Method and apparatus for processing substrates

Abstract

The present invention provides a method and apparatus for processing a substrate. In the substrate processing method, a liquid film is formed by supplying a processing liquid to a rotating substrate, and a wetting medium is sprayed onto the substrate in the form of fine particles to aid in the diffusion of the liquid film.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0066635, filed with the Korean Intellectual Property Office on June 2, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to a method and apparatus for processing a substrate, and more specifically, to a substrate processing method and apparatus for processing a substrate by supplying liquid to the substrate. Background Technology

[0004] Various processes, such as photolithography, etching, ashing, thin film deposition, and cleaning, are performed to manufacture semiconductor devices or flat display panels. Among these processes, photolithography involves supplying photoresist to a semiconductor substrate to form a coating film on the substrate surface, exposing the formed coating film using a mask, and supplying a developing solution to obtain the desired pattern on the substrate. In particular, to achieve a proportional reduction of the critical dimension (CD) of the pattern, the coating film formed in the coating process requires a high level of uniformity.

[0005] Usually, such as Figure 1 As shown, the process of forming a coating film on the substrate surface is performed by rotating the substrate W (such as a wafer) using a chuck 2 that supports the substrate W, and supplying photoresist PR to the rotating substrate W through a photoresist nozzle 4. The photoresist PR supplied by the photoresist nozzle 4 is supplied to the central region of the substrate W and dispersed towards the edge region of the substrate W by the centrifugal force generated by the rotation of the substrate W. Thus, the photoresist PR supplied to the substrate W forms a coating film.

[0006] When the photoresist PR used in the coating film formation process has a high viscosity (e.g., 300 cP or higher), it is difficult to uniformly form the coating film thickness. As described above, the photoresist PR supplied to the central region of the substrate W is dispersed towards the edge region of the substrate W by the centrifugal force generated by the rotation of the substrate W. However, when the photoresist PR has a high viscosity, it cannot be properly dispersed towards the edge region of the substrate W. Therefore, tearing or poor coating may occur in the formed coating film. Furthermore, the uniformity of the coating film may be significantly reduced. Since the rotational speed of the substrate W gradually increases with distance from the center of the substrate W, the above-mentioned problems occur significantly in the region adjacent to the edge region of the substrate W. Summary of the Invention

[0007] The present invention provides a substrate processing method and apparatus for effectively processing substrates.

[0008] Furthermore, embodiments of the present invention provide a substrate processing method and apparatus for improving the uniformity of liquid films formed on a substrate.

[0009] In addition, embodiments of the present invention provide a substrate processing method and apparatus for minimizing defects such as tearing and / or poor coating in a liquid film formed on a substrate.

[0010] The technical problems to be solved by the present invention are not limited to those described above, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

[0011] According to one embodiment, a method for processing a substrate is provided. In this method, a liquid film is formed by supplying a processing liquid to a rotating substrate, and a wetting medium is sprayed onto the substrate in the form of fine particles to aid in the diffusion of the liquid film.

[0012] According to one embodiment, the wetting medium can be sprayed in the form of a mist.

[0013] According to one embodiment, the wetting medium can be sprayed toward the edge region of the substrate.

[0014] According to one embodiment, the location where the wetting medium is supplied to the substrate can be further away from the center of the substrate than the location where the processing liquid is supplied to the substrate.

[0015] According to one embodiment, the wetting medium can be sprayed after the supply of the treatment liquid has started and a set time has elapsed.

[0016] According to one embodiment, after the supply of the treatment fluid is stopped, the wetting medium can be sprayed for a set period of time.

[0017] According to one embodiment, the method may include a first step of supplying a processing liquid and rotating the substrate at a first speed; and a second step of rotating the substrate at a second speed different from the first speed, wherein the wetting medium may be sprayed onto the substrate in at least one of the first step or the second step.

[0018] According to one embodiment, the method may further include a third step of rotating the substrate at a third speed higher than the first speed and the second speed, and the wetting medium may be sprayed onto the substrate in at least one of the first step, the second step, or the third step.

[0019] According to one embodiment, when the wetting medium is sprayed onto the substrate in the third step, the spraying of the wetting medium can be stopped before the end of the third step.

[0020] According to one embodiment, a method for processing a substrate is provided. In this method, a liquid film is formed by supplying a coating solution to a rotating substrate, and a wetting medium is sprayed onto the substrate in the form of fine particles, the wetting medium inhibiting the evaporation of solvent contained in the liquid film.

[0021] According to one embodiment, the wetting medium can be sprayed in the form of a mist.

[0022] According to one embodiment, the coating solution can be supplied toward the central region of the substrate, and the wetting medium can be sprayed toward the edge region of the substrate.

[0023] According to one embodiment, the duration of spraying the wetting medium and the duration of supplying the coating solution can at least partially overlap with each other.

[0024] According to one embodiment, the spraying of the wetting medium can begin later than the supply of the coating solution.

[0025] According to one embodiment, the spraying of the wetting medium can begin earlier than the supply of the coating solution.

[0026] According to one embodiment, the time to stop spraying the wetting medium can be later than the time to stop supplying the coating solution.

[0027] According to one embodiment, a method for processing a substrate is provided. In this method, a liquid film is formed by supplying a photosensitive liquid to a rotating substrate, and a thinner is sprayed in the form of a mist into a processing space to adjust the degree of evaporation of the solvent contained in the liquid film, wherein the substrate is processed in the processing space.

[0028] According to one embodiment, the diluent can be sprayed such that the concentration of the diluent per unit volume varies depending on the region of the substrate as viewed from above.

[0029] According to one embodiment, when viewed from above, the concentration of the diluent per unit volume sprayed into the processing space can be higher in the edge region of the substrate than in the center region of the substrate.

[0030] According to one embodiment, the method may include: a coating step of supplying the photosensitive liquid to a substrate rotating at a first speed; a thickness adjustment step of stopping the supply of the photosensitive liquid and rotating the substrate at a second speed lower than the first speed; and a drying step of drying the liquid film by rotating the substrate at a third speed higher than the second speed. The diluent may be sprayed into the processing space during at least one of the coating step, the thickness adjustment step, or the drying step.

[0031] According to one embodiment, an apparatus for processing a substrate includes: a support unit that supports and rotates the substrate in a processing space; a liquid supply unit that supplies processing liquid to the substrate supported on the support unit; and a wetting unit that sprays a wetting medium in the form of fine particles onto the substrate, wherein the wetting medium facilitates the diffusion of the processing liquid.

[0032] According to one embodiment, the wetting unit can spray the wetting medium toward the edge region of the substrate supported on the support unit.

[0033] According to one embodiment, the apparatus may further include a processing container having the processing space, and the wetting unit may include a wetting medium nozzle mounted on the processing container.

[0034] According to one embodiment, the wetting medium nozzle can be adjusted to spray the wetting medium toward the substrate supported on the support unit.

[0035] According to one embodiment, the device may further include: a housing having an internal space surrounding the processing space; and an airflow supply unit that supplies downward airflow into the internal space. The wetting unit may be mounted in the airflow supply unit to spray the wetting medium toward the substrate supported on the support unit.

[0036] According to one embodiment, the liquid supply unit may include: a processing liquid nozzle that supplies the processing liquid; and a first arm that supports the processing liquid nozzle; and the wetting unit may include: a wetting medium nozzle that sprays the wetting medium; and a second arm that supports the wetting medium nozzle.

[0037] According to one embodiment, the liquid supply unit may include a first arm having the processing liquid nozzle mounted on the first arm; the wetting unit may include a second arm driven independently of the first arm, and a wetting medium nozzle for spraying the wetting medium and a pre-wetting nozzle for supplying pre-wetting liquid in a flow manner may be mounted on the second arm.

[0038] According to one embodiment, the device may further include a controller that controls the support unit, the liquid supply unit, and the wetting unit, and the controller may control the liquid supply unit, the support unit, and the wetting unit to supply the processing liquid to the central region of the rotating substrate supported on the support unit and to spray the wetting medium to the edge region of the substrate supported on the support unit.

[0039] According to one embodiment, the controller can control the liquid supply unit and the wetting unit to spray the wetting medium from the processing liquid supplied to the central region of the substrate as it reaches the edge region of the substrate.

[0040] According to one embodiment, after the supply of the processing liquid begins and a set time has elapsed, the controller can control the liquid supply unit and the wetting unit to spray the wetting medium. Attached Figure Description

[0041] Referring to the following figures, the above and other objects and features will become apparent from the following description, wherein, unless otherwise stated, the same reference numerals refer to the same parts throughout the figures, and in the figures:

[0042] Figure 1 This is a view illustrating a conventional substrate processing method for forming a coating film on a substrate;

[0043] Figure 2 A schematic perspective view of a substrate processing apparatus according to an embodiment of the present invention is shown;

[0044] Figure 3 To show Figure 2 Cross-sectional views of the coating block and developing block of the substrate processing apparatus;

[0045] Figure 4 for Figure 2 A plan view of the substrate processing apparatus;

[0046] Figure 5 To show Figure 4 A view of one embodiment of a conveying robot;

[0047] Figure 6 To show Figure 4A schematic plan view of one embodiment of a heat treatment chamber;

[0048] Figure 7 for Figure 6 Front view of the heat treatment chamber;

[0049] Figure 8 To show Figure 4 A schematic view of one embodiment of a liquid handling chamber;

[0050] Figure 9 for Figure 8 A plan view of the liquid handling chamber;

[0051] Figure 10 This is a flowchart illustrating a substrate processing method according to an embodiment of the present invention;

[0052] Figure 11 To show in passing Figure 10 A view showing the RPM (rotation speed) variation of the substrate and the time of supplying the processing medium to the substrate during the process of forming a liquid film on the substrate in the substrate processing method.

[0053] Figure 12 To show the setting Figure 8 The substrate processing device in the liquid processing chamber performs Figure 10 A diagram showing the state of the pre-wetting step;

[0054] Figures 13 to 15 To show the setting Figure 8 The substrate processing device in the liquid processing chamber performs Figure 10 A diagram showing the state of the coating process;

[0055] Figures 16 to 18 A view illustrating a wetting unit according to an embodiment of the present invention;

[0056] Figures 19 to 20 A view illustrating a wetting medium injection method according to an embodiment of the present invention;

[0057] Figure 21 This is a view of a substrate processing apparatus according to another embodiment of the concept of the present invention;

[0058] Figure 22 for Figure 21 A plan view of the substrate processing apparatus;

[0059] Figure 23 This is a view of a substrate processing apparatus according to another embodiment of the concept of the present invention;

[0060] Figure 24 This is a view of a substrate processing apparatus according to another embodiment of the concept of the present invention;

[0061] Figure 25 This is a view of a substrate processing apparatus according to another embodiment of the present invention; and

[0062] Figures 26 to 33 This is a view illustrating other embodiments of the RPM variation of the substrate and the timing of supplying the processing medium to the substrate during the process of forming a liquid film on the substrate. Detailed Implementation

[0063] Hereinafter, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement the inventive concept. However, the inventive concept can be implemented in various different forms and is not limited to the embodiments described herein. Furthermore, in describing embodiments of the inventive concept, detailed descriptions relating to known functions or configurations will be omitted where such descriptions might unnecessarily obscure the subject matter of the inventive concept. Additionally, components performing similar functions and operations are provided with the same reference numerals throughout the drawings.

[0064] The terms "include" and "comprise" in this specification are open-ended expressions, used only to indicate the presence of the corresponding components, and do not exclude the possibility of including additional components unless otherwise specified. In particular, it should be understood that when used herein, the terms "include," "comprise," and "have" specifically refer to the presence of the stated feature, integer, step, operation, component, and / or part, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts, and / or groups thereof.

[0065] Unless otherwise stated, singular terms may include plural forms. Furthermore, in the accompanying drawings, the shape and size of components may be exaggerated for clarity.

[0066] The substrate processing apparatus according to an embodiment of the present invention will be described in detail below. Figure 2 This is an exemplary perspective view illustrating a substrate processing apparatus according to an embodiment of the present invention. Figure 3 To show Figure 2 Cross-sectional view of the coating block and developing block of the substrate processing apparatus. Figure 4 for Figure 2 A plan view of the substrate processing apparatus.

[0067] Reference Figures 2 to 4According to an embodiment of the present invention, a substrate processing apparatus 10 includes an index module 100, a processing module 300, and an interface module 500. According to one embodiment, the index module 100, the processing module 300, and the interface module 500 are arranged in a row in sequence. Hereinafter, the direction in which the index module 100, the processing module 300, and the interface module 500 are arranged is referred to as a first direction 12, the direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and the direction perpendicular to both the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0068] The indexing module 100 transfers the substrate W from a carrier F, in which the substrate W is received, to the processing module 300, and places the fully processed substrate W in the carrier F. The indexing module 100 is configured such that its longitudinal direction is parallel to the second direction 14. The indexing module 100 has a loading port 110 and an index frame 130. The loading port 110 is located on the opposite side of the processing module 300 relative to the index frame 130. The carrier F, in which the substrate W is received, is placed on the loading port 110. The loading port 110 can be positioned along the second direction 14.

[0069] For example, an airtight carrier F for a front-opening unified pod (FOUP) can be used as carrier F. Carrier F can be placed on loading port 110 by means of a conveyor such as an overhead conveyor, a conveyor unit of an overhead conveyor (not shown), an automated guided vehicle, or by an operator.

[0070] An indexing robot 132 is disposed within an indexing frame 130. A guide rail 136 is disposed within the indexing frame 130, the longitudinal direction of the guide rail being parallel to the second direction 14. The indexing robot 132 is movable on the guide rail 136. The indexing robot 132 includes a hand 134, on which a base plate W is placed. The hand 134 is movable forward or backward, rotatable about an axis facing the third direction 16, and movable along the third direction 16.

[0071] The processing module 300 can perform coating and developing processes on the substrate W. The processing module 300 has a coating block (COT) 300a and a developing block (DEV) 300b. The coating block 300a performs the coating process on the substrate W, and the developing block 300b performs the developing process on the substrate W. The coating blocks 300a are stacked on top of each other. The developing blocks 300b are stacked on top of each other. Figure 2One embodiment includes two coating blocks 300a and two developing blocks 300b. The coating blocks 300a may be positioned below the developing blocks 300b. According to one embodiment, the two coating blocks 300a can perform the same process and may have the same structure. Similarly, the two developing blocks 300b can perform the same process and may have the same structure.

[0072] Reference Figure 4 Each coating block 300a has a heat treatment chamber 320, a transfer chamber 350, a liquid processing chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 performs a heat treatment process on the substrate W. The heat treatment process may include a cooling process and a heating process. The liquid processing chamber 360 forms a liquid film on the substrate W by supplying liquid onto the substrate W. The liquid film may be a photoresist film or an anti-reflection film. In the coating block 300a, the transfer chamber 350 transfers the substrate W between the heat treatment chamber 320 and the liquid processing chamber 360.

[0073] A transfer chamber 350 is configured such that its longitudinal direction is parallel to the first direction 12. A transfer robot 352 is disposed in the transfer chamber 350. The transfer robot 352 transfers the substrate W between the heat treatment chamber 320, the liquid treatment chamber 360, and the buffer chambers 312 and 316. According to one embodiment, the transfer robot 352 has a hand 354 on which the substrate W is placed, and the hand 354 is movable forward and backward, rotatable about an axis toward the third direction 16, and movable along the third direction 16. A guide rail 356 is disposed in the transfer chamber 350, the longitudinal direction of the guide rail being parallel to the first direction 12, and the transfer robot 352 is movable on the guide rail 356.

[0074] Figure 5 To show Figure 4 A view of one embodiment of the hand of a transfer robot. (Refer to...) Figure 5 The hand portion 354 has a base 3541 and a support protrusion 3543. The base 3541 may have an annular ring shape, and the circumference of the base 3541 is partially curved. The base 3541 has an inner diameter larger than the diameter of the substrate W. The support protrusion 3543 extends inward from the base 3541. The support protrusion 3543 supports the edge region of the substrate W. According to one embodiment, four support protrusions 3543 may be provided at equal intervals.

[0075] The heat treatment chamber 320 is arranged along the first direction 12. The heat treatment chamber 320 is located on one side of the transfer chamber 350.

[0076] Figure 6 To show Figure 4 A schematic plan view of one embodiment of the heat treatment chamber, and Figure 7 for Figure 6 Front view of the heat treatment chamber. (Refer to...) Figure 6 and Figure 7 The heat treatment chamber 320 has a housing 3210, a cooling unit 3220, a heating unit 3230, and a conveyor plate 3240.

[0077] The housing 3210 has a generally rectangular parallelepiped shape. The housing 3210 has an inlet / outlet opening (not shown) in its sidewall through which the substrate W enters or exits the housing 3210. This inlet / outlet opening can remain open. Optionally, a door (not shown) can be provided to open and close the inlet / outlet opening. A cooling unit 3220, a heating unit 3230, and a transfer plate 3240 are disposed within the housing 3210. The cooling unit 3220 and the heating unit 3230 are arranged side-by-side along a second direction 14. According to one embodiment, the cooling unit 3220 may be located closer to the transfer chamber 350 than the heating unit 3230.

[0078] The cooling unit 3220 has a cooling plate 3222. When viewed from above, the cooling plate 3222 may have a generally circular shape. A cooling member 3224 is disposed inside the cooling plate 3222. According to one embodiment, the cooling member 3224 may be formed inside the cooling plate 3222 and may serve as a fluid channel through which cooling fluid flows.

[0079] The heating unit 3230 includes a heating plate 3232, a cover 3234, and a heater 3233. When viewed from above, the heating plate 323 may have a generally circular shape. The heating plate 3232 has a diameter larger than that of the substrate W. The heating plate 3232 is equipped with the heater 3233. The heater 3233 may be implemented with a resistance heating element to which current is applied. The heating plate 3232 has a lifting pin 3238 that is vertically movable along a third direction 16. The lifting pin 3238 receives the substrate W from a transfer unit outside the heating unit 3230 and places the substrate W downwards onto the heating plate 3232, or lifts the substrate W from the heating plate 3232 and transfers the substrate W to a transfer unit outside the heating unit 3230. According to one embodiment, three lifting pins 3238 may be provided. The cover 3234 has a space therein, which is open at the bottom. The sleeve 3234 is located above the heating plate 3232 and moves vertically via the actuator 3236. The sleeve 3234 is moved so that the space formed together with the heating plate 3232 is used as a heating space, in which the substrate W is heated.

[0080] The conveyor plate 3240 has a generally circular plate shape and a diameter corresponding to the diameter of the substrate W. The conveyor plate 3240 has notches 3244 formed at its edges. The notches 3244 may have a shape corresponding to the support protrusions 3543 formed on the hand portion 354 of the aforementioned conveying robot 352. Furthermore, as many notches 3244 as the support protrusions 354 formed on the hand portion 354 are formed in positions corresponding to the support protrusions 354. The substrate W is conveyed between the hand portion 354 and the conveyor plate 3240 when their vertical positions, aligned with each other in the up / down direction, change. The conveyor plate 3420 can be mounted on a guide rail 3249 and can be moved along the guide rail 3249 between a first region 3212 and a second region 3214 by an actuator 3246. A plurality of slit-shaped guide grooves 3242 are formed in the conveyor plate 3240. Guide grooves 3242 extend inward from the edge of conveyor plate 3240. The longitudinal direction of guide grooves 3242 is parallel to the second direction 14, and guide grooves 3242 are positioned to be spaced apart from each other along the first direction 12. Guide grooves 3242 prevent conveyor plate 3240 and lifting pin 3238 from interfering with each other when the substrate W is conveyed between conveyor plate 3240 and heating unit 3230.

[0081] The substrate W is cooled while in contact with the cooling plate 3222 via a transfer plate 3240 on which the transfer plate 3240 is placed. To effectively transfer heat between the cooling plate 3222 and the substrate W, the transfer plate 3240 is formed of a material with high thermal conductivity. According to one embodiment, the transfer plate 3240 may be formed of a metallic material.

[0082] Heating units 3230 disposed in some of the heat treatment chambers 3200 can improve the adhesion of photoresist to the substrate W by supplying gas while the substrate is heated. According to one embodiment, the gas can be hexamethyldisilane gas.

[0083] Some of the liquid handling chambers 360 can be stacked on top of each other. The liquid handling chambers 360 are located on one side of the transfer chamber 350. The liquid handling chambers 360 are arranged side-by-side along a first direction 12. Some of the liquid handling chambers 360 are located near the index module 100. Hereinafter, these liquid handling chambers 360 are referred to as front liquid handling chambers 362. Other liquid handling chambers 360 are located near the interface module 500. Hereinafter, these liquid handling chambers 360 are referred to as rear liquid handling chambers 364.

[0084] Each pre-liquid processing chamber 362 applies a first liquid to the substrate W, and each post-liquid processing chamber 364 applies a second liquid to the substrate W. The first liquid and the second liquid can be different types of liquids. According to one embodiment, the first liquid is an antireflection film, and the second liquid is photoresist. The photoresist can be applied to the substrate W coated with the antireflection film. Alternatively, the first liquid can be photoresist, and the second liquid can be an antireflection film. In this case, the antireflection film can be applied to the substrate W coated with photoresist. Alternatively, the first liquid and the second liquid can be of the same type. Both the first liquid and the second liquid can be photoresist.

[0085] Figure 8 To show Figure 4 A schematic view of one embodiment of a liquid handling chamber, and Figure 9 for Figure 8 A plan view of the liquid handling chamber. (Refer to...) Figure 8 and Figure 9 A substrate processing apparatus 1000 for processing substrate W can be provided in a liquid processing chamber 360. The substrate processing apparatus 1000 for performing liquid processing on substrate W can be provided in the liquid processing chamber 360.

[0086] The substrate processing apparatus 1000 disposed in the liquid processing chamber 360 may include a housing 1100, a processing container 1200, a support unit 1300, an airflow supply unit 1400, a liquid supply unit 1500, a wetting unit 1600, and a controller 1900.

[0087] The housing 1100 may have an internal space 1102. The housing 1100 may have a rectangular container shape with the internal space 1102. An opening (not shown) may be formed in the sidewall of the housing 1100. This opening serves as an inlet / outlet opening through which the substrate W enters or exits the internal space 1102. Furthermore, to selectively open or close the opening, a door (not shown) may be provided in the area adjacent to the opening. When a processing step is performed on the substrate W placed in the internal space 1102, the door can close the opening to seal the internal space 1102 from the outside.

[0088] The processing container 1200 may be disposed within the internal space 1102. The processing container 1200 may have a processing space 1202. That is, the processing container 1200 may be a bowl with a processing space 1202. Therefore, the internal space 1102 may surround the processing space 1202. The processing container 1200 may have a cup shape that is open at the top. The processing space 1202 of the processing container 1200 may be the space where the support unit 1300 (described below) supports and rotates the substrate W. The processing space 1202 may be the space where the liquid supply unit 1500 and the wetting unit 1600 supply processing media to process the substrate W.

[0089] The processing container 1200 includes an inner cup 1210 and an outer cup 1230. The outer cup 1230 may surround the support unit 1300, and the inner cup 1210 may be located inside the outer cup 1230. When viewed from above, the inner cup 1210 and the outer cup 1230 may each have an annular shape. The space between the inner cup 1210 and the outer cup 1230 may be used as a recycling channel through which processing media introduced into the processing space 1202 are recycled.

[0090] When viewed from above, the inner cup 1210 may have a shape around a rotation axis 1330 of the support unit 1300 (described below). For example, when viewed from above, the inner cup 1210 may have a circular plate shape around the rotation axis 1330. When viewed from above, the inner cup 1210 may be positioned to overlap with the discharge port 1120 connected to the housing 1100. The inner cup 1210 may have an interior and an exterior. The upper surfaces of the interior and exterior may have different angles relative to a virtual horizontal line. For example, when viewed from above, the interior may be positioned to overlap with the support plate 1310 of the support unit 1300 (described below). The interior may be positioned facing the rotation axis 1330. The upper surface of the interior may slope upward away from the rotation axis 1330, and the exterior may extend outward from the interior. The upper surface of the exterior may slope downward away from the rotation axis 1330. The upper end of the interior may coincide with the lateral end portion of the substrate W in the up / down direction. According to the implementation scheme, the point where the inner and outer surfaces meet can be located lower than the upper end of the inner surface. The point where the inner and outer surfaces meet can be rounded. The outer surface can be combined with the outer cup 1230 to form a recovery channel through which the processing medium, such as the processing liquid and wetting medium, is recovered.

[0091] The outer cup 1230 may have a cup shape surrounding the support unit 1300 and the inner cup 1210. The outer cup 1230 may have a bottom 1232, a side portion 1234, and an inclined portion 1236. The bottom 1232 may have a circular plate shape with empty space. A recycling line 1238 may be connected to the bottom 1232. The recycling line 1238 may be used to recycle the processing medium supplied to the substrate W. The processing medium recycled by the recycling line 1238 may be reused by an external regeneration system. The side portion 1234 may have an annular shape surrounding the support unit 1300. The side portion 1234 may extend vertically from the lateral end of the bottom 1232. The side portion 1234 may extend upward from the bottom 1232.

[0092] The inclined portion 1236 may extend from the upper end of the side portion 1234 in a direction toward the central axis of the outer cup 1230. The inner surface of the inclined portion 1236 may be inclined upward to be close to the support unit 1300. The inclined portion 1236 may have a ring shape. When processing is performed on the substrate W, the upper end of the inclined portion 1236 may be located at a higher position than the substrate W supported on the support unit 1300.

[0093] The internal lifting member 1242 and the external lifting member 1244 can raise or lower the inner cup 1210 and the outer cup 1230, respectively. The internal lifting member 1242 and the external lifting member 1244 can be connected to the inner cup 1210 and the outer cup 1230 to raise or lower the inner cup 1210 and the outer cup 1230, respectively.

[0094] Support unit 1300 can support and rotate substrate W. Support unit 1300 can be a chuck for supporting and rotating substrate W. Support unit 1300 may include support plate 1310, rotation shaft 1330, and rotation actuator 1350. Support plate 1310 may have a mounting surface on which substrate W is placed. When viewed from above, support plate 1310 may have a generally circular shape. When viewed from above, support plate 1310 may have a diameter smaller than substrate W. Suction holes (not shown) may be formed in support plate 1310, and support plate 1310 may clamp substrate W by vacuum pressure. Optionally, support plate 1310 may include an electrostatic plate (not shown), and substrate W may be clamped by electrostatic attraction. Optionally, support plate 1310 may include support pins for supporting substrate W, and support pins may physically contact substrate W to clamp substrate W.

[0095] The rotating shaft 1330 can be connected to the support plate 1310. The rotating shaft 1330 can be connected to the lower surface of the support plate 1310. The rotating shaft 1330 can be configured such that its longitudinal direction is parallel to the up / down direction. The rotating shaft 1330 can be rotated by power transmitted from the rotary actuator 1350. Therefore, the rotating shaft 1330 can rotate the support plate 1310. The rotary actuator 1350 can change the rotational speed of the rotating shaft 1330. The rotary actuator 1350 can be an electric motor providing the driving force. However, it is not limited to this; the rotary actuator 1350 can be implemented using various known devices for providing the driving force.

[0096] Airflow supply unit 1400 supplies airflow to the interior space 1102. Airflow supply unit 1400 supplies downward airflow to the interior space 1102. Airflow supply unit 1400 supplies temperature- and / or humidity-regulated airflow to the interior space 1102. Airflow supply unit 1400 can be mounted within housing 1100. Airflow supply unit 1400 can be positioned above processing container 1200 and support unit 1300. Airflow supply unit 1400 may include fan 1410, airflow supply line 1430, and filter 1450. Airflow supply line 1430 supplies temperature- and / or humidity-regulated external airflow to the interior space 1102. Filter 1450 can be connected in series (in-line) with airflow supply line 1430 and can remove impurities contained in the external airflow flowing in airflow supply line 1430. In addition, when in operation, the fan 1410 can evenly deliver the external airflow supplied by the airflow supply line 1430 into the internal space 1102.

[0097] The liquid supply unit 1500 can supply a processing liquid PR to the substrate W supported on the support unit 1300. The processing liquid PR supplied to the substrate W by the liquid supply unit 1500 can be a coating solution. For example, the coating solution can be a photosensitive liquid, such as photoresist. Furthermore, the liquid supply unit 1500 can supply a pre-wetting liquid TH to the substrate W supported on the support unit 1300. The pre-wetting liquid TH supplied to the substrate W by the liquid supply unit 1500 can be a liquid that can change the surface properties of the substrate W. For example, the pre-wetting liquid TH can be a diluent that can change the surface properties of the substrate W to hydrophobic.

[0098] The liquid supply unit 1500 may include a pre-wetting nozzle 1510, a processing liquid nozzle 1530, a first arm 1540, a first guide rail 1550, and a first actuator 1560.

[0099] The pre-wetting nozzle 1510 can supply the aforementioned pre-wetting liquid TH to the substrate W. The pre-wetting nozzle 1510 can supply the pre-wetting liquid TH to the substrate W in a flow manner. The pre-wetting nozzle 1530 can supply the aforementioned processing liquid PR to the substrate W. The processing liquid nozzle 1530 can be a coating solution nozzle, which supplies a coating solution such as the aforementioned photoresist. The processing liquid nozzle 1530 can supply the processing liquid PR to the substrate W in a flow manner.

[0100] The first arm 1540 can support the pre-wetting nozzle 1510 and the processing fluid nozzle 1530. The pre-wetting nozzle 1510 and the processing fluid nozzle 1530 can be mounted on one end of the first arm 1540. The pre-wetting nozzle 1510 and the processing fluid nozzle 1530 can be mounted on the lower surface of one end of the first arm 1540. When viewed from above, the pre-wetting nozzle 1510 and the processing fluid nozzle 1530 can be arranged in a direction parallel to the longitudinal direction of the first guide rail 1550 (described below). The opposite ends of the first arm 1540 can be coupled to the first actuator 1560. The first arm 1540 can be moved by the first actuator 1560, which moves the first arm 1540. Therefore, the position of the pre-wetting nozzle 1510 and the processing fluid nozzle 1530 mounted on the first arm 1540 can be changed. The first arm 1540 can be guided along the first guide rail 1550, on which the first actuator 1560 is mounted. The first guide rail 1550 can be configured such that its longitudinal direction is parallel to the horizontal direction. For example, the first guide rail 1550 can be configured such that its longitudinal direction is parallel to the first direction 12. Optionally, the first arm 1540 can be coupled to a rotating shaft whose longitudinal direction is parallel to the third direction 16. The rotating shaft can be rotated by an actuator. Therefore, the positions of the pre-wetting nozzle 1510 and the treatment fluid nozzle 1530 mounted on the first arm 1540 can be changed.

[0101] The wetting unit 1600 can spray the wetting medium M into the processing space 1202 of the processing container 1200. For example, the wetting unit 1600 can spray the wetting medium M into the processing space 1202 in a direction toward the upper surface of the substrate W. Furthermore, the wetting unit 1600 can spray the wetting medium M into the region of the processing space 1202 facing the upper surface of the substrate W. For example, the wetting unit 1600 can spray the wetting medium M into the region above the substrate W in the processing space 1202.

[0102] The wetting unit 1600 can be mounted on the processing container 1200 to spray the wetting medium M toward the substrate W supported on the support unit 1300. For example, the wetting unit 1600 can be mounted on the processing container 1200 to spray the wetting medium M toward the edge region of the substrate W supported on the support unit 1300. Furthermore, the wetting unit 1600 can be mounted on the inclined portion 1236 of the processing container 1200. Additionally, the wetting unit 1600 can be mounted on the outer surface of the inclined portion 1236 of the processing container 1200.

[0103] The wetting unit 1600 may include a wetting medium nozzle 1610 and a support portion 1630. The support portion 1630 may be mounted on the processing container 1200. The support portion 1630 may be mounted on the outer cup 1230 of the processing container 1200. The support portion 1630 may be mounted on the outer surface of the outer cup 1230. The support portion 1630 may be mounted on the inclined portion 1236 of the outer cup 1230. The support portion 1630 may be mounted at the distal end of the inclined portion 1236. The wetting medium nozzle 1610 may be mounted on the processing container 1200 via the support portion 1630. Furthermore, at least one wetting unit 1600 may be provided. For example, multiple wetting units 1600 may be provided. Multiple wetting units 1600 may be mounted on the processing container 1200. When multiple wetting units 1600 are provided, when viewed from above, the wetting units 1600 may be mounted on the processing container 1200 at predetermined intervals. For example, four wetting units 1600 can be set.

[0104] The wetting medium nozzle 1610 can be configured to spray the wetting medium M into the processing space 1202 of the processing container 1200. The wetting medium nozzle 1610 can be configured to spray the wetting medium M into the processing space 1202 in a direction toward the substrate W. The wetting medium nozzle 1610 can also be configured to spray the wetting medium M into the processing space 1202 in a direction toward the edge region of the substrate W. The wetting medium nozzle 1610 can be configured to tilt downwards so that the dispensing end faces the substrate W. Therefore, the wetting medium M can be sprayed into the edge region of the substrate W and / or the region in the processing space 1202 facing the edge region of the substrate W.

[0105] Furthermore, the wetting medium nozzle 1610 can be configured to spray the wetting medium M in the form of fine particles. For example, the wetting medium nozzle 1610 can be configured to spray the wetting medium M in the form of a mist.

[0106] The wetting medium M sprayed by the wetting unit 1600 can be a medium that helps the processing liquid PR diffuse on the substrate W. The wetting medium M can also be a medium that inhibits the evaporation of solvents contained in the liquid film formed on the substrate W. Furthermore, the wetting medium M can be a medium that regulates the degree of evaporation of solvents contained in the coating solution supplied to the substrate W. For example, the wetting medium M can be a diluent.

[0107] The controller 1900 can control the substrate processing apparatus 10. For example, the controller 1900 can control the substrate processing apparatus 1000 disposed in the liquid processing chamber 360. The controller 1900 can control the substrate processing apparatus 1000 to perform a liquid processing process on the substrate W in the liquid processing chamber 360. The controller 1900 can control the substrate processing apparatus 1000 to perform a coating process for forming a liquid film on the substrate W in the liquid processing chamber 360. For example, the controller 1900 can control the processing container 1200, the support unit 1300, the airflow supply unit 1400, the liquid supply unit 1500, and the wetting unit 1600. For example, controller 1900 can control support unit 1300, liquid supply unit 1500, and wetting unit 1600, such that support unit 1300 supports and rotates substrate W, liquid supply unit 1500 supplies pre-wetting liquid TM or processing liquid PR to substrate W, and wetting unit 1600 sprays wetting medium M into processing space 1202. Furthermore, controller 1900 can control substrate processing apparatus 10 to perform the substrate processing method described below. Additionally, controller 1900 can control substrate processing apparatus 1000 to perform the liquid film formation method described below.

[0108] The substrate processing method according to an embodiment of the present invention will be described in detail below. The substrate processing method according to an embodiment of the present invention can be a method of forming a liquid film on a substrate W by supplying a processing liquid PR to the substrate W. However, it is not limited thereto; the substrate processing method according to an embodiment of the present invention can be applied in the same or similar way to various processes that require liquid processing of the substrate W.

[0109] Figure 10 This is a flowchart illustrating a substrate processing method according to an embodiment of the present invention, and Figure 11 To show in passing Figure 10 A view of the RPM variation of the substrate and the time of supplying the processing medium to the substrate during the process of forming a liquid film on the substrate in the substrate processing method.

[0110] Reference Figure 10 and Figure 11 The substrate processing method according to the embodiment of the present invention may include a pre-wetting step S00, a coating step S10, a thickness adjustment step S20, and a drying step S30.

[0111] The pre-wetting step S00 can be a step of changing the surface of the substrate W to a wetted state. In the pre-wetting step S00, the pre-wetting nozzle 1510 can supply pre-wetting liquid TH to the substrate W. In the pre-wetting step S00, the substrate W can rotate at a free speed Vp, and the wetting nozzle 1510 can supply pre-wetting liquid TH to the central region of the rotating substrate W. Figure 12 In the pre-wetting step S00, the pre-wetting nozzle 1510 can supply the pre-wetting liquid TH in a flow manner to the central region of the rotating substrate W. Figure 11 An embodiment is shown where the free velocity Vp is lower than the first velocity V1, which is the rotational speed of the substrate W in the pre-wetting step S00, and the first velocity is the rotational speed of the substrate W in the coating step S10. However, it is not limited to this, and the free velocity Vp can be changed to various velocities.

[0112] The coating step (or first step) S10 can be a step of forming a liquid film on the substrate W by supplying the processing liquid PR to the substrate W. In the coating step S10, the processing liquid nozzle 1530 can supply the processing liquid PR to the central region of the substrate W. Figure 13 When the processing liquid PR is supplied to the substrate W by the processing liquid nozzle 1530, the substrate W can rotate at a first speed V1. The processing liquid PR supplied to the central region of the rotating substrate W can be dispersed from the central region of the substrate W to the edge region of the substrate W by centrifugal force. When the processing liquid PR supplied by the processing liquid nozzle 1530 has a high viscosity (e.g., 300 cP or higher), the processing liquid PR may not be properly dispersed to the edge region of the substrate W.

[0113] To solve this problem, in the substrate processing method according to an embodiment of the present invention, the wetting unit 1600 can spray the wetting medium M into the processing space 1202 of the processing container 1200. Figure 14 The duration of spraying the wetting medium M and the duration of supplying the processing liquid PR can at least partially overlap. Furthermore, the location where the wetting medium M is sprayed onto the substrate W can be further away from the center of the substrate W than the location where the processing liquid PR is supplied to the substrate W. For example, the wetting unit 1600 can spray the wetting medium M into the processing space 1202 in a direction toward the edge region of the substrate W. Since the wetting medium M is sprayed through the wetting unit 1600, the concentration of the wetting medium M per unit volume can vary depending on the region of the substrate W when viewed from above. For example, when viewed from above, the concentration of the wetting medium M per unit volume sprayed into the processing space 1202 can be higher in the edge region of the substrate W than in the center region of the substrate W.

[0114] In the substrate processing method of an embodiment of the present invention, the wetting unit 1600 can spray a wetting medium M in the form of fine particles (e.g., mist) into the processing space 1202 in a direction toward the edge region of the substrate W. The wetting unit 1600 can spray the wetting medium M when the processing liquid PR supplied to the substrate W reaches the edge region of the substrate W. For example, the wetting unit 1600 can spray the wetting medium M after the processing liquid PR has been supplied and a set time has elapsed. For example, the time at which the spraying of the wetting medium M begins can be later than the time at which the processing liquid PR has been supplied.

[0115] Alternatively, the wetting unit 1600 can spray the wetting medium M based on a sensing signal generated by a sensor (not shown), which is disposed in the substrate processing apparatus 1000 and senses whether the processing liquid PR has reached the edge region of the substrate W. When the processing liquid PR reaches the edge region of the substrate W, the wetting medium M can be continuously sprayed. Figure 15 In other words, the time to stop spraying the wetting medium M can be later than the time to stop supplying the treatment fluid PR. That is, after stopping the supply of the treatment fluid PR, the wetting medium M can be sprayed for a set period of time.

[0116] The wetting medium M can regulate the degree of evaporation of the solvent contained in the liquid film formed by the processing liquid PR. For example, the wetting medium M can be provided as a medium for dissolving the processing liquid PR (such as photoresist) and can wet the processing liquid PR, which is an organic material. The wetting medium M can regulate the degree of evaporation of the solvent contained in the liquid film formed by the processing liquid PR. For example, the wetting medium M can suppress the evaporation of the solvent contained in the liquid film formed by the processing liquid PR. The solvent contained in the processing liquid PR can promote the adhesion of the processing liquid PR to the substrate W, and in the substrate processing method according to an embodiment of the present invention, the wetting medium M can be sprayed in the coating step S10 so that the solvent contained in the processing liquid PR does not evaporate but remains in the processing liquid PR, thereby minimizing the loss of adhesion between the processing liquid PR and the substrate W. Therefore, the uniformity of the liquid film formed on the substrate W (e.g., thickness uniformity) can be ensured, and problems such as tearing of the liquid film and poor coating caused by improper diffusion of the processing liquid PR can be minimized.

[0117] Furthermore, when the wetting medium M is sprayed in a stream onto the edge region of the substrate W, the liquid film formed by the wetting medium M may collide with the liquid film formed by the processing liquid PR, potentially hindering the uniform coating of the processing liquid PR. However, the substrate processing method according to an embodiment of the present invention can spray the wetting medium M in the form of a mist, thereby minimizing defects caused by the aforementioned film collisions. Additionally, by spraying the wetting medium M in the form of a mist into the processing space 1202, the substrate processing method according to an embodiment of the present invention can change the atmosphere in the processing space 1202 to an atmosphere where the processing liquid PR can easily diffuse, thereby more effectively ensuring the uniformity of the liquid film and minimizing problems such as tearing and / or poor coating.

[0118] Refer again Figure 10 and Figure 11 In the thickness adjustment step (or second step) S20, the thickness of the liquid film formed by the processing liquid PR supplied to the substrate W can be adjusted. In the thickness adjustment step S20, the supply of the processing liquid PR can be stopped, and the substrate W can be rotated at a second speed V2. The second speed V2 can be lower than the first speed V1. Therefore, in the thickness adjustment step S20, the liquid film can move in a direction from the edge region of the substrate W toward the center region of the substrate W.

[0119] The drying step (or third step) S30 can be a step of drying the liquid film formed on the substrate W. In the drying step S30, the substrate W can rotate at a third speed V3. The third speed V3 can be higher than the first speed V1 and / or the second speed V2. When performing the drying step S30, the third speed V3 can be changed.

[0120] Although the dispensing end of the wetting medium nozzle 1610 has been shown to face the edge region of the substrate W, the inventive concept is not limited thereto. For example, the wetting medium nozzle 1610 can be configured to adjust the spraying area of ​​the wetting medium M sprayed toward the substrate W supported on the support unit 1300. In this case, the wetting medium nozzle 1610 can selectively spray the wetting medium M toward the central region or the edge region of the substrate W. The adjustment of the spraying area can be performed when the processing liquid PR is supplied to the substrate W.

[0121] like Figure 16 As shown, the dispensing end of the wetting medium nozzle 1610a, which is connected to the support portion 1630a, can be configured to be rotatable and the spray angle can be changed. The wetting unit 1600a can selectively spray the wetting medium M onto the center region or the edge region of the substrate W.

[0122] like Figure 17As shown, the wetting medium nozzle 1610b connected to the support portion 1630b can be configured to selectively change the spray range of the wetting medium M from "A" to "B" or from "B" to "A". Furthermore, in Figures 16 to 17 The embodiments of the inventive concept shown can be combined with each other.

[0123] Although an example has been shown of the wetting medium nozzle 1610 being fixedly connected to the processing container 1200 via the support portion 1630, the inventive concept is not limited thereto. For example, as Figure 18 As shown, the support portion 1630c can be configured to raise or lower the wetting medium nozzle 1610c in the up / down direction. The wetting unit 1600c can selectively spray the wetting medium M onto the center region or the edge region of the substrate W. Furthermore, in Figure 18 The embodiments of the inventive concept shown are, and Figure 16 and Figure 17 The embodiments of the inventive concept shown can be combined with each other.

[0124] Figure 19 and Figure 20 A view illustrating a wetting medium injection method according to an embodiment of the present invention. (Refer to...) Figure 19 and Figure 20 The wetting unit 1600c can spray a wetting medium M such that, when viewed from above, the concentration of the wetting medium M per unit volume varies depending on the region of the substrate W. For example, when the wetting unit 1600c sprays the wetting medium M onto the edge region of the substrate W when viewed from above, the wetting unit 1600c can spray the wetting medium M such that the concentration of the wetting medium M per unit volume is equal to a first concentration. For example, when the wetting unit 1600c sprays the wetting medium M onto the center region of the substrate W when viewed from above, the wetting unit 1600c can spray the wetting medium M such that the concentration of the wetting medium M per unit volume is equal to a second concentration. The second concentration may be less than the first concentration.

[0125] Although the wetting unit 1600 has been illustrated as mounted on the processing container 1200, the inventive concept is not limited thereto. For example, as Figure 21 and Figure 22 As shown, the wetting unit 1600d may include a wetting medium nozzle 1610d, a second arm 1640d, a second guide rail 1650d, and a second actuator 1660d.

[0126] The second arm 1640d can support the wetting medium nozzle 1610d. The wetting medium nozzle 1610d can be mounted on one end of the second arm 1640d. The wetting medium nozzle 1610d can be mounted on the lower surface of one end of the second arm 1640d. When viewed from above, the opposite end of the second arm 1640d can be connected to the second actuator 1660d. The second arm 1640d can be moved by the second actuator 1660d, which moves the second arm 1640d. Therefore, the position of the wetting medium nozzle 1610d mounted on the second arm 1640d can be changed. The second arm 1640d can be guided along the second guide rail 1650d, on which the second actuator 1660d is mounted. The second guide rail 1650d can be configured such that the longitudinal direction of the second guide rail 1650d is parallel to the horizontal direction. Optionally, the second arm 1640d can be coupled to a rotating shaft whose longitudinal direction is parallel to the third direction 16. The rotating shaft can be rotated by an actuator. Therefore, the position of the wetting medium nozzle 1610d mounted on the second arm 1640d can be changed. Furthermore, the wetting unit 1600d and the liquid supply unit 1500 can be driven independently of each other.

[0127] Although the wetting unit 1600 has been illustrated as mounted on the processing container 1200, the inventive concept is not limited thereto. For example, as Figure 23 As shown, the wetting medium nozzle 1610e of the wetting unit can be mounted on the liquid supply unit 1500. For example, the wetting medium nozzle 1610e can be mounted on the lower surface of the first arm 1540 included in the liquid supply unit 1500.

[0128] Although the wetting unit 1600 has been illustrated as mounted on the processing container 1200, the inventive concept is not limited thereto. For example, as Figure 24 As shown, the wetting unit 1600f can be installed in the airflow supply unit 1400. The fan 1410 of the airflow supply unit 1400 can be installed in a region corresponding to the central region of the substrate W supported on the support unit 1300, and the wetting unit 1600f can be installed in a region corresponding to the edge region of the substrate W supported on the support unit 1300. Furthermore, when the wetting unit 1600f is installed in the airflow supply unit 1400, the wetting unit 1600f can have a structure that sprays a wetting medium M and an airflow, the temperature and / or humidity of which are regulated. For example, the wetting unit 1600f can be configured to mix and supply the wetting medium M and the airflow.

[0129] Although the wetting unit 1600 has been illustrated as mounted on the processing container 1200, the inventive concept is not limited thereto. For example, as Figure 25As shown, the processing liquid nozzle 1530 can be mounted on and supported by the first arm 1540, and the pre-wetting nozzle 1510 and the wetting nozzle 1610f can be mounted on and supported by the second arm 1640f. The pre-wetting nozzle 1510 can be configured to supply pre-wetting liquid TH in a flow form, and the wetting nozzle 1610f can be configured to spray the wetting medium M in a mist form. Furthermore, the first arm 1540 and the second arm 1640f can be driven independently of each other. In this case, in the pre-wetting step S00, the second arm 1640f can move the pre-wetting nozzle 1510 to a region above the central region of the substrate W, and the pre-wetting nozzle 1510 can supply the pre-wetting liquid TH to the central region of the substrate W. Furthermore, in the coating step S10, the second arm 1640f can move the wetting nozzle 1610f to the area above the edge region of the substrate W, and the wetting nozzle 1610f can spray the wetting medium M onto the edge region of the substrate W.

[0130] Although the wetting unit 1600 has been exemplified as being mounted on the processing container 1200, the inventive concept is not limited thereto. The wetting unit 1600 may be mounted on the inner wall of the housing 1100. For example, the wetting unit 1600 may be mounted on the inner wall of the housing 1100 at a position corresponding to the edge region of the substrate W supported on the support unit 1300.

[0131] Although it has been exemplified that in coating step S10, the liquid supply unit 1500 supplies the processing liquid PR, and the wetting unit 1600 sprays the wetting medium M from the processing liquid PR as it reaches the edge region of the substrate W, the inventive concept is not limited thereto. For example, as... Figure 26 As shown, the wetting unit 1600 can spray the wetting medium M into the processing space 1202 before the liquid supply unit 1500 supplies the processing liquid PR (before the coating step S10 begins). That is, the time when the spraying of the wetting medium M begins can be earlier than the time when the processing liquid PR begins to be supplied.

[0132] Although it has been exemplified that in coating step S10, the liquid supply unit 1500 supplies the processing liquid PR, and the wetting unit 1600 sprays the wetting medium M from the processing liquid PR as it reaches the edge region of the substrate W, the inventive concept is not limited thereto. For example, as... Figure 27 As shown, the wetting unit 1600 can spray the wetting medium M into the processing space 1202, while the liquid supply unit 1500 supplies the processing liquid PR. That is, the time when the wetting medium M is started to be sprayed can be the same as the time when the processing liquid PR is started to be supplied.

[0133] Although examples have been given of continuing to spray the wetting medium M even after the supply of the processing fluid PR has been stopped, the inventive concept is not limited thereto. For example, such as Figure 28 As shown, the time for stopping the supply of the treatment fluid PR can coincide with the time for stopping the spraying of the wetting medium M. Alternatively, as... Figure 29 As shown, the time to stop spraying the wetting medium M can be earlier than the time to stop supplying the treatment fluid PR.

[0134] Although examples have been given of the start time of spraying the wetting medium M being later than the start time of supplying the treatment fluid PR, and the stop time of spraying the wetting medium M being later than the stop time of supplying the treatment fluid PR, the inventive concept is not limited thereto. For example, as Figure 30 As shown, the time to start spraying the wetting medium M and the time to stop spraying the wetting medium M can be the same as the time to start supplying the treatment fluid PR and the time to stop supplying the treatment fluid PR, respectively.

[0135] Although the example shown is that the wetting unit 1600 sprays the wetting medium M in the coating step S10, the inventive concept is not limited thereto. For example, the wetting unit 1600 may spray the wetting medium M into the processing space 1202 in at least one of the coating step S10, the thickness adjustment step S20, or the drying step S30. For example, as Figure 31 As shown, the wetting unit 1600 can spray the wetting medium M into the processing space 1202 during the coating step S10 and the thickness adjustment step S20. Alternatively, as Figure 32 As shown, the wetting unit 1600 can spray the wetting medium M into the processing space 1202 during the coating step S10, thickness adjustment step S20, and drying step S30. In another case, such as Figure 33 As shown, the wetting unit 1600 can spray the wetting medium M during the thickness adjustment step S20 and the drying step S30. That is, the wetting unit 1600 can spray the wetting medium M after the supply of the processing liquid PR is stopped. When spraying the wetting medium M during the drying step S30, the spraying of the wetting medium M can be stopped before the drying step S30 ends. This is because the wetting medium M evaporates faster than the processing liquid PR, which is to dry the processing liquid PR more quickly.

[0136] In another case, between the pre-wetting step S00, the coating step S10, the thickness adjustment step S20 and the drying step S30, the wetting unit 1600 may spray the wetting medium M into the processing space 1202.

[0137] Refer again Figure 3 and Figure 4Multiple buffer chambers 312 and 316 are provided. Some of the buffer chambers 312 and 316 are located between the indexing module 100 and the transfer chamber 350. Hereinafter, these buffer chambers are referred to as front buffers 312. Front buffers 312 are stacked on top of each other in the up / down direction. Other buffer chambers 316 are located between the transfer chamber 350 and the interface module 500. These buffer chambers are referred to as rear buffers 316. Rear buffers 316 are stacked on top of each other in the up / down direction. Front buffers 312 and rear buffers 316 temporarily store multiple substrates W. The substrates W stored in the front buffer 312 are loaded and unloaded by the indexing robot 132 and the transfer robot 352. The substrates W stored in the rear buffer 316 are loaded or unloaded by the transfer robot 352 and the first robot 552.

[0138] The developing block 300b has a heat treatment chamber 320, a transfer chamber 350, and a liquid treatment chamber 360. The heat treatment chamber 320 and the transfer chamber 350 of the developing block 300b are arranged in a structure that is substantially similar to that of the heat treatment chamber 320 and the transfer chamber 350 of the coating block 300a. Therefore, a detailed description thereof will be omitted.

[0139] The liquid processing chamber 360 in the developing block 300b is configured as the developing chamber 360, and all developing chambers 360 are supplied with developing solution in the same way to perform the developing process on the substrate W.

[0140] Interface module 500 connects processing module 300 to external exposure apparatus 700. Interface module 500 has interface frame 510, additional process chamber 520, interface buffer 530 and transfer member 550.

[0141] The interface frame 510 may have a fan filter unit at its top, which forms a downward airflow within the interface frame 510. An additional process chamber 520, an interface buffer 530, and a transport member 550 are disposed within the interface frame 510. The additional process chamber 520 may perform a predetermined additional process before the substrate W to be processed in the coating block 300a is transported to the exposure apparatus 700. Optionally, the additional process chamber 520 may perform a predetermined additional process before the substrate W to be processed in the exposure apparatus 700 is transported to the developing block 300b. According to one embodiment, the additional process may be an edge exposure process that exposes the edge region of the substrate W to light, a top-side cleaning process that cleans the top side of the substrate W, or a rear-side cleaning process that cleans the rear side of the substrate W. Multiple additional process chambers 520 may be provided. The additional process chambers 520 may be stacked on top of each other. All additional process chambers 520 may perform the same process. Optionally, some of the additional process chambers 520 may perform different processes.

[0142] Interface buffer 530 provides space for the substrate W to temporarily reside during transport between coating block 300a, additional process chamber 520, exposure apparatus 700, and developing block 300b. Multiple interface buffers 530 can be provided. Interface buffers 530 can be stacked on top of each other.

[0143] According to one embodiment, the additional process chamber 520 may be located on one side of an extension line facing the longitudinal direction of the transfer chamber 350, and the interface buffer 530 may be located on the opposite side of the extension line.

[0144] A transfer member 550 transfers substrate W between coating block 300a, additional process chamber 520, exposure apparatus 700, and developing block 300b. The transfer member 550 can be operated by one or more robots. According to one embodiment, the transfer member 550 has a first robot 552 and a second robot 554. The first robot 552 can transfer substrate W between coating block 300a, additional process chamber 520, and interface buffer 530. The second robot 554 can transfer substrate W between interface buffer 530 and exposure apparatus 700, and can also transfer substrate W between interface buffer 530 and developing block 300b.

[0145] The first robotic arm 552 and the second robotic arm 554 each include a hand, a base plate W is placed on the hand, and the hand is movable forward and backward, rotatable about an axis parallel to the third direction 16, and movable along the third direction 16.

[0146] The hands of indexing robot 132, first robot 552, and second robot 554 may all have the same shape as the hand 354 of transfer robot 352. Optionally, the hands of robots that directly exchange substrates W with transfer plates 3240 of each heat treatment chamber 3200 may have the same shape as the hand 354 of transfer robot 352, and the hands of the remaining robots may have a different shape from the hand 354 of transfer robot 352.

[0147] According to one embodiment, the indexing robot 132 can directly exchange substrates W with the heating unit 3230 of the pre-heat treatment chamber 3200 disposed in the coating block 300a. In addition, the transfer robot 352 disposed in the coating block 300a and the developing block 300b can directly exchange substrates W with the transfer plate 3240 located in the heat treatment chamber 320.

[0148] The apparatus and method for forming a liquid film on a substrate W by supplying a processing liquid PR to the substrate W have been described above. However, the inventive concept is not limited thereto, and the above description can be applied in the same or similar way to apparatus and methods for processing a substrate W by supplying liquid to the substrate W.

[0149] As described above, the substrate can be processed effectively according to the embodiments conceived in this invention.

[0150] Furthermore, according to the embodiments conceived in this invention, the uniformity of the liquid film formed on the substrate can be improved.

[0151] Furthermore, according to embodiments of the present invention, defects (such as tearing and / or poor coating) in the liquid film formed on the substrate can be minimized.

[0152] The effects of this invention are not limited to those described above, and any other effects not mentioned herein can be clearly understood by those skilled in the art from this specification and the accompanying drawings.

[0153] The foregoing description illustrates the inventive concept. Furthermore, while the foregoing describes embodiments of the inventive concept, it can be used in various other combinations, variations, and environments. That is, variations or modifications can be made to the inventive concept without departing from the scope of the inventive concept disclosed herein, its equivalents in the written disclosure, and / or the skill or knowledge of those skilled in the art. The written embodiments describe the optimal state for realizing the technical spirit of the inventive concept and various changes can be made as needed for specific applications and purposes of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiments. Additionally, it should be understood that the appended claims include other embodiments.

[0154] While the inventive concept has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. A method for processing a substrate, wherein, A liquid film is formed by supplying a processing liquid to a rotating substrate, and a wetting medium is sprayed onto the substrate in the form of fine particles to aid in the diffusion of the liquid film. The method includes: The first step of supplying the processing liquid and rotating the substrate at a first speed; The second step of rotating the substrate at a second speed different from the first speed, and A third step involves rotating the substrate at a third speed that is higher than both the first and second speeds; Wherein, the wetting medium is sprayed onto the substrate only in the third step; or In the third step, the wetting medium is sprayed onto the substrate, and the wetting medium is also sprayed onto the substrate in at least one of the first or second steps; and Specifically, when the wetting medium is sprayed onto the substrate in the third step, the spraying of the wetting medium is stopped before the end of the third step.

2. The method of claim 1, wherein, The wetting medium is sprayed in the form of a mist.

3. The method of claim 1, wherein, The wetting medium is sprayed toward the edge region of the substrate.

4. The method of claim 1, wherein, The location where the wetting medium is supplied to the substrate is further away from the center of the substrate than the location where the processing liquid is supplied to the substrate.

5. The method of any one of claims 1 to 4, wherein, After the treatment fluid is supplied and a set time has elapsed, the wetting medium is sprayed.

6. The method of any one of claims 1 to 4, wherein, After the supply of the treatment fluid is stopped, the wetting medium is sprayed for a set period of time.

7. A method for processing a substrate, wherein, A liquid film is formed by supplying a coating solution to a rotating substrate, and a wetting medium is sprayed onto the substrate in the form of fine particles, the wetting medium being configured to suppress the evaporation of the solvent contained in the liquid film; The method includes: The first step of supplying the coating solution and rotating the substrate at a first speed; The second step of rotating the substrate at a second speed different from the first speed, and A third step involves rotating the substrate at a third speed that is higher than both the first and second speeds; Wherein, the wetting medium is sprayed onto the substrate only in the third step; or In the third step, the wetting medium is sprayed onto the substrate, and the wetting medium is also sprayed onto the substrate in at least one of the first or second steps; and Specifically, when the wetting medium is sprayed onto the substrate in the third step, the spraying of the wetting medium is stopped before the end of the third step.

8. The method of claim 7, wherein, The wetting medium is sprayed in the form of a mist.

9. The method of claim 7, wherein, The coating solution is supplied toward the central region of the substrate, and the wetting medium is sprayed toward the edge region of the substrate.

10. The method of claim 7, wherein, The duration of spraying the wetting medium and the duration of supplying the coating solution at least partially overlap.

11. The method of claim 7, wherein, The spraying of the wetting medium begins later than the supply of the coating solution.

12. The method of claim 7, wherein, The spraying of the wetting medium begins earlier than the supply of the coating solution begins.

13. The method of claim 7, wherein, The spraying of the wetting medium is stopped later than the supply of the coating solution is stopped.

14. A method for processing a substrate, wherein, A liquid film is formed by supplying a photosensitive liquid to a rotating substrate, and a diluent is sprayed in the form of a mist into a processing space to adjust the degree of evaporation of the solvent contained in the liquid film, wherein the substrate is processed in the processing space. The method includes: The coating step involves supplying the photosensitive liquid to the substrate rotating at a first speed; The thickness adjustment step involves stopping the supply of the photosensitive liquid and rotating the substrate at a second speed lower than the first speed; and The drying step involves drying the liquid film by rotating the substrate at a third speed, which is higher than the second speed. Wherein, the diluent is sprayed onto the substrate only during the drying step; or The diluent is sprayed onto the substrate during the drying step, and the diluent is also sprayed onto the substrate during at least one of the coating step or the thickness adjustment step; and Specifically, when the diluent is sprayed into the processing space during the drying step, the spraying of the diluent is stopped before the drying step ends.

15. The method of claim 14, wherein, The diluent is sprayed such that the concentration of the diluent per unit volume varies depending on the region of the substrate as viewed from above.

16. The method of claim 15, wherein, When viewed from above, the concentration of the diluent per unit volume sprayed into the processing space is higher in the edge region of the substrate than in the center region of the substrate.

17. An apparatus for processing a substrate, employing the method for processing a substrate according to any one of claims 1-16, the apparatus comprising: A support unit configured to support and rotate the substrate in the processing space; A liquid supply unit configured to supply processing liquid to the substrate supported on the support unit; as well as A wetting unit configured to spray a wetting medium in the form of fine particles onto the substrate, wherein the wetting medium facilitates the diffusion of the processing liquid; The device further includes a processing container having the processing space, and The wetting unit includes a wetting medium nozzle installed on the processing container; The wetting medium nozzle is configured to adjust the spraying area of ​​the wetting medium sprayed toward the substrate supported on the support unit.

18. The apparatus of claim 17, wherein, The wetting unit is configured to spray the wetting medium toward the edge region of the substrate supported on the support unit.

19. The apparatus of claim 17, wherein, The device further includes: A housing having an internal space surrounding the processing space; and An airflow supply unit configured to supply downward airflow into the interior space; and The wetting unit is installed in the airflow supply unit to spray the wetting medium toward the substrate supported on the support unit.

20. The apparatus of claim 17, wherein, The liquid supply unit includes: A treatment fluid nozzle, configured to supply the treatment fluid; and The first arm, configured to support the treatment fluid nozzle, and Wherein, the wetting medium nozzle is configured to spray the wetting medium; and The wetting unit further includes: The second arm is configured to support the wetting medium nozzle.

21. The apparatus of claim 17, wherein, The liquid supply unit includes a processing liquid nozzle and a first arm, the processing liquid nozzle being configured to supply the processing liquid, and the first arm having the processing liquid nozzle mounted on the first arm. The wetting unit includes a second arm, which is driven independently of the first arm. The second arm is equipped with a wetting medium nozzle and a pre-wetting nozzle. The wetting medium nozzle is configured to spray the wetting medium, and the pre-wetting nozzle is configured to supply pre-wetting liquid in a flow manner.

22. The apparatus of claim 17, wherein, The device further includes a controller configured to control the support unit, the liquid supply unit, and the wetting unit. The controller controls the liquid supply unit, the support unit, and the wetting unit to supply the processing liquid to the central region of the substrate supported on the support unit and to spray the wetting medium onto the edge region of the substrate supported on the support unit.

23. The apparatus of claim 22, wherein, The controller controls the liquid supply unit and the wetting unit to spray the wetting medium from the processing liquid supplied to the central region of the substrate as it reaches the edge region of the substrate.

24. The apparatus of claim 22, wherein, The controller controls the liquid supply unit and the wetting unit to spray the wetting medium after the processing liquid is started and a set time has elapsed.

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