Display device

Abstract

A display device is disclosed. The display device includes: a substrate including a first region and a second region adjacent to the first region; a first light-emitting diode (LED) to a third LED disposed in the first region and including a color-emitting layer; an encapsulation layer stacked with the first LED to the third LED and including an inorganic layer and an organic layer; a first light-shielding wall portion disposed on the encapsulation layer, the first light-shielding wall portion including a first-1 opening, a first-2 opening, and a first-3 opening respectively corresponding to the first LED to the third LED; and a second light-shielding wall portion disposed on the encapsulation layer and stacked with the second region. In a plan view, the first light-shielding wall portion and the second light-shielding wall portion are spaced apart from each other.

Description

[0001] This application is based on and claims priority to Korean Patent Application No. 10-2020-0068600, filed on June 5, 2020, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to a display device, and more specifically, to a display device having improved display quality. Background Technology

[0003] With the development of various electronic devices such as mobile phones, personal digital assistants (PDAs), computers, and large television sets (TVs), various types of display devices suitable for them have also been developed. For example, liquid crystal displays including backlight units and organic light-emitting displays that emit different colors of light in each color region are already widely used in the market. Recently, display devices that include quantum dot color conversion layers (QD-CCLs) have been developed. Summary of the Invention

[0004] One or more embodiments include a display device having improved image quality uniformity and improved display quality. However, these are merely examples, and the scope of disclosure is not limited thereto.

[0005] Other aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the disclosed embodiments given.

[0006] According to one or more embodiments, a display device may include: a substrate including a first region and a second region adjacent to the first region; a first light-emitting diode (LED); a second LED; a third LED disposed in the first region of the substrate and including a color emitting layer; an encapsulation layer stacked with the first, second, and third LEDs and including at least one inorganic layer and at least one organic layer; a first light-shielding wall portion disposed on the encapsulation layer, the first light-shielding wall portion including a first-1 opening, a first-2 opening, and a first-3 opening corresponding to the first, second, and third LEDs, respectively; and a second light-shielding wall portion disposed on the encapsulation layer and stacked with the second region of the substrate. In a plan view, the first and second light-shielding wall portions may be spaced apart from each other.

[0007] According to the given embodiment, the second light-shielding wall portion can be arranged along the edge of the substrate.

[0008] According to the given embodiments, the display device may further include a first color conversion layer located in the first-1 opening, a second color conversion layer located in the first-2 opening, and a light-transmitting layer located in the first-3 opening.

[0009] According to the given embodiments, the first color conversion layer, the second color conversion layer, and the light-transmitting layer may all include scattering particles. The first color conversion layer and the second color conversion layer may each include a first quantum dot and a second quantum dot, and the first quantum dot and the second quantum dot may include the same material and have different sizes from each other.

[0010] According to the given embodiment, the second light-shielding wall portion may include a plurality of second openings.

[0011] According to the given embodiment, the display device may further include a first dummy color conversion layer, a second dummy color conversion layer, and a dummy light-transmitting layer. Each of the first dummy color conversion layer, the second dummy color conversion layer, and the dummy light-transmitting layer may be located in a corresponding second opening among the plurality of second openings.

[0012] According to the given embodiments, the display device may further include a dummy light-transmitting layer located in the plurality of second openings.

[0013] According to the given embodiments, the dummy light-transmitting layer and the light-transmitting layer may include the same material.

[0014] According to the given embodiments, the first light-shielding wall portion and the second light-shielding wall portion may be integral with each other, and the second light-shielding wall portion may include a plurality of second openings.

[0015] According to the given embodiment, the display device may further include a first color conversion layer located in the first-1 opening, a second color conversion layer located in the first-2 opening, a light-transmitting layer located in the first-3 opening, a first dummy color conversion layer, a second dummy color conversion layer, and a dummy light-transmitting layer. Each of the first dummy color conversion layer, the second dummy color conversion layer, and the dummy light-transmitting layer may be located in a corresponding second opening among the plurality of second openings.

[0016] According to the given embodiments, the display device may further include a first color conversion layer located in the first-1 opening, a second color conversion layer located in the first-2 opening, a light-transmitting layer located in the first-3 opening, and a dummy light-transmitting layer located in the plurality of second openings.

[0017] According to the given embodiments, the dummy light-transmitting layer and the light-transmitting layer may include the same material.

[0018] According to the given embodiment, the display device may further include a driver disposed in a second region of the substrate and providing electrical signals to the first, second, and third light-emitting diodes. In the plan view, at least a portion of the second light-shielding wall may be stacked with the driver.

[0019] According to the given embodiments, the first light-shielding wall portion and the second light-shielding wall portion may include the same material.

[0020] According to the given embodiments, both the first light-shielding wall portion and the second light-shielding wall portion may include colored pigments or dyes and / or at least one metal oxide selected from titanium oxide, chromium oxide and molybdenum oxide.

[0021] According to the given embodiments, both the first light-shielding wall portion and the second light-shielding wall portion may have a thickness of approximately 8 μm to approximately 20 μm.

[0022] According to the given embodiments, both the first light-shielding wall portion and the second light-shielding wall portion may include a first surface facing the substrate and a second surface opposite to the first surface, and the second surface may be hydrophobic.

[0023] According to one or more embodiments, a display device may include: a light-emitting unit, including a display area emitting light of a single color and a peripheral area adjacent to the display area; and an optical unit, which converts the light emitted from the light-emitting unit into light of different colors or transmits the light emitted from the light-emitting unit. The light-emitting unit may include: a pixel electrode disposed in the display area; a counter electrode disposed on the pixel electrode; and an emitting layer disposed between the pixel electrode and the counter electrode. The optical unit may include: a first light-shielding wall portion disposed in the display area, the first light-shielding wall portion including a plurality of first openings corresponding to pixel electrodes; a second light-shielding wall portion disposed in the peripheral area and spaced apart from the first light-shielding wall portion in a plan view; a first color conversion layer, a second color conversion layer and a light-transmitting layer, each of the first color conversion layer, the second color conversion layer and the light-transmitting layer being located in a corresponding first opening among the plurality of first openings; a cover layer superimposed on the first light-shielding wall portion; a first color filter layer, a second color filter layer and a third color filter layer, the first color filter layer, the second color filter layer and the third color filter layer being disposed on the cover layer and superimposed on the first color conversion layer, the second color conversion layer and the light-transmitting layer respectively.

[0024] According to the given embodiment, the second light-shielding wall may include a plurality of second openings spaced apart from each other. The display device may also include a first dummy color conversion layer, a second dummy color conversion layer, and a dummy light-transmitting layer. Each of the first dummy color conversion layer, the second dummy color conversion layer, and the dummy light-transmitting layer may be located in a corresponding second opening among the plurality of second openings.

[0025] According to the given embodiments, the first light-shielding wall portion and the second light-shielding wall portion can be integral with each other and can include the same material.

[0026] Other aspects, features, and advantages of the disclosure will be better understood through the accompanying drawings, claims, and detailed descriptions.

[0027] These general and specific aspects can be realized by using systems, methods, computer programs, or any combination thereof. Attached Figure Description

[0028] The above and other aspects, features, and advantages of the disclosed specific embodiments will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 This is a schematic plan view of a display device according to an embodiment;

[0030] Figure 2 This is a schematic equivalent circuit diagram of pixel circuitry for a pixel included in a display device according to an embodiment;

[0031] Figure 3 It is shown schematically. Figure 1 A cross-sectional view of a portion of a display device;

[0032] Figure 4 This is a schematic cross-sectional view showing a portion of a display device according to an embodiment;

[0033] Figure 5 This is a schematic enlarged plan view of a portion of a display device according to an embodiment;

[0034] Figure 6 It is shown schematically. Figure 5 A cross-sectional view of a portion of a display device;

[0035] Figure 7A This is a schematic plan view showing a portion of the first light-shielding wall of a display device according to a comparative example. Figure 7B This is a schematic plan view showing a portion of the first light-shielding wall portion of a display device according to an embodiment;

[0036] Figure 8A and Figure 8B This is a schematic enlarged plan view of a portion of a display device according to other embodiments;

[0037] Figure 9 It is shown schematically. Figure 8A or Figure 8B A cross-sectional view of a portion of a display device;

[0038] Figure 10A and Figure 10B This is a schematic enlarged plan view of a portion of a display device according to other embodiments; and

[0039] Figure 11 It is shown schematically. Figure 10A or Figure 10B A cross-sectional view of a portion of the display device. Detailed Implementation

[0040] Referring now to embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals always denote the same elements. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to explain various aspects of this specification. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expressions “at least one of a, b, or c” or “at least one of a, b, and c” mean only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0041] Because the disclosure can have different modified embodiments, preferred embodiments are shown in the accompanying drawings and described in the detailed description. The effects and characteristics of the disclosure, as well as the methods for achieving these effects and characteristics, will become clear when referring to the embodiments described with reference to the accompanying drawings. However, the disclosure can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein.

[0042] One or more embodiments disclosed will now be described in more detail with reference to the accompanying drawings. Regardless of the drawing numbers, those components that are the same or corresponding to each other are denoted by the same reference numerals, and redundant explanations are omitted.

[0043] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0044] Unless the singular form of an expression has a clearly distinct meaning in the context, the singular form of an expression includes the plural form of the expression.

[0045] It will also be understood that the term “comprising” and its variations as used herein indicate the presence of the stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0046] It will be understood that when a layer, region, or element is referred to as being formed or disposed "on" another layer, region, or element, that layer, region, or element may be formed directly or indirectly on said other layer, region, or element. For example, intermediate layers, intermediate regions, or intermediate elements may exist.

[0047] For ease of explanation, the dimensions of the elements in the accompanying drawings may be exaggerated. In other words, because the dimensions and thicknesses of the components in the drawings are arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0048] When an embodiment can be implemented differently, the specific process sequence can be performed in a sequence different from that described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0049] In the following embodiments, it will be understood that when a layer, region, or component is referred to as "connected to" or "combined to" another layer, region, or component, that layer, region, or component may be directly or indirectly connected to or combined to said other layer, region, or component. For example, intermediate layers, intermediate regions, or intermediate components may exist. In the following embodiments, it will be understood that when a layer, region, or element is referred to as "electrically connected to" or "electrically combined to" another layer, region, or element, that layer, region, or element may be directly or indirectly electrically connected to or electrically combined to said other layer, region, or element. For example, intermediate layers, intermediate regions, or intermediate elements may exist.

[0050] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0051] Unless otherwise defined or implied herein, all terms used (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an ideal or overly formal sense unless expressly defined in the specification.

[0052] Figure 1 This is a schematic plan view of a display device according to an embodiment.

[0053] Reference Figure 1The display device 1 may include a display area DA and a peripheral area PA located outside or adjacent to the display area DA. The display device 1 can provide an image via an array of pixels PX arranged in two dimensions within the display area DA. Pixel PX may include a first pixel PX1, a second pixel PX2, and a third pixel PX3. The peripheral area PA is an area where no image is provided and may completely or partially surround the display area DA. Drivers, etc., that provide electrical signals or power to the pixel circuitry corresponding to each pixel PX may be arranged in the peripheral area PA. Pads (or "solder pads") that can be electrically connected to electronic components, printed circuit boards, etc., may be arranged in the peripheral area PA. For example, a border may be arranged in the peripheral area PA.

[0054] Display device 1 may include a substrate 100. Components included in display device 1 (e.g., light-emitting diodes, pixel circuits, wiring, drivers, electronic devices, etc.) may be arranged on substrate 100. Substrate 100 may include a first region AR1 and a second region AR2. Light-emitting diodes may be arranged in the first region AR1. The first region AR1 may correspond to a display region DA, in which an image is realized by light emitted by the light-emitting diodes. Light-emitting diodes may not be arranged in the second region AR2. Even when light-emitting diodes are arranged, they may not be driven by pixel circuits. Therefore, the second region AR2 may correspond to a peripheral region PA that does not provide an image.

[0055] Although the following description will include organic light-emitting diode (OLED) as part of the display device 1 (see Figure 2 While this can be the case of a light-emitting diode (LED), the disclosed display device 1 is not limited thereto. In another embodiment, the display device 1 may include an inorganic light-emitting display or an inorganic electroluminescent (EL) display (such as a micro LED) or a quantum dot light-emitting display comprising inorganic materials. For example, the emitting layer of the LED disposed in the display device 1 may include organic materials, inorganic materials, quantum dots, organic materials and quantum dots, or inorganic materials and quantum dots.

[0056] Figure 2 This is an equivalent circuit diagram of pixel circuitry for a pixel included in a display device according to an embodiment.

[0057] Reference Figure 2 Display devices ( Figure 1 1) may include a light-emitting diode (LED) and a pixel circuit PC. For example, the LED may include, for example, an organic light-emitting diode (OLED). An OLED may be electrically connected to the pixel circuit PC, receive a driving voltage through the pixel circuit PC, and emit light. The LED emits light through an emitting region. The emitting region can be defined as a pixel. Figure 1 (PX in the middle).

[0058] The pixel circuit PC may include thin-film transistors and storage capacitors. In an embodiment, the pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cap.

[0059] The second thin-film transistor T2 is a switching thin-film transistor that can be electrically connected to the scan line SL and the data line DL, and can be configured to transmit the data voltage (or data signal) input from the data line DL to the first thin-film transistor T1 based on the switching voltage (or switching signal) input from the scan line SL.

[0060] The storage capacitor Cap can be electrically connected to the second thin-film transistor T2 and the drive voltage line PL, and can be configured to store a voltage corresponding to the difference between the voltage received from the second thin-film transistor T2 and the first power supply voltage ELVDD supplied to the drive voltage line PL. The storage capacitor Cap can include at least a first storage plate Cap1 and a second storage plate Cap2.

[0061] The first thin-film transistor T1 is a driving thin-film transistor, which can be electrically connected to the driving voltage line PL and the storage capacitor Cap, and can be configured to control the driving current flowing from the driving voltage line PL to the organic light-emitting diode (OLED) based on the voltage value stored in the storage capacitor Cap. The OLED can emit light with a certain brightness according to the driving current. The counter electrode (e.g., cathode) of the OLED can be configured to receive a second power supply voltage ELVSS.

[0062] Already referred to Figure 2 The description describes a scenario where the pixel circuit PC includes two thin-film transistors and one storage capacitor, but the disclosure is not limited thereto. For example, the pixel circuit PC may include three or more thin-film transistors and / or two or more storage capacitors. In an embodiment, the pixel circuit PC may include seven thin-film transistors and one storage capacitor. The number of thin-film transistors and the number of storage capacitors can vary depending on the design of the pixel circuit PC. For ease of explanation, the scenario where the pixel circuit PC includes two thin-film transistors and one storage capacitor will be described below.

[0063] Figure 3 It is shown schematically. Figure 1 A cross-sectional view of a portion of a display device, and may correspond to along Figure 1 The cross section taken from line III-III'.

[0064] Reference Figure 3The display device 1 may include pixels PX. Pixels PX may include, for example, first pixels PX1 to third pixels PX3. Although Figure 3 The diagram shows first pixels PX1 to third pixels PX3 being adjacent to each other, but the disclosure is not limited to this. Elements such as other pixels or wiring can be located between first pixels PX1 and third pixels PX3. Therefore, for example, first pixels PX1 and second pixels PX2 may not be adjacent to each other. Furthermore, Figure 3 The cross-sections of the first pixel PX1 to the third pixel PX3 in the image do not have to be cut along the same direction.

[0065] The display device 1 according to an embodiment may include a substrate 100. The substrate 100 may include glass, metal, or a polymer resin. When the substrate 100 is flexible or bendable, it may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. For example, the substrate 100 may have a multilayer structure comprising two layers, each containing the aforementioned polymer resin, and a barrier layer between the two layers, the barrier layer comprising an inorganic material. The barrier layer may include an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride.

[0066] The light-emitting diode 200 can be located on the substrate 100. Figure 3 The diagram shows a first light-emitting diode 210, a second light-emitting diode 220, and a third light-emitting diode 230 positioned thereon. In addition to the light-emitting diode 200, thin-film transistors (TFTs) and storage capacitors (Caps) electrically connected to the light-emitting diodes 200 can be located on the substrate 100. For example, pixel circuits (PCs) including both TFTs and storage capacitors (Caps) can be located on the substrate 100. Figure 3 An organic light-emitting diode (OLED) is shown located on substrate 100 as an OLED. The electrical connection between the OLED and the thin-film transistor (TFT) can be understood as the electrical connection between pixel electrodes 211, 221, and 231 and the TFT.

[0067] A thin-film transistor (TFT) may include a semiconductor layer Act, a gate electrode GE superimposed on the channel region of the semiconductor layer Act, and a source electrode SE and a drain electrode DE respectively connected to the source region and drain region of the semiconductor layer Act.

[0068] The semiconductor layer Act may include polycrystalline silicon. In some embodiments, the semiconductor layer Act may include amorphous silicon. In some embodiments, the semiconductor layer Act may include an oxide selected from at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layer Act may include a channel region and impurity-doped source and drain regions.

[0069] The gate electrode GE may include low-resistance conductive materials such as molybdenum (Mo), aluminum (Al), copper (Cu) and / or titanium (Ti), and may include a single-layer structure or a multi-layer structure containing the above materials.

[0070] The source electrode SE or drain electrode DE may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may have a single layer or multiple layers comprising the above materials. For example, the source electrode SE or drain electrode DE may have a three-layer structure of titanium layer / aluminum layer / titanium layer.

[0071] A storage capacitor Cap may include a first storage plate Cap1 and a second storage plate Cap2 stacked on top of each other. The first storage plate Cap1 and the gate electrode GE may be arranged on the same layer and may comprise the same material. The second storage plate Cap2 and the source electrode SE or drain electrode DE may be arranged on the same layer and may comprise the same material. An insulating layer may be present between the first storage plate Cap1 and the second storage plate Cap2 of the storage capacitor Cap. The first storage plate Cap1 and the second storage plate Cap2 are stacked on top of each other to form a capacitor. In this case, the insulating layer may serve as the dielectric layer of the storage capacitor Cap.

[0072] although Figure 3 The diagram shows the gate electrode GE of a thin-film transistor (TFT) and the first storage plate Cap1 of a storage capacitor Cap spaced apart from each other, but the storage capacitor Cap can be stacked with the TFT. In this case, the gate electrode GE of the TFT can serve as the first storage plate Cap1 of the storage capacitor Cap.

[0073] A buffer layer 110 may be disposed between the substrate 100 and the semiconductor layer Act. The buffer layer 110 may reduce or prevent the penetration of foreign matter, moisture, or external air from the bottom of the substrate 100 and may provide a flat surface on the substrate 100. The buffer layer 110 may comprise an inorganic insulating material such as silicon oxide, silicon oxynitride, and silicon nitride, and may have a single-layer structure or a multi-layer structure comprising the aforementioned materials.

[0074] To ensure electrical insulation between the semiconductor layer Act and the gate electrode GE, a gate insulating film 130 may be disposed between the semiconductor layer Act and the gate electrode GE. The gate insulating film 130 may comprise inorganic materials such as silicon oxide, silicon nitride, and / or silicon oxynitride.

[0075] An interlayer insulating layer 150 may be disposed over the gate electrode GE and the first memory plate Cap1. The interlayer insulating layer 150 may comprise an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. The source electrode SE, drain electrode DE, and the second memory plate Cap2 may be disposed over the interlayer insulating layer 150. The interlayer insulating layer 150 comprising such an inorganic material may be formed by chemical vapor deposition (CVD) or atomic layer deposition (ALD). This also applies to the following embodiments and their modifications.

[0076] The planarization layer 170 can be disposed on the thin-film transistor (TFT). For example, as... Figure 3 As shown, when an organic light-emitting diode is disposed above a thin-film transistor (TFT), the planarization layer 170 can substantially planarize the protective layer covering the TFT. The planarization layer 170 may comprise an organic insulating material such as acrylic, benzocyclobutene (BCB), or hexamethyldisiloxane (HMDSO). Although Figure 3 The planarization layer 170 is shown to have a single-layer structure, but it can be modified in various ways. For example, the planarization layer 170 can have a multi-layer structure.

[0077] The first light-emitting diode 210, the second light-emitting diode 220, and the third light-emitting diode 230 can be arranged on the planarization layer 170. In an embodiment, the first light-emitting diode 210, the second light-emitting diode 220, and the third light-emitting diode 230 can have the same structure. In the following description, for ease of explanation, the first light-emitting diode 210 will be used.

[0078] The stacked structure of the first pixel electrode 211, the intermediate layer 203, and the counter electrode 205 can form a first light-emitting diode 210. An organic light-emitting diode can be used as a light-emitting diode. The organic light-emitting diode can emit light of a first color. The emission area of ​​the organic light-emitting diode corresponds to pixel PX.

[0079] Specifically, the first light-emitting diode 210 may include, for example, a first pixel electrode 211, a counter electrode 205, and an intermediate layer 203 between the first pixel electrode 211 and the counter electrode 205. The intermediate layer 203 may include an emitter layer. The first pixel electrode 211 may be electrically connected to one of the source electrode SE and the drain electrode DE via a contact hole formed in the planarization layer 170, etc., so that the first pixel electrode 211 is electrically connected to the thin-film transistor TFT. The first pixel electrode 211 includes a transmissive conductive layer and a reflective layer. The transmissive conductive layer includes a transmissive conductive oxide such as indium tin oxide (ITO), In2O3, or indium zinc oxide (IZO), and the reflective layer includes a metal such as Al or Ag. For example, the first pixel electrode 211 to the third pixel electrode 231 may each have a three-layer structure of ITO / Ag / ITO.

[0080] An intermediate layer 203, including the emitter layer, may be integrally formed across pixel electrodes 211, 221, and 231, and a counter electrode 205 on the intermediate layer 203 may also be integrally formed across pixel electrodes 211, 221, and 231. The counter electrode 205 may include a transmissive conductive layer comprising ITO, In2O3, or IZO, and may also include a semi-transmissive layer comprising a metal such as Al or Ag. For example, the counter electrode 205 may include a semi-transmissive layer comprising MgAg.

[0081] A pixel defining layer 190 may be disposed above the planarization layer 170. The pixel defining layer 190 may define pixels PX by including openings corresponding to each pixel PX (e.g., openings exposing at least the central portion of the first pixel electrode 211, the second pixel electrode 221, and the third pixel electrode 231). Furthermore, the pixel defining layer 190 may increase the distance between the edge of each of the first pixel electrode 211, the second pixel electrode 221, and the third pixel electrode 231 and the counter electrode 205, thereby preventing arcing at the edges of the first pixel electrode 211, the second pixel electrode 221, and the third pixel electrode 231. The pixel defining layer 190 may comprise an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

[0082] Intermediate layer 203 may comprise low molecular weight or high molecular weight materials. When intermediate layer 203 comprises a low molecular weight material, it may have a structure in which the hole injection layer (HIL), hole transport layer (HTL), emitter layer (EML), electron transport layer (ETL), and electron injection layer (EIL) are stacked as a single structure or multiple structures. Intermediate layer 203 may be formed by vacuum deposition. When intermediate layer 203 comprises a high molecular weight material, it may have a structure including both HTL and EML. In this case, HTL may comprise poly(3,4-ethylenedioxythiophene) (PEDOT), and EML may comprise poly(phenylenevinylene) (PPV) polymers or polyfluorene polymers. Intermediate layer 203 may be formed by screen printing, inkjet printing, deposition, or laser-induced thermal imaging (LITI). Intermediate layer 203 is not limited to these methods. Intermediate layer 203 may have various structures.

[0083] The intermediate layer 203 may include a layer integrally formed over the first pixel electrode 211, the second pixel electrode 221, and the third pixel electrode 231 as described above. However, in some cases, the intermediate layer 203 may include layers patterned respectively corresponding to the first pixel electrode 211, the second pixel electrode 221, and the third pixel electrode 231. In any case, the intermediate layer 203 includes a first color emitting layer. The first color emitting layer may be integrally formed over the first pixel electrode 211, the second pixel electrode 221, and the third pixel electrode 231, but in some cases, the first color emitting layer may be patterned respectively corresponding to the first pixel electrode 211, the second pixel electrode 221, and the third pixel electrode 231. The first color emitting layer may emit light having a wavelength of, for example, approximately 450 nm to approximately 495 nm.

[0084] Counter electrode 205 may be located on intermediate layer 203 to correspond to first pixel electrode 211, second pixel electrode 221 and third pixel electrode 231 respectively. Counter electrode 205 may be integrally formed relative to organic light-emitting diode.

[0085] Organic light-emitting diodes (OLEDs) can be easily damaged by external moisture or oxygen. Therefore, the encapsulation layer 300 can cover or be stacked with the OLED to protect it.

[0086] The encapsulation layer 300 can be disposed on the counter electrode 205. The first light-emitting diode 210, the second light-emitting diode 220, and the third light-emitting diode 230 can be covered by the encapsulation layer 300. The encapsulation layer 300 may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330.

[0087] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may each comprise one or more inorganic insulating materials. The one or more inorganic insulating materials may include aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be formed by chemical vapor deposition.

[0088] The organic encapsulation layer 320 may include polymeric materials. Examples of polymeric materials may include acrylic resins, epoxy resins, polyimides, and / or polyethylene. For example, the organic encapsulation layer 320 may include acrylic resins such as polymethyl methacrylate, polyacrylic acid, etc. The organic encapsulation layer 320 may be formed by curing monomers or applying polymers.

[0089] The structure stacked from the substrate 100 to the first light-emitting diode 210, the second light-emitting diode 220, and the third light-emitting diode 230 can be referred to as the light-emitting unit 10. The light-emitting unit 10 can generate incident light Lib that is incident on the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453, which will be described below, and the incident light Lib emitted from the light-emitting unit 10 can travel through the encapsulation layer 300 to the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453.

[0090] The display device 1 according to the embodiment may include a first light-shielding wall portion 410, a first color conversion layer 451, a second color conversion layer 452, a light-transmitting layer 453, a first cover layer 470, a light-shielding layer 510, a first color filter layer 531, a second color filter layer 532, a third color filter layer 533, and a second cover layer 550. The first light-shielding wall portion 410, the first color conversion layer 451, the second color conversion layer 452, the light-transmitting layer 453, the first cover layer 470, the light-shielding layer 510, the first color filter layer 531, the second color filter layer 532, and the third color filter layer 533 may be referred to as an optical unit 20.

[0091] The first light-shielding wall portion 410 may include a first opening portion OP1 corresponding to the light-emitting diode 200. For example, the first light-shielding wall portion 410 may include a first-1 opening portion OP1-1, a first-2 opening portion OP1-2, and a first-3 opening portion OP1-3 corresponding to the first light-emitting diode 210, the second light-emitting diode 220, and the third light-emitting diode 230, respectively.

[0092] The first light-shielding wall portion 410 may have various colors including black, white, red, purple, and blue. The first light-shielding wall portion 410 may include colored pigments or dyes. The first light-shielding wall portion 410 may include a light-shielding material. The light-shielding material may include an opaque inorganic insulating material comprising metal oxides (such as titanium oxide (TiO2), chromium oxide (Cr2O3), or molybdenum oxide (MoO3)), or may include an opaque organic insulating material such as black resin. In another example, the first light-shielding wall portion 410 may include an organic insulating material such as white resin.

[0093] As described below, the first light-shielding wall portion 410 can prevent color mixing between light converted or transmitted by the adjacent first color conversion layer 451, second color conversion layer 452 and light-transmitting layer 453.

[0094] The first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can be located in the first-1 opening OP1-1, the first-2 opening OP1-2, and the first-3 opening OP1-3, respectively, and can correspond to the first light-emitting diode 210, the second light-emitting diode 220, and the third light-emitting diode 230, respectively. The first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can be spaced apart from each other at regular intervals, and the first light-shielding wall portion 410 can be located between the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453.

[0095] The first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can convert or transmit the incident light Lib generated by the light-emitting unit 10 into light of a specific color, and can emit the light toward the first color filter layer 531, the second color filter layer 532, and the third color filter layer 533, respectively. The light converted or transmitted by the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can be one of red light, green light, and blue light.

[0096] For example, the incident light Lib may be blue light having a wavelength band in the range of about 400 nm to about 495 nm, and the light emitted through the first color filter layer 531, the second color filter layer 532 and the third color filter layer 533 may include red light having a wavelength band in the range of about 580 nm to about 750 nm, green light having a wavelength band in the range of about 495 nm to about 580 nm and blue light having a wavelength band in the range of about 400 nm to about 495 nm.

[0097] Incident light Lib can be converted into red light through the first color conversion layer 451 and emitted toward the first color filter layer 531. Light passing through the first color filter layer 531 can be emitted to the outside. Incident light Lib can be converted into green light through the second color conversion layer 452 and emitted toward the second color filter layer 532. Light passing through the second color filter layer 532 can be emitted to the outside. Incident light Lib can be transmitted through the light-transmitting layer 453 without color conversion and emitted toward the third color filter layer 533. Light passing through the third color filter layer 533 can be emitted to the outside. Therefore, the incident light Lib emitted from the light-emitting unit 10 is converted or transmitted into green light, red light, and blue light respectively when passing through the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453, thereby displaying a color image.

[0098] The first cover layer 470 may be disposed on the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453. The first cover layer 470 may be stacked with (or cover) the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453. The first cover layer 470 may include an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride.

[0099] The first cover layer 470 and the encapsulation layer 300 can be arranged such that the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 are disposed between the first cover layer 470 and the encapsulation layer 300. The first color conversion layer 451 and the second color conversion layer 452 may include quantum dots, as shown below. Figure 4 As described. Because quantum dots comprise nanoparticles, they may degrade due to reactions with moisture, oxygen, etc. Therefore, the first capping layer 470 and the encapsulation layer 300 may be stacked on or cover the first color conversion layer 451 and the second color conversion layer 452 above and below them to prevent moisture, oxygen, etc., from being introduced into the quantum dots within the first color conversion layer 451 and the second color conversion layer 452.

[0100] A light-shielding layer 510 may be disposed on the first cover layer 470. The light-shielding layer 510 may include holes 510H respectively superimposed on the first opening OP1. The light-shielding layer 510 may include a light-shielding material. The light-shielding material may include an opaque inorganic insulating material comprising metal oxides (such as titanium oxide (TiO2), chromium oxide (Cr2O3), or molybdenum oxide (MoO3)), or may include an opaque organic insulating material such as black resin. The light-shielding layer 510 can block light emission to the outside of the emitting area, thereby preventing light leakage in the display device 1.

[0101] The first color filter layer 531, the second color filter layer 532, and the third color filter layer 533 can each be located in the holes 510H of the light-shielding layer 510. For example, the first color filter layer 531 can be located in the first hole 510H-1 corresponding to the first light-emitting diode 210, the second color filter layer 532 can be located in the second hole 510H-2 corresponding to the second light-emitting diode 220, and the third color filter layer 533 can be located in the third hole 510H-3 corresponding to the third light-emitting diode 230. As another example, a portion of each of the first color filter layer 531, the second color filter layer 532, and the third color filter layer 533 can be arranged on the light-shielding layer 510.

[0102] The first color filter layer 531, the second color filter layer 532, and the third color filter layer 533 may each include an organic pattern containing dyes or pigments. The first color filter layer 531, the second color filter layer 532, and the third color filter layer 533 may each include pigments or dyes of different colors and selectively transmit only light of the corresponding color. For example, the first color filter layer 531 may include red pigments or dyes and selectively transmit only red light, the second color filter layer 532 may include green pigments or dyes and selectively transmit only green light, and the third color filter layer 533 may include blue pigments or dyes and selectively transmit only blue light.

[0103] In order to adjust the amount of each color of light emitted from the display device 1, for example, the third color filter layer 533 may be thicker than the first color filter layer 531 and the second color filter layer 532.

[0104] As another example, the light-shielding layer 510 and the third color filter layer 533 may comprise the same material and can be formed by the same process. In this case, the first color filter layer 531 may be located in the first hole 510H-1 at the position corresponding to the first light-emitting diode 210, the second color filter layer 532 may be located in the second hole 510H-2 at the position corresponding to the second light-emitting diode 220, the third hole 510H-3 is not formed at the position corresponding to the third light-emitting diode 230, and a portion of the light-shielding layer 510 may be used as the third color filter layer 533. The portion of the light-shielding layer 510 between the first color filter layer 531 and the second color filter layer 532 can prevent color mixing between the light converted by the adjacent first color conversion layer 451 and second color conversion layer 452.

[0105] The filler 540 can be disposed on the light-shielding layer 510 and can cover the first color filter layer 531, the second color filter layer 532, and the third color filter layer 533. The filler 540 can buffer external pressure, etc., and can provide a flat upper surface. The filler 540 can include organic materials such as acrylic resin, epoxy resin, polyimide, or polyethylene.

[0106] The second cover layer 550 may be disposed on the filler 540. The second cover layer 550 may include an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride.

[0107] The incident light Lib emitted from the light-emitting unit 10 cannot penetrate through the light-shielding material of the first light-shielding wall portion 410 and the light-shielding layer 510, but can only penetrate through the area where the first opening OP1 of the first light-shielding wall portion 410 overlaps with the hole 510H of the light-shielding layer 510. Therefore, the area where the first opening OP1 overlaps with the hole 510H can be defined as the emission area, and the area where the first light-shielding wall portion 410 and the light-shielding material of the light-shielding layer 510 are located can be defined as the non-emission area.

[0108] The case in which the light-emitting unit 10 and the optical unit 20 of the display device 1 are formed on a single substrate has already been described. However, in another embodiment, the display device 1 can be manufactured by forming the light-emitting unit 10 and the encapsulation layer 300 on a lower substrate, forming the optical unit 20 on an upper substrate, and bonding the lower substrate and the upper substrate together.

[0109] Figure 4 This is a schematic cross-sectional view showing a portion of a display device according to an embodiment.

[0110] Reference Figure 4 The display device 1 according to the embodiment may include a first color conversion layer 451, a second color conversion layer 452 and a light-transmitting layer 453.

[0111] For example, the first color conversion layer 451 can convert blue incident light Lib into red light Lr. To this end, the first color conversion layer 451 may include a first photosensitive polymer 451a in which first quantum dots 451b are dispersed.

[0112] The first photosensitive polymer 451a may include organic materials with light-transmitting properties, such as silicone resin or epoxy resin.

[0113] The first quantum dot 451b can be excited by blue incident light Lib to isotropically emit red light Lr with a wavelength longer than that of blue light. The first quantum dot 451b may include group II-VI compounds, group III-V compounds, group IV-VI compounds, group IV compounds, or any combination thereof.

[0114] The first scattering particles 451c can be further dispersed in the first photosensitive polymer 451a. The first scattering particles 451c can excite more of the first quantum dots 451b by scattering the blue incident light Lib that is not absorbed by the first quantum dots 451b. Therefore, the color conversion efficiency of the first color conversion layer 451 can be improved. The first scattering particles 451c may include, for example, titanium oxide (TiO2) or metal particles.

[0115] For example, the second color conversion layer 452 can convert blue incident light Lib into green light Lg. The second color conversion layer 452 may include a second photosensitive polymer 452a in which second quantum dots 452b are dispersed. In the second photosensitive polymer 452a, second scattering particles 452c are dispersed together with the second quantum dots 452b. Therefore, the color conversion efficiency of the second color conversion layer 452 can be improved.

[0116] The second photosensitive polymer 452a and the first photosensitive polymer 451a may comprise the same material, and the second scattering particle 452c and the first scattering particle 451c may comprise the same material. The second quantum dot 452b may comprise any combination of Group II-VI, Group III-V, Group IV-VI, Group IV compounds, or the like. For example, the second quantum dot 452b and the first quantum dot 451b may comprise the same material. However, the size of the second quantum dot 452b may be smaller than the size of the first quantum dot 451b. Therefore, the second quantum dot 452b can be excited by blue incident light Lib to isotropically emit green light Lg having a wavelength longer than that of blue light and shorter than that of red light Lr.

[0117] The light-transmitting layer 453 may include a third photosensitive polymer 453a in which third scattering particles 453c are dispersed. For example, the light-transmitting layer 453 may not include individual quantum dots that can be excited by blue incident light Lib. Similar to the first photosensitive polymer 451a, the third photosensitive polymer 453a may include an organic material with light-transmitting properties, and the third scattering particles 453c and the first scattering particles 451c may include the same material. Because the blue incident light Lib incident on the light-transmitting layer 453 can be transmitted through the light-transmitting layer 453 without color change, the light emitted through the light-transmitting layer 453 may be blue light Lb. However, the blue incident light Lib can be scattered by the third scattering particles 453c in the light-transmitting layer 453 and can be emitted to the outside. Because the light-transmitting layer 453 allows the blue incident light Lib to be transmitted without color change, higher light efficiency is achieved.

[0118] Figure 5 This is a schematic enlarged plan view of a portion of a display device according to an embodiment. Figure 5 It shows the relationship with Figure 1The arrangement of the area corresponding to part V and the first light-shielding wall, the second light-shielding wall, the first color conversion layer, the second color conversion layer and the light-transmitting layer. Figure 5 This can be understood as the state when viewed from above the base in a direction perpendicular to the base.

[0119] Reference Figure 5 The display device 1 may include a first light-shielding wall portion 410 disposed in the display area DA and a second light-shielding wall portion 430 disposed in the peripheral area PA. The first light-shielding wall portion 410 may be disposed in a first area AR1 of the substrate 100 corresponding to the display area DA, and the second light-shielding wall portion 430 may be disposed in a second area AR2 of the substrate 100 corresponding to the peripheral area PA.

[0120] The first light-shielding wall portion 410 may include a first opening OP1. In a plane, the first opening OP1 may have a rectangular shape, but the disclosure is not limited thereto. The first opening OP1 may have a triangular shape, a rectangular shape, a rhombus shape, a polygonal shape, a circular shape, an elliptical shape, etc. The plane may be a virtual plane parallel to a surface of the substrate 100, or a plane when viewed in a direction perpendicular to the substrate 100. In the following description, unless otherwise stated, the expression "in a plane" may mean "on a virtual plane parallel to a surface of the substrate."

[0121] The first opening OP1 can be arranged along the X direction and the Y direction intersecting the X direction, but the disclosure is not limited thereto. The shape and arrangement of the first opening OP1 can correspond to the shape and arrangement of the pixel PX. The pixel PX can be arranged in a pattern such as a stripe pattern, an S-stripe pattern, or... In the case of a pattern arrangement, the first opening OP1 can also be arranged in a corresponding pattern.

[0122] The first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can be arranged in the first opening OP1 of the first light-shielding wall portion 410. The first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can be spaced apart from each other on a plane, and the distance between the first color conversion layer 451 and the second color conversion layer 452, or the distance between the second color conversion layer 452 and the light-transmitting layer 453, can be substantially equal to the width of the first light-shielding wall portion 410. The first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can be arranged in a certain regularity or pattern in one direction.

[0123] The second light-shielding wall portion 430 may be spaced apart from the first light-shielding wall portion 410 in a plane and may be arranged along the edge 100E of the substrate 100. The separation region SA between the first light-shielding wall portion 410 and the second light-shielding wall portion 430 may overlap with the peripheral region PA or may be adjacent to the display region DA. The first separation distance d1 between the first light-shielding wall portion 410 and the second light-shielding wall portion 430 in the X direction may be different from or substantially equal to the second separation distance d2 between the first light-shielding wall portion 410 and the second light-shielding wall portion 430 in the Y direction.

[0124] Figure 6 It is shown schematically. Figure 5 A cross-sectional view of a portion of a display device, and may correspond to along Figure 5 The section cut by line VI-VI'. The same reference numerals are assigned to the sections referenced above. Figure 3 The same or corresponding elements are described, and their redundant descriptions will be omitted.

[0125] A driver DR that provides electrical signals to the first light-emitting diode 210, the second light-emitting diode 220, and the third light-emitting diode 230 may be disposed on the substrate 100. The driver DR may be disposed in the peripheral region PA and may be superimposed on at least a portion of the second light-shielding wall portion 430 when viewed in a direction perpendicular to the substrate 100.

[0126] The buffer layer 110 between the substrate 100 and the pixel electrodes 211, 221, and 231, as well as the insulating layers 130, 150, and 170, the pixel defining layer 190, the intermediate layer 203 of the light-emitting diode 200, and the counter electrode 205 can be arranged in the display area DA and the peripheral area PA. The encapsulation layer 300 covering the counter electrode 205 can also be arranged in the display area DA and the peripheral area PA.

[0127] The first light-shielding wall portion 410 and the second light-shielding wall portion 430 can be disposed on the encapsulation layer 300 and can be formed simultaneously by the same process. The first light-shielding wall portion 410 and the second light-shielding wall portion 430 can include the same material. For example, both the first light-shielding wall portion 410 and the second light-shielding wall portion 430 can include colored pigments or dyes and / or light-shielding materials. The light-shielding material can include an opaque inorganic insulating material comprising at least one metal oxide selected from titanium dioxide (TiO2), chromium oxide (Cr2O3), and molybdenum oxide (MoO3), or an opaque organic insulating material such as black resin.

[0128] The first light-shielding wall portion 410 and the second light-shielding wall portion 430 can have substantially the same thickness t, which can be in the range of approximately 8 μm to approximately 20 μm. In this way, the height difference between the display area DA and the peripheral area PA can be significantly reduced.

[0129] The first light-shielding wall portion 410 and the second light-shielding wall portion 430 may each include a first surface S1 facing the substrate 100 and a second surface S2 opposite to the first surface S1. The second surface S2 may be hydrophobic. In one embodiment, the second surface S2 may be made hydrophobic by a photolithography process that forms the first light-shielding wall portion 410 and the second light-shielding wall portion 430. In another embodiment, after forming the first light-shielding wall portion 410 and the second light-shielding wall portion 430, a surface treatment may be performed on the second surface S2 to make the second surface S2 hydrophobic.

[0130] The first color conversion layer 451, the second color conversion layer 452, or the light-transmitting layer 453 can be formed in the first opening OP1 of the first light-shielding wall portion 410 by an inkjet printing process. Because the ink material forming the first color conversion layer 451, the second color conversion layer 452, or the light-transmitting layer 453 is hydrophilic, and the second surface S2 of the first light-shielding wall portion 410 is hydrophobic, it is possible to prevent the ink material from flowing from the predetermined first opening OP1 across the first light-shielding wall portion 410 to another adjacent first opening OP1. Therefore, mixing of the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can be prevented, and the manufacturing quality of the display device 1 can be improved.

[0131] The first cover layer 470 may be arranged throughout the display area DA and the peripheral area PA, and may cover the first light-shielding wall portion 410 and the second light-shielding wall portion 430 or be superimposed on the first light-shielding wall portion 410 and the second light-shielding wall portion 430. The first cover layer 470 may contact the encapsulation layer 300 in the separation area SA between the first light-shielding wall portion 410 and the second light-shielding wall portion 430.

[0132] For example, such as Figure 6 As shown, the light-shielding layer 510, along with the first color filter layer 531, the second color filter layer 532, and the third color filter layer 533, can be arranged in the display area DA. As another example, the light-shielding layer 510, along with the first color filter layer 531, the second color filter layer 532, and the third color filter layer 533, can be arranged in the peripheral area PA.

[0133] The filler 540 may be located in the separation zone SA. The height difference between the upper surfaces of the separation zone SA and the display zone DA, as well as the height difference between the upper surfaces of the separation zone SA and the peripheral zone PA, can be eliminated to form a flat upper surface. The filler 540 may include organic materials such as acrylic resin, epoxy resin, polyimide, or polyethylene.

[0134] The second cover layer 550 can be arranged on the filler 540, and the second cover layer 550 can be arranged throughout the display area DA and the peripheral area PA.

[0135] To form a light-shielding wall including an opening, a photolithography process can be performed to form a layer including a specific pattern. The material of the light-shielding wall can be deposited, for example, on the entire encapsulation layer. A photoresist can be applied to the deposited material of the light-shielding wall by various methods such as spin coating, spraying, or dipping. The photoresist can be a negative photoresist. An exposure mask with a specific pattern formed thereon can be disposed on the photoresist, and this pattern can correspond to the light-shielding wall. The specific pattern of the exposure mask on the photoresist can be exposed. A portion of the photoresist can be removed by a development process. Because, as described above, the photoresist is a negative photoresist, the portion of the photoresist other than the exposed portion can be removed by the development process to form a patterned photoresist. An etching process can be performed by using the patterned photoresist as an etching mask. The etching process can remove a portion of the material of the light-shielding wall, and an opening can be formed in the area where the portion of the material of the light-shielding wall is removed. Remove the photoresist to form a light-shielding wall including the opening.

[0136] Figure 7A This is a schematic plan view showing a portion of the first light-shielding wall of a display device according to a comparative example. Figure 7B This is a plan view schematically showing a portion of the first light-shielding wall of a display device according to an embodiment.

[0137] Reference Figure 7A As a comparative example, the display device includes a light-shielding wall portion comprising a first opening OP1 arranged in the display area DA, and the light-shielding wall portion may extend to the peripheral area PA. The opening may not be formed in the peripheral area PA.

[0138] The exposure mask used to form the light-shielding wall may include a penetrating portion corresponding to the peripheral region PA. During the exposure process, light can pass through the penetrating portion and reach the photoresist in the peripheral region PA, forming the light-shielding wall throughout the entire peripheral region PA. However, during the exposure process, light may be diffracted or scattered as it passes through the penetrating portion, and may accidentally reach a portion of the display region DA adjacent to the peripheral region PA (e.g., a portion of the photoresist located at the edge of the display region DA). Accidental exposure may cause unintended deformation of the photoresist pattern. As a result, an irregular first opening OP1 is formed at the edge of the display region DA.

[0139] The formation of the irregular first opening OP1 will result in the irregular formation of the first color conversion layer 451, the second color conversion layer 452 and the light-transmitting layer 453 located in the first opening OP1.

[0140] Furthermore, when comparing the width or area of ​​the penetration portion corresponding to the first opening OP1 on the same exposure mask, the actual width or area of ​​the first opening OP1 may change, thus increasing the deviation. The width of the first opening OP1 in the plane located between the first and second surfaces of the light-shielding wall portion will be smaller than the width of the first opening OP1 in the plane located on the first surface of the light-shielding wall portion (e.g., the bottom surface of the light-shielding wall portion). Therefore, a tail will be formed on the inner surface of the first opening OP1.

[0141] Due to deviations and tails, the amounts of the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 formed in the first opening OP1 may change unexpectedly.

[0142] As a result, the height, width, or area of ​​the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 may deviate depending on the position of the display area DA, which adversely affects the uniformity of the color coordinates or the light conversion efficiency of the display device 1. This may lead to a deterioration in the uniformity of image quality.

[0143] Furthermore, due to accidental exposure, a first opening OP1 will not be formed at the edge of the display area DA, but an accidental opening R will be partially formed. If the opening R is filled with a color conversion layer or a light conversion layer, it may lead to residual film or stain defects.

[0144] However, according to an embodiment, the display device 1 may include a separation region SA between the first light-shielding wall portion 410 and the second light-shielding wall portion 430 (for example, see...). Figure 5 The separation region SA can be a region superimposed on the peripheral region PA and arranged adjacent to the edge of the display region DA. The exposure mask used to form the light-shielding wall can be formed such that light does not pass through the portion of the exposure mask corresponding to the separation region SA. In other words, the penetration portion may not be formed in the portion of the exposure mask corresponding to the separation region SA. As a result, in the exposure process, it is possible to prevent (or reduce) accidental light from reaching the portion of the photoresist located in the display region DA adjacent to the peripheral region PA due to light diffraction or scattering.

[0145] Reference Figure 7B In the display device 1 according to the embodiment, a first opening OP1 having a desired shape can be formed in the portion of the first light-shielding wall portion 410 adjacent to the peripheral region PA. The first opening OP1 does not change depending on the position of the display region DA, but can be formed regularly. The regular formation of the first opening OP1 can cause the regular formation of the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453. Therefore, image quality uniformity and display quality can be improved.

[0146] In this embodiment, because the portion of the photoresist corresponding to the separation region SA is not exposed, this portion of the photoresist can be removed by a developing process. In the developing process, the developer can be dispersed into the portion of the photoresist corresponding to the separation region SA and the portion corresponding to the first opening OP1 disposed in the edge of the display region DA. This allows for better formation of the first opening OP1 disposed in the edge of the display region DA.

[0147] Figure 8A and Figure 8B This is a schematic enlarged plan view of a portion of a display device according to other embodiments. References to the above will be omitted. Figure 5 The components described are the same as those described below, and the differences will be mainly described below.

[0148] Reference Figure 8A The second light-shielding wall portion 430 may include a second opening portion OP2 (see Figure 9 The second opening OP2 and the first opening OP1 may have the same shape and may be arranged in the same manner. In another embodiment, the second opening OP2 and the first opening OP1 may have different shapes and / or arrangements.

[0149] In this embodiment, the first dummy color conversion layer 451D, the second dummy color conversion layer 452D, and the dummy light-transmitting layer 453D may be located in the second opening OP2. The first dummy color conversion layer 451D and the first color conversion layer 451 may contain the same material, the second dummy color conversion layer 452D and the second color conversion layer 452 may contain the same material, and the dummy light-transmitting layer 453D and the light-transmitting layer 453 may contain the same material.

[0150] As will be referred to below Figure 9 As described, because no light-emitting diodes (LEDs) are arranged in the peripheral region PA, or if LEDs are arranged, they are not driven, the incident light Lib emitted from the light-emitting unit 10 can bypass the first dummy color conversion layer 451D, the second dummy color conversion layer 452D, and the dummy light-transmitting layer 453D. The first dummy color conversion layer 451D, the second dummy color conversion layer 452D, and the dummy light-transmitting layer 453D can be used for basic conversion or transmission of light.

[0151] Reference Figure 8B One of the first dummy color conversion layer 451D, the second dummy color conversion layer 452D, and the dummy light-transmitting layer 453D can be located in the second opening OP2. For example, the dummy light-transmitting layer 453D can be located in the second opening OP2.

[0152] Thus, because the layer formed in the second opening OP2 is a single type of layer (e.g., a dummy light-transmitting layer 453D), the process can be easily performed. In particular, when only the dummy light-transmitting layer 453D is formed in the second opening OP2, unlike the first dummy color conversion layer 451D and the second dummy color conversion layer 452D, the dummy light-transmitting layer 453D may not include quantum dots. Therefore, manufacturing costs can be reduced.

[0153] Figure 9 It is shown schematically. Figure 8A or Figure 8B A cross-sectional view of a portion of a display device, and may correspond to along Figure 8A or Figure 8B The cross section intercepted by line IX-IX'.

[0154] Figure 9 The diagram shows the first-third opening OP1-3 within the first opening OP1 and the light-transmitting layer 453 located within the first-third opening OP1-3, and also shows a second opening OP2 within the second opening OP2 and a dummy light-transmitting layer 453D located within that second opening OP2. However, this is only along... Figure 8A or Figure 8B The example is taken from line VI-VI', so the disclosure is not limited to this.

[0155] The light-transmitting layer 453 and the dummy light-transmitting layer 453D can be arranged on the same layer (e.g., encapsulation layer 300).

[0156] The light-emitting diode 200 may not be arranged in the peripheral region PA. Even if the light-emitting diode 200 is arranged in the peripheral region PA, the light-emitting diode 200 may not be electrically connected to the pixel circuit PC or may not be driven. Because there is no light emission in the peripheral region PA, the dummy light-transmitting layer 453D may not be used for basic light transmission. However, because the space in the second opening OP2 is filled, the height difference can be eliminated, and the second opening OP2 can be used as a spacer.

[0157] Based on the above reference Figure 8A , Figure 8B and Figure 9 The described embodiments are similar to those described with reference to Figure 7B The described embodiments can provide a display device 1 with improved image quality uniformity and improved display quality.

[0158] Figure 10A and Figure 10B This is a schematic enlarged plan view of a portion of a display device according to other embodiments.

[0159] Reference Figure 10AThe first light-shielding wall portion 410 and the second light-shielding wall portion 430 can be connected to each other to form an integral unit. The first light-shielding wall portion 410 may include a first opening OP1, and the second light-shielding wall portion 430 may include a second opening OP2. The first opening OP1 and the second opening OP2 may be formed to have the same shape and the same type of arrangement. The second opening OP2 may extend throughout the entire peripheral area PA and be formed in the second light-shielding wall portion 430.

[0160] The first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453 can be located in the first opening OP1, and the first dummy color conversion layer 451D, the second dummy color conversion layer 452D, and the dummy light-transmitting layer 453D can be located in the second opening OP2. (Refer to the above.) Figure 8B As described, one of the first dummy color conversion layer 451D, the second dummy color conversion layer 452D, and the dummy light-transmitting layer 453D may be located in the second opening OP2. For example, the dummy light-transmitting layer 453D may be located in the second opening OP2.

[0161] Reference Figure 10B The second light-shielding wall portion 430 includes a second opening portion OP2, and the second opening portion OP2 can be arranged in the portion of the peripheral region PA adjacent to the display region DA.

[0162] Figure 11 It is shown schematically. Figure 10A or Figure 10B A cross-sectional view of a portion of a display device, and may correspond to along Figure 10A or Figure 10B The cross section taken by line XI-XI'.

[0163] Figure 11 The diagram shows the first and second openings OP1-2 within the first opening OP1, the second color conversion layer 452 located within the first and second openings OP1-2, the two second openings OP2 within the second openings OP2, and the dummy light-transmitting layer 453D and the first dummy color conversion layer 451D located within the two second openings OP2, respectively. However, because this is only along... Figure 10A or Figure 10B The example is taken from the line XI-XI', so the disclosure is not limited to this.

[0164] The second color conversion layer 452, the dummy light-transmitting layer 453D, and the first dummy color conversion layer 451D can be arranged on the same layer (e.g., encapsulation layer 300).

[0165] The dummy light-transmitting layer 453D and the first dummy color conversion layer 451D may not be used for basic transmitted light. However, since the space in the second opening OP2 is filled, the height difference can be eliminated, and the second opening OP2 can be used as a spacer.

[0166] Based on the above reference Figure 10A , Figure 10B and Figure 11 In the described embodiment, the second opening OP2 can be arranged in at least a portion of the peripheral region PA adjacent to the display region DA. To form the second opening OP2, an exposure mask can be formed such that light does not pass through the portion of the exposure mask corresponding to the second opening OP2. In other words, the penetration portion may not be formed in the portion of the exposure mask corresponding to the second opening OP2 (i.e., the portion of the exposure mask corresponding to the portion of the peripheral region PA adjacent to the display region DA). In this way, during the exposure process, unwanted light reaching the portion of the photoresist corresponding to the edge of the display region DA due to light diffraction or scattering can be significantly reduced.

[0167] Therefore, a first opening OP1 with a good shape can be formed even at the edge of the display area DA adjacent to the peripheral area PA. The first opening OP1 does not change depending on the position of the display area DA, but can be formed regularly. The regular formation of the first opening OP1 causes the regular formation of the first color conversion layer 451, the second color conversion layer 452, and the light-transmitting layer 453. Therefore, image quality uniformity and display quality can be improved.

[0168] Although a display device has been described, the disclosure is not limited thereto. For example, it is understood that methods for manufacturing the display device also fall within the scope of the disclosure.

[0169] According to one or more embodiments, a color conversion layer and a light-transmitting layer arranged regularly in the display area are formed to improve image quality uniformity. Therefore, a display device with improved display quality can be realized. The scope of the disclosure is not limited to these effects.

[0170] It should be understood that the embodiments described herein are to be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the claims.

Claims

1. A display device, the display device comprising: The substrate includes a first region and a second region adjacent to the first region; A first light-emitting diode, a second light-emitting diode, and a third light-emitting diode are disposed in the first region of the substrate and include a color-emitting layer; An encapsulation layer is stacked with the first light-emitting diode, the second light-emitting diode, and the third light-emitting diode, and includes at least one inorganic layer and at least one organic layer; A first light-shielding wall portion is disposed on the encapsulation layer. The first light-shielding wall portion includes a first-1 opening portion, a first-2 opening portion, and a first-3 opening portion, which are respectively corresponding to the first light-emitting diode, the second light-emitting diode, and the third light-emitting diode. A second light-shielding wall portion is disposed on the encapsulation layer and overlapped with the second region of the substrate; A light-shielding layer is disposed on the first light-shielding wall portion and the second light-shielding wall portion, and includes holes that overlap with the first-1 opening portion, the first-2 opening portion and the first-3 opening portion respectively; as well as The color filter layer is located in the pores of the light-shielding layer. In the plan view, the first light-shielding wall portion and the second light-shielding wall portion are spaced apart from each other.

2. The display device according to claim 1, wherein, The second light-shielding wall is arranged along the edge of the substrate.

3. The display device according to claim 1, further comprising: The first color conversion layer is located in the first-1 opening; The second color conversion layer is located in the first-second opening; as well as The light-transmitting layer is located in the first to third openings.

4. The display device according to claim 3, wherein, The first color conversion layer, the second color conversion layer, and the light-transmitting layer all include scattering particles. The first color conversion layer and the second color conversion layer respectively include a first quantum dot and a second quantum dot, and The first quantum dot and the second quantum dot are made of the same material and have different sizes from each other.

5. The display device according to claim 3, wherein, The second light-shielding wall includes a plurality of second openings.

6. The display device according to claim 5, further comprising a first dummy color conversion layer, a second dummy color conversion layer, and a dummy light-transmitting layer. in, Each of the first dummy color conversion layer, the second dummy color conversion layer, and the dummy light-transmitting layer is located in a corresponding second opening among the plurality of second openings.

7. The display device according to claim 5, wherein the display device further comprises a dummy light-transmitting layer located in the plurality of second openings.

8. The display device according to claim 6, wherein, The dummy light-transmitting layer and the light-transmitting layer both consist of the same material.

9. The display device according to claim 1, wherein, The first light-shielding wall portion and the second light-shielding wall portion are integrally formed with each other, and The second light-shielding wall includes a plurality of second openings.

10. The display device according to claim 9, further comprising: The first color conversion layer is located in the first-1 opening; The second color conversion layer is located in the first-second opening; The light-transmitting layer is located in the first to third openings; First virtual color conversion layer; A second, virtual color conversion layer; as well as A fake light-transmitting layer Each of the first dummy color conversion layer, the second dummy color conversion layer, and the dummy light-transmitting layer is located in a corresponding second opening among the plurality of second openings.

11. The display device according to claim 9, further comprising: The first color conversion layer is located in the first-1 opening; The second color conversion layer is located in the first-second opening; The light-transmitting layer is located in the first to third openings; as well as A dummy light-transmitting layer is located within the plurality of second openings.

12. The display device according to claim 10, wherein, The dummy light-transmitting layer and the light-transmitting layer both consist of the same material.

13. The display device according to claim 1, further comprising a driver disposed in the second region of the substrate and providing electrical signals to the first light-emitting diode, the second light-emitting diode, and the third light-emitting diode. in, In the plan view, at least a portion of the second light-shielding wall is superimposed on the driver.

14. The display device according to claim 1, wherein, The first light-shielding wall portion and the second light-shielding wall portion are made of the same material.

15. The display device according to claim 14, wherein, Both the first light-shielding wall portion and the second light-shielding wall portion include colored pigments or dyes and / or at least one metal oxide selected from titanium oxide, chromium oxide and molybdenum oxide.

16. The display device according to claim 1, wherein, Both the first light-shielding wall portion and the second light-shielding wall portion have a thickness of 8μm to 20μm.

17. The display device according to claim 1, wherein, Both the first light-shielding wall portion and the second light-shielding wall portion include a first surface facing the substrate and a second surface opposite to the first surface, and The second surface is hydrophobic.

18. A display device, the display device comprising: The light-emitting unit includes a display area that emits light of a single color and a peripheral area adjacent to the display area; as well as An optical unit converts light emitted from the light-emitting unit into light of different colors or transmits light emitted from the light-emitting unit, wherein... The light-emitting unit includes: Pixel electrodes are arranged in the display area; The counter electrode is disposed above the pixel electrode; and An emission layer is disposed between the pixel electrode and the counter electrode, and The optical unit includes: A first light-shielding wall portion is disposed in the display area, and the first light-shielding wall portion includes a plurality of first opening portions corresponding to the pixel electrode; The second light-shielding wall portion is arranged in the peripheral area and is spaced apart from the first light-shielding wall portion in the plan view; A first color conversion layer, a second color conversion layer, and a light-transmitting layer, wherein each of the first color conversion layer, the second color conversion layer, and the light-transmitting layer is located in a corresponding first opening among the plurality of first openings; A covering layer is stacked on top of the first light-shielding wall portion; A light-shielding layer is disposed on the cover layer and includes holes respectively superimposed on the plurality of first openings; and A first color filter layer, a second color filter layer, and a third color filter layer are disposed in the holes of the light-shielding layer on the cover layer and are respectively stacked with the first color conversion layer, the second color conversion layer, and the light-transmitting layer.

19. The display device according to claim 18, wherein, The second light-shielding wall includes a plurality of second openings spaced apart from each other, and The display device further includes a first dummy color conversion layer, a second dummy color conversion layer, and a dummy light-transmitting layer, wherein each of the first dummy color conversion layer, the second dummy color conversion layer, and the dummy light-transmitting layer is located in a corresponding second opening among the plurality of second openings.

20. The display device according to claim 18, wherein, The first light-shielding wall portion and the second light-shielding wall portion are integrally formed and comprise the same material.

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