Electronic device

Abstract

An electronic device comprising: a display layer; and a sensor layer on the display layer and having an active area and a peripheral area adjacent to the active area, the sensor layer including a plurality of sensing cells in the active area and a plurality of wirings in the peripheral area, wherein each of the plurality of sensing cells includes a plurality of sub-sensing cells, wherein each of the plurality of sub-sensing cells includes: a first portion extending in a first direction; a plurality of second portions protruding from the first portion; a plurality of cross patterns spaced apart from each other, the first portion being between the plurality of cross patterns; and a bridge pattern insulated from the first portion and electrically connected to the plurality of cross patterns, the bridge pattern intersecting the first portion, wherein the plurality of wirings includes a first wiring and a second wiring electrically connected to the plurality of sub-sensing cells.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0077314, filed on June 24, 2020, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] Some aspects of embodiments of the present invention relate to an electronic device with increased detection reliability. Background Technology

[0004] The electronic device can detect external input applied from outside the device. External input can be user input, which may include the user's body parts, light, heat, a pen, pressure, or various other types of external input. The electronic device can use electromagnetic resonance (EMR) or active electrostatic discharge (AES) to identify the pen's coordinate information.

[0005] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0006] Some aspects of embodiments of the present invention include an electronic device with increased detection reliability.

[0007] According to some embodiments of the present invention, an electronic device may include: a display layer; and a sensor layer, the sensor layer being on the display layer and having an active region and a peripheral region adjacent to the active region. The sensor layer may include a plurality of sensing units in the active region and a plurality of wirings in the peripheral region. Each of the plurality of sensing units may include a plurality of sub-sensing units. Each of the plurality of sub-sensing units may include: a first portion extending in a first direction; a plurality of second portions protruding from the first portion; a plurality of intersecting patterns spaced apart from each other, with the first portion between the plurality of intersecting patterns; and a bridging pattern insulated from the first portion and electrically connected to the plurality of intersecting patterns, the bridging pattern intersecting the first portion. The plurality of wirings may include first wirings and second wirings electrically connected to the plurality of sub-sensing units.

[0008] In some embodiments, each of the plurality of intersecting patterns may include: a first intersecting portion extending in a second direction intersecting the first direction; and a plurality of second intersecting portions protruding from the first intersecting portion and adjacent to the plurality of second portions.

[0009] In some embodiments, the plurality of second portions may include: a plurality of first pattern portions protruding from the first portion in the second direction; a plurality of second pattern portions protruding correspondingly from the plurality of first pattern portions in a direction adjacent to the first intersecting portion; and a plurality of third pattern portions protruding in a first intersecting direction intersecting the first direction and the second direction.

[0010] In some embodiments, the plurality of second intersecting portions may include: a plurality of first intersecting pattern portions correspondingly surrounding the plurality of first pattern portions and the plurality of second pattern portions; and a plurality of second intersecting pattern portions correspondingly protruding in a direction facing the plurality of third pattern portions.

[0011] In some embodiments, each of the plurality of sub-sensing units may further include a plurality of dummy components, which are correspondingly located between the plurality of first pattern portions, the plurality of second pattern portions, the plurality of third pattern portions, and the plurality of second cross pattern portions.

[0012] In some embodiments, the plurality of second intersecting portions may include: a plurality of first intersecting pattern portions protruding from the first intersecting portion in the first direction; and a plurality of second intersecting pattern portions protruding correspondingly from the plurality of first intersecting pattern portions in a direction adjacent to the first portion.

[0013] In some embodiments, the plurality of second portions may include: a plurality of first pattern portions correspondingly surrounding the plurality of first intersecting pattern portions and the plurality of second intersecting pattern portions; and a plurality of second pattern portions correspondingly spaced apart from the plurality of first pattern portions, the plurality of first intersecting pattern portions and the plurality of second intersecting pattern portions being between the plurality of first pattern portions and the plurality of second pattern portions.

[0014] In some embodiments, the plurality of second portions may include: a plurality of first pattern portions protruding from the first portion in a first intersecting direction intersecting the first direction and the second direction; and a plurality of second pattern portions protruding from the first portion in a second intersecting direction intersecting the first intersecting direction.

[0015] In some embodiments, the plurality of second intersecting portions may surround the plurality of second portions.

[0016] In some embodiments, the plurality of sub-sensing units may further include: a plurality of dummy components, the plurality of dummy components being correspondingly located between the plurality of second intersection portions and the plurality of second portions.

[0017] In some embodiments, the plurality of second intersecting portions may include: a plurality of first intersecting pattern portions adjacent to the plurality of first pattern portions and protruding from the first intersecting portions in the first intersecting direction; and a plurality of second intersecting pattern portions adjacent to the plurality of second pattern portions and protruding from the first intersecting portions in the second intersecting direction.

[0018] In some embodiments, each of the plurality of sub-sensing units may include: a plurality of first dummy portions correspondingly located between the plurality of first pattern portions and the plurality of first cross pattern portions; and a plurality of second dummy portions correspondingly located between the plurality of second pattern portions and the plurality of second cross pattern portions.

[0019] In some embodiments, the plurality of second portions may protrude from the first portion in the second direction. The plurality of second intersecting portions may protrude from the first intersecting portion in the first direction.

[0020] In some embodiments, each of the plurality of sensing units may have a first region, a plurality of second regions, and a plurality of third regions, wherein the plurality of second regions are adjacent to the first region in a first direction, and the plurality of third regions are adjacent to the first region in a second direction, the second direction intersecting the first direction. The first region may be provided with a first portion, the plurality of second portions, the plurality of intersection patterns, and the bridging pattern. Each of the plurality of second regions may be provided with the first portion and the plurality of second portions. Each of the plurality of third regions may be provided with the plurality of intersection patterns.

[0021] In some embodiments, each of the plurality of sub-sensing units may further include a dummy electrode. Each of the plurality of sub-sensing units may have a first region and a second region surrounding the first region. The first region may be provided with a first portion, the plurality of second portions, the plurality of cross patterns, the bridging pattern, and the dummy electrode. The second region may be provided with the first portion, the first cross portion, and the dummy electrode.

[0022] In some embodiments, each of the plurality of wires may be connected to the sub-sensing unit adjacent to the peripheral region.

[0023] In some embodiments, each of the plurality of wirings may be connected to one of the sub-sensing units adjacent to the peripheral region. The sensor layer may also include a plurality of connection patterns connecting the plurality of sub-sensing units to each other.

[0024] In some embodiments, the first wiring may be electrically connected to the first portion and the plurality of second portions. The second wiring may be electrically connected to the plurality of cross patterns and the bridging patterns.

[0025] According to some embodiments of the present invention, an electronic device may include: a display layer; and a sensor layer, the sensor layer being on the display layer and having an active region and a peripheral region adjacent to the active region. The sensor layer may include a first electrode, a second electrode, a third electrode, and a plurality of wirings, the first electrode and the second electrode extending in a first direction, and the third electrode extending in a second direction intersecting the first direction. The first electrode, the second electrode, and the third electrode may be located in the active region. The plurality of wirings may be located in the peripheral region. The first electrode may include: a first electrode portion extending in the first direction; and a plurality of first protrusions protruding from the first electrode portion. The second electrode may include: a second electrode portion extending in the first direction; and a plurality of second protrusions protruding from the second electrode portion. The third electrode may include: a third electrode portion extending in the second direction; and a plurality of third protrusions correspondingly surrounding the plurality of first protrusions and the plurality of second protrusions. The plurality of wirings may include: a first wiring, the first wiring being electrically connected to the first electrode and the second electrode; and a second wiring, the second wiring being electrically connected to the third electrode.

[0026] In some embodiments, the sensor layer may further include a plurality of bridging patterns electrically connected to opposite ends of the third electrode. Attached Figure Description

[0027] Figure 1 The illustration shows a perspective view of an electronic device according to some embodiments of the present invention.

[0028] Figure 2 The illustration shows a simplified block diagram of an input device and an electronic device according to some embodiments of the present invention.

[0029] Figure 3 The illustration shows a cross-sectional view of an electronic device according to some embodiments of the present invention.

[0030] Figure 4 The illustration shows a plan view of a sensor layer according to some embodiments of the present invention.

[0031] Figure 5A The illustration shows a plan view of one of a plurality of sensing units according to some embodiments of the present invention.

[0032] Figure 5B The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention.

[0033] Figure 6A The diagram follows Figure 5A The cross-sectional view taken from line I-I'.

[0034] Figure 6B The diagram follows Figure 4 The cross-sectional view taken from line II-II'.

[0035] Figure 7 The illustration shows a plan view of one of a plurality of sensing units according to some embodiments of the present invention.

[0036] Figure 8 The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention.

[0037] Figure 9 The illustration shows a plan view of one of a plurality of sensing units according to some embodiments of the present invention.

[0038] Figure 10 The illustration shows a plan view of one of a plurality of sensing units according to some embodiments of the present invention.

[0039] Figures 11 to 16 The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention.

[0040] Figure 17 The illustration shows a schematic diagram of a sensor layer in a first mode according to some embodiments of the present invention.

[0041] Figure 18A and Figure 18B The illustration shows a schematic diagram of a sensor layer in a second mode according to some embodiments of the present invention.

[0042] Figure 19 The illustration shows a sensor layer in a first mode according to some embodiments of the present invention. Detailed Implementation

[0043] In this description, when a component (or region, layer, section, etc.) is referred to as being "on", "connected to", or "coupled to" other components, a component may be directly arranged on or located on other components, directly connected to or directly coupled to other components, or at least one intermediate component may exist between a component and other components.

[0044] The same reference numerals indicate the same components. Furthermore, in the accompanying drawings, the thickness, proportions, and dimensions of the components are exaggerated to effectively explain the technical content.

[0045] The term "and / or" includes one or more combinations defined by the relevant components.

[0046] It will be understood that although the terms first, second, etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another. For example, a first component may be referred to as a second component without departing from the spirit and scope of the inventive concept, and vice versa. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form.

[0047] In addition, the spatial relative terms “below,” “lower,” “above,” and “upper” are used in this document to describe the relationship between one component illustrated in the accompanying drawings and other components(s). Besides the orientations depicted in the accompanying drawings, the spatial relative terms are intended to also cover different orientations.

[0048] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, unless expressly defined herein, terms defined in a general dictionary shall be interpreted as having the same meaning as defined in that field or as defined in that field according to the context, and shall not be construed as having an idealized or overly formal meaning.

[0049] It should be understood that the terms “comprising,” “including,” and “having” are used to specify the presence of the stated features, wholes, steps, operations, components, elements, or combinations thereof, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, components, elements, or combinations thereof.

[0050] Now, aspects of some embodiments of the present invention will be described below with reference to the accompanying drawings.

[0051] Figure 1 The illustration shows a perspective view of an electronic device according to some embodiments of the present invention.

[0052] Reference Figure 1 The electronic device 1000 can be a device activated by an electrical signal. For example, the electronic device 1000 can be a mobile phone, tablet computer, car navigation system, game console, or wearable device, but is not limited thereto according to embodiments of the present invention. Figure 1 An example depicting a mobile phone as an electronic device 1000.

[0053] Electronic device 1000 can display an image at an active region 1000A. Active region 1000A may include a plane defined by a first direction DR1 and a second direction DR2. The thickness direction of electronic device 1000 may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2 (e.g., in a direction perpendicular or orthogonal to the plane defined by the first direction DR1 and the second direction DR2). The third direction DR3 may be used as a reference to define the front and rear surfaces (or top and bottom surfaces) of each of the components constituting electronic device 1000.

[0054] The electronic device 1000 can detect input applied from outside the electronic device 1000. External input can be user input. User input can include the user's body (e.g., a finger), light, heat, pressure, or various other types of external input.

[0055] Figure 1 The electronic device 1000 shown can detect input from a user's touch or input device 2000. The input device 2000 can direct input to a device other than the user's body. For example, the input device 2000 can be an active pen, a stylus, a stylus, or an electronic pen. An example using an active pen as the input device 2000 will be described below.

[0056] Electronic device 1000 and input device 2000 can each perform bidirectional communication. Electronic device 1000 can transmit uplink signal ULS (see example) Figure 2 The uplink signal ULS may be provided to the input device 2000. For example, the uplink signal ULS may include a synchronization signal or information about the electronic device 1000, but is not particularly limited thereto according to embodiments of the invention. The input device 2000 may provide the downlink signal DLS (see, for example) to the input device 2000. Figure 2 The input device 2000 is provided with a downlink signal (DLS). The downlink signal (DLS) may include a synchronization signal or information about the state of the input device 2000. For example, the downlink signal (DLS) may include coordinate information of the input device 2000, battery information of the input device 2000, tilt information of the input device 2000, and / or various information stored in the input device 2000, but is not particularly limited thereto according to embodiments of the present invention.

[0057] Figure 2 The illustration shows a simplified block diagram of an input device and an electronic device according to some embodiments of the present invention.

[0058] Reference Figure 2 The electronic device 1000 may include a display layer 100 and a sensor layer 200.

[0059] Display layer 100 can be a component that substantially generates an image. Display layer 100 can be an emitting display layer, such as an organic light-emitting display layer, a quantum dot display layer, a micron LED display layer, or a nano LED display layer. However, embodiments according to this disclosure are not limited thereto, and display layer 100 can be any suitable emitting display layer depending on the design of electronic device 1000.

[0060] The sensor layer 200 may be located on the display layer 100. The sensor layer 200 can detect external input applied from the outside. The sensor layer 200 can detect not only input from the user's body 3000, but also input from the input device 2000.

[0061] The user's body 3000 can have an input area with a first width WE1.

[0062] The sensor layer 200 can operate using a time-division driving method. For example, the sensor layer 200 can be driven alternately and repeatedly in a first mode and a second mode. Input from the user's body 3000 can be detected in the first mode, and input from the input device 2000 can be detected in the second mode.

[0063] When the second mode begins, sensor layer 200 can provide uplink signal ULS to input device 2000. When input device 2000 receives uplink signal ULS and synchronizes with electronic device 1000, input device 2000 can provide downlink signal DLS to sensor layer 200.

[0064] Input device 2000 may include a power supply 2100, a memory 2200, a controller 2300, a transmitter 2400, a receiver 2500, and a pen electrode 2600. However, the components of input device 2000 are not limited to those mentioned above. For example, input device 2000 may also include an electrode switch for switching the pen electrode 2600 to a signal transmission mode or a signal reception mode, a pressure sensor for detecting pressure, or a rotation sensor for detecting rotation.

[0065] Pen electrode 2600 may include a first pen electrode 2610 (see example) Figure 5A ) and the second electrode 2620 (see example) Figure 5AThe first electrode 2610 can be located at one end of the input device 2000. The second electrode 2620 can be located on the side surface of the input device 2000. The sensor layer 200 can obtain the coordinates of the input device 2000 through the first electrode 2610, and can also obtain the tilt of the input device 2000 through the second electrode 2620.

[0066] The pen electrode 2600 may have an input area with a second width WE2. The second width WE2 of the input area of ​​the pen electrode 2600 may be smaller than the first width WE1 of the input area of ​​the user's body 3000.

[0067] Power supply 2100 may include one of a battery and a high-capacitance capacitor, each of which provides power to input device 2000. Memory 2200 may store information about the functionality of input device 2000. Controller 2300 may control the operation of input device 2000. Each of transmitter 2400 and receiver 2500 may communicate with electronic device 1000 via pen electrode 2600. Transmitter 2400 may be referred to as a signal generator or transmitting circuit, and receiver 2500 may be referred to as a signal receiver or receiver circuit.

[0068] Figure 3 The illustration shows a cross-sectional view of an electronic device according to some embodiments of the present invention.

[0069] Reference Figure 3 The display layer 100 may include a substrate layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0070] The substrate layer 110 may be a component providing a substrate surface, and the circuit layer 120 is located on the substrate surface. The substrate layer 110 may be a glass substrate, a metal substrate, or a polymer substrate. However, some embodiments of the present invention are not limited thereto, and the substrate layer 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0071] The substrate layer 110 may have a multilayer structure. For example, the substrate layer 110 may include a first synthetic resin layer and silicon dioxide (SiO2) located on the first synthetic resin layer. xThe first and second synthetic resin layers comprise a silicon oxide layer, an amorphous silicon (a-Si) layer situated on the silicon oxide layer, and a second synthetic resin layer situated on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as substrate barrier layers. Each of the first and second synthetic resin layers may comprise a polyimide-based resin. Alternatively or additionally, each of the first and second synthetic resin layers may comprise at least one selected from acrylate-based resins, methacrylate-based resins, polyisoprene-based resins, vinyl resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and perylene-based resins. In this description, the term "X-based resin" may refer to a resin comprising the functional group X.

[0072] Circuit layer 120 may be located on substrate layer 110. Circuit layer 120 may include dielectric layers, semiconductor patterns, conductive patterns, and signal lines, etc. Dielectric layers, semiconductor layers, and conductive layers may be formed on substrate layer 110 using coating and deposition processes, and then photolithography processes may be performed multiple times to selectively pattern the dielectric layers, semiconductor layers, and conductive layers. Subsequently, semiconductor patterns, conductive patterns, and signal lines included in circuit layer 120 may be formed.

[0073] At least one inorganic layer may be formed on the top surface of the substrate layer 110. The inorganic layer may include at least one selected from alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed to have a multilayer structure. The multilayer inorganic layers may constitute a barrier layer and / or a buffer layer. In some embodiments, the display layer 100 is illustrated to include a buffer layer BFL.

[0074] The buffer layer (BFL) can increase the adhesion between the substrate layer 110 and the semiconductor pattern. The buffer layer (BFL) may include a silicon oxide layer and a silicon nitride layer, and the silicon oxide layer and silicon nitride layer may be stacked alternately.

[0075] The semiconductor pattern may be located on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, embodiments of the invention are not limited thereto, and the semiconductor pattern may include amorphous silicon or metal oxide.

[0076] Figure 3 Only portions of the semiconductor pattern are depicted, and the semiconductor pattern can also be arranged in other areas. The semiconductor pattern can be specifically distributed throughout the pixel arrangement. The semiconductor pattern can have different electrical properties based on whether it is doped. The semiconductor pattern can include a first region with high conductivity and a second region with low conductivity. The first region can be doped with n-type or p-type impurities. A p-type transistor can include a doped region implanted with p-type impurities, and an n-type transistor can include a doped region implanted with n-type impurities. The second region can be an undoped region, or it can be implanted with impurities at a concentration lower than that implanted into the first region.

[0077] The first region can have a higher conductivity than the second region and can be used essentially as an electrode and signal line. The second region can essentially correspond to the active region (or channel) of a transistor. For example, a portion of the semiconductor pattern can be the active region of a transistor, another portion of the semiconductor pattern can be the source or drain of a transistor, and yet another portion of the semiconductor pattern can be a connecting electrode or a connecting signal line.

[0078] Each pixel can have an equivalent circuit consisting of seven transistors, a capacitor, and a light-emitting element, and the equivalent circuit of a pixel can be modified in different ways. Figure 3 A pixel comprising a transistor 100PC and a light-emitting element 100PE is depicted by way of example.

[0079] The source SC1, active region A1, and drain D1 of transistor 100PC can be formed from a semiconductor pattern. When viewed in cross-section, the source SC1 and drain D1 can extend from the active region A1 in opposite directions. Figure 3 The connection signal line SCL, formed by a semiconductor pattern, is partially shown. According to some embodiments, when viewed in a plan view, the connection signal line SCL may be electrically connected to the drain D1 of transistor 100PC.

[0080] The first dielectric layer 10 may be located on the buffer layer BFL. The first dielectric layer 10 may overlap with multiple pixels and may cover a semiconductor pattern. The first dielectric layer 10 may be one or more of inorganic and organic layers, and may have a single-layer or multi-layer structure. The first dielectric layer 10 may include at least one selected from alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In some embodiments, the first dielectric layer 10 may be a single-layer silicon oxide layer. Similar to the first dielectric layer 10, the dielectric layer of the circuit layer 120 may be one or more of inorganic and organic layers, and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the materials mentioned above, but is not limited thereto by embodiments of the present invention.

[0081] Transistor 100PC may have a gate G1 located on the first dielectric layer 10. Gate G1 may be a portion of a metal pattern. Gate G1 may overlap with the active region A1. When doping a semiconductor pattern, gate G1 may be used as a mask.

[0082] The second dielectric layer 20 may be located on the first dielectric layer 10 and may cover the gate G1. The second dielectric layer 20 may overlap with the pixel. The second dielectric layer 20 may be one or more of inorganic and organic layers, and may have a single-layer or multi-layer structure. In some embodiments, the second dielectric layer 20 may be a single-layer silicon oxide layer.

[0083] The third dielectric layer 30 may be located on the second dielectric layer 20, and in some embodiments, the third dielectric layer 30 may be a single layer of silicon oxide.

[0084] The first connection electrode CNE1 can be located on the third dielectric layer 30. The first connection electrode CNE1 can be coupled to the connection signal line SCL through the contact hole CNT-1, which penetrates the first dielectric layer 10, the second dielectric layer 20 and the third dielectric layer 30.

[0085] The fourth dielectric layer 40 may be located on the third dielectric layer 30. The fourth dielectric layer 40 may be a single layer of silicon oxide. The fifth dielectric layer 50 may be located on the fourth dielectric layer 40. The fifth dielectric layer 50 may be an organic layer.

[0086] The second connection electrode CNE2 can be located on the fifth dielectric layer 50. The second connection electrode CNE2 can be coupled to the first connection electrode CNE1 through the contact hole CNT-2, which penetrates the fourth dielectric layer 40 and the fifth dielectric layer 50.

[0087] The sixth dielectric layer 60 may be located on the fifth dielectric layer 50 and may cover the second connection electrode CNE2. The sixth dielectric layer 60 may be an organic layer. The light-emitting element layer 130 may be located on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include organic light-emitting materials, quantum dots, quantum rods, micron LEDs, or nano LEDs. The light-emitting element 100PE may include a first electrode AE, an emitting layer EL, and a second electrode CE.

[0088] The first electrode AE ​​can be located on the sixth dielectric layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the contact hole CNT-3, which penetrates the sixth dielectric layer 60.

[0089] The pixel defining layer 70 may be located on the sixth dielectric layer 60 and may cover a portion of the first electrode AE. An opening 70-OP may be defined in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 may expose at least a portion of the first electrode AE. According to some embodiments, the light-emitting region PXA may be defined as a portion corresponding to the first electrode AE, which is exposed through the opening 70-OP. A non-light-emitting region NPXA may surround the light-emitting region PXA.

[0090] The emitting layer EL can be located on the first electrode AE. The emitting layer EL can be located in the opening 70-OP. For example, multiple emitting layers EL can be formed in corresponding pixels. When the emitting layer EL is formed in a corresponding pixel, each emitting layer EL can emit light having at least one of blue, red, and green. However, embodiments of the present invention are not limited to this, and emitting layers EL commonly connected to pixels can be provided. In this case, the emitting layer EL can provide blue light or white light.

[0091] The second electrode CE can be located on the emitter layer EL. The second electrode CE can coexist in multiple pixels while having a single monolithic shape. The second electrode CE can be supplied with a common voltage and can be referred to as the common electrode.

[0092] According to some embodiments, a hole control layer may be located between the first electrode AE ​​and the emitter layer EL. The hole control layer may coexist within the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer may be located between the emitter layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. An open mask can be used to form the hole control layer and the electron control layer, which are co-arranged in multiple pixels.

[0093] The encapsulation layer 140 may be located on the light-emitting element layer 130. The encapsulation layer 140 may include inorganic layers, organic layers and inorganic layers stacked in sequence, but no restrictions are imposed on the constituent layers of the encapsulation layer 140.

[0094] The inorganic layer protects the light-emitting element layer 130 from moisture and oxygen, while the organic layer protects the light-emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but is not limited to this according to embodiments of the invention.

[0095] The sensor layer 200 can be formed on the display layer 100 using a continuous process. In this case, it can be expressed as the sensor layer 200 being directly disposed on the display layer 100. The phrase "directly disposed on" or "directly located on" can indicate that a third component is not located between the sensor layer 200 and the display layer 100. For example, the adhesive member is not located solely between the sensor layer 200 and the display layer 100. In this case, the thickness of the electronic device 1000 can be reduced.

[0096] The sensor layer 200 may include a substrate dielectric layer 201, a first conductive layer 202, a sensing dielectric layer 203, a second conductive layer 204, and a cover dielectric layer 205.

[0097] The substrate dielectric layer 201 may be an inorganic layer comprising one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the substrate dielectric layer 201 may be an organic layer comprising an epoxy resin, an acrylic resin, or an imide resin. The substrate dielectric layer 201 may have a monolayer structure or a multilayer structure stacked along the third direction DR3.

[0098] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure stacked along the third direction DR3.

[0099] The single-layer conductive layer may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium zinc tin oxide (IZTO). Alternatively or additionally, the transparent conductive layer may include metal nanowires, graphene, or conductive polymers such as poly(3,4-ethylene dioxythiophene): PEDOT.

[0100] The multilayer conductive layer may include a metal layer. The metal layer may include, for example, a three-layer structure of titanium / aluminum / titanium. The multilayer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0101] One or both of the sensing dielectric layer 203 and the covering dielectric layer 205 may include an inorganic layer. The inorganic layer may include at least one selected from alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0102] Parasitic capacitance Cb can appear between sensor layer 200 and the second electrode CE. A decrease in the distance between sensor layer 200 and the second electrode CE can cause an increase in parasitic capacitance Cb. The larger the parasitic capacitance Cb, the smaller the rate of change of capacitance relative to a reference value. Changes in capacitance can be indicated from an input device (e.g., input device 2000, see example...) Figure 2 ) or the user's body 3000 (see example) Figure 2 The capacitance change that occurs before and after the input.

[0103] The driver chip that processes the signal detected from sensor layer 200 can perform a leveling operation to remove the value of the corresponding parasitic capacitance Cb from the detected signal. The leveling operation can increase the rate of change of capacitance relative to a reference value, and thus improve the detection sensitivity.

[0104] However, the ability to remove the value of the corresponding parasitic capacitance Cb can depend on the specifications of the driver chip. For example, when approximately 500 pF is specified as the maximum value of the parasitic capacitance Cb, and when approximately 200 pF is assigned to the driver chip as the value of the parasitic capacitance Cb that can be removed from the signal detected by the sensor layer 200, the driver chip may not be able to sufficiently reduce the reference value. In this case, the rate of change of capacitance may be insignificant compared to the reference value, and therefore the driver chip may not be able to detect the capacitance change, or may interpret the capacitance change as noise, which could lead to a failure to detect touch coordinates. According to the invention, the electrode structure of the sensor layer 200 can be modified such that the maximum value of the parasitic capacitance Cb can be reduced to below a certain value. In this case, even when the driver chip has low performance, it is possible to improve the accuracy of coordinate detection. This certain value may be approximately 200 pF, but is not particularly limited to this according to embodiments of the invention.

[0105] Figure 4 The illustration shows a plan view of a sensor layer according to some embodiments of the present invention.

[0106] Reference Figure 4 The sensor layer 200 may include an active region 200A and a peripheral region 200N. The active region 200A may be a region activated by an electrical signal. For example, the active region 200A may be an input detection unit. The active region 200A may be referred to as a sensing region. The peripheral region 200N may surround the active region 200A.

[0107] The sensor layer 200 may include a substrate dielectric layer 201, multiple sensing units 210, and multiple wiring lines 220. The multiple sensing units 210 may be located in an active region 200A. The multiple wiring lines 220 may be located in a peripheral region 200N.

[0108] The plurality of sensing units 210 may have a first spacing PC1. The first spacing PC1 of the plurality of sensing units 210 may be less than 3000 mm of the user's body (see figure 3000). Figure 2 The first width of the input region WE1 (see) Figure 2 The first spacing PC1 can be in the range of approximately 3.5 mm to approximately 4.5 mm. For example, the first spacing PC1 can be approximately 4 mm. According to the invention, each of the plurality of sensing units 210 can have an area smaller than the area of ​​the input region of the user's body 3000. Therefore, the sensor layer 200 can accurately detect the coordinates input by the user's body 3000.

[0109] Each of the plurality of sensing units 210 may include a plurality of sub-sensing units SU. As follows: Figure 5AAs discussed herein, electrode 211 and cross electrode 212 may intersect each other at each of the plurality of sub-sensing units SU.

[0110] Multiple sub-sensing units SU may have a second spacing PC2. The second spacing PC2 of the multiple sub-sensing units SU may be smaller than that included in the input device 2000 (see...). Figure 2 The second width WE2 of the pen electrode 2600 in the input device 2000. The second spacing PC2 can be in the range of approximately 1.0 mm to approximately 2.0 mm. For example, the second spacing PC2 can be approximately 1.5 mm. According to the invention, each of the plurality of sub-sensing units SU can have an area smaller than the area of ​​the input region of the pen electrode 2600 included in the input device 2000. Therefore, the sensor layer 200 can accurately detect the coordinates input by the input device 2000.

[0111] The sensor layer 200 can operate in either a first mode or a second mode. In the first mode, information about external input is obtained based on changes in the mutual capacitance between electrodes included in the plurality of sensing units 210. In the second mode, input from the input device 2000 is detected based on changes in the capacitance of each of the electrodes included in the plurality of sub-sensing units SU. The first and second modes will be discussed in further detail below.

[0112] Multiple sensing units 210 can be arranged along the first direction DR1 and the second direction DR2.

[0113] Multiple wiring 220 can be electrically connected to multiple sub-sensing units SU.

[0114] Figure 5A The illustration shows a plan view of one of a plurality of sensing units according to some embodiments of the present invention. Figure 5B The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention.

[0115] Reference Figure 5A and Figure 5B A single sensing unit 210 may include multiple sub-sensing units SU. The multiple sub-sensing units SU may be arranged in the first direction DR1 and the second direction DR2. For example, nine sub-sensing units SU may be provided.

[0116] The sensing unit 210 may include multiple electrodes 211, multiple cross electrodes 212, and dummy electrodes 213. The multiple electrodes 211, multiple cross electrodes 212, and dummy electrodes 213 may have a grid structure.

[0117] Based on the variation of mutual capacitance between multiple electrodes 211 and multiple cross electrodes 212, sensor layer 200 (see example) Figure 4It can obtain information about external input.

[0118] Each of the plurality of electrodes 211 may extend in a first direction DR1. The plurality of electrodes 211 may be arranged spaced apart from each other in a second direction DR2.

[0119] Each of the plurality of intersecting electrodes 212 may extend in the second direction DR2. The plurality of intersecting electrodes 212 may be arranged spaced apart from each other in the first direction DR1. The plurality of electrodes 211 may intersect with the plurality of intersecting electrodes 212.

[0120] Multiple dummy electrodes 213 may surround multiple electrodes 211 and multiple cross electrodes 212. The presence of dummy electrodes 213 can reduce the difference in transmittance or reflectance between portions having multiple electrodes 211 or cross electrodes 212 and portions not having multiple electrodes 211 or cross electrodes 212. As a result, it is possible to prevent the identification of specific boundaries, such as the boundary between multiple electrodes 211 and multiple cross electrodes 212, or the boundary between portions having multiple electrodes 211 or cross electrodes 212 and portions not having multiple electrodes 211 or cross electrodes 212.

[0121] Each of the plurality of electrodes 211 may include a first portion 211P1 and a plurality of second portions 211P2. The first portion 211P1 may extend in a first direction DR1. The plurality of second portions 211P2 may protrude from the first portion 211P1. The first portion 211P1 and the plurality of second portions 211P2 may be provided integrally with each other.

[0122] The plurality of second parts 211P2 may include a plurality of first pattern parts 211PP1, a plurality of second pattern parts 211PP2 and a plurality of third pattern parts 211PP3.

[0123] Each of the plurality of first pattern portions 211PP1 may protrude from the first portion 211P1. For example, each of the plurality of first pattern portions 211PP1 may protrude from the first portion 211P1 in the second direction DR2. For example, a single sub-sensing unit SU may include four first pattern portions 211PP1.

[0124] Multiple second pattern portions 211PP2 may each protrude from multiple first pattern portions 211PP1 in a direction adjacent to (discussed below) the first intersection portion 212P1. For example, multiple second pattern portions 211PP2 may each protrude from multiple first pattern portions 211PP1 in a first direction DR1. For example, a single sub-sensing unit SU may include four second pattern portions 211PP2.

[0125] Each of the plurality of first pattern portions 211PP1 may have one end adjacent to the first portion 211P1 and another end adjacent to one of the plurality of second pattern portions 211PP2. The first pattern portions 211PP1 and the second pattern portions 211PP2 may be provided integrally with each other.

[0126] Each of the plurality of third pattern portions 211PP3 may protrude from the first portion 211P1 in either a first intersecting direction DRa or a second intersecting direction DRb. The first intersecting direction DRa may intersect with the first direction DR1 and the second direction DR2. The second intersecting direction DRb may intersect with the first intersecting direction DRa. The first intersecting direction DRa and the second intersecting direction DRb may be orthogonal to each other. For example, a single sub-sensing unit SU may include four third pattern portions 211PP3.

[0127] The multiple cross electrodes 212 may include multiple cross patterns 212PT and multiple bridging patterns 212B.

[0128] Each of the plurality of intersecting patterns 212PT may include a first intersecting pattern 212PT1 and a second intersecting pattern 212PT2 spaced apart from each other, with a first portion 211P1 between the first intersecting pattern 212PT1 and the second intersecting pattern 212PT2. The first intersecting pattern 212PT1 and the second intersecting pattern 212PT2 may have shapes that are symmetrical to each other about a first axis AX1 extending along a first direction DR1.

[0129] Each of the first cross pattern 212PT1 and the second cross pattern 212PT2 may include a first cross portion 212P1 and a plurality of second cross portions 212P2.

[0130] The first intersecting portion 212P1 may extend in the second direction DR2. A plurality of second intersecting portions 212P2 may protrude from the first intersecting portion 212P1. The first intersecting portion 212P1 and the plurality of second intersecting portions 212P2 may be provided integrally with each other.

[0131] The plurality of second intersecting portions 212P2 may include a plurality of first intersecting pattern portions 212PP1 and a plurality of second intersecting pattern portions 212PP2.

[0132] Multiple first cross-pattern portions 212PP1 may surround multiple first pattern portions 211PP1 and multiple second pattern portions 211PP2. Each of the multiple first cross-pattern portions 212PP1 may include a first part and a second part. The second part may extend in a second direction DR2 and may be spaced apart from the first cross portion 212P1 in a first direction DR1. The second part may be adjacent to one of the multiple second pattern portions 211PP2. The first part may be located between the first cross portion 212P1 and the second part. The first part may be adjacent to one of the multiple first pattern portions 211PP1. The first part and the second part may be provided integrally with each other. For example, a single sub-sensing unit SU may include four first cross-pattern portions 212PP1.

[0133] Multiple second intersecting pattern portions 212PP2 may protrude in a direction facing multiple third pattern portions 211PP3. Each of the multiple second intersecting pattern portions 212PP2 may protrude from the first intersecting portion 212P1 in a first intersecting direction DRa or a second intersecting direction DRb. The multiple second intersecting pattern portions 212PP2 may be positioned adjacent to the multiple third pattern portions 211PP3. For example, a single sub-sensing unit SU may include four second intersecting pattern portions 212PP2.

[0134] Multiple bridging patterns 212B can be electrically connected to multiple cross patterns 212PT. The multiple bridging patterns 212B can be insulated from and intersect with the first portion 211P1. The multiple bridging patterns 212B can extend in a first cross direction DRa and a second cross direction DRb. The multiple bridging patterns 212B can have a grid structure.

[0135] Each of the multiple bridging patterns 212B can electrically connect the first cross pattern 212PT1 to the second cross pattern 212PT2.

[0136] Multiple bridging patterns 212B can be located at different levels than the levels of multiple electrodes 211 and multiple cross patterns 212PT.

[0137] The dummy electrode 213 may include multiple first dummy portions 213P1 and multiple second dummy portions 213P2.

[0138] Multiple first dummy portions 213P1 may be located between multiple first pattern portions 211PP1, multiple second pattern portions 211PP2, multiple third pattern portions 211PP3, and multiple first intersecting pattern portions 212PP1.

[0139] Multiple second dummy portions 213P2 can be positioned adjacent to the first portion 211P1, the first intersecting portion 212P1, and multiple first intersecting pattern portions 212PP1.

[0140] The first cross pattern 212PT1 of a sub-sensing unit SU can be provided integrally with the second cross pattern 212PT2 of another sub-sensing unit SU adjacent to a sub-sensing unit SU in the second direction DR2.

[0141] The electrodes 211 of two sub-sensing units SU that are adjacent to each other in the second direction DR2 can be referred to as the first electrode and the second electrode, and the first cross pattern 212PT1 of one of the two sub-sensing units SU and the second cross pattern 212PT2 of the other of the two sub-sensing units SU can be referred to as the third electrode.

[0142] Sensor layer 200 may include a first spacing PC1 (see Figure 4 Multiple sensing units 210 are repeatedly arranged, with a first spacing PC1 smaller than the user's body 3000 (see...). Figure 2 The first width of the input region WE1 (see) Figure 2 Each of the multiple sensing units 210 may have an area smaller than the input area of ​​the user's body 3000.

[0143] According to the present invention, when a user's body 3000 is detected, the sensing unit 210 can be located within the coverage area of ​​the input region of the user's body 3000 that overlaps with the sensor layer 200. It is possible to correctly detect changes in mutual capacitance between the multiple cross electrodes 212 and the multiple electrodes 211 when detecting the user's body 3000. Therefore, the sensor layer 200 can improve the detection reliability and coordinate accuracy of the user's body 3000.

[0144] In addition, sensor layer 200 may include a second spacing PC2 (see Figure 4 Multiple sub-sensing units SU are repeatedly arranged, with a second spacing PC2 smaller than that included in the input device 2000 (see...). Figure 2 The pen electrode 2600 in ) (see Figure 2 The second width of the input region WE2 (see) Figure 2 The input area of ​​the input device 2000 may have an area smaller than that of each of the plurality of sub-sensing units SU. The electrode 211 and the cross electrode 212 may intersect each other at each of the plurality of sub-sensing units SU.

[0145] Unlike the present invention, when there is only one intersection due to a sensing unit 210 including a sub-sensing unit SU, the spacing of the sensing units 210 can be greater than the second width WE2 of the input area of ​​the pen electrode 2600 included in the input device 2000. On a sensing unit 210, there may be a difference between the first capacitance CAP1a detected by the first pen electrode 2610 when the input device 2000 is placed in a first position and the second capacitance CAP1b detected by the first pen electrode 2610 when the input device 2000 is placed in a second position. In this case, the coordinate accuracy of the sensor layer 200 may be reduced. In contrast, according to the present invention, when the input device 2000 is detected, the sub-sensing unit SU can be located within the coverage area of ​​the input area of ​​the input device 2000 overlapping with the sensor layer 200. On a sensing unit 210, a reduced difference can be provided between the first capacitance CAP1a detected by the first pen electrode 2610 when the input device 2000 is placed in the first position and the second capacitance CAP1b detected by the first pen electrode 2610 when the input device 2000 is placed in the second position. For example, in a sensing unit 210, there may be a reduced capacitance deviation between the sensor layer 200 and the input device 2000, which depends on the position of the input device 2000. Therefore, the sensor layer 200 can increase the coordinate accuracy and detection reliability of the input device 2000.

[0146] Furthermore, according to the present invention, a reduced difference can be provided on a sensing unit 210 between a first capacitance CAP2a detected by the second electrode 2620 when the input device 2000 is placed in a first position and a second capacitance CAP2b detected by the second electrode 2620 when the input device 2000 is placed in a second position. For example, a reduced capacitance deviation can exist between the sensor layer 200 and the input device 2000 on a sensing unit 210, the deviation depending on the position of the input device 2000. Therefore, the sensor layer 200 can increase the tilt accuracy and detection reliability of the input device 2000.

[0147] Figure 6A The diagram follows Figure 5A The cross-sectional view taken by line I-I'. In explaining... Figure 6A When assigning the same reference numerals to the figures in Figure 5A and Figure 5B The components discussed herein may be omitted, and some repeated descriptions of them may be omitted.

[0148] Reference Figure 6AThe bridging pattern 212B may be located on the substrate dielectric layer 201. The sensing dielectric layer 203 may be located on the bridging pattern 212B. The sensing dielectric layer 203 may cover the bridging pattern 212B. The sensing dielectric layer 203 may include inorganic materials, organic materials, or composite materials.

[0149] The first cross pattern 212PT1, the second cross pattern 212PT2, and the electrode 211 can be located on the sensing dielectric layer 203.

[0150] Multiple first contact holes CNT1 can be formed to penetrate the sensing dielectric layer 203 on the third-direction DR3. The first cross pattern 212PT1 and the second cross pattern 212PT2 can be electrically connected to the bridging pattern 212B through the multiple first contact holes CNT1.

[0151] The dielectric layer 205 can be located on the first cross pattern 212PT1, the second cross pattern 212PT2, and the electrode 211. The dielectric layer 205 can cover the first cross pattern 212PT1, the second cross pattern 212PT2, and the electrode 211. The dielectric layer 205 can include inorganic materials, organic materials, or composite materials.

[0152] Figure 6A The bridging pattern 212B is depicted by way of example as a bottom bridge structure located under the first cross pattern 212PT1, the second cross pattern 212PT2, and the electrode 211. However, according to some embodiments of the present invention, the sensor layer 200 (see example) Figure 4 The structure is not limited to the structure mentioned above. For example, according to some embodiments of the present invention, the sensor layer 200 may have a top bridge structure in which the bridging pattern 212B is located on the first cross pattern 212PT1, the second cross pattern 212PT2 and the electrode 211.

[0153] Figure 6B The diagram follows Figure 4 The cross-sectional view taken from line II-II'. In the explanation... Figure 6B When assigning the same reference numerals to the figures in Figure 6A The components discussed herein may be omitted, and some repeated descriptions of them may be omitted.

[0154] Reference Figure 6B Each of the multiple wirings 220 may include a first wire component 220P1 and a second wire component 220P2.

[0155] The first line component 220P1 may be located on the substrate dielectric layer 201. The sensing dielectric layer 203 may be located on the first line component 220P1. The sensing dielectric layer 203 may cover the first line component 220P1.

[0156] The second line component 220P2 can be located on the first line component 220P1.

[0157] Multiple second contact holes CNT2 can be formed to penetrate the sensing dielectric layer 203 on the third-direction DR3. The first line component 220P1 and the second line component 220P2 can be connected to each other through the multiple second contact holes CNT2.

[0158] The overlay dielectric layer 205 may be located on the second line component 220P2. The overlay dielectric layer 205 may cover the second line component 220P2.

[0159] Figure 6B The structure in which the first wire component 220P1 and the second wire component 220P2 are connected to each other is depicted by way of example, but according to some embodiments of the invention, the sensor layer 200 (see example) Figure 4 The structure is not limited to the structure mentioned above. For example, the sensing dielectric layer 203 may not include multiple second contact holes CNT2. The first line component 220P1 and the second line component 220P2 may be arranged to be spaced apart from each other on the third-direction DR3.

[0160] Figure 7 The illustration shows a plan view of one of a plurality of sensing units according to some embodiments of the present invention. (In the explanation...) Figure 7 When assigning the same reference numerals to the figures in Figure 5A and Figure 5B The components discussed herein may be omitted, and some repeated descriptions of them may be omitted.

[0161] Reference Figure 5B and Figure 7 A sensing unit 210a may include a plurality of sub-sensing units SUa. The plurality of sub-sensing units SUa may be arranged in a first direction DR1 and a second direction DR2. For example, twenty-five sub-sensing units SUa may be provided. However, embodiments of the present invention are not limited thereto, and no limitation is imposed on the number of the plurality of sub-sensing units SUa according to some embodiments of the present invention. For example, sixteen sub-sensing units SUa may be provided.

[0162] Multiple sub-sensing units SUa may have a second spacing PC2a. The second spacing PC2a of the multiple sub-sensing units SUa may be smaller than that included in the input device 2000 (see...). Figure 2 The pen electrode 2600 in ) (see Figure 2 The second width of the input region WE2 (see) Figure 2 The second spacing PC2a can be smaller than multiple sub-sensing units SU (see example). Figure 5A The second spacing PC2 (see example) Figure 4The input area of ​​the input device 2000 may have an area smaller than that of each of the plurality of sub-sensing units SUa.

[0163] According to the present invention, when the input device 2000 is detected, the sub-sensing unit SUa can be located at the sensor layer 200 (see, for example) Figure 4 The sensor layer 200 is located within the coverage area of ​​the overlapping input area of ​​the input device 2000. Even though the input device 2000 moves, the sensor layer 200 can still normally detect the capacitance of each of the first portion 211P1, the second portion 211P2, the first cross portion 212P1, and the second cross portion 212P2. Therefore, the sensor layer 200 can increase the detection reliability of the input device 2000.

[0164] Figure 8 The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention. (In the explanation...) Figure 8 When, the same reference numerals are assigned to the reference figures. Figure 5B The components are discussed, and some repetitive descriptions of them can be omitted.

[0165] Reference Figure 8 The first portion 211P1b may extend in the first direction DR1. Multiple second portions 211P2b may protrude from the first portion 211P1b. The first portion 211P1b and the multiple second portions 211P2b may be provided integrally with each other. The first portion 211P1b and the multiple second portions 211P2b may have a mesh structure.

[0166] The plurality of second portions 211P2b may include a plurality of first pattern portions 211PP1b and a plurality of second pattern portions 211PP2b.

[0167] Each of the plurality of first pattern portions 211PP1b may protrude from the first portion 211P1b. For example, each of the plurality of first pattern portions 211PP1b may protrude in a first intersecting direction DRa. The first intersecting direction DRa may intersect with the first direction DR1 and the second direction DR2.

[0168] Each of the plurality of second pattern portions 211PP2b may protrude from the first portion 211P1b. For example, each of the plurality of second pattern portions 211PP2b may protrude in a second intersecting direction DRb. The second intersecting direction DRb may intersect with the first direction DR1 and the second direction DR2. The second intersecting direction DRb may intersect with the first intersecting direction DRa. The first intersecting direction DRa and the second intersecting direction DRb may be orthogonal to each other.

[0169] Multiple intersecting patterns 212PTb can be spaced apart from each other, with a first part 211P1b situated between the multiple intersecting patterns 212PTb. The multiple intersecting patterns 212PTb can be symmetrical about the first axis AX1.

[0170] The multiple intersecting patterns 212PTb may include a first intersecting portion 212P1b and multiple second intersecting portions 212P2b.

[0171] The first intersecting portion 212P1b may extend in the second direction DR2. A plurality of second intersecting portions 212P2b may protrude from the first intersecting portion 212P1b. The first intersecting portion 212P1b and the plurality of second intersecting portions 212P2b may be integrally provided with each other. The first intersecting portion 212P1b and the plurality of second intersecting portions 212P2b may have a grid structure.

[0172] A plurality of second intersecting portions 212P2b may correspondingly surround a plurality of second portions 211P2b. One of the plurality of second intersecting portions 212P2b may protrude in a first intersecting direction DRa and may be positioned adjacent to a plurality of first pattern portions 211PP1b. Another of the plurality of second intersecting portions 212P2b may protrude in a second intersecting direction DRb and may be positioned adjacent to a plurality of second pattern portions 211PP2b.

[0173] Figure 9 The illustration shows a plan view of one of a plurality of sensing units according to some embodiments of the present invention. (In the explanation...) Figure 9 When, the same reference numerals are assigned to the reference figures. Figure 8 The components are discussed, and some repetitive descriptions of them can be omitted.

[0174] Reference Figure 9 Each of the plurality of sensing units 210b may include a first region AR1, a plurality of second regions AR2, a plurality of third regions AR3 and a plurality of fourth regions AR4. The plurality of second regions AR2 are adjacent to the first region AR1 in the first direction DR1, the plurality of third regions AR3 are adjacent to the first region AR1 in the second direction DR2, and the plurality of fourth regions AR4 are spaced apart from the first region AR1 in the first intersection direction DRa and the second intersection direction DRb.

[0175] Multiple first portions 211P1b, multiple second portions 211P2b, multiple cross patterns 212PTb, multiple bridging patterns 212B, and dummy electrodes 213 can be provided in the first region AR1.

[0176] Multiple first portions 211P1b, multiple second portions 211P2b, and dummy electrodes 213 can be provided in multiple second regions AR2. When viewed in a plan view, multiple intersecting patterns 212PTb and multiple bridging patterns 212B may not overlap with the multiple second regions AR2.

[0177] Multiple cross patterns 212PTb, multiple bridging patterns 212B, and dummy electrodes 213 can be provided in multiple third regions AR3. When viewed in a plan view, multiple first portions 211P1b and multiple second portions 211P2b may not overlap with the multiple third regions AR3.

[0178] Dummy electrodes 213 can be provided in multiple fourth regions AR4.

[0179] Figure 10 The illustration shows a plan view of one of a plurality of sensing units according to some embodiments of the present invention. (In the explanation...) Figure 10 When assigning the same reference numerals to the figures in Figure 8 The components discussed herein may be omitted, and some repeated descriptions of them may be omitted.

[0180] Reference Figure 10 Each of the plurality of sensing units 210c may include a first region AR1a and a second region AR2a surrounding the first region AR1a.

[0181] Multiple first portions 211P1b, multiple second portions 211P2b, multiple cross patterns 212PTb, multiple bridging patterns 212B, and dummy electrodes 213 can be provided in the first region AR1a.

[0182] Multiple first portions 211P1b, multiple first cross portions 212P1b, and dummy electrodes 213 can be provided in the second region AR2a.

[0183] Figure 11 The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention. (In the explanation...) Figure 11 When, the same reference numerals are assigned to the reference figures. Figure 5B The components are discussed, and some repetitive descriptions of them can be omitted.

[0184] Reference Figure 11 The first part 211P1c may extend in the first direction DR1. A plurality of second parts 211P2c may protrude from the first part 211P1c. The first part 211P1c and the plurality of second parts 211P2c may be provided integrally with each other. The first part 211P1c and the plurality of second parts 211P2c may have a mesh structure.

[0185] The plurality of second portions 211P2c may include a plurality of first pattern portions 211PP1c and a plurality of second pattern portions 211PP2c.

[0186] Each of the plurality of first pattern portions 211PP1c may protrude from the first portion 211P1c. Each of the plurality of first pattern portions 211PP1c may include a first part and a second part. The first part may protrude from the first portion 211P1c in a second direction DR2. One end of the first part may be adjacent to the first portion 211P1c. The second part may protrude from the other end of the first part in a first direction DR1. The first part and the second part may be provided integrally with each other.

[0187] Multiple first pattern portions 211PP1c may correspondingly surround multiple first intersecting pattern portions 212PP1c and multiple second intersecting pattern portions 212PP2c.

[0188] Each of the plurality of second pattern portions 211PP2c may protrude from the first portion 211P1c. Each of the plurality of second pattern portions 211PP2c may include a third portion and a fourth portion. The third portion may protrude from the first portion 211P1c in the second direction DR2. One end of the third portion may be adjacent to the first portion 211P1c. The fourth portion may protrude from the other end of the third portion in the first direction DR1. The third and fourth portions may be provided integrally with each other.

[0189] Multiple second pattern portions 211PP2c may be spaced apart from multiple first pattern portions 211PP1c, and multiple first intersecting pattern portions 212PP1c and multiple second intersecting pattern portions 212PP2c are located between the multiple first pattern portions 211PP1c and the multiple second pattern portions 211PP2c.

[0190] Multiple intersecting patterns 212PTc can be spaced apart from each other, with a first part 211P1c situated between the multiple intersecting patterns 212PTc. The multiple intersecting patterns 212PTc can be symmetrical about the first axis AX1.

[0191] The multiple intersecting patterns 212PTc may include a first intersecting portion 212P1c and multiple second intersecting portions 212P2c.

[0192] The first intersecting portion 212P1c may extend in the second direction DR2. A plurality of second intersecting portions 212P2c may protrude from the first intersecting portion 212P1c. The first intersecting portion 212P1c and the plurality of second intersecting portions 212P2c may be integrally provided with each other. The first intersecting portion 212P1c and the plurality of second intersecting portions 212P2c may have a mesh structure.

[0193] Multiple second intersecting portions 212P2c may be located between multiple first pattern portions 211PP1c and multiple second pattern portions 211PP2c. Multiple second intersecting portions 212P2c may include multiple first intersecting pattern portions 212PP1c and multiple second intersecting pattern portions 212PP2c.

[0194] Each of the plurality of first intersecting pattern portions 212PP1c may protrude from the first intersecting portion 212P1c. For example, each of the plurality of first intersecting pattern portions 212PP1c may protrude from the first intersecting portion 212P1c in a first direction DR1.

[0195] Multiple second intersecting pattern portions 212PP2c may protrude from multiple first intersecting pattern portions 212PP1c in a direction adjacent to the first portion 211P1c. For example, multiple second intersecting pattern portions 212PP2c may protrude from multiple first intersecting pattern portions 212PP1c in a second direction DR2.

[0196] Each of the plurality of first cross pattern portions 212PP1c may have one end adjacent to the first cross portion 212P1c and another end adjacent to one of the plurality of second cross pattern portions 212PP2c.

[0197] Multiple second intersecting portions 212P2b may surround multiple second portions 211P2b. One of the multiple second intersecting portions 212P2b may protrude in a first intersecting direction DRa and may be positioned adjacent to multiple first pattern portions 211PP1b. Another of the multiple second intersecting portions 212P2b may protrude in a second intersecting direction DRb and may be positioned adjacent to multiple second pattern portions 211PP2b.

[0198] Figure 12 The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention. (In the explanation...) Figure 12 When, the same reference numerals are assigned to the reference figures. Figure 5B The components are discussed, and some repetitive descriptions of them can be omitted.

[0199] Reference Figure 12 The first portion 211P1d may extend in the first direction DR1. A plurality of second portions 211P2d may protrude from the first portion 211P1d. The first portion 211P1d and the plurality of second portions 211P2d may be provided integrally with each other. The first portion 211P1d and the plurality of second portions 211P2d may have a mesh structure.

[0200] The plurality of second portions 211P2d may include a plurality of first pattern portions 211PP1d and a plurality of second pattern portions 211PP2d.

[0201] Each of the plurality of first pattern portions 211PP1d may protrude from the first portion 211P1d. For example, each of the plurality of first pattern portions 211PP1d may protrude in a first intersecting direction DRa.

[0202] Each of the plurality of second pattern portions 211PP2d may protrude from the first portion 211P1d. For example, each of the plurality of second pattern portions 211PP2d may protrude in the second intersecting direction DRb.

[0203] Each of the multiple intersecting patterns 212PTd can be spaced apart from each other, with the first portion 211P1d situated between the multiple intersecting patterns 212PTd. The multiple intersecting patterns 212PTd can be symmetrical about each other about the first axis AX1.

[0204] The multiple intersecting patterns 212PTd may include a first intersecting portion 212P1d and multiple second intersecting portions 212P2d.

[0205] The first intersecting portion 212P1d may extend in the second direction DR2. A plurality of second intersecting portions 212P2d may protrude from the first intersecting portion 212P1d. The first intersecting portion 212P1d and the plurality of second intersecting portions 212P2d may be integrally provided with each other. The first intersecting portion 212P1d and the plurality of second intersecting portions 212P2d may have a mesh structure.

[0206] The plurality of second intersecting portions 212P2d may include a plurality of first intersecting pattern portions 212PP1d and a plurality of second intersecting pattern portions 212PP2d.

[0207] Each of the plurality of first intersecting pattern portions 212PP1d may protrude from the first intersecting portion 212P1d. For example, the plurality of first intersecting pattern portions 212PP1d may protrude in the first intersecting direction DRa. The plurality of first intersecting pattern portions 212PP1d may be correspondingly positioned adjacent to the plurality of first pattern portions 211PP1d.

[0208] Multiple second intersecting pattern portions 212PP2d may protrude from multiple first intersecting portions 212P1d. For example, multiple second intersecting pattern portions 212PP2d may protrude in the second intersecting direction DRb. Multiple second intersecting pattern portions 212PP2d may be correspondingly positioned adjacent to multiple second pattern portions 211PP2d.

[0209] Figure 13The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention. (In the explanation...) Figure 13 When, the same reference numerals are assigned to the reference figures. Figure 8 The components are discussed, and some repetitive descriptions of them can be omitted.

[0210] Reference Figure 13 The dummy electrode 213e may include multiple first dummy portions 213P1e and multiple second dummy portions 213P2e.

[0211] Multiple first dummy portions 213P1e may correspondingly surround multiple first pattern portions 211PP1b and multiple second pattern portions 211PP2b. Multiple first dummy portions 213P1e may correspondingly be located between multiple second intersecting portions 212P2e and multiple second portions 211P2b.

[0212] Multiple second dummy portions 213P2e can be positioned adjacent to the first portion 211P1b, the first intersecting portion 212P1e, and multiple second intersecting portions 212P2e.

[0213] The multiple intersecting patterns 212PTe may include a first intersecting portion 212P1e and multiple second intersecting portions 212P2e.

[0214] The first intersecting portion 212P1e may extend in the second direction DR2. A plurality of second intersecting portions 212P2e may protrude from the first intersecting portion 212P1e. The first intersecting portion 212P1e and the plurality of second intersecting portions 212P2e may be provided integrally with each other. The first intersecting portion 212P1e and the plurality of second intersecting portions 212P2e may have a mesh structure. The plurality of second intersecting portions 212P2e may correspondingly surround a plurality of first dummy portions 213P1e.

[0215] Figure 14 The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention. (In the explanation...) Figure 14 When assigning the same reference numerals to the figures in Figure 12 The components discussed herein may be omitted, and some repeated descriptions of them may be omitted.

[0216] Reference Figure 14 The dummy electrode 213f may include multiple first dummy portions 213P1f, multiple second dummy portions 213P2f, and multiple third dummy portions 213P3f.

[0217] Multiple first dummy portions 213P1f can be located between multiple first pattern portions 211PP1d and multiple first intersecting pattern portions 212PP1f.

[0218] Multiple second dummy portions 213P2f can be correspondingly located between multiple second pattern portions 211PP2d and multiple second intersecting pattern portions 212PP2f.

[0219] Multiple third dummy parts 213P3f can be positioned adjacent to the first part 211P1d, multiple second parts 211P2d, and multiple intersecting patterns 212PTf.

[0220] The multiple intersecting patterns 212PTf may include a first intersecting portion 212P1f and multiple second intersecting portions 212P2f.

[0221] The first intersecting portion 212P1f may extend in the second direction DR2. Multiple second intersecting portions 212P2f may protrude from the first intersecting portion 212P1f. The first intersecting portion 212P1f and the multiple second intersecting portions 212P2f may be provided integrally with each other. The first intersecting portion 212P1f and the multiple second intersecting portions 212P2f may have a mesh structure.

[0222] The plurality of second intersecting portions 212P2f may include a plurality of first intersecting pattern portions 212PP1f and a plurality of second intersecting pattern portions 212PP2f.

[0223] Multiple first intersecting pattern portions 212PP1f can be spaced apart from multiple first pattern portions 211PP1d, and multiple first dummy portions 213P1f are located between multiple first pattern portions 211PP1d and multiple first intersecting pattern portions 212PP1f.

[0224] Multiple second intersecting pattern portions 212PP2f can be spaced apart from multiple second pattern portions 211PP2d, and multiple second dummy portions 213P2f are between multiple second intersecting pattern portions 212PP2f.

[0225] Figure 15 The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention. (In the explanation...) Figure 15 When, the same reference numerals are assigned to the reference figures. Figure 5B The components are discussed, and some repetitive descriptions of them can be omitted.

[0226] Reference Figure 15 The first portion 211P1g may extend in the first direction DR1. A plurality of second portions 211P2g may protrude from the first portion 211P1g in the second direction DR2. The plurality of second portions 211P2g may be spaced apart from each other in the first direction DR1.

[0227] The first part 211P1g and the multiple second parts 211P2g can be provided integrally with each other. The first part 211P1g and the multiple second parts 211P2g can have a grid structure.

[0228] Multiple intersecting patterns 212PTg can be spaced apart from each other, with a first part 211P1g situated between the multiple intersecting patterns 212PTg. The multiple intersecting patterns 212PTg can be symmetrical about the first axis AX1.

[0229] The multiple intersecting patterns 212PTg may include a first intersecting portion 212P1g and multiple second intersecting portions 212P2g.

[0230] The first intersecting portion 212P1g may extend in the second direction DR2. A plurality of second intersecting portions 212P2g may protrude from the first intersecting portion 212P1g in the first direction DR1. The plurality of second intersecting portions 212P2g may be spaced apart from each other in the second direction DR2.

[0231] The first intersecting portion 212P1g and the plurality of second intersecting portions 212P2g can be provided integrally with each other. The first intersecting portion 212P1g and the plurality of second intersecting portions 212P2g can have a mesh structure.

[0232] Figure 16 The illustration shows a plan view of one of a plurality of sub-sensing units according to some embodiments of the present invention. (In the explanation...) Figure 16 When, the same reference numerals are assigned to the reference figures. Figure 5B The components are discussed, and some repetitive descriptions of them can be omitted.

[0233] Reference Figure 16 The first part 211P1h can extend in the first direction DR1. The first part 211P1h can have a mesh structure.

[0234] Multiple intersecting patterns 212PTh may be spaced apart from each other, with a first portion 211P1h situated between the multiple intersecting patterns 212PTh. The multiple intersecting patterns 212PTh may be symmetrical about a first axis AX1. Each of the multiple intersecting patterns 212PTh may extend in a second direction DR2. The multiple intersecting patterns 212PTh may have a grid structure.

[0235] Figure 17 The illustration shows a schematic diagram of a sensor layer in a first mode according to some embodiments of the present invention. Figure 18A and Figure 18B The illustration shows a schematic diagram of a sensor layer in a second mode according to some embodiments of the present invention. Figure 17Four sensing units are depicted by way of example, but the operation of the present invention does not depend on the number of sensing units. Figure 17 , Figure 18A and Figure 18B Region A1 in the middle corresponds to Figure 4 Region A1 in the middle.

[0236] Reference Figures 4 to 5B and Figures 17 to 18B In the first mode, each of the plurality of electrodes 211 can be used as a transmitting electrode, and each of the plurality of cross electrodes 212 can be used as a receiving electrode. However, this is merely an example, and no limitation is imposed on the operation of the plurality of electrodes 211 and cross electrodes 212 according to some embodiments of the present invention. For example, in the first mode, each of the plurality of cross electrodes 212 can be used as a transmitting electrode, and each of the plurality of electrodes 211 can be used as a receiving electrode. In the first mode, the sensor controller SC can detect external input by sensing changes in the mutual capacitance between the sensing electrodes 211 and the cross electrodes 212.

[0237] The multiple wirings 220 may include multiple first wirings 221a and 221b and multiple second wirings 222a and 222b, all of which are electrically connected to multiple sub-sensing units SU. For example, each of the multiple wirings 220 may be connected to multiple sub-sensing units SU adjacent to the peripheral region 200N. For example, one wiring 220 may be connected to three sub-sensing units SU.

[0238] According to the present invention, a single wiring 220 can be connected to multiple sub-sensing units SU. It is not necessary to increase the number of wirings required to provide signals to the sensor layer 200. Therefore, since no additional wiring is required, the area of ​​the peripheral region 200N does not need to be increased, and a narrow bezel can be achieved.

[0239] Multiple first wirings 221 can be electrically connected to multiple electrodes 211. Multiple second wirings 222 can be electrically connected to multiple cross electrodes 212.

[0240] In the first mode, the sensor controller SC can provide drive signals TS1 and TS2 to multiple electrodes 211. In the first mode, the sensor controller SC can receive sensing signals RS1 and RS2 from multiple cross electrodes 212. Therefore, based on changes in the sensing signals RS1 and RS2, the sensor controller SC can generate the coordinates of the position where the input is provided.

[0241] When the input device 2000 approaches the sensor layer 200, the sensor layer 200 can enter and detect the input device 2000 (see...). Figure 2The second mode. The input device 2000 and the sensor controller SC can send and receive data to each other through the sensor layer 200.

[0242] In the second mode, the multiple electrodes 211 and the multiple cross electrodes 212 can be used as transmitting electrodes, which provide the input device 2000 with the uplink signals TSa, TSb, TSc, and TSd received from the sensor controller SC. In the second mode, the multiple electrodes 211 and the multiple cross electrodes 212 can also be used as receiving electrodes, which provide the sensor controller SC with the downlink signals RSa, RSb, RSc, and RSd received from the input device 2000. For example, in the second mode, all of the multiple electrodes 211 and the multiple cross electrodes 212 can be used as either transmitting or receiving electrodes.

[0243] Sensor layer 200 may include a plurality of sub-sensing units SU arranged repeatedly at a second spacing PC2, the second spacing PC2 being smaller than the pen electrode 2600 included in input device 2000 (see example). Figure 2 The second width of WE2 (see example) Figure 2 The input area of ​​the input device 2000 may have an area smaller than that of each of the plurality of sub-sensing units SU.

[0244] According to the present invention, when the input device 2000 is detected, the sub-sensing unit SU can be located within the coverage area of ​​the input region of the input device 2000, which overlaps with the sensor layer 200. On a single sensing unit 210, a reduced capacitance deviation may exist between the sensor layer 200 and the input device 2000, depending on the position of the input device 2000. For example, when using the input device 2000 to provide input in the form of lines such as characters or images, it is possible to prevent capacitance differences measured from a single sensing unit 210. Therefore, the sensor layer 200 can increase coordinate accuracy and detection reliability. As a result, the linearity of the input can be improved.

[0245] Figure 19 The illustration shows a sensor layer in a first mode according to some embodiments of the present invention. (The explanation follows.) Figure 19 When, the same reference numerals are assigned to the reference figures. Figure 17 The components are discussed, and some repetitive descriptions of them can be omitted. Figure 19 Region A1 in the middle corresponds to Figure 4 Region A1 in the middle.

[0246] Reference Figures 4 to 5B and Figure 19 Each of the multiple wirings 220 can be connected to one of the multiple sub-sensing units SU adjacent to the peripheral area 200N.

[0247] Each of the plurality of sensing units 210 may also include a plurality of connection patterns 214, which connect the plurality of sub-sensing units SU to each other. The plurality of connection patterns 214 may be located in the active region 200A.

[0248] The multiple connection patterns 214 may include multiple first connection patterns 214a and multiple second connection patterns 214b.

[0249] Multiple first connection patterns 214a can electrically connect multiple first cross portions 212P1 to each other.

[0250] Multiple second connection patterns 214b can electrically connect multiple first parts 211P1 to each other.

[0251] At least one of the plurality of first connection patterns 214a may be insulated from and intersect with at least one of the plurality of second connection patterns 214b.

[0252] According to the present invention, the sensor layer 200 can be configured such that a plurality of connection patterns 214 electrically connect a plurality of sub-sensing units SU to each other, and the plurality of connection patterns 214 reduce the resistance of each of the plurality of electrodes 211 and the plurality of cross electrodes 212. The sensor layer 200 can easily transmit drive signals TS1 and TS2 and sensing signals RS1 and RS2. Therefore, it is possible to improve the signal transmission of the sensor layer 200.

[0253] According to the present invention, the sensor layer may include a plurality of sensing units, and each of the plurality of sensing units may include a plurality of sub-sensing units. When an input device is detected, the sub-sensing units may be located within the coverage area of ​​the input region of the input device that overlaps with the sensor layer. A reduced capacitance deviation may exist between the sensor layer and the input device on a single sensing unit, the deviation depending on the position of the input device. Therefore, the sensor layer can increase the coordinate accuracy of the input device. For example, when using an input device to provide input in the form of lines such as characters or images, it is possible to prevent capacitance differences measured from a single sensing unit, and as a result, the linearity of the input can be improved, and the sensor layer can improve detection reliability.

[0254] Although various aspects of some embodiments have been described with reference to several illustrative examples of aspects of some embodiments, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the inventive concept as set forth in the appended claims and their equivalents. Therefore, the technical scope of embodiments of the present invention is not limited to the embodiments and examples described above, but is limited by the appended claims and their equivalents.

Claims

1. An electronic device, wherein, The electronic device includes: Display layer; and A sensor layer is located on the display layer and has an active region and a peripheral region adjacent to the active region. The sensor layer includes multiple sensing units in the active region and multiple wirings in the peripheral region. Each of the plurality of sensing units includes a plurality of sub-sensing units. Each of the plurality of sub-sensing units includes: A first portion of the electrode, the first portion extending in a first direction; The electrode has multiple second portions that protrude from the first portion; A plurality of intersecting patterns of intersecting electrodes, the plurality of intersecting patterns being spaced apart from each other, the first portion being between the plurality of intersecting patterns; and The bridging pattern of the cross electrodes, which is insulated from the first portion and electrically connected to the plurality of cross patterns, intersects with the first portion. The plurality of wirings includes a first wiring that is individually electrically connected to the electrode of each of the plurality of sub-sensing units of a single sensing unit in the plurality of sensing units, and a second wiring that is individually electrically connected to the cross electrode of each of the plurality of sub-sensing units of the single sensing unit in the plurality of sensing units.

2. The electronic device according to claim 1, wherein, Each of the plurality of intersecting patterns includes: The first intersecting portion extends in a second direction intersecting the first direction; and A plurality of second intersecting portions, the plurality of second intersecting portions protruding from the first intersecting portion and adjacent to the plurality of second portions.

3. The electronic device according to claim 2, wherein, The plurality of second parts include: A plurality of first pattern portions, the plurality of first pattern portions protruding from the first portion in the second direction; A plurality of second pattern portions, the plurality of second pattern portions protruding from the plurality of first pattern portions in a direction adjacent to the first intersecting portion; and Multiple third pattern portions protrude in a first intersecting direction that intersects the first direction and the second direction.

4. The electronic device according to claim 3, wherein, The plurality of second intersecting portions include: A plurality of first intersecting pattern portions, the plurality of first intersecting pattern portions correspondingly surrounding the plurality of first pattern portions and the plurality of second pattern portions; and Multiple second intersecting pattern portions, which protrude correspondingly in the direction facing the multiple third pattern portions.

5. The electronic device according to claim 4, wherein, Each of the plurality of sub-sensing units further includes: a plurality of dummy components, the plurality of dummy components being correspondingly located between the plurality of first pattern portions, the plurality of second pattern portions, the plurality of third pattern portions, and the plurality of second cross pattern portions.

6. The electronic device according to claim 2, wherein, The plurality of second intersecting portions include: A plurality of first intersecting pattern portions, the plurality of first intersecting pattern portions protruding from the first intersecting portion in the first direction; and Multiple second intersecting pattern portions, which protrude from the multiple first intersecting pattern portions in a direction adjacent to the first portion.

7. The electronic device according to claim 6, wherein, The plurality of second parts include: A plurality of first pattern portions, the plurality of first pattern portions correspondingly surrounding the plurality of first intersecting pattern portions and the plurality of second intersecting pattern portions; and A plurality of second pattern portions, the plurality of second pattern portions being correspondingly spaced apart from the plurality of first pattern portions, the plurality of first intersecting pattern portions and the plurality of second intersecting pattern portions being between the plurality of first pattern portions and the plurality of second pattern portions.

8. The electronic device according to claim 2, wherein, The plurality of second parts include: A plurality of first pattern portions, the plurality of first pattern portions protruding from the first portion in a first intersecting direction intersecting the first direction and the second direction; and Multiple second pattern portions protrude from the first portion in a second intersecting direction that intersects the first intersecting direction.

9. The electronic device according to claim 8, wherein, The plurality of second intersecting portions surround the plurality of second portions.

10. The electronic device according to claim 9, wherein, The plurality of sub-sensing units further include: a plurality of dummy components, which are correspondingly located between the plurality of second intersection portions and the plurality of second portions.

11. The electronic device according to claim 8, wherein, The plurality of second intersecting portions include: A plurality of first intersecting pattern portions, the plurality of first intersecting pattern portions being adjacent to the plurality of first pattern portions and protruding from the first intersecting portions in the first intersecting direction; and A plurality of second intersecting pattern portions, the plurality of second intersecting pattern portions being adjacent to the plurality of second pattern portions and protruding from the first intersecting portion in the second intersecting direction.

12. The electronic device according to claim 11, wherein, Each of the plurality of sub-sensing units includes: A plurality of first dummy portions, the plurality of first dummy portions being correspondingly located between the plurality of first pattern portions and the plurality of first intersecting pattern portions; and Multiple second dummy portions are located between the multiple second pattern portions and the multiple second intersecting pattern portions.

13. The electronic device according to claim 2, wherein, The plurality of second portions protrude from the first portion in the second direction, and The plurality of second intersecting portions protrude from the first intersecting portion in the first direction.

14. The electronic device according to claim 1, wherein, Each of the plurality of sensing units has a first region, a plurality of second regions, and a plurality of third regions. The plurality of second regions are adjacent to the first region in the first direction, and the plurality of third regions are adjacent to the first region in the second direction. The second direction intersects the first direction. The first region is provided with the first portion, the plurality of second portions, the plurality of intersecting patterns, and the bridging pattern. Each of the plurality of second regions is provided with the first portion and the plurality of second portions, and Each of the plurality of third regions is provided with the plurality of intersecting patterns.

15. The electronic device according to claim 2, wherein, Each of the plurality of sub-sensing units also includes a dummy electrode. Each of the plurality of sub-sensing units has a first region and a second region surrounding the first region. The first region is provided with the first portion, the plurality of second portions, the plurality of intersecting patterns, the bridging pattern, and the dummy electrode. The second region is provided with the first portion, the first intersection portion, and the dummy electrode.

16. The electronic device according to claim 1, wherein, Each of the multiple wirings is connected to the sub-sensing unit adjacent to the peripheral area.

17. The electronic device according to claim 1, wherein, Each of the multiple wirings is connected to one of the sub-sensing units adjacent to the peripheral region, and The sensor layer also includes multiple connection patterns that connect the multiple sub-sensing units to each other.

18. The electronic device according to claim 1, wherein, The first wiring is electrically connected to the first portion and the plurality of second portions, and The second wiring is electrically connected to the plurality of cross patterns and the bridging patterns.

19. An electronic device, wherein, The electronic device includes: Display layer; and A sensor layer is provided on the display layer and has an active region and a peripheral region adjacent to the active region. The sensor layer includes a plurality of sensing units and a plurality of wirings. The plurality of sensing units are located in the active region. Each of the plurality of sensing units includes a first electrode, a second electrode, and a third electrode. The first electrode and the second electrode extend in a first direction, and the third electrode extends in a second direction intersecting the first direction. Wherein, the first electrode and the second electrode form an electrode. The third electrode forms a cross electrode. The first electrode, the second electrode, and the third electrode are located in the active region and form multiple sub-sensing units. The multiple wirings are located in the peripheral area. The first electrode includes: A first electrode portion, the first electrode portion extending in the first direction; and A plurality of first protrusions protruding from the first electrode portion, The second electrode includes: The second electrode portion extends in the first direction; and A plurality of second protrusions protruding from the second electrode portion, The third electrode includes: A third electrode portion, the third electrode portion extending in the second direction; and A plurality of third protrusions correspondingly surround the plurality of first protrusions and the plurality of second protrusions, and The plurality of wirings includes: A first wiring, wherein the first wiring is individually electrically connected to the electrode of each of the plurality of sub-sensing units of a single sensing unit among the plurality of sensing units, and is electrically connected to the first electrode and the second electrode; and The second wiring is individually electrically connected to the third electrode of each of the plurality of sub-sensing units of the single sensing unit among the plurality of sensing units.

20. The electronic device according to claim 19, wherein, The sensor layer further includes a plurality of bridging patterns electrically connected to opposite ends of the third electrode.

Images