Chip packaging structure and chip packaging method

Abstract

The present disclosure relates to a chip packaging structure and a chip packaging method, wherein the chip packaging structure comprises a base frame, a chip, a conductive support and a packaging material body; the chip is arranged on one side of the base frame; the conductive support is arranged on the base frame and is insulated between the conductive support and the base frame; one end of the conductive support is electrically connected with the chip, and the other end of the conductive support extends in a direction away from the base frame; the packaging material body is formed on the base frame by injection molding to wrap the chip and the conductive support inside, and the other end of the conductive support protrudes from the packaging material body to form a solder pad for connecting peripheral devices, that is, by arranging one end of the conductive support to be electrically connected with the chip, and arranging the other end of the conductive support to extend away from the base frame and to extend out of the packaging material body and form a solder pad to connect peripheral devices, three-dimensional packaging is achieved, and the size of the chip packaging structure in the horizontal direction can be reduced, which is beneficial to miniaturization of the chip packaging structure.

Description

Technical Field

[0001] This disclosure relates to the field of chip packaging technology, and in particular to a chip packaging structure and a chip packaging method. Background Technology

[0002] Chip packaging refers to the assembly of hundreds of thousands or even millions of chips into a compact package that is powered and communicates with from the outside.

[0003] As the complexity of various electronic products increases, the requirements for high integration and miniaturization of chip packaging technology are becoming increasingly stringent. When using traditional two-dimensional packaging technology to package chips, the resulting chip packaging structure has a large horizontal dimension, which cannot meet the requirements for chip miniaturization. Summary of the Invention

[0004] To solve the above-mentioned technical problems, or at least partially solve them, this disclosure provides a chip packaging structure and a chip packaging method.

[0005] This disclosure provides a chip packaging structure, including a substrate frame, a chip, a conductive support, and a packaging material body;

[0006] The chip is disposed on one side of the substrate frame;

[0007] The conductive support is disposed on the substrate frame and is insulated from the substrate frame. One end of the conductive support is electrically connected to the chip, and the other end of the conductive support extends in a direction away from the substrate frame. The encapsulation material is formed on the substrate frame by injection molding to encapsulate the chip and the conductive support. The other end of the conductive support protrudes from the encapsulation material to form a solder pad for connecting peripheral devices.

[0008] According to one embodiment of this disclosure, the conductive support includes a first support and a second support. The first support is disposed within the encapsulation material and one end of the first support is electrically connected to the chip. The other end of the first support is connected to the second support. The second support is parallel to the substrate frame and partially protrudes from the encapsulation material. The side of the second support opposite to the substrate frame forms the bonding pad.

[0009] According to one embodiment of the present disclosure, the first support includes a first sub-support and a second sub-support; one end of the second sub-support is connected to the first sub-support, and the other end of the second sub-support extends in a direction away from the base frame and is connected to the second support; the first sub-support is parallel to the base frame, and the first sub-support is disposed on the base frame and electrically connected to the chip.

[0010] According to one embodiment of this disclosure, the second sub-support is flat or arc-shaped.

[0011] According to one embodiment of this disclosure, the second sub-support is planar, and the first sub-support and the second support are respectively disposed on both sides of the second sub-support.

[0012] According to one embodiment of this disclosure, an insulating adhesive is provided between the first sub-support and the base frame, so that the conductive support and the base frame are connected and insulated through the insulating adhesive.

[0013] According to one embodiment of this disclosure, the conductive support includes at least two, and the at least two conductive supports are disposed on both sides of the chip.

[0014] According to one embodiment of this disclosure, the conductive support includes two conductive supports, which are respectively disposed on both sides of the chip and are symmetrically arranged with respect to the chip.

[0015] According to one embodiment of this disclosure, the chip is electrically connected to one end of the conductive support via a wire.

[0016] This disclosure also provides a chip packaging method for fabricating the above-described chip packaging structure, comprising the following steps:

[0017] A chip is disposed on one side of the substrate frame;

[0018] A conductive support is disposed on one side of the substrate frame, and one end of the conductive support is electrically connected to the chip; wherein, the conductive support and the substrate frame are insulated from each other, and the other end of the conductive support extends away from the substrate frame;

[0019] An encapsulation material is injection molded on one side of the substrate frame to form an encapsulation material body, which encapsulates the chip and the conductive support within the encapsulation material body; wherein the side of the encapsulation material body away from the substrate frame protrudes from the conductive support.

[0020] The side of the encapsulation material away from the base frame is polished so that the other end of the conductive support protrudes from the encapsulation material and forms a solder pad for connecting peripheral devices.

[0021] The technical solution provided in this disclosure has the following advantages compared with the prior art:

[0022] This disclosure provides a chip packaging structure and a chip packaging method. The chip packaging structure includes a substrate frame, a chip, a conductive support, and a packaging material body. The chip is disposed on one side of the substrate frame. The conductive support is disposed on the substrate frame and is insulated from the substrate frame. One end of the conductive support is electrically connected to the chip, and the other end of the conductive support extends in a direction away from the substrate frame. The packaging material body is formed on the substrate frame by injection molding to encapsulate the chip and the conductive support. The other end of the conductive support protrudes from the packaging material body to form a bonding pad for connecting peripheral devices. The chip packaging structure of this disclosure achieves three-dimensional packaging by setting one end of the conductive support to be electrically connected to the chip and the other end to extend away from the substrate frame and protrude from the packaging material body to form a bonding pad for connecting peripheral devices. The bonding pad formed on the packaging material body for connecting peripheral devices can reduce the horizontal size of the chip packaging structure, which is beneficial for miniaturizing the chip packaging structure. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the chip packaging structure described in the embodiments of this disclosure;

[0026] Figure 2 This is a schematic flowchart of the chip packaging method described in the embodiments of this disclosure.

[0027] Among them, 1. base frame; 2. chip; 3. conductive support; 31. first support; 311. first sub-support; 312. second sub-support; 32. second support; 4. encapsulation material body; 5. solder pad; 6. bottom solder pad; 7. insulating adhesive; 8. wire. Detailed Implementation

[0028] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0029] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0030] like Figure 1 As shown, this disclosure provides a chip packaging structure, including a substrate frame 1, a chip 2, a conductive support 3, and a packaging material body 4; the chip 2 is disposed on one side of the substrate frame 1, for example, on... Figure 1 The upper surface of the substrate frame 1 is shown. A conductive support 3 is disposed on the substrate frame 1 and is insulated from the substrate frame 1. One end of the conductive support 3 is electrically connected to the chip 2, and the other end of the conductive support 3 extends in a direction away from the substrate frame 1, so that the conductive support 3 is vertically three-dimensional. The encapsulation material body 4 is formed on the substrate frame 1 by injection molding to encapsulate the chip 2 and the conductive support 3. The other end of the conductive support 3 protrudes from the encapsulation material body 4 to form a solder pad 5 for connecting peripheral devices. That is, the chip encapsulation structure of this disclosure achieves three-dimensional encapsulation by setting a three-dimensional and vertically arranged conductive support 3 electrically connected to the chip 2, and the other end extending away from the substrate frame 1 and protruding from the encapsulation material body 4 to form a solder pad 5 for connecting peripheral devices. The solder pad 5 formed on the encapsulation material body 4 is used to connect peripheral devices, which can reduce the size of the chip encapsulation structure in the horizontal direction and is conducive to miniaturization of the chip encapsulation structure.

[0031] Specifically, such as Figure 1 As shown, the base frame 1 can be a copper frame or other conductive support, and the bottom of the copper frame can be provided with a bottom pad 6.

[0032] Chip 2 is located on one side of the base frame 1, for example... Figure 1 As shown in the drawing orientation, chip 2 is located on the upper surface of the base frame 1, and the outline size of chip 2 is smaller than the outline size of the base frame 1.

[0033] The conductive support 3 is disposed on the substrate frame 1, and the conductive support 3 is insulated from the substrate frame 1 to prevent electrical connection between the conductive support 3 and the substrate frame 1. One end of the conductive support 3 is electrically connected to the chip 2, specifically, the bottom of the conductive support 3 and the chip 2 can be electrically connected by wire bonding. The other end of the conductive support 3 extends in a direction away from the substrate frame 1, and the conductive support 3 is in the height direction of the chip 2 (i.e., as shown in the image). Figure 1The conductive support 3 is positioned vertically (as shown in the vertical direction) above the top surface of chip 2, making the overall conductive support 3 vertically oriented to facilitate the subsequent formation of a three-dimensional packaging structure and reduce the horizontal dimensions of the chip packaging structure. Furthermore, peripheral devices connected to the solder pad 5 are directly connected to chip 2 via the vertically oriented conductive support 3, which can reduce parasitic impedance and inductance of related signals or power supplies caused by the connection method to a certain extent.

[0034] In addition, the conductive support 3 can be a copper support. In addition to its excellent electrical conductivity, the copper support also has good thermal conductivity, which can transfer the working heat generated by the chip 2 through the copper conductive support 3, thereby enhancing the heat dissipation effect of the chip 2.

[0035] The encapsulation material body 4 is formed on the substrate frame 1 by injection molding to encapsulate the chip 2 and the conductive support 3. The other end of the conductive support 3 protrudes from the encapsulation material body 4, that is, the upper end of the conductive support 3 protrudes beyond the encapsulation material body 4 to form a solder pad 5 for connecting peripheral devices, such as capacitors or inductors, so as to save the horizontal dimension of the encapsulation structure, that is, reduce the placement area of ​​peripheral devices on the substrate frame 1.

[0036] Specifically, when the encapsulation material body 4 is injection molded onto the substrate frame 1 and encapsulates the chip 2 and conductive support 3, the encapsulation material body 4 has a regular shape, such as a rectangle. For example, the upper surface of the encapsulation material body 4 can be a plane parallel to the substrate frame 1. The encapsulation material body 4 can be injection molded from encapsulation material, such as encapsulation plastic.

[0037] like Figure 1 As shown, the conductive support 3 includes a first support 31 and a second support 32. The first support 31 is disposed inside the encapsulation material body 4 and one end of the first support 31 is electrically connected to the chip 2. The other end of the first support 31 is connected to the second support 32. The second support 32 is parallel to the base frame 1 and partially protrudes outside the encapsulation material body 4. The side of the second support 32 away from the base frame 1 forms a bonding pad 5. That is, the first support 32 is vertically arranged and the second support 32 is horizontally arranged.

[0038] like Figure 1As shown, the first support 31 includes a first sub-support 311 and a second sub-support 312; one end of the second sub-support 312 is connected to the first sub-support 311, and the other end of the second sub-support 312 extends in a direction away from the substrate frame 1 and is connected to the second support 32; the first sub-support 311 is parallel to the substrate frame 1, the first sub-support 311 is disposed on the substrate frame 1 and electrically connected to the chip 2, that is, the first sub-support 311 is horizontally disposed, and the second sub-support 312 is vertically extended and protrudes beyond the encapsulation material body 4. The second sub-support 312 can be flat, curved, or any other arbitrary shape.

[0039] like Figure 1 As shown, in this embodiment, the second sub-support 312 is planar, and the first sub-support 311 and the second support 32 are respectively disposed on both sides of the second sub-support 312, so as to form as shown in the figure. Figure 1 The Z-shaped support shown can provide good stability. Of course, the conductive support 3 can also be formed into a C-shape or other shapes, but this embodiment does not limit this.

[0040] like Figure 1 As shown, an insulating adhesive 7 is provided between the first sub-support 311 and the base frame 1, so that the conductive support 3 and the base frame 1 are connected and insulated by the insulating adhesive 7. That is, the first sub-support 311 of the conductive support 3 is fixed to the base frame 1 by bonding with the insulating adhesive 7, and the insulating adhesive 7 itself is insulating, thereby achieving insulation between the first sub-support 311 and the conductive support 3. In addition, the conductive support 3 is placed on the base frame 1 simultaneously during the bonding process between the conductive support 3 and the base frame 1 by the insulating adhesive 7. In this embodiment, the insulating adhesive 7 is specifically insulating glue.

[0041] like Figure 1 As shown, the conductive support 3 includes at least two, and the at least two conductive supports 3 are respectively disposed on both sides of the chip 2. The specific conductive supports 3 can be as follows: Figure 1 As shown, there are two conductive supports 3, which are respectively disposed on both sides of the chip 2; or in other embodiments, there are multiple conductive supports 3, which can be disposed at intervals on both sides of the chip 2 or at intervals around the outer periphery of the chip 2.

[0042] In this embodiment, when two conductive supports 3 are provided, the two conductive supports 3 are respectively located on both sides of the chip 2 and are symmetrically arranged with respect to the chip 2.

[0043] According to one embodiment of this disclosure, the chip 2 is electrically connected to the bottom of the conductive support 3 via a wire 8, such as a metal wire.

[0044] like Figure 2As shown, this disclosure also provides a chip packaging method for fabricating the above-described chip packaging structure, comprising the following steps:

[0045] S101: The chip is placed on one side of the base frame;

[0046] S102: A conductive support is provided on one side of the substrate frame, and one end of the conductive support is electrically connected to the chip; wherein, the conductive support and the substrate frame are insulated from each other, and the other end of the conductive support extends away from the substrate frame.

[0047] S103: Injecting encapsulation material into one side of the substrate frame to form an encapsulation material body, wherein the encapsulation material body encapsulates the chip and the conductive support; wherein the side of the encapsulation material body away from the substrate frame protrudes from the conductive support.

[0048] S104: Grind the side of the encapsulation material away from the base frame so that the other end of the conductive support protrudes from the encapsulation material and forms a solder pad for connecting peripheral devices.

[0049] Specifically, in step S101, the substrate frame can be a copper frame, and the chip is a bare chip. In step S102, the conductive support can be a copper support, and the conductive support is vertically oriented to form a three-dimensional packaging structure. In step S103, to facilitate injection molding, the side of the packaging material away from the substrate frame protrudes from the conductive support, and the packaging material is further polished in step S104 to expose the upper end of the conductive support and form a bonding pad for connection with peripheral devices.

[0050] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0051] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip packaging structure, characterized in that, It includes a base frame (1), a chip (2), a conductive support (3), and a packaging material body (4); The chip (2) is disposed on one side of the substrate frame (1); The conductive support (3) is disposed on the substrate frame (1) and is insulated from the substrate frame (1). One end of the conductive support (3) is electrically connected to the chip (2), and the other end of the conductive support (3) extends in a direction away from the substrate frame (1). The encapsulation material body (4) is formed on the substrate frame (1) by injection molding to encapsulate the chip (2) and the conductive support (3). The other end of the conductive support (3) protrudes from the encapsulation material body (4) to form a solder pad (5) for connecting peripheral devices. The conductive support (3) includes a first support (31) and a second support (32). The first support (31) is disposed inside the encapsulation material body (4) and one end of the first support (31) is electrically connected to the chip (2). The other end of the first support (31) is connected to the second support (32). The second support (32) is parallel to the substrate frame (1) and partially protrudes outside the encapsulation material body (4). The side of the second support (32) away from the substrate frame (1) forms the bonding pad (5). The first support (31) includes a first sub-support (311) and a second sub-support (312); one end of the second sub-support (312) is connected to the first sub-support (311), and the other end of the second sub-support (312) extends in a direction away from the base frame (1) and is connected to the second support (32); the first sub-support (311) is parallel to the base frame (1), and the first sub-support (311) is disposed on the base frame (1) and electrically connected to the chip (2); An insulating adhesive (7) is provided between the first sub-support (311) and the base frame (1) so that the conductive support (3) and the base frame (1) are connected and insulated through the insulating adhesive (7); The chip (2) is electrically connected to one end of the conductive support (3) via a wire (8); The bottom of the substrate frame (1) is provided with a bottom pad (6), and the chip (2) is disposed on the upper surface of the substrate frame (1).

2. The chip packaging structure according to claim 1, characterized in that, The second sub-support (312) is flat or arc-shaped.

3. The chip packaging structure according to claim 1, characterized in that, The second sub-support (312) is planar, and the first sub-support (311) and the second support (32) are respectively disposed on both sides of the second sub-support (312).

4. The chip packaging structure according to any one of claims 1 to 3, characterized in that, The conductive support (3) includes at least two, and at least two of the conductive supports (3) are disposed on both sides of the chip (2).

5. The chip packaging structure according to claim 4, characterized in that, The conductive support (3) includes two, and the two conductive supports (3) located on both sides of the chip (2) are symmetrically arranged with respect to the chip (2).

6. A chip packaging method for fabricating a chip packaging structure as described in any one of claims 1 to 5, characterized in that, Includes the following steps: A chip is disposed on one side of the substrate frame; A conductive support is disposed on one side of the substrate frame, and one end of the conductive support is electrically connected to the chip; wherein, the conductive support and the substrate frame are insulated from each other, and the other end of the conductive support extends away from the substrate frame; An encapsulation material is injection molded on one side of the substrate frame to form an encapsulation material body, which encapsulates the chip and the conductive support within the encapsulation material body; wherein the side of the encapsulation material body away from the substrate frame protrudes from the conductive support. The side of the encapsulation material away from the base frame is polished so that the other end of the conductive support protrudes from the encapsulation material and forms a solder pad for connecting peripheral devices.

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