Display device

Abstract

A display device can include a display panel and an input sensor on the display panel. The input sensor can include an active area and a pad area adjacent to each other, and the input sensor can include a sensing electrode overlapping the active area to sense an input, a sensing pad overlapping the pad area, and a sensing line electrically connecting the sensing electrode to the sensing pad. The sensing pad can include a pad portion and an edge portion extending from the pad portion to an edge of the input sensor in a plan view. Each of the pad portion and the edge portion can include a first pad and a second pad at least partially overlapping the first pad. At least a portion of the second pad can be spaced apart from the first pad in the edge portion in the plan view.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0061651, filed on May 22, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of this disclosure relate to display devices and methods of manufacturing display devices. Background Technology

[0004] Various display devices are being developed for use in multimedia equipment, such as televisions, mobile phones, tablet computers, navigation systems, and game consoles. Keyboards or mice can be used as input devices for display devices. In some cases, input sensors, such as those on touch panels, are also used as input devices for display devices.

[0005] Various malfunctions can occur during the manufacturing process of display devices or in display devices manufactured using that process. Such malfunctions may occur in the input sensors. Summary of the Invention

[0006] According to an embodiment of the present invention, a display device including an input sensor and a method for manufacturing the same are provided.

[0007] According to another aspect of the embodiments of the present invention, a display device with a low failure rate is provided.

[0008] According to another aspect of the embodiments of the present invention, in the method of manufacturing a display device, malfunctions that may occur during the manufacturing of the display device can be prevented or substantially prevented.

[0009] According to one or more embodiments of the present invention, a display device includes a display panel and an input sensor on the display panel. The input sensor may include an active area and a pad area adjacent to the active area. The input sensor may include: a sensing electrode overlapping the active area and configured to sense an input; a sensing pad overlapping the pad area; and a sensing line electrically connecting the sensing electrode to the sensing pad. The sensing pad may include a pad portion and an edge portion, the edge portion extending from the pad portion to an edge of the input sensor when viewed in a plan view. Each of the pad portion and the edge portion may include a first pad and a second pad, the second pad at least partially overlapping the first pad. When viewed in a plan view, at least a portion of the second pad of the edge portion may be spaced apart from the first pad of the edge portion and may not overlap with the first pad of the edge portion.

[0010] In one embodiment, the edge portion may include a first portion and a second portion, the first portion being located in a first region adjacent to the pad portion, and the second portion being located in a second region extending from the first region to the edge of the input sensor. One end of the second portion may be aligned with the edge of the input sensor in the thickness direction of the input sensor.

[0011] In an implementation, the first portion of the edge portion may include: a first pad; a first insulating layer on the first pad; a second pad on the first insulating layer; and a second insulating layer on the second pad.

[0012] In one embodiment, the second insulating layer may cover the entire first pad, the first insulating layer, and the second pad.

[0013] In one embodiment, one end of the first insulating layer and one end of the first pad can be aligned with each other in the thickness direction of the display panel.

[0014] In an implementation, the second part may consist essentially only of a second pad, at least a portion of which is disposed on the display panel and exposed to the outside.

[0015] In one embodiment, the pad portion may further include: a first insulating layer on the first pad; and a second insulating layer on the second pad. A first contact hole may be defined in the first insulating layer to electrically connect the first pad to the second pad.

[0016] In one embodiment, a second contact hole may be defined in the second insulating layer to expose the second pad to the outside.

[0017] In an embodiment, the display panel may include: a first base substrate; a second base substrate opposite to the first base substrate; a circuit device layer between the first base substrate and the second base substrate; and a light-emitting device layer on the circuit device layer.

[0018] In one implementation, the first pad may contact the top surface of the second base substrate.

[0019] In an implementation, the second pad at the edge may include a plurality of second pads.

[0020] In an implementation, the second pad in the pad portion may overlap with the first pad, and the second pad in the edge portion may not overlap with the first pad.

[0021] In one embodiment, the first pad may include a metallic material, and the second pad may include a transparent conductive oxide (TCO) material.

[0022] According to one or more embodiments of the present invention, a method of manufacturing a display device may include: providing a display panel defining a display area, a pad area, and a cut area therein; arranging an input sensor including sensing pads on the display panel; and cutting the display panel and the input sensor along the cut area. The pad area and the cut area may be adjacent to the display area. Arranging the input sensor may include arranging a first pad on the display panel that overlaps at least with the pad area and the cut area, arranging a second pad on the first pad, and removing a portion of the first pad that overlaps with the cut area. The second pad may be arranged such that it does not overlap with the first pad in the cut area.

[0023] In one embodiment, the method may further include disposing of an insulating layer that does not overlap with the cutting area and covers the first and second pads. The placement of the insulating layer can be performed between removing the portion of the first pad that overlaps with the cutting area and cutting the display panel along the cutting area.

[0024] In one embodiment, removing the portion of the first pad that overlaps with the cutting area may include etching the portion of the first pad that overlaps with the cutting area.

[0025] In one embodiment, arranging the input sensor may further include arranging a first insulating layer on the first pad and arranging a second pad on the first insulating layer.

[0026] In one implementation, the first insulating layer may not overlap with the cutting area, and when the portion of the first pad that overlaps with the cutting area is etched, the insulating layer may cover the portion of the first pad that is different from the portion to be removed.

[0027] In one implementation, the input sensor may include a pad portion overlapping the pad area and an edge portion, and the edge portion may be adjacent to the cut area.

[0028] In one implementation, the second pad may be arranged such that at least a portion of the second pad does not overlap with the first pad at the edge. Attached Figure Description

[0029] The embodiments will become clearer through the following brief description of some exemplary embodiments, taken in conjunction with the accompanying drawings. The drawings illustrate non-limiting exemplary embodiments as described herein.

[0030] Figure 1A This is a perspective view illustrating a display device according to an embodiment of the concept of the present invention.

[0031] Figure 1B It is shown Figure 1A An exploded perspective view of the display device.

[0032] Figure 1C and Figure 1D It is along Figure 1B A sectional view taken by line A-A'.

[0033] Figure 2A This is a cross-sectional view illustrating a display substrate according to an embodiment of the present invention.

[0034] Figure 2B This is a plan view illustrating a display substrate according to an embodiment of the concept of the present invention.

[0035] Figure 3 This is a plan view illustrating an input sensor according to an embodiment of the concept of the present invention.

[0036] Figure 4A It is shown Figure 3 Plan view of area A1.

[0037] Figure 4B It is along Figure 4A A sectional view taken by line X-X'.

[0038] Figure 5A It is shown Figure 3 Plan view of area A2.

[0039] Figure 5B It is along Figure 5A A sectional view taken by the line Y-Y'.

[0040] Figure 6 It is shown Figure 3 Plan view of area A3.

[0041] Figure 7A It is along Figure 6 A sectional view taken from line I-I'.

[0042] Figure 7B It is along Figure 6 The sectional view taken from line II-II'.

[0043] Figure 7C It is along Figure 6 The sectional view taken from line III-III'.

[0044] Figure 7D It is along Figure 6 A sectional view taken from line IV-IV'.

[0045] Figure 7E It is along Figure 6 A sectional view taken by line V-V'.

[0046] Figures 8A to 8D This is a plan view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0047] Figure 9 This is a plan view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0048] Figure 10 This is a plan view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0049] Figure 11A and Figure 11B It's a floor plan. Figure 11A and Figure 11B Each of the figures illustrates a pad area of ​​a display device according to an embodiment of the present invention.

[0050] The accompanying drawings are intended to illustrate the general characteristics of the methods, structures, and / or materials used in some exemplary embodiments and to supplement the written description provided below. However, the drawings may not be drawn to scale and may not precisely reflect the structural or performance characteristics of any given embodiment, and should not be construed as limiting the range of values ​​or properties covered by the exemplary embodiments. For example, the relative thickness and location of components, layers, regions, and / or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numerals in the various drawings is intended to indicate the presence of similar or identical elements or features. Detailed Implementation

[0051] Embodiments of the inventive concept will now be described more fully with reference to the accompanying drawings, in which some exemplary embodiments are illustrated. However, embodiments of the inventive concept can be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of implementation to those skilled in the art. In the drawings, the thickness of layers and regions may be exaggerated for clarity. The same reference numerals in the drawings denote the same elements, and therefore their repeated descriptions may be omitted.

[0052] It should be understood that when an element is referred to as “connected” or “linked” to another element, the element may be directly connected or linked to the other element, or one or more intermediary elements may be present. Conversely, when an element is referred to as “directly connected” or “directly linked” to another element, no intermediary element is present. The same reference numerals denote the same element throughout. As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items. Other terms used to describe relationships between elements or layers (e.g., “between” vs. “directly between”, “adjacent” vs. “directly adjacent”, and “on” vs. “directly on”) should be interpreted in the same manner.

[0053] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, the first element, first component, first region, first layer, or first portion discussed below may be referred to as a second element, second component, second region, second layer, or second portion without departing from the teachings of the exemplary embodiments.

[0054] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature and another element (or feature) or feature (or feature) as shown in the accompanying drawings. It should be understood that, in addition to the orientations depicted in the drawings, spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will consequently be oriented “above” other elements or features. Thus, for example, the term “below” can encompass both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0055] The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit the exemplary embodiments. As used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context clearly indicates otherwise. It should also be understood that, as used herein, the terms “comprises,” “comprising,” “includes,” and / or “including” specify the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0056] Some exemplary embodiments of the inventive concept are described herein with reference to cross-sectional views that can serve as schematic diagrams (and intermediate structures of exemplary embodiments). Therefore, variations in the shapes shown in the figures should be expected, for example, due to manufacturing techniques and / or tolerances. Thus, embodiments of the inventive concept should not be construed as limited to the region-specific shapes shown herein, but should include, for example, deviations in shape due to manufacturing processes.

[0057] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of the inventive concept pertain. It should also be understood that terms, such as those defined in common dictionaries, shall be interpreted as having the meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0058] Figure 1A This is a perspective view illustrating a display device EA according to an embodiment of the concept of the present invention; Figure 1B yes Figure 1A An exploded perspective view of the display device EA; and Figure 1C and Figure 1D It is along Figure 1B The sectional view taken along line A-A'. In this document, reference will be made to... Figures 1A to 1D The display device EA according to this embodiment will be described in more detail.

[0059] The display device EA can be activated by an electrical signal. The display device EA can be implemented in any of a variety of forms. For example, the display device EA may include one of a tablet computer, a laptop computer, a computer, a smart TV, etc. In this embodiment, as... Figure 1A and Figure 1B As shown, the display device EA can be a smartphone.

[0060] Display device EA may include a display surface FS for displaying an image IM. The display surface FS may be parallel to a surface defined by a first direction DR1 and a second direction DR2. A direction perpendicular to the display surface FS (e.g., the thickness direction of display device EA) will be referred to as a third direction DR3. In this document, the third direction DR3 may be used to distinguish the front or top surface of each element from its rear or bottom surface. In this document, the first direction DR1, the second direction DR2, and the third direction DR3 may be directions indicated by the first direction axis, the second direction axis, and the third direction axis, respectively, and will be identified using the same reference numerals.

[0061] The display surface FS on which the image IM is displayed can correspond to the front surface FS of the display device EA and the front surface FS of the window member 100. In this document, the same reference numerals will be used to identify the display surface or front surface of the display device EA and the front surface of the window member 100. Figure 1A As shown, a clock icon and multiple application icons can be displayed as an example of an image IM.

[0062] The display device EA may include a window member 100 and an electronic panel 200. In some embodiments, although not shown, the display device EA may also include an optical component disposed between the window member 100 and the electronic panel 200. In some embodiments, the optical component may include a polarizer to reduce the reflectivity of external light. In some embodiments, the optical component may include a color filter component.

[0063] Window member 100 may include a base panel. For example, the base panel may be formed of at least one of glass, plastic, and combinations thereof. The front surface FS of window member 100 may include a transmissive region TA and a frame region BZA. The transmissive region TA may be an optically transparent region. For example, the transmissive region TA may be a region whose transmittance to visible light is about 90% or higher.

[0064] Compared to the transmissive region TA, the border region BZA can have a relatively low optical transmittance. The border region BZA can define the shape of the transmissive region TA. In an embodiment, the border region BZA can be configured to be adjacent to the transmissive region TA to surround it. In an embodiment, the window member 100 may also include a light-blocking pattern disposed on the base panel to define the border region BZA.

[0065] In one embodiment, the border region BZA may have a color (e.g., a predetermined color). The border region BZA may cover the peripheral region NAA of the electronic panel 200, and thus prevent or substantially prevent the peripheral region NAA from being recognized by the user. However, the inventive concept is not limited to this example, and in another embodiment, at least a portion of the border region BZA may be omitted from the window member 100.

[0066] The electronic panel 200 can be configured to display an image IM and sense an external input TC. The image IM can be displayed on the front surface IS of the electronic panel 200. The front surface IS of the electronic panel 200 can include an active area AA and a peripheral area NAA. The active area AA can be an area activated by an electrical signal. The active area AA can be a reference area. Figure 2B The region where pixels PX overlap as described.

[0067] In this embodiment, the effective area AA can be used to display the image IM and sense the external input TC. The effective area AA may correspond to the transmission area TA, and the peripheral area NAA may correspond to the border area BZA. In this specification, the statement "area or portion corresponds to another area or portion" means that the two areas or portions overlap each other, but even in this case, they may not necessarily have the same area and / or the same shape.

[0068] In one embodiment, the electronic panel 200 may include a display panel 210, an input sensor 220, a driving circuit DIC, and a flexible circuit board CF. In another embodiment, such as... Figure 1B As shown, a pair of flexible circuit boards CF can be disposed in the electronic panel 200.

[0069] Display panel 210 can substantially generate an image IM. Display panel 210 can be a light-emitting display panel. In embodiments, the light-emitting display panel can be one of an organic light-emitting display panel, a quantum dot light-emitting display panel, and a micro-LED light-emitting display panel. Panels can be classified according to the materials used for the light-emitting layer. The light-emitting layer of an organic light-emitting display panel can include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel can include quantum dots and / or quantum rods. The light-emitting layer of a micro-LED light-emitting display panel can include a plurality of micro-LEDs. In this document, an organic light-emitting display panel will be described as an example of display panel 210.

[0070] Input sensor 220 can sense external input TC (e.g., touch event) applied from the outside. In this embodiment, input sensor 220 can be a capacitive touch sensor, but the inventive concept is not limited to this example.

[0071] The driving circuit DIC can be disposed on the display panel 210. The driving circuit DIC can be mounted on the display panel 210. The driving circuit DIC can be electrically connected to the display panel 210 to provide electrical signals to the display panel 210 for operating the display panel 210.

[0072] The flexible circuit board CF can be electrically connected to the input sensor 220. In one embodiment, a sensing drive circuit can be mounted on the flexible circuit board CF. The flexible circuit board CF can electrically connect the input sensor 220 to the display panel 210 or another flexible circuit board.

[0073] Reference Figure 1C In one embodiment, the display panel 210 may include a display substrate 210-B, a package substrate 210-U, and a sealing element SM for attaching the display substrate 210-B to the package substrate 210-U. The display substrate 210-B may include pixels PX that substantially generate the image IM (see [link to relevant documentation]). Figure 2B In an embodiment, the encapsulation substrate 210-U can hermetically seal the pixel PX to prevent or substantially prevent damage to the pixel PX from external moisture or the like.

[0074] The driving circuit DIC can be mounted on the display substrate 210-B. In one embodiment, the driving circuit DIC can be configured as an integrated chip. However, the inventive concept is not limited to this example, and in another embodiment, the driving circuit DIC may not be mounted on the display substrate 210-B.

[0075] In one embodiment, each of the display substrate 210-B and the encapsulation substrate 210-U may include a glass substrate serving as its base substrate. In another embodiment, the display substrate 210-B may have a larger area than the encapsulation substrate 210-U. The driving circuit DIC may be disposed on an exposed area of ​​the display substrate 210-B not covered by the encapsulation substrate 210-U. However, the inventive concept is not limited to this example, and in another embodiment, the display substrate 210-B and the encapsulation substrate 210-U may have substantially the same shape. The outer surface or top surface of the encapsulation substrate 210-U may be used as the base surface on which the input sensor 220 is disposed.

[0076] The sealing element SM may include, for example, a glass frit. The glass frit is a ceramic bonding material that can be melted and solidified by a laser exposure process. In embodiments, the glass frit may include 15-40 wt% V₂O₅, 10-30 wt% TeO₂, 1-15 wt% P₂O₅, 1-15 wt% BaO, 1-20 wt% ZnO, 5-30 wt% ZrO₂, 5-20 wt% WO₃, and 1-15 wt% BaO as main components, and at least one of Fe₂O₃, CuO, MnO, Al₂O₃, Na₂O, and Nb₂O₅ as additives. If the glass frit is prepared having the above components, the glass frit may have a density of 40-100 × 10⁻⁶. -7 The coefficient of thermal expansion is 0.05°C and the glass transition temperature is 250°C-400°C. The sealing element SM can overlap with the peripheral area NAA.

[0077] Reference Figure 1D In one embodiment, the display panel 210 may include a display substrate 210-B and a thin encapsulation layer 210-L. In another embodiment, the thin encapsulation layer 210-L may hermetically seal the display device layer 210-OLED (see [link to previous embodiment]). Figure 2A In one embodiment, the thin encapsulation layer 210-L may include at least one inorganic layer. In another embodiment, the thin encapsulation layer 210-L may include multiple inorganic layers and multiple organic layers. In yet another embodiment, the thin encapsulation layer 210-L may have a structure in which inorganic layers, organic layers, and inorganic layers are stacked. The top layer of the thin encapsulation layer 210-L can serve as a base surface on which the input sensor 220 is disposed. In this document, based on... Figure 1C The technical features of the display panel 210 are described using the display panel 210.

[0078] Figure 2A This is a cross-sectional view showing a display substrate 210-B according to an embodiment of the present invention; and Figure 2B This is a plan view illustrating a display substrate 210-B according to an embodiment of the present invention. Reference will be made herein. Figure 2A and Figure 2B A display substrate 210-B is described according to an embodiment of the concept of the present invention.

[0079] like Figure 2A As shown, the display substrate 210-B may include a base substrate 210-G (hereinafter referred to as the first base substrate), a circuit device layer 210-CL disposed on the top surface or inner surface of the first base substrate 210-G, and a display device layer 210-OLED disposed on the circuit device layer 210-CL. The display substrate 210-B may also include an insulating layer covering the display device layer 210-OLED.

[0080] In this embodiment, the first base substrate 210-G may include a glass substrate, a metal substrate, or a substrate made of an organic / inorganic composite material. The circuit device layer 210-CL may include at least one insulating layer and circuit devices. The insulating layer may include at least one inorganic layer and at least one organic layer. The circuit devices may include sensing lines, pixel driving circuits, etc. The display device layer 210-OLED may at least include an organic light-emitting diode (OLED) serving as its emitting element. The display device layer 210-OLED may also include an organic layer such as a pixel defining layer.

[0081] like Figure 2B As shown, the display substrate 210-B may include a driving circuit GDC, multiple sensing lines SGL, and multiple pixels PX.

[0082] The driving circuit GDC may include a scan driving circuit. The scan driving circuit can generate multiple scan signals and sequentially output these signals to multiple scan lines GL, which will be described below. Furthermore, the scan driving circuit can output other control signals to the driving circuit of pixel PX.

[0083] The scan driving circuit may include a plurality of transistors that can be formed by the same method as the driving circuit used to form the pixel PX, or for example by a low-temperature polycrystalline silicon (LTPS) process and / or a low-temperature polycrystalline oxide (LTPO) process.

[0084] The sensing line SGL may include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. Each scan line GL can be connected to a corresponding pixel in pixel PX, and each data line DL can be connected to a corresponding pixel in pixel PX. The power line PL can be connected to pixel PX. The control signal line CSL can be used to provide control signals to the scan drive circuitry.

[0085] like Figure 2B As shown, the display substrate 210-B may include a driving circuit DIC disposed therein (see Figure 1). Figure 1CThe mounting area is DDA. The driver circuit DIC can be connected to the data line DL.

[0086] Figure 3 This is a plan view of an input sensor 220 according to an embodiment of the present invention. The input sensor 220 can be disposed on the display panel 210 (see [reference]). Figure 1B The input sensor 220 may include a plurality of sensing electrodes SE1 and SE2 and a plurality of sensing lines SL1, SL2 and SL3 connected to the sensing electrodes SE1 and SE2. The sensing electrodes SE1 and SE2 may be disposed within an effective region AA. The sensing electrodes SE1 and SE2 may include a plurality of first sensing electrodes SE1 and a plurality of second sensing electrodes SE2 disposed intersecting each other. The first sensing electrodes SE1 may extend in a first direction DR1 and may be disposed in a second direction DR2. Each of the first sensing electrodes SE1 may include a plurality of first sensing portions SP1 and a plurality of first intermediate portions BP1 disposed in the first direction DR1.

[0087] The second sensing electrode SE2 may extend in the second direction DR2 and may be arranged in the first direction DR1. Each of the second sensing electrodes SE2 may include a plurality of second sensing portions SP2 and a plurality of second intermediate portions BP2 arranged in the second direction DR2.

[0088] Sensing lines SL1, SL2, and SL3 can be positioned within the peripheral area NAA. Sensing lines SL1, SL2, and SL3 may include multiple first sensing lines SL1, multiple second sensing lines SL2, and multiple third sensing lines SL3.

[0089] The first sensing line SL1 can be connected to one end of the first sensing electrode SE1. The second sensing line SL2 can be connected to one end of the second sensing electrode SE2. The third sensing line SL3 can be connected to the opposite end of the second sensing electrode SE2. However, the present invention is not limited to this connection structure of the sensing electrodes SE1 and SE2 and the sensing lines SL1, SL2 and SL3.

[0090] Pad areas PDA1, PDA2, and PDA3 can be defined within input sensor 220. Input sensor 220 can include sensing pads disposed in pad areas PDA1, PDA2, and PDA3. In an embodiment, the pad areas can include a first pad area PDA1, a second pad area PDA2, and a third pad area PDA3. The sensing pads disposed in the first pad area PDA1, the second pad area PDA2, and the third pad area PDA3 can be respectively connected to a first sensing line SL1, a second sensing line SL2, and a third sensing line SL3.

[0091] Figure 4A It is shown Figure 3 A floor plan of area A1; and Figure 4B It is along Figure 4A A cross-sectional view taken by line X-X'. In this article, it will be included... Figure 3 refer to Figure 4A and Figure 4B The input sensor 220 is described in more detail.

[0092] like Figure 4A and Figure 4B As shown, region A1 can correspond to the intersection of the first sensing electrode SE1 and the second sensing electrode SE2. The first intermediate portion BP1 and the second intermediate portion BP2 can be disposed in the intersection region. In this embodiment, the first sensing portion SP1 and the first intermediate portion BP1 can be configured as a single object, while the second sensing portion SP2 and the second intermediate portion BP2 can be configured as separate objects; however, the inventive concept is not limited to this example. For instance, in an embodiment, the first sensing portion SP1 and the first intermediate portion BP1 can be configured as separate objects, while the second sensing portion SP2 and the second intermediate portion BP2 can be configured as a single object.

[0093] When the sensing portion and the intermediate portion are not set as a single object, they can be defined as an electrode pattern and a bridging pattern, respectively. For example, in this embodiment, the second sensing electrode SE2 may include an electrode pattern SP2 and a bridging pattern BP2. Although two bridging patterns BP2-1 and BP2-2 are shown as an example disposed in an intersection area, the number of bridging patterns is not limited to a specific number.

[0094] In this embodiment, the bridging pattern BP2-1 may include a first portion B1, a second portion B2, and a third portion B3. The second portion B2 may be disposed on a layer different from the layers of the first portion B1 and the third portion B3. The second portion B2 may be disposed on the same layer as the electrode pattern SP2.

[0095] like Figure 4A and Figure 4B As shown, the input sensor 220 can be directly disposed on the outer or top surface of the encapsulation substrate 210-U. In this embodiment, the encapsulation substrate 210-U is shown as an example comprising only a base substrate (hereinafter, the second base substrate), but the inventive concept is not limited to this example. In this embodiment, a portion of the bridging pattern BP2 is shown in contact with the top surface of the encapsulation substrate 210-U, but the inventive concept is not limited to this example. In embodiments, a buffer layer may also be disposed on the top surface of the encapsulation substrate 210-U, and a portion of the bridging pattern BP2 may contact the top surface of the buffer layer. The buffer layer may include at least one of an inorganic layer and an organic layer.

[0096] In this embodiment, the input sensor 220 may not be directly disposed on the packaging substrate 210-U, and an adhesive layer may be disposed between the input sensor 220 and the packaging substrate 210-U. The base layer of the input sensor 220 can be attached to the packaging substrate 210-U via the adhesive layer.

[0097] According to this embodiment, at least a portion of the bridging pattern BP2 can contact the top surface of the packaging substrate 210-U. The first portion B1 and the third portion B3 can be disposed on the top surface of the packaging substrate 210-U. In this embodiment, the first portion B1 and the third portion B3 can be formed of or comprise a metallic material. For example, the first portion B1 and the third portion B3 can be formed of or comprise at least one of titanium (Ti), aluminum (Al), copper (Cu), gold (Au), and silver (Ag). In this embodiment, the first portion B1 and the third portion B3 can be a multilayer structure comprising a metal layer made of a metallic material.

[0098] A first insulating layer 221 may be disposed on the top surface of the package substrate 210-U. A first sensing electrode SE1, an electrode pattern SP2, and a second portion B2 may be disposed on the first insulating layer 221. An opening BP1-OP may be defined in a first intermediate portion BP1, and a second portion B2 may be disposed in an opening BP1-OP. The electrode pattern SP2 and the second portion B2 may be connected to the first portion B1 and the third portion B3 of the bridging pattern BP2-1 through a through-hole 221-TH penetrating the first insulating layer 221.

[0099] In some embodiments, the first sensing electrode SE1, the electrode pattern SP2, and the second portion B2 may be formed of or comprise the same material. For example, the first sensing electrode SE1, the electrode pattern SP2, and the second portion B2 may be formed of or comprise at least one of transparent conductive oxide (TCO) materials. In other embodiments, the first sensing electrode SE1, the electrode pattern SP2, and the second portion B2 may be formed of or comprise at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). Furthermore, in some embodiments, the first sensing electrode SE1, the electrode pattern SP2, and the second portion B2 may be formed of or comprise PEDOT, metal nanowires, or graphene.

[0100] The second insulating layer 222 may be disposed on the first insulating layer 221. The second insulating layer 222 may cover the first sensing electrode SE1, the electrode pattern SP2, and the second portion B2. Each of the first insulating layer 221 and the second insulating layer 222 may be formed of or include at least one of inorganic and organic materials. Each of the first insulating layer 221 and the second insulating layer 222 may have a single-layer structure or a multi-layer structure.

[0101] In one embodiment, the bridging pattern BP2 may consist only of a metal pattern disposed on the top surface of the package substrate 210-U. The bridging pattern BP2 may not intersect with the first intermediate portion BP1. The bridging pattern BP2 may overlap with the first sensing portion SP1 to take a long path around the first intermediate portion BP1. Here, the second portion B2 may be disposed within the first sensing portion SP1.

[0102] Figure 5A It is shown Figure 3 A floor plan of area A2; and Figure 5B It is along Figure 5A A sectional view taken by the line Y-Y'. Figure 6 It is shown Figure 3 A floor plan of area A3. This document will include... Figure 3 , Figure 4A and Figure 4B refer to Figure 5A , Figure 5B and Figure 6 The input sensor 220 is described in more detail.

[0103] Reference Figure 5A , Figure 5B and Figure 6 Sensing lines SL1, SL2, and SL3 can be connected to the sensing pad SPD. Sensing lines SL1, SL2, and SL3 can electrically connect sensing electrodes SE1 and SE2 to the sensing pad SPD.

[0104] exist Figure 5A and Figure 5B As an example, a second sensing line SL2 connected to the sensing pad SPD will be shown. The second sensing line SL2 may be disposed on the package substrate 210-U. In an embodiment, an insulating layer may be disposed between the second sensing line SL2 and the package substrate 210-U. A first insulating layer 221 may be disposed on the second sensing line SL2, and a second insulating layer 222 may be disposed on the first insulating layer 221.

[0105] In an implementation, the second sensing line SL2 can be formed by the same process as the first portion B1 and the third portion B3 of the bridging pattern BP2-1 and the first pad MP, and can include the same material as the first portion B1, the third portion B3 and the first pad MP.

[0106] In one implementation, the second sensing line SL2 and the sensing pad SPD can be configured as a single object. In another implementation, with... Figures 5A to 6 The structure shown is different; the second sensing line SL2 can have the same width as the sensing pad SPD.

[0107] like Figure 6 As shown, the input sensor 220 may include a sensing pad SPD. As an example, Figure 6 The setting is shown in the second pad area PDA2 (specifically, set in...). Figure 3 The second sensing line SL2 and sensing pad SPD are connected to each other in region A3, but the inventive concept is not limited to this example. The sensing pad SPD may include a first pad MP and a second pad TP. The second pad TP may be disposed on the first pad MP. The second pad TP may be disposed on the first insulating layer 221 and may be connected to the first pad MP through a first contact hole CNT passing through the first insulating layer 221. In an embodiment, the first pad MP may be formed of or include at least one of the metal materials. For example, the first pad MP may be formed of or include at least one of the metal materials selected from titanium (Ti), aluminum (Al), copper (Cu), gold (Au), and silver (Ag).

[0108] In an embodiment, the second pad TP can be formed by the same process as the first sensing electrode SE1, electrode pattern SP2 and second portion B2, and can be formed by or include the same material as the first sensing electrode SE1, electrode pattern SP2 and second portion B2.

[0109] In one embodiment, the second pad TP may be formed of or include at least one of transparent conductive oxide (TCO) materials. In another embodiment, the second pad TP may be formed of or include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). Furthermore, in another embodiment, the second pad TP may be formed of or include PEDOT, metal nanowires, or graphene.

[0110] The sensing pad SPD may include a pad portion PP and an edge portion EP. The pad portion PP may be a portion electrically connected to the flexible circuit board CF, and the edge portion EP may correspond to the portion extending from the pad portion PP to the edge EZ of the input sensor 220 (or the package substrate 210-U).

[0111] The pad portion PP may include a first pad MP1 and a second pad TP1. The first pad MP1 and the second pad TP1 are electrically connected to the pads of the flexible circuit board CF via an anisotropic conductive film, solder balls, etc. For example, the first pad MP1 of the pad portion PP can be connected to the second sensing electrode SE2 via a second sensing line SL2, and can be electrically connected to the second pad TP1 of the pad portion PP via a first contact hole CNT. In an embodiment, multiple first contact holes CNTs may be provided. The second pad TP1 of the pad portion PP, together with the first pad MP1, can be electrically connected to the pads of the flexible circuit board CF via anisotropic conductive film, solder balls, etc., in contact with it.

[0112] The edge portion EP may include a first pad MP2 and a second pad TP2 extending from the pad portion PP to the edge EZ of the input sensor 220 (or package substrate 210-U). The first pad MP2 of the edge portion EP may extend from the first pad MP1 of the pad portion PP, and the second pad TP2 of the edge portion EP may extend from the second pad TP1 of the pad portion PP. In an embodiment, the first pad MP2 of the edge portion EP and the first pad MP1 of the pad portion PP may be configured as a single object, and the second pad TP2 of the edge portion EP and the second pad TP1 of the pad portion PP may be configured as a single object. Figure 6 An example is shown in which the first pad MP2 and the second pad TP2 of the edge portion EP are configured to have a smaller width than the first pad MP1 and the second pad TP1 of the pad portion PP, but the inventive concept is not limited to this example. For example, the pads of the edge portion EP and the pads of the pad portion PP can be configured to have the same width.

[0113] In the pad portion PP, the second pad TP1 can be placed on the first pad MP1, and the first pad MP1 can be covered by the second pad TP1. In the pad portion PP, the first pad MP1 can overlap with the second pad TP1.

[0114] In the edge portion EP, when viewed in a plan view, the second pad TP2 and the first pad MP1 may be spaced apart from each other. In the edge portion EP, at least a portion of the second pad TP2 may overlap with the first pad MP2, and the remaining portion may not overlap with the first pad MP2. In other words, the second pad TP2 of the edge portion EP may extend from the second pad TP1 of the pad portion PP and may include at least one portion arranged in a bypass manner that does not overlap with the first pad MP2 of the edge portion EP. For example, the second pad TP2 of the edge portion EP may include a first extension portion to a third extension portion sequentially connected to each other. The first extension portion may extend from the pad portion PP in the second direction DR2 to overlap with a portion of the first pad MP2. When viewed in a plan view, the second extension portion may extend in the first direction DR1 such that it does not overlap with the first pad MP2 of the edge portion EP in the thickness direction, and the third extension portion may extend in the second direction DR2 to the edge EZ of the input sensor 220 while maintaining a distance from the first pad MP2.

[0115] In one embodiment, the edge portion EP may include a first region A1 and a second region A2. The first region A1 may be adjacent to the pad portion PP, and the second region A2 may be adjacent to the edge EZ of the input sensor 220. The second region A2 may correspond to the region extending from the first region A1 to the edge EZ of the input sensor 220. The edge portion EP may include a first portion P1 and a second portion P2. The first portion P1 may be disposed in the first region A1, and the second portion P2 may be disposed in the second region A2. The first portion P1 may include a first pad MP2, a second pad TP2, a first insulating layer 221, and a second insulating layer 222 disposed on the package substrate 210-U. The second portion P2 may include a second pad TP2 disposed on the package substrate 210-U. In another embodiment, the second portion P2 may include the second pad TP2 and the second insulating layer 222 on the second pad TP2.

[0116] In this embodiment, one end of the second portion P2 can be aligned with the edge EZ of the input sensor 220 in the thickness direction. More specifically, the second pad TP2-1 constituting the second portion P2 in the second pad TP2 of the edge portion EP can be disposed on the package substrate 210-U and exposed to the outside, and one end of the second pad TP2-1 in the second direction DR2 can be aligned with the edge EZ in the thickness direction.

[0117] Figure 7A It is along Figure 6 A sectional view taken from line I-I'. Figure 7B It is along Figure 6 The sectional view taken from line II-II'. Figure 7C It is along Figure 6 The sectional view taken from line III-III'. Figure 7D It is along Figure 6 A sectional view taken from line IV-IV'. Figure 7E It is along Figure 6 A sectional view taken by line V-V'.

[0118] Reference Figure 7A Sensing pad SPD (e.g., see Figure 6 The pad portion PP of the package can be disposed on the package substrate 210-U. The first pad MP1 of the pad portion PP can be directly disposed on the package substrate 210-U. A first insulating layer 221 can be disposed on the first pad MP1, and a second pad TP1 can be disposed on the first insulating layer 221. A second insulating layer 222 can be disposed on the second pad TP1. A first contact hole CNT can be defined within the first insulating layer 221. The first pad MP1 and the second pad TP1 can be electrically connected to each other through the first contact hole CNT. A second contact hole SD can be defined within the second insulating layer 222. The second contact hole SD can be configured to expose the second pad TP1.

[0119] Reference Figure 7B Sensing pad SPD (see Figure 6 The edge portion EP of the pad portion PP can be disposed on the package substrate 210-U. In an embodiment, each of the first pad MP2, the second pad TP2, the first insulating layer 221, and the second insulating layer 222 of the edge portion EP can extend from a corresponding one of the first pad MP1, the second pad TP1, the first insulating layer 221, and the second insulating layer 222 of the pad portion PP to form a single object. Figure 7B The first part P1 of the edge portion EP is shown. (See figure) Figure 7B As shown, a portion of the second pad TP2 can be configured to overlap with the first pad MP2.

[0120] Reference Figure 7C In sensing pad SPD (see Figure 6 In the first region A1 of the edge portion EP, the second insulating layer 222 can cover the entire first pad MP2, the first insulating layer 221, and the second pad TP2. For example... Figure 7C As shown, one end of the first insulating layer 221 can be substantially aligned with one end of the first pad MP2 in the thickness direction. The end of the first insulating layer 221 and the end of the first pad MP2 located near the end of the first portion P1 adjacent to the second portion P2 can be aligned with each other.

[0121] Reference Figure 7D The first pad MP2 and the second pad TP2 can be configured in the first region A1 such that they do not overlap. When viewed in a plan view, the first pad MP2 and the second pad TP2 can be configured to be spaced apart from each other.

[0122] Reference Figure 7E The second part P2 may include the second pad TP2-1 in the second region A2. For example... Figure 6 As shown, the second part P2 of the sensing pad SPD can be configured to include essentially only the second pad TP2-1 in the second region A2.

[0123] Figures 8A to 8D This is a plan view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0124] Reference Figures 8A to 8D A method for manufacturing a display device may include providing a display panel, setting an input sensor on the display panel, and cutting the display panel and the input sensor along a cut region CTL. Each of the display panel and the input sensor may include a pad area and a cut region CTL adjacent to the pad area. The input sensor may include a pad portion PP and an edge portion EP located in the pad area. The edge portion EP may be adjacent to the cut region CTL. Here, the cut region CTL may correspond to the area to be cut in a cell process that divides the mother substrate into multiple unit cells. This will refer to Figure 9 and Figure 10 This will be described in more detail.

[0125] Setting up the input sensor may include setting a first pad MP2 on the display panel, setting a second pad TP2 on the first pad MP2, and removing the first pad MP2 from the display panel where it overlaps with the cut area CTL of the input sensor.

[0126] Setting a second pad TP2 on a first pad MP2 may include setting the second pad TP2 such that the first pad MP2 and the second pad TP2 do not overlap each other in the cut region CTL. Subsequently, setting the input sensor may include removing the first pad MP2 that overlaps with the cut region CTL. The first pad MP2 may not overlap with the second pad TP2 in the cut region CTL and may be exposed to the outside. In an embodiment, removing the first pad MP2 in the cut region CTL may include etching the portion of the first pad MP2 that overlaps with the cut region CTL.

[0127] In an embodiment, setting the input sensor may further include setting a first insulating layer 221 on the first pad MP2 and a second pad TP2 on the first insulating layer 221. The first insulating layer 221 may overlap with the pad area of ​​the input sensor. The first insulating layer 221 may not overlap with the cut area CTL. Therefore, the first pad MP2 may be exposed to the outside in the cut area CTL and may be covered by the first insulating layer 221 in the pad area. During etching the portion of the first pad MP2 that overlaps with the cut area CTL, the first insulating layer 221 may cover the portion of the first pad MP2 that is different from the portion to be removed. In other words, the first insulating layer 221 may be used as a mask for etching the cut area CTL or the first pad MP2 in the cut area CTL.

[0128] When the first pad MP2 is removed, a second pad TP2, spaced apart from or not overlapping with the removed first pad MP2, can be positioned within the cut area CTL. The second pad TP2 can be cut when the input sensor is cut along the cut area CTL. The cut portion of the second pad TP2 can be exposed to the outside.

[0129] In one embodiment, the manufacturing method may further include setting a second insulating layer 222 that does not overlap with the cutting region CTL but overlaps with the pad region and covers the first pad MP2 and the second pad TP2. Here, the setting of the second insulating layer 222 can be performed after removing the portion of the first pad MP2 that overlaps with the cutting region CTL and before cutting the cutting region CTL of the input sensor. In another embodiment, the second insulating layer 222 may overlap with the cutting region CTL.

[0130] like Figure 8A As shown, when viewed in a plan view, the first pad MP2 and the second pad TP2 of the edge portion EP may include portions that are at least partially spaced apart from each other and do not overlap in the thickness direction. The first insulating layer 221 may cover the edge portion EP of the input sensor. Figure 8AThe diagram illustrates a mother substrate prior to cell fabrication (e.g., comprising adjacent cell units connected to each other via a first pad MP2 and a second pad TP2). The first pad MP2 of the display device may extend to the first pad MP2-2 of the adjacent cell unit, and the second pad TP2 may be bent to avoid overlapping with the first pad MP2 and connected to the second pad TP2-2 of the adjacent cell unit. The second pads TP2 and TP2-2 may be connected to the first pads MP2 and MP2-2, respectively, via first contact holes CNT and CNT-2.

[0131] Figure 8B The diagram illustrates a structure formed by removing the portion of the first pad MP2 not covered by the first insulating layer 221 through an etching process. In this embodiment, although the first pad MP2 is disconnected from the first pad MP2-2 of the adjacent unit cell, the second pads TP2 and TP2-2 can be connected to each other, and the pad portion PP can be electrically connected to the pad portion of the adjacent unit cell through the first contact holes CNT and CNT-2. That is, the second pads TP2 and TP2-2 can be connected to each other, thereby acting as short-circuit bars.

[0132] Figure 8C and Figure 8D The steps for setting the second insulating layer 222 and cutting the cut area CTL are shown. The edge EZ of the input sensor can be formed by cutting the cut area CTL. One end of the second pad TP2 aligned with the edge EZ can be exposed to the outside. Since the second pad TP2 is exposed to the outside in the edge EZ, and the first pad MP2 was previously removed, the second pad TP2 can avoid overlapping with the first pad MP2 near the edge EZ or in the cut area CTL. Therefore, in the input sensor according to the embodiment of the present invention, it is possible to prevent or substantially prevent corrosion problems caused by the overlap and exposure of the first pad MP2 and the second pad TP2 in the cut area CTL, thereby reducing the failure rate of the display device.

[0133] Figure 9 This is a plan view illustrating a method for manufacturing a display device according to an embodiment of the present invention. Figure 10 This is a plan view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0134] Reference Figure 9The mother substrate WP can correspond to a working panel that will be cut into multiple unit cells. A display device according to an embodiment of the present invention can be formed in each unit cell. A cutting wheel CHW can be used to cut the mother substrate WP into unit cells. Here, the mother substrate WP can be formed by combining a first working substrate WS1 and a second working substrate WS2. One of the first working substrate WS1 and the second working substrate WS2 can be a packaging substrate on which an input sensor is disposed, and the other can correspond to a display substrate in which pixels, etc., are disposed. Figure 9 Region A4 may include the pad area and cut area of ​​the substrate in each unit cell.

[0135] Figure 10 The pad area and cut area in each unit cell of the mother substrate WP are shown. (Refer to...) Figure 10 The cut region CTL can be defined within a dummy portion DMP provided with dummy pads, which extend from the pad portion PP and connect to adjacent unit cells. The dummy portion DMP may include edge portions 12, connecting portions 13, and shorting bars 14. The edge portions 12 extend from each pad in the pad portion PP and overlap with the cut region CTL. The connecting portions 13 connect the edge portions 12 of the pads to each other, and the shorting bars 14 connect the connecting portions 13 of the unit cells to each other. An embodiment of the dummy portion DMP according to the present invention may include a second pad TP2 disposed on the package substrate (see...). Figure 6 The second pad TP2 can be used as a shorting bar, which connects the unit cells to each other through contact holes. The shorting bar 14 may include the second pad TP2 (see...). Figure 6 The units can be connected to each other via shorting bar 14 until the unit process is performed, and thus, display device malfunctions due to electrostatic discharge problems can be prevented or substantially prevented.

[0136] Figure 11A and Figure 11B It's a floor plan. Figure 11A and Figure 11B Each of the figures illustrates a pad area of ​​a display device according to an embodiment of the present invention.

[0137] like Figure 11A As shown, the first pad MP2 and the second pad TP2 of the edge portion EP can extend from the pad portion PP and can be spaced apart from each other. For example, the first pad MP2 and the second pad TP2 of the edge portion EP can be configured such that they do not completely overlap each other.

[0138] like Figure 11B As shown, multiple second pads TP2 can extend from the second pad TP1 of the pad portion PP. Although Figure 11BAn example is shown in which two second pads TP2 are provided, but the inventive concept is not limited to this example. In an embodiment, all the second pads TP2 of the edge portion EP may not overlap with the first pad MP2.

[0139] like Figure 11A and Figure 11B As shown, in the second region A2 of the edge portion EP, at least one of the second pads TP2-1 can be aligned with the edge EZ. The first pad MP2 of the first region A1 can be aligned with the first insulating layer 221.

[0140] According to embodiments of the present invention, the failure rate of input sensors can be reduced. For example, the display device can be configured to prevent or substantially prevent corrosion in the pad areas of the input sensor.

[0141] Furthermore, in the manufacturing process of display devices, it is possible to prevent or substantially prevent malfunctions caused by corrosion in the input sensors.

[0142] Although some exemplary embodiments of the inventive concept have been specifically shown and described, those skilled in the art will understand that changes in form and detail may be made therein without departing from the spirit and scope of the inventive concept as set forth in the appended claims.

Claims

1. A display device, including: Display panel; as well as An input sensor is provided on the display panel, comprising an effective area and a pad area adjacent to the effective area. The input sensor includes: Sensing electrodes overlap the effective region and are configured to sense input; Sensing pads that overlap with the pad area; and The sensing line electrically connects the sensing electrode to the sensing pad. The sensing pad includes a pad portion and an edge portion. When viewed in a plan view, the edge portion extends from the pad portion to the edge of the input sensor. Each of the pad portion and the edge portion includes a first pad and a second pad, the second pad at least partially overlapping the first pad, and When viewed in a plan view, at least a portion of the second pad of the edge portion is spaced apart from and does not overlap with the first pad of the edge portion.

2. The display device of claim 1, wherein, The edge portion includes a first portion and a second portion, the first portion of the edge portion being in a first region adjacent to the pad portion, and the second portion being in a second region extending from the first region to the edge of the input sensor. One end of the second part is aligned with the edge of the input sensor in the thickness direction of the input sensor.

3. The display device of claim 2, wherein, The first portion of the edge portion includes: The first pad; A first insulating layer is applied to the first pad. The second pad is on the first insulating layer; and The second insulating layer is on the second pad.

4. The display device of claim 3, wherein, The second insulating layer covers the entire first pad, the first insulating layer, and the second pad.

5. The display device according to claim 3, wherein, One end of the first insulating layer and one end of the first pad are aligned with each other in the thickness direction of the display panel.

6. The display device according to claim 2, wherein, The second part includes only the second pad, at least a portion of which is disposed on the display panel and exposed to the outside.

7. The display device according to claim 1, wherein, The pad portion also includes: A first insulating layer is applied to the first pad; and The second insulating layer is on the second pad. The first insulating layer defines a first contact hole to electrically connect the first pad to the second pad.

8. The display device according to claim 7, wherein, The second insulating layer defines a second contact hole to expose the second pad to the outside.

9. The display device according to claim 1, wherein, The display panel includes: First basic substrate; The second base substrate is opposite to the first base substrate; A circuit device layer is located between the first base substrate and the second base substrate; and A light-emitting device layer is located on the circuit device layer.

10. The display device according to claim 9, wherein, The first pad is in contact with the top surface of the second base substrate.

11. The display device according to claim 1, wherein, The second pad in the edge portion includes a plurality of second pads.

12. The display device according to claim 1, wherein, The second pad in the pad portion overlaps with the first pad, while the second pad in the edge portion does not overlap with the first pad.

13. The display device according to claim 1, wherein, The first pad comprises a metallic material, and the second pad comprises a transparent conductive oxide material.

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