Input sensing unit and display device using the same

Abstract

The present application relates to an input sensing unit and a display device using the same. The input sensing unit includes a first conductive layer, a first organic layer, a second conductive layer, and a second organic layer which are sequentially stacked on each other, wherein the first organic layer includes a first base resin and a first hollow polymer, and the second organic layer includes a second base resin and a second hollow polymer.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0063351, filed on May 27, 2020, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to an input sensing unit, a method of manufacturing an input sensing unit, and a display device using an input sensing unit, and particularly to an input sensing unit having improved touch sensitivity. Background Technology

[0004] Various display devices are being developed for use in multimedia devices such as televisions, cellular phones, tablet computers, and game consoles. These display devices include a display panel for showing images to the user and input devices such as a keyboard, mouse, or touch panel.

[0005] With the development of new display devices such as display devices with curved surfaces, rollable display devices, or foldable display devices, research is underway on touch panels with good flexibility and touch sensitivity.

[0006] The information disclosed in this background section is only for understanding the background technology of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0007] The input sensing unit constructed according to an exemplary embodiment of the present invention can improve flexibility and touch sensitivity.

[0008] Exemplary implementations also provide a simplified method for manufacturing the input sensing unit.

[0009] Exemplary embodiments also provide a display device including a highly reliable input sensing unit.

[0010] Other features of the inventive concept will be set forth in the following description and will be apparent in part from the description or may be learned by practice of the inventive concept.

[0011] An input sensing unit according to an exemplary embodiment includes a first conductive layer, a first organic layer, a second conductive layer, and a second organic layer stacked sequentially on top of each other, wherein the first organic layer includes a first base resin and a first hollow polymer, and the second organic layer includes a second base resin and a second hollow polymer.

[0012] The first base resin and the second base resin may comprise substantially the same material, and the first hollow polymer and the second hollow polymer may comprise substantially the same material.

[0013] The first and second organic layers may have a dielectric constant ranging from about 1.3 to about 3.0.

[0014] The content of the first hollow polymer in the first organic layer and the content of the second hollow polymer in the second organic layer can each be in the range of about 10 wt% to about 70 wt%.

[0015] The first hollow polymer may include a first shell defining a first hollow space therein, the second hollow polymer may include a second shell defining a second hollow space therein, and each of the first and second shells may include at least one selected from polyimide, polyurethane, polystyrene, acrylic resin and epoxy resin.

[0016] The average diameter of each of the first and second hollow cores can range from about 20 nm to about 150 nm.

[0017] At least one of the first conductive layer and the second conductive layer may include at least one of molybdenum, silver, titanium, copper, aluminum and their alloys, indium tin oxide, indium zinc oxide, zinc oxide and indium tin zinc oxide.

[0018] A method of manufacturing an input sensing unit according to another exemplary embodiment includes forming a first conductive layer on an inorganic layer, providing and curing an organic layer compound on the first conductive layer to form a first organic layer, forming a second conductive layer on the first organic layer, and providing and curing an organic layer compound on the second conductive layer to form a second organic layer, wherein the organic layer compound includes a base resin and a hollow polymer.

[0019] The base resin may include at least one of polyimide, polyurethane, silicone resin, acrylic resin and epoxy resin.

[0020] Hollow polymers may include a hollow shell defined therein, and the shell may include at least one of polyimide, polyurethane, polystyrene, acrylic resin and epoxy resin.

[0021] The content of hollow polymer in the organic layer compound can range from about 10 wt% to about 70 wt%.

[0022] Curing organic layer compounds may include organic layer compounds that are cured using ultraviolet light or heat.

[0023] The method may also include forming a plurality of through holes in the first organic layer after the first organic layer is formed.

[0024] The organic layer compound may further include at least one of a dispersant and a curing initiator.

[0025] A display device according to another exemplary embodiment includes a display panel, a first conductive layer disposed on the display panel, a first organic layer disposed on the first conductive layer, a second conductive layer disposed on the first organic layer, and a second organic layer disposed on the second conductive layer, wherein the first organic layer includes a first base resin and a first hollow polymer, and the second organic layer includes a second base resin and a second hollow polymer.

[0026] The first base resin and the second base resin may comprise substantially the same material, and the first hollow polymer and the second hollow polymer may comprise substantially the same material.

[0027] The display panel may include a light-emitting element layer and a thin encapsulation layer covering the light-emitting element layer, and a first conductive layer may be directly disposed on the thin encapsulation layer.

[0028] The display device may further include an inorganic layer disposed on the display panel, wherein the first conductive layer may be disposed directly on the inorganic layer.

[0029] Display panels may include flexible display panels.

[0030] At least one of the first conductive layer and the second conductive layer may include multiple conductive patterns, and the multiple conductive patterns may include sensing electrodes.

[0031] It should be understood that the general description above and the detailed description below are exemplary and illustrative, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0032] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the invention and, together with the description, serve to explain the inventive concept.

[0033] Figure 1A This is a perspective view illustrating a display device according to an exemplary embodiment.

[0034] Figure 1B It is shown Figure 1A A 3D view of the display device in a folded state.

[0035] Figure 2A This is a perspective view illustrating a display device according to an exemplary embodiment.

[0036] Figure 2B It is shown Figure 2A A 3D view of the display device in a folded state.

[0037] Figure 3 This is a cross-sectional view of a display device according to an exemplary embodiment.

[0038] Figure 4 This is an enlarged cross-sectional view of a portion of a display panel according to an exemplary embodiment.

[0039] Figure 5A This is a cross-sectional view of a display device according to an exemplary embodiment.

[0040] Figure 5B yes Figure 5A A magnified view of region SS.

[0041] Figure 5C yes Figure 5A A magnified view of region TT.

[0042] Figure 6 This is a plan view illustrating an input sensing unit according to an exemplary embodiment.

[0043] Figure 7A It is according to the exemplary implementation along Figure 6 The cross section intercepted by line I-I'.

[0044] Figure 7B It is according to another exemplary implementation along Figure 6 A sectional view taken by line I-I'.

[0045] Figure 7C This is a plan view illustrating an input sensing unit according to another exemplary embodiment.

[0046] Figure 8 This is a flowchart illustrating a method for manufacturing an input sensing unit according to an exemplary embodiment.

[0047] Figure 9A and Figure 9B This is a cross-sectional view illustrating some steps of a method for manufacturing an input sensing unit according to an exemplary embodiment.

[0048] Figure 9C This is a view illustrating an organic layer compound according to an exemplary embodiment.

[0049] Figure 9D This is a cross-sectional view illustrating a method for manufacturing an input sensing unit according to an exemplary embodiment.

[0050] Figure 9E It was obtained using focused ion beam (FIB). Figure 9D The image of region AA.

[0051] Figure 9F , Figure 9G , Figure 9H and Figure 9I This is a cross-sectional view illustrating some steps of a method for manufacturing an input sensing unit according to an exemplary embodiment. Detailed Implementation

[0052] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of apparatuses or methods employing one or more of the inventive concepts disclosed herein. However, it will be apparent, however, that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, a particular shape, configuration, and characteristic of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0053] Unless otherwise stated, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects (hereinafter individually or collectively referred to as “elements”) of various embodiments may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0054] The use of crosshairs and / or shading in the accompanying drawings is generally to clarify the boundaries between adjacent elements. Therefore, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonalities between illustrated elements, and / or any other characteristics, properties, or characteristics of the elements. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented differently, the specific order of processes may be performed differently than the order described. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description. Furthermore, the same reference numerals denote the same elements.

[0055] When a component or layer is referred to as being "on," "connected to," or "attached to" another component or layer, it may be directly on, directly connected to, or attached to the other component or layer, or there may be an intermediate component or layer. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly attached to" another component or layer, there is no intermediate component or layer. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection, with or without an intermediate component. Furthermore, the DR1, DR2, and DR3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) and can be interpreted in a broader sense. For example, the DR1, DR2, and DR3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the set consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0056] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0057] Spatial relative terms such as “beneath,” “below,” “under,” “lower,” “above,” “upper,” “over,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and thus to describe the relationship of one element to another(s) as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will then be oriented “above” other elements or features. Thus, the exemplary term “below” can cover both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and thus the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0058] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, as used herein. Furthermore, when used in this specification, the terms “comprising,” “including,” “including,” and / or “comprising” indicate the presence of stated features, integrals, steps, operations, elements, components, and / or sets thereof, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or sets thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than as terms of degree, and are therefore used to allow for inherent deviations in measurements, calculated values, and / or provided values ​​that will be recognized by those skilled in the art.

[0059] Various exemplary embodiments are described herein with reference to cross-sectional and / or exploded views as schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Thus, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the specific shapes of the regions shown, but rather include deviations in shape caused, for example, by manufacturing processes. In this way, the regions shown in the figures may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0060] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0061] Figure 1A This is a perspective view showing a display device DD according to an exemplary embodiment. Figure 1B It is shown Figure 1A A 3D view of the display device DD in a folded state.

[0062] Reference Figure 1A and Figure 1B The display device DD can be a foldable display device. The display device DD can be used in large electronic devices (e.g., televisions and monitors) or small to medium-sized electronic devices (e.g., smartphones, tablets, car navigation systems, game consoles, and smartwatches).

[0063] The top surface of the display device DD can be defined as the display surface DS. When the display device DD is in the unfolded state, the display surface DS can be parallel to the plane defined by the first direction DR1 and the second direction DR2.

[0064] The display surface DS may include a display area DA and a non-display area NDA adjacent to the display area DA. The display area DA may be the area on which an image IM is displayed, and the non-display area NDA may be the area not used to display the image IM. Figure 1A The image shows an example of an application icon used as an image IM.

[0065] The display area DA can be substantially rectangular in shape. The non-display area NDA can surround the display area DA. However, the inventive concept is not limited thereto, and the shapes of the display area DA and the non-display area NDA can be varied. For example, in some exemplary embodiments, at least a portion of the non-display area NDA can have a curved shape.

[0066] The display device DD may include a first non-folding region NFA1, a folding region FA, and a second non-folding region NFA2, which are sequentially defined in the first direction DR1. Figure 1A and Figure 1B An exemplary display device DD comprising one folded region and two non-folded regions is shown, but the inventive concept is not limited to a specific number of folded and non-folded regions in the display device DD. For example, in some exemplary embodiments, the display device DD may include three or more non-folded regions and two or more folded regions located therebetween.

[0067] The display device DD can be folded along the folding axis FX. Specifically, the folding area FA can be bent along the folding axis FX. The folding axis FX can be substantially parallel to the second direction DR2. The folding axis FX can be defined as substantially parallel to the long side of the display device DD.

[0068] When the display device DD is folded, the first non-folding region NFA1 and the second non-folding region NFA2 can be configured such that their display surfaces face each other. Thus, in the folded state, the display surface DS is not exposed to the outside. However, the inventive concept is not limited to this. In another exemplary embodiment, the display device DD can be folded such that the display surfaces of the first non-folding region NFA1 and the second non-folding region NFA2 are opposite to each other. In this case, in the folded state, the display surface DS can be exposed to the outside.

[0069] Figure 2A This is a perspective view showing a display device DD-1 according to an exemplary embodiment. Figure 2B It is shown Figure 2AA 3D view of the DD-1 display device in a folded state.

[0070] Reference Figure 2A and Figure 2B The display device DD-1 may include a first non-foldable region NFA1-1, a foldable region FA-1, and a second non-foldable region NFA2-1, which are sequentially defined along the second direction DR2.

[0071] The display device DD-1 can be folded along the folding axis FX-1. In particular, the folding area FA-1 can be bent along the folding axis FX-1. The folding axis FX-1 can be substantially parallel to the first direction DR1. The folding axis FX-1 can be defined as substantially parallel to the short side of the display device DD-1.

[0072] As used herein, a foldable display device will be exemplarily shown as a display device, but the inventive concept is not limited thereto. For example, the inventive concept can be applied to any of flexible display devices (e.g., rollable display devices, stretchable display devices, etc.) and rigid display devices.

[0073] Figure 3 This is a cross-sectional view showing a display device DD according to an exemplary embodiment. Figure 4 This is an enlarged cross-sectional view of a display panel DP according to an exemplary embodiment. Figure 5A This is a cross-sectional view showing a display device DD according to an exemplary embodiment. Figure 5B yes Figure 5A A magnified view of region SS. Figure 5C yes Figure 5A A magnified view of region TT.

[0074] Figure 3 , Figure 4 and Figure 5A The cross-section taken parallel to the second direction DR2 and the third direction DR3 is shown. Figure 3 , Figure 4 and Figure 5A In the diagram, the display device DD is shown schematically to better illustrate the stacked structure of the functional units of the display device DD.

[0075] exist Figure 3 , Figure 4 and Figure 5AIn this context, when one of the input sensing unit, anti-reflective unit, and window unit is formed onto another element through a continuous process, the unit is referred to as a "layer." Conversely, when one of the input sensing unit, anti-reflective unit, and window unit is bonded to another element by an adhesive member, the unit is referred to as a "panel." A unit identified by the term "panel" may include a base layer (e.g., a synthetic resin film, composite film, or glass substrate) providing a substrate surface, but a unit identified by the term "layer" may not include a base layer.

[0076] Reference Figure 3 The display device DD may include a display panel DP, an input sensing unit ISL, an anti-reflective unit RPL, and a window unit WL. Figure 3 An exemplary embodiment is shown in which the input sensing unit ISL, the anti-reflective unit RPL, and the window unit WL are layers, and each of them is formed by a continuous process. For example, the input sensing unit ISL can be directly disposed on the display panel DP.

[0077] As used herein, the statement "component B can be directly disposed on component A" means that the adhesive layer or component is not disposed between component A and component B. More specifically, component A is formed, and then component B is formed on the substrate surface provided by component A through a continuous process.

[0078] The display panel DP and the input sensing unit ISL directly mounted on the display panel DP can be collectively defined as the display module DM.

[0079] In some exemplary embodiments, the adhesive layer may be disposed between the display module DM and the anti-reflective unit RPL, and between the anti-reflective unit RPL and the window unit WL, respectively.

[0080] The display panel DP can be used to display an image IM, and the input sensing unit ISL can be used to obtain coordinate information about the location of an external input (e.g., a touch event or light). In some exemplary embodiments, the display module DM may also include a protective member disposed on the bottom surface of the display panel DP.

[0081] According to exemplary embodiments, the display panel DP can be a light-emitting display panel, but the inventive concept is not limited to a specific type of display panel DP. For example, the display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The emitting layer of an organic light-emitting display panel can be formed of or include organic light-emitting materials. The emitting layer of a quantum dot light-emitting display panel can include quantum dots, quantum rods, etc. Hereinafter, the display panel DP will be exemplarily described as an organic light-emitting display panel.

[0082] An anti-reflection unit RPL can reduce the reflectivity of external light incident on a window unit WL from the outside. In an exemplary embodiment, the anti-reflection unit RPL may include a phase retarder, a polarizer, and / or a destructive interference structure. The phase retarder may be film-type or liquid crystal coating-type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be film-type or liquid crystal coating-type. A film-type polarizer may include an elongated synthetic resin film, and a liquid crystal coating-type polarizer may include liquid crystals arranged with a specific orientation. The phase retarder and polarizer may also include a protective film. At least one of the phase retarder, polarizer, and protective film can be used as the anti-reflection unit RPL. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, can destructively interfere with each other and reduce the reflectivity of external light.

[0083] The anti-reflective unit (RPL) may include a color filter and a separation pattern. The color filter may be configured to transmit light emitted from the display module (DM) or to change the wavelength of the light. The separation pattern may include a light-blocking material and prevent mixing of light passing through the color filter. Furthermore, the light-blocking material of the separation pattern may absorb external light. For example, the separation pattern may be formed of or include a blue or black material.

[0084] Since the display device DD includes color filters and separation patterns, the reflectivity of external light in the display device DD can be reduced.

[0085] In an exemplary embodiment, the window unit WL may include a base layer and a light-shielding pattern. The base layer may include a glass substrate and / or a synthetic resin film. The light-shielding pattern may partially overlap the rear surface of the base layer to define a bezel area of ​​the display device DD (e.g., Figure 1A The non-display area NDA).

[0086] In some exemplary embodiments, the stacking order of the input sensing unit ISL and the anti-reflective unit RPL can be changed, or the anti-reflective unit RPL can be omitted from the display device DD. Furthermore, the input sensing unit ISL is exemplarily shown to overlap the entire area of ​​the display panel DP, but in other exemplary embodiments, the input sensing unit ISL may overlap a portion of the display area DA, or it may overlap only with the non-display area NDA. The input sensing unit ISL may be a touch sensing panel capable of sensing touch events from a user, or a fingerprint sensing panel capable of sensing the fingerprint of a user's finger.

[0087] Reference Figure 4The display panel DP may include a substrate layer BL and a circuit device layer DP-CL, a light-emitting element layer DP-OLED, and a thin encapsulation layer TFE disposed on the substrate layer BL. In some exemplary embodiments, the display panel DP may also include functional layers such as an anti-reflective layer and a refractive index control layer.

[0088] The substrate layer BL may include a synthetic resin film. The synthetic resin film may be a polyimide-based resin layer, but the inventive concept is not limited to specific materials of synthetic resin films. Furthermore, the substrate layer BL may include a glass substrate, a metal substrate, or a substrate comprising an organic / inorganic composite material.

[0089] The DP-CL (Distributed Device Layer) may include at least one insulating layer and at least one circuit device. In the following text, the insulating layer in the DP-CL will also be referred to as the intermediate insulating layer. The intermediate insulating layer may include at least one intermediate inorganic layer and at least one intermediate organic layer. The circuit devices in the DP-CL may include multiple signal lines, multiple signal pads, pixel driving circuits, etc. The DP-CL can be formed by using coating or deposition processes to form the insulating layer, semiconductor layer, and conductive layer, and then using photolithography and etching processes to pattern the insulating layer, semiconductor layer, and conductive layer.

[0090] A DP-OLED with a light-emitting element layer may include a light-emitting device. For example, a DP-OLED with a light-emitting element layer may include an organic light-emitting diode. A DP-OLED with a light-emitting element layer may include a pixel-defining layer and a light-emitting device. The light-emitting device may include a first electrode, an emitting layer, and a second electrode. The first electrode may be a plurality of patterns disposed between and spaced apart from each other among multiple pixel-defining layers. The pixel-defining layer may be an organic layer. The pixel-defining layer may be used to separate emitting regions from non-emitting regions.

[0091] A first electrode, an emission layer, and a second electrode that do not overlap with the pixel defining layer can be defined as emission regions. The region where the pixel defining layer is disposed can be defined as a non-emission region. The thin encapsulation layer (TFE) can be configured to hermetically seal the light-emitting element layer of the DP-OLED. The thin encapsulation layer (TFE) may include at least one insulating layer. In an exemplary embodiment, the thin encapsulation layer (TFE) may include at least one inorganic layer (hereinafter referred to as an inorganic encapsulation layer). In an exemplary embodiment, the thin encapsulation layer (TFE) may include at least one organic layer (hereinafter referred to as an organic encapsulation layer) and at least one inorganic encapsulation layer.

[0092] Inorganic encapsulation layers can be used to protect the DP-OLED light-emitting element layer from moisture or oxygen, while organic encapsulation layers can be used to protect the DP-OLED light-emitting element layer from contaminating materials such as dust particles. Inorganic encapsulation layers may include at least one of silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide layers, but the inventive concept is not limited thereto. Organic encapsulation layers may include, but are not limited to, acrylic organic layers.

[0093] When viewed in a plan view, the display panel DP may include a display area DP-DA and a non-display area DP-NDA. In the illustrated exemplary embodiment, the non-display area DP-NDA may be defined along the boundary of the display area DP-DA. The display area DP-DA and the non-display area DP-NDA of the display panel DP may respectively correspond to Figures 1A to 2A The display area DA and the non-display area NDA of the display device DD or DD-1 shown.

[0094] In an exemplary embodiment, the first inorganic encapsulation layer IOL1 may be configured to cover the display area DP-DA and the non-display area DP-NDA of the display panel DP. An organic encapsulation layer OL may be disposed on the first inorganic encapsulation layer IOL1. The organic encapsulation layer OL may overlap with the entire portion of the display area DP-DA and a portion of the non-display area DP-NDA. For example, the organic encapsulation layer OL may not overlap with the pad area NDA-PD (e.g., see...). Figure 6 Overlap. Pad area NDA-PD (for example, see...) Figure 6 This can be the area of ​​the display panel (DP) to which printed circuit boards, flexible circuit boards, etc., are connected.

[0095] The second inorganic encapsulation layer IOL2 can be disposed on the organic encapsulation layer OL. The second inorganic encapsulation layer IOL2 can also be configured to cover the display area DP-DA and the non-display area DP-NDA.

[0096] exist Figure 5A The diagram schematically illustrates a display panel DP to better illustrate the stacked structure of the input sensing units ISL. For example, anti-reflective units and window units that may be disposed on the input sensing units ISL may not be shown. In the illustrated exemplary embodiment, the input sensing unit ISL will be exemplarily described as a reference. Figure 3 The description takes the form of "layers".

[0097] The input sensing unit ISL may also include a buffer layer IS-BFL directly disposed on the thin encapsulation layer TFE. The buffer layer IS-BFL may be formed of or comprise at least one inorganic material (e.g., alumina, titanium oxide, silicon oxide, silicon oxynitride, silicon nitride, zirconium oxide, or hafnium oxide). For example, the buffer layer IS-BFL may be formed of or comprise silicon nitride. The inorganic layer disposed at the top layer of the thin encapsulation layer TFE may also comprise silicon nitride. The silicon nitride layer in the thin encapsulation layer TFE may be formed under deposition conditions different from those used to form the buffer layer IS-BFL.

[0098] The input sensing unit ISL, which is in the form of a "layer," can be directly disposed on the substrate surface provided by the buffer layer IS-BFL. In this case, unlike the input sensing unit in the form of a "panel," the substrate layer can be omitted, thereby reducing the thickness of the display module DM. In the exemplary embodiment shown, the substrate surface can be the top surface of the buffer layer IS-BFL. However, the inventive concept is not limited thereto, and in some exemplary embodiments, the buffer layer IS-BFL can be omitted, and the input sensing unit ISL can be directly disposed on the thin encapsulation layer TFE.

[0099] The input sensing unit (ISL) can have a multi-layered structure. The ISL may include sensing electrodes, signal lines connected to the sensing electrodes, and at least one insulating layer. The ISL can sense external input capacitively, electromagnetically, or by pressure sensing. In an exemplary embodiment, the ISL can sense external input capacitively.

[0100] In an exemplary embodiment, the input sensing unit ISL may include a buffer layer IS-BFL, a first conductive layer IS-CL1, a first insulating layer IS-IL1, a second conductive layer IS-CL2, and a second insulating layer IS-IL2. The buffer layer IS-BFL, the first conductive layer IS-CL1, the first insulating layer IS-IL1, the second conductive layer IS-CL2, and the second insulating layer IS-IL2 may be sequentially disposed on the display panel DP.

[0101] Each of the first conductive layer IS-CL1 and the second conductive layer IS-CL2 may have a monolayer structure or a multilayer structure comprising multiple layers stacked on a third-direction DR3. The monolayer conductive layer may comprise a metal layer or a transparent conductive layer. The metal layer may be formed of or comprise at least one of molybdenum, silver, titanium, copper, aluminum, and alloys thereof. The transparent conductive layer may comprise at least one of a transparent conductive oxide material such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). In some exemplary embodiments, the transparent conductive layer may comprise a conductive polymer (e.g., PEDOT), metal nanowires, or graphene.

[0102] Each of the first conductive layer IS-CL1 and the second conductive layer IS-CL2, which have multiple conductive layers, may include multiple metal layers. For example, the multilayer conductive layer may be configured as a three-layer structure including a titanium layer, an aluminum layer, and a titanium layer. Optionally, the multilayer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0103] Each of the first conductive layer IS-CL1 and the second conductive layer IS-CL2 may include multiple conductive patterns. Hereinafter, the first conductive layer IS-CL1 will be described as including a first conductive pattern, and the second conductive layer IS-CL2 will be described as including a second conductive pattern. Each of the first and second conductive patterns may include at least one sensing electrode and at least one signal line.

[0104] The stacking structure and materials of the sensing electrodes can be determined by considering the technical requirements for sensing sensitivity. Sensing sensitivity can be affected by RC delay, and a conductive layer including a metal layer can have a lower resistance than a transparent conductive layer. Thus, using a conductive layer including a metal layer can reduce the RC delay value and decrease the charging time for the capacitor defined between the sensing electrodes. Compared to sensing electrodes including a metal layer, sensing electrodes including a transparent conductive layer are less easily identifiable by the user and can have a larger input area, which may increase capacitance.

[0105] In an exemplary embodiment, the sensing electrode, which includes a metal layer, may have a mesh structure, which will be described in more detail below, and in this case, the sensing electrode can be prevented from being identified by the user.

[0106] In an exemplary embodiment, the first insulating layer IS-IL1 and the second insulating layer IS-IL2 may be formed of or comprise organic materials. Hereinafter, the first insulating layer IS-IL1 will be referred to as the first organic layer IS-IL1, and the second insulating layer IS-IL2 will be referred to as the second organic layer IS-IL2.

[0107] refer to Figure 5B In region SS, the first organic layer IS-IL1 may include a first base resin RS1 and a first hollow polymer HP1. The first hollow polymer HP1 may include a first shell SH1 in which a first hollow OP1 is defined. The first shell SH1 may surround the first hollow OP1 and may define the outer surface of the first hollow polymer HP1.

[0108] The average diameter of the first hollow OP1 can range from about 20 nm to about 150 nm. For example, the average diameter of the first hollow OP1 can range from about 50 nm to about 100 nm. When the diameter of the first hollow OP1 ranges from about 20 nm to about 150 nm, haze problems in the first organic layer IS-IL1 can be suppressed or minimized.

[0109] In an exemplary embodiment, the first base resin RS1 may be formed of or include at least one of polyimide, polyurethane, silicone resin, acrylic resin, and epoxy resin. The first shell SH1 may be formed of or include at least one of polyimide, polyurethane, polystyrene, acrylic resin, and epoxy resin. The materials used for the first base resin RS1 and the first hollow polymer HP1 may each be independently selected from the above-mentioned materials, and in this case, the materials forming the first organic layer IS-IL1 may be in various combinations.

[0110] refer to Figure 5C In region TT, the second organic layer IS-IL2 may include a second base resin RS2 and a second hollow polymer HP2. The second hollow polymer HP2 may include a second shell SH2 in which a second hollow OP2 is defined.

[0111] In an exemplary embodiment, the first base resin RS1 may be formed of or comprise the same material as the second base resin RS2. The first hollow polymer HP1 may be formed of or comprise the same material as the second hollow polymer HP2. For example, the first organic layer IS-IL1 and the second organic layer IS-IL2 may be formed of the same material.

[0112] In an exemplary embodiment, Figure 5C The second base resin RS2 and the second hollow polymer HP2 can have the same properties as the reference. Figure 5B The first base resin RS1 and the first hollow polymer HP1 are described to have essentially the same characteristics.

[0113] Figure 6This is a plan view illustrating an input sensing unit ISL according to an exemplary embodiment. Figure 7A It is according to the exemplary implementation along Figure 6 A sectional view taken by line I-I'. Figure 7B It is according to another exemplary implementation along Figure 6 A sectional view taken by line I-I'. Figure 7C This is a plan view illustrating an input sensing unit ISL according to another exemplary embodiment.

[0114] like Figure 6 As shown, the input sensing unit ISL may include first sensing electrodes IE1-1 to IE1-5, first signal lines SL1-1 to SL1-5 connected to the first sensing electrodes IE1-1 to IE1-5, second sensing electrodes IE2-1 to IE2-4, and second signal lines SL2-1 to SL2-4 connected to the second sensing electrodes IE2-1 to IE2-4. In some exemplary embodiments, the input sensing unit ISL may further include optical virtual electrodes disposed in the boundary region between the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4.

[0115] The first sensing electrodes IE1-1 to IE1-5 can be configured to intersect with the second sensing electrodes IE2-1 to IE2-4. The first sensing electrodes IE1-1 to IE1-5 can be arranged on a first direction DR1, and each is a pattern extending on a second direction DR2. In an exemplary embodiment, the first sensing electrodes IE1-1 to IE1-5 can sense external input using self-capacitance. In an exemplary embodiment, the second sensing electrodes IE2-1 to IE2-4 can sense external input using mutual capacitance.

[0116] Each of the first sensing electrodes IE1-1 to IE1-5 may include a first sensor unit SP1 and a first portion CP1. Each of the second sensing electrodes IE2-1 to IE2-4 may include a second sensor unit SP2 and a second portion CP2. The first sensor unit SP1 and the first portion CP1 may be configured as a single object, or they may be electrically connected to each other through a through-hole. The second sensor unit SP2 and the second portion CP2 may be configured as a single object, or they may be electrically connected to each other through a through-hole.

[0117] Reference Figure 7A The first part CP1 can be directly disposed on the buffer layer IS-BFL. The first organic layer IS-IL1 can be disposed on the buffer layer IS-BFL to cover the first part CP1. The first sensor unit SP1 and the second part CP2 can be disposed on the first organic layer IS-IL1.

[0118] Multiple through-holes (CNTs) penetrating the first organic layer IS-IL1 can be defined within the first organic layer IS-IL1. A first sensor unit SP1 can be electrically connected to a first portion CP1 via the through-holes (CNTs). First sensor units SP1 spaced apart from each other can be electrically connected to each other via the first portion CP1. The first portion CP1 can be formed of or comprise a material having a lower resistance than the first sensor unit SP1.

[0119] In an exemplary embodiment, the first portion CP1 may be a first conductive pattern. The first portion CP1 may be formed by patterning a first conductive layer IS-CL1 (e.g., see...). Figure 5A The pattern formed by )

[0120] The first sensor unit SP1 and the second portion CP2 can be a second conductive pattern. Specifically, the first sensor unit SP1 and the second portion CP2 can be patterned by a second conductive layer IS-CL2 (see, for example, see...). Figure 5A The pattern formed by )

[0121] The dielectric constants of the first organic layer IS-IL1 and the second organic layer IS-IL2 can range from about 1.3 to 3.0. The dielectric constant of the first organic layer IS-IL1 can be adjusted by the content of the first hollow polymer HP1 in the first organic layer IS-IL1. The dielectric constant of the second organic layer IS-IL2 can be adjusted by the content of the second hollow polymer HP2 in the second organic layer IS-IL2. This will be described in more detail below.

[0122] Figure 7B It is according to another exemplary implementation along Figure 6 A sectional view taken by line I-I'. Figure 7B They exchanged [something] with each other. Figure 7A The first conductive pattern of the first conductive layer IS-CL1 and the second conductive pattern of the second conductive layer IS-CL2 are shown in the figure.

[0123] Reference Figure 7B The first sensor unit SP1' and the second part CP2' can be directly disposed on the buffer layer IS-BFL. The first organic layer IS-IL1 can be disposed on the buffer layer IS-BFL to cover the first sensor unit SP1' and the second part CP2'. The first part CP1' can be disposed on the first organic layer IS-IL1, and the second organic layer IS-IL2 can be disposed on the first organic layer IS-IL1 to cover the first part CP1'.

[0124] The first sensor unit SP1' and the second part CP2' can be a first conductive pattern. The first sensor unit SP1' and the second part CP2' can be patterned by designing a first conductive layer IS-CL1 (e.g., see...). Figure 5A The pattern formed by )

[0125] The first portion CP1' can be a second conductive pattern. The first portion CP1' can be achieved by patterning a second conductive layer IS-CL2 (e.g., see...). Figure 5A The pattern formed by )

[0126] Figure 7A and Figure 7B An exemplary illustration shows an input sensing unit ISL including a buffer layer IS-BFL, but in some exemplary embodiments, the buffer layer IS-BFL may be omitted. For example, it may be omitted as... Figure 7A The buffer layer IS-BFL is shown, and the first part CP1 can be directly disposed on the top surface of the thin encapsulation layer TFE. As another example, elements such as... Figure 7B The buffer layer IS-BFL shown, and the first sensor unit SP1' and the second part CP2' can be directly disposed on the top surface of the thin encapsulation layer TFE. An inorganic encapsulation layer can be disposed as the top side of the thin encapsulation layer TFE.

[0127] Figure 7C This is a plan view illustrating an input sensing unit (ISL) according to another exemplary embodiment. Figure 7C In the display device DD, the first sensor unit SP1 and the second sensor unit SP2 have a mesh shape to improve the flexibility of the display device DD. Each of the first sensor unit SP1 and the second sensor unit SP2 may include a metal layer. The first sensor unit SP1 and the second sensor unit SP2 may be referred to as a metal mesh pattern.

[0128] Figure 8 This is a flowchart illustrating a method (represented as S10) for manufacturing an input sensing unit ISL according to an exemplary embodiment. Figure 9A and Figure 9B This is a cross-sectional view illustrating some steps of a method for manufacturing an input sensing unit (ISL) according to an exemplary embodiment. Figure 9C This is a view illustrating an organic layer compound OS according to an exemplary embodiment. Figure 9D This is a cross-sectional view illustrating the steps of a method for manufacturing an input sensing unit (ISL) according to an exemplary embodiment. Figure 9E The results obtained using focused ion beam (FIB) are shown. Figure 9D The image of region AA. Figures 9F to 9I This is a cross-sectional view illustrating some steps of a method for manufacturing an input sensing unit (ISL) according to an exemplary embodiment.

[0129] Reference Figure 8 The method of manufacturing an input sensing unit ISL (represented by S10) may include forming a first conductive layer IS-CL1 on an inorganic layer (represented by S100), providing and curing an organic layer compound OS on the first conductive layer IS-CL1 to form a first organic layer OL1 (represented by S200), forming a plurality of through holes CTH1 and CTH2 in the first organic layer OL1 (represented by S300), forming a second conductive layer IS-CL2 on the first organic layer OL1 (represented by S400), and providing and curing an organic layer compound OS on the second conductive layer IS-CL2 to form a second organic layer OL2 (represented by S500).

[0130] Reference Figure 8 and Figure 9A The step of forming the first conductive layer IS-CL1 on the inorganic layer (represented by S100) may include directly forming the first conductive layer IS-CL1 on the inorganic layer. Figures 9A to 9I In this embodiment, the inorganic layer is exemplarily shown as a buffer layer IS-BFL, but the inventive concept is not limited thereto. In some exemplary embodiments, the inorganic layer may be a second inorganic encapsulation layer IOL2 of the thin encapsulation layer TFE (e.g., see [reference needed]). Figure 4 ).

[0131] Reference Figure 8 and Figure 9B The step of forming the first organic layer OL1 (represented by S200) may include forming an organic layer compound OS on the buffer layer IS-BFL to cover the first conductive layer IS-CL1.

[0132] Reference Figure 9C The organic layer compound OS may include a base resin RS and a hollow polymer HP. Furthermore, the organic layer compound OS may further include a functional material FN. The functional material FN may include at least one of a dispersant and a curing initiator. The dispersant can improve the dispersion properties of the hollow polymer HP in the base resin RS. The curing initiator can be used to initiate a curing reaction to cure the base resin RS. For example, when the organic layer compound OS is irradiated with ultraviolet light (UV), the base resin RS can be cured by a curing initiator. Alternatively, when the organic layer compound OS is subjected to heat, the base resin RS can be cured by a curing initiator. Various known materials can be used as dispersants and curing initiators.

[0133] In an exemplary embodiment, the content of hollow polymer HP can range from about 10 wt% to about 70 wt%, and is preferably from about 10 wt% to about 40 wt%. If the content of hollow polymer HP is about 10 wt% or less, the dielectric constant of the organic layer may not be effectively reduced by the hollow polymer HP. If the content of hollow polymer HP is about 40 wt% or more, it may be difficult to ensure pattern reliability in the photoresist process used to form through-holes in the first organic layer OL1.

[0134] Reference Figure 9D The step of forming the first organic layer OL1 (represented by S200) may include curing the organic layer compound OS as described above. In an exemplary embodiment, the step of curing the organic layer compound OS may include irradiating the organic layer compound OS with ultraviolet light (UV). In this case, the organic layer compound OS can be cured by ultraviolet light (UV) to form the first organic layer OL1 on the first conductive layer IS-CL1. Figure 9D The curing method is exemplarily shown as irradiating the organic layer compound OS with ultraviolet (UV) light, but the inventive concept is not limited thereto. For example, in another exemplary embodiment, the organic layer compound OS as described above can be cured by heat instead of UV light, or by heat and UV light, and this is relevant to reference... Figure 9I The curing method described can be the same.

[0135] Figure 9E It was obtained using focused ion beam (FIB). Figure 9D The image of region AA. Figure 9E Hollow OP and shell SH of hollow polymer HP in region AA are shown.

[0136] Reference Figure 8 and Figure 9F The step of forming through holes CTH1 and CTH2 in the first organic layer OL1 (represented by S300) may include a photoresist process using a mask.

[0137] Reference Figure 8 and Figure 9G The step of forming a second conductive layer IS-CL2 on a first organic layer OL1 (represented by S400) may include forming a second conductive layer IS-CL2 on a first organic layer OL1 having through holes CTH1 and CTH2. The first conductive patterns of the first conductive layer IS-CL1 that are spaced apart from each other may be connected to each other through the second conductive layer IS-CL2.

[0138] Reference Figure 8 and Figure 9HThe step of forming the second organic layer OL2 (represented by S500) can be performed in substantially the same manner as the step of forming the first organic layer OL1 (represented by S200). This can be used in conjunction with reference to... Figure 9C The organic layer compound OS described is substantially the same as the organic layer compound OS used to form the second organic layer OL2. In this case, the first organic layer OL1 and the second organic layer OL2 can be formed from the same material.

[0139] Reference Figure 9I The step of forming the second organic layer OL2 (represented by S500) may include the step of curing the organic layer compound OS as described above. In an exemplary embodiment, the step of curing the organic layer compound OS may include irradiating the organic layer compound OS with ultraviolet light (UV). In this case, the organic layer compound OS can be cured by ultraviolet light (UV) to form the second organic layer OL2 on the second conductive layer IS-CL2. As in the first organic layer OL1, the second organic layer OL2 may include the base resin RS and the hollow polymer HP.

[0140] The first organic layer OL1 and the second organic layer OL2 can be used as the first organic layer IS-IL1 and the second organic layer IS-IL2, respectively. The sum of the thicknesses WD of the first organic layer OL1 and the second organic layer OL2 can be less than about 1.8 μm, more specifically, less than about 1.5 μm.

[0141] Tables 1 and 2 below show the dielectric constants measured from the organic layers comprising the base resin and the hollow polymer.

[0142] In the experiments shown in Table 1, the base resin was formed from siloxane, and the shell of the hollow polymer was formed from acrylic resin.

[0143] More specifically, in the organic layer of Embodiment 1, the content of hollow polymer is 15 wt%. In the organic layer of Embodiment 2, the content of hollow polymer is 30 wt%. In the organic layer of Embodiment 3, the content of hollow polymer is 40 wt%. In Comparative Example 1, the organic layer does not contain any hollow polymer.

[0144] The reduction ratio of the dielectric constant is given by rounding to the nearest integer and is calculated by the formula (Ec-En) / Ec, where Ec and En are the dielectric constants of the organic layers in Comparative Example 1 and Embodiments 1, 2 or 3, respectively.

[0145] Table 1

[0146]

[0147] Referring to the results in Table 1, the dielectric constants in Embodiments 1 to 3 range from 1.38 to 2.68, which is less than the dielectric constant of 3.35 in Comparative Example 1. In Embodiment 1, where the hollow polymer content is 15 wt%, the dielectric constant of the organic layer is reduced by 20% compared to that of the organic layer in Comparative Example 1.

[0148] In Embodiment 2, where the hollow polymer content was 30 wt%, the dielectric constant of the organic layer was reduced by 45% compared to that of the organic layer in Comparative Example 1.

[0149] In Embodiment 3, where the hollow polymer content was 40 wt%, the dielectric constant of the organic layer was reduced by 59% compared to that of the organic layer in Comparative Example 1.

[0150] This indicates that if the content of hollow polymer in the organic layer ranges from about 10 wt% to about 70 wt%, the dielectric constant of the organic layer is 3.0 or less. For example, when the content of hollow polymer in the first organic layer IS-IL1 and the second organic layer IS-IL2 ranges from about 10 wt% to about 70 wt%, the dielectric constant of the first organic layer IS-IL1 and the second organic layer IS-IL2 can range from about 1.3 to about 3.0.

[0151] In the experiments shown in Table 2, the base resin was formed from polyimide (PI), and the shell of the hollow polymer was formed from acrylic resin.

[0152] More specifically, in the organic layer of Embodiment 4, the content of hollow polymer is 30 wt%. In the organic layer of Embodiment 5, the content of hollow polymer is 40 wt%. In Comparative Example 2, the organic layer does not contain any hollow polymer.

[0153] The reduction ratio of the dielectric constant is given by rounding to the nearest integer and is calculated by the formula (Ec-En) / Ec, where Ec and En are the dielectric constants of the organic layers in Comparative Example 2 and Embodiment 4 or 5, respectively.

[0154] Table 2

[0155]

[0156] Referring to the results in Table 2, the dielectric constants in Embodiments 4 and 5 range from 2.71 to 2.90, which is less than the dielectric constant of 3.52 in Comparative Example 2. In Embodiment 4, where the hollow polymer content is 30 wt%, the dielectric constant of the organic layer is reduced by 18% compared to that of the organic layer in Comparative Example 2.

[0157] In Embodiment 5, where the hollow polymer content was 40 wt%, the dielectric constant of the organic layer was reduced by 24% compared to that of the organic layer in Comparative Example 2.

[0158] These results indicate that the presence of hollow polymers reduces the dielectric constant of the organic layer.

[0159] When the content of hollow polymer in the organic layer ranges from about 10 wt% to about 70 wt%, the dielectric constant of the organic layer can be reduced to a value of 3.0 or lower. For example, the dielectric constant of the first organic layer IS-IL1 and the second organic layer IS-IL2 can range from about 1.3 to about 3.0.

[0160] Table 3 shows the capacitance reduction rate (%) and the improvement in touch sensitivity (dB) calculated based on Comparative Example B with a dielectric constant of 3.5 in each embodiment.

[0161] The organic layers in embodiments A, B, and C have dielectric constants of 2.3, 2.6, and 2.9, respectively. The organic layers in comparative examples A and B have dielectric constants of 3.2 and 3.5, respectively.

[0162] [Table 3]

[0163]

[0164] Referring to the results in Table 3, for embodiments A, B, and C, compared to Comparative Example B, the capacitance was reduced by 17% or more, and the touch sensitivity was improved by 0.9 dB or more. For Comparative Example A, compared to Comparative Example B, the capacitance was reduced by 9%, and the touch sensitivity was improved by 0.3 dB.

[0165] In embodiments A, B, and C, which correspond to the exemplary embodiments described above, the organic layer is configured to have a dielectric constant of 2.9 or lower, and in this case, compared to Comparative Example B, where the organic layer has a dielectric constant of 3.5, the electrostatic capacitance is reduced by 17% or more and the touch sensitivity is improved by 0.9 dB or more.

[0166] Referring to the results in Tables 1 to 3, the input sensing unit according to the exemplary embodiment may include a first organic layer IS-IL1 and a second organic layer IS-IL2 whose dielectric constant is adjusted to a range of 1.3 to 3.0. In this case, parasitic capacitance problems that may occur between the first organic layer IS-IL1 and the second organic layer IS-IL2 and the electrodes of the display panel DP can be suppressed, and the touch sensitivity of the input sensing unit can be improved.

[0167] According to an exemplary embodiment, the input sensing unit may include a first organic layer and a second organic layer, wherein the dielectric constants of the first and second organic layers range from 1.3 to 3.0, and the first and second organic layers comprise a hollow polymer in a content ranging from about 10 wt% to about 70 wt%. In this way, the input sensing unit can have good touch sensitivity even when it has a small thickness. Furthermore, since the first organic layer IS-IL1 and the second organic layer IS-IL2 are formed in the same manner, the processing time and cost for manufacturing the input sensing unit can be reduced. A display device including an input sensing unit according to the exemplary embodiment can have good touch sensitivity even when the display device has a reduced thickness, and this improves both the flexibility of the display device and the touch reliability.

[0168] According to an exemplary embodiment, the input sensing unit can have good touch sensitivity characteristics even when the input sensing unit has a small thickness.

[0169] According to an exemplary embodiment, the display device may include an input sensing unit with improved reliability.

[0170] While certain exemplary embodiments and examples have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. An input sensing unit, comprising: A first conductive layer, a first organic layer, a second conductive layer, and a second organic layer are stacked sequentially on top of each other. in: The first organic layer comprises a first base resin and a first hollow polymer; and The second organic layer comprises a second base resin and a second hollow polymer.

2. The input sensing unit according to claim 1, wherein: The first base resin and the second base resin comprise the same material; and The first hollow polymer and the second hollow polymer comprise the same material.

3. The input sensing unit according to claim 1, wherein, The first organic layer and the second organic layer have dielectric constants ranging from 1.3 to 3.

0.

4. The input sensing unit according to claim 3, wherein, The content of the first hollow polymer in the first organic layer and the content of the second hollow polymer in the second organic layer are each in the range of 10 wt% to 70 wt%.

5. The input sensing unit according to claim 1, wherein: The first hollow polymer includes a first shell, wherein the first shell defines a first hollow space therein; The second hollow polymer includes a second shell, wherein the second shell defines a second hollow space therein; as well as Each of the first shell and the second shell comprises at least one of polyimide, polyurethane, polystyrene, acrylic resin and epoxy resin.

6. The input sensing unit according to claim 5, wherein, The average diameter of each of the first hollow and the second hollow ranges from 20 nm to 150 nm.

7. The input sensing unit according to claim 1, wherein, At least one of the first conductive layer and the second conductive layer includes at least one of molybdenum, silver, titanium, copper, aluminum and their alloys, indium tin oxide, indium zinc oxide, zinc oxide and indium tin zinc oxide.

8. A display device, comprising: Display panel; A first conductive layer is disposed on the display panel; A first organic layer is disposed on the first conductive layer; A second conductive layer is disposed on the first organic layer; as well as The second organic layer is disposed on the second conductive layer. in: The first organic layer comprises a first base resin and a first hollow polymer; and The second organic layer comprises a second base resin and a second hollow polymer.

9. The display device according to claim 8, wherein: The first base resin and the second base resin comprise the same material; and The first hollow polymer and the second hollow polymer comprise the same material.

10. The display device according to claim 8, wherein: The display panel includes a light-emitting element layer and a thin encapsulation layer covering the light-emitting element layer; and The first conductive layer is directly disposed on the thin encapsulation layer.

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