Fingerprint sensor housing with non-uniform thickness

Abstract

A sensor assembly includes a cover layer and a first sensor device. The cover layer is molded from a first material to have a flat surface and a non-uniform thickness, wherein a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. Within the first region, the first sensor device is disposed beneath the flat surface of the cover layer. The first sensor device is configured to transmit and receive a first capacitive sensing signal through a portion of the flat surface that coincides with the first region. For example, the first sensor device can be a fingerprint sensor configured to detect a fingerprint on the portion of the flat surface that coincides with the first region based on a change in the first capacitive sensing signal.

Description

Technical Field

[0001] This embodiment generally relates to fingerprint sensors, and more specifically to fingerprint sensor housings having uneven thickness. Background Technology

[0002] Authentication is a mechanism used to verify the identity of a user attempting to access a device and / or application. Basic forms of authentication might require a user to enter a username and password via an input device. However, usernames and passwords are easily stolen and can be used by unauthorized users to gain access to the corresponding device or application. Therefore, modern authentication schemes increasingly rely on biometric sensors (e.g., sensors capable of identifying a user's unique biological characteristics) to provide a higher level of security. Examples of biometric sensors include fingerprint scanners, facial recognition systems, eye scanners, voice recognition systems, etc. Biometric input typically requires the user to physically interact with one or more sensors to perform authentication.

[0003] Some fingerprint scanners use capacitive imaging techniques to capture details of a user's fingerprint. For example, a fingerprint scanner may include an array of capacitive sensing elements (e.g., sensor electrodes) for measuring changes in capacitance or electric field on the fingerprint sensing surface caused by a finger interacting with the surface. More specifically, the amount of charge accumulated on the capacitive sensing elements can be correlated with ridges and valleys in the user's fingertip. To ensure a high level of detail and accuracy in the capacitive measurements required for fingerprint authentication, the fingerprint sensing surface is typically formed by placing a very thin sheet of overlay material (such as glass) over the capacitive sensing elements. However, such overlays are fragile, expensive to manufacture, and offer limited customizability. Summary of the Invention

[0004] This summary is provided to introduce, in a simplified form, the selection of concepts that will be further described in the following detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0005] One innovative aspect of the subject matter of this disclosure can be implemented as a sensor assembly including a cover layer and a first sensor device. The cover layer is molded from a first material to have a flat surface and a non-uniform thickness, wherein the thickness of the first material in a first region of the cover layer is less than the thickness of the first material surrounding the first region. Within the first region, the first sensor device is disposed below the flat surface of the cover layer and is configured to transmit and receive a first capacitive sensing signal through a portion of the flat surface coinciding with the first region.

[0006] Another innovative aspect of the subject matter of this disclosure can be achieved by a method of manufacturing a sensor assembly. The method includes the steps of: molding a first material to form a cover layer having a flat surface and a non-uniform thickness, wherein the thickness of the first material in a first region of the cover layer is less than the thickness of the first material surrounding the first region; and within the first region, disposing a first sensor device below the flat surface of the cover layer, wherein the first sensor device is configured to transmit and receive a first capacitive sensing signal through a portion of the flat surface coinciding with the first region.

[0007] Another innovative aspect of the subject matter of this disclosure can be implemented using a sensing assembly comprising an overlay, a fingerprint sensor, and a proximity sensor. The overlay is molded from a first material to have a flat surface and a non-uniform thickness, wherein the thickness of the first material in a first region of the overlay is less than the thickness of the first material surrounding the first region. Within the first region, a fingerprint sensor is disposed beneath the flat surface of the overlay and configured to detect a fingerprint on a portion of the flat surface coinciding with the first region. In a second region surrounding the first region, a proximity sensor is disposed beneath the flat surface of the overlay and configured to detect the position of an input object relative to a portion of the flat surface coinciding with the second region. Attached Figure Description

[0008] This embodiment is illustrated by way of example and is not intended to be limited to the figures in the accompanying drawings.

[0009] Figure 1 An example input device that can be used with this embodiment is shown.

[0010] Figure 2A and 2B An example sensor assembly according to some implementations is shown.

[0011] Figures 3A-3C Cross-sectional views of example sensor assemblies at various stages of the manufacturing process, according to some embodiments, are shown.

[0012] Figure 4A and 4B Another example sensor assembly according to some implementations is shown.

[0013] Figure 5A and 5B Another example sensor assembly according to some implementations is shown.

[0014] Figure 6A and 6B Another example sensor assembly according to some implementations is shown.

[0015] Figure 7 Another example input device that can be used with this implementation is shown.

[0016] Figure 8A and 8B Another example sensor assembly according to some implementations is shown.

[0017] Figures 9A-9F A cross-sectional view of another example sensor assembly at various stages of the manufacturing process, according to some embodiments, is shown.

[0018] Figure 10 An illustrative flowchart of a process for manufacturing a sensor assembly according to some embodiments is shown. Detailed Implementation

[0019] In the following description, numerous specific details (such as examples of specific components, circuits, and processes) are set forth to provide a thorough understanding of this disclosure. As used herein, the term "coupled" means directly connected to or connected via one or more intermediate components or circuits. The terms "electronic system" and "electronic device" may be used interchangeably to refer to any system capable of electronically processing information. Furthermore, specific nomenclature is set forth in the following description and for illustrative purposes to provide a thorough understanding of various aspects of this disclosure. However, it will be apparent to those skilled in the art that practical exemplary embodiments may not require these specific details. In other instances, well-known circuits and devices are illustrated in block diagram form to avoid obscuring the disclosure. Some portions of the subsequent detailed description are presented according to other symbolic representations of processes, logic blocks, handling, and operations on data bits within computer memory.

[0020] These descriptions and representations are means by which those skilled in the art of data processing most effectively communicate the substance of their work to others skilled in the art. In this disclosure, processes, logic blocks, handling, etc., are conceived as a self-consistent sequence of steps or instructions that leads to a desired result. These steps are those that require physical manipulation of physical quantities. Typically, although not essential, these quantities take the form of electrical or magnetic signals that can be stored, transmitted, combined, compared, and otherwise manipulated in a computer system. However, it should be remembered that all these and similar terms are to be associated with appropriate physical quantities and are merely convenient notations applied to those quantities.

[0021] Unless otherwise specifically stated as is evident from the following discussion, it should be understood that throughout this application, discussions using terms such as “access,” “receive,” “send,” “use,” “select,” “determine,” “normalize,” “multiply,” “average,” “monitor,” “compare,” “apply,” “update,” “measure,” “derive,” etc., refer to the actions and processes of a computer system or similar electronic computing device that operates on and transforms data represented as physical (electronic) quantities within the registers and memories of the computer system into other data similarly represented as physical quantities within the computer system’s memory or registers or other such information storage, transmission, or display devices.

[0022] In the accompanying drawings, a single block may be described as performing one or more functions; however, in practice, the one or more functions performed by that block may be performed in a single component or across multiple components, and / or may be performed using hardware, software, or a combination of hardware and software. To clearly illustrate this interchangeability between hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described below according to their functionality. Whether this functionality is implemented in hardware or software depends on the specific application and the design constraints imposed on the system as a whole. Those skilled in the art may implement the described functionality in varying ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the invention. Furthermore, the example input device may include components other than those shown, including well-known components such as processors, memory, etc.

[0023] Unless explicitly described as being implemented in a particular manner, the techniques described herein can be implemented in hardware, software, firmware, or any combination thereof. Any feature described as a module or component may also be implemented together in an integrated logic device or separately as discrete but interoperable logic devices. If implemented in software, the techniques may be implemented at least in part by a non-transitory processor-readable storage medium comprising instructions that, when executed, perform one or more of the methods described above. The non-transitory processor-readable data storage medium may form part of a computer program product, which may include encapsulation material.

[0024] Non-transitory processor-readable storage media may include random access memory (RAM) such as synchronous dynamic random access memory (SDRAM), read-only memory (ROM), non-volatile random access memory (NVRAM), electrically erasable programmable read-only memory (EEPROM), flash memory, and other known storage media. Alternatively or additionally, the technology may be implemented at least in part by a processor-readable communication medium that carries or transmits code in the form of instructions or data structures that can be accessed, read, and / or executed by a computer or other processor.

[0025] The various illustrative logic blocks, modules, circuits, and instructions described in conjunction with the embodiments disclosed herein can be executed by one or more processors. As used herein, the term "processor" can refer to any general-purpose processor, conventional processor, controller, microcontroller, special-purpose processor, and / or state machine capable of executing scripts or instructions of one or more software programs stored in memory.

[0026] Various embodiments generally relate to input devices capable of fingerprint sensing. Some embodiments more specifically relate to fingerprint sensor assemblies having an input surface and a housing formed of a single layer of dielectric material. In some embodiments, the sensor assembly may include a cover layer and a first sensor device. The cover layer is molded from a first material (such as plastic, polyester film, or polymer) having a flat surface and a non-uniform thickness, wherein the thickness of the material at a first region of the cover layer is less than the thickness of the material surrounding the first region. Within the first region, the first sensor device is disposed below the flat surface of the cover layer and configured to transmit and receive a first capacitive sensing signal through a portion of the flat surface coinciding with the first region. In some other embodiments, in a second region surrounding the first region, a second sensor device may be disposed below the flat surface of the cover layer and configured to transmit and receive a second capacitive sensing signal through a portion of the flat surface coinciding with the second region.

[0027] Specific embodiments of the subject matter described in this disclosure can be implemented to achieve one or more of the following potential advantages. In some embodiments, the described techniques can be used to manufacture low-cost fingerprint sensor components that provide robust performance and a good user experience. For example, by molding the input surface and housing from a single layer of material, the manufacturing and assembly processes can be streamlined, and the associated costs are reduced. By using plastic or polymer materials for the overlay, the input surface can be made very thin while maintaining a relatively high dielectric constant, thus improving the performance of the fingerprint sensor. Furthermore, by combining the fingerprint sensor with an additional sensor device (such as a proximity sensor) under the same overlay, the sensor device can provide a continuous or uninterrupted input surface capable of receiving various forms of user input. A continuous input surface can improve the user experience while reducing or eliminating “dead zones” at the transition or intersection between the fingerprint sensor and the additional sensor device.

[0028] Figure 1 An example input device 100 that can be used with this embodiment is shown. Input device 100 includes a processing system 110 and a sensing area 120. In some embodiments, input device 100 may be configured to provide input and / or control access to an electronic system (not shown for simplicity). Example electronic systems may include, but are not limited to, personal computing devices (e.g., desktop computers, laptop computers, netbook computers, tablet computers, web browsers, e-book readers, personal digital assistants (PDAs), etc.), composite input devices (e.g., physical keyboards, joysticks, push-button switches, etc.), data input devices (e.g., remote controls, mice, etc.), data output devices (e.g., display printers, etc.), remote terminals, kiosks, video game consoles (e.g., video game consoles, portable gaming devices, etc.), communication devices (e.g., cellular phones, smartphones, etc.), and media devices (e.g., recorders, editors, televisions, set-top boxes, music players, digital photo frames, digital cameras, etc.).

[0029] In some aspects, the input device 100 may be implemented as a physical part of a corresponding electronic system. Alternatively, the input device 100 may be physically separated from the electronic system. The input device 100 may be coupled to (and communicate with) components of the electronic system using various wired and / or wireless interconnection and communication technologies, such as buses and networks. Suitable examples of such technologies may include inter-integrated circuits (I-ICs). 2 C) Serial Peripheral Interface (SPI), PS / 2, Universal Serial Bus (USB), Bluetooth®, Infrared Data Association (IrDA), and various radio frequency (RF) communication protocols defined by the IEEE 802.11 family of standards.

[0030] exist Figure 1In the example, input device 100 may correspond to a fingerprint sensor (also referred to as a "fingerprint scanner" or "fingerprint sensing device") configured to sense input provided by an input object 140 in sensing area 120. In some embodiments, input object 140 may correspond to a user's finger or fingertip. Sensing area 120 may cover any space above, around, in, and / or near input device 100, where input device 100 is capable of detecting user input. The size, shape, and / or positioning of sensing area 120 may vary depending on the specific implementation. In some embodiments, sensing area 120 may extend from the surface of input device 100 in one or more directions in space, for example, until the signal-to-noise ratio (SNR) of the sensor drops below a threshold suitable for fingerprint detection. For example, the distance that sensing area 120 extends in a particular direction may be approximately less than one millimeter, several millimeters, several centimeters, or more, and may vary depending on the type of sensing technology used and / or the desired accuracy.

[0031] Input device 100 can utilize various sensing technologies to detect user input. Example sensing technologies may include capacitive sensing, optical sensing, and ultrasonic sensing. In some embodiments, sensing area 120 may be formed by an array of capacitive sensing elements (e.g., sensor electrodes) for measuring changes in capacitance generated by a finger interacting with sensing area 120. For example, sensing area 120 may include one or more capacitive sensing elements (e.g., sensor electrodes) to create an electric field. Input device 100 can detect input based on changes in the capacitance of the sensor electrodes. For example, an object in contact with (or in close proximity to) an electric field can cause changes in voltage and / or current in the sensor electrodes. More specifically, changes in voltage and / or current at various points in the array may be correlated with ridges and valleys in the user's finger.

[0032] Example capacitive sensing techniques can be based on "self-capacitance" (also known as "absolute capacitance") and / or "mutual capacitance" (also known as "cross-capacitance"). Absolute capacitance sensing methods detect changes in capacitive coupling between sensor electrodes and an input object. For example, an input object near the sensor electrodes can alter the electric field near the sensor electrodes, thus changing the measured capacitive coupling. In some implementations, input device 100 can achieve absolute capacitance sensing by modulating the sensor electrodes relative to a reference voltage and detecting the capacitive coupling between the sensor electrodes and the input object. The reference voltage can be substantially constant or can vary. In some aspects, the reference voltage can correspond to ground potential.

[0033] Transcapacitive sensing methods detect changes in capacitive coupling between sensor electrodes. For example, an input object near the sensor electrodes can alter the electric field between the sensor electrodes, thus changing the measured capacitive coupling of the sensor electrodes. In some embodiments, input device 100 can achieve transcapacitive sensing by detecting the capacitive coupling between one or more “transmitter” electrodes and one or more “receiver” electrodes. The transmitter electrodes can be modulated relative to the receiver electrodes. For example, the transmitter electrodes can be modulated relative to a reference voltage to transmit a signal, while the receiver electrodes can be maintained at a relatively constant voltage to “receive” the transmitted signal. The signal received by the receiver electrodes may be affected by environmental interference (e.g., from objects in contact with or in close proximity to the sensor electrodes). In some aspects, each sensor electrode can be a dedicated transmitter or a dedicated receiver. In other aspects, each sensor electrode can be configured to both transmit and receive.

[0034] Processing system 110 may be configured to operate the hardware of input device 100 to detect input in sensing area 120. In some embodiments, processing system 110 may control one or more sensor electrodes to detect objects and / or fingerprints in sensing area 120. For example, processing system 110 may be configured to transmit signals via one or more transmitter sensor electrodes and receive signals via one or more receiver sensor electrodes. In some aspects, one or more components of processing system 110 may be co-located, for example, closely proximate to the sensing element of input device 100. In some other aspects, one or more components of processing system 110 may be physically separated from the sensing element of input device 100. For example, input device 100 may be a peripheral device coupled to a computing device, and processing system 110 may be implemented as software executed by the central processing unit (CPU) of the computing device. In another example, input device 100 may be physically integrated into a mobile device, and processing system 110 may at least partially correspond to the CPU of the mobile device.

[0035] The processing system 110 may be implemented as a collection of modules implemented in firmware, software, or a combination thereof. Example modules include a hardware operation module for operating hardware such as one or more sensing elements; a data processing module for processing data such as sensor signals; and a reporting module for reporting information to other components of the electronic system, such as a host processor or CPU. In some embodiments, the processing system 110 may include a sensor operation module configured to operate sensing elements to detect user input in sensing area 120; an authentication module configured to authenticate a user of input device 100 and / or the electronic system based at least in part on user input; an identification module configured to recognize gestures associated with certain user inputs; and a mode-changing module for changing the operating mode of input device 100 and / or the electronic system.

[0036] Processing system 110 can respond to user input in sensing area 120 by triggering one or more actions. Example actions include changing the operating mode of input device 100 and / or authenticating the user of input device 100. In some embodiments, processing system 110 may provide information about the detected input to an electronic system (e.g., to the CPU of the electronic system). The electronic system can then process the information received from processing system 110 to perform additional actions (e.g., changing the mode of the electronic system and / or authentication operations).

[0037] The processing system 110 can perform any appropriate amount of processing on the electrical signals to convert or generate information for the electronic system. For example, the processing system 110 can digitize analog signals received via sensor electrodes and / or perform filtering or conditioning on the received signals. In some aspects, the processing system 110 can subtract or otherwise take into account a “baseline” associated with the sensor electrodes. For example, the baseline can represent the state of the sensor electrodes when no user input is detected. Therefore, the information provided to the electronic system by the processing system 110 can reflect the difference between the signals received from the sensor electrodes and the baseline associated with each sensor electrode.

[0038] In some implementations, when fingerprint 140 is placed on sensing area 120 of the input surface, processing system 110 can scan sensor electrodes to capture or acquire a capacitive “image” of fingerprint 140. Variations in capacitance across the image can be interpreted as a pattern of ridges and valleys in the user’s fingertip (e.g., representing the user’s fingerprint). The detail and accuracy of capacitive sensing information can be affected by the input surface through which sensing signals are emitted and received. For example, input surfaces made of thinner materials and / or having a higher dielectric constant tend to produce more accurate sensing information. Thus, some fingerprint sensors are fabricated by placing a very thin sheet of cover material (such as glass) on top of an open housing surrounding the capacitive sensing element. The cover serves as the input surface while closing the housing and encapsulating the sensing element within it. However, such multi-piece housing assemblies are typically fragile, expensive to manufacture, and offer limited customizability.

[0039] In some embodiments, the housing assembly for the input device 100 may be made of a single layer of material and / or compound. For example, the material forming the housing assembly may have a non-uniform thickness, wherein the opening region coinciding with the input surface is thinner than the surrounding region (e.g., which provides side support or the remainder of the housing). A fingerprint sensor may be disposed within the opening region such that the sensor electrodes are positioned just below the input surface. In some embodiments, the housing assembly may be molded from a polymeric material such as plastic, polyester film, etc. The polymeric material can be molded to have a very thin input surface with a relatively high dielectric constant (e.g., higher than that of glass), thereby allowing robust capacitive sensing measurements. Compared to existing multi-piece housing assemblies, the housing assembly of this embodiment can be produced by a single manufacturing (e.g., molding) process.

[0040] Figure 2A and 2B An example sensor assembly 200 according to some embodiments is shown. Specifically, Figure 2A A scale view of the sensor assembly 200 is shown, and Figure 2B A cross-sectional view of the sensor assembly 200 is shown. In some embodiments, the sensor assembly 200 may be... Figure 1 An example of input device 100.

[0041] exist Figure 2A and 2B In the example, the sensor assembly 200 is configured, for example, as a keycap structure that may be included or integrated with a keyboard or numeric keypad. The sensor assembly 200 includes a fingerprint sensor 204 and a cover layer 202 having a substantially flat surface 203. Figure 2BAs shown, the cover layer 202 is formed of a single-layer material (such as plastic, polyester film, or polymer) with uneven thickness. The fingerprint sensor 204 is disposed beneath the cover layer 202, in the opening region where the material is thinnest. Therefore, the flat surface 203 of the cover layer 202 can provide an input surface for capturing or acquiring fingerprints. For example, the flat surface 203 may include… Figure 1 Sensing area 102.

[0042] Figures 3A-3C Cross-sectional views 300-320 of example sensor assemblies are shown, illustrating various stages of the manufacturing process according to some embodiments. In some embodiments, regarding... Figures 3A-3C The described manufacturing process can be used to manufacture the sensor assembly 200 of Figure 2. Therefore, Figures 3A-3C The sensor component can correspond to a fingerprint sensor component. In some implementations, the sensor component can be configured as a keycap.

[0043] like Figure 3A As shown, the cover layer 302 can be molded from a first material. In some embodiments, the first material can be a polymer, such as, for example, plastic, polyester film, etc. Furthermore, in some embodiments, the first material can be selected to have a relatively high dielectric constant. In some aspects, the first material can be opaque (e.g., colored). In some other aspects, the first material can be translucent. Figure 3A As shown, the cover layer 302 has a substantially flat surface 304 and a non-uniform thickness. In some embodiments, the outer surface of the cover layer 302 may be painted for aesthetic purposes and / or to obscure circuitry disposed therein. In some other embodiments, text and / or images may be printed on the flat surface 304 to indicate the purpose or function of the sensor assembly. The thickness (T1) of the material in the opening region 306 beneath the flat surface 304 may be significantly smaller (e.g., thinner than) the thickness (T2) of the material surrounding the opening region 306. Therefore, the opening region 306 provides an opening or cavity in the cover layer 302 in which a sensor device may be disposed.

[0044] like Figure 3B As shown, adhesive or glue 312 is dispersed into the opening area 306 of the cover layer 302. More specifically, adhesive 312 can be used to bond sensor devices to the cover layer 302 on the underside of the flat surface 304. In some embodiments, adhesive 312 can be a heat-curing type adhesive that can be cured or solidified by heat. Figure 3B In the example shown, adhesive 312 is used to fill the opening area 306 of the cover layer 302. However, in other embodiments, a smaller or larger amount of adhesive 312 may be used.

[0045] like Figure 3C As shown, a sensor device is disposed or inserted into an opening region 306 of a cover layer 302. In some embodiments, the sensor device may be a fingerprint sensor including an array of sensor electrodes 322 coupled to a printed circuit board (PCB) 324. The sensor electrodes 322 may be configured to transmit and receive capacitive sensing signals for fingerprint detection. The PCB may include circuitry (such as one or more processors) for operating the sensor electrodes 322 and / or interpreting the capacitive sensing signals. Alternatively or additionally, the PCB 324 may include circuitry (such as pins, traces, etc.) for routing the capacitive sensing signals to and from an external processor or CPU. In some embodiments, the sensor electrodes 322 may be stacked on top of the PCB 324. This allows the sensor electrodes 322 to be positioned close to a flat surface 304 and thus transmit and receive capacitive sensing signals through the flat surface 304 of the cover layer 302. With the sensor device properly positioned below the flat surface 304, adhesive 312 may be heated or cured to bond and / or encapsulate the sensor device to the cover layer 302.

[0046] Figure 4A and 4B Another example sensor assembly 400 according to some implementations is shown. Specifically, Figure 4A A scale view of the sensor assembly 400 is shown, and Figure 4B A cross-sectional view of the sensor assembly 400 is shown. In some embodiments, the sensor assembly 400 may be... Figure 1 An example of an input device 100. Furthermore, in some embodiments, the sensor assembly 400 can use... Figures 3A-3C The process described is used to manufacture it.

[0047] The sensor assembly 400 includes a fingerprint sensor 404 and a cover layer 402 having a substantially flat surface 403. Figure 4A and 4B In this example, the cover layer 402 is formed of a single-layer material (such as plastic, polyester film, or polymer) with uneven thickness. More specifically, the cover layer 402 is molded to include raised or wavy edges around the boundary or periphery of the flat surface 403. The fingerprint sensor 404 is disposed beneath the cover layer 404, in the opening area where the material is thinnest. Thus, the flat surface 403 of the cover layer 402 can provide an input surface for capturing or acquiring fingerprints, and the wavy edges can serve as guides for placing the user's finger.

[0048] Figure 5A and 5B Another example sensor assembly 500 according to some implementations is shown. Specifically, Figure 5A A top view of the sensor assembly 500 is shown, and Figure 5B A cross-sectional view of the sensor assembly 500 is shown. In some embodiments, the sensor assembly 500 may be... Figure 1 An example of an input device 100. Furthermore, in some embodiments, the sensor assembly 500 can use... Figures 3A-3C The process described is used to manufacture it.

[0049] like Figure 5A As shown, the sensor assembly 500 includes a cover layer 510 configured to emit or transmit light via a halo 512. In some embodiments, the cover layer 510 may be molded from a translucent material capable of transmitting light, such as plastic, polyester film, or polymer. The surface 514 surrounded by the halo 512 may be colored to confine or direct the emitted light to the uncolored area forming the halo 512. Figure 5B As shown, the sensor assembly 500 also includes a fingerprint sensor 520 disposed beneath the cover layer 510 and one or more light sources 530 disposed beneath the sensor 520. In some embodiments, the light source 530 may include a light-emitting diode (LED) or any other light source capable of emitting light in the visible spectrum. In some embodiments, the light source 530 may be coupled to the fingerprint sensor 520. For example, the light source 530 may be configured to emit light in a specific pattern and / or color to indicate the state or configuration of the fingerprint sensor 520. In some embodiments, the sensor assembly 500 may further include one or more light guides 540 to help guide the light emitted by the light source 530 to a halo 512 in the cover layer 510.

[0050] Figure 6A and 6B Another example sensor assembly 600 according to some embodiments is shown. Specifically, Figure 6A A top view of the sensor assembly 600 is shown, and Figure 6B A cross-sectional view of the sensor assembly 600 is shown. In some embodiments, the sensor assembly 600 may be... Figure 1 An example of an input device 100. Furthermore, in some embodiments, the sensor assembly 600 can use... Figures 3A-3C The process described is used to manufacture it.

[0051] like Figure 6A As shown, the sensor assembly 600 includes a cover layer 610 configured to emit or transmit light via a light bar 612. In some embodiments, the cover layer 610 may be molded from a translucent material capable of transmitting light, such as plastic, polyester film, or polymer. The surface 614 surrounding the light bar 612 may be colored to confine or direct the emitted light to an uncolored area forming the light bar 612. Figure 6B As shown, the sensor assembly 600 also includes a fingerprint sensor 620 disposed beneath the cover layer 610 and one or more light sources 630 disposed beneath the sensor 620. In some embodiments, the light source 630 may include an LED or any other light source capable of emitting light in the visible, IR, or UV spectra. In some embodiments, the light source 630 may be coupled to the fingerprint sensor 620. For example, the light source 630 may be configured to emit light in a specific pattern and / or color to indicate the status or configuration of the fingerprint sensor 620.

[0052] Figure 7 Another example input device 700 that can be used with this embodiment is shown. Input device 700 includes a processing system 710 and a sensing area 720. Input device 700 can be configured to provide input to an electronic system (not shown for simplicity). Examples of electronic systems may include personal computing devices (e.g., desktop computers, laptop computers, netbook computers, tablet computers, web browsers, e-book readers, and PDAs), composite input devices (e.g., physical keyboards, joysticks, and push-button switches), data input devices (e.g., remote controls and mice), data output devices (e.g., displays and printers), remote terminals, kiosks, video game consoles (e.g., video game consoles, portable gaming devices, etc.), communication devices (e.g., cellular phones such as smartphones), and media devices (e.g., recorders, editors, and players, such as televisions, set-top boxes, music players, digital photo frames, and digital cameras).

[0053] In some aspects, the input device 700 can be implemented as a physical part of a corresponding electronic system. Alternatively, the input device 700 can be physically separated from the electronic system. The input device 700 can be coupled to (and communicate with) components of the electronic system using various wired and / or wireless interconnection and communication technologies, such as buses and networks. Example technologies may include I 2 C, SPI, PS / 2, USB, Bluetooth®, IrDA, and various RF communication protocols defined by the IEEE 802.11 family of standards.

[0054] exist Figure 7In the example, input device 700 may correspond to a proximity sensor device (e.g., also referred to as a “touchpad” or “touch sensor device”) configured to sense input provided by one or more input objects 740 in sensing area 720. Example input objects 740 include fingers, styluses, etc. Sensing area 720 may cover any space above, around, in, and / or near input device 700, where input device 700 is capable of detecting user input (such as that provided by one or more input objects 740). The size, shape, and / or positioning of sensing area 720 (e.g., relative to an electronic system) may vary depending on the specific implementation.

[0055] In some embodiments, the sensing area 720 may extend from the surface of the input device 700 in one or more directions in space, for example, until the sensor's SNR drops below a threshold suitable for object detection. For example, the distance the sensing area 720 extends in a particular direction may be approximately less than one millimeter, several millimeters, several centimeters, or greater, and may vary depending on the type of sensing technology used and / or the desired accuracy. In some embodiments, the sensing area 720 may detect input involving: no physical contact with any surface of the input device 700, contact with the input surface of the input device 700 (e.g., a touch surface and / or screen), contact with the input surface of the input device 700 coupled with a certain amount of applied force or pressure, and / or any combination thereof.

[0056] In some embodiments, the input surface may be provided by one or more surfaces of the housing of the input device 700 and / or projected onto one or more surfaces of the housing of the input device 700 (e.g., as an image). For example, the sensing area 720 may have a rectangular shape when projected onto the input surface of the input device 700. In some aspects, input may be provided by an image spanning a one-dimensional, two-dimensional, three-dimensional, or higher-dimensional space in the sensing area 720. In some other aspects, input may be provided by projection along a specific axis or plane in the sensing area 720. Furthermore, in some aspects, input may be provided by a combination of an image and a projection in the sensing area 720.

[0057] Input device 700 can utilize various sensing technologies to detect user input. Example sensing technologies may include capacitive, inverse dielectric, resistive, inductive, magnetic, acoustic, ultrasonic, thermal, and optical sensing technologies. In some embodiments, input device 700 may utilize capacitive sensing technology to detect user input. For example, sensing area 720 may include one or more capacitive sensing elements (e.g., sensor electrodes) to create an electric field. Input device 700 may detect input based on changes in the capacitance of the sensor electrodes. For example, an object in contact with (or in close proximity to) an electric field may cause a change in voltage and / or current in the sensor electrodes. This change in voltage and / or current can be detected as a “signal” indicating user input. Sensor electrodes may be arranged in an array or other configuration to detect input at multiple points within sensing area 720. As described above, example capacitive sensing technologies may be based on absolute capacitance and / or transcapacitance.

[0058] Processing system 710 can be configured to operate the hardware of input device 700 to detect input in sensing area 720. In some embodiments, processing system 710 can control one or more sensor electrodes to detect objects in sensing area 720. For example, processing system 710 can be configured to transmit signals via one or more transmitter sensor electrodes and receive signals via one or more receiver sensor electrodes. In some aspects, one or more components of processing system 710 can be co-located, for example, closely proximate to the sensing element of input device 700. In some other aspects, one or more components of processing system 710 can be physically separated from the sensing element of input device 700. For example, input device 700 can be a peripheral device coupled to a computing device, and processing system 710 can be implemented as software executed by the CPU of the computing device. In another example, input device 700 can be physically integrated into a mobile device, and processing system 720 can at least partially correspond to the CPU of the mobile device.

[0059] In some embodiments, the processing system 710 may be implemented as a collection of modules implemented in firmware, software, or a combination thereof. Example modules include a hardware operation module for operating hardware such as sensor electrodes and a display screen; a data processing module for processing data such as sensor signals and location information; and a reporting module for reporting information. In some embodiments, the processing system 710 may include a sensor operation module configured to operate sensing elements to detect user input in the sensing area 720; a recognition module configured to recognize gestures such as pattern-changing gestures; and a pattern-changing module for changing the operating mode of the input device 700 and / or the electronic system.

[0060] Input device 700 may include additional input components that can be operated by processing system 710 or another processing system. In some embodiments, the additional input components may include a fingerprint sensor that can be used to authenticate a user of input device 700 and / or a corresponding electronic system. For example, the fingerprint sensor may use capacitive fingerprint imaging technology to detect and / or analyze the user's fingerprint 730 in fingerprint scanning area 750. In some embodiments, fingerprint scanning area 750 may coincide with or substantially overlap with sensing area 720.

[0061] Processing system 710 can respond to user input in sensing area 720 and / or fingerprint scanning area 750 by triggering one or more actions. Example actions include changing the operating mode of input device 700 and / or graphical user interface (GUI) actions such as cursor movement, selection, menu navigation, etc. In some embodiments, processing system 710 can determine location information of the detected input. As used herein, the term "location information" refers to any information that describes or otherwise indicates the location or orientation of the detected input (e.g., within sensing area 720). Example location information may include absolute position, relative position, velocity, acceleration, and / or other types of spatial information. In some embodiments, processing system 710 may provide information about the detected input to an electronic system (e.g., to the CPU of the electronic system). The electronic system can then process the information received from processing system 710 to perform additional actions (e.g., changing the mode of the electronic system and / or GUI actions).

[0062] The processing system 710 is operable on the sensing elements of the input device 700 to generate electrical signals indicating input (or the absence of input) in the sensing area 720 and / or the fingerprint scanning area 750. The processing system 710 can perform any appropriate amount of processing on the electrical signals to convert or generate information for the electronic system. For example, the processing system 710 can digitize analog signals received via sensor electrodes and / or perform filtering or conditioning on the received signals. In some aspects, the processing system 710 can subtract or otherwise account for a “baseline” associated with the sensor electrodes. For example, the baseline can represent the state of the sensor electrodes when no user input is detected. Therefore, the information provided to the electronic system by the processing system 710 can reflect the difference between the signals received from the sensor electrodes and the baseline associated with each sensor electrode.

[0063] In some implementations, the processing system 710 may interpret location information based on user input received at least partially via the fingerprint scanning area 750. For example, location information may correspond to a swiping gesture initiated in the sensing area 720 and traversing or terminating within the fingerprint scanning area 750. Aspects of this disclosure recognize that it may be desirable to interpret such user input as gesture input rather than fingerprint input. However, in some input devices, the input surface associated with the scanning area 750 is positioned within a cutout window of the input surface associated with the sensing area 720. In other words, the fingerprint sensor (below the fingerprint scanning area 750) and the proximity sensor (below the sensing area 720) have different input surfaces manufactured separately and combined during the assembly stage. Therefore, gaps or openings exist at the transition or intersection of the fingerprint scanning area 750 and the sensing area 720. Such gaps may create “dead zones” in the sensing area 720 and / or the fingerprint scanning area 750 due to poor sensitivity and / or user experience.

[0064] In some embodiments, the shared input surface for the sensing area 720 and the fingerprint scanning area 750 may be produced from a single layer of material and / or compound. For example, the material forming the input surface may have a non-uniform thickness, wherein the opening region coinciding with the input surface is thinner than the surrounding region. The fingerprint sensor may be disposed within the opening region such that the sensor electrodes are located directly below the input surface. A proximity sensor may be disposed below a region of the input surface surrounding the opening region. In some embodiments, the input surface may be molded from a polymeric material, such as plastic, polyester film, etc. The polymeric material can be molded into a very thin input surface with a relatively high dielectric constant (e.g., higher than that of glass), thereby allowing robust capacitive sensing measurements. Compared to existing input devices with multiple input surfaces, the input surface of this embodiment can be produced by a single manufacturing (e.g., molding) process.

[0065] Figure 8A and 8B Another example sensor assembly 800 according to some implementations is shown. Specifically, Figure 8A A scale view of the sensor assembly 800 is shown, and Figure 8B A cross-sectional view of sensor assembly 800 (e.g., the upper right corner of sensor assembly 800) is shown. In some embodiments, sensor assembly 800 may be... Figure 7 An example of an input device 700.

[0066] exist Figure 8A and 8BIn the example, sensor assembly 800 is configured as, for example, a touchpad or touchpad that may be included or integrated with a keyboard or keypad. Sensor assembly 800 includes a fingerprint sensor 820, a proximity sensor 830, and a cover layer 810 having a substantially flat surface 801. Figure 8B As shown, the cover layer 810 is formed of a single layer of material (such as plastic, polyester film, or polymer) with uneven thickness. A fingerprint sensor 820 is disposed beneath the cover layer 810, in the opening region 814 where the material is thinnest. A proximity sensor 830 is also disposed beneath the cover layer 810, in region 812 surrounding the opening region 814. In some embodiments, the fingerprint sensor 820 may be coupled to the proximity sensor 830 via a PCB 832 (also referred to as the "proximity sensor PCB") associated with the proximity sensor 830. Furthermore, in some embodiments, the lower side 816 of the cover layer 810 may be colored for aesthetic purposes (e.g., to provide a glassy or mirror-like finish) and / or to conceal the underlying circuitry.

[0067] The flat surface 801 of the overlay layer 810 can provide a continuous or uninterrupted input surface for detecting fingerprints and proximity information from one or more input objects. (See example...) Figure 7 A flat surface 801 may encompass the sensing area 720 and the fingerprint scanning area 750. More specifically, the fingerprint scanning area 750 may coincide with the opening area 814 of the cover layer 810, and the sensing area 720 may coincide with the surrounding area 812 of the cover layer 810. Because there are no openings or gaps at the transition or intersection between the opening area 814 and the surrounding area 812, the sensor assembly 800 can provide improved performance and / or user experience compared to existing input devices with multiple input surfaces.

[0068] Figures 9A-9F Cross-sectional views 900-950 of another example sensor assembly at various stages of the manufacturing process, according to some embodiments, are shown respectively. In some embodiments, regarding Figures 9A-9F The manufacturing process described can be used to manufacture the sensor assembly 800 of Figure 8. Therefore, Figures 9A-9F The sensor assembly can correspond to a combination of fingerprint and proximity sensor assemblies. In some implementations, the sensor assembly can be configured as a touchpad or touch panel.

[0069] like Figure 9AAs shown, fingerprint sensor 904 is placed in a cavity or opening of fixture 902. Although not shown, for simplicity, fingerprint sensor 904 may include an array of sensor electrodes coupled to a PCB. The sensor electrodes may be configured to transmit and receive capacitive sensing signals for fingerprint detection. The PCB may include circuitry for operating the sensor electrodes and / or interpreting the capacitive sensing signals. Alternatively or additionally, the PCB may include circuitry for routing the capacitive sensing signals to and from an external processor or CPU. In some embodiments, the PCB may be stacked on top of the sensor electrodes such that the sensor electrodes face or are adjacent to fixture 902. This allows the sensor electrodes to be positioned close to a cover layer to be added at a later stage of the manufacturing process.

[0070] like Figure 9B As shown, the proximity sensor PCB 912 can be positioned on top of the mounting device 902, surrounding the fingerprint sensor 904. The proximity sensor PCB 912 may be coupled to or include one or more sensor electrodes (not shown for simplicity) configured to transmit and receive capacitive sensing signals for proximity detection. The proximity sensor PCB 912 may include circuitry for operating the sensor electrodes and / or interpreting the capacitive sensing signals. Alternatively or additionally, the proximity sensor PCB 912 may include circuitry for routing the capacitive sensing signals to an external processor CPU. In some embodiments, the proximity sensor PCB 912 may further provide a communication interface between the fingerprint sensor 904 and the proximity sensor.

[0071] like Figure 9C As shown, the proximity sensor PCB 912 is wire-bonded to the fingerprint sensor 904. More specifically, the fingerprint sensor 904 may be coupled to the proximity sensor PCB 912 via one or more leads 922. All aspects of this disclosure recognize that, (e.g., compared to conventional solder flow processes) wire bonding is a relatively low-cost technique for coupling the fingerprint sensor 904 to the proximity sensor PCB 912. However, unlike solder balls, the leads 922 may need to be encapsulated or otherwise protected from external components.

[0072] like Figure 9DAs shown, an epoxy molding compound or other filler material (such as silicone) 932 is dispersed into the opening of the retaining device 902. The epoxy molding compound 932 can be used to encapsulate and / or hold the lead 922 in place. For example, once cured, the epoxy molding compound 932 can prevent the lead 922 from bending or separating under external forces and / or stress. In some embodiments, the epoxy molding compound 932 may be opaque. In some other embodiments, the epoxy molding compound 932 may be translucent.

[0073] like Figure 9E As shown, after the epoxy molding compound 932 has cured, the fixing device 902 is removed. Adhesive 944 is dispersed on the surface of the fingerprint sensor 904 (e.g., the surface adjacent to the fixing device 902), and one or more adhesives 942 are attached to the surface adjacent to the sensor PCB 912 (e.g., the surface adjacent to the fixing device 902). In some embodiments, adhesive 944 may be a heat-curing or solidifying adhesive.

[0074] like Figure 9F As shown, a cover layer 952 is placed over the sensor assembly and bonded or attached to the fingerprint sensor 904 and the proximity sensor PCB 912 via adhesive 944 and bonding agent 942, respectively. In some embodiments, the cover layer 952 may be molded from a polymer material such as, for example, plastic, polyester film, etc. Furthermore, in some embodiments, the material may be selected to have a relatively high dielectric constant. In some aspects, the material may be opaque (e.g., colored). In some other aspects, the material may be translucent. Figure 9F As shown, the cover layer 952 has a substantially flat surface 951 and an uneven thickness. In some embodiments, the underside of the cover layer 952 (e.g., opposite the flat surface 951) may be colored to provide a glassy or mirror-like finish and / or to obscure the circuitry disposed underneath. The thickness of the material in the area overlapping with the fingerprint sensor 904 may be less than (e.g., thinner than) the thickness of the material overlapping with the proximity sensor PCB 912. Therefore, the fingerprint sensor 904 may be positioned closer to the flat surface 951 than the proximity sensor PCB 912.

[0075] Figure 10 An illustrative flowchart of a process 1000 for manufacturing a sensor assembly according to some embodiments is shown. More specifically, process 1000 can be used to manufacture any of the example sensor assemblies described herein.

[0076] A first material is molded to form a cover layer (1010) having a flat surface and a non-uniform thickness. The first material can be a polymer, such as a plastic, polyester film, etc. In some aspects, the first material can be selected to have a relatively high dielectric constant. The first material can be thinner below the flat surface, in a first region of the cover layer, and thicker in a region surrounding the first region. In some embodiments, the cover layer can be molded to form a housing for a fingerprint sensor (such as regarding...). Figure 1-6B As described. In some other embodiments, the overlay can be molded to form a combined input surface for multiple sensor devices (such as regarding...). Figure 7-9F (As described).

[0077] Within the first region, a first sensor device (1020) is disposed beneath the flat surface of the overlay layer. The first sensor device can be configured to transmit and receive capacitive sensing signals via a portion of the flat surface coinciding with the first region. In some embodiments, the first sensor device may be a fingerprint sensor configured to detect fingerprints on the flat surface using capacitive sensing technology. Therefore, the first sensor device can be positioned beneath the thinnest region of the overlay layer, such that the associated sensor electrodes are closest to the flat surface (e.g., regarding...). Figure 3C and 9F (As described).

[0078] In some embodiments, a second sensor device (1030) is disposed below a flat surface of the overlay in a second region surrounding the first region. The second sensor device can be configured to transmit and receive capacitive sensing signals via a portion of the flat surface coinciding with the second region. In some embodiments, the second sensor device can be a proximity sensor configured to use capacitive sensing technology to determine positional information of an object on or near the flat surface. However, because positional information can be more granular or accurate than the capacitive sensor data required for fingerprint detection and authentication, the second sensor device can be positioned below a thicker area of ​​the overlay such that the associated sensor electrodes are further away from the flat surface than the sensor electrodes used for fingerprint detection (e.g., regarding...). Figure 9F (As described).

[0079] Those skilled in the art will understand that information and signals can be represented using any of a variety of different techniques and skills. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0080] Furthermore, those skilled in the art will understand that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the aspects disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability between hardware and software, the various illustrative components, blocks, modules, circuits, and steps have been generally described above according to their functionality. Whether this functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the system as a whole. Those skilled in the art can implement the described functionality in varying ways for each specific application, but such implementation decisions should not be construed as departing from the scope of this disclosure.

[0081] The methods, sequences, or algorithms described in connection with the aspects disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from and write information to the storage medium. Alternatively, the storage medium may be integral with the processor.

[0082] In the foregoing description, specific examples of embodiments have been described with reference to them. However, it will be apparent that various modifications and changes can be made thereto without departing from the broader scope of this disclosure as set forth in the appended claims. Therefore, the description and drawings should be considered in an illustrative sense rather than a restrictive one.

Claims

1. A sensor assembly, comprising: A cover layer, which is molded from a first material to have a flat surface and a non-uniform thickness, wherein the thickness of the first material in a first region of the cover layer is less than the thickness of the first material surrounding the first region; A first sensor device is disposed within the first region, below the flat surface of the cover layer, and the first sensor device is configured to transmit and receive a first capacitive sensing signal through a portion of the flat surface that coincides with the first region. as well as A second sensor device is disposed below a second region of the cover layer, the second region having a different thickness than the first region, the second sensor device being configured to transmit and receive a second capacitive sensing signal through a portion of the flat surface coinciding with the second region.

2. The sensor assembly of claim 1, wherein the first material comprises plastic, polyester film, epoxy molding compound, or polymer.

3. The sensor assembly of claim 1, wherein the first sensor device includes a fingerprint sensor configured to detect a fingerprint on the portion of the flat surface coinciding with the first region based on a change in the first capacitive sensing signal.

4. The sensor assembly of claim 1, wherein the first sensor device is bonded to the first region of the cover layer using adhesive.

5. The sensor assembly of claim 1, wherein the second sensor device includes a proximity sensor configured to detect the position of an input object relative to a portion of the flat surface coinciding with the second region based on a change in the second capacitive sensing signal.

6. The sensor assembly of claim 1, wherein the second sensor device is bonded to the second region of the cover layer using an adhesive.

7. The sensor assembly of claim 1, wherein the second sensor device is coupled to the first sensor device via a lead-connected coupling.

8. The sensor assembly of claim 7, wherein the lead connection is encapsulated in a sealing material disposed between the first sensor device and the second sensor device.

9. The sensor assembly of claim 1, wherein the lower side of the cover layer is colored with a first color, wherein the lower side of the cover layer is opposite to the flat surface.

10. A method of manufacturing a sensor assembly, comprising: A first material is molded to form a cover layer having a flat surface and a non-uniform thickness, wherein the thickness of the first material in a first region of the cover layer is less than the thickness of the first material surrounding the first region; Within the first region, a first sensor device is disposed below the flat surface of the cover layer, the first sensor device being configured to transmit and receive a first capacitive sensing signal through a portion of the flat surface that coincides with the first region. as well as A second sensor device is disposed below a second region of the cover layer, the second region having a different thickness than the first region, the second sensor device being configured to transmit and receive a second capacitive sensing signal through a portion of the flat surface that coincides with the second region.

11. The method of claim 10, wherein the first material comprises a plastic or a polymer.

12. The method of claim 10, wherein the first sensor device comprises a fingerprint sensor configured to detect a fingerprint on the portion of the flat surface coinciding with the first region based on a change in the first capacitive sensing signal.

13. The method of claim 10, further comprising: The first sensor device is bonded to the first area of ​​the cover layer using adhesive.

14. The method of claim 10, wherein the second sensor device is further configured to detect the position of the input object relative to the portion of the flat surface coinciding with the second region based on a change in the second capacitive sensing signal.

15. The method of claim 10, further comprising: The second sensor device is bonded to the second area of ​​the cover layer using an adhesive.

16. The method of claim 10, further comprising: Connect the leads of the second sensor device to the first sensor device.

17. The method of claim 16, further comprising: A sealing material is placed between the first sensor device and the second sensor device to encapsulate the lead joint.

18. The method of claim 10, further comprising: The lower side of the cover layer is colored with a first color, wherein the lower side of the cover layer is opposite to the flat surface.

19. A sensor assembly, comprising: A cover layer, which is molded from a first material to have a flat surface and a non-uniform thickness, wherein the thickness of the first material in a first region of the cover layer is less than the thickness of the first material surrounding the first region; A fingerprint sensor is disposed within the first region, below the flat surface of the cover layer, and the fingerprint sensor is configured to detect fingerprints on a portion of the flat surface that overlaps with the first region. as well as A proximity sensor is disposed below a second region of the cover layer, the second region having a different thickness than the first region, the proximity sensor being configured to transmit and receive capacitive sensing signals to detect the position of an input object relative to a portion of the flat surface coinciding with the second region.

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