Inductive sensor with one or more modular circuit boards

Abstract

An inductive sensor includes a first circuit board having a sensor element configurable in a plurality of different coil configurations. The sensor element includes a transmit coil and a plurality of receive coils. For each of the plurality of different coil configurations, the first circuit board includes an interconnect point at a same location on the first circuit board. The inductive sensor includes a second circuit board spaced apart from the first circuit board in an axial direction. The second circuit board includes processing circuitry associated with the sensor element and configurable in a plurality of different configurations. For each configuration of the processing circuitry, the second circuit board includes an interconnect point at a same location on the second circuit board. Further, each interconnect point on the second circuit board is aligned with a corresponding interconnect point on the first circuit board along a circumferential and radial direction.

Description

[0001] Priority Statement

[0002] This application claims the benefit of U.S. Provisional Application Serial No. 63 / 021,720, filed May 8, 2020, entitled "Inductive Sensor Having One or More Modular Circuit Boards," which is incorporated herein by reference. This application also claims the benefit of U.S. Provisional Application Serial No. 63 / 037,052, filed June 10, 2020, entitled "Inductive Sensor Having One or More Modular Circuit Boards," which is also incorporated herein by reference. Technical Field

[0003] This disclosure generally relates to sensing sensors, and more specifically, to sensing sensors having one or more modular circuit boards. Background Technology

[0004] A sensing sensor may include a target and a sensor element. The target may be mounted on a first object. The sensor element may be mounted on a second object that is stationary relative to the first object. The sensor element may include a transmitting coil and multiple receiving coils. Whenever the target passes the sensor element, the multiple receiving coils may be inductively coupled to the transmitting coil. When the multiple receiving coils are inductively coupled to the transmitting coil, each of the multiple receiving coils may output a signal that can be used to determine the position of the first object relative to the second object. Additionally, this signal can be used to determine the velocity of the first object. Summary of the Invention

[0005] Aspects and advantages of embodiments of this disclosure will be set forth in part in the description which follows, or may be learned from the description or by practice of the embodiments.

[0006] On one hand, a sensing sensor is provided. The sensing sensor defines an axial direction, a circumferential direction, and a radial direction. The sensing sensor includes a first circuit board. The first circuit board includes a sensor element that can be configured as a variety of different coil configurations. The sensor element includes a transmitting coil and a plurality of receiving coils. The transmitting coil is configured to induce a current in the plurality of receiving coils via a target. The first circuit board also includes a plurality of interconnecting points, which are located at the same position on the first circuit board for each of the plurality of different coil configurations. The sensing sensor includes a second circuit board spaced apart from the first circuit board in the axial direction. The second circuit board includes processing circuitry associated with the sensor element. The processing circuitry can be configured as a variety of different configurations. For each of the plurality of different configurations of the processing circuitry, the second circuit board also includes a plurality of interconnecting points located at the same position on the second circuit board. Furthermore, each of the plurality of interconnecting points on the second circuit board is aligned with a corresponding interconnecting point of the plurality of interconnecting points on the first circuit board in both the circumferential and radial directions.

[0007] On the other hand, a sensing sensor is provided. The sensing sensor defines an axial direction, a circumferential direction, and a radial direction. The sensing sensor includes a housing defining a cavity. The sensing sensor also includes a target. The sensing sensor even includes a first circuit board. The first circuit board includes a sensor element that can be configured as a variety of different coil configurations. The sensor element includes a transmitting coil and a plurality of receiving coils. The transmitting coil is configured to induce current in the plurality of receiving coils via the target. The first circuit board also includes a plurality of interconnecting points, which are located at the same position on the first circuit board for each of the plurality of different coil configurations. The sensing sensor includes a second circuit board spaced axially from the first circuit board. The second circuit board includes processing circuitry associated with the sensor element. The processing circuitry can be configured as a variety of different configurations. For each of the plurality of different configurations of the processing circuitry, the second circuit board also includes a plurality of interconnecting points located at the same position on the second circuit board. Furthermore, each of the plurality of interconnecting points on the second circuit board is aligned circumferentially and radially with a corresponding interconnecting point of the plurality of interconnecting points on the first circuit board.

[0008] In another aspect, a sensing sensor is provided. The sensing sensor includes a target and a circuit board. The circuit board includes a sensor element contained in a first set of layers of the circuit board. The sensor element can be configured in various different coil configurations. The sensor element includes a transmitting coil and multiple receiving coils. The transmitting coil is configured to induce current in the multiple receiving coils via the target. The circuit board also includes processing circuitry associated with the sensor element. The processing circuitry is contained in a second set of layers of the circuit board. The processing circuitry can be configured in various different configurations. The circuit board includes a third set of layers located between the first and second sets of layers. The circuit board also includes multiple conductive through-hole vias extending from the first set of layers to the second set of layers via the third set of layers. For each of the multiple different coil configurations of the sensor element and each of the multiple different configurations of the processing circuitry, each of the multiple conductive through-hole vias is located at the same position on the circuit board.

[0009] These and other features, aspects, and advantages of the various embodiments will be better understood by referring to the following description and the appended claims. Embodiments of this disclosure are illustrated in conjunction with the accompanying drawings, which are incorporated in and form part of this specification, and serve, together with the description, to explain the relevant principles. Attached Figure Description

[0010] Referring to the accompanying drawings, a detailed discussion of embodiments for those skilled in the art is set forth in the specification, in which:

[0011] Figure 1 A sensing sensor according to an example embodiment of the present disclosure is depicted;

[0012] Figure 2 An exploded view of the components of a sensing sensor according to an exemplary embodiment of the present disclosure is depicted;

[0013] Figure 3 Components of a first circuit board for a sensing sensor according to an exemplary embodiment of the present disclosure are depicted;

[0014] Figure 4 Components of a second circuit board for a sensing sensor according to an exemplary embodiment of the present disclosure are depicted;

[0015] Figure 5 Example embodiments according to this disclosure are depicted. Figure 2 A perspective view of the first circuit board of the sensing sensor;

[0016] Figure 6 Example embodiments according to this disclosure are depicted. Figure 2 A perspective view of the second circuit board of the sensing sensor;

[0017] Figure 7Interconnection components for sensing sensors according to exemplary embodiments of the present disclosure are depicted;

[0018] Figure 8 A top view of a spacer for an interconnection assembly for a sensing sensor according to an exemplary embodiment of the present disclosure is depicted;

[0019] Figure 9 An interconnection assembly located between a first circuit board of a sensing sensor and a second circuit board of a sensing sensor, according to an exemplary embodiment of the present disclosure, is depicted;

[0020] Figure 10 A top view of a spacer for an interconnection assembly for a sensing sensor according to an exemplary embodiment of the present disclosure is depicted;

[0021] Figure 11 A first circuit board of a sensing sensor having a first coil configuration according to an exemplary embodiment of the present disclosure is depicted;

[0022] Figure 12 A first circuit board of a sensing sensor having a second coil configuration according to an exemplary embodiment of the present disclosure is depicted;

[0023] Figure 13 A first circuit board of a sensing sensor having a third coil configuration according to an exemplary embodiment of the present disclosure is depicted;

[0024] Figure 14 A first circuit board of a sensing sensor having a fourth coil configuration according to an exemplary embodiment of the present disclosure is depicted;

[0025] Figure 15 A first circuit board of a sensing sensor having a fifth coil configuration according to an exemplary embodiment of the present disclosure is depicted;

[0026] Figure 16 A first circuit board of a sensing sensor having a sixth coil configuration according to an exemplary embodiment of the present disclosure is depicted;

[0027] Figure 17 A first circuit board of a sensing sensor having a seventh coil configuration according to an exemplary embodiment of the present disclosure is depicted;

[0028] Figure 18 A first circuit board of an inductive sensor having an eight-coil configuration according to an exemplary embodiment of the present disclosure is depicted;

[0029] Figure 19 A cross-sectional view of a sensing sensor according to an exemplary embodiment of the present disclosure is depicted;

[0030] Figure 20Another cross-sectional view of a sensing sensor according to an exemplary embodiment of the present disclosure is depicted;

[0031] Figure 21 Another cross-sectional view of a sensing sensor according to an exemplary embodiment of the present disclosure is depicted;

[0032] Figure 22 The components of a sensing sensor according to an exemplary embodiment of this disclosure are depicted; and

[0033] Figure 23 Another cross-sectional view of a sensing sensor according to an exemplary embodiment of the present disclosure is depicted. Detailed Implementation

[0034] Reference will now be made in detail to embodiments, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation of the embodiments and not as a limitation thereof. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments without departing from the scope of this disclosure. For example, features shown or described as part of one embodiment may be used with another embodiment to produce yet another embodiment. Therefore, aspects of this disclosure are intended to cover these modifications and variations.

[0035] The exemplary aspects of this disclosure pertain to inductive sensors for applications associated with controlling the operation of an electric motor or generator. The inductive sensor may include a first circuit board on which a sensor element is disposed. The sensor element may include a transmitting coil and a plurality of receiving coils. The inductive sensor may also include a second circuit board on which processing circuitry (e.g., a processor, storage device, communication interface, etc.) associated with the sensor element is disposed. The second circuit board may be spaced apart from the first circuit board in an axial direction. Furthermore, the first and second circuit boards may each include a plurality of interconnect points adapted to accommodate interconnect components configured to electrically couple the first circuit board to the second circuit board to facilitate electrical communication between the sensor element and the processing circuitry.

[0036] The sensor element on the first circuit board can be configured with multiple different coil configurations to suit different types of motors or generators (e.g., pole pair configurations). In some embodiments, for each of the multiple different coil configurations, the multiple receiving coils can have different numbers of coil periods. For example, when the sensor element is arranged according to a first coil configuration to suit a first motor, the multiple receiving coils can have a first number of coil periods. Conversely, when the sensor element is arranged according to a second coil configuration to suit a second motor different from the first motor, the multiple receiving coils can have a second number of coil periods. For example, in some embodiments, the pole pair configuration of the first motor can be different from that of the second motor. However, it should be understood that for each of the multiple coil configurations of the sensor element, the positions of the multiple interconnect points on the first circuit board can be the same (e.g., fixed). In this way, the first circuit board can be changed to suit different motors or generators without having to change or modify the interconnect components.

[0037] In some embodiments, the plurality of interconnect points on the first circuit board can be divided into multiple groups. Furthermore, each of the multiple groups can be located at a different position on the first circuit board. For example, in some embodiments, the plurality of interconnect points can be divided into four separate groups. The first group of interconnect points can be located at a first position on the first circuit board. The second group can be located at a second position on the first circuit board, which is circumferentially spaced approximately 90 degrees from the first position. The third group can be located at a third position on the first circuit board, which is circumferentially spaced approximately 180 degrees from the first position. The fourth group can be located at a fourth position on the first circuit board, which is circumferentially spaced approximately 270 degrees from the first position. As used herein, the term "approximately" refers to a range of values ​​within 10% of the stated values.

[0038] It should be understood that the position of each of the multiple sets of interconnect points on the first circuit board allows the first circuit board to be adapted to each of the multiple coil configurations of the sensor element without having to change the position of the multiple interconnect points thereon. In this way, a first circuit board having a sensor element arranged according to a first coil configuration can be replaced with a first circuit board having a sensor element arranged according to a second coil configuration without having to change or modify the interconnect components.

[0039] The processing circuitry on the second circuit board can be constructed in a variety of different configurations. For example, the processing circuitry (e.g., sensors, processors, communication interfaces, etc.) can be disposed on the second circuit board according to a first configuration or layout. Alternatively, the processing circuitry can be disposed on the second circuit board according to a second configuration or layout different from the first configuration. However, it should be understood that for each of the various configurations of the processing circuitry, the positions of the plurality of interconnect points on the second circuit board can be the same (e.g., fixed). In this way, a second circuit board having processing circuitry according to the first configuration can be changed to a second circuit board having processing circuitry according to the second configuration without having to change or modify the interconnect components.

[0040] In some embodiments, the multiple interconnect points on the second circuit board can be divided into multiple groups. Furthermore, each of the multiple groups can be located at a different position on the second circuit board. For example, in some embodiments, the multiple interconnect points can be divided into four separate groups. The first group of interconnect points can be located at a first position on the second circuit board. The second group can be located at a second position on the second circuit board, which is approximately 90 degrees circumferentially spaced from the first position. The third group can be located at a third position on the second circuit board, which is approximately 180 degrees circumferentially spaced from the first position. The fourth group can be located at a fourth position on the second circuit board, which is approximately 270 degrees circumferentially spaced from the first position.

[0041] It should be understood that the position of each of the multiple sets of interconnect points on the second circuit board allows the second circuit board to be adapted to each of multiple configurations of the processing circuit without having to change the position of the multiple interconnect points thereon. In this way, a second circuit board having processing circuitry according to a first configuration can be changed to having processing circuitry according to a second configuration without changing or modifying the interconnect components. It should also be understood that the multiple interconnect points on the second circuit board can be aligned with the multiple interconnect points on the first circuit board along both radial and circumferential directions.

[0042] In some embodiments, the sensing sensor may include a housing configured to be adapted to the first circuit board, the second circuit board, and the interconnect components. For example, the housing may define a cavity configured to be adapted to the first circuit board, the second circuit board, and the interconnect components. The first circuit board, the second circuit board, and the interconnect components may be positioned in a stacked configuration within the cavity such that the interconnect components are located between the first circuit board and the second circuit board. It should be understood that the housing, the first circuit board, and the second circuit board may have any suitable shape. For example, in some embodiments, the housing, the first circuit board, and the second circuit board may each have an annular shape.

[0043] In some embodiments, the target of the sensing sensor may include a backplate. In such embodiments, the target may be positioned relative to the housing such that the backplate of the housing and the target together shield the circuit board of the sensing sensor (e.g., a first circuit board and a second circuit board) from the external environment in which the sensing sensor is located. More specifically, the housing and the housing of the target may isolate the circuit board of the sensing sensor from one or more metal components present in the external environment. In this way, electromagnetic coupling between one or more external metal components and the circuit board of the sensing sensor can be prevented.

[0044] Furthermore, in some embodiments, the target can be positioned relative to the housing such that an air gap is defined between the housing and the target's backplate in both the radial and axial directions. In such embodiments, the length of the backplate, as measured radially, can be at least as long as the radial length of the first circuit board and the radial length of the second circuit board. In this way, although an air gap is defined between the housing and the backplate in the radial direction, the backplate of the housing and the target can still shield the circuit boards of the inductive sensor (e.g., the first and second circuit boards) from the influence of the external environment.

[0045] Details of the interconnect assembly configured to electrically couple a first circuit board to a second circuit board will now be discussed. In some embodiments, the interconnect assembly may include a plurality of conductive pins coupled between the first and second circuit boards. For example, in some embodiments, a first end of each of the plurality of conductive pins may be connected to the first circuit board. Additionally, a second end of each of the plurality of conductive pins may be connected to the second circuit board. In this way, a sensor element disposed on the first circuit board can be electrically connected to processing circuitry disposed on the second circuit board via the plurality of conductive pins.

[0046] It should be understood that the multiple conductive pins can be connected to the first and second circuit boards in any suitable manner. For example, in some embodiments, the first end of each of the multiple conductive pins can be soldered to a corresponding interconnect point among multiple interconnect points (e.g., pads) on the first circuit board. Similarly, the second end of each of the multiple conductive pins can be soldered to a corresponding interconnect point among multiple interconnect points on the second circuit board.

[0047] In some embodiments, the interconnect components may include spacers. The spacers may be positioned axially between a first circuit board and a second circuit board. It should be understood that the spacers may have any suitable shape. For example, in some embodiments, the spacers may have an annular shape.

[0048] The spacer may define multiple holes. Each of the multiple holes may be aligned radially and circumferentially with a corresponding interconnect point among multiple interconnect points on the first and second circuit boards, respectively. In this way, each of the multiple holes may be adapted to couple with a corresponding conductive pin among multiple conductive pins between the first and second circuit boards.

[0049] In some embodiments, the plurality of holes defined by the spacer can be divided into multiple groups. Furthermore, each of the multiple groups can be positioned at a different location on the spacer. For example, in some embodiments, the plurality of holes can be divided into four separate groups. A first group of holes can be positioned at a first location on the spacer. A second group of holes can be positioned at a second location on the spacer, approximately 90 degrees circumferentially spaced from the first location. A third group of holes can be positioned at a third location on the spacer, approximately 180 degrees circumferentially spaced from the first location. A fourth group can be positioned at a fourth location on the spacer, approximately 270 degrees circumferentially spaced from the first location.

[0050] In some embodiments, the spacer may include one or more pillars extending axially through corresponding holes in a plurality of holes defined by a first circuit board. In this way, movement of the first circuit board in at least one direction (e.g., radial direction) can be restricted via the spacer. Alternatively or additionally, the spacer may include one or more pillars extending axially through corresponding holes in a plurality of holes defined by a second circuit board. In this way, movement of the second circuit board in one or more directions (e.g., radial direction) can be restricted via the spacer. In some embodiments, a plurality of interconnect points on the first circuit board may include a plurality of holes defined by the first circuit board. Alternatively or additionally, a plurality of interconnect points on the second circuit board may include a plurality of holes defined by the second circuit board.

[0051] The sensing sensor according to this disclosure can provide numerous technical effects and benefits. For example, since the positions of multiple interconnect points on the first circuit board are identical (e.g., fixed) for each of the multiple different coil configurations of the sensor element disposed thereon, the first circuit board can be replaced without modifying or changing the interconnect components. This can facilitate the interchangeability of the first circuit board to suit motors requiring different coil configurations. Furthermore, interconnect points on the first circuit board that are not used by the interconnect components can be used to help orient the spacers of the interconnect components relative to the first circuit board.

[0052] Now for reference Figure 1 , Figure 1A sensing sensor 100 according to an exemplary embodiment of the present disclosure is depicted. As shown, the sensing sensor 100 may include a sensor element 110. The sensor element 110 may include a transmitting coil 112 having one or more turns. The sensor element 110 may also include a plurality of receiving coils 114. Each of the plurality of receiving coils 114 may have one or more turns.

[0053] As shown, the plurality of receiving coils 114 may include at least a first receiving coil 116 and a second receiving coil 118. In some embodiments, the first receiving coil 116 may have a shape corresponding to a first sine wave. Additionally, the second receiving coil 118 may have a shape corresponding to a second sine wave phase-shifted relative to the first sine wave. In some embodiments, the second sine wave may be phase-shifted by 90 degrees relative to the first sine wave. In such embodiments, the first receiving coil 116 and the second receiving coil 118 may be a sine receiving coil and a cosine receiving coil, respectively. It should be understood that in some embodiments, the plurality of receiving coils 114 may include more than two receiving coils (e.g., the first receiving coil 116 and the second receiving coil 118). For example, in some embodiments, the plurality of receiving coils 114 may include three or more separate receiving coils.

[0054] The sensing sensor 100 may include a target 120 that moves relative to the sensor element 110. The target 120 may be any object, including metal. For example, in some embodiments, the target 120 may include a loop structure. In some embodiments, the target 120 may be mounted to an object that moves relative to the sensor element 110. In some embodiments, the object may be the rotor of an electric motor. In such embodiments, the sensor element 110 may be mounted to the stator of the electric motor. It should be understood that in some embodiments, the target 120 may be integral with the rotor.

[0055] The sensing sensor 100 may include processing circuitry 130 associated with the sensor element 110. The processing circuitry 130 may include a transmit (“TX”) drive circuitry 132 configured to generate an AC signal provided to the transmit coil 112 of the sensor element 110. In some embodiments, the TX drive circuitry 132 may include a free-running oscillator that generates the AC signal at a drive frequency determined by the inductance of the transmit coil 112 and the capacitance of a capacitor (not shown) connected in parallel with the transmit coil 112. In some embodiments, the target 120 includes a resonant circuit, and the drive frequency is set to the resonant frequency of that resonant circuit.

[0056] Providing an AC signal to the transmitting coil 112 induces an electromotive force (EMF) in the first receiving coil 116 (e.g., a sine receiving coil) and the second receiving coil 118 (e.g., a cosine receiving coil), causing current to flow into the first receiving coil 116 and the second receiving coil 118. However, due to the arrangement of the first receiving coil 116 and the second receiving coil 118 relative to the transmitting coil 112, the EMF directly induced in the first receiving coil 116 and the second receiving coil 118 is negligible, resulting in negligible current flowing in the first receiving coil 116 and the second receiving coil 118. However, the EMF induced in the transmitting coil 112 via the target 120 in the plurality of receiving coils 114 does indeed cause current to flow in each of the plurality of receiving coils 114 (e.g., the first receiving coil 116 and the second receiving coil 118).

[0057] In some embodiments, each of the plurality of receiving coils 114 may be formed by a separate winding, such that a separate current flows in each of the plurality of receiving coils 114. For example, the first receiving coil 116 and the second receiving coil 118 may each be formed by a separate winding, such that a separate current flows in the first receiving coil 116 and the second receiving coil 118. Furthermore, the first receiving coil 116 and the second receiving coil 118 may be coupled to separate terminals (not shown) associated with the processing circuitry 130, wherein the current flowing in the first receiving coil 116 is processed to provide a first output signal 150, and the current flowing in the second receiving coil 118 is processed to provide a second output signal 152.

[0058] In some embodiments, the processing circuit 130 includes an EMC filter circuit 134 associated with filtered harmonics related to the current flowing in the first receiving coil 116. For example, the EMC filter circuit 134 may be associated with filtered harmonics at frequencies different from the drive frequency. In this way, harmonics caused by interference from electrical signals generated by other nearby electrical components can be removed. The filtered electrical signal then passes through a synchronous demodulation circuit 136, in which it is mixed with a demodulated signal from the TX drive circuit 132.

[0059] The demodulated electrical signal then passes through a low-pass filter 138, which is configured to remove high-frequency components that have deviated from the baseband components, and then through a gain and output buffer circuit 140, which allows adjustable gain to be applied before being output as the first output signal 150. It should be understood that the induced signal from the second receiving coil 118 also passes through an EMC filter circuit 134, a synchronous demodulation circuit 136, a low-pass filter 138, and a gain and output buffer circuit 140 before being output as the second output signal 152.

[0060] In some embodiments, the position of target 120 relative to sensor element 110 can be determined at least in part based on the first output signal 150 and the second output signal 152. For example, the position of target 120 relative to sensor element 110 may correspond to the arctangent of the first output signal 150 divided by the second output signal 152. In such embodiments, one or more processors 142 of processing circuitry 130 may be configured to output a signal indicating the position of target 120 relative to sensor element 110. Alternatively and / or additionally, one or more processors may be configured to output a signal indicating the velocity of target 120 based at least in part on the first output signal 150 and the second output signal 152. In some embodiments, the velocity of target 120 and / or the position of target 120 relative to sensor element 110 may be calculated by one or more processors located remotely from sensing sensor 100.

[0061] In some embodiments, the processing circuitry 130 may include one or more sensors 144. For example, in some embodiments, the one or more sensors 144 may include a temperature sensor configured to monitor the temperature of the environment in which the sensing sensor 100 is located. Alternatively and / or additionally, the one or more sensors 144 may include one or more motion sensors (e.g., accelerometers). Furthermore, in some embodiments, the processing circuitry 130 may include one or more communication interfaces 146 configured to facilitate communication with the sensor element 110 and / or one or more devices located remotely from the sensing sensor 100. It should be understood that the one or more communication interfaces 146 may include any suitable wired or wireless interface.

[0062] In some embodiments, the TX drive circuit 132, the EMC filter circuit 134, the synchronous demodulation circuit 136, the low-pass filter 138, and the gain and output buffer circuit 140 may each be implemented as a single integrated circuit. Furthermore, in some embodiments, one or more processors 142, one or more sensors 144, and one or more communication interfaces 146 may be included within the integrated circuit.

[0063] Now for reference Figures 2 to 4 According to an exemplary embodiment of this disclosure, components of a sensing sensor 200 are provided. As shown, the sensing sensor 200 defines a coordinate system including an axial direction A, a circumferential direction C, and a radial direction (not shown). The sensing sensor 200 may include a first circuit board 210 on which the above-mentioned reference is disposed. Figure 1 The sensor element 110 is discussed. The sensing sensor 200 may also include a second circuit board 220, which is spaced apart from the first circuit board 210 along the axial direction A. Furthermore, referenced above... Figure 1One or more electronic components (e.g., processors, sensors, etc.) of the processing circuitry 130 discussed may be disposed on the second circuit board 220. For example, in some embodiments, one or more processors 142 of the processing circuitry 130 may be disposed on the second circuit board 220. Alternatively and / or additionally, one or more sensors 144 associated with the processing circuitry 130 may be disposed on the second circuit board 220. Furthermore, in some embodiments, one or more communication interfaces 146 may be disposed on the second circuit board 220.

[0064] In some embodiments, the sensing sensor 200 may include a housing 230 defining a cavity 232, in which a first circuit board 210 and a second circuit board 220 are disposed. For example, in some embodiments, the first circuit board 210 and the second circuit board 220 may be positioned within the cavity 232 of the housing 230 such that the first circuit board 210 and the second circuit board 220 are stacked along an axial direction A. In some embodiments, the housing 230 may define an opening 234 configured to couple to a plurality of conductors (e.g., wires) or connectors 216 of the second circuit board 220. As shown, the plurality of connectors 216 may be at least partially disposed within a shield or sheath 218. In particular, each of the plurality of connectors 216 passing through a portion of the opening 234 defined by the housing 230 may be disposed within the sheath 218.

[0065] It should be understood that, in some embodiments, the second circuit board 220 may include a plurality of connectors 216 that can be connected to a plurality of terminals 520. Figure 6 In this way, electrical communication can be provided between the processing circuitry 130 on the second circuit board 220 and one or more electronic devices coupled to multiple connectors 216.

[0066] In some embodiments, the sensor 200 may include a cover 240 positioned on the housing 230 to enclose the first circuit board 210 and the second circuit board 220 within a cavity 232 defined by the housing 230. In this way, the circuit boards (e.g., the first circuit board 210 and the second circuit board 220) disposed within the cavity 232 defined by the housing 230 can be shielded from the influence of the external environment in which the sensor 200 is located. Furthermore, in some embodiments, the sensor 200 may include a gasket 250 positioned on the housing 230 to provide a seal between the housing 230 and the cover 240.

[0067] It should be understood that the cover 240 can be removed (e.g., detached) from the housing 230 to allow the user access to the first circuit board 210 and the second circuit board 220. In this way, as will be discussed in more detail below, the user can replace the first circuit board 210 and / or the second circuit board 220 as needed to suit a motor or generator of a different configuration. It should also be understood that the housing 230 can be formed of any suitable material. For example, in some embodiments, the housing 230 may be formed of metal.

[0068] Now, a brief reference. Figure 5 and 6 The first circuit board 210 and the second circuit board 220 may each include a plurality of interconnect points 400, 500. In some embodiments, the first circuit board 210 and the second circuit board 220 may each include the same number of interconnect points 400, 500. It should be understood that each of the plurality of interconnect points 500 on the second circuit board 220 is aligned with a corresponding interconnect point of the plurality of interconnect points 400 on the first circuit board 210 along the circumferential direction C and the radial direction R.

[0069] In some embodiments, the multiple interconnect points 400, 500 may include multiple pads. However, it should be understood that the multiple interconnect points 400, 500 may include any suitable type of connection to facilitate electrical communication between the two circuit boards (e.g., the first circuit board 210 and the second circuit board 220) of the sensing sensor 200. As will be discussed in more detail below, in some embodiments, the sensing sensor 200 may include interconnect components 300 ( Figure 2 The interconnect component 300 is configured to electrically couple the first circuit board 210 to the second circuit board 220 to facilitate the sensor element 110 on the first circuit board 210. Figure 1 ) and the processing circuit 130 on the second circuit board 220 Figure 1 Electrical connection between ).

[0070] Now for reference Figures 7 to 9 The interconnect component 300 may include a plurality of conductive pins 310. The plurality of conductive pins 310 may be coupled between a first circuit board 210 and a second circuit board 220. In this manner, the first circuit board 210 and the second circuit board 220 may be electrically connected to each other via the plurality of conductive pins 310. For example, in some embodiments, a first end 312 of each of the plurality of conductive pins 310 may be connected to a corresponding interconnect point among a plurality of interconnect points 400 on the first circuit board 210. Additionally, a second end 314 of each of the plurality of conductive pins 310 may be connected to a corresponding interconnect point among a plurality of interconnect points 500 on the second circuit board 220.

[0071] It should be understood that the plurality of conductive pins 310 can be connected to a plurality of interconnect points 400, 500 on the first circuit board 210 and the second circuit board 220 in any suitable manner. For example, in some embodiments, the first end 312 of each of the plurality of conductive pins 310 may be soldered to a plurality of interconnect points 400 on the first circuit board 210. Figure 3 The corresponding interconnect points in the circuit. Similarly, the second end 314 of each of the plurality of conductive pins 310 can be soldered to the plurality of interconnect points 500 on the second circuit board 220. Figure 4 The corresponding interconnection points in ).

[0072] In some embodiments, the interconnect component 300 may include a spacer 320 positioned along an axial direction A between the first circuit board 210 and the second circuit board 220. In this way, the first circuit board 210 may be spaced apart from the second circuit board 220 via the spacer 320. As shown, the spacer 320 may have an annular shape. However, it should be understood that the spacer 320 may have any suitable shape.

[0073] In some embodiments, the spacer 320 may include one or more feet 324. Furthermore, in embodiments where the spacer 320 includes multiple feet 324, the feet 324 may be spaced apart from each other in the circumferential direction C. It should be understood that the feet 324 may contact the bottom wall 236 of the housing 230. Figure 2 This arrangement ensures that the second circuit board 220 is spaced apart from the bottom wall 236 of the housing 230 along the axial direction A. In this way, when the second circuit board 220 is located within the cavity 232 defined by the housing 230, the second circuit board 220 does not contact the bottom wall 236 of the housing 230.

[0074] As shown, the spacer 320 may define a plurality of holes 340. It should be understood that each of the plurality of holes 340 is aligned with a corresponding interconnection point of a plurality of interconnection points 400, 500 on the first circuit board 210 and the second circuit board 220, respectively, along the circumferential direction C and the radial direction R. In this way, each of the plurality of holes 340 may be configured to be suitable for coupling with a corresponding conductive pin in a plurality of conductive pins 310 between the first circuit board 210 and the second circuit board 220.

[0075] In some embodiments, the plurality of holes 340 can be divided into multiple groups. Furthermore, each group can be located at a different position on the spacer 320. For example, as... Figure 8As shown, the plurality of holes 340 can be divided into three separate groups. More specifically, the first group 350 of holes 340 can be positioned at a first location on the spacer 320. The second group 352 of holes 340 can be positioned at a second location on the spacer 320, which is spaced approximately 90 degrees from the first location along the circumferential direction C. The third group 354 of holes 340 can be located at a third location on the spacer 320, which is spaced approximately 180 degrees from the first location along the circumferential direction C. As shown, the number of holes 340 included in each of the three groups (e.g., the first group 350, the second group 352, and the third group 354) can be different. However, it should be understood that in alternative embodiments, the number of holes 340 included in each group can be the same.

[0076] In some embodiments, spacer 320 may include one or more posts 370 extending along an axial direction A in a first direction 372, such that the one or more posts 370 extend through corresponding holes in a plurality of holes 410 defined by the first circuit board 210. In this way, movement of the first circuit board 210 along at least one direction (e.g., a radial direction) can be limited via spacer 320. Alternatively and / or additionally, spacer 320 may include one or more posts 380 along an axial direction A in a second direction 382 different from the first direction 372, such that the one or more posts 380 extend through corresponding holes in a plurality of holes 510 defined by the second circuit board 220. In this way, movement of the second circuit board 220 along at least one direction (e.g., a radial direction) can be limited via spacer 320.

[0077] Now for reference Figure 10 A top view of another embodiment of the spacer 320 is provided according to this disclosure. The spacer 320 has an annular shape (e.g., circular). However, it should be understood that the spacer 320 can have any suitable shape. It should also be understood that each of the plurality of holes 340 configured to be adapted for a plurality of conductive pins 310 can be connected to a plurality of interconnect points 400, 500 on the first circuit board 210 and the second circuit board 220 respectively along the radial direction R and the circumferential direction C. Figure 5 and Figure 6 The corresponding interconnection points are aligned. Furthermore, as will be discussed in more detail below, the multiple holes 340 can be divided into multiple groups. Moreover, each of the multiple groups can be positioned at a different location on the spacer 320.

[0078] As shown, the plurality of holes 340 can be divided into a first group of 390 holes 340, a second group of 392 holes 340, a third group of 394 holes 340, and a fourth group of 396 holes 340. The first group of 390 holes 340 can be located at a first position on the spacer 320. The second group of 392 holes 340 can be located at a second position on the spacer 320, which is approximately 90 degrees away from the first position along the circumferential direction C. The third group of 394 holes 340 can be located at a third position on the spacer 320, which is approximately 180 degrees away from the first position along the circumferential direction C. The fourth group of 396 holes 340 can be located at a fourth position on the spacer 320, which is approximately 270 degrees away from the first position along the circumferential direction C.

[0079] Now for reference Figure 11-18 Sensor element 110 (located on the first circuit board 210) Figure 1 and 3 It can be constructed in multiple different coil configurations to suit different types of motors (e.g., pole pair configurations). Figure 10-17 The construction based on the first coil is described ( Figure 11 ), second coil construction ( Figure 12 ), third coil construction ( Figure 13 ), fourth coil construction ( Figure 14 ), fifth coil construction ( Figure 15 ), sixth coil construction ( Figure 16 ), the construction of the seventh coil ( Figure 17 ) and the construction of the eighth coil ( Figure 18 The sensor element 110 is arranged on the first circuit board 210. However, it should be understood that the sensor element 110 can be constructed with any suitable number of different coil configurations. For example, in some embodiments, the sensor element 110 can be constructed with more (e.g., greater than 8) or fewer (e.g., less than 8) coil configurations. As will be discussed below, for each of the multiple coil configurations of the sensor element 110, the positions of the multiple interconnect points 400 on the first circuit board 210 can be the same (e.g., fixed). In this way, the first circuit board 210 having the sensor element 110 disposed thereon according to one of the multiple coil configurations can be replaced with the first circuit board 210 having the sensor element disposed thereon according to a different coil configuration of the multiple coil configurations without changing or modifying the interconnect components 300. Figure 7 It should be understood that, in some embodiments, the pattern associated with each different coil construction may begin at the same location on the first circuit board 210.

[0080] In some embodiments, the plurality of interconnect points 400 on the first circuit board 210 can be divided into multiple groups. Furthermore, each of the multiple groups can be located at a different position on the first circuit board 210. For example, in some embodiments, the plurality of interconnect points can be divided into a first group 420, a second group 422, a third group 424, and a fourth group 426 of interconnect points 400. The first group 420 of interconnect points 400 can be located at a first position on the first circuit board 210. The second group 422 of interconnect points 400 can be located at a second position on the first circuit board 210, which is spaced approximately 90 degrees from the first position along the circumferential direction C. The third group 424 of interconnect points 400 can be located at a third position on the first circuit board 210, which is spaced approximately 180 degrees from the first position along the circumferential direction C. The fourth group 426 of interconnect points 400 can be located at a fourth position on the first circuit board 210, which is spaced approximately 270 degrees from the first position along the circumferential direction C.

[0081] It should be understood that the position of each of the multiple groups of interconnect points 400 (e.g., first group 420, second group 422, third group 424, fourth group 426) allows the first circuit board 210 to be adapted to each of the multiple coil configurations without having to change the position of the multiple interconnect points 400 on the first circuit board 210. In this way, a first coil configuration suitable for a first motor ( Figure 11 The first circuit board 210 can be replaced with a first circuit board 210 having a second coil configuration suitable for the second motor, without changing or modifying the interconnect components 300.

[0082] In some embodiments, the first group 420, the second group 422, the third group 424, and the fourth group 426 of interconnect points 400 may each include the same number of interconnect points 400. For example, the first group 420, the second group 422, the third group 424, and the fourth group 426 of interconnect points 400 may each include four interconnect points 400. Furthermore, in some embodiments, the four interconnect points 400 included in each of the first group 420, the second group 422, the third group 424, and the fourth group 426 may be arranged in a diamond configuration. However, it should be understood that the interconnect points 400 included in each of the multiple groups can be arranged according to any suitable configuration.

[0083] Although discussed with reference to multiple interconnect points 400 on the first circuit board 210 Figure 11-18However, it should be understood that the plurality of interconnect points 500 on the second circuit board 220 can be arranged in a similar manner. For example, in some embodiments, the processing circuit 130 may include a first set of electronic components (e.g., sensors, processors, communication interfaces, etc.) disposed on the second circuit board 220 according to a first configuration or layout. Alternatively, the processing circuit 130 may include a second set of electronic components, which are different from the first set of electronic components and disposed on the second circuit board 220 according to a second configuration or layout different from the first configuration.

[0084] It should be understood that for each of the multiple different configurations of the processing circuit 130, the positions of the multiple interconnect points 500 on the second circuit board 220 can be the same (i.e., fixed). In this way, a second circuit board 220 having the processing circuit 130 according to the first configuration disposed thereon can be replaced with a second circuit board 220 having the processing circuit 130 according to the second configuration disposed thereon, without having to change or modify the interconnect components 300. Figure 7 It should also be understood that each of the plurality of interconnect points 500 on the second circuit board 220 is aligned with a corresponding interconnect point of the plurality of interconnect points 400 on the first circuit board 210 along the radial direction R and the circumferential direction C.

[0085] Now for reference Figure 19 In some embodiments, the target 120 of the sensing sensor 200 may include a backplate 122. In such embodiments, the target 120 may be positioned relative to the housing 230 such that the housing 230 and the backplate 122 together shield the first circuit board 210, the interconnect assembly 300, and the second circuit board 220 from the influence of the external environment in which the sensing sensor 200 is located. More specifically, the housing 230 and the backplate 122 of the target 120 may electrically shield the first circuit board 210, the interconnect assembly 300, and the second circuit board 220 from one or more metal components present in the external environment. In this way, electromagnetic coupling between one or more metal components and the sensing sensor 100, particularly its first circuit board 210, interconnect assembly 300, and second circuit board 220, can be prevented.

[0086] Furthermore, in some embodiments, the target 120 may be positioned relative to the housing 230 such that an air gap 600 is defined along the radial direction R between the housing 230 and the backplate 122. Additionally, the air gap 600 may be further defined along the axial direction A between the housing 230 and the backplate 122. However, it should be understood that the length of the backplate 122, as measured along the radial direction R, may be greater than the length of the first circuit board 210 as measured along the radial direction R and the length of the second circuit board 220 as measured along the radial direction R. In this way, the backplate 122 of the housing 230 and the target 120 can still jointly shield the first circuit board 210 and the interconnect assembly 300 (…). Figure 7 The first circuit board 210, the interconnect assembly 300, and the second circuit board 220 are protected from the external environment in which the sensing sensor 200 is located. More specifically, although an air gap 600 is defined between the housing 230 and the back plate 122 of the target 120 along the radial direction R and the axial direction A, the housing 230 and the back plate 122 of the target 120 can still electrically shield the first circuit board 210, the interconnect assembly 300, and the second circuit board 220 from one or more metal components present in the external environment. In this way, electromagnetic coupling between one or more metal components and the sensing sensor 100, and in particular its first circuit board 210, interconnect assembly 300, and second circuit board 220, can be prevented.

[0087] In some embodiments, the foot 324 of the spacer 320 may contact the bottom wall 236 of the housing 230, which extends radially R between the inner wall 237 and the outer wall 238 of the housing 230. In this way, the second circuit board 220 may be spaced apart from the bottom wall 236 of the housing 230 along the axial direction A as shown. It should be understood that in alternative embodiments, the second circuit board 220 may be located on the bottom wall 236 of the housing 230. In particular, the second circuit board 220 may contact (e.g., touch) the bottom wall 236 of the housing 230.

[0088] Now for reference Figure 20 In some embodiments, the sensing sensor 200 may include an unbroken conductive plane 610. In some embodiments, the unbroken conductive plane 610 may include an electrically grounded plane. In alternative embodiments, the unbroken conductive plane 610 may include a power plane. In other embodiments, the unbroken conductive plane 610 may be electrically floating (i.e., not electrically grounded).

[0089] As shown, the uninterrupted conductive plane 610 may be located within the cavity 232 defined by the housing 230. Furthermore, the uninterrupted conductive plane 610 may extend radially between the inner wall 237 and the outer wall 238 of the housing 230. In some embodiments, the uninterrupted conductive plane 610 may be spaced apart radially from the inner wall 237 and the outer wall 238. In this way, an air gap may be defined between the uninterrupted conductive plane 610 and the inner wall 237 of the housing 230. Similarly, an air gap may be defined between the uninterrupted conductive plane 610 and the outer wall 238 of the housing 230.

[0090] A continuous conductive plane 610 can replace the bottom wall 236 of the housing 230. Figure 19In this way, since the bottom wall 236 of the housing 230 is no longer needed, the amount of material (e.g., metal) required for the housing 230 can be reduced. As shown, the length of the uninterrupted conductive plane 610, as measured in the radial direction R, can be equal to or greater than the length of the second circuit board 220, as measured in the radial direction R. In this way, the housing 230, the uninterrupted conductive plane 610, and the backplate 122 of the target 120 can collectively shield the first circuit board 210, the second circuit board 220, and the interconnect assembly 300. Figure 6 This is to protect the sensor 200 from the influence of the external environment in which it is located. More specifically, the housing 230, the uninterrupted conductive plane 610, and the backplate 122 of the target 120 can electrically shield the first circuit board 210, the interconnect assembly 300, and the second circuit board 220 from one or more metal components in the external environment. In this way, electromagnetic coupling between one or more metal components and the sensor 200, particularly its first circuit board 210, interconnect assembly 300, and second circuit board 220, can be prevented.

[0091] In some embodiments, the uninterrupted conductive plane 610 may be separated from the second circuit board 220. In such embodiments, as shown, the second circuit board 220 may be located on the uninterrupted conductive plane 610. More specifically, the second circuit board 220 may contact (e.g., touch) the uninterrupted conductive plane 610. Alternatively, the second circuit board 220 may be spaced apart from the uninterrupted conductive plane 610 along the axial direction A. For example, in some embodiments, the feet 324 of the spacer 320 ( Figure 7 The second circuit board 220 can contact the uninterrupted conductive plane 610. In this way, the second circuit board 220 can be spaced apart from the uninterrupted conductive plane 610 along the axial direction A.

[0092] In some embodiments, the uninterrupted conductive plane 610 may be integrated with the second circuit board 220. For example, in some embodiments, the uninterrupted conductive plane 610 may be included as a layer of the second circuit board 220. In this way, the number of discrete components of the sensing sensor 200 can be reduced because the uninterrupted conductive plane 610 is included as one of the layers of the second circuit board 220.

[0093] Now for reference Figure 21In some embodiments, the first circuit board 210 and the second circuit board 220 may be positioned on a shelf located within a cavity 232 of the housing 230. For example, the first circuit board 210 may be positioned on a first shelf 700 located within the cavity 232. Conversely, the second circuit board 220 may be positioned on a second shelf 710 located within the cavity 232. As shown, the second shelf 710 may be spaced apart from the first shelf 700 in the axial direction A, such that the first circuit board 210 and the second circuit board 220 are spaced apart from each other in the axial direction A. In this way, the spacer 320 of the interconnecting assembly 300 ( Figure 7 There is no longer a need to provide an axial spacing between the first circuit board 210 and the second circuit board 220. Furthermore, although the first shelf 700 and the second shelf 710 are depicted as integral with the housing 230, it should be understood that in some embodiments, the first shelf 700 and the second shelf 710 may be separable from the housing 230 (i.e., not integral).

[0094] Now for reference Figure 22 and 23 According to an example embodiment of this disclosure, a sensing sensor 800 is provided. As shown, the sensing sensor 800 includes the components referenced above. Figure 1 The objective discussed is 120. Furthermore, the sensing sensor 800 includes a circuit board 810. The circuit board 810 may include a first set of layers 820, a second set of layers 830, and an intermediate third set of layers 840 located between the first set of layers 820 and the second set of layers 830. The sensor element 110 may be included within the first set of layers 820. Additionally, one or more electronic components (e.g., a processor, a sensor, a communication interface) of the processing circuitry 130 associated with the sensor element 110 may be included within the second set of layers 830. In some embodiments, the thickness 842 of the intermediate third set of layers 840 may be greater than the thickness 822 of the first set of layers and the thickness 832 of the second set of layers 830. In this way, the first set of layers 820 may be spaced apart from the second set of layers 830 via the intermediate third set of layers 840. In some embodiments, the intermediate third set of layers 840 may be formed of FR4 material. Alternatively or additionally, at least one of the first set of layers 820 or the second set of layers 830 may be formed of FR4 material.

[0095] As shown, the circuit board 810 may include a plurality of conductive vias 850 extending from the first layer 820 through an intermediate third layer 840 to the second layer 830. In this way, the plurality of conductive vias 850 can electrically couple a sensor element 110 included in the first layer 820 of the circuit board 810 to a processing circuit 130 included in the second layer 830 of the circuit board 810. Furthermore, it should be understood that the plurality of conductive vias 850 may be located in the same position for each of the plurality of different coil configurations of the sensor element 110 and for each of the plurality of different configurations of the processing circuit 130.

[0096] It should be understood that the first group of layers 820, the second group of layers 830, and the intermediate third group of layers 840 may each include one or more layers. For example, the first group of layers 820 may include one or more layers of the circuit board 810, the second group of layers 830 may include one or more layers of the circuit board 810, and the intermediate third group of layers 840 may include one or more layers of the circuit board 810.

[0097] While the subject matter has been described in detail with reference to specific exemplary embodiments of the invention, it should be understood that those skilled in the art, upon understanding the foregoing, can readily make changes, variations, and equivalents to these embodiments. Therefore, the scope of this disclosure is illustrative rather than restrictive, and this disclosure does not exclude such modifications, variations, and / or additions to the subject matter, which will be readily apparent to those skilled in the art.

Claims

1. A sensing sensor defining an axial direction, a circumferential direction, and a radial direction, the sensing sensor comprising: A first circuit board, the first circuit board comprising: A sensor element can be constructed in various different coil configurations, the sensor element including a transmitting coil and multiple receiving coils, the transmitting coil being configured to induce current in the multiple receiving coils via a target; For each of the multiple different coil configurations, multiple interconnection points are located at the same position on the first circuit board; and A second circuit board, spaced apart from the first circuit board along the axial direction, includes: The processing circuit, associated with the sensor element, can be constructed in a variety of different configurations; and For each of the multiple different configurations of the processing circuit, multiple interconnect points located at the same position on the second circuit board are aligned with a corresponding interconnect point on the first circuit board along the circumferential and radial directions. A housing defining the cavity, in which a first circuit board and a second circuit board are disposed; An interconnect assembly is disposed within a cavity of the housing such that the interconnect assembly is located axially between a first circuit board and a second circuit board. The interconnect assembly includes a plurality of conductive pins, each of which is coupled between a corresponding interconnect point on the first circuit board and a corresponding interconnect point on the second circuit board. The interconnect assembly further includes a spacer positioned between the first circuit board and the second circuit board, the spacer including one or more legs spaced apart from each other, the one or more legs contacting the bottom wall of the housing. and The target, positioned relative to the housing, includes a backplate such that the housing and the backplate shield the first and second circuit boards from electromagnetic coupling with one or more metal components located outside the housing, and the target is configured to move relative to the sensor elements of the first circuit board.

2. The sensing sensor according to claim 1, wherein, The first and second circuit boards each include the same number of interconnect points.

3. The sensing sensor according to claim 1, wherein, The multiple receiving coils have different coil periods for each of the multiple different coil configurations.

4. The sensing sensor according to claim 1, wherein, The multiple interconnection points of the first circuit board and the second circuit board include: The first set of interconnection points located at the first position; A second set of interconnecting points located at a second position, the second position being approximately 90 degrees apart from the first position along the circumferential direction; The third set of interconnecting points is located at a third position, which is approximately 180 degrees apart from the first position along the circumferential direction; and The fourth set of interconnecting points is located at the fourth position, which is approximately 270 degrees apart from the first position along the circumferential direction.

5. The sensing sensor according to claim 4, wherein, At least one of the first group of interconnect points, the second group of interconnect points, the third group of interconnect points, and the fourth group of interconnect points includes four interconnect points arranged in a diamond configuration.

6. The sensing sensor according to claim 1, wherein the first circuit board and the second circuit board are disposed in the cavity.

7. The sensing sensor according to claim 1, wherein, The number of conductive pins is less than the number of interconnect points on at least one of the first and second circuit boards.

8. The sensing sensor according to claim 1, wherein: The first end of each of the plurality of conductive pins is connected to a corresponding interconnect point on the first circuit board; and The second end of each of the multiple conductive pins is connected to a corresponding interconnect point on the second circuit board.

9. The sensing sensor according to claim 1, wherein, The spacer defines a plurality of holes, each of which is aligned radially and circumferentially with a corresponding interconnection point on the first circuit board and the second circuit. Each of the plurality of holes is configured to be adapted to a corresponding conductive pin among a plurality of conductive pins, such that the corresponding conductive pin extends through it.

10. The sensing sensor according to claim 9, wherein, The plurality of holes defined by the spacer include: The first set of holes is located at the first position; A second set of holes is located at a second position, which is approximately 90 degrees apart from the first position along the circumferential direction; The third set of holes is located at a third position, which is approximately 180 degrees circumferentially spaced from the first position; and The fourth set of holes is located at the fourth position, which is approximately 270 degrees apart from the first position along the circumferential direction.

11. The sensing sensor according to claim 9, wherein, The spacer also includes: A first post extending in a first direction along an axial direction, the first post extending through a hole defined by a first circuit board; and A second post extends in a second direction along an axial direction, the second post extending through a hole defined by a second circuit board.

12. The sensing sensor according to claim 1, wherein, The processing circuit includes at least one of a motion sensor and a temperature sensor.

13. The sensing sensor according to claim 1, wherein, The processing circuit includes one or more processors configured to process output signals obtained from one or more of the plurality of receiving coils.

14. A sensing sensor defining an axial direction, a circumferential direction, and a radial direction, the sensing sensor comprising: Shell, defining cavity; Target; A first circuit board, disposed within the cavity, comprises: A sensor element can be constructed in various different coil configurations, the sensor element including a transmitting coil and a plurality of receiving coils, the transmitting coil being configured to induce current in the plurality of receiving coils via the target; For each of the multiple different coil configurations, multiple interconnection points are located at the same position on the first circuit board; A second circuit board is disposed within the cavity, such that the second circuit board is spaced apart from the first circuit board in the axial direction. The second circuit board includes: The processing circuit, associated with the sensor element, can be constructed in a variety of different configurations; and For each of the multiple different configurations of the processing circuit, multiple interconnect points located at the same position on the second circuit board are aligned along the circumferential and radial directions with a corresponding interconnect point on the first circuit board. An interconnect assembly is disposed within a cavity of the housing such that it is axially positioned between a first circuit board and a second circuit board. The interconnect assembly includes a plurality of conductive pins, each of which is coupled between a corresponding interconnect point on the first circuit board and a corresponding interconnect point on the second circuit board. The interconnect assembly further includes a spacer positioned between the first and second circuit boards, the spacer including one or more legs spaced apart from each other, the one or more legs contacting the bottom wall of the housing. The target includes a backplate such that the housing and the backplate shield the first circuit board and the second circuit board from electromagnetic coupling with one or more metal components located outside the housing, and the target is configured to move relative to the sensor element of the first circuit board.

15. The sensing sensor according to claim 14, wherein: The first circuit board is located on the first part disposed within the cavity; and The second circuit board is located on a second shelf disposed within the cavity, and the second shelf is spaced apart from the first shelf in the axial direction.

16. The sensing sensor according to claim 15, wherein, The first and second shelves are integral with the housing.

17. The sensing sensor according to claim 14, wherein, An air gap is defined between the back plate and the housing in the radial direction.

18. The sensing sensor according to claim 17, wherein, The air gap is further defined axially between the back plate and the housing.

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