Wire saw device and silicon rod processing apparatus

Abstract

The application discloses a wire cutting device and a silicon rod processing equipment. The wire cutting device comprises at least one pitch adjusting mechanism and is arranged on at least one wire cutting unit. Under the action of the pitch adjusting mechanism, a plurality of cutting wheels of the at least one wire cutting unit of the wire cutting device can be driven to move in a second direction. At least one cutting wire saw formed by the plurality of cutting wheels can change the cutting position in the second direction under the action of the pitch adjusting mechanism. Alternatively, the wire groove position of the cutting wire wound around the plurality of cutting wheels can be changed based on the movement of the plurality of cutting wheels in the second direction. The process of realizing the cutting wire position change or the wire groove change based on the pitch adjusting mechanism is simple, easy to realize and convenient to operate, and the operation efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of silicon rod processing technology, and in particular to a wire cutting device and silicon rod processing equipment. Background Technology

[0002] In the field of photovoltaic power generation, typical crystalline silicon solar cells are made on high-quality silicon wafers, which are cut from solar silicon material using a wire saw. Currently, wire cutting technology, represented by diamond wire, is widely used in silicon material cutting production due to its high production efficiency, low operating cost, and high operating precision. The silicon material can be, for example, monocrystalline silicon or polycrystalline silicon, and the silicon material cutting operations include, but are not limited to, squaring, and slicing.

[0003] Taking the application of wire cutting technology to the squaring of single-crystal silicon rods as an example, the silicon rod to be cut is first placed vertically and positioned. Then, the wire cutting device enters from the top of the silicon rod and feeds downward along the length of the silicon rod until it exits at the bottom, thereby cutting four parallel axial cut surfaces around the silicon rod. Commonly used wire cutting devices include single-wire cutting devices and multi-wire cutting devices.

[0004] In related wire EDM equipment, multiple cutting wheels are either separately mounted on a rotating shaft and fixed by a mounting bracket, or several cutting wheels are mounted on the same spindle and fixed by a mounting bracket. Generally, once installed, the position and relationship between the cutting wheels will not easily change. Therefore, when the groove of one cutting wheel is worn, the entire groove needs to be replaced. Replacing the groove requires adjusting the position of the cutting wheel or other components (such as transition wheels) and recalibrating. The whole process is very cumbersome and inefficient.

[0005] To address this, the industry has successively provided designs that enable the replacement of wire slots on the cutting wheel. For example, adjusting shims are provided during the installation of the cutting wheel (such as Chinese patent documents CN205588494U and CN205522032U). The thickness of the adjusting shim is equal to the spacing between two adjacent wire slots. Thus, by adding or removing adjusting shims, the wire slot can be replaced. For instance, adding or removing one adjusting shim allows the current wire slot to be replaced with the next adjacent one. However, this structure still requires steps such as loosening screws, adding or removing adjusting shims, retightening screws, and final calibration, resulting in cumbersome operation and low efficiency. Summary of the Invention

[0006] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a wire cutting device and silicon rod processing equipment to solve the problems of cumbersome and inefficient slot replacement process after wear of the wire cutting device in the prior art.

[0007] To achieve the above and other related objectives, this application discloses a wire cutting device for silicon rod processing equipment. The silicon rod processing equipment includes: a base with a silicon rod processing platform; a silicon rod bearing device disposed on the silicon rod processing platform for bearing the silicon rod to be cut; the wire cutting device includes: a cutting frame disposed on the base; at least one wire cutting unit movably disposed on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged sequentially along a first direction, each cutting wheel having at least two cutting grooves; a cutting wire sequentially wound around the plurality of cutting wheels to form at least one wire saw; at least one adjusting mechanism disposed on the at least one wire cutting unit for driving the plurality of cutting wheels in the at least one wire cutting unit to move along a second direction, so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or change the cutting grooves of the cutting wire wound around the plurality of cutting wheels in the at least one wire cutting unit.

[0008] In a second aspect, this application also discloses a silicon rod processing apparatus, comprising: a base having a silicon rod processing platform; a silicon rod bearing device disposed on the silicon rod processing platform for bearing the silicon rod to be cut; and a wire cutting apparatus as described in any embodiment of the first aspect of this application.

[0009] In summary, the wire cutting device and silicon rod processing equipment provided in this application have the following beneficial effects: the wire cutting device includes at least one adjusting mechanism and is disposed on at least one wire cutting unit. Under the action of the adjusting mechanism, multiple cutting wheels of at least one wire cutting unit in the wire cutting device can be driven to move along a second direction. At least one wire saw formed around the multiple cutting wheels can thus change its cutting position in the second direction under the action of the adjusting mechanism. Alternatively, based on the movement of the multiple cutting wheels in the second direction, the position of the groove of the cutting wire around the multiple cutting wheels can be changed. The process of changing the position of the cutting wire or changing the groove based on the adjusting mechanism is simple, easy to implement and convenient to operate, which is conducive to improving operating efficiency. Attached Figure Description

[0010] The specific features of the invention involved in this application are shown in the appended claims. The features and advantages of the invention can be better understood by referring to the exemplary embodiments and drawings described in detail below. A brief description of the drawings is as follows:

[0011] Figure 1 The diagram shown is a structural schematic of the silicon rod loading and unloading device of this application in one embodiment.

[0012] Figure 2a The diagram shows a partial structural schematic of a silicon rod loading and unloading device in one embodiment, showing the silicon rod to be cut being clamped.

[0013] Figure 2bThe image shown is a partial bottom view of the silicon rod loading and unloading device in one embodiment, showing the silicon rod to be cut being clamped.

[0014] Figure 3a The diagram shows a partial structural schematic of a silicon rod loading and unloading device in one embodiment, where a cut silicon rod is being held in place.

[0015] Figure 3b The image shown is a partial bottom view of the silicon rod loading and unloading device in one embodiment, showing the device holding a cut silicon rod.

[0016] Figure 4 The diagram shown is a structural schematic of a silicon rod clamping member in one embodiment of the silicon rod loading and unloading device of this application.

[0017] Figure 5 The diagram shown is a structural schematic of the silicon rod loading and unloading device of this application in one embodiment.

[0018] Figure 6 The diagram shown is a structural schematic of the lifting drive mechanism of the silicon rod loading and unloading device of this application in one embodiment.

[0019] Figures 7a-7b The diagram shows a structural schematic of the lifting drive mechanism in different states of one embodiment of the silicon rod loading and unloading device.

[0020] Figures 8a-8d The diagram shows the silicon rod loading and unloading device of this application in different transfer states in one embodiment.

[0021] Figure 9 The diagram shown is a structural schematic of the silicon rod motion device of the silicon rod processing equipment of this application in one embodiment.

[0022] Figure 10 The diagram shown is a schematic representation of the elastic pusher structure of the silicon rod processing equipment of this application in one embodiment.

[0023] Figure 11 The diagram shown is a partial structural schematic of a silicon rod transport device of the silicon rod processing equipment of this application in one embodiment.

[0024] Figure 12 The diagram shown is a schematic representation of the silicon rod transport device of the silicon rod processing equipment of this application in one embodiment.

[0025] Figure 13 The diagram shown is a structural schematic of the silicon rod clamping device of this application in one embodiment.

[0026] Figure 14a The diagram shown is a structural schematic of the silicon rod clamping device of this application in one embodiment.

[0027] Figures 14b-14c Displayed as Figure 14a Enlarged schematic diagram of B under different locking states.

[0028] Figure 15 Displayed as Figure 13 Enlarged diagram of point A in the middle.

[0029] Figure 16 The diagram shown is a structural schematic of the wire cutting apparatus of this application in one embodiment.

[0030] Figure 17 The present invention is illustrated in a schematic diagram of a wire cutting apparatus used in a silicon rod squaring device in one embodiment.

[0031] Figure 18 The diagram shown is a schematic representation of the wire cutting apparatus of this application used in a silicon rod squaring device in one embodiment.

[0032] Figure 19 The diagram shown is a structural schematic of the wire cutting unit in one embodiment of the wire cutting apparatus of this application.

[0033] Figure 20 The diagram shows a structural schematic of the intermediate cutting wheel and the transition wheel beside it in one embodiment of the wire cutting device.

[0034] Figure 21 The diagram shown is a partial structural schematic of a silicon rod processing apparatus, which is a silicon rod cutting device according to this application, in one embodiment.

[0035] Figure 22 The diagram shows a partial structural schematic of a silicon rod processing device, which is a silicon rod cutting and grinding integrated machine, in one embodiment.

[0036] Figure 23 The diagram shown is a structural schematic of the wire cutting apparatus of this application in one embodiment.

[0037] Figure 24 This diagram shows a structural schematic of the transition wheel and support in one embodiment of the wire cutting apparatus of this application.

[0038] Figure 25 Displayed as Figure 23 Enlarged diagram of point C in the middle.

[0039] Figure 26 Displayed as Figure 17 Enlarged diagram of point D in the middle.

[0040] Figure 27 The image shown is a top view of one embodiment of the wire cutting apparatus of this application.

[0041] Figure 28 The image shown is a side view of one embodiment of the wire cutting apparatus of this application.

[0042] Figure 29 Displayed as Figure 28 A magnified structural diagram at point E in the middle.

[0043] Figure 30 The diagram shown is a schematic representation of the edge unloading device of this application applied to a silicon rod squaring device in one embodiment. Figure 31 The diagram shown is a structural schematic of the edge unloading device of this application in one embodiment.

[0044] Figure 32 The diagram shown is a structural schematic of the edge skin unloading device of this application in one embodiment of the edge skin top support mechanism.

[0045] Figure 33 The diagram shown is a schematic representation of the edge skin lifting unit in one embodiment of the edge skin unloading device of this application.

[0046] Figure 34 The diagram shown is a structural schematic of the clamping assembly of the edge unloading device of this application in one embodiment.

[0047] Figure 35 The diagram shown is a cross-sectional view of the clamping assembly in one embodiment of the edge unloading device of this application.

[0048] Figure 36 The diagram shown is a cross-sectional view of the clamping assembly of the edge unloading device of this application in another embodiment.

[0049] Figures 37a-37e The diagram shows different states of edge skin transfer performed by the edge skin unloading device in one embodiment. Detailed Implementation

[0050] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0051] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the present application. It should be understood that other embodiments may also be used, and changes in mechanical composition, structure, and operation may be made without departing from the spirit and scope of this disclosure. The following detailed description should not be considered limiting, and the scope of the embodiments of the present application is defined only by the claims of the published patents. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present application. Spatially related terms, such as “upper,” “lower,” “left,” “right,” “below,” “below,” “lower part,” “above,” “upper part,” etc., may be used herein to illustrate the relationship between one element or feature shown in the figures and another element or feature.

[0052] While the terms "first," "second," etc., are used in some instances herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are used only to distinguish one element or parameter from another. For example, a first groove may be referred to as a second groove, and similarly, a second groove may be referred to as a first groove, without departing from the scope of the various described embodiments. Both "first groove" and "second groove" describe a groove, but they are not the same groove unless the context otherwise explicitly indicates otherwise. Similar cases include "first wire cutting unit" and "second wire cutting unit," or "first cutting wheel set" and "second cutting wheel set."

[0053] In industrial production, crystalline silicon is usually processed into silicon wafers before being used in product manufacturing. The original silicon rods include monocrystalline silicon rods and polycrystalline silicon rods. Monocrystalline silicon rods are rod-shaped monocrystalline silicon grown from melt using Czochralski or floating zone methods. Common examples in silicon rod processing are monocrystalline silicon rods with lengths of 5000mm or 5360mm, or monocrystalline silicon rods with a length of approximately 800mm. Polycrystalline silicon is silicon rods that are deposited on the surface of silicon core wires using precipitation techniques such as chemical vapor deposition.

[0054] The existing silicon wafer manufacturing process generally involves first pulling brittle polycrystalline silicon material into a monocrystalline silicon rod, and then using a squaring machine to squaric it. At this time, the cutting mechanism feeds along the length of the silicon rod and cuts four parallel planes in pairs along the circumference of the silicon rod, making the cross-section of the silicon rod rectangular. After squaring, a multi-wire slicing machine is used to slice the squared silicon rod along the length to obtain the required silicon wafer.

[0055] In the squaring operation of silicon rods, the silicon rod to be cut (i.e., the silicon rod that has not yet been squared) needs to be loaded onto the preset bearing position of the silicon rod squaring equipment so that it can be squared and cut into the silicon rod according to the preset specifications by the wire cutting device. After the squaring is completed, the cut silicon rod needs to be transferred away from the bearing structure of the machine base so that the silicon rod squaring equipment can continue to cut and process the silicon rod to be cut.

[0056] This application provides a silicon rod loading and unloading device for a silicon rod squaring equipment. The silicon rod squaring equipment includes a base, a silicon rod bearing structure, and a wire cutting device. The silicon rod bearing structure is used to support vertically placed silicon rods. The silicon rod loading and unloading device includes: a first bracket, which is suspended from the base by a mounting frame; a silicon rod clamp, which is disposed on the first bracket and is used to clamp the silicon rod to be cut or the cut silicon rod; and a shifting mechanism, which is used to drive the first bracket and the silicon rod clamp on it to shift in at least one direction on the mounting frame, so that the silicon rod clamp moves to a first predetermined position to clamp the silicon rod to be cut or the cut silicon rod and moves the clamped silicon rod to be cut or the cut silicon rod to a second predetermined position.

[0057] Here, the first predetermined position and the second predetermined position are not limited to fixed positions or areas established in the coordinate system. In the example provided in this application, by determining the transfer path of the loading and unloading device during loading and unloading, and following the time sequence of the transfer, the starting position of the first support in the silicon rod loading and unloading device in the transfer path is taken as the first predetermined position, and the ending position of the first support is taken as the second predetermined position. Here, when the silicon rod loading and unloading device performs a feeding process, the position where the silicon rod clamp holds the silicon rod to be cut is the first predetermined position, and the position where the silicon rod to be cut is placed on the silicon rod support structure by moving the moving mechanism is the second predetermined position. Conversely, when the silicon rod loading and unloading device performs a feeding process of transferring the cut silicon rod after squaring out of the machine base, the position where the first support is located adjacent to the silicon rod support structure to hold the cut silicon rod is taken as the starting position, which is also the first predetermined position, and the position where the cut silicon rod is transferred away from the machine base by the silicon rod clamp and released is the second predetermined position.

[0058] Please see Figure 1 The figure shows a schematic diagram of the silicon rod loading and unloading device of this application in one embodiment. As shown, the first support 31 is suspended from the base by a mounting frame 33. Here, the first support 31 can serve as a support structure for the silicon rod clamp 32. The first support 31 is movably disposed on the mounting frame 33 and can move in at least one direction under the action of the shifting mechanism, thereby realizing the movement of the silicon rod to be cut or the cut silicon rod held by the silicon rod clamp 32.

[0059] The mounting frame 33 is disposed above the base. Here, the mounting frame 33 can be used to determine the path and range of movement of the first bracket 31 along the mounting frame 33. In some embodiments, such as... Figure 1 In the example shown, the mounting frame 33 is positioned above the silicon rod support structure in the loading / unloading area of ​​the silicon rod processing platform of the machine base. Simultaneously, the length of the mounting frame 33 in the first direction is greater than the loading / unloading area, or the endpoint of the mounting frame 33 in the first direction is located outside the silicon rod support structure in the loading / unloading area. This allows the first support 31 to move along the mounting frame 33 to the adjacent position of any silicon rod support structure in the loading / unloading area to place the silicon rod to be cut onto the corresponding silicon rod support structure or to transfer the cut silicon rod on the silicon rod support structure away from the loading / unloading area. Here, the loading / unloading area is the area on the silicon rod processing platform of the silicon rod squaring equipment where loading and unloading are performed. For example, in some examples, the mounting frame 33 is arranged parallel to the wire cutting support of the silicon rod squaring equipment to fully utilize the spare equipment space above the machine base.

[0060] The silicon rod loading and unloading device 3 can be mounted on the base of the silicon rod squaring equipment via the mounting frame 33. In some examples, the silicon rod loading and unloading device 3 can also be separated from the silicon rod squaring equipment as a separate component, for example, as an independent sales device. For example, the mounting frame 33 is detachably connected to the silicon rod squaring equipment, and the mounting frame 33, the first bracket 31, and the silicon rod clamp 32 can be mounted on the silicon rod squaring equipment; or, for example, the first bracket 31 is detachably connected to the mounting frame 33, and the first bracket 31 and the silicon rod clamp 32 can be mounted on a silicon rod squaring equipment including the mounting frame 33 or a lifting frame.

[0061] The silicon rod clamp 32 is mounted on the first support 31. The silicon rod clamp 32 includes a silicon rod holding member that contacts the surface of the silicon rod and performs clamping or releasing actions. In some examples, the silicon rod clamp 32 includes a single silicon rod holding member. In this example, the clamping surface of the silicon rod holding member can be configured to have a certain height to ensure that the contact area between the silicon rod holding member and the side of the vertically placed silicon rod is sufficient for clamping in the clamped state.

[0062] Please see Figure 2a The diagram shows a schematic representation of the first support 31 and the silicon rod clamp of the silicon rod loading and unloading device of this application in one example. Figure 2a As shown, any of the silicon rod clamping members on the first support 31 includes a first clamping arm 321 and a second clamping arm 322 disposed opposite to each other, and a clamping arm driving mechanism 320 for driving the first clamping arm 321 and the second clamping arm 322 to perform opening and closing actions. It should be understood that the first clamping arm 321 and the second clamping arm 322 may be mirror images or symmetrically arranged. When the first clamping arm 321 and the second clamping arm 322 perform a closing action, they can be used to approach and clamp the silicon rod; when the first clamping arm 321 and the second clamping arm 322 perform an opening action, they can be used to release the clamped silicon rod.

[0063] In some embodiments, the first and second clamping arms have a clamping arc surface and a clamping plane. Here, the silicon rod clamping member can be used to clamp a silicon rod to be cut or a cut silicon rod. To achieve vertical placement of the clamped silicon rod on or from the silicon rod support structure, the first and second clamping arms clamp the silicon rod on its side through an opening and closing action; that is, the silicon rod is vertical in the clamping state. Correspondingly, the first and second clamping arms have a clamping arc surface adapted to the arc surface of the silicon rod to be cut, and a clamping plane adapted to the side plane of the cut silicon rod.

[0064] The clamping arc surfaces of the first and second clamping arms are not limited to having arc surfaces on the clamping arms for contacting the silicon rod. For some implementations, please refer to [link to relevant documentation]. Figures 2a to 3bThe figures show a side view and a bottom view of the silicon rod clamping component of this application in different clamping states, wherein... Figure 2a and Figure 2b A three-dimensional schematic diagram and a bottom view of a silicon rod clamping device holding a silicon rod with curved sides to be cut. Figure 3a and Figure 3b A three-dimensional schematic diagram and a bottom view of a silicon rod clamping device holding a cut silicon rod. As shown in the figure, the first and second clamping arms are symmetrically provided with clamping arc surfaces and clamping planes.

[0065] like Figure 3a , Figure 3b As shown, the clamping arc surface can be a contact plane arranged in different directions to conform to the curvature of the silicon rod surface. Figure 3b In the view shown, the planes in different directions on a single clamping arm are symmetrical to the diameter of the silicon rod cross section, such that the pressure applied to the silicon rod by the first clamping arm 321 and the second clamping arm 322 during clamping converges at the center of the silicon rod cross section, so as to prevent the extension line of the resultant pressure force on the silicon rod under the clamping state from being outside the clamping arc surface, thus preventing the silicon rod from having a tendency to detach from the silicon rod clamping member.

[0066] In some implementations, the clamping arc surfaces of the first and second clamping arms extend beyond one-quarter of the arc of the side surface of the silicon rod to be cut, and the clamping contact surface formed during clamping extends beyond half the arc of the side surface of the silicon rod. Furthermore, a buffer pad may be provided on the clamping arc surface to prevent damage to the surface of the silicon rod during clamping. The buffer pad is made of, for example, an elastic rubber material, or silicone, or other materials with elastic deformation, damping properties, or cushioning properties, to prevent the surface of the silicon rod to be cut or the already cut silicon rod from being scratched or broken during clamping and transportation.

[0067] In some examples, the clamping arm drive mechanism includes: a splitting gear, a rack, and a drive source (not shown); wherein, the first clamping arm and the second clamping arm are respectively provided with splitting gears, the rack is provided with teeth on opposite sides that mesh with the splitting gears on the first clamping arm and the second clamping arm, and the drive source is connected to the gear drive member for driving the gear drive member to move.

[0068] In one implementation, the gear drive component is a rack located between the first clamping arm and the second clamping arm. The rack has teeth on the two outer surfaces of the clamping arms facing the sides, which are respectively provided to mesh with the opening and closing gears on the first and second clamping arms. The drive source can be, for example, a drive motor or a cylinder. Thus, according to the above implementation method, in practical applications, when clamping of the clamping arm is required, the drive motor or cylinder, acting as the drive source, drives the rack, which acts as the gear drive component, to move upward. The rack drives the meshing opening and closing gears on both sides to rotate outward. During the outward rotation, the opening and closing gears drive the clamping arm (which can be connected to the clamping arm via a rotating shaft) to move downward, thus transitioning from the loosened state to the clamped state. Conversely, when clamping of the clamping arm is required to be released, the drive motor (or cylinder), acting as the drive source, drives the rack, which acts as the gear drive component, to move downward. The rack drives the meshing opening and closing gears on both sides to rotate inward. During the inward rotation, the opening and closing gears drive the clamping arm (which can be connected to the clamping arm via a rotating shaft) to move upward, thus transitioning from the clamped state to the released state. Of course, the above is only one embodiment and is not intended to limit the working state of the silicon rod clamp. In fact, the aforementioned changes in the states of "upward", "outward rotation", "downward", "inward rotation", "upward", "release" and "clamping" can be modified according to the structure and operation mode of the clamping arm and the construction of the clamping arm drive mechanism.

[0069] In another implementation, please refer to Figure 4The figure shows a schematic diagram of a silicon rod clamping component of the silicon rod loading and unloading device of this application in one embodiment. As shown, the clamping arm driving mechanism 320 includes: a first rack 3201, a second rack 3202, a clamping cylinder 3203, and a transmission gear 3204; the first rack 3201 is linked to the first clamping arm, the second rack 3202 is linked to the second clamping arm, and the transmission gear 3204 meshes with the first rack 3201 and the second rack 3202, for driving the first clamping arm and the second clamping arm to move towards each other to perform a closing action when rotating in the forward direction, and driving the first clamping arm and the second clamping arm to move away from each other to perform an opening action when rotating in the reverse direction. Based on the fundamental principle of external meshing between gears or between a gear and a rack, when the transmission gear 3204 rotates, the first rack 3201 moves in the opposite direction to the linear velocity of the upper teeth of the transmission gear 3204; the second rack 3202 moves in the opposite direction to the linear velocity of the lower teeth of the transmission gear 3204 when the transmission gear 3204 rotates. When the transmission gear 3204 rotates, the first rack 3201 and the second rack 3202, which are symmetrical about the gear center, necessarily satisfy a relationship of opposite linear velocity directions, that is, they exhibit movements that move towards each other or away from each other. For example, when the clamping cylinder 3203 pushes the first rack 3201 or the second rack 3202 to move and drive the transmission gear 3204 to rotate, when the transmission gear 3204 is in the forward rotation state, the first rack 3201 and the second rack 3202 move closer to each other to drive the first clamping arm and the second clamping arm to move closer to each other to perform a closing action; when the transmission gear 3204 is in the reverse rotation state, the first rack 3201 and the second rack 3202 move away from each other to drive the first clamping arm and the second clamping arm to move away from each other to perform an opening action.

[0070] In another implementation, the clamping arm drive mechanism includes a first rack, a second rack, and a drive gear. The first rack is linked to the first clamping arm, and the second rack is linked to the second clamping arm. The drive gear is connected to the power output shaft of the drive motor (not shown) and meshes with the first and second racks. It is used to drive the first and second clamping arms to move towards each other to perform a closing action when rotating in the forward direction, and to drive the first and second clamping arms to move away from each other to perform an opening action when rotating in the reverse direction. The first and second racks can mesh on opposite sides of the drive gear, such that when the drive gear rotates, the linear velocities of the first and second racks are opposite. The drive motor drives the drive gear to rotate, causing the first and second racks to move towards each other when the drive gear rotates in the forward direction, thus driving the first and second clamping arms to move towards each other to perform a closing action. When the drive gear is driven to rotate in the reverse direction, the first and second racks to move away from each other, thus driving the first and second clamping arms to move away from each other to perform an opening action.

[0071] In some examples, the silicon rod clamping element in the silicon rod clamp is fixedly mounted on the first bracket in the lifting direction for clamping silicon rods of the same specification or a preset specification range (e.g., lengths from 500mm to 800mm). In some examples, multiple sets of silicon rod clamping elements may be provided on the first bracket to ensure that the silicon rod loading and unloading device can clamp silicon rods covering various length specifications.

[0072] Here, the single-wafer silicon rod is formed by cutting the original long silicon rod, which inevitably results in significant differences in size between the single-wafer silicon rods. Since the silicon rod clamping device is used to clamp the single-wafer silicon rod in a vertically placed state or the cut silicon rod after squaring, the impact of the aforementioned size difference on the silicon rod clamping device is mainly reflected in the concern that the difference in length of the single-wafer silicon rod may affect whether the silicon rod clamping device in the silicon rod clamping device can clamp the single-wafer silicon rod accordingly.

[0073] To reduce or even eliminate the risk that the aforementioned silicon rod clamping components may fail to clamp the silicon rod, silicon rod clamps may have different design schemes.

[0074] In some examples, the silicon rod clamp includes at least two silicon rod holders, wherein the two silicon rod holders are spaced apart on the first support. For example Figure 2a , Figure 3a In the illustrated embodiment, the first support 31 is vertically oriented, and the two silicon rod clamping members in the silicon rod clamp are vertically spaced on the first support 31. In a specific implementation, the silicon rod clamping members can be mounted on the first support 31 via clamping member mounting seats. In some examples, the clamping member mounting seats are movably mounted on the first support 31 to adjust the clamping position of the silicon rod clamping member relative to the silicon rod or the distance between the spaced-apart silicon rod clamping members. For example, in the illustrated embodiment, the first support 31 is provided with a lifting guide rail, and the clamping member mounting seat can be configured as a slider movably mounted on the lifting guide rail, thereby enabling vertical movement along the first support 31. With this configuration, the spacing between different silicon rod clamping members can be adjusted, allowing for the clamping of silicon rods of different specifications using a small number of clamping members, such as two.

[0075] In some examples, the silicon rod clamp further includes a lifting drive mechanism, wherein at least one of the at least two silicon rod clamping members is driven by the lifting drive mechanism to move up and down along the first support. For example, when the silicon rod clamp includes two silicon rod clamping members, one silicon rod clamping member can be fixed to the first support, and the other silicon rod clamping member can be movably disposed on the first support and driven by the lifting drive mechanism to move up and down along the first support; or, both silicon rod clamping members in the silicon rod clamp can be movably disposed on the first support and move up and down along the first support under the drive of the lifting drive mechanism.

[0076] In some examples, the lifting drive mechanism includes: a drive chain and at least one locking device; wherein the drive chain is wound around two drive sprockets arranged vertically, at least one of the two drive sprockets is shaft-connected to a sprocket drive source, and the at least one locking device is disposed on at least one silicon rod clamping member for switching between locked and open states between the at least one silicon rod clamping member and the drive chain.

[0077] Here, the at least one locking device corresponds to at least one silicon rod clamping member. For example, when there is one locking device, it is installed on one silicon rod clamping member; when there are two locking devices, they are installed on two silicon rod clamping members. Each locking device is used to control the locking or moving state between a silicon rod clamping member and the transmission chain, so as to realize the state switching of the silicon rod clamping member moving in accordance with the transmission chain or stopping at a preset height on the first support.

[0078] Please see Figure 5 The image shows a schematic diagram of the silicon rod loading and unloading device of this application in one embodiment. The lifting drive mechanism 323 includes a transmission chain 3231, which can be configured as a ring chain (as shown in the image). Figure 5 (As shown in the embodiment) or an open sprocket with an end point, at least one of the drive sprockets 3232 around which the drive sprocket is wound is driven to rotate by a sprocket drive source 3233, such as a drive motor, thereby driving the drive chain 3231 meshing with the drive sprocket 3232 to move. The direction of movement of the drive chain 3231 is determined by the position of the vertically arranged drive sprockets 3232. For example, when the vertically arranged drive sprockets 3232 are located on the same vertical line, the drive chain 3231 between the two drive sprockets 3232 moves in the vertical direction.

[0079] Please see Figure 6The image shows a simplified schematic diagram of a portion of the lifting drive mechanism of this application in one embodiment. In some embodiments, the locking device 3234 includes a locking sprocket 32341 and a locking mechanism 32340. The locking sprocket 32341 is rotatably mounted on the silicon rod holder and engages with the transmission chain 3231. The locking mechanism 32340 is located on the silicon rod holder and is used to lock the locking sprocket 32341 so that the locking sprocket 32341 is stationary relative to the transmission chain 3231, thereby switching the silicon rod holder connected to the locking sprocket 32341 and the transmission chain 3231 from an active state to a locked state. Here, the locking sprocket 32341 can be connected to the silicon rod clamping member via a sprocket shaft. When the locking mechanism 32340 is at rest, the locking sprocket 32341 rotates around the sprocket shaft under the drive of the meshing transmission chain 3231. When the locking mechanism 32340 is in operation, it restricts the rotation of the locking sprocket 32341 so that the movement of the transmission chain 3231 in the lifting direction provides force to both the locking sprocket 32341 and the silicon rod clamping member in the lifting direction. Therefore, when the movement of the locking sprocket 32341 relative to the transmission chain is stationary, the silicon rod clamping member can move up and down along the first support under the drive of the transmission chain 3231. Here, the locking mechanism 32340 can restrict the rotation of the locking sprocket 32341, for example, by clamping the teeth of the locking sprocket 32341.

[0080] Please see Figure 7a and Figure 7b The figure shows a schematic diagram of the lifting drive mechanism of this application in different locking states in one embodiment. In some embodiments, as shown in the figure, the locking mechanism 32340 includes a locking cylinder 32342 and a locking part 32343. The locking part 32343 is connected to the telescopic end of the locking cylinder 32342 and enters the teeth of the locking sprocket 32341 under the drive of the locking cylinder 32342 to lock the locking sprocket 32341.

[0081] In one specific embodiment, the detailed structure of the locking mechanism 32340 is as follows: it includes a locking cylinder 32342 fixedly mounted on the silicon rod clamping member. The telescopic rod of the locking cylinder 32342 can extend and retract radially along the locking sprocket 32341. Simultaneously, a locking part 32343 is fixed to the end of the telescopic rod of the locking cylinder 32342. The outer contour of the locking part 32343 is a rectangular block structure. A pin is provided on the side of the locking part 32343 near the locking sprocket 32341. When the locking part 32343 is driven by the locking cylinder 32342 to extend into the locking sprocket 32341, the locking part 32343 locks the locking sprocket 32341, preventing relative rotation between it and the transmission chain 3231 (as shown in the image). Figure 7b(As shown in the diagram). At this time, the silicon rod clamping member connected to the locking mechanism 32340 moves up and down synchronously with the transmission chain 3231. When the silicon rod clamping member rises and falls to the preset height, the locking part 32343 retracts and retracts, so that the locking sprocket 32341 returns to the state of being rotatably engaged with the transmission chain 3231 (as shown in the diagram). Figure 7a When the silicon rod clamping member loses the force in the lifting direction transmitted by the locking sprocket 32341 (as shown in the figure), it can be stabilized at the preset height.

[0082] Meanwhile, in practical implementation, because the locking part experiences a significant force from the locking sprocket after entering it, the telescopic rod of the locking cylinder is prone to deformation under prolonged stress, affecting the cylinder's service life. To address this issue, in some examples, a retaining part is fixedly installed on the silicon rod holder. This retaining part consists of two pressure plates, positioned on either side of the locking part, forming a sliding channel parallel to the telescopic direction of the locking cylinder. The locking part is slidably disposed within this sliding channel. When the locking part experiences a large force from the locking sprocket and needs to change the shape of the telescopic rod of the locking cylinder, the retaining part presses against the outside of the locking part, providing a certain degree of stability.

[0083] In other possible implementations, the retaining part 3235 can also be a rectangular block arranged along the movement trajectory of the locking part, with a groove provided in the rectangular block, the locking part being slidably disposed in the groove, and moving radially along the locking sprocket.

[0084] In some cases, the transmission chain 3231 may vibrate during transmission, causing it to disengage from the locking sprocket 32341, thus keeping the silicon rod holder and the transmission chain 3231 in a constantly moving state. To eliminate this possibility, in some embodiments, the lifting drive mechanism 323 is also provided with an anti-disengagement mechanism 3235, such as... Figure 5 In the illustrated embodiment, the anti-disengagement mechanism 3235 has a U-shaped structure, with its two parallel sides fixed to the silicon rod holder to move synchronously with it. The bottom of the groove at the bottom of the U-shaped structure of the anti-disengagement mechanism 3235 is close to the transmission chain 3231. When the transmission chain 3231 vibrates and is about to disengage from the locking sprocket 32341, the bottom of the groove of the anti-disengagement mechanism 3235 will inevitably exert a radial force on the transmission chain 3231 towards the locking sprocket 32341, thereby preventing the transmission chain 3231 from disengaging from the locking sprocket 32341.

[0085] Here, the locking device 3234 can be used to switch between a locked state where the silicon rod clamp moves synchronously with the transmission chain 3231 and a relatively active state between the silicon rod clamp and the transmission chain 3231. In practical scenarios, based on the preset adjustment height of the silicon rod clamp, the locking device 3234 locks the silicon rod clamp and the transmission chain 3231. When the silicon rod clamp rises or falls to the preset height under the drive of the transmission chain 3231, the locking device 3234 restores the active state between the silicon rod clamp and the transmission chain 3231, so that the silicon rod clamp can be stably positioned at the preset height of the first bracket 31. Of course, the range of motion of the silicon rod clamp is related to the first bracket 31. Through this movable silicon rod clamp, the length range of silicon rods that the silicon rod clamp can hold is increased.

[0086] Please refer to the reference. Figure 1 and Figure 5 The first bracket 31 and the silicon rod clamp 32 provided on the first bracket 31 can be moved along at least one direction on the mounting frame 30 under the action of the shifting mechanism 33, so that the silicon rod clamp 32 clamps the silicon rod from the first predetermined position and then moves the silicon rod to the second predetermined position.

[0087] In some embodiments, the displacement mechanism 33 includes a first directional displacement mechanism, which includes a first directional guide rail 3310 and a first driving device (not shown in the figure). The first directional guide rail 3310 is disposed on the mounting frame 30, and the first driving device is used to drive the first bracket 31 to shift along the first directional guide rail on the mounting frame 30. The first bracket is connected to the mounting frame 30 based on a first slider 3311 adapted to the first directional guide rail 3310 to form a degree of freedom of movement 3310 along the first directional guide rail.

[0088] Here, the first bracket 31 is suspended from the base via the mounting frame 30, and can move along the mounting frame 30 located above the base under the drive of the first driving device. In practical scenarios, the mounting frame 30 is provided with a first directional guide rail 3310 to suspend the first bracket 31. The first directional guide rail 3310 can be configured to span both ends of the base in a first direction, or the length of the first directional guide rail 3310 can cover each silicon rod bearing structure in the loading and unloading area, so that the first frame 31 set on the first directional guide rail 3310 can move along the first directional guide rail 3310 to the adjacent position of each silicon rod bearing structure in the loading and unloading area under the drive of the first driving device. In some examples, the silicon rod bearing structures of the loading and unloading area of ​​the silicon rod processing platform are set on the same straight line in the first direction, and the first directional guide rail 3310 can be set above the straight line connecting the silicon rod bearing structures, so that the first frame 31 can move above the supporting part of the silicon rod bearing structure to clamp the cut silicon rods carried on the silicon rod bearing structure or place the silicon rods to be cut on the silicon rod bearing structure.

[0089] The first driving device is, for example, a traveling motor. The first bracket can be connected to the first directional guide rail via a traveling screw. The traveling screw is laid on the first directional guide rail and simultaneously connected to the traveling motor, thereby driving the first bracket to move along the first directional guide rail under the drive of the traveling motor. In some examples, the first driving device may also be a drive motor that drives the first bracket to move via a ball screw; this application does not impose any limitations.

[0090] The first bracket 31 can move along the mounting frame 30 to load and unload materials in the equipment space above the base. When the silicon rod squaring equipment is idle, the first bracket 31 can be moved to the top of the base for storage, thereby reducing the inconvenience of operation caused by the excessive space occupied by the equipment in the process flow, and thus increasing the efficiency of the process flow in silicon rod processing.

[0091] In some embodiments, the shifting mechanism further includes a second directional shifting mechanism, which includes a second directional guide rail and a second driving device. The second directional guide rail is used to mount the first bracket, and the second driving device is used to drive the first bracket to move along the second directional guide rail. The second driving device is, for example, a traveling motor that drives the first bracket to move along the second directional guide rail via a traveling screw. Of course, the second driving device can also be configured as other devices capable of moving the first frame, such as using a chain conveyor mechanism to move the first frame; this application does not impose any limitations.

[0092] Please continue to refer to the reference. Figure 1 and Figure 5Here, the first bracket 31 is mounted on the first direction guide rail 3310 of the mounting frame via the second direction guide rail 3320. For example, the first bracket 31 can be connected to the second direction guide rail 3320 via the second slider 3321. The first bracket 31 can move along the first direction, i.e., the length direction of the base, driven by the first driving device. At the same time, it can also move along the second direction guide rail 3320 in the second direction under the drive of the second driving device (not shown in the figure). The range of movement of the first bracket 31 and the silicon rod clamp 32 in space is increased, which can be used to transfer silicon rods between the first preset position and the second preset position with different spatial position relationships. For example, when the first preset position and the second preset position have a certain distance in the second direction, the silicon rod clamp 32 can move along the second direction guide rail 3320 to reach the target position.

[0093] In one scenario, when the first preset position is the location outside the base where the silicon rod to be cut is placed, and the second preset position is the support position of the silicon rod bearing structure, the first support moves under the drive of the first driving device to a straight line in the second direction connecting the first preset position and the first preset position, and then approaches the first preset position under the drive of the second driving device. Of course, it is also possible to first move under the drive of the second driving device to a straight line in the first direction connecting the first support and the first preset position, and then move to the first preset position under the drive of the first driving device. It should be noted here that the first driving device and the second driving device are independent. Therefore, the movement path of the first support and the silicon rod clamp can also be a multi-segment broken line. For example, it can first move a certain distance along the first direction, then move along the second direction, and then move along the first direction again to the preset position. The aforementioned movement directions are only examples to illustrate some feasible movement paths. The first support only needs to move to the preset position. At the same time, in actual scenarios, the movement path can also be changed according to the equipment layout and the direction of the moving guide rail of the moving mechanism. Similarly, after the first support reaches the first preset position, the movement path from the first preset position to the second preset position can also be set based on the movement range determined by the shifting mechanism. When the movement range can cover both the first preset position and the second preset position, the transfer can be realized.

[0094] Here, the moving path has a variety of options, but based on the silicon rod loading and unloading device of this application, the moving path is to transfer silicon rods through a straight path or a broken path. At the same time, the equipment space above the base is used for the transfer and the equipment space can be used as the housing space for the silicon rod loading and unloading device. During the transfer, the space occupied on the outside of the silicon rod squaring equipment base can be reduced. In addition, the silicon rod loading and unloading device can be set up as an integral part of the silicon rod squaring equipment, which eliminates the process of calling up the silicon rod loading and unloading device and makes the transfer process simpler.

[0095] Please see Figures 8a to 8d The diagram shows the structure of the silicon rod loading and unloading device of this application under different transfer states.

[0096] In one embodiment of this application, the process by which the silicon rod loading and unloading device clamps the silicon rod to be cut is as follows:

[0097] The silicon rod clamping member moves along the mounting frame 30 in accordance with the first support 31 driven by the first directional displacement mechanism. The silicon rod clamping member and the first support 31 can be driven, for example, by a first driving device to move along a first directional guide rail provided on the mounting frame 30. Simultaneously, in some scenarios, the first support 31 and the silicon rod clamping member can be driven by a second directional displacement mechanism, for example, moving along a second directional guide rail under the drive of a second driving device. Through the first displacement mechanism and / or the second displacement mechanism, the silicon rod clamping member follows the first support 31 to approach the silicon rod to be cut (as shown in the image) located at a first predetermined position. Figure 8a (as shown in the state); Furthermore, during the movement of the silicon rod clamping member following the first support, the silicon rod clamping member can control the first and second clamping arms of the silicon rod clamping member to perform opening or closing actions based on its movement state (or movement position). For example, before reaching the first predetermined position, the drive gear of the silicon rod clamping member reverses under the drive of the motor, causing the first and second clamping arms to separate until the clamping space between the clamping arms is greater than the diameter of the silicon rod or there is a gap between them to form a receiving space for the silicon rod to be cut. When the first support 31 drives the silicon rod clamping member to move to the receiving space between the first and second clamping arms where the silicon rod to be cut is located, the drive gear rotates forward to control the first and second clamping arms to move closer to each other, that is, to approach each other to clamp the silicon rod. When the first and second clamping arms contact and clamp the silicon rod, they stop moving towards each other.

[0098] After clamping the silicon rod, the silicon rod holder remains clamped. Based on the preset placement position of the silicon rod, the first direction shifting mechanism and / or the second direction shifting mechanism drive the first bracket 31 and the silicon rod holder to move the silicon rod along a preset path until the clamped silicon rod is transported to the second predetermined position (as shown in the image). Figure 8b After the state shown, the first clamping arm and the second clamping arm perform an opening action to release the silicon rod. Here, the second predetermined position is, for example, the clamped silicon rod to be cut is located directly above the support surface used to support the silicon rod in the silicon rod support structure.

[0099] In such Figure 8a and Figure 8b In the illustrated embodiment, the silicon rod clamp performs the process of loading the silicon rod to be cut onto the silicon rod support structure. It should be understood that after the transport of a silicon rod to be cut is completed (as shown in the image), Figure 8bAs shown in the diagram, the silicon rod holder returns to the first predetermined position (as shown in the diagram) under the drive of the first support via the first direction displacement mechanism and / or the second direction displacement mechanism. Figure 8a (as shown in the diagram) to continue loading and transporting the next silicon rod to be cut; after the silicon rod loading and unloading device has loaded all the silicon rods to be cut in the corresponding squaring operation, for example... Figure 8a or Figure 8b In the silicon rod squaring equipment shown in the view, after the silicon rod loading and unloading device has loaded the corresponding silicon rods to be cut onto the multiple silicon rod bearing structures in the loading and unloading area on the machine base, the first support 31 and the silicon rod clamping member can return to an initial position under the drive of the first direction displacement mechanism and / or the second direction displacement mechanism. The initial position is, for example, the waiting area of ​​the silicon rod loading and unloading device in a non-working state. In practical scenarios, the initial position can be set based on the layout of the silicon rod squaring equipment. For example, in... Figure 8a or Figure 8b In the example shown, the initial position can be set at the end of the mounting frame 30.

[0100] In some examples, when the silicon rod loading and unloading device performs the unloading process of the cut silicon rod, similarly, the silicon rod clamp and the first support 31 move along the mounting frame 30 in accordance with the drive of the displacement mechanism. Here, the movement stops at the first predetermined position adjacent to the silicon rod support structure carrying the cut silicon rod (as shown in the image). Figure 8c (As shown in the diagram), the first and second clamping arms approach each other to clamp the silicon rod, and stop moving towards each other when they contact and clamp the silicon rod; the silicon rod clamp and the first support 31 move along a straight line or zigzag line under the drive of the first and second direction shifting mechanisms according to the second predetermined position to transfer the cut silicon rod out of the processing platform of the machine base, and transfer the cut silicon rod to the second predetermined position for unloading (as shown in the diagram). Figure 8d (as shown in the diagram). After the unloading operation is completed, the first support 31 and the silicon rod clamp can return to the aforementioned initial position.

[0101] In another aspect, this application also provides a silicon rod squaring apparatus, including a base, a silicon rod support structure, a wire cutting device, and a device suspended from the base as described above. Figures 1 to 8d The silicon rod loading and unloading device is described in any of the embodiments shown. The silicon rod supporting structure is used to support vertically placed silicon rods, and the silicon rod loading and unloading device is used to clamp the silicon rod to be cut or the already cut silicon rod and move the clamped silicon rod to be cut or the already cut silicon rod to a predetermined position.

[0102] In some examples, the wire cutting device includes a liftable wire cutting support and a wire cutting unit mounted on the support. The wire cutting unit has a wire saw, which can be driven by the lifting movement of the wire cutting support to cut the silicon rods vertically placed on the silicon rod support structure. Before cutting, the silicon rod to be cut needs to be placed in the loading and unloading area of ​​the silicon rod squaring equipment. After cutting, the cut silicon rod is promptly transferred out for continuous operation of squaring different silicon rods. The silicon rod loading and unloading device can transfer the silicon rod to be transferred from the first predetermined position to the second predetermined position to cooperate with the wire cutting device to cut different silicon rods.

[0103] Here, the silicon rod loading and unloading device is hoisted on the machine base. The silicon rod clamp is transferred between a first predetermined position and a second predetermined position by a shifting mechanism. In some scenarios, the storage area for the silicon rod to be cut and the area where the cut silicon rod is placed are far from the machine base. For example, it is necessary to transfer the silicon rod to be cut to the first predetermined position, and then the silicon rod loading and unloading device transfers the silicon rod to be cut to the silicon rod support structure. Or, after the wire saw has squared the silicon rod, the silicon rod loading and unloading device transfers the cut silicon rod from the silicon rod support structure to the second predetermined position, and then transfers the cut silicon rod at the second predetermined position to the preset placement area for cut silicon rods or to the next process equipment.

[0104] Here, the first and second predetermined positions are not limited to fixed positions or areas established in the coordinate system. In the example provided in this application, by determining the transfer path of the loading and unloading device during loading and unloading, and following the time sequence of the transfer, the starting position of the first support in the silicon rod loading and unloading device in the transfer path is taken as the first predetermined position, and the ending position of the first support is taken as the second predetermined position. Here, when the silicon rod loading and unloading device is performing a feeding process, the position where the silicon rod clamp holds the silicon rod to be cut is the first predetermined position, and the position where the silicon rod to be cut is placed on the silicon rod support structure by the movement of the moving mechanism is the second predetermined position. Conversely, when the silicon rod loading and unloading device is performing a feeding process of transferring the cut silicon rod after squaring out of the machine base, the position where the first support is located adjacent to the silicon rod support structure to hold the cut silicon rod is taken as the starting position, which is also the first predetermined position, and the position where the cut silicon rod is transferred away from the machine base by the silicon rod clamp and released is the second predetermined position.

[0105] In some examples, the silicon rod squaring equipment further includes a silicon rod conveying device, which includes a feeding and conveying section and a feeding drive source. The feeding and conveying section is used to convey the silicon rod to be cut, and the feeding drive source is used to drive the feeding and conveying section to move the silicon rod to be cut.

[0106] Driven by a feeding drive source, the feeding and transfer unit transports the silicon rod to be cut to the first predetermined position, thus enabling the silicon rod loading and unloading device to transfer the silicon rod. In some examples, the end of the feeding and transfer unit is located at the first predetermined position where the silicon rod loading and unloading device performs the feeding process.

[0107] Please see Figure 9 The image shows a schematic diagram of the silicon rod conveying device of the silicon rod processing equipment of this application in one embodiment. In some examples, the loading and transfer section 41 includes a support section 411 for carrying the silicon rod to be cut and a chain conveying mechanism 412; wherein, the support section 411 has two rows of rollers arranged opposite each other, and the chain conveying mechanism 412 includes a conveying chain 4121, and further includes sprockets 4122 arranged at least at both ends of the conveying chain 4121 and meshing with the conveying chain 4121. Here, the support section 411 is the part used to support the silicon rod, and the oppositely arranged rollers contact the silicon rod to be cut and realize the horizontal transport of the silicon rod. At least one of the sprockets 4122 meshed with by the conveying chain is connected as a drive sprocket to a sprocket drive source, for example, the drive sprocket 4122 shaft is connected to the power output shaft of a motor to drive the conveying chain 4121 to rotate.

[0108] In some examples, the material conveying unit 41 conveys a long distance, and the corresponding conveying chain 4121 is long. In order to prevent the conveying chain 4121 from becoming loose or disengaging from the sprocket 4122, the chain conveying mechanism 412 is provided with multiple sprockets 4122. The multiple sprockets 4122 can be arranged at equal intervals to ensure the tension at all points of the conveying chain 4121.

[0109] In some examples, the loading and transfer unit further includes at least one elastic push rod structure connected to the conveyor chain for pushing the silicon rod to be cut along the loading and transfer unit.

[0110] Please refer to the following: Figure 9 , Figure 10 ,in, Figure 10 The diagram shows a schematic of the elastic push rod structure 413 in one embodiment. As shown, the elastic push rod structure 413 includes a push rod 4131 and a torsion spring 4132. The elastic push rod structure 413 is mounted on a conveyor chain 4121, and moves forward on the conveyor chain 4121 of the feeding and transfer section (e.g., ...). Figure 9 When the arrow points in the direction shown, it abuts against the end face of the silicon rod to cooperate with the transfer unit to move the abutted silicon rod to a preset position, and during the retraction movement of the conveyor chain 4121 (as indicated by the arrow). Figure 9When avoiding obstacles (i.e., the silicon rod to be cut in this scenario) in the opposite direction of the arrow shown; the torsion spring 4132 is located below the push rod 4131 to cooperate with the rotational movement of the push rod 4131.

[0111] Here, the push rod 4131 includes a swing rod as the main body, a roller at the far end of the swing rod for contacting the silicon rod to be cut, and a pivot at the near end of the swing rod, along which the swing rod can rotate; the torsion spring 4132 is sleeved on the pivot to provide the torque for positioning the swing rod at a certain angle. For example, when the swing rod is not subjected to external force, the torsion spring 4132 can stabilize the swing rod in an upright position. The elastic push rod structure 413 also includes a support base 4133, which is fixedly connected to the conveyor chain 4121 and is used to set the push rod 4131 and the spring. The support base 4133 also includes a limiting baffle. As shown in the figure, when the swing rod rotates counterclockwise, it will abut against the limiting baffle and reach the maximum rotation angle. During the process of the elastic push rod structure 413 moving forward in accordance with the conveyor chain 4121, the roller at the far end of the swing rod contacts the end face of the silicon rod to be cut and generates a tendency to rotate counterclockwise relative to the axis of rotation. After abutting against the limiting baffle, the rotation stops. The push rod 4131 can generate a pushing force on the silicon rod to be cut based on the limiting effect of the limiting baffle, thereby pushing the silicon rod to be cut to move along the bearing part in the forward direction.

[0112] Please see Figure 11 The figure shows a partial structural schematic diagram of the silicon rod transport device of this application in one example. As shown in the figure, in a specific implementation, the bearing part 411 includes upright plates 4111 disposed on opposite sides of the conveyor chain 4121. Two rows of rollers 4112 are disposed opposite to each other on the upright plates 4111. It should be understood that the silicon rod to be cut has point contact with the rollers 4112. In some examples, the two rows of rollers 4112 are rotatably disposed on the upright plates 4111 above the conveyor chain 4121. The elastic push rod structure moves with the conveyor chain 4121. During the forward movement of the conveyor chain 4121, the push rod abuts against the end face of the silicon rod to be cut, which can provide the silicon rod to be cut with a thrust to move along the silicon rod axially. Through the arrangement of the bearing part 411 including the rollers 4112 and the elastic push rod structure, when the silicon rod to be cut moves along the bearing part 411, the thrust only needs to overcome the rolling friction between the silicon rod and the rollers 4112, and the resistance required to overcome to achieve silicon rod transmission is small.

[0113] In some examples, the loading and transfer unit includes, for example, a support unit and a conveyor belt structure. The elastic push rod structure is fixedly mounted on the transmission belt and moves with the conveyor belt to abut against the end face of the silicon rod to be cut when the conveyor belt moves forward, thereby driving the silicon rod to move in the forward direction.

[0114] Of course, depending on the needs of the transfer direction during the silicon rod feeding process in actual scenarios, in some examples, the elastic push rod structure can also be set to abut against the end face of the silicon rod during the retraction of the conveyor chain or conveyor belt, so as to transport the strip-cut silicon rod to the first predetermined position in the feeding process.

[0115] In some examples, the silicon ingot transfer device further includes a feeding transfer section and a feeding drive source. The feeding transfer section is used to transport the cut silicon ingots, and the feeding drive source is used to drive the feeding transfer section to move the cut silicon ingots. Here, the starting end of the feeding transfer section may be set at the second predetermined position during the feeding process of the silicon ingot loading and unloading device, whereby the silicon ingot loading and unloading device clamps and transfers the cut silicon ingots from the silicon ingot support structure to the feeding transfer section, so that the silicon ingot transport device transfers the cut silicon ingots to the next process position or the placement area of ​​the cut silicon ingots.

[0116] Please see Figure 12 The image shows a schematic diagram of the silicon rod conveying device according to one embodiment of this application. In some examples, the unloading and transfer unit 42 is a conveyor belt mechanism. It should be understood that the cut silicon rod is a cuboid with flat sides after squaring. By placing the cut silicon rod horizontally on the conveyor belt, it can be transported by the friction formed on the surface of the conveyor belt by its own weight. Here, the unloading drive source is, for example, a drive motor, which drives at least one synchronous pulley in the conveyor belt mechanism to rotate, thereby causing the conveyor belt to rotate.

[0117] In some examples, the silicon rod transport device further includes a flipping device for flipping the carried silicon rod to be cut from a horizontal state to a vertical state and for flipping the carried cut silicon rod from a vertical state to a horizontal state.

[0118] The silicon rod loading and unloading device in the silicon rod squaring equipment can be used to clamp vertically placed silicon rods to be cut or cut silicon rods. Here, the flipping device 43 can be used to flip the silicon rod to be cut from a horizontal state to a vertical state so that the silicon rod loading and unloading device can perform loading and transportation of the silicon rod to be cut, or it can be used to flip the cut silicon rods transported from the silicon rod support structure to the silicon rod transfer device from a vertical state to a horizontal state to realize the subsequent transportation of the cut silicon rods.

[0119] The flipping device 43 docks with the end of the loading transfer unit or the beginning of the unloading transfer unit. In some examples, the loading transfer unit and the unloading transfer unit are located on the same side of the machine base, so that the silicon rod loading and unloading device can reach the loading transfer unit and the unloading transfer unit by moving on the same side of the machine base. Here, the flipping device 43 is mounted on a linear motion mechanism 44 to move from the loading transfer unit to dock with the unloading transfer unit, that is, the flipping device 43 can move between the loading transfer unit and the unloading transfer unit.

[0120] Please refer to the following: Figure 8c , Figure 12 The loading and unloading transfer units are located on the same side of the machine base and are arranged parallel to each other. The flipping device 43 is mounted on a linear motion mechanism 44 laid in the second direction. The linear motion mechanism 44 includes, for example, a linear guide rail in the second direction, a traveling motor, and a traveling screw. The traveling screw connects the linear guide rail and the flipping device 43. Driven by the traveling motor, the flipping device 43 moves along the linear guide rail in the second direction, allowing the loading and unloading transfer units to share the same flipping device 43. For example, in a practical scenario, after the loading transfer unit flips the horizontally placed silicon rod to be cut into an upright position, the flipping device 43 can move along the linear guide rail in the second direction to the docking unloading transfer unit to flip the vertically placed cut silicon rod into a horizontal position.

[0121] Of course, in actual scenarios, the loading and unloading transfer units can also be set on both sides of the machine base. For example, when a silicon rod processing platform with a silicon rod bearing structure is set on a translation mechanism, one side of the machine base is set as the loading area. After the silicon rod is square-cut, it is translated towards the side away from the loading area to move the cut silicon rod to the unloading area. The loading and unloading transfer units correspond to the loading area and the unloading area, respectively.

[0122] In some examples, such as Figure 12 As shown, the flipping device 43 includes a flipping table 431, which is equipped with a flipping motor for driving the flipping table 431 to rotate. Here, the flipping table 431 includes a flipping section and a flipping shaft. The flipping shaft is disposed on the flipping section and axially connected to the flipping motor, thereby driving the flipping section to rotate a predetermined angle under the drive of the flipping motor. The flipping section is used to carry the silicon rod to be cut or the already cut silicon rod, and through clamping, adsorption, or limiting actions, ensures that the silicon rod to be cut or the already cut silicon rod remains in contact with the flipping section during flipping. In one specific implementation, the flipping section includes a lifting seat disposed on a support plate of the flipping section and a pressing block or pressing plate disposed on the lifting seat. In other implementations, the flipping section may also include a clamping arm or a sleeve as a limiting structure.

[0123] In such Figure 12In the view shown, the flipping shaft is located on the right side of the flipping part. When the flipping device corresponds to the feeding and transfer part, the flipping part rotates 90° clockwise around the flipping shaft under the drive of the flipping motor to flip the silicon rod to be cut onto a vertical position. When the flipping device corresponds to the unloading and transfer part, the flipping part rotates 90° counterclockwise around the flipping shaft under the drive of the flipping motor to flip the cut silicon rod onto a horizontal position.

[0124] Therefore, the silicon rod squaring equipment of this application transports the silicon rod to be cut to a first predetermined position via a silicon rod conveying device. The silicon rod loading and unloading device can then move along the mounting frame above the machine base to reach the first predetermined position via a shifting mechanism, and can also move along the mounting frame to transfer the silicon rod to be cut onto the silicon rod bearing structure. The silicon rod conveying device and the silicon rod loading and unloading device work together with the wire cutting device to transfer and cut the silicon rod, making the flow between different processes automated, reducing labor costs and helping to avoid damage to the silicon rod during the transfer process. Furthermore, the transfer path of the silicon rod loading and unloading device can be a straight line or a broken line, and the hoisting method provides space for the equipment to be placed on the ground, such as for the silicon rod moving device. The silicon rod squaring equipment can achieve automated process flow in the silicon rod squaring operation by occupying a small equipment space.

[0125] Existing monocrystalline silicon rods are generally cylindrical in shape. In existing squaring equipment, the silicon rod is typically supported by its own weight. However, during wire cutting, the cutting line along the length of the rod causes vibration, resulting in an uneven cut surface and poor product quality. Therefore, it is necessary to propose a silicon rod squaring device that ensures the silicon rod remains stably positioned on the support structure during the cutting process. The silicon rod mentioned in this application is a monocrystalline silicon rod. This application discloses a silicon rod clamping device and a silicon rod squaring device equipped with the clamping device. The clamping device presses the top of the monocrystalline silicon rod on the support structure during wire cutting, ensuring the rod remains stably positioned and guaranteeing the cutting quality.

[0126] The silicon rod clamping device of this application can be used in a silicon rod squaring equipment. The silicon rod clamping device can be detachably installed as an independent unit in the silicon rod squaring equipment to cooperate with the silicon rod squaring operation in the silicon rod squaring equipment, and to clamp the silicon rod during the squaring and cutting process, so that the silicon rod is in a stable state during the cutting process. Of course, it should be understood that in some embodiments, the silicon rod clamping device can also be installed in the silicon rod squaring equipment to form an integral structure.

[0127] Please see Figure 13The figure shows a schematic diagram of the silicon rod clamping device in one embodiment. As shown, the silicon rod clamping device is applied in a silicon rod squaring equipment. The silicon rod squaring equipment includes a base 10, a silicon rod bearing structure (not shown in the figure), and a wire cutting device. The silicon rod clamping device includes a clamping bracket 61 and a plurality of independent clamping components 60. The clamping bracket 60 is movably mounted on the cutting frame 20. The plurality of independent clamping components 60 are respectively mounted on the clamping bracket 61 and are used to clamp the top of the silicon rod to be cut, which is supported by the silicon rod bearing structure. Each clamping component 60 includes a clamping head 601 and a driving mechanism 602 that drives the clamping head 601 to move up and down relative to the clamping bracket 61.

[0128] The base 10 is configured as the main component of the silicon rod squaring equipment of this application, and is used to provide a squaring operation platform. In one example, the base 10 has a large volume and weight to provide a larger mounting surface and a more robust overall stability.

[0129] The silicon rod support structure is set on the silicon rod processing platform and is used to support the vertically placed silicon rod to be cut.

[0130] The wire cutting device is provided with at least one wire cutting unit 21, which includes a cutting wheel, a transition wheel, and a cutting wire wound between the cutting wheel and the transition wheel. Thus, the wire cutting unit 21 forms a wire saw for cutting silicon rods.

[0131] The silicon rod clamping device includes a clamping bracket 61 and a clamping component 60 disposed on the clamping bracket 61 and corresponding to the silicon rod support structure located in the cutting area. In one example, a slider that cooperates with the lifting guide rail 22 is fixed on the clamping bracket 61. The clamping bracket 61 is vertically mounted on the cutting frame and located above the wire cutting device through its slider cooperating with the lifting guide rail 22. The clamping component 60 is disposed on the clamping bracket 61 and can move up and down with the clamping bracket 61 to release or clamp the silicon rod to be cut located on the silicon rod support structure in the cutting area.

[0132] Due to the influence of the manufacturing process, the silicon rods to be cut on the silicon rod support structure in the cutting area are not completely uniform in height. The fact that the clamping assembly 60 descends with the clamping bracket 61 does not guarantee that each clamping assembly 60 is tightly pressed against the silicon rod to be cut supported by its corresponding silicon rod support structure. Therefore, in the silicon rod clamping device provided in this application, the clamping bracket 61 is provided with multiple independent clamping assemblies 60. Each clamping assembly 60 includes a clamping head 601 and a driving mechanism 602 that drives the clamping head 601 to move up and down along the clamping bracket 61. That is, each clamping assembly 60 has the degree of freedom to move along the cutting frame with the clamping bracket 61 and the degree of freedom to move up and down relative to the clamping bracket 61.

[0133] Each clamping component 60 can be used to perform a clamping operation on a vertically placed silicon rod on a silicon rod support structure. In actual scenarios, the silicon rod clamping device can, for example, adjust the overall lifting position of the clamping bracket 61 and each clamping component 60 set on the clamping bracket 61. After the distance between the clamping head 601 of the clamping component 60 and the upper end face of the silicon rod to be cut is within a preset range, the lifting amplitude of the corresponding clamping head 601 is adjusted based on the height of the upper end face of each silicon rod to be cut on the silicon rod support structure so that the clamping head 601 contacts and clamps the silicon rod to be cut.

[0134] In some embodiments, the wire cutting unit 21 in the wire cutting device is movably mounted on the cutting frame 20 via a lifting mechanism. The lifting mechanism includes a lifting guide rail 22 and a lifting motor. The clamping bracket 61 in the silicon rod clamping device is movably mounted on the cutting frame 20 via the lifting guide rail 22. That is, here, the lifting clamping device and the wire cutting unit 21 can share a lifting guide rail 22 to achieve movement in the lifting direction. The lifting guide rail 22 is disposed on the cutting frame 20.

[0135] To simplify the structure of the silicon rod squaring equipment of this application and reduce the manufacturing cost, in one embodiment, the silicon rod clamping device is attached to the mounting beam 214 supporting the wire cutting unit 21 by its own weight, and can move up and down along the lifting guide rail 22 following the mounting beam 214. The lifting motor drives the mounting beam 214 to drive the wire cutting unit 21 to descend along the lifting guide rail 22. The silicon rod clamping device, attached to the mounting beam 214, also descends along the lifting guide rail 22 to the top of the silicon rod to be cut, which is supported by the silicon rod bearing structure in the cutting area. The driving structure in its clamping component 60 drives the clamping head 601 to move up and down to clamp the corresponding silicon rod to be cut, while the mounting beam 214 will continue to be driven by the first driving mechanism 602 to descend with the wire cutting unit 21 to perform the cutting operation of the silicon rod to be cut.

[0136] In some embodiments, the wire cutting unit and the silicon rod clamping device are respectively equipped with lifting drive devices. The wire cutting unit may be driven by a lifting motor mounted on the mounting beam that supports the wire cutting unit, so as to follow the lifting and lowering movement of the mounting beam. The clamping bracket in the silicon rod clamping device moves along the lifting guide rail of the cutting frame under the drive of the lifting drive device mounted on the clamping bracket.

[0137] In one example, the silicon rod squaring equipment equipped with the silicon rod clamping device includes a first lifting drive mechanism and a second lifting drive mechanism. The first lifting drive mechanism drives the wire cutting unit to move along the lifting guide rail; the second lifting drive mechanism drives the silicon rod clamping device to move up and down along the lifting guide rail. At this time, the silicon rod clamping device no longer relies on gravity to be attached to the mounting beam, but is driven by the second lifting drive mechanism to move up and down along the lifting guide rail. The second lifting drive mechanism is configured as a cylinder assembly or a lead screw assembly driven by a motor. In practical applications, the first lifting drive mechanism drives the mounting beam carrying the wire cutting unit to descend. When the second lifting drive mechanism drives the silicon rod clamping device to descend to a predetermined position, the second lifting drive mechanism stops driving the silicon rod clamping device, allowing the silicon rod clamping device to be positioned at the predetermined position to clamp the silicon rod to be cut. The first lifting drive mechanism continues to drive the mounting beam carrying the wire cutting unit to descend to complete the cutting of the silicon rod. After the cutting operation of the silicon rod is completed, the first lifting drive mechanism drives the mounting beam carrying the wire cutting unit to rise, and the second lifting drive mechanism drives the silicon rod clamping device to rise.

[0138] In some embodiments, the wire cutting unit in the wire cutting device is movably mounted on the cutting frame via a first lifting mechanism, and the silicon rod clamping device is movably mounted on the cutting frame via a second lifting mechanism.

[0139] In some embodiments, the first lifting mechanism includes a first lifting guide rail and a first drive motor, and the second lifting mechanism includes a second lifting guide rail and a second drive motor.

[0140] Here, the first and second lifting guide rails are respectively arranged in the vertical direction, that is, the direction of the plumb line. The first and second lifting guide rails are both set on both sides of the cutting frame. The wire cutting unit is set on the mounting beam. The two ends of the mounting beam are respectively connected to the first lifting guide rails on the cutting frame on both sides of the machine base. Under the drive of the first drive motor, the wire cutting unit moves in the lifting direction. Here, the cutting line segment in the wire cutting unit moves up and down accordingly, so that the silicon rod can be cut under the control of the first drive motor. The two ends of the clamping bracket of the silicon rod clamping device are set on the second lifting guide rails on both sides of the cutting frame. Under the drive of the second drive motor, the clamping bracket carries the clamping component and moves along the lifting guide rail, so that the clamping head of the clamping component can be clamped to the top of the silicon rod.

[0141] In some embodiments, the clamping bracket is provided with a guide rail locking mechanism. For example, to prevent the silicon rod clamping device from continuously descending with the mounting beam and damaging the silicon rod to be cut, a guide rail locking mechanism is provided on the clamping bracket of the silicon rod clamping device; as another example, to prevent the silicon rod clamping device from not being able to stay at a preset height when moving along the lifting guide rail or the second lifting guide rail used to set the clamping bracket under the action of the second drive motor, a guide rail locking mechanism is provided on the clamping bracket.

[0142] The guide rail locking mechanism can be used to position the silicon rod clamping device at a predetermined position on the lifting guide rail (or the second lifting guide rail). For example, the predetermined position is that the clamping component in the silicon rod clamping device is located 0 to 5 cm above the corresponding silicon rod to be cut. However, this is not a limitation. As long as the clamping component is located above the corresponding silicon rod to be cut, the clamping head in the clamping component can be pressed against the top surface of the corresponding silicon rod to be cut when it is driven to descend.

[0143] In one implementation, the guide rail locking mechanism includes a locking clamp and a cylinder. The locking clamp is disposed on the clamping bracket, and the cylinder is used to provide a clamping force to the locking clamp on the lifting guide rail or the second lifting guide rail. When the cylinder is extended, the locking clamp is forced to abut against the lifting guide rail or the second lifting guide rail connected to the clamping bracket. Based on the force when the cylinder is extended, the locking clamp remains relatively stationary with the guide rail after abutting against the lifting guide rail or the second lifting guide rail.

[0144] Please see Figure 14a , 14b , Figure 14c , Figure 14a The diagram shown is a structural schematic of the silicon rod clamping device 6 of this application in one embodiment. Figure 14b , Figure 14c The display shows the silicon rod clamping device 6 in different motion states. Figure 14a An enlarged schematic diagram of B in the figure. As shown in the figure, the guide rail locking mechanism 62 is, for example, the pneumatic guide rail locking mechanism 62 shown in the figure, such as... Figure 14a As shown, the silicon rod clamping device 6 is mounted on the lifting guide rail 22, thereby enabling movement in the lifting direction to clamp the silicon rod. Figure 14b As shown in 14c, the pneumatic guide rail locking mechanism 62 in this embodiment includes a locking clamp 621 that cooperates with the lifting guide rail 22, a cylinder 622 that drives the locking clamp 621, and a spring 623. Here, the locking clamp 621 and the lifting guide rail 22 are respectively provided with racks in the lifting direction, that is, along the guide rail direction. The locking clamp 621 is disposed on the clamping bracket in the silicon rod clamping device 6. In a moving state, the silicon rod clamping device 6 and the mounting beam descend (as shown in 14c). Figure 14b(As shown in the diagram), at this time, the cylinder 622 is in a stopped state, and the rack between the locking clamp 621 and the lifting guide rail 22 is separated by the spring force of the spring 623. Therefore, the silicon rod clamping device 6 can move along the lifting guide rail 22. When it reaches the predetermined position, the cylinder 622 drives the locking clamp 621 on the clamping bracket to move. Here, the pushing action of the cylinder 622 overcomes the spring force of the spring 623, causing the locking clamp 621 to grip the lifting guide rail 22 and position the silicon rod clamping device 6 at the predetermined position (as shown in the diagram). Figure 14c (As shown in the diagram), the locking clamp 621 engages with the rack of the lifting guide rail 22, thereby fixing the silicon rod clamping device 6 onto the lifting guide rail 22 and positioning the silicon rod clamping device 6 to a predetermined position. The clamping components in the silicon rod clamping device 6 clamp the corresponding silicon rod to be cut, while the mounting beam continues to be driven, causing the wire cutting unit to descend and complete the cutting of the silicon rod. After the cutting operation of the silicon rod is completed, when the mounting beam is driven by the first driving mechanism to raise the wire cutting unit to the position positioned by the silicon rod clamping device 6, the cylinder 622 drives the locking clamp 621 on the clamping bracket to release the lifting guide rail 22, allowing the silicon rod clamping device 6 to continue to be attached to the mounting beam and rise (as shown in the diagram). Figure 14b (The state shown).

[0145] In some embodiments, the clamping bracket 61 is provided with a guide rail clamp (as shown in the image). Figure 13 (As shown in the embodiment), the guide rail clamps can be disposed at both ends of the clamping bracket 61 to connect the clamping bracket 61 to the lifting guide rail 22 or the second lifting guide rail. When the lifting guide rail 22 or the second lifting guide rail on both sides of the cutting frame 20 is a double guide rail, the guide rail clamps 221 can be configured as four, each connected to the clamping bracket 61 at the double guide rail on both sides. In actual scenarios, the clamping bracket 61 can be attached to the cutting frame 20 to move along the lifting guide rail 22 or move along the second lifting guide rail under the action of the second drive motor. After reaching the predetermined position, the guide rail clamps 221 clamp the guide rail to stabilize the clamping bracket 61 at the preset height.

[0146] Here, multiple independent clamping components installed on the clamping bracket can move along the lifting guide rail under the drive of the clamping bracket. At the same time, the clamping head of each lifting component can move up and down along the lifting bracket under the drive of the driving mechanism.

[0147] In some embodiments, the drive mechanism includes a power structure and a guide rail, wherein the clamping head is linked to and controlled by the power structure to move up and down along the guide rail.

[0148] Please refer to the following: Figure 13 and Figure 15 ,in, Figure 15 Displayed as Figure 13 An enlarged schematic diagram at point A. As shown in the figure, the clamping bracket 61 is provided with multiple clamping components 60, which correspond to multiple silicon rod support structures with squared cutting areas. Each clamping component 60 is provided with a clamping head 601 and a driving mechanism 602. The driving mechanism 602 includes a guide rail 6022 arranged on the clamping bracket 61 along the lifting direction, and a power structure 6021 that serves as the driving source for the lifting of the clamping head 601. The clamping head 601 can move along the guide rail 6022 under the drive of the power structure 6021.

[0149] In some embodiments, the power structure 6021 includes a cylinder or hydraulic pump and a telescopic member, wherein the telescopic member is connected to the cylinder or hydraulic pump, and the clamping head 601 is disposed at the bottom of the telescopic member.

[0150] In one specific implementation, the telescopic member moves along the lifting direction under the propulsion of the cylinder. For example, the telescopic member is connected to the cylinder piston rod, and the pressing head 601 is located at the bottom of the telescopic member (i.e., the end face of the telescopic member facing the silicon rod support structure in the cutting area). The cylinder drives the telescopic member to move up and down with the pressing head 601 to release or press the silicon rod to be cut on the silicon rod support structure in the cutting area.

[0151] In another specific implementation, the telescopic component is connected to a hydraulic pump. For example, the telescopic component is a rod connected to the piston of a hydraulic cylinder or a lifting cylinder connected to the hydraulic pump. The telescopic component can move up and down along the guide rail 6022 under the drive of the hydraulic pump, and drive the pressing head 601 at the bottom of the telescopic component to move up and down to adjust the distance between the pressing head 601 and the end face of the silicon rod to be cut.

[0152] In another specific implementation, the driving mechanism includes a guide rail and a lifting motor (not shown). The guide rail is arranged on the clamping bracket along the lifting direction. The clamping head moves up and down relative to the clamping bracket under the drive of the lifting motor to adjust the distance between the clamping head and the top of the silicon rod to be cut.

[0153] In some embodiments, the power structure includes a lifting motor and a telescopic member, wherein the telescopic member is connected to the lifting motor, and the clamping head is disposed at the bottom of the telescopic member. Here, the telescopic member may be, for example, a connecting rod between the lifting motor and the clamping head, and the lifting motor may be, for example, a traveling motor that can move along a guide rail. The telescopic member drives the clamping head to move up and down under the movement of the traveling motor, thereby adjusting the distance between the clamping head and the end face of the silicon rod to be cut; alternatively, the telescopic member may be an electric push rod driven by a lifting motor, the extended end of which is connected to the clamping head, thereby driving the compression head to move up and down by the lifting motor.

[0154] In some embodiments, the clamping head is connected to the drive mechanism via an extension arm.

[0155] Please continue reading. Figure 15 In one specific implementation, the proximal end of the extension arm 6011 is connected to the drive mechanism 602, and the distal end is connected to the clamping head 601, so that under the drive of the drive mechanism 602, the extension arm 6011 drives the distal clamping head 601 to move up and down relative to the clamping bracket. In practical scenarios, the extension arm 6011 may, for example, be connected to the telescopic component of the power structure 6021; or, for example, the distal end of the extension arm 6011 may be connected to a slider that can move along the guide rail 6022, the slider being driven by a lifting motor.

[0156] The extension arm 6011 can also be configured to be length-adjustable, with the distal end of the extension arm 6011 being the free end for length adjustment; here, the guide rail in each clamping assembly 60 is disposed on one side of the silicon rod bearing structure, such that the guide rail 6022 and its extending direction are outside the corresponding silicon rod to be cut, for example... Figure 1 The guide rail 6022 shown in the view is located on the right side of the silicon rod support structure, and the distal end of the extension arm 6011 extends to the left so that the clamping head 601 is located directly above the end face of the silicon rod to be cut.

[0157] By connecting the clamping head 601 to the adjustable-length extension arm 6011, the clamping head 601 can be positioned correctly to avoid poor clamping effect or even overturning torque caused by the clamping head 601 being out of center of the silicon rod to be cut. Simultaneously, the length adjustment of the extension arm 6011 is easily achieved, and the clamping position of the silicon rod can be adjusted by moving small components without interfering with other silicon rod clamping devices or other structures or components in the silicon rod squaring equipment. The extension arm 6011 can be, for example, a telescopic rod equipped with a telescopic drive device. In some examples, a linear guide rail can be provided on the extension arm 6011, and the clamping head 601 can be positioned on the linear guide rail, thus effectively achieving the effect of adjustable length of the extension arm 6011, ensuring that the clamping head 601 clamps the silicon rod at the center of the end face of the silicon rod to be cut.

[0158] In some examples, the clamping head is a rotating clamping head.

[0159] In some examples, in a silicon rod squaring device equipped with the aforementioned silicon rod clamping device, the silicon rod supporting structure has a rotating mechanism that can drive the silicon rod to be cut located thereon to rotate in order to adjust the cutting surface. To cooperate with the rotating mechanism of the silicon rod supporting structure, in one implementation, the clamping head is connected to the driving structure via a rotating shaft (not shown). For example, a bearing (not shown) is provided at the bottom of the telescopic component connected to the cylinder, and the clamping head has a rotating shaft adapted to the bearing. The clamping head is rotatably mounted on the bearing of the telescopic component via the rotating shaft. Thus, when the clamping head clamps the silicon rod to be cut, the silicon rod supporting structure drives the silicon rod to be cut to rotate, and the clamping head can also cooperate with the rotation of the silicon rod to be cut.

[0160] In some examples, each clamping head is rotatably disposed at the distal end of the extension arm. The clamping head can be connected to the extension arm via a rotating shaft, which is disposed in a third direction, i.e., the lifting direction. When the clamping head is clamping the silicon rod to be cut, the clamping head can rotate along the rotating shaft when the silicon rod bearing structure drives the silicon rod to rotate.

[0161] In some examples, to better protect the silicon rod to be cut, a buffer pad (not shown) can be provided between the clamping head and the silicon rod to be cut. The buffer pad is fixed to the clamping surface of the clamping head (which is the lower surface of the clamping head).

[0162] In some embodiments, a detection device (not shown) is further provided at the bottom of the clamping head for detecting the contact state of the clamping head with the silicon rod to be cut. In one implementation, the detection device includes a pressure sensor disposed on the lower surface of the clamping head for contacting the silicon rod to be cut. The pressure-sensitive element of the pressure sensor contacts the silicon rod to be cut and outputs a contact signal. The pressure sensor can also be used to detect the magnitude of the pressure value to determine whether the clamping force borne by the silicon rod to be cut is within a preset range.

[0163] In some embodiments, the lifting range of the clamping head along the clamping bracket is 200 mm to 400 mm. In the squaring process, the silicon rods to be cut may have different lengths. These silicon rods are typically segments of a single-crystal silicon rod grown from a melt using the Czochralski method or the floating zone melting method. There may be a certain height difference between different silicon rod segments, as shown in the figure. Figure 13 The state shown.

[0164] In specific implementations, for example, the length of the guide rail can be set to 200 mm to 400 mm, or the telescopic distance of the telescopic component can be set to 200 mm to 400 mm. Thus, the height difference of the clamping heads in the clamping assembly mounted on the same clamping bracket can reach 200 mm to 400 mm. The silicon rod clamping device can then clamp silicon rods of different lengths to be cut onto the silicon rod bearing structure in the cutting area. This eliminates the need to group the silicon rods to be cut based on the same length before loading and cutting, making the squaring process much simpler.

[0165] In practical scenarios, when the height difference between the silicon rods to be cut is greater than 400 mm, the silicon rods can be grouped by length before loading and cutting. For example, in... Figure 1 In the silicon rod squaring equipment shown, the cutting area has four silicon rod support structures. The silicon rods to be cut can be divided into groups of four, ensuring that the length difference between the rods in each group is less than 400 mm. The silicon rod clamping device can then be used to clamp each group of rods. Since there can be a length difference between each group of rods, precise measurement is not required when determining the length, simplifying the squaring process for silicon rods of different lengths.

[0166] The silicon rod clamping device provided in this application can cooperate with the wire cutting device in the silicon rod squaring equipment. The silicon rod clamping device can share a lifting guide rail with the wire cutting device or move separately along a lifting guide rail. The silicon rod clamping device can be simply set above the silicon rod to be cut with the help of the mounting beam in the wire cutting device, or a second driving mechanism can be configured to drive the silicon rod clamping device to move along the lifting guide rail in the lifting direction. At the same time, each lifting component in the silicon rod clamping device can move up and down along the clamping bracket to adapt to clamping silicon rods of different specifications. Before squaring and cutting, the silicon rod clamping device clamps the top of the silicon rod to be cut, ensuring that the silicon rod is stably and vertically placed on the silicon rod support structure, effectively reducing or avoiding the silicon rod being disturbed and shaking, displaced or even overturned during the subsequent cutting process, thus improving the quality of the finished product of squaring processing.

[0167] This application also provides a silicon rod squaring apparatus, including a base, a silicon rod support structure, a wire cutting device, and as shown in Figures 13 to 14. Figure 15 The silicon rod clamping device described in any of the embodiments shown.

[0168] The machine base has a processing platform, and the silicon rod support structure is disposed on the silicon rod processing platform and is used to support the vertically placed silicon rod. The wire cutting device includes a cutting frame disposed on the machine base and a wire cutting unit movably disposed on the cutting frame; wherein, the wire cutting unit includes a cutting wheel, a transition wheel, and a cutting wire, and the cutting wire is sequentially wound around the cutting wheel and the transition wheel to form at least one wire saw, which can be used to perform squaring cuts on the silicon rod to be cut.

[0169] In the silicon rod squaring equipment provided in this application, the silicon rod clamping device can be used in conjunction with the wire cutting device to clamp the top of the silicon rod, i.e. the upper end face of the silicon rod, when the wire cutting device cuts the silicon rod supported by the silicon rod support structure. This ensures that the silicon rod is stably and vertically placed on the silicon rod support structure during the cutting process, thereby avoiding poor cutting quality and silicon rod overturning caused by silicon rod displacement.

[0170] In silicon rod processing technology, wire cutting technology is used in multiple processes of silicon rod processing, such as cutting, squaring and slicing of silicon rods.

[0171] Wire EDM is currently one of the most advanced silicon material processing technologies in the world. Its principle involves a high-speed steel wire driving a cutting blade attached to the wire, or directly using diamond wire, to rub against the workpiece, thus achieving wire cutting. During the cutting process, the steel or diamond wire is guided by a guide wheel, forming a wire saw or wire mesh on the cutting roller. The workpiece is fed by the rising and falling of the worktable or the rising and falling of the wire saw or wire mesh. Under the action of a pressure pump, an automatic cooling water spraying device installed on the equipment sprays cold water onto the cutting area of ​​the steel or diamond wire and the workpiece. The reciprocating motion of the steel or diamond wire generates cutting, simultaneously cutting the material into multiple pieces. Compared with traditional saw blades, grinding wheels, and internal circular cutting, wire EDM technology has advantages such as high efficiency, high throughput, and high precision.

[0172] In the field of silicon rod processing technology, the general process is to first pull brittle polycrystalline silicon material into monocrystalline silicon rods, then cut the original monocrystalline silicon rods to obtain silicon rod segments of a predetermined length, and then use a squaring machine to squarify them. At this time, the cutting mechanism feeds along the length of the silicon rod and cuts four parallel planes in the circumferential direction of the silicon rod, so that the cross-section of the silicon rod is rectangular. After the squaring is completed, a multi-wire slicing machine is used to slice the squared silicon rod along the length to obtain the required silicon wafers.

[0173] In silicon rod processing, several steps require the use of wire cutting equipment. A high-speed steel wire drives a cutting abrasive attached to the wire, or diamond wire is used directly to rub against the workpiece, achieving the purpose of wire cutting. Multi-wire cutting equipment typically consists of multiple cutting wheels and transition wheels. The cutting wire is wound sequentially around the grooves of the cutting wheels and the corresponding grooves of the transition wheels to form multiple wire saws, which are then used to cut the silicon rod. After prolonged use, the grooves on the cutting wheels will wear down, affecting the cutting effect. Therefore, it is necessary to replace the grooves on the cutting wheels. Usually, to ensure that the silicon rod is cut to the preset specifications, the travel distance of the cutting wheels also needs to be adjusted after changing the grooves.

[0174] As described in the background section, in related wire EDM devices, the relative positions of multiple cutting wheels do not easily change after installation. When one of the wire EDM wheels wears out, the entire groove needs to be replaced by adjusting the position of the cutting wheel or other components. Furthermore, the components that need to be adjusted need to be calibrated, which is cumbersome and inefficient.

[0175] In view of this, this application also provides a wire cutting device for silicon rod processing equipment. The silicon rod processing equipment includes: a base having a silicon rod processing platform; a silicon rod bearing device disposed on the silicon rod processing platform for bearing the silicon rod to be cut; the wire cutting device includes: a cutting frame disposed on the base; at least one wire cutting unit movably disposed on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged sequentially along a first direction, each cutting wheel having at least two cutting grooves; a cutting wire sequentially wound around the plurality of cutting wheels to form at least one wire saw; at least one adjusting mechanism disposed on the at least one wire cutting unit for driving the plurality of cutting wheels in the at least one wire cutting unit to move along a second direction, so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or change the cutting grooves of the cutting wire wound around the plurality of cutting wheels in the at least one wire cutting unit.

[0176] The wire cutting device can switch the cutting wire between different cutting slots on the cutting wheel based on the adjusting mechanism, or adjust the position of the wire saw to change the cutting position (or processing specifications) relative to the silicon rod. The silicon rod processing equipment using the wire cutting device can be a silicon rod squaring device, a silicon rod cutting device, a silicon rod cutting and grinding integrated device, etc. It should be understood that the wire cutting device can change slots or adjust the position of the wire saw by adjusting the adjusting mechanism only needs to be achieved by the structure and winding method of the wire cutting device itself, and is not limited by the specific type of silicon rod processing equipment.

[0177] In the embodiments provided in this application, the cutting wire saw is a segment of the cutting wire that can be used to feed and process silicon rods. It should be understood that the cutting wire is running at high speed during the cutting process, and the position of the cutting wire saw is usually determined by the winding method between the cutting wheel and the cutting wire.

[0178] In the embodiments provided below, the application of the wire cutting of this application to a silicon rod squaring equipment is used as an example for illustration, but it is not intended to limit the application scenarios of the wire cutting device of this application.

[0179] Please refer to the following: Figure 16 and Figure 17 ,in, Figure 16 The diagram shown is a structural schematic of the wire cutting apparatus of this application in one embodiment. Figure 17 The present invention provides a schematic diagram of the wire cutting apparatus used in a silicon rod squaring device in one embodiment. As shown in the figure, the wire cutting apparatus includes a cutting frame 20, at least one wire cutting unit 21, and at least one pitch adjustment mechanism 23.

[0180] The cutting frame 20 is disposed on the base 10. In some embodiments, the cutting frame 20 is disposed at both ends of the base 10 to ensure that the wire saw formed on the wire cutting unit 21 mounted on the cutting frame 20 can cover different processing stations. For example, in the example shown in Figure 2, the cutting frame 20 is a column disposed at both ends of the base 10. The base 10 of the silicon rod squaring equipment is provided with multiple silicon rod support structures, and the span of the wire cutting unit 21 includes each silicon rod support structure in the cutting area.

[0181] The at least one wire cutting unit 21 is movably mounted on the cutting frame 20. The wire cutting unit 21 includes a plurality of cutting wheels 211 and cutting wires 213 arranged sequentially along a first direction. In some implementations, as shown in the embodiment of FIG2, the wire cutting unit 21 is mounted on the cutting frame 20 via a wire cutting support 24. The wire cutting support 24 is mounted on the cutting frame 20 and includes a guide rail arranged along a second direction. The wire cutting unit 21 is mounted on the guide rail of the wire cutting support 24 to form a degree of freedom of movement along the second direction. Of course, the wire cutting support 24 may also be configured with a guide groove, a slide bar, or other limiting or guiding structure in the second direction for mounting the at least one wire cutting unit 21. This application does not impose any limitations.

[0182] It should be understood that the plurality of cutting wheels 211 need to be attached to the carrier provided by the wire cutting unit 21. In some examples, the wire cutting unit 21 includes a mounting beam 214 in a first direction, the two ends of which are movably connected to the cutting frame 20. A plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, a wire cutting unit 21 consists of a plurality of cutting wheels 211 arranged in the same direction (or the same straight line), a cutting line 213, and a load-bearing structure for the cutting wheels 211.

[0183] In other embodiments, the multiple cutting wheels 211 in the wire cutting unit 21 are mounted on the cutting frame 20 via a bracket, connecting plate, or mounting frame. Here, the carrier provided by the wire cutting unit 21 for mounting the multiple cutting wheels 211 can be of different forms, and this application does not impose any restrictions.

[0184] In some examples, the wire cutting device is provided with multiple wire cutting units 21, and the different wire cutting units 21 are located on different straight lines. For example, the two wire cutting units 21 shown in Figure 2 are parallel to each other. In some examples, the extension directions of the different wire cutting units 21 may also intersect.

[0185] It should be noted that in various embodiments of the wire cutting device provided in this application, the first direction is the direction in which multiple cutting wheels are arranged in the wire cutting unit, such as the direction of the mounting beam of the wire cutting unit in some examples, and the wire saw formed by the cutting wire wrapped around the cutting wheel is also the first direction; the second direction is the orthogonal direction of the first direction, and the at least one adjusting mechanism drives the at least one wire cutting unit to move along the second direction, so that the wire saw in the wire cutting unit moves along its orthogonal direction.

[0186] It should be understood that the wire cutting device can perform cutting of the silicon rod based on the lifting and lowering movement of the wire cutting unit 21 along the cutting frame 20, while controlling the cutting specifications is achieved by adjusting the relative position between the wire saw and the silicon rod in the second direction. (Refer to the reference...) Figure 16 and Figure 17 When the silicon rod is placed on the silicon rod support structure and its position is fixed, the cutting wire saw can be moved along the second direction by the adjusting mechanism 23, so as to adjust the cutting position of at least one cutting wire saw in the at least one line cutting unit 21, which can be used to control the cutting amount of the silicon rod.

[0187] In some examples, the at least one line cutting unit further includes at least one transition wheel, each transition wheel having at least two wire grooves; wherein, when the plurality of cutting wheels in the at least one line cutting unit are driven to move along the second direction by the at least one adjusting mechanism, the at least one transition wheel in the at least one line cutting unit remains relatively stationary with respect to the plurality of cutting wheels.

[0188] In some implementation methods, please combine Figure 16 , Figure 17 Taking a wire cutting unit 21 in a wire cutting device as an example, the wire cutting unit 21 includes at least one transition wheel 212. The at least one transition wheel 212 is used to guide the direction or adjust the tension of the cutting wire 213 when it is wound around different cutting wheels 211. The at least one transition wheel 212 can be disposed on a carrier that supports multiple cutting wheels 211, such as... Figure 17 As shown in the mounting beam 214, the adjusting mechanism 23 can be used to drive the carrier to move along the second direction. At least one transition wheel 212 and multiple cutting wheels 211 move together with the carrier along the second direction. In this state, the at least one transition wheel 212 and multiple cutting wheels 211 are relatively stationary, that is, the positional relationship between the transition wheel 212 and the cutting wheels 211 remains unchanged. When the adjusting mechanism 23 is used to adjust the cutting position of at least one wire saw in the at least one wire cutting unit 21, the positional relationship of the wire saw relative to the cutting wheels 211 and the transition wheel 212 remains unchanged; that is, only movement along the second direction occurs, thus achieving the cutting position adjustment.

[0189] In some embodiments, multiple cutting wheels 211 belonging to the same wire cutting unit 21 are mounted on a mounting beam 214 arranged along a first direction, and at least one transition wheel 212 is mounted on the mounting beam 214 via a bracket. Here, the adjustment mechanism 23 may be configured to be connected to the mounting beam 214 to drive the multiple cutting wheels 211 carried by the mounting beam 214 to move along a second direction, and the bracket follows the movement of the mounting beam 214 and drives at least one transition wheel 212 to move along the second direction, so that at least one transition wheel 212 in the wire cutting unit 21 remains relatively stationary with respect to the multiple cutting wheels 211.

[0190] The at least one transition wheel 212 has at least two guide grooves. When the at least one adjusting mechanism 23 is used to change the position of the cutting wire groove of the cutting wire 213 wound around the plurality of cutting wheels 211 in the at least one line cutting unit 21, the position of the changing cutting wire 213 corresponding to the at least one transition wheel 212 on the guide groove is such that the cutting wire wound around the transition wheel and the guide wheel after the groove change is still located in a vertical plane. In actual scenarios, the commonly used winding method requires that the cutting wire between the transition wheel and the cutting wheel be located in a vertical plane. It should be understood that when the cutting wire groove used for winding the cutting wire and the guide groove are not in the same plane after the groove change, the cutting wire has a component force along the second direction on the transition wheel and the cutting wheel, which is not conducive to the efficient operation of the cutting wire. Here, setting the transition wheel 212 to have at least two guide grooves can be used to realize the direction adjustment of the cutting wire 213 after the groove change.

[0191] Each cutting wheel 211 has at least two cutting grooves, which are parallel to each other and the projection of the cutting groove plane on the horizontal plane is along a first direction. There is a cutting offset in a second direction between the different cutting grooves. When the cutting line 213 changes the position of the groove on the cutting wheel 211, the cutting line 213 has a displacement in the second direction relative to the cutting wheel 211. It should be understood that since the transition wheel 212 is relatively stationary with respect to the cutting wheel 211, in order for the cutting line 213 to remain in a vertical plane after changing the position of the groove on the cutting wheel 211, the position of the cutting line 213 around the groove of the transition wheel 212 also needs to be changed.

[0192] Each transition wheel 212 has at least two wire grooves, which are parallel to each other, and the projection of the plane containing the wire grooves onto the horizontal plane is along a first direction. There is a transition offset in a second direction between different wire grooves. Based on the at least two wire grooves, the wire grooves of the cutting line 213 in the transition wheel 212 can be changed so that the cutting wire saw wrapped around the transition wheel and the wire wheel after the groove change adjustment is still located in a plumb line.

[0193] In some implementations, the transition offset between adjacent wire grooves in the transition wheel 212 is equal to the cutting offset between adjacent cutting grooves in the cutting wheel 211, so as to facilitate the changing of the cutting line 213 according to a preset position. In this example, the cutting wheel 211 and the wire wheel in the wire cutting unit 21 can be configured in a one-to-one correspondence between the wire groove and the cutting groove (the correspondence means that the cutting groove and the wire groove are coplanar). The number of wire grooves in the transition wheel 212 can be equal to or different from the number of cutting wheels 211.

[0194] In different silicon rod processing equipment, the cutting wheel 211 and the transition wheel 212 in the wire cutting unit 21 can be set to different positional relationships and configured with different winding methods.

[0195] In some embodiments, multiple cutting wheels belonging to the same wire cutting unit are paired in pairs to form at least two cutting wheel groups. A transition wheel is also provided between adjacent cutting wheels in two adjacent cutting wheel groups. The transition wheel has at least two wire grooves. The cutting is sequentially wound around the cutting wheels and the transition wheel to form a wire saw between two cutting wheels in each cutting wheel group. The cutting wire passes through the cutting groove of the last cutting wheel in the preceding cutting wheel group and through the wire groove of the transition wheel before entering the cutting groove of the first cutting wheel in the following cutting wheel group. When the multiple cutting wheels in the at least one wire cutting unit are driven to move in a second direction by the at least one adjusting mechanism, the at least one transition wheel in the at least one wire cutting unit remains relatively stationary with respect to the multiple cutting wheels.

[0196] Please see Figure 18 and Figure 19 ,in Figure 18 The diagram shown is a schematic representation of the wire cutting apparatus of this application used in a silicon rod squaring device in one embodiment. Figure 19 The diagram shows a schematic representation of the wire cutting unit in one embodiment of the wire cutting device. As shown, the wire cutting unit in the wire cutting device has four cutting wheel sets. A transition wheel 212 is positioned between two adjacent cutting wheel sets. The cutting wire 213 is sequentially wound around the cutting wheel 211 and the transition wheel 212 to form a wire saw on the two cutting wheels 211 of each cutting wheel set. When the cutting wire 213 is wound around two adjacent cutting wheels 211 in two adjacent cutting wheel sets, it exits through the cutting groove of the last cutting wheel 211 in the preceding cutting wheel set, passes through the transition wheel 212, and then enters the cutting groove of the first cutting wheel 211 in the following cutting wheel set. Here, the same transition wheel 212 is shared between every two adjacent cutting wheel sets for guidance, which reduces the length of the cutting wire 213 used for tension adjustment and guidance, thereby increasing the proportion of the length of the cutting wire 213 used to form the cutting wire saw. This simplifies the winding method, improves the utilization rate of the cutting wire 213, and reduces production costs.

[0197] Please refer to the reference. Figure 18 , Figure 19 Each wire saw can cut silicon rods on a silicon rod support structure 11. It should be understood that by changing the spacing of the cutting wheels 211 in the first direction, any one wire saw can correspond to two, three, or four silicon rod support structures 11. Specifically, for example, the distance between the two cutting wheels 211 in each cutting wheel group in the first direction can be increased, or the spacing of the silicon rod support structures 11 in the first direction can be decreased, so that in the second direction, the two cutting wheels 211 in the cutting wheel group are located at the ends of two, three, or four silicon rod support structures 11 respectively. When the lifting device drives the wire cutting unit to move up and down, each wire saw can simultaneously cut the silicon rods placed on its corresponding multiple silicon rod support structures 11. In a specific embodiment, to prevent uneven tension in the cutting wire 213 due to excessively long wire saws, the number of silicon rod support structures 11 corresponding to each wire saw can be selected according to actual conditions to stabilize processing quality.

[0198] In some embodiments, multiple cutting wheels belonging to the same wire cutting unit include a first cutting wheel, a tail cutting wheel, and at least one intermediate cutting wheel located between the first and tail cutting wheels. A transition wheel is also provided beside the at least one intermediate cutting wheel. The transition wheel has at least two wire grooves. The cutting wire is sequentially wound around the cutting wheel and the transition wheel to form a wire saw on any two adjacent cutting wheels. When the cutting wire is wound around the intermediate cutting wheel, it exits through one of the at least two wire grooves on the intermediate cutting wheel and passes through the adjacent transition wheel before entering through another of the at least two wire grooves on the intermediate cutting wheel. This results in a cutting offset between any two adjacent wire saws in a second direction, the cutting offset corresponding to the distance between the two related wire grooves. When the multiple cutting wheels in the at least one wire cutting unit are moved along the second direction by the at least one adjusting mechanism, the at least one transition wheel in the at least one wire cutting unit remains relatively stationary with respect to the multiple cutting wheels.

[0199] Please see Figure 20 The diagram shows a schematic representation of an intermediate cutting wheel and a transition wheel disposed beside it in one embodiment of the wire cutting apparatus of this application. (In conjunction with...) Figure 17 and Figure 20 This example illustrates the winding method used in the wire cutting unit 21. When the cutting wire 213 winds around the cutting wheel assembly in the wire cutting unit 21, each intermediate cutting wheel 211 undergoes two windings, while the first and last cutting wheels 211 undergo at least one winding. When the cutting wire 213 winds around the intermediate cutting wheel 211, it passes through the first cutting groove 2111 of at least two cutting grooves on the intermediate cutting wheel 211 and passes through the side (in... Figure 20 In the illustrated embodiment, the transition wheel 212 (located on the upper side of the cutting wheel 211) is then penetrated by the second cutting groove 2112 of at least two cutting grooves on the intermediate cutting wheel 211, thereby creating a cutting offset between any two adjacent cutting grooves in a first direction, the cutting offset corresponding to the distance between the first cutting groove 2111 and the second cutting groove 2112.

[0200] In some implementations, for each intermediate cutting wheel and a transition wheel located beside it, the line connecting the axis of the transition wheel and the axis of the cutting wheel is parallel to the plumb line. In this case, the cutting lines on both sides of the transition wheel are of equal or approximately equal length, and the stress state during the cutting process is approximately the same. This helps to prevent the cutting lines on both sides of the transition wheel from being subjected to excessive local or unilateral stress or insufficient tension.

[0201] In one example, such as Figure 20As shown, here, the transition wheel 212 is positioned directly above the cutting wheel. The cutting line 213 passes through the first cutting groove 2111 of the cutting wheel 211, is guided by the transition wheel 212, and then winds around to the second cutting groove 2112 of the cutting wheel 211. The projections of the cutting lines 213 on both sides of the transition wheel 212 onto the plane in the direction of the plumb bob are line segments of equal length. In this example, the formed cutting saw is the tangent below the cutting groove of the cutting wheel 211.

[0202] In another example, the transition wheel can also be positioned directly below the cutting wheel, meaning the axis connecting the transition wheel and the cutting wheel is a perpendicular line. The cutting line winds downward from the first cutting groove of the cutting wheel to the transition wheel, and is guided upward by the transition wheel to pass through the second cutting groove of the cutting wheel. In this example, the resulting cutting line saw is a tangent line above the cutting groove of the cutting wheel.

[0203] It should be understood that the "side" is mainly used to determine the correspondence between the intermediate cutting wheel and the transition wheel, and is not a specific position or orientation. For example, the "side" can also be the left, right, upper, lower, or oblique side of the cutting wheel, etc., and this application does not impose any restrictions. Specifically, the arrangement of the multiple cutting wheels, the intermediate cutting wheel, and the cutting lines in the wire cutting unit can adopt the method described in Chinese patent application CN2020204403178 (Invention Title: Silicon Rod Squaring Equipment).

[0204] In the aforementioned examples, although the relative positional relationship between the cutting wheel and the transition wheel, as well as the winding method of the cutting wire, are different, multiple cutting wheels in the wire cutting unit can move along the second direction under the action of the at least one adjusting mechanism to realize the adjustment of the cutting position of the wire saw or the changing of the groove.

[0205] Please continue reading. Figure 16 As explained in the preceding examples, each cutting wheel 211 belonging to the same wire cutting unit can move along the second direction under the drive of the adjusting mechanism 23. Therefore, the cutting wire saw formed between the cutting wheels 211 can move in the second direction to adjust the cutting position of the cutting wire saw. When the wire cutting unit also includes a transition wheel 212, when the at least one adjusting mechanism 23 drives multiple cutting wheels 211 in the at least one wire cutting unit to move along the second direction, the transition wheel 212 remains relatively stationary with the cutting wheels 211, and the corresponding cutting wire saw can move in the second direction to adjust the cutting position of the cutting wire saw.

[0206] When the at least one adjusting mechanism 23 is used to change the cutting groove of the cutting wire around the multiple cutting wheels 211 in the at least one wire cutting unit 21, in a practical scenario, the cutting grooves corresponding to the cutting wire before and after the groove change can be predetermined. For example, before the groove change, the cutting wire is located in cutting groove a1, and after the groove change, the cutting wire is wrapped around cutting groove a2. Based on the cutting offset between cutting groove a1 and cutting groove a2, the displacement of the multiple cutting wheels 211 in the wire cutting unit driven by the at least one adjusting mechanism 23 in the second direction is determined, that is, the displacement... The cutting offset between cutting groove a1 and cutting groove a2 can be set to realize the replacement of cutting groove a1 to cutting groove a2 for the cutting wire. It should be noted that the direction in which the multiple cutting wheels 211 in the wire cutting unit driven by the at least one adjusting mechanism 23 move in the second direction is the direction from cutting groove a2 to cutting groove a1. After the groove is changed, the cutting position of the cutting wire saw in space remains unchanged, thus eliminating the need for further calibration of the cutting wheel 211 or other component positions. The silicon rod can be cut according to the preset cutting amount, which simplifies the groove changing process.

[0207] To further illustrate how the at least one adjusting mechanism enables the movement of multiple cutting wheels in the wire cutting unit along the second direction, this application provides the following embodiments. In some examples, the specific form of the at least one adjusting mechanism can vary depending on the number of wire cutting units in the wire cutting process.

[0208] In one embodiment, the wire cutting device includes a single-wire cutting unit; the pitch adjustment mechanism includes: a lead screw, which is arranged along a second direction and threadedly connected to the single-wire cutting unit; and a drive source for driving the lead screw to rotate.

[0209] Here, the single-wire cutting unit is a wire cutting unit. The single-wire cutting unit in the wire cutting device includes multiple cutting wheels arranged along a first direction. The cutting wire is wound around the multiple cutting wheels to form at least one wire saw, and the at least one wire saw is along the same straight line direction. The lead screw of the adjusting mechanism has a distal end and a proximal end. In a specific implementation, for example, the proximal end of the lead screw can be connected to a drive source and rotated under the drive source's drive. The distal end of the lead screw is threaded to the single-wire cutting unit. Through the connection method at both ends of the lead screw, the lead screw can rotate based on the drive source transmission, and the rotation of the lead screw can be converted into axial displacement through the threaded connection. The direction of the axial displacement is the setting direction of the lead screw, i.e., the second direction. By driving the lead screw to rotate through the drive source in the adjusting mechanism, the single-wire cutting unit can be displaced in the second direction. Different rotation directions of the driven lead screw can achieve forward or backward displacement of the single-wire cutting unit in the second direction.

[0210] In another embodiment, the wire cutting device includes a single-wire cutting unit; the adjustment mechanism includes: a telescopic member, arranged along a second direction and associated with the single-wire cutting unit; and a drive source for driving the telescopic member to extend or retract along the second direction. Here, the telescopic member can be configured as a rod structure with the rod extending in the second direction. Driven by the drive source, the telescopic member can extend or retract along its extension direction. One end of the telescopic member can be connected to the drive source, and the extendable free end is associated with the single-wire cutting unit, thus driving the single-wire cutting unit to move in the second direction under the action of the drive source. The telescopic member can be, for example, an electric telescopic rod, or a connecting rod connected to a cylinder cone rod, where the cylinder can serve as the drive source; this application does not impose limitations. The telescopic rod can be connected to the single-wire cutting unit in a straight line or indirectly. For example, it can be directly connected to the mounting beam of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or bearing. It should be understood that the extension or retraction of the telescopic member corresponds to the forward or backward movement of the single-wire cutting unit along the second direction.

[0211] In the embodiments provided in this application, the association can be achieved by one or more of snap-fit, screw-lock, bonding, and welding. For example, in the above embodiments, the telescopic rod can be associated with the wire cutting unit by one or more of snap-fit, screw-lock, bonding, and welding. Of course, the method of association is not limited to this, but is intended to achieve transmission in the second direction.

[0212] In another embodiment, the wire cutting device includes a single-wire cutting unit; the pitch adjustment mechanism includes: a rack disposed in the single-wire cutting unit along a second direction; a transmission gear meshing with the rack; and a drive source for driving the transmission gear to rotate. The transmission gear rotates under the drive source, and the rack meshing with the transmission gear moves accordingly along the rack's direction. In this example, by cooperating with the transmission gear, the rotational motion driven by the drive source can be converted into wire transport along the rack direction. The rack, disposed in the single-wire cutting unit along the second direction, can drive the single-wire cutting unit to move along the second direction. Simultaneously, by controlling the rotation direction of the transmission gear by the drive source, the single-wire cutting unit can switch between forward and backward displacement directions along the second direction.

[0213] In the foregoing embodiments, the adjusting mechanism can be configured as one or more. For example, when the span of the single-wire cutting unit in the first direction is large, and it is difficult to drive multiple cutting wheels in the single-wire cutting unit to move in the second direction by setting one adjusting mechanism, multiple adjusting mechanisms can be set for driving. For example, adjusting structures can be set at both ends of the single-wire cutting unit in the first direction, or multiple adjusting mechanisms can be set at equal intervals in the first direction. Here, the multiple adjusting mechanisms corresponding to the single-wire cutting unit can work together to ensure that the multiple adjusting mechanisms drive the multiple wire cutting wheels of the single-wire cutting unit to move in the second direction with the same displacement (magnitude and direction).

[0214] In one embodiment, the wire cutting device includes a first wire cutting unit and a second wire cutting unit disposed opposite to each other along a second direction. At least one of the first wire cutting unit and the second wire cutting unit is driven to move along the second direction by the at least one adjusting mechanism, for adjusting the wire cutting saw spacing between at least one wire saw in the first wire cutting unit and at least one wire saw in the second wire cutting unit, or changing the cutting wire grooves of the multiple cutting wheels in the first wire cutting unit and / or the multiple cutting wheels in the second wire cutting unit.

[0215] In some embodiments, the wire cutting apparatus includes two wire cutting units, such as a first wire cutting unit and a second wire cutting unit, for example... Figure 16 In the illustrated embodiment, the first wire cutting unit 21a and the second wire cutting unit 21b are arranged parallel to each other along a first direction, and the wire saws in the first wire cutting unit 21a and the second wire cutting unit 21b are also parallel. In practical scenarios, the wire cutting device can be used, for example, in a silicon rod squaring device. In the silicon rod squaring device, each silicon rod on the silicon rod support structure corresponds to the wire saws of the first and second cutting units in the cutting area. Thus, a single lifting and cutting operation can form two parallel cut surfaces on the surface of the silicon rod. Here, by adjusting the distance between the first wire cutting unit 21a and the second wire cutting unit 21b in the second direction, the cutting amount of the silicon rod can be controlled.

[0216] The at least one adjusting mechanism 23 can be configured to be connected to the first wire cutting unit 21a or the second wire cutting unit 21b, or simultaneously associated with the first wire cutting unit 21a and the second wire cutting unit 21b, so as to drive the plurality of cutting wheels 211 in the connected or associated first wire cutting unit 21a or / and second wire cutting unit 21b to move along the second direction, and realize the adjustment of the cutting position of at least one wire saw in the connected or associated first wire cutting unit 21a or / and second wire cutting unit 21b, or change the cutting groove of the plurality of cutting wheels 211 in the connected or associated first wire cutting unit 21a or / and second wire cutting unit 21b.

[0217] In one embodiment, the adjusting mechanism includes: a lead screw, disposed along a second direction and threadedly connected to the first wire cutting unit or the second wire cutting unit; and a drive source for driving the lead screw to rotate. The manner in which the lead screw and drive source drive multiple cutting wheels in the first or second wire cutting unit to move in the second direction is similar to the aforementioned embodiment. The first or second wire cutting unit driven by the adjusting mechanism can be considered a single wire cutting unit, which will not be elaborated here. It should be understood that by providing the adjusting mechanism on any wire cutting unit, the spacing between the parallel cutting wire saws formed between the first and second wire cutting units can be increased or decreased, allowing the wire cutting device to cut silicon rods into different specifications.

[0218] In another embodiment, the adjusting mechanism includes: a telescopic member, disposed along a second direction and associated with the first wire cutting unit or the second wire cutting unit; and a driving source for driving the telescopic member to extend or retract along the second direction. Here, the first cutting unit or the second wire cutting unit equipped with the adjusting mechanism can be considered a single-wire cutting unit, and its specific implementation can be referred to the foregoing embodiments, which will not be repeated here.

[0219] In another embodiment, the pitch adjustment mechanism includes: a rack along a second direction and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear meshing with the rack; and a drive source for driving the transmission gear to rotate. Through the meshing transmission gear and rack, the drive source can control the rack to move along the rack direction line, and the first or second wire cutting unit associated with the rack can drive multiple cutting wheels to move along the second direction via the rack.

[0220] In one embodiment, the adjusting mechanism includes: a bidirectional lead screw, disposed along a second direction and threadedly connected to the first wire cutting unit and the second wire cutting unit; and a drive source for driving the lead screw to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or away from each other along the second direction. In one embodiment, it is presented as follows: Figure 16 In the illustrated embodiment, the bidirectional lead screw 231 is a double-threaded lead screw. Both ends of the bidirectional lead screw 231 are respectively threaded with opposite directions. The drive source 232 can be located at either end of the bidirectional lead screw 231 to drive it to rotate along its axis. Due to the opposite directions of the threads at both ends of the bidirectional lead screw 231, the motion at both ends of the bidirectional lead screw 231 is converted into opposite axial linear motion when driven by the drive source 232. This axial direction is the second direction of the bidirectional lead screw 231. Under the drive of the drive source 232, the first wire cutting unit 21a and the second wire cutting unit 21b can move towards each other or away from each other.

[0221] In one embodiment, the pitch adjustment mechanism includes: a first rack along a second direction and associated with the first wire cutting unit; a second rack along a second direction and associated with the second wire cutting unit; a transmission gear meshing with the first rack and the second rack; and a drive source for driving the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move toward each other or away from each other along the second direction.

[0222] In this embodiment, the first rack is linked to the first wire cutting unit, and the second rack is linked to the second wire cutting unit. The transmission gear is connected to the power output shaft of a drive source, such as a servo motor, and meshes with the first and second racks. It is used to drive the first and second wire cutting units to move towards each other to perform a closing action when rotating in the forward direction, and to drive the first and second wire cutting units to move away from each other when rotating in the reverse direction. The first and second racks can mesh on opposite sides of the transmission gear, so that when the transmission gear rotates, the linear velocities of the first and second racks are in opposite directions. The drive motor drives the transmission gear to rotate, causing the first and second racks to move towards each other when the transmission gear rotates in the forward direction, thus driving the first and second wire cutting units to move towards each other. When the transmission gear is driven to rotate in the reverse direction, the first and second racks move away from each other, thus driving the first and second wire cutting units to move away from each other. Here, the transmission gear can be axially connected to the power output shaft of the drive source, or indirectly connected to the power output shaft, for example, axially connected to a rotating part connected to the power output shaft.

[0223] Here, the wire cutting device can be equipped with one or more adjustment mechanisms. Each adjustment mechanism is connected to the first wire cutting unit and the second wire cutting unit. The number of adjustment mechanisms can be determined comprehensively based on factors such as the driving power requirements, the screw force, the smoothness of the movement of multiple cutting wheels in the wire cutting unit, and the equipment space of the wire cutting device. For example, when the span between the first wire cutting unit and the second wire cutting unit in the first direction is small, only one adjustment mechanism is needed to adjust the cutting position of the wire saw in the cutting unit or change the cutting wire groove. In this case, one adjustment mechanism can be set in the wire cutting device to drive the wire cutting unit. The first wire cutting unit and the second wire cutting unit move towards each other or away from each other along the second direction. For example, when the span between the first wire cutting unit and the second wire cutting unit in the first direction is long, the wire cutting unit requires a large amount of power to drive it, and the power must be within the strength range of the transmission connection components such as lead screws or racks. In this case, the wire cutting device can be equipped with multiple adjusting mechanisms. The multiple adjusting mechanisms work together to ensure that the multiple adjusting mechanisms drive the multiple wire cutting wheels of the first wire cutting unit and the second wire cutting unit to move towards each other or away from each other in the second direction with the same amount of displacement (magnitude and direction).

[0224] In some embodiments, the adjustment mechanism is a servo motor mounted on the at least one wire cutting unit. In practical scenarios, a servo motor is mounted on at least one wire cutting unit or each wire cutting unit of the wire cutting device, and the servo motor controls the displacement of the corresponding wire cutting unit in the second direction. The wire cutting unit can be driven by a predetermined cutting offset for slotting or an adjustment amount for changing the cutting position of the cutting line, and the servo motor's precise positioning function drives multiple cutting wheels in the wire cutting unit to move along the second direction by a preset displacement. For example, the wire cutting device includes a single wire cutting unit, and the single wire cutting unit is equipped with a servo motor to drive the single wire cutting unit to move along the second direction; or, for example, the wire cutting device includes a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit and / or the second wire cutting unit move relatively independently along the second direction under the drive of their corresponding servo motors. In some examples, the servo motor can also be replaced by a travel motor and a travel screw, and the wire cutting unit can be driven by the travel motor to move along the second direction on the wire cutting support.

[0225] The wire cutting device for silicon rod processing equipment provided in this application includes at least one adjusting mechanism disposed on at least one wire cutting unit. Under the action of the adjusting mechanism, multiple cutting wheels of at least one wire cutting unit in the wire cutting device can be driven to move along a second direction. At least one wire saw formed around the multiple cutting wheels can thus change its cutting position in the second direction under the action of the adjusting mechanism. Alternatively, based on the movement of the multiple cutting wheels in the second direction, the position of the groove of the cutting wire around the multiple cutting wheels can be changed. The process of changing the position of the cutting wire or changing the groove based on the adjusting mechanism is simple, easy to implement and convenient to operate, which is conducive to improving operating efficiency.

[0226] In another aspect, this application also provides a silicon rod processing apparatus, including a base, a silicon rod support structure, and a wire cutting device. The base has a silicon rod processing platform; the silicon rod support structure is disposed on the silicon rod processing platform for supporting the silicon rod to be cut; the wire cutting device includes a cutting frame disposed on the base; at least one wire cutting unit is movably disposed on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged sequentially along a first direction, each cutting wheel having at least two cutting grooves; a cutting wire, sequentially wound around the plurality of cutting wheels to form at least one wire saw; and at least one adjusting mechanism disposed on the at least one wire cutting unit for driving the plurality of cutting wheels in the at least one wire cutting unit to move along a second direction, thereby adjusting the cutting position of the at least one wire saw in the at least one wire cutting unit, or changing the cutting grooves around the plurality of cutting wheels in the at least one wire cutting unit.

[0227] In some embodiments, the silicon rod processing equipment is a silicon rod squaring device, and the silicon rod supporting device is a silicon rod supporting structure.

[0228] Here, the silicon rod processing platform may be provided with one or more silicon rod support structures, each of which can be used to support a single silicon rod. Correspondingly, the number of silicon rod support structures in the cutting area of ​​the silicon rod processing platform can correspond to the number of wire saws in the wire cutting unit of the wire cutting device, for example... Figure 17 or Figure 18 In the embodiment shown, the cutting area of ​​the silicon rod processing platform is provided with multiple silicon rod support structures 11, and the wire cutting unit 21 in the wire cutting device includes multiple cutting wire saws to correspond to the multiple silicon rod support structures 11 respectively.

[0229] by Figure 17 The silicon rod processing equipment described in the illustrated embodiment is a silicon rod squaring equipment. In some embodiments, the silicon rod processing platform is located on the machine base 10 via a worktable conversion mechanism. Here, the worktable conversion mechanism may be, for example, a rotation mechanism or a translation mechanism.

[0230] The rotating mechanism may include, for example, a rotating shaft and a rotating drive unit. The rotating shaft is connected to the silicon rod processing platform, and the rotating drive unit drives the rotating shaft to rotate, thereby causing the silicon rod processing platform to rotate.

[0231] The translation mechanism may include, for example, a translation guide rail, a slider, and a translation drive unit. The translation guide rail is laid on the machine base, the slider is located at the bottom of the silicon rod processing platform and adapted to the translation guide rail to provide translation guidance for the silicon rod processing platform, and the translation drive unit is used to drive the silicon rod processing platform to move along the translation guide rail so that the silicon rod support structure located on the silicon rod processing platform switches between the cutting area and the loading / unloading area. The translation drive unit may be a cylinder assembly or a lead screw assembly driven by a motor. In other embodiments, the translation mechanism may also employ gear transmission. Specifically, the translation mechanism includes a translation rack and a rotating gear driven by a motor and adapted to the translation rack. The translation rack is located at the bottom of the silicon rod processing platform and may be, for example, at least one rack with a certain length. To ensure smooth movement of the silicon rod processing platform, each rack is adapted to at least two spaced rotating gears. The motor drives the rotating gears to rotate, thereby moving the silicon rod processing platform and causing the silicon rod support structure located on the silicon rod processing platform to switch between the cutting area and the loading / unloading area.

[0232] In some examples, when the worktable conversion mechanism is a translation mechanism, the position of the silicon rod carried by the silicon rod support structure in the second direction can be controlled by the translation mechanism. The cutting amount of the silicon rod can be determined by the silicon rod position determined by the translation mechanism and the cutting wire saw position determined by the wire cutting device adjustment mechanism. For example, when the wire cutting device is provided with a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or the second wire cutting unit is provided with the adjustment mechanism, after the adjustment mechanism adjusts the cutting position of at least one wire cutting saw in the first wire cutting unit or the second wire cutting unit, the translation mechanism can adjust the position of the silicon rod so that the silicon rod axis is located on the line of symmetry of the cutting wire saws of the first wire cutting unit and the second wire cutting unit. Since the cross-section of the silicon rod is usually circular, if the distance from the cutting wire saws of the first wire cutting unit and the second wire cutting unit to the center of the silicon rod cross-section is equal, the specifications of the two opposite cut surfaces formed on the surface of the silicon rod after cutting are approximately the same.

[0233] The silicon rod squaring equipment can be, for example, Figure 17 or Figure 18 The silicon rod squaring device of the illustrated embodiment can, of course, be other types of silicon rod squaring devices. For example, the wire cutting device in the silicon rod squaring device can be configured as a single wire cutting unit; or, for example, the wire saw in the wire cutting unit of the wire cutting device of the silicon rod squaring device is a single segment, but of course, the wire saw can also be two, three, four, etc., and this application does not impose any restrictions. Correspondingly, the number of silicon rod support structures on the silicon rod processing platform can be changed accordingly; or, for example, the number of silicon rod support structures corresponding to each wire saw in the wire cutting unit of the silicon rod squaring device can be one, two, three, etc.

[0234] It should be understood that when the silicon rod squaring equipment is equipped with such Figures 16 to 20 In any one of the embodiments shown, the wire cutting device can adjust the cutting position of the wire saw based on the at least one adjusting mechanism to determine the cutting amount of the silicon rod during the squaring cutting process. Alternatively, after the groove of the cutting wheel of the silicon rod squaring device is worn during long-term cutting operations, the groove position of the cutting line can be changed based on the at least one adjusting mechanism to ensure the processing accuracy of the silicon rod squaring device in continuing the squaring operation.

[0235] In some embodiments, when the silicon rod processing equipment is a silicon rod cutting machine, the silicon rod cutting machine includes a base, a silicon rod carrying device, and a wire cutting device.

[0236] The machine base includes a silicon rod processing platform, and the silicon rod carrying device is mounted on the silicon rod processing platform. Here, the silicon rod carrying device can be used, for example, to horizontally carry the silicon rod to be cut. The wire cutting device includes a cutting frame mounted on the machine base; at least one wire cutting unit movably mounted on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged sequentially along a first direction, each cutting wheel having at least two cutting grooves; a cutting wire sequentially wound around the plurality of cutting wheels to form at least one wire saw; and at least one adjusting mechanism mounted on the at least one wire cutting unit, used to drive the plurality of cutting wheels in the at least one wire cutting unit to move along a second direction, thereby adjusting the cutting position of the at least one wire saw in the at least one wire cutting unit, or changing the cutting grooves around the plurality of cutting wheels in the at least one wire cutting unit. The wire cutting unit in the wire cutting device can achieve the feeding and cutting of the silicon rod to be cut by moving the wire cutting unit relative to the cutting frame.

[0237] In some examples, the wire cutting device of the silicon rod cutting machine has multiple parallel wire cutting units. These multiple parallel wire cutting units move up and down along the cutting frame, allowing the silicon rod to be cut into multiple silicon rod segments in a single cut. By adjusting the cutting position of at least one cutting wire saw in the wire cutting unit in a second direction based on at least one adjusting mechanism of the wire cutting device, the silicon rod to be cut can be cut into silicon rod segments of different lengths. In one implementation, the arrangement of the wire cutting device of the silicon rod cutting machine and the form of the silicon rod carrying device can refer to the arrangement disclosed in Chinese Patent CN105196433B. Of course, the wire cutting device of the silicon rod cutting machine includes the at least one adjusting mechanism to adjust the cutting position of at least one cutting wire saw in at least one wire cutting unit of the silicon rod cutting machine, or to change the cutting wire grooves around the multiple cutting wheels in the at least one wire cutting unit.

[0238] In some examples, the silicon rod cutting machine is, for instance, a dual silicon rod cutting device. Here, the silicon rod carrying device of the silicon rod cutting machine has a first processing station and a second processing station, respectively corresponding to carrying the first silicon rod to be cut and the second silicon rod to be cut. See also... Figure 21The diagram shows a schematic representation of the wire cutting device of the silicon rod cutting machine in one embodiment. In this example, the wire cutting support 24 is mounted on the cutting frame 20. At least one wire cutting unit 21 is provided on each side of the wire cutting support 24 along a first direction. The at least one wire cutting unit 21 located on both sides of the wire cutting support 24 can cut the silicon rod to be cut at the first processing station and the second processing station, respectively. Each wire cutting unit 21 has multiple cutting wheels 211 and cutting wires 213 wound around the cutting wheels 211. In some examples, the wire cutting unit 21 also has a transition wheel 212. The cutting wheels 211 have at least two cutting grooves, and the transition wheel 212 has at least two wire grooves. Here, each side of the wire cutting support 24 also includes the at least one adjusting mechanism (not shown in the figure). The adjusting mechanism can be configured, for example, as shown in the figure. Figures 16 to 20 The adjusting mechanism described in any implementation of the illustrated embodiment may be connected to the first or second wire cutting unit via a lead screw, or connected to both the first and second wire cutting units via a bidirectional lead screw, or may be a servo motor, etc., and will not be elaborated further here. Thus, using the adjusting mechanism, the cutting position of at least one wire saw in the at least one wire cutting unit 21 can be adjusted, or the cutting wire 213 can be changed around the cutting grooves of the plurality of cutting wheels 211 in the at least one wire cutting unit 21.

[0239] When the adjusting mechanism is used to adjust the position of at least one wire saw or to change the cutting groove of the cutting wire 213 wound around the cutting wheel 211, the transition wheel 212 in the wire cutting unit 21 remains relatively stationary with respect to the cutting wheel 211. Specifically, when the adjusting mechanism is used to adjust the position of the wire saw, it can, for example, drive both the cutting wheel 211 and the transition wheel 212 on the wire cutting unit 21 to move along the second direction. The positional relationship of the wire saw relative to the cutting wheel 211 and the transition wheel 212 remains unchanged; that is, only movement along the second direction is required to adjust the cutting position. When the adjusting mechanism is used to change the position of the groove of the cutting wire 213 wound around the cutting wheel 211, the position of the guide groove in the transition wheel 212 used for winding the cutting wire 213 also changes accordingly, ensuring that after the cutting wire 213 is changed, the guide groove used for winding the cutting wire 213 and the cutting groove remain in the same plane.

[0240] In some embodiments, the wire cutting units 21 on both sides of the wire cutting support 24 can also form at least one pair of wire cutting units 21. For example, the wire cutting units 21 on both sides of the wire cutting support 24 can be connected one-to-one to form at least one pair of wire cutting units 21. The pair of wire cutting units 21 are located on the same straight line in the first direction. In this example, multiple cutting wheels 211 in the pair of wire cutting units 21 can be driven to move in the second direction based on the same adjustment mechanism. Of course, the pair of wire cutting units 21 can also be driven by multiple adjustment mechanisms in a coordinated manner.

[0241] Of course, the specific form of the silicon rod cutting machine is not limited to the aforementioned embodiments. For example, based on the relationship between the placement position of the silicon rod on the silicon rod support device and the position of the cutting wire saw, each cutting wire saw in the silicon rod cutting machine can cut multiple silicon rods simultaneously. Or, the wire cutting device of the silicon rod cutting machine includes only one cutting wire saw, which is used to cut one or more silicon rods in one cutting operation, dividing the silicon rod into a silicon rod segment. This application does not impose any limitations. It should be noted that the wire cutting device of the silicon rod cutting machine includes at least one pitch adjustment mechanism, which can be used to drive multiple cutting wheels in at least one line cutting unit of the wire cutting device to move along a second direction, so as to adjust the cutting position of at least one line cutting wire saw in the at least one line cutting unit, or change the cutting wire groove around the multiple cutting wheels in the at least one line cutting unit.

[0242] In some embodiments, the silicon rod processing equipment is a silicon rod cutting and grinding integrated machine. Here, the silicon rod cutting and grinding integrated machine includes a base, a silicon rod support device, a wire cutting device, and a grinding device.

[0243] The machine base includes a silicon rod processing platform. In the integrated silicon rod cutting and grinding machine, the silicon rod processing platform can be configured as a processing area to perform different processing functions, such as consisting of a cutting station and a grinding station. The silicon rod carrying device is used to carry the silicon rod to be processed. The wire cutting device includes a cutting frame disposed on the machine base; at least one wire cutting unit movably disposed on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged sequentially along a first direction, each cutting wheel having at least two cutting grooves; a cutting wire, sequentially wound around the plurality of cutting wheels to form at least one wire saw; at least one adjusting mechanism disposed on the at least one wire cutting unit, used to drive the plurality of cutting wheels in the at least one wire cutting unit to move along a second direction, so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or change the cutting grooves around the plurality of cutting wheels in the at least one wire cutting unit.

[0244] Please see Figure 22 The image shows a schematic diagram of the silicon rod slicing and grinding machine of this application in one embodiment. In this example, as... Figure 22 As shown, the silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform; a wire cutting device, disposed on the base, for cutting silicon rods on the first processing area of ​​the silicon rod processing platform in a first direction and cutting silicon rods on the second processing area of ​​the silicon rod processing platform in a second direction to form square silicon rods; a grinding device, disposed on the base, for grinding and chamfering the square silicon rods on the third processing area of ​​the silicon rod processing platform; and a silicon rod conversion device, disposed on the silicon rod processing platform, for converting the silicon rods on the first, second, and third processing areas.

[0245] Here, the wire cutting device includes: a cutting frame 20, a wire cutting support 24, a first cutting unit group, and a second cutting unit group, wherein the first cutting unit group and the second cutting unit group are used to cut silicon rods on the first processing area and the second processing area, respectively.

[0246] In this embodiment, the wire EDM support 24 can be configured with both a first cutting unit group and a second cutting unit group, meaning that the first and second cutting unit groups share the wire EDM support 24. Therefore, in this embodiment, on one hand, the cutting frame 20 and the wire EDM support 24 in the wire EDM apparatus are positioned centrally between the first and second processing areas. On the other hand, the wire EDM support 24 is specially designed. For example... Figure 22 As shown, the wire cutting support 24 in this embodiment may include a support body and a first support wing and a second support wing located on opposite sides of the support body. In some embodiments, the support body of the wire cutting support 24 is arranged at a 45° angle to the X-axis or Y-axis, the first support wing forms a 145° angle with the support body and is arranged along the Y-axis, and the second support wing forms a 145° angle with the support body and is arranged along the X-axis.

[0247] In some embodiments, the first cutting unit group may include at least four first cutting wheels 211a. These four first cutting wheels 211a can be combined into a pair of first cutting wheel groups. That is, two first cutting wheels 211a arranged opposite each other along the X-axis form a first cutting wheel group, and two first cutting wheel groups arranged along the Y-axis form a pair of first cutting wheel groups, thus forming two parallel wire cutting units 21 arranged along the X-direction. The cutting wire 213 is sequentially wound around each of the first cutting wheel groups in the first cutting unit group to form a cutting wire mesh. In practical applications, the cutting wire 213 is sequentially wound around the four first cutting wheels 211a in the first cutting unit group to form two cutting wire saws. These two cutting wire saws are arranged along the X-axis and are parallel to each other, forming a cutting wire mesh. Specifically, the cutting wire 213 is wound around two first cutting wheels 211a arranged along the X-axis in one first cutting wheel set to form a cutting wire saw. The cutting wire 213 is then wound around two first cutting wheels 211a arranged along the X-axis in another first cutting wheel set to form another cutting wire saw. In this way, these two parallel cutting wire saws cooperate to form a first cutting wire mesh in an "=" shape along the X-axis.

[0248] Similarly, the second cutting unit group may include at least four second cutting wheels 211b. Two second cutting wheels 211b arranged opposite each other along the Y-axis form a second cutting wheel group, and two second cutting wheel groups along the X-axis form a pair of second cutting wheel groups, that is, forming two parallel wire cutting units 21 arranged along the Y direction. In practical applications, the cutting line 213 is sequentially wound around the four second cutting wheels 211b in the second cutting unit group to form two cutting wire saws. These two cutting wire saws are arranged along the Y-axis and are parallel to each other. The two parallel cutting wire saws cooperate to form a second cutting wire mesh in the Y-axis direction in the shape of "=".

[0249] In some examples, the silicon rod conversion device is located in the central area of ​​the silicon rod processing platform, used to convert the silicon rod between the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform. In one embodiment, the silicon rod conversion device is rotatably mounted on the silicon rod processing platform, and the silicon rod conversion device may further include: a conveying body, which is disc-shaped, square-shaped, or other similar; a silicon rod positioning mechanism (i.e., a silicon rod carrying device) disposed on the conveying body, used to position the silicon rod; and a conversion drive mechanism, used to drive the conveying body to rotate so as to move the silicon rod positioned by the silicon rod positioning mechanism to a conversion position. In some examples, the silicon rod positioning mechanism further includes a rotating structure, used to drive the silicon rod carried on the silicon rod positioning mechanism to rotate along the silicon rod axis to adjust the cutting surface of the silicon rod.

[0250] Here, after the silicon rod to be cut is placed and positioned on the silicon rod positioning mechanism, the silicon rod to be cut is cut at the first processing area by the first cutting wire mesh in the X-axis direction in an "=" shape in the wire cutting device to form two axial sections in the X-axis direction; then, the conversion drive mechanism drives the conveying body to move the silicon rod positioning mechanism to position the silicon rod to the second processing area, where it is cut by the second cutting wire mesh in the Y-axis direction in an "=" shape in the wire cutting device to form two axial sections in the Y-axis direction, that is, to form a cut silicon rod with a rectangular cross-section; the cut silicon rod can also be converted to the third processing area for subsequent grinding operations.

[0251] In the aforementioned examples of the silicon rod cutting and grinding integrated machine, the wire cutting device further includes at least one adjusting mechanism (not shown in the figure). In one specific embodiment, the first cutting unit group at the first processing area and the second cutting unit group at the second processing area include at least one adjusting mechanism, which is disposed on at least one line cutting unit in the corresponding cutting unit group and is used to drive multiple cutting wheels in the cutting wheel group of the at least one line cutting unit to move along the second direction.

[0252] Here, the first and second directions are defined based on the carrier coordinate system of the wire cutting unit. Therefore, when the directions of multiple wire cutting units in a silicon rod processing device (in this example, a silicon rod cutting and grinding integrated machine) are different, the first directions corresponding to the multiple wire cuts are not the same in external space. Correspondingly, the second direction is orthogonal to the first direction. Therefore, the driving movement direction executed by the at least one adjusting mechanism is orthogonal to the driven wire cutting unit. For example, in the first cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the X-axis direction, and the first direction in the first cutting unit group is the X-axis direction, and the second direction is the Y-axis direction; in the second cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the Y-axis direction, and the first direction in the second cutting unit group is the Y-axis direction, and the second direction is the X-axis direction.

[0253] Taking the first cutting unit group as an example, it includes two wire cutting units. The distance adjustment mechanism can be associated with either the first or second wire cutting unit of the two wire cutting units, or simultaneously with both the first and second wire cutting units. The distance adjustment mechanism can be configured as follows: Figures 16 to 20 The pitch adjustment mechanism described in any implementation of the illustrated embodiment may be connected to the first wire cutting unit or the second wire cutting unit via a lead screw, or connected to both the first and second wire cutting units via a bidirectional lead screw, or may be a servo motor, etc., which will not be elaborated here.

[0254] In the first cutting unit group, when the at least one adjusting mechanism drives the plurality of cutting wheels in the first wire cutting unit and / or the second wire cutting unit to move along the second direction, the first wire cutting unit and / or the second wire cutting unit may, for example, move along the side wing of the first support, that is, move along the second direction (Y-axis direction) in the first cutting unit group; it can be used to adjust the cutting position of at least one wire saw in the first wire cutting unit and / or the second wire cutting unit, or change the cutting wire grooves around the plurality of cutting wheels in the first wire cutting unit and / or the second wire cutting unit.

[0255] The second cutting unit group has a similar structure to the first cutting unit group, the main difference being the different arrangement position and direction in the silicon rod cutting and grinding integrated machine; however, in the second cutting unit group, the structure and function of the at least one adjusting mechanism used to drive the multiple cutting wheels in the first wire cutting unit or / and the second wire cutting unit to move along the second direction are similar to those in the first cutting unit group, and will not be described again here.

[0256] It should be understood that, in some embodiments, the positional relationship between the first processing area and the second processing area can be changed. For example, the first processing area and the second processing area can be set up so that the silicon rod conversion device can rotate the silicon rod by 60° to achieve switching between the two processing areas. The direction of the wire cutting unit in the first cutting unit group and the second cutting unit group may also change. In this example, the first direction corresponding to the wire cutting unit in the first cutting unit group and the second cutting unit group changes, but the position adjustment or slot change of the cutting wire saw can still be achieved by at least one adjusting mechanism in the cutting unit group. In some embodiments, different processing stations in the silicon rod cutting and grinding machine include, for example, only single-wire cutting units. In some embodiments, the silicon rod cutting and grinding machine has only one station for cutting. In one specific implementation, the cutting station can be equipped with an "=" shaped cutting wire mesh, and the silicon rod positioning mechanism drives the silicon rod to rotate 90° to cut again. The silicon rod cutting and grinding machine has various variations, which are not limited in this application.

[0257] Generally, in wire EDM equipment, the relative positions of multiple cutting wheels do not change easily after installation. When one of the wire EDM wheels wears out, the entire groove needs to be replaced by adjusting the position of the cutting wheel or other components. The components that need to be adjusted also need to be further calibrated, which is cumbersome and inefficient.

[0258] This application also provides a wire cutting device for silicon rod processing equipment. The silicon rod processing equipment includes a base with a silicon rod processing platform; a silicon rod bearing device disposed on the silicon rod processing platform for bearing the silicon rod to be cut; the wire cutting device includes: a cutting frame disposed on the base; at least one wire cutting unit movably disposed on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged sequentially along a first direction, each cutting wheel having at least two cutting grooves; at least one transition wheel, each of the transition wheels having a wire groove; a cutting wire sequentially wound around the plurality of cutting wheels and the transition wheel to form at least one wire saw; at least one shifting mechanism for driving the at least one transition wheel to move along a second direction, so that the current wire groove wound by cutting in the at least one transition wheel moves in the second direction from the first groove corresponding to the cutting wheel to the second groove corresponding to the cutting wheel.

[0259] It should be understood that in wire EDM equipment, a high-speed running steel wire drives a cutting blade attached to the steel wire, or directly uses diamond wire to rub against the workpiece, thereby achieving the purpose of wire cutting. During the cutting process, the steel wire or diamond wire is guided by a transition wheel, forming a wire saw or a wire mesh on the cutting wheel. The workpiece is fed by the rising and falling of the worktable or the rising and falling of the wire saw or wire mesh. In long-term cutting operations, the cutting grooves of the cutting wheel and the guide grooves of the transition wheel inevitably wear, which affects the positioning accuracy of the cutting wire, thus leading to the need for groove replacement.

[0260] In the following embodiments provided in this application, the wire cutting device includes at least one wire cutting unit, in which multiple cutting wheels are arranged along a first direction, that is, the plane where the cutting grooves of the multiple cutting wheels are located is parallel to the first direction, and for any of the multiple cutting wheels, there is an offset in a second direction between their different cutting grooves; the at least one shifting mechanism can be used to drive at least one transition wheel to move relative to the wire cutting unit along the second direction, that is, to move the current wire groove that has been cut and wound in the transition wheel from the first groove corresponding to the cutting wheel to the second groove corresponding to the cutting wheel in the second direction.

[0261] Here, the first groove (also referred to as the first cutting groove in this application) and the second groove (also referred to as the second cutting groove in this application) refer to the cutting grooves of the cutting wheel corresponding to the wire grooves cut and wound before and after the shifting mechanism drives the movement of the at least one transition wheel. The number of cutting grooves of the cutting wheel is not limited to two. At the same time, the first groove and the second groove do not necessarily have to be adjacent cutting grooves on the cutting wheel, but only different cutting grooves.

[0262] The silicon rod processing equipment using the wire cutting device can be a silicon rod squaring device, a silicon rod cutting device, a silicon rod cutting and grinding integrated device, etc. In the following embodiments, the application of the wire cutting device of this application to a silicon rod squaring device is used as an example for illustration, but it is not intended to limit the application scenarios of the wire cutting device of this application.

[0263] Please refer to the following: Figure 23 and Figure 17 ,in Figure 23 The diagram shown is a structural schematic of the wire cutting apparatus of this application in one embodiment. Figure 17 The diagram shows a schematic representation of the wire cutting apparatus of this application used in a silicon rod squaring device in one embodiment. As shown, the wire cutting apparatus includes a cutting frame 20 and at least one wire cutting unit 21.

[0264] The cutting frame 20 is located on the machine base. In some embodiments, the cutting frame 20 is located at both ends of the machine base to ensure that the wire saw formed on the wire cutting unit 21 mounted on the cutting frame 20 can cover different processing stations. For example, in the example shown in Figure 2, the cutting frame 20 is a column located at both ends of the machine base. The machine base of the silicon rod squaring equipment is provided with multiple silicon rod support structures, and the span of the wire cutting unit 21 includes each silicon rod support structure in the cutting area.

[0265] The wire cutting unit 21 includes multiple cutting wheels 211, at least one transition wheel 212, a cutting wire 213, and at least one shifting mechanism 215.

[0266] It should be understood that the plurality of cutting wheels 211 need to be attached to the carrier provided by the wire cutting unit 21. In some examples, the wire cutting unit 21 includes a mounting beam 214 in a first direction. The two ends of the mounting beam 214 are movably connected to the cutting frame 20, and a plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, a wire cutting unit 21 consists of a plurality of cutting wheels 211 arranged in the same direction (or the same straight line), a cutting line 213, and a load-bearing structure for the cutting wheels 211; the direction in which the plurality of cutting wheels 211 are arranged along the mounting beam 214 is the direction of the wheel surface of the cutting wheel 211 (or the plane where the cutting line groove is located) along the mounting beam 214 (i.e., the first direction).

[0267] In some examples, the wire cutting device is provided with multiple wire cutting units 21, and the different wire cutting units 21 are located on different straight lines, such as... Figure 23 The two wire cutting units 21 shown are parallel to each other. In some examples, the extension directions of different wire cutting units 21 may also intersect.

[0268] It should be noted that in various embodiments of the wire cutting device provided in this application, the first direction is the direction in which the plurality of cutting wheels 211 in the wire cutting unit 21 are arranged, for example, in some examples, the direction of the mounting beam 214 of the wire cutting unit 21, and the cutting wire saw formed by the cutting wire 213 wrapped around the cutting wheel 211 is also the first direction; the second direction is the orthogonal direction of the first direction, and the at least one adjusting mechanism drives the at least one wire cutting unit 21 to move along the second direction, so that the cutting wire saw in the wire cutting unit 21 moves along its orthogonal direction.

[0269] The at least one transition wheel 212 is used to guide the direction or adjust the tension of the cutting line 213 when it is wound around different cutting wheels 211.

[0270] In some implementations, taking the wire cutting unit 21 as an example, the wire cutting unit 21 includes at least one transition wheel 212, which is movably disposed on a carrier that carries multiple cutting wheels 211.

[0271] It should be understood that the plurality of cutting wheels 211 need to be attached to the carrier provided by the wire cutting unit 21. In some embodiments, the plurality of cutting wheels 211 belonging to the same wire cutting unit 21 are mounted on a mounting beam 214 arranged along a first direction. The two ends of the mounting beam 214 are movably connected to the cutting frame 20, and a plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, a wire cutting unit 21 consists of a plurality of cutting wheels 211 arranged along the same direction (or the same straight line), a cutting line 213, and a mounting beam 214 on which the cutting wheels 211 are mounted. In other embodiments, the plurality of cutting wheels 211 in the wire cutting unit 21 are mounted on the cutting frame 20 by a mounting bracket, a connecting plate, or a frame. Here, the carrier provided by the wire cutting unit 21 for mounting the plurality of cutting wheels 211 can be of different forms, and this application does not limit it.

[0272] like Figure 17In the illustrated embodiment, multiple cutting wheels 211 in the same wire cutting unit 21 are mounted on a mounting beam 214. The mounting beam 214 is positioned along a first direction and moves relative to the mounting beam 214 along a second direction under the drive of the at least one shifting mechanism 215. The at least one transition wheel 212 then moves relative to the multiple cutting wheels 211 in the second direction. The displacement of the transition wheel 212 is controlled by the at least one shifting mechanism 215, thereby enabling the current wire groove, after cutting and winding, in the at least one transition wheel 212 to move from the first groove corresponding to the cutting wheel 211 to the second groove corresponding to the cutting wheel 211 in the second direction. In practical scenarios, by changing the position of the cutting groove corresponding to the wire groove of the at least one transition wheel 212, the groove changing of the cutting wire 213 on the cutting wheel 211 can be achieved without adjusting the transition wheel 212, effectively simplifying the groove changing operation.

[0273] Here, the slot changing process can be completed without changing the wire slot wound around the cutting line 213. In some examples, the transition wheel 212 is a single wire slot transition wheel 212.

[0274] In one embodiment, at least one transition wheel is detachably mounted on the wire cutting unit. Here, the transition wheel can be a replaceable transition wheel. For example, the axle corresponding to the transition wheel is mounted on the wire cutting unit, and the wheel surface of the transition wheel is detachably fitted onto the axle. In practical scenarios, to reduce production costs, the wheel surface of the transition wheel can be, for example, a consumable transition wheel made of plastic. When the transition wheel wears out during use, it can be disassembled and replaced with a new one, eliminating the need for installation, positioning, and calibration operations when changing the transition wheel groove, thus simplifying the maintenance of the wire cutting device. Of course, the transition wheel can also be detachably mounted on the transition wheel bracket of the wire cutting unit, and the material of the transition wheel can also be rubber or similar materials; this application does not impose any limitations. Here, when the transition wheel is a consumable transition wheel, it can be a single-channel groove transition wheel.

[0275] Of course, in other examples, the transition wheel may also be configured as a transition wheel with at least two wire slots. Here, the number of wire slots in the transition wheel can be determined based on the positional relationship between the transition wheel and the cutting wheel and the winding method of the cutting wire.

[0276] When each transition wheel has at least two guide grooves, and the at least two guide grooves are parallel to each other, in one example, the guide wheel is configured such that the projection of the plane containing the guide grooves onto the horizontal plane is along a first direction, and there is a transition offset in a second direction between different guide grooves. In some implementations, the transition offset between adjacent guide grooves in the transition wheel is equal to the cutting offset between adjacent cutting grooves in the cutting wheel; in this example, the cutting wheel and the guide wheel in the wire cutting unit can be configured in a one-to-one correspondence between guide grooves and cutting grooves (the correspondence means that the cutting grooves and guide grooves are coplanar), and the number of guide grooves in the transition wheel can be equal to or unequal to the number of cutting wheels.

[0277] Here, based on the selected structural form of the transition wheel (e.g., the number of wire grooves), the positional relationship between the transition wheel and the cutting wheel, and the winding method of the cutting wire, the wire cutting unit can be configured in different forms. For example, this application provides the following embodiment of applying the wire cutting unit in a silicon rod squaring device:

[0278] In some embodiments, multiple cutting wheels belonging to the same wire cutting unit are paired in pairs to form at least two cutting wheel groups. A transition wheel is provided between two adjacent cutting wheels in two adjacent cutting wheel groups. The cutting wire is sequentially wound around the cutting wheel and the transition wheel to form a wire saw between two cutting wheels in each cutting wheel group. The cutting wire passes through the cutting groove of the last cutting wheel in the preceding cutting wheel group and through the guide groove of the transition wheel before entering the cutting groove of the first cutting wheel in the following cutting wheel group.

[0279] Please see Figure 18 and Figure 19 ,in Figure 18 The diagram shown is a schematic representation of the wire cutting apparatus of this application used in a silicon rod squaring device in one embodiment. Figure 19The diagram shows a schematic representation of the wire cutting unit in one embodiment of the wire cutting device. As shown, the wire cutting unit 21 in the wire cutting device has four cutting wheel sets. A transition wheel 212 is provided between two adjacent cutting wheel sets. The cutting wire 213 is sequentially wound around the cutting wheel 211 and the transition wheel 212 to form a wire saw on the two cutting wheels 211 of each cutting wheel set. When the cutting wire 213 is wound around two adjacent cutting wheels 211 in two adjacent cutting wheel sets, it exits through the cutting groove of the last cutting wheel 211 in the preceding cutting wheel set, passes through the transition wheel 212, and then enters the cutting groove of the first cutting wheel 211 in the following cutting wheel set. Here, the same transition wheel 212 is shared between every two adjacent cutting wheel sets for guidance, which reduces the length of the cutting wire 213 used for tension adjustment and guidance, thereby increasing the proportion of the cutting wire 213 used to form the cutting wire saw. This simplifies the winding method, improves the utilization rate of the cutting wire 213, and reduces production costs.

[0280] Based on the positional relationship between the cutting wheel 211 and the silicon rod bearing structure in each cutting wheel group, any one wire saw can be used for one corresponding (e.g., Figure 18 The silicon rods with 2, 3, or 4 silicon rod support structures are cut in the embodiment shown. In a specific implementation, in order to prevent the cutting wire saw from being too long and causing uneven tension in the cutting wire 213, the number of silicon rod support structures corresponding to each cutting wire saw can be selected according to the actual situation to stabilize the processing quality.

[0281] In other embodiments, as shown in FIG2, a plurality of cutting wheels 211 belonging to the same wire cutting unit 21 include a first cutting wheel 211, a tail cutting wheel 211, and at least one intermediate cutting wheel 211 located between the first cutting wheel 211 and the tail cutting wheel 211. A transition wheel 212 is also provided on the side of the at least one intermediate cutting wheel 211. The transition wheel 212 has at least two wire grooves. The cutting wire 213 is sequentially wound around the cutting wheel 211 and the transition wheel 212 to form a wire saw on any two adjacent cutting wheels 211. When the cutting wire 213 is wound around the intermediate cutting wheel 211, it passes through one of the at least two cutting grooves on the intermediate cutting wheel 211 and then through the transition wheel 212 on the side and enters through the other of the at least two cutting grooves on the intermediate cutting wheel 211. This results in a cutting offset between any two adjacent wire saws in a second direction. The cutting offset corresponds to the distance between the two related cutting grooves.

[0282] The transition wheel can be directly connected to the at least one shifting mechanism, or it can be indirectly connected.

[0283] In some embodiments, each of the transition wheels is mounted on a support, and the support moves the transition wheel along a second direction via the at least one shifting mechanism.

[0284] In one embodiment, the wire cutting unit is provided with a bracket for supporting a transition wheel. The bracket is movably mounted on the mounting beam of the wire cutting unit. The bracket moves along a second direction under the drive of at least one shifting mechanism. The transition wheel mounted on the bracket follows the bracket in moving relative to the mounting beam in the second direction.

[0285] Please see Figure 24 The figure shows a schematic diagram of the transition wheel and support in one embodiment of the wire cutting device of this application. As shown, the support 2121 for setting the transition wheel 212 can be configured as a triangular support or a truss structure, or other structures such as a vertical support plate. The transition wheel 212 is rotatably mounted on the support 2121. When the at least one shifting mechanism drives the support 2121 to move in the second direction, the transition wheel 212 carried by the support 2121 can move accordingly.

[0286] In some embodiments, the at least one transition wheel is configured on an independent shifting mechanism, and each transition wheel is driven to move along a second direction by a corresponding shifting mechanism; or, the supports of the at least one transition wheel are connected together by a connecting beam, and the connecting beam moves the at least one transition wheel along the second direction via the at least one shifting mechanism.

[0287] Here, each of the at least one transition wheel can be configured with a shifting mechanism to independently drive the corresponding transition wheel to move in the second direction. The shifting mechanism can be connected to the transition wheel support. Alternatively, the supports of the at least one transition wheel can be connected together by a connecting beam. The specific form of the connecting beam is not limited to a beam structure. For example, the connecting beam can be a beam body, a truss structure, a frame structure, etc. The connecting beam is only needed to connect the supports of different transition wheels in the wire cutting unit. The at least one shifting mechanism drives the connecting beam to move in the second direction, so that each transition wheel and its corresponding support, which are relatively fixed by the connecting beam, can follow the connecting beam to move in the second direction.

[0288] In some embodiments, the shifting mechanism is used to drive the at least one transition wheel to move along a second direction, and the shifting mechanism may also movably position the at least one transition wheel in the wire cutting unit.

[0289] In some examples, the shifting mechanism includes: a shifting guide rail disposed along a second direction; and a power source for driving the at least one transition wheel to move along the shifting guide rail.

[0290] Please see Figure 25 Displayed as Figure 23 A magnified structural diagram at point C. (Combined with...) Figure 23 and Figure 25 As shown in the figure, the displacement guide rail 2151 can be disposed on the mounting beam, for example, to support the transition wheel 212 so that the transition wheel 212 moves along the guide rail under the drive of the power source; or it can be used to support the transition wheel bracket 2121 or the connecting beam 2122 connecting each transition wheel bracket 2121. Correspondingly, the power source can drive the bracket 2121 or the connecting beam 2122 of the transition wheel 212. In a specific implementation, the transition wheel 212, bracket 2121 or connecting beam 2122 can be disposed on the displacement guide rail 2151 by means of a slider. Under the action of the power source, the transition wheel 212, bracket 2121 or connecting beam 2122 carried on the displacement guide rail 2151 can be displaced in the second direction under the limiting action of the displacement guide rail 2151.

[0291] It should be noted that, in the embodiments provided in this application, when each of the at least one transition wheel is configured with a shifting mechanism to independently drive the corresponding transition wheel to move in the second direction, the shifting guide rail in the shifting mechanism corresponds to a transition wheel, and the power source corresponds to drive the transition wheel set on the shifting guide rail; when the supports of the at least one transition wheel are connected together by a connecting beam, the shifting guide rail is set corresponding to the connecting beam, and the number of shifting guide rails can be one, two, three, etc. In actual scenarios, the number of shifting guide rails can be determined comprehensively based on factors such as the span length of the connecting beam and the total weight of the connecting beam and the transition wheel it carries.

[0292] In some embodiments, the power source is a cylinder assembly, including a cylinder or a hydraulic pump, and a telescopic rod; wherein the telescopic rod is connected to the bracket of the transition wheel or the connecting beam.

[0293] Here, the telescopic rod is arranged along the second direction. One end of the telescopic rod is connected to the cylinder or hydraulic pump, and the other end, i.e., the free end, is connected to the bracket of the transition wheel or the connecting beam. The free end of the telescopic rod moves forward or backward under the drive of the cylinder or hydraulic pump, i.e., it moves forward or backward along the second direction. This causes the bracket of the transition wheel or the connecting beam connected to the free end to move forward or backward along the second direction. The position of the wire groove of the transition wheel corresponding to the transition wheel bracket or the connecting beam moves relative to the cutting groove along the second direction. By controlling the displacement of the free end of the telescopic rod, the current wire groove that has been cut and wound in the corresponding transition wheel can be moved in the second direction from the first groove corresponding to the cutting wheel to the second groove corresponding to the cutting wheel.

[0294] In some embodiments, the power source includes a lead screw and a drive source; wherein the lead screw is connected to the bracket of the transition wheel or the connecting beam.

[0295] In one implementation, the lead screw is positioned in a second direction. One end of the lead screw is connected to the drive source to rotate along the lead screw axis under the drive of the drive source. The other end of the lead screw is threaded to the transition wheel bracket or connecting beam. Through the threaded connection, the lead screw converts the rotation driven by the drive source into linear motion along the direction in which the lead screw is positioned. The transition wheel bracket or connecting beam is moved along the displacement guide by the lead screw drive.

[0296] In another implementation, one end of the lead screw is connected to the drive source, and the other end is connected to the transition wheel bracket or connecting beam. The lead screw moves in a second direction under the drive source. For example, the lead screw is connected to a cylinder piston rod, or to other mechanisms that can generate linear motion. The lead screw moves linearly in the second direction under the drive source and causes the bracket or connecting beam of the connected transition wheel to be displaced in the second direction.

[0297] Here, the at least one transition wheel can move along the second direction under the action of the at least one shifting mechanism. By controlling the moving distance of the at least one transition wheel, the current wire groove that has been cut and wound in the at least one transition wheel can be moved from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction. This allows for the changing of the groove of the cutting wheel. During the groove switching process, there is no need to change the groove of the transition wheel or perform calibration, and the groove switching process is simplified.

[0298] In actual cutting operations, after the slot-changing operation, the cutting wire moves from the first slot to the second slot, thus changing the position of the wire saw in the second direction. Based on processing requirements, the position of the wire saw usually needs to be adjusted to process the silicon rod according to the preset cutting amount. To simplify this process, this application also provides the following embodiments:

[0299] In some embodiments, the wire cutting device further includes: at least one adjusting mechanism disposed on the at least one wire cutting unit, for driving multiple cutting wheels in the at least one wire cutting unit to move along a second direction, so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or change the cutting groove of the cutting wire around the multiple cutting wheels in the at least one wire cutting unit.

[0300] The wire cutting device can switch the cutting wire between different cutting grooves of the cutting wheel based on the at least one pitch adjustment mechanism, or adjust the position of the wire saw to change the cutting position (or processing specifications) relative to the silicon rod.

[0301] For some implementation methods, please refer to Figure 26 Displayed as Figure 17An enlarged schematic diagram at point D. As shown, the wire cutting unit 21 can be mounted on the cutting frame 20 via a wire cutting support 24. The wire cutting support 24 is mounted on the cutting frame 20 and includes a guide rail arranged along a second direction. The wire cutting unit 21 is mounted on the guide rail of the wire cutting support 24 to form a degree of freedom of movement along the second direction. Of course, the wire cutting support 24 can also be configured with a guide groove, a slide bar, or other limiting or guiding structure in the second direction for mounting the at least one wire cutting unit 21. This application does not impose any limitations. The at least one adjusting mechanism 23 thereby adjusts the position of the wire cutting unit 21 in the second direction on the wire cutting support 24.

[0302] It should be understood that the wire cutting device can perform cutting of the silicon rod based on the lifting and lowering movement of the wire cutting unit 21 along the cutting frame 20, while controlling the cutting specifications is achieved by adjusting the relative position between the wire saw and the silicon rod in the second direction. (Refer to the reference...) Figure 17 and Figure 26 When the silicon rod is placed on the silicon rod support structure, its position is fixed. By moving the wire saw along the second direction through the adjustment mechanism 23, the cutting position of at least one wire saw in the at least one wire cutting unit 21 can be adjusted, thereby controlling the cutting amount of the silicon rod. Alternatively, by adjusting the position of the cutting wheel carried by the wire cutting unit 21 along the second direction, the cutting wire can be grooved while keeping the position of the wire saw in the second direction unchanged before and after the groove change.

[0303] In some embodiments, the wire cutting device includes a single-wire cutting unit, and the pitch adjustment mechanism includes: a lead screw, which is arranged along a second direction and threadedly connected to the single-wire cutting unit; and a drive source for driving the lead screw to rotate.

[0304] Here, the single-wire cutting unit is a wire cutting unit. The single-wire cutting unit in the wire cutting device includes multiple cutting wheels arranged along a first direction. The cutting wire is wound around the multiple cutting wheels to form at least one wire saw, and the at least one wire saw is along the same straight line direction. The lead screw of the adjusting mechanism has a distal end and a proximal end. In a specific implementation, for example, the proximal end of the lead screw can be connected to a drive source and rotated under the drive source's drive. The distal end of the lead screw is threaded to the single-wire cutting unit. Through the connection method at both ends of the lead screw, the lead screw can rotate based on the drive source transmission, and the rotation of the lead screw can be converted into axial displacement through the threaded connection. The direction of the axial displacement is the setting direction of the lead screw, i.e., the second direction. By driving the lead screw to rotate through the drive source in the adjusting mechanism, the single-wire cutting unit can be displaced in the second direction. Different rotation directions of the driven lead screw can achieve forward or backward displacement of the single-wire cutting unit in the second direction.

[0305] In another embodiment, the wire cutting device includes a single-wire cutting unit; the adjustment mechanism includes: a telescopic member, arranged along a second direction and associated with the single-wire cutting unit; and a drive source for driving the telescopic member to extend or retract along the second direction. Here, the telescopic member can be configured as a rod structure with the rod extending in the second direction. Driven by the drive source, the telescopic member can extend or retract along its extension direction. One end of the telescopic member can be connected to the drive source, and the extendable free end is associated with the single-wire cutting unit, thus driving the single-wire cutting unit to move in the second direction under the action of the drive source. The telescopic member can be, for example, an electric telescopic rod, or a connecting rod connected to a cylinder cone rod, where the cylinder can serve as the drive source; this application does not impose limitations. The telescopic rod can be connected to the single-wire cutting unit in a straight line or indirectly. For example, it can be directly connected to the mounting beam of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or bearing. It should be understood that the extension or retraction of the telescopic member corresponds to the forward or backward movement of the single-wire cutting unit along the second direction.

[0306] In the embodiments provided in this application, the association can be achieved by one or more of snap-fit, screw-lock, bonding, and welding. For example, in the above embodiments, the telescopic rod can be associated with the wire cutting unit by one or more of snap-fit, screw-lock, bonding, and welding. Of course, the method of association is not limited to this, but is intended to achieve transmission in the second direction.

[0307] In another embodiment, the wire cutting device includes a single-wire cutting unit; the pitch adjustment mechanism includes: a rack disposed in the single-wire cutting unit along a second direction; a transmission gear meshing with the rack; and a drive source for driving the transmission gear to rotate. The transmission gear rotates under the drive source, and the rack meshing with the transmission gear moves accordingly along the rack's direction. In this example, by cooperating with the transmission gear, the rotational motion driven by the drive source can be converted into wire transport along the rack direction. The rack, disposed in the single-wire cutting unit along the second direction, can drive the single-wire cutting unit to move along the second direction. Simultaneously, by controlling the rotation direction of the transmission gear by the drive source, the single-wire cutting unit can switch between forward and backward displacement directions along the second direction.

[0308] In the foregoing embodiments, the adjusting mechanism can be configured as one or more. For example, when the span of the single-wire cutting unit in the first direction is large, and it is difficult to drive multiple cutting wheels in the single-wire cutting unit to move in the second direction by setting one adjusting mechanism, multiple adjusting mechanisms can be set for driving. For example, adjusting structures can be set at both ends of the single-wire cutting unit in the first direction, or multiple adjusting mechanisms can be set at equal intervals in the first direction. Here, the multiple adjusting mechanisms corresponding to the single-wire cutting unit can work together to ensure that the multiple adjusting mechanisms drive the multiple wire cutting wheels of the single-wire cutting unit to move in the second direction with the same displacement (magnitude and direction).

[0309] In some embodiments, the wire cutting device includes a first wire cutting unit and a second wire cutting unit disposed opposite to each other along a second direction. At least one of the first wire cutting unit and the second wire cutting unit is driven to move along the second direction by the at least one adjusting mechanism, for adjusting the wire cutting saw spacing between at least one wire saw in the first wire cutting unit and at least one wire saw in the second wire cutting unit, or changing the cutting wire grooves around the plurality of cutting wheels in the first wire cutting unit and / or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.

[0310] In some embodiments, the wire cutting apparatus includes two wire cutting units, such as a first wire cutting unit and a second wire cutting unit, for example... Figure 23 In the illustrated embodiment, the first and second wire cutting units are arranged parallel to each other along a first direction, and the wire saws in the first and second wire cutting units are also parallel. In practical scenarios, the wire cutting device can be used, for example, in a silicon rod squaring machine. In this machine, each silicon rod on the supporting structure corresponds to the wire saws of the first and second cutting units within the cutting area. A single lifting and cutting motion can then create two parallel cut surfaces on the silicon rod surface. Here, the amount of silicon rod cut can be controlled by adjusting the distance between the first and second wire cutting units in a second direction.

[0311] The at least one adjustment mechanism can be configured to be connected to the first wire cutting unit or the second wire cutting unit, or simultaneously associated with the first wire cutting unit and the second wire cutting unit, so as to drive multiple cutting wheels in the connected or associated first wire cutting unit or / and second wire cutting unit to move along the second direction, and realize the adjustment of the cutting position of at least one wire saw in the connected or associated first wire cutting unit or / and second wire cutting unit, or change the cutting groove of multiple cutting wheels in the connected or associated first wire cutting unit or / and second wire cutting unit.

[0312] In one embodiment, the adjusting mechanism includes: a lead screw, disposed along a second direction and threadedly connected to the first wire cutting unit or the second wire cutting unit; and a drive source for driving the lead screw to rotate. The manner in which the lead screw and drive source drive multiple cutting wheels in the first or second wire cutting unit to move in the second direction is similar to the aforementioned embodiment. The first or second wire cutting unit driven by the adjusting mechanism can be considered a single wire cutting unit, which will not be elaborated here. It should be understood that by providing the adjusting mechanism on any wire cutting unit, the spacing between the parallel cutting wire saws formed between the first and second wire cutting units can be increased or decreased, allowing the wire cutting device to cut silicon rods into different specifications.

[0313] In another embodiment, the adjusting mechanism includes: a telescopic member, disposed along a second direction and associated with the first wire cutting unit or the second wire cutting unit; and a driving source for driving the telescopic member to extend or retract along the second direction. Here, the first cutting unit or the second wire cutting unit equipped with the adjusting mechanism can be considered a single-wire cutting unit, and its specific implementation can be referred to the foregoing embodiments, which will not be repeated here.

[0314] In another embodiment, the pitch adjustment mechanism includes: a rack along a second direction and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear meshing with the rack; and a drive source for driving the transmission gear to rotate. Through the meshing transmission gear and rack, the drive source can control the rack to move along the rack direction line, and the first or second wire cutting unit associated with the rack can be driven by the rack to move along the second direction.

[0315] In one embodiment, the pitch adjustment mechanism includes: a bidirectional lead screw, disposed along a second direction and threadedly connected to the first wire cutting unit and the second wire cutting unit; and a drive source for driving the lead screw to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or away from each other along the second direction. In one embodiment, the bidirectional lead screw is a double-threaded lead screw, with threads at both ends of the bidirectional lead screw in opposite directions. The drive source can be disposed at either end of the bidirectional lead screw to drive the bidirectional lead screw to rotate along the lead screw axis. Through the opposite-direction threads at both ends of the bidirectional lead screw, when the bidirectional lead screw rotates under the drive source, the motion at both ends of the bidirectional lead screw is converted into axial linear motion in opposite directions, the axial direction being the second direction in which the bidirectional lead screw is disposed. Under the drive source, the first wire cutting unit and the second wire cutting unit can move towards each other or away from each other.

[0316] In one embodiment, the pitch adjustment mechanism includes: a first rack along a second direction and associated with the first wire cutting unit; a second rack along a second direction and associated with the second wire cutting unit; a transmission gear meshing with the first rack and the second rack; and a drive source for driving the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move toward each other or away from each other along the second direction.

[0317] In this embodiment, the first rack is linked to the first wire cutting unit, and the second rack is linked to the second wire cutting unit. The transmission gear is connected to the power output shaft (not shown) of a drive source, such as a servo motor, and meshes with the first and second racks. It is used to drive the first and second wire cutting units to move towards each other to perform a closing action when rotating in the forward direction, and to drive the first and second wire cutting units to move away from each other when rotating in the reverse direction. The first and second racks can mesh on opposite sides of the transmission gear, so that when the transmission gear rotates, the linear velocities of the first and second racks are in opposite directions. The drive motor drives the transmission gear to rotate, causing the first and second racks to move towards each other when the transmission gear rotates in the forward direction, thus driving the first and second wire cutting units to move towards each other. When the transmission gear is driven to rotate in the reverse direction, the first and second racks move away from each other, thus driving the first and second wire cutting units to move away from each other. Here, the transmission gear can be axially connected to the power output shaft of the drive source, or indirectly connected to the power output shaft, for example, axially connected to a rotating part connected to the power output shaft.

[0318] In practical scenarios, the wire cutting device can be equipped with one or more adjustment mechanisms. Each adjustment mechanism is connected to the first wire cutting unit and the second wire cutting unit. The number of adjustment mechanisms can be determined comprehensively based on factors such as the driving power requirements, the force state of the transmission mechanism such as the lead screw, the smoothness of the movement of multiple cutting wheels in the driving wire cutting unit, and the equipment space of the wire cutting device. For example, when the span between the first wire cutting unit and the second wire cutting unit in the first direction is small, only one adjustment mechanism is needed to adjust the cutting position of the cutting wire saw in the cutting unit or change the cutting wire groove. In this case, one adjustment mechanism can be set in the wire cutting device. The distance adjustment mechanism drives the first wire cutting unit and the second wire cutting unit to move towards or away from each other along the second direction. For example, when the span between the first wire cutting unit and the second wire cutting unit in the first direction is long, the wire cutting unit requires a large amount of power to drive it, and this power must be within the force strength range of the transmission connection components such as lead screws or racks. The wire cutting device can be equipped with multiple distance adjustment mechanisms. The multiple distance adjustment mechanisms work together to ensure that the multiple distance adjustment mechanisms drive the multiple wire cutting wheels of the first wire cutting unit and the second wire cutting unit to move towards or away from each other in the second direction with the same amount of displacement (magnitude and direction).

[0319] In some embodiments, the adjustment mechanism is a servo motor mounted on the at least one wire cutting unit. In practical scenarios, a servo motor is mounted on at least one wire cutting unit or each wire cutting unit of the wire cutting device, and the servo motor controls the displacement of the corresponding wire cutting unit in the second direction. The wire cutting unit can be driven by a predetermined cutting offset for slotting or an adjustment amount for changing the cutting position of the cutting line, and the servo motor's precise positioning function drives multiple cutting wheels in the wire cutting unit to move along the second direction by a preset displacement. For example, the wire cutting device includes a single wire cutting unit, and the single wire cutting unit is equipped with a servo motor to drive the single wire cutting unit to move along the second direction; or, for example, the wire cutting device includes a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit and / or the second wire cutting unit move relatively independently along the second direction under the drive of their corresponding servo motors. In some examples, the servo motor can also be replaced by a travel motor and a travel screw, and the wire cutting unit can be driven by the travel motor to move along the second direction on the wire cutting support.

[0320] In some embodiments, the at least one adjusting mechanism drives the lower wire cutting unit to move along a second direction. The at least one transition wheel and multiple cutting wheels move together along the second direction following the mounting beam. In this state, the at least one transition wheel and multiple cutting wheels are relatively stationary, that is, the positional relationship between the transition wheel and the cutting wheels remains unchanged. When the adjusting mechanism is used to adjust the cutting position of at least one wire saw in the at least one wire cutting unit, the positional relationship of the wire saw relative to the cutting wheels and transition wheels remains unchanged, that is, only movement along the second direction occurs, thus achieving the cutting position adjustment.

[0321] Please see Figure 27 , Figure 28 and Figure 29 , Figure 27 The image shown is a top view of one embodiment of the wire cutting apparatus of this application. Figure 28 The image shown is a side view of one embodiment of the wire cutting apparatus of this application. Figure 29 Displayed as Figure 28 A magnified structural diagram at point E in the middle.

[0322] Please refer to the reference. Figure 27 and Figure 28 In some embodiments, when the at least one adjusting mechanism drives the wire cutting unit 21 to move in the second direction, the at least one transition wheel 212 and the plurality of cutting wheels 211 move together with the mounting beam 214 in the second direction (as shown in the figure). Figure 27(As indicated by the arrow direction), simultaneously, the at least one shifting mechanism 215 drives the at least one transition wheel 212 or the connecting beam 2122 for connecting the transition wheel bracket 2121 to move in the second direction (as shown by the arrow direction) in accordance with the shifting guide rail. Figure 28 (As indicated by the arrow above the middle bracket 2121), even if the at least one transition wheel 212 moves relative to the mounting beam 214 in a second direction, so that the current wire groove in the at least one transition wheel 212, which has been cut and wound, moves in the second direction from the first wire groove corresponding to the cutting wheel 211 to the second wire groove corresponding to the cutting wheel 211, in conjunction with reference to... Figure 29 When the transition wheel 212 moves relative to the cutting wheel 211 along the second direction, the wire groove of the transition wheel 212 can be switched to correspond to different cutting wire grooves. In this state, the distance that the adjustment mechanism drives the wire cutting unit 21 to move along the second direction is equal to and opposite to the distance that the at least one shifting mechanism 215 drives the at least one transition wheel 212 to move along the second direction. This can be used to realize the changing of the groove of the cutting wire 213 relative to the cutting wheel 211, and the spatial position of the cutting wire 213 remains unchanged before and after the groove changing. That is, after the groove changing, silicon rod cutting can continue according to the preset cutting specifications of the silicon rod before the groove changing. In this example, the groove changing adjustment of the transition wheel 212 and the position calibration operation of the cutting wire 213 and the cutting wheel 211 can be omitted during the groove changing process.

[0323] In practical scenarios, the cutting grooves corresponding to the cutting lines before and after the groove change can be predetermined. For example, before the groove change, the cutting line is located in cutting groove a1, and after the groove change, the cutting line is wrapped around cutting groove a2. Based on the cutting offset between cutting groove a1 and cutting groove a2, the displacement of the multiple cutting wheels in the wire cutting unit driven by the at least one adjusting mechanism in the second direction is determined. That is, the displacement is set as the cutting offset between cutting groove a1 and cutting groove a2, which can be used to realize the replacement of cutting groove a1 to cutting groove a2 for the cutting line. It should be noted that the direction in which the multiple cutting wheels in the wire cutting unit driven by the at least one adjusting mechanism move in the second direction is the cutting line. Slot a2 points in the direction of cutting slot a1; simultaneously, the shifting mechanism drives at least one transition wheel to move relative to the wire cutting unit along the second direction, and the moving distance is the cutting offset between cutting slot a1 and cutting slot a2. The displacement direction of the at least one transition wheel relative to the wire cutting unit is the direction from cutting slot a1 to cutting slot a2. Before and after the movement, the position of the at least one transition wheel in the second direction in space (e.g., with the machine base as a reference) remains unchanged. Here, the cutting position of the wire saw in space remains unchanged after the slot is changed, thus eliminating the need for further calibration of the cutting wheel or other component positions. The silicon rod can be cut according to the preset cutting amount, simplifying the slot changing process.

[0324] The wire cutting device for silicon rod processing equipment provided in this application includes at least one shifting mechanism in its wire cutting unit for driving at least one transition wheel to move along a second direction, so that the current wire groove wound by the cut wire in the at least one transition wheel moves in the second direction from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel. The wire cutting device provided in this application can eliminate the need to adjust the position of the cutting wire wound in the wire groove during groove changing through the at least one shifting mechanism, and can save the need for adjustment and calibration of the transition wheel after groove changing. Furthermore, the transition wheel can be a single-groove transition wheel to achieve groove changing. In practical scenarios, the transition wheel can also be set as a replaceable consumable transition wheel; when the wire groove of the transition wheel wears down, the transition wheel can be directly replaced, simplifying the equipment maintenance process for equipment wear caused by cutting.

[0325] In another aspect, this application also provides a silicon rod processing apparatus, including a base, a silicon rod support structure, and as shown in 23 to Figure 29 The wire cutting apparatus described in any of the embodiments shown. The base has a silicon rod processing platform, and the silicon rod supporting device is disposed on the silicon rod processing platform for supporting the silicon rod to be cut.

[0326] In some embodiments, the silicon rod processing equipment is a silicon rod squaring device, and the silicon rod bearing device is a silicon rod bearing structure.

[0327] Here, the silicon rod processing platform may be equipped with one or more silicon rod support structures, each of which can be used to support a single silicon rod. Correspondingly, the number of silicon rod support structures in the cutting area of ​​the silicon rod processing platform can correspond to the number of wire saws in the wire cutting unit of the wire cutting device, for example... Figure 17 or Figure 18 In the embodiment shown, the cutting area of ​​the silicon rod processing platform is provided with multiple silicon rod support structures 11, and the wire cutting unit 21 in the wire cutting device includes multiple cutting wire saws to correspond to the multiple silicon rod support structures 11 respectively.

[0328] by Figure 17 The silicon rod processing equipment described in the illustrated embodiment is a silicon rod squaring equipment. In some embodiments, the silicon rod processing platform is located on the machine base 10 via a worktable conversion mechanism. Here, the worktable conversion mechanism may be, for example, a rotation mechanism or a translation mechanism.

[0329] The rotating mechanism may include, for example, a rotating shaft and a rotating drive unit. The rotating shaft is connected to the silicon rod processing platform, and the rotating drive unit drives the rotating shaft to rotate, thereby causing the silicon rod processing platform to rotate.

[0330] The translation mechanism may include, for example, a translation guide rail, a slider, and a translation drive unit. The translation guide rail is laid on the machine base, the slider is located at the bottom of the silicon rod processing platform and is adapted to the translation guide rail to provide translation guidance for the silicon rod processing platform, and the translation drive unit is used to drive the silicon rod processing platform to move along the translation guide rail so that the silicon rod support structure switches between the cutting area and the loading and unloading area. In other embodiments, the translation mechanism may also adopt a gear transmission method. Specifically, the translation mechanism includes a translation rack and a rotating gear adapted to the translation rack by a motor. The translation rack is located at the bottom of the silicon rod processing platform and may be, for example, at least one rack with a certain length. In order to make the silicon rod processing platform move smoothly, each rack is adapted to at least two spaced rotating gears. The motor drives the rotating gears to rotate so as to drive the silicon rod support structure located on the silicon rod processing platform to switch between the cutting area and the loading and unloading area.

[0331] The silicon rod squaring equipment can be, for example, Figure 17 or Figure 18 The silicon rod squaring device of the illustrated embodiment can, of course, be other types of silicon rod squaring devices. For example, the wire cutting device in the silicon rod squaring device can be configured as a single wire cutting unit; or, for example, the wire saw in the wire cutting unit of the wire cutting device of the silicon rod squaring device is a single segment, but of course, the wire saw can also be two, three, four, etc., and this application does not impose any restrictions. Correspondingly, the number of silicon rod support structures on the silicon rod processing platform can be changed accordingly; or, for example, the number of silicon rod support structures corresponding to each wire saw in the wire cutting unit of the silicon rod squaring device can be one, two, three, etc.

[0332] The silicon rod squaring equipment is equipped with, for example... Figures 23 to 29 In any of the embodiments shown, the wire cutting apparatus, after the cutting wheel in the silicon rod squaring device wears down during the squaring operation, can eliminate the need for changing the groove of the transition wheel and calibrating the transition wheel during the groove changing process by means of the shifting mechanism, making the groove changing process simpler; Figures 23 to 29In some embodiments provided, the wire cutting device of the silicon rod squaring equipment may also be provided with at least one adjusting mechanism. Based on the at least one adjusting mechanism, the cutting position of the wire saw can be adjusted to determine the cutting amount of the silicon rod. Alternatively, after the groove of the cutting wheel of the silicon rod squaring equipment wears during long-term cutting operations, the groove position of the cutting line can be changed based on the at least one adjusting mechanism to ensure the processing accuracy of the silicon rod squaring equipment in continuing squaring operations. At the same time, when the at least one adjusting mechanism and the at least one shifting mechanism cooperate, the silicon rod squaring equipment does not need to adjust the guide groove in the transition wheel used for winding the cutting line when changing the cutting groove. In addition, the cutting wire saw after changing the groove can keep the position in the second direction consistent with that before changing the groove, thus eliminating the need for cutting line position calibration operation, which simplifies the groove changing process.

[0333] In some embodiments, when the silicon rod processing equipment is a silicon rod cutting machine, the silicon rod cutting machine includes a base, a silicon rod carrying device, and a wire cutting device.

[0334] The machine base includes a silicon rod processing platform, and the silicon rod carrying device is mounted on the silicon rod processing platform. Here, the silicon rod carrying device can be used, for example, to horizontally carry the silicon rod to be cut. The wire cutting device includes: a cutting frame mounted on the machine base; at least one wire cutting unit movably mounted on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged sequentially along a first direction, each cutting wheel having at least two cutting grooves; at least one transition wheel, each transition wheel having a wire groove; a cutting wire sequentially wound around the plurality of cutting wheels and the transition wheel to form at least one wire saw; and at least one shifting mechanism for driving the at least one transition wheel to move along a second direction, so that the current wire groove wound on the at least one transition wheel after cutting moves in the second direction from the first groove corresponding to the cutting wheel to the second groove corresponding to the cutting wheel. The wire cutting unit's lifting and lowering movement relative to the cutting frame enables the feeding and cutting of the silicon rod to be cut.

[0335] In some examples, the wire cutting device of the silicon rod cutting machine is equipped with multiple parallel wire cutting units. These multiple parallel wire cutting units move up and down along the cutting frame, allowing the silicon rod to be cut into multiple silicon rod segments in a single cut. Based on at least one shifting mechanism of the wire cutting device, the cutting groove of at least one cutting wire saw in the cutting unit can be adjusted in the cutting wheel. This allows the cutting wheel worn during the cutting operation to continue to be used after the cutting groove is replaced. Furthermore, the groove replacement process can be achieved without adjusting the position of the wire guide groove on the transition wheel.

[0336] In one embodiment, the arrangement of the wire cutting device of the silicon rod cutting machine and the form of the silicon rod carrying device can refer to the arrangement disclosed in Chinese Patent CN105196433B. Of course, the wire cutting device of the silicon rod cutting machine includes the at least one shifting mechanism for driving the at least one transition wheel to move along the second direction, so that the current wire groove that has been cut and wound in the at least one transition wheel moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction.

[0337] In some examples, the silicon rod cutting machine is, for instance, a dual silicon rod cutting device. Here, the silicon rod carrying device of the silicon rod cutting machine has a first processing station and a second processing station, respectively corresponding to carrying the first silicon rod to be cut and the second silicon rod to be cut. See also... Figure 21 The image shows a schematic diagram of the wire cutting device of the silicon rod cutting machine in one embodiment. In this example, the wire cutting support 24 is mounted on the cutting frame 20, and at least one wire cutting unit 21 is provided on both sides of the wire cutting support 24 along a first direction. The at least one wire cutting unit 21 located on both sides of the wire cutting support 24 can cut the silicon rod to be cut at the first processing station and the second processing station, respectively. Here, the wire cutting unit 21 of the wire cutting support 24 includes a cutting wheel 211, a transition wheel 212, a cutting wire 213 wrapped around the cutting wheel 211, and at least one shifting mechanism; wherein, the cutting wheel 211 has at least two cutting wire grooves, and the at least one shifting mechanism is used to drive the at least one transition wheel 212 to move along a second direction, so that the current wire groove wrapped by the cutting in the at least one transition wheel 212 moves from the first wire groove corresponding to the cutting wheel 211 to the second wire groove corresponding to the cutting wheel 211 in the second direction. Based on the at least one shifting mechanism, the relative position of the transition wheel 212 and the cutting wheel 211 in the wire cutting unit of the silicon rod cutting machine is adjustable in the second direction. Under the drive of the at least one shifting mechanism, the wire groove of the transition wheel can be aligned with different cutting wire grooves in the cutting wheel. In practical scenarios, when changing the cutting wire groove of the cutting wheel 211, it is not necessary to change the wire groove of the cutting wire 213 wound in the transition wheel 212, so that the wire groove used for winding the cutting wire 213 and the cutting wire groove are aligned in the second direction before and after the groove change.

[0338] Here, the form of the at least one shifting mechanism can also be referred to as follows: Figures 23 to 29 The shifting mechanism as described in any of the embodiments shown.

[0339] In some embodiments, the wire cutting units 21 on both sides of the wire cutting support 24 can also form at least one pair of wire cutting units 21. For example, the wire cutting units 21 on both sides of the wire cutting support 24 can be connected one-to-one to form at least one pair of wire cutting units 21. The pair of wire cutting units 21 are located on the same straight line in the first direction. In this example, the transition wheels 212 on the pair of wire cutting units 21 can be driven to move in the second direction based on the same displacement mechanism. For example, when the supports of the transition wheels 212 of the pair of wire cutting units 21 are connected together by a connecting beam. Of course, the pair of wire cutting units 21 can also be driven by multiple displacement mechanisms in concert, or each transition wheel 212 can be driven by an independent displacement mechanism.

[0340] Here, the specific form of the shifting mechanism can be referred to as follows: Figures 23 to 29 The implementation methods provided in the illustrated embodiments will not be described in detail here. In some examples, the wire cutting unit may also be provided with, for example... Figures 23 to 29 The distance adjustment mechanism described in the embodiment shown is used in the implementation of the method whereby the distance adjustment mechanism and the shifting mechanism cooperate to adjust the position of the wire saw or change the cutting groove of the cutting wire wound in the cutting wheel. This can be referred to as follows: Figures 23 to 29 The implementation method provided in the illustrated embodiment.

[0341] Of course, the specific form of the silicon rod cutting machine is not limited to the aforementioned embodiments. For example, based on the relationship between the placement position of the silicon rod on the silicon rod support device and the position of the wire saw, each wire saw in the silicon rod cutting machine can simultaneously cut multiple silicon rods; or, for example, the wire cutting device of the silicon rod cutting machine includes only one section of wire saw, which is used to cut one or more silicon rods in a single cutting operation, dividing the silicon rod into a silicon rod segment; this application does not impose any limitations. It should be noted that the wire cutting device of the silicon rod cutting machine includes, for example, Figures 23 to 29 The shifting mechanism described in any of the embodiments shown is used to adjust the position of the transition wheel relative to the cutting wheel in the wire cutting device in a second direction.

[0342] In some embodiments, the silicon rod processing equipment is a silicon rod cutting and grinding integrated machine. Here, the silicon rod cutting and grinding integrated machine includes a base, a silicon rod support device, a wire cutting device, and a grinding device.

[0343] The machine base has a silicon rod processing platform. In the silicon rod cutting and grinding integrated machine, the silicon rod processing platform can be configured as a processing area to perform different processing functions, such as consisting of a cutting station and a grinding station. The silicon rod carrying device is used to carry the silicon rod to be processed. The wire cutting device includes: a cutting frame, disposed on the machine base; at least one wire cutting unit, movably disposed on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged sequentially along a first direction, each cutting wheel having at least two cutting grooves; at least one transition wheel, each of the transition wheels having a wire groove; a cutting wire, sequentially wound around the plurality of cutting wheels and the transition wheel to form at least one wire saw; at least one shifting mechanism, used to drive the at least one transition wheel to move along a second direction, so that the current wire groove wound by cutting in the at least one transition wheel moves in the second direction from the first groove corresponding to the cutting wheel to the second groove corresponding to the cutting wheel.

[0344] Please see Figure 22 The image shows a schematic diagram of the silicon rod slicing and grinding machine of this application in one embodiment. In this example, as... Figure 22 As shown, the silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform; a wire cutting device, disposed on the base, for cutting silicon rods on the first processing area of ​​the silicon rod processing platform in a first direction and cutting silicon rods on the second processing area of ​​the silicon rod processing platform in a second direction to form square silicon rods; a grinding device, disposed on the base, for grinding and chamfering the square silicon rods on the third processing area of ​​the silicon rod processing platform; and a silicon rod conversion device, disposed on the silicon rod processing platform, for converting the silicon rods on the first, second, and third processing areas.

[0345] Here, the wire cutting device includes: a cutting frame 20, a wire cutting support 24, a first cutting unit group, and a second cutting unit group, wherein the first cutting unit group and the second cutting unit group are used to cut silicon rods on the first processing area and the second processing area, respectively.

[0346] In this embodiment, since the wire EDM support 24 can be used to configure the first cutting unit and the second cutting unit, that is, the first cutting unit and the second cutting unit share the wire EDM support 24. Therefore, in this embodiment, on the one hand, the cutting frame 20 and the wire EDM support 24 in the wire EDM apparatus are located in a central position between the first processing area and the second processing area. On the other hand, the wire EDM support 24 has a special design. For example... Figure 22As shown, the wire cutting support 24 in this embodiment may include a support body and a first support wing and a second support wing located on opposite sides of the support body. In some embodiments, the support body of the wire cutting support 24 is arranged at a 45° angle to the X-axis or Y-axis, the first support wing forms a 145° angle with the support body and is arranged along the Y-axis, and the second support wing forms a 145° angle with the support body and is arranged along the X-axis.

[0347] In some embodiments, the first cutting unit group may include at least four first cutting wheels 211a and two first transition wheels. These four first cutting wheels 211a can be combined into a pair of first cutting wheel groups. That is, two first cutting wheels 211a arranged opposite each other along the X-axis form a first cutting wheel group, and two first cutting wheel groups arranged along the Y-axis form a pair of first cutting wheel groups. The cutting wire 213 is sequentially wound around each of the first cutting wheels 211a in the first cutting unit group to form a cutting wire mesh. In practical applications, the cutting wire 213 is sequentially wound around the four first cutting wheels 211a in the first cutting unit group to form two cutting wire saws. These two cutting wire saws are arranged along the X-axis direction and are parallel to each other, forming a cutting wire mesh. Specifically, two parallel wire saws work together to form a first wire mesh in an "=" shape along the X-axis. Simultaneously, the cutting wire 213, while winding around the first cutting wheel set, also winds around the first transition wheel to change the direction or adjust the tension of the cutting wire 213. Here, the first transition wheel is parallel to the wheel surface of the corresponding cutting wheel 211 of the first cutting wheel set, i.e., both are parallel to the first direction. A single-wire cutting unit can be formed by two first cutting wheels 211a arranged opposite each other along the X-axis, the cutting wire 213 wound within them, and a first transition wheel. In this embodiment, the first cutting unit set forms two parallel wire cutting units 21.

[0348] Similarly, the second cutting unit group may include at least four second cutting wheels 211b and two second transition wheels. Two second cutting wheels 211b arranged opposite each other along the Y-axis form a second cutting wheel group, and two second cutting wheel groups arranged along the X-axis form a pair of second cutting wheel groups. In practical applications, the cutting line 213 is sequentially wound around the four second cutting wheels 211b in the second cutting unit group to form two cutting line saws. These two cutting line saws are arranged along the Y-axis and are parallel to each other. The two parallel cutting line saws cooperate to form a second cutting line mesh in the Y-axis direction in the shape of "=". At the same time, when the cutting line 213 is wound around the second cutting wheel group, it is wound around the second transition wheel to change the direction of the cutting line 213 or adjust the tension. Here, the second transition wheel is parallel to the wheel surface of the corresponding cutting wheel 211 of the second cutting wheel group, that is, they are both parallel to the first direction. A line cutting unit can be formed by two first cutting wheels 211a arranged opposite each other along the Y-axis, a cutting line 213 wound therein, and a second transition wheel. In this embodiment, two parallel line cutting units 21 are formed in the second cutting unit group.

[0349] It should be noted that the first and second directions are defined based on the carrier coordinate system of the wire cutting unit. Therefore, when the directions of multiple wire cutting units in a silicon rod processing equipment (in this example, a silicon rod cutting and grinding integrated machine) are different, the first directions corresponding to the multiple wire cuts are not the same in external space. Correspondingly, the second direction is orthogonal to the first direction. Therefore, the direction of movement of the at least one transition wheel driven by the at least one shifting mechanism is orthogonal to the driven wire cutting unit. For example, in the first cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the X-axis direction, and the first direction in the first cutting unit group is the X-axis direction, and the second direction is the Y-axis direction; in the second cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the Y-axis direction, and the first direction in the second cutting unit group is the Y-axis direction, and the second direction is the X-axis direction.

[0350] Of course, in the first and second cutting unit groups, the number of cutting wheels and transition wheels in any of the wire cutting units can be changed accordingly. For example, the number of cutting wheels in a wire cutting unit can be three or four, and the number of transition wheels can be two or more.

[0351] In some examples, the silicon rod conversion device is located in the central area of ​​the silicon rod processing platform, used to convert the silicon rod between the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform. In one embodiment, the silicon rod conversion device is rotatably mounted on the silicon rod processing platform, and the silicon rod conversion device may further include: a conveying body, which is disc-shaped, square-shaped, or other similar; a silicon rod positioning mechanism (i.e., a silicon rod carrying device) disposed on the conveying body, used to position the silicon rod; and a conversion drive mechanism, used to drive the conveying body to rotate so as to move the silicon rod positioned by the silicon rod positioning mechanism to a conversion position. In some examples, the silicon rod positioning mechanism further includes a rotating structure, used to drive the silicon rod carried on the silicon rod positioning mechanism to rotate along the silicon rod axis to adjust the cutting surface of the silicon rod.

[0352] Here, after the silicon rod to be cut is placed and positioned on the silicon rod positioning mechanism, the silicon rod to be cut is cut at the first processing area by the first cutting wire mesh in the X-axis direction in an "=" shape in the wire cutting device to form two axial sections in the X-axis direction; then, the conversion drive mechanism drives the conveying body to move the silicon rod positioning mechanism to position the silicon rod to the second processing area, where it is cut by the second cutting wire mesh in the Y-axis direction in an "=" shape in the wire cutting device to form two axial sections in the Y-axis direction, that is, to form a cut silicon rod with a rectangular cross-section; the cut silicon rod can also be converted to the third processing area for subsequent grinding operations.

[0353] In the aforementioned examples of the silicon rod cutting and grinding integrated machine, each cutting wheel in the wire cutting unit has at least two cutting grooves. Here, each wire cutting unit of the wire cutting device further includes at least one shifting mechanism for driving the at least one transition wheel to move along a second direction, so that the current wire groove wound around the cutting wire in the at least one transition wheel moves in the second direction from the first groove corresponding to the cutting wheel to the second groove corresponding to the cutting wheel. In this configuration, the transition wheel can be a single-groove transition wheel or a multi-groove transition wheel. Based on the driving action of the at least one shifting mechanism, the position of the wire groove around the transition wheel does not need to be changed, thus achieving groove changing on the cutting wheel. When the cutting wheel in the wire cutting unit of the first or second cutting unit group performs a squaring operation and the cutting groove is worn, the shifting mechanism can be used to change the position of the cutting groove around the cutting wheel, allowing the cutting wheel to be reused. Through the at least one shifting mechanism, the relative position of the cutting wire and the transition wheel does not need to be adjusted during groove changing. Here, the configuration of the shifting mechanism can be referred to as follows: Figures 23 to 29 The shifting mechanism described in any implementation of the illustrated embodiment.

[0354] In the silicon rod grinding integrated machine, the first processing area and the second processing area include two parallel wire cutting units. In some examples, the first processing area and the second processing area also include at least one adjusting mechanism. The adjusting mechanism may be associated with either the first wire cutting unit or the second wire cutting unit of the two wire cutting units, or simultaneously with both the first wire cutting unit and the second wire cutting unit. The adjusting mechanism may be configured as follows: Figures 23 to 29 The pitch adjustment mechanism described in any implementation of the illustrated embodiment may be connected to the first wire cutting unit or the second wire cutting unit via a lead screw, or connected to both the first and second wire cutting units via a bidirectional lead screw, or may be a servo motor, etc., which will not be elaborated here.

[0355] When the at least one adjusting mechanism drives multiple cutting wheels in the first wire cutting unit and / or the second wire cutting unit to move along the second direction, the first wire cutting unit and / or the second wire cutting unit may, for example, move along the side wing of the first support, i.e., move along the second direction (Y-axis direction) in the first cutting unit group; it can be used to adjust the cutting position of at least one wire saw in the first wire cutting unit and / or the second wire cutting unit, or change the cutting groove of the cutting wire wound around the multiple cutting wheels in the first wire cutting unit and / or the second wire cutting unit; the at least one adjusting mechanism cooperates with at least one shifting mechanism in the wire cutting unit to realize the groove changing without changing the wire groove used for winding the cutting wire in the transition wheel, and the position of the wire saw in the second direction remains unchanged before and after the groove changing.

[0356] The second cutting unit group has a similar structure to the first cutting unit group, the main difference being the different arrangement position and direction in the silicon rod cutting and grinding integrated machine; however, the structure and function of the at least one displacement mechanism and the at least one distance adjustment mechanism in the second cutting unit group are similar to those in the first cutting unit group, and will not be described again here.

[0357] It should be understood that in some embodiments, the positional relationship between the first processing area and the second processing area can be changed. For example, the first processing area and the second processing area can be set up such that the silicon rod switching device rotates the silicon rod by 60° to achieve switching between the two processing areas. Correspondingly, the direction of the wire cutting unit in the first cutting unit group and the second cutting unit group may also change. In this example, the first direction corresponding to the wire cutting unit in the first cutting unit group and the second cutting unit group changes respectively, but the wire cutting unit in either cutting unit group can still be switched by means of... Figures 23 to 29In any of the embodiments shown, at least one shifting mechanism is used to adjust the position of the transition wheel relative to the cutting wheel in the second direction. In some embodiments, different processing stations in the silicon rod cutting and grinding machine include, for example, only single-wire cutting units. In some embodiments, the silicon rod cutting and grinding machine has only one station for cutting. In one specific implementation, the cutting station can be equipped with an "=" shaped cutting wire mesh. After the silicon rod is cut once by lifting and lowering via the cutting wire mesh, the silicon rod positioning mechanism drives the silicon rod to rotate 90° for cutting again. The silicon rod cutting and grinding machine has various variations, which are not limited in this application.

[0358] In silicon rod squaring operations, edge skins are formed after the silicon rods are squared and cut. Therefore, these edge skins need to be unloaded. Currently, most edge skin unloading methods still involve operators manually detaching the edge skins from the cut silicon rods and carrying them out of the silicon rod squaring equipment. This is not only inefficient but also increases the risk of damage to the cut silicon rods due to collisions during handling. Therefore, it is necessary to propose a silicon rod squaring equipment and an edge skin unloading device applied to the equipment, enabling timely unloading of the edge skins and improving operational efficiency.

[0359] Furthermore, the need to transfer edge skins from the cutting area to the unloading area in the edge skin unloading device will occupy a certain amount of equipment space. By determining the structure and transfer path of the edge skin unloading device, the simplicity of the equipment layout and the transfer efficiency of the edge skin unloading device will also be different. Here, this application provides an edge skin unloading device, which is provided with an edge skin clamping mechanism for transferring edge skins. The edge skin clamping mechanism can transfer edge skins by rotating the swing arm, or it can be stored by rotating the swing arm in the non-transfer state, so that the edge skin unloading device occupies less equipment space, while simplifying the transfer path and improving the transfer efficiency.

[0360] In the various embodiments provided in the application, an edge unloading device for a silicon rod squaring equipment is provided. The silicon rod squaring equipment includes a base, a wire cutting device, and a silicon rod support structure. The silicon rod support structure is used to support vertically placed silicon rods. The wire cutting device includes a liftable wire cutting support and a wire cutting unit disposed on the wire cutting support. The wire cutting unit has a wire saw, which cuts the silicon rod to form a cut silicon rod and an edge. The edge unloading device includes: an edge lifting unit for lifting the edge so that the top of the edge protrudes from the cut silicon rod; and an edge clamping unit for clamping and transferring the edge. The edge clamping unit includes: a support column disposed on the base; a first mounting part disposed on the support column; and at least one set of edge clamping mechanisms connected to the first mounting part via a swing arm for clamping the edge and lifting the edge away from the cut silicon rod, and for controlled rotation around the swing arm axis to transfer the edge to the edge unloading area.

[0361] Please see Figure 30 and Figure 31 ,in, Figure 30 The diagram shown is a structural schematic of the edge unloading device of this application applied to a silicon rod squaring equipment in one embodiment. Figure 31 The figure shows a schematic diagram of the edge unloading device of this application in one embodiment. As shown, the silicon rod squaring equipment has a silicon rod bearing structure 11, which can be used to support vertically placed silicon rods. After the silicon rod is cut by the wire saw in the wire cutting device, the edge formed continues to stay on the silicon rod bearing structure 11 and close to the cut silicon rod due to its own gravity and the limiting effect of the silicon rod bearing structure 11. Therefore, it is necessary to make the edge formed after cutting relative to the cut silicon rod. The edge is clamped by the protruding part formed by the displacement. The edge is then transferred. The edge lifting unit described in this application is used to lift the edge so that the top of the edge protrudes from the cut silicon rod.

[0362] In some examples, the supporting surface of the silicon rod bearing structure in the silicon rod squaring equipment equipped with the edge unloading device is a planar structure. Therefore, the edge strips formed after cutting may fall or overturn due to the lack of corresponding support. In some embodiments, the edge unloading device also includes an edge strip support mechanism for supporting the edge strips formed after the silicon rod to be cut is squared. The edge strip lifting unit lifts the mechanism supported by the edge strip support mechanism. It should be noted that the edge strip support mechanism may also be a component of the silicon rod squaring equipment, or it may not be a necessary component of the edge unloading device or the silicon rod squaring equipment.

[0363] In one embodiment, see Figure 32The figure shows a schematic diagram of the edge support mechanism in one embodiment. As shown, the edge support mechanism 53 includes a support member, which includes a base 531 connected to one side of the silicon rod support structure 11 and a top support portion 532 extending upward from the base 531. The base 531 can also be configured as a flat plate structure, curved plate structure, or other irregular structure adapted to the side of the silicon rod support structure 11, and this application does not impose any restrictions. The top support portion 532 is configured as two top columns located on both sides of the base 531. The height of the top columns is consistent with the height of the bearing surface of the silicon rod support structure 11. In practice, the top support portion 532 can also be a top plate or top rod extending upward from the base 531. When the wire cutting device performs a square cut on the silicon rod to be cut on the silicon rod support structure 11, the support member can support the corresponding edge, thereby effectively preventing the cutting line segment in the wire cutting device from chipping when it passes through the silicon rod to be cut, and preventing the edge from falling off and overturning.

[0364] In another embodiment, the edge support mechanism includes a movable support member and a locking control member. In this embodiment, the movable support member includes a movable base connected to one side of the silicon rod support structure, a top support extending upward from the movable base, and a power generating structure providing vertical movement for the top support. In one implementation, the movable base may be, for example, a flat plate structure adapted to the side of the silicon rod support structure, but is not limited thereto; the movable base may also be, for example, a curved plate structure or other irregularly shaped structure. The top support consists of at least two top rods extending upward from the movable base, but is not limited thereto; the top support may also be, for example, a top plate or top column extending upward from the movable base. The power generating structure includes two legs located at the movable base and two springs respectively sleeved on the two legs, but is not limited thereto; the power generating structure may also employ, for example, a torsion spring, a spring sheet, or other structure. Utilizing the spring force, the legs and the connected top rods can move vertically relative to the silicon rod support structure. In this embodiment, the locking control component is used to lock the movable support component when it abuts against the bottom of the silicon rod to be cut. In one implementation, the locking control component can be, for example, an electromagnetic lock. In the initial state, the push rod protrudes from the bearing surface of the silicon rod support structure under the action of the support leg and the spring. When the silicon rod to be cut is placed, the push rod, after being pressed by the silicon rod to be cut, overcomes the elastic force of the spring and moves downward until the silicon rod to be cut is completely placed on the bearing surface of the silicon rod support structure. At this time, the electromagnetic lock, as the locking control component, is energized and uses the strong magnetic force generated by the principle of electromagnetism to tightly attract the movable base in the movable support component, thereby controlling the push rod in the locked state. When the wire cutting device performs a square cut on the silicon rod to be cut carried by the silicon rod support structure corresponding to the cutting area in the silicon rod conversion device, the movable support in the locked state can support the corresponding edge skin, which can effectively prevent the cutting wire mesh in the wire cutting unit from chipping when it passes through the silicon rod to be cut, and can also prevent the edge skin from falling off and overturning.

[0365] The edge skin lifting unit and the edge skin clamping unit can be used to protrude the edge skin located on the silicon rod support structure from the cut silicon rod and transfer it.

[0366] In some examples, the edge skin lifting unit includes a lifting member that can move vertically and is controlled to support the edge skin to lift it.

[0367] In one example, the edge skin lifting unit is mounted on the base via a lifting guide rail. After the edge skin is cut and formed, the edge skin lifting unit is controlled to rise and fall to the bottom of the silicon rod support structure and lift the edge skin from the bottom so that the edge skin protrudes from the cut silicon rod.

[0368] In another example, the edge lifting unit moves up and down via a liftable wire cutting support attached to the wire cutting device. (See also...) Figure 33 The diagram shows a schematic of the edge skin lifting unit 51 in one embodiment of the edge skin unloading device of this application. The edge skin lifting unit 51 includes a lifting member 511 disposed on the wire cutting support. The lifting member is driven by a telescopic member 512 to perform telescopic movement. After the lifting member 511 is controlled to perform an extension movement, it supports the bottom of the edge skin to lift the edge skin.

[0369] In one embodiment, the lifting member 511 includes a backing plate and a support plate. The backing plate extends upward from the bottom of the support plate. Further, the backing plate may be an arc-shaped plate adapted to the arc-shaped surface of the edge skin. When the backing plate abuts against the edge skin, it can fully contact the arc-shaped surface of the edge skin. The part of the backing plate that contacts the edge skin has a smooth design, or a buffer pad is added to the inner surface of the backing plate that contacts the edge skin. The support plate is used to support the bottom of the edge skin. Further, the support plate may be an arched plate adapted to the bottom surface of the edge skin. In other embodiments, the chord edge of the arched plate serving as the support plate may also be provided with protrusions to increase the contact area with the bottom surface of the edge skin.

[0370] In one embodiment, the telescopic component 512 is, for example, a cylinder with a telescopic rod. The telescopic rod can be connected to the support plate in the lifting component 511 via a connecting structure. The cylinder can drive the telescopic rod to cause the lifting component 511 to perform telescopic movement. Here, the telescopic movement of the lifting component 511 includes the contraction and extension movements of the lifting component 511. In practical scenarios, the contraction movement of the lifting component 511 is the cylinder driving the telescopic rod to contract, thereby moving the lifting component 511 away from the edge. The extension movement of the lifting component 511 specifically refers to the cylinder driving the telescopic rod to extend, thereby moving the lifting component 511 closer to the edge. Of course, the aforementioned telescopic component 512 can also be implemented in other ways. For example, the telescopic component 512 can also be a servo motor with a lead screw. The lead screw is connected to the lifting member 511. The servo motor drives the lead screw to rotate so as to drive the connected lifting member 511 to perform telescopic movement. For example, driving the lead screw to rotate in the forward direction to drive the lifting member 511 to perform contraction movement, and driving the lead screw to rotate in the reverse direction to drive the lifting member 511 to perform extension movement, or driving the lead screw to rotate in the forward direction to drive the lifting member 511 to perform extension movement and driving the lead screw to rotate in the reverse direction to drive the lifting member 511 to perform contraction movement.

[0371] In practical applications, in the initial state, the telescopic rod drives the lifting member 511 to be in a retracted state. The wire cutting unit is driven to descend with the wire cutting support, so that the cutting lines formed by the various cutting segments in the wire cutting unit perform a square cut on the silicon rod to be cut in the cutting area until the cutting segments penetrate the silicon rod to be cut, completing one complete cut of the silicon rod to be cut and forming an edge skin. At this time, the edge skin lifting mechanism has descended to the bottom with the wire cutting support. The cylinder drives the telescopic rod to extend, so that the lifting member 511 moves closer to the edge skin until the abutment plate in the lifting member 511 contacts the edge skin and abuts against it. Subsequently, the wire cutting unit is driven to... The wire cutting support rises, and the edge lifting mechanism rises with the wire cutting support, causing the edge to rise relative to the silicon rod that has already been cut once, so that the top of the edge protrudes from the silicon rod to be cut. When the protrusion of the top of the edge relative to the silicon rod to be cut meets the set conditions, the wire cutting support can be controlled to stop rising. In this way, the top of the edge can be used as the gripping force, so that the edge is gripped and unloaded. Then, the cylinder drives the telescopic rod to retract, so as to drive the lifting component 511 back to the initial state, while controlling the wire cutting support to drive the wire cutting unit and the edge lifting mechanism to continue to rise above the silicon rod to be cut in preparation for the next cutting operation.

[0372] In some examples, the edge lifting unit includes a retractable suction member that is controlled to extend and then abuts against the edge to lift it.

[0373] In one implementation, the edge lifting mechanism may include an adsorption member and a telescopic component that drives the adsorption member to extend and retract. The adsorption member, controlled by the telescopic component, abuts against and adsorbs the edge. The adsorption member may further include a stop plate and an adsorption element. The stop plate may be, for example, an arc-shaped plate adapted to the arc-shaped surface of the edge, and when the stop plate abuts against the edge, it can make full contact with the arc-shaped surface of the edge. The adsorption element may be, for example, a vacuum suction cup, and multiple vacuum suction cups may be arranged on the contact surface of the stop plate that will contact the edge. The telescopic component may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking a cylinder with a telescopic rod as an example, the telescopic rod can be connected to the stop plate in the lifting member through a connecting structure. The cylinder can drive the telescopic rod to retract to move the stop plate away from the edge, and the cylinder can drive the telescopic rod to extend to move the stop plate closer to the edge, and after the stop plate contacts the edge, the adsorption element adsorbs the edge. Subsequently, the wire cutting support is driven to rise, and the edge lifting mechanism and wire cutting device rise with the wire cutting support. The edge lifting mechanism uses adsorption force to drive the edge to rise relative to the cut silicon rod, so that the top of the edge protrudes out of the silicon rod that has undergone one cutting operation.

[0374] It should be noted that in some examples, the silicon rod squaring equipment is equipped with multiple cutting wheel sets to simultaneously cut multiple silicon rods to be cut. Therefore, multiple edge lifting mechanisms are provided on the wire cutting support corresponding to the multiple cutting wheel sets to simultaneously unload the edge material from the multiple silicon rods that have undergone cutting. When the wire cutting device includes one wire cutting unit, each downward cut of the wire cutting device forms one edge material. An edge lifting mechanism is provided above a pair of cutting wheels corresponding to each silicon rod support structure on the wire cutting support to promptly unload the edge material formed during the cutting operation. When the wire cutting device has two wire cutting units, each downward cut of the wire cutting device forms two edge materials. Two edge lifting mechanisms are provided above each silicon rod support structure on the wire cutting support to push the edge material formed during the cutting operation out of the cut silicon rod to achieve timely unloading of the edge material.

[0375] After the edge skin is formed as a protrusion relative to the cut silicon rod by the edge skin lifting unit, the edge skin clamping unit continues to displace the edge skin based on the protrusion to clamp the edge skin and transfer it to the unloading area.

[0376] Please continue reading. Figure 30 , Figure 31 ,like Figure 30 As shown, the edge clamping unit 52 includes a support column 521 disposed on the base 10 of the silicon rod squaring equipment. The support column 521 is, for example, at least one guide column disposed in a first direction as shown in the figure. The support column 521 is provided with a first mounting part 522 and an edge clamping mechanism 523 connected to the first mounting part 522. In the illustrated example, the support column 521 is disposed in the middle of the silicon rod squaring equipment in the first direction to reduce the distance from the edge clamping mechanism 523 to the edge. Of course, the position of the support column 521 is not limited to this.

[0377] The first mounting part 522 is disposed on the support column 521. The first mounting part 522 can serve as a transition part between the edge clamping mechanism 523 and the support column 521. In some examples, the first mounting part 522 is, for example, a support block that is movably or fixedly disposed on the support column 521.

[0378] The at least one set of edge-gripping mechanisms 523 is connected to the first mounting portion 522 via a swing arm 524. In some examples, the first mounting portion 522 is fixed at a preset height on the support column 521, the preset height being, for example, the top of the support column 521, to ensure that the edge-gripping mechanism 523 connected to the first mounting portion 522 can lift the edge away from the cut silicon rod after gripping it.

[0379] In other examples, the edge unloading device further includes a first lifting drive (not shown) for driving the first mounting part 522 to move up and down along the support column 521. Here, based on the first lifting drive controlling the movement of the first mounting part 522 along the support column 521, the edge clamping mechanism 523 connected to the first mounting part 522 can be driven to move up and down in space. The edge clamping mechanism 523 can thereby clamp and lift the edge. For example, after the edge is cut to form an edge, the first lifting drive drives the first mounting part 522 to descend so that the edge clamping mechanism 523 contacts and clamps the edge protruding from the cut silicon rod. The first lifting drive can then drive the edge clamping mechanism 523 in the clamping state to rise so that the edge is detached from the cut silicon rod.

[0380] The edge leather clamping mechanism 523 is a component used for clamping and transferring edge leather. The at least one set of edge leather clamping mechanisms 523 is connected to the first mounting part 522 via a swing arm 524. The swing arm 524 has a proximal end and a distal end. The proximal end of the swing arm 524 is located in the first mounting part 522, and the edge leather clamping mechanism 523 is located at the distal end, i.e., the extension end, of the swing arm 524.

[0381] The edge gripping mechanism 523 is controlled to rotate around the swing arm pivot 525. In some examples, the set of edge gripping mechanisms 523 refers to edge gripping mechanisms 523 that are shared by different swing arms 524 extension ends on the same swing arm pivot 525, such as... Figure 30 As shown, the set of edge leather clamping mechanisms 523 includes two edge leather clamping mechanisms 523, each edge leather clamping mechanism 523 being disposed at the extension end of a swing arm 524, and the proximal ends of different swing arms 524 in the set of edge leather clamping mechanisms 523 are connected to the same swing arm pivot 525. Here, the different swing arms 524 connected to the swing arm pivot 525 corresponding to the set of edge leather clamping mechanisms 523 can be of equal length (as shown in the figure). Figure 30(Example shown), of course, can also be set to unequal lengths; in actual scenarios, the included angle between different swing arms 524, the length of swing arms 524, and the position of the swing arm pivot 525 can be determined based on the position of the silicon rod support structure 11. Here, the position of the edge skin on the horizontal plane is determined by the position of the silicon rod support structure 11 and the cutting wire saw. It should be understood that one edge skin clamping mechanism 523 can be used to clamp the edge skin formed after the silicon rod on the silicon rod support structure 11 is cut. When the set of edge skin clamping mechanisms 523 includes multiple The edge clamping mechanism 523 corresponds to a silicon rod on a silicon rod support structure 11. The position of the swing arm pivot 525, the length of different swing arms 524, and the included angle between the swing arms 524 can be determined based on the position of the silicon rod support structure 11 (or the position of the vertically placed silicon rod). For example, based on the position of the swing arm pivot 525 when lifting the edge is preset by the first mounting part, the length of each swing arm 524 and the angle between the swing arms 524 are determined based on the line connecting the position of the swing arm pivot 525 and the different silicon rod support structures 11.

[0382] For example, such as Figure 30 In the example shown, the silicon rod support structure 11 on the silicon rod squaring device is set at equal intervals. Each set of edge skin clamping mechanism 523 clamps and transfers the edge skin formed by the cut silicon rod on the two silicon rod support structures 11. When the edge skin is lifted from the silicon rod support structure 11, the swing arm pivot 525 is located on the vertical plane of the two silicon rod support structures 11, and the two swing arms 524 connecting the swing arm pivot 525 are of equal length.

[0383] In some examples, each of the at least one set of edge clamping mechanisms includes at least one edge clamping mechanism, that is, the edge clamping mechanism included in the silicon rod unloading device can be one, two, three, four, etc.; wherein, the number of edge clamping mechanisms in one set of edge clamping mechanisms can be one, two, three, etc.

[0384] In such Figure 30 In the example shown, four silicon rod support structures are provided in the cutting area below the wire cutting device. Each set of edge-clamping mechanisms includes two edge-clamping mechanisms. The set of edge-clamping mechanisms located on both sides of the first mounting part removes the edge skin from the cut silicon rods on the two silicon rod support structures on the left and right sides of the base in the view. In some examples, the support column can be set at the midpoint of the base's length direction, that is, the projection of the first mounting part on the horizontal plane is located in the middle of the base. The set of edge-clamping mechanisms on both sides can be symmetrically arranged. It should be understood that based on the symmetrical structure of the silicon rod support structure of the silicon rod squaring equipment, this arrangement can reduce the space occupied by the equipment.

[0385] In some examples, the swing arm shaft 525 further includes a rotation drive device (not shown) for driving the edge skin clamping mechanism 523, connected to the extended end of the swing arm of the swing arm shaft 525, to rotate by a preset angle after clamping the edge skin and driving it to detach from the cut silicon rod, so as to transfer the edge skin to the edge skin unloading area. In one implementation, the swing arm shaft 525 is connected to the power output shaft of a drive motor, and the drive motor controls the rotation of the swing arm shaft 525, thereby causing the swing arm connected to the swing arm shaft 525 to rotate by a certain angle, and the edge skin clamping mechanism 523 at the extended end of the swing arm is transferred to the edge skin unloading area through the arc-shaped path formed by the rotation.

[0386] The edge gripping mechanism 523 can rotate around the swing arm pivot 525. Through the space above the base 10, when edge transfer is not required, such as when the silicon rod squaring equipment is in a stopped state, the edge gripping mechanism 523 can be stored above the base 10 based on the rotation of the swing arm pivot 525, which can save equipment space. Furthermore, the edge gripping mechanism 523 has a rotational degree of freedom based on the rotation of the swing arm pivot 525. Compared with a straight path, edge transfer through an arc path can reduce the transfer distance, thereby increasing the transfer efficiency of the edge.

[0387] In some examples, when the first mounting portion 522 is provided with swing arm pivots 525 on opposite sides, the swing arm pivots 525 on both sides rotate in opposite directions during edge-to-edge transport. For example, in... Figure 30 In this state, the projections of the edge clamping mechanisms 523 on both sides of the first mounting part 522 onto the silicon rod bearing structure 11 are located on the horizontal plane. The direction of rotation of the set of edge clamping mechanisms 523 on the left side of the view around the swing arm pivot 525 during transport is as follows: Figure 30 As shown by the arrow on the left, within a certain angle range, the edge gripping mechanism 523 moves away from the machine base in accordance with the direction of rotation; correspondingly, the set of edge gripping mechanisms 523 on the right side of the view rotates around the swing arm axis 525 in the following direction during transport. Figure 30 As shown by the arrow on the right, within a certain angle range, the edge gripping mechanism 523 moves away from the base in accordance with the direction of rotation. Of course, the edge gripping mechanisms 523 on both sides of the first mounting part 522 can rotate relatively independently. For example, each set of edge gripping mechanisms 523 is equipped with a rotation drive device corresponding to the swing arm pivot 525. The direction of rotation of the edge gripping mechanism 523 around the corresponding swing arm pivot 525 is not limited to this. The method described here includes: based on the position of the swing arm pivot 525, the edge gripping mechanism 523 corresponding to the swing arm pivot 525 is rotated in a direction away from the first mounting part 522 (or support column) when transferring the edge gripping mechanism.

[0388] In some embodiments, the first mounting portion further includes at least one moving mechanism that provides movement in at least one direction for setting the swing arm pivot.

[0389] Here, the swing arm and the edge gripping mechanism at the extended end of the swing arm, connected to the swing arm pivot, can move along the swing arm pivot in at least one direction provided by the at least one moving mechanism. This increases the degree of freedom of movement of the edge gripping mechanism, extending its range of motion to ensure that the range of motion of the edge gripping mechanism can transfer the edge to the unloading area; simultaneously, the first mounting part and its included at least one moving mechanism are located above the base, which can save equipment space.

[0390] In some examples, a set of edge clamping mechanisms is provided on each of the opposite sides of the first mounting part via a swing arm pivot. For example... Figure 30 or Figure 31 As shown, a moving mechanism 5221 is respectively provided on both sides of the first mounting part 522. In the illustrated embodiment, it is shown as a linear motion mechanism. The linear motion mechanism includes a linear guide rail 52211, which is arranged along the width direction of the silicon rod squaring device. The swing arm shaft 525 can move along the linear guide rail 52211 to drive its corresponding set of edge clamping mechanisms away from or towards the silicon rod bearing structure 11. In some examples, the moving mechanism 5221 also includes a moving drive device, such as a traveling motor, provided on the swing arm shaft 525. The traveling motor can be connected to the linear guide rail 52211, for example, through a traveling screw, so that the traveling motor drives the swing arm shaft 525 to move along the linear guide rail 52211.

[0391] In one embodiment, such as Figure 31 As shown, the moving mechanism 5221 includes a linear guide rail 52211 and a moving drive device, wherein the moving drive device includes a telescopic rod 52212 arranged along the direction of the linear guide rail 52211 and a drive source. In this example, the linear guide rail 52211 is disposed on the first mounting part 522 and arranged along the width direction of the base; the telescopic rod 52212 is collinearly arranged with the linear guide rail 52211, and the telescopic rod 52212 has a distal end and a proximal end, wherein the proximal end of the telescopic rod 52212 is connected to the drive source, and the distal end of the telescopic rod 52212 is connected to the swing arm pivot 525. Under the drive of the drive source, the distal end of the telescopic rod 52212 moves axially along the telescopic rod 52212 to drive the swing arm pivot 525 to move along the linear guide rail 52211.

[0392] In other possible implementations, the telescopic rod can also be replaced by a lead screw threaded to the swing arm shaft. Under the action of the drive source, the lead screw rotates along the lead screw axis to convert into linear motion along the lead screw axis at the swing arm shaft; or, the swing arm shaft is driven by a servo motor to move along a linear guide rail. This application does not impose any restrictions.

[0393] In some examples, each of the at least one set of edge leather clamping mechanisms includes: a clamping component for clamping or releasing the top end of the edge leather; and a second lifting drive structure for driving the clamping component to move up and down.

[0394] Please continue reading. Figure 31 As shown in the figure, the edge clamping mechanism 523 includes a second lifting drive structure 5232 and a clamping component 5231 disposed at the bottom of the second lifting drive structure 5232. In an embodiment, the second lifting drive structure 5232 is used to drive the clamping component 5231 to perform lifting and lowering movements. The second lifting drive structure 5232 may be, for example, a lifting cylinder with a lifting rod. The lifting rod is connected to the clamping component 5231. The lifting cylinder can control the extension and retraction of the lifting rod to drive the clamping component 5231 to perform lifting and lowering movements, but it is not limited to this. For example, the second lifting drive structure 5232 may also be a lead screw assembly driven by a motor. The lead screw assembly is connected to the clamping component 5231. The motor drives the lead screw assembly to lift and lower to drive the clamping component 5231 to perform lifting and lowering movements.

[0395] The clamping assembly is the part used to clamp the edge skin. In some examples, the clamping assembly includes a cover and a retractable clamping member. The cover is used to cover the edge skin, and the retractable clamping member is located inside the cover. The clamping member and the cover body form a clamping space for clamping the edge skin.

[0396] Please refer to the following: Figure 34 and Figure 35 ,in, Figure 34 The diagram shown is a structural schematic of the clamping assembly in one embodiment of the edge unloading device of this application. Figure 35 The figure shows a cross-sectional schematic diagram of the clamping assembly of the edge unloading device of this application in one embodiment. As shown, the clamping assembly 5231 includes a cover 52311 and a retractable clamping member 52312. The retractable clamping member 52312 is disposed inside the cover 52311, and a clamping space for clamping the edge is formed between the clamping member 52312 and the cover 52311. In this embodiment, the cover 52311 is used to cover the edge, and the size of the cover 52311 is slightly larger than the cross-sectional circle of the silicon rod to be cut. The cover 52311 can be configured as a closed or open circular cover, but is not limited thereto.

[0397] In some examples, the top of the main body of the cover 52311 has an opening for the edge skin to be lifted to protrude from the cover 52311. It should be understood that when the edge skin protrudes from the cover 52311, the contact area between the clamping member 52312, which is engaged with the cover 52311 to clamp the edge skin, reaches its maximum, which can be used to ensure the stability of the clamping assembly 5231 in clamping the edge skin.

[0398] In some examples, the inner wall of the cover 52311 is provided with nylon toothed strips 523111 for contacting the clamped edge skin, thereby increasing the friction between the outer side of the edge skin and the cover 52311 to facilitate lifting of the edge skin.

[0399] The structure of the clamping assembly is not limited thereto. In other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, with a clamping space formed between the clamping member and the arc-shaped plate for clamping the edge skin. [0400...

Claims

1. A wire cutting device for silicon rod processing equipment, characterized in that, The silicon rod processing equipment includes: a base with a silicon rod processing platform; a silicon rod bearing device disposed on the silicon rod processing platform for bearing the silicon rod to be cut; the wire cutting device includes: The cutting frame is mounted on the machine base; At least one wire cutting unit is movably mounted on the cutting frame; the wire cutting unit includes: The mounting beam is arranged along the first direction and is movably connected to the cutting frame; Multiple cutting wheels are sequentially arranged on the mounting beam along a first direction, each cutting wheel having at least two cutting grooves; At least one transition wheel is provided on the mounting beam, and each transition wheel has at least two wire grooves; A cutting line is sequentially wound around the plurality of cutting wheels and the at least one transition wheel to form at least one cutting wire saw; At least one adjusting mechanism is provided on the mounting beam of the at least one line cutting unit for driving the mounting beam and the plurality of cutting wheels and the at least one transition wheel on it to move along the second direction; When the entire mounting beam and its plurality of cutting wheels and at least one transition wheel are driven to move together in the second direction by the at least one adjusting mechanism, the at least one transition wheel and the plurality of cutting wheels remain relatively stationary, thereby changing the cutting line around the cutting line groove of the plurality of cutting wheels in the at least one line cutting unit.

2. The wire cutting device for silicon rod processing equipment according to claim 1, characterized in that, Multiple cutting wheels belonging to the same wire cutting unit are paired in pairs to form at least two cutting wheel groups. A transition wheel is provided between two adjacent cutting wheels in two adjacent cutting wheel groups. The transition wheel has at least two wire grooves. The cutting wire is sequentially wound around the cutting wheel and the transition wheel to form a wire saw between two cutting wheels in each cutting wheel group. The cutting wire passes through the cutting groove of the last cutting wheel in the preceding cutting wheel group and through the wire groove of the transition wheel before entering the cutting groove of the first cutting wheel in the following cutting wheel group.

3. The wire cutting device for silicon rod processing equipment according to claim 1, characterized in that, Multiple cutting wheels belonging to the same wire cutting unit include a first cutting wheel, a tail cutting wheel, and at least one intermediate cutting wheel located between the first and tail cutting wheels. A transition wheel is also provided on the side of the at least one intermediate cutting wheel. The transition wheel has at least two wire grooves. The cutting wire is sequentially wound around the cutting wheel and the transition wheel to form a wire saw on any two adjacent cutting wheels. When the cutting wire is wound around the intermediate cutting wheel, it exits through one of the at least two cutting grooves on the intermediate cutting wheel and passes through the adjacent transition wheel before entering through another of the at least two cutting grooves on the intermediate cutting wheel. This results in a cutting offset between any two adjacent wire saws in a second direction, and the cutting offset corresponds to the spacing between the two related cutting grooves.

4. The wire cutting device for silicon rod processing equipment according to claim 2 or 3, characterized in that, The at least one transition wheel is mounted on the mounting beam via a bracket.

5. The wire cutting device for silicon rod processing equipment according to claim 1, characterized in that, It includes a single-wire cutting unit; the adjusting mechanism includes: a lead screw, which is arranged along a second direction and threadedly connected to the single-wire cutting unit; and a drive source for driving the lead screw to rotate.

6. The wire cutting device for silicon rod processing equipment according to claim 1, characterized in that, It includes a single-wire cutting unit; the adjusting mechanism includes: a telescopic member, which is arranged along a second direction and associated with the single-wire cutting unit; and a driving source for driving the telescopic member to telescopically move along the second direction.

7. The wire cutting device for silicon rod processing equipment according to claim 1, characterized in that, It includes a single-wire cutting unit; the pitch adjustment mechanism includes: a rack, disposed in the single-wire cutting unit along a second direction; a transmission gear, meshing with the rack; and a drive source for driving the transmission gear to rotate.

8. The wire cutting device for silicon rod processing equipment according to claim 1, characterized in that, The device includes a first wire cutting unit and a second wire cutting unit arranged opposite each other along a second direction. At least one of the first wire cutting unit and the second wire cutting unit is driven to move along the second direction by the at least one pitch adjustment mechanism, for changing the cutting wire around the cutting grooves of the plurality of cutting wheels in the first wire cutting unit and / or the cutting grooves of the plurality of cutting wheels in the second wire cutting unit.

9. The wire cutting device for silicon rod processing equipment according to claim 8, characterized in that, The adjusting mechanism includes: A lead screw, arranged in a second direction and threadedly connected to the first wire cutting unit or the second wire cutting unit; and A drive source for driving the lead screw to rotate.

10. The wire cutting device for silicon rod processing equipment according to claim 8, characterized in that, The adjusting mechanism includes: A telescopic component is provided along a second direction and is associated with the first wire cutting unit or the second wire cutting unit; A drive source is used to drive the telescopic member to extend and retract along the second direction.

11. The wire cutting device for silicon rod processing equipment according to claim 8, characterized in that, The adjusting mechanism includes: A rack, along a second direction and associated with either the first wire cutting unit or the second wire cutting unit; The transmission gear meshes with the rack; A drive source is used to drive the transmission gear to rotate.

12. The wire cutting device for silicon rod processing equipment according to claim 8, characterized in that, The adjusting mechanism includes: A bidirectional lead screw, arranged along a second direction and threadedly connected to the first wire cutting unit and the second wire cutting unit; and A drive source is used to drive the lead screw to rotate so that the first wire cutting unit and the second wire cutting unit move toward each other or away from each other along a second direction.

13. The wire cutting device for silicon rod processing equipment according to claim 8, characterized in that, The adjusting mechanism includes: The first rack is along the second direction and is associated with the first wire cutting unit; The second rack is along the second direction and is associated with the second wire cutting unit; The transmission gear meshes with the first rack and the second rack; A drive source is used to drive the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move toward each other or away from each other along a second direction.

14. A silicon rod processing device, characterized in that, include: The machine base has a silicon rod processing platform; A silicon rod support device is provided on the silicon rod processing platform for supporting the silicon rod to be cut; The wire cutting apparatus as described in any one of claims 1 to 13.

15. The silicon rod processing equipment according to claim 14, characterized in that, The silicon rod processing equipment is a silicon rod squaring machine, a silicon rod cutting machine, or a silicon rod cutting and grinding integrated machine.

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