Display module including sensor and electronic device including the same

Abstract

An electronic device includes a display module, wherein the display module includes a housing, a display including a first panel, a cover layer, a second panel, wherein the first panel includes a first surface, a second surface opposite the first surface, and a plurality of pixels between the first surface and the second surface, the cover layer is disposed on the first surface of the first panel, the second panel is disposed on the second surface of the first panel, and a sensor connected to the second surface of the first panel to provide a sensing area on one surface of the housing.

Description

Technical Field

[0001] This disclosure relates to a display module including a sensor and an electronic device including the display module. Background Technology

[0002] Electronic devices may include sensors for identifying biometric information. For example, an electronic device may include a sensor for identifying fingerprints. The fingerprint sensor may be visible from the outside of the electronic device. For example, the fingerprint sensor may be located at the lower end of a display area on the front surface of the housing of the electronic device. For example, the fingerprint sensor may be located on the rear surface of the housing of the electronic device.

[0003] As the size of displays in portable electronic devices increases, the size of the area outside the display can be further reduced. Therefore, research and development have been ongoing on mounting various sensors on the front surface of electronic devices while simultaneously increasing display size. For example, attempts have been made to achieve large screens by placing the fingerprint sensor of the electronic device within the display area and reducing or eliminating the non-display area. Summary of the Invention

[0004] Technical issues

[0005] The sensor can be disposed on the rear surface of the display module. The display module may include a light-shielding panel attached to the rear surface of the display panel. A hole may be formed in at least a portion of the light-shielding panel to obtain a fingerprint input from the front surface of the display module on the rear surface of the display. In this case, the hole may be formed with a size larger than the sensor surface of the sensor to ensure minimal space and interference in the process. When the sensor is mounted, an air gap may be formed between the sensor and the hole.

[0006] External light can be introduced into the display panel through the air gap. A photoelectric effect is generated by the introduced external light. Due to the photoelectric effect, leakage current can occur in the thin-film transistor (TFT), which is used to adjust the brightness of at least one pixel of the display. When the display shows a lower grayscale image, the display area corresponding to the air gap can be viewed as brighter than another part of the display due to the leakage current. When the display shows a higher grayscale image, the display area corresponding to the air gap can be viewed as darker than another part of the display due to the leakage current generated by the photoelectric effect. Therefore, the user can visually identify the air gap due to the brightness difference in the display area.

[0007] The above information is presented as background information only to aid in understanding this disclosure. Whether any of the information above is applicable to prior art in relation to this disclosure is neither determined nor stated.

[0008] Technical solution

[0009] The embodiments of this disclosure at least address the above-described problems and / or disadvantages, and at least provide the advantages described below.

[0010] According to an example embodiment of this disclosure, an electronic device may include: a housing; a display including a first panel, a cover layer, and a second panel, wherein the first panel has a first surface, a second surface opposite to the first surface, and a plurality of pixels between the first surface and the second surface, the cover layer is disposed on the first surface of the first panel, and the second panel is disposed on the second surface of the first panel; and a sensor connected to the second surface of the first panel of the display. The display may include an opening in the second panel, wherein the opening is configured to accommodate at least a portion of the sensor in the opening, the second panel may include a first layer connected to the first panel on one surface of the second panel, and a second layer connected to the first layer on a surface of the first layer opposite to the one surface, the opening may include a first opening in the first layer, wherein the first opening may be disposed within a closed area of ​​a second opening in the second layer, and the outer periphery of the first opening may be spaced apart from the outer periphery of the second opening on the second layer by at least a specified distance.

[0011] According to an example embodiment of this disclosure, the display module may include: a first panel having a first surface, a second surface opposite to the first surface, and a plurality of pixels between the first surface and the second surface; a cover layer disposed on the first surface of the first panel; a second panel disposed on the second surface of the first panel; and a sensor connected to the second surface of the first panel. The second panel may include a first layer connected to a first layer on one surface of the second panel and a second layer connected to the first layer on a surface of the first layer opposite to the one surface. The second panel may include an opening in the second panel, wherein the opening is configured to accommodate at least a portion of the sensor. The opening may include a first opening in the first layer, wherein the first opening may be disposed within a closed area of ​​a second opening in the second layer, and the outer periphery of the first opening may be spaced apart from the outer periphery of the second opening on the second layer by at least a specified distance.

[0012] Other aspects, advantages, and distinctive features of this disclosure will become apparent to those skilled in the art from the following detailed description of various exemplary embodiments disclosed in conjunction with the accompanying drawings.

[0013] Beneficial effects

[0014] According to the various embodiments disclosed in this disclosure, the sensor mounting area located below the display can be prevented and / or avoided from being viewed from the outside of the electronic device.

[0015] According to the various embodiments disclosed in this disclosure, adhesive material can be prevented and / or avoided from being absorbed into the buffer layer.

[0016] In addition, various effects can be provided directly or indirectly through this disclosure. Attached Figure Description

[0017] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 This is a front perspective view showing an example electronic device according to an embodiment;

[0019] Figure 2 This illustrates an embodiment. Figure 1 Rear perspective view of the electronic device;

[0020] Figure 3 According to the embodiments Figure 1 An exploded perspective view of an electronic device;

[0021] Figure 4a This is a cross-sectional view showing an example display of an electronic device according to an embodiment;

[0022] Figure 4b This is a cross-sectional view showing an example display of an electronic device according to an embodiment;

[0023] Figure 5 This is a diagram illustrating an example layer structure of the second panel according to an embodiment;

[0024] Figure 6 This is an exploded perspective view showing an example display according to an embodiment;

[0025] Figure 7 This is a diagram illustrating an example shape of the opening according to an embodiment;

[0026] Figure 8a This is a diagram illustrating an example sensor mounting structure according to an embodiment;

[0027] Figure 8b It is shown along the embodiment Figure 8a The example shown is a cross-sectional view of the module intercepted by line B-B';

[0028] Figure 9a This is a diagram illustrating an example sensor mounting structure with applied light-shielding material according to an embodiment;

[0029] Figure 9b It is shown along the embodiment Figure 9a The example shown is a cross-sectional view of the module intercepted by line C-C'.

[0030] Figure 10a This is a diagram illustrating an example sensor mounting structure including a wall structure according to an embodiment;

[0031] Figure 10b It is shown along the embodiment Figure 10a The example shown is a cross-sectional view of the module intercepted by line D-D'.

[0032] Figure 11a This is a diagram illustrating an example sensor mounting structure with applied light-shielding adhesive material according to an embodiment;

[0033] Figure 11b It is shown along the embodiment Figure 11a The example shown is a cross-sectional view of the module intercepted by line E-E';

[0034] Figure 12 This is a diagram illustrating an example method of applying a light-shielding adhesive material according to an embodiment;

[0035] Figure 13 This is a diagram illustrating an example method of applying a light-shielding adhesive material according to an embodiment;

[0036] Figure 14 This is a diagram illustrating an example opening structure according to an embodiment;

[0037] Figure 15 This illustrates an embodiment for mounting a sensor. Figure 14 A diagram illustrating an example method in an open structure;

[0038] Figure 16 It is shown according to the embodiment. Figure 15 An example installation structure diagram showing the sensor's installation method; and

[0039] Figure 17 This is a diagram illustrating an example sensor mounting structure including a wall structure according to an embodiment;

[0040] In the following description with reference to the accompanying drawings, similar components will be assigned similar reference numerals. Detailed Implementation

[0041] In the following description, various exemplary embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. However, those skilled in the art will understand that the present disclosure is not limited to the specific embodiments, and various modifications, equivalents, and / or substitutions may be made to the various exemplary embodiments described herein without departing from the scope and spirit of the present disclosure.

[0042] Figure 1 This is a front perspective view showing an example electronic device according to an embodiment. Figure 2This illustrates an embodiment. Figure 1 Rear perspective view of the electronic device.

[0043] Reference Figure 1 and Figure 2 The electronic device 100 may include a housing 110, wherein the housing 110 includes a first surface 110A (or front surface), a second surface 110B (or rear surface) and a side surface 110C surrounding the space between the first surface 110A and the second surface 110B.

[0044] In another embodiment (not shown), the housing 110 can be considered as forming Figure 1 The structure of some of the first surface 110A, the second surface 110B, and the side surface 110C.

[0045] According to an embodiment, the first surface 110A may include a front panel 102 having at least a substantially transparent portion (e.g., a glass or polymer panel including various coatings). The second surface 110B may be formed by a substantially opaque rear panel 111. The rear panel 111 may include, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 110C may include a side frame structure (or “side member”) 118 connected to the front panel 102 and the rear panel 111 and comprising metal and / or polymer.

[0046] In one embodiment, the back panel 111 and the side frame structure 118 may be integrally formed with each other and may include the same material (e.g., a metallic material such as aluminum).

[0047] In the illustrated embodiment, the front panel 102 may include two first regions 110D, wherein the two first regions 110D bend from the first surface 110A toward the rear panel 111 at opposite long edge ends of the front panel 102, while extending seamlessly.

[0048] In the illustrated embodiment (see Figure 2 The rear panel 111 may include two second regions 110E, wherein the two second regions 110E bend from the second surface 110B toward the front panel 102, while extending seamlessly and forming at the opposite long edge ends of the rear panel 111.

[0049] In one embodiment, the front panel 102 (or the rear panel 111) may include only one of the first regions 110D (or the second region 110E). In another embodiment, the front panel 102 (or the rear panel 111) may not include some of the first regions 110D (or the second region 110E).

[0050] In an embodiment, when viewed from the side surface of the electronic device 100, the side frame structure 118 may have a first thickness (or width) on the side surface (e.g., the shorter side) that does not have the first region 110D or the second region 110E, and may have a second thickness that is thinner than the first thickness on the side surface (e.g., the longer side) that includes the first region 110D or the second region 110E.

[0051] In an embodiment, the electronic device 100 includes at least one of the following: a display 101, audio modules 103, 107, and 114, sensor modules 104, 116, and 119, camera modules 105, 112, and 113, a key input device 117, a light-emitting device 106, and connector holes 108 and 109. In an embodiment, the electronic device 100 may omit at least one component (e.g., the key input device 117, sensor module 104, or light-emitting device 106), or may additionally include other components.

[0052] Display 101 may be visible, for example, through a large portion of front panel 102. In an embodiment, at least a portion of display 101 may be exposed through front panel 102 including a first region 110D comprising a first surface 110A and a side surface 110C.

[0053] In one embodiment, the edge of the display 101 may be formed to have a shape substantially the same as the adjacent outer edge shape of the front panel 102. In another embodiment (not shown), in order to extend the area for exposing the display 101, the distance between the outer edge portion of the display 101 and the outer edge portion of the front panel 102 may be formed substantially uniformly.

[0054] In an embodiment, the surface of the housing 110 (or the front panel 102) may include a screen display area formed when the display 101 is visually exposed. For example, the screen display area may include a first surface 110A and a first region 110D of the side surface.

[0055] In the illustrated embodiment, screen display areas 110A and 110D may include a sensing area 110F configured to acquire a user's biometric information. In this disclosure, screen display areas 110A and 110D include a sensing area 110F that may overlap with screen display areas 110A and 110D. In other words, sensing area 110F may refer to an area that displays visual information via display 101 and additionally acquires the user's biometric information (e.g., fingerprint), an area similar to another area of ​​screen display areas 110A and 110D.

[0056] In the illustrated embodiment, the screen display areas 110A and 110D of the display 101 may include area 110G, through which the first camera device 105 (e.g., a punch-hole camera) can be visually exposed. At least a portion of the edge of the area exposing the first camera device 105 may be surrounded by the screen display areas 110A and 110D.

[0057] In another embodiment (not shown), the screen display areas 110A and 110D of the display 101 may have recesses or openings formed in a portion of the screen display areas 110A and 110D of the display 101, and may include at least one of an audio module 114, a first sensor module 104, and a light-emitting device 106 aligned with the recesses or openings.

[0058] According to another embodiment (not shown), the display 101 may include an audio module 114, sensor modules 104, 116 and 119 and a light-emitting device 106 on the rear surface of the screen display areas 110A and 110D.

[0059] In another embodiment (not shown), the display 101 may be connected to or arranged adjacent to touch sensing circuitry, a pressure sensor for measuring the intensity (pressure) of the touch, and / or a digital converter for detecting a stylus based on an electromagnetic scheme.

[0060] In an embodiment, at least some of the sensor modules 104, 116 and 119 and / or at least a portion of the key input device 117 may be arranged on the side surface 110C (e.g., the first region 110D and / or the second region 110E).

[0061] Audio modules 103, 107, and 114 may include a microphone hole 103 and speaker holes 107 and 114. The microphone hole 103 may have a microphone disposed therein for receiving external sound. In embodiments, the microphone hole 103 may have multiple microphones disposed therein for sensing the direction of sound. Speaker holes 107 and 114 may include an external speaker hole 107 and a receiver hole 114 for dialogue. In embodiments, speaker holes 107 and 114 and the microphone hole 103 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without speaker holes 107 and 114.

[0062] In embodiments, sensor modules 104, 116, and 119 may generate electrical signals or data values ​​corresponding to the internal operating state of electronic device 100 or the external environmental state of electronic device 100. For example, sensor modules 104, 116, and 119 may include a first sensor module 104 (e.g., a proximity sensor) disposed on a first surface 110A of housing 110, a second sensor module 116 (e.g., a TOF camera device) disposed on a second surface 110B of housing 110, a third sensor module 119 (e.g., an HRM sensor) disposed on the second surface 110B of housing 110, and / or a fourth sensor module (e.g., a...) connected to display 101. Figure 3 Sensor 190 (e.g., fingerprint sensor).

[0063] In various embodiments, the second sensor module 116 may include a TOF camera device for distance measurement.

[0064] In various embodiments, the fourth sensor module (e.g., Figure 3 At least a portion of the sensor 190 may be arranged below the screen display areas 110A and 110D. For example, the fourth sensor module may be arranged in a recess formed in the rear surface of the display 101 (e.g., Figure 3 In the recess 139). In other words, the fourth sensor module (e.g., Figure 3 The sensor 190 is not exposed through the screen display areas 110A and 110D, and the sensing area 110F may be formed in at least a portion of the screen display areas 110A and 110D.

[0065] In an embodiment (not shown), a fingerprint sensor may be arranged on a second surface 110B and a first surface 110A of the housing 110 (e.g., screen display areas 110A and 110D).

[0066] In various embodiments, the electronic device 100 may also include at least one of the following sensor modules not shown: for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0067] Camera modules 105, 112, and 113 may include a first camera device 105 (e.g., a punch camera device) exposed through a first surface 110A of the electronic device 100, a second camera device 112 exposed through a second surface 110B, and / or a flash 113.

[0068] In the illustrated embodiment, the first camera device 105 may be exposed through a portion of the first surface 110A. For example, the first camera device 105 may be exposed through an opening (not shown) formed in a portion of the display 101.

[0069] In the illustrated embodiment, the second camera device 112 may include multiple camera devices (e.g., dual-camera or triple-camera). However, the second camera device 112 is not necessarily limited to including multiple camera devices and may include a single camera device.

[0070] Camera devices 105 and 112 may include one or more lenses, an image sensor, and / or an image signal processor. Flash 113 may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle lens, and telephoto lens) and image sensors may be arranged on one side of electronic device 100.

[0071] Key input device 117 may be arranged on the side surface 110C of housing 110. In another embodiment, electronic device 100 may not include some or all of the aforementioned key input device 117, and some or all of the unincluded key input device 117 may be implemented on display 101 in different forms (such as software). In an embodiment, key input device 117 may include a sensor module (e.g., forming a sensing area 110F included in screen display areas 110A and 110D) to form a sensing area 110F. Figure 3 Sensor 190).

[0072] The light-emitting device 106 may, for example, be disposed on a first surface 110A of the housing 110. The light-emitting device 106 may provide status information of the electronic device 100 in the form of light. In another embodiment, the light-emitting device 106 may, for example, provide light associated with the operation of the first camera device 105. The light-emitting device 106 may include, for example, an LED, an IR LED, and a xenon lamp.

[0073] Connector holes 108 and 109 may include a first connector hole 108 and / or a second connector hole 109 (e.g., a headphone jack), wherein the first connector hole 108 is used to receive a connector (e.g., a USB connector) to send power and / or data to and / or receive power and / or data from an external electronic device, and the second connector hole 109 is used to send power and / or data to and / or receive power and / or data from an external electronic device.

[0074] Figure 3 This illustrates an embodiment. Figure 1 An exploded perspective view of the electronic device.

[0075] Reference Figure 3The electronic device 100 may include a side member 140 (e.g., a side housing), a first support member 142 (e.g., a bracket), a front panel 120, and a display 130 (e.g., Figure 1 The electronic device 100 includes a display 101, a printed circuit board 150, a battery 152, a second support member 160 (e.g., a rear housing), an antenna 170, and a rear panel 180. In embodiments, at least one component of the electronic device 100 (e.g., the first support member 142 or the second support member 160) may be omitted, or other components may be included. At least one component of the electronic device 100 may be... Figure 1 or Figure 2 At least one component of the electronic device 100 is the same or similar, and will not be repeated here.

[0076] A first support member 142 is disposed in the electronic device 100 to connect to or integrate with the side member 140. The first support member 142 may comprise, for example, a metallic material and / or a non-metallic material (e.g., a polymer). The first support member 142 may have a surface connected to the display 130 and an opposing surface connected to the printed circuit board 150. A processor, memory, and / or interface may be mounted on the printed circuit board 150. The processor may include, for example, one or more of a central processing unit, application processor, graphics processing unit, image signal processor, sensor central processor, or communication processor.

[0077] The memory may include, for example, volatile memory and / or non-volatile memory.

[0078] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 100 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0079] Battery 152 may include means for supplying power to at least one component of electronic device 100, such as a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell. At least a portion of battery 152 may be substantially coplanar with printed circuit board 150, for example. Battery 152 may be integrally disposed within electronic device 100 and may be detachably disposed from electronic device 100.

[0080] Antenna 170 may be located between rear panel 180 and battery 152. Antenna 170 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. Antenna 170 may communicate with external devices over short range or wirelessly send or receive power required for charging. In another embodiment, the antenna structure may be formed by a portion of side member 140 and / or a combination of side member 140 and first support member 142.

[0081] In the illustrated embodiment, the electronic device 100 may further include a sensor 190 connected to the display 130. At least a portion of the sensor 190 may be disposed in a recess 139 formed in the rear surface of the display 130 (e.g., Figure 4a and Figure 4b In the opening 225). The sensor 190 may include a sensing area (e.g., in the opening 225) formed on a portion of the front panel 120. Figure 1 Sensing area 110F).

[0082] Figure 4a This is a cross-sectional view showing an example display module 200 of an electronic device 100 according to an embodiment. Figure 4b It is according to the embodiment along Figure 3 A cross-sectional view taken from line A-A'.

[0083] For example, display module 200 may include display panels 210, 220 and 230 (e.g., Figure 3 The display 130) and the sensor 240 (e.g., Figure 3 (e.g., sensor 190). For example, display module 200 may include displays 210, 220 and 230, and sensor 240 may be connected to display module 200.

[0084] In the illustrated embodiment, the display module 200 may include a first panel 210 comprising a plurality of pixels 213, a cover layer 230 disposed on a first surface 211 (e.g., in the +Z axis direction) of the first panel 210, and a second panel 220 disposed on a second surface 212 (e.g., in the -Z axis direction) of the first panel 210. For example, a sensor 240 may be connected to the first panel 210. The first panel 210 may be disposed between the second panel 220 and the cover layer 230.

[0085] In the illustrated embodiment, the first panel 210 may include a first surface 211 facing a first direction (e.g., the +Z-axis direction) and a second surface 212 facing a second direction opposite to the first direction (e.g., the -Z-axis direction). The first direction may be, for example, the direction facing the front surface of the electronic device 100 (e.g., facing...). Figure 3The direction of the front panel 120), and the second direction can be the direction facing the rear surface of the electronic device 100 (e.g., facing the direction of the front panel 120). Figure 3 (The rear panel in the 180-degree direction).

[0086] In the illustrated embodiment, the cover layer 230 may form the front panel (e.g., Figure 3 At least a portion of the front panel 120, and at least a portion of the cover layer 230, may form a housing (e.g., Figure 1 The first surface of the housing 110 (e.g., Figure 1 The first surface 110A, or the surface that can form the electronic device 100.

[0087] In various embodiments, the cover layer 230 may be formed transparently. The cover layer 230 may include a transparent material. In various embodiments, the cover layer 230 may include a variety of materials. For example, the cover layer 230 may include glass or a polymer material (e.g., polyimide (PI), polyethylene terephthalate (PET)).

[0088] In various embodiments, the cover layer 230 may have a screen display area 201 formed by a first panel 210 arranged in a second direction (e.g., the -Z-axis direction) of the cover layer 230. Furthermore, the cover layer 230 may have a sensing area 202 formed by a sensor 240. For example, the sensing area 202 and the screen display area 201 may at least partially overlap each other.

[0089] In various embodiments, sensor 240 may transmit, receive, and / or sense signals (e.g., optical or ultrasonic signals). For example, a signal may travel from sensor 240 through sensing area 202 toward a part of the user's body (e.g., a fingerprint), and a signal reflected by the part of the user's body may again be received by sensor 240 through sensing area 202. For example, a signal may be emitted from at least a portion of the first panel 210, and a signal reflected by a part of the user's body may be received by sensor 240 through sensing area 202.

[0090] In the illustrated embodiment, the first panel 210 may include a pixel layer comprising a plurality of pixels 213. The pixel layer may be formed on the front panel (e.g., Figure 3 The screen display area 201 is located on the front panel 120 (the front surface of the electronic device 100). In an embodiment, the first panel 210 may also include a touch layer (not shown) containing a plurality of touch sensors.

[0091] In the illustrated embodiment, the second panel 220 may include a first layer 510 and a second layer 520. Figure 5 An example layer structure of the second panel 220 according to an embodiment is shown.

[0092] Reference Figure 5 The second panel 220 can optically and / or electrically shield the first panel 210.

[0093] According to an embodiment, the first layer 510 may refer to a layer used for optically shielding the first panel 210. For example, the first layer 510 may include, for example, a black embossed layer (e.g., a black layer comprising an irregular pattern). The first layer 510 may include an embossed pattern formed in at least one surface of the first layer 510 to prevent and / or reduce the introduction of light or moisture into the first panel 210. The first layer 510 may include, for example, a first adhesive layer 324, a black polymer layer 323, and a second adhesive layer 322.

[0094] For example, the first adhesive layer 324 may include, for instance, a double-sided adhesive member for bonding the first panel 210 to the second panel 220. The surface of the first adhesive layer 324 facing the first panel 210 (e.g., the surface in the +Z direction) may be applied with adhesive material in an irregular shape to prevent and / or reduce bubble formation. The first adhesive layer 324 may be located between the first panel 210 and the black polymer layer 323.

[0095] For example, a black polymer layer 323 may be situated between a first adhesive layer 324 and a second adhesive layer 322. The black polymer layer 323 may include a black material (e.g., ink) to prevent and / or reduce the introduction of external light through the second panel 220 into the first panel 210. For example, the black polymer layer 323 may include a layer that holds the panel of the first layer 510 in an irregular pattern (e.g., an embossed pattern). For example, the black polymer layer 323 may be situated between a first adhesive layer 324 and a second adhesive layer 322. The irregular pattern of the black polymer layer 323 may prevent and / or reduce the formation of bubbles when the first layer 510 is attached to the second layer 520. According to an embodiment, the black polymer layer 323 may include multiple layers. For example, the black polymer layer 323 may include a black layer with light-blocking properties and a polymer layer with an embossed pattern.

[0096] According to an embodiment, the first layer 510 may further include a second adhesive layer 322 that combines the first layer 510 with the second layer 520.

[0097] According to an embodiment, the second layer 520 may include a layer for electrically shielding the display module and / or radiant heat. For example, the second layer 520 may include a buffer member 321 and a rear surface layer 531. The second layer 520 may be attached to the surface of the first layer 510 opposite to the surface attached to the first panel 210.

[0098] For example, the buffer member 321 may correspond to an impact absorbing member used to absorb shocks.

[0099] For example, the rear surface layer 531 may include a shielding layer and / or a thermally radiating layer. The shielding layer may shield another electronic component (e.g., an electronic device disposed on a printed circuit board) from noise generated from the display module 200. According to an embodiment, the shielding layer may include a copper (Cu) sheet. According to an embodiment, the thermally radiating layer may include a graphite material. The rear surface layer 531 may also include an adhesive layer (not shown) that combines the cushioning member 321 with the remaining layers.

[0100] Figure 5 The first layer 510 and the second layer 520 shown are provided for illustrative purposes, and the embodiments in this disclosure are not limited thereto. For example, the first layer 510 may be a layer that includes at least a layer between a light shielding layer (e.g., black layer 323) and the first panel 210.

[0101] Figure 5 The structure of the second panel 220 shown is provided for illustrative purposes, and the embodiments in this disclosure are not limited thereto. For example, the second panel 220 disclosed in this disclosure may include components that can be used with... Figure 5 The layers shown are stacked in different orders, and may also include additional layers, or may not have some layers.

[0102] Return to reference Figure 4a According to various embodiments, the display module 200 may also include a protective film (PF) (not shown). For example, the protective film (PF) may be located between the first panel 210 and the second panel 220 to protect the first panel 210. For example, the protective film (PF) may be included in the first panel 210.

[0103] In the illustrated embodiment, the display module 200 may include an opening 225 formed through the second panel 220. For example, when the display module 200 is viewed in the +Z axis direction, the opening 225 may be rectangular, square, circular, or elliptical. For example, the opening 225 may have a shape corresponding to a combination of various shapes. According to an embodiment, when viewed in the -Z axis direction, the opening 225 may be formed through the second panel 220. For example, the second surface 212 may be directly exposed through the opening 225. For example, the second surface 212 may be visually exposed through the opening 225 and a protective film (not shown). For example, the protective film (PF) may be exposed through the opening 225. In this case, at least a portion of the sensor 240 may be arranged within the opening 225. According to an embodiment, the opening 225 may include an inner sidewall with a stepped difference. For example, the opening 225 may include a first inner sidewall 2261 formed at the first layer 510 and a second inner sidewall 2262 formed at the second layer 520.

[0104] In the illustrated embodiment, opening 225 may be referred to as a recess formed in a surface of display module 200 or display. For example, the recess may include a first recess formed at the second layer 520 (e.g., a recess formed by the second inner sidewall 2262) and a second recess formed in the bottom surface of the first recess (e.g., a recess formed by the first inner sidewall 2261). The second recess may be formed within the first recess to form a stepped surface on the bottom surface of the first recess. For example, the recess may include a bottom surface 2251, first inner sidewalls 2261 facing each other, and second inner sidewalls 2262 facing each other. The first inner sidewalls 2261 may face each other with a width of at least W1, and the second inner sidewalls 2262 may face each other with a width of at least W2. For example, W2 may be greater than W1. The bottom surface 2251 may include a portion of the second surface 212 of the first panel 210. The second inner sidewall 2262 includes an end surface of the second layer 520 formed from an opening (e.g., a closed area) in the second layer 520 of the second panel 220, and the first inner sidewall 2261 may include an end surface of the first layer 510 formed from an opening (e.g., a closed area) in the first layer 510 of the second panel 220.

[0105] For example, the opening 225 may be formed to be larger than the sensor 240, such that the width W1 between the first inner sidewalls 2261 is larger than the side surface of the sensor 240 that will be mounted in at least a portion of the opening 225 by at least a specified distance (e.g., "d"). Figure 4a The shape of the sensor 240 shown is provided for illustrative purposes, and the embodiments in this disclosure are not limited thereto. For example, only a portion of the sensor 240 may be mounted in the opening 225, and the remaining portion of the sensor 240 may protrude from the opening 225. The size of the remaining portion of the sensor 240 protruding from the opening 225 may be larger than the size of the opening 225.

[0106] In the illustrated embodiment, the sensor 240 may include a first surface 241 arranged facing the first panel 210, a second surface 242 opposite to the first surface 241, and a side surface 243 between the first surface 241 and the second surface 242.

[0107] According to various embodiments, the sensor 240 may be embedded in the opening 225 such that the first surface 241 is attached to the bottom surface 2251 of the opening 225, and the side surface 243 is spaced apart from the first inner sidewall 2261 of the opening 225 by a specified distance (e.g., "d").

[0108] In the following description, the sensor 240 disclosed according to various embodiments of this disclosure may include, for example, but not limited to, an ultrasonic sensor. The ultrasonic sensor may be configured to use ultrasonic waves of a specific frequency to obtain biometric information of a user (e.g., the structure of a fingerprint).

[0109] In various embodiments, the ultrasonic sensor is oriented toward (e.g., in contact with) the sensing region 202 formed at the cover layer 230 (e.g., ...). Figure 1 The sensing area 110F) emits ultrasonic waves from a portion of the user's body and receives the ultrasonic waves reflected from that portion to obtain the user's biometric information. For example, sensor 240 could be an ultrasonic fingerprint sensor that obtains the user's fingerprint information, and the user's biometric information could correspond to the user's fingerprint. (See also...) Figure 4a The structures of the display 200 and sensor 240 described are provided for illustrative purposes only, and the embodiments in this disclosure are not limited thereto.

[0110] Figure 4b This is a cross-sectional view of the display 200 of the electronic device according to an embodiment. Unless otherwise stated, reference may be made to... Figure 4a The descriptions performed are similarly applied to Figure 4b Examples.

[0111] although Figure 4a The illustration shows sensor 240 attached to the bottom surface 2251 of opening 225 (e.g., the second surface 212 of first panel 210), but embodiments in this disclosure are not limited thereto. See also... Figure 4b According to an embodiment, the opening at the first layer 510 (e.g., the opening defined by the first inner sidewall 2261) may be smaller than the first surface 241 of the sensor 240. In this case, a portion of the first surface 241 of the sensor 240 may be placed on a portion of the first layer 510.

[0112] Figure 6 This is an exploded perspective view showing a display 200 according to an embodiment.

[0113] For reference Figure 4a and Figure 4b The display 200 may include an inner sidewall of a second panel 220 having a stepped difference (e.g., Figure 4a and Figure 4b The openings of the first inner wall 2261 and the second inner wall 2262 (e.g., Figure 4a and Figure 4b (Opening 225). For example, opening 225 may include a first opening 610 formed in the first layer 510 and a second opening 620 formed in the second layer 520. When the first layer 510 and the second layer 520 are combined, the first opening 610 is formed within the second opening 620. The boundary of the second enclosed region formed by the second opening 620 may be spaced apart from the boundary of the first enclosed region formed by the first opening 610 by a specified distance.

[0114] For example, after forming the first opening 610 and the second opening 620, the first layer 510 and the second layer 520 can be combined with each other. For example, after combining the second layer 520 having the second opening 620 with the first layer 510, the first opening 610 can be formed through the second opening 620. The manner in which the first opening 610 and the second opening 620 are formed is provided for illustrative purposes, and the embodiments in this disclosure are not limited thereto.

[0115] Figure 7 This is a diagram illustrating an example shape of an opening according to an embodiment.

[0116] According to an embodiment, the second opening 620 may be formed to deviate from the four surfaces of the first opening 610. For example, the second opening 620 may be spaced apart from the first side (e.g., the left side perpendicular to the +X-axis direction) of the first opening 610 by a specified distance (e.g., d1) in a first direction (e.g., the +X-axis direction). For example, the second opening 620 may be spaced apart from the second side (e.g., the upper side perpendicular to the +Y-axis direction) of the first opening 610 by a specified distance (e.g., d2) in a second direction (e.g., the +Y-axis direction). For example, the second opening 620 may be spaced apart from the third side (e.g., the lower side perpendicular to the -Y-axis direction) of the first opening 610 by a specified distance (e.g., d3) in a third direction (e.g., the -Y-axis direction). The second opening 620 may be spaced apart from the fourth side (the right side perpendicular to the -X-axis direction) of the first opening 610 by a specified distance (e.g., d4) in a fourth direction (e.g., the -X-axis direction). For example, the specified distance d4 may be longer than the specified distances d1, d2, and d3.

[0117] Figure 8a This is a diagram illustrating an example sensor mounting structure 801 according to an embodiment. Figure 8b It is according to the embodiment along Figure 8a The cross-sectional view of the display module taken by line B-B' is shown in Figure 802.

[0118] Reference Figure 8a and Figure 8b According to an embodiment, the sensor (e.g., Figure 4a and Figure 4b The sensor 240 can be attached to the first panel 210 through the first opening 610. For example, the sensor 240 may include sensor circuitry 810 and a connection member 820 (e.g., a flexible printed circuit board (FPCB)). For example, the sensor circuitry 810 can be attached to the first panel 210 by an adhesive material 890 (e.g., resin or epoxy resin) applied to the first panel 210. The adhesive material 890 may be, for example, an adhesive material that cures at a low temperature (e.g., about 40°C to about 60°C or lower), and may be a light-shielding material.

[0119] exist Figure 8a and Figure 8b In the example, a photocurable adhesive material can be used to fix the sensor 240 to the first panel 210 during the curing process of the adhesive material 890. For example, multiple UV (ultraviolet) adhesive points 891, 892, 893, and 894 can be used. After the sensor circuit 810 is placed on the first panel 210, UV adhesive points 891, 892, 893, and 894 are formed, and the sensor circuit 810 can be fixed to the first panel 210 by UV curing. After the sensor circuit 810 is fixed to the first panel 210, a curing process (e.g., a heat treatment process and / or a bubble removal process) can be performed to cure the adhesive material 890. UV adhesive points 891, 892, 893, and 894 are provided for illustrative purposes, and the embodiments in this disclosure are not limited thereto. According to embodiments, the fixing process using UV adhesive points 891, 892, 893, and 894 can be omitted.

[0120] like Figure 8a and Figure 8b As shown, a space (e.g., an air gap) may exist between the adhesive material 890 and the first layer 510. For example, the air gap may be formed between the adhesive material 890 and the first layer 510 along the outer periphery of the adhesive material 890 or along the inner sidewall of the first layer 510. When the light-shielding material (e.g., the first layer 510 and / or the adhesive material 890) is not in the air gap, light from the outside can be introduced through the air gap. According to an embodiment, the light-shielding material may be applied to the air gap to be filled within it.

[0121] Figure 9a This is a diagram illustrating an example sensor mounting structure 901 with applied light-shielding material according to an embodiment. Figure 9b It is according to the embodiment along Figure 9a The cross-sectional view of the display module taken by line C-C' is shown in Figure 902.

[0122] Reference Figure 9a and Figure 9bThe light-shielding material 910 can be applied to the first panel 210 along the inner sidewall of the first opening 610. The light-shielding material 910 covers the air gap, thus preventing the introduction of external light and / or reducing external light. For example, the light-shielding material 910 can be a low-viscosity material (e.g., epoxy resin or liquid) comprising a light-shielding component (e.g., black ink). The light-shielding material 910 is a low-viscosity material with a viscosity below a specified viscosity. Therefore, the light-shielding material 910 can be distributed along the outer periphery of the adhesive material 890, wherein the adhesive material 890 is applied to points between the light-shielding material 910 and the first layer 510 and including areas covered by the connecting member 820. For example, the light-shielding material 910 can be a material that dries at room temperature. For example, the light-shielding material 910 does not require an additional heat treatment process, thereby preventing and / or reducing performance degradation due to heat treatment of the display module and display.

[0123] As the amount of light-shielding material 910 increases, it can flow across the recess formed by the first opening 610 in the first layer 510. When the light-shielding material 910 is absorbed into the second layer 520, the first layer 510 can decouple from the second layer 520. Furthermore, due to the absorption of the light-shielding material 910, the degree of light shielding can be irregular. Figure 9a and Figure 9b As shown, there is a stepped difference region between the first opening 610 and the second opening 620 to prevent and / or reduce the light shielding material 910 from reaching the second layer 520.

[0124] Figure 10a This is a diagram illustrating an example sensor mounting structure 1001 including a wall structure according to an embodiment. Figure 10b It is according to the embodiment along Figure 10a The cross-sectional view of the display module taken by line D-D' is shown in Figure 1002.

[0125] According to an embodiment, the protrusion 1010 may be formed on the first layer 510. For example, on the first layer 510, a protrusion 1010 having a closed-loop shape may be placed in the space between the outer periphery of the first opening 610 and the inner sidewall of the second opening 620. The protrusion 1010 may be a wall structure to prevent and / or reduce the absorption of the light-shielding material 910 into the second layer 520.

[0126] According to an embodiment, the protrusion 1010 may be formed on the first layer 510 before the sensor circuit 810 is bonded. For example, the protrusion 1010 may be an adhesive component (e.g., tape) or an adhesive material (e.g., a UV-curable resin).

[0127] Figure 11aThis is a diagram illustrating an example sensor mounting structure 1101 with light-shielding adhesive material 1110 applied according to an embodiment. Figure 11b It is according to the embodiment along Figure 11a The cross-sectional view of the display module with line E-E' in the middle is shown in Figure 1102.

[0128] According to an embodiment, the light-shielding adhesive material 1110 (e.g., Figure 8a and Figure 8b The adhesive material 890 is applied to all areas of the first panel 210 exposed through the first opening 610. In this case, the light-shielding adhesive material 1110 can be used to cover all areas of the first panel 210, thus allowing the reference to be removed. Figure 8a and Figure 8b The air gap described.

[0129] like Figure 11a and Figure 11b As shown, after the light-shielding adhesive material 1110 is applied to the first panel 210 through the first opening 610, the sensor circuit 810 can be attached to the first panel 210 by a compression process. In this case, the light-shielding adhesive material 1110 can overflow from the recess formed by the first opening 610 in the first layer 510 by the compression process. The second opening 620 is formed to be larger than the first opening 610. Therefore, the light-shielding adhesive material 1110 overflowing from the first layer 510 can be prevented and / or avoided from being absorbed into the second layer 520. For example, the display module 200 may also include a reference Figure 10a and 10b The wall structure described.

[0130] According to embodiments, the light-shielding adhesive material 1110 may include, for example, but not limited to, black ink, epoxy resin film, chip adhesive film (DAF), and / or polyimide (PI) shielding film. For example, the light-shielding adhesive material 1110 may be a low-temperature, fast-curing adhesive material. For example, the light-shielding adhesive material 1110 may be a low-viscosity material that dries naturally (e.g., at room temperature).

[0131] Figure 12 This is a diagram illustrating an example method of applying light-shielding adhesive material 1110 according to an embodiment.

[0132] According to an embodiment, the light-shielding adhesive material 1110 can be applied to the first panel 210, for example, by pad printing.

[0133] Referring to reference numeral 1201, a light-shielding adhesive material 1110 (e.g., epoxy resin) can be applied to the pad 1210. For example, the pad 1210 may comprise a low-hardness and flexible material. Referring to reference numeral 1202, the pad 1210 allows the light-shielding adhesive material 1110 to be applied to the entire area of ​​the first panel 210 exposed through the first opening 610 via a compression process. The pad 1210 has flexible properties. Therefore, the light-shielding adhesive material 1110 can be applied according to the shape of the recess formed in the first layer 510. Referring to reference numeral 1203, after the light-shielding adhesive material 1110 is applied, the sensor circuit 810 can be attached.

[0134] For reference Figure 11a and Figure 11b As described above, due to the step difference formed by the first opening 610 and the second opening 620, the absorption of the light-shielding adhesive material 1110 into the second layer 520 can be prevented and / or avoided. According to an embodiment, refer to... Figure 10a and Figure 10b The wall structure described can be formed prior to the compression process of reference numeral 1202.

[0135] Figure 13 This is a diagram illustrating an example method of applying light-shielding adhesive material 1110 according to an embodiment.

[0136] According to an embodiment, the light-shielding adhesive material 1110 can be applied to the first panel 210 in a vacuum lamination manner.

[0137] Referring to reference numeral 1302, a light-shielding adhesive material 1110 (e.g., epoxy resin) can be applied to the pad 1310. For example, the pad 1310 may include ends 1311 comprising a material with low hardness and flexibility. Referring to reference numeral 1302, the pad 1310 allows the light-shielding adhesive material 1110 to be applied to the entire area of ​​the first panel 210 exposed through the first opening 610 via a compression process. The ends 1311 are flexible. Therefore, the light-shielding adhesive material 1110 can be applied into the shape of a recess formed in the first layer 510. In the compression process, the light-shielding adhesive material 1110 can be applied into the shape of the recess, for example, by blasting through the ends 1311. Referring to reference numeral 1303, after the light-shielding adhesive material 1110 is applied, the sensor circuit 810 can be attached.

[0138] For reference Figure 11a and Figure 11b As described above, due to the step difference formed by the first opening 610 and the second opening 620, the absorption of the light-shielding adhesive material 1110 into the second layer 520 can be prevented and / or avoided. According to an embodiment, refer to... Figure 10a and Figure 10bThe wall structure described can be formed prior to the compression process of reference numeral 1302.

[0139] Figure 14 This is a diagram illustrating an example opening structure 1401 according to an embodiment.

[0140] According to an embodiment, the size of the first opening 610 formed in the first layer 510 may be smaller than that of the sensor circuit 810. For example, the area of ​​the first panel 210 exposed through the first opening 610 may be smaller than the surface of the sensor circuit 810 facing the first panel 210 (e.g., Figure 4a and Figure 4b The size of the first surface 241). The outer perimeter of the closed region formed by the first opening 610 may be smaller than the outer perimeter of the first surface of the sensor circuit 810 facing the first layer 510. For example, the first opening 610 may correspond to a portion of the sensor circuit 810 (e.g., a sensing area).

[0141] like Figure 14 As shown, because the first opening 610 is formed smaller than the sensor circuit 810, the entire area of ​​the first opening 610 in the first layer 510 can be covered by the sensor circuit 810. When viewed from above (in the +Z axis direction), the first panel 210 is not exposed due to the sensor circuit 810 and the first layer 510.

[0142] Figure 15 This illustrates an embodiment for mounting a sensor. Figure 14 A diagram illustrating an example method in a sensor opening structure.

[0143] Referring to reference numeral 1501, adhesive material 1510 (e.g., resin) can be applied through the first opening 610 to the recess formed in the first layer 510. For example, adhesive material 1510 can be applied in an amount that is sufficient to fill at least the entire portion of the recess formed in the first layer 510 through the first opening 610.

[0144] Referring to reference numeral 1502, sensor circuitry 810 may be placed on first layer 510 to cover first opening 610. For example, to ensure that adhesive material 1510 fills the entire portion of the space formed by first opening 610 between sensor circuitry 810 and first panel 210, adhesive material 1510 may be applied in a larger amount than the amount applied to the recess formed in first layer 510 through first opening 610. In this case, depending on the compression process of sensor circuitry 810, excess amount 1511 may overflow first layer 510. Second opening 620 of second layer 520 is formed to be spaced apart from the outer periphery of first opening 610. Therefore, contamination of second layer 520 by excess amount 1511 can be prevented and / or avoided.

[0145] Figure 16 Showing through Figure 15 The installation method of the sensor installation structure 1601.

[0146] According to an embodiment, at least a portion of the sensor circuit 810 may be attached to the first layer 510. For example, a portion (e.g., an edge) of the sensor circuit 810 may be attached to an adhesive layer of the first layer 510 (e.g., Figure 5 The second adhesive layer 322). The sensor circuit 810 is fixed by the adhesive layer, thus providing the necessary fixation of the sensor circuit 810 during the curing process of the adhesive material 1510. According to another embodiment, adhesive points 831, 832, 833 and 834 may be placed in at least some of the corners of the sensor circuit 810 to more firmly fix the sensor circuit 810.

[0147] Figure 17 This is a diagram illustrating an example sensor mounting structure 1701 including a wall structure according to an embodiment.

[0148] According to an embodiment, the display module may include a protrusion 1710 formed on the first layer 510. For example, a protrusion 1710 having a closed-loop shape may be placed in the space between the outer periphery of the sensor circuit 810 and the inner sidewall of the second opening 620 on the first layer 510. The protrusion 1710 may be a wall structure to prevent and / or reduce the absorption of adhesive material 1510 into the second layer 520. For example, the protrusion 1710 may prevent and / or reduce excess amount 1511 of adhesive material 1510 reaching the second layer 520.

[0149] According to an embodiment, the protrusion 1710 may be formed on the first layer 510 before the sensor circuit 810 is bonded. For example, the protrusion 1710 may be an adhesive component (e.g., tape) or an adhesive material (e.g., a UV-curable resin).

[0150] According to various example embodiments, electronic devices (e.g., Figure 1 The electronic device 100 may include: a housing (e.g., Figure 1 The housing 110), the display (e.g., Figure 1 The display 101) and the sensor (e.g., Figure 4a and Figure 4b Sensor 240). The display module may include a first panel (e.g., Figure 4a and Figure 4b First panel 210), cover layer (e.g., Figure 4a and Figure 4b The cover layer 230) and the second panel (e.g., Figure 4a and Figure 4bThe second panel 220), wherein the first panel has a first surface, a second surface opposite to the first surface, and a plurality of pixels between the first surface and the second surface, a cover layer is disposed on the first surface of the first panel, and the second panel is disposed on the second surface of the first panel. A sensor may be attached to the second surface of the first panel. For example, the sensor may form a sensing area on one surface of the housing (e.g., Figure 1 The sensing area 110F). The display may include an opening provided in the second panel (e.g., Figure 4a and Figure 4b The opening 225), and at least a portion of the sensor may be disposed in the opening, and the second panel may include a first layer (e.g., on one surface of the second panel) connected to the first panel. Figure 5 The first layer 510) and the second layer (e.g., on the surface of the first layer opposite to the first surface) connected to the first layer. Figure 5 The second layer 520). The opening may include the first opening in the first layer (e.g., Figure 6 The first opening 610), and the first opening may be provided by the second opening in the second layer (e.g., Figure 6 Within the enclosed area formed by the second opening (620). The outer periphery of the first opening may be spaced apart from the outer periphery of the second opening in the second layer by at least a specified distance.

[0151] According to an example embodiment, the second layer may include a conductive layer for providing electrical shielding, and the first layer may include a layer for providing optical shielding.

[0152] According to an embodiment, the sensor can be accessed through an adhesive material (e.g., within the first opening) Figure 9b The adhesive material 890 is attached to the second surface of the first panel, and the electronic device may also include a light-shielding material (e.g., light-shielding material) filling the mounting area formed by the adhesive material and the first opening on the second surface of the first panel. Figure 9b (e.g., light-shielding material 910). For example, the light-shielding material may have a specified viscosity or lower viscosity and may dry at room temperature.

[0153] According to an example embodiment, the electronic device may also include protrusions (e.g., Figure 10a and Figure 10b The protrusion 1010), wherein the protrusion is arranged in the region between the second opening and the first opening on the first layer and has a closed loop shape.

[0154] According to an example embodiment, the electronic device may further include a light-shielding adhesive material (e.g., applied to a second surface of the first panel in an area exposed through the first opening) that is then used to shield the light. Figure 11a and Figure 11bThe sensor can be attached to the second surface of the first panel using the light-shielding adhesive material 1110. For example, this can be achieved through a compression process (e.g., Figure 12 or Figure 13 The compression process applies a light-shielding adhesive material to the entire area of ​​the second surface of the first panel exposed through the first opening. For example, the electronic device may also include protrusions (e.g., Figure 10a and Figure 10b The protrusion 1010), wherein the protrusion is arranged in the region between the second opening and the first opening on the first layer and has a closed loop shape.

[0155] According to an example embodiment, the entire area of ​​the second surface of the first panel exposed through the first opening is covered by the sensor. For example, a portion of the sensor may pass through the first opening via an adhesive material filled in the first opening (e.g., Figure 15 The adhesive material 1510 is attached to the second surface of the first panel, and the remainder of the sensor can be attached to the first layer.

[0156] According to various example embodiments, the display module (e.g., Figure 4a and Figure 4b The display module 200 may include a first panel (e.g., Figure 4a and Figure 4b First panel 210), cover layer (e.g., Figure 4a and Figure 4b The cover layer 230), the second panel (e.g., Figure 4a and Figure 4b The second panel 220) and sensors (e.g., Figure 4a and Figure 4b The sensor 240, wherein the first panel includes a first surface, a second surface opposite to the first surface, and a plurality of pixels between the first surface and the second surface, a cover layer is disposed on the first surface of the first panel, the second panel is disposed on the second surface of the first panel, and the sensor is connected to the second surface of the first panel. The sensor may be connected to the second surface of the first panel. For example, the sensor may form a sensing area on one surface of the housing (e.g., Figure 1 The sensing area 110F). The display module may include an opening extending through the second panel (e.g., the sensing area 110F). Figure 4a and Figure 4b The opening 225), and at least a portion of the sensor may be disposed in the opening, and the second panel may include a first layer (e.g., on one surface of the second panel) connected to the first panel. Figure 5 The first layer 510) and the second layer (e.g., on the surface of the first layer opposite to the first surface) connected to the first layer. Figure 5The second layer 520). The opening may include the first opening in the first layer (e.g., Figure 6 The first opening 610), and the first opening may be provided in the second opening in the second layer (e.g., Figure 6 Within the enclosed area of ​​the second opening (620). The outer periphery of the first opening may be spaced apart from the outer periphery of the second opening in the second layer by at least a specified distance.

[0157] According to an example embodiment, the second layer may include a conductive layer configured to provide electrical shielding, and the first layer may include a layer configured to provide optical shielding.

[0158] According to an example embodiment, the sensor can be accessed through an adhesive material (e.g., in the first opening) Figure 9b An adhesive material 890 is attached to the second surface of the first panel. The electronic device may also include a light-shielding material (e.g., [material name missing]) in the mounting area formed by the adhesive material and the first opening on the second surface of the first panel. Figure 9b (e.g., light-shielding material 910). For example, the light-shielding material may have a specified viscosity or lower viscosity and may dry at room temperature.

[0159] According to an example embodiment, the display module may also include protrusions (e.g., Figure 10a and Figure 10b The protrusion 1010 is arranged on the first layer and in the region between the second opening and the first opening, and has a closed loop shape.

[0160] According to an example embodiment, the display module may further include a light-shielding adhesive material (e.g., applied to the second surface of the first panel, covering the entire area exposed through the first opening) of the light-shielding adhesive material. Figure 11a and Figure 11b The sensor can be attached to the second surface of the first panel using the light-shielding adhesive material 1110. For example, this can be achieved through a compression process (e.g., Figure 12 or Figure 13 The compression process applies a light-shielding adhesive material to the entire area of ​​the second surface of the first panel exposed through the first opening. For example, the electronic device may also include protrusions (e.g., Figure 10a and Figure 10b The protrusion 1010), wherein the protrusion is arranged in the region between the second opening and the first opening on the first layer and has a closed loop shape.

[0161] According to an example embodiment, the entire area of ​​the second surface of the first panel exposed through the first opening can be covered by the sensor. For example, this can be achieved by using an adhesive material (e.g., [material name missing]) filled in the first opening. Figure 15The adhesive material 1510) is used to attach a portion of the sensor to the second surface of the first panel, and the remaining portion of the sensor can be attached to the first layer.

[0162] The various embodiments of this disclosure and the terminology used herein are not intended to limit the technology described herein to specific embodiments, and it should be understood that embodiments and terminology include various modifications, equivalents, and / or substitutions to the corresponding embodiments described herein. Regarding the description of the drawings, similar components may be labeled with similar reference numerals. Unless otherwise stated, singular terms may include plural forms. In the disclosure herein, expressions such as “A or B,” “at least one of A and / or B,” “A, B, or C,” or “at least one of A, B, and / or C,” etc., may include any and all combinations of one or more of the associated listed items. Expressions such as “first” or “second,” etc., may denote their components regardless of their priority or importance and may be used to distinguish one component from another, but are not limited to these components. When a component (e.g., the first) is referred to as being "(operably or communicatively) coupled" / "(operably or communicatively) coupled" to another component (e.g., the second) or "connected" to another component (e.g., the second), the component may be directly coupled to / coupled to the other component or connected to the other component, or there may be an intermediate component (e.g., a third component).

[0163] Depending on the context, the expression “adapted to or configured to” as used herein may be used interchangeably with expressions such as “suitable for,” “capable of,” “modified to,” “manufactured to,” “capable of,” or “designed to” in hardware or software. The expression “device configured as” may refer to, for example, a device “capable of” operating with another device or other component. For example, “processor configured (or set to) perform A, B, and C” may refer to, for example, a dedicated processor (e.g., an embedded processor) for performing the respective operations, or a general-purpose processor (e.g., a central processing unit (CPU) or application processor (AP)) that performs the respective operations by executing one or more software programs stored in a storage device.

[0164] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, or any combination thereof, and is used interchangeably with the terms "logic," "logic block," "component," or "circuit." A "module" can be the smallest unit or part of an integrated component, or it can be the smallest unit or part of a smallest unit used to perform one or more functions. A "module" can be implemented mechanically or electronically and can include, for example, application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs), and programmable logic devices for performing known or to be developed operations.

[0165] At least a portion of a device (e.g., its modules or functions) or method (e.g., operation) according to various embodiments may be implemented, for example, by instructions stored in a computer-readable storage medium as program modules. When the instructions are executed by a processor, the processor may perform a function corresponding to the instructions. Computer-readable recording media may include hard disks, floppy disks, magnetic media (e.g., magnetic tape), optical media (e.g., optical disc read-only memory (CD-ROM and digital versatile optical disc (DVD)), magneto-optical media (e.g., floppy disk), embedded memory, etc. One or more instructions may contain code generated by a compiler or code executable by an interpreter.

[0166] Each component (e.g., a module or program module) according to various embodiments may include a single entity or multiple entities, may omit a portion of the aforementioned sub-components, or may also include other sub-components. Optionally or additionally, after being integrated into a single entity, some components (e.g., modules or program modules) may perform the functions performed by each respective component prior to integration in the same or similar manner. According to various embodiments, operations performed by modules, program modules, or other components may be performed in a sequential, parallel, repetitive, or heuristic manner, or at least a portion of the operations may be performed in a different order or omitted. Optionally, additional operations may be added.

[0167] According to the various embodiments disclosed in this disclosure, the sensor mounting area located below the display can be prevented and / or avoided from being viewed from the outside of the electronic device.

[0168] According to the various embodiments disclosed in this disclosure, adhesive material can be prevented and / or avoided from being absorbed into the buffer layer.

[0169] In addition, various effects can be provided directly or indirectly through this disclosure.

[0170] Although this disclosure has been shown and described with reference to various exemplary embodiments thereof, it will be understood that these exemplary embodiments are intended to be illustrative rather than limiting. Those skilled in the art will also understand that various changes in form and detail may be made therein without departing from the true spirit and full scope of this disclosure, including the appended claims and their equivalents.

Claims

1. An electronic device comprising: case; A display includes a first panel, a cover layer, and a shielding layer, wherein the first panel includes a plurality of pixels between a first surface and a second surface opposite to the first surface, the cover layer is disposed on the first surface, the shielding layer is disposed on the second surface, and the shielding layer includes a first layer connected to the second surface and a second layer connected to the first layer; An ultrasonic fingerprint sensor is attached to the second surface via an opening in the shielding layer using a light-shielding adhesive material; and A light-shielding material is arranged along the inner wall of the first opening of the first layer and spread along the outer periphery of the light-shielding adhesive material to cover the gap between the outer periphery of the light-shielding adhesive material and the inner wall of the first opening. The opening includes the first opening in the first layer and the second opening in the second layer. The first layer is configured to provide optical shielding. The second layer is configured to provide electrical shielding. The first opening is located within the enclosed area of ​​the second opening. Wherein, the outer periphery of the first opening is spaced apart from the outer periphery of the second opening, and The closed-shaped protrusion is formed on the first layer and is located between the outer periphery of the first opening and the outer periphery of the second opening.

2. The electronic device as claimed in claim 1, in, The light-shielding material includes epoxy resin.

3. The electronic device as claimed in claim 1, wherein, The light-shielding material has a specified viscosity or lower and is configured to dry at room temperature.

4. The electronic device as claimed in claim 1, in, The ultrasonic fingerprint sensor is configured to emit ultrasonic waves and receive ultrasonic waves reflected from parts of the body.

5. The electronic device as claimed in claim 1, wherein, The second layer includes copper sheets.

6. A display module, comprising: The first panel includes a plurality of pixels located between a first surface and a second surface opposite to the first surface; A cover layer is disposed on the first surface of the first panel; A shielding layer is disposed on the second surface and includes a first layer connected to the second surface and a second layer connected to the first layer; An ultrasonic fingerprint sensor is attached to the second surface via an opening in the shielding layer using a light-shielding adhesive material. as well as A light-shielding material is arranged along the inner wall of the first opening of the first layer and spread along the outer periphery of the light-shielding adhesive material to cover the gap between the outer periphery of the light-shielding adhesive material and the inner wall of the first opening. The opening includes the first opening in the first layer and the second opening in the second layer. The first layer is configured to provide optical shielding. The second layer is configured to provide electrical shielding. The first opening is located within the enclosed area of ​​the second opening. Wherein, the outer periphery of the first opening is spaced apart from the outer periphery of the second opening, and The closed-shaped protrusion is formed on the first layer and is located between the outer periphery of the first opening and the outer periphery of the second opening.

7. The display module as described in claim 6, in, The light-shielding material includes epoxy resin.

8. The display module as described in claim 6, wherein, The light-shielding material has a specified viscosity or lower and is configured to dry at room temperature.

Images