Light source package and mobile device including the same

Abstract

A light source package includes a substrate, a first light source device disposed on the substrate and configured to emit light of a first wavelength, a second light source device disposed on the substrate spaced apart from the first light source and configured to emit light of a second wavelength different from the first wavelength, and a light-transmissive structure disposed above the first and second light source devices and including at least one first lens configured to increase a beam angle of the light of the first wavelength and at least one second lens configured to decrease a beam angle of the light of the second wavelength.

Description

[0001] Cross-reference to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2020-0058123 filed with the Korean Intellectual Property Office on May 15, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] An exemplary embodiment of the present invention relates to a light source package and a mobile device including the light source package. Background Technology

[0004] Recently, due to the emphasis on camera functionality in mobile devices such as mobile phones, distance measurement methods utilizing the time-of-flight (TOF) method for measuring distances at high speeds have been adopted. However, a problem exists in the light source package that emits pulsed light for measuring TOF: the light source package is frequently damaged due to high power and low reliability. Additionally, there is a problem that the light source package used for TOF measurement is configured to be separate from the light source package used for illuminating the object. Summary of the Invention

[0005] An exemplary embodiment of the present invention provides a light source package having improved robustness and reliability, wherein multiple light sources having different illumination beams are integrated, and a method thereof.

[0006] Example embodiments also provide a mobile device including a light source package.

[0007] According to one aspect of an example embodiment, a light source package is provided, which may include: a substrate having a first surface and a second surface opposite to each other, and having a device mounting region; a first light source device disposed in the device mounting region and configured to emit light of a first wavelength; a second light source device disposed in the device mounting region spaced apart from the first light source and configured to emit light of a second wavelength different from the first wavelength; a shielding shell disposed around the first light source device and the second light source device, and providing a light emission window through which light of the first wavelength and the second wavelength are emitted; and a light-transmitting molding disposed above the light emission window, and including a first lens array superimposed with the first light source device and a second lens array superimposed with the second light source device.

[0008] According to one aspect of an example embodiment, a light source package is provided, which may include: a substrate having a device mounting region; a vertical-cavity surface-emitting laser (VCSEL) device disposed in the device mounting region; a shielding shell configured to surround the VCSEL device and provide a light emission window through which light emitted from the VCSEL device is output; and a light-transmitting molding disposed above the light emission window and supporting the shielding shell, the light-transmitting molding comprising a lens array formed of a plurality of lenses and configured to be superimposed on the light emission window, the plurality of lenses having a predetermined pitch.

[0009] According to one aspect of an example embodiment, a mobile device is provided, which may include: a housing having a first surface and a second surface opposite to each other; a camera module mounted on at least one of the first surface and the second surface of the housing; and one of the above light source packages mounted adjacent to the camera module on the at least one of the first surface and the second surface of the housing. Attached Figure Description

[0010] The above and other aspects, features, and advantages of the exemplary embodiments will become more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0011] Figure 1 This is a perspective view showing a light source package according to an example embodiment;

[0012] Figure 2 This illustrates an example embodiment. Figure 1 An exploded perspective view of the light source package shown in the image;

[0013] Figure 3 According to the example embodiment along Figure 1 A cross-sectional view taken from line I-I';

[0014] Figure 4 This illustrates an example embodiment. Figure 1 A plan view of the lens array shown;

[0015] Figure 5 According to the example embodiment Figure 3 A magnified view of the lens array;

[0016] Figure 6 This illustrates a method based on an example embodiment. Figure 2 The diagram shows the beam angle of the light emitted by the light source package.

[0017] Figure 7A According to the example embodiment, from Figure 6 The light emitted by the vertical cavity surface-emitting laser (VCSEL) device is transmitted through the first lens array and then distributed according to the angle of light.

[0018] Figure 7B According to the example embodiment, from Figure 6 The light emitted by the light-emitting diode (LED) is transmitted through the second lens array and then distributed according to the angle of light intensity.

[0019] Figure 8 This is a cross-sectional view of a VCSEL device that can be used in a light source package according to an example embodiment;

[0020] Figure 9 This is a cross-sectional view of an LED device that can be used in a light source package according to an example embodiment;

[0021] Figure 10 This is a cross-sectional view showing a light source package according to an example embodiment;

[0022] Figure 11 This is a cross-sectional view showing a light source package according to an example embodiment;

[0023] Figure 12 This illustrates, according to an example embodiment, when an infrared filter is added... Figure 11 A curve showing the distribution of spectral sensitivity when the light source is packaged.

[0024] Figure 13 This illustrates, according to an example embodiment, when an infrared cutoff filter is added... Figure 11 A curve showing the distribution of spectral sensitivity when the light source is packaged.

[0025] Figures 14 to 18 This is an illustrative representation based on an example embodiment. Figure 3 A diagram illustrating the manufacturing process of the light source package;

[0026] Figure 19 and Figure 20 These are front perspective views and rear perspective views of a mobile device with a camera according to an example embodiment; and

[0027] Figure 21 According to the example embodiment along Figure 20 The cross-sectional view taken from line III-III'. Detailed Implementation

[0028] In the following description, exemplary embodiments of the inventive concept are described with reference to the accompanying drawings.

[0029] It will be understood that when an element or layer is referred to as "above," "over," "below," "connected to," or "coupled to" another element or layer, the element or layer may be directly above, above, above, below, or directly connected to or coupled to the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as "directly above," "over," "below," "below," "directly connected to," or "directly coupled to" another element or layer, there are no intermediate elements or layers. The same reference numerals always indicate the same element.

[0030] Figure 1 This is a perspective view of the light source module according to an embodiment. Figure 2 yes Figure 1 The exploded view of the light source module shown is as follows. Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0031] Reference Figure 1 and Figure 2 According to this embodiment, the light source package 100 includes a substrate 110, a first light source device 120 and a second light source device 130 disposed adjacent to each other on the upper surface of the substrate 110, a shielding shell 140 surrounding or covering the first light source device 120 and the second light source device 130 and having a light emission window 141, and a light-transmitting molding 150 covering the light emission window 141.

[0032] For example, substrate 110 may be a substrate such as a printed circuit board (PCB), a metal core PCB (MCPCB), a metal PCB (MPCB), a flexible PCB (FPCB), a ceramic substrate, etc., and the first light source and the second light source may be electrically connected to the circuitry of substrate 110. In some embodiments, an additional device such as a Zener diode may be mounted on substrate 110. In this embodiment, substrate 110 may be an MPCB as an example.

[0033] Reference Figure 3 The substrate 110 may be a metal substrate wiring board and has a first surface 110A and a second surface 110B opposite to each other. It may also include a metal plate 111 having a plurality of through-holes TH1 to TH3 penetrating the substrate 110 from the first surface 110A to the second surface 110B. The metal plate 111 may comprise a metal or alloy with high thermal and electrical conductivity. For example, the metal plate 111 may comprise copper (Cu), aluminum (Al), or alloys thereof.

[0034] Reference Figure 2 and Figure 3The device mounting area MA, in which the first light source device 120 and the second light source device 130 are mounted, is located at the center of the first surface 110A of the substrate 110. A ground electrode P1 can be located at the periphery of the device mounting area MA. The ground electrode P1 is the area where the shielding shell 140 is grounded and can be used to electrically shield the shielding shell 140, which is configured to cover the light source with high output to shield electromagnetic interference (EMI) emitted from the light source. Multiple pads P2 to P5 connected to the first light source device 120 and the second light source device 130 can be located in the device mounting area MA. The first light source device 120 and the second light source device 130 can be surface-mounted on pads P3 and P4 of the multiple pads P1 to P5, respectively, and connected to pads P2 and P5 of the multiple pads P1 to P5 via wires W.

[0035] The substrate 110 may include a vertical wiring structure connecting the first surface 110A and the second surface 110B. For example... Figure 3 As shown, such a vertical wiring structure may include multiple vias CV1, CV4, and CV5 respectively disposed in multiple vias TH1 to TH3. The multiple vias CV1, CV4, and CV5 can be electrically insulated from the metal plate 111 through the insulating structure 112. Additionally, vias CV2 and CV3 may be included below the pad P3, penetrating the insulating structure 112 and connecting to the metal plate 111. Thus, due to the structure in which the first light source device 120 and the second light source device 130 directly contact the metal plate 111, the substrate 110 can have high heat dissipation efficiency; therefore, even if a high-power light source is installed, the heat generated from the light source can be effectively dissipated through the metal plate 111.

[0036] In this embodiment, the first light source device 120 may be a vertical-cavity surface-emitting laser (VCSEL) device. A VCSEL device may be a device that emits near-infrared light from an emitter disposed on its surface. This will be referred to... Figure 8 Provide a detailed description. Figure 8 This is a cross-sectional view of a VCSEL device that can be used in the light source package of this embodiment.

[0037] Reference Figure 8In a VCSEL device, multiple emitters 122 and a first electrode 124 can be disposed on the front side 120A of the main body 121, and a second electrode 123 can be disposed on the back side 120B of the main body 121. In an embodiment, near-infrared light (approximately 940 nm) with high output (approximately 2 W or more) can be emitted from the multiple emitters 122 at a very narrow beam angle (approximately 30°). The near-infrared light emitted from the multiple emitters 122 can be pulsed light, which in an embodiment can flicker at a period of approximately 100 to 400 MHz. The multiple emitters 122 can be arranged in a two-dimensional array (such as a matrix array) with a predetermined pitch PT3. Therefore, the light emitted from each of the multiple emitters 122 can illuminate the front of the first light source device 120 in the form of a two-dimensional array of point matrices. The near-infrared light emitted from the VCSEL device in the form of an array of point matrices can be used as pulses for distance measurement in the time-of-flight (TOF) method.

[0038] In this embodiment, the second light source device 130 may be a light-emitting diode (LED) device. The LED device can emit white light with a wavelength different from the near-infrared light emitted from the first light source device 120. The second light source device 130 may include an LED chip and a wavelength conversion device. This will be referred to... Figure 9 Provide a detailed description.

[0039] The LED device may include a light-emitting structure S disposed on a support substrate 131 and a transparent electrode layer 136 disposed on one surface of the light-emitting structure S. The light-emitting structure S may include a second conductivity type semiconductor layer 135, an active layer 134 and a first conductivity type semiconductor layer 133 sequentially disposed on the support substrate 131.

[0040] The support substrate 131 can be a substrate made of a conductive material or an insulating substrate having electrode structures (such as conductive vias connected in the vertical direction of the support substrate 131). The support substrate 131 serves to support the light-emitting structure S and simultaneously provides electrodes therein for applying power to the second conductivity type semiconductor layer 135. The support substrate 131 can be attached to the light-emitting structure S via a conductive adhesive layer 132. The conductive adhesive layer 132 is designed to further enhance the contact between the second conductivity type semiconductor layer 135 and the support substrate 131, and may include Ag solder paste and quasi-eutectic metals (such as Au / Ge, Au / In, Au containing Au / Sn, etc.).

[0041] The light-emitting structure S may include a first conductivity type semiconductor layer 133, a second conductivity type semiconductor layer 135, and an active layer 134. The first conductivity type semiconductor layer 133 may be an n-type In... x Al y Ga1-x-y a nitride semiconductor of N(0≤x<1, 0≤y<1, 0≤x+y<1), and the n-type impurity may be Si. For example, the first conductive type semiconductor layer 133 may comprise n-type GaN. The second conductive type semiconductor layer 135 may be p-type In satisfying x Al y Ga 1-x-y N(0≤x<1, 0≤y<1, 0≤x+y<1) nitride semiconductor layer, and the p-type impurity may be Mg. For example, the second conductive type semiconductor layer 135 may be implemented as a single-layer structure, but may also have a multi-layer structure including layers with different components, as in the present exemplary embodiment.

[0042] The active layer 134 may have a multiple quantum well (MQW) structure in which quantum well layers and quantum barrier layers are alternately stacked. For example, the quantum well layers and quantum barrier layers may be In with different components x Al y Ga 1-x-y N(0≤x≤1, 0≤y≤1, 0≤x+y≤1). In a specific example, the quantum well layer may be In x Ga 1-x N(0<x≤1), and the quantum barrier layer may be GaN or AlGaN. The thicknesses of the quantum well layer and the quantum barrier layer may each be in a range from 1 nm to 50 nm. The active layer 134 is not limited to a multiple quantum well structure, and may be a single quantum well structure.

[0043] The transparent electrode layer 136 may be disposed on the first conductive type semiconductor layer 133 of the light emission structure S. The transparent electrode layer 136 may be made of a transparent conductive oxide (TCO) material such as indium tin oxide (ITO), and graphene may be used if necessary.

[0044] Compared with a VCSEL device, an LED device having such a structure has a very wide light beam angle. When the LED device is used as a flash for capturing images, it is necessary to reduce the light beam angle to concentrate light only on an area that can be captured by a camera. In this embodiment, a lens array for reducing the light beam angle may be disposed in the light emission window 141 through which light emitted from the LED device transmits, thereby increasing the amount of light per unit area of light emitted forward.

[0045] Reference Figure 2 and Figure 3The shielding shell 140 can be configured to cover the first light source device 120 and the second light source device 130 to block EMI noise emitted from the first light source device 120 and the second light source device 130. The end 142 can be grounded to the ground electrode P1 of the substrate 110. A light emission window 141 can be disposed in the central region of the shielding shell 140, overlapping with the device mounting area MA in which the first light source device 120 and the second light source device 130 are disposed, such that light emitted from the first light source device and the second light source device can pass through the light emission window 141 to illuminate the front of the shielding shell 140. The shielding shell 140 can be manufactured by rolling a steel sheet, such as nickel silver, stainless steel, or aluminum alloy, into a can shape.

[0046] The light-transmitting molding 150 can be configured to cover the light-emitting window 141 of the shielding shell 140, and can be formed by molding the light-transmitting resin in the shielding shell 140 to cover the entire shielding shell 140. However, according to an embodiment, the light-transmitting molding 150 can be configured to cover the light-emitting window 141 of the shielding shell 140, rather than completely covering the shielding shell 140. The end 142 of the shielding shell 140 can be exposed outside the light-transmitting molding 150 to be electrically connected to the ground electrode P1 of the substrate 110. A lens unit 151 for adjusting the beam angle of the light emitted from the first light source device 120 and the second light source device 130 can be disposed in the region of the light-transmitting molding 150 that overlaps with the light-emitting window 141.

[0047] The light-transmitting molding 150 may have a first surface 150A facing the first light source device 120 and the second light source device 130, and a second surface 150B opposite to the first surface 150A. A lens unit 151 may be disposed on the first surface 150A. According to an embodiment, the lens unit 151 may also be disposed on the second surface 150B. The lens unit 151 may include one or more lens arrays, each of which is formed by a plurality of lenses. In this embodiment, two lens arrays LA1 and LA2 are disposed on the first surface 150A of the light-transmitting molding 150, and a lens array LA3 is disposed on the second surface 150B. The first to third lens arrays LA1, LA2, and LA3 may be configured to overlap with the light-emitting window 141 of the shielding shell 140, having areas respectively overlapping with the first light source device 120 and the second light source device 130.

[0048] The first lens array to the third lens array LA1, LA2, and LA3 may include multiple lenses for adjusting the light distribution characteristics of light from the first light source device 120 and the second light source device 130, respectively. This will refer to... Figure 4 and Figure 5 To describe it. Figure 4 It is shown Figure 1A plan view of the lens array shown. Figure 5 yes Figure 3 A magnified view of the lens array.

[0049] Reference Figure 4 When viewed from above, the first lens array LA1 and the second lens array LA2 can be configured to overlap with the first region A1 and the second region A2 of the third lens array LA3, respectively. The first lens array LA1 and the second lens array LA2 can each consist of multiple lenses LENS1 and LENS2. The first lens array LA1 may include multiple first lenses LENS1 having a first pitch PT1, and the second lens array LA2 may include multiple second lenses LENS2 having a second pitch PT2. The optical axes of the multiple first lenses LENS1 and the multiple second lenses LENS2 can be the same as the optical axes of the light emitted from the first light source device 120 and the second light source device 130, respectively. The multiple first lenses LENS1 and the multiple second lenses LENS2 can be rectangular when viewed from above, and can be formed such that the ratio of the horizontal W1 and W3 to each of the vertical W2 and W4 is 3:4. This corresponds to a 4:3 ratio of the width to the height of an image captured by an imaging device included in a camera. In this case, the first pitch PT1 and the second pitch PT2 can be equal to each other. Therefore, although the lenses have different appearances, the multiple first lenses LENS1 and the multiple second lenses LENS2 can have the same area when viewed from above. In this embodiment, the first pitch PT1 and the second pitch PT2 can be any value ranging from 15 to 50 μm. When the first pitch PT1 of the first lens array LA1 and the second pitch PT2 of the second lens array LA2 are less than 15 μm, the lens shape cannot be formed normally, and therefore, the lens function may not be performed correctly. When they exceed 50 μm, optical crosstalk between adjacent lenses may occur. According to the embodiment, each of the first pitch PT1 and the second pitch PT2 can be connected to the first light source device 120 (i.e., Figure 8 The predetermined pitch PT3 of the multiple transmitters 122 of the VCSEL device shown may be the same or different.

[0050] Reference Figure 5 and Figure 6The plurality of first lenses LENS1 may have the same shape, and according to the embodiment, each of them may be formed by a concave lens or a convex lens. The plurality of first lenses LENS1 may have a surface shape that increases the beam angle of the light L1 emitted from the VCSEL device (first light source device 120) from a first beam angle θ1 to a second beam angle θ2. In addition, in contrast to the plurality of first lenses LENS1, the plurality of second lenses LENS2 may have a surface shape that decreases the beam angle of the light L2 emitted from the LED device (i.e., the second light source device 130) from a third beam angle θ3 to a fourth beam angle θ4. For example, the ratio of the height TK1 to the diameter W1 of the surface shape of the plurality of first lenses LENS1 may be TK1 / W1<1, and the ratio of the height TK2 to the diameter W3 of the surface shape of the plurality of second lenses LENS2 may be TK2 / W3≥1. As in this embodiment, when the plurality of first lenses LENS1 and the plurality of second lenses LENS2 have rectangular bottom surfaces, the diameters W1 and W3 may be the smaller width or length of the rectangular bottom surface, respectively, with the horizontal length having a relatively small width.

[0051] Therefore, the light emitted from the first light source device 120 and the second light source device 130 has different beam angles, but it is transmitted through the first lens array LA1 and the second lens array LA2 respectively, and can be adjusted to a second beam angle θ2 and a fourth beam angle θ4 that are similar to each other.

[0052] Figure 7A The brightness distribution according to angle is shown after light emitted from the VCSEL device (i.e., the first light source device 120) is transmitted through the first lens array LA1 of the light-transmitting mold 150. Figure 7A The overall directionality of the light is enhanced, so that the maximum illuminance value I2 is located between 0° and ±90° of the beam angle. The maximum illuminance value I2 is 120% of the illuminance value I1 when the beam angle is 0°, and the brightness distribution has a batwing shape. Figure 7B The brightness distribution according to angle is shown after light emitted from the LED device (i.e., the second light source device 130) is transmitted through the second lens array LA2 of the light-transmitting mold 150. Figure 7B This shows that the overall directionality of the light is reduced, so that the highest illuminance value I3 is located at a beam angle of 0°.

[0053] A third lens array LA3 can be disposed on the second surface 150B to be superimposed on the first lens array LA1 and the second lens array LA2, and can be formed by a plurality of third lenses LENS3 having the same shape overall. In this embodiment, each of the plurality of third lenses LENS3 can be configured to have the same area as 25 first lenses LENS1 or second lenses LENS2. Therefore, when viewed from above, they can be configured such that the first lens array LA1 and the second lens array LA2 are projected onto the third lens array LA3. In this embodiment, one third lens LENS3 can be configured to be superimposed on 25 first lenses LENS1 or second lenses LENS2. According to an embodiment, each of the plurality of third lenses LENS3 can be formed by a convex lens or a concave lens.

[0054] The material used to form the light-transmitting molded part 150 is not specifically limited, as long as it is a light-transmitting material. Therefore, light-transmitting resins such as silicone resin, epoxy resin, and acrylic resin can be used. In this embodiment, silicone resin can be used as the light-transmitting resin. The light-transmitting molded part 150 can be formed by a transfer molding method, wherein a shielding shell 140 is disposed inside the molded part and a flowable resin flows through it.

[0055] The light source package with the above configuration can be used as a light source for distance measurement in the TOF method for measuring the distance between an object and a camera. According to the TOF method, the time from when pulsed light is irradiated onto the object to when the pulsed light reflected from the object is received is measured, and the distance between the object and the camera is calculated based on the measured time. However, because the light emitted from a VCSEL device (typically used as a light source for pulsed light) has high output (approximately 2W or more) and illuminates with a very narrow beam angle (approximately 30°), when the object is a human, the retina can be damaged when the light emitted from the VCSEL device directly shines on the eye. To prevent such retinal damage, a method is used to reduce the amount of light per unit area by increasing the beam angle of the light emitted from the VCSEL device. For this purpose, a method is used to increase the beam angle of the light emitted from the VCSEL device by placing a glass substrate with a lens made of resin material on the front surface of the VCSEL device. However, when the glass substrate is damaged, the light with the narrow beam angle is emitted as is. To prevent this, a transparent electrode layer is placed on the surface of a glass substrate, causing the VCSEL to stop operating if the glass substrate is damaged. However, this increases manufacturing costs and reduces operational reliability due to the complex configuration. In this embodiment, since a lens array can be integrally formed with a shielding shell using silicone resin through molding, the lens array is used to increase the beam angle of light transmitted through the light emission window 141 of the VCSEL device. Therefore, this structure is simple, reduces manufacturing costs, and improves operational reliability compared to using a glass substrate.

[0056] Figure 10 This is a cross-sectional view showing the light source package 200 according to an embodiment. Figures 1 to 6 Compared to previous embodiments, the difference lies in that only the first light source device 220 is provided, and there is no second light source device. Furthermore, in the above embodiments, the first lens array LA1 and the second lens array LA2 are provided on the light-transmitting molding component; however, the difference in this embodiment is that the lens unit 251 on the first surface 250A of the light-transmitting molding component 250 only includes the first lens LENS4. The arrangement of multiple second lenses LENS5 on the second surface 250B of the light-transmitting molding component 250, and the arrangement of the substrate 210, the first light source device 220, and the shielding shell 240 are... Figures 1 to 6 The previous embodiments are the same, therefore, their detailed description is omitted to prevent repetition.

[0057] Figure 11 This is a cross-sectional view showing the light source package 300 according to an embodiment. Figures 1 to 6Compared to previous embodiments, these differ in that a photodetector 360 is provided as a first light sensor adjacent to the first light source device 320, and an ambient light sensor ALS 370 is also provided as a second optical sensor adjacent to the second light source device 330. The configuration of the substrate 310, the first light source device 320, the second light source device 330, and the shielding shell 340 is similar to... Figures 1 to 6 The same applies to the embodiments described above; therefore, its detailed description is omitted to prevent repetition.

[0058] Most of the light L3 emitted from the first light source device 320 can be emitted outside the light source package 300. However, light L4 emitted from the first light source device 320 and subsequently reflected by the second surface 350B of the light-transmitting molded member 350 is incident on the photodetector 360 and detected. This method allows monitoring of a certain amount of light from the first light source device 320. Additionally, the ambient light sensor 370 can detect ambient light L6 and monitor a certain amount of ambient light. However, among the light emitted from the first light source device 320, light L8, after being reflected from the second surface 350B of the light-transmitting molded member 350 and incident on the ambient light sensor 370, generates optical crosstalk, which causes incorrect light measurement by the ambient light sensor 370.

[0059] In addition, most of the light L5 emitted from the second light source device 330 can be emitted outside the light source package 300. However, among the light emitted from the second light source device 330, the light L7 that is reflected from the second surface 350B and then incident on the photodetector 360 will produce optical crosstalk. Due to this optical crosstalk, the measurement value of the photodetector 360 will be incorrect.

[0060] In this embodiment, an infrared filter CL1 that allows only light or near-infrared light with a wavelength of approximately 900 nm or greater to pass through can be disposed on the upper surface of the photodetector 360, and an infrared cutoff filter that blocks light or near-infrared light with a wavelength of approximately 900 nm or greater can be disposed on the upper surface of the ambient light sensor 370, thereby blocking reflected light L7 incident on the photodetector 360 and blocking reflected light L8 incident on the ambient light sensor 370. Therefore, optical crosstalk occurring in the photodetector 360 and the ambient light sensor 370 can be reduced.

[0061] Figure 12 This shows the addition of an infrared filter. Figure 11 The curve showing the distribution of spectral sensitivity based on wavelength when packaging the light source. Figure 13 This illustrates adding an infrared cutoff filter. Figure 11 The curve shows the distribution of spectral sensitivity based on wavelength when packaging a light source.

[0062] Figure 12 G1 is shown where the infrared filter is not set as... Figure 11 The curves showing the spectral sensitivity of the photodetector 360 in the comparison example are shown in Figure G2, which illustrates the spectral sensitivity of an embodiment in which an infrared filter is set in the photodetector 360. In the case of G2, it can be seen that only infrared light with wavelengths of 900 nm or greater passes through.

[0063] Figure 13 G3 is shown where the infrared cutoff filter is not set as in Figure 11 The ambient light sensor 370 shown in the diagram is a curve illustrating the spectral sensitivity of a comparative example. Curve G4 illustrates the spectral sensitivity of an embodiment in which an infrared cutoff filter is configured in the ambient light sensor 370. In case G4, it can be seen that infrared light with wavelengths of 900 nm or greater is blocked.

[0064] Reference Figures 14 to 18 The manufacturing process of the light source package according to the embodiments will be described. Figures 14 to 18 It is shown schematically. Figure 3 A diagram illustrating the manufacturing process of the light source package. Specifically, Figures 14 to 17 The process for manufacturing a mold for producing a light-transmitting molded part used in manufacturing a light source package is shown. Figure 18 The use of molds to manufacture translucent molded parts is shown.

[0065] Reference Figure 14 The upper mold M1 can be formed by forming a first uneven portion C1 on the bottom surface HL of the mold body MB, where the groove portion H1 is formed. This process can be performed using a diamond lathe (DTM). The reference numeral DT denotes the cutting tool of the diamond lathe. The first uneven portion C1 can be formed to have a shape similar to... Figures 1 to 6 The dimensions corresponding to the third lens array LA3 in the embodiment.

[0066] Figures 15 to 17 The process of forming the lower mold is shown.

[0067] Reference Figure 15 A trench portion H2 can be formed on a glass wafer WA, and a second uneven portion C2 and a third uneven portion C3 can be formed on the bottom surface of the trench portion H2. The trench portion H2 and the second uneven portion C2 and the third uneven portion C3 can be formed at one time or sequentially.

[0068] The third region A3 and the fourth region A4, which are respectively provided with the second uneven part C2 and the third uneven part C3, can be set in accordance with... Figures 1 to 6In the embodiments, the first region A1 and the second region A2 correspond to each other. The second uneven portion C2 and the third uneven portion C3 can be formed to have respectively with the regions corresponding to the first region A1 and the second region A2. Figures 1 to 6 The dimensions of the first lens array LA1 and the second lens array LA2 in the embodiment are shown. The second uneven portion C2 and the third uneven portion C3 can be formed such that the pitch between two adjacent uneven portions is any value ranging from 15 μm to 50 μm. Since such fine-sized uneven portions cannot be formed by the diamond lathe described above, they can be formed by semiconductor manufacturing processes. That is, the trench portion H2 and the second uneven portion C2 and the third uneven portion C3 can be formed on the wafer WA by photolithography processes using semiconductor manufacturing processes.

[0069] Next, as Figure 16 As shown, the plating layer ML can be formed to fill the trench portion H2. Since the plating layer ML is separated and used as a mold in subsequent processes, it can be formed to cover the wafer WA with a predetermined thickness T sufficient to ensure mechanical strength. The second uneven portion C2 and the third uneven portion C3 of the wafer WA can be transferred to the separated plating layer ML to form the fourth uneven portion C4 and the fifth uneven portion C5. When the plating layer ML formed using a scraper B is cut to the cell package size, it can be manufactured... Figure 17 The lower mold M2.

[0070] Next, as Figure 18 As shown, when a shielding shell 140 is provided between the upper mold M1 and the lower mold M2, and resin is injected and subsequently molded, a [structure / form] can be formed. Figure 3 The light-transmitting molded part 150 shown is used as an example. The light source package 100 can be manufactured by combining a substrate 110 on which the first light source device 120 and the second light source device 130 are mounted with the light-transmitting molded part 150 manufactured as described above.

[0071] Figure 19 and Figure 20 These are, respectively, a front perspective view and a rear perspective view of the camera-embedded mobile device according to the embodiment. Figure 21 It is intercepted along line III-III' shown therein. Figure 20 Cross-sectional view.

[0072] Reference Figure 19 and Figure 20 The mobile device 500 according to this embodiment may include a housing 510, which includes a first surface (or front) 510A, a second surface (or back) 510B and a side surface 510C surrounding the space between the first surface 510A and the second surface 510B.

[0073] In an embodiment, the first surface 510A may be formed by a front panel 502 that is at least partially transparent (e.g., glass or a polymer comprising various coatings). The second surface 510B may be formed by a substantially opaque back panel 511. The back panel 511 may be formed, for example, by coating with glass or colored glass, ceramic, polymer, metal, or a combination of at least two of the above materials. The side surface 510C may be formed by a side frame structure (or “side member”) 518 in conjunction with the front panel 502 and the back panel 511, and may comprise metal and / or polymer.

[0074] The mobile device 500 according to this embodiment may include at least one or more of the following: a display 501, audio modules 503, 507 and 514, a sensor module 504, multiple camera modules 505 and 550, key input units 515, 516 and 517, an indicator 506, and connector holes 508 and 509. In some embodiments, the mobile device 500 may omit at least one of the above-mentioned components, or may additionally include other components.

[0075] For example, the display 501 may be exposed through the main portion of the front panel 502. The display 501 may be located adjacent to or combined with touch sensing circuitry, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field stylus.

[0076] Audio modules 503, 507, and 514 may include a microphone hole 503 and speaker holes 507 and 514. The microphone hole 503 may house a microphone for acquiring external sound, and in some embodiments, multiple microphones may be provided to sense the direction of sound. Speaker holes 507 and 514 may include an external speaker hole 507 and a call receiver hole 514. In some embodiments, speaker holes 507 and 514 and the microphone hole 503 may be implemented as a single hole, or a speaker may be included without speaker holes 507 and 514.

[0077] Camera modules 505 and 550 can be disposed on a first surface 510A and a second surface 510B of the mobile device 500, respectively. Camera modules 505 and 550 may include one or more lenses, image sensors, and / or image signal processors. Camera module 550 disposed on the second surface 510B may include multiple red / green / blue (RGB) cameras 551, 552, and 553. Camera module 550 may also include a light source package 100 and a TOF camera 520. The multiple RGB cameras 551, 552, and 553 may include an ultra-wide-angle lens camera 551, a wide-angle lens camera 552, and a narrow-angle lens camera 553. The light source package 100 can provide white light for the multiple RGB cameras 551, 552, and 553 and near-infrared light for the TOF camera 520 within a single package. (See reference...) Figure 21 The light source package 100 can be mounted on the substrate 540 as a stacked package (POP) module combined with the inserter 560, and the inserter 560 can be a wiring substrate made of a material such as FR4. Additionally, a driver integrated circuit (IC) for controlling the light source package 100 can be disposed inside the inserter 560. The camera module 550 and the light source package 100 can be arranged as a single module, and a transparent substrate 530, such as glass, for protecting the camera module 550 and the light source package 100 can be disposed on the front side. A light-blocking layer BL can be disposed on one surface of the transparent substrate 530, and light-transmitting holes LH1 and LH2 can be disposed in areas corresponding to the camera module 550 and the light source package 100.

[0078] The sensor module 504 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the mobile device 500. The sensor module 504 can be, for example, a proximity sensor.

[0079] Key input units 515, 516, and 517 may include: a home button 515 disposed on a first surface 510A of the housing 510; a touch pad 516 disposed around the periphery of the home button 515; and / or a side button 517 disposed on a side surface 510C of the housing 510. In some embodiments, the mobile device 500 may exclude some or all of the above-described components, and alternatively, the mobile device 500 may be implemented using other input devices (such as soft keys on the display 501).

[0080] For example, an indicator 506 may be disposed on a first surface 510A of the housing 510. For example, the indicator 506 may provide status information of the mobile device 500 in the form of light and may include an LED. Connector holes 508 and 509 may include: a first connector hole 508 for receiving a connector (e.g., a USB connector) for transmitting and / or receiving power and / or data using external electronic devices; and a second connector hole 509 for receiving a connector (e.g., a headphone jack) for transmitting and receiving audio signals using external electronic devices.

[0081] In addition to the mobile communication terminal as in the previous example embodiments, the sensor-integrated flash LED package according to this embodiment can be advantageously applied to various electronic devices having a camera or image sensor.

[0082] As described above, according to the embodiments, a light source package that integrates light sources with different functions in a single package can be provided, and improved robustness and reliability can be provided.

[0083] The various beneficial advantages and effects of the present invention are not limited to those described above, and will be more readily understood in the process of describing specific embodiments of the present invention.

[0084] Although various exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the inventive concept as defined by the appended claims.

Claims

1. A light source package, comprising: The substrate has a first surface and a second surface opposite to each other, and has a device mounting area; A first light source device is disposed in the device mounting area and configured to emit light of a first wavelength; A second light source device is provided, which is spaced apart from the first light source device in the device mounting area, and is configured to emit light of a second wavelength different from the first wavelength; A shielding shell is configured to surround the first light source device and the second light source device to shield electromagnetic interference emitted from the first light source device and the second light source device, and to provide a light emission window through which light of the first wavelength and the second wavelength are emitted; as well as A light-transmitting molded part, comprising a first part and a second part, wherein at least a portion of the shielding shell is disposed inside the first part; The second portion extends from the first portion, overlaps with the light emitting window of the shielding shell, and is disposed above the first light source device and the second light source device. The second portion of the light-transmitting molded part includes a first lens array overlapped with the first light source device and a second lens array overlapped with the second light source device. The light-transmitting molded part is integrally molded with the shielding shell.

2. The light source package according to claim 1, wherein, The first light source device includes a vertical cavity surface-emitting laser device, and the second light source device includes a light-emitting diode device.

3. The light source package according to claim 2, wherein, The first lens array includes a plurality of first lenses, which are arranged at a predetermined pitch and have the same area. The second lens array includes a plurality of second lenses arranged at the predetermined pitch and having the same area. The surface shape of each of the plurality of first lenses is different from the surface shape of each of the plurality of second lenses.

4. The light source package according to claim 3, wherein, The predetermined pitch has a value in the range of 15 μm to 50 μm.

5. The light source package according to claim 4, wherein, The first light source device is configured to face the light emission window and has a plurality of emitters spaced apart at the predetermined pitch.

6. The light source package according to claim 2, wherein, The first lens array is configured to increase the beam angle of light of the first wavelength, and The second lens array is configured to reduce the beam angle of the light of the second wavelength.

7. The light source package according to claim 6, wherein, The first lens array includes a plurality of first lenses, wherein the height / length ratio of the plurality of first lenses is less than 1, and The second lens array includes a plurality of second lenses, wherein the height / length ratio of the height and length of the plurality of second lenses is ≥1.

8. The light source package according to claim 1, wherein, The light-transmitting molded part is formed from at least one of silicone resin, epoxy resin and acrylic resin.

9. The light source package according to claim 1, wherein, The light-transmitting molded part has a first surface facing the mounting area of ​​the device and a second surface opposite to the first surface. The first lens array and the second lens array are disposed on the first surface of the light-transmitting molded part.

10. The light source package according to claim 9 further includes a third lens array disposed on the second surface of the light-transmitting molded part to overlap with the light-emitting window.

11. The light source package according to claim 1, further comprising a ground electrode disposed at the edge of the substrate and connected to the shielding shell.

12. The light source package according to claim 2, further comprising: A first optical sensor is disposed adjacent to the first light source device and has a first light receiving area; as well as The second optical sensor is disposed adjacent to the second light source device and has a second light receiving area.

13. The light source package according to claim 12, wherein, An infrared filter is also provided in the first light-receiving area of ​​the first optical sensor, and An infrared cutoff filter is also provided in the second light receiving area of ​​the second optical sensor.

14. The light source package according to claim 13, wherein, The infrared filter is configured to allow light with a wavelength of 900 nm or longer to pass through, and The infrared cutoff filter is configured to block light with a wavelength of 900 nm or greater.

15. The light source package according to claim 12, wherein, The first optical sensor includes a photodetector configured to detect light of the first wavelength, and The second optical sensor includes an ambient light sensor.

16. A light source package, comprising: A substrate having a device mounting area; A vertical-cavity surface-emitting laser device is disposed in the device mounting area; A shielding shell is configured to surround the vertical cavity surface-emitting laser device to shield electromagnetic interference emitted from the vertical cavity surface-emitting laser device, and to provide a light emission window through which light emitted from the vertical cavity surface-emitting laser device is output; as well as A light-transmitting molded part, comprising a first part and a second part, wherein at least a portion of the shielding shell is disposed inside the first part; The second portion extends from the first portion, overlaps with the light emitting window of the shielding shell, and is disposed above the vertical cavity surface-emitting laser device, wherein the second portion of the light-transmitting molding includes a lens array formed by a plurality of lenses and configured to overlap with the light emitting window, the plurality of lenses having a predetermined pitch, and the light-transmitting molding is integrally molded with the shielding shell.

17. The light source package according to claim 16, wherein, The vertical cavity surface-emitting laser device is configured to face the light emission window and has a plurality of emitters spaced apart from each other at a predetermined pitch.

18. The light source package according to claim 16, wherein, The predetermined pitch has a value in the range of 15 μm to 50 μm.

19. A light source package, comprising: Substrate; A first light source device is disposed on the substrate and configured to emit light of a first wavelength; A second light source device is disposed on the substrate at a distance from the first light source device and is configured to emit light of a second wavelength different from the first wavelength; A shielding shell is configured to surround the first light source device and the second light source device to shield electromagnetic interference emitted from the first light source device and the second light source device, and to provide a light emission window through which light of the first wavelength and the second wavelength are emitted; as well as A light-transmitting structure comprising a first part and a second part, wherein at least a portion of the shielding shell is disposed inside the first part; The second portion extends from the first portion, overlaps with the light emitting window of the shielding shell, and is disposed above the first light source device and the second light source device. The second portion of the light-transmitting structure includes at least one first lens and at least one second lens. The at least one first lens is configured to increase the beam angle of the light of the first wavelength, and the at least one second lens is configured to decrease the beam angle of the light of the second wavelength. The light-transmitting structure is integrally molded with the shielding shell.

20. A mobile device, comprising: A housing having a first surface and a second surface that are opposite to each other; A camera module is mounted on at least one of the first and second surfaces of the housing; as well as According to claim 1, the light source package is mounted adjacent to the camera module on at least one of the first and second surfaces of the housing.

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