Cleaning device for cleaning a component, substrate cleaning device and cleaning component assembly

Abstract

As one embodiment of the present application, a cleaning device for cleaning a component has: a substrate support section (200) that holds a dummy substrate (Wd); a holding section (100) that holds a component assembly (1) having a component (90) to be cleaned; a component rotation section (80) that rotates the component; an inner cleaning liquid supply section (110) that supplies a cleaning liquid to the inside of the component; an outer cleaning liquid supply section (120) that supplies a cleaning liquid to the outside of the component; and a control section (350) that controls to perform a first process of pressing the component against the dummy substrate at a first pressure while supplying a cleaning liquid to the dummy substrate from the outer cleaning liquid supply section and a second process of separating the component from the dummy substrate or pressing the component against the substrate at a second pressure lower than the first pressure while supplying a cleaning liquid from the inner cleaning liquid supply section.

Description

Technical Field

[0001] The present invention relates to a cleaning apparatus for cleaning cleaning components, a substrate cleaning apparatus, and a cleaning component assembly for cleaning cleaning components. Background Technology

[0002] Previously, new cleaning components with contaminants attached needed to be removed and initialized before use. Furthermore, a problem exists where, when a cleaned cleaning component is used to continuously clean a substrate, substrate particles, such as abrasive slurry, accumulate on the cleaning component, reducing cleaning efficiency. To address this issue, Japanese Patent Application Publication No. 2016-152345 discloses a substrate cleaning apparatus that rotates the substrate and cleans it while the cleaning component contacts the rotating substrate. This substrate cleaning apparatus includes: a self-cleaning component disposed on an arm supporting the cleaning component and contacting the cleaning component to perform self-cleaning; and a moving mechanism disposed on the arm supporting the cleaning component and moving the self-cleaning component between a position of contact with the cleaning component and a position of departure from the cleaning component.

[0003] The technical problem that the invention aims to solve

[0004] Japanese Patent Application Publication No. 2016-152345 also discloses a method of supplying cleaning fluid to the contact portion between the cleaning component and the self-cleaning component. However, in this conventional method of supplying cleaning fluid to the contact portion between the cleaning component and the self-cleaning component from the outside, there are known technical problems such as the possibility that the particle removal performance may not meet the expected performance during the cleaning process after substrate grinding using a recently studied specific slurry. Summary of the Invention

[0005] The present invention provides a cleaning device for cleaning components, a substrate cleaning device, and a cleaning component assembly that can effectively clean cleaning components.

[0006] Technical means for solving technical problems

[0007] [Concept 1]

[0008] The cleaning apparatus for the cleaning component of the present invention may include:

[0009] A substrate support portion that holds the substrate.

[0010] A holding section that holds a cleaning component assembly having a cleaning component;

[0011] A component rotating part, which causes the cleaning component to rotate;

[0012] An internal cleaning fluid supply unit supplies cleaning fluid into the cleaning component;

[0013] An external cleaning fluid supply unit supplies cleaning fluid from outside the cleaning component; and

[0014] The control unit controls the first and second processes. The first process presses the cleaning component against the substrate with a first pressure while supplying cleaning fluid to the substrate from the external cleaning fluid supply unit. The second process removes the cleaning component from the substrate or presses the cleaning component against the substrate with a second pressure less than the first pressure while supplying cleaning fluid from the internal cleaning fluid supply unit.

[0015] [Concept 2]

[0016] In the cleaning device for the cleaning components of Concept 1, it can be,

[0017] During the second process, the supply of cleaning fluid from the external cleaning fluid supply unit to the substrate is stopped.

[0018] [Concept 3]

[0019] In the cleaning device for the cleaning components of Concept 1, it can be,

[0020] During the second process, cleaning fluid is also supplied from the external cleaning fluid supply unit to the substrate.

[0021] [Concept 4]

[0022] In the cleaning device for any of the cleaning components in concepts 1-3, it can be,

[0023] The second rotational speed of the cleaning component in the second process is faster than the first rotational speed of the cleaning component in the first process.

[0024] [Concept 5]

[0025] In the cleaning device for any of the cleaning components in concepts 1-4, it can be,

[0026] The internal cleaning fluid supply unit supplies rinsing fluid, and the external cleaning fluid supply unit supplies medication; the internal cleaning fluid supply unit supplies medication, and the external cleaning fluid supply unit supplies rinsing fluid; or the internal cleaning fluid supply unit and the external cleaning fluid supply unit both supply medication.

[0027] [Concept 6]

[0028] In the cleaning device for any of the cleaning components in concepts 1 to 5, it can be,

[0029] The internal cleaning fluid supply unit supplies a first cleaning solution, while the external cleaning fluid supply unit supplies a second cleaning solution that is different from the first cleaning solution.

[0030] [Concept 7]

[0031] In the cleaning device for any of the cleaning components in concepts 1 to 6, it can be,

[0032] The control unit supplies cleaning fluid from the internal cleaning fluid supply unit while the cleaning component is pressed against the substrate with a second pressure.

[0033] The second pressure is less than half of the first pressure.

[0034] [Concept 8]

[0035] In the cleaning device for any of the cleaning components in concepts 1 to 7, it can be,

[0036] The control unit controls the conveying unit to replace the substrate, and the control unit controls the first processing and the second processing and the substrate replacement processing to be performed in multiple groups.

[0037] [Concept 9]

[0038] In the cleaning device for the cleaning components of Concept 8, it can be,

[0039] The first pressure in the second half of the group is less than the first pressure in the first half of the group.

[0040] [Concept 10]

[0041] In the cleaning device for any of the cleaning components in concepts 1 to 9, it can be,

[0042] The control unit controls the rotation of the substrate and the cleaning component in opposite directions when the first pressure is above the threshold, and in the same direction when the first pressure is below the threshold.

[0043] [Concept 11]

[0044] In the cleaning device for any of the cleaning components in concepts 1 to 10, it can be,

[0045] The external cleaning fluid supply unit continuously supplies cleaning fluid during the first and second processes.

[0046] The internal cleaning fluid supply unit supplies rinsing fluid and stops supplying rinsing fluid during the first treatment.

[0047] [Concept 12]

[0048] In a cleaning device for any of the cleaning components in concepts 1 to 11, it can be,

[0049] The internal cleaning fluid supply unit supplies rinsing fluid.

[0050] The control unit performs control so that the first time for performing the first process is longer than the second time for performing the second process.

[0051] [Concept 13]

[0052] In a cleaning device for any of the cleaning components in concepts 1 to 12, it can be,

[0053] The control unit controls the external cleaning fluid supply unit to perform a rinsing process before cleaning the substrate to be cleaned.

[0054] [Concept 14]

[0055] Any of the cleaning component components in concepts 1 to 13 can have:

[0056] The cleaning component is cleaned by the cleaning device of the aforementioned cleaning component.

[0057] [Concept 15]

[0058] The substrate cleaning apparatus of the present invention cleans substrates, and the substrate cleaning apparatus may include:

[0059] A substrate support portion that holds the substrate.

[0060] A substrate cleaning solution supply unit that supplies cleaning solution to the substrate;

[0061] A holding section that holds a cleaning component assembly having a cleaning component;

[0062] A component rotating part, which causes the cleaning component to rotate;

[0063] An internal cleaning fluid supply unit supplies cleaning fluid into the cleaning component;

[0064] An external cleaning fluid supply unit supplies cleaning fluid from outside the cleaning component; and

[0065] The control unit controls the first and second processes. The first process presses the cleaning component against the substrate with a first pressure while supplying cleaning fluid to the substrate from the external cleaning fluid supply unit. The second process removes the cleaning component from the substrate or presses the cleaning component against the substrate with a second pressure less than the first pressure while supplying cleaning fluid from the internal cleaning fluid supply unit.

[0066] [Concept 16]

[0067] The cleaning component assembly of Concept 15 may include:

[0068] The cleaning component is cleaned by the aforementioned substrate cleaning apparatus.

[0069] Effects of the present invention

[0070] According to the present invention, a cleaning apparatus for a cleaning component that can effectively clean a cleaning component is provided. Attached Figure Description

[0071] Figure 1 This is a schematic top view showing the overall structure of the substrate processing apparatus according to an embodiment of the present invention.

[0072] Figure 2 This is a perspective view showing the substrate cleaning apparatus used in an embodiment of the present invention.

[0073] Figure 3 This is a diagram showing a cleaning apparatus for a cleaning component used as an example of an embodiment of the present invention.

[0074] Figure 4 This is a diagram illustrating a cleaning apparatus using a cleaning component as another example of an embodiment of the present invention.

[0075] Figure 5 This is a diagram illustrating a cleaning method for a roller cleaning component used in an embodiment of the present invention.

[0076] Figure 6 This diagram illustrates the removal of foreign matter from the cleaning component through an embodiment of the present invention.

[0077] Figure 7 This is a diagram illustrating an example of a method for manufacturing a one-piece molded cleaning component used in an embodiment of the present invention.

[0078] Figure 8 This is a block diagram of a cleaning apparatus for cleaning components used in embodiments of the present invention.

[0079] Figure 9 These are defect maps showing particles larger than 19 nm remaining on the substrate when using the cleaning apparatus with the cleaning component of Embodiment 1 of the present invention and particles larger than 19 nm remaining on the substrate when using the cleaning apparatus with the cleaning component of Comparative Example 1.

[0080] Figure 10A and Figure 10BThis is a graph showing the ratio of the number of particles larger than 19 nm remaining on the substrate when using the cleaning apparatus of the cleaning component of Embodiment 1 of the present invention to the number of particles larger than 19 nm remaining on the substrate when using the cleaning apparatus of the cleaning component of Comparative Example 1.

[0081] Figure 11A This indicates that at the point where the dummy substrate contacts the roller cleaning component, the dummy substrate and the roller cleaning component rotate in opposite directions. Figure 11B This indicates that in the area where the dummy substrate contacts the roller cleaning component, the dummy substrate and the roller cleaning component rotate in the same direction.

[0082] Figure 12 This is a diagram illustrating a cleaning method using a pen-shaped cleaning component used in an embodiment of the present invention.

[0083] Figure 13 This is a schematic structural diagram showing the structure of the roller cleaning apparatus used in an embodiment of the present invention.

[0084] Figure 14 This is a diagram illustrating the cleaning method of the roller cleaning component used in Embodiment 2 of the present invention.

[0085] Figure 15 This is a diagram illustrating the cleaning method of the roller cleaning component used in Embodiment 3 of the present invention.

[0086] Figure 16 This is a graph representing the number of particles larger than 19 nm remaining on the substrate in Examples 1 to 3 of the present invention, using ratios.

[0087] Figure 17 This is a perspective view of a running-in device that can be used in embodiments of the present invention.

[0088] Figure 18 This is a 3D diagram showing the state when the dummy substrate is installed in the break-in module.

[0089] Figure 19 This is a block diagram of the break-in module used in an embodiment of the present invention.

[0090] Symbol Explanation

[0091] 80 Rotating Part

[0092] 90 Cleaning components

[0093] 100 Maintenance Section

[0094] 110 Internal Cleaning Fluid Supply Department

[0095] 120 External Cleaning Fluid Supply Department

[0096] 350 Control Department

[0097] Wd Virtual substrate Detailed Implementation

[0098] "structure"

[0099] Embodiments of a substrate processing apparatus, including a substrate cleaning apparatus, will be described. Furthermore, in one embodiment below, a cleaning process for a semiconductor wafer (the object being processed) is shown, particularly an example using a chemical solution; however, the present invention is not limited to wafer cleaning processes.

[0100] like Figure 1 As shown, the substrate processing apparatus of this embodiment includes a generally rectangular housing 310 and a loading port 312 for holding substrate cassettes storing multiple substrates W. The loading port 312 is disposed adjacent to the housing 310. An open-type cassette, an SMIF (Standard Mechanical Interface) cassette, or a FOUP (FrontOpening Unified Pod) can be mounted in the loading port 312. SMIF cassettes and FOUPs are sealed containers that can maintain an environment independent of the external space by internally housing substrate cassettes and covering them with partitions. Examples of substrates W include semiconductor wafers.

[0101] The interior of the outer casing 310 contains: multiple (in Figure 1 The illustrated arrangement includes four polishing units 314a-314d, a first cleaning unit 316 and a second cleaning unit 318 for cleaning the polished substrate W, and a drying unit 320 for drying the cleaned substrate W. The polishing units 314a-314d are arranged along the length of the substrate processing apparatus, as are the cleaning units 316, 318 and the drying unit 320. According to this embodiment, the substrate processing apparatus can polish various substrates W during the manufacturing process of image sensors such as semiconductor wafers (300mm or 450mm in diameter), flat panels, CMOS (Complementary Metal Oxide Semiconductor), CCD (Charge Coupled Device), and magnetic films in MRAM (Magnetoresistive Random Access Memory). Furthermore, as another embodiment, the substrate processing apparatus can also be used to perform cleaning and drying of the substrate W without housing the polishing unit within the housing 310.

[0102] A first conveying robot 322 is arranged in the area surrounded by the loading port 312, the grinding unit 314a located on the side of the loading port 312, and the drying unit 320. Additionally, a conveying unit 324 is arranged parallel to the grinding units 314a-314d, the cleaning units 316, 318, and the drying unit 320. The first conveying robot 322 receives the substrate W before grinding from the loading port 312 and transfers it to the conveying unit 324, or transfers the dried substrate W taken from the drying unit 320 to the conveying unit 324.

[0103] A second conveying robot 326 is disposed between the first cleaning unit 316 and the second cleaning unit 318, and performs the transfer of substrate W between these two units. A third conveying robot 328 is disposed between the second cleaning unit 318 and the drying unit 320, and performs the transfer of substrate W between these units. Furthermore, a control unit (overall control unit) 350 for controlling the operation of each device of the substrate processing apparatus is disposed inside the housing 310. In this embodiment, the control unit 350 is described as being disposed inside the housing 310, but this is not a limitation; the control unit 350 may be disposed outside the housing 310, or it may be located at a remote location.

[0104] As the first cleaning unit 316, a roller cleaning device can be used. In the presence of cleaning fluid, the roller cleaning device contacts the substrate W with a roller cleaning member 90 that extends linearly along approximately the entire diameter of the substrate W, and scrubs the surface of the substrate W while rotating about a central axis parallel to the substrate W. Alternatively, as the second cleaning unit 318, a pen-shaped cleaning device can be used. In the presence of cleaning fluid, the contact surface of a cylindrical pen-shaped cleaning member extending in the vertical direction contacts the substrate W, and the pen-shaped cleaning member rotates while moving in one direction to scrub the surface of the substrate W. Furthermore, as the drying unit 320, a rotary drying unit can be used. This rotary drying unit sprays IPA vapor from a moving nozzle toward the horizontally rotating substrate W to dry the substrate W, and rotates the substrate W at high speed, thereby drying the substrate W through centrifugal force.

[0105] Furthermore, the first cleaning unit 316 may not use a roller cleaning device, but instead uses the same pen-shaped cleaning device as the second cleaning unit 318, or a two-fluid nozzle cleaning device that cleans the surface of the substrate W through a two-fluid nozzle. Similarly, the second cleaning unit 318 may not use a pen-shaped cleaning device, but instead uses the same roller cleaning device as the first cleaning unit 316, or a two-fluid nozzle cleaning device that cleans the surface of the substrate W through a two-fluid nozzle.

[0106] The cleaning solution in this embodiment includes: rinsing solutions such as pure water (DIW), ammonia peroxide (SC1), hydrochloric acid peroxide (SC2), sulfuric acid peroxide (SPM), sulfuric acid diluted with water, hydrofluoric acid, etc. Alternatively, it may be a mixture or dilution of these as the main components. In this embodiment, unless specifically denied, the cleaning solution refers to rinsing solution, chemical solution, or both. Furthermore, the cleaning in this embodiment includes: a method of wiping by supplying cleaning solution to the substrate while rotating cleaning components such as the roller cleaning component 90 and the pen cleaning component 90a and bringing them into contact with the substrate, and a method of supplying cleaning solution without bringing the components into contact with the substrate.

[0107] like Figure 3 As shown, the cleaning component assembly 1 may include a cleaning component mounting portion 10 and a cleaning component mounted on the surface of the cleaning component mounting portion 10. Hereinafter, as an example, a roller cleaning component 90 will be described, but the embodiment is not limited to this; cleaning components such as pen-shaped cleaning components, brushes, and mandrels can also be used. Figure 2 As shown, the roller cleaning component 90 can also be made of a sponge with multiple protrusions (protrusions) 95. The area of ​​the top of the protrusions 95 can be set to 5 cm². 2 The following are options. PVDF and PTFE can be used as the materials for the cleaning component mounting part 10.

[0108] like Figure 2 As shown, the substrate cleaning apparatus may include a substrate support 200 for holding the substrate W. The substrate support 200 can hold the substrate W extending in a horizontal direction, extending in a vertical direction, or tilted from the horizontal direction. The substrate support 200 can hold and rotate the substrate W using a chuck or suction, or as shown in the diagram. Figure 2 The guide shaft shown rotates and supports the substrate W. A drug supply unit 210 for supplying drug solution to the substrate W and a rinsing solution supply unit 220 for supplying rinsing solution to the substrate W can be provided. In this embodiment, the substrate cleaning solution supply unit for supplying cleaning solution to the substrate W is composed of the drug supply unit 210 and the rinsing solution supply unit 220.

[0109] In this embodiment, the cleaning apparatus for cleaning components is described as being composed of a substrate cleaning apparatus. That is, in this embodiment, it is described as follows: In a substrate cleaning apparatus used to clean a substrate W used in a series of processing steps during mass production of semiconductor substrate wafers, etc., the cleaning apparatus for cleaning components (self-cleaning apparatus or break-in apparatus 600 (see reference 600)) is a cleaning apparatus for cleaning components that cleans cleaning components. Figure 17 This device is also used as a substrate cleaning apparatus for cleaning substrates. However, it is not limited to this method; a cleaning apparatus with a dedicated cleaning component, different from the substrate cleaning apparatus, can also be provided. When using such a cleaning apparatus with a dedicated cleaning component, it is not necessary to use the substrate cleaning apparatus for cleaning substrate W in the cleaning component's cleaning apparatus. Therefore, it is advantageous in that it can extend the operating time of the substrate cleaning apparatus and increase the number of substrates processed (increasing the apparatus's efficiency). Regarding the cleaning apparatus with a dedicated cleaning component, reference is made to the entirety of U.S. Patent Application No. 2019 / 0088509A1, which is incorporated herein by reference.

[0110] Furthermore, when cleaning components such as the cleaning roller cleaning component 90, a dummy substrate Wd can be used as the substrate. In this embodiment, the use of a dummy substrate Wd as the substrate will be described below, but it is not limited to this; a substrate W such as a wafer used in mass production can also be used for cleaning the cleaning components. Moreover, since the metal film in the dummy substrate Wd may dissolve when a cleaning solution is used, it is preferable to use a substrate with an insulating film such as an oxide film as the dummy substrate Wd when a cleaning solution is used. This insulating film can be TEOS (tetraethoxysilane).

[0111] like Figure 3 As shown, the cleaning device for the cleaning component may include: a holding part 100 for holding the cleaning component assembly 1 having the roller cleaning component 90, a component rotating part 80 for rotating the roller cleaning component 90, an inner cleaning liquid supply part 110 for supplying cleaning liquid into the roller cleaning component 90, and an outer cleaning liquid supply part 120 for supplying cleaning liquid from the outside of the roller cleaning component 90.

[0112] In one embodiment, the component rotation section 80 is composed of a transmission section such as a motor or a belt that transmits the driving force of the motor, and the component rotation section 80 is connected to the cleaning component assembly 1 via a holding section 100. Furthermore, it is configured to transmit the rotational driving force generated by the component rotation section 80 to the roller cleaning component 90 of the cleaning component assembly 1. Additionally, the component rotation section 80 allows the cleaning component assembly 1 to move freely up and down in the vertical direction (relative to the substrate W), and can also have a stop member to stop the cleaning component assembly 1 at a predetermined position. In one embodiment, a cylinder mechanism for moving the roller cleaning component up and down can be provided. Furthermore, when the roller cleaning component rotates, it is configured such that, in addition to generating a driving force from the motor, the driving force is also transmitted to a transmission section such as a belt, causing the roller cleaning component 90 to rotate about an axis center along the length direction. Furthermore, in order to enable axial motion control of the xyz axes of the roller cleaning component, a sensor for measuring the position of the roller cleaning component can be installed. The control unit receives the signal obtained from the sensor, generates a displacement signal that causes the position of the roller cleaning component to shift, and sends the displacement signal to the component rotation unit or cylinder, thereby controlling the position of the roller cleaning component to the most suitable position.

[0113] use Figure 13 Let's illustrate with more specific examples.

[0114] like Figure 13 As shown, a roller pressing drive unit 519 can be provided, which is used to press the roller cleaning member 90 against the substrate W or to move the roller cleaning member 90 away from the substrate W. Additionally, a transmission unit 517, made of a belt or the like, can be provided to transmit the rotational force based on the drive unit 515, such as a motor. Furthermore, the roller cleaning member 90 can be driven directly by the drive unit 515 or indirectly by electric drive via a belt or the like.

[0115] The component rotation unit 80 may include a torque detection unit 516 for detecting the torque applied to the drive unit 515, and a pressure detection unit 518 for detecting the pressing pressure of the roller cleaning unit 90 on the substrate W based on the pressing drive unit 519. As the pressure detection unit 518, a force sensor, for example, can be used.

[0116] The control unit 350 can also control the pressing force of the roller cleaning member 90 on the substrate W based on the detection result from the torque detection unit 516. For example, the control unit 350 controls the pressing force of the roller cleaning member 90 on the substrate W to limit the torque applied to the drive unit 515 to a certain range (the second range described later) or to make the torque a constant value.

[0117] The control unit 350 can also control the pressing pressure of the roller cleaning member 90 based on the pressing drive unit 519 on the substrate W based on the detection results from the pressing pressure detection unit 518.

[0118] Alternatively, the control unit 350 can control the pressing force of the roller cleaning member 90 on the substrate W based on the pressing drive unit 519 from the moment the roller cleaning member 90 comes into contact with the substrate W until the first time interval (e.g., 1 to 3 seconds) arrives, based on the detection results from the pressing pressure detection unit 518, and control the pressing force based on the detection results from the torque detection unit 516 after the first time interval has elapsed. Furthermore, in addition to this method, control can also be performed based on the detection results from the pressing pressure detection unit 518, ensuring that the pressing force of the roller cleaning member 90 on the substrate W does not become excessively large or excessively small (threshold control).

[0119] In addition, when the first time arrives, the control unit 350 can determine whether the pressing pressure of the roller cleaning member 90 on the substrate W is within the first range based on the detection result from the pressing pressure detection unit 518, and if the pressing pressure is outside the first range, control the pressing drive unit 519 so that the pressing pressure is within the first range.

[0120] The torque detection unit 516 may detect the torque multiple times within a specified time, and the control unit 350 may control the pressing pressure based on the values ​​of the multiple torques detected by the torque detection unit 516 (using, for example, the average value of the multiple torque values). Alternatively, the torque detection unit 516 may detect the torque at predetermined intervals (e.g., every 0.1 to 0.3 seconds). As an example, the control unit 350 may control the pressing pressure based on two to five consecutive detection results. For example, three points may be acquired every 0.1 seconds, and their average value may be used to control the pressing pressure applied to the substrate W from the roller cleaning member 90. In one embodiment, when the substrate is wiped by the roller cleaning member, the pressing pressure of the cleaning member on the substrate may be controlled based on the values ​​of multiple torques detected by the torque detection unit 516 within a specified time.

[0121] Furthermore, when the component rotation unit 80 rotates at a preset speed, since the component rotation unit 80 achieves a constant speed, the applied torque repeatedly takes large and small values. That is, when the torque becomes high at a certain moment, control is performed to reduce the pressing force applied from the roller cleaning member 90 to the substrate W, resulting in a smaller torque. When the torque becomes low in this way, control is performed to increase the pressing force applied from the roller cleaning member 90 to the substrate W, resulting in a larger torque. By repeating this control of the component rotation unit 80, a high-precision torque value can be used for control by taking an average value. In addition, since the torque repeatedly increases and decreases during one rotation of the rotating shaft, the period of increase and decrease can also be stored as a preset value in advance. Based on this, the above-mentioned torque monitoring can be performed based on the calculation of the effect of increase and decrease during one rotation of the rotating shaft. Furthermore, the smaller the torque variation within one rotation of the roller cleaning component 90, the less deviation in cleaning effect caused by the different rotation positions of the roller cleaning component 90 (the circumferential part of the protrusion 95 in contact with the substrate W or other objects to be cleaned).

[0122] Alternatively, the torque detection unit 516 may detect the torque multiple times within a time period of n rotations of the roller cleaning member 90 ("n" is an integer), and use the average value to control the pressing pressure applied from the roller cleaning member 90 to the substrate W.

[0123] The control unit 350 can also control the torque to be different values ​​relative to at least two different types of cleaning solutions. Furthermore, the control unit 350 can also control the pressing pressure applied from the roller cleaning member 90 to the substrate W to achieve different torque values ​​depending on the type of substrate W.

[0124] The control unit 350 can also control the pressing drive unit 519 based on the detection results from the torque detection unit 516 to bring the torque within the second range. Alternatively, the control unit 350 can also detect whether the torque is within the second range at predetermined intervals based on the detection results from the torque detection unit 516, and control the pressing drive unit 519 to bring the torque within the second range if the torque is outside the second range. Furthermore, the control unit 350 can continuously detect whether the torque is within the second range based on the detection results from the torque detection unit 516 and make appropriate adjustments to ensure that the torque does not deviate from the second range.

[0125] When a guide shaft is used as the substrate support 200, the control unit 350 can also control the pressing drive unit 519 based on the detection result from the torque detection unit 516 to prevent the torque from exceeding a first threshold, thereby preventing the substrate W from stopping its rotation. The first threshold can be determined based on the empirical value when the substrate W does not rotate or stops rotating, or it can be determined based on the theoretical value when the substrate W does not rotate. For example, the first threshold can be a value of 10% to 30% or less of the empirical value of the torque when the substrate W does not rotate or stops rotating, or a value of 10% to 30% or less of the theoretical value of the torque when the substrate W does not rotate.

[0126] During the first processing, control can be performed as follows: by receiving feedback from the detection results from the torque detection unit 516 and / or the pressing pressure detection unit 518, the control unit 350 controls the pressing drive unit 519 to make the roller cleaning member 90 press the substrate W with a first pressure, and controls the external cleaning liquid supply unit 120 to supply cleaning liquid to the substrate W from the external cleaning liquid supply unit 120.

[0127] During the second processing, control can be implemented, for example, by receiving feedback from the torque detection unit 516 and / or the pressure detection unit 518, thereby controlling the pressing drive unit 519 to cause the roller cleaning member 90 to leave the substrate W, or controlling the pressing drive unit 519 to cause the roller cleaning member 90 to press the substrate W with a second pressure. Additionally, at this time, the control unit 350 can also control the internal cleaning fluid supply unit 110 to supply cleaning fluid into the roller cleaning member 90.

[0128] Signals are sent from the torque detection unit 516 and / or the pressure detection unit 518 to the control unit 350, and the control unit 350 receives the detection results from the torque detection unit 516 and / or the pressure detection unit 518. Additionally, a signal is sent from the control unit 350 to the pressing drive unit 519, which receives the signal and causes the pressing drive unit 519 to move the roller cleaning member 90 along the normal direction of the substrate W.

[0129] like Figure 17 As shown, the break-in device 600 may include: a break-in housing 605, a break-in module 610 disposed within the break-in housing 605, a break-in control unit 650 for controlling the break-in module 610, and a break-in storage unit 655 for storing various information (see reference). Figure 19The break-in control unit 650 can be configured as, for example, a touch panel, and is provided on the side of the break-in housing 605. In this embodiment, it is described with two break-in modules 610 provided inside the break-in housing 605, but it is not limited to this; one break-in module 610 or three or more break-in modules 610 may be provided inside the break-in housing 605. When multiple break-in modules 610 are provided inside the break-in housing 605, the break-in process of the roller cleaning component 90 can be performed by one or more break-in modules 610, and the break-in process of the pen-shaped cleaning component can be performed by one or more other break-in modules 610. In addition, the control of the break-in device 600 can also be performed by the control unit 350, which is an overall control unit, in addition to the break-in control unit 650. Figure 19 As shown, the break-in control unit 650 and the control unit 350, which is an integral control unit, can also be connected to enable communication.

[0130] like Figure 17 As shown, the break-in device 100 may have a first moving part 690 that allows the break-in device 100 to move. As an example, casters or similar first moving parts 690 may be provided on the lower surface of the break-in housing 605. Additionally, the break-in device 600 may have a locking part 691 for locking it in place so that it cannot move via the first moving parts 690. In this embodiment, it will be described with four first moving parts 690 and four corresponding locking parts 691.

[0131] With the first movable part 690 enabling the break-in device 600 to move, it is advantageous to be able to freely change the configuration position of the break-in device 600. When the type of substrate being cleaned changes or the number of substrates being cleaned increases, the layout of the substrate cleaning device inside the housing may change. Therefore, it is advantageous to enable the break-in device 600 to move, so that it can be easily configured in spare space.

[0132] The cleaning component holding part 100 can be configured to hold three or more roller cleaning components 90 (see reference). Figure 18 However, this is not the only possibility. The cleaning component holding part 100 may also be configured to hold one or two cleaning components 90. Figure 18 In the manner shown, the cleaning component holding part 100 is able to hold four roller cleaning components 90.

[0133] From the viewpoint of "adapting" the roller cleaning component 90 to the same environment as actual cleaning, the rotation speed of the roller cleaning component 90 based on the cleaning component holding part 100 can be the same as the rotation speed used in the cleaning process of the substrate cleaning apparatus.

[0134] like Figure 18 As shown, the substrate support portion 200 can be configured to hold the dummy substrate Wd in a vertical direction (i.e., the dummy substrate Wd extends in the vertical direction in the in-plane direction). However, it is not limited to this; the substrate support portion 200 can also be configured to hold the substrate in a horizontal direction or to hold the substrate at an angle from the horizontal direction.

[0135] exist Figure 18 In the illustrated configuration, four substrate support portions 200 are arranged equally (at a 90° angle with respect to the rotation center). In this embodiment, the substrate support portion 200 is constructed of a guide shaft and configured to rotate and hold the dummy substrate Wd. Alternatively, a component constructed of a chuck can be used instead of a guide shaft as the substrate support portion 200. In this case, the dummy substrate Wd is held by the chuck, and the dummy substrate Wd held by the chuck is rotated by a driving force from the rotating portion. The number of substrate support portions 200 is sufficient to stably hold the dummy substrate Wd; for example, three or six may be used.

[0136] When a chuck is used as the substrate support 200, the substrate support 200 may be in an open state when the dummy substrate Wd is not held, and in a closed state when the dummy substrate Wd is held. The opening and closing of the dummy substrate Wd may be controlled based on instructions from the break-in control unit 650, or the substrate support 200 may automatically become closed when the dummy substrate Wd is placed on it, and automatically become open when the dummy substrate Wd is removed (by applying a certain amount of force).

[0137] When the dummy substrate Wd is placed on the substrate support 200, it can be either the operator who places the dummy substrate Wd on the substrate support 200, or a substrate transport unit such as a robotic arm that places the dummy substrate Wd on the substrate support 200.

[0138] exist Figure 18 The illustrated configuration includes four external cleaning supply units 120, which can be arranged such that one cleaning component holding unit 100 corresponds to one external cleaning fluid supply unit 120. Alternatively, one internal cleaning fluid supply unit 110 can correspond to one cleaning component holding unit 100 (see reference). Figure 19 This is done in a way that allows for a reliable supply of cleaning fluid to each of the roller cleaning components 90°.

[0139] A second movable part 660 may be connected to the cleaning component holding part 100. The second movable part 660 is used to bring the cleaning component holding part 100 closer to and separate it from the dummy substrate Wd (see also). Figure 18(arrow). In addition, in order to reduce manufacturing costs and miniaturize the device structure, the second moving part 660 may also be configured to only bring the cleaning component holding part 100 close to or separate from the dummy substrate Wd, without making the cleaning component holding part 100 swing, etc.

[0140] In order to run-in the entire assembly including the two ends of the roller cleaning member 90 along its length, the second moving part 660 may also be able to move or swing the roller cleaning member 90 along its length or in-plane direction of the dummy substrate Wd orthogonal to the length direction.

[0141] exist Figure 18 In the illustrated configuration, second moving parts 660 are respectively provided on the front and back sides of the dummy substrate Wd, and the two roller cleaning members 90 located on the front side of the dummy substrate Wd and the two roller cleaning members 90 located on the back side of the dummy substrate Wd move synchronously. The second moving parts 660 can be configured as, for example, actuators.

[0142] Next, an example of the cleaning method for the roller cleaning unit 90 will be described.

[0143] First, the dummy substrate Wd is supported by the substrate support portion 200, such as the guide shaft.

[0144] Next, the substrate W is rotated, and cleaning fluid is supplied to the substrate W from the external cleaning fluid supply unit 120.

[0145] Next, the control unit 350 controls the pressing drive unit 519 to cause the roller cleaning member 90 to press the substrate W with a first pressure (first processing). During this period, cleaning fluid is continuously supplied to the substrate W from the external cleaning fluid supply unit 120.

[0146] Next, the control unit 350 controls the pressing drive unit 519 to move the roller cleaning member 90 away from the substrate W, or controls the pressing drive unit 519 to press the roller cleaning member 90 against the substrate W with a second pressure. During or after such control, the control unit 350 controls the inner cleaning fluid supply unit 110 to supply cleaning fluid into the roller cleaning member 90 (second process). During this period, cleaning fluid is continuously supplied to the substrate W from the outer cleaning fluid supply unit 120.

[0147] Next, the control unit 350 receives a signal and controls the transport unit 300 to remove the used dummy substrate Wd and move in other dummy substrates Wd.

[0148] The above process is then repeated. Alternatively, the dummy substrate Wd can be replaced after multiple sets of the first and second processes, instead of after only one first and second process.

[0149] The control unit 350 can also control the roller cleaning member 90 to contact the dummy substrate Wd. To make the roller cleaning member 90 contact the dummy substrate Wd, the control unit 350 controls the holding unit 100 and controls the roller cleaning member 90 to approach or move away from the dummy substrate Wd. Not limited to this, the control unit 350 can also control the substrate support unit 200 to make the dummy substrate Wd approach or move away from the roller cleaning member 90. The rotational speed of the roller cleaning member 90 is, for example, 50 rpm to 400 rpm. The rotational speed of the dummy substrate Wd is, for example, 50 rpm to 400 rpm. Furthermore, when a substrate cleaning apparatus is used as the cleaning member in a cleaning apparatus, the external cleaning liquid supply unit 120 can also be used. Figure 2 The medicine supply unit 210 or the rinsing solution supply unit 220 shown.

[0150] The control unit 350 can also perform control to perform a first process and a second process. In the first process, the roller cleaning member 90 presses the dummy substrate Wd with a first pressure while supplying cleaning liquid from the outer cleaning liquid supply unit 120 to the dummy substrate Wd. In the second process, the roller cleaning member 90 moves away from the dummy substrate Wd, or the roller cleaning member 90 presses the dummy substrate Wd with a second pressure less than the first pressure while supplying cleaning liquid from the inner cleaning liquid supply unit 110.

[0151] In the second process, while the roller cleaning member 90 is separated from the dummy substrate Wd, an internal cleaning liquid composed of rinsing liquid or the like can be supplied while the roller cleaning member 90 is rotated at a speed of 200 to 600 rpm. In particular, it can be rotated back and forth at 400 rpm.

[0152] The temperature of the cleaning solution is, for example, less than 60 degrees Celsius. When the temperature is set to 60 degrees Celsius or higher, the cleaning components such as the roller cleaning component 90 may deteriorate. Furthermore, a higher temperature of the cleaning solution (less than 60 degrees Celsius) is advantageous in terms of its effectiveness in removing foreign matter. In this application, waste present on the substrate W is referred to as particles, and particles and residues contained in the cleaning components such as the roller cleaning component 90 are referred to as foreign matter.

[0153] When the roller cleaning member 90 moves away from the dummy substrate Wd (moves towards the retraction position), the roller cleaning member 90 can be moved along the normal direction of the dummy substrate Wd, or after the roller cleaning member 90 moves slightly along the normal direction of the dummy substrate Wd, the roller cleaning member 90 can be moved along the in-plane direction of the dummy substrate Wd.

[0154] The second rotational speed of the roller cleaning component 90 in the second process can be faster than the first rotational speed of the roller cleaning component 90 in the first process. The second rotational speed of the roller cleaning component 90 can be 1.5 to 6 times the first rotational speed, and is particularly preferred to be 1.5 to 3 times the first rotational speed.

[0155] For example, when breaking in a new roller cleaning component 90, a cleaning apparatus of the cleaning component of this embodiment can be used. Since there is a high probability of dirt adhering to a new roller cleaning component 90, it is advantageous to use a cleaning apparatus of a cleaning component like that of this embodiment. Furthermore, even after the roller cleaning component 90 has been used to a certain extent, dirt may still adhere to it. Therefore, the cleaning apparatus of the cleaning component of this embodiment can also be used when cleaning a roller cleaning component 90 that has been used to a certain extent.

[0156] The control unit 350 can control the first and second processes and the replacement process of the dummy substrate Wd to be performed multiple times. The control unit 350 can repeat the first and second processes and the replacement process of the dummy substrate Wd, for example, 3 to 150 times. As an example, the group (the first and second processes and the replacement process of the dummy substrate Wd) shown in the table below can be repeated. That is, in the first process, external cleaning liquid can be supplied while the roller cleaning member 90 presses against the dummy substrate Wd, and in the second process, internal and external cleaning liquids can be supplied while the roller cleaning member 90 moves away from the dummy substrate Wd (see reference). Figure 5 After that, the supply of internal and external cleaning solutions can be stopped, the dummy substrate Wd can be replaced, and the first process can be started again.

[0157] Table 1

[0158] Pressing on the virtual substrate ON OFF OFF Internal cleaning fluid supply OFF ON OFF External cleaning fluid supply ON ON OFF

[0159] Furthermore, not limited to this method, the dummy substrate Wd can also be replaced after repeating the first and second processes described in Table 1 a predetermined number of times (e.g., 3 to 50 times). Additionally, during the replacement of the dummy substrate Wd, the supply of external cleaning fluid can be continuously maintained. According to this method, the dummy substrate Wd being replaced can be reliably kept wet from the outset.

[0160] The control unit 350 can control the process so that the first pressure in the latter half of the group is lower than the first pressure in the former half of the group. For example, the first pressure in the first group can be higher than the first pressure in the last group. Furthermore, when the first and second processes and the replacement process of the dummy substrate Wd are repeated n times, the average value of the first pressure in more than half of n times can be lower than the average value of the first pressure in less than half of n times. More specifically, when n is even, the average value of the first pressure in n / 2 times or less can be higher than the average value of the first pressure in (n / 2+1) times or more; when n is odd, the average value of the first pressure in (n-1) / 2 times or less can be higher than the average value of the first pressure in (n+1) / 2 times or more.

[0161] The same process (processing content) can be used for cleaning the new roller cleaning component 90 (run-in process) and for cleaning the roller cleaning component 90 after it has been used to a certain extent (hereinafter also referred to as "maintenance process"). However, different processes can also be used. Generally, in the roller cleaning component 90, the roller itself is manufactured with a sponge-like structure and is machined to provide internal space for internal rinsing. Therefore, fragments of roller material from the manufacturing process remain in the internal space. Therefore, generally, the new roller cleaning component 90 is dirtier than the roller cleaning component 90 already used in cleaning the substrate W, and the maintenance process can be shorter than the run-in process. When the first and second processes and the replacement of the dummy substrate Wd are performed in multiple groups, the maintenance process can be performed with 1 / 2 to 1 / 3 of the number of groups as the run-in process.

[0162] A detection device 250 for detecting contamination of substrate W can be provided (see reference). Figure 8 If, based on the detection results from the detection device 250, the contamination level of the substrate W exceeds a specified limit (e.g., the number of particles exceeds a specified number), the control unit 350 can control the cleaning process performed by the cleaning unit such as the roller cleaning unit 90. Alternatively, the cleaning process can be performed after a specified number of substrates W have been cleaned; for example, the control unit 350 can control the cleaning process to be performed using a cleaning unit employing a dummy substrate Wd every twenty substrates W have been cleaned.

[0163] After cleaning the cleaning unit using the dummy substrate Wd, the same cleaning unit can be used to clean substrates such as display wafers, and the contamination of the substrate can be confirmed by the detection device 250. Alternatively, a cleaning unit such as a wetted roller cleaning unit 90 can be squeezed, and particles in the liquid obtained can be detected by the detection device 250. The detection device 250 can be ICP-MS (ICP quality analysis), LC (liquid chromatography), or SP5 (manufactured by KLA-Tencor) as a wafer foreign matter inspection device.

[0164] The same cleaning fluid can be supplied to both the internal cleaning fluid supply unit 110 and the external cleaning fluid supply unit 120, but this is not a limitation; different cleaning fluids can also be supplied to the internal cleaning fluid supply unit 110 and the external cleaning fluid supply unit 120. For example, the internal cleaning fluid supply unit 110 can supply a rinsing fluid, while the external cleaning fluid supply unit 120 can supply a medicinal solution. Alternatively, unlike this method, the internal cleaning fluid supply unit 110 can supply a medicinal solution, while the external cleaning fluid supply unit 120 can supply a rinsing fluid. Furthermore, the internal cleaning fluid supply unit 110 can supply a first medicinal solution, while the external cleaning fluid supply unit 120 can supply a second medicinal solution different from the first medicinal solution.

[0165] The control unit 350 can control the supply of cleaning fluid from the internal cleaning fluid supply unit 110 during the period when the roller cleaning member 90 presses the dummy substrate Wd with a second pressure. The second pressure can be lower than the first pressure, which can be less than 1 / 2 or even less than 1 / 3. The pressing pressure on the dummy substrate Wd is, for example, 1N to 20N, such as about 6N. Furthermore, if 6N is used as the first pressure, the second pressure can be around 3N. However, it is not limited to this; the second pressure can be the same as the first pressure, or it can be greater than the first pressure.

[0166] The control unit 350 can control the transport unit 300 to replace the dummy substrate Wd (see reference). Figure 8 The conveying unit 300 may include: a loading port 312, a first conveying robot 322, a conveying unit 324, and a second conveying robot 326 (see reference). Figure 1 In the case of a cleaning device that uses dedicated cleaning components, which is different from the substrate cleaning device, a dedicated transport section 300 may also be provided.

[0167] The control unit 350 can also control the rotation of the dummy substrate Wd and the roller cleaning member 90 to be opposite when the first pressure is above a threshold, and to be in the same direction when the first pressure is below the threshold. The threshold can be preset or input by the user from the computer keyboard and mouse, etc., via the input unit 400 (see reference). Figure 8The threshold is set by inputting the information. In this embodiment, "the rotation direction of the dummy substrate Wd and the roller cleaning component 90 is opposite" means that at the point where the dummy substrate Wd and the roller cleaning component 90 contact, the dummy substrate Wd and the roller cleaning component 90 rotate in opposite directions (see reference). Figure 11A Additionally, "the dummy substrate Wd and the roller cleaning member 90 rotate in the same direction" means that at the point where the dummy substrate Wd contacts the roller cleaning member 90, the dummy substrate Wd and the roller cleaning member 90 rotate in the same direction (see reference). Figure 11B Furthermore, when changing the rotation direction, the rotation direction of the dummy substrate Wd can be changed, as can the rotation direction of the roller cleaning component 90.

[0168] The cleaning fluid supplied from the internal cleaning fluid supply unit 110 and the external cleaning fluid supply unit 120 can be an alkaline liquid such as NH4OH.

[0169] The external cleaning fluid supply unit 120 can continuously supply cleaning fluid during the first and second processes. The internal cleaning fluid supply unit 110 can supply rinsing fluid and stop supplying rinsing fluid during the first process. Such control of the cleaning fluid and rinsing fluid can be performed by the control unit 350.

[0170] The internal cleaning fluid supply unit 110 supplies cleaning fluid at a rate of, for example, 50 ml / min to 2500 ml / min, typically 400 ml / min to 900 ml / min. The external cleaning fluid supply unit 120 can supply cleaning fluid in a spray or in a straight line. If the amount of cleaning fluid supplied from the internal cleaning fluid supply unit 110 is less than 50 ml / min, even if internal cleaning fluid is supplied, it may not be able to be sprayed out from the holes provided in the entire cleaning component with a uniform spray pressure, and it is also impossible to expect physical removal of contaminants by spray pressure. In addition, to reliably supply internal cleaning fluid into the cleaning component, for example, to reduce concerns such as backflow, it is preferable to set the rate to less than 1500 ml / min.

[0171] Alternatively, the concentration of the medicine supplied from the internal cleaning fluid supply unit 110 can be changed while the medicine is being supplied. Furthermore, when medicine is supplied from both the internal cleaning fluid supply unit 110 and the external cleaning fluid supply unit 120, the medicine supplied from the internal cleaning fluid supply unit 110 and the medicine supplied from the external cleaning fluid supply unit 120 can be different types of medicine, the same medicine, or medicines with different concentrations.

[0172] The control unit 350 can also control the process so that the first time of the first processing is longer than the second time of the second processing.

[0173] The control unit 350 can control associated devices, including the external cleaning fluid supply unit 120, to perform rinsing treatment before cleaning mass-produced wafers or other substrates W. Furthermore, rinsing refers to cleaning the interior of a device by spraying rinsing fluid into a substrate cleaning apparatus where no substrate W is installed, or a cleaning apparatus with dedicated cleaning components.

[0174] Alternatively, one end of the cleaning component assembly 1 may be passively held by the cleaning component holding part 100, and the other end may be driven by the component rotating part 80 having a motor (see reference). Figure 3 That is, the cleaning component holding part 100 may have a second cleaning component holding part 100b driven by the component rotating part 80 and a first cleaning component holding part 100a driven passively.

[0175] The roller cleaning component 90 can be a cantilever holding structure or a two-end holding structure. In the case of a cantilever holding structure, from a structural point of view, there are concerns about the cleaning component detaching from the dummy substrate Wd and rotating; however, according to the inventors of this application, it can be determined that there are no particular problems at speeds below 400 rpm. In the case of a cantilever holding structure, a component rotation section 80 can be provided at the end where the roller cleaning component 90 is held, and internal cleaning fluid can be supplied from this end (see reference). Figure 4 Furthermore, in the case of a two-end retaining structure, speeds of 400 rpm or higher can be used if necessary. Moreover, even with a cantilever retaining structure, depending on the design specifications, speeds of 400 rpm or higher can be used.

[0176] When supplying cleaning solutions for both internal and external cleaning solutions, although the choice depends on the substrate being processed, filters 112 and 122 with a mesh size of approximately 1 nm or larger can be used (see reference). Figure 3 However, to meet future requirements such as further miniaturization of the substrate, there are also cases where filters with smaller mesh sizes are used. By using such filters 112, 122, foreign matter contained in the cleaning fluid can be removed. The external cleaning fluid supply unit 120 may have an external cleaning fluid storage unit 124 and an external cleaning fluid supply member 121 consisting of a nozzle or the like connected to the external cleaning fluid storage unit 124. In this case, a filter 122 can be provided between the external cleaning fluid storage unit 124 and the external cleaning fluid supply member 121. Alternatively, a filter 112 can be provided between the internal cleaning fluid supply unit 110 and the cleaning member holding unit 100.

[0177] like Figure 3As shown, the cleaning component mounting portion 10 may include: a main body 20, a cleaning fluid inlet portion (gap) 30 extending inside the main body 20, and a plurality of cleaning fluid supply holes 40 communicating with the cleaning fluid inlet portion 30. The cleaning component mounting portion 10 may be constructed in a cylindrical shape having a hollow region. This hollow region may be the cleaning fluid inlet portion 30, with the cleaning fluid supply holes 40 communicating with it. Cleaning fluid supplied to the cleaning fluid inlet portion 30 is then immersed in the roller cleaning component 90 for use when cleaning the substrate W. Figure 3 It is a cross-section of the roller cleaning component 90 cut off at the part where the protrusion 95 is not set.

[0178] The cleaning fluid to the cleaning fluid inlet 30 can be introduced through the supply pipe 115 provided inside the first cleaning component holding part 100a.

[0179] The dummy substrate Wd can be arranged at an angle relative to the horizontal direction, or it can be arranged to extend in the vertical direction. Furthermore, the cleaning process of the roller cleaning member 90 can be performed using both the front and back surfaces of the dummy substrate Wd. The processing of both the front and back surfaces of the dummy substrate Wd can be performed simultaneously, or one surface at a time.

[0180] In the cleaning component assembly 1, the cleaning component mounting part 10 and the roller cleaning component 90 can be integrally formed, and the roller cleaning component 90 can be formed on the cleaning component mounting part 10. Alternatively, the cleaning component mounting part 10 and the roller cleaning component 90 can be separate components that can be easily disassembled. The roller cleaning component 90 can be made of porous resin materials such as PVA (polyvinyl alcohol) sponge material or PVFM (polyvinyl formal) after reacting PVA. The PVA sponge material (e.g., containing PVA-t (polyvinyl acetal) resin material) can be adjusted from homopolymers of polyvinyl acetate, etc. As the material of the roller cleaning component 90, nylon, polyurethane, or a combination of polyurethane and PVA can be used, or other molding possibilities such as copolymers that do not scratch the substrate surface and provide material removal suitable for the process can be used.

[0181] In one embodiment, the cover member constituting the first end 11 is molded by an inner frame 951 having a hole 951a and an outer frame 952 (see reference). Figure 7The cleaning component mounting part 10 is inserted into the inner frame 951 forming the mold. Furthermore, a cover part can be installed to cover each opening of the cleaning liquid supply hole 40 after filling the interior of the cleaning component mounting part 10 with filler (e.g., wax). Next, using a nozzle (not shown), a mixture (or foaming solution) of PVA material constituting the roller cleaning component 90, an aqueous solution containing at least 500-4000 overlap and 80% or more of polyvinyl alcohol, an aldehyde crosslinking agent, a catalyst, and starch as a pore-forming agent is flowed between the inner frame 951 and the cleaning component mounting part 10. Then, the cover part constituting the second end 12 is installed on the cleaning component mounting part 10, the inner frame 951, and the outer frame 952, and heated to 40-80 degrees Celsius to cause a reaction in the liquid. In this way, the elongated cleaning component mounting portion 10 with internally extending pores and the porous cleaning layer (PVA porous layer) covering the outer surface of the cleaning component mounting portion 10 are integrally formed with the cleaning component mounting portion 10, and are formed as a plurality of protrusions made of the same porous PVA as the cleaning layer protruding outward.

[0182] The inner frame 951 and the outer frame 952 can be opened and closed respectively. Then, by opening these inner frames 951 and outer frames 952, the cleaning component mounting part 10 is removed from the mold. Then, the filler (e.g., wax) filling the interior of the cleaning component mounting part 10 is removed by a prescribed method, and the cover parts covering each opening of the cleaning fluid supply hole 40 are removed.

[0183] Next, the interior of the cleaning component mounting section 10, each opening of the cleaning fluid supply hole 40, and the roller cleaning component 90 are washed with water. Through this series of processes, the roller cleaning component 90 made of PVA material can be integrally molded onto the cleaning component mounting section 10 to suppress the problem of back contamination during use.

[0184] When the roller cleaning component 90 made of PVA material is manufactured on the cleaning component mounting part 10 by integral molding, the roller cleaning component 90 made of PVA material can be formed in such a way that recesses are formed at the locations corresponding to the openings of the cleaning fluid supply holes 40 of the roller cleaning component 90. By configuring the cleaning component assembly 1 in this way, it is possible to effectively prevent the cleaning fluid sprayed from the cleaning component mounting part 10 to the cleaning part 90 from flowing back inside.

[0185] The cleaning component assembly 1 can be used to fix the cleaning component mounting part 10 and the roller cleaning component 90 with an adhesive.

[0186] In one embodiment, the cleaning component assembly 1 is formed such that the inner diameter of the roller cleaning component 90 is smaller than the outer diameter of the cleaning component mounting portion 10. By pressing the roller cleaning component 90 into the cleaning component mounting portion 10, the cleaning component mounting portion 10 and the roller cleaning component 90 are fixedly supported by the elastic force of the roller cleaning component 90. Furthermore, in one embodiment, a surfactant is coated on the surface of the cleaning component mounting portion 10. After the roller cleaning component 90 is inserted into the cleaning component mounting portion 10, the surfactant can be removed by rinsing the cleaning component mounting portion 10 and the roller cleaning component 90 with water.

[0187] In one embodiment, the average pore diameter of the roller cleaning component 90 can be set to 50 μm to 250 μm (here, the average pore diameter is the average of the major diameters of a predetermined number of pores randomly selected from a plurality of pores in the target area). Furthermore, in one embodiment, the apparent density of the roller cleaning component 90 can be set to 0.05 g / cm³. 3 The water retention rate is set to 500% to 1200%. Furthermore, in one embodiment, the 30% compressive stress of the roller cleaning member 90 under a suitable moisture content state can be set to 3 kPa or more and 200 kPa or less. Furthermore, a suitable moisture content state refers to the moisture content state relative to the dry state, and is a moisture content state in which the roller cleaning member 90 has suitable elastic force during cleaning processes such as cleaning the substrate W. Additionally, the 30% compressive stress is the load value per unit area obtained by dividing the measured value by the area of ​​the end faces, based on the roller cleaning member 90 being in a suitable moisture content state. This load is measured using a digital load tester when a load is applied to both end faces and compressed to 30% in the length direction.

[0188] As described above, a pen cleaning component 90a can be used as a cleaning component. When the pen cleaning component 90a is used as a cleaning component in this way, during the second process, the pen cleaning component 90a can be rotated simultaneously or instead of rotated, via the suction portion 260 (see reference 1a) connected to the cleaning component assembly 1a (denoted by the symbol "1a" for a cleaning component assembly having the pen-shaped cleaning component 90a). Figure 12 () to attract the cleaning fluid inside the pen cleaning component 90a.

[0189] One embodiment of this implementation is illustrated by way of example.

[0190] <Example 1>

[0191] The method of Example 1 is as follows (refer to...) Figure 5During the pressing of the roller cleaning member 90, made of resin material, onto the dummy substrate Wd, rinsing liquid is not supplied from the inner cleaning liquid supply unit 110. During the removal of the roller cleaning member 90 from the dummy substrate Wd, rinsing liquid is supplied from the inner cleaning liquid supply unit 110. The rotational speed of the roller cleaning member 90 is 400 rpm. A cleaning solution is continuously supplied from the outer cleaning liquid supply unit 120. Furthermore, NH4OH is used as the cleaning solution, and pure water (DIW) is used as the rinsing liquid. In Example 1, the first and second treatments and the exchange treatment of the dummy substrate Wd are repeated.

[0192] <Comparative Example 1>

[0193] In Comparative Example 1, the cleaning solution is continuously supplied from the outer cleaning solution supply unit 120 while the roller cleaning member 90 is pressed against the dummy substrate Wd. At this time, rinsing solution is not supplied from the inner cleaning solution supply unit 110.

[0194] According to Example 1, after 60 minutes, the yield was approximately 42% compared to Comparative Example 1, and after 180 minutes, it was approximately 12% compared to the result of Comparative Example 1 after 60 minutes (see Example 1). Figure 10A and Figure 10B According to Comparative Example 1, although the number of particles could be reduced to a certain level, it was difficult to reduce it further. A photograph showing this result is... Figure 9 The image shown is a defect map. Furthermore, the image referred to in Embodiment 1 of this application (…) Figure 10A and Figure 10B The particles shown refer to those with a maximum diameter of 19 nm or more that can be observed by the inspection device. However, it is also possible to improve the accuracy of the inspection device to meet future requirements such as further miniaturization of substrates, thereby allowing smaller particles to be observed.

[0195] <Example 2>

[0196] In Example 2, during the supply of medication from the external cleaning fluid supply unit 120, the rinsing fluid is not supplied from the internal cleaning fluid supply unit 110. After the supply of medication from the external cleaning fluid supply unit 120 is stopped, the rinsing fluid is supplied from the internal cleaning fluid supply unit 110 at a rate of 900 ml / min (see reference). Figure 14 During this period, the roller cleaning component 90, made of resin material, is pressed against the dummy substrate Wd with a pressure of 9N. The pressing pressure of the roller cleaning component 90 on the dummy substrate Wd is always the same value of 9N (i.e., the first pressure = the second pressure).

[0197] <Example 3>

[0198] In Example 3, the cleaning solution is continuously supplied from the external cleaning solution supply unit 120, and the rinsing solution is supplied from the internal cleaning solution supply unit 110 at a rate of 900 ml / min at certain intervals (see reference). Figure 15 During this period, similar to Example 2, the roller cleaning member 90 made of resin material is pressed against the dummy substrate Wd with a pressure of 9N, and the pressing pressure of the roller cleaning member 90 on the dummy substrate Wd is always the same value of 9N (i.e., first pressure = second pressure).

[0199] Furthermore, since the methods (schemes) for particle identification in the experiments of Examples 2 and 3 are different from those used in the experiments of Examples 1 and Comparative Example 1, the following method was adopted: During the period when the roller cleaning member 90 made of resin material is pressed against the dummy substrate Wd, rinsing liquid is not supplied from the internal cleaning liquid supply unit 110; during the period when the roller cleaning member 90 is removed from the dummy substrate Wd, rinsing liquid is supplied from the internal cleaning liquid supply unit 110 (see Example 1). Figure 5 The results obtained using the same scheme as in Examples 2 and 3 are shown as Example 4 (see reference). Figure 16 ).

[0200] In Examples 2 and 3 of this application, similar to Example 1, particles with a maximum diameter of 19 nm or more that can be observed by the inspection device are treated as particles, their number is counted, and compared with the result of Comparative Example 1 after 60 minutes (this result is taken as 100%), thus obtaining... Figure 16 The results are shown. Furthermore, in Examples 2 and 3, the first and second processes and the replacement process of the dummy substrate Wd are repeated, similar to Example 1. When replacing the dummy substrate Wd, the roller cleaning member 90 is moved away from the dummy substrate Wd. As described above, the first and second processes and the replacement process of the dummy substrate Wd can be performed in multiple sets, for example, in sets of 2 to 10 times. This is also the case in Example 1.

[0201] like Figure 16 As shown, in Example 3, the result was about 3% compared to Comparative Example 1 after 60 minutes; in Example 2, the result was about 5% compared to Comparative Example 1 after 60 minutes. In Example 4, which corresponds to Example 1, the result was about 8% compared to Comparative Example 1 after 60 minutes. Therefore, beneficial effects can be obtained in Examples 2 and 3 even compared to Example 4.

[0202] In each of Examples 2 and 3, it is advantageous to significantly reduce the number of particles within a short time of 60 minutes. In particular, the method according to Example 2 yields better results than that of Example 3, thus confirming the advantage of using this method. That is, it is particularly advantageous to stop supplying cleaning liquid from the external cleaning liquid supply unit 120 to the dummy substrate Wd while pressing the roller cleaning member 90 against the dummy substrate Wd during the second process, and it has been confirmed that it is also advantageous to supply cleaning liquid from the external cleaning liquid supply unit 120 to the dummy substrate Wd while pressing the roller cleaning member 90 against the dummy substrate Wd during the second process. Furthermore, in Examples 2 to 4, the roller cleaning member 90 is pressed against the dummy substrate Wd with a force of 9N. However, it is advantageous to press the roller cleaning member 90 against the dummy substrate Wd with a force of 5N or more, it is even more advantageous to press the roller cleaning member 90 against the dummy substrate Wd with a force of 9N or more, and it is even more advantageous to press the roller cleaning member 90 against the dummy substrate Wd with a force of 15N or more.

[0203] "Effect"

[0204] Next, the effects of this embodiment with the above-described structure will be explained, focusing on effects not yet described. Even in cases not described in the "Structure" section, all the structures described in the "Effects" section can be used in this invention. Furthermore, in the "Effects" section, the term "cleaning component" will be used instead of "roller cleaning component" as an example of a cleaning component.

[0205] When the control unit 350 controls the first and second processes, the cleaning time of the cleaning components can be significantly shortened (see reference). Figure 10A and Figure 10B In the first process, the cleaning component to be cleaned is pressed against the dummy substrate Wd with a first pressure while cleaning fluid is supplied to the dummy substrate Wd from the outer cleaning fluid supply unit 120. In the second process, the cleaning component is either removed from the dummy substrate Wd or pressed against the dummy substrate Wd with a second pressure less than the first pressure while cleaning fluid is supplied from the inner cleaning fluid supply unit 110. By pressing the cleaning component against the dummy substrate Wd while supplying cleaning fluid from the outer cleaning fluid supply unit 120, dirt on the outside of the cleaning component can be removed. Furthermore, by pressing the cleaning component against the dummy substrate Wd with a second pressure less than the first pressure while supplying cleaning fluid from the inner cleaning fluid supply unit 110, foreign matter inside the cleaning component can be effectively forced outwards (see reference). Figure 6 ).

[0206] In recent years, there has been a growing demand for the removal of small-sized foreign objects, and the method described in this embodiment is advantageous in that it can effectively remove small-sized foreign objects. In addition, since the cleanliness of the cleaning components can be maintained at a high level, it is also possible to extend the lifespan of the cleaning components and stabilize production.

[0207] According to the inventors of this application, it has been confirmed that by making the second rotation speed of the cleaning component in the second process faster than the first rotation speed of the cleaning component in the first process, the cleaning effect of the cleaning component can be improved.

[0208] When different cleaning solutions are supplied to the internal cleaning solution supply unit 110 and the external cleaning solution supply unit 120, cleaning can be performed more effectively depending on the material of the cleaning component.

[0209] When the internal cleaning fluid supply unit 110 supplies rinsing fluid and the external cleaning fluid supply unit 120 supplies chemical solution, it is advantageous to improve the cleaning effect by using a method in which the first time of performing the first treatment is longer than the second time of performing the second treatment, so that the cleaning components are rich in chemical solution.

[0210] While the cleaning component is pressed against the dummy substrate Wd with a second pressure, and cleaning fluid is supplied from the internal cleaning fluid supply unit 110, it is possible to prevent contaminants adhering to the dummy substrate Wd from returning to the cleaning component. Therefore, the cleaning component can be cleaned more effectively.

[0211] When the control unit 350 controls the transport unit 300 to replace the dummy substrate Wd, the replacement of the dummy substrate Wd during the cleaning process of the cleaning component can also be performed automatically.

[0212] When the control unit 350 controls the first and second processing and the replacement of the dummy substrate Wd in multiple groups, the cleaning process of the cleaning components can be performed automatically and effectively.

[0213] By controlling the pressure in the control unit 350 to ensure that the first pressure in the latter half of the set is lower than that in the former half, backcontamination can be prevented. Even though the substrate W, such as the wafer, is cleaned at the end of the cleaning process, the possibility of contaminants from the dummy substrate Wd adhering to the cleaning components during the cleaning process cannot be ruled out. Such contamination may occur if the cleaning components are pressed too firmly against the dummy substrate Wd. Therefore, ensuring that the first pressure in the latter half of the set is lower than that in the former half is beneficial in reducing the risk of backcontamination.

[0214] By rotating the dummy substrate Wd and the cleaning component in opposite directions when the first pressure exceeds a threshold, the cleaning component can be cleaned while retaining more cleaning fluid at the contact area between the dummy substrate Wd and the cleaning component. Generally, pressing the cleaning component firmly against the dummy substrate Wd is effective for cleaning, but this method allows for the retention of more cleaning fluid at the contact area between the dummy substrate Wd and the cleaning component even under such conditions.

[0215] When the rotation direction of the dummy substrate Wd and the cleaning component is controlled to be the same when the first pressure is lower than the threshold, the cleaning component can be prevented from being immersed in a large amount of cleaning fluid without relatively more effective cleaning. In this way, by preventing the cleaning component from being immersed in a large amount of cleaning fluid, back contamination from the dummy substrate Wd to the cleaning component can be prevented.

[0216] As an example, in the first half of the group with higher pressure, the control unit 350 controls the rotation in the opposite direction to that of the dummy substrate Wd and the cleaning component (see reference). Figure 11B In the latter half of the first group where the pressure is lower, the control unit 350 controls the rotation of the dummy substrate Wd and the cleaning component in the same direction (see reference). Figure 11A ).

[0217] By using a cleaning solution, a negative potential can be generated, resulting in a higher threshold potential. Therefore, repulsive forces can be generated between the cleaning component and the foreign matter, and between the foreign matter itself, thus facilitating the removal of the foreign matter. From this perspective, using an alkaline cleaning solution is advantageous. This is because alkaline solutions such as NH4OH have a larger negative potential compared to acidic solutions. Furthermore, even if the cleaning solution used in the cleaning process of the substrate W is acidic, an alkaline solution can still be used in the cleaning process of the cleaning component. On the other hand, the same cleaning solution used in the cleaning process of the substrate W can also be used to clean the cleaning component. In this case, it is advantageous that the device structure does not need to be changed.

[0218] When the external cleaning fluid supply unit 120 continuously supplies cleaning fluid during the first and second processes, the dummy substrate Wd can always be kept moist. Since the possibility of foreign matter adhering to the cleaning components increases when the dummy substrate Wd is dry, it is advantageous to keep the dummy substrate Wd always moist via the external cleaning fluid supply unit 120. From this perspective, it is advantageous to begin the cleaning process, including the break-in process, after the dummy substrate Wd has been moistened with cleaning fluid.

[0219] When cleaning new components (during break-in), the components can be pre-wetted with a cleaning solution. This is advantageous because cleaning the components when they are dry can lead to backcontamination. To wet the components with the cleaning solution, the control unit 350 can either control the component to be immersed in the solution or control the solution to be supplied from the internal cleaning solution supply unit 110, and begin cleaning only after a certain amount of solution has been supplied. Furthermore, the inventors of this application have confirmed that using a chemical solution instead of a rinsing solution as the cleaning solution for wetting the components results in a higher cleaning effect.

[0220] When rinsing fluid is supplied from the internal cleaning fluid supply unit 110 and chemical solution is supplied from the external cleaning fluid supply unit 120, the supply of rinsing fluid from the internal cleaning fluid supply unit 110 can be stopped during the period when the cleaning component is in contact with the dummy substrate Wd. This is because when rinsing fluid is continuously supplied from the internal cleaning fluid supply unit 110, the chemical solution supplied from the external cleaning fluid supply unit 120 becomes diluted, thereby reducing the cleaning effect. Furthermore, when chemical solution is supplied from the internal cleaning fluid supply unit 110, the chemical solution can be supplied from the internal cleaning fluid supply unit 110 even during the period when the cleaning component is in contact with the dummy substrate Wd.

[0221] Rotating the cleaning components may cause the cleaning fluid to splatter within the apparatus, adversely affecting the cleaning of the mass-produced substrate W. From this perspective, when using a substrate cleaning apparatus as a cleaning component, rinsing the apparatus before starting the cleaning of the mass-produced substrate W can prevent the adverse effects caused by splattered cleaning fluid, which is beneficial. Furthermore, from the viewpoint of preventing cleaning fluid splattering within the apparatus, when using a substrate cleaning apparatus as a cleaning component, the downward flow rate within the apparatus can be increased during the cleaning process of the cleaning components compared to cleaning the substrate W.

[0222] Furthermore, in one embodiment, the object being cleaned by the cleaning component is not limited to semiconductor wafers, but can include silicon wafers, glass substrates, printed wiring substrates, liquid crystal panels, and solar panels. Additionally, the shape of the plane of the object being cleaned can be circular or rectangular, and the thickness of the plane can be the thickness allowing for in-plane deflection. The substrates being cleaned include square substrates and circular substrates. Furthermore, square substrates include rectangular or other polygonal glass substrates, liquid crystal substrates, printed wiring substrates, and other polygonal electroplating objects. Circular substrates include semiconductor wafers, glass substrates, and other circular electroplating objects.

[0223] As a cleaning fluid, it can be made of high-temperature pure water, APM (Ammonium Hydrogen-peroxide Mixture), SPM (Sulfuric-Acid Hydrogen Peroxide Mixture), carbonated water, ultrasonic water, ozone water, etc.

[0224] The descriptions of the above embodiments and the accompanying drawings are merely examples used to illustrate the invention described within the scope of the claimed protection, and do not limit the invention described within the scope of the claimed protection by means of the descriptions of the above embodiments or the accompanying drawings. Furthermore, the description of the scope of protection at the time of application is merely an example, and appropriate changes can be made to the description of the scope of protection based on the descriptions in the specification, drawings, etc.

Claims

1. A cleaning apparatus for cleaning components, the cleaning apparatus being used to clean the components, characterized in that, have: A substrate support portion that holds the substrate. A holding section that holds a cleaning component assembly having a cleaning component; A component rotating part, which causes the cleaning component to rotate; An internal cleaning fluid supply unit supplies cleaning fluid into the cleaning component; An external cleaning fluid supply unit supplies cleaning fluid from outside the cleaning component; as well as The control unit controls the first and second processes. The first process involves pressing the cleaning component against the substrate with a first pressure while supplying cleaning fluid to the substrate from the external cleaning fluid supply unit. The second process involves removing the cleaning component from the substrate or pressing the cleaning component against the substrate with a second pressure less than the first pressure while supplying cleaning fluid from the internal cleaning fluid supply unit. During the second process, the supply of cleaning fluid from the external cleaning fluid supply unit to the substrate is stopped.

2. The cleaning device for the cleaning components according to claim 1, characterized in that, The second rotational speed of the cleaning component in the second process is faster than the first rotational speed of the cleaning component in the first process.

3. The cleaning apparatus for the cleaning components according to claim 1 or 2, characterized in that, The internal cleaning fluid supply unit supplies flushing fluid, and the external cleaning fluid supply unit supplies medication; or The internal cleaning fluid supply unit supplies the cleaning solution, and the external cleaning fluid supply unit supplies the rinsing solution; or The internal cleaning fluid supply department and the external cleaning fluid supply department supply the cleaning solution.

4. The cleaning apparatus for the cleaning components according to claim 1 or 2, characterized in that, The internal cleaning fluid supply unit supplies a first cleaning solution, while the external cleaning fluid supply unit supplies a second cleaning solution that is different from the first cleaning solution.

5. The cleaning apparatus for the cleaning components according to claim 1 or 2, characterized in that, The control unit supplies cleaning fluid from the internal cleaning fluid supply unit while the cleaning component is pressed against the substrate with a second pressure. The second pressure is less than half of the first pressure.

6. The cleaning apparatus for the cleaning components according to claim 1 or 2, characterized in that, The control unit controls the conveying unit to replace the substrate. Furthermore, the control unit performs control to group the first processing, the second processing, and the substrate replacement processing into a set and repeat multiple sets.

7. The cleaning apparatus for the cleaning components according to claim 6, characterized in that, The first pressure in the second half of the array is smaller than the first pressure in the first half of the array.

8. The cleaning apparatus for the cleaning components according to claim 1 or 2, characterized in that, The cleaning component consists of a roller cleaning component that rotates around a rotating axis extending in the in-plane direction of the substrate. The substrate has a rotation axis extending along the normal direction of the substrate. The roller cleaning component abuts against the substrate outside the periphery of the substrate's rotation axis. The control unit controls the substrate and the cleaning component to rotate in opposite directions at the point where they contact each other when the first pressure is above a threshold, and to rotate in the same direction at the point where they contact each other when the first pressure is below the threshold.

9. The cleaning apparatus for the cleaning components according to claim 1 or 2, characterized in that, The external cleaning fluid supply unit continuously supplies cleaning fluid during the first and second processes. The internal cleaning fluid supply unit supplies rinsing fluid and stops supplying rinsing fluid during the first treatment.

10. The cleaning apparatus for the cleaning components according to claim 1 or 2, characterized in that, The control unit controls the external cleaning fluid supply unit to perform a rinsing process before cleaning the substrate to be cleaned.

11. A cleaning component assembly, characterized in that, A cleaning component having a cleaning device that is cleaned by the cleaning component as described in claim 1 or 2.

12. A substrate cleaning apparatus for cleaning substrates, characterized in that, have: A substrate support portion that holds the substrate. A substrate cleaning solution supply unit that supplies cleaning solution to the substrate; A holding section that holds a cleaning component assembly having a cleaning component; A component rotating part, which causes the cleaning component to rotate; An internal cleaning fluid supply unit supplies cleaning fluid into the cleaning component; An external cleaning fluid supply unit supplies cleaning fluid from outside the cleaning component; as well as The control unit controls the first and second processes. The first process involves pressing the cleaning component against the substrate with a first pressure while supplying cleaning fluid to the substrate from the external cleaning fluid supply unit. The second process involves removing the cleaning component from the substrate or pressing the cleaning component against the substrate with a second pressure less than the first pressure while supplying cleaning fluid from the internal cleaning fluid supply unit. During the second process, the supply of cleaning fluid from the external cleaning fluid supply unit to the substrate is stopped.

13. The substrate cleaning apparatus according to claim 12, characterized in that, It also includes a torque detection unit that repeatedly detects the torque when the cleaning component is pressed against the substrate within a specified time. The control unit controls the pressing pressure of the cleaning component on the substrate based on the values ​​of multiple torques detected by the torque detection unit.

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