Substrate processing system for processing a substrate

Abstract

The present disclosure relates to a semiconductor processing system for processing semiconductor substrates and provided with an enclosure formed by walls. The system can also include a process module and a cassette module located adjacent to the process module. An electronics module can be provided with supports for mounting electronics components so that the electronics module is located behind a door in a wall of the system to create an access for maintenance. The electronics components have straight mounting pedestals for mounting the electronics components so that when the door is closed, the mounting pedestals are mounted in the system at an angle between 10 and 80 degrees relative to the door.

Description

Technical Field

[0001] This disclosure generally relates to a substrate processing system for processing substrates. More specifically, this disclosure relates to providing maintenance for semiconductor processing systems. Background Technology

[0002] A substrate processing system for processing substrates may have a housing including sidewalls, a rear wall, and a front wall. The system may further include:

[0003] The processing module is equipped with a reactor for processing the substrate;

[0004] A box module, having a loading port for supporting the substrate box, is located near the front wall and before the processing module; and

[0005] An electronic equipment module is provided with supports for mounting electronic equipment components. The electronic equipment module can be located behind a door in the wall of the system to create access for working on the electronic equipment components.

[0006] A substrate processing system may have many parts that may require maintenance. For safety reasons, it may be necessary to disconnect the power supply before starting work on certain parts of the system. Therefore, electronic equipment modules may be equipped with electronic components, such as circuit breakers, to disconnect the power supply.

[0007] To check if the power supply was properly disconnected, it is necessary to measure the power on the cable using a voltage tester. This check can be considered electronic work, and therefore safety measures may be required to ensure that maintenance workers performing electronic work on electronic components have sufficient space to leave the system in the event of an electronic hazard. Because space is very limited in cleanroom manufacturing facilities where processing systems can be used, there may be only very narrow alleys between systems. Therefore, in the event of an electronic hazard, maintenance workers providing electronic work may have very limited space to stay away from electrical components. Summary of the Invention

[0008] This summary is provided to present the chosen concepts in a simplified form. These concepts are further described in detail below in a detailed description of exemplary embodiments of this disclosure. This summary is not intended to require identification of key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0009] Depending on the purpose, it may be desirable to provide a system that can be safely maintained even in a limited space.

[0010] Therefore, a semiconductor processing system for processing semiconductor substrates and having a housing formed by walls can be provided. This system may further include:

[0011] The processing module is equipped with a reactor for processing the substrate; and

[0012] The box module, which has a loading port for supporting the substrate box, is located adjacent to the processing module. The electronics module may be provided with supports for mounting electronic components, so that the electronics module is located behind a door in the system wall to create access for maintenance. The electronic components may have direct mounting bases for mounting the electronic components, so that when the door is closed, the mounting bases are mounted in the system at an angle between 10 and 80 degrees relative to the door.

[0013] The narrow passageway used by maintenance workers to supply power to electronic components may be adjacent to the wall of a neighboring semiconductor processing system. The front walls of the adjacent semiconductor processing system can be aligned and form a straight wall. This can be done on either side of the passageway, so the passageway may be small and narrow.

[0014] By installing mounting bases for the electronic components at an angle between 10 and 80 degrees relative to the door when it is closed, maintenance workers can work on the electronic components at an angle between 10 and 80 degrees when the door is open. In case of danger, they will move away from the electronic components, not along the wall perpendicular to the door, but at an angle of 10 to 80 degrees to it. The passageway is much wider in this direction than in the direction perpendicular to the wall. Therefore, maintenance workers have more space to safely enter the passageway.

[0015] To summarize the invention and the advantages achieved compared to the prior art, certain objects and advantages of the invention have been described above. It should be understood, of course, that not all of these objects or advantages may necessarily be achieved according to any particular embodiment of the invention. Therefore, for example, those skilled in the art will recognize that the invention may be practiced or carried out in a manner that achieves or optimizes one or more advantages taught or implied herein, without necessarily achieving other objects or advantages that may be taught or implied herein.

[0016] All these embodiments are intended to fall within the scope of the invention disclosed herein. These and other embodiments will become apparent to those skilled in the art from the following detailed description of certain embodiments with reference to the accompanying drawings, and the invention is not limited to any particular embodiment disclosed. Attached Figure Description

[0017] Although the specification concludes with claims that specifically point out and expressly claim protection for embodiments of the invention, the advantages of the embodiments of the present disclosure can be more readily identified when the description of certain examples of embodiments of the present disclosure is read in conjunction with the accompanying drawings, in which:

[0018] Figure 1A schematic top view of an example of a substrate processing system according to an embodiment is shown.

[0019] Figure 2 An enlarged view shows a module with electronic devices. Figure 1 It is part of the system. Detailed Implementation

[0020] Although certain embodiments and examples are disclosed below, those skilled in the art will understand that the invention extends beyond the specific disclosed embodiments and / or uses of the invention and their obvious modifications and equivalents. Therefore, it is intended that the scope of the disclosed invention should not be limited to the specific disclosed embodiments described below. The illustrations presented herein are not intended to be actual views of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of this disclosure.

[0021] As used herein, the terms “substrate” or “wafer” can refer to any one or more underlying materials that can be used, or materials on which devices, circuits, or films can be formed. The term “semiconductor device structure” can refer to any portion of a processed or partially processed semiconductor structure, that is, at least a portion of the active or passive components of a semiconductor device to be formed on or in a semiconductor substrate. For example, a semiconductor device structure can include active and passive components of an integrated circuit, such as transistors, memory elements, transducers, capacitors, resistors, wires, conductive vias, and conductive pads.

[0022] Figure 1 A schematic top view of an example of a substrate processing system, such as furnace 1, according to an embodiment is shown. Furnace 1 includes a housing 2 having a front wall 4 and a rear wall 6.

[0023] The furnace 1 may include a cassette module 3 having a storage device, such as a cassette storage turntable 5, for storing multiple wafer cassettes C, each wafer cassette accommodating multiple substrates. The cassette storage turntable 5 may include multiple platform stands for supporting the cassettes. The platform stands may be connected to a central axis mounted to be rotatable about a vertical axis. Each platform stand is configured to accommodate multiple cassettes C. A drive assembly is operatively connected to the central axis so that the central axis rotates about the vertical axis along with the multiple platform stands.

[0024] The box module 3 may have a box processor 7 with a box processor arm 9 configured to transfer boxes C between the box storage turntable 5, a box inlet / outlet port 11 adjacent to the front wall 4 of the housing 2 of the furnace 1, and / or a loading port 15. The box processor 7 may include a lifting mechanism to reach boxes at different heights. Each platform for storing boxes may have a cutout therein, the size and shape of which are designed to allow the box processor arm 9 to pass vertically through it and to allow the platform to support the box C thereon.

[0025] An inner wall 19 may be provided to separate the cassette module 3 from the processing module 8. The inner wall 19 may have a closable substrate inlet opening 33 adjacent to the loading port 15, which may be constructed and arranged to also open the cassette. The loading port 15 may be provided with a cassette turntable to rotate the cassette C and / or press it against the closable substrate inlet opening 33.

[0026] The processing module 8 may include a substrate processing robot 35 equipped with a substrate processing arm 36 to transfer substrates from a cassette C located on the loading port 15 through a closable substrate entry opening 33 to a substrate rack, and vice versa. The furnace may include a substrate processing chamber 37 in which the substrate processing robot 35 is housed.

[0027] The housing 2 may have first and second sidewalls 47 extending along the entire length of the furnace 1. The distance between the sidewalls 47 of the furnace, which may define the width of the system, may be between 190 and 250 cm, preferably between 210 and 230 cm, and most ideally around 220 cm. The furnace 1 can be maintained from the rear side 6 or the front side 4, thus potentially eliminating the need for doors in the sidewalls 47.

[0028] By constructing a sidewall 47 without doors, multiple furnaces 1 can be positioned side-by-side in a semiconductor manufacturing plant. Therefore, the sidewalls of adjacent furnaces can be positioned very close together, or even opposite each other. Advantageously, multiple furnaces can form a wall, with the front side 4 of furnace 1 docking with a cartridge transport device in a very clean environment, a so-called "cleanroom," where particle requirements are very stringent. The rear side 6 of furnace 1 can dock with a maintenance passageway, where particle requirements may be less stringent than those of the front side 4.

[0029] Furnace 1 may be equipped with first and second reactors 45 for processing multiple substrates. Using two reactors can increase the productivity of furnace 1. The substrate processing system in the top view can be configured in a generally U-shape. The first and second reactors 45 can be constructed and arranged in the legs. The maintenance area 43 can be constructed and arranged between the U-shaped legs.

[0030] Figure 2 It shows Figure 1 This is part of a substrate processing system, more specifically, it is shown in an enlarged view as a box module 3 having an electronic module 21. Figure 2 In order to make it clear, Figure 1 Different internal components of box module 3 have been removed.

[0031] Electronic device module 21 may be provided with a support, such as a mounting wall 23, for rigidly mounting electronic components 25 thereto. Mounting wall 23 may be rigidly connected to the frame of box module 3. Mounting wall 23 may be mounted parallel to front wall 4. Electronic device module 21 may be located behind door 29 in the front wall 4 of the system. Door 29 may be opened to create a passage for maintaining electronic components 25.

[0032] Electronic component 25 may have a vertical mounting base 31 for mounting electronic equipment components. Mounting base 31 may be mounted in the system at an angle A. Angle A may be determined about a substantially vertical axis, such as an axis substantially perpendicular to the floor supporting the system. When the door is closed, angle A relative to door 29 may be between 5 and 85 degrees, preferably between 10 and 60 degrees, more preferably between 20 and 50 degrees, and most preferably about 35 degrees. When door 29 is closed, the door may be parallel to the front wall 4. Electronic component 25 may be mounted in the system 5 to 25 cm behind door 29.

[0033] Electronic components may include circuit breakers. Maintenance workers can use circuit breakers to switch the power supply to the system. For example, to disconnect the power supply to the box processor 7 or any other electric actuator in the system. To check that the 220 / 230 volt power supply has been properly disconnected, a maintenance worker can use a voltage tester to measure for any residual voltage. The test probes of the voltage tester can therefore move within holes set into the front surface of the electrical component 25 to connect to the electrical carrier. This test is considered electrical engineering and adheres to stringent safety standards.

[0034] The small channel used by maintenance workers to supply electrical power to electronic component 25 can be adjacent to the front wall 4 of the adjacent semiconductor processing system 1 on one side. These front walls 4 of the adjacent semiconductor processing systems can be aligned and form a straight wall. Other adjacent semiconductor processing systems can be aligned and form straight walls on opposite sides of the alley. The alley may be small and narrow to maintain the compactness of the manufacturing site.

[0035] By mounting the electronic component 25's mounting base 31 at an angle A between 10 and 80 degrees relative to door 29 when the door is closed, a maintenance worker can work through the open door at an angle between 10 and 80 degrees relative to the front wall 4 perpendicular to the electronic component 25. In the event of an electrical hazard, he may have to quickly leave the electronic component 25. He will not move along the direction perpendicular to the front wall 4 where door 29 is located, but rather along a safe direction S, which has an angle between 10 and 80 degrees relative to it. The width of the alley in this direction can be greater than its width in the direction perpendicular to the front wall 4. Therefore, the maintenance worker has more space to safely enter the alley in this way. In addition, because he moves at an angle not equal to 90 degrees relative to the front wall 4, the risk of him violently bouncing against the opposite wall of the alley and slamming back to the electrical component is likely to be less.

[0036] Although illustrative embodiments of the invention have been described above in part with reference to the accompanying drawings, it should be understood that the invention is not limited to these embodiments. By studying the drawings, the disclosure, and the appended claims, those skilled in the art will understand and implement variations of the disclosed embodiments in practicing the claimed invention.

[0037] Throughout this specification, references to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, it should be noted that specific features, structures, or characteristics of one or more embodiments can be combined in any suitable manner to form new embodiments that are not explicitly described.

Claims

1. A semiconductor processing system for processing a semiconductor substrate and having a housing formed by walls, said walls including a front wall, a rear wall, and side walls, the semiconductor processing system further comprising: The processing module is equipped with a reactor for processing the substrate; The box module is provided with a loading port for supporting the baseboard box; as well as An electronic device module is provided with a support for mounting electronic device components, such that the electronic device module is located behind a door in the front wall of the semiconductor processing system. The support is a mounting wall that is mounted on the frame of the box module. The mounting wall is parallel to the front wall and parallel to the door when the door is closed. When the door can be opened, it creates a maintenance passage for the electronic device components. The electronic device components have a straight mounting base for mounting the electronic device components, such that when the door is closed, the mounting base is mounted in the semiconductor processing system at an angle between 5 and 85 degrees relative to the door. The box module is located between the front wall and the processing module, and also includes an inner wall that separates the box module from the processing module.

2. The semiconductor processing system according to claim 1, wherein, When the door is closed, the mounting base of the electronic device component is installed at an angle between 10 and 60 degrees relative to the door.

3. The semiconductor processing system according to claim 1, wherein, When the door is closed, the mounting base of the electronic device component is installed at an angle between 20 and 50 degrees relative to the door.

4. The semiconductor processing system according to claim 1, wherein, The electronic device module is rigidly mounted in the semiconductor processing system.

5. The semiconductor processing system according to claim 3, wherein, The electronic device components are mounted on the mounting wall at an angle between 5 and 85 degrees relative to the mounting wall.

6. The semiconductor processing system according to claim 5, wherein, When the door is closed, the mounting wall is rigidly mounted in the housing parallel to the door.

7. The semiconductor processing system according to claim 1, wherein, The electronic equipment components include circuit breakers.

8. The semiconductor processing system according to claim 7, wherein, The semiconductor processing system includes a wafer handling robot configured to transfer semiconductor substrates between a wafer boat of the processing module and a substrate cassette at the loading port of the cassette module.

9. The semiconductor processing system according to any one of claims 1-8, wherein, The front wall of the semiconductor processing system faces the cleanroom.

10. The semiconductor processing system according to claim 1, wherein, The box module also includes: - A substrate receiving platform, which is disposed at the front wall of the semiconductor processing system; - A box processor configured to transport a baseboard box between a baseboard box receiving platform and a loading port.

Images