Adaptive 360-degree all-around light-emitting diode and light-emitting device

Abstract

The present application provides an adaptive 360-degree all-around light-emitting diode and a light-emitting device, the adaptive 360-degree all-around light-emitting diode comprises: an integrated LED light-emitting body, two pin brackets and a package with phosphor, the integrated LED light-emitting body comprises: a substrate, an LED chip arranged on the substrate and two welding pieces arranged on the substrate and electrically connected to the LED chip, the same end face of the two pin brackets is flat, the substrate is arranged on the same end face of the two pin brackets and the two welding pieces are electrically connected to the end faces of the corresponding pin brackets respectively. The adaptive 360-degree all-around light-emitting diode of the present application has the advantages of low production cost, few production processes and high power.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic components, and more specifically, to an adaptive 360-degree all-around light emitting diode and a light emitting device. Background Art

[0002] Light-emitting diode is referred to as LED (Light-Emitting Diode), which has multiple colors such as white light, blue light and red light.

[0003] At present, the structure of the light-emitting diodes on the market is: the LED chip is encapsulated in a transparent epoxy resin, and the electrode sheet of the LED chip is connected to the pin bracket through a gold wire, an alloy wire or a lead wire. In order to ensure the welding quality, the technical requirements for the connection between the gold wire, the alloy wire or the lead wire and the pin bracket are very high, such as the pin bracket connection surface finish must be high, the need to plate precious metal silver, etc., and the pin bracket needs to be processed into a cup body to accommodate the LED chip, which increases the cost. When making a light-emitting diode, at least the following steps are included: first, separately prepare glue and phosphor, second, fix the LED chip on the pin bracket with glue, third, weld the two ends of the lead wire to the LED chip and the pin bracket respectively, fourth, apply phosphor, and fifth, seal the glue. The existing process has many steps and high process requirements. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an adaptive 360-degree all-around light-emitting diode and a light-emitting device to solve the technical problems of the light-emitting diode in the prior art having many manufacturing process steps and high manufacturing cost.

[0005] To achieve the above-mentioned purpose, the technical solution adopted in this application is: to provide an adaptive 360-degree all-around light-emitting diode, including: an integrated LED light-emitting body, two pin brackets and a package with fluorescent powder, the integrated LED light-emitting body includes: a substrate, an LED chip arranged on the substrate, and two welding pieces arranged on the substrate and electrically connected to the LED chip, the same end surface of the two pin brackets is flush, the substrate is arranged on the same end surface of the two pin brackets and the two welding pieces are respectively welded to the corresponding end surfaces of the pin brackets.

[0006] In one embodiment, a groove is provided on the substrate, the LED chip is placed in the groove, the electrode sheet of the LED chip is provided on the side of the LED chip away from the substrate, the welding sheet includes a first sheet, a second sheet and a third sheet connected in sequence, the first sheet is welded to the electrode sheet, and the third sheet is welded to the end face of the pin bracket.

[0007] In one embodiment, the welding piece is U-shaped, the angle between the first piece and the second piece is 80° to 90°, and the angle between the second piece and the third piece is 90° to 100°.

[0008] In one embodiment, a U-shaped groove for accommodating the soldering sheet is provided on the surface of the substrate.

[0009] In one embodiment, the substrate is a rigid substrate or a flexible substrate.

[0010] In one embodiment, the power of the integrated LED light source is 0.05W-1.0W.

[0011] In one embodiment, the LED chip is a blue light chip or a purple light chip with a wavelength of 260nm-480nm.

[0012] In one embodiment, the package body includes an outer transparent potting glue layer, luminescent fluorescent powder and an anti-precipitation inner transparent potting glue layer, the luminescent fluorescent powder is evenly distributed in the inner transparent potting glue layer, the outer transparent potting glue is coated on the outer surface of the inner transparent potting glue layer, and the integrated LED light source is placed in the inner transparent potting glue layer.

[0013] In one embodiment, a trumpet-shaped reflective cover is disposed outside the packaging body, and the opening direction of the reflective cover is the same as the light emitting direction of the integrated LED light-emitting body.

[0014] Another object of the present application is to provide a light-emitting device, comprising: the adaptive 360-degree all-around light-emitting diode as described above.

[0015] The adaptive 360-degree all-around light emitting diode and light emitting device provided by the present application have the following beneficial effects:

[0016] 1. By integrating the LED light source and directly connecting it to the pin bracket, the steps of dispensing and bonding wires required in the prior art are omitted, thus simplifying the production process;

[0017] 2. By integrating the soldering piece on the LED luminous body and electrically connecting it to the pin bracket, the requirements for the surface finish of the pin bracket are reduced, and there is no need to plate precious metals to ensure welding quality;

[0018] 3. The end face of the pin bracket is a plane, and there is no need to process a cup body for accommodating the LED chip on the end face of the pin bracket, which reduces the processing technology of the pin bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 A schematic diagram of the structure of an adaptive 360-degree all-around light emitting diode provided in an embodiment of the present application;

[0021] Figure 2 A schematic diagram of an exploded structure of an integrated LED light emitting body in an adaptive 360-degree all-around light emitting diode provided in an embodiment of the present application;

[0022] Figure 3 Another structural schematic diagram of the adaptive 360-degree all-around light emitting diode provided in an embodiment of the present application.

[0023] Among them, the reference numerals in the figure are:

[0024] 1. Integrated LED light source; 11. Substrate; 111. Groove; 112. U-shaped groove; 12. LED chip; 121. Electrode sheet; 13. Solder sheet; 131. First sheet; 132. Second sheet; 133. Third sheet; 2. Pin bracket; 3. Package; 31. Outer transparent potting glue layer; 32. Luminescent phosphor; 33. Inner transparent potting glue layer; 4. Reflection cover. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0029] like Figure 1 and Figure 2 As shown, the adaptive 360-degree all-around light-emitting diode provided in the embodiment of the present application is now described. The adaptive 360-degree all-around light-emitting diode comprises: an integrated LED illuminant 1, two pin brackets 2 and a package 3 with phosphor. Among them, the integrated LED illuminant 1 comprises: a substrate 11, an LED chip 12 arranged on the substrate 11, and two welding pieces 13 arranged on the substrate 11 and electrically connected to the LED chip 12, and the welding pieces 13 are used to weld the LED chip 12 and the pin bracket 2. The end faces of the two pin brackets 2 are planes and the same end faces of the two pin brackets 2 are flat. The substrate 11 is arranged on the same end face of the two pin brackets 2 and the two welding pieces 13 are respectively welded to the end faces of the corresponding pin brackets 2. The two pin brackets 2 are respectively a positive pin bracket and a negative pin bracket, and the two welding pieces 13 are respectively a positive welding piece and a negative welding piece. The positive welding piece is electrically connected to the positive pin bracket and the positive electrode piece on the LED chip 12, and the negative welding piece is electrically connected to the negative pin bracket 2 and the negative electrode piece on the LED chip 12. The integrated LED light source 1 is an integrated device. When the integrated LED light source 1 is electrically connected to the pin bracket 2, it is only necessary to weld the welding piece 13 to the pin bracket 2, thereby omitting the process of welding the lead wire in the prior art.

[0030] The adaptive 360-degree all-around light emitting diode provided by the present application has the following beneficial effects:

[0031] 1. By integrating the LED light emitter 1 and directly electrically connecting it to the pin bracket 2, the steps of dispensing glue to fix the LED chip and welding the lead wires in the prior art are omitted, thus simplifying the production process.

[0032] 2. By integrating the soldering piece 13 on the LED illuminant 1 and electrically connecting it to the pin bracket 2, the requirement for the surface finish of the pin bracket 2 is reduced, and there is no need to plate precious metals to ensure welding quality, thereby reducing production costs.

[0033] 3. The end face of the pin bracket 2 is a plane. Compared with the prior art, there is no need to process a cup body for accommodating the LED chip on the end face of the pin bracket 2, which reduces the processing technology of the pin bracket 2.

[0034] 4. The integrated LED illuminant 1 can increase the power and light decay resistance of the light emitting diode compared with the prior art of welding the LED chip by wire.

[0035] In one embodiment, a groove 111 is provided on the substrate 11, and the LED chip 12 is placed in the groove 111. The electrode sheet 121 of the LED chip 12 is provided on the side of the LED chip 12 away from the substrate 11. The welding sheet 13 includes a first sheet 131, a second sheet 132 and a third sheet 133 connected in sequence. The first sheet 131 is electrically connected to the electrode sheet 121, and the third sheet 133 is electrically connected to the end surface of the lead bracket 2. The groove 111 is used to accommodate the LED chip 12 and plays a positioning role.

[0036] In this embodiment, the soldering piece 13 is U-shaped. The angle α between the first piece 131 and the second piece 132 is 80° to 90°, and α is preferably 85°; the angle β between the second piece 132 and the third piece 133 is 90° to 100°, and β is preferably 95°. This arrangement enables the first piece 131 to have a pressing force against the electrode piece 121, and the third piece 133 to have a pressing force against the end face of the lead bracket 2, thereby ensuring the stability of the contact between the first piece 131 and the electrode piece 121 and the stability of the contact between the third piece 133 and the lead bracket 2, and also facilitating the assembly of the LED chip 12 and the substrate 11, reducing the difficulty of producing the integrated LED light-emitting body 1.

[0037] In this embodiment, a U-shaped groove 112 for accommodating the soldering piece 13 is provided on the surface of the substrate 11 . The U-shaped groove 112 is provided to facilitate the assembly of the soldering piece 13 and has a positioning function for the soldering piece 13 .

[0038] In other embodiments, the substrate 11 is a rigid substrate or a flexible substrate, the rigid substrate is a ceramic substrate or an aluminum substrate, and the flexible substrate is an FPC board; the LED chip 12 and the welding piece 13 are formed on the substrate 11, the LED chip 12 can be arranged protruding from the surface of the substrate 11, and the electrode piece 121 of the LED chip 12 is arranged on a side close to the substrate 11. The substrate 11 has a variety of materials to choose from and has a wide range of applications.

[0039] In this embodiment, the power of the integrated LED illuminant 1 is 0.05W to 1.0W. In the prior art, the power of the light emitting diode is generally 0.2W to 0.3W because the light emitting diode is connected to the LED chip through the welding wire, which limits the power range of the light emitting diode, making it difficult for the light emitting diode to be used in various occasions. However, the power range of the integrated LED illuminant 1 in this embodiment is relatively large, and it can be well applied to more occasions.

[0040] In this embodiment, the light decay of the integrated LED light source 1 is 5% within 3000 hours, compared with the prior art where the light decay of the LED chip electrically connected via leads is 50% within 3000 hours. Therefore, the integrated LED light source 1 of this embodiment greatly improves the ability to resist light decay.

[0041] In this embodiment, the LED chip 12 is a blue chip or a purple chip with a wavelength of 260nm-480nm, wherein the wavelength of the blue chip is preferably 440nm-480nm, and the wavelength of the purple chip is preferably 400nm-430nm.

[0042] In this embodiment, the pin bracket 2 includes a substrate, an inner copper layer, a nickel layer and an outer copper layer arranged in sequence from the inside to the outside, and the substrate can be made of conductive materials such as iron, aluminum, and copper. The material of the pin bracket 2 does not need to use precious metal silver, and the silver plating layer is reduced compared with the pins in the prior art, eliminating the electroplating process, and reducing the cost of raw materials and processes.

[0043] In one embodiment, the package body 3 includes: an outer transparent potting glue layer 31, luminescent phosphor 32 and an anti-precipitation inner transparent potting glue layer 33, wherein the luminescent phosphor 32 is evenly distributed in the inner transparent potting glue layer 33, the outer transparent potting glue is coated on the outer surface of the inner transparent potting glue layer 33, and the integrated LED luminous body 1 is placed in the inner transparent potting glue layer 33. The outer transparent potting glue layer 31 and the inner transparent potting glue layer 33 are made of epoxy resin or silicone resin.

[0044] In this embodiment, the luminescent phosphor 32 is selected from rare earth yttrium aluminum garnet phosphor, and the anti-precipitation inner transparent potting glue is selected from silicone resin, so that the rare earth yttrium aluminum garnet phosphor is evenly distributed in the inner transparent potting glue layer 33 without precipitation. In this embodiment, the outer transparent potting glue layer 31 is made of transparent epoxy AB glue, and the outer transparent potting glue layer 31 is a convex lens structure. The focal length of the outer transparent potting glue layer 31 can be adjusted according to requirements, so as to achieve the purpose of focusing and scattering light. For example, when the position of the light-emitting diode (LED chip 12) on the optical axis is equal to the focal length formed by the outer transparent potting glue layer 31, the light-emitting effect of the light-emitting diode will produce focusing and scattering light; when the position of the light-emitting diode on the optical axis is less than the focal length formed by the outer transparent potting glue layer 31, the light-emitting effect of the light-emitting diode forms 360-degree body light emission.

[0045] In other embodiments, the luminescent phosphor 32 includes a fluoride red phosphor and also includes a blue phosphor, a green phosphor or a yellow phosphor. Thus, the fluoride red phosphor has good performance and high luminous efficiency, and its mixing with the blue phosphor, the green phosphor or the yellow phosphor is conducive to obtaining a light-emitting diode that emits white light. When the LED chip 12 is a blue chip, the luminescent phosphor 32 includes a fluoride red phosphor and at least one of the green phosphor and the yellow phosphor. When the LED chip 12 is a purple chip, the luminescent phosphor 32 includes a fluoride red phosphor and at least two of the blue phosphor, the green phosphor and the yellow phosphor.

[0046] like Figure 3 As shown, in one embodiment, a horn-shaped reflector 4 is provided outside the package body 3, and the opening direction of the reflector 4 is the same as the light emitting direction of the integrated LED light emitting body 1. The reflector 4 is used to converge the light emitted by the LED chip 12, thereby increasing the irradiation distance of the light and obtaining a light spot with good light focusing. The reflector 4 is made of plastic or metal material, and the inner surface of the reflector 4 is provided with a reflective layer, which is used to reflect light, and the opening angle of the reflector 4 is 120°-150°, preferably 130°-140°.

[0047] The following steps are involved in making the adaptive 360-degree all-around light-emitting diode of this embodiment: first, add luminescent phosphor 32 to the glue and stir evenly to obtain a mixture of glue and phosphor; second, attach the integrated LED luminous body 1 to the end surface of the pin bracket 2 and perform soldering so that the soldering piece 13 is electrically connected to the pin bracket 2; third, place the pin bracket 2 with the integrated LED luminous body 1 in the mixture of glue and phosphor to form an inner transparent potting glue layer 33; fourth, form an outer transparent potting glue layer 31 on the outer surface of the inner transparent potting glue layer 33, and the outer transparent potting glue layer 31 is used to control the light-emitting effect of the light-emitting diode. The step of soldering the lead in the prior art is omitted in this manufacturing step.

[0048] This embodiment also provides a light emitting device, which at least includes the above-mentioned adaptive 360-degree omnidirectional light emitting diode. In addition to the above-mentioned adaptive 360-degree omnidirectional light emitting diode, the light emitting device may also include a conventional packaging structure, a switch, a housing, a power supply, etc., which will not be described in detail here.

[0049] In this embodiment, the light emitting device may be a bulb lamp, a flashlight, a spotlight, a panel lamp, a line lamp, a floodlight, a mining lamp or a car headlight. Alternatively, the light emitting device may also be an electronic product such as a router using the adaptive 360-degree light emitting diode.

[0050] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. Adaptive 360-degree all-around light emitting diode, characterized by: include: An integrated LED illuminant, two pin brackets and a package with fluorescent powder, wherein the integrated LED illuminant comprises: a substrate, an LED chip arranged on the substrate, and two welding pieces arranged on the substrate and electrically connected to the LED chip, the same end surface of the two pin brackets is flush, the substrate is arranged on the same end surface of the two pin brackets and the two welding pieces are respectively welded to the end surfaces of the corresponding pin brackets; The substrate is provided with a groove, the LED chip is placed in the groove, the electrode sheet of the LED chip is provided on a side of the LED chip away from the substrate, the welding sheet comprises a first sheet, a second sheet and a third sheet connected in sequence, the first sheet is welded to the electrode sheet, and the third sheet is welded to the end face of the lead bracket; The welding piece is U-shaped, the angle between the first piece and the second piece is 85°, and the angle between the second piece and the third piece is 95°.

2. The adaptive 360-degree all-around light emitting diode according to claim 1, characterized in that: A U-shaped groove for accommodating the welding sheet is provided on the surface of the substrate.

3. The adaptive 360-degree all-around light emitting diode according to claim 1, characterized in that: The substrate is a rigid substrate or a flexible substrate.

4. The adaptive 360-degree all-around light emitting diode according to claim 1, characterized in that: The power of the integrated LED light source is 0.05W~1.0W.

5. The adaptive 360-degree all-around light emitting diode according to claim 1, characterized in that: The LED chip is a blue light chip or a purple light chip with a wavelength of 260nm-480nm.

6. The adaptive 360-degree all-around light emitting diode according to claim 1, characterized in that: The encapsulation body comprises an outer transparent potting glue layer, luminescent fluorescent powder and an anti-precipitation inner transparent potting glue layer, the luminescent fluorescent powder is evenly distributed in the inner transparent potting glue layer, the outer transparent potting glue is coated on the outer surface of the inner transparent potting glue layer, and the integrated LED light-emitting body is placed in the inner transparent potting glue layer.

7. The adaptive 360-degree all-around light emitting diode according to any one of claims 1 to 6, characterized in that: A horn-shaped reflective cover is disposed outside the packaging body, and the opening direction of the reflective cover is the same as the light emitting direction of the integrated LED light emitting body.

8. A light emitting device, characterized in that: include: An adaptive 360-degree all-around light emitting diode as claimed in any one of claims 1 to 7.

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