Carrier-based laser assembly and method of assembly thereof with a photonic integrated circuit

Abstract

A carrier laser device assembly is provided in which a visible region of the laser, including an output portion and / or output facet of a waveguide of the laser, is visible to an imaging system when the laser is attached to the carrier. The laser can be programmed and / or tested prior to attachment to a photonic integrated circuit. When the laser assembly is attached to the PIC by the imaging system via imaging of the visible portion, the output portion and / or output facet of the waveguide can be aligned with a corresponding input portion and / or input facet of a waveguide of the PIC.

Description

Background Technology

[0001] Photonic and / or silicon photonic optical engines increasingly require multiple laser sources to support multiple data channels. Typically, for example, higher optical reflection tolerance usually necessitates lower output power, thus requiring a larger number of lasers to support fewer channels. This large number of lasers necessitates very high single-device laser yields in the integrated optical engine, as cumulative yield increases with the number of devices used. Furthermore, the lowest loss and most cost-effective assembly methods require direct attachment of the laser source to the silicon photonics. Attached Figure Description

[0002] To better understand the various examples described in this article and to more clearly illustrate how they are implemented, reference is now made only to the accompanying drawings, in which:

[0003] Figure 1 A top view of an exemplary device including a carrier and a laser, based on some examples, is depicted.

[0004] Figure 2 Depicted based on some examples Figure 1 A side view of an exemplary device.

[0005] Figure 3 Depicted based on some examples Figure 1 An end view of an exemplary device.

[0006] Figure 4 Depicted based on some examples Figure 1 A perspective view of an exemplary device.

[0007] Figure 5 Depicting based on some examples and Figure 1 An end view of the laser attached to the carrier of an exemplary device.

[0008] Figure 6 The text describes, according to some examples, the testing and / or programming of components before attachment to a photonic integrated circuit. Figure 1 A perspective view of an exemplary device.

[0009] Figure 7 The cavity positioning relative to an exemplary PIC is depicted according to some examples. Figure 1 A perspective view of an exemplary device.

[0010] Figure 8 It depicts a more precise alignment at the PIC based on some examples. Figure 1 An end view of an exemplary device.

[0011] Figure 9Depicting attachments to PICs based on some examples. Figure 1 A side view of an exemplary device, wherein the corresponding planes, optical axis, waveguide, and facet are aligned.

[0012] Figure 10 Depicting attachments to PICs based on some examples. Figure 1 A top view of an exemplary device, wherein the corresponding planes, optical axis, waveguide and facet are aligned.

[0013] Figure 11 The text describes alternative methods of attaching PICs using polymer waveguides, based on several examples. Figure 1 A top view of an exemplary device.

[0014] Figure 12 Depicting, based on some examples, the use of... Figure 1 A flowchart of an exemplary device attached to a PIC.

[0015] Figure 13 Alternative devices according to some examples are depicted, which include a carrier and a laser attached to an alternative PIC having a polymer waveguide for optically connecting a small facet of the PIC.

[0016] Those skilled in the art will understand that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the figures may be exaggerated relative to other elements to aid in understanding embodiments of the invention.

[0017] The components of the apparatus and method are indicated by conventional symbols in the accompanying drawings where appropriate, showing only those specific details relevant to understanding embodiments of the invention, so as not to obscure this disclosure with details that would be obvious to a person of ordinary skill in the art who would benefit from the description herein. Detailed Implementation

[0018] If the laser is not programmed before attachment, current attachment processes for laser devices to photonic integrated circuits (PICs) are considered to have a high probability of causing laser performance degradation or failure during their lifetime. This is especially true if high temperatures (such as those used for soldering) are used in the attachment process. Parallel non-WDM (wavelength division multiplexing) systems typically require one laser per “channel.” For example, 100, 400, and 800G systems may require 1, 4, and 8 lasers, respectively, for each optical layout. Advanced packaging solutions for monolithic electro-optics involve placing these lasers at the ePIC (electro-photonic integrated circuit) and possibly on the ePIC wafer. For stability and reliability, such lasers may require soldering (e.g., Au-Sn soldering) and post-attach programming to ensure the reliability of the entire multi-laser assembly. However, this post-attach programming can lead to laser failure, which can cause the entire laser assembly to fail. Specifically, programming laser devices after attaching them to a photonic integrated circuit (PIC) is problematic because the laser devices may fail after attachment. This could cause the entire PIC, along with any previously attached lasers and packaged components, to fail, thus reducing the yield of PIC laser assembly production. In fact, maximizing the yield of optical engines comprising one or more lasers and a PIC is crucial for reducing production costs, and since each optical engine mold may require multiple lasers to be soldered and programmed, the yield of a single assembled laser mold becomes extremely critical.

[0019] One approach is to provide a flip-chip active region (“p-down”) soldered to a PIC die in a pattern-matched, face-to-face coupling arrangement. However, a problem with monolithic PIC die systems with flip-chip LD configurations is that the soldering process occurs at the die or wafer level. Flip-chip lasers used for face-coupled applications require solder seams within the micrometer range of the active region. The additional stress and stress inhomogeneity of this solder seam will affect the optical performance of the laser device. The final overall yield of devices using multiple lasers can be extremely low.

[0020] An additional issue that further impacts yield is optical alignment. Face-to-face coupling may require precise placement of the laser chip at the submicron level in a flip-chip arrangement, while simultaneously performing soldering at temperatures exceeding 300°C. This process may require very expensive assembly equipment and necessitates lengthy development times.

[0021] Therefore, this paper provides a process that allows the component to be programmed and screened by testing after welding (e.g., attaching a laser device to a carrier via welding) but before attaching the laser component to photonics and / or silicon photonics, for example, to avoid device failure after attaching the laser component to photonics and / or silicon photonics.

[0022] This document also provides a laser assembly that can improve the yield of laser PIC assemblies when the laser is first attached to a carrier different from the PIC. The carrier size and / or configuration is selected to make the carrier compatible with subsequent attachment to the PIC.

[0023] This paper also provides a technique to reduce machine-aided alignment requirements, wherein the output portion and / or output surface of the laser's waveguide are visible when the laser is attached to a carrier. For example, the size and / or configuration of the combination of the laser and the carrier to which it is attached (e.g., a laser assembly) are selected such that the output portion and / or output surface of the waveguide are not obscured by the carrier and / or are visible to an external vision system when the laser is attached to the carrier; thus, when the laser assembly is attached to a PIC, the output portion and / or output surface of the waveguide can be aligned with the corresponding input portion and / or input surface of the PIC's waveguide. In other words, the laser's output on the carrier is generally visible during the attachment of the laser assembly to the PIC, and / or is not obscured by the PIC.

[0024] This document also provides a technique that can reduce machine-aided alignment requirements, for example, by removing one of the alignment axes at both the PIC and the laser assembly, relative to the vertical optical plane. These physical planes mate when the laser assembly is flipped and in contact with the PIC, which can lead to optical plane alignment.

[0025] Specifically, this document provides an apparatus comprising: a carrier with a laser having a region (e.g., a visible region) visible to an external vision system and including an output surface of the laser; and a portion of a waveguide from the laser device of the laser to the output surface, allowing for easier positioning of the laser on a surface of a PIC. For example, the visible region may protrude from the carrier, and when the laser is positioned on the surface of the PIC, the laser can be positioned within a cavity of the PIC, wherein the carrier abuts against the surface of the PIC. A method for assembling the apparatus with a PIC is also provided, the method relying on the visible portion to align the output surface of the PIC and its associated waveguide with the input surface of the PIC and its corresponding associated waveguide.

[0026] Specifically, one aspect of this specification provides an apparatus comprising: a carrier including: a first side, a second side opposite to the first side, and an edge connecting the first side and the second side; a through-carrier via (TCV) from the first side to the second side, the TCV including an electrical connector passing through it; a first electrical contact for the electrical connector at the first side; and a second electrical contact for the electrical connector at the second side; and a laser attached to the second side of the carrier, the laser including: a body supporting a portion of the laser; a laser device configured to generate light, the laser device being located on a corresponding side of the body attached to the second side of the carrier; a corresponding electrical connector from the second electrical contact to the laser device; and a protruding region of the body protruding from the edge of the carrier, the body additionally having a footprint smaller than the carrier; and an output portion configured to transmit light from the laser device from the laser device, the output portion being located at the protruding region of the body.

[0027] Another aspect of this specification provides an apparatus comprising: a photonic integrated circuit (PIC) including a waveguide and an input portion to the waveguide; and a cavity having the input portion located at an inner edge of the cavity; and a laser device including: a carrier including: opposing sides connected by an edge; a through-carrier via (TCV) between the opposing sides, the TCV including an electrical connector passing through it; and a laser attached to a given side of the opposing sides of the carrier, the laser including: a body supporting components of the laser; and a laser device configured to generate light for the PIC. The laser device is located between the given side of the carrier and the body; a corresponding electrical connection from the laser device to the electrical connection of the TCV; and an output portion and a corresponding waveguide configured to transmit light from the laser device from the laser; a protruding region of the body supporting the output portion and the corresponding waveguide, the protruding region protruding from the edge of the carrier, the body additionally having a smaller coverage area than the carrier, the body being located in the cavity of the PIC, wherein the output portion and the corresponding waveguide are aligned with the input portion and the waveguide of the PIC, respectively, the carrier being attached to the PIC, the carrier supporting the body in the cavity.

[0028] Another aspect of this specification provides a method comprising: programming a laser device, the laser device comprising: a laser attached to a carrier; a visible region of the laser, the visible region including an output portion and at least a portion of a waveguide configured to transmit light from the laser, the visible region being visible to an imaging system external to the laser device; positioning the laser device on the surface of a photonic integrated circuit (PIC) using one or more of the imaging system and a robotic device such that the corresponding optical axes of the output and input portions of the waveguide of the PIC are substantially aligned; and attaching the carrier to the surface of the PIC.

[0029] Another aspect of this specification provides an apparatus comprising: a photonic integrated circuit (PIC) including a waveguide and an input portion to the waveguide; and a laser device attached to the PIC, the laser device including: a carrier; and a laser attached to the carrier, the laser including: a laser device, a corresponding waveguide, an output portion, and a visible region of the laser, the visible region including at least a portion of the output portion and the waveguide, the at least a portion being configured to transmit light from the laser to the input portion of the PIC via the output portion, the output portion and the input portion being optically coupled via an optical coupling device, the visible region being visible to an imaging system external to the laser device.

[0030] Although the term "facet" is referred to below, such as the output and input surfaces of a waveguide, such terms are interchangeably used below as output portions (e.g., the output portion of a waveguide) and input portions (e.g., the input portion of a waveguide), but the terms (e.g., the output and input portions of a waveguide) should be understood to encompass other structures and / or configurations for emitting or receiving light at a waveguide (e.g., other than the facet). For example, optical coupling between waveguides described as occurring via a "facet" can alternatively occur via dissipative wave coupling at any suitable input and output portion of the waveguide, including but not limited to, coupling between polymer waveguides (and / or 3D-printed polymer waveguides) and laser waveguides and / or PIC waveguides.

[0031] about Figure 1 , Figure 2 and Figure 3 They depict a top view and a side view (e.g., through) of the laser device 100 (hereinafter interchangeably referred to as device 100 and / or laser device assembly 100 and / or assembly 100). Figure 1 (AA line) and end view.

[0032] Device 100 includes a carrier 101 and a laser 103. As will be explained in more detail below, the laser device 103 is attached to and / or assembled with the carrier 101 and the laser device assembly 100, which is programmed (e.g., and tested) before being attached to the PIC.

[0033] The carrier 101 typically comprises any suitable material, which may include, but is not limited to, silicon, silicon nitride, etc., and / or the carrier typically comprises any other suitable material (e.g., another suitable crystalline material, a suitable ceramic, etc.) that is etched and / or cut and / or formed and / or cleaved into a suitable shape. Therefore, in a particular example, the carrier 101 may comprise a silicon carrier. The carrier 101 typically serves as a mechanical support mechanism for the laser 103, as described in more detail below. Figure 1 and Figure 2 As best shown, a portion of the laser 103 protrudes relative to the carrier 10, and Figure 1 The component of the laser 103 that is shielded by the carrier 101 is depicted in outline to show its position relative to the rest of the device 100.

[0034] The carrier 101 typically includes: a first side 111, a second side 112 opposite to the first side 111, and an edge 113 connecting the first side 111 and the second side 112. It should be understood that although one edge 113 connecting the first side 111 and the second side 112 is numbered and described herein, other edges connect the sides 111 and 112; for example, as depicted, the sides 111 and 112 have a generally rectangular shape and are thus connected by four edges including edge 113. However, the carrier 101 can have any suitable shape and therefore any suitable number of edges.

[0035] The carrier 101 further includes through carrier vias (TCVs) 115-1 and 115-2 (e.g., interchangeably referred to herein as TCV 115) extending from the first side 111 to the second side 112. Figure 2 and Figure 3 In the figure, the TCV 115 is depicted in a profile diagram, which indicates that they are located inside the carrier 101.

[0036] When the carrier 101 includes a silicon carrier, the TCV may include a through-silicon via (TSV). The TCV typically includes an electrical connection passing through it; for example, the TCV may be filled with a conductive material such as aluminum, gold, etc. The carrier 101 further includes first electrical contacts 117-1, 117-2 (e.g., multiple electrical contacts 117 and / or a single electrical contact 117) for the electrical connection at the first side 111; and second electrical contacts 127-1, 127-2 (e.g., multiple electrical contacts 127 and / or a single electrical contact 127) for the electrical connection at the second side 112. Figure 3 As best shown, for example during the assembly of laser 103 to carrier 101, electrical contacts 127 are electrically connected via corresponding solder connectors 119-1, 119-2 (e.g., multiple solder connectors 119 and / or one solder connector 119) to corresponding laser electrical connectors 128-1, 128-2 (e.g., multiple electrical connectors 128 and / or one electrical connector 128 to laser device 123). Similarly, as... Figure 3 As best shown, the carrier 101 further includes a recess 120 at the second side 112, and the solder connector 119 may be located in the recess 120 at the second side 112. Similarly, a portion of the electrical contact 127 connected to the solder connector 119 may also be located in the recess 120 at the second side 112. However, the electrical connector 128 and the electrical contact 127 may be electrically connected in any suitable manner (e.g., using an electrical connector different from the solder connector, such as adhesive wire, conductive adhesive, contact pin, etc.).

[0037] It should be understood that TCV 115 may not be aligned (e.g., as depicted) with electrical connector 128 and / or solder connector 119. Therefore, electrical contact 127 may include an electrical trace, etc., between one end of the electrical connector in TCV 115 at the second side 112 and electrical connector 128 and / or solder connector 119. Thus, when power, voltage, etc., is supplied to electrical contact 117, power, voltage, etc., are fed to the corresponding electrical connector 128 via the electrical connector in TCV 115, the corresponding electrical contact 127 (e.g., and its corresponding trace), and the corresponding solder connector 119, etc. For example, electrical contact 117-1 and electrical connector 128-1 are electrically connected, and electrical contact 117-2 and electrical connector 128-2 are electrically connected. Electrical contacts 117 and 127 may be formed of the same and / or similar materials as the electrical connectors in TCV 115; however, electrical contact 117 has a shape and size for connecting a power source and / or voltage source thereto, while the shape and size of electrical contact 127 allow the corresponding electrical connector 128 of laser 103 to be soldered to electrical contact 127 via solder connector 119. In some examples, electrical connector 128-1 includes an "N" electrical connector to laser device 123, while electrical connector 128-2 includes a "P" electrical connector to laser device 123.

[0038] like Figure 1 and Figure 2 As best shown, laser 103 is typically (e.g., by soldering using solder connector 119, and / or other suitable accessory mechanisms and / or materials) attached to a second side 112 of carrier 101, for example, as described in more detail below. Specifically, laser 103 includes: a body 121 that supports components of laser 103; and a laser device 123 configured to generate light, located at a corresponding side 125 of the body 121 attached to the second side 112 of carrier 101. Specifically, as described in more detail below, laser device 123 may be combined with and / or at least partially include a waveguide 129, and / or at least partially combine with waveguide 129, and / or laser device 123 and waveguide 129 may be coincident, such that waveguide 129 guides light from laser device 123 to output surface 131. In some examples, laser device 123 may include an active guiding region and a passive waveguide region (e.g., waveguide 129), wherein the laser gain region of laser device 123 constitutes only a portion of the longitudinal cross-section of laser device 123 (e.g., waveguide 129 may include the front passive waveguide portion of laser device 123); while laser device 123 may typically include an active laser cross-section that directs light output to the active guiding region, which guides light to the passive region and / or waveguide 129.

[0039] Laser device 123 may include any suitable laser device 123 and may be formed on body 121 and / or waveguide 129 using any suitable process. For example, body 121 may include InP (indium phosphide) p-doped at side 125 (e.g., n-doped at the opposite side), and laser device 123 may include an InP laser device formed on the p-doped side of InP body 121. Thus, laser 103 may be referred to as an InP P-Up laser and / or component, etc.

[0040] Although not described in detail, it should be understood that laser 103 can be manufactured using techniques familiar to those skilled in the art, including but not limited to photolithography, etching, etc. (e.g., starting with doped InP, etc.).

[0041] As already described, laser 103 further includes corresponding electrical connections 128 from electrical contacts 127 to laser device 123 (e.g., via solder connectors 119). For example, electrical contact 127-1 can be soldered to electrical connector 128-1 via solder connector 119-1, and electrical contact 127-2 can be soldered to electrical connector 128-2 via solder connector 119-2. Thus, laser 103 can be at least partially attached to carrier 101 by soldering electrical contacts 127 and electrical connectors 128 via corresponding solder connectors 119. However, laser 103 can be at least partially attached to carrier 101 via any suitable technique and / or material, including but not limited to: adhesive wires, conductive adhesives, contact pins, solder, etc.

[0042] In other words, electrical contacts 117 and / or 127 (e.g., their traces) are connected to electrical components of the laser device 123, causing the laser device 123 to emit laser light. Therefore, electrical contact 117-1 can be electrically connected to the “N” electrical connector 128-1 of the laser device 123 via TCV 115-1, electrical contact 127-1, and solder connector 119-1, while electrical contact 117-2 can be electrically connected to the “P” electrical connector 128-2 of the laser device 123 via TCV 115-2, electrical contact 127-2, and solder connector 119-2, thus allowing the laser device 123 to be operated via electrical contact 117.

[0043] As already described, laser 103 further includes a waveguide 129 that transmits light from laser device 123 to output surface 131, allowing light from laser device 123 to exit laser 103. As already described, waveguide 129 may include a passive waveguide region of laser device 123. As depicted, output surface 131 is typically generally perpendicular to the second side 112 of carrier 101 and is configured to transmit light from laser device 123 out of laser 103 (e.g., via waveguide 129). However, although output surface 131 is depicted perpendicular to the second side 112 of carrier 101, output surface 131 may be at any suitable angle to the second side 112 (e.g., in the range of about 0° to about 8° (e.g., off-vertical) and / or any other suitable angle).

[0044] As depicted, the body 121 typically includes a protruding region 133 that supports the output surface 131 and protrudes from the edge 113 of the carrier 101. As described throughout the specification, the term "visible area" may alternatively be used to refer to the protruding region 133. Figure 1 As best shown, the coverage area of ​​the body 121 and / or laser 103 is additionally smaller than that of the carrier 101. As will be explained in more detail below, the body 121 of the laser 103 is typically configured (e.g., having a suitable shape and size) to reside within a photonic integrated circuit (PIC) cavity supported by the carrier 101. Furthermore, as Figure 2 Ideally, the output surface 131 is located at the protruding region 133, and / or the output surface 131 is located at one end 132 of the protruding region 133.

[0045] like Figure 1Ideally, as shown, the device 100 may further include optional alignment features 135 at the protruding region 133 and / or body 121 of the laser 103. These alignment features are configured to facilitate one or more machine and human visual alignments between the output surface 131 and the corresponding waveguide 129 of the laser 103 terminating at the output surface 131, and the input surface and corresponding waveguide of the PIC to which the device 100 is attached. As depicted, the alignment feature 135 includes two intersections symmetrically arranged around the waveguide 129 at the surface of the protruding region 133 where the waveguide 129 is located. However, when the alignment feature 135 is present, it may include any appropriate markings, etc., located at any suitable location at the protruding region 133. Furthermore, although alignment feature 135 is depicted as symmetrical, alignment feature 135 need not be symmetrical; in fact, alignment feature 135 can be any suitable shape recognizable by the imaging system and / or machine vision system, for which it has suitable contrast (e.g., compared to other portions of protruding region 133), and wherein the coordinates of alignment feature 135 relative to the optical axis of waveguide 129 and / or output surface 131 are predetermined and / or "known" and / or pre-configured at the means controlling the positioning of device 100 at PIC, as described in more detail below. Alignment feature 135 may be photolithographically etched at protruding region 133 during the fabrication of laser 103.

[0046] like Figure 2 and Figure 3 Ideally, the device 100 may further include one or more of a base (e.g., depicted as base 137) and a recess at the mating surfaces of one or more of the carrier 101 and the body 121 (e.g., the surfaces of the mating second sides 112 and 125), which are configured to position the output surface 131 and the waveguide optical axis at a given plane parallel to the second side 112. For example, the following focuses on... Figure 4 It depicts a perspective view of device 100, showing one end of device 100, which includes a protruding region 133 and an output surface 131. (As shown) Figure 4 As shown, although the output surface 131 includes one end of the waveguide 129, the output surface 131 can be recessed into the body 121 of the laser 103 (e.g., although light from the laser device 123 is typically guided by the waveguide 129 formed at the surface of the body 121, light from the laser device 123 can further propagate within the body 121 near the waveguide 129); typically, the output surface 131 includes a portion of one end of a protruding region 133 in which the waveguide 129 terminates, and light is emitted from the laser device 123 at this portion. For example, as Figure 4As further depicted, laser 103 further includes a waveguide optical axis 401, which may be parallel to waveguide 129 and / or normal to (e.g., perpendicular to) output surface 131; however, waveguide optical axis 401 may form any suitable angle with waveguide 129 and / or output surface 131. In practice, the angle of waveguide optical axis 401 may depend at least in part on the angle of output surface 131; in some examples, due to refraction at output surface 131, the angle of waveguide optical axis 401 may be in the range of about 0° to about 21° (and / or any suitable angle). Waveguide optical axis 401 generally indicates the position and direction of light emitted from laser 103. Output surface 131 may be perpendicular to waveguide optical axis 401, or form another angle with waveguide optical axis (e.g., the aforementioned range of about 0° to about 8° and / or any other suitable angle).

[0047] Similarly, Figure 4 As depicted, a given plane 403 is defined by an output surface 131 and a waveguide optical axis 401; for example, the given plane 403 includes the waveguide optical axis 401 and may be substantially perpendicular to the output surface 131 (e.g., when the output surface 131 is substantially perpendicular to the second side 112) and / or the given plane 403 may be substantially parallel to the mating surfaces to the carrier 101 and / or the laser device 100. In practice, as depicted, the given plane 403 is further parallel to the second side 112 of the carrier 101. Specifically, the dimensions and configuration of the base (e.g., depicted as a base and recess 137) and one or more of the bases or recesses at the mating surfaces of one or more of the carrier 101 and the body 121 are typically chosen to position the given plane 403 such that when the device 100 is positioned relative to the cavity of the PIC (as described below), the given plane 403 is aligned with the corresponding plane of the PIC (e.g., may be substantially perpendicular to its input surface, as described in more detail below). In other words, the base 137 (and / or recess) typically positions the waveguide optical axis 401 (e.g., and / or the output surface 131 and / or the plane 403 and / or) at a given position relative to the second side 112 of the carrier 101, as described above, such that when the device 100 is positioned relative to the cavity of the PIC, the waveguide optical axis 401 is aligned with the corresponding waveguide optical axis of the PIC (e.g., and / or the input surface) (and / or the corresponding waveguide optical axis is aligned when the device 100 is positioned relative to the cavity of the PIC).

[0048] Next, pay attention to Figure 5 It depicts an end view of the device 100 when the laser 103 is attached to the carrier 101. For example, with Figure 3In contrast, the carrier 101 and the laser 103 can be reversed, the carrier 101 can be placed in an apparatus (not depicted) and / or a device for holding the carrier 101, and the laser 103 can be mated with and electrically connected to the carrier 101, for example, by welding the electrical contacts 127 to the corresponding electrical connectors 128 to form a welded connector 119 (e.g., the weld indicated by arrow 501); as described above, the base 137 (and / or the recess) generally positions the waveguide optical axis 401 (and / or the plane 403 and / or the output surface 131) at a given position relative to the second side 112 of the carrier 101.

[0049] Once device 100 is assembled, it can be programmed (e.g., tested) by operating laser device 123. For example, the following focuses on... Figure 6 The diagram depicts a perspective view of the device 100 being programmed (e.g., and / or tested). For example, electrical contacts 117 are connected to a power supply 601, and the laser device 123 is operated such that light 603 (e.g., a laser) is emitted along the waveguide optical axis 401 from and / or approximately along the output surface 131 (e.g., depending on the angle of the output surface 131). The programming (and / or testing) process can stabilize the operation of the laser device 123 and test its operation. For example, during programming, the intensity and / or wavelength of the light 603 can be monitored, and similarly, the power and / or voltage used to operate the laser device 123 at the power supply 601 can be monitored to determine whether the laser device 123 is operating within given parameters (e.g., compatible with PIC and / or telecommunications systems used in conjunction with device 100 (e.g., in combination with a PIC)). The programming process can continue for any suitable time, which can be determined by trial and / or until it is determined that the laser device 123 operates within given parameters and / or until it is determined that the laser device 123 is fault-free. In fact, programming the device 100 before attaching it to the PIC can ensure that the device 100 operates within given parameters, which can improve the yield of optical devices including the combination of the device 100 and the corresponding PIC (e.g., compared to programming after attachment to the PIC).

[0050] Next, pay attention to Figure 7The illustration depicts a perspective view of a device 100 positioned at a PIC 700 using a robotic device 710 (e.g., a robotic arm, depicted as a holding device 100 via a carrier 101, etc.) and an imaging system 712. The PIC includes a cavity 701 within a surface 702 of the PIC 700. Surface 702 may include a mating surface of the PIC 700 (e.g., to which the carrier 101 will be attached, as described in more detail below). It should be understood that only a portion of the PIC 700 is depicted, and the PIC 700 further includes a waveguide 729, an input surface 731 of the waveguide 729, and a cavity 701 with the input surface 731 located at its inner edge 741. The input surface 731 may be perpendicular to the waveguide optical axis 751, and / or at another angle to the waveguide optical axis (e.g., similar to the output surface 131, within the aforementioned range of about 0° to about 8° and / or any other suitable angle). The waveguide optical axis 751 and / or input surface 731 of waveguide 729 are also depicted. It should be understood that waveguide 729, input surface 731 and waveguide optical axis 751 are substantially similar to waveguide 129, output surface 131 and waveguide optical axis 401, respectively, but are suitable for receiving light rather than outputting light.

[0051] Although not depicted, it should be understood that the PIC 700 further includes other optical components, such as, but not limited to, optical modulators, and the waveguide 729 can optically communicate with such optical components, such that the waveguide 729 guides light received at the input surface 731 to such optical components for modulation, etc.

[0052] As depicted and described above, device 100 is operated via power supply 601 during positioning, causing light 603 to be emitted from output surface 131. This operation also causes waveguide 129 to emit light at least partially from its surface, making waveguide 129 more visible to imaging system 712 compared to when device 100 is not operated. As another example, this operation also causes waveguide 129 to at least partially direct light to photodetectors and / or power detectors and / or photodetectors, such that its output signal can be used to help align output surface 131 with input surface 731. However, in other examples, device 100 is not operated during positioning.

[0053] Imaging system 712 is typically positioned to image the face of protruding region 133 and, for example, the face of PIC 700, with waveguide 129 (e.g., and output face 131) and alignment feature 135 (e.g., if present) located in the face of the protruding region, and the edges 741 of waveguide 129 and cavity 701 (e.g., and input face 731) located in the face of the PIC. Imaging system 712 may include any suitable imaging system, including but not limited to a machine vision system and / or its controller that can communicate with feedback system 760 and also with robotic device 710. The robot device 710 can be controlled in a feedback loop, where an image from the imaging system 712 is used to position the body 121 of the laser 103 within the cavity 701, such that the carrier 101 is located at the surface 702 (and / or the base and / or recess at the surface 702 of the PIC 700), and the laser 103 is located within the cavity 701 of the PIC 700, such that the corresponding optical axes 401, 751 of the output surface 131 and the input surface 731 are substantially aligned. In practice, the goal of positioning the device 100 at the PIC 700 is to align axes 401, 751 and / or waveguides 129, 729 (and / or facets 131, 731) so that light exiting the output surface 131 enters the input surface 731. Although not depicted, surface 702 may also include a base and / or recess on which carrier 101 is located (and / or therein), and / or the base and / or recess mates with corresponding features at carrier 101.

[0054] In some examples, the alignment of optical axes 401, 751, etc. can be detected by imaging the protruding region 133 via imaging system 712 during the attachment of carrier 101 to surface 702 (e.g., via polymer adhesive and / or thermosetting adhesive and / or ultraviolet (UV) adhesive, etc.).

[0055] However, in other examples, before attaching carrier 101 to surface 702, robotic device 710 can be used to move device 100 to use feedback system 760 to more precisely align corresponding optical axes 401, 751, etc., which is typically configured to help determine when to align optical axes 401, 751, etc. For example, during movement of laser device 100, imaging system 712 (e.g., machine vision system) can be used to image one or more of protruding region 133 and alignment feature 135 relative to waveguide 729 of PIC 700 to determine when to more precisely align optical axes 401, 751, etc. For example, feedback system 760, which may include any suitable combination of processor, controller, memory, etc., can be configured to determine the position of alignment feature 135 relative to features of PIC 700 corresponding to the more precisely aligned optical axes 401, 751, etc. Specifically, since the coordinates of the alignment feature 135 relative to the optical axis 401 and / or the output surface 131 have been predetermined and / or "known" and can be pre-configured in the feedback system 760, the feedback system 760 can rely on the image of the alignment feature 135 to position and / or place the device 100 relative to the PIC 700.

[0056] Furthermore, more precise alignment can also occur during the operation of the laser device 100, such that when the optical axes 401, 751, etc. are more precisely aligned, the waveguide 729 may become more visible to the imaging system 712 because the light 603 enters the waveguide 729 more precisely.

[0057] In yet another example, the feedback system 760 may further include one or more of a power measurement device and an optical measurement device (not depicted), which optically communicate with the input surface 731 located at the waveguide via a waveguide 729 (e.g., via optical taps, etc.). During more precise alignment of the optical axes 401, 751, etc., the feedback system 760 monitors the output of the power measurement device and / or the optical measurement device (e.g., a photodetector) as the robot device 710 moves the device 100. The feedback system 760 can determine more precise alignment of the optical axes 401, 751, etc. by determining that the output signals of the power measurement device and / or the optical measurement device are maximized approximately at a given position of the laser device 100 relative to the PIC 700 (e.g., and achieving this maximization may be more advantageous than welding during alignment). In some examples, more precise positioning (e.g., to facilitate light transmission between them) can be facilitated by placing a refractive index-matched polymer fluid between the output surface 131 and the input surface 731.

[0058] In other words, in the first step, the device 100 is positioned at surface 702, with the laser 103 located in cavity 701, and facets 131 and 731 generally opposite to each other and / or facing in opposite directions, but the alignment accuracy of optical axes 401, 751, etc., is not initially considered; in the second step, the device 100 is further positioned to more precisely align optical axes 401, 751, etc. In other words, the physical mating surfaces of PIC 700 and device 100 do not necessarily need to be used for aligning optical axes 401, 751, but can be aligned in the second step.

[0059] Furthermore, in some examples, as will be described in more detail below, the physical mating surfaces of the PIC 700 and the device 100 can be used to initially position the device 100 at surface 702, but a robotic device 710 or the like can be used to position the device 100 relative to the PIC 700 (e.g., whether the carrier 101 is in contact with surface 702), and polymer adhesives or the like can be used to hold the device 100 in place relative to the PIC 700 (e.g., the corresponding mating surfaces are separated). This “vertical” positioning can be performed by aligning the optical axes 401, 751, etc., and / or maximizing the light from the output surface 131 to the input surface 731 and / or maximizing the light detected by the power and / or light detection devices as described above.

[0060] For example, next focus Figure 8 It depicts an end view of the device 100 (e.g., similar to...). Figure 5 The view is shown, but device 100 is inverted), and laser 103 is located in cavity 701 of PIC 700 (which is schematically depicted without waveguide 729, etc.); in other words, in Figure 8 In the process, a first step occurs in positioning the device 100 at the surface 702, where the laser 103 is located in the cavity 701, and the facets 131, 731 are generally opposite each other, but initially the alignment accuracy of the optical axes 401, 751 and / or the facets 131, 731 is not taken into consideration. As depicted, and as described above, the robotic device 710 can then move the device 100 left or right relative to the surface 702 and / or the cavity 701, as indicated by arrow 801, until a more precise alignment is achieved. Similarly, the robotic device 710 can move the device 100 vertically relative to the surface 702 and / or the cavity 701 (e.g., toward and away from the surface 702 and / or the cavity 701), as indicated by double arrow 802.

[0061] exist Figure 9 and Figure 10 This precise alignment is further illustrated in the figures, which depict schematic side views of device 100 and PIC 700 and top views of device 100 and PIC 700, respectively. Figure 9The view in the middle is similar to Figure 2 The view in the image is shown, but for the sake of simplicity, some parts of device 100 and PIC 700 are omitted, but they are still understood to be present.

[0062] Specifically, in Figure 9 The image depicts a device 100, wherein a carrier 101 is located at a surface 702 of a PIC 700 (and / or a mating reference surface that may be the same as or different from surface 702), while a laser 103 is located within a cavity 701. The PIC 700 is depicted in cross-section to show the relative positions of the carrier 101 and the laser 103 with respect to surface 702 and cavity 701 (e.g., the PIC 700 is depicted through a plane perpendicular to surface 702). Figure 9 and Figure 10 The diagram also depicts plane 903 of the PIC 700, which includes the waveguide optical axis 751 of waveguide 729 and is substantially perpendicular to the input plane 731. Figure 9 Side view and in Figure 10 Plane 903 is depicted in a side view. Figure 9 The middle also includes a side view and in Figure 10 Plane 403 of the device 100 is depicted in a top view. Figure 9 and Figure 10 and Figure 7 By comparison, it can be understood that plane 903 is aligned with plane 403 of the device, including the corresponding waveguide optical axis 401 of the corresponding waveguide 129 and is substantially perpendicular to the output surface 131. Therefore, most of the base and recess of the device 100 described so far with reference to base 137 are generally chosen to have a size and configuration for positioning the output surface 131 and the waveguide optical axis 401 at plane 403, which is aligned with plane 903 when the carrier 101 is attached to the PIC 700. Specifically, the terms “aligned” and / or “precisely aligned” used with respect to planes 403, 903 can be understood to mean that planes 403, 903 are located in the same plane and / or coplanar with each other. In other words, as previously described, one or more of the base and recess (e.g., base 137) are configured to position the output surface 131 and the waveguide optical axis 401 relative to the surface of the carrier 101 attached to the PIC 700 (e.g., at the second side 112) at plane 403.

[0063] Next reference Figure 10This further illustrates that when planes 403 and 903 are aligned, waveguides 129 and 729 are also aligned. Specifically, the term "precise alignment" as used with respect to waveguides 129 and 729 can be understood to mean that waveguides 129 and 729 are on the same line and / or collinear with each other. However, the term "alignment" as used with respect to waveguides 129 and 729 can be understood to mean that waveguides 129 and 729 are positioned substantially parallel to each other, with facets 131 and 731 facing opposite directions (e.g., when facets 131 and 731 are perpendicular to the respective axes 401 and 751); in some examples, the term "alignment" as used with respect to waveguides 129 and 729 can be further understood to mean that waveguides 129 and 729 are positioned substantially parallel to each other, with facets 131 and 731 positioned such that light emitted from output surface 131 enters input surface 731 (e.g., but may not be maximized).

[0064] In practice, planes 403 and 903 may include references to and / or optical planes associated with reference reference planes that serve as reference planes and / or semiconductor-based reference reference planes (e.g., because they can form and / or serve as references to the semiconductor surfaces of device 100 and PIC 700) at both laser assembly device 100 and PIC 700; such reference reference planes may be located at mating surfaces of laser assembly device 100 such that, during alignment, the corresponding planes 403 and 903 are aligned. In other words, planes 403 and 903 may include vertical optical planes associated with semiconductor-based reference reference planes at PIC 700 and laser assembly 100; when laser assembly 100 is flip-chipped and in contact with PIC 700, these physical reference reference planes mate, which may result in alignment of optical planes 403 and 903. This technique can reduce the requirements for machine-aided alignment.

[0065] Despite Figure 10Not depicted, but it should be understood that when planes 403 and 903 are aligned, planes 131 and 731 are also aligned. Specifically, the term "precise alignment" as used with respect to planes 131 and 731 can be understood as meaning that planes 131 and 731 are positioned to maximize the light emitted from output surface 131 into input surface 731. However, the term "alignment" as used with respect to planes 131 and 731 can be understood as meaning that planes 131 and 731 are positioned such that light emitted from output surface 131 enters input surface 731 (e.g., but may not be maximized). In other words, in some examples, when planes 131 and 731 are precisely aligned, more light can enter input surface 731 from output surface 131 compared to when planes 131 and 731 are initially aligned. However, initial alignment may result in planes 131 and 731 (and / or waveguides 129 and 729) being precisely aligned.

[0066] As will be explained below, in Figure 10 In this process, an adhesive 1002 or similar material has been used to attach the carrier 101 to the surface 702 of the PIC 700, for example, along both sides of the carrier 101 adjacent to the surface 702. However, the adhesive 1002 can be located at any suitable position where the carrier 101 is attached to the surface 702 of the PIC 700.

[0067] Adhesive 1002 may include any suitable polymeric adhesive compatible with device 100 and PIC 700 and further compatible with the environment in which the combination of device 100 and PIC 700 will be deployed (e.g., in a telecommunications system). For example, adhesive 1002 may include ultraviolet (UV) adhesives, thermosetting adhesives, etc., but any suitable adhesive and / or polymeric adhesive is within the scope of this specification. In some examples, welding may be used to attach carrier 101 to surface 702 of PIC 700.

[0068] Although not depicted, as described herein, adhesive 1002 can be automatically dispensed, for example, using any suitable adhesive dispensing system that can be controlled by the feedback system 760, in response to the feedback system 760 determining that the device 100 and PIC 700 are aligned and / or more precisely aligned. In practice, the use of adhesive 1002 avoids soldering the device 100 to the PIC 700, which can reduce damage and / or improve yield (e.g., compared to soldering). However, this specification does not preclude the use of solder to attach the device 100 to the PIC 700 (e.g., solder can be used to attach the carrier 101 to the surface 702 of the PIC 700).

[0069] However, in other examples, instead of more precisely aligning the optical axes 401, 751 and / or the facets 131, 731, polymer waveguides and / or 3D-printed polymer waveguides can be used to optically connect the facets 131, 731. For example, we will focus on the following... Figure 11 The text describes an alternative example where planes 403 and 903 are aligned, but optical axes 401 and 751 and / or facets 131 and 731 and / or waveguides 129 and 729 are only approximately aligned because waveguides 129 and 729 are not collinear, and facets 131 and 731 are not arranged to maximize the light emitted from output surface 131 to input surface 731. However, a polymer waveguide 1101 (e.g., a 3D-printed polymer waveguide) has been used to optically connect output surface 131 to input surface 731, such that light emitted from output surface 131 is transmitted to input surface 731 via polymer waveguide 1101. However, any suitable optical coupling device can be used to couple facets 131 and 731, including but not limited to dissipation waveguides, tapered waveguides, and / or any other suitable waveguides.

[0070] Therefore, the combination of device 100 and PIC 700 can typically form an optical device that can be used in conjunction with telecommunications systems, etc. Such an optical device typically includes: a photonic integrated circuit (PIC) 700, the PIC including a waveguide 729 and an input surface 731 (e.g., an input portion) of the waveguide 729; and a cavity 701, the input surface 731 being located at an inner edge 741 of the cavity 701; and a laser device 100, the laser device including: a carrier 101 including: opposing sides 111, 112 connected by an edge 113; a through-carrier via (TCV) 115 between the opposing sides 111, 112, the TCV 115 including an electrical contact 117 passing through it; and a laser 103 attached to a given side 112 of the opposing sides 111, 112 of the carrier 101, the laser 103 including: a body 121 supporting components of the laser 103; and a laser device 123 configured to generate power for the PIC. The laser device 123 is located between a given side 112 of the carrier 101 and the body 121; a corresponding electrical connection 127 from the laser device 123 to the electrical contact 117 of the TCV 115; and an output surface 131 (e.g., an output portion) and a corresponding waveguide 129 configured to transmit the light 603 from the laser device 123 from the laser 103; a protruding region 133 of the body 121 supporting the output surface 131 and the corresponding waveguide 129, the protruding region protruding from the edge of the carrier 101, the body 121 additionally having a smaller coverage area than the carrier 101, the body 121 being located in the cavity 701 of the PIC 700, wherein the output surface 131 and the corresponding waveguide 129 are aligned with the input surface 731 and the waveguide 729 of the PIC 700, respectively, the carrier 101 being attached to the PIC 700, the carrier 101 supporting the body 121 in the cavity 701. Figure 9 , Figure 10 , Figure 11 An example of an optical device including laser device 100 and PIC 700 is shown.

[0071] It should be further understood that one or more of the following can be used to electrically connect component 100 to electrical contact 117, for example, to electrically connect component 100 to PIC 700 and / or another device in which laser 103 is operated during operation of an optical device incorporating component 100 and PIC 700.

[0072] As already explained, in this optical device, the first plane 903 of the PIC 700 can be aligned with the second plane 403 of the body 121. The first plane includes the waveguide optical axis 751 of the waveguide 729 and can be substantially perpendicular to the input surface 731. The second plane includes the corresponding waveguide optical axis 401 of the corresponding waveguide 129 and is substantially perpendicular to the output surface 131.

[0073] Similarly, in such an optical device, the first plane 903 of the PIC 700 may include the waveguide optical axis 751 of the waveguide 729 and may be substantially perpendicular to the input surface 731. The optical device may further include, at one or more of a base (e.g., base 137) and a recess at one or more of a given side 112 of the carrier 101 and a corresponding side 125 of the body 121 attached to the given side 112, the base and recess being configured to position the waveguide optical axis 401 at a second plane 403 aligned with the first plane 903 when the carrier 101 is attached to the PIC 700, the second plane 403 being substantially perpendicular to the output surface 131. Similarly, in such an optical device, one or more of the base and recess may position the output surface 131 and the waveguide optical axis 401 at plane 403 relative to the surface of the carrier 101 attached to the PIC 700 (e.g., at side 112).

[0074] Although examples have been described so far regarding waveguide 129 and output surface 131 located at protruding region 133, in other examples, the combination of laser and carrier may include a region of the laser's output surface (e.g., a visible region); and a portion of the waveguide from the laser device of the laser to the output surface, allowing for easier positioning of the laser on the surface of the PIC. For example, such a visible region has so far included protruding region 133; however, such a visible region may alternatively be achieved by "flipping" the laser 103 relative to carrier 101 (e.g., as described below regarding...). Figure 13 (To be described in more detail). The following describes a method for assembling an apparatus including a carrier and a laser having a visible area with a PIC, using apparatus 100 and PIC 700 as examples.

[0075] Therefore, the following is about Figure 12 This describes an exemplary method 1200 for manufacturing an optical device that can be performed by the components described herein. However, method 1200 can be performed by other suitable components.

[0076] At frame 1202, the laser device 100 is programmed. As already explained, the laser device 100 includes: a laser 103 attached to a carrier 101; a visible region (e.g., a protruding region 133) of the laser 103, the visible region including at least a portion of an output surface 131 and a waveguide 129 configured to transmit light from the laser 103, the visible region being visible to an imaging system (e.g., imaging system 712) outside the laser device 100. Programming can occur via a power supply 601 and can be performed by placing the laser device 100 in a programming apparatus, etc., the programming apparatus including a connector to the power supply 601 connected to electrical contacts 117; programming may include monitoring the laser 103 (e.g., light emitted from the laser) and / or programming may include operating the laser 103 via the power supply 601 according to a predetermined protocol to test for faults and / or lifespan, etc.

[0077] At frame 1204, the laser device 100 is positioned on surface 702 of the PIC 700 using imaging system 712 and / or robotic device 710, such that the corresponding optical axes 401, 751 (e.g., the output surface 131 and input surface 731 of waveguide 729 of the PIC 700) are substantially aligned. In a particular example, as described above, the laser device 100 may be positioned on surface 702 of the PIC 700 such that carrier 101 is located on surface 702 and laser 103 is located in cavity 701 of the PIC 700, such that the corresponding optical axes 401, 751 are substantially aligned.

[0078] At optional box 1206, the feedback system 760 and the imaging system 712 and / or the robotic device 710 can be used to further position the laser device 100 to more accurately align (e.g., the output surface 131 and the input surface 731) the corresponding optical axes 401, 751.

[0079] At frame 1208, carrier 101 is attached to surface 702 of PIC 700. For example, adhesive 1002, polymer adhesive, UV adhesive, thermosetting adhesive, etc., can be used to attach carrier 101 to surface 702 of PIC 700. When using a UV adhesive, frame 1208 may include using UV light to cure the UV adhesive. Similarly, when using a thermosetting adhesive, frame 1208 may include using heat to cure the thermosetting adhesive. In some examples, frame 1208 may include using solder to attach carrier 101 to surface 702 of PIC 700.

[0080] Method 1200 can typically be executed automatically.

[0081] Specifically, when implementing block 1206, before attaching the carrier 101 to the surface 702 of the PIC 700 at block 1208, method 1200 may further include: using a feedback system 760 to more precisely align the corresponding optical axes 401, 751 of the output surface 131 and the input surface 731, the feedback system being configured to assist in determining when the output surface 131 and the input surface 731 are aligned; and in response to determining that the output surface 131 and the input surface 731 are more precisely aligned using the feedback system 760, attaching the carrier 101 (e.g., at block 1208) to the surface 702 of the PIC 700 using a polymer adhesive 1002. For example, when waveguides 129, 729 are collinear, the feedback system 760 may determine that the output surface 131 and the input surface 731 are more precisely aligned based on an image from the imaging system 712.

[0082] As previously described, feedback system 760 may include imaging system 712, and / or feedback system 760 may communicate with imaging system 712. Furthermore, also as previously described, imaging system 712 may include a machine vision system positioned relative to waveguide 729 of PIC 700 to image one or more of the visible region (e.g., protruding region 133) and alignment features 135 on the visible region (e.g., protruding region 133). In some examples, method 1200 may further include: during movement of laser device 103 (e.g., at box 1206), using the machine vision system to image one or more of the visible region (e.g., protruding region 133) and alignment features 135 relative to waveguide 729 of PIC 700 to determine when to more precisely align output surface 131 and input surface 731. For example, the feedback system 760 and / or the imaging system 712 can be configured to determine that when the alignment feature 135 and / or the waveguide 129 is located relative to the waveguide 729 at a given position, the facets 131, 731 are aligned and / or more precisely aligned.

[0083] In some examples, method 1200 may further include operating laser device 100 during movement of laser device 100 (e.g., at boxes 1204 and / or 1206) to assist machine vision system and / or imaging system 712 in imaging one or more of visible areas (e.g., protruding areas 133) and alignment features 135 relative to waveguide 729 of the PIC. Specifically, operating laser device 100 during movement can help machine vision system and / or imaging system 712 determine when light 603 leaving output surface 131 enters input surface 731 (e.g., due to reduced light scattering, etc., and / or a portion of light 603 propagating through waveguide 729 is emitted via waveguide 729).

[0084] As already described, in some examples, the visible area (e.g., protruding area 133) includes alignment feature 135. In some of these examples, method 1200 may further include: imaging the alignment feature 135 using imaging system 712 to aid in one or more of the following: positioning laser device 100 on the surface of PIC 700 using imaging system 712 and / or robotic device 710 (e.g., at box 1204); and moving laser device 100 using imaging system 712 and / or robotic device 710 (e.g., at box 1206) to more precisely align output surface 131 with input surface 731. Moreover, feedback system 760 and / or imaging system 712 may be configured to determine that facets 131, 731 are aligned and / or more precisely aligned when alignment feature 135 and / or waveguide 129 are located relative to waveguide 729 at a given position.

[0085] As already described, in some examples, the feedback system 760 may include one or more of a power measurement device and an optical measurement device that are optically in communication with the input surface 731 via a waveguide 729; in these examples, method 1200 may further include using the feedback system 760 to determine that the respective optical axes 401, 751 are more precisely aligned: determining that the output signal of one or more of the power measurement device and the optical measurement device is approximately maximized at a given position of the laser device relative to the PIC.

[0086] However, in other examples, box 1206 may be omitted, and method 1200 may further include optically connecting output surface 131 to input surface 731 using polymer waveguide 1101. In such examples, any suitable device and / or material may be used to form polymer waveguide 1101.

[0087] In some examples, polymer waveguides (and / or 3D-printed polymer waveguides) can be used in conjunction with attaching laser devices to a PIC in other configurations that do not include a cavity. For example, the following section discusses... Figure 13 The diagram schematically depicts a laser device 1300 (and / or laser assembly 1300, etc.) comprising a carrier 1301 and a laser 1303 attached to the carrier; however, unlike the carrier 101 and laser 103, the laser 1303 is attached to the carrier 1301 on the side opposite to the carrier 1301 via a laser device 1323, a waveguide 1329, and a corresponding output surface 1331 (e.g., an output portion). However, in other examples, the laser device 1300 may be similar to and / or identical to the laser device 100. Although details of the carrier 1301 and laser 1303 are not depicted, it should be understood that the laser 1303 includes laser devices similar to laser device 123, etc.

[0088] Similarly, Figure 13 As depicted, device 1300 is attached to the surface of PIC 1340, for example, by means of adhesive or the like, on the side of carrier 1301 opposite to laser 1303. Unlike device 100 and PIC 700, laser 1303 is not located in the cavity of PIC 1340; in fact, as depicted, PIC 1340 does not include a cavity similar to cavity 701.

[0089] Furthermore, one side of the laser 1303, including the waveguide 1329 and the corresponding output surface 1331, may include a visible area that can be used to position and / or align the device 1300 at the PIC 1340, as described above with respect to method 1200. The visible area may include alignment features similar to the alignment feature 135 described above.

[0090] Specifically, as described above, the laser 1303 can be programmed before being attached to the PIC 1340. As depicted, the PIC 1340 includes a waveguide 1339 and a corresponding input surface 1341 (e.g., an input portion), which may resemble waveguide 729 and input surface 731, respectively; however, waveguide 1339 and input surface 1341 are not located at the cavity.

[0091] As depicted, facets 1331 and 1341 face opposite directions but are not otherwise aligned; furthermore, facets 1331 and 1341 can be at any suitable angle, similar to those described above regarding facets 131 and 1331. As depicted, facets 1331 and 1341 communicate optically via polymer waveguide 1351 (e.g., a 3D-printed polymer waveguide), such that light exiting output surface 1331 is transmitted to input surface 1341 via polymer waveguide 1351. However, any suitable optical coupling device can be used to couple facets 1331 and 1341, including but not limited to dissipation waveguides, tapered waveguides, and / or any other suitable waveguides.

[0092] In some examples, during the attachment of device 1300 to PIC 1340, device 1300 may be located at PIC 1340 to minimize and / or reduce the distance between the facets 1331, 1341 to minimize and / or reduce the length of polymer waveguide 1351.

[0093] Therefore, in these examples, device 1300 may be manufactured and / or programmed (and / or screened and / or tested) prior to attachment to PIC 1340, and polymer waveguide 1351 may be attached between facets 1331 and 1341 to optically connect them. Furthermore, in some examples, device 1300 may include alignment features (e.g., similar to alignment feature 135 and adjacent to waveguide 1329 on a surface visible to the imaging system) to assist in positioning device 1300 at PIC 1340. Furthermore, although not described, it should be further understood that one or more of adhesive wires, conductive adhesives, contact pins, solder, etc., can be used to electrically connect component 1300 to electrical contacts (e.g., similar to electrical contact 117), for example to electrically connect component 700 to PIC 1340 and / or another device in which laser 1323 is operated during operation of an optical device incorporating component 1300 and PIC 1340.

[0094] In this specification, an element may be described as being "configured to" perform one or more functions or "configured for" such functions. Typically, an element configured to perform or configured for performing a function is enabled to perform that function, or is adapted to perform that function, or is operable to perform that function, or is otherwise capable of performing that function.

[0095] It should be understood that, for the purposes of this specification, the language “at least one of X, Y, and Z” and “one or more of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more X, Y, and Z (e.g., XYZ, XY, YZ, XZ, etc.). Similar logic can be applied to two or more items in any case where the language “at least one…” and “one or more…” appears.

[0096] For example, as understood by those skilled in the art, the terms “about,” “substantially,” “essentially,” “approximately,” etc., are defined as “close to.” In some examples, the term should be understood as “within 10%”, in others as “within 5%”, in still others as “within 1%”, and in yet still others as “within 0.5%”.

[0097] Those skilled in the art will understand that, in some examples, the functionality of the apparatus and / or methods and / or processes described herein can be implemented using pre-programmed hardware or firmware elements (e.g., application-specific integrated circuits (ASICs), electrically erasable programmable read-only memory (EEPROM), etc.) or other related components. In other examples, the functionality of the apparatus and / or methods and / or processes described herein can be implemented using a computing device capable of accessing a code memory (not shown) that stores computer-readable program code for the operation of the computing device. The computer-readable program code can be stored on a computer-readable storage medium (e.g., a removable disk, CD-ROM, ROM, fixed disk, USB drive) that is fixed, tangible, and directly readable by these components. Furthermore, it should be understood that a computer-readable program can be stored as a computer program product including a computer-usable medium. Additionally, a persistent storage device can include computer-readable program code. It should be further understood that computer-readable program code and / or computer-usable medium can include non-transitory computer-readable program code and / or non-transitory computer-usable medium. Alternatively, computer-readable program code may be stored remotely, but may be transmitted to these components via a modem or other interface device connected to a network (including, but not limited to, the Internet) through a transmission medium. The transmission medium may be a non-mobile medium (e.g., optical and / or digital and / or analog communication lines) or a mobile medium (e.g., microwave, infrared, free-space optical, or other transmission schemes) or a combination thereof.

[0098] Those skilled in the art will understand that many other alternative examples and modifications are possible, and that the examples above are merely illustrative of one or more embodiments. Therefore, the scope is limited only by the appended claims.

Claims

1. A carrier-based laser assembly, the laser assembly comprising: A photonic integrated circuit (PIC), the photonic integrated circuit (PIC) including a waveguide and an input portion to the waveguide; And a cavity, wherein the input portion is located at the inner edge of the cavity; as well as Laser device, the laser device comprising: The carrier includes: A first side, a second side opposite to the first side, and an edge connecting the first side and the second side; a through-carrier via (TCV) from the first side to the second side, the through-carrier via (TCV) including an electrical connector passing through it; a first electrical contact for the electrical connector at the first side; and a second electrical contact for the electrical connector at the second side; and A laser attached to the second side of the carrier, the laser comprising: A main body, the main body supporting the laser; a laser device configured to generate light, the laser device being located on a corresponding side of the main body attached to the second side of the carrier; From the second electrical contact to the corresponding electrical connection of the laser device; and The main body has a protruding region that protrudes from the edge of the carrier, and the main body further has a coverage area smaller than that of the carrier; and An output section and a corresponding waveguide, configured to transmit light from the laser device from the laser, the output section being located at the protruding region of the main body. The main body is located within the cavity of the photonic integrated circuit (PIC), wherein the output portion and the corresponding waveguide are aligned with the input portion and the waveguide of the photonic integrated circuit (PIC), respectively, and the carrier is attached to the photonic integrated circuit (PIC), supporting the main body within the cavity. The protruding region is located within the cavity, and the protruding region includes a visible region, which includes the output portion. The visible region is visible within the cavity near the input portion of the photonic integrated circuit (PIC).

2. The laser assembly of claim 1, further comprising one or more bases and recesses at mating surfaces of one or more of the second side of the carrier and the body, the bases and recesses being configured to position the output portion and the waveguide optical axis parallel to the second side at a given plane.

3. The laser assembly of claim 1, further comprising an alignment feature at the protruding region, the alignment feature being configured to facilitate one or more of the following: The machine alignment of the output section with the input section and the machine alignment of the corresponding waveguide of the laser terminating at the output section with the waveguide of the photonic integrated circuit (PIC); and The human visual alignment of the output portion with the input portion and the human visual alignment of the corresponding waveguide of the laser terminating at the output portion with the waveguide of the photonic integrated circuit (PIC).

4. The laser assembly according to claim 1, wherein, The carrier further includes a recess on the second side, and the second electrical contact is at least partially located in the recess on the second side.

5. A carrier-based laser assembly, the laser assembly comprising: A photonic integrated circuit (PIC), the photonic integrated circuit (PIC) including a waveguide and an input portion to the waveguide; And a cavity, wherein the input portion is located at the inner edge of the cavity; as well as Laser device, the laser device comprising: A carrier comprising: two opposing sides connected by an edge; a through-carrier via (TCV) between the opposing sides, the through-carrier via (TCV) including an electrical connector passing through it; and A laser, attached to a given side of opposite sides of a carrier, the laser comprising: a body supporting components of the laser; a laser device configured to generate light for the photonic integrated circuit (PIC), the laser device being located between the given side of the carrier and the body; a corresponding electrical connection from the laser device to the through-carrier via (TCV) electrical connection; and an output portion and a corresponding waveguide configured to transmit the light from the laser device from the laser; a protruding region of the body supporting the output portion and the corresponding waveguide, the protruding region protruding from the edge of the carrier, the body additionally having a coverage area smaller than the carrier, the output portion being located at the protruding region of the body. The main body is located within the cavity of the photonic integrated circuit (PIC), wherein the output portion and the corresponding waveguide are aligned with the input portion and the waveguide of the photonic integrated circuit (PIC), respectively. The carrier is attached to the photonic integrated circuit (PIC) and supports the main body within the cavity. The protruding region is located within the cavity, and the protruding region includes a visible region, which includes the output portion. The visible region is visible within the cavity near the input portion of the photonic integrated circuit (PIC).

6. The laser assembly according to claim 5, wherein, The first plane of the photonic integrated circuit (PIC) is aligned with the second plane of the body. The first plane includes the waveguide optical axis of the waveguide and is substantially parallel to the mating surface of the carrier and the laser device. The second plane includes the corresponding waveguide optical axis of the corresponding waveguide and is substantially parallel to the mating surface of the carrier and the laser device.

7. The laser assembly according to claim 5, wherein, The first plane of the photonic integrated circuit (PIC) includes the waveguide optical axis of the waveguide and is generally parallel to the mating surface of the carrier and the laser device. The device further includes one or more of a base and a recess at one or more of the given side of the carrier and the corresponding side of the body attached to the given side. The base and the recess are configured to position the waveguide optical axis at a second plane. When the carrier is attached to the photonic integrated circuit (PIC), the second plane is aligned with the first plane and is generally perpendicular to the output portion.

8. The laser assembly according to claim 7, wherein, One or more of the base and the recess position the output portion and the waveguide optical axis at the second plane relative to the surface of the carrier to which the photonic integrated circuit (PIC) is attached.

9. A method for assembling a carrier-based laser assembly, the method comprising: A laser burning device includes: a laser attached to a carrier; a visible region of the laser, the visible region including an output portion and at least a portion of a waveguide configured to transmit light from the laser, the visible region being visible to an imaging system outside the laser device; the laser including: a body supporting components of the laser; a laser device configured to generate light for a photonic integrated circuit (PIC), the laser device being located between a given side of the carrier and the body; the output portion and the waveguide configured to transmit the light from the laser device from the laser; a protruding region of the body supporting the output portion; and the waveguide protruding from an edge of the carrier, the body further having a coverage area smaller than the carrier, the output portion being located at the protruding region of the body; The laser device is positioned on the surface of the photonic integrated circuit (PIC) using one or more of the imaging system and robotic device, wherein the photonic integrated circuit (PIC) includes a cavity in the surface such that the corresponding optical axes of the input and output portions of the respective waveguides of the photonic integrated circuit (PIC) are substantially aligned, and the body is located within the cavity, wherein a protruding region is located within the cavity, the protruding region including the visible region, the visible region including the output portion, the visible region being visible within the cavity near the input portion of the photonic integrated circuit (PIC); and The carrier is attached to the surface of the photonic integrated circuit (PIC).

10. The method of claim 9, further comprising: Before attaching the carrier to the surface of the photonic integrated circuit (PIC): one or more of the imaging system and the robotic device are used to move the laser device to more precisely align the corresponding optical axes of the output and input portions using a feedback system configured to help determine when the output and input portions are aligned; as well as In response to using the feedback system to determine a more precise alignment between the output portion and the input portion, the carrier is attached to the surface of the photonic integrated circuit (PIC).

11. The method according to claim 10, wherein, The feedback system includes a machine vision system positioned relative to a corresponding waveguide of the photonic integrated circuit (PIC) to image one or more of the visible region and alignment features on the visible region, and the method further includes: During the movement of the laser device, the machine vision system images one or more of the visible area and the alignment features relative to the corresponding waveguide of the photonic integrated circuit (PIC) to determine when the output portion is more precisely aligned with the input portion.

12. The method of claim 11, further comprising operating the laser device during movement of the laser device to assist the machine vision system in imaging one or more of the visible region and the alignment features relative to the respective waveguide of the photonic integrated circuit (PIC).

13. The method according to claim 10, wherein, The visible region includes alignment features, and the method further includes: Imaging the alignment features using a machine vision system helps to perform one or more of the following: positioning the laser device on the surface of the photonic integrated circuit (PIC) using the imaging system; and moving the laser device using the robotic device to more precisely align the output portion with the input portion.

14. The method of claim 10, wherein, The feedback system includes one or more of a power measurement device and an optical measurement device that optically communicate with the input portion via the waveguide, wherein using the feedback system to determine that the respective optical axes of the output portion and the input portion are more precisely aligned includes determining that the output signal of one or more of the power measurement device and the optical measurement device is approximately maximized at a given position of the laser device relative to the photonic integrated circuit (PIC).

15. The method of claim 9, further comprising: The output section is optically connected to the input section using a polymer waveguide.

16. The method according to claim 9, wherein, The carrier is attached to the surface of the photonic integrated circuit (PIC) using one or more of polymer adhesives, thermosetting adhesives, and ultraviolet (UV) adhesives.

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