Manufacturing apparatus of display device
Patent Information
- Application Number
- CN202110356769.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-04-03
- Filing Date
- 2021-04-01
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2041-04-01
Smart Images

Figure CN113496920B_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present invention relate to apparatus and methods, specifically to a display device manufacturing apparatus and a cleaning method for the display device manufacturing apparatus. Background Technology
[0002] Mobile electronic devices are being used extensively. Besides small electronic devices like mobile phones, tablet computers are increasingly being used as mobile electronic devices.
[0003] Such mobile electronic devices include display devices to provide various functions (e.g., providing users with visual information such as images or videos). Recently, as other components used to drive the display device have become smaller, the proportion of display devices in electronic devices has been gradually increasing, and structures that can be bent at a predetermined angle in a flat state are also being developed.
[0004] In particular, when the display device is a flexible display device as described above, the display part of the display device can be encapsulated in consideration of the lifespan of the display device. Chemical vapor deposition (CVD) and atomic layer deposition (ALD) are among the encapsulation processes that can be used.
[0005] In the manufacturing apparatus for display devices that perform the packaging process as described above, various studies are being conducted, such as the development of nozzles that range from the existing time-sharing gas supply method to the zoned gas supply method, in order to improve the efficiency of the packaging process. Summary of the Invention
[0006] Embodiments of the present invention provide a display device manufacturing apparatus and a cleaning method thereof for cleaning a nozzle portion of a display device manufacturing apparatus in its original position in order to improve the efficiency of the above-described partitioned gas supply method.
[0007] An embodiment of the present invention discloses a manufacturing apparatus for a display device, comprising: a first nozzle portion including a first nozzle unit for releasing a first source gas and a first exhaust portion disposed outside the first nozzle unit and discharging the first source gas; and a second nozzle portion arranged side by side with the first nozzle portion along a first direction, and including a second nozzle unit for releasing a second source gas and a second exhaust portion disposed outside the second nozzle unit and discharging the second source gas, wherein at least one of the first exhaust portion and the second exhaust portion releases a cleaning gas.
[0008] In one embodiment, the manufacturing apparatus for the display device may further include: a first piping section connected to the first exhaust section; a first cleaning gas supply section connected to the first piping section via a first supply valve; and a first regulating section connected to the first piping section via a first regulating valve, and regulating the pressure of the first piping section.
[0009] In one embodiment, the manufacturing apparatus for the display device may further include: a second piping section connected to the second exhaust section; a second cleaning gas supply section connected to the second piping section via a second supply valve; and a second regulating section connected to the second piping section via a second regulating valve, and regulating the pressure of the second piping section.
[0010] In one embodiment, the manufacturing apparatus for the display device may further include: a third nozzle section arranged side by side with the second nozzle section, and including a third nozzle unit for releasing a third source gas and a third exhaust section disposed outside the third nozzle unit and discharging the third source gas, wherein the third exhaust section may be connected to the first piping section.
[0011] In one embodiment, the first exhaust section can release a first cleaning gas, and the second exhaust section can discharge the first cleaning gas.
[0012] In one embodiment, the first exhaust section and the second exhaust section may alternately release the cleaning gas.
[0013] In one embodiment, the first exhaust section and the second exhaust section can simultaneously release the cleaning gas.
[0014] In one embodiment, at least one of the first nozzle portion and the second nozzle portion may further include a plasma forming portion, and at least one of the first nozzle unit and the second nozzle unit may release nozzle cleaning gas.
[0015] In one embodiment, the manufacturing apparatus for the display device may further include: a first nozzle piping section connected to the first nozzle unit; and a third cleaning gas supply section for supplying cleaning gas from the first nozzle to the first nozzle piping section.
[0016] In one embodiment, the manufacturing apparatus for the display device may further include: a second nozzle piping section connected to the second nozzle unit; and a fourth cleaning gas supply section for supplying cleaning gas to the second nozzle piping section.
[0017] In one embodiment, the first exhaust portion may include: a first flow path defined by the outer side of the first nozzle unit and the inner side of the first exhaust portion; and a second flow path disposed on the first nozzle unit and connected to the first flow path. The first nozzle unit may include a plurality of first nozzles, and the width of the first flow path may be greater than the width of any one of the plurality of first nozzles.
[0018] In one embodiment, the manufacturing apparatus for the display device may further include a chamber, wherein the first nozzle portion and the second nozzle portion may be arranged inside the chamber.
[0019] Another embodiment of the present invention discloses a cleaning method as a cleaning method for a manufacturing apparatus for a display device comprising: a first nozzle portion including a first nozzle unit for releasing a first source gas and a first exhaust portion disposed outside the first nozzle unit; and a second nozzle portion including a second nozzle unit for releasing a second source gas and a second exhaust portion disposed outside the second nozzle unit, wherein the cleaning method comprises the following steps: the first exhaust portion releasing a first cleaning gas; and the first cleaning gas cleaning the first nozzle unit.
[0020] In one embodiment, the cleaning method may further include the following steps: the first cleaning gas moves to the second nozzle portion to clean the second nozzle unit and the second exhaust portion; and the second exhaust portion discharges the first cleaning gas.
[0021] In one embodiment, the cleaning method may further include the following steps: the second exhaust section releases a second cleaning gas; the second cleaning gas moves to the first nozzle section to clean the first nozzle unit and the first exhaust section; and the first exhaust section discharges the second cleaning gas.
[0022] In one embodiment, the cleaning method may further include the following steps: the second nozzle unit releases a second nozzle cleaning gas; and the second nozzle cleaning gas is transformed into a free radical form.
[0023] In one embodiment, the cleaning method may further include the following steps: the first nozzle unit releases a first nozzle cleaning gas; and the first nozzle cleaning gas is transformed into a free radical form.
[0024] In one embodiment, the cleaning method may further include the following steps: releasing a second cleaning gas from the second exhaust section, wherein, in the step of releasing the first cleaning gas, the second nozzle cleaning gas may be transformed into a free radical form, and in the step of releasing the second cleaning gas, the first nozzle cleaning gas may be transformed into a free radical form.
[0025] In one embodiment, during the step of the first exhaust section releasing the first cleaning gas, the second exhaust section may release the second cleaning gas.
[0026] In one embodiment, the manufacturing apparatus for the display device may further include: a first piping section connected to the first exhaust section; a first regulating section connected to the first piping section via a first regulating valve and regulating the pressure of the first piping section; a second piping section connected to the second exhaust section; and a second regulating section connected to the second piping section via a second regulating valve and regulating the pressure of the second piping section, wherein, in the step of the first exhaust section releasing the first cleaning gas, the first regulating valve may be closed and the second regulating valve may be opened.
[0027] As described above, one embodiment of the present invention may include a first nozzle portion comprising a first nozzle unit and a first exhaust portion, and a second nozzle portion comprising a second nozzle unit and a second exhaust portion, wherein at least one of the first exhaust portion and the second exhaust portion can discharge cleaning gas. Therefore, the first nozzle portion or the second nozzle portion can be cleaned in its original position, and the first nozzle portion or the second nozzle portion can be cleaned effectively. Attached Figure Description
[0028] Figure 1 This is a cross-sectional view illustrating a manufacturing apparatus for a display device according to an embodiment of the present invention.
[0029] Figure 2 This is a partial cross-sectional view illustrating a manufacturing apparatus for a display device according to an embodiment of the present invention.
[0030] Figure 3 This is a cross-sectional view illustrating a nozzle assembly according to an embodiment of the present invention.
[0031] Figure 4 as well as Figure 5 This is a simplified cross-sectional view illustrating the piping of a nozzle assembly according to an embodiment of the present invention.
[0032] Figure 6 as well as Figure 7 This is a cross-sectional view illustrating a cleaning method according to an embodiment of the present invention.
[0033] Figure 8 as well as Figure 9 This is a cross-sectional view illustrating a cleaning method according to another embodiment of the present invention.
[0034] Figure 10 This is a cross-sectional view illustrating a cleaning method according to another embodiment of the present invention.
[0035] Figure 11 This is a cross-sectional view illustrating a cleaning method according to another embodiment of the present invention.
[0036] Figure 12 These are comparative examples that differ from the embodiments of the present invention.
[0037] Figure 13 This is a graph comparing the cleaning speeds of the embodiments and comparative examples of the present invention.
[0038] Symbol explanation:
[0039] SV1, SV2: First supply valve, second supply valve
[0040] NP1, NP2: First nozzle piping section, Second nozzle piping section
[0041] NCG1, NCG2: Cleaning gas for the first nozzle, cleaning gas for the second nozzle
[0042] P1, P2: First piping section, Second piping section
[0043] SG1, SG2, SG3: First source gas, second source gas, third source gas
[0044] CV1, CV2: First regulating valve, second regulating valve
[0045] C1: First Adjustment Section
[0046] CG1, CG2: First cleaning gas, Second cleaning gas
[0047] CGS1, CGS2, CGS3, CGS4: First Cleaning Gas Supply Department, Second Cleaning Gas Supply Department, Third Cleaning Gas Supply Department, Fourth Cleaning Gas Supply Department
[0048] PF1, PF2: First plasma forming section, Second plasma forming section
[0049] C3: Third Regulation Section
[0050] 1: Manufacturing apparatus for display devices
[0051] 100: Chamber
[0052] 210, 220, 230: First nozzle section, second nozzle section, third nozzle section
[0053] 211, 221, 231: First nozzle unit, second nozzle unit, third nozzle unit
[0054] 213a, 213b: First flow path, second flow path
[0055] 213, 223, 233: First exhaust section, second exhaust section, third exhaust section Detailed Implementation
[0056] This invention can be modified in various ways and has many embodiments. Specific embodiments are illustrated in the accompanying drawings and described in detail in the specific description. The effects and features of this invention, as well as the methods for achieving them, are explained with reference to the accompanying drawings. Figure 1 The detailed embodiments described later will become clear. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms.
[0057] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding constituent elements will be given the same reference numerals, and repeated descriptions thereon will be omitted.
[0058] In the following embodiments, the terms "first," "second," etc., are not used in a limiting sense, but are used for the purpose of distinguishing one constituent element from other constituent elements.
[0059] In the following embodiments, the singular expression includes the plural expression unless otherwise explicitly indicated in the context.
[0060] In the following embodiments, terms such as "comprising" or "having" indicate the presence of features or constituent elements described in the specification, without pre-excluding the possibility of adding more than one other feature or constituent element.
[0061] In the following embodiments, when referring to a portion of a membrane, region, constituent element, etc., located on or above another portion, it includes not only the case where it is immediately above the other portion, but also the case where other membranes, regions, constituent elements, etc. are sandwiched in between.
[0062] In the accompanying drawings, the sizes of the constituent elements may be exaggerated or reduced for ease of illustration. For example, the sizes and thicknesses of the various components shown in the drawings are arbitrarily depicted for clarity, and therefore the invention is not necessarily limited to the depicted contents.
[0063] In cases where a particular embodiment can be implemented in different ways, a specific sequence of operations may be performed in a different order than that described. For example, two operations described consecutively may be performed substantially simultaneously, or they may be performed in the reverse order of the description.
[0064] In the following embodiments, when it is mentioned that membranes, regions, constituent elements, etc., are connected, it includes not only the case where the membranes, regions, and constituent elements are directly connected, but also the case where they are indirectly connected by intercalating other membranes, regions, and constituent elements. For example, in this specification, when it is mentioned that membranes, regions, constituent elements, etc., are electrically connected, it includes not only the case where the membranes, regions, and constituent elements are directly electrically connected, but also the case where they are indirectly electrically connected by intercalating other membranes, regions, and constituent elements.
[0065] Figure 1 This is a cross-sectional view of a manufacturing apparatus 1 for a display device according to an embodiment of the present invention. Figure 2 This is a partial cross-sectional view illustrating a manufacturing apparatus for a display device according to an embodiment of the present invention.
[0066] Reference Figure 1 as well as Figure 2 The manufacturing apparatus 1 for the display device may include a chamber 100, a nozzle assembly 200, a pressure regulating unit 300, and a moving unit MP.
[0067] For the chamber 100, a space can be formed inside, and an opening is formed on one side, so that the substrate S can be led out or stored. In one embodiment, a first opening and closing part 110 and / or a second opening and closing part 120 including a gate valve can be arranged in the part of the chamber 100 with the opening, so that it can be selectively opened and closed.
[0068] In one embodiment, chamber 100 may be a chamber for chemical vapor deposition (CVD) or plasma-enhanced chemical vapor deposition (PECVD). In another embodiment, chamber 100 may be a chamber for atomic layer deposition (ALD) or plasma-enhanced atomic layer deposition (PEALD), or it may be a chamber that selectively performs chemical vapor deposition (or plasma-enhanced chemical vapor deposition) and atomic layer deposition (or plasma-enhanced atomic layer deposition).
[0069] The nozzle assembly 200 can release or exhaust gases used to form an encapsulation layer on the substrate S. The nozzle assembly 200 can be disposed within the chamber 100. In one embodiment, the nozzle assembly 200 can be fixed within the chamber 100. In another embodiment, the nozzle assembly 200 can be movable within the chamber 100.
[0070] Nozzle assembly 200 may include a first nozzle portion 210 and a second nozzle portion 220. In another embodiment, nozzle assembly 200 may include a first nozzle portion 210, a second nozzle portion 220, a third nozzle portion 230, a fourth nozzle portion 240, and a fifth nozzle portion 250. In yet another embodiment, nozzle assembly 200 may include three or four nozzle portions, or may include six or more nozzle portions. Hereinafter, a detailed description will focus on the case where nozzle assembly 200 includes the first nozzle portion 210 to the fifth nozzle portion 250.
[0071] The first nozzle section 210, the second nozzle section 220, the third nozzle section 230, the fourth nozzle section 240, and the fifth nozzle section 250 can be arranged side by side along a first direction (e.g., the x-direction or the -x-direction). In this case, the first nozzle section 210 to the fifth nozzle section 250 can be arranged sequentially. That is, the second nozzle section 220 can be arranged between the first nozzle section 210 and the third nozzle section 230, and the fourth nozzle section 240 can be arranged between the third nozzle section 230 and the fifth nozzle section 250. In another embodiment, the order of the first nozzle section 210 to the fifth nozzle section 250 can be changed. For example, they can be arranged in the order of the first nozzle section 210, the third nozzle section 230, the second nozzle section 220, the fourth nozzle section 240, and the fifth nozzle section 250. As another example, they can be arranged in the order of the first nozzle section 210, the third nozzle section 230, the fifth nozzle section 250, the second nozzle section 220, and the fourth nozzle section 240. The following detailed description focuses on the arrangement of the first nozzle section 210, the second nozzle section 220, the third nozzle section 230, the fourth nozzle section 240, and the fifth nozzle section 250.
[0072] The first nozzle section 210 may include a first nozzle unit 211 and a first exhaust section 213 disposed outside the first nozzle unit 211. The first nozzle unit 211 may release a first source gas SG1. The first nozzle unit 211 may include a first nozzle N1, a first plasma forming section PF1, a first nozzle support section 211SP, and an insulating section IP.
[0073] In one embodiment, multiple first nozzles N1 may be provided. Multiple first nozzles N1 may be connected to a first nozzle piping section NP1. Multiple first nozzles N1 may release a first source gas SG1 that flows in through the first nozzle piping section NP1. Figure 2 The illustration shows two first nozzles N1, however, the first nozzle unit 211 may include more than two first nozzles N1.
[0074] The first plasma forming unit PF1 can transform the gas emitted from the plurality of first nozzles N1 into a radical state. That is, the first plasma forming unit PF1 can transform the gas emitted from the plurality of first nozzles N1 into a plasma state. For example, the first plasma forming unit PF1 can transform the first source gas SG1 into a radical state. The first plasma forming unit PF1 can be arranged in a manner corresponding to the first nozzle unit 211 and can include electrodes.
[0075] The first nozzle support 211SP can support multiple first nozzles N1, first plasma forming parts PF1, and insulating parts IP. Therefore, multiple first nozzles N1, first plasma forming parts PF1, and insulating parts IP can be fixed in the first nozzle support 211SP.
[0076] The insulating part IP can insulate between the plurality of first nozzles N1 and the first nozzle support 211SP and / or between the first plasma forming part PF1 and the first nozzle support 211SP. The insulating part IP may include a ceramic material or may include polyvinyl fluoride synthetic fibers.
[0077] In one embodiment, the insulating portion IP may include a first insulating portion IP1 surrounding a plurality of first nozzles N1 and a second insulating portion IP2 above the first insulating portion IP1. In this case, the first insulating portion IP1 may include a ceramic material, and the second insulating portion IP2 may include polyvinyl fluoride synthetic fibers.
[0078] The first exhaust section 213 can discharge gas. For example, the first exhaust section 213 can discharge a first source gas SG1, a first source gas SG1 in the form of a free radical, a second source gas SG2, and by-product gases generated when an encapsulation layer is formed on the substrate S. The first exhaust section 213 can be arranged around the first nozzle unit 211. The first exhaust section 213 can discharge gas through a first piping section.
[0079] The second nozzle section 220 may include a second nozzle unit 221 and a second exhaust section 223 disposed outside the second nozzle unit 221. The second nozzle unit 221 may release a second source gas SG2. The second nozzle unit 221 may include a second nozzle N2, a second plasma forming section PF2, a second nozzle support section, and an insulating section. At this time, since the second nozzle N2, the second plasma forming section PF2, the second nozzle support section, and the insulating section are similar to the first nozzle N1, the first plasma forming section PF1, the first nozzle support section 211SP, and the insulating section IP of the first nozzle unit 211, detailed descriptions are omitted.
[0080] The second nozzle N2 can be connected to the second nozzle piping section NP2. Multiple second nozzles N2 can be configured. Multiple second nozzles N2 can release the second source gas SG2 that flows in through the second nozzle piping section NP2.
[0081] The second exhaust section 223 can discharge gases. For example, the second exhaust section 223 can discharge a second source gas SG2, a free radical form of the second source gas SG2, a first source gas SG1, and byproduct gases generated when an encapsulation layer is formed on the substrate S. The second exhaust section 223 can be arranged around the second nozzle unit 221. The second exhaust section 223 can discharge gases through a second piping section.
[0082] The third nozzle section 230 may include a third nozzle unit 231 for releasing a third source gas SG3 and a third exhaust section 233 disposed outside the third nozzle unit 231. At this time, the third nozzle unit 231 may include a plurality of third nozzles and a third plasma forming section PF3.
[0083] The fourth nozzle section 240 may include a fourth nozzle unit 241 for releasing a fourth source gas and a fourth exhaust section 243 disposed outside the fourth nozzle unit 241. In this case, the fourth nozzle unit 241 may include a plurality of fourth nozzles and a fourth plasma forming section PF4.
[0084] The fifth nozzle section 250 may include a fifth nozzle unit 251 for releasing a fifth source gas and a fifth exhaust section 253 disposed outside the fifth nozzle unit 251. At this time, the fifth nozzle unit 251 may include a plurality of fifth nozzles and a fifth plasma forming section PF5.
[0085] The third nozzle section 230 and the fifth nozzle section 250 may be similar to the first nozzle section 210, and the fourth nozzle section 240 may be similar to the second nozzle section 220. Furthermore, the third source gas SG3 and the fifth source gas may be similar to the first source gas SG1, and the fourth source gas may be similar to the second source gas SG2. Therefore, detailed descriptions of the third nozzle section 230, the fourth nozzle section 240, and the fifth nozzle section 250 are omitted.
[0086] In one embodiment, at least one of the first nozzle portion 210 and the second nozzle portion 220 may include a plasma forming portion. For example, as... Figure 2The first nozzle portion 210 may include a first plasma forming portion PF1, and the second nozzle portion 220 may include a second plasma forming portion PF2. In some embodiments, the first nozzle portion 210 may include the first plasma forming portion PF1, and the second nozzle portion 220 may not include the second plasma forming portion PF2. In some embodiments, the first nozzle portion 210 may not include the first plasma forming portion PF1, and the second nozzle portion 220 may include the second plasma forming portion PF2. Hereinafter, for ease of explanation, a detailed description will focus on the case where the first nozzle portion 210 and the second nozzle portion 220 respectively include the first plasma forming portion PF1 and the second plasma forming portion PF2.
[0087] In one embodiment, the first source gas SG1 and the second source gas SG2 may comprise different substances and may be emitted from the first nozzle unit 211 and the second nozzle unit 221, respectively. In this case, the first source gas SG1 may comprise the main deposited material, and the second source gas SG2 may be a reactive gas that reacts with the first source gas SG1. In this case, the encapsulation layer may be formed on the substrate S using atomic layer deposition or plasma atomic layer deposition.
[0088] In another embodiment, the first source gas SG1 and the second source gas SG2 may comprise the same substance and may be emitted from the first nozzle unit 211 and the second nozzle unit 221, respectively. In this case, the encapsulation layer may be formed on the substrate S using chemical vapor deposition or plasma chemical vapor deposition. In yet another embodiment, the first source gas SG1 may comprise an inorganic substance, and the second source gas SG2 may comprise an organic substance.
[0089] The nozzle assembly 200 may also include a support portion SP. The support portion SP can support the first nozzle portion 210 to the fifth nozzle portion 250. That is, the first nozzle portion 210 to the fifth nozzle portion 250 can be fixed to the support portion SP.
[0090] The nozzle assembly 200 may be equipped with a purified gas nozzle section for releasing purified gas PG. The purified gas nozzle section may be arranged between or outside multiple nozzle sections. For example, the purified gas nozzle section may be arranged between the first nozzle section 210 and the second nozzle section 220, between the second nozzle section 220 and the third nozzle section 230, between the third nozzle section 230 and the fourth nozzle section 240, and between the fourth nozzle section 240 and the fifth nozzle section 250. Furthermore, the purified gas nozzle section may be arranged outside the first nozzle section 210, which does not face the second nozzle section 220, and outside the fifth nozzle section 250, which does not face the fourth nozzle section 240. The purified gas PG can prevent gases released from adjacent nozzle sections from mixing with each other. For example, the purified gas PG can prevent the first source gas SG1 released from the first nozzle unit 211 and the second source gas SG2 released from the second nozzle unit 221 from mixing with each other. That is, the purified gas PG can act as an air curtain to prevent the first source gas SG1 and the second source gas SG2 from mixing with each other.
[0091] The pressure regulating unit 300 can be connected to the chamber 100 to regulate the pressure inside the chamber 100. In one embodiment, the pressure regulating unit 300 can regulate the pressure inside the chamber 100 to be the same as or similar to atmospheric pressure. Furthermore, the pressure regulating unit 300 can regulate the pressure inside the chamber 100 to be the same as or similar to a vacuum state. For example, the pressure regulating unit 300 can maintain a vacuum state during the process and maintain an atmospheric pressure state when the substrate S is loaded or unloaded.
[0092] The pressure regulating unit 300 may include a connecting pipe 310 connected to the chamber 100 and a pump 320 disposed on the connecting pipe 310. At this time, with the start of the pump 320, outside air can flow in through the connecting pipe 310, or the gas inside the chamber 100 can be guided to the outside through the connecting pipe 310.
[0093] The moving part MP can be arranged at the lower part of the nozzle assembly 200. In this case, a substrate S can be arranged on the moving part MP, and it can perform linear reciprocating motion within the chamber 100. For example, the moving part MP can move along a first direction (e.g., the x-direction or -x-direction) or along a second direction intersecting the first direction (e.g., the y-direction or -y-direction). As another example, the moving part MP can move along a first direction (e.g., the x-direction or -x-direction), a second direction (e.g., the y-direction or -y-direction), or along a third direction intersecting the first and second directions (e.g., the z-direction or -z-direction). In one embodiment, the moving part MP may include a roller and a motor. In this case, the roller can be rotated by the motor, thereby moving the moving part MP. In another embodiment, the moving part MP may include a linear motion block and a linear motion rail guiding the linear motion block. In this case, the linear motion block can be connected to the moving part MP. Therefore, the moving part MP can move along the linear motion rail. In another embodiment, the moving part MP may include a belt, a lead screw, etc. The moving part MP may include all the devices and structures capable of transferring the substrate S.
[0094] Here, the substrate S can be a display device under manufacture. The substrate S can include glass, or it can include polymer resins such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate (PC), tri-cellulose acetate (TAC), cellulose acetate propionate, etc.
[0095] In the display device manufacturing apparatus 1 described above, the nozzle portions of the nozzle assembly 200 can be arranged side-by-side along a first direction, and the display device manufacturing apparatus 1 can form an encapsulation layer on the substrate S using a zoned gas supply method. In this case, byproduct gases or the like may come into contact with each nozzle unit or exhaust portion, reducing the efficiency of the display device manufacturing apparatus 1. Therefore, it is necessary to clean the nozzle units or exhaust portions. In this situation, the nozzle portions or exhaust portions of the nozzle assembly 200 can be cleaned in their original positions, thereby improving the efficiency of the display device manufacturing apparatus 1.
[0096] Figure 3 This is a cross-sectional view illustrating a nozzle assembly 200 according to an embodiment of the present invention. Figure 3 In terms of, due to Figure 2 The same reference symbol represents the same part, so repeated descriptions are omitted.
[0097] Reference Figure 3 At least one of the first exhaust section 213 to the fifth exhaust section 253 can release cleaning gas. At this time, the third exhaust section 233 and the fifth exhaust section 253 are similar to the first exhaust section 213, and the fourth exhaust section 243 is similar to the second exhaust section 223. Therefore, a detailed description will be given with the first exhaust section 213 and the second exhaust section 223 as the focus.
[0098] The cleaning gas can be selected as a gas capable of cleaning the nozzle unit or the exhaust section, or a free radical form of said gas. For example, the cleaning gas may include chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4). As another example, the cleaning gas may include the free radical form of chlorine (Cl2), the free radical form of nitrogen trifluoride (NF3), the free radical form of boron trichloride (BCl3), or the free radical form of carbon tetrachloride (CCl4).
[0099] At least one of the first exhaust section 213 and the second exhaust section 223 can release cleaning gas. For example, the first exhaust section 213 can release a first cleaning gas CG1, and the second exhaust section 223 can discharge the released gas. In this case, the first cleaning gas CG1 can clean the first nozzle unit 211 and the first exhaust section 213. The first cleaning gas CG1 can move from the first nozzle section 210 to the second nozzle section 220, and the first cleaning gas CG1 can clean the second nozzle unit 221 and the second exhaust section 223. Furthermore, the first cleaning gas CG1 can be discharged through the second exhaust section 223.
[0100] As another example, the first exhaust section 213 can discharge the released gas, and the second exhaust section 223 can discharge the second cleaning gas. In this case, the second cleaning gas can clean the second nozzle unit 221 and the second exhaust section 223. The second cleaning gas can move from the second nozzle section 220 to the first nozzle section 210 and / or the third nozzle section 230. The second cleaning gas moving to the first nozzle section 210 can clean the first nozzle unit 211 and the first exhaust section 213, and can be discharged through the first exhaust section 213. The second cleaning gas moving to the third nozzle section 230 can clean the third nozzle unit 231 and the third exhaust section 233, and can be discharged through the third exhaust section 233.
[0101] As another example, the first exhaust section 213 and the second exhaust section 223 can respectively release a first cleaning gas CG1 and a second cleaning gas. In this case, the first cleaning gas CG1 can clean the first nozzle unit 211 and the first exhaust section 213. Furthermore, a portion of the first cleaning gas CG1 can move to the second nozzle section 220 to clean the second nozzle unit 221 and the second exhaust section 223. The second cleaning gas can clean the second nozzle unit 221 and the second exhaust section 223. Furthermore, a portion of the second cleaning gas can move to the first nozzle section 210 to clean the first nozzle unit 211 and the first exhaust section 213, or it can move to the third nozzle section 230 to clean the third nozzle unit 231 and the third exhaust section 233.
[0102] In this embodiment, the first exhaust section 213 and the second exhaust section 223 can alternately release cleaning gas. Specifically, when the first exhaust section 213 releases the first cleaning gas CG1, the second exhaust section 223 can discharge the released gas. Furthermore, when the second exhaust section 223 releases the second cleaning gas, the first exhaust section 213 can discharge the released gas. For example, as... Figure 3 As shown, when the first exhaust section 213, the third exhaust section 233, and the fifth exhaust section 253 release the first cleaning gas CG1, the second exhaust section 223 and the fourth exhaust section 243 can discharge the released gas. Furthermore, when the second exhaust section 223 and the fourth exhaust section 243 release the second cleaning gas CG2, the first exhaust section 213, the third exhaust section 233, and the fifth exhaust section 253 can discharge the released gas.
[0103] In another embodiment, the first exhaust section 213 and the second exhaust section 223 can simultaneously discharge cleaning gas. For example, the first exhaust section 213 to the fifth exhaust section 253 can simultaneously discharge cleaning gas.
[0104] In one embodiment, at least one of the first nozzle unit 211 to the fifth nozzle unit 251 can release nozzle cleaning gas. In this case, the third nozzle unit 231 and the fifth nozzle unit 251 are similar to the first nozzle unit 211, and the fourth nozzle unit 241 is similar to the second nozzle unit 221. Therefore, the detailed description will focus on the first nozzle unit 211 and the second nozzle unit 221.
[0105] At least one of the first nozzle unit 211 and the second nozzle unit 221 can release nozzle cleaning gas. For example, the first nozzle unit 211 can release a first nozzle cleaning gas, and the second nozzle unit 221 can release a second nozzle cleaning gas. As another example, the first nozzle unit 211 can release the first nozzle cleaning gas, and the second nozzle unit 221 may not release the second nozzle cleaning gas. As yet another example, the first nozzle unit 211 may not release the first nozzle cleaning gas, and the second nozzle unit 221 can release the second nozzle cleaning gas. Hereinafter, for ease of explanation, a detailed description will focus on the case where the first nozzle unit 211 and the second nozzle unit 221 release the first nozzle cleaning gas and the second nozzle cleaning gas, respectively.
[0106] At least one of the first plasma forming unit PF1 and the second plasma forming unit PF2 can transform the nozzle cleaning gas into a free radical form. For example, the first plasma forming unit PF1 can transform the first nozzle cleaning gas into a free radical form. As another example, the second plasma forming unit PF2 can transform the second nozzle cleaning gas into a free radical form. As yet another example, the first plasma forming unit PF1 and the second plasma forming unit PF2 can transform the first nozzle cleaning gas and the second nozzle cleaning gas into free radical forms, respectively. Hereinafter, a detailed description will focus on the case where the first plasma forming unit PF1 and the second plasma forming unit PF2 transform the first nozzle cleaning gas and the second nozzle cleaning gas into free radical forms, respectively.
[0107] In one embodiment, the first plasma forming unit PF1 and the second plasma forming unit PF2 can alternately transform the nozzle cleaning gas into a free radical form. For example, the first plasma forming unit PF1 can transform the first nozzle cleaning gas into a free radical form. Subsequently, the second plasma forming unit PF2 can transform the second nozzle cleaning gas into a free radical form. As another example, the second plasma forming unit PF2 can transform the second nozzle cleaning gas into a free radical form. Subsequently, the first plasma forming unit PF1 can transform the first nozzle cleaning gas into a free radical form. In another embodiment, the first plasma forming unit PF1 and the second plasma forming unit PF2 can simultaneously transform the nozzle cleaning gas into a free radical form. For example, when the first plasma forming unit PF1 transforms the first nozzle cleaning gas into a free radical form, the second plasma forming unit PF2 can transform the second nozzle cleaning gas into a free radical form.
[0108] In this embodiment, the release of cleaning gas from at least one of the first exhaust section 213 and the second exhaust section 223 may be for cleaning the first nozzle section 210 or the second nozzle section 220 within a relatively short period of time. When the cleaning gas is in the form of free radicals, radical recombination may occur when it passes through a narrow flow path. If radical recombination occurs in the cleaning gas, the cleaning time of the nozzle section may increase, and the efficiency of cleaning the nozzle section may decrease.
[0109] The first exhaust section 213 in this embodiment may include: a first flow path 213a, defined by the outer surface 211S of the first nozzle unit 211 and the inner surface 213S of the first exhaust section 213; and a second flow path 213b, connected to the first flow path 213a and arranged on the first nozzle unit 211. In this case, the width W1 of the first flow path 213a may be greater than the width 211W of any one of the plurality of first nozzles N1. The width W1 of the first flow path 213a may be defined as the shortest distance between the outer surface 211S of the first nozzle unit 211 and the inner surface 213S of the first exhaust section 213. The width 211W of any one of the plurality of first nozzles N1 may be defined as the maximum value among the widths of any one of the plurality of first nozzles N1.
[0110] In embodiments of the present invention, the cleaning gas can be released through the exhaust section, thereby reducing the overlap of cleaning gas free radicals when the cleaning gas passes through the flow path. Therefore, embodiments of the present invention can reduce cleaning time.
[0111] Furthermore, in embodiments of the present invention, the plasma forming unit can transform the nozzle cleaning gas emitted from the nozzle unit into a free radical form. Therefore, for nozzle cleaning gas where free radicals overlap due to the relatively narrow flow path compared to the exhaust section, the plasma forming unit can transform the nozzle cleaning gas into a free radical form, thereby cleaning the nozzle section. Thus, embodiments of the present invention can further reduce cleaning time.
[0112] Figure 4 as well as Figure 5 This is a simplified cross-sectional view illustrating the piping of a nozzle assembly 200 according to an embodiment of the present invention. Figure 4 as well as Figure 5 In the middle, due to with Figure 3 The same reference symbol represents the same part, so repeated descriptions are omitted.
[0113] Reference Figure 4 as well as Figure 5The nozzle assembly 200 may include a first nozzle section 210, a second nozzle section 220, a third nozzle section 230, a fourth nozzle section 240, and a fifth nozzle section 250. The first nozzle section 210, the second nozzle section 220, the third nozzle section 230, the fourth nozzle section 240, and the fifth nozzle section 250 may respectively include a first exhaust section 213, a second exhaust section 223, a third exhaust section 233, a fourth exhaust section 243, and a fifth exhaust section 253.
[0114] In this embodiment, the nozzle assembly 200 may include a cleaning gas supply unit CGS, an adjustment unit C, a first piping unit P1, a second piping unit P2, a first nozzle piping unit NP1, and a second nozzle piping unit NP2.
[0115] The cleaning gas supply unit CGS can supply cleaning gas. In one embodiment, the cleaning gas supply unit CGS may include a first cleaning gas supply unit CGS1 supplying a first cleaning gas CG1, a second cleaning gas supply unit CGS2 supplying a second cleaning gas CG2, a third cleaning gas supply unit CGS3 supplying cleaning gas to a first nozzle, and a fourth cleaning gas supply unit CGS4 supplying cleaning gas to a second nozzle. In some embodiments, the first cleaning gas supply unit CGS1 and the second cleaning gas supply unit CGS2 may be integrated. In some embodiments, the third cleaning gas supply unit CGS3 and the fourth cleaning gas supply unit CGS4 may be integrated.
[0116] The regulating unit C can regulate the pressure of the piping section. In this case, the regulating unit C may include a pump. Therefore, with the start of the pump, outside air can flow in, or gas inside the piping section can be guided to the outside. The regulating unit C may include a first regulating unit C1 for regulating the pressure of the first piping section P1, a second regulating unit C2 for regulating the pressure of the second piping section P2, and a third regulating unit C3 for regulating the pressure of the first nozzle piping section NP1.
[0117] The first piping section P1 can be connected to the first exhaust section 213, and the first piping section P1 can also be connected to the first cleaning gas supply section CGS1. Therefore, the first piping section P1 can supply the first cleaning gas CG1 supplied from the first cleaning gas supply section CGS1 to the first exhaust section 213. The first piping section P1 can also be connected to the third exhaust section 233 and the fifth exhaust section 253. Therefore, the first cleaning gas CG1 supplied from the first cleaning gas supply section CGS1 can be supplied to the third exhaust section 233 and the fifth exhaust section 253.
[0118] The first piping section P1 can be connected to the first cleaning gas supply section CGS1 via the first supply valve SV1. At this time, when the first supply valve SV1 is opened, the first cleaning gas CG1 supplied from the first cleaning gas supply section CGS1 can flow into the first piping section P1.
[0119] The first piping section P1 can be connected to the first regulating section C1. In this case, the first piping section P1 can be connected to the first regulating section C1 via the first regulating valve CV1. When the first regulating valve CV1 is opened, the pressure inside the first piping section P1 can be adjusted.
[0120] When the first supply valve SV1 is opened, the first regulating valve CV1 can be closed. In this case, as follows: Figure 4 The first cleaning gas CG1 can flow into the first piping section P1. When the first supply valve SV1 is closed, the first regulating valve CV1 can be opened. In this case, as... Figure 5 The pump in the first regulating unit C1 is activated, thereby guiding the gas inside the first piping unit P1 to the outside. Therefore, the gas inside the first exhaust unit 213, the third exhaust unit 233, and the fifth exhaust unit 253 can be guided to the outside.
[0121] The second piping section P2 can be connected to the second exhaust section 223, and the second piping section P2 can also be connected to the second cleaning gas supply section CGS2. Therefore, the second piping section P2 can supply the second cleaning gas CG2 supplied from the second cleaning gas supply section CGS3 to the second exhaust section 223. The second piping section P2 can also be connected to the fourth exhaust section 243. Therefore, the second cleaning gas CG2 supplied from the second cleaning gas supply section CGS2 can be supplied to the fourth exhaust section 243.
[0122] The second piping section P2 can be connected to the second cleaning gas supply section CGS2 via the second supply valve SV2. At this time, when the second supply valve SV2 is opened, the second cleaning gas CG2 supplied from the second cleaning gas supply section CGS2 can flow into the second piping section P2.
[0123] The second piping section P2 can be connected to the second regulating section C2. In this case, the second piping section P2 can be connected to the second regulating section C2 via the second regulating valve CV2. Therefore, when the second regulating valve CV2 is opened, the pressure inside the second piping section P2 can be adjusted.
[0124] When the second supply valve SV2 is opened, the second regulating valve CV2 can be closed. In this case, as... Figure 5 The second cleaning gas CG2 can flow into the second piping section P2. When the second supply valve SV2 is closed, the second regulating valve CV2 can be opened. In this case, as... Figure 4The pump in the second regulating section C2 is activated, thereby guiding the gas inside the second piping section P2 to the outside. Therefore, the gas inside the second exhaust section 223 and the fourth exhaust section 243 can be guided to the outside.
[0125] In one embodiment, when the first supply valve SV1 is opened, the second supply valve SV2 can be closed. At this time, the first regulating valve CV1 can be closed, and the second regulating valve CV2 can be opened. In this case, as... Figure 4 The first cleaning gas CG1 can be supplied to the first piping section P1, while the second cleaning gas may not be supplied to the second piping section P2. When the first supply valve SV1 is closed, the second supply valve SV2 can be opened. In this case, as... Figure 5 The first cleaning gas may not be supplied to the first piping section P1, while the second cleaning gas CG2 may be supplied to the second piping section P2. At this time, the first regulating valve CV1 is opened, and the second regulating valve CV2 is closed.
[0126] In another embodiment, the first supply valve SV1 and the second supply valve SV2 can be opened or closed simultaneously. In this case, the first regulating valve CV1 and the second regulating valve CV2 can be closed or opened simultaneously.
[0127] The first nozzle piping section NP1 can be connected to the third cleaning gas supply section CGS3. The first nozzle piping section NP1 can also be connected to the first nozzle unit, the third nozzle unit, and the fifth nozzle unit. In this case, the first nozzle piping section NP1 can be connected to the first nozzle unit, the third nozzle unit, and the fifth nozzle unit via various valves. Therefore, the first nozzle cleaning gas supplied from the third cleaning gas supply section CGS3 can be supplied to the first nozzle unit, the third nozzle unit, and the fifth nozzle unit via the first nozzle piping section NP1.
[0128] The first nozzle piping section NP1 can be connected to the third regulating section C3. In this case, the first nozzle piping section NP1 can be connected to the third regulating section C3 via the third regulating valve CV3. When the third regulating valve CV3 is opened, the pressure inside the first nozzle piping section NP1 can be adjusted. In some embodiments, the third regulating section C3 can be omitted.
[0129] The second nozzle piping section NP2 can be connected to the fourth cleaning gas supply section CGS4. The second nozzle piping section NP2 can also be connected to both the second and fourth nozzle units. In this case, the second nozzle piping section NP2 can be connected to both the second and fourth nozzle units via various valves. The second nozzle cleaning gas supplied from the fourth cleaning gas supply section CGS4 can be supplied to both the second and fourth nozzle units via the second nozzle piping section NP2. Although not illustrated in the figures, in some embodiments, the second nozzle piping section NP2 can be connected to a fourth regulating section for adjusting the pressure of the second nozzle piping section NP2. In this case, the fourth regulating section can be connected to the second nozzle piping section NP2 via a fourth regulating valve, similar to the third regulating section C3.
[0130] Figure 6 as well as Figure 7 This is a cross-sectional view illustrating a cleaning method according to an embodiment of the present invention. For Figure 6 as well as Figure 7 In terms of, due to Figure 3 The same reference symbol represents the same part, so repeated descriptions are omitted.
[0131] Reference Figure 6 The nozzle assembly 200 may include a first nozzle section 210 and a second nozzle section 220. The first nozzle section 210 may include a first nozzle unit 211 for releasing a first source gas and a first exhaust section 213 disposed outside the first nozzle unit 211. The second nozzle section 220 may include a second nozzle unit 221 for releasing a second source gas and a second exhaust section 223 disposed outside the second nozzle unit 221.
[0132] The first exhaust section 213 can release a first cleaning gas CG1. At this time, the first cleaning gas CG1 can clean the inner surface of the first exhaust section 213 and / or the outer surface of the first nozzle unit 211. Furthermore, the first cleaning gas CG1 can clean the first nozzle N1 of the first nozzle unit 211.
[0133] The first cleaning gas CG1 may include chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4). Preferably, the first cleaning gas CG1 may include the free radical form of chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4). In this embodiment, the first cleaning gas CG1 is released through a first exhaust section 213 having a width relatively wider than that of the first nozzle N1, thus reducing the occurrence of free radical overlap and thereby reducing the cleaning time.
[0134] The third exhaust section 233 and the fifth exhaust section 253 can release the first cleaning gas CG1 in a similar manner to the first exhaust section 213.
[0135] The first cleaning gas CG1 can move to the second nozzle section 220 to clean the second nozzle unit 221 and the second exhaust section 223. Specifically, the first cleaning gas CG1 can clean the second nozzle N2 of the second nozzle unit 221, the outer surface of the second nozzle unit 221, and the inner surface of the second exhaust section 223.
[0136] The second exhaust section 223 can discharge the first cleaning gas CG1. At this time, the second adjustment section (not shown) connected to the second exhaust section 223 can adjust the pressure inside the second exhaust section 223 for the first cleaning gas CG1, thereby guiding the first cleaning gas CG1 to the outside.
[0137] The fourth exhaust section 243 can discharge the first cleaning gas CG1 in a similar manner to the second exhaust section 223.
[0138] Reference Figure 7 The second exhaust section 223 can release a second cleaning gas CG2. At this time, the second cleaning gas CG2 can clean the inner surface of the second exhaust section 223 and / or the outer surface of the second nozzle unit 221. Furthermore, the second cleaning gas CG2 can clean the second nozzle N2 of the second nozzle unit 221.
[0139] The second cleaning gas CG2 may include chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4), similar to the first cleaning gas. Preferably, the second cleaning gas CG2 may include the free radical form of chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4).
[0140] The fourth exhaust section 243 can release the second cleaning gas CG2 in a similar manner to the second exhaust section 223.
[0141] The second cleaning gas CG2 can move to the first nozzle section 210 to clean the first nozzle unit 211 and the first exhaust section 213. Specifically, the second cleaning gas CG2 can clean the first nozzle N1 of the first nozzle unit 211, the outer surface of the first nozzle unit 211, and the inner surface of the first exhaust section 213. Furthermore, the second cleaning gas CG2 can move to the third nozzle section 230 to clean the third nozzle unit 231 and the third exhaust section 233.
[0142] The first exhaust section 213 can discharge the second cleaning gas CG2. At this time, the first adjustment section (not shown) connected to the first exhaust section 213 can adjust the pressure inside the first exhaust section 213, thereby guiding the second cleaning gas CG2 to the outside.
[0143] The third exhaust section 233 and the fifth exhaust section 253 can discharge the second cleaning gas CG2 in a similar manner to the first exhaust section 213.
[0144] In this embodiment, the first exhaust section 213 and the second exhaust section 223 can alternately release cleaning gas. Specifically, when the first exhaust section 213 releases the first cleaning gas CG1, the second exhaust section 223 can discharge the released gas. And when the second exhaust section 223 releases the second cleaning gas, the first exhaust section 213 can discharge the released gas.
[0145] exist Figure 6 as well as Figure 7 The illustration shows the first nozzle section 210 to the fifth nozzle section 250 arranged side by side. However, in another embodiment, the first nozzle section 210 to the fifth nozzle section 250 may be arranged in the order of first nozzle section 210, third nozzle section 230, second nozzle section 220, fourth nozzle section 240, and fifth nozzle section 250. In yet another embodiment, the first nozzle section 210 to the fifth nozzle section 250 may be arranged in the order of first nozzle section 210, third nozzle section 230, fifth nozzle section 250, second nozzle section 220, and fourth nozzle section 240.
[0146] Figure 8 as well as Figure 9 This is a cross-sectional view illustrating a cleaning method according to another embodiment of the present invention. Figure 8 In terms of, due to Figure 6 The same reference numerals represent the same component, therefore repeated descriptions are omitted. For Figure 9 In terms of, due to Figure 7 The same reference symbol represents the same part, so repeated descriptions are omitted.
[0147] Reference Figure 8 The first exhaust section 213 can release the first cleaning gas CG1. The third exhaust section 233 and the fifth exhaust section 253 can release the first cleaning gas CG1 in a similar manner to the first exhaust section 213. The second exhaust section 223 can discharge the first cleaning gas CG1. The fourth exhaust section 243 can discharge the first cleaning gas CG1 in a similar manner to the second exhaust section 223.
[0148] The second nozzle unit 221 can release a second nozzle cleaning gas NCG2. Specifically, the second nozzle cleaning gas NCG2 can be released through a second nozzle piping section connected to the second nozzle unit 221. The second nozzle cleaning gas NCG2 may include chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4). Preferably, the second nozzle cleaning gas NCG2 may include the free radical form of chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4).
[0149] The first nozzle unit 211 can release a first nozzle cleaning gas NCG1. Specifically, the first nozzle cleaning gas NCG1 can be released through a first nozzle piping section connected to the first nozzle unit 211. The first nozzle cleaning gas NCG1 may include chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4), which are the same as or similar to the second nozzle cleaning gas NCG2. Preferably, the first nozzle cleaning gas NCG1 may include the free radical form of chlorine (Cl2), nitrogen trifluoride (NF3), boron trichloride (BCl3), or carbon tetrachloride (CCl4).
[0150] The third nozzle unit 231 and the fifth nozzle unit 251 can release the first nozzle cleaning gas NCG1 in a manner similar to the first nozzle unit 211. The fourth nozzle unit 241 can release the second nozzle cleaning gas NCG2 in a manner similar to the second nozzle unit 221.
[0151] The second nozzle cleaning gas NCG2 can be transformed into a free radical form. Specifically, the second nozzle cleaning gas NCG2 can be transformed into a free radical form by the second plasma forming section PF2. Therefore, for the second nozzle cleaning gas NCG2 that generates free radical overlap through the second nozzle N2, which has a relatively narrow flow path compared to the second exhaust section 223, the second plasma forming section PF2 can transform the second nozzle cleaning gas NCG2 into a free radical form to clean the second nozzle N2. Therefore, embodiments of the present invention can improve the cleaning completion rate and reduce the cleaning time.
[0152] The fourth plasma forming section PF4 can transform the second nozzle cleaning gas NCG2 into a free radical form, similar to the second plasma forming section PF2.
[0153] Reference Figure 9The second exhaust section 223 can release the second cleaning gas CG2. The fourth exhaust section 243 can release the second cleaning gas CG2 in a similar manner to the second exhaust section 223. The first exhaust section 213 can discharge the second cleaning gas CG2. The third exhaust section 233 and the fifth exhaust section 253 can discharge the second cleaning gas CG2 in a similar manner to the first exhaust section 213. The first nozzle unit 211 can release the first nozzle cleaning gas NCG1, and the second nozzle unit 221 can release the second nozzle cleaning gas NCG2.
[0154] The first nozzle cleaning gas NCG1 can be transformed into a free radical form. Specifically, the first nozzle cleaning gas NCG1 can be transformed into a free radical form by the first plasma forming section PF1. Therefore, for the first nozzle cleaning gas NCG1 that generates free radical overlap through the first nozzle N1, which has a relatively narrow flow path compared to the first exhaust section 213, the first plasma forming section PF1 can transform the first nozzle cleaning gas NCG1 into a free radical form to clean the first nozzle N1.
[0155] The third plasma forming section PF3 and the fifth plasma forming section PF5 can transform the first nozzle cleaning gas NCG1 into a free radical form, similar to the first plasma forming section PF1.
[0156] In this embodiment, the first plasma forming unit PF1 and the second plasma forming unit PF2 can alternately transform the nozzle cleaning gas into a free radical form. Specifically, when the first exhaust unit 213 releases the first cleaning gas CG1, the second plasma forming unit PF2 can transform the second nozzle cleaning gas NCG2 into a free radical form. Subsequently, when the second exhaust unit 223 releases the second cleaning gas CG2, the first plasma forming unit PF1 can transform the first nozzle cleaning gas NCG1 into a free radical form. Therefore, the nozzle assembly 200 can ensure the completeness of the cleaning process.
[0157] Figure 10 This is a cross-sectional view illustrating a cleaning method according to another embodiment of the present invention. Figure 10 In terms of, due to Figure 3 The same reference symbol represents the same part, so repeated descriptions are omitted.
[0158] Reference Figure 10 The nozzle assembly 200 may include a first nozzle section 210 and a second nozzle section 220. The first nozzle section 210 may include a first nozzle unit 211 for releasing a first source gas and a first exhaust section 213 disposed outside the first nozzle unit 211. The second nozzle section 220 may include a second nozzle unit 221 for releasing a second source gas and a second exhaust section 223 disposed outside the second nozzle unit 221.
[0159] The first exhaust section 213 can release a first cleaning gas CG1. At this time, the second exhaust section 223 can also release a second cleaning gas CG2. That is, the first exhaust section 213 and the second exhaust section 223 can release cleaning gases simultaneously. In this case, the first exhaust section 213, the second exhaust section 223, the third exhaust section 233, the fourth exhaust section 243, and the fifth exhaust section 253 can release cleaning gases simultaneously. In some embodiments, at least one of the first exhaust section 213 to the fifth exhaust section 253 may not release cleaning gases, but may discharge the released gas. For example, the first exhaust section 213, the second exhaust section 223, the fourth exhaust section 243, and the fifth exhaust section 253 may each release cleaning gases, and the third exhaust section 233 may discharge the discharged gas.
[0160] Figure 11 This is a cross-sectional view illustrating a cleaning method according to another embodiment of the present invention. Figure 11 In terms of, due to Figure 10 The same reference symbol represents the same part, so repeated descriptions are omitted.
[0161] Reference Figure 11 The first exhaust section 213 can release the first cleaning gas CG1. At this time, the second exhaust section 223 can also release the second cleaning gas CG2.
[0162] When the first exhaust section 213 releases the first cleaning gas CG1, the first nozzle unit 211 can release the first nozzle cleaning gas NCG1. Furthermore, when the second exhaust section 223 releases the second cleaning gas CG2, the second nozzle unit 221 can release the second nozzle cleaning gas NCG2. For example, when the first exhaust section 213 to the fifth exhaust section 253 release cleaning gases respectively, the first nozzle unit 211 to the fifth nozzle unit 251 can release nozzle cleaning gases respectively.
[0163] When the first exhaust section 213 releases the first cleaning gas CG1, the first nozzle cleaning gas NCG1 can be transformed into a free radical form. Specifically, the first nozzle cleaning gas NCG1 can be transformed into a free radical form by the first plasma forming section PF1. Furthermore, when the second exhaust section 223 releases the second cleaning gas CG2, the second nozzle cleaning gas NCG2 can be transformed into a free radical form. Specifically, the second nozzle cleaning gas NCG2 can be transformed into a free radical form by the second plasma forming section PF2. For example, when the first exhaust section 213 to the fifth exhaust section 253 release cleaning gases respectively, the first nozzle unit 211 to the fifth nozzle unit 251 can release nozzle cleaning gases respectively, and the first plasma forming section PF1 to the fifth plasma forming section PF5 can transform the nozzle cleaning gases into free radical forms respectively.
[0164] In some embodiments, at least one of the first plasma forming section PF1 to the fifth plasma forming section PF5 may not convert the nozzle cleaning gas into a free radical form. For example, the first plasma forming section PF1, the second plasma forming section PF2, the fourth plasma forming section PF4, and the fifth plasma forming section PF5 may convert the nozzle cleaning gas into a free radical form, while the third plasma forming section PF3 may not convert the first nozzle cleaning gas NCG1 into a free radical form.
[0165] Figure 12 These are comparative examples that differ from the embodiments of the present invention. Figure 13 This is a graph comparing the cleaning speeds of the embodiments and comparative examples of the present invention.
[0166] Reference Figure 12 The nozzle assembly 200 may include a first nozzle section 210-1 to a fifth nozzle section 250-1. The first nozzle section 210-1 to the fifth nozzle section 250-1 may each include a first nozzle unit 211-1 to a fifth nozzle unit 251-1. The first nozzle section 210-1 to the fifth nozzle section 250-1 may each include a first exhaust section 213-1 to a fifth exhaust section 253-1. Because... Figure 12 The first nozzle unit 211-1 to the fifth nozzle unit 251-1 and the first exhaust section 213-1 to the fifth exhaust section 253-1 and Figure 3 as well as Figure 4 The first nozzle unit 211 to the fifth nozzle unit 251 and the first exhaust section 213 to the fifth exhaust section 253 are similar, so detailed descriptions are omitted.
[0167] The first nozzle unit 211-1, the third nozzle unit 231-1, and the fifth nozzle unit 251-1 can release the first nozzle cleaning gas NCG1. The second nozzle unit 221-1 and the fourth nozzle unit 241-1 can release the second nozzle cleaning gas NCG2.
[0168] The first exhaust section 213-1 to the fifth exhaust section 253-1 can be connected to a pressure regulating section. For example, the first exhaust section 213-1 can be connected to the first regulating section C1-1, the second exhaust section 223-1 can be connected to the second regulating section C2-1, the third exhaust section 233-1 can be connected to the third regulating section C3-1, the fourth exhaust section 243-1 can be connected to the fourth regulating section C4-1, and the fifth exhaust section 253-1 can be connected to the fifth regulating section C5-1. The first exhaust section 213-1 to the fifth exhaust section 253-1 do not release cleaning gas.
[0169] Reference Figure 13 , can be compared with Figure 12The cleaning speeds of the same comparative examples and embodiments of the present invention were compared. Here, the comparison was based on the case where the organic material formed on the nozzle portion is cleaned after an organic film is formed on the substrate in the manufacturing apparatus of the display device. NF3 was used as the cleaning gas, and the organic material may include SiOC. x .
[0170] Example 1 is with Figure 12 The cleaning rate of the same comparative example. Under predetermined conditions, the cleaning rate of Example 1 is...
[0171] Example 2 is Figure 6 as well as Figure 7 The cleaning speed of the embodiment. Under the same conditions as Example 1, the cleaning speed of Example 2 is The cleaning speed of Example 2 is increased to approximately 8 times that of Example 1.
[0172] Example 3 is Figure 8 as well as Figure 9 The cleaning speed of the embodiment. Under the same conditions as Example 1, the cleaning speed of Example 3 is The cleaning speed of Example 3 is increased by approximately 17 times compared to the cleaning speed of Example 1. Furthermore, the cleaning speed of Example 3 is increased by approximately 2 times compared to the cleaning speed of Example 2.
[0173] Therefore, in embodiments of the present invention, cleaning gas can be released from at least one of the exhaust sections, thereby effectively cleaning the nozzle section.
[0174] As described above, although the present invention has been described with reference to one embodiment shown in the accompanying drawings, it is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiments can be made accordingly. Therefore, the true scope of protection of the present invention should be determined based on the technical concept of the claims.
Claims
1. An apparatus for manufacturing a display device, comprising: Chamber; A first nozzle section is disposed inside the chamber and includes a first nozzle unit that releases a first source gas into the chamber and a first exhaust section disposed outside the first nozzle unit and discharging the first source gas into the chamber. as well as The second nozzle section is disposed inside the chamber and arranged side by side with the first nozzle section along a first direction. It includes a second nozzle unit that releases a second source gas into the chamber, and a second exhaust section disposed outside the second nozzle unit that discharges the second source gas into the chamber. In this configuration, at least one of the first exhaust section and the second exhaust section releases cleaning gas into the chamber. At least one of the first nozzle section and the second nozzle section further includes a plasma forming section. The nozzle unit in the first nozzle unit and the second nozzle unit, which has the plasma forming part, releases nozzle cleaning gas into the chamber.
2. The manufacturing apparatus for the display device as claimed in claim 1, further comprising: The first piping section is connected to the first exhaust section; The first cleaning gas supply unit is connected to the first piping unit via a first supply valve; as well as The first regulating unit is connected to the first piping unit via a first regulating valve and regulates the pressure of the first piping unit.
3. The manufacturing apparatus for the display device as claimed in claim 2, further comprising: The second piping section is connected to the second exhaust section; The second cleaning gas supply unit is connected to the second piping unit via a second supply valve; as well as The second regulating unit is connected to the second piping unit via a second regulating valve, and regulates the pressure of the second piping unit.
4. The manufacturing apparatus for the display device as claimed in claim 1, wherein, The first exhaust section releases a first cleaning gas into the chamber. The second exhaust section discharges the first cleaning gas from inside the chamber.
5. The manufacturing apparatus for the display device as claimed in claim 1, wherein, The first exhaust section and the second exhaust section alternately release the cleaning gas into the chamber.
6. The manufacturing apparatus for the display device as claimed in claim 1, wherein, The first exhaust section and the second exhaust section simultaneously release the cleaning gas into the chamber.
7. The manufacturing apparatus for the display device as claimed in claim 1, wherein, Both the first nozzle unit and the second nozzle unit release the nozzle cleaning gas into the chamber.
8. The manufacturing apparatus for the display device as claimed in claim 1, further comprising: The first nozzle piping section is connected to the first nozzle unit; as well as The third cleaning gas supply unit supplies cleaning gas from the first nozzle to the first nozzle piping unit.
9. The manufacturing apparatus for the display device as claimed in claim 1, wherein, The first exhaust portion includes: a first flow path defined by the outer surface of the first nozzle unit and the inner surface of the first exhaust portion; and a second flow path disposed on the first nozzle unit and connected to the first flow path. The first nozzle unit includes a plurality of first nozzles. The width of the first flow path is greater than the width of any one of the plurality of first nozzles.
Citation Information
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