Resin-molded article for optical semiconductor sealing

Abstract

This invention provides a resin molded article for sealing optical semiconductors, which can produce an optical semiconductor sealing material with excellent heat resistance, temperature cycling resistance, and reflow soldering resistance. The resin molded article for sealing optical semiconductors satisfies the following relationship (1): 0.0005≤E' 265℃ / E' 100℃ ≤0.0050(1) (where E') 265℃ and E' 100℃ These represent the storage modulus (Pa) of the cured product (dimensions: width 5mm × length 35mm × thickness 1mm) obtained by the following method at 265℃ and 100℃, respectively. (Method for preparing the cured product) The resin molding material is heated at 150℃ for 4 minutes to form a mold, and then heated at 150℃ for 3 hours to obtain the cured product.

Description

Technical Field

[0001] This invention relates to resin molded articles for sealing optical semiconductors. Background Technology

[0002] Optical semiconductor elements are sealed using ceramic or plastic encapsulation to form devices. However, due to the high cost and poor mass production capabilities of ceramic encapsulation materials, plastic encapsulation has become the mainstream method. From the perspectives of operability, mass production, and reliability, the technique of pre-pressing epoxy resin compositions into small sheets and then performing transfer molding has become the mainstream approach.

[0003] Patent document 1 discloses a technique for granulating an epoxy resin composition into granules and then compressing it into tablets.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2011-9394 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] In recent years, with the increasing functionality and high output power of electronic devices, higher reliability is required for optical semiconductors. For example, due to use in high-temperature environments or environments with repeated temperature changes from low to high, or during the reflow soldering process in the manufacturing stage of the equipment, sealing materials sometimes crack, peel, or discolor, requiring measures to be taken to reduce the damage to optical semiconductor components caused by these issues.

[0009] The purpose of this invention is to provide a resin molded article for sealing optical semiconductors, which can produce an optical semiconductor sealing material with excellent heat resistance, temperature cycling resistance and reflow soldering resistance.

[0010] means for solving problems

[0011] The present invention relates to a resin molded article for sealing optical semiconductors, wherein the resin molded article for sealing optical semiconductors satisfies the following relationship (1).

[0012] 0.0005≤E' 265℃ / E' 100℃ ≤0.0050 (1)

[0013] (where E') 265℃ and E' 100℃ The values ​​represent the storage modulus (Pa) of the cured material (dimensions: 5 mm width × 35 mm length × 1 mm thickness) obtained by the following method at 265 °C and 100 °C, respectively.

[0014] (Method for Producing Solidified Product)

[0015] The resin molded product is heated at 150 °C for 4 minutes for molding, and then heated at 150 °C for 3 hours to obtain a solidified product.

[0016] The resin molded product for optical semiconductor sealing preferably has a glass transition temperature of 130 °C or higher when it is made into a solidified product (size: width 5 mm × length 35 mm × thickness 1 mm) by the above method, and satisfies the following relational expression (2).

[0017] Y < 160000X - 14500000 (2)

[0018] (In the formula, X represents the glass transition temperature (°C) of the solidified product, and Y represents the storage modulus (Pa) of the solidified product at 265 °C.)

[0019] The resin molded product for optical semiconductor sealing preferably satisfies the following relational expressions (3) and (4).

[0020] Y <6300000> (130 ≤ X < 150) (3)

[0021] Y < 160000X - 17000000 (150 ≤ X ≤ 190) (4)

[0022] (In each formula, X represents the glass transition temperature (°C) of the solidified product (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the above method, and Y represents the storage modulus (Pa) of the solidified product at 265 °C.)

[0023] The resin molded product for optical semiconductor sealing preferably satisfies the following relational expression (5).

[0024] 0.70 < R 450nm <1.00 (5)

[0025] (In the formula, R 450nm represents the ratio of the linear transmittance at a wavelength of 450 nm before and after 3 times of reflow soldering at 265 °C for the solidified product (size: width 50 mm × length 50 mm × thickness 1 mm) obtained by the above method (after implementation / before implementation).)

[0026] The resin molded product for optical semiconductor sealing preferably satisfies the following relational expressions (6) and (7).

[0027] 0.80 < R 400nm / R 450nm <1.00 (6)

[0028] [

[0028] 0.10 < R 300nm / R450nm <0.50 (7)

[0029] (In each formula, R) 300nm R 400nm and R 450nm The figures represent the ratios of linear transmittance at wavelengths of 300nm, 400nm, and 450nm (before / after) for the cured material (dimensions: 50mm width × 50mm length × 1mm thickness) obtained by the above method after three reflow soldering cycles at 265°C.

[0030] The aforementioned resin molded article for sealing optical semiconductors preferably has a linear transmittance of 70% or more at a wavelength of 450 nm when it is cured by the method (dimensions: width 50 mm × length 50 mm × thickness 1 mm).

[0031] The aforementioned resin molded article for sealing optical semiconductors preferably includes a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator.

[0032] The aforementioned resin molding compound for sealing optical semiconductors preferably further comprises a polyol and a reaction product of the polyol and a curing agent.

[0033] The aforementioned resin molding for sealing optical semiconductors preferably comprises at least one compound selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III).

[0034] Formula (I):

[0035]

[0036] (where A is in the formula) 1 Indicates an organic group containing two or more ring structures; R 1a Indicates the site containing epoxy resin residues; R 1b Represents a hydrogen atom or related to R 1a (The bond in a bond.)

[0037] Equation (II):

[0038]

[0039] (where A is in the formula) 2 Indicates an organic group; R 2a This indicates a site containing epoxy resin residues having two or more consecutive ring structures (excluding ethylene oxide rings); R 2b Represents a hydrogen atom or related to R 2a (The bond in a bond.)

[0040] Equation (III):

[0041]

[0042] (where A is in the formula) 3 Indicates an organic group; R 3a This indicates an organic group having a non-aromatic ring.

[0043] The present invention also relates to an optical semiconductor sealing material, wherein the optical semiconductor sealing material is obtained by molding the above-mentioned optical semiconductor sealing resin molded article.

[0044] The present invention also relates to an optical semiconductor device, wherein the optical semiconductor device has an optical semiconductor element and the aforementioned optical semiconductor sealing material for sealing the optical semiconductor element.

[0045] Invention Effects

[0046] According to the resin molding for sealing optical semiconductors of the present invention, an optical semiconductor sealing material with excellent heat resistance, temperature cycling resistance and reflow soldering resistance can be obtained. Therefore, even when used in high-temperature environments or during reflow soldering processes, the optical semiconductor sealing material is not prone to cracking, peeling, discoloration, etc., thereby reducing damage to optical semiconductor components caused by these factors. Attached Figure Description

[0047] Figure 1 This is a schematic diagram illustrating the evaluation package used in the embodiments and comparative examples. Detailed Implementation

[0048] The present invention will now be described in detail.

[0049] The resin molded article for sealing optical semiconductors of the present invention satisfies the following relationship (1).

[0050] 0.0005≤E' 265℃ / E' 100℃ ≤0.0050 (1)

[0051] (where E') 265℃ and E' 100℃ The values ​​represent the storage modulus (Pa) of the cured material (dimensions: 5 mm width × 35 mm length × 1 mm thickness) obtained by the following method at 265 °C and 100 °C, respectively.

[0052] (Method for preparing cured materials)

[0053] The resin molding compound is heated at 150°C for 4 minutes to form a mold, and then heated at 150°C for 3 hours to obtain a cured product.

[0054] Resin moldings that satisfy equation (1) can produce cured products with high glass transition temperatures and low elastic modulus at high temperatures, thus enabling the production of optoelectronic semiconductor sealing materials with excellent heat resistance, temperature cycling resistance, and reflow soldering resistance. Furthermore, optoelectronic semiconductor sealing materials with excellent resistance to yellowing, dimensional stability to temperature changes, shock absorption, and impact resistance can also be obtained. Such optoelectronic semiconductor sealing materials are less prone to cracking, peeling, discoloration, etc., even when used in high-temperature environments or during reflow soldering processes, thus reducing damage to optoelectronic semiconductor components caused by these factors.

[0055] In addition, the above-mentioned resin molded articles do not become too hard when heated, thus exhibiting excellent workability, moldability, and demolding properties.

[0056] E' 265℃ / E' 100℃ The value is 0.0050 or less, preferably 0.0030 or less, more preferably 0.0010 or less, and even more preferably 0.0008 or less.

[0057] E' 265℃ / E' 100℃ When the value is less than 0.0005 or greater than 0.0050, the heat resistance, temperature cycling resistance and reflow soldering resistance of the obtained opto-semiconductor sealing material may decrease.

[0058] E' 265℃ and E' 100℃ The results were obtained by using the cured products obtained by the above method and measuring their dynamic viscoelasticity at 265℃ and 100℃ (mode: tensile, scanning temperature: 0℃~270℃, frequency: 1Hz, heating rate: 10℃ / min).

[0059] The preferred glass transition temperature (Tg) of the resin molded article for sealing the optical semiconductor of the present invention is 130°C or higher when the cured article (dimensions: width 5mm × length 35mm × thickness 1mm) is prepared by the above method, and satisfies the following relationship (2).

[0060] Y < 160000X - 14500000(2)

[0061] (Where, X represents the glass transition temperature (°C) of the cured product, and Y represents the storage modulus (Pa) of the cured product at 265°C.)

[0062] When such resin moldings are cured, cured products with high glass transition temperatures and low elastic modulus at high temperatures can be obtained. Therefore, optical semiconductor sealing materials with superior heat resistance, temperature cycling resistance, reflow soldering resistance, yellowing resistance, dimensional stability to temperature changes, impact absorption, and impact resistance can be obtained.

[0063] The above glass transition temperature is preferably 130 °C or higher, more preferably 140 °C or higher, further preferably 145 °C or higher, and particularly preferably 155 °C or higher. Additionally, the glass transition temperature is preferably 200 °C or lower, more preferably 190 °C or lower, and further preferably 180 °C or lower.

[0064] When the glass transition temperature of the cured product is within the above range, a light semiconductor sealing material with more excellent heat resistance, temperature cycle resistance, yellowing resistance, dimensional stability to temperature changes, and shock absorption can be obtained.

[0065] The above glass transition temperature is obtained as follows: Dynamic viscoelasticity measurement is performed on the cured product (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the above method (mode: tension, scanning temperature: 0 °C to 270 °C, frequency: 1 Hz, heating rate: 10 °C / minute), thereby obtaining the storage modulus E' and the loss modulus E". A curve of tanδ (=E” / E’) is obtained from the storage modulus E' and the loss modulus E", and the glass transition temperature is obtained according to the peak temperature of tanδ.

[0066] The resin molded product for light semiconductor sealing of the present invention preferably satisfies the following relational expressions (3) and (4), and more preferably satisfies the following relational expressions (3') and (4').

[0067] Y<6300000>(130≤X<150) (3)

[0068] Y<160000X - 17000000(150≤X≤190) (4)

[0069] Y<1400000>(130≤X<150) (3’)

[0070] Y<160000X - 22000000(150≤X≤190) (4’)

[0071] (In each formula, X represents the glass transition temperature (°C) of the cured product (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the above method, and Y represents the storage modulus (Pa) of the above cured product at 265 °C.) <000032,0>

[0072] Thereby, a light semiconductor sealing material with more excellent heat resistance, temperature cycle resistance, reflow resistance, yellowing resistance, dimensional stability to temperature changes, shock absorption, and impact resistance can be obtained.

[0073] The storage modulus (E’) of the resin molded product for light semiconductor sealing of the present invention at 265 °C when made into a cured product (size: width 5 mm × length 35 mm × thickness 1 mm) by the above method265℃ The preferred value is 1.5 × 10⁻⁶. 7 Pa or less, more preferably 1.0 × 10 Pa. 7 Below Pa.

[0074] The resin molded article for sealing optical semiconductors of the present invention preferably satisfies the following relationship (5).

[0075] 0.70 < R 450nm <1.00 (5)

[0076] (where R is in the formula) 450nm This represents the ratio of the linear transmittance at 450 nm before and after three reflow soldering cycles at 265°C for a cured product (dimensions: 50 mm width × 50 mm length × 1 mm thickness) obtained by the above method.

[0077] R 450nm More preferably, it is 0.80 or higher. Additionally, R... 450nm More preferably, it is 0.95 or less.

[0078] When R 450nm Within the aforementioned range, the decrease in transmittance at a specific wavelength of the cured material after reflow soldering can be suppressed, thus enabling the acquisition of a light semiconductor sealing material with superior reflow soldering resistance and yellowing resistance.

[0079] The resin molded article for sealing optical semiconductors of the present invention preferably satisfies the following relationship (5').

[0080] 0.60 < R 400nm <0.90 (5')

[0081] (where R is in the formula) 400nm This represents the ratio of the linear transmittance at 400 nm before and after three reflow soldering cycles at 265°C for a cured product (dimensions: 50 mm width × 50 mm length × 1 mm thickness) obtained by the above method.

[0082] R 400nm More preferably, it is 0.70 or higher. Additionally, R... 400nm More preferably, it is 0.85 or less.

[0083] When R 400nm Within the aforementioned range, the decrease in transmittance at a specific wavelength of the cured material after reflow soldering can be suppressed, thus enabling the acquisition of a light semiconductor sealing material with superior reflow soldering resistance and yellowing resistance.

[0084] The resin molded article for sealing optical semiconductors of the present invention preferably satisfies the following relationship (5”).

[0085] 0.10 < R 300nm <0.50 (5”)

[0086] (where R is in the formula) 300nm This represents the ratio of the linear transmittance at 300 nm before and after three reflow soldering cycles at 265°C for a cured material (dimensions: 50 mm width × 50 mm length × 1 mm thickness) obtained by the above method.

[0087] R 300nm More preferably, it is 0.15 or higher. Additionally, R... 300nm More preferably, it is 0.40 or less.

[0088] When R 300nm Within the aforementioned range, the decrease in transmittance at a specific wavelength of the cured material after reflow soldering can be suppressed, thus enabling the acquisition of a light semiconductor sealing material with superior reflow soldering resistance and yellowing resistance.

[0089] The resin molded article for sealing optical semiconductors of the present invention preferably satisfies the following relationships (6) and (7).

[0090] 0.80 < R 400nm / R 450nm <1.00 (6)

[0091] 0.10 < R 300nm / R 450nm <0.50 (7)

[0092] (In each formula, R) 300nm R 400nm and R 450nm The figures represent the ratios (after / before) of the linear transmittance at wavelengths of 300 nm, 400 nm, and 450 nm for the cured material (dimensions: 50 mm width × 50 mm length × 1 mm thickness) obtained by the above method after three solder reflows at 265°C.

[0093] R 400nm / R 450nm More preferably, it is 0.95 or less.

[0094] R 300nm / R 450nm More preferably, it is 0.20 or higher. Additionally, R... 300nm / R 450nm More preferably, it is 0.40 or less.

[0095] When R 400nm / R 450nm and R 300nm / R 450nmWithin the aforementioned range, the decrease in transmittance at a specific wavelength of the cured material after reflow soldering can be suppressed, thus enabling the acquisition of a light semiconductor sealing material with superior reflow soldering resistance and yellowing resistance.

[0096] The linear transmittance at each wavelength was determined by preparing a cured product using the method described above and measuring the transmittance spectrum of the cured product using a spectrophotometer before and after reflow soldering.

[0097] The above reflow soldering uses the above-mentioned cured material and is performed in a reflow oven at a peak temperature of 265°C for 10 seconds each time.

[0098] The linear transmittance at a wavelength of 450 nm of the resin molding for sealing the optical semiconductor of the present invention, when cured by the above method (dimensions: width 50 mm × length 50 mm × thickness 1 mm), is preferably 70% or more, more preferably 90% or more, and even more preferably 95% or more.

[0099] Thus, it is possible to obtain a light semiconductor sealing material with excellent light transmittance (transparency).

[0100] The linear transmittance was determined by measuring the transmission spectrum of the cured material at a wavelength of 450 nm using a spectrophotometer.

[0101] Examples of resin molded materials for sealing optical semiconductors according to the present invention include: small pieces (tabrets) and thin sheets (seats).

[0102] When the resin molded part for sealing optoelectronic semiconductors is a small piece, its volume is not particularly limited, but 1 cm is preferred. 3 ~100cm 3 More preferably 10cm 3 ~100cm 3 .

[0103] The resin molded article for sealing optical semiconductors of the present invention preferably comprises a reaction product of a thermosetting resin and a curing agent. Furthermore, it is also preferable to include a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator. In addition to the above, it is also preferable to include a polyol and a reaction product of the polyol and the curing agent. The resin molded article for sealing optical semiconductors of the present invention can be in a so-called B-stage (semi-cured) state.

[0104] Epoxy resin is preferred as a thermosetting resin. Among epoxy resins, epoxy resins with minimal coloring are preferred.

[0105] As the aforementioned epoxy resin, epoxy resins having two or more consecutive ring structures (excluding ethylene oxide rings) are preferred because resin molded articles satisfying the above-described relationships can be easily obtained. Here, "two or more consecutive ring structures" means that two or more ring structures are directly connected; in other words, it means that there are no atoms that do not form a ring between one ring structure and an adjacent ring structure. Preferably, in the two or more consecutive ring structures, one ring structure and an adjacent ring structure share two or more atoms.

[0106] The aforementioned ring structure is preferably a non-aromatic ring, more preferably a non-aromatic carbon ring. The aforementioned epoxy resin can be an alicyclic epoxy resin.

[0107] The ring structure described above may have unsaturated bonds, but preferably does not.

[0108] The epoxy resin described above preferably has a hydrocarbon group containing a bridging structure, more preferably has a bicyclic or tricyclic hydrocarbon group containing a bridging structure, and even more preferably has a bicyclic hydrocarbon group having a bridging structure on a 6-membered ring.

[0109] The aforementioned bridging hydrocarbon group is particularly preferably a group represented by the following formula:

[0110]

[0111] (where R is in the formula) 11 Represents an oxygen atom or an alkylene group. R 12 ~R 17 Each can independently represent a hydrogen atom or an alkyl group.

[0112] Therefore, it is easier to obtain resin molded articles that satisfy the above relationships.

[0113] In the above formula, R 11 This refers to an oxygen atom or an alkylene group. The number of carbon atoms in the aforementioned alkylene group is preferably 1 to 5, more preferably 1 to 3, even more preferably 1 to 2, and particularly preferably 1.

[0114] R 11 Preferably, it is an alkylene group.

[0115] In the above formula, R 12 ~R 17 Each can independently represent a hydrogen atom or an alkyl group. As R 12 ~R 17 The number of carbon atoms in the alkyl group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1 to 2.

[0116] R 12 ~R 17 Hydrogen atoms are preferred.

[0117] Examples of epoxy resins mentioned above include the following substances, but are not limited to these substances. It should be noted that, in the presence of stereoisomers, each stereoisomer and mixtures of two or more stereoisomers are also included in the examples.

[0118]

[0119] Other epoxy resins besides those mentioned above can also be used. Examples include: bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic varnish type epoxy resin, alicyclic epoxy resin, triglycidyl isocyanurate, hydantoin epoxy resin and other heterocyclic epoxy resins, hydrogenated bisphenol A type epoxy resin, aliphatic epoxy resin, glycidyl ether type epoxy resin, etc. These can be used in combination with the above-mentioned epoxy resins having two or more consecutive ring structures (excluding ethylene oxide rings).

[0120] Epoxy resins can be used alone or in combination with two or more.

[0121] As a curing agent, anhydride that causes minimal coloration to the cured resin molded article during or after curing is preferred. Among them, anhydride (a) represented by the following formula (a) is preferred because it is easy to obtain resin molded articles that satisfy the above relationships.

[0122]

[0123] (where A is in the formula) 1 (This indicates an organic group containing two or more ring structures).

[0124] In equation (a), A 1 It is an organic group containing two or more ring structures (polycyclic). The above organic groups are divalent organic groups.

[0125] The number of carbon atoms in the above-mentioned organic groups is preferably 5 or more, more preferably 6 or more, and even more preferably 7 or more. In addition, the number of carbon atoms in the above-mentioned organic groups is preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, and particularly preferably 7 or less.

[0126] As the aforementioned organic group, a hydrocarbon group is preferred, and it may contain heteroatoms such as oxygen atoms, unsaturated bonds such as double bonds, etc.

[0127] As the aforementioned organic group, a hydrocarbon group having a bridging structure is preferred, a bicyclic hydrocarbon group having a bridging structure is more preferred, and a bicyclic hydrocarbon group having a bridging structure on a 6-membered ring is even more preferred.

[0128] A 1 Particularly preferred are groups represented by the following formula (A1):

[0129]

[0130] (where R is in the formula) 2 Represents an oxygen atom or an alkylene group. R 3 R represents a hydrocarbon group with two or more carbon atoms. 4 ~R 7 Each can independently represent a hydrogen atom or an alkyl group.

[0131] Therefore, it is easier to obtain resin molded articles that satisfy the above relationships.

[0132] In equation (A1), R 2 This refers to an oxygen atom or an alkylene group. The number of carbon atoms in the aforementioned alkylene group is preferably 1 to 5, more preferably 1 to 3, even more preferably 1 to 2, and particularly preferably 1.

[0133] R 2 Preferably, it is an alkylene group.

[0134] In equation (A1), R 3 This refers to a hydrocarbon group having 2 or more carbon atoms. The aforementioned hydrocarbon group is a divalent hydrocarbon group. The aforementioned hydrocarbon group has 2 or more carbon atoms, more preferably 2 to 5, further preferably 2 to 4, and particularly preferably 2.

[0135] As R 3 The above-mentioned hydrocarbon group is preferably -CX. 1 2-CX 2 2-(where X) 1 and X 2 (independently hydrogen atom or alkyl group) or -CX 1 =CX 2 -(where X is in the formula) 1 and X 2 (As mentioned above).

[0136] As X 1 and X 2 The number of carbon atoms in the alkyl group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1 to 2.

[0137] In the presence of multiple X 1 or multiple X 2 In this case, these multiple X 1 or multiple X 2 They can be the same or different.

[0138] X 1 and X 2 Hydrogen atoms are preferred.

[0139] In equation (A1), R 4 ~R 7 Each can independently represent a hydrogen atom or an alkyl group. As R 4 ~R7 The number of carbon atoms in the alkyl group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1 to 2.

[0140] R 4 and R 5 Preferably, it is a hydrogen atom or an alkyl group, more preferably a hydrogen atom.

[0141] R 6 and R 7 Hydrogen atoms are preferred.

[0142] The following groups can be exemplified as groups represented by formula (A1), but are not limited to these groups. It should be noted that, in the presence of stereoisomers, each stereoisomer and mixtures of two or more stereoisomers are also included in the examples.

[0143]

[0144] As a group represented by formula (A1), the following groups are preferred.

[0145]

[0146] Other acid anhydrides besides those mentioned above can also be used. Examples include: phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, glutaric anhydride, etc. These can be used in combination with the acid anhydrides (a) mentioned above.

[0147] Hardeners can be used alone or in combination with two or more.

[0148] There is no particular limitation on the amount of curing agent, but for example, it is preferably 20 to 200 parts by weight relative to 100 parts by weight of thermosetting resin. When the amount of curing agent is less than 20 parts by weight, the curing speed is slower, and when the amount of curing agent is greater than 200 parts by weight, there is an excess of curing agent in the curing reaction, which may lead to a reduction in various physical properties.

[0149] When the thermosetting resin is an epoxy resin and the curing agent is an anhydride, the equivalence ratio (A / E) of the anhydride group (A) to the epoxy group (E) is preferably 0.5 to 1.5, more preferably 0.8 to 1.2, and most preferably 0.9 to 1.0. When the equivalence ratio is less than 0.5 or greater than 1.5, the reactivity decreases, and the strength and heat resistance of the cured product may be impaired.

[0150] In the case where the resin molding for sealing optical semiconductors of the present invention contains a curing agent, a portion of the curing agent may react with a thermosetting resin.

[0151] Examples of curing accelerators include: tertiary amines such as triethanolamine and dimethylbenzylamine; imidazoles such as 2-methylimidazole and 2-ethyl-4-methylimidazole; and tetraphenyl... Organophosphorus compounds such as tetraphenylborate and triphenylphosphine; diazabicyclic olefins such as 1,8-diazabicyclo[5.4.0]undec-7-ene and 1,5-diazabicyclo[4.3.0]non-5-ene. These curing accelerators can be used alone or in combination of two or more.

[0152] There are no particular limitations on the amount of curing agent. For example, it can be appropriately selected from 0.1 parts to 5 parts by weight relative to 100 parts by weight of thermosetting resin, preferably 0.5 parts to 3 parts by weight, and more preferably 1 part to 2 parts by weight. If the amount of curing accelerator is too small, the curing speed will be slow and the productivity will be reduced. On the other hand, if the amount of curing accelerator is too large, the curing reaction will be too fast, making it difficult to control the reaction state and raising concerns about changes in the reaction.

[0153] In the case where the resin molding for sealing optical semiconductors of the present invention contains a curing accelerator, a portion of the curing accelerator may react with the thermosetting resin and / or the curing agent.

[0154] The resin molding compound for sealing optical semiconductors of the present invention preferably further comprises a polyol. This allows for the production of cured products with lower elastic modulus, thereby enabling the production of optical semiconductor sealing materials with superior impact absorption and impact resistance.

[0155] Polyols can be any compounds having two or more hydroxyl groups, but diols are preferred.

[0156] From the viewpoint of easily obtaining resin molded articles that satisfy the above-mentioned relationships, polyols having non-aromatic rings are preferred as the aforementioned polyols. The aforementioned polyols may be alicyclic polyols. The number of carbon atoms in the aforementioned polyols is preferably 3 or more, more preferably 5 or more, and even more preferably 6 or more. Furthermore, the number of carbon atoms in the aforementioned polyols is preferably 30 or less, more preferably 20 or less.

[0157] The aforementioned non-aromatic ring is more preferably a non-aromatic carbon ring. The aforementioned non-aromatic ring may have unsaturated bonds, but preferably does not. The aforementioned non-aromatic ring can be monocyclic or polycyclic.

[0158] The aforementioned non-aromatic ring can be a hydrocarbon ring with a bridging structure. Preferably, the hydrocarbon ring with the bridging structure is a bicyclic or tricyclic ring, and more preferably a tricyclic ring with a bridging structure.

[0159] As the aforementioned non-aromatic ring, the cyclohexane ring is particularly preferred.

[0160] Examples of the aforementioned polyols include, but are not limited to, the following polyols. It should be noted that, in the presence of stereoisomers, each stereoisomer and mixtures of two or more stereoisomers are also included in the examples.

[0161]

[0162] Other polyols besides those mentioned above may also be used. Examples include diols with a preferred number of carbon atoms of 2 to 10, more preferably 2 to 6, and even more preferably 2 to 5. Examples of such diols include ethylene glycol, propylene glycol, neopentyl glycol, pentylene glycol, and butanediol, with neopentyl glycol being preferred. These can be used in combination with the aforementioned polyols having non-aromatic rings.

[0163] Polyols can be used alone or in combination with two or more.

[0164] There are no particular restrictions on the amount of polyols used; for example, it can be selected from 5 to 200 parts by weight relative to 100 parts by weight of thermosetting resin.

[0165] When the curing agent is an acid anhydride, the molar ratio (B / C) of the polyol compound (B) to the acid anhydride (C) is preferably 0.01 to 0.70, more preferably 0.05 to 0.60, and most preferably 0.10 to 0.50.

[0166] When the amount of polyol is too small, the elastic modulus of the cured product is sometimes too high. On the other hand, when the amount of polyol is too large, the glass transition temperature and elastic modulus of the cured product are sometimes too low.

[0167] In the case where the resin molding for sealing optical semiconductors of the present invention contains a polyol, a portion of the polyol may react with a thermosetting resin and / or a curing agent.

[0168] The resin molding for sealing optical semiconductors of the present invention preferably comprises epoxy resin, acid anhydride, polyol, reaction product of epoxy resin and acid anhydride, reaction product of polyol and acid anhydride, and curing accelerator, and satisfies at least one of (i) to (iii) below.

[0169] (i) The epoxy resin mentioned above is an epoxy resin having two or more continuous ring structures (excluding ethylene oxide rings).

[0170] (ii) The above-mentioned acid anhydride is the acid anhydride (a) represented by the above formula (a).

[0171] (iii) The above polyols are polyols with non-aromatic rings.

[0172] Such resin moldings can produce cured products with high glass transition temperatures and low elastic modulus at high temperatures, thus enabling the production of opto-semiconductor sealing materials with excellent heat resistance, temperature cycling resistance, and reflow soldering resistance. Furthermore, opto-semiconductor sealing materials with excellent resistance to yellowing, dimensional stability to temperature changes, shock absorption, and impact resistance can also be obtained.

[0173] Generally, as the glass transition temperature increases, the elastic modulus also tends to increase. However, by satisfying at least one of (i) to (iii) above, a resin molded article can be obtained that has a high glass transition temperature and a low elastic modulus on the high-temperature side compared to the glass transition temperature. The reason for this is not yet clear, but it is speculated that for the reaction products of epoxy resin and acid anhydride or the reaction products of polyol and acid anhydride, the steric repulsion between the side chains generated by the ring structure of the epoxy resin, acid anhydride, or polyol is large. Therefore, the glass transition temperature increases due to the increased rigidity of the main chain of the above reaction products, and the elastic modulus decreases due to the increased free volume of the above reaction products.

[0174] The resin molding for sealing optical semiconductors of the present invention preferably comprises at least one compound selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III).

[0175] Formula (I):

[0176]

[0177] (where A is in the formula) 1 This indicates an organic group containing two or more ring structures. R 1a Indicates the site containing epoxy resin residues. R 1b Represents a hydrogen atom or related to R 1a (The bond in a bond.)

[0178] Equation (II):

[0179]

[0180] (where A is in the formula) 2 Indicates an organic group. R 2a This indicates a site containing epoxy resin residues having two or more consecutive ring structures (excluding ethylene oxide rings). 2b Represents a hydrogen atom or related to R 2a (The bond in a bond.)

[0181] Equation (III):

[0182]

[0183] (where A is in the formula) 3 Indicates an organic group. R 3a This indicates an organic group having a non-aromatic ring.

[0184] Resin molding compounds containing such compounds can produce cured products with high glass transition temperatures and low elastic modulus at high temperatures, thus enabling the production of opto-semiconductor sealing materials with excellent heat resistance, temperature cycling resistance, and reflow soldering resistance. Furthermore, opto-semiconductor sealing materials with excellent resistance to yellowing, dimensional stability to temperature changes, shock absorption, and impact resistance can also be obtained.

[0185] The compound having structural unit (I) can be the reaction product of epoxy resin and the above-mentioned acid anhydride (a). The epoxy resin used to form structural unit (I) can be the above-mentioned epoxy resin having two or more consecutive ring structures (excluding ethylene oxide rings), or it can be any other epoxy resin.

[0186] In equation (I), A 1 This indicates an organic group containing two or more ring structures. In formula (I), A... 1 With A in equation (a) above 1 same.

[0187] In equation (I), R 1a This indicates the site containing epoxy resin residues. In this specification, epoxy resin residues are structures obtained by removing at least one epoxy group (ethylene oxide ring) from an epoxy resin.

[0188] R 1a It may also contain one or more unreacted epoxy groups, or it may contain structures obtained by reacting epoxy groups with other compounds (curing agents, curing accelerators, other additives, etc.).

[0189] In equation (I), R 1b Represents a hydrogen atom or related to R 1a Bonded bonds. In R 1b When R is the key, 1a They bond together to form a ring.

[0190] In compounds having structural unit (I), adjacent A 1 The number of atoms in the main chain is preferably 6 to 17. More preferably, the number of atoms is 13 or less, and even more preferably 9 or less. Alternatively, the number of atoms can be 10 or more, or 14 or more.

[0191] The above adjacent A 1 The number of atoms in the main chain refers to the number of atoms in a chain from an A 1To the nearest other A 1 The number of atoms present along the shortest path of the bond. The atoms in the main chain described above do not include those constituting A. 1 The atoms of the carbonyl group, the oxygen atoms that make up R 1a and R 1b Atoms.

[0192] Through adjacent A 1 The number of atoms in the main chain of the above-mentioned compounds is within the above-mentioned range. The rigidity and free volume of the main chain of the above-mentioned compounds are further increased. Therefore, it is possible to obtain cured products with higher glass transition temperature and lower elastic modulus at high temperature. Furthermore, it is possible to obtain opto-semiconductor sealing materials with better heat resistance, temperature cycling resistance, reflow soldering resistance, yellowing resistance, dimensional stability to temperature changes, impact absorption and impact resistance.

[0193] The compound having structural unit (II) can be the reaction product of the epoxy resin having two or more consecutive ring structures (excluding the ethylene oxide ring) and an acid anhydride. The acid anhydride used to form structural unit (II) can be the acid anhydride (a) described above, or it can be any other acid anhydride.

[0194] In equation (II), A 2 This indicates an organic group. The organic group mentioned above is a divalent organic group.

[0195] The organic group has 2 or more carbon atoms, more preferably 6 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less.

[0196] As the aforementioned organic group, a hydrocarbon group is preferred, and it may contain heteroatoms such as oxygen atoms, unsaturated bonds such as double bonds, etc.

[0197] The organic groups mentioned above may have a ring structure, preferably a ring structure.

[0198] In equation (II), R 2a This refers to a site containing epoxy resin residues having two or more consecutive ring structures (excluding ethylene oxide rings). Epoxy resins having two or more consecutive ring structures (excluding ethylene oxide rings) are as described above.

[0199] R 2a It may also contain one or more unreacted epoxy groups, or it may contain structures obtained by reacting epoxy groups with other compounds (curing agents, curing accelerators, other additives, etc.).

[0200] In equation (II), R 2b Represents a hydrogen atom or related to R 2a Bonded bonds. In R 2bWhen R is the key, 2a They bond together to form a ring. R 2b Preferably with R 2a Bonded bonds.

[0201] Compounds having structural unit (III) can be the reaction product of a polyol having a non-aromatic ring and an acid anhydride. The acid anhydride used to form structural unit (III) can be the acid anhydride (a) mentioned above, or it can be any other acid anhydride.

[0202] In equation (III), A 3 This indicates an organic group. As A 3 Organic groups, such as those mentioned above, can be listed as A. 2 The same organic group as the group.

[0203] In equation (III), R 3a This refers to an organic group having a non-aromatic ring. The aforementioned organic group is a divalent organic group. The number of carbon atoms in the aforementioned organic group is preferably 3 or more, more preferably 5 or more, even more preferably 6 or more; furthermore, the number of carbon atoms in the aforementioned organic group is preferably 30 or less, more preferably 20 or less.

[0204] As the aforementioned organic group, a hydrocarbon group is preferred, and it may contain heteroatoms such as oxygen atoms, unsaturated bonds such as double bonds, etc.

[0205] As for the non-aromatic rings possessed by the aforementioned organic groups, examples of non-aromatic rings that are the same as those in the non-aromatic rings of the aforementioned polyols possessing non-aromatic rings can be listed.

[0206] R 3a It can be a group obtained by removing two hydroxyl groups from the polyol with a non-aromatic ring mentioned above.

[0207] In the case where the resin molding for sealing the optical semiconductor of the present invention contains a compound having structural unit (III), it is preferable to further contain a compound having structural unit (IV) represented by the following formula (IV).

[0208] Formula (IV):

[0209]

[0210] (where A is in the formula) 3 As described above. R 4a Indicates the site containing epoxy resin residues. R 4b Represents a hydrogen atom or related to R 4a (The bond in a bond.)

[0211] The compound having structural unit (IV) can be a reaction product of epoxy resin and acid anhydride. The epoxy resin used to form structural unit (IV) can be the epoxy resin having two or more consecutive ring structures (excluding ethylene oxide rings) as described above, or it can be any other epoxy resin. Furthermore, the acid anhydride used to form structural unit (IV) can be the acid anhydride (a) described above, or it can be any other acid anhydride.

[0212] In equation (IV), R 4a Indicates the site containing epoxy resin residues. R 4a It may also contain one or more unreacted epoxy groups, or it may contain structures obtained by reacting epoxy groups with other compounds (curing agents, curing accelerators, other additives, etc.).

[0213] In equation (IV), R 4b Represents a hydrogen atom or related to R 4a Bonded bonds. In R 4b When R is the key, 4a They bond together to form a ring.

[0214] In the resin molded article for sealing optical semiconductors of the present invention, in addition to the components described above, additives such as anti-coloring agents, lubricants, modifiers, anti-deterioration agents, release agents, phosphors that change the wavelength of light, and inorganic / organic fillers that diffuse light can be used as needed. It should be noted that fillers such as silica powder can be used as long as they do not impair the degree of light transmission.

[0215] Examples of anti-staining agents include: phenolic compounds, amine compounds, organic sulfur compounds, and phosphine compounds.

[0216] Examples of lubricants include: stearic acid, magnesium stearate, calcium stearate, and other waxes; talc, etc. It should be noted that when using the above lubricants, the amount used should be appropriately set according to the molding conditions, for example, preferably set to 0.1% to 0.4% of the total weight of the resin molded article.

[0217] Examples of phosphors that change light wavelength and inorganic / organic fillers that diffuse light include: silica powders such as quartz glass powder, talc, fused silica powder, and crystalline silica powder; alumina; silicon nitride; aluminum nitride; and silicon carbide. It should be noted that the amount of phosphor or inorganic / organic filler incorporated is appropriately set according to the molding conditions. Specifically, in the case of phosphors, the amount incorporated can be appropriately set from 1% to 60% by mass of the total resin molded article. On the other hand, in the case of fillers (organic / inorganic) that diffuse light, the amount incorporated can be appropriately set from 0.5% to 25% by mass of the total resin molded article.

[0218] The resin molded article for sealing optical semiconductors of the present invention is used for resin sealing of optical semiconductor elements such as light receiving elements. Therefore, from an optical point of view, a transparent molded article is preferred. Here, "transparent" means that the transmittance of the cured article at 400 nm is 90% or more. It should be noted that the transmittance in the case of containing the above-mentioned additives such as phosphors that change the light wavelength and inorganic / organic fillers that diffuse the light refers to the transmittance of the resin portion after removing the additives.

[0219] The resin molded article for sealing optical semiconductors of the present invention can be suitably manufactured, for example, by a manufacturing method comprising the following steps:

[0220] The process of mixing thermosetting resin, curing agent and curing accelerator, and polyol as needed to obtain a curable resin composition.

[0221] The process of heat-treating the curable resin composition;

[0222] The process of granulating the curable resin composition to obtain a granular curable resin composition; and

[0223] The process of molding the granular curable resin composition.

[0224] There are no particular restrictions on the mixing method; for example, using an extruder can be used. There are also no particular restrictions on the mixing temperature, which can be appropriately adjusted according to the characteristics of the thermosetting resin.

[0225] There are no particular limitations on the shape of the curable resin composition obtained by mixing, and examples include: film, flake, granules, block, etc.

[0226] A B-stage (semi-cured) resin composition for sealing optical semiconductors is obtained by heat treatment of a curable resin composition obtained through mixing. There are no particular limitations on the heat treatment temperature and time; they can be appropriately adjusted according to the characteristics of the thermosetting resin.

[0227] The heat-treated resin composition is granulated to obtain a granular curable resin composition. Before granulation, it can also be pulverized using a ball mill, turbo mill, or similar method. The granulation method is not particularly limited; methods using a dry compression granulator are examples. The average particle size of the granules obtained by granulation is not particularly limited, but is preferably 1 μm to 5000 μm, more preferably 100 μm to 2000 μm. When the average particle size is greater than 5000 μm, the compression ratio tends to decrease.

[0228] The obtained granular curable resin composition is molded to obtain a molded article. Examples of molded articles include small pieces and thin sheets. Examples of molding methods include sheet compression molding to obtain small pieces and extrusion molding to obtain thin sheets. The obtained molded article satisfies the specific relationship described above, thus it is possible to obtain a cured article with a high glass transition temperature and a low elastic modulus, and to obtain a light semiconductor sealing material with excellent heat resistance, temperature cycling resistance and reflow soldering resistance.

[0229] When the molded product is in the form of small flakes, the conditions for compressing these flakes can be appropriately adjusted according to the composition, average particle size, and particle size distribution of the granular curable resin composition. Typically, the compression ratio during compression molding is preferably set to 90% to 96%. This is because when the compression ratio is less than 90%, the density of the flakes may decrease, making them prone to breakage. Conversely, when the compression ratio is greater than 96%, cracks may occur during compression, resulting in defects or breakage during demolding.

[0230] The resin molded article for sealing optical semiconductors of the present invention can seal optical semiconductor elements by molding methods such as transfer molding. The optical semiconductor sealing material obtained by molding the resin molded article for sealing optical semiconductors of the present invention is also part of the present invention. The optical semiconductor packaging material of the present invention is obtained from the resin molded article of the present invention, and therefore exhibits excellent heat resistance, temperature cycling resistance, and reflow soldering resistance. Furthermore, it also exhibits excellent resistance to yellowing, dimensional stability to temperature changes, shock absorption, and impact resistance. Therefore, even due to use in high-temperature environments or reflow soldering processes, cracking and peeling are minimal, reducing damage to the sealed optical semiconductor elements.

[0231] In this specification, the optical semiconductor sealing material is a component formed in a manner that covers and seals the optical semiconductor element constituting the optical semiconductor device.

[0232] An optical semiconductor device having an optical semiconductor element and an optical semiconductor sealing material of the present invention for sealing the optical semiconductor element is also one aspect of the present invention. Because the optical semiconductor device of the present invention has the optical semiconductor sealing material of the present invention, even when operating in a high-temperature environment, the sealing material exhibits fewer cracks and peelings, resulting in less damage to the optical semiconductor element.

[0233] The resin molded article for sealing optical semiconductors of the present invention is particularly suitable for sealing automotive optical semiconductors that are frequently used in high-temperature environments and are frequently supplied to reflow soldering processes.

[0234] [Example]

[0235] The present invention will now be described in more detail by way of examples, but the present invention is not limited to these examples.

[0236] The materials used are shown below.

[0237] Epoxy Resin A: Triglycidyl Isocyanurate (TEPIC-S manufactured by Nissan Chemical Co., Ltd., epoxy equivalent 100)

[0238] Epoxy Resin B: Bisphenol A type epoxy resin (JER-1002W manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 650)

[0239] Epoxy Resin C: Epoxy resin represented by the following formula (DE-102 manufactured by JXTG, epoxy equivalent 111).

[0240]

[0241] Epoxy resin D: Epoxy resin represented by the following formula (DE-103 manufactured by JXTG, epoxy equivalent 174).

[0242]

[0243] Anhydride A: A mixture of bicyclic [2.2.1]heptane-2,3-dicarboxylic anhydride and 5-methylbicyclic [2.2.1]heptane-2,3-dicarboxylic anhydride represented by the following formula (RIKACID HNA-100 manufactured by Shin Nippon Rika Co., Ltd., anhydride equivalent 179).

[0244]

[0245] Anhydride B: Cis-5-norbornene-exo-2,3-dicarboxylic anhydride represented by the following formula

[0246]

[0247] Anhydride C: Hexahydrophthalic anhydride (RIKACID HH manufactured by Shin Nippon Rikka Co., Ltd.)

[0248] Diol Additive A: Neopentyl Glycol (manufactured by Mitsubishi Gas Chemical Company)

[0249] Diol Additive B: Hydrogenated Bisphenol A (RIKABINOL HB manufactured by Shin Nippon Rikka Co., Ltd.)

[0250] Curing accelerator: 2-ethyl-4-methylimidazolium

[0251] Examples 1-16 and Comparative Examples 1-2

[0252] The components shown in Tables 1 and 2 were melt-mixed at the proportions indicated in the tables at 50°C to 140°C, and then cooled to obtain an epoxy resin composition. The reactivity of the obtained epoxy resin composition was adjusted at 40°C to 80°C, and then pulverized and pressed into sheets to produce resin sheets for optical semiconductor sealing.

[0253] Using the small pieces prepared in the various embodiments and comparative examples, various physical properties were determined using the methods shown below, and reflow solderability and hot hardness were evaluated. The results are shown in Tables 1 and 2.

[0254] <Preparation of Experimental Sheets (Cures)>

[0255] Using small pieces prepared as described above and molded using a special mold (curing conditions: heating at 150°C for 4 minutes), a cured specimen of the corresponding size for the test method was produced. The curing process was completed by heating the cured specimen at 150°C for 3 hours, thus obtaining the test specimen.

[0256] <Energy storage modulus E'>

[0257] Using the test specimens prepared above (size: width 5mm × length 35mm × thickness 1mm), the storage modulus E' of the test specimens was obtained using the RSA-II manufactured by RHEOMETRICSCIENTIFIC under the following conditions: tensile mode, frequency 1Hz, scanning temperature 0℃~270℃, and heating rate 10℃ / min. The storage modulus of the cured products at the measurement temperatures of 265℃ and 100℃ was then derived.

[0258] Glass transition temperature (Tg)

[0259] The storage modulus E' and loss modulus E” of the above-prepared test piece (dimensions: width 5mm × length 35mm × thickness 1mm) were obtained using an RSA-II instrument manufactured by RHEOMETRIC SCIENTIFIC under tensile mode, frequency 1Hz, scanning temperature 0℃~270℃, and heating rate 10℃ / min. The tanδ (=E” / E') curve was obtained from the storage modulus E' and loss modulus E”, and the glass transition temperature (Tg) was determined according to the peak temperature of tanδ.

[0260] <Linear transmittance>

[0261] First, a quartz cell was filled with Fujifilm film and liquid paraffin manufactured by Kojun Pharmaceutical Co., Ltd., and the baseline was measured using a V-670 spectrophotometer manufactured by Nippon Spectrophotometer Co., Ltd. Then, the test pieces (dimensions: 50mm width × 50mm length × 1mm thickness) prepared above, before and after reflow soldering, were immersed in the liquid paraffin in the quartz cell, and the light transmittance at various wavelengths (300nm, 400nm, and 450nm) was measured.

[0262] <Reflow Soldering>

[0263] The test piece was passed through a reflow oven (peak temperature 265℃ × 10 seconds) three times.

[0264] <Evaluation of Package Fabrication>

[0265] like Figure 1 As shown, a small piece prepared above was molded to the dimensions of 5mm width × 6mm length × 2mm thickness (curing conditions: heated at 150°C for 4 minutes) to cover the end of a reliability evaluation frame (Ag) manufactured by Hirai Precision Industries Co., Ltd. The evaluation package was obtained by heating it at 150°C for 3 hours to achieve complete curing. Twenty of these packages were manufactured for each embodiment and comparative example.

[0266] <Reflow Solder Resistance>

[0267] The aforementioned packages were passed through a reflow oven (peak temperature 265°C × 10 seconds) three times. Next, the packages were immersed in red ink manufactured by Taiyo Co., Ltd., and subjected to depressurization for 10 minutes. The packages were then removed, and the ink penetration was visually observed. Packages with ink penetration were deemed to have poor peeling properties. The number of packages with poor peeling properties out of 20 packages was counted, and reflow soldering resistance was evaluated according to the following criteria.

[0268] 〇: 0 to 5

[0269] ×: 6 or more

[0270] Temperature Cycling Test (TCT)

[0271] The aforementioned packages were exposed to high temperature (130°C) and low temperature (-40°C) for 15 minutes each. Recovery from each temperature was completed within 5 minutes. This was treated as a cycle, and the packages were subjected to 1000 temperature cycling tests. The packages were then removed and inspected for cracks. The number of packages with cracks out of 20 was counted, and evaluated according to the following criteria.

[0272] 〇: 0 to 5

[0273] ×: 6 or more

[0274] <Hot Hardness>

[0275] The test pieces prepared above (size: 50mm width × 50mm length × 3mm thickness) were tested for hot hardness at 200℃ using a Shore A hardness tester and evaluated according to the following standards.

[0276] ○: Hot hardness less than 70

[0277] ×: Hot hardness is 70 or higher

[0278]

[0279]

[0280] Industrial practicality

[0281] This invention relates to resin molded articles for sealing optical semiconductor elements, optical semiconductor sealing materials, and optical semiconductor devices. This invention can be used in the manufacture of optical semiconductor devices.

Claims

1. A resin molded article for sealing a light semiconductor, wherein, The resin molding for sealing the optoelectronic semiconductor satisfies the following relationship (1), and also satisfies the following relationship (3) or (4). The cured material with dimensions of 5 mm width × 35 mm length × 1 mm thickness obtained by the following method has a storage modulus of 1.4 × 10⁻⁶ at 265°C. 6 Pa or higher and 1.5 × 10 7 Below Pa, 0.0005 < E' 265℃ / E' 100℃ ≤ 0.0050 (1) In the formula, E' 265℃ and E' 100℃ These represent the storage modulus of a cured material with dimensions of 5 mm width × 35 mm length × 1 mm thickness, obtained by the following method, at 265 °C and 100 °C, respectively, in Pa. Method for producing a cured product: The resin molded product is heated at 150 °C for 4 minutes for molding, and then heated at 150 °C for 3 hours to obtain a cured product. Y <6300000> provided that 130 ≤ X < 150 (3) Y < 160000X - 17000000 provided that 150 ≤ X ≤ 190 (4) In formulas (3) and (4), X represents the glass transition temperature of the cured product with dimensions of width 5 mm × length 35 mm × thickness 1 mm obtained by the said method, in °C, and Y represents the storage modulus of the cured product at 265 °C, in Pa.

2. The resin-molded article for optical semiconductor sealing according to claim 1, wherein The resin molded product for optical semiconductor sealing satisfies the following relational expression (5): 0.70＜R 450nm ＜1.00 (5) In the formula, R 450nm This represents the ratio of the linear transmittance at a wavelength of 450 nm after three reflow soldering cycles at 265°C to the linear transmittance at a wavelength of 450 nm before the reflow soldering of a cured material with dimensions of 50 mm width × 50 mm length × 1 mm thickness obtained by the method.

3. The resin-molded article for optical semiconductor sealing according to claim 1 or 2, wherein The resin molded product for optical semiconductor sealing satisfies the following relational expressions (6) and (7): 0.80 < R 400nm / R 450nm <1.00 (6) 0.10 < R 300nm / R 450nm <0.50 (7) In each formula, R 300nm R 400nm and R 450nm These represent the ratios of the linear transmittance at wavelengths of 300nm, 400nm, and 450nm after three reflow soldering cycles at 265°C for a cured material with dimensions of 50mm width × 50mm length × 1mm thickness obtained by the above method, to the linear transmittance at wavelengths of 300nm, 400nm, and 450nm before the reflow soldering.

4. The resin-molded article for optical semiconductor sealing according to claim 1 or 2, wherein When the resin molded product for optical semiconductor sealing is made into a cured product with dimensions of width 50 mm × length 50 mm × thickness 1 mm by the said method, the linear transmittance at a wavelength of 450 nm is 70% or more.

5. The resin-molded article for optical semiconductor sealing according to claim 1 or 2, wherein The resin molded product for optical semiconductor sealing contains a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator.

6. The resin-molded article for optical semiconductor sealing according to claim 5, wherein The resin molded product for optical semiconductor sealing further contains a polyol and a reaction product of the polyol and the curing agent.

7. The resin-molded article for optical semiconductor sealing according to claim 1 or 2, wherein The resin molded product for optical semiconductor sealing contains at least one compound selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III). Formula (I): In the formula, A 1 Indicates an organic group containing two or more ring structures; R 1a Indicates the site containing epoxy resin residues; R 1b Represents a hydrogen atom or related to R 1a Bonded bonds, Formula (II): In the formula, A 2 Indicates an organic group; R 2a This indicates a site containing epoxy resin residues having a continuous ring structure of two or more rings, excluding ethylene oxide rings; R 2b Represents a hydrogen atom or related to R 2a Bonded bonds, Formula (III): In the formula, A 3 represents an organic group; R 3a represents an organic group having a non-aromatic ring.

8. A light semiconductor sealing material, wherein, The optical semiconductor sealing material is obtained by molding the resin molded product for optical semiconductor sealing according to any one of claims 1 to 7.

9. A light semiconductor device, wherein, The optical semiconductor device has an optical semiconductor element and the optical semiconductor sealing material according to claim 8 that seals the optical semiconductor element.

10. A resin molded article for sealing a light semiconductor, wherein, The resin molding for sealing the optoelectronic semiconductor satisfies the following relationship (1), and also satisfies the following relationships (6) and (7). The cured material with dimensions of 5 mm width × 35 mm length × 1 mm thickness obtained by the following method has a storage modulus of 1.4 × 10⁻⁶ at 265°C. 6 Pa or higher and 1.5 × 10 7 Below Pa, 0.0005 < E' 265℃ / E' 100℃ ≤0.0050 (1) In the formula, E' 265℃ and E' 100℃ These represent the storage modulus of a cured material with dimensions of 5 mm width × 35 mm length × 1 mm thickness, obtained by the following method, at 265 °C and 100 °C, respectively, in Pa. Method for producing a cured product: The resin molded product is heated at 150 °C for 4 minutes for molding, and then heated at 150 °C for 3 hours to obtain a cured product. 0.80 < R 400nm / R 450nm <1.00 (6) 0.10 < R 300nm / R 450nm <0.50 (7) In equations (6) and (7), R 300nm R 400nm and R 450nm These represent the ratios of the linear transmittance at wavelengths of 300nm, 400nm, and 450nm after three reflow soldering cycles at 265°C for a cured material with dimensions of 50mm width × 50mm length × 1mm thickness obtained by the above method, to the linear transmittance at wavelengths of 300nm, 400nm, and 450nm before the reflow soldering.

11. The resin molded article for sealing optical semiconductors as described in claim 10, wherein, When the resin molded product for optical semiconductor sealing is made into a cured product with dimensions of width 5 mm × length 35 mm × thickness 1 mm by the said method, the glass transition temperature is 130 °C or more, and the resin molded product for optical semiconductor sealing satisfies the following relational expression (2): Y < 160000X - 14500000 (2) In the formula, X represents the glass transition temperature of the cured product, in °C, and Y represents the storage modulus of the cured product at 265 °C, in Pa.

12. The resin-molded article for optical semiconductor sealing according to claim 10 or 11, wherein The resin molded product for optical semiconductor sealing satisfies the following relational expression (5): 0.70＜R 450nm ＜1.00 (5) In the formula, R 450nm This represents the ratio of the linear transmittance at a wavelength of 450 nm after three reflow soldering cycles at 265°C to the linear transmittance at a wavelength of 450 nm before the reflow soldering of a cured material with dimensions of 50 mm width × 50 mm length × 1 mm thickness obtained by the method.

13. The resin-molded article for optical semiconductor sealing according to claim 10 or 11, wherein When the resin molded product for optical semiconductor sealing is made into a cured product with dimensions of width 50 mm × length 50 mm × thickness 1 mm by the said method, the linear transmittance at a wavelength of 450 nm is 70% or more.

14. The resin-molded article for optical semiconductor sealing according to claim 10 or 11, wherein The resin molded product for optical semiconductor sealing contains a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator.

15. The resin molded article for sealing optical semiconductors as described in claim 14, wherein, The resin molding for sealing optical semiconductors also includes polyols and reaction products of polyols and curing agents.

16. The resin-molded article for sealing a light semiconductor as claimed in claim 10 or 11, wherein The resin molding for sealing optical semiconductors comprises at least one compound selected from the group consisting of a compound having a structural unit (I) represented by formula (I), a compound having a structural unit (II) represented by formula (II), and a compound having a structural unit (III) represented by formula (III). Formula (I): In the formula, A 1 Indicates an organic group containing two or more ring structures; R 1a Indicates the site containing epoxy resin residues; R 1b Represents a hydrogen atom or related to R 1a Bonded bonds, Equation (II): In the formula, A 2 Indicates an organic group; R 2a This indicates a site containing epoxy resin residues having a continuous ring structure of two or more rings, excluding ethylene oxide rings; R 2b Represents a hydrogen atom or related to R 2a Bonded bonds, Equation (III): In the formula, A 3 represents an organic group; R 3a represents an organic group having a non-aromatic ring.

17. An optical semiconductor sealing material, wherein, The optical semiconductor sealing material is obtained by molding the optical semiconductor sealing resin molded article according to any one of claims 10 to 16.

18. A light semiconductor device, wherein, The optical semiconductor device has an optical semiconductor element and an optical semiconductor sealing material as described in claim 17 for sealing the optical semiconductor element.

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