Semiconductor package with predictive safety guard

Abstract

Embodiments of the present disclosure relate to semiconductor packages with predictive safety guards. The present disclosure describes techniques for detecting, in the field, a failure or performance degradation of a device comprising an integrated circuit (IC) component by including additional contacts (i.e., terminals) and a circuit that is used to connect the circuit, which is part of a system, to the system. These additional contacts can be external to the package surface and can be used to measure electrical properties that dynamically change over time, such as voltage, current, capacitance, temperature, and impedance. These electrical properties can be indicative of one or more failure modes and can be considered as an indicator of the device’s state of health (SOH).

Description

Technical Field

[0001] This disclosure relates to field reliability testing of integrated circuits. Background Technology

[0002] During operation, the performance of semiconductor devices may degrade or fail, sometimes referred to as field failure. In some cases, the performance of semiconductor devices may degrade over time even without a detectable field failure. In applications requiring high reliability, such as commercial aircraft, automobiles, trains, power grids, and similar applications, reliability issues can be mitigated, for example, by periodically replacing certain components. However, scheduled replacements can be expensive, and scheduled replacement of semiconductor components may also occur even if those components are still fully functional.

[0003] In other examples, components used in high-reliability applications may be subject to stringent design and testing requirements, which can significantly increase component costs. Summary of the Invention

[0004] In general, this disclosure relates to techniques for detecting field failures or performance degradation of integrated circuit (IC) components by including additional contacts (i.e., terminals) and functional contacts used to connect the IC to a system in which the IC is part. These additional contacts can be inside or outside the IC package and can be used to measure electrical characteristics that change dynamically over time, such as voltage, current, capacitance, temperature, and impedance. These electrical characteristics can represent one or more failure modes and can be considered as indicators of the state of health (SOH) of the IC, either internally or via signals sent to the system including the IC.

[0005] In one example, this disclosure describes a device including an IC configured to perform one or more circuit operations and a plurality of external terminals including a first terminal and a second terminal. The plurality of external terminals are configured to provide electrical connections to the IC and, while the IC is performing one or more circuit operations, to provide measurements of electrical characteristics between the first and second terminals, wherein the measured electrical characteristics indicate the state of health (SOH) of the device.

[0006] In another example, this disclosure describes a system comprising: an IC device configured to perform one or more circuit operations, the IC device including a plurality of external terminals, the plurality of external terminals including a first terminal and a second terminal. The plurality of external terminals are configured to provide electrical connections to the integrated circuit, and the first terminal of the plurality of terminals is configured to provide a measurement of an electrical characteristic between the first terminal and the second terminal while the IC is performing one or more circuit operations. The measured electrical characteristic indicates the state of health (SOH) of the device. The system also includes measurement circuitry configured to determine the electrical characteristic, wherein the electrical characteristic determines one or more of voltage, current, impedance, and temperature.

[0007] In another example, this disclosure describes a method comprising: measuring, at a first time, an electrical characteristic between a first terminal and a second terminal of an IC using a measurement circuit. The first and second terminals are terminals of the IC configured to provide an electrical connection to the IC, and wherein the IC is configured to perform one or more circuit operations. The method further comprises measuring the electrical characteristic between the first and second terminals of the IC using a measurement circuit at a second time other than the first time; comparing the electrical characteristic measured at the first time with the electrical characteristic measured at the second time; and determining the state of health (SOH) of the IC based on the comparison while the IC is performing one or more circuit operations.

[0008] Details of one or more examples of this disclosure are set forth in the accompanying drawings and the following description. Other features, objects, and advantages of this disclosure will become apparent from the specification, the drawings, and the claims. Attached Figure Description

[0009] Figure 1 This is a conceptual diagram illustrating a system for measuring the electrical characteristics between two terminals of an integrated circuit (IC) according to one or more techniques of this disclosure.

[0010] Figure 2 This is a conceptual diagram illustrating an IC configured to measure the electrical characteristics between two terminals of an IC according to one or more techniques of this disclosure.

[0011] Figure 3 This is a conceptual diagram illustrating another example of the electrical characteristics between the terminals of a measurement IC according to one or more techniques of this disclosure.

[0012] Figure 4 This is a conceptual diagram illustrating an example of multiple additional terminals added to an IC to measure the electrical characteristics between at least two terminals of the IC, according to one or more techniques of this disclosure.

[0013] Figure 5This is a conceptual diagram illustrating another example of an additional terminal internally added to an IC to measure the electrical characteristics between two terminals of the IC according to one or more techniques of this disclosure.

[0014] Figure 6 This is a schematic diagram illustrating an example configuration of an ESD diode in an IC according to one or more technologies of this disclosure, the ESD diode being used to measure one or more electrical characteristics.

[0015] Figure 7 This is a flowchart illustrating an example operation of a system for measuring the electrical characteristics of this disclosure. Detailed Implementation

[0016] This disclosure relates to techniques for detecting field failures or performance degradation of integrated circuit (IC) components using additional test contacts (i.e., test terminals) and functional contacts. These additional contacts can be inside the IC package or outside the package surface and are used to measure electrical properties that change dynamically over time, such as voltage, current, capacitance, temperature, or impedance. These electrical characteristics can indicate certain failure modes and can be used within the IC or signaled to a system including the IC as an indicator of state of health (SOH). Some examples of problems that may lead to component degradation or eventual failure include vibration, extreme temperature variations, and moisture.

[0017] In some examples, prolonged thermal changes can cause metal phase transition separation, leading to voids within the IC package, and delamination and breakage of electrical connections (such as wirebonding and solder bonding that connect the IC package to the system). Field environments can also cause long-term induced degradation of package materials (e.g., mold materials and adhesives, as well as metal plating). Degradation of package materials can allow moisture to penetrate the IC package and may accelerate corrosion within the package. In other examples, metal migration effects can cause internal short circuits or short circuits between IC terminals connected to the system via solder or wire bonding.

[0018] To prevent electrostatic discharge (ESD), an IC may include ESD protection diodes to clamp ESD voltages to a damage-free level. In some examples, existing ESD protection diodes can be used to measure the IC's electrical characteristics, such as temperature. For instance, additional contacts on the IC can be used to measure the IC temperature by monitoring the voltage across one or more ESD diodes. Temperature can be compared to a temperature range or threshold to detect errors, as well as temperature changes caused by increased resistance on the terminal bonds that may creep over time or propagate through crack formation in the electrical connectors.

[0019] In some examples, the IC may include a built-in self-test (BIST), cyclic redundancy check (CRC), and other tests to ensure the IC's functionality. In other examples, systems in high-reliability applications may include additional sensors and test functions for early detection of failures or degradation of system components. However, the techniques of the present invention can use additional structures added to the IC to provide detectability of failure modes that would be undetectable by existing technologies.

[0020] Figure 1 This is a conceptual diagram illustrating a system for measuring the electrical characteristics between two terminals of an IC according to one or more techniques of this disclosure. While device performance can be measured in a test environment such as during manufacturing, the techniques of this disclosure also provide information about the device's State of Health (SOH) when the device is operating in the field. Some examples of test environments across various manufacturing stages may include wafer testing of multiple integrated circuits on a silicon wafer. Other testing may include testing the IC as it is being diced from the wafer, testing the IC when it is being attached to a leadframe or similar assembly, and testing may be performed before and after molding compounds are applied to the IC package. Other test environments may include board testing after the IC package is assembled into a circuit, system testing after the circuit is connected to a system, and overall product testing before the final product leaves the factory. Test environments may include automated test equipment (ATE) to run a series of tests on the device or an assembly including the device. The techniques of this disclosure may be advantageous during the post-assembly stages in a test environment; however, they may also be ideal for devices performing one or more circuit operations in the field outside the test environment, and may not require additional sensors and testing capabilities for early detection of system component failures or performance degradation as required by other techniques.

[0021] exist Figure 1 In the example of system 100 depicted, device 104 includes circuit means 150 configured to perform one or more circuit operations. In some examples, circuit means 150 may be an IC. In other examples, circuit means 150 may include one or more ICs and one or more additional components as part of device 104. Circuit means 150 may be configured to perform one or more circuit operations to perform functions designed for device 104. The functions of device 104 can be anything performed by an IC in a system (e.g., system-on-a-chip, application-specific integrated circuit (ASIC), microcontroller, multiplexer, etc.) that performs sensing, warning, display functions, power supply, and many other functions.

[0022] Device 104 may include multiple external terminals, such as terminal 106 and corner terminal 156, configured to provide electrical connections to circuitry 150. For example, terminal 106 may be electrically and mechanically connected to a circuit board, lead frame, a back-mount service on another IC package, etc. External terminals may provide power, reference voltages such as circuit ground, input and output signals, and other signals to or from circuitry 150 to other components of system 100. Figure 1 (Not shown in the image). In some examples, one or more of the external terminals 106 may provide only a mechanical connection to the fixed device 104, without an electrical connection. Some examples of external terminals may withstand greater mechanical stress than other terminals (such as corner terminals 156) and may be more susceptible to weak electrical bonding, such as broken solder joints. Weak bonding results in an open circuit at the external terminal. In this disclosure, external terminals may also be referred to as leads or contacts, for example, electrical contacts.

[0023] In some examples, the external terminals of device 104 may be defined by a lead frame coupled to circuit arrangement 150. In other examples, device 104 may be a circuit package including an IC and multiple external terminals.

[0024] In some examples, device 104 may include molding compound 152 or similar material for isolating and protecting components of the circuit package, such as circuit device 150 and lead frame. Molding compound 152 may be made of a variety of materials, such as epoxy resin, organic compounds, ceramic materials, and similar materials. Molding compound 152 may provide mechanical stiffness, electrical insulation, moisture resistance, and other protective characteristics.

[0025] While circuit device 150 is performing one or more circuit operations, the measurement circuitry of system 100, including measurement circuitry device 102, can be connected to one or more external terminals of device 104. Unlike BIST or manufacturing-period testing, measurement circuitry device 102 is configured to measure one or more electrical characteristics that can provide an indication of the health status of device 104 in the field. Figure 1 In the example, the measuring circuit device 102 is connected to external terminals 110 and 112 and can measure one or more electrical characteristics between terminals 110 and 112. Some examples of electrical characteristics may include AC impedance, resistance, voltage, temperature, and other characteristics. In some examples, terminals 110 and 112 may each be functional terminals configured to conduct electrical signals between system 100 and one or more functional blocks of circuit device 150 when device 104 performs one or more circuit operations outside the test environment.

[0026] In some examples, device 104 may also include one or more internal terminals ( Figure 1 (Not shown in the image). The internal terminals can be configured to connect to the measuring circuit device 102 and provide a measurement of another electrical characteristic, such as that between terminal 110 and the internal terminals. The electrical characteristics measured from the internal terminals can, for example, determine the amount of leakage between terminal 110 and the internal terminals.

[0027] In some examples, device 104 may be a large, expensive device with numerous external terminals and a high-end molding compound. In other examples, device 104 may include smaller devices, such as power switches controlling power to system 100, in system-critical applications. In other examples, device 104 may include less expensive devices, such as secondary functions that allow the system to continue operating if the device fails. In some examples, the functionality of measurement circuitry 102 may be implemented by components of system 100, which may be controlled by one or more processors 120 of system 100. In other examples, device 104 may include processing circuitry configured to receive signals indicating values ​​of electrical characteristics from measurement circuitry 102. Measurement circuitry 102 may be implemented as one or more sub-circuits within circuitry 150 and may be configured to determine state of equilibrium (SOH) based on the measured electrical characteristics. When device 104 performs one or more circuit operations in the field, device 104 may output signals indicating SOH to one or more processors 120 of system 100. In other examples, it may be implemented as an IC (Integrated Circuit-Based Component). Figure 1 A dedicated measurement circuit (not shown) may be included in system 100 and includes measurement circuitry 102, a processor, logic circuitry, communication circuitry, and other components to measure and determine the state of equilibrium (SOH) of device 104. One or more processors (internal or external to device 104) may enable measurement circuitry 102 to measure the electrical characteristics between terminals 110 and 112 based on, for example, one or more trigger events, expiration periods (e.g., once per minute), or other factors.

[0028] In some examples, SOH can be determined by a single measurement. In other examples, SOH can be determined by comparing changes in measured values ​​of an electrical characteristic over at least two distinct time periods. In some examples, SOH can be associated with a specific device in a particular application. For a given electrical characteristic, similar devices in two different applications may have different threshold limits. For example, the requirements for devices involved in interior lighting in a car may be less stringent than those for devices that are part of an aircraft's flight control system. The threshold limits for a leakage characteristic may be more stringent for an aircraft or for a stability control system on an oil drilling platform compared to less critical applications. In some examples, one or more processors 120 of system 100 can compare the measured characteristic with one or more threshold limits stored at a memory location such as memory 122. System 100 can determine the SOH of device 104 based on the comparison. In some examples, system 100 can determine that the SOH of device 104 indicates that device 104 should be replaced, for example, because device 104 may be at risk of failure.

[0029] In other examples, device 104 may include measuring circuitry 102 and output a signal to system 100 indicating the value of the measured electrical characteristic. In some examples, device 104 may be configured to measure electrical characteristics such as resistance by running a test program triggered by a signal external to device 104, such as a signal from processor 120. System 100 may compare the value to a threshold limit to determine the state of harmonics (SOH) of device 104. In other examples, while device 104 performs one or more circuit operations, processing circuitry included in device 104 may determine the SOH based on the measured electrical characteristics and output a signal to system 100 indicating the SOH of device 104. In some examples, one or more processors 120 may determine whether device 104 should be replaced. In other examples, dedicated measuring circuitry may measure one or more electrical characteristics between one or more terminals of device 104 and output a signal indicating the SOH of device 104.

[0030] In some examples, device 104 can be configured to operate in an operational mode, a manufacturing test mode, and an operational test mode. For example, device 104 can operate in manufacturing test mode at various manufacturing stages and be coupled to automated test equipment, such as a bare die, as part of a sub-assembly or as part of a complete system, assembled as a circuit package. In some examples, device 104 can operate in operational test mode, in which it can be configured to continue performing one or more circuit operations as designed, but can also receive signals from measurement circuitry 102, which measures electrical characteristics between terminals 110 and 112, such as AC impedance, resistance, voltage, temperature, and other characteristics as described above. In some examples, while device 104 performs one or more circuit operations in the field, it can operate in operational mode without a separate operational test mode and still receive signals from measurement circuitry 102 to measure electrical characteristics. As described above, during any of the operational mode, manufacturing test mode, or operational test mode, measurement circuitry 102 can be internal to device 104 or an external circuit controlled by system 100.

[0031] Devices incorporating the technology of this disclosure may offer advantages over other technologies. In some examples, the device may be expensive and difficult to replace in the field. For devices providing critical functions, such as safety, navigation, and functions requiring system shutdown for a period of time in the event of a failure, periodic replacement to ensure reliability may be costly. Scheduled replacement of semiconductor components may also occur for components that are still fully functional. The technology of this disclosure can provide an indication of the device's state of health (SOH), which may not be provided by, for example, BIST or other tests.

[0032] The technology disclosed herein can detect leaks, increased resistance, unexpected changes in operating temperature, and other electrical characteristics that may indicate deterioration in health. This technology enables system designers to perform measurements and set threshold limits relevant to the specific application and environment in which the equipment can operate in the field. In this way, equipment replacement can be planned based on objective thresholds rather than on estimated timeframes (such as statistical mean time between failures (MTBF)). Additional advantages may include providing external leads and internal contacts within the equipment during manufacturing, allowing system designers to perform measurements of leaks, temperature, and other electrical characteristics without the need for additional system sensors and leads.

[0033] Figure 2 This is a conceptual diagram illustrating an IC configured to measure the electrical characteristics between two terminals of an IC according to one or more techniques of this disclosure. Device 204 and measuring circuit device 202 are described above regarding... Figure 1 The described example of device 104 and measuring circuit device 102 is configured to determine the state of electrical shock (SOH) of device 204 by measuring the electrical characteristics between two or more terminals.

[0034] Figure 2 The example depicts device 204, which has IC 250, external terminals Vdd 210 and Vref 212, and is protected by a sealant configured to seal IC 250, such that multiple external terminals provide a single electrical connection to IC 250. IC molding compound 252 is a sealant for device 204 and may be made of organic compounds, ceramics, resins, or similar materials. External terminals Vdd 210 and Vref 212 are functional terminals configured to conduct electrical signals to and from functional blocks of IC 250 when IC 250 performs one or more circuit operations.

[0035] exist Figure 2 In this example, terminal Vdd 210 is connected to a power supply and can provide power to IC 250. Vref 212 is connected to a reference voltage, such as signal ground. Measurement circuitry 202 is connected between external terminals Vdd 210 and Vref 212. In other examples, measurement circuitry 202 can be configured to be electrically connected to any internal terminal ( Figure 2 (not shown in the image) and external terminals (such as those mentioned above) Figure 1 The external terminals 106 and 156 described are located between the device 204. The measuring circuit device 202 can be located outside or inside the device 204 and can be configured to output a signal indicating the measured electrical characteristics in the field when the IC 250 performs one or more circuit operations. The device 204 can be exposed to environmental conditions such as temperature changes, humidity, mechanical vibration, etc.

[0036] By measuring electrical characteristics such as resistance, the measuring circuit device 202 can detect changes in resistance between terminals Vdd 210 and Vref 212, changes in resistance that may be caused by, for example, metal migration 216 along the surface of a lead frame or circuit board. For example, silver ions (Ag+ ions) may form dendritic crystals or similar structures, causing leakage current 214. In some examples, a processing circuit device (such as processor 120 described above with respect to system 100) can receive signals from the measuring circuit device 202 indicating resistance values ​​or other electrical characteristics. The processing circuit device can determine the state of health (SOH) based on a comparison of the measured electrical characteristics with a threshold. For example, the processing circuit device can determine that a resistance exceeding a threshold, such as a resistance greater than one ohm, indicates that the health condition has deteriorated to the point where the device needs replacement. In other examples, the processing circuit device can determine that changes in electrical characteristics over a period of time indicate a deterioration in health condition. For example, the processing circuit device can receive a signal from the measuring circuit indicating that the resistance value has increased by 50% during a predetermined time period, such as from a start time to an end time. The increased amount may exceed the difference threshold, and the processing circuitry may output a signal indicating the state of harm (SOH) of device 204. During the period when IC 250 is performing one or more circuit operations outside the test environment and except for any BIST or other test indications from device 204, the processing circuitry may continue to receive measurement signals from the measurement circuitry 202.

[0037] Figure 3 This is a conceptual diagram illustrating another example of the electrical characteristics between the terminals of a measuring IC according to one or more techniques of this disclosure. Device 304 and measuring circuit device 302 are described above regarding... Figure 1 and Figure 2 Examples of the described devices 104 and 204 and the measuring circuit devices 102 and 202. Figure 3 The example depicts a device 304, IC 350, external terminals Vdd 310 and Vref 312, and measurement circuit device 302 protected by IC molding compound 352. The functions and characteristics of device 304, IC 350, external terminals Vdd 310 and Vref 312, molding compound 352, metal migration 316, leakage current 314, and measurement circuit device 302 may be the same as or similar to device 204, IC 250, external terminals Vdd 210 and Vref 212, molding compound 252, metal migration 216, leakage current 214, and measurement circuit device 202.

[0038] Device 304 includes an external terminal 320 connected to the measurement circuitry 302. In some examples, terminal 320 may be an additional terminal added to device 304 specifically to help determine the state of harmonics (SOH) of device 304. In other examples, terminal 320 may be a functional terminal configured to conduct electrical signals between one or more functional blocks of IC 350 during normal field operation. In some examples, terminal 320 may be located in areas of device 304 subjected to increased metal migration 316 or increased mechanical stress, as described above. Figure 1 The corner terminal 156 is described.

[0039] Measurement circuitry 302 can be configured to measure one or more electrical characteristics between terminal Vdd 310 and terminal 320. In some examples where device 304 includes measurement circuitry 302, device 304 can be configured to output a signal indicating the measured electrical characteristics when IC 350 performs one or more circuit operations in the field. In other examples where device 304 also includes processing circuitry, when IC 350 performs one or more circuit operations outside the test environment, device 304 can determine the State of Health (SOH) based on the measured electrical characteristics and send a signal to the system processing circuitry. Figure 2 (Not shown in the image) Outputs a signal indicating SOH.

[0040] Figure 4 This is a conceptual diagram illustrating an example of a plurality of additional terminals on an IC package for measuring the electrical characteristics between at least two terminals of the IC according to one or more technologies of this disclosure. Device 404 and measuring circuit device 402 are as described above. Figures 1 to 3 Examples of the described devices 104, 204 and 304 and the measuring circuit devices 102, 202 and 302. Figure 4 The example depicts a device 404, IC 450, external terminals Vdd 410 and Vref 412, and measurement circuit device 402 protected by IC molding compound 452. The functions and characteristics of device 404, IC 450, external terminals Vdd 410 and Vref 412, molding compound 452, metal migration 416, leakage current 414, and measurement circuit device 402 may be the same as or similar to device 204, IC 250, external terminals Vdd 210 and Vref 212, molding compound 252, metal migration 216, leakage current 214, and measurement circuit device 202.

[0041] As mentioned above Figure 1 As described, the measuring circuit device 402 can be configured to connect to internal terminals ( Figure 4 (not shown in the image) or any external terminals, such as Figure 1 Terminal 106 is depicted in the image. Figure 4The example illustration shows the measurement of electrical characteristics between multiple external terminals to determine the state of harmonics (SOH) of device 404. Figure 4 In the example, the measuring circuit device 402 is configured to measure the electrical characteristics between terminals 422 and 420. Such measurements may include temperature, leakage, resistance, etc. (As mentioned above regarding...) Figures 1 to 3 As described, changes over time or values ​​exceeding a threshold can provide an indication of the State of Health (SOH) of device 404. In some examples, terminal 422 may be a functional terminal, while in other examples, terminal 422 may be added to device 404 during manufacturing to enable system designers to perform measurements.

[0042] Figure 5 This is a conceptual diagram illustrating another example of additional terminals internally added to an IC to measure the electrical characteristics between two terminals of the IC according to one or more techniques of this disclosure. Device 504 and measuring circuit device 502 are as described above regarding... Figures 1 to 4 Examples of the described devices 104, 204, 304 and 404, and the measuring circuit devices 102, 202, 302 and 402. Figure 5 The example depicts a device 504, an IC 550, external terminals Vdd 510 and Vref 512, and a measurement circuit device 502 protected by an IC molding compound 552. The functions and characteristics of the device 504, the IC 550, the external terminals Vdd 510 and Vref 512, the molding compound 552, and the measurement circuit device 502 may be the same as or similar to those of the device 204, the IC 250, the external terminals Vdd 210 and Vref 212, the molding compound 252, and the measurement circuit device 202.

[0043] Device 504 includes internal contacts 522 and 520 connected to the measuring circuit device 502. Although Figure 5 Not shown, but the measuring circuit 502 can be configured to measure the internal contacts (e.g., 522 and 520) and one or more external terminals (e.g., Vdd 510, Vref 512 or...). Figure 1 Electrical characteristics between any terminals 106 depicted in the text.

[0044] In some examples where the measuring circuit 502 is located within the device 504, the measuring circuit 502 may be configured to be directly connected to any one or more contacts among external terminals or internal contacts, or in some examples, it may be configured to be connected via a multiplexer. Figure 5(Not shown) Connected to any one or more contacts among external terminals or internal contacts. In other examples where the measuring circuit device 502 is outside the device 504, the measuring circuit device 502 may be configured to connect to one or more contacts among internal contacts 522 and 520 (in) via electrical wiring to external terminals of internal contacts within the IC 550. Figure 5 (Not shown in the image).

[0045] In some examples, the electrical characteristics of the internal contacts, or the combination of internal contacts and external terminals, can enable the system to detect long-term induced degradation of the package material caused by the field environment. For example, molding materials and adhesives, as well as metal plating, may be affected by moisture penetration into the IC package, causing delamination, voids, and other defects, and may accelerate corrosion effects inside the IC package. In some examples, measurement circuitry 502 may be able to detect delamination and other defects that other types of tests (such as BIST) might fail to detect by measuring AC impedance or other electrical characteristics.

[0046] Figure 6 This is a schematic diagram illustrating an example configuration of an ESD diode in an IC according to one or more technologies of this disclosure, the ESD diode being used to measure one or more electrical characteristics. Figure 6 The example depicts IC 650, external terminals Vdd 610, Vref 612, and functional terminal 620. The functions and characteristics of IC 650, external terminals Vdd 610, Vref 612, and functional terminal 620 can be related to the above. Figure 2 and Figure 4 The described IC 250, external terminals Vdd 210, Vref 212, and external terminals 410 and 420 are the same as or similar. Measurement circuitry, such as... Figure 1 The measurement circuit device 102 depicted can be connected to any one of the external terminals Vdd 610, Vref 612 and functional terminal 620, as well as any internal terminal of IC 650. Figure 6 (Not shown in the image).

[0047] exist Figure 6 In the example, Vdd 610 is connected to the cathode of ESD diode 626. The anode of ESD diode 626 is connected to the cathode of ESD diode 628 and function terminal 620. The anode of ESD diode 628 is connected to signal ground and Vref 612. In some examples, function terminal 620 may also be electrically connected to IC 650 (…). Figure 6 (Not shown) One or more functional blocks within IC 650. Similarly, Vdd 610 and Vref 612 can also be connected to one or more functional blocks within IC 650.

[0048] In some examples, the measurement circuitry can measure, for example, the electrical characteristics between Vdd 610 and functional terminal 620. In some examples, the electrical characteristic is impedance, and the device is configured to measure the impedance of the ESD diode by applying a reverse supply voltage. In other examples, the measurement circuitry can determine the temperature of IC 650 near the ESD diode 626 based on the diode's characteristics, which will produce voltage changes in response to changes in ambient temperature. The measured temperature or temperature changes over time can provide an indication of the health status of IC 650. In other examples, the processing circuitry can use the measured temperature to adjust other electrical characteristics. For example, the measured resistance can change based on temperature, so the processing circuitry can correct the measured resistance based on the measured temperature.

[0049] Figure 7 This is a flowchart illustrating an example operation of a system for measuring the electrical characteristics of this disclosure. Unless otherwise stated, Figure 7 The frame will be based on Figure 1 To describe.

[0050] Measurement circuitry, such as measurement circuitry device 102, can be configured to measure the electrical characteristics (90) between a first terminal (e.g., terminal 110) and a second terminal (e.g., terminal 112) of device 104, including IC 150. In some examples, the measurement circuitry can perform the measurement at a first moment and determine the state of equilibrium (SOH) of device 104 based on the measurement result. In other examples, the measurement circuitry can provide values ​​of the electrical characteristics to be stored at a memory location (e.g., memory 122) for use by processing circuitry to track trends in the electrical characteristics. (As stated above regarding...) Figures 1 to 6 As described, the terminals of the configured IC can be configured to provide electrical connections from other terminals within system 100 to the IC and to other terminals within system 100. Figure 1 and Figure 7 Electrical connections (not shown in the diagram). In other examples, the measuring circuit may be connected as described above. Figure 5 The internal terminals described herein. In contrast to measurement circuits such as those used in automated test equipment that can perform similar measurements during manufacturing, the measurement circuits of this disclosure can be configured to measure electrical characteristics even when the IC is configured to perform one or more circuit operations in the field.

[0051] The measurement circuit can also measure the electrical characteristics between the first and second terminals of the IC at a second time different from the first time (92). The duration between the first and second times can be any period of time, such as from nanoseconds to days, weeks, etc.

[0052] The processing circuitry can compare the electrical characteristics measured at a first time with those measured at a second time (94). In some examples, the difference between the values ​​of the electrical characteristics can be approximated as zero, where "approximated as zero" means that these values ​​are the same within the measurement tolerance.

[0053] The processing circuitry can determine the health status of IC 150 based on comparisons (96) while IC 150 is performing one or more circuit operations. In some examples, a difference close to zero can provide a first indication of the health status of IC 150, such as IC 150 operating normally. In other examples, a difference between a first value and a second value exceeding a threshold can indicate an impending failure. In other examples, a change in value over time exceeding a variability threshold can also provide an indication of health status. According to one or more techniques of this disclosure, the techniques of this disclosure enable system designers to determine and apply multiple indicators for the health status of a device.

[0054] In one or more examples, the above functionality can be implemented in hardware, software, firmware, or any combination thereof. For example, Figures 1 to 6 The various components can be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functionality can be stored on a tangible computer-readable storage medium and executed by a processor or hardware-based processing unit.

[0055] Instructions can be executed by one or more processors, such as one or more digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other equivalent integrated or discrete logic circuit devices. Therefore, the term "processor" as used herein can refer to any of the foregoing structures or any other structure suitable for implementing the techniques described herein. Furthermore, the techniques can be implemented entirely within one or more circuit or logic elements.

[0056] The techniques disclosed herein can be implemented in a variety of devices or apparatuses, including wireless handheld devices, ICs, or IC sets (e.g., chipsets). Various components, modules, or units are described in this disclosure to emphasize functional aspects of a device configured to perform the disclosed techniques, but do not necessarily need to be implemented by different hardware units. Rather, as described above, various units can be combined within a hardware unit or provided by a collection of interoperable hardware units (including one or more processors as described above).

[0057] The technology disclosed herein can also be described in the following examples.

[0058] Example 1. A device comprising: an integrated circuit (IC) configured to perform one or more circuit operations, and a plurality of external terminals including a first terminal and a second terminal. The plurality of external terminals are configured to provide electrical connections to the IC and, while the IC is performing one or more circuit operations, to provide measurement of electrical characteristics between the first terminal and the second terminal, wherein the measured electrical characteristics indicate the state of health (SOH) of the device.

[0059] Example 2. The device according to Example 1, wherein the first terminal and the second terminal are each functional terminals configured to conduct electrical signals between one or more functional blocks of the IC while the IC is performing one or more circuit operations outside a test environment.

[0060] Example 3. The device according to any one of Examples 1-2 or any combination thereof, wherein the electrical characteristics determine one or more of voltage, current, impedance and temperature.

[0061] Example 4. The device according to any combination of Examples 1-3 further includes a measurement circuit, wherein the measurement circuit is configured to be electrically connected to the first terminal and the second terminal, wherein the measurement circuit is configured to measure an electrical characteristic, and wherein the device is configured to output a signal indicating the measured electrical characteristic while the IC is performing one or more circuit operations.

[0062] Example 5, the device according to any combination of Examples 1-4, further includes a processing circuit arrangement configured to: receive a signal indicating the value of an electrical characteristic from a measuring circuit when the IC performs one or more circuit operations; determine the State of Health (SOH) based on the measured electrical characteristic; and output a signal indicating the SOH.

[0063] Example 6. The device according to any combination of Examples 1-5, wherein the processing circuit means is configured to: receive a signal indicating a first value of an electrical characteristic from a measuring circuit at a first time; and receive a signal indicating a second value of an electrical characteristic from a measuring circuit at a second time, wherein the SOH includes the difference between the electrical characteristic at the first time and the electrical characteristic at the second time.

[0064] Example 7. The device according to any combination of Examples 1-6 further includes a sealant configured to seal the IC, such that a plurality of external terminals provide a single electrical connection to the IC.

[0065] Example 8. The device according to any combination of Examples 1-7, wherein the device is a circuit package including an IC and a plurality of external terminals.

[0066] Example 9. The device according to any combination of Examples 1-8, wherein the electrical characteristic is a first electrical characteristic, and the device further includes an internal terminal configured to provide a measurement of a second electrical characteristic between the first terminal and the second terminal, wherein the measured second electrical characteristic determines the amount of leakage between the first terminal and the internal terminal.

[0067] Example 10. The device according to any combination of Examples 1-9, wherein the SOH is based on a first leakage amount between the first terminal and the internal terminal at a first time and a second leakage amount between the first terminal and the internal terminal at a second time, the second time being different from the first time.

[0068] Example 11. The device according to any combination of Examples 1-10, wherein the device includes an IC and external terminals are defined by a lead frame coupled to the IC.

[0069] Example 12. The device according to any combination of Examples 1-11, wherein the SOH is based on a first impedance between a first terminal and a second terminal of the device at a first time and a second impedance between the first terminal and the second terminal of the device at a second time, the second time being different from the first time.

[0070] Example 13. The device according to any combination of Examples 1-12, wherein the impedance is an alternating current (AC) impedance.

[0071] Example 14. The device according to any combination of Examples 1-13 further includes an electrostatic discharge (ESD) diode coupled to a first terminal, wherein the electrical characteristic is impedance, and the device is configured to measure the impedance of the ESD diode by applying a reverse supply voltage.

[0072] Example 15. The device according to any combination of Examples 1-14, wherein the device is configured to measure impedance by running a test program triggered by a signal external to the device.

[0073] Example 16. The device according to any combination of Examples 1-15, wherein the SOH is based on the leakage between the first terminal and the second terminal.

[0074] Example 17. A method comprising: measuring, at a first time, an electrical characteristic between a first terminal and a second terminal of an integrated circuit (IC) by means of a measurement circuit. The first and second terminals are terminals of the IC configured to provide an electrical connection to the IC, and wherein the IC is configured to perform one or more circuit operations. The method further comprises, at a second time different from the first time, while the IC is performing one or more circuit operations, measuring, by means of the measurement circuit, the electrical characteristic between the first and second terminals of the IC; comparing the electrical characteristic measured at the first time with the electrical characteristic measured at the second time; and determining a state of health (SOH) of the IC based on the comparison.

[0075] Example 18. The method described in Example 17, wherein the measurement circuit is included in the IC.

[0076] Example 19. The method according to any combination of Examples 17-18, wherein the measured electrical characteristics determine one or more of voltage, current, impedance, and temperature.

[0077] Example 21. A system comprising: an integrated circuit (IC) device configured to perform one or more circuit operations, the IC device including a plurality of external terminals, the plurality of external terminals including a first terminal and a second terminal. The plurality of external terminals are configured to provide an electrical connection to the integrated circuit, and the first terminal of the plurality of terminals is configured to provide a measurement of an electrical characteristic between the first terminal and the second terminal while the IC is performing one or more circuit operations. The measured electrical characteristic indicates the state of health (SOH) of the device. The system further includes measuring circuitry configured to determine the electrical characteristic, wherein the electrical characteristic determines one or more of voltage, current, impedance, and temperature.

[0078] Example 22. The system according to Example 21, wherein the system further includes a processing circuit device configured to: determine an electrical characteristic at a first time; determine an electrical characteristic at a second time different from the first time; and determine the state of harmonics (SOH) based on the difference between the electrical characteristics measured at the first time and the second time.

[0079] Example 23. A system according to any combination of Examples 21 and 22, wherein the processing circuitry is located outside the IC.

[0080] Various examples of this disclosure have been described. These and other examples are within the scope of the appended claims.

Claims

1. A device for measuring electrical characteristics, comprising: A circuit is configured to perform one or more circuit operations; as well as The circuit includes a plurality of terminals, including a first terminal and a second terminal, wherein the plurality of terminals includes one or more external terminals configured to provide an electrical connection to the circuit. The first terminal of the plurality of terminals is one of the one or more external terminals and is configured to be electrically connected to the measurement circuit. The measurement circuit is configured to output a first signal at a first time, the first signal indicating a first value of the measured electrical characteristic between the first terminal and the second terminal while the circuit is performing the one or more circuit operations. The measurement circuit is configured to output a second signal at a second time, the second signal indicating a second value of the measured electrical characteristic between the first terminal and the second terminal, and The difference between the first and second values ​​of the measured electrical characteristics indicates the health status (SOH) of the device.

2. The device according to claim 1, Wherein the second terminal is another of the one or more external terminals; and The first terminal and the second terminal are each functional terminals configured to conduct electrical signals to one or more functional blocks of the circuit when the circuit is performing one or more circuit operations outside the test environment.

3. The device of claim 1, wherein the first signal and the second signal provide indications of one or more of the following: voltage, current, impedance, and temperature.

4. The device according to claim 1, wherein the circuit includes the measuring circuit.

5. The apparatus of claim 4, further comprising a processing circuit device, the processing circuit device being configured to: Receive a first signal indicating the first value of the electrical characteristic from the measuring circuit; Receive a second signal indicating the second value of the electrical characteristic from the measuring circuit; The SOH is determined based on the first and second values ​​of the measured electrical properties; as well as While the circuit is performing one or more circuit operations, a third signal indicating the SOH is output.

6. The device of claim 1, wherein the device is a circuit package including the circuit and the plurality of external terminals.

7. The device according to claim 1, The second terminal is an internal terminal; and The first and second values ​​of the measured electrical characteristics respectively determine the amount of leakage between the first terminal and the internal terminal at the first time and the second time.

8. The device of claim 1, wherein the device includes the circuit, and the external terminal is defined by a lead frame coupled to the circuit.

9. The device of claim 1, wherein the SOH is based on a first impedance between the first terminal and the second terminal of the device at a first time and a second impedance between the first terminal and the second terminal of the device at a second time, the second time being different from the first time.

10. The device of claim 9, wherein the first impedance is an alternating current (AC) impedance.

11. The device of claim 1, further comprising an electrostatic discharge (ESD) diode coupled to the first terminal, wherein the electrical characteristic is impedance, and the device is configured to measure the impedance of the ESD diode by applying a reverse supply voltage.

12. The device of claim 11, wherein the device is configured to measure the impedance by running a test procedure triggered by a signal external to the device.

13. The device of claim 1, wherein the SOH is based on the leakage amount between the first terminal and the second terminal.

14. A method for measuring electrical characteristics, comprising: At the first moment, the electrical characteristics between the first and second terminals of the circuit are measured using a measuring circuit. The first terminal and the second terminal are terminals of the circuit configured to provide an electrical connection to the circuit, and The circuit is configured to perform one or more circuit operations; At a second time different from the first time, the electrical characteristics between the first terminal and the second terminal of the circuit are measured by the measuring circuit. At the first time, the measurement circuit outputs a first signal indicating a first value of the electrical characteristic; At the second time, the measuring circuit outputs a second signal indicating a second value of the electrical characteristic; The first value of the electrical characteristic measured at the first time is compared with the second value of the electrical characteristic at the second time by the processing circuit device. as well as While the circuit is performing one or more circuit operations, the health status (SOH) of the circuit is determined by the processing circuit device and based on the comparison.

15. The method of claim 14, wherein the measurement circuit is included in the circuit.

16. The method of claim 14, wherein the first signal and the second signal provide an indication of one or more of the following: voltage, current, impedance, and temperature.

17. A system for measuring electrical characteristics, comprising: A circuit package configured to perform one or more circuit operations, the circuit package comprising: An integrated circuit includes one or more semiconductor components. A measuring circuit configured to determine the electrical characteristics, wherein the electrical characteristics determine one or more of voltage, current, impedance, and temperature; The circuit includes a plurality of terminals, including a first terminal and a second terminal, wherein the plurality of terminals includes one or more external terminals configured to provide an electrical connection to the circuit. The first terminal of the plurality of terminals is one of the one or more external terminals and is configured to be electrically connected to the measuring circuit. The measurement circuit is configured to output a first signal at a first time, the first signal indicating a first value of a measurement of the electrical characteristics between the first terminal and the second terminal while the circuit package is performing the one or more circuit operations. The measurement circuit is configured to output a second signal at a second time, the second signal indicating a second value of the measured electrical characteristic between the first terminal and the second terminal, and The difference between the first and second values ​​of the measured electrical characteristics indicates the state of health (SOH) of the circuit package.

18. The system of claim 17, further comprising a processing circuit device, the processing circuit device being configured to: Receive the first signal and the second signal; The electrical characteristics are determined at the first time. The electrical characteristics are determined at a second time, different from the first time; and The SOH is determined based on the difference between the first and second values ​​of the electrical properties measured at the first time and the second time.

19. The system of claim 18, wherein the processing circuitry is external to and separated from the circuit package.

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