Display device and method of manufacturing a display device

Abstract

A display device and a method of manufacturing the display device are provided. The display device includes a display panel, a circuit board, and a conductive adhesive member. The display panel includes a display area and a non-display area adjacent to the display area. The circuit board overlaps the non-display area and is connected to the display panel. The conductive adhesive member is located between the circuit board and the display panel and electrically connects the circuit board and the display panel. The circuit board includes a base layer, a plurality of circuit pads, and a first resin layer, the base layer includes a pad area, the plurality of circuit pads overlap the pad area and are located on the base layer, the plurality of circuit pads are spaced apart in a plan view and are arranged in a direction, and the first resin layer overlaps the pad area and is located on the base layer. In the plan view, the first resin layer overlaps an area between two adjacent circuit pads and covers side surfaces of the two adjacent circuit pads facing each other in the direction.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0068126, filed on June 5, 2020, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0003] The embodiments generally relate to display devices, and more specifically, to display devices and methods of manufacturing display devices. Background Technology

[0004] Various display devices are being developed for multimedia devices such as televisions, mobile phones, tablets, navigation systems, game consoles, and the like. The display devices include a display panel for displaying images. The display panel may include multiple gate lines, multiple data lines, and multiple pixels connected to the gate lines and data lines. The display panel may be connected to a circuit board and electronic components that provide electrical signals for image display to the gate lines and / or data lines. The circuit board and electronic components may be electrically connected to the display panel by various methods. As an example, conductive adhesive members may be arranged between pads on the circuit board and pads on the display panel to enable electrical connection between the circuit board and the display panel.

[0005] The information disclosed in this section is only for understanding the background of the concept of the present invention, and therefore may contain information that does not form prior art. Summary of the Invention

[0006] Some aspects offer display devices that can improve process efficiency.

[0007] Several aspects provide methods for manufacturing display devices that can improve process efficiency.

[0008] Additional aspects will be set forth in the detailed description below and will be apparent in part from this disclosure or may be learned by practicing the inventive concepts.

[0009] According to some aspects, the display device includes a display panel, a circuit board, and a conductive adhesive member. The display panel includes a display area and a non-display area adjacent to the display area. The circuit board overlaps with the non-display area and is connected to the display panel. The conductive adhesive member is disposed between the circuit board and the display panel. The conductive adhesive member electrically connects the circuit board and the display panel. The circuit board includes a base layer, a plurality of circuit pads, and a first resin layer. The base layer includes pad areas. The plurality of circuit pads overlap with the pad areas and are disposed on the base layer. The plurality of circuit pads are spaced apart from each other in a plan view and arranged in one direction. The first resin layer overlaps with the pad areas and is disposed on the base layer. In a plan view, the first resin layer overlaps with the area between two adjacent circuit pads among the plurality of circuit pads and covers the side surfaces of the two adjacent circuit pads facing each other in one direction.

[0010] According to some aspects, a method of manufacturing a display device includes: aligning a circuit board and a display panel such that a plurality of circuit pads of the circuit board arranged in one direction face a plurality of drive pads of the display panel, the circuit board including a first resin layer between two adjacent circuit pads among the plurality of circuit pads; placing an adhesive member including a second resin layer and conductive particles located in the second resin layer between the plurality of circuit pads and the plurality of drive pads; and pressing at least one of the circuit board and the display panel such that the first resin layer and the second resin layer contact each other, thereby electrically connecting the plurality of circuit pads and the plurality of drive pads to each other via the conductive particles.

[0011] According to some aspects, a method of manufacturing a display device includes: placing an adhesive member comprising a second resin layer and conductive particles located in the second resin layer between a plurality of circuit pads arranged in one direction on a circuit board and a plurality of drive pads on a display panel, the circuit board including a first resin layer located between two adjacent circuit pads among the plurality of circuit pads; and pressing at least one of the circuit board and the display panel such that the first resin layer and the second resin layer contact each other, and the plurality of circuit pads and the plurality of drive pads are electrically connected to each other via the conductive particles. Each of the first resin layer and the second resin layer includes a photoinitiator or a thermal initiator.

[0012] The foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the claimed subject matter. Attached Figure Description

[0013] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0014] Figure 1AThis is a perspective view of the display device according to the embodiment;

[0015] Figure 1B This is an exploded perspective view of the display device according to the embodiment;

[0016] Figure 2 This is a cross-sectional view of the display module according to the implementation method;

[0017] Figure 3 This is a plan view of the display panel according to the embodiment;

[0018] Figure 4 This is an exploded perspective view of the display device according to the embodiment;

[0019] Figure 5 This is a perspective view of a conductive adhesive component according to an embodiment;

[0020] Figure 6A It is according to the implementation method along Figure 4 The cross-sectional view shown is taken by section line I-I'.

[0021] Figure 6B It is according to the implementation method along Figure 4 The cross-sectional view shown is taken by section line I-I'.

[0022] Figure 7A and Figure 7B This is a perspective view of a circuit board according to some implementation methods;

[0023] Figure 8A It is according to the implementation method along Figure 7B The cross-sectional view taken by section line II-II' shown in the figure;

[0024] Figure 8B It is according to the implementation method along Figure 7B The cross-sectional view taken by section line II-II' shown in the figure;

[0025] Figure 8C This is a perspective view of the circuit board according to the embodiment;

[0026] Figure 9A , Figure 9B and Figure 9C This is a view showing the display device at various stages of manufacturing according to an embodiment;

[0027] Figure 10A and Figure 10B These are views showing the display device at various stages of manufacturing according to an embodiment; and

[0028] Figure 11A , Figure 11B and Figure 11CThis is a view showing the display device at various stages of manufacturing according to an embodiment. Detailed Implementation

[0029] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of the various embodiments. As used herein, the terms “implementation” and “mode of implementation” are used interchangeably and are non-limiting examples employing one or more of the inventive concepts disclosed herein. However, it will be apparent that various embodiments may be practiced without these specific details or in one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, the various embodiments may be different, but are not necessarily exclusive. For example, the specific shape, construction, and characteristics of an embodiment may be used or implemented in another embodiment without departing from the inventive concept.

[0030] Unless otherwise specified, the embodiments shown are to be understood as exemplary features providing variations of some exemplary embodiments. Therefore, unless otherwise specified, the various illustrated features, components, modules, layers, films, panels, areas, aspects, etc. (hereinafter individually or collectively referred to as “elements” or “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from the concept of the invention.

[0031] Crosshairs and / or shading are typically provided in the accompanying drawings to clarify the boundaries between adjacent elements. Therefore, unless otherwise specified, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, proportion, commonalities between the elements shown, or any other characteristics, properties, performance, etc., of the elements. Additionally, in the drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. Therefore, the dimensions and relative dimensions of individual elements are not necessarily limited to those shown in the drawings. When embodiments can be implemented in different ways, the specific process sequence may be performed differently from the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Furthermore, similar reference numerals denote similar elements.

[0032] When an element (such as a layer) is described as being "on," "connected to," or "attached to" another element, it may be directly on, directly connected to, or directly attached to the other element, or there may be intermediate elements present. However, when an element is described as being "directly" on, directly connected to, or directly attached to another element, there are no intermediate elements present. Other terms and / or phrases used to describe relationships between elements should be interpreted in a similar manner (e.g., "between" vs. "directly between," "adjacent" vs. "directly adjacent," "on" vs. "directly on," etc.). Furthermore, the term "connected" can refer to a physical connection, an electrical connection, and / or a fluid connection. Additionally, the X, Y, and Z axes are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the DR1, DR2, and DR3 axes may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the cluster of X, Y, and Z" can be interpreted as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0033] While the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0034] Spatial relative terms, such as “beneath,” “below,” “under,” “lower,” “above,” “upper,” “over,” “higher,” and “side” (e.g., as in “sidewall”), may be used herein for descriptive purposes and, therefore, to describe the relationship between one element and another as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are also intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will subsequently be oriented “above” other elements or features. Thus, the term “below” can encompass both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and thus, the spatial relative descriptive terms used herein are interpreted accordingly.

[0035] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the,” as used herein, are intended to include the plural forms as well. Furthermore, the terms “comprise,” “comprising,” “include,” and / or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and / or clusters thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or clusters thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximations rather than terms of degree, and are thus utilized to account for inherent biases in measurements, calculations, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0036] Various embodiments are described herein with reference to schematic illustrations of idealized embodiments and / or intermediate structures, including cross-sectional views, isometric views, perspective views, plan views, and / or exploded views. Therefore, variations in the shapes of the illustrations, resulting from, for example, manufacturing techniques and / or tolerances, are to be expected. Consequently, the embodiments disclosed herein should not be construed as limited to the specific shapes of the regions shown, but will include deviations in shape due to, for example, manufacturing processes. Therefore, the regions shown in the figures may be schematic in nature, and their shapes may not reflect the actual shapes of the regions of the device, and are thus not intended to be limiting.

[0037] Unless otherwise specified, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Unless expressly defined herein, terms, such as those defined in common dictionaries, shall be interpreted as having the meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense.

[0038] As is customary in the art, some embodiments of functional blocks, units, and / or modules are shown and described in the accompanying drawings. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuitry, such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, and wiring connectors, which may be formed using semiconductor-based or other manufacturing techniques. In the case of blocks, units, and / or modules implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may be selectively driven by firmware and / or software. It is also contemplated that each block, unit, and / or module may be implemented by dedicated hardware, or may be implemented as a combination of dedicated hardware performing some functions and processors (e.g., one or more programmed microprocessors and associated circuitry) performing other functions. Furthermore, without departing from the concept of the invention, each block, unit, and / or module of some embodiments may be physically separated into two or more interactive and discrete blocks, units, and / or modules. Furthermore, without departing from the concept of the present invention, some implementation blocks, units and / or modules may be physically combined into more complex blocks, units and / or modules.

[0039] In the following text, various embodiments will be explained in detail with reference to the accompanying drawings.

[0040] Figure 1A This is a perspective view of the display device DD according to the embodiment. Figure 1B This is an exploded perspective view of the display device DD according to the embodiment. Figure 2 This is a cross-sectional view of the display module DM according to the implementation method.

[0041] In this specification, as an example, the display device DD is shown for use in a mobile phone terminal, but the implementation is not limited thereto. Although not shown in the drawings, electronic modules, camera modules, power modules, and / or the like mounted on the motherboard can be arranged together with the display device DD in a bracket / housing to constitute a mobile phone terminal. In addition to large electronic devices such as televisions, monitors, and billboards, the display device DD according to some embodiments can also be applied to small and medium-sized electronic devices such as tablet computers, car navigation units, game consoles, and smartwatches.

[0042] Reference Figure 1A The display device DD can display the image IM through the display surface DD-IS. As an example of the image IM, Figure 1AAn icon image is shown. The display surface DD-IS is parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DD-IS (e.g., the thickness direction of the display device DD) is indicated by the third direction DR3. In this specification, "viewed in a plan view" or "in a plan view" means viewing the element on the third direction DR3. The front (or upper) surface and rear (or lower) surface of each of the various layers, units, etc., described below are distinguished by the third direction DR3. However, as a relative concept, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be converted to other directions, for example, opposite directions.

[0043] The display surface DD-IS includes a display area DD-DA for displaying the image IM and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA may be an area where the image IM is not displayed. However, the implementation is not limited to this. For example, the non-display area DD-NDA may be adjacent to one side of the display area DD-DA or omitted from one side of the display area DD-DA.

[0044] Reference Figure 1B The display device DD may include a window WM, a display module DM, a driver chip DC, a circuit board CF, and a storage component BC. The storage component BC houses the display module DM and may be combined (or connected) with the window WM.

[0045] A window WM is arranged on the display module DM and can transmit images (such as image IM) provided by the display module DM to the outside. The window WM includes a transmissive region TA and a non-transmissive region NTA. The transmissive region TA overlaps with the display regions DD-DA and may have a shape corresponding to the display regions DD-DA. The image IM displayed on the display regions DD-DA of the display device DD can be observed from the outside through the transmissive region TA of the window WM.

[0046] The non-transmissive region NTA overlaps with the non-display region DD-NDA and may have a shape corresponding to the non-display region DD-NDA. The non-transmissive region NTA may be a region with relatively low light transmittance compared to the transmissive region TA. However, the implementation is not limited to this configuration. For example, the non-transmissive region NTA may be omitted.

[0047] The window WM can be made of at least one of glass, sapphire, and plastic, but the implementation is not limited thereto. Furthermore, although the window WM is shown as a single layer, it can comprise multiple layers. The window WM may include a base layer and at least one printed layer that overlaps with the non-transparent region NTA and is disposed on the back surface of the base layer. The printed layer may have a predetermined color. For example, the printed layer may be set to black, or it may be set to a color other than black.

[0048] The display module DM is arranged between the window WM and the storage component BC. The display module DM includes a display panel DP and an input detection layer ISU. The display panel DP generates an image (e.g., an image IM) and can transmit the generated image to (or through) the window WM.

[0049] According to the embodiments, the display panel DP can be a light-emitting display panel, but the type (or kind) of the display panel DP is not particularly limited. For example, the display panel DP can be an organic light-emitting display panel, a quantum dot light-emitting display panel, etc. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include one or more quantum dots, quantum rods, and / or the like. In addition, although the display panel DP is shown as rigid, the display panel DP may be flexible, such that the display panel DP can be folded along a folding axis or bent in at least one direction.

[0050] In the following text, the display panel DP will be described as an organic light-emitting display panel. However, the implementation is not limited to this, and various display panels may be used in association with at least one implementation.

[0051] Reference Figure 2 The display panel DP includes a substrate SUB and circuit element layer DP-CL, display element layer DP-OLED and encapsulation layer TFL arranged on the substrate SUB.

[0052] The display panel DP includes the display area DP-DA and the non-display area DP-NDA. The display area DP-DA of the display panel DP can correspond to... Figure 1A The display area shown is DD-DA or Figure 1B The transmission region TA is shown in the diagram. The non-display region DP-NDA can correspond to... Figure 1A The non-display area DD-NDA shown is... Figure 1B The non-transmissive region NTA is shown in the figure.

[0053] The substrate SUB may include at least one plastic film. In some embodiments, as a flexible substrate, the substrate SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate. The substrate SUB may be a component that substantially supports the parts of the display panel DP, and in this specification, the substrate SUB may be described as a display substrate.

[0054] The circuit element layer DP-CL includes at least one intermediate insulating layer and one or more circuit elements. The intermediate insulating layer includes at least one intermediate inorganic film and at least one intermediate organic film. The circuit elements may include signal lines, pixel driving circuits for pixels, and the like.

[0055] The DP-OLED display element layer includes at least organic light-emitting diodes. The DP-OLED display element layer may also include an organic layer, such as a pixel defining layer. According to an embodiment, when the display panel is configured as a liquid crystal display panel, the display element layer may include a liquid crystal layer.

[0056] The encapsulation layer TFL seals the display element layer DP-OLED. For example, the encapsulation layer TFL can be a thin-film sealing layer. The encapsulation layer TFL protects the display element layer DP-OLED from foreign matter such as moisture, oxygen, and dust particles. However, the implementation is not limited to this, and a sealing substrate can be provided instead of (or attached to) the encapsulation layer TFL. In this case, the sealing substrate can face the substrate SUB, and the circuit element layer DP-CL and the display element layer DP-OLED can be arranged between the sealing substrate and the substrate SUB.

[0057] Reference Figure 2 The encapsulation layer TFL is shown as overlapping the display area DP-DA, but is not limited thereto. For example, the encapsulation layer TFL may partially overlap with the non-display area DP-NDA.

[0058] An input detection layer (ISU) can be positioned between the window WM and the display panel DP. The ISU detects input applied from the outside. Externally applied input can be provided in various forms. For example, external input includes various types of external inputs, such as a part of the user's body, a stylus, light, heat, or pressure. Moreover, touch of a part of the body (such as the user's hand) and spatial touch (e.g., hover) near or adjacent to the user's body can also be forms of input.

[0059] The input detection layer (ISU) can be directly disposed on the display panel (DP). In this specification, "structure A is directly disposed on structure B" means that no adhesive layer is disposed between structure A and structure B. In some embodiments, the input detection layer (ISU) can be manufactured together with the display panel (DP) via a continuous process. However, the embodiments are not limited to this. For example, the input detection layer (ISU) can be a separate panel and can be combined with the display panel (DP) via an adhesive layer. As another example, the input detection layer (ISU) can be omitted.

[0060] Refer again Figure 1B The driver chip DC overlaps with the non-display area DP-NDA and can be arranged on the display panel DP. For example, the driver chip DC can generate drive signals for the operation of the display panel DP based on control signals transmitted from the circuit board CF. The driver chip DC can then transmit the generated drive signals to the circuit element layer DP-CL of the display panel DP.

[0061] The circuit board CF is electrically connected to the display module DM. For example... Figure 1BAs shown, the circuit board CF is shown as being connected to the display panel DP, but the circuit board CF can be electrically connected to each of the display panel DP and the input detection layer ISU.

[0062] According to one embodiment, each of the circuit board CF and the driver chip DC can be electrically connected to the display panel DP via a conductive adhesive member. For example, a conductive adhesive member can be arranged between the circuit board CF and the display panel DP, and the circuit board CF and the display panel DP can be electrically connected by a plurality of conductive particles included in the conductive adhesive member.

[0063] Figure 3 This is a plan view of the display panel DP according to the embodiment.

[0064] Reference Figure 3 The display panel DP may include a driving circuit GDC, multiple signal lines SGL, multiple first driving pads DP-PD, multiple second driving pads DP-CPD, and multiple pixels PX. The multiple pixels PX are arranged in the display area DP-DA. Each of the multiple pixels PX includes an organic light-emitting diode and a pixel driving circuit connected thereto. The driving circuit GDC, signal lines SGL, first driving pads DP-PD, second driving pads DP-CPD, and pixel driving circuit may be included... Figure 2 The circuit element layer DP-CL is shown.

[0065] The driving circuit GDC outputs a gate signal (e.g., sequentially) to multiple gate lines GL. The driving circuit GDC may also output another control signal to the pixel PX. The driving circuit GDC may include multiple thin-film transistors formed using the same process as the pixel driving circuit of the pixel PX (e.g., low-temperature polycrystalline silicon (LTPS), low-temperature polycrystalline oxide (LTPO), and / or similar processes).

[0066] The multiple signal lines SGL include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. The gate lines GL are connected to corresponding pixels PX, and the data lines DL are also connected to corresponding pixels PX. The power line PL is connected to the pixel PX. The control signal line CSL provides control signals to the drive circuit GDC.

[0067] Signal lines SGL overlap with the display area DP-DA and the non-display area DP-NDA. Each of the plurality of signal lines SGL may include a pad portion and a line portion. The line portion overlaps with the display area DP-DA and the non-display area DP-NDA. The pad portion is connected to the end of the line portion. The pad portion is arranged in the non-display area DP-NDA and overlaps with the corresponding signal pad among the plurality of first drive pads DP-PD.

[0068] In the following description, the area where the first driving pad DP-PD is arranged among the multiple portions of the non-display area DP-NDA can be defined as the chip area NDA-DC, and the area where the second driving pad DP-CPD is arranged can be defined as the first pad area NDA-PC1.

[0069] According to the implementation method, Figure 1B The driver chip DC shown can be mounted on the chip area NDA-DC. The first driver pad DP-PD is electrically connected to the driver chip DC to transmit the electrical signals received from the driver chip DC to the signal line SGL.

[0070] The plurality of first driving pads DP-PDs includes a plurality of first row pads DP-PD1 arranged in a first row along a first direction DR1 and a plurality of second row pads DP-PD2 arranged in a second row along the first direction DR1. However, the implementation is not limited thereto. For example, the plurality of first driving pads DP-PDs may be arranged in one row or multiple rows along the first direction DR1.

[0071] Any portion of the circuit board CF can be disposed on the first pad area NDA-PC1. The second drive pad DP-CPD is electrically connected to the circuit board CF to transmit electrical signals received from the circuit board CF to the first drive pad DP-PD. The circuit board CF can be rigid and / or flexible. For example, when the circuit board CF is flexible, it can be configured as a flexible printed circuit board.

[0072] The circuit board CF may include timing control circuitry for controlling the operation of the display panel DP. This timing control circuitry may be mounted on the circuit board CF as an integrated chip. Additionally, although not shown, the circuit board CF may include input detection circuitry for controlling the input detection layer ISU.

[0073] The circuit board CF may include circuit pads CF-PD that are electrically connected to the display panel DP. The circuit pads CF-PD may be arranged in a second pad area NDA-PC2 defined in (or on) the circuit board CF.

[0074] Although the display panel DP is described as including installation... Figure 1BThe diagram shows the structure of the first driver pad DP-PD for the driver chip DC, but the implementation is not limited to this. The driver chip DC can be mounted on the circuit board CF. In this case, the first driver pad DP-PD can be omitted.

[0075] Figure 4 This is an exploded perspective view of the display device DD according to the embodiment. Figure 5 This is a perspective view of the first conductive adhesive member AF-C according to an embodiment.

[0076] Reference Figure 4 The display device DD includes a first conductive adhesive member AF-C disposed between a circuit board CF and a substrate SUB of a display panel DP, and a second conductive adhesive member AF-D disposed between a driver chip DC and a substrate SUB of the display panel DP. The first conductive adhesive member AF-C electrically connects the circuit board CF and the display panel DP, and the second conductive adhesive member AF-D electrically connects the driver chip DC and the display panel DP.

[0077] The circuit board CF includes an upper surface CF-US and a lower surface CF-DS. The lower surface CF-DS of the circuit board CF may be the surface facing the display panel DP. Circuit pads CF-PD are arranged on the lower surface CF-DS of the circuit board CF and may be electrically connected to the second driving pads DP-CPD of the display panel DP. The circuit pads CF-PD and the second driving pads DP-CPD may be electrically connected to each other through a first conductive adhesive member AF-C. The circuit pads CF-PD may contact the upper surface of the first conductive adhesive member AF-C, and the second driving pads DP-CPD may contact the lower surface of the first conductive adhesive member AF-C.

[0078] The driver chip DC includes an upper surface DC-US and a lower surface DC-DS. The lower surface DC-DS of the driver chip DC may be the surface facing the display panel DP. The driver chip DC includes chip pads DC-PD that are electrically connected to first driver pads DP-PD disposed on the substrate SUB. The chip pads DC-PD include a first row of chip pads DC-PD1 arranged in a first row along a first direction DR1 and a second row of chip pads DC-PD2 arranged in a second row along the first direction DR1. The first row of chip pads DC-PD1 and the second row of chip pads DC-PD2 may have a shape that exposes the lower surface DC-DS of the driver chip DC to the outside.

[0079] In this specification, multiple chip pad DC-PDs are described as being arranged in two rows, but based on the structure with the first drive pad DP-PD arranged, multiple chip pad DC-PDs may be arranged in a single row or multiple rows.

[0080] Chip pad DC-PD and first drive pad DP-PD can be electrically connected to each other via second conductive adhesive member AF-D. Chip pad DC-PD can contact the upper surface of second conductive adhesive member AF-D, and circuit pad CF-PD of circuit board CF can contact the upper surface of first conductive adhesive member AF-C.

[0081] Reference Figure 5 The figure shows a first conductive adhesive member AF-C disposed between the circuit board CF and the substrate SUB of the display panel DP. Although not shown in the figure, the structure of the second conductive adhesive member AF-D may also have the same characteristics. Figure 5 The first conductive adhesive member AF-C shown has essentially the same structure.

[0082] The first conductive adhesive component AF-C includes a resin layer AF-AD and a plurality of conductive particles CB dispersed in the resin layer AF-AD. For example, the conductive particles CB are contained within the resin layer AF-AD. Circuit pads CF-PD and second drive pads DP-CPD are respectively in contact with the conductive particles CB, such that the circuit pads CF-PD and the second drive pads DP-CPD can be electrically connected to each other.

[0083] According to some embodiments, the resin layer AF-AD may be an adhesive resin including a photoinitiator or a thermal initiator. For example, the resin layer AF-AD including a photoinitiator can be activated by ultraviolet light, and the resin layer AF-AD including a thermal initiator can be activated by external heat.

[0084] Multiple conductive particles CB are spaced apart from each other and can be divided into multiple conductive clusters arranged in a first direction DR1. Each of the multiple conductive clusters may include multiple conductive particles CB arranged in a second direction DR2.

[0085] According to some embodiments, multiple conductive clusters have an aligned structure and can be arranged in a resin layer AF-AD. The multiple conductive clusters may have a structure that overlaps with each other in a first direction DR1. For example, in a cross-section of the resin layer AF-AD, the conductive particles CB of different conductive clusters may have a structure that overlaps with each other in the first direction DR1. Accordingly, each of the multiple conductive particles CB dispersed in the resin layer AF-AD can be positioned at the same height from the lower surface of the resin layer AF-AD.

[0086] Furthermore, each of the plurality of conductive particles CB may have a diameter of a first length DS. The resin layer AF-AD in which the conductive particles CB are dispersed may be configured as a film type having a constant thickness H1. According to some embodiments, the thickness H1 of the resin layer AF-AD may be 0.5 times or more and 2.0 times or less the diameter length (e.g., the first length DS) of each of the plurality of conductive particles CB.

[0087] By setting the thickness H1 of the resin layer AF-AD based on the above conditions, irregular arrangement of conductive particles CB can be prevented during the bonding of the circuit pad CF-PD and the second drive pad DP-CPD.

[0088] In some embodiments, during the bonding of the circuit pads CF-PD and the second drive pads DP-CPD, the upper and lower surfaces of the resin layer AF-AD can be pressed by the circuit pads CF-PD and the second drive pads DP-CPD, respectively. In this case, the arrangement of the conductive particles CB included in the resin layer AF-AD can also be changed by the pressure applied to the resin layer AF-AD. For example, by pressing the resin layer AF-AD, two adjacent conductive clusters in the first direction DR1 can move closer to each other. In this case, a short circuit may occur between the two circuit pads CF-PD or the two second drive pads DP-CPD that receive different signals.

[0089] However, since the resin layer AF-AD according to various embodiments may be provided with a thickness of 0.5 times or more and 2.0 times or less than the diameter of the first length DS of each of the plurality of conductive particles CB, movement of the conductive particles CB in the first direction DR1 can be prevented even when the resin layer AF-AD is pressed. Therefore, when pressure is applied to the conductive particles CB according to the pressure of the resin layer AF-AD (hereinafter referred to as the second resin layer AF-AD), the conductive particles CB can be pinned between the circuit pad CF-PD and the second drive pad DP-CPD. As a result, short circuits between the two circuit pads CF-PD or the two second drive pads DP-CPD that receive different signals can be prevented.

[0090] Figure 6A It is according to the implementation method along Figure 4 The cross-sectional view shown is taken by section line I-I'. Figure 6B It is according to the implementation method along Figure 4 The cross-sectional view shown is taken by section line I-I'.

[0091] Figure 6A The diagram shows the structure in which the circuit pad CF-PD of the circuit board CF and the second drive pad DP-CPD of the display panel DP are bonded. Additionally, Figure 6A It shows Figure 4 The diagram shows two second drive pads (DP-CPDs) and two circuit pads (CF-PDs) electrically connected to them. The two circuit pads (CF-PDs) are electrically insulated and can receive other electrical signals.

[0092] Reference Figure 6AThe circuit board CF includes a base layer CF-BS, circuit pads CF-PD, and a first resin layer CF-AD. Although not shown in the figures, an insulating layer may also be disposed on the base layer CF-BS. For example, the insulating layer may be disposed between the base layer CF-BS and the circuit pads CF-PD. The first resin layer CF-AD may be an adhesive resin including a photoinitiator or a thermal initiator. For example, the first resin layer CF-AD including a photoinitiator may be activated by ultraviolet light, and the first resin layer CF-AD including a thermal initiator may be activated by external heat.

[0093] The circuit pad CF-PD includes a first circuit pad CF-P1 disposed on the base layer CF-BS and a second circuit pad CF-P2 disposed on the base layer CF-BS, covering the first circuit pad CF-P1. The second circuit pad CF-P2 may have a smaller thickness than the first circuit pad CF-P1. In some embodiments, the first circuit pad CF-P1 may be copper (Cu), and the second circuit pad CF-P2 may be tin (Sn). The second circuit pad CF-P2 can prevent the first circuit pad CF-P1, which is made of copper, from being oxidized externally.

[0094] According to some embodiments, the first resin layer CF-AD can be arranged in... Figure 4 Between two adjacent circuit pads CF-PD among the multiple circuit pads CF-PD shown. Figure 6A As shown, the first resin layer CF-AD may have a structure that is completely arranged in the space between the two circuit pads CF-PD facing each other on the first direction DR1.

[0095] Depending on the thickness of the second resin layer AF-AD, the thickness of the first resin layer CF-AD can be thinner, the same as, or greater than the thickness of the circuit pad CF-PD along the third direction DR3. Thus, the first resin layer CF-AD has a structure that contacts each of the side surfaces of the circuit pad CF-PD facing each other in the first direction DR1 and each of the base layers CF-BS, and for example, the first resin layer CF-AD can completely cover the side surfaces of the circuit pad CF-PD.

[0096] Display panel DP includes reference Figure 2 The substrate SUB, the first insulating layer IL1 and the second insulating layer IL2 disposed on the substrate SUB, and the second drive pad DP-CPD (hereinafter referred to as drive pad DP-CPD) are described.

[0097] According to some embodiments, at least one insulating layer may be disposed between the drive pad DP-CPD and the substrate SUB. For example, in Figure 6AThe diagram shows a first insulating layer IL1 and a second insulating layer IL2 stacked on a substrate SUB. A drive pad DP-CPD can be disposed on the first insulating layer IL1. The second insulating layer IL2 exposes the drive pad DP-CPD to the outside and can also be disposed on the first insulating layer IL1.

[0098] The driving pad DP-CPD may include any of a metal and a transparent conductive layer. For example, the transparent conductive layer may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The metal may include at least one of molybdenum, silver, titanium, copper, aluminum, alloys thereof, and the like.

[0099] Despite passing Figure 6A The DP-CPD driving pad is described as having a single construction including either a metal or a transparent conductive layer, but implementations are not limited to this. For example, such as Figure 6B As shown, each of the multiple drive pad DP-CPDs may include two stacked first pads PD1 and second pads PD2. The first pads PD1 may be metal, and the second pads PD2 may be a transparent conductive layer. In this case, the second pads PD2 may be disposed on the first pads PD1.

[0100] Return to reference Figure 6A The circuit pad CF-PD and the drive pad DP-CPD can be electrically bonded to each other via the conductive particles CB of the first conductive adhesive member AF-C. (As with...) Figure 5 As described in connection, the second resin layer AF-AD of the first conductive adhesive member AF-C may have a thickness of 0.5 to 2.0 times the diameter of each conductive particle CB. Meanwhile, when the first resin layer CF-AD of the circuit board CF is omitted, an internal space may be defined between the second resin layer AF-AD and the base layer CF-BS of the circuit board CF.

[0101] According to one embodiment, the internal space can be filled by a first resin layer CF-AD of the circuit board CF. In this case, the first resin layer CF-AD can have a greater thickness than the second resin layer AF-AD.

[0102] For example, when the circuit pad CF-PD and the drive pad DP-CPD are bonded, the first resin layer CF-AD and the second resin layer AF-AD are configured as an adhesive layer. That is, the first resin layer CF-AD and the second resin layer AF-AD have a structure in contact with each other, and the circuit board CF and the display panel DP can be substantially fixed. The first resin layer CF-AD is fixed to the base layer CF-BS and the circuit pad CF-PD of the circuit board CF, and the second resin layer AF-AD can be fixed to the second insulating layer IL2. In addition, the first resin layer CF-AD is fixed to the base layer CF-BS and the circuit pad CF-PD of the circuit board CF, and the second resin layer AF-AD can also be fixed to the first resin layer CF-AD.

[0103] Furthermore, even after the circuit pads CF-PD and drive pads DP-CPD are bonded, the multiple conductive particles CB can still have a structure that overlaps with each other in the first direction DR1. In this way, since the orientation structure of the multiple conductive particles CB is maintained, short circuits between the multiple circuit pads CF-PD and / or the multiple drive pads DP-CPD can be prevented.

[0104] As described above, since the circuit board CF according to various embodiments includes a first resin layer CF-AD bonded to the first conductive adhesive member AF-C, the bonding process between the circuit board CF and the display panel DP is easier. When the first resin layer CF-AD of the circuit board CF is omitted, a process of filling the internal space with an adhesive layer and a process of curing it are performed after the bonding process of the circuit pad CF-PD and the drive pad DP-CPD. However, in various embodiments, since the circuit board CF is provided with a structure including the first resin layer CF-AD, the process of filling the internal space with an adhesive layer after the bonding process of the circuit pad CF-PD and the drive pad DP-CPD can be omitted. As a result, the overall process efficiency of the display device DD can be improved.

[0105] Figure 7A and Figure 7B This is a perspective view of a circuit board CF according to some implementation methods. Figure 8A It is based on the implementation method along Figure 7B The cross-sectional view shown is taken by section line II-II'. Figure 8B It is based on the implementation method along Figure 7B The cross-sectional view shown is taken by section line II-II'. Figure 8C This is a perspective view of the circuit board CF according to the embodiment.

[0106] Reference Figure 7A and Figure 7B To form Figure 6A The manufacturing process of the circuit board CF shown is described.

[0107] Reference Figure 7A A base layer CF-BS is provided for the circuit board CF. A plurality of circuit pads CF-PD arranged in the first direction DR1 can be formed on the second pad region NDA-PC2 defined in the base layer CF-BS. Although the plurality of circuit pads CF-PD are shown arranged in a single row, the implementation is not limited thereto, and the plurality of circuit pads CF-PD may be arranged in multiple rows.

[0108] Reference Figure 7B A first resin layer CF-AD can be formed on the base layer CF-BS. According to some embodiments, the first resin layer CF-AD can be formed on the base layer CF-BS by at least one of the following methods: nozzle, inkjet, and printing transfer. Additionally, the first resin layer CF-AD can be configured as a carrier film type to be formed on the base layer CF-BS.

[0109] In a plan view, the first resin layer CF-AD may overlap between two adjacent circuit pads CF-PD of the plurality of circuit pads CF-PD, and cover the side surfaces of the two circuit pads CF-PD facing each other in the first direction DR1. Figure 7B As shown, the first resin layer CF-AD may have a structure that overlaps with a portion of the base layer CF-BS of the circuit board CF.

[0110] like Figure 7B As shown, the circuit board CF defines a first region IA and a second region INA. In the first region IA, a first resin layer CF-AD is disposed on a base layer CF-BS, and in the second region INA, the first resin layer CF-AD does not overlap with the base layer CF-BS. The first region IA may include a second pad region NDA-PC2. In a plan view, the first resin layer CF-AD may completely surround the second pad region NDA-PC2 on which circuit pads CF-PD are disposed. Furthermore, according to some embodiments, the first region IA may have a smaller planar area than the second region INA.

[0111] For example, refer to Figure 8A The first resin layer CF-AD covers multiple circuit pads CF-PD as a whole and can be disposed on the base layer CF-BS. In this case, on the third-direction DR3, each of the multiple circuit pads CF-PD has a first thickness D1, and the first resin layer CF-AD may have a second thickness D2 that is larger than the first thickness D1.

[0112] As another example, refer to Figure 8BThe first resin layer CF-AD may expose at least a portion of each of the plurality of circuit pads CF-PD. For example, each of the plurality of circuit pads CF-PD may include a lower surface CF-PDS facing the base layer CF-BS and an upper surface CF-PDU opposite to the lower surface CF-PDS. At least one region of the upper surface CF-PDU of each of the plurality of circuit pads CF-PD may be exposed to the outside from the first resin layer CF-AD. In this way, depending on the thickness of the second resin layer AF-AD, the first resin layer CF-AD may have a thickness less than, equal to, or greater than the thickness DT of each of the plurality of circuit pads CF-PD on the third direction DR3.

[0113] Reference Figure 8C The first resin layer CF-AD can be completely overlapped on the base layer CF-BS. For example, the first resin layer CF-AD can be with... Figure 7B The first region IA and the second region INA shown overlap and can be formed on the base layer CF-BS. In this case, the first resin layer CF-AD can cover the multiple circuit pads CF-PD as a whole, or expose at least a portion of each of the multiple circuit pads CF-PD to the outside.

[0114] Figures 9A to 9C This is a view showing the display device at various stages of manufacturing according to an embodiment.

[0115] Reference Figure 9A A circuit board CF is provided, comprising a plurality of circuit pads CF-PD arranged along a first direction DR1 and a first resin layer CF-AD disposed between the plurality of circuit pads CF-PD. For example... Figure 9A As shown, although the first resin layer CF-AD covers the multiple circuit pads CF-PD as a whole, the first resin layer CF-AD may expose at least a portion of each of the multiple circuit pads CF-PD.

[0116] Reference Figure 9B A display panel DP is provided, comprising multiple drive pads DP-CPD, each facing a plurality of circuit pads CF-PD. The circuit pads CF-PD and drive pads DP-CPD may be arranged to face each other. A first conductive adhesive member AF-C may be disposed between the aligned circuit pads CF-PD and drive pads DP-CPD. The first conductive adhesive member AF-C may include a second resin layer AF-AD having a thickness smaller than that of the first resin layer CF-AD, and includes conductive particles CB arranged in a first direction DR1 and sprayed onto the second resin layer AF-AD.

[0117] According to some implementations, before the circuit pads CF-PD and drive pads DP-CPD are bonded, on the third-direction DR3, the second resin layer AF-AD may have a thickness of 0.5 to 2.0 times the diameter of the first length DS of each of the plurality of conductive particles CB.

[0118] After aligning the circuit pad CF-PD and the drive pad DP-CPD, a first conductive adhesive member AF-C is provided, but the implementation is not limited to this. As an example, after providing the first conductive adhesive member AF-C, a process for aligning the circuit pad CF-PD and the drive pad DP-CPD can be performed. As another example, after providing the drive pad DP-CPD, the first conductive adhesive member AF-C can be provided. Subsequently, a process for aligning the circuit pad CF-PD with the drive pad DP-CPD can be performed, and a process corresponding to the reverse is also possible. Then, an operation is performed to press either the circuit board CF or the display panel DP. Through this process, the first resin layer CF-AD and the second resin layer AF-AD are brought into contact with each other, and the circuit pad CF-PD and the drive pad DP-CPD are electrically connected to each other via conductive particles CB.

[0119] Subsequently, refer to Figure 9C The process involves curing the first resin layer CF-AD and the second resin layer AF-AD that are in contact with each other. For example... Figure 9C As shown, the curing of the first resin layer CF-AD and the second resin layer AF-AD can be performed by an external element FS applied from the outside.

[0120] For example, the external element FS can be ultraviolet light. In this case, each of the first resin layer CF-AD and the second resin layer AF-AD includes a photoinitiator and can be cured by ultraviolet light emitted from the outside.

[0121] As another example, the external element FS can be external heat. In this case, each of the first resin layer CF-AD and the second resin layer AF-AD includes a thermal initiator and can be cured by heat applied from the outside.

[0122] According to various embodiments, the first resin layer CF-AD of the circuit board CF and the second resin layer AF-AD of the first conductive adhesive member AF-C can be cured by a single process.

[0123] Figure 10A and Figure 10B This is a view showing the display device at various stages of manufacturing according to an embodiment.

[0124] Reference Figure 10ABefore the bonding process between the circuit board CF and the display panel DP, the first resin layer CF-AD of the circuit board CF can be cured in advance. In this case, the first resin layer CF-AD can be cured by ultraviolet light or external heat.

[0125] Reference Figure 10B This allows for the execution of a process between a circuit board CF, including a cured first resin layer CF-AD, and a display panel DP. In this case, a process of electrically bonding circuit pads CF-PD and drive pads DP-CPD is performed using the conductive particles CB of the first conductive adhesive member AF-C. Then, after the second resin layer AF-AD comes into contact with the first resin layer CF-AD, the second resin layer AF-AD, which is included in the first conductive adhesive member AF-C, can be cured.

[0126] The curing process of the second resin layer AF-AD can be performed later than the curing process of the first resin layer CF-AD. As a result, the curing process of the second resin layer AF-AD can be performed using the same process as the curing process of the first resin layer CF-AD, or it can be performed using a different process.

[0127] Figures 11A to 11C This is a view showing the display device at various stages of manufacturing according to an embodiment.

[0128] First, with Figure 9B Compared to the circuit board CF shown, reference Figure 11A The circuit board CFz may include a first resin layer CF-ADz having a first refractive index. Additionally, the remaining components of the circuit board CFz may substantially correspond to... Figure 9B The remaining components of the circuit board CF shown.

[0129] In addition, with Figure 9B Compared to the first conductive adhesive member AF-C shown, the first conductive adhesive member AF-Cz may include a second resin layer AF-ADz having a second refractive index. Furthermore, the remaining components of the first conductive adhesive member AF-Cz may substantially correspond to... Figure 9B The remaining components of the first conductive adhesive member AF-C shown.

[0130] According to an embodiment, the first refractive index of the first resin layer CF-ADz may be lower than the second refractive index of the second resin layer AF-ADz. Since the first refractive index of the first resin layer CF-ADz is lower than the second refractive index of the second resin layer AF-ADz, total internal reflection can occur at the interface between the first resin layer CF-ADz and the second resin layer AF-ADz. In this case, external ultraviolet light can be incident on the second resin layer AF-ADz.

[0131] Each of the first resin layer CF-ADz and the second resin layer AF-ADz may include a photoinitiator. According to an embodiment, the first resin layer CF-ADz may be cured by externally irradiated ultraviolet light prior to bonding with the first conductive adhesive member AF-Cz. Thus, the first resin layer CF-ADz may be cured prior to the second resin layer AF-ADz.

[0132] Reference Figure 11B This allows the operation of pressing either the circuit board CF or the display panel DP. In this way, the first resin layer CF-ADz and the second resin layer AF-ADz come into contact with each other, and the circuit pad CF-PD and the drive pad DP-CPD are electrically connected to each other via conductive particles CB.

[0133] Then, the second resin layer AF-ADz is cured. For example... Figure 11B As shown, ultraviolet light passing through the lower part of the display panel DP can irradiate the second resin layer AF-ADz. Figure 11C According to the implementation method Figure 11B A magnified view of area AA shown. (Refer to...) Figure 11C Because the second refractive index of the second resin layer AF-ADz is greater than the first refractive index of the first resin layer CF-ADz, total internal reflection can occur at the interface between the second resin layer AF-ADz and the first resin layer CF-ADz. For example, a portion of the ultraviolet light transmitted through the second resin layer AF-ADz can be reflected by the first resin layer CF-ADz or can pass through the first resin layer CF-ADz. As described above, ultraviolet light can be totally reflected from the first resin layer CF-ADz and then irradiate the second resin layer AF-ADz. As a result, the curing efficiency of the second resin layer AF-ADz can be improved.

[0134] As another example, ultraviolet light incident on the second resin layer AF-ADz can pass through both the second resin layer AF-ADz and the first resin layer CF-ADz. For instance, when ultraviolet light is irradiated onto the second resin layer AF-ADz in a direction parallel to the third direction DR3, the ultraviolet light may not generate total internal reflection at the interface between the second resin layer AF-ADz and the first resin layer CF-ADz.

[0135] Although reference Figures 11A to 11C An embodiment in which a first resin layer CF-ADz is pre-cured and then a second resin layer AF-ADz is cured is described, but the embodiment is not limited thereto. For example, such as Figure 11CAs shown, the second resin layer AF-ADz and the first resin layer CF-ADz can be cured simultaneously by ultraviolet light. In this case, the ultraviolet light irradiating the lower part of the display panel DP may not cause total reflection at the interface between the second resin layer AF-ADz and the first resin layer CF-ADz, or it may pass through the second resin layer AF-ADz and the first resin layer CF-ADz. Accordingly, the curing of the second resin layer AF-ADz and the first resin layer CF-ADz can be performed simultaneously.

[0136] According to an embodiment, the circuit board may be provided with a structure including a first resin layer disposed between circuit pads, and the conductive adhesive component may include a structure comprising a second resin layer with dispersed conductive particles. Since the circuit pads of the circuit board and the drive pads of the display panel are each bonded, the first and second resin layers can contact each other. Subsequently, since the curing of the first and second resin layers is performed through a single process, the overall process speed and efficiency of the display device can be improved.

[0137] While certain implementations and methods have been described herein, other implementations and variations will become apparent from this description. Accordingly, the inventive concept is not limited to these implementations, but rather to the broader scope of the appended claims and various obvious variations and equivalent arrangements as will be apparent to those skilled in the art.

Claims

1. A display device, comprising: The display panel includes a display area and a non-display area adjacent to the display area; A circuit board that overlaps with the non-display area and is connected to the display panel; as well as A conductive adhesive component is disposed between the circuit board and the display panel, and the conductive adhesive component electrically connects the circuit board and the display panel. The conductive adhesive component includes: Second resin layer; and Multiple conductive particles are dispersed within the second resin layer, and these conductive particles electrically connect the circuit board and the display panel. The circuit board includes: A base layer, the base layer including pad areas; Multiple circuit pads, overlapping with the pad area and disposed on the base layer, the multiple circuit pads being spaced apart from each other in a plan view and arranged in one direction; and A first resin layer overlaps with the pad area and is disposed on the base layer, and In the plan view, the first resin layer overlaps with the area between two adjacent circuit pads among the plurality of circuit pads, and covers the side surfaces of the two adjacent circuit pads facing each other in the stated direction. The plurality of conductive particles are divided into a plurality of conductive clusters, and at least a portion of the plurality of conductive clusters overlap each other in the direction within the second resin layer.

2. The display device as claimed in claim 1, wherein, Each of the first resin layer and the second resin layer includes a photoinitiator, and The refractive index of the second resin layer is greater than that of the first resin layer.

3. The display device as claimed in claim 1, wherein, In the thickness direction of the base layer, the thickness of the first resin layer is greater than the thickness of the second resin layer.

4. The display device as claimed in claim 1, wherein, The first resin layer includes a thermal initiator or a photoinitiator.

5. The display device as claimed in claim 1, wherein, Each of the plurality of circuit pads includes: A first circuit pad, the first circuit pad being disposed on the base layer; and A second circuit pad, which covers the first circuit pad and is disposed on the base layer; The first circuit pad and the second circuit pad comprise different metal materials, and The first resin layer is in contact with the second circuit pad.

6. A method for manufacturing a display device, the method comprising: Align the circuit board and the display panel such that a plurality of circuit pads of the circuit board arranged in one direction face a plurality of drive pads of the display panel, the circuit board including a first resin layer between two adjacent circuit pads among the plurality of circuit pads; An adhesive component comprising an adhesive second resin layer and conductive particles located in the second resin layer is placed between the plurality of circuit pads and the plurality of drive pads. as well as Press at least one of the circuit board and the display panel to bring the first resin layer and the second resin layer into contact with each other, so that the plurality of circuit pads and the plurality of drive pads are electrically connected to each other via the conductive particles, wherein, after the pressing, the conductive particles are divided into a plurality of conductive clusters, and at least a portion of the plurality of conductive clusters remain aligned in the direction within the second resin layer.

7. The method of claim 6, wherein, The refractive index of the second resin layer is greater than that of the first resin layer.

8. The method of claim 7, wherein, Each of the first resin layer and the second resin layer includes a photoinitiator, and The method further includes: after pressing at least one of the circuit board and the display panel, simultaneously photocuring the first resin layer and the second resin layer.

9. A method for manufacturing a display device, the method comprising: An adhesive member comprising an adhesive second resin layer and conductive particles located in the second resin layer is placed between a plurality of circuit pads arranged in one direction on a circuit board and a plurality of drive pads on a display panel, the circuit board comprising a first resin layer located between two adjacent circuit pads among the plurality of circuit pads. as well as Press at least one of the circuit board and the display panel so that the first resin layer and the second resin layer come into contact with each other, and the plurality of circuit pads and the plurality of drive pads are electrically connected to each other via the conductive particles. Upon pressing, the conductive particles are divided into multiple conductive clusters, and at least a portion of these conductive clusters remain aligned in the direction within the second resin layer. Each of the first resin layer and the second resin layer includes a photoinitiator or a thermal initiator.

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