Display device and method of manufacturing the same
Patent Information
- Application Number
- CN202080030574.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-04-22
- Filing Date
- 2020-02-13
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2040-02-13
AI Technical Summary
[0028] Forming the second electrode may also include removing the light-emitting element sprayed onto the second insulating layer.
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Figure CN113711360B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a display device and a method for manufacturing the same. Background Technology
[0002] With the development of multimedia, display devices have become increasingly important. Therefore, various types of display devices are being used, such as organic light-emitting diode (OLED) displays and liquid crystal displays (LCDs).
[0003] The display device includes a display panel (such as an organic light-emitting display panel or a liquid crystal display panel) as a means for displaying images on the display device. The light-emitting display panel may include light-emitting elements, such as light-emitting diodes (LEDs). For example, the LED may be an organic light-emitting diode (OLED) that uses organic materials as fluorescent materials, or it may be an inorganic LED that uses inorganic materials as fluorescent materials.
[0004] Inorganic LEDs using inorganic semiconductors as fluorescent materials are durable even in high-temperature environments and exhibit higher blue light efficiency than OLEDs. Furthermore, a transfer method using dielectric electrophoresis (DEP) has been developed to address the manufacturing processes that have been identified as limiting factors for conventional inorganic LEDs. Therefore, ongoing research is being conducted on inorganic LEDs with better durability and efficiency than OLEDs. Summary of the Invention
[0005] [Technical Issues]
[0006] This disclosure provides a display device including light-emitting elements extending in one direction and aligned in a direction perpendicular to each electrode.
[0007] This disclosure also provides a method for manufacturing a display device, the method comprising a process of fixing a light-emitting element in a direction perpendicular to the electrodes.
[0008] It should be noted that the aspects of this disclosure are not limited thereto, and other aspects not mentioned herein will be apparent to those skilled in the art from the following description.
[0009] [Technical Solution]
[0010] According to an embodiment of the present disclosure, the display device includes: a first electrode; a first insulating layer disposed on the first electrode; a second electrode disposed on the first insulating layer, and at least a portion of the second electrode facing the first electrode in a first direction; and a plurality of first light-emitting elements disposed between the first electrode and the second electrode and extending in one direction, wherein the first insulating layer partially covers the outer surface of the first light-emitting elements, and at least some of the first light-emitting elements extend in a direction parallel to the first direction.
[0011] The first end of the first light-emitting element can partially contact the first electrode, and the second end of the first light-emitting element opposite to the first end can contact the second electrode.
[0012] The acute angle formed by the first light-emitting element along one direction and a second direction perpendicular to the first direction can be in the range of 80 to 90 degrees.
[0013] Each of the first light-emitting elements may include a first conductivity type semiconductor, a second conductivity type semiconductor, and an active layer disposed between the first conductivity type semiconductor and the second conductivity type semiconductor, and in at least some of the first light-emitting elements, the first conductivity type semiconductor, the active layer, and the second conductivity type semiconductor are disposed sequentially along a first direction.
[0014] Each of the first light-emitting elements may include an insulating film surrounding a side surface of a first conductivity type semiconductor, a side surface of a second conductivity type semiconductor, and a side surface of an active layer, and the insulating film may partially contact the first insulating layer.
[0015] In at least some of the first light-emitting elements, light emitted from the active layer can travel parallel to a first direction.
[0016] The display device may further include: a second insulating layer disposed between the second electrode and the first insulating layer; and an opening region disposed in the region surrounded by the second insulating layer to partially expose the first insulating layer.
[0017] The first electrode may overlap with at least a portion of the second insulating layer and the opening region in the first direction, and the first light-emitting element may be disposed between the first electrode and the second electrode in the opening region.
[0018] The area of the first electrode can be larger than the area of the opening region.
[0019] The second end of the first light-emitting element may protrude partially from the upper surface of the first insulating layer, and the second electrode may surround the protruding portion of the second end of the first light-emitting element.
[0020] The thickness of the second insulating layer can be greater than the height of the protruding portion at the second end of each of the first light-emitting elements.
[0021] The length of each of the first light-emitting elements extending in one direction can range from 2 μm to 6 μm.
[0022] The first electrode may further include a first electrode protrusion that protrudes from the upper surface of the first electrode to cover the first end of the first light-emitting element.
[0023] The display device may further include: a third electrode, spaced apart from the first electrode in a second direction perpendicular to the first direction, and facing at least a portion of the second electrode in the first direction; and a second light-emitting element disposed between the third electrode and the second electrode, wherein a first insulating layer may be disposed between the third electrode and the second electrode.
[0024] The second insulating layer may partially overlap with the first electrode and the third electrode in the first direction, and the first electrode and the third electrode may be spaced apart from each other in the region where they overlap with the second insulating layer.
[0025] According to embodiments of the present disclosure, a method for manufacturing a display device includes: preparing a substrate portion comprising a first electrode, a first insulating layer covering the first electrode, and a second insulating layer partially disposed on the first insulating layer; inserting a light-emitting element extending in one direction into the first insulating layer in a first direction perpendicular to the upper surface of the first insulating layer; and forming a second electrode covering the first insulating layer and the second insulating layer.
[0026] Inserting a light-emitting element into a first insulating layer may include: spraying the light-emitting element onto a first electrode; aligning the light-emitting element such that the light-emitting element extends in a direction parallel to a first direction by forming an electric field on the first electrode; and inserting the light-emitting element into the first insulating layer in the first direction.
[0027] The second insulating layer may include an opening region that partially exposes the first insulating layer, and the light-emitting element may be inserted into the first insulating layer within the opening region.
[0028] Forming the second electrode may also include removing the light-emitting element sprayed onto the second insulating layer.
[0029] Each of the light-emitting elements may have its end partially protruding from the first insulating layer, and a second electrode may be formed to cover the end.
[0030] Details of other implementation methods are included in the detailed description and accompanying drawings.
[0031] [Beneficial Effects]
[0032] In a display device according to an embodiment, a plurality of light-emitting elements can be aligned between electrodes in a direction perpendicular to the electrodes. A method of manufacturing the display device may include a process of inserting the light-emitting elements in a direction perpendicular to the electrodes, wherein the electrodes may face each other in the thickness direction, and an insulating layer is interposed between the electrodes. Therefore, the light-emitting elements can be aligned such that the light-emitting elements are parallel to the thickness direction in their direction of extension. When the light-emitting elements are inserted into the insulating layer, the insulating layer can fix the light-emitting elements in place.
[0033] Therefore, light emitted by the light-emitting element along its extension direction can be output in the upward direction of each pixel.
[0034] The effects of the implementation methods are not limited to the examples above, and this disclosure includes many more effects. Attached Figure Description
[0035] Figure 1 This is a schematic plan view of the display device according to the embodiment;
[0036] Figure 2 This is a schematic plan view of the pixels of the display device according to this embodiment;
[0037] Figure 3 This is a schematic cross-sectional view of the pixels of the display device according to this embodiment;
[0038] Figure 4 It is along Figure 2 A sectional view taken by line IV-IV';
[0039] Figure 5 yes Figure 2 A planar graph of sub-pixels;
[0040] Figure 6 yes Figure 3 An enlarged sectional view of a portion;
[0041] Figure 7 This is a schematic diagram of a light-emitting element according to an embodiment;
[0042] Figure 8 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment;
[0043] Figures 9 to 17 This is a cross-sectional view illustrating the manufacturing process of the display device according to an embodiment;
[0044] Figure 18 This is a plan view of the pixels of a display device according to another embodiment;
[0045] Figure 19 It is along Figure 18 A sectional view taken from line VII-VII';
[0046] Figure 20 This is a cross-sectional view of a display device according to another embodiment;
[0047] Figure 21 This is a schematic diagram illustrating a portion of a manufacturing process for a display device according to another embodiment;
[0048] Figures 22 to 24 It shows the use Figure 21A schematic diagram of a method for manufacturing a display device using a display device manufacturing process; and
[0049] Figure 25 This is a cross-sectional view of a display device according to another embodiment. Detailed Implementation
[0050] The invention will now be described more fully below with reference to the accompanying drawings, which illustrate preferred embodiments of the invention. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0051] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or an intervening layer may be present. Throughout the specification, the same reference numerals denote the same parts.
[0052] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the teachings of the invention, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element.
[0053] In the following description, embodiments will be described with reference to the accompanying drawings.
[0054] Figure 1 This is a schematic plan view of a display device according to an embodiment.
[0055] Reference Figure 1 The display device 10 displays moving or still images. The display device 10 can represent any electronic device that provides a display screen. Examples of the display device 10 may include televisions, laptops, monitors, billboards, Internet of Things (IoT) devices, mobile phones, smartphones, tablet PCs, electronic watches, smartwatches, watch phones, head-mounted displays, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, game consoles, digital cameras, and camcorders, all of which provide a display screen.
[0056] Display device 10 includes a display panel that provides a display screen. Examples of display panels include light-emitting diode (LED) display panels, organic light-emitting diode (OLED) display panels, quantum dot (QD) light-emitting diode (OLED) display panels, plasma display panels, and field emission display panels. An example of using an LED display panel as a display panel will be described below; however, this disclosure is not limited to this, and other display panels may be used, provided the same technical spirit is applied.
[0057] The shape of the display device 10 can be modified in various ways. For example, the display device 10 can have various shapes, such as a horizontally elongated rectangle, a vertically elongated rectangle, a square, a quadrilateral with rounded corners (vertices), other polygons, and a circle. The shape of the display area DA of the display device 10 can also resemble the overall shape of the display device 10. Figure 1 The image shows a display device 10 with a horizontally elongated rectangular shape and a display area DA.
[0058] The display device 10 may include a display area DA and a non-display area NDA. The display area DA may be an area where an image can be displayed, and the non-display area NDA may be an area where no image is displayed. The display area DA may also be referred to as the active area, and the non-display area NDA may also be referred to as the inactive area.
[0059] The display area DA can generally occupy the center of the display device 10. The display area DA can include a plurality of pixels PX. The pixels PX can be arranged in a matrix. Each of the pixels PX can be rectangular or square in a planar view. However, the present disclosure is not limited thereto, and each of the pixels PX can also have a rhomboid planar shape, with each side inclined relative to the first direction DR1. Each pixel PX can include one or more light-emitting elements 300, which emit light in a specific wavelength band to display a specific color.
[0060] Figure 2 This is a schematic plan view of the pixels of the display device according to this embodiment.
[0061] Reference Figure 2 Each of the pixels PX may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. The first sub-pixel PX1 may emit light of a first color, the second sub-pixel PX2 may emit light of a second color, and the third sub-pixel PX3 may emit light of a third color. The first color may be red, the second color may be green, and the third color may be blue. However, this disclosure is not limited thereto, and sub-pixels PXn (which may represent any of the sub-pixels included in pixel PX, and n may be 1, 2, 3, etc.) may also emit light of the same color. Furthermore, although in Figure 2In this context, pixel PX comprises three sub-pixels PXn, but this disclosure is not limited thereto, and pixel PX may also comprise more sub-pixels PXn.
[0062] It will be understood that although the terms first, second, third, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. That is, elements defined as first, second, etc., are not necessarily limited to a specific structure or location, and in some cases, other numerical terms may be assigned. Therefore, the numbers assigned to each element can be described by way of the accompanying drawings and the following description, and without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.
[0063] Each sub-pixel PXn of the display device 10 may include a region defined as an emitting region EMA and a non-emitting region NEM. The emitting region EMA may be defined as a region provided with light-emitting elements 300 included in the display device 10 to emit light in a specific wavelength band. Each of the light-emitting elements 300 may include an active layer 330, which will be described later (see [link to relevant documentation]). Figure 7 The active layer 330 can emit light in a specific wavelength band omnidirectionally. That is, the light emitted from the active layer 330 of each light-emitting element 300 can radiate in the lateral direction of the light-emitting element 300 and toward both ends of the light-emitting element 300. The emission region EMA of each sub-pixel PXn may include a region in which the light-emitting element 300 is disposed and a region adjacent to the light-emitting element 300 from which the light emitted from the light-emitting element 300 is output. However, this disclosure is not limited to this, and the emission region EMA may also include a region from which the light emitted from the light-emitting element 300 is output after being reflected or refracted by other components. Multiple light-emitting elements 300 may be disposed in each sub-pixel PXn, and the region in which the light-emitting element 300 is disposed and the region adjacent to that region may form the emission region EMA.
[0064] The non-emitting region (NEM) can be a region other than the emitting region (EMA), and can be defined as a region in which no light-emitting element 300 is disposed, and since the light emitted from the light-emitting element 300 does not reach this region, no light is output from this region.
[0065] The second insulating layer 520 can be disposed between each pixel PX and another adjacent pixel PX, or between each sub-pixel PXn and another adjacent sub-pixel PXn. The second insulating layer 520 may include portions extending in the first direction DR1 and portions extending in the second direction DR2, and can be disposed at the boundary of each sub-pixel PXn to form a grid pattern. The portion of the second insulating layer 520 extending in the first direction DR1 can separate the pixels PX or sub-pixels PXn arranged in the second direction DR2, and the portion extending in the second direction DR2 can separate the pixels PX or sub-pixels PXn arranged in the first direction DR1. That is, each sub-pixel PXn can be understood as the area in the display area DA surrounded by the second insulating layer 520.
[0066] In the accompanying drawings, the second insulating layer 520 surrounds a pixel PX and is disposed at the boundary of each sub-pixel PXn included in the pixel PX, that is, at the boundary of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3. The second insulating layer 520 may be disposed integrally in the display area DA to surround multiple pixels PX or sub-pixels PXn.
[0067] The second insulating layer 520 may be disposed on the first insulating layer 510, which will be described later (see [link]). Figure 3 On, and expose the first insulating layer 510 (see) Figure 3 An opening region 520P, a portion of which is located in a region where the second insulating layer 520 is not disposed, can be provided. The opening region 520P can be located in a region surrounded by the portion of the second insulating layer 520 extending in the first direction DR1 and the portion of the second insulating layer 520 extending in the second direction DR2, to expose the first insulating layer 510 in each sub-pixel PXn. Figure 2 As shown, the opening region 520P can be disposed in each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3, and the light-emitting element 300 can be disposed in the first insulating layer 510 exposed by the opening region 520P. The emitting region EMA can be formed in the region in which the first insulating layer 510 is exposed and the light-emitting element 300 is disposed, and the non-emitting region NEM can be formed in the region in which the second insulating layer 520 is disposed and the light-emitting element 300 is not present.
[0068] Each sub-pixel PXn formed in the region surrounded by the second insulating layer 520 may include a first electrode 210 and a second electrode 220 (see...). Figure 3The system comprises a first insulating layer 510 and a plurality of light-emitting elements 300. The light-emitting elements 300 may be disposed between the first electrode 210 and the second electrode 220, and may receive emission signals from the first electrode 210 and the second electrode 220 to emit light in a specific wavelength band. The structure of each sub-pixel PXn will now be described in more detail with reference to other accompanying drawings.
[0069] Figure 3 This is a schematic cross-sectional view of the pixels of the display device according to this embodiment. Figure 4 It is along Figure 2 A sectional view taken from line IV-IV'.
[0070] although Figure 3 and Figure 4 This is a cross-sectional view of the first sub-pixel PX1, but the same diagram can be applied to other pixels PX or sub-pixels PXn.
[0071] Reference Figures 2 to 4 The display device 10 according to this embodiment includes a circuit element layer PAL and a light-emitting layer EML. The circuit element layer PAL may include a substrate 110, a buffer layer 115, a light-blocking layer BML, a first transistor 120 and a second transistor 140, and the light-emitting layer EML may include a plurality of electrodes 210 and 220 disposed on the first transistor 120 and the second transistor 140, a light-emitting element 300, and a plurality of insulating layers 510 and 520.
[0072] The substrate 110 may be an insulating substrate. The substrate 110 may be made of an insulating material such as glass, quartz, or polymer resin. In addition, the substrate 110 may be a rigid substrate, but it may also be a flexible substrate that can be bent, folded, rolled, etc.
[0073] A light-blocking layer BML may be disposed on the substrate 110. The light-blocking layer BML may include a first light-blocking layer BML1 and a second light-blocking layer BML2. The first light-blocking layer BML1 may be electrically connected to the first drain electrode 123 of the first transistor 120, which will be described later. The second light-blocking layer BML2 may be electrically connected to the second drain electrode 143 of the second transistor 140.
[0074] The first light-blocking layer BML1 and the second light-blocking layer BML2 overlap with the first active material layer 126 of the first transistor 120 and the second active material layer 146 of the second transistor 140, respectively. The first light-blocking layer BML1 and the second light-blocking layer BML2 may include a light-blocking material to prevent light from entering the first active material layer 126 and the second active material layer 146. For example, the first light-blocking layer BML1 and the second light-blocking layer BML2 may be made of an opaque metallic material that blocks light transmission. However, this disclosure is not limited thereto. In some cases, the light-blocking layer BML may be omitted.
[0075] A buffer layer 115 is disposed on the light-blocking layer BML and the substrate 110. The buffer layer 115 can completely cover the substrate 110 and the light-blocking layer BML. The buffer layer 115 can prevent the diffusion of impurity ions, prevent the penetration of moisture or external air, and perform surface planarization. In addition, the buffer layer 115 can insulate the light-blocking layer BML, the first active material layer 126, and the second active material layer 146 from each other.
[0076] A semiconductor layer is disposed on the buffer layer 115. The semiconductor layer may include a first active material layer 126 of the first transistor 120, a second active material layer 146 of the second transistor 140, and an auxiliary layer 163. The semiconductor layer may include polycrystalline silicon, monocrystalline silicon, oxide semiconductor, etc.
[0077] The first active material layer 126 may include a first doped region 126a, a second doped region 126b, and a first channel region 126c. The first channel region 126c may be disposed between the first doped region 126a and the second doped region 126b. The second active material layer 146 may include a third doped region 146a, a fourth doped region 146b, and a second channel region 146c. The second channel region 146c may be disposed between the third doped region 146a and the fourth doped region 146b. The first active material layer 126 and the second active material layer 146 may include polycrystalline silicon. Polycrystalline silicon can be formed by crystallizing amorphous silicon. Examples of crystallization methods may include, but are not limited to, rapid thermal annealing (RTA), solid-state crystallization (SPC), excimer laser annealing (ELA), metal-induced crystallization (MILC), and continuous lateral solidification (SLS). Optionally, the first active material layer 126 and the second active material layer 146 may include monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, etc. The first doped region 126a, the second doped region 126b, the third doped region 146a, and the fourth doped region 146b can be regions of the first active material layer 126 and the second active material layer 146 that are doped with impurities. However, this disclosure is not limited thereto.
[0078] A first gate insulating layer 150 is disposed on the semiconductor layer. The first gate insulating layer 150 may completely cover the buffer layer 115 and the semiconductor layer. The first gate insulating layer 150 may be used as the gate insulating layer for each of the first transistor 120 and the second transistor 140.
[0079] A first conductive layer is disposed on a first gate insulating layer 150. The first conductive layer disposed on the first gate insulating layer 150 may include a first gate electrode 121 of a first transistor 120 disposed on a first active material layer 126, a second gate electrode 141 of a second transistor 140 disposed on a second active material layer 146, and power wiring 161 disposed on an auxiliary layer 163. The first gate electrode 121 may overlap with a first channel region 126c of the first active material layer 126, and the second gate electrode 141 may overlap with a second channel region 146c of the second active material layer 146. An interlayer insulating film 170 is disposed on the first conductive layer. The interlayer insulating film 170 may serve as an interlayer insulating film between the first conductive layer and the second conductive layer. Furthermore, the interlayer insulating film 170 may include an organic insulating material and perform a surface planarization function.
[0080] The second conductive layer is disposed on the interlayer insulating film 170. The second conductive layer includes the first drain electrode 123 and the first source electrode 124 of the first transistor 120, the second drain electrode 143 and the second source electrode 144 of the second transistor 140, and the power electrode 162 disposed on the power wiring 161.
[0081] The first drain electrode 123 and the first source electrode 124 can contact the first doped region 126a and the second doped region 126b of the first active material layer 126, respectively, through contact holes penetrating the interlayer insulating film 170 and the first gate insulating layer 150. The second drain electrode 143 and the second source electrode 144 can contact the third doped region 146a and the fourth doped region 146b of the second active material layer 146, respectively, through contact holes penetrating the interlayer insulating film 170 and the first gate insulating layer 150. In addition, the first drain electrode 123 and the second drain electrode 143 can be electrically connected to the first photoblocking layer BML1 and the second photoblocking layer BML2, respectively, through other contact holes.
[0082] A via layer 200 is disposed on the second conductive layer. The via layer 200 may include an organic insulating material and perform a surface planarization function.
[0083] The first electrode 210 is disposed on the through-hole layer 200. For example... Figure 2 As shown, the first electrode 210 can be disposed in each sub-pixel PXn and can be spaced apart from the first electrode 210 disposed in adjacent sub-pixels PXn.
[0084] The shape of the first electrode 210 in a plan view can resemble a quadrilateral by including a side extending in the first direction DR1 and a side extending in the second direction DR2. However, the shape of the first electrode 210 is not limited to this, and the side extending in the first direction DR1 can also be inclined relative to the first direction DR1. The display device 10 includes a plurality of first electrodes 210, and the first electrodes 210 are respectively disposed in sub-pixels PXn and spaced apart from each other. The first electrodes 210 can be arranged in an island-like or linear pattern throughout the display area DA. However, this disclosure is not limited thereto.
[0085] In this embodiment, the area of the first electrode 210 can be larger than the area of the opening region 520P. That is, the width of the first electrode 210 measured in the first direction DR1 and the width of the first electrode 210 measured in the second direction DR2 can be larger than the width of the opening region 520P measured in the first direction DR1 and the width of the opening region 520P measured in the second direction DR2, respectively. Therefore, the first electrode 210 can overlap with a portion of the opening region 520P and the second insulating layer 520 in the third direction DR3 (which is the thickness direction). As will be described later, the first electrode 210 can be electrically connected to the light-emitting element 300, and the first electrode 210 can be disposed on the via layer 200 to cover an area larger than the emitting region EMA in which the light-emitting element 300 is disposed. This will be described in more detail later with reference to other figures.
[0086] The first electrode 210 can contact the first drain electrode 123 through a first electrode contact hole CNTD that partially exposes the first drain electrode 123 of the first transistor 120 via the through-hole layer 200. The first electrode 210 can receive a predetermined electrical signal from the first transistor 120. A protrusion may be provided on one side of the first electrode 210, and the first electrode 210 can be electrically connected to the first transistor 120 through the protrusion in the first electrode contact hole CNTD. However, this disclosure is not limited thereto. The first electrode 210 may also not include the protrusion and can be electrically connected to the first transistor 120 through the first electrode contact hole CNTD in any region.
[0087] The first electrode 210 may include a conductive material with high reflectivity. For example, the first electrode 210 may include a metal such as silver (Ag), copper (Cu), or aluminum (Al) as a material with high reflectivity. In this case, the first electrode 210 can reflect light emitted from the light-emitting element 300 in the upward direction of each sub-pixel PXn. Furthermore, the first electrode 210 may have a structure in which transparent conductive materials and highly reflective metal layers are each stacked in multiple layers, or it may be formed as a single layer comprising them. In embodiments, the first electrode 210 may have a stacked structure of ITO / Ag / ITO / IZO, or it may be an alloy containing aluminum (Al), nickel (Ni), lanthanum (La), etc. However, this disclosure is not limited thereto.
[0088] A first insulating layer 510 is disposed on the first electrode 210. The first insulating layer 510 can be integrally disposed in the display area DA of the display device 10 and disposed on the first electrode 210. The first electrodes 210 disposed in adjacent sub-pixels PXn can be spaced apart from each other in the second direction DR2, and the first insulating layer 510 can also be disposed on the portion of the via layer 200 exposed between the spaced-apart first electrodes 210. The first insulating layer 510 can insulate the first electrode 210 and the second electrode 220 from each other, and at the same time, by compensating for the step formed by the first electrode 210, a flat upper surface is formed.
[0089] According to an embodiment, the first insulating layer 510 may be formed to at least partially cover the outer surface of the light-emitting element 300 disposed between the first electrode 210 and the second electrode 220. As described later, the light-emitting element 300 may extend in one direction and may be disposed in a direction perpendicular to the upper surface of the first insulating layer 510. In the manufacturing process of the display device 10, the light-emitting element 300 may be aligned in a direction perpendicular to the upper surface of the first insulating layer 510, i.e., aligned in a third direction DR3, and may then be physically inserted into the first insulating layer 510. Each of the light-emitting elements 300 may have a first end that contacts the first electrode 210, a second end that contacts the second electrode 220, and an outer surface that is partially surrounded by the first insulating layer 510. The first insulating layer 510 may prevent the light-emitting elements 300 disposed between the first electrode 210 and the second electrode 220 from contacting each other, while fixing the light-emitting elements 300.
[0090] In some embodiments, the first insulating layer 510 may include an organic insulating material. The first insulating layer 510 may include a material having a relatively lower hardness than the light-emitting element 300. Therefore, the light-emitting element 300 can be physically inserted into the first insulating layer 510 during the manufacturing process of the display device 10. For example, the first insulating layer 510 may include organic insulating materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, benzocyclobutene, cardo resin, siloxane resin, silsesquioxane resin, polymethyl methacrylate, polycarbonate, or polymethyl methacrylate-polycarbonate synthetic resin. However, this disclosure is not limited thereto.
[0091] A second insulating layer 520 may be disposed on the first insulating layer 510. The second insulating layer 520 disposed on the first insulating layer 510 may extend in the first direction DR1 and the second direction DR2, and may be disposed at the boundary between sub-pixels PXn. An opening region 520P exposing a portion of the first insulating layer 510 may be disposed in the region surrounded by the second insulating layer 520. Figure 2 In this embodiment, portions of the second insulating layer 520 extending in the first direction DR1 are spaced apart in the second direction DR2, and opening regions 520P are disposed between them. The second insulating layer 520, according to the embodiment, can define the boundary of each sub-pixel PXn while blocking the electric field formed on the first electrode 210 during the manufacturing process of the display device 10.
[0092] As described above, since the opening region 520P surrounded by the second insulating layer 520 has a smaller area than the first electrode 210, at least a portion of the second insulating layer 520 according to this embodiment can overlap with the first electrode 210 in the third direction DR3. Both sides of the first electrode 210 in the second direction DR2 can overlap with the second insulating layer 520 in the third direction DR3, and the sides of the second insulating layer 520 that contact the opening region 520P can be recessed inward from both sides of the first electrode 210. The electric field formed on the first electrode 210 during the manufacturing process of the display device 10 can be formed only in the opening region 520P because it is blocked in the area overlapping with the second insulating layer 520. Therefore, the light-emitting element 300 can be aligned on the first insulating layer 510 in the opening region 520P where the second insulating layer 520 is not provided. The light-emitting element 300 can be inserted and fixed in the first insulating layer 510 to form the emission region EMA of each sub-pixel PXn.
[0093] The second electrode 220 is disposed on the portion of the first insulating layer 510 exposed by the opening region 520P, and on the second insulating layer 520. The second electrode 220 can be disposed integrally in the display area DA of the display device 10. That is, unlike the first electrode 210, a single second electrode 220 can be disposed uniformly in each pixel PX or each sub-pixel PXn.
[0094] Although not shown in the accompanying drawings, the second electrode 220 can make electrical contact with the power wiring 161 in an area other than the display area DA through a contact hole that penetrates the first insulating layer 510 and the via layer 200 to expose a portion of the power electrode 162. The second electrode 220 can receive a predetermined electrical signal from the power wiring 161.
[0095] In an embodiment, the first electrode 210 may be a pixel electrode separated for each sub-pixel PXn, and the second electrode 220 may be a common electrode commonly connected along each sub-pixel PXn. Either the first electrode 210 or the second electrode 220 may be the anode of the light-emitting element 300, and the other may be the cathode of the light-emitting element 300. However, this disclosure is not limited to this, and the opposite may also be true.
[0096] The second electrode 220 can contact a second end of the light-emitting element 300 disposed between the first electrode 210 and the second electrode 220. According to an embodiment, the second electrode 220 can be formed to cover the second end of the light-emitting element 300 protruding from the upper surface of the first insulating layer 510. The light-emitting element 300 can contact the second electrode 220 to receive electrical signals and can emit light in a specific wavelength band in an upward direction toward the second electrode 220. The second electrode 220 can include a transparent conductive material. For example, the second electrode 220 can include materials such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (ITZO), but this disclosure is not limited thereto.
[0097] A light-emitting element 300 is disposed between the first electrode 210 and the second electrode 220. The light-emitting element 300 may extend in one direction and may be inserted into the first insulating layer 510. The outer surface of the light-emitting element 300 according to the embodiment may be partially surrounded by the first insulating layer 510. The light-emitting elements 300 may be spaced apart from each other and may be aligned substantially parallel to each other. The gap between the light-emitting elements 300 is not particularly limited. In some cases, multiple light-emitting elements 300 may be arranged adjacent to each other to form a cluster, and multiple other light-emitting elements 300 may be arranged at regular intervals to form a cluster, or may be oriented and aligned in one direction with non-uniform density.
[0098] According to an embodiment, the first end of the light-emitting element 300 can partially contact the first electrode 210, and the second end opposite to the first end can contact the second electrode 220. In the manufacturing process of the display device 10, the light-emitting element 300 can be vertically inserted into the first insulating layer 510 disposed on the first electrode 210, such that the first end partially contacts the first electrode 210, and the second electrode 220 can be disposed on the first insulating layer 510, such that the second end contacts the second electrode 220. The light-emitting element 300 can receive a predetermined electrical signal because the first end and the second end of the light-emitting element 300 are electrically connected to the first electrode 210 and the second electrode 220.
[0099] The light-emitting element 300 can be substantially parallel to the third direction DR3 of the first electrode 210 and the second electrode 220 facing each other along its extension direction. The light-emitting element 300 extending in this direction can emit light in a specific wavelength band in this direction. Because the light-emitting element 300 is parallel to the first electrode 210 and the second electrode 220 along the third direction DR3 of their facing each other along its extension direction, the light-emitting element 300 can emit light in a specific wavelength band in an upward direction toward the second electrode 220 (i.e., in the upward direction of each sub-pixel PXn). Light emitted from the second end of the light-emitting element 300 in contact with the second electrode 220 can pass through the second electrode 220, which includes a transparent material, and travel in the upward direction of each sub-pixel PXn. Light emitted from the first end of the light-emitting element 300 in contact with the first electrode 210 can be reflected by the first electrode 210, which includes a material with high reflectivity, to travel in the upward direction of each sub-pixel PXn.
[0100] Figure 5 yes Figure 2 A planar graph of subpixels. Figure 6 yes Figure 3 An enlarged sectional view of a portion of the document.
[0101] Reference Figure 5 and Figure 6 Each pixel PX or sub-pixel PXn includes an emitting region EMA formed by placing a light-emitting element 300 in the opening region 520P, and a non-emitting region NEM in which a second insulating layer 520 is positioned instead of a light-emitting element 300. The first electrode 210 of the display device 10 according to this embodiment may have an area larger than the opening region 520P. As shown in the figures, the first width D of the first electrode 210, measured in the first direction DR1... 210 The width D0 of the opening region 520P, measured in the first direction DR1, can be greater than the width of the first electrode 210, and the second width W of the first electrode 210, measured in the second direction DR2, can be greater than the width of the opening region 520P. 210The width W0 of the opening region 520P, as measured in the second direction DR2, can be greater than that of the opening region 520P. Since the opening region 520P is located in the region surrounded by the second insulating layer 520, the first electrode 210 can have a larger area than the opening region 520P and can partially overlap with the second insulating layer 520 in the third direction DR3.
[0102] As will be described later, the manufacturing process of the display device 10 may include aligning the light-emitting element 300 by forming an electric field on the first electrode 210. The first electrode 210 may serve as an alignment electrode, transmitting an alignment signal required to align the light-emitting element 300. The alignment signal transmitted to the first electrode 210 may form an electric field on the first electrode 210 in a third direction DR3, and the electric field may align the light-emitting element 300 such that the direction in which the light-emitting element 300 extends is perpendicular to the first electrode 210 and the upper surface of the first insulating layer 510, i.e., the third direction DR3.
[0103] When the first electrode 210 has an area smaller than the opening region 520P in which the first insulating layer 510 is exposed, some light-emitting elements 300 may be inserted into the first insulating layer 510 without being aligned by an electric field. These light-emitting elements 300 may not contact the first electrode 210 and the second electrode 220, and may cause emission failures in each sub-pixel PXn. Since the first electrode 210 according to the embodiment has an area larger than the opening region 520P in which the light-emitting elements 300 are disposed, it is possible to prevent the light-emitting elements 300 from being inserted into the first insulating layer 510 without being aligned in one direction during the manufacturing process of the display device 10.
[0104] Furthermore, the first electrode 210 may include a region on the third-direction DR3 that overlaps with the second insulating layer 520, and the electric field formed by the alignment signal transmitted to the first electrode 210 can be blocked by the second insulating layer 520. During the alignment of the light-emitting element 300, the light-emitting element 300 sprayed onto the second insulating layer 520 may not be aligned by an electric field, but may remain on the second insulating layer 520. When cleaning the light-emitting element 300 after it has been aligned by an electric field into the first insulating layer 510, the light-emitting element 300 remaining on the second insulating layer 520 can be removed.
[0105] Therefore, multiple light-emitting elements 300 can be aligned on the first electrode 210 in a direction perpendicular to the upper surface of the first insulating layer 510 by an electric field formed in the opening region 520P (in which the second insulating layer 520 is not disposed). The light-emitting elements 300 aligned in a direction perpendicular to the upper surface of the first insulating layer 510 can be physically inserted into the first insulating layer 510, and their first ends can contact the first electrode 210, and their second ends can contact the second electrode 220.
[0106] According to an embodiment, at least some of the light-emitting elements 300 may extend in a direction parallel to the first electrode 210 and the second electrode 220 along a third direction DR3 facing each other. For example... Figure 6 As shown, a plurality of light-emitting elements 300 may be disposed between the first electrode 210 and the second electrode 220, and may be partially inserted into the first insulating layer 510. In an embodiment, the light-emitting elements 300 may include a first light-emitting element 301 extending in a direction not parallel to the third-party direction DR3 and a second light-emitting element 302 extending in a direction parallel to the third-party direction DR3.
[0107] In the manufacturing process of the display device 10, the electric field formed on the first electrode 210 can align the light-emitting element 300 such that the light-emitting element 300 extends in a direction perpendicular to the upper surface of the first insulating layer 510. Since the light-emitting element 300 is aligned in a direction perpendicular to the upper surface of the first insulating layer 510 along its extension direction (like the second light-emitting element 302), the acute angle θ2 formed by the second light-emitting element 302 along its extension direction and the surface direction of the upper surface of the first insulating layer 510 or the upper surface of the second electrode 220 (i.e., the second direction DR2) can be 90 degrees. As will be described later, each light-emitting element 300 according to the embodiment may include an active layer 330 (see Figure 7 The light-emitting element 300 emits light from both ends along its extension direction from both ends. When the light-emitting element 300 (such as the second light-emitting element 302) extends in a direction perpendicular to the second direction DR2, the light emitted from the active layer 330 ( Figure 6 The light L1 emitted from the active layer 330 can be output upward toward the second electrode 220 to travel in the upward direction of each sub-pixel PXn. That is, in the embodiment, in the case of at least some of the light-emitting elements 300 (i.e., the second light-emitting element 302), the light L1 emitted from the active layer 330 can travel parallel to the third direction DR3.
[0108] However, at least some of the light-emitting elements 300 (i.e., the first light-emitting element 301) can be aligned by an electric field in a direction not perpendicular to the second direction DR2. In the embodiment, the acute angles θ1 and θ2 formed by the light-emitting element 300 along its extending direction and the second direction DR2 perpendicular to the third direction DR3 (the first electrode 210 and the second electrode 220 facing each other) can be in the range of 80 to 90 degrees. The electric field formed on the first electrode 210 can be on the third direction DR3, but some of the light-emitting elements 300, such as the first light-emitting element 301, may not extend on the third direction DR3. However, when the acute angle θ1 formed by the light-emitting element 300 (such as the first light-emitting element 301) along its extending direction and the second direction DR2 is in the range of 80 to 90 degrees, the light L1' emitted from the second end of the first light-emitting element 301 in contact with the second electrode 220 can be output in a direction inclined from the upper surface of the second electrode 220 and in the upward direction of each sub-pixel PXn. Furthermore, the light L2 emitted from the first end of the first light-emitting element 301 that contacts the first electrode 210 can be reflected by the first electrode 210 in the upward direction of each sub-pixel PXn. The first electrode 210 comprises a material with high reflectivity. However, the acute angle at which the light-emitting element 300 is tilted relative to the second direction DR2 is not limited to the above angle, and the light-emitting element 300 can be inserted into the first insulating layer 510 at an angle within an allowable range.
[0109] The first end of the light-emitting element 300 may partially contact the first electrode 210, and the second end opposite to the first end may contact the second electrode 220. According to an embodiment, the second end of the light-emitting element 300 may partially protrude from the upper surface of the first insulating layer 510, and the second electrode 220 may be formed to cover the protruding second end of the light-emitting element 300. The light-emitting element 300 may be physically inserted into the first insulating layer 510, and its first end may partially contact the first electrode 210. In an embodiment, the length h of each light-emitting element 300 measured in the extending direction of the light-emitting element 300 (see...) Figure 7 The height h can be greater than that of the first insulating layer 510. 510 Here, the height h of the first insulating layer 510 is... 510 The height of the portion of the first insulating layer 510 that does not overlap with the first electrode 210 on the third-direction DR3 is defined. Since the light-emitting element 300 is disposed on the first electrode 210 and has a height h greater than that of the first insulating layer 510, the height h is determined by the first insulating layer 510. 510 The length h of the first electrode allows the second end, which is opposite to the first end that contacts the first electrode 210, to protrude from the upper surface of the first insulating layer 510. The second electrode 220 can be formed to cover and smoothly contact the second end of the light-emitting element 300 that protrudes from the upper surface of the first insulating layer 510.
[0110] In the embodiment, the height h of the second end of the light-emitting element 300 protruding above the first insulating layer 510 is... 301 and h 302 The thickness h of the second insulating layer 520 can be less than or equal to that of the second insulating layer 520. 520 As described above, the light-emitting element 300 can be aligned by an electric field formed on the first electrode 210 and can be physically inserted into the first insulating layer 510. The light-emitting element 300 can be inserted using a predetermined clamping unit ZIG (see [link to clamping unit]). Figure 14 Physical insertion. To prevent damage to the first electrode 210 or the circuit element layer PAL, the clamping unit ZIG can apply physical force until its lower surface contacts the upper surface of the second insulating layer 520. Therefore, the light-emitting element 300 can be inserted into the first insulating layer 510 such that the second end is located at a height at least below the upper surface of the second insulating layer 520. For example, the height h of the second end of each first light-emitting element 301 protruding above the first insulating layer 510. 301 The thickness h can be less than that of the second insulating layer 520. 520 And the height h of the protruding second end of each second light-emitting element 302 302 The thickness h of the second insulating layer 520 can be used. 520 Basically the same.
[0111] In the example, the length h of each light-emitting element 300 is equal to the thickness h of the first electrode 210. 210 The sum can be equal to the height h of the first insulating layer 510. 510 The thickness h of the second insulating layer 520 520 The sum. For example, when the length h of each light-emitting element 300 is 3.5 μm and the thickness h of the first electrode 210 is... 210 When the thickness h of the second insulating layer 520 is 0.2 μm, 520 It can be 0.3 μm, and the height h of the first insulating layer 510 510 It can be 3.4 μm. However, the above numerical range is merely an example, and this disclosure is not limited thereto.
[0112] Return to reference Figure 3 and Figure 4 A passivation layer 550 is provided on the second electrode 220. The passivation layer 550 can protect the components provided on the through-hole layer 200 from the influence of the external environment.
[0113] Each of the first insulating layer 510, the second insulating layer 520, and the passivation layer 550 described above may comprise an inorganic insulating material or an organic insulating material. In an embodiment, the first insulating layer 510, the second insulating layer 520, and the passivation layer 550 may comprise an inorganic insulating material, such as silicon oxide (SiO2). x), silicon nitride (SiN) x ), silicon nitride oxide (SiO) x N y The insulating layer 510, the second insulating layer 520, and the passivation layer 550 may comprise organic insulating materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin, benzocyclobutene, cardo resin, siloxane resin, silsesquioxane resin, polymethyl methacrylate, polycarbonate, or polymethyl methacrylate-polycarbonate synthetic resin. However, this disclosure is not limited thereto.
[0114] Each of the light-emitting elements 300 may be a light-emitting diode (LED). Specifically, each of the light-emitting elements 300 may be an inorganic LED having a micrometer or nanometer size and made of inorganic materials. An inorganic LED can be aligned between two electrodes, in which polarity is formed, when an electric field is formed in a specific direction between two electrodes facing each other. The light-emitting elements 300 can be aligned between two electrodes by an electric field formed on the electrodes.
[0115] Each of the light-emitting elements 300 can extend in one direction. Each of the light-emitting elements 300 can be shaped like a rod, wire, tube, etc. In embodiments, the shape of each of the light-emitting elements 300 can be similar to a cylinder or rod. However, the shape of each light-emitting element 300 is not limited to this, and each of the light-emitting elements 300 can also have various shapes, such as cubes, cuboids, and hexagonal prisms. The plurality of semiconductors included in each light-emitting element 300, which will be described later, can be arranged or stacked sequentially along one direction.
[0116] Each of the light-emitting elements 300 may include a semiconductor crystal doped with impurities of any conductivity type (e.g., p-type or n-type). The semiconductor crystal can receive electrical signals from an external power source and emit light in a specific wavelength band.
[0117] Figure 7 This is a schematic diagram of a light-emitting element according to an embodiment.
[0118] The light-emitting element 300 according to this embodiment can emit light in a specific wavelength band. In this embodiment, the light emitted from the active layer 330 can be blue light with a center wavelength band in the range of 450 nm to 495 nm. However, the center wavelength band of blue light is not limited to the above range and should be understood to include all wavelength ranges that can be identified as blue in the art to which this disclosure pertains. Furthermore, the light emitted from the active layer 330 of the light-emitting element 300 is not limited to this and can also be green light with a center wavelength band in the range of 495 nm to 570 nm or red light with a center wavelength band in the range of 620 nm to 750 nm.
[0119] Reference Figure 7 The light-emitting element 300 according to this embodiment may include a first conductivity type semiconductor 310, a second conductivity type semiconductor 320, an active layer 330, and an insulating film 380. Furthermore, the light-emitting element 300 according to this embodiment may also include at least one conductive electrode layer 370. Although in Figure 7 In this embodiment, the light-emitting element 300 also includes a conductive electrode layer 370, but this disclosure is not limited thereto. In some cases, the light-emitting element 300 may include more conductive electrode layers 370, or the conductive electrode layer 370 may be omitted. Even if the light-emitting element 300 includes different numbers of conductive electrode layers 370 or includes other structures, the following description of the light-emitting element 300 shall apply equally.
[0120] The first conductivity type semiconductor 310 may be, for example, an n-type semiconductor having a first conductivity type. In the example, when the light-emitting element 300 emits light in the blue wavelength band, the first conductivity type semiconductor 310 may include a semiconductor having the chemical formula Al. x Ga y In 1-x-y The semiconductor material is N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), for example, it can be any one or more of n-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The first conductivity type semiconductor 310 can be doped with a first conductivity type dopant, and the first conductivity type dopant can be, for example, Si, Ge, Se, or Sn. In an embodiment, the first conductivity type semiconductor 310 can be n-GaN doped with n-type Si. The length of the first conductivity type semiconductor 310 can be in the range of 1.5 μm to 5 μm, but is not limited thereto.
[0121] A second conductivity type semiconductor 320 is disposed on the active layer 330, which will be described later. The second conductivity type semiconductor 320 may be, for example, a p-type semiconductor having a second conductivity type. In the example, when the light-emitting element 300 emits light in the blue or green wavelength band, the second conductivity type semiconductor 320 may include a semiconductor having the chemical formula Al.x Ga y In 1-x-y The semiconductor material of type N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) can be, for example, any one or more of p-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The second conductivity type semiconductor 320 can be doped with a second conductivity type dopant, and the second conductivity type dopant can be, for example, Mg, Zn, Ca, or Ba. In an embodiment, the second conductivity type semiconductor 320 can be p-GaN doped with p-type Mg. The length of the second conductivity type semiconductor 320 can be in the range of 0.08 μm to 0.25 μm, but is not limited thereto.
[0122] Although each of the first conductivity type semiconductor 310 and the second conductivity type semiconductor 320 is represented by a single layer in the accompanying drawings, this disclosure is not limited thereto. In some cases, each of the first conductivity type semiconductor 310 and the second conductivity type semiconductor 320 may include more layers, for example, a cladding layer or a tensile strain barrier reduction (TSBR) layer, depending on the material of the active layer 330.
[0123] An active layer 330 is disposed between a first conductivity type semiconductor 310 and a second conductivity type semiconductor 320. The active layer 330 may include a material having a single quantum well structure or a multiple quantum well structure. When the active layer 330 includes a material having a multiple quantum well structure, it may have a structure in which multiple quantum layers and multiple well layers are alternately stacked. Based on the electrical signals received through the first conductivity type semiconductor 310 and the second conductivity type semiconductor 320, the active layer 330 may emit light through the recombination of electron-hole pairs. For example, when the active layer 330 emits light in the blue wavelength band, it may include materials such as AlGaN or AlGaInN. Specifically, when the active layer 330 has a multiple quantum well structure in which quantum layers and well layers are alternately stacked, the quantum layers may include materials such as AlGaN or AlGaInN, and the well layers may include materials such as GaN or AlInN. In an embodiment, the active layer 330 may include AlGaInN as a quantum layer and AlInN as a well layer to emit blue light with its center wavelength band in the range of 450 nm to 495 nm as described above.
[0124] However, this disclosure is not limited to this, and the active layer 330 may also have a structure in which semiconductor materials with large bandgap energy and semiconductor materials with small bandgap energy are stacked alternately, or may include different group III to group V semiconductor materials depending on the wavelength band of the emitted light. The light emitted from the active layer 330 is not limited to light in the blue wavelength band. In some cases, the active layer 330 may emit light in the red or green wavelength band. The length of the active layer 330 may be in the range of 0.05 μm to 0.25 μm, but is not limited thereto.
[0125] The light emitted from the active layer 330 can radiate not only to the outer surface of the light-emitting element 300, but also to the two side surfaces in the longitudinal direction. The direction of the light emitted from the active layer 330 is not limited to one direction.
[0126] The conductive electrode layer 370 may be an ohmic contact electrode. However, this disclosure is not limited thereto, and the conductive electrode layer 370 may also be a Schottky contact electrode. The conductive electrode layer 370 may include a conductive metal. For example, the conductive electrode layer 370 may include at least any one of aluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag), indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). Furthermore, the conductive electrode layer 370 may include an n-type or p-type doped semiconductor material. The conductive electrode layer 370 may include the same material or different materials, but this disclosure is not limited thereto.
[0127] An insulating film 380 surrounds the outer surface of the semiconductor. In an embodiment, the insulating film 380 may surround at least the outer surface of the active layer 330 and extend along the direction in which the light-emitting element 300 extends. The insulating film 380 may protect the aforementioned components. For example, the insulating film 380 may surround the side surfaces of the aforementioned components, but may expose both ends of the light-emitting element 300 in the longitudinal direction.
[0128] In the accompanying drawings, the insulating film 380 extends in the longitudinal direction of the light-emitting element 300 to cover the conductive electrode layer 370 from the first conductivity type semiconductor 310. However, this disclosure is not limited thereto, and the insulating film 380 may also cover only some of the conductivity type semiconductors and the outer surface of the active layer 330, or it may cover only a portion of the outer surface of the conductive electrode layer 370 to partially expose the outer surface of the conductive electrode layer 370.
[0129] The thickness of the insulating film 380 can be in the range of 10 nm to 1.0 μm, but is not limited thereto. The thickness of the insulating film 380 is preferably 40 nm.
[0130] The insulating film 380 may include a material with insulating properties, such as silicon oxide (SiO2). x), silicon nitride (SiN) x ), silicon nitride oxide (SiO) x N y The insulating film 380 can be made of aluminum nitride (AlN) or aluminum oxide (Al2O3). Therefore, the insulating film 380 can prevent short circuits that may occur when the active layer 330 directly contacts the electrodes through which electrical signals are transmitted to the light-emitting element 300. Furthermore, the insulating film 380 can prevent a decrease in luminous efficiency by protecting the outer surface of the light-emitting element 300, including the active layer 330.
[0131] Furthermore, in some embodiments, the outer surface of the insulating film 380 may be treated. When manufacturing the display device 10, the light-emitting element 300 may be sprayed onto the electrode while the light-emitting element 300 is dispersed in a predetermined ink, and then the light-emitting element 300 may be aligned. Here, the surface of the insulating film 380 may be treated with a hydrophobic or hydrophilic method so that the light-emitting element 300 remains separate from other adjacent light-emitting elements 300 in the ink and does not aggregate with them.
[0132] The length h of the light-emitting element 300 can be in the range of 1 μm to 10 μm or 2 μm to 6 μm, and preferably in the range of 4 μm to 5 μm. Furthermore, the diameter of the light-emitting element 300 can be in the range of 300 nm to 700 nm, and the aspect ratio of the light-emitting element 300 can be 1.2 to 100. However, this disclosure is not limited to these, and the plurality of light-emitting elements 300 included in the display device 10 can also have different diameters depending on the composition of the active layer 330. Preferably, the diameter of the light-emitting element 300 can be about 500 nm.
[0133] According to an embodiment, in at least some of the plurality of light-emitting elements 300, a first conductivity type semiconductor 310, an active layer 330, and a second conductivity type semiconductor 320 may be sequentially disposed along a third direction DR3 facing each other, along the first electrode 210 and the second electrode 220. (Refer to...) Figure 6 and Figure 7 The light-emitting element 300 can be disposed between the first electrode 210 and the second electrode 220, and the light-emitting element 300 can be aligned parallel to the third direction DR3 along its extension direction (like the second light-emitting element 302).
[0134] In each light-emitting element 300, since the first conductivity type semiconductor 310, the active layer 330 and the second conductivity type semiconductor 320 are arranged sequentially along the extension direction of the light-emitting element 300, according to the embodiment, the first conductivity type semiconductor 310, the active layer 330 and the second conductivity type semiconductor 320 can be arranged along the third direction DR3 facing each other along the first electrode 210 and the second electrode 220.
[0135] Furthermore, according to the embodiment, the insulating film 380 of each light-emitting element 300 can partially contact the first insulating layer 510. For example... Figure 6 As shown, except for the first end contacting the first electrode 210 and the second end contacting the second electrode 220, the outer surface of each light-emitting element 300 may be surrounded by a first insulating layer 510. Each light-emitting element 300 includes an insulating film 380 protecting a first conductivity type semiconductor 310, a second conductivity type semiconductor 320, and an active layer 330. In each light-emitting element 300, the active layer 330 emitting light from it may be surrounded and protected by the insulating film 380 and the first insulating layer 510. The insulating film 380 and the first insulating layer 510 may be disposed between the active layers 330 of adjacent light-emitting elements 300.
[0136] A method for manufacturing the display device 10 according to this embodiment will now be described.
[0137] Figure 8 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment.
[0138] Reference Figure 8 The method for manufacturing the display device 10 according to this embodiment includes: preparing a substrate portion SUB1 comprising a first electrode 210, a first insulating layer 510 covering the first electrode 210, and a second insulating layer 520 partially disposed on the first insulating layer 510 (see [link to documentation]). Figure 12 (Operation S100); Insert the light-emitting element 300 extending in one direction into the first insulating layer 510 on a third direction DR3 perpendicular to the upper surface of the first insulating layer 510 (Operation S200); and form a second electrode 220 covering the first insulating layer 510 and the second insulating layer 520 (Operation S300).
[0139] As described above, the process of manufacturing the display device 10 may include: spraying a light-emitting element 300 onto the opening region 520P and the portion of the second insulating layer 520 that overlaps with the first insulating layer 510; aligning the light-emitting element 300 in one direction; and then inserting the light-emitting element 300 into the first insulating layer 510. Inserting the light-emitting element 300 into the first insulating layer 510 can be performed by physical methods, and examples of physical methods are not limited. The method of manufacturing the display device 10 will now be described in detail with reference to other accompanying drawings.
[0140] Figures 9 to 17 This is a cross-sectional view showing the manufacturing process of a display device according to an embodiment.
[0141] First, refer to Figure 9The circuit element layer PAL is fabricated. The circuit element layer PAL may include a substrate 110, a buffer layer 115, and a plurality of transistors 120 and 140. These elements are the same as those described above and will therefore not be described in detail.
[0142] Next, refer to Figures 10 to 12 A substrate portion SUB1 is formed, comprising a first electrode 210, a first insulating layer 510, and a second insulating layer 520 disposed on the circuit element layer PAL. The first electrode 210, the first insulating layer 510, and the second insulating layer 520 of the substrate portion SUB1 are the same as those described above, and therefore will not be described further below.
[0143] Next, refer to Figure 13 The light-emitting elements 300 are sprayed onto the first electrode 210. The light-emitting elements 300 can be sprayed onto a first insulating layer 510 and a second insulating layer 520 disposed on the first electrode 210, and some of the light-emitting elements 300 can be sprayed onto the first insulating layer 510 exposed by the opening region 520P, while other light-emitting elements 300 are sprayed onto the second insulating layer 520. In an embodiment, the light-emitting elements 300 can be sprayed while they are dispersed in ink S. The ink S can be provided in a solution or colloidal state. For example, the ink S can be, but is not limited to, acetone, water, ethanol, toluene, propylene glycol (PG), or propylene glycol methyl acetate (PGMA). In some cases, the light-emitting elements 300 can be sprayed onto the first electrode 210 without being dispersed in ink S.
[0144] The light-emitting element 300 is sprayed onto the first electrode 210, that is, onto the first insulating layer 510 or the second insulating layer 520, while the light-emitting element 300 is dispersed in the ink S. The light-emitting element 300 may extend in one direction, but may exist in the ink S in a random direction rather than in a specific direction.
[0145] Next, refer to Figure 14 An electric field E is formed on the first electrode 210 to align the light-emitting element 300 such that the light-emitting element 300 is parallel to the third direction DR3 along its extension direction. The first electrode 210 can be used as an alignment electrode for aligning the light-emitting element 300. A clamping unit ZIG, which transmits alignment signals to it, is positioned on ink S sprayed onto the first electrode 210, and alternating current (AC) power is applied to the first electrode 210 and the clamping unit ZIG. When AC power is applied to the first electrode 210 and the clamping unit ZIG, an electric field E is formed between them, and the light-emitting element 300 is subjected to a dielectric force applied by the electric field E.
[0146] The orientation and position of the light-emitting element 300 subjected to dielectric force can be changed according to the direction or polarity of the electric field E. For example... Figure 14 As shown, the light-emitting elements 300 can be aligned such that their extension directions are parallel to the third direction DR3 by an electric field E formed between the first electrode 210 and the clamping unit ZIG. However, since the electric field E is blocked in the region between the first electrode 210 and the clamping unit ZIG where the second insulating layer 520 is disposed, the light-emitting elements 300 are not aligned in this region. The light-emitting elements 300 located in the opening region 520P where the second insulating layer 520 is not disposed are aligned such that their extension directions are parallel to the third direction DR3, but the light-emitting elements 300 located on the second insulating layer 520 may not be aligned and may be in a random direction.
[0147] Next, refer to Figure 15 The light-emitting element 300 is inserted into the first insulating layer 510 on the third-direction DR3. Insertion of the light-emitting element 300 may include physically inserting the light-emitting element 300 using a clamping unit ZIG. Figure 15 As shown, the insertion of the light-emitting element 300 can be performed by moving the fixture unit ZIG in the downward direction (which is the third direction DR3). The fixture unit ZIG can be moved in the third direction DR3 until its lower surface contacts the upper surface of the second insulating layer 520, and the light-emitting element 300 aligned in the third direction DR3 in the opening region 520P can be inserted into the first insulating layer 510. However, the insertion of the light-emitting element 300 is not limited to this and can also be performed by using insertion processes using other physical methods.
[0148] As described above, the light-emitting element 300 located in the opening region 520P can be aligned parallel to the third direction DR3 by the electric field E, and is therefore inserted into the first insulating layer 510 by the movement of the clamping unit ZIG. The light-emitting element 300 located on the second insulating layer 520 is retained and is not inserted into the first insulating layer 510.
[0149] Next, refer to Figure 16 The light-emitting elements 300 sprayed onto the second insulating layer 520 are removed. When the light-emitting elements 300 are inserted into the first insulating layer 510, the light-emitting elements 300 that are not inserted or remain on the second insulating layer 520 are removed by cleaning. In this process, the ink S in which the light-emitting elements 300 are dispersed can also be removed. Therefore, the light-emitting elements 300 that are not inserted into the first insulating layer 510 are removed, and it is possible to prevent the light-emitting elements 300 that remain in each pixel PX or sub-pixel PXn of the display device 10 but do not emit light from the outside.
[0150] Next, refer to Figure 17 A second electrode 220 is formed to cover the first insulating layer 510 and the second insulating layer 520. Furthermore, although in Figure 17 Not shown, but a passivation layer 550 may be formed on the second electrode 220 (see [reference]). Figure 4 This process is used to manufacture the display device 10. The second electrode 220 and the passivation layer 550 are the same as those described above, and therefore will not be described in detail below.
[0151] The display device 10 may include a plurality of sub-pixels PXn, and a first electrode 210 may be disposed in each sub-pixel PXn. As described above, the first electrode 210 may be spaced apart from the first electrodes 210 of adjacent sub-pixels PXn, and a second electrode 220 may be disposed integrally in the display area DA. In the display device 10 according to the embodiment, the first electrodes 210 of adjacent sub-pixels PXn may be formed as a single layer, and may then be spaced apart from each other during the manufacturing process of the display device 10 by a process of partially cutting the single layer.
[0152] Figure 18 This is a plan view of the pixels of a display device according to another embodiment. Figure 19 It is along Figure 18 A sectional view taken from line VII-VII'.
[0153] Reference Figure 18 and Figure 19 The display device 10_1 according to this embodiment may include a hole 520N_1 extending in one direction at the boundary between adjacent sub-pixels PXn. In the drawings, the hole 520N_1 extends in a first direction DR1 between the first sub-pixel PX1 and the second sub-pixel PX2 and between the second sub-pixel PX2 and the third sub-pixel PX3, but this disclosure is not limited thereto.
[0154] In some cases, the hole 520N_1 can extend in the first direction DR1 and the second direction DR2, and can be located at the boundary between multiple sub-pixels PXn. Apart from the shapes of the first insulating layer 510_1, the second insulating layer 520_1, and the second electrode 220_1 (the differences in shape described above are due to the hole 520N_1 included in the display device 10_1), Figure 18 and Figure 19 The display device 10_1 and Figure 2 and Figure 3 The display device 10 is the same. Therefore, any redundant description will be omitted, and the differences will be described in detail below.
[0155] The first electrodes 210_1 are respectively disposed in the second sub-pixel PX2 and the third sub-pixel PX3, and are spaced apart from each other in the second direction DR2. The second electrode 220_1 can be disposed integrally in the second sub-pixel PX2 and the third sub-pixel PX3. That is, the second electrode 220_1 can face the first electrode 210_1 of the second sub-pixel PX2 and the first electrode 210_1 of the third sub-pixel PX3 on the third direction DR3, and the light-emitting element 300 can be disposed between the second electrode 220_1 and the first electrode 210_1 of the second sub-pixel PX2 and between the second electrode 220_1 and the first electrode 210_1 of the third sub-pixel PX3.
[0156] The first electrode 210_1 of the second sub-pixel PX2 and the first electrode 210_1 of the third sub-pixel PX3 can be spaced apart from each other at the boundary between the second sub-pixel PX2 and the third sub-pixel PX3. Figure 2 and Figure 3 Unlike in China, in Figure 18 and Figure 19 In the display device 10_1, multiple portions of the first insulating layer 510_1 and multiple portions of the second insulating layer 520_1 may also be spaced apart at the boundary between the second sub-pixel PX2 and the third sub-pixel PX3 to form a hole 520N_1.
[0157] exist Figure 2 and Figure 3 In the display device 10, a separate first electrode 210 is formed for each sub-pixel PXn. Therefore, when an electric field E is formed on the first electrode 210 (see...), Figure 14 Individual alignment signals can be transmitted to the first electrode 210 of each sub-pixel PXn. However, this disclosure is not limited thereto. When the first electrodes 210_1 of adjacent sub-pixels PXn are connected to each other, an electric field E formed by the alignment signals can be generated simultaneously for each sub-pixel PXn. In this case, the first electrodes 210_1 of the second sub-pixel PX2 and the first electrodes 210_1 of the third sub-pixel PX3, which are connected to each other, can receive the alignment signals and can be separated from each other in a subsequent process along a cut portion CB located at the boundary between the second sub-pixel PX2 and the third sub-pixel PX3. The process of separating the first electrodes 210_1 along the cut portion CB may include a process of partially etching the first insulating layer 510_1 and the second insulating layer 520_1. Therefore, a hole 520N_1 can be formed at each boundary between sub-pixels PXn.
[0158] Figure 20 This is a cross-sectional view of a display device according to another embodiment.
[0159] Reference Figure 20According to an embodiment, the first electrode 210_2 may further include a first electrode protrusion 210D_2 that protrudes from the upper surface and covers the first end of the light-emitting element 300. In addition to the first electrode 210_2 including the first electrode protrusion 210D_2, Figure 20 Display device and Figure 3 The display device 10 is the same. Therefore, the differences will be described in detail below.
[0160] Depending on the direction in which the light-emitting element 300 is inserted into the first insulating layer 510_2, the first end of the light-emitting element 300 that contacts the first electrode 210_2 may not make a smooth contact with the first electrode 210_2. According to an embodiment, a process of applying heat to the first electrode 210_2 can be performed after the process of inserting the light-emitting element 300 into the first insulating layer 510_2.
[0161] For example, when the first electrode 210_2 comprises a metallic material as a material with high reflectivity, the first electrode 210_2 can be partially melted by applying heat. When the first electrode 210_2 is partially melted, the light-emitting element 300 can be finely moved toward the first electrode 210_2, or the melted first electrode 210_2 can be finely moved toward the first end of the light-emitting element 300. When the melted first electrode 210_2 moves partially along the outer surface of the light-emitting element 300, some areas of the first electrode 210_2 can protrude from the upper surface of the first electrode 210_2 to form a first electrode protrusion 210D_2 covering the first end of the light-emitting element 300. The first electrode protrusion 210D_2 can be formed to cover the first end of the light-emitting element 300 in the same way that the second electrode 220_2 covers the second end of the light-emitting element 300, thereby improving the contact between the light-emitting element 300 and the first electrode 210_2.
[0162] Figure 21 This is a schematic diagram illustrating a portion of the manufacturing process of a display device according to another embodiment. Figures 22 to 24 It shows the use Figure 21 A schematic diagram of a method for manufacturing a display device using a display device manufacturing process.
[0163] As described above, there are no particular limitations on inserting the light-emitting element 300 into the first insulating layer 510. In one embodiment, the light-emitting element 300 can be physically inserted into the first insulating layer 510 via a clamping unit ZIG attached to a rotating roller assembly ROLL.
[0164] Reference Figure 21 When the light-emitting element 300 is inserted into the first insulating layer 510, as the roller assembly rotates in one direction, the clamping unit ZIG attached to the roller assembly can insert the light-emitting element 300 into the first insulating layer 510. Figure 15 Unlike other devices, the ROLL device can move to an adjacent sub-pixel PXn while rotating along the said direction, and can sequentially insert the light-emitting element 300 along multiple sub-pixels PXn.
[0165] Reference Figures 22 to 24 The roller assembly (ROLL) can move in one direction (e.g., along a first direction DR1) while rotating. The clamping unit (ZIG) attached to the roller assembly (ROLL) can continuously insert the light-emitting element (LED) 300 while moving along a plurality of sub-pixels (PXn) arranged along the first direction DR1. Here, the sub-pixel (PXn) into which the LED 300 will be inserted can be determined based on the position of the clamping unit (ZIG) of the roller assembly (ROLL).
[0166] First, such as Figure 22 As shown, when the clamping unit ZIG of the roller assembly is positioned above the first sub-pixel PX1, the light-emitting element 300 can be inserted into the first insulating layer 510 in the first sub-pixel PX1 and the sub-pixels PXn arranged in the first direction DR1 from the first sub-pixel PX1 as the roller assembly moves. On the other hand, the light-emitting element 300 is not inserted into the second sub-pixel PX2 and the third sub-pixel PX3, or the sub-pixels PXn arranged in the first direction DR1 from the second sub-pixel PX2 and the third sub-pixel PX3, because the clamping unit ZIG is not positioned thereon.
[0167] Next, as Figure 23 and Figure 24 As shown, the roller assembly moves to position the clamping unit ZIG above the second sub-pixel PX2 or the third sub-pixel PX3, and then moves along the first direction DR1. Therefore, the light-emitting element 300 can be inserted into the first insulating layer 510 of the second sub-pixel PX2 or the third sub-pixel PX3 and the sub-pixels PXn arranged along the first direction DR1 from the second sub-pixel PX2 or the third sub-pixel PX3. In the method of manufacturing the display device 10 according to this embodiment, the light-emitting element 300 can be sequentially inserted into the sub-pixels PXn arranged in one direction by using the roller assembly including the clamping unit ZIG.
[0168] Figure 25 This is a cross-sectional view of a display device according to another embodiment.
[0169] Reference Figure 25 According to the embodiment, the second electrode 220_3 can be thinner than the second insulating layer 520_3. Therefore, the upper surface of the second electrode 220_3 can be uneven, but can have steps formed along the protruding ends of the first insulating layer 510_3, the second insulating layer 520_3 and the light-emitting element 300.
[0170] because Figure 3 The second electrode 220 is thicker than the second insulating layer 520, and its upper surface can form a flat surface at the step formed by the first insulating layer 510, the second insulating layer 520, and the second end of the light-emitting element 300. On the other hand, Figure 25 The second electrode 220_3 can have a relatively small thickness, for example, 0.1 μm, and can be formed along the first insulating layer 510_3, the second insulating layer 520_3, and the second end of the light-emitting element 300. Even if the upper surface of the second electrode 220_3 is not flat, the second electrode 220_3 can be formed to cover the second end of the light-emitting element 300, and thus can smoothly contact the light-emitting element 300. Furthermore, although in Figure 25 Not shown, but a passivation layer 550 can be provided on the second electrode 220_3 (see [reference]). Figure 4 To form a flat upper surface.
[0171] In closing with the detailed description, those skilled in the art will understand that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the preferred embodiments of the invention disclosed herein are used in a general and descriptive sense only and are not intended to be limiting.
Claims
1. A display device, comprising: First electrode; A first insulating layer is disposed on the first electrode; A second electrode is disposed on the first insulating layer, and at least a portion of the second electrode faces the first electrode in a first direction; One or more first light-emitting elements are disposed between the first electrode and the second electrode and extend in one direction; A second insulating layer is disposed between the second electrode and the first insulating layer; as well as An opening area is provided in the region surrounded by the second insulating layer to partially expose the first insulating layer. Wherein, the first insulating layer partially covers the outer surface of the first light-emitting element, and the extension direction of at least one of the first light-emitting elements is parallel to the first direction.
2. The display device according to claim 1, wherein, The first end of the first light-emitting element partially contacts the first electrode, and the second end of the first light-emitting element opposite to the first end contacts the second electrode.
3. The display device according to claim 2, wherein, The acute angle formed by the first light-emitting element in the direction in which it extends and the second direction perpendicular to the first direction is in the range of 80 degrees to 90 degrees.
4. The display device according to claim 3, wherein, Each of the first light-emitting elements includes a first conductivity type semiconductor, a second conductivity type semiconductor, and an active layer disposed between the first conductivity type semiconductor and the second conductivity type semiconductor, and in the at least one first light-emitting element, the first conductivity type semiconductor, the active layer and the second conductivity type semiconductor are arranged sequentially along the first direction.
5. The display device according to claim 4, wherein, Each of the first light-emitting elements includes an insulating film surrounding a side surface of the first conductivity type semiconductor, a side surface of the second conductivity type semiconductor, and a side surface of the active layer, and the insulating film partially contacts the first insulating layer.
6. The display device according to claim 4, wherein, In at least one of the first light-emitting elements, light emitted from the active layer travels parallel to the first direction.
7. The display device according to claim 1, wherein, The first electrode overlaps with at least a portion of the second insulating layer and the opening region in the first direction, and the first light-emitting element is disposed between the first electrode and the second electrode in the opening region.
8. The display device according to claim 7, wherein, The area of the first electrode is larger than the area of the opening region.
9. The display device according to claim 2, wherein, The second end of the first light-emitting element protrudes partially from the upper surface of the first insulating layer, and the second electrode surrounds the protruding portion of the second end of the first light-emitting element.
10. The display device according to claim 9, wherein, The thickness of the second insulating layer is greater than the height of the protruding portion at the second end of each of the first light-emitting elements.
11. The display device according to claim 10, wherein, The length of each of the first light-emitting elements extending in the one direction is in the range of 2µm to 6µm.
12. The display device according to claim 9, wherein, The first electrode further includes a first electrode protrusion that protrudes from the upper surface of the first electrode to cover the first end of the first light-emitting element.
13. The display device according to claim 1, further comprising: The third electrode is spaced apart from the first electrode in a second direction perpendicular to the first direction, and faces at least a portion of the second electrode in the first direction; as well as A second light-emitting element is disposed between the third electrode and the second electrode. The first insulating layer is disposed between the third electrode and the second electrode.
14. The display device according to claim 13, wherein, The second insulating layer partially overlaps with the first electrode and the third electrode in the first direction, and the first electrode and the third electrode are spaced apart from each other in the region where they overlap with the second insulating layer.
15. A method for manufacturing a display device, the method comprising: A substrate portion comprising a first electrode, a first insulating layer covering the first electrode, and a second insulating layer partially disposed on the first insulating layer is prepared. A light-emitting element extending in one direction is inserted into the first insulating layer in a first direction perpendicular to the upper surface of the first insulating layer; as well as A second electrode is formed that covers the first insulating layer and the second insulating layer.
16. The method according to claim 15, wherein, Inserting the light-emitting element into the first insulating layer includes: The light-emitting element is sprayed onto the first electrode; The light-emitting element is aligned such that the light-emitting element, along the direction in which it extends, is parallel to the first direction by forming an electric field on the first electrode; and The light-emitting element is inserted into the first insulating layer in the first direction.
17. The method according to claim 16, wherein, The second insulating layer includes an opening region that partially exposes the first insulating layer, and the light-emitting element is inserted into the first insulating layer in the opening region.
18. The method according to claim 17, wherein, Forming the second electrode also includes removing the light-emitting element that has been sprayed onto the second insulating layer.
19. The method according to claim 18, wherein, Each of the light-emitting elements has an end that partially protrudes from the first insulating layer, and the second electrode is formed to cover the end.
Citation Information
Patent Citations
Display Apparatus and Method for manufacturing the same
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Display device
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