digitizer

Abstract

The digitizer includes a flexible printed circuit film including a folding area that can be folded and unfolded, a plurality of first wirings disposed on a first face of the flexible printed circuit film and extending in a first direction, and a plurality of second wirings disposed on a second face of the flexible printed circuit film opposite the first face and extending in a second direction crossing the first direction, a through hole penetrating the flexible printed circuit film being formed in a grid area overlapping the folding area among a plurality of grid areas defined between the first wirings and the second wirings in a plane.

Description

Technical Field

[0001] This invention relates to a digitizer and a display device including the same. More specifically, this invention relates to a digitizer having a through-hole and a display device including the same. Background Technology

[0002] The display device may include at least one of a touch panel for sensing touches caused by a user's hand and a digitizer for sensing touches caused by an electromagnetic pen. The digitizer may operate in various modes, such as electromagnetic resonance (EMR), pressure-sensitive, or capacitive. In the case of electromagnetic resonance, touch coordinates can be identified through electromagnetic resonance between the digitizer and the electromagnetic pen.

[0003] Recently, there has been a growing demand for foldable display devices that can be folded and unfolded. Therefore, it is also necessary to apply the digitizer to such foldable display devices. Summary of the Invention

[0004] One object of the present invention is to provide a digitizer having through holes.

[0005] Another object of the present invention is to provide a display device including the digitizer.

[0006] However, the purpose of this invention is not limited to the above-described purpose, and various extensions can be made without departing from the spirit and scope of this invention.

[0007] To achieve the aforementioned objective of the present invention, an embodiment of the present invention relates to a digitizer that may include: a flexible printed circuit film including a foldable region capable of being folded and unfolded; a plurality of first wirings disposed on a first surface of the flexible printed circuit film and extending in a first direction; and a plurality of second wirings disposed on a second surface of the flexible printed circuit film opposite to the first surface and extending in a second direction intersecting the first direction, wherein a through hole is formed in a grid region that overlaps with the foldable region among a plurality of grid regions defined on a plane between the first wirings and the second wirings.

[0008] According to one embodiment, the through hole may have a quadrilateral shape on a plane.

[0009] According to one embodiment, the digitizer may further include: a first height difference compensation layer disposed on the first surface of the flexible printed circuit film and covering the through hole.

[0010] According to one embodiment, the digitizer may further include a filling component for filling the interior of the through hole.

[0011] According to one embodiment, the filling component may include at least one of polyurethane, thermoplastic polyurethane, latex, acrylic resin, polyurethane foam, and polystyrene foam.

[0012] According to one embodiment, the first height difference compensation layer may comprise the same material as the filling component.

[0013] According to one embodiment, the first height difference compensation layer may include an adhesive.

[0014] According to one embodiment, the adhesive may include at least one of optically transparent adhesive (OCA), optically transparent resin (OCR), and pressure-sensitive adhesive (PSA).

[0015] According to one embodiment, the first height difference compensation layer may also cover the first wiring.

[0016] According to one embodiment, the digitizer may further include a second height difference compensation layer disposed on the second surface of the flexible printed circuit film and covering the through hole.

[0017] According to one embodiment, the through hole may include: a first through hole having a U-shaped form on a plane; and a second through hole having a form symmetrical to the first through hole with respect to the center of the grid region.

[0018] To achieve other objectives of the present invention as described above, an embodiment of the present invention relates to a display device that may include: a substrate; a display panel including display structures disposed on the substrate; and a digitizer disposed on the lower portion of the display panel, the digitizer including: a flexible printed circuit film including a folding region capable of folding and unfolding; a plurality of first wirings disposed on the flexible printed circuit film and extending in a first direction; and a plurality of second wirings disposed on the lower portion of the flexible printed circuit film and extending in a second direction intersecting the first direction, wherein a through-hole is formed in a grid region that overlaps with the folding region among a plurality of grid regions defined on a plane between the first wirings and the second wirings.

[0019] According to one embodiment, the through hole may have a quadrilateral shape on a plane.

[0020] According to one embodiment, the digitizer may further include: a first height difference compensation layer disposed on a first surface of the flexible printed circuit film and covering the through hole.

[0021] According to one embodiment, the digitizer may further include a filling component for filling the interior of the through hole.

[0022] According to one embodiment, the first height difference compensation layer may comprise the same material as the filling component.

[0023] According to one embodiment, the first height difference compensation layer may include an adhesive.

[0024] According to one embodiment, the digitizer may further include a second height difference compensation layer disposed on the second surface of the flexible printed circuit film and covering the through hole.

[0025] According to one embodiment, the display device may further include a touch panel disposed on the display panel.

[0026] According to one embodiment, the display device may further include: a protective film disposed between the display panel and the digitizer; a buffer member disposed between the protective film and the digitizer; and a support member disposed at the lower part of the digitizer, wherein a plurality of gaps are formed in the support member that overlap with the folded area.

[0027] (Invention Effects)

[0028] The digitizers according to various embodiments of the present invention include a flexible printed circuit film penetrated by through-holes, thereby relatively weakening the repulsive force applied to the flexible printed circuit film. This allows for easy folding and unfolding of the flexible printed circuit film and suppresses warping, thereby improving the display quality of the display device including the digitizer.

[0029] Furthermore, the digitizer includes a first height difference compensation layer and a second height difference compensation layer that flatten the upper and lower surfaces of the digitizer, so that the user will not perceive the height difference caused by the through-hole. This further improves the display quality of the display device.

[0030] However, the effects of the present invention are not limited to those described above, and various extensions can be made without departing from the spirit and scope of the present invention. Attached Figure Description

[0031] Figure 1 This is a diagram illustrating a display device according to an embodiment of the present invention.

[0032] Figure 2 It is along Figure 1 A sectional view taken along line I-I'.

[0033] Figure 3 It means Figure 1 A plan view of an example of a digitizer included in a display device.

[0034] Figure 4 It is along Figure 3 A sectional view taken from line II-II'.

[0035] Figure 5 It is along Figure 3 A sectional view taken from line III-III'.

[0036] Figure 6 It is along Figure 3 A sectional view taken along line IV-IV'.

[0037] Figure 7 It means Figure 1 A plan view of other examples of digitizers included in the display device.

[0038] Figure 8 It is along Figure 7 A cross-sectional view taken by the V-V' line.

[0039] Figure 9 It is along Figure 7 A sectional view taken along line VI-VI'.

[0040] Figure 10 It means Figure 1 A plan view of another example of a digitizer included in a display device.

[0041] Figure 11 It is along Figure 10 A sectional view taken along line VII-VII'.

[0042] Figure 12 It is along Figure 10 A sectional view taken from line VIII-VIII'.

[0043] Figure 13 It means Figure 1 A plan view of another example of a digitizer included in a display device.

[0044] Figure 14 It means Figure 1 A plan view of another example of a digitizer included in a display device.

[0045] Symbol explanation:

[0046] 1000: Display device; 2000: Input component; 100, 110, 120, 130, 140: Digitizer; 200, 220, 230, 240: Flexible printed circuit film; 300: First wiring; 400: Second wiring; 310, 320, 330, 340, 350, 360: First to sixth upper wiring; 410, 420, 430, 440, 450, 460: First to sixth lower wiring; H: Through hole; H_1: First through hole; H_2: Second through hole; BRC: Bracket; MTL: Support component; CPN: Buffer component; PTF: Protective film; DPN: Display panel; TPN: Touch panel; WIN: Window. Detailed Implementation

[0047] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings, and repeated descriptions of the same constituent elements are omitted.

[0048] Figure 1 This is a diagram illustrating a display device according to an embodiment of the present invention. Figure 2 It is along Figure 1 A sectional view taken along line I-I'.

[0049] Reference Figure 1 and Figure 2 In one embodiment of the present invention, the display device 1000 can be divided into an effective area AA and an ineffective area NA. For example, as Figure 1 As shown, the display device 1000 can be divided into an effective area AA and an ineffective area NA surrounding the effective area AA on a plane. A digitizer 100 can be configured in the effective area AA. When a user brings an input component 2000 close to the effective area AA, the input component 2000 and the digitizer 100 can communicate with each other to perform various input functions. For example, the input component 2000 can be an electromagnetic pen.

[0050] Furthermore, the display device 1000 can be divided into a folded area FA and a flat area PA. For example, as Figure 1 As shown, the display device 1000 can be divided into the folded region FA and the flat region PA adjacent to the folded region FA. The flat region PA can be an area of ​​the display device 1000 that is not folded.

[0051] The folding area FA can be an area capable of folding and unfolding the display device 1000. The folding area FA and the effective area AA can overlap each other. Thus, when the user brings the input component 2000 close to the folding area FA, the input component 2000 and the digitizer 100 can also communicate with each other. When the display device 1000 is folded, the components of the display device 1000 that overlap with the folding area FA (e.g., the digitizer 100) can be folded together.

[0052] The display device 1000 may include the digitizer 100, buffer component CPN, protective film PTF, display panel DPN, touch panel TPN, window WIN, support component MTL, and bracket BRC.

[0053] The digitizer 100 can communicate with the input component 2000 to sense the proximity of the input component 2000. For this purpose, the digitizer 100 can be implemented using electromagnetic resonance (EMR), pressure-sensitive, capacitive, or a combination thereof. Furthermore, as a portion of the digitizer 100 overlaps with the folding area FA, the digitizer 100 can be folded together with the display device 1000 when it is folded. Figure 2 The illustration shows the digitizer 100 including the flexible printed circuit film 200, the first height difference compensation layer 600, and the second height difference compensation layer 700, which will be described in detail later.

[0054] The buffer component CPN can be disposed on the digitizer 100. The buffer component CPN can mitigate external impacts applied to the display panel DPN, thereby protecting the display panel DPN. For this purpose, the buffer component CPN may include a cushion, sponge, or other material that can contain air for cushioning. Furthermore, to facilitate the folding and unfolding of the display panel DPN, the buffer component CPN may include a flexible material. For example, the buffer component CPN may include polyacrylate resin, polyurethane, thermoplastic polyurethane (TPU), latex, polyurethane foam, polystyrene foam, etc.

[0055] The protective film PTF can be disposed on the buffer component CPN. The protective film PTF can prevent moisture and oxygen from penetrating from the outside and can absorb external impacts. To achieve a flexible display device, the display panel DPN may include a flexible plastic substrate SUB, and the protective film PTF can support the plastic substrate SUB.

[0056] Furthermore, the protective film PTF can overlap with the folded region FA. Therefore, the protective film PTF can prevent the plastic substrate SUB from deforming in the folded region FA.

[0057] For example, the protective film PTF can be a plastic film. For example, the protective film PTF may include polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyarylate (PAR), polycarbonate (PC), poly(arylene ethersulfone), polyethylene terephthalate (PET), polyimide (PI), etc.

[0058] The display panel DPN may include the plastic substrate SUB and a plurality of display structures DS disposed on the plastic substrate SUB. The plastic substrate SUB may be in contact with the protective film PTF. Each of the plurality of display structures DS may include a plurality of transistors and a light-emitting element disposed on the transistor. In one embodiment, the light-emitting element may be an organic light-emitting diode (OLED). For example, the transistor may supply a driving current to the OLED, and the OLED may receive the supply of the driving current and emit light.

[0059] The touch panel TPN can be configured on the display panel DPN. In one embodiment, the touch panel TPN can sense touch caused by a user's hand. For this purpose, the touch panel TPN can be implemented using pressure-sensitive, resistive film, capacitive, infrared, ultrasonic, or combinations thereof. For example, the touch panel TPN may include multiple transmitting electrodes and multiple receiving electrodes, capable of detecting changes in capacitance within the touch panel TPN caused by the user's touch, thereby sensing the user's touch.

[0060] The window WIN can be disposed on the touch panel TPN. The window WIN can form the front surface of the display device 1000 and can protect the display panel DPN and the touch panel TPN. In order to realize the foldable display device 1000, the window WIN can include polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), etc.

[0061] The support member MTL can be disposed at the lower part of the digitizer 100. The support member MTL can support the display panel DPN. For this purpose, the support member MTL can include a rigid material. For example, the support member MTL can include metals such as invar (Ni) alloy, stainless steel (SUS), titanium (Ti), and copper (Cu).

[0062] Additionally, the support member MTL may include multiple slits SLT that overlap with the folding area FA. The support member MTL, including the slits SLT, allows the display panel DPN to be easily and repeatedly folded and unfolded. Furthermore, the slits SLT overlapping the folding area FA prevent wrinkles from forming on the upper surface of the window portion WIN that overlaps with the folding area FA.

[0063] The bracket BRC can be disposed on the lower surface of the support member MTL. The bracket BRC can be disposed at the bottommost part of the display device 1000, thereby protecting the display device 1000. For this purpose, the bracket BRC can also cover the side of the display device 1000. Additionally, the bracket BRC may include an opening that overlaps with the folding area FA.

[0064] Figure 3 It means Figure 1 A plan view of an example of a digitizer included in a display device. Figure 4 It is along Figure 3A sectional view taken from line II-II'. Figure 5 It is along Figure 3 A sectional view taken from line III-III'. Figure 6 It is along Figure 3 A sectional view taken along line IV-IV'.

[0065] Reference Figure 1 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The digitizer 100 may include a flexible printed circuit film 200, a first wiring 300, a second wiring 400, a filling component 500, a first height difference compensation layer 600, and a second height difference compensation layer 700.

[0066] The flexible printed circuit film 200 may include an insulating material. For example, the flexible printed circuit film 200 may include polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyarylate (PAR), polycarbonate (PC), poly(arylene ethersulfone), polyethylene terephthalate (PET), polyimide (PI), etc. The flexible printed circuit film 200 can prevent direct contact between the first wiring 300 and the second wiring 400.

[0067] In one embodiment, the flexible printed circuit film 200 may include the folded region FA. For example, the flexible printed circuit film 200 may repeatedly fold and unfold in the folded region FA.

[0068] The first wiring 300 may be disposed on a first surface (e.g., the upper surface) of the flexible printed circuit film 200. For example, the first wiring 300 may include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. For example, the first wiring 300 may include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), copper (Cu), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), tungsten (W), and tungsten nitride (WN). x ), titanium nitride (TiN) x ), tantalum nitride (TaN) x ), Ruthenium-Strontium oxide (SrRu) x O y ), zinc oxide (ZnO) x Indium tin oxide (ITO), tin oxide (SnO) x Indium oxide (InO) x Gallium oxide (GaO) x At least one of indium zinc oxide (IZO) and their alloys.

[0069] In one embodiment, the first wiring 300 may include a first upper wiring 310, a second upper wiring 320, a third upper wiring 330, a fourth upper wiring 340, a fifth upper wiring 350, and a sixth upper wiring 360. The first upper wiring 310 to the sixth upper wiring 360 may extend in a first direction D1 and be spaced apart in a second direction D2 intersecting the first direction D1. Additionally, as... Figure 3 As shown, the first upper wiring 310 and the sixth upper wiring 360 may overlap with the flat region PA, and the second upper wiring 320 to the fifth upper wiring 350 may overlap with the folded region FA.

[0070] For example, the first upper wiring 310 to the sixth upper wiring 360 can be formed by etching the conductive plate after forming a conductive plate including any of the above-described conductive materials on the flexible printed circuit film 200.

[0071] The second wiring 400 may be disposed on a second side (e.g., the lower surface) of the flexible printed circuit film 200 opposite to the first side. For example, the second wiring 400 may include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, etc.

[0072] In one embodiment, the second wiring 400 may include a first lower wiring 410, a second lower wiring 420, a third lower wiring 430, a fourth lower wiring 440, a fifth lower wiring 450, and a sixth lower wiring 460. The first lower wiring 410 to the sixth lower wiring 460 may extend in the second direction D2 and be spaced apart in the first direction D1. Additionally, as... Figure 3 As shown, a portion of each of the first lower wiring 410 to the sixth lower wiring 460 may overlap with the folded region FA, and the remaining portion may overlap with the flat region PA.

[0073] For example, the first lower wiring 410 to the sixth lower wiring 460 can be formed by etching the conductive plate after forming a conductive plate including any of the above-described conductive materials on the lower part of the flexible printed circuit film 200.

[0074] In one embodiment, the flexible printed circuit film 200 may define a plurality of grid regions, each grid region being defined on a plane between the first wiring 300 extending along the first direction D1 and the second wiring 400 extending along the second direction D2. For example, as Figure 3 As shown, any one of the plurality of grid regions MA can be defined by the first upper wiring 310, the second upper wiring 320, the first lower wiring 410, and the second lower wiring 420. Thus, a portion of the plurality of grid regions can overlap with the folded region FA, and the remaining portion of the plurality of grid regions can overlap with the flat region PA.

[0075] In one embodiment, a through-hole H can be formed in the grid region that overlaps with the folded region FA among the plurality of grid regions, penetrating the flexible printed circuit film 200. For example, the through-hole H can be formed in each of all grid regions that overlap with the folded region FA.

[0076] In one embodiment, such as Figure 3 As shown, the through-hole H can have a quadrilateral shape on a plane. For example, the through-hole H can be formed by irradiating the flexible printed circuit film 200 with a laser.

[0077] The digitizer 100, through the flexible printed circuit film 200 including the through hole H, can be easily folded and unfolded, thereby improving the display quality of the display device 1000.

[0078] Specifically, when a flexible printed circuit film without the through-hole H is folded by an external force, a repulsive force acting in the opposite direction to the external force may be applied to the flexible printed circuit film. Due to this repulsive force, folding and unfolding the flexible printed circuit film may not be easy. Furthermore, the flexible printed circuit film overlapping the folded area FA may warp, and the resulting pattern may be visible to the user through the window WIN.

[0079] However, for the flexible printed circuit film 200 with the through-hole H formed therein, the repulsive force can be applied relatively weakly. Therefore, folding and unfolding of the flexible printed circuit film 200 can be easily performed, and the display quality of the display device 1000 can be improved by suppressing the warping phenomenon.

[0080] In one embodiment, the filling member 500 may be used to fill the interior of the through hole H. For example, the filling member 500 may include a material for reducing the repulsive force. In one embodiment, the filling member 500 may include the same material as the buffer member CPN. For example, the filling member 500 may include polyacrylate resin, polyurethane, thermoplastic polyurethane (TPU), latex, polyurethane foam, polystyrene foam, etc.

[0081] The first height difference compensation layer 600 can be disposed on the first surface of the flexible printed circuit film 200, and can cover the through hole H. Additionally, the first height difference compensation layer 600 can also cover the first wiring 300. Thus, the first height difference compensation layer 600 can compensate for the height difference of the first surface caused by the through hole H and the first wiring 300. In other words, the first height difference compensation layer 600 can cover the through hole H and the first wiring 300, and can have a substantially flat upper surface.

[0082] The second height difference compensation layer 700 can be disposed on the second surface of the flexible printed circuit film 200, and can cover the through hole H. Additionally, the second height difference compensation layer 700 can also cover the second wiring 400. Thus, the second height difference compensation layer 700 can compensate for the height difference of the second surface caused by the through hole H and the second wiring 400. In other words, the second height difference compensation layer 700 can cover the through hole H and the second wiring 400, and can have a substantially flat lower surface.

[0083] In one embodiment, the first height difference compensation layer 600 and the second height difference compensation layer 700 may each comprise the same material as the filling member 500. For example, the filling member 500, the first height difference compensation layer 600, and the second height difference compensation layer 700 may be formed integrally.

[0084] The digitizer 100, by including a first height difference compensation layer 600 and a second height difference compensation layer 700 that flatten the upper and lower surfaces of the digitizer 100, prevents the pattern caused by the through-hole H, the first wiring 300, and the second wiring 400 from being recognized by the user through the window WIN. This further improves the display quality of the display device 1000.

[0085] like Figure 6 As shown, the first wiring 300 can be disposed on the first surface of the flexible printed circuit film 200, and the second wiring 400 can be disposed on the second surface. Through the flexible printed circuit film 200, the first wiring 300 and the second wiring 400 do not need to be in direct contact.

[0086] The input component 2000 may include a resonant circuit with a capacitor and a coil. For example, a magnetic or electromagnetic field radiated from the input component 2000 can affect the capacitance formed between the first wiring 300 and the second wiring 400. Thus, the digitizer 100 can sense where the input component 2000 is located. Additionally, the digitizer 100 can generate a magnetic or electromagnetic field by inputting current to the first wiring 300 and the second wiring 400. The magnetic or electromagnetic field radiated from the digitizer 100 can affect the input component 2000. Therefore, the digitizer 100 and the input component 2000 can communicate with each other to perform various input functions.

[0087] Figure 7 It means Figure 1 A plan view of other examples of digitizers included in the display device. Figure 8 It is along Figure 7 A cross-sectional view taken by the V-V' line. Figure 9 It is along Figure 7 A sectional view taken along line VI-VI'.

[0088] Reference Figure 1 , Figure 7 , Figure 8 and Figure 9The digitizer 110 may include a flexible printed circuit film 200, a first wiring 300, a second wiring 400, a filling component 500, a first height difference compensation layer 610, and a second height difference compensation layer 710. However, the digitizer 110 is substantially the same as the digitizer 100 described above, except for the first height difference compensation layer 610 and the second height difference compensation layer 710. Therefore, the first height difference compensation layer 610 and the second height difference compensation layer 710 will be described below.

[0089] In one embodiment, the first height difference compensation layer 610 and the second height difference compensation layer 710 may each include an adhesive. For example, the adhesive may include at least one of optically clear adhesive (OCA), optically clear resin (OCR), and pressure-sensitive adhesive (PSA). In other words, the filler component 500 may include thermoplastic polyurethane (TPU), and the first height difference compensation layer 610 and the second height difference compensation layer 710 may each include a pressure-sensitive adhesive (PSA). This improves the adhesion of the digitizer 110 and enhances the reliability of the display device 1000.

[0090] Figure 10 It means Figure 1 A plan view of another example of a digitizer included in a display device. Figure 11 It is along Figure 10 A sectional view taken from line VII-VII'. Figure 12 It is along Figure 10 A sectional view taken from line VIII-VIII'.

[0091] Reference Figure 1 , Figure 10 , Figure 11 and Figure 12 The digitizer 120 may include a flexible printed circuit film 220, a first wiring 300, and a second wiring 400. The first wiring 300 and the second wiring 400 of the digitizer 120 are substantially the same as the first wiring 300 and the second wiring 400 of the digitizer 100 described above, and therefore the following description is omitted.

[0092] In one embodiment, a first through-hole H_1 and a second through-hole H_2 penetrating the flexible printed circuit film 220 can be formed in the grid region that overlaps with the folded region FA among the plurality of grid regions. For example, the first through-hole H_1 and the second through-hole H_2 can be formed in all grid regions that overlap with the folded region FA, respectively. For example, as Figure 10As shown, the first through hole H_1 can have a U-shaped shape on the plane, and the second through hole H_2 can have a shape that is symmetrical to the first through hole H_1 with the center of the grid region as the reference.

[0093] The areas of the first through-hole H_1 and the second through-hole H_2 of the digitizer 120 can be made smaller than the area of ​​the through-hole H of the digitizer 100, which has a quadrilateral shape on the plane. Therefore, the digitizer 120 may not include the filling member 500, the first height difference compensation layer 600, and the second height difference compensation layer 700 of the digitizer 100. Thus, the efficiency of the manufacturing process for the digitizer 120 can be improved.

[0094] Figure 13 It means Figure 1 A plan view of another example of a digitizer included in a display device.

[0095] Reference Figure 1 and Figure 13 The digitizer 130 may include a flexible printed circuit film 230, a first wiring 300, and a second wiring 400. The first wiring 300 and the second wiring 400 of the digitizer 130 are substantially the same as the first wiring 300 and the second wiring 400 of the digitizer 100 described above, and therefore the following description is omitted.

[0096] In one embodiment, a first through-hole H_1 and a second through-hole H_2 penetrating the flexible printed circuit film 230 can be formed in the grid region that overlaps with the folded region FA among the plurality of grid regions. For example, the first through-hole H_1 and the second through-hole H_2 can be formed in all grid regions that overlap with the folded region FA, respectively. For example, as Figure 13 As shown, the first through hole H_1 can have the shape of "ㄈ (Korean character)" on the plane, and the second through hole H_2 can have a shape that is symmetrical to the first through hole H_1 with the center of the grid area as the reference.

[0097] The areas of the first through-hole H_1 and the second through-hole H_2 of the digitizer 130 can be made smaller than the area of ​​the through-hole H of the digitizer 100, which has a quadrilateral shape on the plane. Therefore, the digitizer 130 may not include the filling member 500, the first height difference compensation layer 600, and the second height difference compensation layer 700 of the digitizer 100. Thus, the efficiency of the manufacturing process for the digitizer 130 can be improved.

[0098] Figure 14It means Figure 1 A plan view of another example of a digitizer included in a display device.

[0099] Reference Figure 1 and Figure 14 The digitizer 140 may include a flexible printed circuit film 240, a first wiring 300, and a second wiring 400. The first wiring 300 and the second wiring 400 of the digitizer 140 are substantially the same as the first wiring 300 and the second wiring 400 of the digitizer 100 described above, and therefore the following description is omitted.

[0100] In one embodiment, the grid regions overlapping the folded region FA among the plurality of grid regions can form through-holes H penetrating the flexible printed circuit film 240. For example, the through-holes H can be formed in all grid regions overlapping the folded region FA. For example, as... Figure 14 As shown, the through hole H can have the shape of the character "ㄈ" (Korean character) on the plane.

[0101] The area of ​​the through-hole H in the digitizer 140 can be made smaller than the area of ​​the through-hole H in the digitizer 100, which has a quadrilateral shape on the plane. Therefore, the digitizer 140 may not include the filling member 500, the first height difference compensation layer 600, and the second height difference compensation layer 700 of the digitizer 100. This improves the efficiency of the manufacturing process for the digitizer 140.

[0102] The digitizers according to various embodiments of the present invention include a flexible printed circuit film penetrated by through-holes, thereby relatively weakening the repulsive force applied to the flexible printed circuit film. This allows for easy folding and unfolding of the flexible printed circuit film and suppresses warping, thus improving the display quality of the display device including the digitizer. Furthermore, the digitizer includes a first height difference compensation layer and a second height difference compensation layer that flatten the upper and lower surfaces of the digitizer, so that the height difference caused by the through-holes is not perceptible to the user. This further improves the display quality of the display device.

[0103] (Industry availability)

[0104] This invention is applicable to display devices and electronic devices including them. For example, it is applicable to high-resolution smartphones, mobile phones, smart tablets, smartwatches, desktop PCs, vehicle navigation systems, televisions, computer displays, laptops, etc.

[0105] The invention has been described above with reference to exemplary embodiments thereof. However, those skilled in the art should understand that various modifications and alterations can be made to the invention without departing from the spirit and scope of the invention as set forth in the claims.

Claims

1. A digitizer, characterized in that, include: Flexible printed circuit film, including foldable foldable areas; A plurality of first wirings are disposed on a first surface of the flexible printed circuit film and extend in a first direction; as well as Multiple second wirings are disposed on a second surface of the flexible printed circuit film opposite to the first surface and extend in a second direction intersecting the first direction. Through holes are formed in a grid region that overlaps with the folded region among a plurality of grid regions defined on the plane between the first wiring and the second wiring.

2. The digitizer according to claim 1, characterized in that, The through hole has a quadrilateral shape on the plane.

3. The digitizer according to claim 1, characterized in that, Also includes: A first height difference compensation layer is disposed on the first surface of the flexible printed circuit film and covers the through hole.

4. The digitizer according to claim 3, characterized in that, Also includes: A filling component is used to fill the interior of the through hole.

5. The digitizer according to claim 4, characterized in that, The filling component includes at least one of polyurethane, latex, acrylic resin, and polystyrene foam.

6. The digitizer according to claim 5, characterized in that, The polyurethane includes at least one of thermoplastic polyurethane and polyurethane foam.

7. The digitizer according to claim 4, characterized in that, The first height difference compensation layer comprises the same material as the filling component.

8. The digitizer according to claim 3, characterized in that, The first height difference compensation layer includes an adhesive.

9. The digitizer according to claim 8, characterized in that, The adhesive includes at least one of optically transparent adhesives, optically transparent resins, and pressure-sensitive adhesives.

10. The digitizer according to claim 3, characterized in that, The first height difference compensation layer also covers the first wiring.

11. The digitizer according to claim 3, characterized in that, Also includes: A second height difference compensation layer is disposed on the second surface of the flexible printed circuit film and covers the through hole.

12. The digitizer according to claim 1, characterized in that, The through hole includes: The first through hole has a U-shaped form on the plane; and The second through hole has a shape that is symmetrical to the first through hole with respect to the center of the grid region.

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