Display device and method of manufacturing display device

Abstract

A display device and a method of manufacturing the same are provided. The display device includes: a substrate; a first electrode and a second electrode disposed on the substrate and spaced apart from each other; a first insulating layer disposed on the substrate to cover at least a portion of the first electrode and at least a portion of the second electrode; and at least one first light-emitting element disposed on the first insulating layer between the first electrode and the second electrode. The first insulating layer includes: a first sub-insulating layer including a first portion and a second portion, the first portion comprising a hydrophilic material, and the second portion being a region other than the first portion and comprising a hydrophobic material; and a second sub-insulating layer disposed below the first sub-insulating layer, wherein at least a portion of the at least one first light-emitting element is disposed on the first portion.

Description

Technical Field

[0001] This disclosure relates to display devices and methods for manufacturing display devices. Background Technology

[0002] With the development of multimedia, display devices have become increasingly important. Therefore, various types of display devices are being used, such as organic light-emitting diode (OLED) displays and liquid crystal displays (LCDs).

[0003] Display panels, such as organic light-emitting display panels or LCD panels, are devices included in display equipment to display images. In such display panels, light-emitting elements can be configured as light-emitting elements, and examples of light-emitting diodes (LEDs) include organic LEDs (OLEDs) that use organic materials as fluorescent materials and inorganic LEDs that use inorganic materials as fluorescent materials.

[0004] Inorganic LEDs using inorganic semiconductors as fluorescent materials exhibit durability even in high-temperature environments and demonstrate higher efficiency in blue light compared to organic LEDs. In manufacturing processes that have been identified as limitations of existing inorganic LED components, a transfer method using dielectric electrophoresis (DEP) has been developed. Therefore, ongoing research is being conducted on inorganic LEDs that offer higher durability and efficiency than organic LEDs. Summary of the Invention

[0005] Technical issues

[0006] The present disclosure aims to provide a display device in which structures positioned between adjacent pixels are omitted and the alignment of light-emitting elements is improved.

[0007] This disclosure also relates to a method of manufacturing a display device, wherein light-emitting elements are selectively disposed in a specific area.

[0008] It should be noted that the aspects of this disclosure are not limited thereto, and other aspects not mentioned herein will be apparent to those skilled in the art from the following description.

[0009] Technical solution

[0010] According to an embodiment of the present disclosure, a display device includes: a substrate; a first electrode and a second electrode disposed on the substrate and spaced apart from each other; a first insulating layer disposed on the substrate to cover at least a portion of the first electrode and at least a portion of the second electrode; and at least one first light-emitting element disposed on the first insulating layer and between the first electrode and the second electrode, wherein the first insulating layer includes a first sub-insulating layer and a second sub-insulating layer, the first sub-insulating layer including a first portion containing a hydrophilic material and a second portion comprising a region other than the first portion and containing a hydrophobic material, the second sub-insulating layer being disposed below the first sub-insulating layer, and at least a portion of the at least one first light-emitting element being disposed on the first portion.

[0011] The first part can be positioned between the first electrode and the second electrode.

[0012] The contact angle between the first part and the water can be 5 degrees or less, and the contact angle between the second part and the water can be 100 degrees or more.

[0013] The first insulating layer may include silicon carbon oxide, the first portion may have a higher oxygen atom concentration than the second portion, and the second portion may have a higher fluorine atom concentration than the first portion.

[0014] The first part can be configured to partially overlap with the opposite side of the first and second electrodes.

[0015] The second part may overlap with the side of the first electrode that is not opposite to the second electrode and the side of the second electrode that is not facing the first electrode.

[0016] It is defined as having a first region and a second region. The first part can be located in the first region, and the second part can be located in the second region, wherein the second region can surround the first region.

[0017] At least one first light-emitting element in the first region may have a higher density than at least one first light-emitting element in the second region.

[0018] It may define an emission region into which light from at least one first light-emitting element is emitted, and the emission region may include a first region.

[0019] The display device may further include a third electrode and a fourth electrode disposed on a substrate and spaced apart from each other, wherein a first insulating layer may also be disposed on the third electrode and the fourth electrode, a first portion may also be positioned between the third electrode and the fourth electrode, and a second portion may be positioned between the third electrode and the first electrode.

[0020] The display device may further include at least one second light-emitting element disposed on the first portion and between the third and fourth electrodes, wherein the at least one second light-emitting element can emit light having a wavelength band different from that of the first light-emitting element.

[0021] According to an embodiment of the present disclosure, a display device includes: a substrate; a first electrode disposed on the substrate and extending in a first direction; a second electrode extending in the first direction and spaced apart from the first electrode in a second direction different from the first direction; a first insulating layer disposed to cover at least a portion of the first electrode and at least a portion of the second electrode; and at least one light-emitting element disposed on the first insulating layer and between the first electrode and the second electrode, wherein the first insulating layer includes a first portion and a second portion, the first portion comprising a hydrophilic material and positioned in the region between the first electrode and the second electrode, and the second portion comprising a hydrophobic material and being the region other than the first portion.

[0022] The display device may further include a third electrode spaced apart from the first electrode in a second direction, wherein the first insulating layer may extend to be disposed on the third electrode, the second portion is positioned between the first electrode and the third electrode, and the light-emitting element between the first electrode and the second electrode may have a higher density than the light-emitting element between the first electrode and the third electrode.

[0023] The contact angle between the first part and the water can be 5 degrees or less, and the contact angle between the second part and the water can be 100 degrees or more.

[0024] The first insulating layer may also include a sub-insulating layer positioned below the first portion and the second portion.

[0025] At least one first portion may be spaced apart from each other in the second direction, and the second portion may be positioned in the area between at least one first portion.

[0026] According to embodiments of the present disclosure, a method for manufacturing a display device includes: forming a substrate, a first electrode and a second electrode disposed on the substrate and spaced apart from each other, and a first insulating layer covering at least a portion of the first electrode and at least a portion of the second electrode; forming a first portion comprising a hydrophilic material and a second portion comprising a hydrophobic material on the first insulating layer; and disposing a light-emitting element on the first portion and between the first electrode and the second electrode.

[0027] Forming the first portion and the second portion may include: forming the second portion by emitting a first plasma into the first insulating layer; and forming the first portion by emitting a second plasma into the second portion between the first electrode and the second electrode.

[0028] The first insulating layer may include silicon carbon oxide, the first plasma may include a fluorine (F)-based plasma, and the second plasma may include an oxygen (O)-based plasma.

[0029] The first insulating layer may also include a sub-insulating layer positioned below the first portion and the second portion.

[0030] Details of other implementation methods are included in the detailed description and accompanying drawings.

[0031] Beneficial effects

[0032] The display device according to the embodiment may include a first insulating layer comprising a hydrophilic region and a hydrophobic region, and a light-emitting element may be selectively disposed in the hydrophilic region. In the display device, the number of light-emitting elements retained in regions other than those where the light-emitting element is disposed can be minimized, and the light-emitting elements can be aligned at specific locations even when the structure between adjacent pixels is omitted. Therefore, in the display device, even when the size of each pixel is reduced, the light-emitting elements can be aligned within the pixel to distinguish them from other pixels.

[0033] The effects of the implementation methods are not limited to the above examples, and many more effects are included in this disclosure. Attached Figure Description

[0034] Figure 1 This is a schematic plan view of a display device according to an embodiment.

[0035] Figure 2 It is a schematic plan view of the pixels of a display device according to an embodiment.

[0036] Figure 3 It is along Figure 2 A schematic cross-sectional view taken by line X1-X1'.

[0037] Figure 4 yes Figure 3 A magnified view of part of Q.

[0038] Figure 5 This is a schematic diagram showing ink being sprayed onto a first insulating layer according to an embodiment.

[0039] Figure 6 It is along Figure 2 A schematic cross-sectional view taken by line X2-X2'.

[0040] Figure 7 It is a cross-sectional view schematically showing a partial cross-section of a display device according to an embodiment.

[0041] Figure 8 It is along Figure 2The sectional views taken by lines Xa-Xa', Xb-Xb', and Xc-Xc'.

[0042] Figure 9 This is a schematic diagram of a light-emitting element according to an embodiment.

[0043] Figure 10 This is a flowchart of a method for manufacturing a display device according to an embodiment.

[0044] Figures 11 to 18 This is a schematic diagram illustrating the manufacturing process of a display device according to an embodiment.

[0045] Figure 19 and Figure 20 This is a plan view showing the sub-pixels of a display device according to other embodiments.

[0046] Figure 21 It is a plan view of the sub-pixels of a display device according to another embodiment.

[0047] Figure 22 It is shown schematically. Figure 21 A cross-sectional view of the subpixels of a display device.

[0048] Figure 23 It is a plan view of the sub-pixels of a display device according to another embodiment.

[0049] Figure 24 It is shown schematically. Figure 23 A cross-sectional view of the subpixels of a display device.

[0050] Figure 25 It is shown Figure 23 A planar view of the three sub-pixels of the display device.

[0051] Figures 26 to 28 It is shown Figure 25 A schematic cross-sectional view of some operations in the manufacturing process of the display device.

[0052] Figure 29 This is a schematic diagram of a light-emitting element according to another embodiment. Detailed Implementation

[0053] The invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the invention are illustrated. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0054] It should also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or there may be an intervening layer. Throughout the specification, the same reference numerals denote the same parts.

[0055] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the teachings of the invention, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element.

[0056] In the following description, embodiments will be described with reference to the accompanying drawings.

[0057] Figure 1 This is a schematic plan view of a display device according to an embodiment.

[0058] refer to Figure 1 Display device 10 displays video or still images. Display device 10 can refer to any type of electronic device that provides a display screen. Examples of display devices 10 may include televisions, laptops, monitors, billboards, Internet of Things (IoT) devices, mobile phones, smartphones, tablet PCs, smartwatches, smartwatch phones, head-mounted displays, mobile communication terminals, electronic notebooks, e-book readers, portable multimedia players (PMPs), navigation devices, game consoles, digital cameras, portable camcorders, etc.

[0059] Display device 10 includes a display panel for providing a display screen. Examples of display panels include light-emitting diode (LED) display panels, organic light-emitting display panels, quantum dot light-emitting display panels, plasma display panels, field emission display panels, etc. The following describes an example of using an LED display panel as the display panel; however, the implementation is not limited to this, and another type of display panel can be used, as long as the same technical concept can be applied.

[0060] The display device 10 can be implemented in various shapes. For example, the display device 10 can have shapes such as a square shape, a rectangle that is long in the horizontal direction, a rectangle that is long in the vertical direction, a quadrilateral with rounded corners (vertices), other polygonal shapes, or circular shapes. The shape of the display area DA of the display device 10 can be substantially similar to the shape of the display device 10. Figure 1 A display device 10 and a display area DA, each having a rectangular shape that is elongated in the horizontal direction, are shown.

[0061] Display device 10 may include a display area DA and a non-display area NDA. The display area DA is the area in which a screen is displayed, and the non-display area NDA is the area in which a screen is not displayed. The display area DA may be referred to as the active area, and the non-display area NDA may be referred to as the inactive area.

[0062] Typically, the display area DA can be the central area of ​​the display device 10. The display area DA can include a plurality of pixels PX. The plurality of pixels PX can be arranged in a matrix. Each of the plurality of pixels PX can have a rectangular or square shape on a plane, but is not limited thereto, and can be a rhombus shape, each side of which is inclined relative to a first direction DR1. Each of the plurality of pixels PX can include at least one light-emitting element 300 that emits light of a specific wavelength band to display a specific color.

[0063] Figure 2 It is a schematic plan view of the pixels of a display device according to an embodiment.

[0064] refer to Figure 2 Each of the plurality of pixels PX may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. The first sub-pixel PX1 may emit light of a first color, the second sub-pixel PX2 may emit light of a second color, and the third sub-pixel PX3 may emit light of a third color. The first color may be red, the second color may be green, and the third color may be blue, but the implementation is not limited thereto, and the sub-pixels PXn may emit light of the same color. Figure 2 It is shown that each pixel PX includes three sub-pixels PXn, but is not limited to this, and may include more than three sub-pixels PXn.

[0065] As used herein, the terms "first," "second," etc., are used simply to distinguish components from each other, rather than to limit the components. That is, the configuration defined by the terms "first," "second," etc., is not limited to a specific configuration or location, and in some cases may be assigned other designations. Therefore, the designations assigned to each component herein can be described with reference to the accompanying drawings and the following description, and within the technical concept of this disclosure, the first component mentioned below may be named the second component.

[0066] Each of the sub-pixels PXn in the display device 10 may include a region defined as an emission region EMA. A first sub-pixel PX1 may include a first emission region EMA1, a second sub-pixel PX2 may include a second emission region EMA2, and a third sub-pixel PX3 may include a third emission region EMA3. The emission region EMA may be defined as including an area in which a light-emitting element 300 in the display device 10 is configured to emit light of a specific wavelength band. The light-emitting element 300 may include as described below. Figure 9 The active layer 330 shown can emit light of a specific wavelength band omnidirectionally. That is, light emitted from the active layer 330 of the light-emitting element 300 can be emitted in a direction toward the side of the light-emitting element 300 and in a direction toward both ends of the light-emitting element 300. The emission region EMA of each sub-pixel PXn (n = 1, 2, or 3) may include a region in which the light-emitting element 300 is disposed and a region adjacent to the light-emitting element 300 and emitting light from the light-emitting element 300 toward it. However, the implementation is not limited to this, and the emission region EMA may also include a region in which the light emitted from the light-emitting element 300 is reflected or refracted by another component. Multiple light-emitting elements 300 may be disposed in each sub-pixel PXn, and the emission region EMA may be formed to include a region in which multiple light-emitting elements 300 are disposed and a region adjacent to that region.

[0067] Although not shown in the accompanying drawings, each sub-pixel PXn of the display device 10 may include a non-emissive region defined as the area other than the emitting region EMA. The non-emissive region may be defined as an area in which no light-emitting element 300 is disposed, and light is not emitted into the area because light emitted from the light-emitting element 300 does not reach it.

[0068] Each sub-pixel PXn of the display device 10 may include a plurality of electrodes 210 and 220, a light-emitting element 300, and at least one insulating layer, for example, Figure 8 The insulating layers 510, 520 and 550 are shown.

[0069] Multiple electrodes 210 and 220 may be electrically connected to the light-emitting element 300, and a specific voltage may be applied to them, enabling the light-emitting element 300 to emit light of a specific wavelength band. At least a portion of each of the multiple electrodes 210 and 220 may be used to form an electric field in each sub-pixel PXn for alignment of the light-emitting element 300.

[0070] The plurality of electrodes 210 and 220 may include a first electrode 210 and a second electrode 220. In an embodiment, the first electrode 210 may be a pixel electrode separate for sub-pixels PXn, and the second electrode 220 may be a common electrode commonly connected along the sub-pixels PXn. One of the first electrode 210 and the second electrode 220 may be the anode electrode of the light-emitting element 300, and the other may be the cathode electrode of the light-emitting element 300. However, the embodiment is not limited thereto, and conversely, one of the first electrode 210 and the second electrode 220 may be the cathode electrode of the light-emitting element 300, and the other may be the anode electrode of the light-emitting element 300.

[0071] The first electrode 210 and the second electrode 220 may include electrode rod portions 210S and 220S extending in the first direction DR1 and at least one electrode branch portion, such as electrode branch portions 210B and 220B branching from the electrode rod portions 210S and 220S and extending in the second direction DR2 intersecting the first direction DR1.

[0072] The first electrode 210 may include a first electrode rod portion 210S extending in a first direction DR1 and at least one first electrode branch portion 210B branching from the first electrode rod portion 210S and extending in a second direction DR2.

[0073] The first electrode rod portion 210S of pixel PX may have two ends spaced apart from each other between sub-pixels PXn, and may be positioned on a line substantially the same as the first electrode rod portion 210S of adjacent sub-pixels PXn in the same row (e.g., adjacent sub-pixels PXn in the first direction DR1). The two ends of the first electrode rod portion 210S in each of the sub-pixels PXn may be spaced apart from the two ends of the first electrode rod portion 210S in other sub-pixels PXn to provide different electrical signals to the first electrode branch portion 210B, and the first electrode branch portion 210B may be driven individually.

[0074] The first electrode branch portion 210B may branch from at least a portion of the first electrode rod portion 210S and extend in the second direction DR2, and its branch may terminate such that the first electrode branch portion 210B is spaced apart from the second electrode rod portion 220S facing the first electrode rod portion 210S.

[0075] The second electrode 220 may include a second electrode rod portion 220S and a second electrode branch portion 220B. The second electrode rod portion 220S extends in a first direction DR1 to face the first electrode rod portion 210S, while being spaced apart from the first electrode rod portion 210S in a second direction DR2. The second electrode branch portion 220B branches from the second electrode rod portion 220S and extends in the second direction DR2. One end of the second electrode rod portion 220S may be connected to a second electrode rod portion 220S of another adjacent sub-pixel PXn in the first direction DR1. That is, unlike the first electrode rod portion 210S, the second electrode rod portion 220S may extend in the first direction DR1 to cross each sub-pixel PXn. The second electrode rod portion 220S crossing each sub-pixel PXn may be connected to an extension in one direction of the outer side of the display area DA where each pixel PX or each sub-pixel PXn is disposed, or to a non-display area NDA.

[0076] The second electrode branch portion 220B can be spaced apart from the first electrode branch portion 210B to face the first electrode branch portion 210B, and its branch can terminate while being spaced apart from the first electrode rod portion 210S. The second electrode branch portion 220B can be connected to the second electrode rod portion 220S, and one end of it in the direction in which the second electrode branch portion 220B extends can be positioned in the sub-pixel PXn, while being spaced apart from the first electrode rod portion 210S.

[0077] Although two first electrode branch portions 210B are positioned in each sub-pixel PXn in the accompanying drawings, and a second electrode branch portion 220B is positioned between the two first electrode branch portions 210B, the implementation is not limited thereto. Alternatively, the first electrode 210 and the second electrode 220 do not necessarily have a shape extending in one direction and can be arranged in various structures. For example, the first electrode 210 and the second electrode 220 may each have a partially curved or bent shape, or one of the first electrode 210 and the second electrode 220 may be arranged to surround the other. The structure or shape in which the first electrode 210 and the second electrode 220 are arranged is not particularly limited, as long as at least some regions of them are spaced apart from each other to face each other so as to form a space between them in which the light-emitting element 300 can be arranged.

[0078] The first electrode 210 and the second electrode 220 can be electrically connected to the display device 10 through contact holes (e.g., through the first electrode contact hole CNTD and the second electrode contact hole CNTS, respectively). Figure 7The circuit element layer PAL. In the figures, a first electrode contact hole CNTD is formed for the first electrode rod portion 210S of each sub-pixel PXn, and a second electrode contact hole CNTS is formed for only one second electrode rod portion 220S spanning each sub-pixel PXn. However, the implementation is not limited to this, and in some cases, a second electrode contact hole CNTS may be formed for the sub-pixel PXn.

[0079] Multiple light-emitting elements 300 may be disposed between the first electrode 210 and the second electrode 220. As shown in the accompanying drawings, the multiple light-emitting elements 300 may be disposed between the first electrode branch portion 210B and the second electrode branch portion 220B. One end of each of at least some of the multiple light-emitting elements 300 may be electrically connected to the first electrode 210, and the other end of each may be electrically connected to the second electrode 220. The two ends of the light-emitting element 300 may be disposed on the first electrode branch portion 210B and the second electrode branch portion 220B, respectively, but the implementation is not limited thereto. In some cases, the light-emitting element 300 may be disposed between the first electrode 210 and the second electrode 220 such that its two ends do not overlap with the first electrode 210 and the second electrode 220.

[0080] Multiple light-emitting elements 300 may be disposed between the first electrode 210 and the second electrode 220, spaced apart from each other and substantially parallel to each other. The gap between the multiple light-emitting elements 300 is not particularly limited. In some cases, multiple light-emitting elements 300 may be arranged adjacent to each other while being oriented and aligned in one direction to cluster together, and multiple other light-emitting elements 300 may be clustered together to be spaced apart from each other, or may be arranged at different densities. In embodiments, the light-emitting elements 300 may have a shape extending in one direction, and the direction in which each electrode (e.g., the first electrode branch portion 210B and the second electrode branch portion 220B) extends and the direction in which the light-emitting element 300 extends may be substantially perpendicular to each other. However, embodiments are not limited to this, and the light-emitting elements 300 may not be perpendicular to the direction in which the first electrode branch portion 210B and the second electrode branch portion 220B extend, but may be inclined to the direction in which the first electrode branch portion 210B and the second electrode branch portion 220B extend.

[0081] The display device 10 according to the embodiment may include a first insulating layer 510 covering at least a portion of the first electrode 210 and at least a portion of the second electrode 220, and each sub-pixel PXn may include a first region IR1 and a second region IR2 of the first insulating layer 510, the first region IR1 and the second region IR2 comprising materials with different polarities.

[0082] A first insulating layer 510 may be disposed on each sub-pixel PXn of the display device 10. The first insulating layer 510 may be configured to substantially completely cover each sub-pixel PXn and extend to adjacent sub-pixels PXn. The first insulating layer 510 may be configured to cover at least a portion of the first electrode 210 and at least a portion of the second electrode 220. Although in Figure 2 Although not shown in the figures, the first insulating layer 510 may be configured to expose a portion of the first electrode 210 and a portion of the second electrode 220, and particularly some areas of the first electrode branch portion 210B and some areas of the second electrode branch portion 220B. This will be described in detail below with reference to other figures.

[0083] In the first insulating layer 510, regions comprising a hydrophilic material and regions comprising a hydrophobic material can be formed. The region comprising the hydrophilic material can be a first region IR1, and the region comprising the hydrophobic material can be a second region IR2. Figure 2 As shown, the first region IR1 and the second region IR2 can be formed in each sub-pixel PXn of the display device 10.

[0084] Each of the first regions IR1 can be configured for one of the sub-pixels PXn. The first region IR1 can overlap with the first electrode 210 and the second electrode 220 configured for each sub-pixel PXn. In particular, the first region IR1 can be positioned to include the first electrode branch portion 210B, the second electrode branch portion 220B, and the area between them. A plurality of first regions IR1 can be formed for the sub-pixel PXn, and thus the first regions IR1 configured in adjacent sub-pixels PXn can be spaced apart from each other in one direction (e.g., a first direction DR1 or a second direction DR2). That is, the first regions IR1 can be formed as island-shaped or linear patterns over substantially the entire area of ​​the display device 10.

[0085] The second region IR2 is the region other than the first region IR1, and can be formed around the first region IR1. The second region IR2 can be formed around the first region IR1 and integrally connected to each sub-pixel PXn. In an embodiment, the second region IR2 can be located at the boundary of adjacent sub-pixels PXn. The second region IR2 can be formed at the boundary between adjacent sub-pixels PXn (e.g., first sub-pixel PX1, second sub-pixel PX2, and third sub-pixel PX3) in the first direction DR1, extending in the second direction DR2. Although not shown in the figures, the second region IR2 can be formed at the boundary between the first sub-pixel PX1, second sub-pixel PX2, and third sub-pixel PX3, and at the boundary between adjacent sub-pixels PXn in the second direction DR2, extending in both the first and second directions DR1 and DR2. That is, the second region IR2 can be formed as a grid pattern over substantially the entire area of ​​the display device 10.

[0086] According to an embodiment, the display device 10 may include a first region IR1 and a second region IR2, each of the first regions IR1 being disposed for one of the sub-pixels PXn, and the second region IR2 being the region other than the first region IR1. A light-emitting element 300 disposed for the sub-pixel PXn may be disposed in the first region IR1. The first region IR1 may be positioned between the first electrode 210 and the second electrode 220, for example, between the first electrode branch portion 210B and the second electrode branch portion 220B. The light-emitting element 300 may be aligned in the first region IR1 and between the first electrode branch portion 210B and the second electrode branch portion 220B. Therefore, the first region IR1 may be included in the emission region EMA, the light-emitting element 300 is arranged in the emission region EMA, and light from the light-emitting element 300 is emitted into the emission region EMA. That is, the emission region EMA of each sub-pixel PXn may have a larger area than the first region IR1. However, the embodiment is not limited to this, and the emission region EMA and the first region IR1 may have substantially the same area.

[0087] In one implementation, this can be achieved by adding the following during the manufacturing process of the display device 10: Figure 5Ink S, in which light-emitting elements 300 are dispersed, is sprayed onto the first electrode 210 and the second electrode 220, and an alignment signal is provided to the first electrode 210 and the second electrode 220 to position the light-emitting elements 300 between the first electrode 210 and the second electrode 220. Here, the ink S in which the light-emitting elements 300 are dispersed can be sprayed onto the first insulating layer 510 on the first electrode 210 and the second electrode 220, and can be fluid on the first insulating layer 510, thus moving to adjacent areas. The display device 10 according to the embodiment may include a first region IR1 and a second region IR2 of the first insulating layer 510 comprising materials with different polarities, and therefore, the ink S in which the light-emitting elements 300 are dispersed can be guided to be positioned in the first region IR1.

[0088] The ink S can form a stronger attraction with the material included in the first region IR1 of the first insulating layer 510 than with the material included in the second region IR2 of the first insulating layer 510, and can be sprayed onto the first insulating layer 510 to provide to the first region IR1. Since the first region IR1 is formed in the space between the first electrode 210 and the second electrode 220 in which the light-emitting elements 300 are aligned, the ink S in which the light-emitting elements 300 are dispersed is disposed in the first region IR1, and thus most of the light-emitting elements 300 can be aligned between the first electrode 210 and the second electrode 220. Each pixel PX or sub-pixel PXn of the display device 10 includes the first region IR1 and the second region IR2, and therefore, during the manufacturing process of the display device 10, the ink S in which the light-emitting elements 300 are dispersed can be guided to move to a certain region, and the number of light-emitting elements 300 in the region other than the region between the first electrode 210 and the second electrode 220 can be minimized. In other words, during the manufacturing process of the display device 10 according to the embodiment, the number of missing light-emitting elements 300 or the number of defective light-emitting elements 300 that are not connected to the electrodes 210 and 220 in each sub-pixel PXn can be minimized.

[0089] In the manufacturing process of the display device 10, even if no structure is provided between adjacent sub-pixels PXn or the structure between adjacent sub-pixels PXn is omitted, the ink S in which the light-emitting elements 300 are dispersed can be prevented from flowing to other sub-pixels PXn. The ink S sprayed onto each sub-pixel PXn can be guided to move to the first region IR1 and prevented from flowing from the boundary between the first region IR1 and the second region IR2 to the second region IR2. The second region IR2 can be formed at the boundary between sub-pixels PXn, and the ink S sprayed onto a sub-pixel PXn can be prevented from moving beyond the boundary between the sub-pixel PXn and its adjacent sub-pixels PXn.

[0090] According to an embodiment, the first insulating layer 510 of the display device 10 may include first sub-insulating layers 511 and 512 and a second sub-insulating layer 513, and the first sub-insulating layers 511 and 512 may each include a first portion 511 and a second portion 512. The region where the first portion 511 is positioned and the region where the second portion 512 is positioned may respectively form the first region IR1 and the second region IR2 described above. The first region IR1, where the light-emitting element 300 is disposed, may be the region where the first insulating layer 510 includes the first portion 511 containing a hydrophilic material, and the second region IR2 may be the region where the first insulating layer 510 includes the second portion 512 containing a hydrophobic material. This will be described in detail below with reference to other accompanying drawings.

[0091] Figure 3 It is along Figure 2 A schematic cross-sectional view taken by line X1-X1'. Figure 4 yes Figure 3 A magnified view of part of Q. Figure 5 This is a schematic diagram showing ink being sprayed onto a first insulating layer according to an embodiment. Figure 6 It is along Figure 2 A schematic cross-sectional view taken by line X2-X2'.

[0092] Figures 3 to 6 A cross-section of a sub-pixel PXn is schematically shown, and therefore the structure of the display device 10 according to the embodiment is not limited thereto. Figures 3 to 6 Only the first electrode 210, the second electrode 220, the first insulating layer 510, and the light-emitting element 300 disposed in each sub-pixel PXn are shown, but the display device 10 may also include a number of other components.

[0093] refer to Figures 3 to 6 The display device 10 according to the embodiment may include a circuit element layer PAL and an emissive layer EML positioned on the circuit element layer PAL. The structure of these components will be described in detail below. A light-emitting element 300 is disposed on the emissive layer EML. The emissive layer EML may include a first electrode 210, a second electrode 220, a first insulating layer 510, and the light-emitting element 300. The first electrode 210, the second electrode 220, and the light-emitting element 300 are as described above.

[0094] The first insulating layer 510 may be configured to cover the first electrode 210 and the second electrode 220, and the light-emitting element 300 may be disposed on the first insulating layer 510 and between the first electrode 210 and the second electrode 220. In the accompanying drawings, the two ends of the light-emitting element 300 are positioned at locations overlapping the first electrode 210 and the second electrode 220, respectively, but the implementation is not limited to this.

[0095] According to an embodiment, the first insulating layer 510 may include a second sub-insulating layer 513, a first portion 511 on a region of the second sub-insulating layer 513, and a second portion 512 comprising a region other than the first portion 511. The second sub-insulating layer 513 may be positioned throughout the first region IR1 and the second region IR2 to cover the first electrode 210 and the second electrode 220. The second sub-insulating layer 513 may be configured to directly contact the first electrode 210 and the second electrode 220 and extend to adjacent sub-pixels PXn.

[0096] The first portion 511 can be formed on a region of the second sub-insulating layer 513. The first portion 511 can be formed on a portion of the first electrode 210 and the second electrode 220 disposed in each sub-pixel PXn. The first portion 511 can be disposed only in each sub-pixel PXn. In the figures, it is shown that the first portion 511 overlaps with a region of the cross-section of the first electrode 210 (i.e., half of the first electrode 210) and covers the entire cross-section of the second electrode 220. That is, the first portion 511 can be configured to overlap only with the side of the first electrode 210 facing the second electrode 220, and with both sides of the second electrode 220 facing the first electrode 210. However, the implementation is not limited to this, and the first portion 511 can be formed to overlap the entire first electrode 210 or a portion of the second electrode 220. The region where the first portion 511 is formed can form a first region IR1. A plurality of light-emitting elements 300 can be disposed on the first portion 511 in the first region IR1.

[0097] The second portion 512 can be disposed in the area of ​​the second sub-insulating layer 513 where the first portion 511 is not formed. When the second portion 512 is positioned in a sub-pixel PXn, the second portion 512 can be disposed on the boundary of an adjacent sub-pixel PXn and can extend to the adjacent sub-pixel PXn to connect a sub-pixel PXn to an adjacent sub-pixel PXn. Figure 6 As shown, only the second sub-insulating layer 513 and the second portion 512 can be disposed in the region between the first electrode 210 in one sub-pixel PXn and the first electrode 210 in another sub-pixel PXn. The region where the second portion 512 is formed can form a second region IR2, and the light-emitting element 300 may not be substantially disposed on the second portion 512. That is, in the embodiment, the density of the light-emitting element 300 disposed in the first region IR1 or the first portion 511 can be higher than the density of the light-emitting element 300 disposed in the second region IR2 or the second portion 512.

[0098] The first portion 511 may include a hydrophilic material, and the second portion 512 may include a hydrophobic material. That is, regions with different polarities can be formed on the upper surface of the first insulating layer 510. According to an embodiment, during the manufacturing process of the display device 10, the ink S in which the light-emitting elements 300 are dispersed can be guided to move only to specific regions on the first insulating layer 510 with different polarities, such as the first portion 511 including the hydrophilic material.

[0099] like Figure 5 As shown, in the manufacturing process of the display device 10, ink S in which light-emitting elements 300 are dispersed can be sprayed onto the first electrode 210 and the second electrode 220. In an embodiment, the first portion 511 forming the first region IR1 can prevent the ink S from moving to the second portion 512. The ink S sprayed onto each sub-pixel PXn can be sprayed into the first region IR1 and held in its initial position, while the ink S sprayed into the second region IR2 other than the first region IR1 can form a strong attraction with the first portion 511, which includes a hydrophilic material, and thus move into the first region IR1. Therefore, the number of light-emitting elements 300 dispersed in the ink S between the first electrode 210 and the second electrode 220 can be increased.

[0100] By controlling the surface energy difference between the first portion 511 and the second portion 512 of the first insulating layer 510 and the ink S, the ink diffusion prevention function of the first insulating layer 510 can be obtained. As described above, the first portion 511 may include a hydrophilic material, the second portion 512 may include a hydrophobic material, and the surface energy difference between the first portion 511 and the ink S may be different from the surface energy difference between the second portion 512 and the ink S.

[0101] The ink S sprayed onto the first insulating layer 510 can be in a form suitable for minimizing surface energy. The ink S can be spherical or semi-elliptical in shape to minimize surface energy.

[0102] Here, the case where ink S is disposed on the first portion 511 (i.e., in the first region IR1) will be described as an example. Ink S may be disposed at the boundary between the first portion 511 and the second portion 512 to form an interface between the first portion 511 and ink S, as well as an interface between ink S and air. Ink S may have surface energy at the above interfaces and may exhibit behavior aimed at minimizing the value of surface energy.

[0103] For example, when ink S is positioned on the first portion 511 forming the first region IR1, ink S may have a first force F1 in a random direction due to the movement of the fluid. The first force F1 may be a force generated by the movement of the fluid contained in ink S, a force acting on ink S due to gravity, or a force applied to minimize the surface energy of ink S. The first force F1 can be applied such that the sum of the level of the first surface energy between ink S and the first portion 511 and the level of the second surface energy between ink S and air is minimized. Figure 5 As shown, when the level of the first surface energy between ink S and the first portion 511 is less than the level of the second surface energy between ink S and air, ink S can move due to the first force F1 applied to it, thereby increasing the interface between ink S and the first portion 511.

[0104] When ink S is positioned between the first region IR1 and the second region IR2 and moves to the second region IR2 by a first force F1, a new interface can be formed between ink S and the second portion 512. However, when the level of the third surface energy formed at the interface between ink S and the second portion 512 is large, the total surface energy of the surface of ink S may increase. To prevent this problem, a force (i.e., a second force F2) is applied to ink S to minimize the interface between ink S and the second portion 512. When the second force F2 applied to ink S is greater than the first force F1, ink S may not move at the boundary between the first portion 511 and the second portion 512. As described above, in the manufacturing process of the display device 10 according to the embodiment, ink S in which light-emitting elements 300 are dispersed can be guided to be positioned in a specific region (e.g., the first region IR1). That is, ink S sprayed onto each sub-pixel PXn can be prevented from spreading to areas other than the first region IR1. Therefore, the light-emitting element 300 dispersed in the ink S can be guided to be positioned only in the first region IR1, and the number of light-emitting elements 300 between the electrodes 210 and 220 in the first region IR1 can be increased.

[0105] In addition, such as Figure 6 As shown, a second region IR2 can be formed between different sub-pixels PXn to prevent ink S from diffusing into adjacent sub-pixels PXn even when no components are provided to separate the sub-pixels PXn from each other. When different types of light-emitting elements 300 are provided for sub-pixels PXn, in the manufacturing process of the display device 10, it is necessary to prevent the light-emitting element 300 to be provided in a particular sub-pixel PXn from being provided in another sub-pixel PXn. Here, in the display device 10 according to the embodiment, a second region IR2 can be formed between adjacent sub-pixels PXn so that different types of light-emitting elements 300 can be provided in the sub-pixels PXn even when no additional components are provided.

[0106] According to an embodiment, the first portion 511 may include a hydrophilic material, and the second portion 512 may include a hydrophobic material. When the ink S in which the light-emitting element 300 is dispersed includes a hydrophilic solvent, the second force F2 applied to the ink S at the boundary between the first portion 511 and the second portion 512 can be greater than the first force F1, and thus can prevent the ink S from diffusing into the sub-pixel PXn. However, the polarity of the materials included in the first portion 511 and the second portion 512 is not limited thereto. In the manufacturing process of the display device 10, the polarity of the materials included in the first portion 511 and the second portion 512 can be reversed according to the polarity of the ink S in which the light-emitting element 300 is dispersed.

[0107] In an embodiment, the first portion 511 may include a material having a contact angle of 30° or less, or 5° or less, relative to water, and the second portion 512 may include a material having a contact angle of 80° or greater, or 150° or greater, relative to water. When the ink S in which the light-emitting element 300 is dispersed is hydrophilic, the first portion 511 may also include a hydrophilic material, and the second portion 512 may include a hydrophobic material, thereby preventing the ink S from diffusing to areas other than the first region IR1. However, the embodiment is not limited to this, and the polarities of the materials of the first portion 511 and the second portion 512 may be opposite to those described above.

[0108] Alternatively, the light-emitting elements 300 may also be disposed in the region of each sub-pixel PXn other than the first region IR1. In some cases, some light-emitting elements 300 may be disposed only in the second region IR2. In the display device 10 according to the embodiment, the density of light-emitting elements 300 disposed in the first region IR1 may be higher than the density of light-emitting elements 300 disposed in the second region IR2.

[0109] In the manufacturing process of the display device 10, the first insulating layer 510 with the above-described structure can be obtained by forming a first insulating layer 510 and emitting different types of plasma into the first insulating layer 510 to form a first portion 511, a second portion 512, and a second sub-insulating layer 513. A first plasma can be emitted into the first insulating layer 510 (see...). Figure 12 The second part 512 can be formed by emitting a second plasma into the first insulating layer 510 (see [link]). Figure 14 The first part 511 is formed by forming the first insulating layer 510, and the second sub-insulating layer 513 can be formed in the region of the first insulating layer 510 where the plasma is not emitted.

[0110] According to an embodiment, the first insulating layer 510 may include an inorganic insulating material. For example, the first insulating layer 510 may include silicon carbide (SiOC). x The first insulating layer 510 may comprise silicon-carbon oxide and thus contains silicon-oxygen (Si-O) bonds and silicon-carbon (Si-C) bonds. Here, when plasma is emitted, the silicon-carbon (Si-C) bonds can be broken, and another bond can be formed by the emitted plasma. In an embodiment, in the manufacturing process of the display device 10, the first plasma and the second plasma emitted to the first insulating layer 510 may be fluorine (F)-based plasma and oxygen-based plasma, respectively. Therefore, the first portion 511 may contain silicon-oxygen (Si-O) bonds formed due to the emission of the second plasma, and the second portion 512 may contain silicon-fluoromethyl (Si-CNFM) bonds formed by the emission of the first plasma. The second sub-insulating layer 513 may be a region that is not emitted plasma and comprises the same material as the first insulating layer 510.

[0111] According to an embodiment, the first insulating layer 510 may include silicon carbide (SiOC) x And therefore can be emitted into silicon carbide (SiOC) x The plasma forms regions containing different bonds. That is, by emitting the first plasma into silicon carbide (SiOC) x Silicon-fluorinated methyl (Si-CNFM) bonds are formed, and silicon-oxygen (Si-O) bonds can be formed by emitting a second plasma. This is contained within silicon carbide (SiOC) compounds. x The silicon (Si) in the first insulating layer 510 can break bonds regardless of the type of element in the bond, and new bonds can be formed when plasma is emitted onto the bond. In other words, when the first plasma or the second plasma is emitted onto the first insulating layer 510, the upper surface of the first insulating layer 510 can be selectively or reversibly surface modified. This will be described below.

[0112] The first portion 511 may contain silicon-oxygen (Si-O) bonds or silicon-hydroxyl (Si-OH) bonds, and therefore may have hydrophilic polarity and a small contact angle with water. Conversely, the second portion 512 may contain silicon-fluoromethyl (Si-CNFM) bonds, and therefore may have hydrophobic polarity and a large contact angle with water. Thus, in the manufacturing process of the display device 10, the ink S sprayed onto the first insulating layer 510 can be guided to be positioned in the first region IR1 in which the first portion 511 with hydrophilic polarity is formed.

[0113] The first insulating layer 510 may be in the form in which a first portion 511 and a second portion 512 comprising different bonds are formed in some regions by emitting a first plasma or a second plasma onto substantially an insulating layer. Although the first portion 511, the second portion 512, and the second sub-insulating layer 513 are shown as different layers in the drawings, the embodiments are not limited thereto. The first insulating layer 510 may be formed such that the first portion 511, the second portion 512, and the second sub-insulating layer 513 are integrally formed, and the composition ratio of the materials or the type of bonds may vary depending on their positions. In some cases, the first insulating layer 510 may include a first portion 511 formed by providing a layer comprising a hydrophilic material on the second sub-insulating layer 513, and a second portion 512 formed by providing a layer comprising a hydrophobic material on the regions of the second sub-insulating layer 513 other than the first portion 511.

[0114] In one embodiment, the first insulating layer 510 may include a second sub-insulating layer 513, a first portion 511 with a higher oxygen (O) atom content than the second sub-insulating layer 513, and a second portion 512 with a higher fluorine (F) atom content than both the second sub-insulating layer 513 and the first portion 511. Alternatively, the oxygen (O) atom content of the first insulating layer 510 in the first region IR1 may increase from the lower region to the upper region, and the fluorine (F) atom content of the first insulating layer 510 in the second region IR2 may increase from the lower region to the upper region. The lower region of the first insulating layer 510 may be the second sub-insulating layer 513. The upper region of the first insulating layer 510 with a higher oxygen (O) atom content in the first region IR1 may be the first portion 511, and the upper region of the first insulating layer 510 with a higher fluorine (F) atom content in the second region IR2 may be the second portion 512.

[0115] According to an embodiment, the first insulating layer 510 may include silicon carbide (SiOC) x The ink S sprayed onto the first insulating layer 510 includes a first portion 511 with a higher oxygen (O) atom content than other regions and a second portion 512 with a higher fluorine (F) atom content than other regions. Because the first portion 511 with a higher oxygen (O) atom content is hydrophilic and the second portion 512 with a higher fluorine (F) atom content is hydrophobic, the ink S sprayed onto the first insulating layer 510 can be guided to be positioned on a specific region (e.g., the first portion 511).

[0116] In some implementations... Figure 7The contact electrode 260 can be disposed on the first electrode 210 and the second electrode 220. The contact electrode 260 can be substantially disposed on the first insulating layer 510, and at least a portion thereof can be in contact with or electrically connected to the first electrode 210 and the second electrode 220.

[0117] Figure 7 It is a cross-sectional view schematically showing a partial cross-section of a display device according to an embodiment.

[0118] refer to Figure 7 According to an embodiment, the first insulating layer 510 may be formed to expose at least a portion of the first electrode 210 and at least a portion of the second electrode 220, and the display device 10 may further include a contact electrode 260 that contacts the first electrode 210 and the second electrode 220 exposed through an opening. The first insulating layer 510 may be configured to cover the electrodes 210 and 220, and the opening may be formed to overlap with the electrodes 210 and 220 to expose some areas of the electrodes 210 and 220. As shown in the figures, the opening may completely expose the flat top surfaces of the electrodes 210 and 220 and partially expose the inclined sides of the electrodes 210 and 220. However, the embodiment is not limited to this. The opening formed in the first insulating layer 510 may only expose a portion of the upper surfaces of the electrodes 210 and 220.

[0119] Contact electrode 260 is disposed on electrodes 210 and 220. Contact electrode 260 can contact the areas of electrodes 210 and 220 exposed through openings and at least one end of the light-emitting element 300. Contact electrode 260 includes a first contact electrode 261 on the first electrode 210 and a second contact electrode 262 on the second electrode 220. The first contact electrode 261 can contact the exposed area of ​​the first electrode 210 and one end of the light-emitting element 300, and the second contact electrode 262 can contact the exposed area of ​​the second electrode 220 and the other end of the light-emitting element 300.

[0120] like Figure 7 As shown, the opening in the first insulating layer 510 can expose at least a portion of the sides of the first electrode 210 and the second electrode 220, as well as the upper surfaces of the first electrode 210 and the second electrode 220. In this case, the area of ​​electrodes 210 and 220 exposed through the opening can be increased, and the contact electrode 260 can contact a larger area of ​​electrodes 210 and 220. Therefore, the contact resistance between the contact electrode 260 and electrodes 210 and 220 can be reduced.

[0121] In the manufacturing process of the display device 10, after forming a first insulating layer 510 covering the entire electrodes 210 and 220, the light-emitting element 300 can be aligned within a first region IR1. Thereafter, openings for exposing portions of the electrodes 210 and 220 can be formed in the first insulating layer 510, and a contact electrode 260 can be formed that contacts at least one end of the light-emitting element 300 and at least a region of the electrodes 210 and 220. Because the display device 10 according to the embodiment also includes the contact electrode 260, which contacts the areas of the electrodes 210 and 220 exposed through the openings and the light-emitting element 300, electrical signals can be transmitted from the electrodes 210 and 220 to the light-emitting element 300 through the contact electrode 260 even when the electrodes 210 and 220 are completely covered by the first insulating layer 510.

[0122] In one embodiment, the first contact electrode 261 may contact one end of the light-emitting element 300 and the first electrode 210, and the second contact electrode 262 may contact the other end of the light-emitting element 300 and the second electrode 220. The light-emitting element 300 may extend in one direction, and its two ends in that direction may contact the first contact electrode 261 and the second contact electrode 262. The contact electrode 260 may also contact the region of the side of the light-emitting element 300 adjacent to both ends of the light-emitting element 300 and the two ends of the light-emitting element 300. That is, the contact electrode 260 may contact the light-emitting element 300 to surround both ends of the light-emitting element 300. However, the embodiment is not limited to this.

[0123] However, the structure of the display device 10 is not limited to Figures 3 to 7 The structure shown is such that the display device 10 can have the same... Figures 3 to 7 The structures shown are different, or a greater number of components can be disposed on the circuit element layer PAL. Although not shown in the figures, the display device 10 may include electrodes 210 and 220, a circuit element layer PAL below the electrodes 210 and 220, and Figure 8 The second insulating layer 520 is configured to cover at least a portion of the light-emitting element 300 and Figure 8 The passivation layer is 550. The following will refer to... Figure 8 The structure of the display device 10 is described in detail.

[0124] Figure 8 It is along Figure 2 The sectional views taken by lines Xa-Xa', Xb-Xb', and Xc-Xc'.

[0125] Figure 8 Only the cross-section of the first sub-pixel PX1 is shown, but it can be applied to other pixels PX or sub-pixels PXn. Figure 8A cross-section across one end and the other end of the light-emitting element 300 is shown.

[0126] refer to Figure 2 and Figure 8 The display device 10 may include a circuit element layer PAL and an emission layer EML. The circuit element layer PAL may include a substrate 110, a buffer layer 115, a light blocking layer BML, a first transistor 120, a second transistor 140, etc., and the emission layer EML may include a plurality of electrodes 210 and 220 disposed on the first transistor 120 and the second transistor 140, a light-emitting element 300, and a plurality of insulating layers 510, 520 and 550, etc.

[0127] Substrate 110 may be an insulating substrate. Substrate 110 may be formed of an insulating material such as glass, quartz, or polymer resin. Substrate 110 may be a rigid substrate, but may be a flexible substrate that can be bent, folded, or rolled.

[0128] A light-blocking layer BML may be disposed on the substrate 110. The light-blocking layer BML may include a first light-blocking layer BML1 and a second light-blocking layer BML2. The first light-blocking layer BML1 may be electrically connected to the first drain electrode 123 of the first transistor 120, which will be described below. The second light-blocking layer BML2 may be electrically connected to the second drain electrode 143 of the second transistor 140.

[0129] The first light-blocking layer BML1 and the second light-blocking layer BML2 are configured to overlap the first active material layer 126 of the first transistor 120 and the second active material layer 146 of the second transistor 140, respectively. The first light-blocking layer BML1 and the second light-blocking layer BML2 may comprise a light-blocking material, and thus prevent light from incident on the first active material layer 126 and the second active material layer 146. For example, the first light-blocking layer BML1 and the second light-blocking layer BML2 may be formed of an opaque metallic material capable of blocking light. However, the implementation is not limited to this, and in some cases, the light-blocking layer BML may be omitted.

[0130] A buffer layer 115 is disposed on the light-blocking layer BML and the substrate 110. The buffer layer 115 can be configured to completely cover the substrate 110 on which the light-blocking layer BML is disposed. The buffer layer 115 can prevent the diffusion of impurity ions, prevent the penetration of moisture or external air, and perform a surface planarization function. In addition, the buffer layer 115 can insulate the light-blocking layer BML, the first active material layer 126, and the second active material layer 146 from each other.

[0131] A semiconductor layer is disposed on the buffer layer 115. The semiconductor layer may include an auxiliary layer 163, a first active material layer 126 of the first transistor 120, and a second active material layer 146 of the second transistor 140. The semiconductor layer may include polycrystalline silicon, monocrystalline silicon, oxide semiconductor, etc.

[0132] The first active material layer 126 may include a first doped region 126a, a second doped region 126b, and a first channel region 126c. The first channel region 126c may be disposed between the first doped region 126a and the second doped region 126b. The second active material layer 146 may include a third doped region 146a, a fourth doped region 146b, and a second channel region 146c. The second channel region 146c may be disposed between the third doped region 146a and the fourth doped region 146b. The first active material layer 126 and the second active material layer 146 may include polycrystalline silicon. Polycrystalline silicon can be formed by crystallizing amorphous silicon. Examples of methods for crystallizing amorphous silicon may include, but are not limited to, rapid thermal annealing (RTA), solid-state crystallization (SPC), excimer laser annealing (ELA), metal-induced crystallization (MILC), sequential lateral solidification (SLS), etc. As another example, the first active material layer 126 and the second active material layer 146 may include monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, etc. Each of the first doped region 126a, the second doped region 126b, the third doped region 146a, and the fourth doped region 146b may be a region of the first active material layer 126 or the second active material layer 146 that is doped with impurities. However, the implementation is not limited to this.

[0133] A first gate insulating film 150 is disposed on the semiconductor layer. The first gate insulating film 150 may be configured to cover the entire buffer layer 115 on which the semiconductor layer is disposed. The first gate insulating film 150 may be used as the gate insulating film for the first transistor 120 and the second transistor 140.

[0134] A first conductive layer is disposed on the first gate insulating film 150. The first conductive layer on the first gate insulating film 150 may include a first gate electrode 121 on the first active material layer 126 of the first transistor 120, a second gate electrode 141 on the second active material layer 146 of the second transistor 140, and a power supply interconnect 161 on the auxiliary layer 163. The first gate electrode 121 may overlap with the first channel region 126c of the first active material layer 126, and the second gate electrode 141 may overlap with the second channel region 146c of the second active material layer 146.

[0135] An interlayer insulating film 170 is disposed on the first conductive layer. The interlayer insulating film 170 can perform the functions of an interlayer insulating film. The interlayer insulating film 170 may include an organic insulating material and perform a surface planarization function.

[0136] A second conductive layer is disposed on the interlayer insulating film 170. The second conductive layer includes the first drain electrode 123 and the first source electrode 124 of the first transistor 120, the second drain electrode 143 and the second source electrode 144 of the second transistor 140, and the power electrode 162 disposed on the power supply interconnect 161.

[0137] The first drain electrode 123 and the first source electrode 124 can contact the first doped region 126a and the second doped region 126b of the first active material layer 126, respectively, through contact holes passing through the interlayer insulating film 170 and the first gate insulating film 150. The second drain electrode 143 and the second source electrode 144 can contact the third doped region 146a and the fourth doped region 146b of the second active material layer 146, respectively, through contact holes passing through the interlayer insulating film 170 and the first gate insulating film 150. The first drain electrode 123 and the second drain electrode 143 can be electrically connected to the first photoblocking layer BML1 and the second photoblocking layer BML2, respectively, through another contact hole.

[0138] A via layer 200 is provided on the second conductive layer. The via layer 200 may include an organic insulating material and perform a surface planarization function.

[0139] Multiple dams 410 and 420, multiple electrodes 210 and 220, and light-emitting elements 300 may be provided on the through-hole layer 200.

[0140] Multiple dikes 410 and 420 may be provided in each sub-pixel PXn, spaced apart from each other. The multiple dikes 410 and 420 may include a first dike 410 and a second dike 420 provided adjacent to the central portion of each sub-pixel PXn.

[0141] The first dike 410 and the second dike 420 are arranged facing each other and spaced apart. The first electrode 210 may be disposed on the first dike 410, and the second electrode 220 may be disposed on the second dike 420. (Reference) Figure 2 and Figure 8 It can be understood that the first electrode branch portion 210B is disposed on the first dam 410, and the second electrode branch portion 220B is disposed on the second dam 420.

[0142] The first dike 410 and the second dike 420 may be disposed in each sub-pixel PXn to extend in the second direction DR2. Although not shown in the figures, the first dike 410 and the second dike 420 may extend in the second direction DR2, and therefore may extend toward the adjacent sub-pixel PXn in the second direction DR2. However, the implementation is not limited to this, and the first dike 410 and the second dike 420 may be disposed for each sub-pixel PXn to form a pattern on the front surface of the display device 10. The first dike 410 and the second dike 420 may include, but are not limited to, polyimide (PI).

[0143] The first dam 410 and the second dam 420 may each have at least a portion protruding relative to the through-hole layer 200. The first dam 410 and the second dam 420 may protrude upward relative to the plane in which the light-emitting element 300 is disposed, and at least a portion of the protruding portion of the first dam 410 and the second dam 420 may be inclined. The shape of the protruding portion of the first dam 410 and the second dam 420 is not particularly limited.

[0144] According to the embodiment, the dikes 410 and 420 may not be provided at the boundary between adjacent sub-pixels PXn. For example, a flat surface may be formed between the first sub-pixel PX1 and the second sub-pixel PX2, instead of forming a flat surface between the dikes 410 and 420 extending in the second direction DR2. As described above, in each sub-pixel PXn, a first insulating layer 510 including multiple sub-insulating layers 511, 512, and 513 may be provided, and a first region IR1 and a second region IR2 with different polarities may be defined. In the manufacturing process of the display device 10, when organic material or solvent is sprayed onto each sub-pixel PXn by inkjet printing, even if the dikes 410 and 420 are not provided at the boundary between sub-pixels PXn, the organic material or solvent can be positioned in the first region IR1 of each sub-pixel PXn. In each sub-pixel PXn, a first insulating layer 510 comprising multiple sub-insulating layers 511, 512, and 513 can be provided, and even when dikes 410 and 420 are not provided at the boundaries between adjacent sub-pixels PXn, sprayed organic materials or solvents can be prevented from flowing into neighboring sub-pixels PXn. This is as referenced above. Figure 5 Detailed description.

[0145] Multiple electrodes 210 and 220 can be disposed on the through-hole layer 200 and the embankments 410 and 420. As described above, electrodes 210 and 220 include electrode rod portions 210S and 220S and electrode branch portions 210B and 220B. Figure 2In the middle, line Xa-Xa' crosses the first electrode rod portion 210S, line Xb-Xb' crosses the first electrode branch portion 210B and the second electrode branch portion 220B, and line Xc-Xc' crosses the second electrode rod portion 220S. That is to say, it can be understood that the configuration is set by... Figure 8 The first electrode 210 in the region indicated by lines Xa-Xa' corresponds to the first electrode rod portion 210S. The first electrode 210 and the second electrode 220 in the region indicated by lines Xb-Xb' correspond to the first electrode branch portion 210B and the second electrode branch portion 220B, respectively. The second electrode 220 in the region indicated by lines Xc-Xc' corresponds to the second electrode rod portion 220S. The electrode rod portions 210S and 220S, as well as the electrode branch portions 210B and 220B, can form the first electrode 210 and the second electrode 220.

[0146] Some regions of the first electrode 210 and some regions of the second electrode 220 can be disposed on the via layer 200, and some regions of them can be disposed on the first dam 410 and the second dam 420. As described above, the first electrode rod portion 210S of the first electrode 210 and the second electrode rod portion 220S of the second electrode 220 can extend in the first direction DR1, and the first dam 410 and the second dam 420 can extend in the second direction DR2, so as to be placed in the adjacent sub-pixel PXn in the second direction DR2. Although not shown in the figures, the first electrode rod portion 210S of the first electrode 210 extending in the first direction DR1 and the second electrode rod portion 220S of the second electrode 220 extending in the first direction DR1 can partially overlap with the first dam 410 and the second dam 420. However, the embodiments are not limited to this, and the first electrode rod portion 210S and the second electrode rod portion 220S may not overlap with the first dam 410 and the second dam 420.

[0147] A first electrode contact hole CNTD may be formed in the first electrode rod portion 210S of the first electrode 210, which passes through the via layer 200 and partially exposes the first drain electrode 123 of the first transistor 120. The first electrode 210 can contact the first drain electrode 123 through the first electrode contact hole CNTD. The first electrode 210 can be electrically connected to the first drain electrode 123 of the first transistor 120 to receive a specific electrical signal.

[0148] The second electrode rod portion 220S of the second electrode 220 can extend in one direction to be placed in a non-emitting area where no light-emitting element 300 is disposed. A second electrode contact hole CNTS can be formed in the second electrode rod portion 220S, penetrating the through-hole layer 200 and partially exposing the power electrode 162. The second electrode 220 can contact the power electrode 162 via the second electrode contact hole CNTS. The second electrode 220 can be electrically connected to the power electrode 162 to receive a specific electrical signal from the power electrode 162.

[0149] Some regions of the first electrode 210 and some regions of the second electrode 220 (e.g., the first electrode branch portion 210B and the second electrode branch portion 220B) can be positioned on the first embankment 410 and the second embankment 420, respectively. The first electrode branch portion 210B of the first electrode 210 can be configured to cover the first embankment 410, and the second electrode branch portion 220B of the second electrode 220 can be configured to cover the second embankment 420. Because the first embankment 410 and the second embankment 420 are spaced apart from each other relative to the center of each sub-pixel PXn, the first electrode branch portion 210B and the second electrode branch portion 220B can also be spaced apart from each other. A plurality of light-emitting elements 300 can be disposed in the region between the first electrode 210 and the second electrode 220, that is, facing each other and spaced apart from each other in the space between the first electrode branch portions 210B and the second electrode branch portions 220B.

[0150] Electrodes 210 and 220 may comprise transparent conductive materials. For example, electrodes 210 and 220 may comprise materials such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (ITZO), but the implementation is not limited thereto. In some implementations, electrodes 210 and 220 may comprise conductive materials with high reflectivity. For example, electrodes 210 and 220 may comprise metals such as silver (Ag), copper (Cu), or aluminum (Al) as materials with high reflectivity. In this case, light incident on electrodes 210 and 220 can be reflected and emitted in the upward direction of each sub-pixel PXn.

[0151] Electrodes 210 and 220 can be formed by alternately stacking at least one transparent conductive material and at least one metal layer with high reflectivity, or by forming a transparent conductive material and a metal layer with high reflectivity in a single layer. In embodiments, electrodes 210 and 220 may have a stacked structure of ITO / silver (Ag) / ITO / IZO, or may be an alloy containing aluminum (Al), nickel (Ni), lanthanum (La), etc. However, embodiments are not limited to these.

[0152] A first insulating layer 510 is disposed on the via layer 200, the first electrode 210, and the second electrode 220. The first insulating layer 510 is configured to partially cover the first electrode 210 and the second electrode 220. The first insulating layer 510 is configured to cover most of the upper surfaces of the first electrode 210 and the second electrode 220, while partially exposing the first electrode 210 and the second electrode 220. The first insulating layer 510 may be configured to expose portions of the upper surfaces of the first electrode 210 and the second electrode 220, for example, portions of the upper surface of the first electrode branch portion 210B on the first embankment 410 and portions of the upper surface of the second electrode branch portion 220B on the second embankment 420. That is, the first insulating layer 510 may be formed on substantially the entire via layer 200 and includes openings to partially expose the first electrode 210 and the second electrode 220. The openings of the first insulating layer 510 may be positioned to expose the relatively flat upper surfaces of the first electrode 210 and the second electrode 220.

[0153] In one embodiment, the flat upper surface of the first insulating layer 510 can be configured to house the light-emitting element 300 between the first electrode 210 and the second electrode 220. The upper surface can extend in a direction toward the first electrode 210 and the second electrode 220 and terminate at the inclined sides of the first electrode 210 and the second electrode 220. That is, the first insulating layer 510 can be disposed in the region where the electrodes 210 and 220 overlap with the inclined sides of the first and second electrodes 410 and 420. The contact electrode 260, described below, can contact the exposed areas of the first electrode 210 and the second electrode 220 and can make smooth contact with the end of the light-emitting element 300 on the flat upper surface of the first insulating layer 510.

[0154] However, the implementation is not limited to this. The upper surface of the first insulating layer 510, which is disposed between the first electrode 210 and the second electrode 220 spaced apart from each other, may not be flat, but may be stepped. When the light-emitting element 300 is disposed on the first insulating layer 510, a space may be formed between the lower surface of the light-emitting element 300 and the stepped region of the first insulating layer 510. The light-emitting element 300 may be disposed partially spaced from the upper surface of the first insulating layer 510, and this space may be filled with the material of the second insulating layer 520, which will be described below.

[0155] The first insulating layer 510 protects the first electrode 210 and the second electrode 220 while insulating them from each other. Furthermore, the first insulating layer 510 prevents the light-emitting element 300 disposed thereon from being damaged due to direct contact with other components. However, the shape and structure of the first insulating layer 510 are not limited thereto.

[0156] As described above, the first insulating layer 510 may include a first portion 511, a second portion 512, and a second sub-insulating layer 513. The second sub-insulating layer 513 may be configured to cover the first dam 410, the second dam 420, the first electrode 210, and the second electrode 220 on the via layer 200. That is, the second sub-insulating layer 513 may be configured in substantially the same form as the first insulating layer 510. Although in Figure 8 It is not shown in the figure, but a first region IR1 can be formed in the region where the first portion 511 of the first insulating layer 510 is disposed, and a second region IR2 can be formed in the remaining region where the second portion 512 is disposed. This is as described above, and therefore a detailed description thereof will be omitted.

[0157] The light-emitting element 300 may be disposed on the first insulating layer 510 between electrodes 210 and 220. For example, at least one light-emitting element 300 may be disposed on the first insulating layer 510 between electrode branch portions 210B and 220B, i.e., disposed on the first portion 511 forming the first region IR1. However, the embodiment is not limited to this, and although not shown in the drawings, at least some of the light-emitting elements 300 disposed in each sub-pixel PXn may be disposed in the second region IR2. In the display device 10 according to the embodiment, most of the light-emitting elements 300 in each sub-pixel PXn may be disposed in the first region IR1, and only some light-emitting elements 300 may be disposed in the second region IR2. Alternatively, some areas of the light-emitting elements 300 may be disposed at locations overlapping with electrodes 210 and 220. Each of the light-emitting elements 300 may be disposed on one of the ends of the first electrode branch portion 210B and the second electrode branch portion 220B facing each other, and may be electrically connected to electrodes 210 and 220 via contact electrode 260.

[0158] The light-emitting element 300 includes a plurality of layers disposed in a horizontal direction relative to the through-hole layer 200. The light-emitting element 300 of the display device 10 according to the embodiment may include... Figure 9 The figure shows a first semiconductor layer 310, an active layer 330, and a second semiconductor layer 320 that can be sequentially arranged in the horizontal direction relative to the via layer 200. As shown in the figures, the first semiconductor layer 310, the active layer 330, and the second semiconductor layer 320 can be sequentially arranged in the light-emitting element 300 in the horizontal direction relative to the via layer 200. However, the implementation is not limited to this. The order in which the multiple layers of the light-emitting element 300 are arranged can be reversed, and the multiple layers of the light-emitting element 300 can be arranged in a direction perpendicular to the via layer 200 when the light-emitting element 300 has a different structure in the following cases.

[0159] The second insulating layer 520 may be partially disposed on the light-emitting element 300. The second insulating layer 520 may be configured to partially cover the outer surface of the light-emitting element 300. The second insulating layer 520 may perform the function of fixing the light-emitting element 300 and protecting it during the manufacturing process of the display device 10. In one embodiment, some material of the second insulating layer 520 may be disposed between the lower surface of the light-emitting element 300 and the first insulating layer 510. As described above, the second insulating layer 520 may be formed to fill the space created between the first insulating layer 510 and the light-emitting element 300 during the manufacturing process of the display device 10. Therefore, the second insulating layer 520 may be formed to cover the outer surface of the light-emitting element 300. However, the embodiments are not limited to this.

[0160] The second insulating layer 520 may extend and be disposed in a plane in a second direction DR2 between the first electrode branch portion 210B and the second electrode branch portion 220B. For example, the second insulating layer 520 may be in the form of an island or a line on the plane of the through-hole layer 200.

[0161] Contact electrode 260 is disposed on electrodes 210 and 220 and on the second insulating layer 520. First contact electrode 261 and second contact electrode 262 may be disposed on the second insulating layer 520 and spaced apart from each other. The second insulating layer 520 insulates the first contact electrode 261 and the second contact electrode 262 from each other, preventing them from contacting each other.

[0162] Although not shown in the accompanying drawings, a plurality of contact electrodes 260 may extend in a plane along the second direction DR2, spaced apart from each other along the first direction DR1. The contact electrodes 260 may contact at least one end of the light-emitting element 300 and be electrically connected to the first electrode 210 or the second electrode 220 to receive electrical signals. The contact electrodes 260 may include a first contact electrode 261 and a second contact electrode 262. The first contact electrode 261 may be disposed on the first electrode branch portion 210B to contact one end of the light-emitting element 300, and the second contact electrode 262 may be disposed on the second electrode branch portion 220B to contact the other end of the light-emitting element 300.

[0163] The first contact electrode 261 can contact the exposed area of ​​the first electrode 210 on the first dam 410, and the second contact electrode 262 can contact the exposed area of ​​the second electrode 220 on the second dam 420. The contact electrode 260 can transmit the electrical signals transmitted from the electrodes 210 and 220 to the light-emitting element 300.

[0164] The contact electrode 260 may include a conductive material. For example, the contact electrode 260 may include ITO, IZO, ITZO, aluminum (Al), etc. However, the embodiments are not limited to this.

[0165] A passivation layer 550 may be disposed on the first contact electrode 261, the second contact electrode 262, and the second insulating layer 520. The passivation layer 550 can protect the components disposed on the via layer 200 from the influence of the external environment.

[0166] Each of the second insulating layer 520 and passivation layer 550 described above may comprise an inorganic or organic insulating material. In an embodiment, the second insulating layer 520 and passivation layer 550 may comprise an inorganic insulating layer, such as silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon nitride oxide (SiO) x N y The second insulating layer 520 and the passivation layer 550 may include acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin, benzocyclobutene, calomel resin, siloxane resin, silsesquioxane resin, polymethyl methacrylate, polycarbonate, polymethyl methacrylate-polycarbonate synthetic resin, etc., as organic insulating materials. However, the embodiments are not limited to this.

[0167] The light-emitting element 300 can be a light-emitting diode, and more particularly, an inorganic light-emitting diode formed of an inorganic material. When an electric field is formed in a certain direction between two opposing electrodes with different polarities, the inorganic light-emitting diode can be aligned between the two opposing electrodes. The light-emitting element 300 can be aligned between the two opposing electrodes by the electric field formed between them.

[0168] The light-emitting element 300 can extend in one direction. The light-emitting element 300 can be rod-shaped, wire-shaped, tubular, etc. In embodiments, the light-emitting element 300 can have a cylindrical or rod-shaped shape. However, the light-emitting element 300 is not limited to these and can have various shapes, such as a polygonal prism shape, such as a cube, a rectangular parallelepiped, or a hexagonal prism, or a shape that extends in one direction and is partially inclined on its outer side. The multiple semiconductor layers included in the light-emitting element 300, as described below, can be arranged or stacked sequentially in that direction.

[0169] The light-emitting element 300 may include a semiconductor crystal doped with impurities of a certain conductivity type (e.g., p-type or n-type). The semiconductor crystal can receive electrical signals supplied from an external power source and emit light of a specific wavelength band.

[0170] Figure 9 This is a schematic diagram of a light-emitting element according to an embodiment.

[0171] The light-emitting element 300 according to the embodiment can emit light of a specific wavelength band. In the embodiment, the light emitted from the active layer 330 can be blue light with a center wavelength band of 450 nm to 495 nm. However, it should be understood that the center wavelength band of blue light is not limited to this and includes all wavelengths of blue light in the art. The light emitted from the active layer 330 of the light-emitting element 300 is not limited to this and can be green light with a center wavelength band of 495 nm to 570 nm or red light with a center wavelength band of 620 nm to 750 nm.

[0172] refer to Figure 9 The light-emitting element 300 according to the embodiment may include a first semiconductor layer 310, a second semiconductor layer 320, an active layer 330, and an insulating film 380. The light-emitting element 300 according to the embodiment may also include at least one electrode layer 370. Figure 9 The illustration shows a light-emitting element 300 including an electrode layer 370, but the implementation is not limited thereto. In some cases, the light-emitting element 300 may include more than one electrode layer 370, or the electrode layer 370 may be omitted. The following description of the light-emitting element 300 also applies even when the number of electrode layers 370 is changed or when the light-emitting element 300 includes another structure.

[0173] The first semiconductor layer 310 may be a semiconductor layer of a first conductivity type, such as an n-type semiconductor. For example, when the light-emitting element 300 emits light in the blue wavelength band, the first semiconductor layer 310 may include a semiconductor layer with Al... x Ga y In 1-x-y Semiconductor materials with the chemical formula N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, the first semiconductor layer 310 may include at least one of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN doped with an n-type dopant. The first semiconductor layer 310 may be doped with a dopant of a first conductivity type, and the dopant of the first conductivity type may be, for example, Si, Ge, Sn, Se, etc. In an embodiment, the first semiconductor layer 310 may be N-GaN doped with n-type silicon (Si). The length of the first semiconductor layer 310 may be in the range of 1.5 μm to 5 μm, but the embodiment is not limited thereto.

[0174] The second semiconductor layer 320 is disposed on the active layer 330, which will be described below. The second semiconductor layer 320 may be, for example, a p-type semiconductor of a second conductivity type, and when the light-emitting element 300 emits light, for example, in a blue or green wavelength band, the second semiconductor layer 320 may include a semiconductor with Al... x Ga y In 1-x-ySemiconductor materials with the chemical formula N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, the second semiconductor layer 320 may include at least one of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN doped with a p-type dopant. The second semiconductor layer 320 may be doped with a dopant of a second conductivity type, and the dopant of the second conductivity type may be, for example, Mg, Zn, Ca, Ba, etc. In an embodiment, the second semiconductor layer 320 may be P-GaN doped with p-type magnesium (Mg). The length of the second semiconductor layer 320 may be in the range of 0.05 μm to 0.10 μm, but the embodiment is not limited thereto.

[0175] In the accompanying drawings, the first semiconductor layer 310 and the second semiconductor layer 320 are formed as a single layer, but the embodiments are not limited thereto. In some cases, depending on the material of the active layer 330, the first semiconductor layer 310 and the second semiconductor layer 320 may also include additional layers, such as cladding or tensile strain barrier reduction (TSBR) layers.

[0176] An active layer 330 is disposed between a first semiconductor layer 310 and a second semiconductor layer 320. The active layer 330 may comprise a single-quantum-well structure or a multi-quantum-well structure. When the active layer 330 comprises a multi-quantum-well structure, it may have a structure in which quantum layers and well layers are alternately stacked multiple times. The active layer 330 may emit light upon electron-hole recombination based on an electrical signal applied through the first semiconductor layer 310 and the second semiconductor layer 320. For example, when the active layer 330 emits light in the blue wavelength band, it may comprise materials such as AlGaN or AlGaInN. Specifically, when the active layer 330 has a multi-quantum-well structure in which quantum layers and well layers are alternately stacked, the quantum layers may comprise materials such as AlGaN or AlGaInN, and the well layers may comprise materials such as GaN or AlInN. In an embodiment, the active layer 330 may include AlGaInN as a quantum layer and AlInN as a well layer, and the active layer 330 may emit blue light having a center wavelength band of 450 nm to 495 nm as described above.

[0177] However, the implementation is not limited to this, and the active layer 330 may have a structure in which semiconductor materials with high bandgap energy and semiconductor materials with low bandgap energy are stacked alternately, and may include group III to group V semiconductor materials depending on the wavelength band of the light emitted from the active layer 330. The light emitted from the active layer 330 is not limited to the blue wavelength band, and in some cases, it may emit red or green wavelength band light. The length of the active layer 330 may be in the range of 0.05 μm to 0.10 μm, but the implementation is not limited to this.

[0178] Light can be emitted from the active layer 330 to both sides of the light-emitting element 300 and its outer surface in the longitudinal direction. The directionality of the light emitted from the active layer 330 is not limited to one direction.

[0179] Electrode layer 370 may be an ohmic contact electrode. However, electrode layer 370 is not limited to this and may also be a Schottky contact electrode. Electrode layer 370 may include a conductive metal. For example, electrode layer 370 may include at least one of aluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag), indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). Electrode layer 370 may also include a semiconductor material doped with n-type or p-type dopants.

[0180] The insulating film 380 is configured to surround the outer surfaces of the plurality of semiconductor layers described above. In an embodiment, the insulating film 380 may be configured to at least surround the outer surface of the active layer 330 and may extend in the direction in which the light-emitting element 300 extends. The insulating film 380 may protect the components described above. For example, the insulating film 380 may be formed to surround the sides of the aforementioned components and expose both ends of the light-emitting element 300 in the longitudinal direction.

[0181] The accompanying drawings show an insulating film 380 extending in the longitudinal direction of the light-emitting element 300 to cover a range from the first semiconductor layer 310 to the electrode layer 370; however, the implementation is not limited to this. The insulating film 380 may only cover the outer surface of some conductive semiconductors including the active layer 330, or only cover a portion of the outer surface of the electrode layer 370 to partially expose the outer surface of the electrode layer 370. Alternatively, the upper surface of the cross-section of the region of the insulating film 380 adjacent to at least one end of the light-emitting element 300 may have a circular shape.

[0182] The thickness of the insulating film 380 can be in the range of 10 nm to 1.0 μm, but the implementation is not limited to this. Preferably, the thickness of the insulating film 380 can be about 40 nm.

[0183] The insulating film 380 may include a material with insulating properties, such as silicon oxide (SiO2). x ), silicon nitride (SiO) x ), silicon nitride oxide (SiO) x N y The active layer 330 contains aluminum nitride (AlN) and aluminum oxide (Al2O3), etc. Therefore, it can prevent electrical short circuits that may occur when the active layer 330 comes into direct contact with the electrodes transmitting electrical signals to the light-emitting element 300. Furthermore, because the insulating film 380 protects the outer surface of the light-emitting element 300, including the active layer 330, it can prevent a decrease in luminous efficiency.

[0184] In some embodiments, the outer surface of the insulating film 380 may be surface-treated. The light-emitting element 300 may be sprayed and aligned onto the electrodes during the manufacturing process of the display device 10 in a state where the light-emitting element 300 is dispersed in a specific ink. Here, the surface of the insulating film 380 may be hydrophobic or hydrophilic, so that the light-emitting element 300 remains dispersed in the ink and does not combine with other light-emitting elements 300.

[0185] The length h of the light-emitting element 300 can be in the range of 1 μm to 10 μm, or in the range of 2 μm to 6 μm, and preferably in the range of 3 μm to 5 μm. The diameter of the light-emitting element 300 is in the range of 300 nm to 700 nm, and the aspect ratio of the light-emitting element 300 is in the range of 1.2 to 100. However, the embodiments are not limited to these, and the multiple light-emitting elements 300 included in the display device 10 may have different diameters depending on the composition ratio of the active layer 330. Preferably, the diameter of the light-emitting element 300 may be about 500 nm.

[0186] The following describes a method for manufacturing a display device 10 according to an embodiment.

[0187] Figure 10 This is a flowchart of a method for manufacturing a display device according to an embodiment.

[0188] refer to Figure 10 A method for manufacturing a display device according to an embodiment may include: S100, forming a first electrode, a second electrode, and a first insulating layer covering at least a portion of the first electrode and at least a portion of the second electrode on a substrate; S200, treating the upper surface of the first insulating layer with a first plasma to form a second portion comprising a hydrophobic material; S300, treating the region of the upper surface of the first insulating layer treated with the first plasma and located between the first and second electrodes with a second plasma to form a first portion comprising a hydrophilic material; S400, spraying ink comprising a light-emitting element onto the region of the upper surface of the first insulating layer treated with the second plasma; S500, aligning the light-emitting element between the first and second electrodes. According to an embodiment, in the manufacturing process of the display device 10, the first portion 511 and the second portion 512 of the first insulating layer 510 can be formed by a plasma process. The first portion 511 and the second portion 512 of the first insulating layer 510 can be formed by using a material for forming a second sub-insulating layer 513 and treating the upper surface of the second sub-insulating layer 513 with a first plasma and a second plasma. The first plasma and the second plasma can be selectively emitted to some regions of each pixel PX or sub-pixel PXn to form the first portion 511 and the second portion 512 in these regions.

[0189] After forming the first insulating layer 510 according to the embodiment through the above-described process, the light-emitting element 300 can be disposed in the first region IR1 in which the first portion 511 is disposed, thereby manufacturing the display device 10. For a more detailed description, reference will be made to other accompanying drawings. In the following description, only the first electrode 210, the second electrode 220, and the first insulating layer 510 (excluding the dikes 410 and 420 disposed on the circuit element layer PAL) will be shown to describe the manufacturing process of the display device 10. However, it will be apparent that the following description can also be applied to cases where the first dike 410 and the second dike 420 are disposed on the circuit element layer PAL.

[0190] Figures 11 to 18 This is a schematic diagram illustrating the manufacturing process of a display device according to an embodiment.

[0191] First, such as Figure 11 and Figure 12 As shown, a first electrode 210, a second electrode 220, and a second sub-insulating layer 513 covering the first electrode 210 and the second electrode 220 can be formed on the circuit element layer PAL. A first insulating material layer 510' can be formed by treating the upper surface of the second sub-insulating layer 513 with a first plasma. The first insulating material layer 510' may include a second portion 512 and a second sub-insulating layer 513. A first portion 511 of the first insulating material layer 510' can also be formed in a subsequent process to obtain the first insulating layer 510. The first insulating material layer 510' can be formed by forming a second sub-insulating layer 513 covering the first electrode 210 and the second electrode 220 and forming a second portion 512 on the upper surface of the second sub-insulating layer 513. In an embodiment, the second portion 512 can be formed by emitting a first plasma onto the second sub-insulating layer 513.

[0192] As described above, when the first plasma is emitted into a region containing silicon carbide (SiOC) x When the second sub-insulating layer 513 is formed, the silicon-carbon (Si-C) bonds are broken, and new bonds are formed using the gas contained in the first plasma. In an embodiment, the first plasma can be a fluorine-based plasma. Therefore, a second portion 512 containing silicon-fluoromethyl (Si-CNFM) bonds can be provided on the second sub-insulating layer 513.

[0193] Next, refer to Figure 13 and Figure 14The first portion 511 is formed by emitting a second plasma into at least some regions of the first insulating material layer 510'. In an embodiment, the second plasma can be emitted between the first electrode 210 and the second electrode 220 into a region on the upper surface of the second portion 512 formed by emitting the first plasma. In the regions on the upper surface of the second portion 512 emitted by the second plasma, silicon-fluoromethyl (Si-CNFM) bonds can be broken, and new bonds can be formed using the gas contained in the second plasma. In an embodiment, the second plasma can be an oxygen-based plasma. Therefore, the first portion 511 containing silicon-oxygen (Si-O) bonds can be formed on the second sub-insulating layer 513. The region on the second sub-insulating layer 513 where the first portion 511 is formed can form a first region IR1, and the region on the second sub-insulating layer 513 where the second portion 512 is formed can form a second region IR2. This has been described above.

[0194] However, the implementation is not limited to this. In some cases, the first plasma and the second plasma can be emitted separately from the upper surface of the first insulating layer 510 (see [link to documentation]). Figure 13 The first portion 511, the second portion 512, and the second sub-insulating layer 513 are formed without forming the first insulating material layer 510'. As will be described below with reference to other figures, the first plasma and the second plasma can be emitted onto the upper surface of a specific region, but in some cases, they can be selectively emitted only to certain regions. Although not shown in the figures, in some embodiments, a layer of material including the first insulating layer 510 can be formed, the first portion 511 can be formed by emitting the second plasma to a position corresponding to the first region IR1, and the second portion 512 can be formed by emitting the first plasma to a position corresponding to the second region IR2.

[0195] Next, refer to Figure 15 The ink S, including the light-emitting element 300, is sprayed onto the area treated by the second plasma, namely, the first portion 511. In one embodiment, the ink S including the light-emitting element 300 can be sprayed through a nozzle using an inkjet method. However, the embodiment is not limited to this.

[0196] The ink S may include a solvent and a light-emitting element 300 dispersed in the solvent. In embodiments, the ink S may be in a solution or colloidal state. For example, the solvent may be, but is not limited to, acetone, water, ethanol, toluene, propylene glycol (PG), or propylene glycol methyl acetate (PGMA).

[0197] As described above, the ink S can be guided to be positioned on the first portion 511 within the first region IR1, and most of the light-emitting elements 300 can be positioned within the first region IR1, i.e., between the first electrode 210 and the second electrode 220. The ink S can be positioned only within the first region IR1 and can remain in the second region IR2, increasing the number of light-emitting elements 300 disposed between the first electrode 210 and the second electrode 220, and reducing the number of defective light-emitting elements 300 that may be lost or retained during the manufacturing process of the display device 10. Even when the structure at the boundary of adjacent sub-pixels PXn is omitted, ink S can be prevented from flowing to other sub-pixels PXn.

[0198] Next, the light-emitting element 300 is aligned between the first electrode 210 and the second electrode 220. Aligning the light-emitting element 300 may include providing an electrical signal to the first electrode 210 and the second electrode 220 to form an electric field in the ink S, receiving a dielectric force induced by the electric field to dispose the light-emitting element 300 on the electrodes 210 and 220, and removing solvent from the ink S.

[0199] The light-emitting element 300 can be disposed on electrodes 210 and 220 by dielectric electrophoresis (DEP). When a solution in which the light-emitting element 300 is dispersed is sprayed onto electrodes 210 and 220 and alternating current (AC) is supplied to electrodes 210 and 220, an electric field can be formed between the first electrode 210 and the second electrode 220, and a dielectric force can be applied to the light-emitting element 300 due to the electric field. A force of movement or rotation in one direction can be applied to the light-emitting element 300 receiving the dielectric force, and ultimately, the light-emitting element 300 can be disposed between the first electrode 210 and the second electrode 220. The ink S can be guided to be positioned in the first region IR1, and multiple light-emitting elements 300 can be disposed aligned in one direction between the first electrode 210 and the second electrode 220.

[0200] Next, as Figure 16 As shown, when the light-emitting element 300 is disposed on electrodes 210 and 220, solvent is removed from the ink S. The solvent can be removed using general methods. For example, it can be removed by methods such as heat treatment or infrared irradiation. Thereafter, although not shown in the drawings, the display device 10 according to the embodiment can be manufactured by performing a process to form multiple components (e.g., contact electrode 260, second insulating layer 520, passivation layer 550, etc.) to be included in the display device 10. This will be described in detail below.

[0201] The display device 10 according to the embodiment may include a plurality of sub-pixels PXn, and the manufacturing process of the display device 10 can be performed by sequentially processing the sub-pixels PXn with a second plasma to set the light-emitting element 300. Here, in areas where the second plasma is not emitted, the second plasma can be blocked by a mask. In the embodiment, the mask is typically a mask that does not react with the plasma, and for example, a metal mask, photoresist (PR), etc. can be used. However, the embodiment is not limited to this.

[0202] refer to Figure 17 and Figure 18 According to the embodiment, when emitting the second plasma to form the first portion 511, a mask can be disposed on a region of the first sub-pixel PX1 except for certain areas, and the second plasma can be emitted only towards the first sub-pixel PX1. Therefore, the first region IR1 can be formed only between the first electrode 210 and the second electrode 220 disposed in the first sub-pixel PX1, and the light-emitting element 300 ejected onto the sub-pixel PXn can be positioned only between the first electrode 210 and the second electrode 220 on the first sub-pixel PX1. When emitting the second plasma, since the first portion 511 is not formed in other sub-pixels PXn on which the mask is disposed, the light-emitting element 300 can be aligned only in the first sub-pixel PX1.

[0203] Next, as Figure 18 As shown, when the mask is disposed on the first sub-pixel PX1 and the second sub-pixel PX2 in which the light-emitting element 300 is aligned, the second plasma can be emitted only to the third sub-pixel PX3. Thereafter, the light-emitting element 300 can be aligned on the third sub-pixel PX3 in the same manner. However, the implementation is not limited to this, and as described above, the first and second plasmas can be selectively emitted to some regions. That is, the first region IR1 and the second region IR2 of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can be formed by emitting the first and second plasmas to some regions in a single process. In this case, the light-emitting elements 300 disposed in each sub-pixel PXn do not need to be disposed sequentially, but can be disposed simultaneously in the same process.

[0204] A method for manufacturing a display device 10 according to an embodiment includes forming a first portion 511 and a second portion 512 with different polarities by emitting plasma onto a second sub-insulating layer 513, and the ink S sprayed onto each sub-pixel PXn can be guided to be positioned in a first region IR1. Therefore, the number of light-emitting elements 300 disposed between the first electrode 210 and the second electrode 220 can be increased, and the number of defective light-emitting elements 300 that will be lost or retained during the manufacturing process of the display device 10 can be reduced. Furthermore, even when the structure at the boundary between adjacent sub-pixels PXn is omitted, ink S can be prevented from flowing to other sub-pixels PXn.

[0205] Various embodiments of the display device 10 will be further described below with reference to other accompanying drawings.

[0206] Figure 19 and Figure 20 This is a plan view showing the sub-pixels of a display device according to other embodiments.

[0207] The first region IR1 according to the implementation method may not be limited to [specific region]. Figure 2 The shape shown is illustrated. In some cases, the first region IR1 can be set by forming multiple patterns within a single sub-pixel PXn.

[0208] refer to Figure 19 and Figure 20 In the display devices 10_1 and 10_2 according to the embodiments, a plurality of first regions IR1_1 and IR1_2 may be disposed in a sub-pixel PXn and spaced apart from each other. Figure 19 and Figure 20 The plurality of first regions IR1_1 and IR1_2 shown can be understood as regions in which a first portion 511 substantially forms the first insulating layer 510. In addition to the plurality of first regions IR1_1 and IR1_2 being spaced apart from each other, Figure 19 and Figure 20 Display devices 10_1 and 10_2 and Figure 2 The display device 10 is the same. The form of setting the first area IR1_1 and IR1_2 will now be described in detail, and the parts that are the same as those described above will be omitted.

[0209] First of all, Figure 19In the display device 10_1, two first regions IR1_1 extending in one direction (i.e., the second direction DR2) can be configured to be spaced apart from each other in a sub-pixel PXn. A plurality of first regions IR1_1 can be disposed between a first electrode branch portion 210B and a second electrode branch portion 220B, or between a second electrode branch portion 220B and another first electrode branch portion 210B. Each of the plurality of first regions IR1_1 can extend along the first electrode branch portion 210B and the second electrode branch portion 220B in the second direction DR2. The plurality of first regions IR1_1 can be spaced apart from each other on the second electrode branch portion 220B in the first direction DR1.

[0210] Next, in Figure 20 In the display device 10_2, multiple first regions IR1_2 can be provided in a sub-pixel PXn, spaced apart from each other in the first direction DR1 and the second direction DR2. Besides providing more than two first regions IR1_2 in each sub-pixel PXn, spaced apart from each other in the first direction DR1 and the second direction DR2, Figure 20 Display device 10_2 and Figure 19 The display device is the same as 10_1.

[0211] As described above, the first regions IR1_1 and IR1_2 of the display devices 10_1 and 10_2 can be regions in which the first portion 511 of the first insulating layer 510 is formed, and the first portion 511 can be formed by emitting a second plasma, and the second regions IR2_1 and IR2_2 can be positioned between the first regions IR1_1 and IR1_2. When emitting the second plasma, the second plasma can be partially emitted to each sub-pixel PXn by placing a mask thereon. According to an embodiment, by partially emitting the second plasma, the first portion 511 can be partially formed in a sub-pixel PXn. Therefore, the light-emitting elements 300 can be concentrated in specific regions of each sub-pixel PXn.

[0212] Figure 21 It is a plan view of the sub-pixels of a display device according to another embodiment. Figure 22 It is shown schematically. Figure 21 A cross-sectional view of the subpixels of a display device.

[0213] refer to Figure 21 and Figure 22 The display device 10_3 according to the embodiment may include a greater number of first electrode branch portions 210B_3 and second electrode branch portions 220B_3. Figure 21 and Figure 22The diagram shows a first electrode 210_3 comprising three first electrode branch portions 210B_3 branching from a first electrode rod portion 210S_3, and a second electrode 220_3 comprising two second electrode branch portions 220B_3 branching from a second electrode rod portion 220S_3. In addition to having a greater number of electrode branch portions 210B_3 and 220B_3, Figure 21 and Figure 22 Display device 10_3 and Figure 2 The display device 10 is the same. In the following text, redundant descriptions will be omitted, and the differences will be described.

[0214] Figure 21 and Figure 22 The first region IR1_3 and the second region IR2_3 can correspond to the first part 511_3 and the second part 512_3 of the first insulating layer 510_3, respectively, and the second sub-insulating layer 513_3 of the first insulating layer 510_3 is disposed below the first part 511_3 and the second part 512_3. Figure 21 and Figure 22 The display device 10_3 includes multiple first electrode branch portions 210B_3 and multiple second electrode branch portions 220B_3, and thus can increase the area in which a light-emitting element 300 can be disposed in a sub-pixel PXn. Therefore, more light-emitting elements 300 can be disposed in a sub-pixel PXn, and the amount of light emitted from each sub-pixel PXn can be increased. Furthermore, the area forming the first portion 511_3 of each sub-pixel PXn can be increased. Figure 2 The display device 10 is different, in Figure 21 and Figure 22 In the display device 10_3, when the first portion 511_3 is part of the first electrode branch portion 210B_3, the first portion 511_3 can be configured to overlap with the opposite side of the second electrode branch portion 220B_3 facing the first portion 511_3.

[0215] Figure 23 It is a plan view of the sub-pixels of a display device according to another embodiment. Figure 24 It is shown schematically. Figure 23 A cross-sectional view of the subpixels of a display device.

[0216] refer to Figure 23 and Figure 24 The display device 10_4 according to the embodiment may include a smaller number of first electrode branch portions 210B_4. Figure 23 and Figure 24In this configuration, the first electrode 210_4 includes a first electrode branch portion 210B_4 branching from the first electrode rod portion 210S_4, and the second electrode 220_4 includes a second electrode branch portion 220B_4 branching from the second electrode rod portion 220S_4. Besides having a smaller number of electrode branch portions 210B_4 and 220B_4, Figure 23 and Figure 24 Display device 10_4 and Figure 2 The display device 10 is the same. In the following text, redundant descriptions will be omitted, and the differences will be described.

[0217] Figure 23 and Figure 24 The first region IR1_4 and the second region IR2_4 can correspond to the first part 511_4 and the second part 512_4 of the first insulating layer 510_4, respectively, and the second sub-insulating layer 513_4 of the first insulating layer 510_4 is disposed below the first part 511_4 and the second part 512_4. Figure 23 and Figure 24 The display device 10_4 may include only one first electrode branch portion 210B_4 and one second electrode branch portion 220B_4. In this case, the first portion 511_4 may be configured to overlap only with the opposite sides of the first electrode branch portion 210B_4 and the second electrode branch portion 220B_4 facing each other. Furthermore, the display device 10_4 may include only one first electrode branch portion 210B_4 and one second electrode branch portion 220B_4, thereby reducing the size of each sub-pixel PXn. Because the first region IR1_4 may be formed for each sub-pixel PXn to densely house the light-emitting elements 300 in a specific area, a desired number of light-emitting elements 300 can be provided even when the size of one sub-pixel PXn is reduced. Furthermore, as the size of one sub-pixel PXn decreases, the size of a pixel PX comprising three sub-pixels PXn can also be reduced. In this case, when the light-emitting elements 300 are aligned in one sub-pixel PXn, the second region IR2_4 at the boundary between adjacent sub-pixels PXn can effectively prevent ink S from flowing to other sub-pixels PXn.

[0218] In an implementation, each sub-pixel PXn may include different types of light-emitting elements 300 to emit light of different wavelength bands.

[0219] Figure 25 It is shown Figure 23 A planar view of the three sub-pixels of the display device. Figures 26 to 28 It is shown Figure 25 A schematic cross-sectional view of some operations in the manufacturing process of the display device.

[0220] refer to Figures 25 to 28 In the display device 10_5 according to the embodiment, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may each include a first light-emitting element 301_5, a second light-emitting element 302_5, and a third light-emitting element 303_5 that are different from each other. Since each sub-pixel PXn includes a first electrode branch portion 210B_5 branching from the first electrode rod portion 210S_5 of the first electrode 210_5 and a second electrode branch portion 220B_5 branching from the second electrode rod portion 220S_5 of the second electrode 220_5, the boundary between adjacent sub-pixels PXn can be significantly reduced. Furthermore, since each of the sub-pixels PXn includes a different light-emitting element 300_5, it is important to prevent the ink S sprayed onto the electrodes from flowing to adjacent sub-pixels PXn during the manufacturing process of the display device 10_5. The display device 10_5 according to the embodiment includes a first region IR1_5 and a second region IR2_5 to effectively prevent ink S, including the light-emitting element 300_5, from flowing to adjacent sub-pixels PXn when ink S is ejected.

[0221] like Figures 26 to 28 As shown, the first insulating layer 510_5 may include silicon carbide oxide, and the first portion 511_5 and the second portion 512_5 may be formed by plasma emitted onto the first insulating layer 510_5. The second sub-insulating layer 513_5 is composed of the same material as the first insulating layer 510_5 and is disposed below the first portion 511_5 and the second portion 512_5. In particular, the first portion 511_5 can be formed even when the second plasma is emitted onto the second portion 512_5. Therefore, the first portion 511_5 can be formed by emitting the second plasma onto the first sub-pixel PX1, the first light-emitting element 301_5 can be disposed, and the first light-emitting element 301_5 can be formed by emitting the first plasma (such as...). Figure 27 As shown in the figure, a second portion 512_5 is formed in the area other than the area where the first light-emitting element 301_5 overlaps with the first portion 511_5.

[0222] According to the embodiment, by repeatedly performing the process of forming the first portion 511_5 by emitting a second plasma into the region and the process of forming the second portion 512_5 by emitting a first plasma into the region, the first region IR1_5 can be selectively formed in a specific region. The ink S in which the light-emitting elements 300_5 are dispersed can be positioned only in the first region IR1_5, instead of flowing into the second region IR2_5 other than the first region IR1_5. Therefore, when different light-emitting elements 300_5 are disposed in relatively narrow pixels PX or sub-pixels PXn, even if the individual structure at the boundary between sub-pixels PXn is omitted, it is possible to prevent the light-emitting elements 300_5 (e.g., the first light-emitting element 301_5) from being disposed in the second sub-pixel PX2 or the third sub-pixel PX3 other than the first sub-pixel PX1.

[0223] The structure of the light-emitting element 300 is not limited to Figure 9 The structure shown is different from that of the light-emitting element 300.

[0224] Figure 29 This is a schematic diagram of a light-emitting element according to another embodiment.

[0225] refer to Figure 29 The light-emitting element 300' can have a shape extending in one direction (i.e., in the direction of the length h' of the light-emitting element 300'), and the sides of this shape are partially inclined. That is, the light-emitting element 300' according to the embodiment can have a partially tapered shape. The light-emitting element 300' can be formed such that multiple layers are not stacked in one direction, but rather each can be formed around the outer surface of another layer. Apart from slight differences in the shape of the layers, Figure 29 The light-emitting element 300' and Figure 9 The light-emitting element 300 is the same. Descriptions of parts that are the same as those of the light-emitting element 300 will be omitted, and the differences from the light-emitting element 300 will be described below.

[0226] According to the implementation, the first semiconductor layer 310' can extend in one direction, and its two ends can be tilted toward its center. Figure 29 The first semiconductor layer 310' may include a body having a rod-shaped or cylindrical shape and an upper end and a lower end each having a tapered shape. The slope of the upper end of the body may be greater than the slope of its lower end.

[0227] The active layer 330' is configured to surround the outer surface of the main body of the first semiconductor layer 310'. The active layer 330' may have an annular shape extending in one direction. The active layer 330' may not be formed on the upper and lower ends of the first semiconductor layer 310'. That is, the active layer 330' may only contact the parallel side surfaces of the first semiconductor layer 310'.

[0228] The second semiconductor layer 320' is configured to surround the outer surface of the active layer 330' and the upper end of the first semiconductor layer 310'. The second semiconductor layer 320' may include a body with an annular shape and an upper end, the side of which is inclined. That is, the second semiconductor layer 320' can be in direct contact with the parallel side of the active layer 330' and the inclined upper end of the first semiconductor layer 310'. However, the second semiconductor layer 320' is not formed on the lower end of the first semiconductor layer 310'.

[0229] The electrode layer 370' is configured to surround the outer surface of the second semiconductor layer 320'. That is, the shape of the electrode layer 370' can be substantially the same as the shape of the second semiconductor layer 320'. In other words, the electrode layer 370' can contact the entire outer surface of the second semiconductor layer 320'.

[0230] The insulating film 380' can be configured to surround the outer surface of the electrode layer 370' and the first semiconductor layer 310'. The insulating film 380' can be in direct contact with the lower end of the first semiconductor layer 310' and the exposed lower end of the active layer 330', the exposed lower end of the second semiconductor layer 320', and the electrode layer 370'.

[0231] In concluding this detailed description, those skilled in the art will understand that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the preferred embodiments of the invention disclosed herein are used only in a general and descriptive sense and not for limiting purposes.

Claims

1. A display device, including: Substrate; The first electrode and the second electrode are disposed on the substrate and spaced apart from each other. A first insulating layer is disposed on the substrate to cover at least a portion of the first electrode and at least a portion of the second electrode; as well as At least one first light-emitting element is disposed on the first insulating layer and between the first electrode and the second electrode. The first insulating layer includes: A first insulating layer includes a first portion and a second portion, the first portion containing a hydrophilic material, and the second portion being the region other than the first portion and containing a hydrophobic material; and The second sub-insulating layer is disposed below the first sub-insulating layer, and Wherein, at least a portion of the at least one first light-emitting element is disposed on the first portion, and The first insulating layer comprises silicon carbon oxide, the first portion having a higher oxygen atom concentration than the second portion, and the second portion having a higher fluorine atom concentration than the first portion.

2. The display device of claim 1, wherein, The first portion is positioned between the first electrode and the second electrode.

3. The display device of claim 2, wherein, The contact angle between the first part and the water is 5 degrees or less, and the contact angle between the second part and the water is 100 degrees or more.

4. The display device of claim 2, wherein, The first portion is configured to partially overlap with the opposite sides of the first electrode and the second electrode.

5. The display device of claim 4, wherein, The second part overlaps with the side of the first electrode that is not opposite to the second electrode and the side of the second electrode that is not opposite to the first electrode.

6. The display device of claim 1, wherein, The system is defined by a first region and a second region, wherein the first region contains the first part and the second region contains the second part, and the second region surrounds the first region.

7. The display device of claim 6, wherein, The at least one first light-emitting element in the first region has a higher density than the at least one first light-emitting element in the second region.

8. The display device of claim 7, wherein, A defined emission region is provided, and light from the at least one first light-emitting element is emitted into the emission region. The launch area includes the first area.

9. The display device according to claim 1, further comprising a third electrode and a fourth electrode, the third electrode and the fourth electrode being disposed on the substrate and spaced apart from each other. wherein The first insulating layer is also disposed on the third electrode and the fourth electrode. The first portion is also positioned between the third electrode and the fourth electrode, and The second part is positioned between the third electrode and the first electrode.

10. The display device of claim 9, further comprising at least one second light-emitting element, said at least one second light-emitting element being disposed on the first portion and between the third electrode and the fourth electrode. wherein, The at least one second light-emitting element emits light having a wavelength band different from that of the first light-emitting element.

11. A display device, including: Substrate; A first electrode is disposed on the substrate and extends in a first direction; The second electrode extends in the first direction and is spaced apart from the first electrode in a second direction different from the first direction; A first insulating layer is configured to cover at least a portion of the first electrode and at least a portion of the second electrode; as well as At least one light-emitting element is disposed on the first insulating layer and between the first electrode and the second electrode. The first insulating layer includes: The first part includes a hydrophilic material and is positioned in the region between the first electrode and the second electrode; and The second part includes hydrophobic materials and is the area other than the first part, and The first insulating layer comprises silicon carbon oxide, the first portion having a higher oxygen atom concentration than the second portion, and the second portion having a higher fluorine atom concentration than the first portion.

12. The display device of claim 11, further comprising a third electrode spaced apart from the first electrode in the second direction. wherein, The first insulating layer extends to be disposed on the third electrode, and the second portion is positioned between the first electrode and the third electrode. The light-emitting element between the first electrode and the second electrode has a higher density than the light-emitting element between the first electrode and the third electrode.

13. The display device of claim 12, wherein, The contact angle between the first part and the water is 5 degrees or less, and the contact angle between the second part and the water is 100 degrees or more.

14. The display device of claim 13, wherein, The first insulating layer further includes a sub-insulating layer positioned below the first portion and the second portion.

15. The display device of claim 14, wherein, At least one of the first portions is spaced apart from each other in the second direction, and the second portion is located in the region between the at least one of the first portions.

16. A method for manufacturing a display device, comprising: A substrate is formed, a first electrode and a second electrode are disposed on the substrate and spaced apart from each other, and a first insulating layer covers at least a portion of the first electrode and at least a portion of the second electrode; A first portion comprising a hydrophilic material and a second portion comprising a hydrophobic material are formed on the first insulating layer; as well as A light-emitting element is disposed on the first portion and between the first electrode and the second electrode. The first insulating layer comprises silicon carbon oxide, the first portion having a higher oxygen atom concentration than the second portion, and the second portion having a higher fluorine atom concentration than the first portion.

17. The manufacturing method of claim 16, wherein, The formation of the first part and the second part includes: The second portion is formed by emitting a first plasma into the first insulating layer; and The first portion is formed by emitting a second plasma into the second portion between the first electrode and the second electrode.

18. The manufacturing method of claim 17, wherein, The first plasma includes a fluorine-based plasma, and the second plasma includes an oxygen-based plasma.

19. The manufacturing method of claim 18, wherein, The first insulating layer further includes a sub-insulating layer positioned below the first portion and the second portion.

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