure 7 and Figure 8 This illustrates an embodiment of the invention, demonstrating the use of a bonding device to bond a circuit board to... Figure 3 A view of the process of the side surface of the display panel.

[0020] Figure 9 and Figure 10 This is a view illustrating a joining device according to an embodiment of the present invention. Detailed Implementation

[0021] In the following description, numerous specific details are set forth for purposes of explanation to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of apparatus or methods employing one or more of the inventive concepts disclosed herein. However, it will be apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are illustrated in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, a particular shape, configuration, and characteristic of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0022] Unless otherwise stated, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0023] The use of crosshairs and / or shading in the accompanying drawings is generally used to clarify the boundaries between adjacent elements. Therefore, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonalities between the elements shown, or any other characteristics, properties, etc., of the elements. Furthermore, the size and relative size of elements may be exaggerated in the drawings for clarity and / or descriptive purposes. A particular process sequence may be performed in a different order than that described when exemplary embodiments can be implemented differently. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description. Moreover, the same reference numerals refer to the same elements.

[0024] Furthermore, the D1, D2, and D3 axes are not limited to the three axes of a rectangular coordinate system (such as the x, y, and z axes) and can be interpreted in a broader sense. For example, the D1, D2, and D3 axes may be perpendicular to each other or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0025] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., in “sidewall”) may be used herein to describe the relationship of one element to another(s) as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to also include different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “below” other elements or features will consequently be oriented “above” other elements or features. Thus, the exemplary term “below” may encompass both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatial relative descriptive terms used herein should be interpreted accordingly.

[0026] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are terms used as approximations, not terms of degree, and therefore to explain the inherent biases in the measured, calculated, and / or provided values ​​that will be recognized by one of ordinary skill in the art.

[0027] Various exemplary embodiments are described herein with reference to cross-sectional and / or exploded views as schematic illustrations of idealized exemplary embodiments and / or intermediate structures. Therefore, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Thus, the exemplary embodiments disclosed herein should not be construed as limited to the specific shapes shown for a particular region, but rather include deviations in shape due to factors such as manufacturing. In this way, the regions shown in the figures may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0028] In this disclosure, it will be understood that when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it may be directly on, directly connected to, or directly coupled to that other element or layer, or there may be an intervening element or layer. Therefore, the term “connection” may refer to a physical connection, electrical connection, and / or fluid connection, with or without an intervening element.

[0029] The same reference numerals always refer to the same elements. In the accompanying drawings, the thickness, proportions, and dimensions of components are exaggerated for the purpose of effectively describing the technical content.

[0030] As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0031] It will be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element. As used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms, unless the context clearly indicates otherwise.

[0032] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “up” may be used herein to describe the relationship between one element or feature and another element(s) shown in the accompanying figures.

[0033] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense unless expressly defined herein.

[0034] It will be further understood that, when used in this specification, the terms “comprise,” “comprising,” “includes,” and “including” specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0035] The inventive concept will be explained in detail below with reference to the accompanying drawings.

[0036] Figure 1 This is a perspective view illustrating a display device DD according to an embodiment of the concept of the present invention.

[0037] Reference Figure 1According to an embodiment of the present invention, the display device DD may have a plate shape defined by a short side extending in a first direction D1 and a long side extending in a second direction D2 intersecting the first direction D1. Hereinafter, the phrase "when viewed in a plane" may mean the state of viewing in a third direction D3 perpendicular to the plane defined by the first direction D1 and the second direction D2. When viewed in a plane, the display device DD may have a rectangular shape; however, it should not be limited to or restricted by this. The display device DD may have various shapes, such as circular or polygonal shapes.

[0038] The upper surface of the display device DD can be defined as the display surface DS, and can be a plane defined by a first direction D1 and a second direction D2. The image IM generated by the display device DD can be provided to the user through the display surface DS.

[0039] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image, and the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and may define a border area of ​​the display device DD.

[0040] Figure 2 It is shown Figure 1 A cross-sectional view of the display device DD.

[0041] Reference Figure 2 The display device DD may include a display panel DP, an input sensing unit ISP disposed on the display panel DP, an anti-reflective layer POL disposed on the input sensing unit ISP, a window WIN disposed on the anti-reflective layer POL, and a cover panel CV disposed under the display panel DP.

[0042] The display panel DP according to embodiments of the present invention can be a light-emitting display panel; however, it should not be particularly limited. For example, the display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots or quantum rods. Alternatively, the display panel DP can be a liquid crystal display panel including a liquid crystal layer. In this embodiment, an organic light-emitting display panel will be described as a display panel DP.

[0043] The display panel DP may include a first substrate SUB1, a second substrate SUB2, a circuit element layer CL, a display element layer OL, and a sealing layer SL.

[0044] The first substrate SUB1 may be a rigid substrate. For example, the first substrate SUB1 may be a glass substrate. The first substrate SUB1 may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA and the non-display area NDA of the first substrate SUB1 may be substantially separate from each other. Figure 1 The display surface DS shown corresponds to the display area DA and the non-display area NDA.

[0045] The second substrate SUB2 may be disposed on the first substrate SUB1. The lower surface of the second substrate SUB2 may face the upper surface of the first substrate SUB1. In this embodiment, the second substrate SUB2 may be a packaging substrate. For example, the second substrate SUB2 may include a glass substrate.

[0046] A circuit element layer CL and a display element layer OL can be disposed between a first substrate SUB1 and a second substrate SUB2. The circuit element layer CL may include an insulating layer, semiconductor patterns, conductive patterns, and signal lines. The insulating layer, semiconductor layer, and conductive layer can be formed on the first substrate SUB1 by coating and deposition processes, and then the insulating layer, semiconductor layer, and conductive layer can be selectively patterned by multiple photolithography processes. The semiconductor patterns, conductive patterns, and signal lines of the circuit element layer CL can then be formed. For example, the signal lines can be data lines or scan lines.

[0047] The display element layer OL can be disposed on the display area DA. The display element layer OL may include light-emitting elements. For example, the display element layer OL may include organic light-emitting materials, quantum dots, quantum rods, or micro light-emitting diodes.

[0048] A sealing layer SL may be disposed between the first substrate SUB1 and the second substrate SUB2. The sealing layer SL may be disposed outside the display element layer OL and the circuit element layer CL. The sealing layer SL may overlap with the non-display area NDA. For example, the sealing layer SL may extend along the edges of the first substrate SUB1 and the second substrate SUB2. The sealing layer SL may include an insulating material. For example, the sealing layer SL may include a glass material.

[0049] The second substrate SUB2 and the sealing layer SL can protect the display element layer OL disposed on the first substrate SUB1 from the outside. For example, the second substrate SUB2 and the sealing layer SL can prevent external moisture from entering the display element layer OL disposed on the first substrate SUB1 and can prevent defects in the light-emitting element.

[0050] However, the display panel DP may not necessarily include a second substrate SUB2 and a sealing layer SL. For example, the display panel DP may include a thin-film encapsulation layer in place of the second substrate SUB2 and the sealing layer SL. For example, the thin-film encapsulation layer may be disposed on the circuit element layer CL to cover the display element layer OL. The thin-film encapsulation layer may include an inorganic layer, an organic layer, and another inorganic layer stacked sequentially. The inorganic layer may include inorganic materials and may protect the display element layer OL from moisture and oxygen. The organic layer may include organic materials and may protect the display element layer OL from foreign substances such as dust particles.

[0051] An input sensing unit (ISP) may be disposed on a display panel (DP). The ISP can sense external input (e.g., a user's touch), convert the external input into a predetermined input signal, and provide the input signal to the display panel (DP). The ISP may include multiple sensing electrodes to sense the external input. The sensing electrodes can sense the external input using capacitive methods. The display panel (DP) can receive the input signal from the ISP and can generate an image corresponding to the input signal.

[0052] An anti-reflective layer (POL) may be disposed on the input sensing unit (ISP). The anti-reflective layer (POL) reduces the reflectance of external light incident from outside the display device (DD) onto the display panel (DP). As an example, the anti-reflective layer (POL) may include a retarder and / or a polarizer.

[0053] The Window WIN protects the Display Panel (DP) and Input Sensing Unit (ISP) from external scratches and impacts. The Window WIN can be attached to the ISP using an adhesive (not shown). The adhesive may include an optically clear adhesive. Images generated by the Display Panel (DP) can be presented to the user through the Window WIN.

[0054] A cover panel (CV) may be disposed beneath the display panel (DP). The cover panel (CV) may include one or more functional layers. For example, the cover panel (CV) may include a buffer layer. The buffer layer may be a synthetic resin foam comprising a substrate and multiple voids. The voids can easily absorb impacts applied to the display panel (DP).

[0055] Figure 3 This is a view showing the display panel DP of a display device DD according to an embodiment of the present invention, and the circuit board COF disposed on a side surface of the display panel DP. For ease of explanation, Figure 3 The stacked structure of the display panel (DP) is illustrated schematically.

[0056] Reference Figure 3The display panel DP may include a first surface S1, a second surface S2, a first side surface SF1, and a second side surface SF2 opposite to the first side surface SF1. The first surface S1 may define the upper surface of the display panel DP. The first surface S1 may be the surface through which an image is displayed in the display panel DP. The first surface S1 may correspond to... Figure 1 The display surface DS is shown in the diagram. The second surface S2 may define the lower surface of the display panel DP. In the display panel DP, the second surface S2 may be opposite to the first surface S1.

[0057] The first side surface SF1 may be substantially perpendicular to the first surface S1 and the second surface S2. The first side surface SF1 may be substantially parallel to the plane defined by the first direction D1 and the third direction D3. A first region AE1 may be defined in the first side surface SF1. A plurality of pads PD may be provided in the first region AE1. The pads PD may be spaced apart from each other in the first direction D1.

[0058] The pad PD can be connected to a signal line. For example, the pad PD can be disposed on the first substrate SUB1 and can be connected to a signal line of the circuit element layer CL (see reference). Figure 2 For example, each of the pads (PDs) can be connected to a corresponding data line. The pads (PDs) located in the first area AE1 can be exposed to the outside of the display panel (DP).

[0059] Figure 3 Five pads PD are shown in the first region AE1; however, this is merely exemplary, and the number of pads PD in the first region AE1 may be greater than five. The second side surface SF2 may be opposite the first side surface SF1.

[0060] The circuit board COF can be a driver that generates signals and applies them to the pad PD. For example, the circuit board COF can generate data signals, and these data signals can be applied to the circuit element layer CL (see reference PD). Figure 2 (Data cable)

[0061] The circuit board COF may include connection pads CPD, a flexible circuit board FPC, and a driver chip IC. The connection pads CPD may be disposed on one surface of the flexible circuit board FPC. The portion of the flexible circuit board FPC on which the connection pads CPD are disposed may be defined as a second region AE2. One surface of the second region AE2 may face the first side surface SF1 of the display panel DP.

[0062] The connection pads (CPDs) can be configured to correspond to the pads (PDs). Specifically, the connection pads (CPDs) can be spaced apart from each other in the first direction (D1). The connection pads (CPDs) can be electrically connected to the pads (PDs) on a one-to-one basis.

[0063] The flexible printed circuit board (FPC) can be a flexible substrate. For example, a portion of the flexible printed circuit board (FPC) can be bent to be disposed beneath the second surface S2 of the display panel DP. The flexible printed circuit board (FPC) may include transparent materials.

[0064] The driver chip IC can be disposed on the opposite surface of the flexible circuit board (FPC). When the flexible circuit board (FPC) is bent, the driver chip IC can be located below the second surface S2. The aforementioned opposite surface of the flexible circuit board (FPC) can be opposite to a surface on which the connection pad CPD is disposed.

[0065] When viewed in the second direction D2, the second region AE2 of the circuit board COF may overlap with the first region AE1 of the display panel DP. More specifically, when viewed in the second direction D2, each of the connection pads CPD may overlap with the corresponding pad PD. When viewed in the second direction D2, each of the connection pads CPD may have an area larger than that of the pad PD.

[0066] According to an embodiment of the present invention, the circuit board COF connected to the signal line via the pad PD can be connected to the first side surface SF1 of the display panel DP, and thus the size of the bezel area of ​​the display device DD can be reduced.

[0067] Figure 4 This is a view illustrating a coupling device BD according to an embodiment of the present invention. Figure 4 The coupling device BD shown can be used to... Figure 3 The circuit board COF is fixed to the first side surface SF1 of the display panel DP.

[0068] Reference Figure 3 and Figure 4 The coupling device BD may include a stage ST, a clamp CLP, a sensor SS, a processing unit HD, and a coupling head BH.

[0069] The target object can be set on the ST (Station). For example, the target object could be... Figure 3 The display panel DP is shown. The stage ST can have sufficient rigidity. For example, the stage ST can include a metallic material.

[0070] The stage ST may include a first support surface SUF1 and a second support surface SUF2. The first support surface SUF1 may be substantially parallel to the vertical direction (e.g., the third direction DR3). For example, the first support surface SUF1 may be substantially parallel to the plane defined by the second direction DR2 and the third direction DR3. Figure 3 The second surface S2 of the display panel DP shown can be placed on the first support surface SUF1.

[0071] The second support surface SUF2 may be substantially parallel to the horizontal direction (e.g., the first direction DR1 or the second direction DR2). For example, the second support surface SUF2 may be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2. The second support surface SUF2 may be substantially perpendicular to the first support surface SUF1. Figure 3 The second side surface SF2 of the display panel DP shown can be placed on the second support surface SUF2.

[0072] The gripper CLP may be spaced apart from the stage ST in the first direction DR1. The gripper CLP may include a third support surface SUF3. The third support surface SUF3 may face the first support surface SUF1. The third support surface SUF3 may be substantially parallel to the first support surface SUF1. A second support surface SUF2 may be disposed between the first support surface SUF1 and the third support surface SUF3 in the first direction DR1.

[0073] The gripper CLP can move in the first direction DR1. For example, the gripper CLP can move closer to or further away from the stage ST. In other words, the distance between the third support surface SUF3 and the first support surface SUF1 can vary when the gripper CLP moves.

[0074] The sensor SS can be mounted on the stage ST. The sensor SS can face the second support surface SUF2 of the stage ST. When viewed in a plane, the sensor SS can overlap with the second support surface SUF2. The sensor SS can capture an image of a mark made on a target object mounted on the stage ST. For example, the sensor SS can be a camera.

[0075] The processing unit HD can be installed between the stage ST and the sensor SS. The processing unit HD can be used for setting... Figure 3 The circuit board COF shown is illustrated. The processing unit HD may include a main body BO and a rod RO connected to the main body BO.

[0076] The lower surface BF of the main body BO can be substantially parallel to the horizontal direction. For example, the lower surface BF can be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2. A plurality of suction holes SH can be defined in the lower surface BF of the main body BO. When air around the lower surface BF of the main body BO is drawn in by the suction holes SH, suction force can be generated on the lower surface BF of the main body BO.

[0077] The main body BO may include a guide groove GH. The guide groove GH may extend in the horizontal direction. For example, the guide groove GH may extend from one surface of the main body BO toward a surface opposite to that one surface in the first direction DR1.

[0078] Rod RO can be connected to body BO for movement in one direction. Rod RO may include a first portion PP1 and a second portion PP2. The first portion PP1 may be disposed in body BO and extend in the horizontal direction. At least a portion of the first portion PP1 may be inserted into guide groove GH. The first portion PP1 may move in guide groove GH along a first direction DR1.

[0079] The second portion PP2 may extend from the first portion PP1 and may be disposed outside the body BO. The second portion PP2 may extend from the first portion PP1 in a downward direction (e.g., opposite to the third direction DR3). Therefore, the lower surface of the second portion PP2 may protrude further downward than the lower surface of the first portion PP1. The second portion PP2 may be a contact tip. For example, the second portion PP2 may be with… Figure 3 The second region AE2 contact of the COF on the circuit board shown is illustrated. This will be described further later.

[0080] The processing unit HD may also include a driver DR. The driver DR controls the position of the lever RO. For example, the driver DR may include a cylinder CY and an extension EX connected to the cylinder CY.

[0081] Cylinder CY can be positioned in guide groove GH. Extension EX can be positioned between cylinder CY and the first part PP1 of rod RO. One end of extension EX can be connected to the first part PP1. When extension EX extends away from cylinder CY, the second part PP2 of rod RO can move away from the main body BO and can be positioned on stage ST. In this case, the second part PP2 can overlap with sensor SS and the second support surface SUF2. When extension EX is pulled by cylinder CY, the second part PP2 of rod RO can be positioned adjacent to the main body BO. In this case, the second part PP2 may not overlap with sensor SS and the second support surface SUF2. However, the method of moving rod RO by actuator DR should not be limited to or restricted by this.

[0082] The rod RO may include a transparent material. For example, the rod RO may include quartz. Therefore, when the second portion PP2 of the rod RO overlaps with the sensor SS, the sensor SS can capture an image of an object positioned beneath the second portion PP2 of the rod RO. However, the material used for the rod RO should not be limited to or restricted by this, and the rod RO may include other transparent materials besides quartz.

[0083] The connector BH can be mounted on the ST stage. The connector BH can bond the circuit board COF to... Figure 3 The first side surface SF1 of the display panel DP is shown. For example, the bonding head BH can be used to bond the circuit board COF to the first side surface SF1 of the display panel DP using one of the following methods: thermal compression, ultrasonic, and laser beam.

[0084] Specifically, the connector BH may include a pressure tip and a heater to apply pressure to a flexible circuit board (e.g., Figure 3 The connector BH applies predetermined pressure and heat to the connection pad CPD and the display panel DP. Alternatively, the connector BH may include an ultrasonic generator and an ultrasonic irradiation unit to apply ultrasonic waves of a predetermined wavelength between the connection pad CPD and the display panel DP. Alternatively, the connector BH may include a laser irradiation unit to irradiate a laser beam between the connection pad CPD and the display panel PD. However, the method of using the connector BH to fix the circuit board COF to the display panel DP should not be limited to or restricted by this.

[0085] Figures 5 to 8 This illustrates the use of bonding equipment BD to bond a circuit board COF to an embodiment of the present invention. Figure 3 A view of the process of the side surface of the display panel DP. A first mark MK1 and a second mark MK2 may be defined in the first region AE1 and the second region AE2 respectively, and each of the first mark MK1 and the second mark MK2 may be an imaginary designated point or line.

[0086] Reference Figure 3 and Figure 5 The display panel DP can be placed on the stage ST. The stage ST can support the display panel DP. Specifically, the second surface S2 of the display panel DP can be placed on the first support surface SUF1 of the stage ST. The first support surface SUF1 can support the display panel DP in the first direction DR1. For example, the stage ST can use a vacuum adsorption method to fix the display panel DP to the first support surface SUF1. The second side surface SF2 of the display panel DP can be disposed on the second support surface SUF2 of the stage ST. The second support surface SUF2 can support the display panel DP in the third direction DR3.

[0087] The clamp CLP can be positioned on the first surface S1 of the display panel DP. The clamp CLP can move toward the first support surface SUF1 in the first direction DR1. The third support surface SUF3 of the clamp CLP can contact the first surface S1 of the display panel DP. Therefore, the display panel DP can be supported in the horizontal direction by the first support surface SUF1 and the third support surface SUF3, and can be supported in the vertical direction by the second support surface SUF2.

[0088] The processing unit HD can mount the circuit board COF on the first side surface SF1 of the display panel DP. The main body BO of the processing unit HD can be mounted on the upper surface of the circuit board COF. Basically, the upper surface of the circuit board COF can be... Figure 3The upper surface of the flexible printed circuit board (FPC) shown. The processing unit HD can fix the circuit board COF. For example, the processing unit HD can vacuum-adsorb the circuit board COF through the suction hole SH defined in the lower surface BF of the body BO.

[0089] The processing unit HD can move back and forth on the first direction DR1 or the third direction DR3. The processing unit HD can first align the circuit board COF so that the second area AE2 of the circuit board COF overlaps with the first area AE1 of the display panel DP.

[0090] In this case, there may be a slight misalignment between the second region AE2 and the first region AE1. For example, there may be an offset between the second mark MK2 defined in the second region AE2 and the first mark MK1 defined in the first region AE1. This is due to sagging that occurs at the end of the second region AE2, which has a flexible circuit board COF.

[0091] Reference Figure 6 and Figure 7 The rod RO of the processing unit HD can selectively contact the upper surface of the second region AE2 and can control the misalignment between the second region AE2 and the first region AE1.

[0092] More specifically, the driver DR can move the first portion PP1 of the lever RO to the left. Therefore, the second portion PP2 of the lever RO can contact the upper surface of the second region AE2. Due to the contact with the second portion PP2, the end portion of the second region AE2 can be straightened to be substantially parallel to the first side surface SF1 of the display panel DP. Therefore, the second region AE2 of the circuit board COF can be precisely positioned on the first region AE1.

[0093] Because the second part PP2 of the rod RO includes a transparent material, the sensor SS can take a picture of the object positioned beneath the second part PP2. When viewed from the sensor SS, the second mark MK2 and the first mark MK1 can overlap each other.

[0094] According to the embodiment, when the second portion PP2 of the rod RO contacts the upper surface of the second region AE2, the bonding device BD can more precisely align the second region AE2 with the first region AE1. Therefore, the bonding device BD can perform a more complete and precise bonding process, and thus can reduce the load on the display device (e.g., Figure 1 The defect rate of “DD” in the text.

[0095] According to an embodiment of the present invention, since the rod RO comprises a transparent material, the second region AE2 of the circuit board COF and the first region AE1 of the display panel DP can be captured substantially simultaneously by a single sensor SS. Therefore, the sensor SS can be easily set up, and it is easy to check whether the display panel DP and the circuit board COF are aligned with each other.

[0096] Reference Figure 8 The lever RO can return to its original position. Specifically, the driver DR can move the first portion PP1 of the lever RO to the right. Therefore, the second portion PP2 of the lever RO can not overlap with the sensor SS. Then, the bonding head BH can move towards the upper surface of the second region AE2. The bonding head BH can contact the upper surface of the second region AE2. The bonding head BH can bond the circuit board COF to the first side surface SF1 of the display panel DP. As described above, the bonding head BH can perform the bonding process using one of the following methods: thermoforming, ultrasonic, and laser beam methods.

[0097] Once the above bonding process is completed, the display panel DP, which is mounted together with the circuit board COF bonded to the side surface of the display panel DP, can be transferred to the outside of the bonding equipment BD. Then, the bonding process can be performed on another display panel.

[0098] Figure 9 and Figure 10 This is a view illustrating the joining device BD-1 according to an embodiment of the present invention. Figure 9 and Figure 10 In this drawing, the same reference numerals refer to the same elements in the above embodiments. Therefore, detailed descriptions of the same elements will be omitted, and the different features will be described primarily.

[0099] Reference Figure 9 and Figure 10 The rod RO-1 of the processing unit HD-1 can move in an inclined direction. Specifically, the main body BO-1 may include a guide rail GR. The guide rail GR may be disposed on a side surface of the main body BO-1. The guide rail GR may be inclined relative to the horizontal direction. Figure 9 As shown, the guide rail GR can extend upwards to the right.

[0100] Rod RO-1 can be connected to the main body BO-1 and can move on the guide rail GR. For example, the contact tip TP of rod RO-1 can move along the guide rail GR in an inclined direction. When rod RO-1 is positioned at the lower part of the guide rail GR on the third direction DR3, the contact tip TP of rod RO-1 ( Figure 4 The second part (PP2) can contact the upper surface of the circuit board COF. When the rod RO-1 is set on the upper part of the guide rail GR on the third direction DR3, the contact tip TP of the rod RO-1 can be spaced apart from the circuit board COF.

[0101] According to this embodiment, when the contact tip TP of the rod RO-1 moves in the tilting direction, the position of the circuit board COF can be prevented from being misaligned due to the movement of the rod RO-1.

[0102] Although embodiments of the inventive concept have been described, it should be understood that the inventive concept is not to be limited to these embodiments, but can be modified and altered in various ways by those skilled in the art within the spirit and scope of the appended claims. Therefore, the disclosed subject matter should not be limited to any single embodiment described herein, and the scope of the inventive concept should be determined by the appended claims.

Claims

1. A joining device, comprising: A platform that supports a display panel having a first area, wherein pads are exposed through the first area; The sensor is mounted on the platform and faces the first area; as well as The processing unit places the circuit board on the first area. The processing unit includes: The main body supports the circuit board; and A rod, comprising a transparent material, is attached to the body and selectively contacts a second region of the circuit board, the second region overlapping the first region. The rod is positioned on the first region and the second region, and the sensor captures images of the first region and the second region through the rod.

2. The joining device according to claim 1, wherein, The main body is disposed on the upper surface of the circuit board.

3. The joining device according to claim 2, wherein, The main body is provided with one or more suction holes defined in the lower surface of the main body.

4. The joining device according to claim 2, wherein, The rod includes: The first portion extends in a horizontal direction parallel to the upper surface of the circuit board; and The second part extends from the first part in a vertical direction perpendicular to the horizontal direction.

5. The joining device according to claim 4, wherein, The main body is provided with a guide groove defined in the main body and extending in the horizontal direction, and the first part is capable of being inserted into the guide groove and moving in the guide groove.

6. The joining device according to claim 4, wherein, The rod also includes a actuator for moving the rod in the horizontal direction.

7. The joining device according to claim 4, wherein, The main body includes a guide rail that is inclined at a predetermined angle relative to the horizontal direction, and the rod is movable on the guide rail.

8. The joining device according to claim 1, further comprising a joining head disposed on the table, wherein, The connector contacts the upper surface of the second region to connect the circuit board to the display panel.

9. The joining device according to claim 8, wherein, The connector applies ultrasonic waves between the second region and the first region.

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