Capacitor module and electronic device including the same

Abstract

A capacitor module and an electronic device are provided. The capacitor module is configured to be mounted horizontally on a PCB, and includes: a housing including a first side surface, an opposite second side surface, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface; and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad, and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from the second electrode pad in a second horizontal direction.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0052095, filed on April 29, 2020, and Korean Patent Application No. 10-2020-0154402, filed on November 18, 2020, the common subject matter of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present invention generally relate to capacitor modules and electronic devices including such capacitor modules. More specifically, embodiments of the present invention relate to horizontally mounted capacitor modules that provide improved integration density and electronic devices including such capacitor modules. Background Technology

[0004] Electronic devices that include one or more semiconductor chips or packages typically comprise electronic circuitry that includes various components that collectively provide multiple functions. In many electronic devices, these components are mounted on a printed circuit board (PCB). For example, to implement a semiconductor device such as a solid-state drive (SSD), various components such as controllers, flash memory, buffer memory, input / output (I / O) ports, electrolytic capacitors, etc., can be mounted on a PCB.

[0005] The overall size of an electronic device is determined by the various geometric dimensions (e.g., height, width, length) of its constituent components and the minimum spacing requirements between them. Some components of a semiconductor device may have predetermined dimensions defined by certain functions and / or physical characteristics. For example, electrolytic capacitors may be used in some semiconductor devices to accumulate a desired level of charge. Here, the physical dimensions of the electrolytic capacitor will correspond to the amount of capacitance expected in the electrolytic capacitor. Therefore, the size of the electrolytic capacitor may be difficult to reduce due to the maximum capacitance requirements (or specifications) required by the associated circuitry or function. As a result, the integration density (e.g., compactness) of a component assembly including one or more electrolytic capacitors may be limited. Summary of the Invention

[0006] Embodiments of the present invention provide horizontally mounted capacitor modules that can improve the integration of components within electronic devices.

[0007] According to an embodiment, a capacitor module includes: a housing horizontally mounted on a printed circuit board (PCB), the PCB having a main surface extending horizontally in a first direction and a second direction perpendicular to the first direction, the housing including a first side surface, a second side surface opposite to the first side surface, a first electrode pad and a second electrode pad disposed on the first side surface, and a third electrode pad disposed on the second side surface; and an electrolytic capacitor including a dielectric extending in the first direction, a first electrode electrically connected to the first electrode pad, and a second electrode electrically connected to the second electrode pad, wherein the second electrode pad is spaced apart from the first electrode pad in the second direction.

[0008] According to an embodiment, an electronic device includes: a printed circuit board (PCB) having a main surface extending horizontally in a first direction and a second direction perpendicular to the first direction, and including a mounting area, a first contact terminal, a second contact terminal, and a third contact terminal; a housing configured to be at least partially mounted horizontally on the PCB within the mounting area, and including a first side surface, a second side surface opposite to the first side surface, a first electrode pad and a second electrode pad disposed on the first side surface, and a third electrode pad disposed on the second side surface; and an electrolytic capacitor including a dielectric extending in the first direction, a first electrode, and a second electrode spaced apart from the first electrode in the second direction, wherein the electrolytic capacitor is mounted on the housing by connecting the first electrode to the first electrode pad and the second electrode to the second electrode pad, and the housing is horizontally mounted within the mounting area of ​​the PCB by connecting the first electrode pad to the first contact terminal, the second electrode pad to the second contact terminal, and the third electrode pad to the third contact terminal.

[0009] According to an embodiment, a capacitor module is configured to be horizontally mounted on a printed circuit board (PCB), the PCB having an upper surface and a lower surface extending horizontally in a first direction and a second direction perpendicular to the first direction. The capacitor module includes: a housing comprising a frame, a first side surface, a second side surface opposite to the first side surface, a third side surface connecting the first side surface and the second side surface, a first electrode pad and a second electrode pad disposed on the first side surface, and a third electrode pad disposed on the third side surface; and a cylindrical electrolytic capacitor comprising a dielectric extending in the first direction, a first electrode contacting the first electrode pad, and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from the second electrode pad in the second direction, and the frame substantially surrounds the side surface of the cylindrical electrolytic capacitor. Attached Figure Description

[0010] The above and other objects and features of the inventive concept can be readily understood by considering the following detailed description and the accompanying drawings, in which:

[0011] Figure 1 This is a perspective view illustrating an electronic device according to an embodiment of the concept of the present invention;

[0012] Figure 2 yes Figure 1 Side view;

[0013] Figure 3A , Figure 3B , Figure 3C and Figure 4 These are views showing different conventional comparative examples of electronic devices, including electrolytic capacitors mounted vertically on a PCB.

[0014] Figure 5 This is a view illustrating an electronic device including a capacitor module according to an embodiment of the present invention;

[0015] Figure 6A It is to further demonstrate Figure 5 Conceptual diagrams of electronic devices, and Figure 6B It is to further demonstrate Figure 5 An exploded perspective view of an electronic device;

[0016] Figure 6C This is a cross-sectional view further illustrating the contact surface of a capacitor module according to an embodiment of the present invention;

[0017] Figure 7A , Figure 7B , Figure 7C , Figure 8A , Figure 8B and Figure 8C These are views showing different embodiments of an electronic device according to the concept of the present invention;

[0018] Figure 9A This is a plan view (or top view) of an electronic device including a capacitor module according to an embodiment of the present invention;

[0019] Figure 9B yes Figure 9A A reverse view of the electronic device; and

[0020] Figure 10 This is a perspective view illustrating an electronic device including an electronic device according to an embodiment of the concept of the present invention. Detailed Implementation

[0021] Embodiments of the inventive concept will now be described in more detail with reference to the accompanying drawings. Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. Terms as defined in a general dictionary should be interpreted as having the same meaning in the context of the relevant technical field and should not be interpreted as having an ideal or overly formal meaning, unless expressly defined in this specification.

[0022] Throughout the written description and accompanying drawings, the same reference numerals and labels are used to denote the same or similar elements and / or features. Throughout the written description, certain geometric terms may be used to emphasize the relative relationships between elements, parts, and / or features with respect to certain embodiments of the inventive concept. Those skilled in the art will recognize that such geometric terms are inherently relative and arbitrary in describing relationships and / or aspects of the illustrated embodiments. Geometric terms may include, for example: height / width; vertical / horizontal; top / bottom; higher / lower; closer / farther; thicker / thinner; adjacent / away; above / below; below / over; up / down; center / side; around; superimposed / bottom; etc.

[0023] In all the accompanying drawings, first, second, and third directions (D1, D2, and D3) are shown. Assuming that in any arbitrarily defined set of axes, the first direction D1 can be understood as a first horizontal direction in which the capacitor module primarily extends; the second direction D2 can be understood as a second horizontal direction substantially perpendicular to the first direction D1; and the third direction D3 can be understood as a direction perpendicular to the plane defined by the first direction D1 and the second direction D2. Here, the plane defined by the first direction D1 and the second direction D2 can extend substantially parallel to the main surface of the printed circuit board (PCB), while the third direction D3 can be the direction in which the electrode pads of the capacitor module connect to the contact terminals of the PCB.

[0024] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present invention, shown in the relevant section. (Refer to...) Figure 1 The electronic device may include a PCB and a capacitor module 100 mounted on the PCB. In some embodiments, the electronic device may be a circuit including various electronic components, such as a solid-state drive (SSD), a motherboard, etc.

[0025] The capacitor module 100 can be electrically connected to one or more circuits or modules of an electronic device via a PCB. For example, assuming the electronic device is an SSD, the capacitor module 100 can be electrically connected to a controller, buffer memory, flash memory, I / O ports, etc. via a PCB.

[0026] Capacitor module 100 typically includes an electrolytic capacitor 110 and a housing 120. As those skilled in the art will understand, the electrolytic capacitor 110 will include an anode and a cathode and can be used (e.g., charged and discharged) to store / provide electrical energy. In some embodiments, the electrolytic capacitor 110 may be an aluminum (Al) electrolytic capacitor. In this respect, the electrolytic capacitor 110 will include a dielectric. For example, the dielectric of the electrolytic capacitor 110 may include an aluminum film disposed within a cylindrical metal housing and extending in a first direction D1. In this example, the dielectric of the electrolytic capacitor 110 may use an alumina film formed on the surface of the aluminum film to store electrical energy.

[0027] The housing 120 can be used to mechanically "mount" (e.g., attach, join, mechanically connect, mechanically contact, and / or electrically connect) the electrolytic capacitor 110. In this respect, the housing 120 can protect the electrolytic capacitor 110 from environmental factors and physical shocks. In some embodiments, the housing 120 is physically fixed to the electrolytic capacitor 110. The housing 120 may include electrode pads for mounting the anode and cathode of the electrolytic capacitor 110, respectively.

[0028] exist Figure 1 and Figure 2 In the electrolytic capacitor 110, the housing 120 includes a first electrode pad 121a, a second electrode pad 121b, and a frame 122. The first electrode pad 121a can be mounted (e.g., mechanically connected and / or electrically connected) to one of the anode and cathode of the electrolytic capacitor 110. The second electrode pad 121b can be mounted to the other of the anode and cathode of the electrolytic capacitor 110. The frame 122 can substantially surround at least a portion of the electrolytic capacitor 110.

[0029] In some embodiments, the first electrode pad 121a and the second electrode pad 121b can mechanically support the capacitor module 100 mounted on the PCB and can stably fix the capacitor module 100 mounted on the PCB. Additionally, the first electrode pad 121a and the second electrode pad 121b can provide electrical connection paths for sending electrical energy to / receiving electrical energy from the anode and cathode of the electrolytic capacitor 110.

[0030] In some embodiments, the capacitor module 100 can be electrically connected to the PCB via the first electrode pad 121a and the second electrode pad 121b. The capacitor module 100 can send electrical energy to or receive electrical energy from a device electrically connected to (or connected via) the PCB or another component mounted on the PCB. That is, the electrolytic capacitor 110 can be charged or discharged via the first electrode pad 121a and the second electrode pad 121b.

[0031] In some embodiments, the housing 120 may further include at least one electrode pad for mechanically connecting (or securing) the capacitor module 100 to the PCB. For example, the housing 120 may also include at least one dummy electrode pad for mechanically supporting the capacitor module 100 on the PCB. Figure 1 (Not shown in the image). Refer to... Figure 5 An example of a capacitor module including at least one dummy electrode pad is described in more detail.

[0032] In some embodiments, the capacitor module 100 can be mounted on a PCB using an automated manufacturing process such as surface mount technology (SMT). That is, this type of automated manufacturing process can be used to mount the electrode pads 121a and 121b of the housing 120 of the capacitor module 100 onto the PCB. Therefore, since automated manufacturing processes can be used to manufacture electronic devices including the capacitor module 100, the defect rate associated with the electronic device can be reduced, and the productivity of the electronic device can be increased compared to non-automated assembly processes (e.g., manual soldering).

[0033] In some embodiments, the electronic device may be an SSD that meets the Low-Profile PCIexpress (PCIe) standard. That is, the electrolytic capacitor 110 may be a power supply unit configured to provide electrical power (i.e., capacitive charge) that meets the Low-Profile PCIe standard. Other electronic components typically associated with a Low-Profile PCIe design may be mounted on a PCB.

[0034] Electrolytic capacitor 110 can have a size consistent with the overall design of the electronic device and its intended function. As an example, assuming electrolytic capacitor 110 is an aluminum electrolytic capacitor, it can have a relatively large size compared to other capacitor types (e.g., multilayer ceramic capacitors, tantalum capacitors, etc.), but can be manufactured at a lower cost than other capacitor types. Therefore, electrolytic capacitor 110 can have the limited volume necessary to accumulate the charge corresponding to the desired capacitance.

[0035] Embodiments of the present invention provide a method for reducing wasted installation space, which is typically associated with conventional methods of mounting electrolytic capacitors. For example, Figure 1 The electrolytic capacitor 110 can be mounted horizontally on the PCB to minimize wasted mounting space.

[0036] In contrast, electrolytic capacitors are typically mounted on the PCB surface in a perpendicular orthogonal orientation using conventional methods. That is, using the nomenclature established above, electrolytic capacitors are conventionally mounted on the PCB in a third direction, D3. Unfortunately, because conventionally mounted electrolytic capacitors protrude upwards from the PCB, the physical volume required to house the PCB within the electronic device is very large due to the size and position of the capacitors. This results in a considerable amount of wasted mounting space.

[0037] In stark contrast, such as Figure 1 As shown, some embodiments of the present invention may include a capacitor module 100 comprising an electrolytic capacitor 110 horizontally mounted on a PCB. This configuration reduces wasted mounting space typically associated with a PCB (e.g., space vertically above the horizontal upper surface of the PCB, and / or space vertically below the horizontal lower surface of the PCB). This results in an electronic device integrated with the PCB having a reduced vertical profile (or height), thereby improving the integration of the electronic device.

[0038] Figure 2 It is to further demonstrate Figure 1 A side view of the electronic device (e.g., viewed from the first direction D1). Here, the capacitor module 100 can be mounted on the PCB on a plane substantially the same as the main surfaces (i.e., the upper and lower surfaces) of the PCB. For example, the capacitor module 100 can be mounted to substantially overlap with a portion of the PCB, such that the capacitor module 100 occupies space both below and above the PCB, as measured in the third direction D3.

[0039] Therefore, unlike conventionally mounted and vertically oriented electrolytic capacitors, Figure 2The capacitor module 100 shares a vertical space with the PCB, which has a first height L1 corresponding to the thickness of the PCB (measured in the third direction D3). Furthermore, the frame 122 of the housing 120 of the capacitor module 100 can extend vertically above the PCB to a second height L2, and the body of the electrolytic capacitor 110 of the capacitor module 100 (e.g., having a cylindrical radius) can extend vertically below the PCB to a third height L3.

[0040] In some embodiments, the first height L1 may be approximately 1.0 mm, the second height L2 may be approximately 1.7 mm, and the third height L3 may be approximately 2.6 mm. However, the scope of the invention is not limited thereto, and the first height L1, the second height L2, and the third height L3 may vary depending on, for example, design, intended use, specification requirements, the number of components mounted on the PCB, etc.

[0041] Figure 3A , Figure 3B and Figure 3C These are views showing different conventional comparative examples of electronic devices that include electrolytic capacitors mounted vertically on a PCB.

[0042] Reference Figure 3A The electronic device may include an electrolytic capacitor 10 mounted vertically on a PCB. In this case, the vertical space relative to the PCB, equal to the height of the electrolytic capacitor 10 (e.g., a cylinder), may become wasted mounting space, thereby increasing the overall physical size of the electronic device and reducing its integration.

[0043] Reference Figure 3B The electronic device includes an electrolytic capacitor 20 vertically mounted on a PCB. Here, the electrolytic capacitor 20 may include a first electrode 21a, a second electrode 21b, and a dielectric 22. One of the first electrode 21a and the second electrode 21b may be an anode, and the other may be a cathode. The dielectric 22 may be a medium capable of storing electrical energy.

[0044] exist Figure 3B In the illustrated example, the first electrode 21a and the second electrode 21b of the electrolytic capacitor 20 can be connected to the PCB using a soldering process. As a result, the PCB including the electrolytic capacitor 20 may suffer from a relatively high defect rate and low productivity compared to embodiments of the inventive concept that use automated manufacturing processes.

[0045] Reference Figure 3CThe electronic device includes a plurality of tantalum capacitors 30 mounted on a PCB. Here, the tantalum capacitors 30 are mounted vertically on the PCB, so that vertical space at least equal to the height of the tantalum capacitors 30 may become wasted mounting space relative to the upper (or lower) surface of the PCB on which the tantalum capacitors 30 are mounted.

[0046] exist Figure 4 The conceptual diagram further illustrates the aforementioned conventional results. Here, a PCB, an electrolytic capacitor 10, and electronic devices mounted on the PCB are shown.

[0047] Each electrolytic capacitor 10 may include a first electrode 11a and a second electrode 11b. Surface mount technology can be used to mount the electrolytic capacitor 10 on a PCB; however, the vertical space above the PCB equal to the height of the electrolytic capacitor 10 may become wasted mounting space.

[0048] Figure 5 This is a plan view (or top view) of an electronic device including a PCB and a horizontally mounted capacitor module, according to an embodiment of the present invention. Here, it is again assumed that the capacitor module 100 includes an electrolytic capacitor 110 and a housing 120. The housing 120 includes a first electrode pad 121a, a second electrode pad 121b, a third electrode pad 121c, and a frame 122. The first electrode pad 121a, the second electrode pad 121b, and the frame 122 may be substantially similar to, respectively, a PCB and a horizontally mounted capacitor module. Figure 1 The first electrode pad 121a, the second electrode pad 121b, and the frame 122.

[0049] As an example, suppose electrolytic capacitor 110 is an aluminum electrolytic capacitor horizontally mounted on a PCB via a housing 120. Figure 3A , Figure 3B , Figure 3C and Figure 4 Compared to the comparative examples, Figure 5 The electrolytic capacitor 110 can be mounted at least partially horizontally within an opening in the PCB (e.g., extending horizontally along the opening). Therefore, vertical space at least equal to the thickness of the PCB is avoided from becoming wasted mounting space. This allows for increased integration of electronic devices that include the PCB with the electrolytic capacitor 110 mounted.

[0050] As described above, some embodiments of the present invention provide a housing (e.g., housing 120) including at least one dummy electrode pad (e.g., third electrode pad 121c). Here, the dummy electrode pad is a component unrelated to charging / discharging the electrolytic capacitor 110. Instead, the dummy electrode pad can mechanically support the electrolytic capacitor 110 mounted on the PCB. In this respect, depending on the design, the dummy electrode pad may be located differently within the housing 120.

[0051] In some embodiments, the dummy electrode pads of the housing 120 may be electrically floated. That is, the dummy electrode pads may not be electrically connected to the anode or cathode of the electrolytic capacitor 110. Alternatively, the dummy electrode pads of the housing 120 may be electrically grounded (e.g., connected to the cathode of the electrolytic capacitor 110, for example, via a separate conductive line).

[0052] Figure 6A It is to further demonstrate Figure 5 Conceptual diagrams of electronic devices, and Figure 6B It is to further demonstrate Figure 5 An exploded perspective view of the electronic device. Figure 6C This is a cross-sectional view further showing the contact surfaces (e.g., CSa, CSb, and CSc) of the electrode pads 121a, 121b, and 121c of the housing 120.

[0053] Reference Figure 6A , Figure 6B and Figure 6C An electronic device including a PCB and a capacitor module 100 is shown. The capacitor module 100 may include an electrolytic capacitor 110 and a housing 120. The electrolytic capacitor 110 may include a first electrode 111a, a second electrode 111b, and a dielectric 112. One of the first electrode 111a and the second electrode 111b may be an anode, and the other may be a cathode. The dielectric 112 may be a medium capable of storing electrical energy.

[0054] The housing 120 may include a first electrode pad 121a, a second electrode pad 121b, a third electrode pad 121c, and a frame 122. The housing 120 may extend primarily in a first direction D1. The housing 120 may have a first side surface SS1 extending primarily in a second direction D2 intersecting the first direction D1 and opposing (or facing) second side surfaces SS2. For example, the first side surface SS1 and the second side surface SS2 may correspond to corresponding surfaces of the frame 122.

[0055] A first electrode pad 121a can be connected to a first side surface SS1 of the housing 120, and a first electrode 111a of an electrolytic capacitor 110 can be mounted thereon. A second electrode pad 121b, spaced apart from the first electrode pad 121a in a second direction D2, can be connected to the first side surface SS1 of the housing 120, and a second electrode 111b of the electrolytic capacitor 110 can be mounted thereon. A third electrode pad 121c can be connected to a second side surface SS2 of the housing 120. The housing 120 may also include one or more dummy electrode pads.

[0056] In some embodiments, electrode pads 121a, 121b, and 121c may include corresponding contact surfaces. For example, as... Figure 6CAs shown, the first electrode pad 121a may include a first contact surface CSa, the second electrode pad 121b may include a second contact surface CSb, and the third electrode pad 121c may include a third contact surface CSa. The first contact surface CSa, the second contact surface CSb, and the third contact surface CSa may be disposed on the same plane. The capacitor module 100 can be mounted on the PCB through the first contact surface CSa, the second contact surface CSb, and the third contact surface CSa.

[0057] The PCB may include a mounting region RG (e.g., an opening cut into the PCB and having a size sufficient to accommodate the capacitor module 100) and a first contact terminal Ta, a second contact terminal Tb, and a third contact terminal Tc disposed adjacent to the mounting region RG. Specifically, the mounting region RG has a length in a first direction sufficient to allow the capacitor module 100 to be mounted horizontally on the PCB. In some embodiments, the mounting region RG may have a width in a second direction that is wider than the width of the capacitor module 100.

[0058] In some embodiments, the capacitor module 100 can be mounted on a PCB by means of the combination or connection between contact terminals Ta, Tb and Tc and contact surfaces CSa, CSb and CSc.

[0059] In some embodiments, the first contact terminal Ta, the second contact terminal Tb, and / or the third contact terminal Tc may each be a flat contact surface. Here, for example, the first contact terminal Ta (or the second contact terminal Tb or the third contact terminal Tc) may be a contact surface extending horizontally on the upper (or lower) surface of the PCB. Alternatively, the first contact terminal Ta (or the second contact terminal Tb or the third contact terminal Tc) may be a contact surface recessed into the PCB and extending across the PCB. Alternatively, the first contact terminal Ta (or the second contact terminal Tb or the third contact terminal Tc) may be a contact surface at least partially disposed within the PCB and extending across the PCB.

[0060] exist Figure 6BIn the example shown, the first contact terminal Ta is connected to the first electrode pad 121a of the capacitor module 100, the second contact terminal Tb is connected to the second electrode pad 121b of the capacitor module 100, and the third contact terminal Tc is connected to the third electrode pad 121c of the capacitor module 100. Therefore, the first contact surface CSa of the first electrode pad 121a can contact the first contact terminal Ta, the second contact surface CSb of the second electrode pad 121b can contact the second contact terminal Tb, and the third contact surface CSa of the third electrode pad 121c can contact the third contact terminal Tc. For example, the first contact surface CSa of the first electrode pad 121a, the second contact surface CSb of the second electrode pad 121b, and the third contact surface CSa of the third electrode pad 121c can be parallel to the first contact terminal Ta, the second contact terminal Tb, and the third contact terminal Tc.

[0061] In this regard, the corresponding connections between the first contact terminal Ta and the first contact surface CSa, between the second contact terminal Tb and the second contact surface CSb, and between the third contact terminal Tc and the third contact surface CCS are not limited to those described above, and those skilled in the art will recognize that many different methods can be used to achieve these mechanical and / or electrical connections. The first contact terminal Ta, the second contact terminal Tb, and the third contact terminal Tc can be respectively disposed on the upper surface and / or the lower surface of the PCB.

[0062] The PCB may also include additional structures of different sizes and shapes (e.g., a fourth contact terminal) to effectively support the capacitor module 100 mounted on the PCB.

[0063] In some embodiments, taking into account the size of the horizontally mounted capacitor module 100, the PCB can be manufactured in a size as small as that allowed by the mounting area RG. The dielectric 112 of the electrolytic capacitor 110 can be cylindrical, having a defined diameter (e.g., the total vertical height in the third direction D3 (up and down from the plane defined by the main surface of the PCB)) and a radius (e.g., a portion of the vertical height in the third direction D3 (up or down from the plane defined by the main surface of the PCB)).

[0064] However, for ease of assembly, the width of the mounting area RG of the PCB, or the width for troubleshooting the mounting area RG of the PCB, can be greater than the width of the electrolytic capacitor 110. Therefore, since the overall size of the PCB can be reduced relative to the mounting area RG, the integration density of the electronic device can be improved.

[0065] Those skilled in the art will recognize that, Figure 6A , Figure 6B and Figure 6CThe foregoing examples are merely exemplary in nature. The number, size, shape, and position of the contact terminals Ta, Tb, and Tc, as well as the number, size, shape, and position of the electrode pads 121a, 121b, and 121c, can vary according to the design, and the scope of the inventive concept is not limited to the exemplary examples.

[0066] Figure 7A , Figure 7B and Figure 7C This is a view illustrating an electronic device according to an embodiment of the present invention. Hereinafter, a first side surface SS1, a second side surface SS2, a third side surface SS3, and a fourth side surface SS4 of the housing 120 are indicated, and a frame 122 includes corresponding first side surface SS1, second side surface SS2, third side surface SS3, and fourth side surface SS4. In the illustrated example, the first side surface SS1 is disposed at one end of the frame 122 in a first direction D1, and the second side surface SS2 is opposite to the first side surface SS1. The third side surface SS3 and the opposite fourth surface SS4 connect the first side surface SS1 and the second side surface SS2.

[0067] Reference Figure 7A The electronic device includes a PCB and a capacitor module 100 horizontally mounted on the PCB. Assume the capacitor module 100 includes an electrolytic capacitor 110 and a housing 120, wherein the housing 120 includes a first electrode pad 121a, a second electrode pad 121b, a third electrode pad 121c, and a frame 122. The first electrode pad 121a and the second electrode pad 121b can be connected to a first side surface SS1 of the housing 120, and the third electrode pad 121c can be connected to a second side surface SS2 of the housing 120.

[0068] Assume the PCB includes a mounting area RG, a first contact terminal Ta, a second contact terminal Tb, and a third contact terminal Tc. The first contact terminal Ta, the second contact terminal Tb, and the third contact terminal Tc can be positioned adjacent to the mounting area RG. For example, the first contact terminal Ta and the second contact terminal Tb can be positioned adjacent to each other at one end of the area RG, and the third contact terminal Tc can be positioned at the other end of the mounting area RG.

[0069] The capacitor module 100 can be horizontally mounted within the mounting area RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a can contact the first contact terminal Ta, the second contact surface CSb of the second electrode pad 121b can contact the second contact terminal Tb, and the third contact surface CSc of the third electrode pad 121b can contact the third contact terminal Tc.

[0070] In this respect, the first contact surface CSa of the first electrode pad 121a and the second contact surface CSb of the second electrode pad 121b can be opposite to the third contact surface CSa of the third electrode pad 121c (see, for example, Figure 6C ).

[0071] In some embodiments, one of the first electrode pad 121a and the second electrode pad 121b is connected to the anode of the electrolytic capacitor 110, and the other is connected to the cathode of the electrolytic capacitor 110. The third electrode pad 121c is a dummy electrode pad.

[0072] Reference Figure 7B It shows the relationship with Figure 7A This is a basically similar electronic device to the one described above, except that the third electrode pad 121c on the second side surface SS2 of the electrolytic capacitor 110 is replaced by the fourth electrode pad 121d on the third side surface SS3 of the electrolytic capacitor 110, and the third contact terminal Tc is replaced by the fourth contact terminal Td. Here, instead of having the first contact surface CSa and the second contact surface CSb facing each other, the fourth contact terminal Td is disposed on the PCB to accommodate the fourth electrode pad 121d disposed on the third side surface SS3 of the electrolytic capacitor 110. That is, Figure 7B Capacitor module 100 and Figure 7A The difference in capacitor module 100 lies in the positioning of the dummy electrode pads.

[0073] Reference Figure 7C This shows that Figure 7A The second electrode pad 121b (the first dummy electrode pad) and Figure 7B The electronic device combines the fourth electrode pad 121d (second dummy electrode pad) with the corresponding second contact terminal Tb of the PCB with the fourth contact terminal Td. This is an example of an electronic device that incorporates more than one dummy electrode pad to mechanically support a capacitor module 100 horizontally mounted on a PCB.

[0074] Figure 5 , Figure 6A , Figure 6B , Figure 7A , Figure 7B and Figure 7C The illustrated embodiments are various examples of capacitor modules being mounted horizontally on a PCB in a longitudinal manner. It is assumed that the orientation of the mounting area RG in the PCB is such that the capacitor module will be at least partially mounted in the mounting area according to its length extending across the horizontal width of the PCB (e.g., defined primarily by the maximum size of the electrolytic capacitor 110).

[0075] In comparison, Figure 8A , Figure 8B and Figure 8C These are various views illustrating an electronic device according to an embodiment of the invention, the electronic device including a capacitor module horizontally mounted on a PCB in a laterally arranged manner. That is, unlike the capacitor module 100 which is horizontally mounted on the PCB in a direction perpendicular to the extensions of the anode and cathode of the electrolytic capacitor 110 (e.g., Figure 7A , Figure 7B and Figure 7C According to the embodiments), Figure 8A , Figure 8B and Figure 8C The capacitor module 100 of the illustrated embodiment can be horizontally mounted on a PCB in a direction parallel to the extensions of the anode and cathode of the electrolytic capacitor 110. As a result, it can be assumed that the orientation of the mounting area RG in the PCB is such that the capacitor module will be at least partially mounted in the mounting area according to the width of its horizontal extension across the PCB (e.g., defined primarily by a size smaller than the maximum size of the electrolytic capacitor 110).

[0076] Reference Figure 8A The electronic device includes a PCB and a capacitor module 100 at least partially horizontally mounted within the PCB. The capacitor module 100 may again include an electrolytic capacitor 110 and a housing 120, wherein the housing 120 may include a first electrode pad 121a, a second electrode pad 121b, a third electrode pad 121c, and a frame 122. Here, the first electrode pad 121a and the second electrode pad 121b may be connected to a first side surface SS1 of the housing 120, and the third electrode pad 121c may be connected to a third side surface SS3 of the housing 120.

[0077] The PCB may again include a mounting area RG and a first contact terminal Ta, a second contact terminal Tb, and a third contact terminal Tc respectively disposed adjacent to the mounting area RG. Here, the first contact terminal Ta and the second contact terminal Tb may be adjacent to the mounting area RG in the second direction D2, and the third contact terminal Tc may be adjacent to the mounting area RG in the first direction D1.

[0078] As before, the capacitor module 100 can be horizontally mounted within the mounting area RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a can contact the first contact terminal Ta, the second contact surface CSb of the second electrode pad 121b can contact the second contact terminal Tb, and the third contact surface CCS of the third electrode pad 121c can contact the third contact terminal Tc. Here, the first contact terminal Ta and the second contact terminal Tb can be arranged adjacent to the first side surface SS1 of the capacitor module 100 when the capacitor module 100 is horizontally mounted on the PCB, and the third contact terminal Tc can be arranged adjacent to the third side surface SS3 when the capacitor module 100 is horizontally mounted on the PCB.

[0079] In some embodiments, one of the first electrode pad 121a and the second electrode pad 121b may be connected to the anode of the electrolytic capacitor 110, and the other of the first electrode pad 121a and the second electrode pad 121b may be connected to the cathode of the electrolytic capacitor 110, while the third electrode pad 121c may be a dummy electrode pad.

[0080] Reference Figure 8B , Figure 8B The capacitor module 100 is basically similar to Figure 8A The capacitor module 100 differs from the other in that it uses the fourth electrode pad 121d on the fourth side surface SS3 of the electrolytic capacitor 110 instead of the third electrode pad 121c on the third side surface SS2 of the electrolytic capacitor 110, and uses the fourth contact terminal Td instead of the third contact terminal Tc on the PCB. That is, Figure 8B Capacitor module 100 and Figure 8A The difference between the capacitor module 100 and the dummy electrode pads is the positioning.

[0081] Reference Figure 8C The electronic device shown combines Figure 8A The second electrode pad 121b (first dummy electrode pad) and Figure 8B The fourth electrode pad 121d (second dummy electrode pad), and the corresponding second contact terminal Tb and fourth contact terminal Td located on the PCB. This is another example of an electronic device that combines more than one dummy electrode pad to mechanically support a capacitor module 100 horizontally mounted on a PCB.

[0082] Figure 9A This is a plan view (e.g., downward along third direction D3) of the upper surface of an electronic circuit EC comprising a plurality of capacitor modules 100 horizontally mounted on a PCB, according to an embodiment of the present invention.

[0083] Here, for example, the electronic circuit EC assumes that four (4) capacitor modules 100 are horizontally mounted on a single PCB. However, this is merely an example, and the scope of the inventive concept is not limited thereto, as any reasonable number of capacitor modules 100 can be horizontally mounted on one or more PCBs within the electronic circuit EC.

[0084] In some embodiments, the electronic circuit EC may also include other components (conductive patterns, resistors, integrated circuits or chips, logic gates, buffer memories, non-volatile memories, etc.) mounted on the upper and / or lower surfaces of the PCB using, for example, various surface mount technologies.

[0085] Because multiple capacitor modules 100 and other electronic components can be mounted on the PCB using the surface mount technology described above, the productivity of electronic circuits (ECs) can be improved compared to manufacturing methods that include hybrid processes such as hand soldering. As a result, the defect rate of electronic circuits (ECs) will be relatively low.

[0086] Figure 9B This is a plan view (e.g., upward along the third direction D3) of a PCB showing an embodiment of the present invention, comprising an electronic circuit EC including multiple capacitor modules 100 horizontally mounted on a PCB. That is, Figure 9B yes Figure 9A The reverse planar diagram.

[0087] like Figure 9A and Figure 9B As shown, the electronic circuit EC can include multiple capacitor modules 100, wherein each capacitor module 100 includes an electrolytic capacitor and is horizontally mounted on a PCB, as described above. Therefore, the integration density of the electronic circuit EC can be improved.

[0088] Figure 10 This is a perspective view illustrating an electronic device ED according to an embodiment of the concept of the present invention. (Refer to...) Figure 10 Electronic devices ED may include Figure 9A and Figure 9B The electronic circuitry EC and the housing CC. In some embodiments, the electronic device ED may be an SSD.

[0089] Here, the cover CC can protect the electronic circuit EC from environmental influences and mechanical shocks. For example, the electronic device ED may include a cover CC disposed on one side of the electronic circuit EC. Alternatively, the electronic device ED may also include another cover (not shown) disposed on the opposite side of the electronic circuit EC, wherein the two (2) cover CCs can be combined together to completely surround the electronic circuit EC between them.

[0090] In some embodiments, the housing CC may include one or more I / O port terminals that extend through the housing CC to connect the PCB to external devices. In this way, electronic devices ED and external devices can be hardwired via the I / O port terminals.

[0091] According to embodiments of the present invention, integration related to vertical mounting space can be improved by horizontally mounting the capacitor module on a PCB. Additionally, the productivity of the electronic device or circuit can be improved by applying fully automated manufacturing processes such as surface mount technology. Furthermore, when the capacitor module is horizontally mounted on the PCB, the structural stability of the resulting device or circuit can be improved by adding one or more dummy electrode pads that mechanically support the capacitor module.

[0092] The foregoing embodiments are illustrative in nature. Changes and modifications can be made to the exemplary embodiments without removing the resulting apparatus from the scope of the inventive concept.

Claims

1. A capacitor module, the capacitor module comprising: A housing is horizontally mounted on a printed circuit board having a main surface extending horizontally in a first direction and a second direction perpendicular to the first direction. The housing includes a first side surface, a second side surface opposite to the first side surface, a first electrode pad and a second electrode pad disposed on the first side surface, and a third electrode pad disposed on the second side surface. and An electrolytic capacitor, comprising a dielectric extending in the first direction, a first electrode electrically connected to the first electrode pad, and a second electrode electrically connected to the second electrode pad. Wherein, the second electrode pad is spaced apart from the first electrode pad in the second direction, and The housing is at least partially installed within an opening in the printed circuit board.

2. The capacitor module according to claim 1, wherein, One of the first electrode and the second electrode is the anode of the electrolytic capacitor, and the other of the first electrode and the second electrode is the cathode of the electrolytic capacitor.

3. The capacitor module according to claim 1, wherein, At least one of the first electrode pad and the second electrode pad is configured to mechanically support the capacitor module when the capacitor module is mounted on the printed circuit board.

4. The capacitor module according to claim 1, wherein, The third electrode pad is a dummy electrode pad, which is configured to mechanically support the capacitor module when the capacitor module is mounted on the printed circuit board.

5. The capacitor module according to claim 4, wherein, The third electrode pad is floating.

6. The capacitor module according to claim 4, wherein, The third electrode pad is grounded.

7. The capacitor module according to claim 6, wherein, One of the first electrode and the second electrode is the cathode of the electrolytic capacitor, and the third electrode pad is electrically connected to the cathode.

8. The capacitor module according to claim 1, wherein, The housing also includes: A third side surface, the third side surface connecting the first side surface and the second side surface; and A fourth electrode pad is disposed on the third side surface.

9. The capacitor module according to claim 8, wherein, Both the third electrode pad and the fourth electrode pad are dummy electrode pads, which are configured to mechanically support the capacitor module when the capacitor module is mounted on the printed circuit board.

10. The capacitor module according to claim 9, wherein, Both the third electrode pad and the fourth electrode pad are connected to be either floating or grounded.

11. An electronic device, the electronic device comprising: A printed circuit board having a main surface extending horizontally in a first direction and a second direction perpendicular to the first direction, and including an opening, a first contact terminal, a second contact terminal and a third contact terminal; A housing configured to be horizontally mounted on the printed circuit board at least partially within the opening, and including a first side surface, a second side surface opposite to the first side surface, a first electrode pad and a second electrode pad disposed on the first side surface, and a third electrode pad disposed on the second side surface. and An electrolytic capacitor, comprising a dielectric extending in a first direction, a first electrode, and a second electrode spaced apart from the first electrode in a second direction. The electrolytic capacitor is mounted on the housing by connecting the first electrode to the first electrode pad and the second electrode to the second electrode pad. The housing is horizontally mounted within the opening of the printed circuit board by connecting the first electrode pad to the first contact terminal, the second electrode pad to the second contact terminal, and the third electrode pad to the third contact terminal.

12. The electronic device according to claim 11, wherein, One of the first electrode and the second electrode is the anode of the electrolytic capacitor, and the other of the first electrode and the second electrode is the cathode of the electrolytic capacitor.

13. The electronic device according to claim 11, wherein, The third electrode pad is a dummy electrode pad, which is configured to mechanically support the housing when the housing is horizontally mounted on the printed circuit board.

14. The electronic device according to claim 11, wherein, The printed circuit board also includes a fourth contact terminal. The housing also includes a third side surface connecting the first side surface and the second side surface, and a fourth electrode pad connected to the third side surface. By further connecting the fourth electrode pad to the fourth contact terminal, the housing is horizontally mounted within the opening of the printed circuit board.

15. The electronic device according to claim 14, wherein, The third and fourth electrode pads are dummy electrode pads, configured to mechanically support the housing when it is mounted on the printed circuit board. Both the third electrode pad and the fourth electrode pad are connected to be either floating or grounded.

16. The electronic device according to claim 11, wherein, The opening is provided within the printed circuit board to accommodate and mount the housing in one of two ways: longitudinally or laterally.

17. The electronic device of claim 11, further comprising: A cover that surrounds at least one of the upper surface and the lower surface of the printed circuit board.

18. A capacitor module configured to be horizontally mounted on a printed circuit board having an upper surface and a lower surface extending horizontally in a first direction and a second direction perpendicular to the first direction, the capacitor module comprising: The housing includes a frame, a first side surface, a second side surface opposite to the first side surface, a third side surface connecting the first side surface and the second side surface, a first electrode pad and a second electrode pad disposed on the first side surface, and a third electrode pad disposed on the third side surface. and A cylindrical electrolytic capacitor includes a dielectric extending in the first direction, a first electrode contacting the first electrode pad, and a second electrode contacting the second electrode pad. Wherein, the first electrode pad is spaced apart from the second electrode pad in the second direction, and the frame surrounds the side surface of the cylindrical electrolytic capacitor, and The housing is at least partially installed within an opening in the printed circuit board.

19. The capacitor module according to claim 18, wherein, One of the first electrode and the second electrode is the anode of the cylindrical electrolytic capacitor, and the other of the first electrode and the second electrode is the cathode of the cylindrical electrolytic capacitor. The third electrode pad is a dummy electrode pad, which is configured to mechanically support the capacitor module when the capacitor module is mounted on the printed circuit board.

20. The capacitor module according to claim 18, wherein, The cylindrical electrolytic capacitor is an aluminum electrolytic capacitor.

Images