Liquid handling device and liquid handling method

Abstract

The present invention provides a liquid processing apparatus and a liquid processing method capable of improving the cleanliness of a processing liquid. A liquid processing apparatus according to an embodiment of the present invention includes a storage tank, a circulation line, a supply line, a return line, and at least one filter. The storage tank is used to store a processing liquid. The circulation line is used to return the processing liquid delivered from the storage tank to the storage tank. The supply line is used to connect the circulation line and a supply portion that supplies the processing liquid to a substrate. The return line is connected to the supply line and is used to return the processing liquid from the supply line to the storage tank. The filter is provided at at least one of a position on the upstream side of the connection portion of the return line to the supply line and in the return line, and is used to remove foreign matter from the processing liquid.

Description

Technical Field

[0001] This invention relates to liquid treatment apparatus and liquid treatment method. Background Technology

[0002] Patent Document 1 discloses a liquid treatment apparatus for supplying treatment liquid to a processing unit via a supply line from a circulation line for processing liquid circulation. The liquid treatment apparatus can use a return line connected to the supply line to prevent the treatment liquid from being supplied to the processing unit, and instead return the treatment liquid to the circulation line.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2011-35135 Summary of the Invention

[0006] The technical problem to be solved by the present invention

[0007] This invention provides a technique that can improve the cleanliness of the treatment fluid.

[0008] Means for solving technical problems

[0009] One aspect of the liquid treatment apparatus of the present invention includes a storage tank, a circulation line, a supply line, a return line, and at least one filter. The storage tank is used to store the treatment liquid. The circulation line is used to return the treatment liquid supplied from the storage tank to the storage tank. The supply line is used to connect the circulation line and a supply section for supplying the treatment liquid to a substrate. The return line is connected to the supply line for returning the treatment liquid from the supply line to the storage tank. The filter is disposed on at least one of the supply line and the return line, upstream of the connection point between the supply and return lines, for removing foreign matter from the treatment liquid.

[0010] Invention Effects

[0011] Using this invention, the cleanliness of the treatment solution can be improved. Attached Figure Description

[0012] Figure 1 This is a diagram showing the schematic configuration of the substrate processing system in an embodiment.

[0013] Figure 2 This is a schematic diagram illustrating the configuration of the processing unit in the implementation method.

[0014] Figure 3 This is a diagram showing the general configuration of the processing fluid supply source in the embodiment.

[0015] Figure 4 This is a diagram showing the flow of IPA during the supply of the implementation method.

[0016] Figure 5 This is a diagram showing the flow of IPA during standby in the implementation method.

[0017] Figure 6 This is a flowchart explaining the processing during the initial operation of the implementation method.

[0018] Figure 7 This is a diagram showing the schematic configuration of the processing liquid supply source in a modified embodiment.

[0019] Explanation of reference numerals in the attached figures

[0020] 1 Substrate processing system (liquid processing device), 4 Control device, 16 Processing unit, 40 Processing liquid supply unit (supply unit), 70 Processing liquid supply source, 71 Tank (storage tank), 74 Circulation pipeline, 75 Supply pipeline, 76 Return pipeline, 80 Pump, 81 Heater (temperature regulating unit), 85 Back pressure valve (flow regulating unit), 91 Constant pressure valve, 92 Filter, 93 Switching valve (switching unit), 100 Switching valve (switching unit). Detailed Implementation

[0021] Hereinafter, with reference to the accompanying drawings, embodiments of the liquid treatment apparatus and liquid treatment method disclosed in this application will be described in detail. The liquid treatment apparatus and liquid treatment method of the present invention are not limited to the embodiments shown below.

[0022] <Overview of Substrate Processing System>

[0023] Reference Figure 1 The general configuration of the substrate processing system 1 (an example of a liquid processing device) according to the embodiment will be described. Figure 1 This is a diagram showing the schematic configuration of the substrate processing system 1 according to the embodiment. In the following description, to make the positional relationships clear, the X-axis, Y-axis and Z-axis are defined as mutually orthogonal, and the positive direction of the Z-axis is set to the vertically upward direction.

[0024] like Figure 1 As shown, the substrate processing system 1 includes an infeed / outfeed station 2 and a processing station 3. The infeed / outfeed station 2 and the processing station 3 are arranged adjacent to each other.

[0025] The infeed / outfeed station 2 includes a carrier placement section 11 and a transport section 12. The carrier placement section 11 can hold multiple carriers C that can accommodate multiple substrates, or in this embodiment, semiconductor wafers W (hereinafter referred to as wafers W) in a horizontal state.

[0026] The transport section 12 is disposed adjacent to the carrier placement section 11, and a substrate transport device 13 and a transfer section 14 are disposed inside it. The substrate transport device 13 includes a wafer holding mechanism for holding the wafer W. The substrate transport device 13 is movable in the horizontal and vertical directions and can rotate about the vertical axis. The wafer holding mechanism is used to transport the wafer W between the carrier C and the transfer section 14.

[0027] The processing station 3 is arranged adjacent to the conveying section 12. The processing station 3 includes the conveying section 15 and a plurality of processing units 16. The plurality of processing units 16 are arranged side by side on both sides of the conveying section 15.

[0028] The transport unit 15 has a substrate transport device 17 inside. The substrate transport device 17 includes a wafer holding mechanism for holding the wafer W. The substrate transport device 17 is movable in the horizontal and vertical directions and can rotate about the vertical axis. The wafer holding mechanism is used to transport the wafer W between the transfer unit 14 and the processing unit 16.

[0029] The processing unit 16 is used to perform substrate processing on the wafer W transported by the substrate transport device 17. The processing unit 16 is capable of holding the transported wafer and performing substrate processing on the held wafer. The processing unit 16 is capable of supplying a processing solution to the held wafer for substrate processing. The processing solution can be a CF-type cleaning solution such as HFC (HydrofluoroCarbon) for processing the wafer W, or a cleaning solution such as DHF (Diluted Hydrofluoric Acid) for cleaning residues from the wafer W. Alternatively, the processing solution can also be a rinsing solution such as DIW (Deionized Water) or a replacement solution such as IPA (IsoPropyl Alcohol).

[0030] Furthermore, the substrate processing system 1 includes a control device 4. The control device 4 is, for example, a computer, including a control unit 18 and a storage unit 19. The storage unit 19 stores programs for controlling various processes executed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the programs stored in the storage unit 19.

[0031] Alternatively, the above program can be recorded in a computer-readable storage medium and installed from that storage medium into the storage unit 19 of the control device 4. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

[0032] In the substrate processing system 1 configured as described above, firstly, the substrate transport device 13 of the delivery station 2 removes the wafer W from the carrier C placed in the carrier placement section 11 and places the removed wafer W in the transfer section 14. The wafer W placed in the transfer section 14 is then removed from the transfer section 14 by the substrate transport device 17 of the processing station 3 and sent to the processing unit 16.

[0033] After the wafer W is processed by the processing unit 16, it is sent out of the processing unit 16 by the substrate transport device 17 and placed in the transfer section 14. Then, the processed wafer W placed in the transfer section 14 is sent back to the carrier C of the carrier placement section 11 by the substrate transport device 13.

[0034] <Summary of Processing Unit>

[0035] Next, refer to Figure 2 An overview of the processing unit 16 is provided. Figure 2 This is a schematic diagram showing the configuration of the processing unit 16 in the embodiment. The processing unit 16 includes a chamber 20, a substrate holding mechanism 30, a processing liquid supply unit 40, and a recovery dish 50.

[0036] The chamber 20 is used to house the substrate holding mechanism 30, the processing liquid supply unit 40, and the recovery dish 50. An FFU (Fan Filter Unit) 21 is provided at the top of the chamber 20. The FFU 21 is used to form a downward flow within the chamber 20.

[0037] The substrate holding mechanism 30 includes a holding portion 31, a support portion 32, and a driving portion 33. The holding portion 31 is capable of holding the wafer W horizontally. The support portion 32 is a component extending in the vertical direction, the base end of the support portion 32 is rotatably supported by the driving portion 33, and the holding portion 31 is horizontally supported at the front end of the support portion 32. The driving portion 33 is capable of rotating the support portion 32 about a vertical axis.

[0038] The substrate holding mechanism 30 rotates the holding portion 31 supported by the support portion 32 by rotating the support portion 32 using the drive portion 33. As a result, the wafer W held in the holding portion 31 rotates.

[0039] A processing liquid supply unit 40 (an example of a supply unit) is used to supply processing liquid to a wafer W (an example of a substrate). The processing liquid supply unit 40 is connected to a processing liquid supply source 70. The processing liquid supply unit 40 includes a plurality of nozzles. For example, the plurality of nozzles are provided corresponding to each processing liquid. Each nozzle is used to discharge processing liquid supplied from each processing liquid supply source 70 to the wafer W.

[0040] The recovery dish 50 is configured to surround the holding portion 31 and is used to collect the processing liquid that splashes off the wafer W due to the rotation of the holding portion 31. A drain port 51 is formed at the bottom of the recovery dish 50, through which the processing liquid collected by the recovery dish 50 is discharged to the outside of the processing unit 16. In addition, an exhaust port 52 is formed at the bottom of the recovery dish 50 for discharging the gas supplied from the FFU 21 to the outside of the processing unit 16.

[0041] <Overview of the Processing Fluid Supply Source>

[0042] Next, refer to Figure 3 The treatment fluid supply source 70 is described. Figure 3 This diagram illustrates the schematic configuration of the processing fluid supply source 70 in the embodiment. Here, the processing fluid supply source 70 for supplying IPA will be described as an example. Figure 3 The configuration of the processing fluid supply source 70 shown is not limited to supplying IPA; it can also be applied to the configuration of a processing fluid supply source for supplying other processing fluids. Furthermore, in Figure 3 The illustration shows an example of a processing fluid supply source 70 supplying IPA to two processing fluid supply units 40, but it is not limited to this. The processing fluid supply source 70 can supply IPA to multiple processing fluid supply units 40. Alternatively, the processing fluid supply source 70 can also supply IPA to only one processing fluid supply unit 40.

[0043] The treatment fluid supply source 70 includes a tank 71, a treatment fluid replenishment unit 72, a drain line 73, a circulation line 74, a supply line 75, and a return line 76.

[0044] Tank 71 (an example of a storage tank) is used to store IPA (an example of a processing fluid). The processing fluid replenishment unit 72 is used to supply new IPA to tank 71. For example, when replacing the IPA in tank 71, or when the IPA in tank 71 is less than a specified amount, the processing fluid replenishment unit 72 supplies new IPA to tank 71.

[0045] When replacing the IPA in tank 71, drain line 73 discharges the IPA from tank 71 to the outside, discarding the IPA. When replacing the IPA in tank 71, IPA can be circulated simultaneously with the supply of new IPA, discarding any IPA remaining in circulation line 74, supply line 75, and return line 76. That is, IPA including any remaining IPA in circulation line 74, supply line 75, and return line 76 can be replaced.

[0046] The circulation line 74 is used to return IPA (an example of a processing liquid) supplied from tank 71 (an example of a storage tank) to tank 71. The circulation line 74 is configured such that the IPA flows outside tank 71 and then returns to tank 71. The circulation line 74 is configured to enable the supply of IPA to multiple processing units 16.

[0047] A pump 80, a heater 81, a filter 82, a flow meter 83, a temperature sensor 84, and a back pressure valve 85 are installed on the circulation line 74. Specifically, on the circulation line 74, in the flow direction of IPA with reference to tank 71, the pump 80, heater 81, filter 82, flow meter 83, temperature sensor 84, and back pressure valve 85 are installed sequentially from the upstream side.

[0048] Pump 80 is used to pressurize IPA in circulation line 74. The pressurized IPA circulates in circulation line 74 and returns to tank 71.

[0049] Heater 81 is installed on circulation line 74 for regulating the temperature of IPA (an example of a processing liquid). Specifically, heater 81 is used to heat the IPA. Heater 81 controls the amount of heating to the IPA based on a signal from control device 4, thereby regulating the temperature of the IPA. For example, the amount of heating to the IPA by heater 81 is adjusted based on the temperature of the IPA detected by temperature sensor 84.

[0050] For example, the control device 4 controls the heater 81 to adjust the temperature of the IPA to a predetermined temperature. The predetermined temperature is the temperature at which the IPA discharged from the nozzle of the processing liquid supply section 40 to the wafer W during supply is a pre-set processing temperature. The predetermined temperature is set based on the heat capacity of the filter 92 installed on the supply line 75, etc.

[0051] Filter 82 is used to remove contaminants, such as particles, contained in the IPA flowing in the circulation line 74. Flow meter 83 is used to measure the flow rate of the IPA flowing in the circulation line 74. Temperature sensor 84 is used to detect the temperature of the IPA flowing in the circulation line 74. Temperature sensor 84 is located upstream of the connection point between the circulation line 74 and the supply line 75 in the circulation line 74.

[0052] When the pressure of the IPA upstream of the back pressure valve 85 is greater than the specified pressure, the back pressure valve 85 increases its opening. When the pressure of the IPA upstream of the back pressure valve 85 is less than the specified pressure, the back pressure valve 85 decreases its opening. The back pressure valve 85 has the function of maintaining the pressure of the processed fluid upstream at a specified pressure. The specified pressure is a preset pressure. The valve opening of the back pressure valve 85 is controlled by the control device 4 (see reference). Figure 1 )control.

[0053] By controlling the valve opening, the back pressure valve 85 can regulate the flow rate of IPA in the circulation line 74. That is, the back pressure valve 85 (an example of a flow regulating unit) is installed on the circulation line 74 to regulate the flow rate of IPA (an example of a processed liquid) returning from the circulation line 74 to the tank 71 (an example of a storage tank). Alternatively, the flow rate of IPA in the circulation line 74 can also be regulated by controlling the discharge pressure of the pump 80. The flow rate of IPA in the circulation line 74 can be controlled based on the flow rate of IPA detected by the flow meter 83.

[0054] Supply line 75 is connected to circulation line 74. Supply line 75 is connected to circulation line 74 downstream of temperature sensor 84 and upstream of back pressure valve 85. Supply line 75 is provided with multiple processing liquid supply units 40 (an example of a supply unit) corresponding to each other. Supply line 75 branches from circulation line 74 and is configured to supply IPA to processing liquid supply units 40. Supply line 75 is used to connect circulation line 74 and processing liquid supply unit 40 that supplies IPA (an example of processing liquid) to wafer W (an example of a substrate).

[0055] A flow meter 90, a constant pressure valve 91, a filter 92, and a switching valve 93 are installed on the supply line 75. Specifically, the flow meter 90, constant pressure valve 91, filter 92, and switching valve 93 are installed sequentially from the circulation line 74 side on the supply line 75. That is, on the supply line 75, in the flow direction of IPA from the circulation line 74 to the treatment liquid supply unit 40, the flow meter 90, constant pressure valve 91, filter 92, and switching valve 93 are installed sequentially from the upstream side.

[0056] Flow meter 90 is used to measure the flow rate of IPA flowing in supply line 75. Pressure valve 91 is used to regulate the pressure of IPA located downstream of pressure valve 91. For example, pressure valve 91 regulates the pressure of IPA so that the discharge rate of IPA from the nozzle of processing liquid supply unit 40 is a predetermined discharge rate. That is, pressure valve 91 can regulate the flow rate of IPA discharged from the nozzle of processing liquid supply unit 40. The predetermined discharge rate is a preset amount and can be set according to the processing conditions of wafer W. Pressure valve 91 regulates the pressure of IPA based on a signal from control device 4.

[0057] Filter 92 is located upstream of the connection 75a between the return line 76 and the supply line 75 in the supply line 75. Filter 92 is located downstream of the constant pressure valve 91 in the supply line 75. Filter 92 is used to remove contaminants, such as particles, or foreign matter contained in the IPA flowing in the supply line 75. That is, filter 92 is used to remove foreign matter from the IPA (an example of a treatment fluid).

[0058] Filter 92 is a smaller filter than filter 82 installed on circulation line 74. Filter 92 is, for example, a POU (Point Of Use) filter. By using a smaller filter such as a POU filter, it is possible to prevent the increase in the size of supply line 75, i.e., the increase in the size of substrate processing system 1.

[0059] The switching valve 93 is used to switch whether or not IPA is supplied to the processing fluid supply unit 40. By opening the switching valve 93, IPA can be supplied to the processing fluid supply unit 40. That is, by opening the switching valve 93, IPA can be discharged from the nozzle of the processing fluid supply unit 40. By closing the switching valve 93, IPA can be stopped from being supplied to the processing fluid supply unit 40. That is, by closing the switching valve 93, IPA can be stopped from being discharged from the nozzle of the processing fluid supply unit 40. The switching valve 93 is opened and closed based on a signal from the control device 4. That is, the switching valve 93 is controlled by the control device 4.

[0060] The return line 76 is connected to the supply line 75 to return IPA (an example of a processing fluid) from the supply line 75 to the tank 71 (an example of a storage tank). The return line 76 is connected to the supply line 75 at a connection point 75a located between the filter 92 and the on / off valve 93. Multiple return lines 76 are provided corresponding to multiple processing fluid supply units 40 (an example of a supply unit). An on / off valve 100 is provided on the return line 76.

[0061] The on / off valve 100 is used to switch the flow of IPA in the return line 76. By opening the on / off valve 100, IPA can flow from the supply line 75 to the return line 76. The IPA flowing to the return line 76 can return to the tank 71. By closing the on / off valve 100, IPA cannot flow to the return line 76. The on / off valve 100 is opened and closed based on a signal from the control device 4. That is, the on / off valve 100 is controlled by the control device 4.

[0062] Each switching valve 93, 100 (an example of a switching unit) is used to switch the flow of IPA (processing fluid) to a position on the return line 76 or the supply line 75 closer to the processing fluid supply unit 40 (an example of a supply unit) than the connection part 75a.

[0063] Multiple return lines 76 converge at a position downstream of the on / off valve 100 in the flow direction of IPA within the return lines 76 and connect to the tank 71. A temperature sensor 101 is installed downstream of the point where the multiple return lines 76 converge in the return lines 76. The temperature sensor 101 is used to detect the temperature of the IPA returning from the return lines 76 to the tank 71. Alternatively, the return lines 76 may be connected to the circulation line 74 downstream of the back pressure valve 85.

[0064] <The flow of IPA during supply>

[0065] Next, refer to Figure 4 Explain the flow of IPA during supply. Figure 4 This is a diagram showing the flow of IPA during the supply of the implementation method.

[0066] When supplying IPA (an example of processing liquid) from the processing liquid supply unit 40 (an example of a supply unit) to the wafer W (an example of a substrate), the control device 4 controls the switching valves 93 and 100 (an example of a switching unit) to allow IPA to flow into the processing liquid supply unit 40. Specifically, during supply, the control device 4 closes the switching valve 100 provided on the return line 76 and opens the switching valve 93 provided on the supply line 75. As a result, IPA does not flow into the return line 76 but is discharged from the nozzle of the processing liquid supply unit 40.

[0067] The IPA flowing in the supply line 75 is filtered to remove foreign matter by the filter 92 and discharged from the nozzle of the processing liquid supply section 40 to the wafer W. Therefore, highly clean IPA can be discharged to the wafer W.

[0068] <IPA flow during standby>

[0069] Next, refer to Figure 5 The flow of IPA during standby is explained. Figure 5 This is a diagram showing the flow of IPA during standby in the implementation method.

[0070] In standby mode, when IPA (an example of processing fluid) is not supplied to the wafer W (an example of a substrate) from the processing fluid supply unit 40 (an example of a supply unit), the control device 4 controls the switching valves 93 and 100 (an example of a switching unit) to allow IPA to flow into the return line 76. Specifically, in standby mode, the control device 4 closes the switching valve 93 provided on the supply line 75 and opens the switching valve 100 provided on the return line 76. As a result, IPA is not discharged from the nozzle of the processing fluid supply unit 40, but returns to the tank 71 via the return line 76.

[0071] The IPA flowing in the return line 76 has foreign matter removed by the filter 92 installed on the supply line 75. During standby, foreign matter in the IPA is removed, thus increasing the cleanliness of the IPA.

[0072] Furthermore, in the multiple processing units 16, the switching of each switching valve 93 and 100 is controlled according to the processing status of the wafer W in each processing unit 16.

[0073] The flow rate of IPA flowing in the supply line 75 during standby is the same as the flow rate of IPA flowing in the supply line 75 during supply. Therefore, by switching the on / off states of each switching valve 93 and 100, a specified discharge amount of IPA can be supplied to the wafer W.

[0074] <Control during initial action>

[0075] Next, refer to Figure 6 The initial processing steps are explained. Figure 6 This is a flowchart illustrating the initial operation process of the implementation method. The initial operation includes the replacement operation of the IPA of the can 71, the replenishment operation of the IPA to the can 71, and the startup operation of the substrate processing system 1.

[0076] During initial operation, control device 4 controls each switching valve 93, 100 (an example of a switching unit) to allow IPA (an example of a processing fluid) to flow into return line 76 (S100). Control device 4 controls each switching valve 93, 100 in multiple supply lines 75 and multiple return lines 76 to allow IPA to flow into return line 76.

[0077] Control device 4 uses pump 80 to circulate IPA in circulation line 74 (S101) and increases the flow rate of IPA (an example of the processed liquid) flowing into return line 76 compared to standby time (S102). Specifically, during initial operation, control device 4 controls constant pressure valve 91 to increase the flow rate of IPA (an example of the processed liquid) flowing into return line 76 compared to standby time. Control device 4 can control each constant pressure valve 91 installed on each supply line 75. Additionally, during initial operation, control device 4 controls back pressure valve 85 to decrease the flow rate of IPA (an example of the processed liquid) returning from circulation line 74 to tank 71 (an example of the storage tank) compared to standby time, and increases the flow rate of IPA flowing into return line 76 compared to standby time. Because the flow rate of IPA returning from circulation line 74 to tank 71 decreases, the flow rate of IPA flowing into each supply line 75 increases, and the flow rate of IPA flowing into return line 76 increases.

[0078] Therefore, during initial operation, the IPA circulating in the circulation line 74 is cleaned of impurities by the filter 82 installed on the circulation line 74. Furthermore, the IPA flowing from the circulation line 74 to the supply line 75 and the return line 76 is cleaned of impurities by the filter 92 installed on the supply line 75.

[0079] During initial operation, the flow rate of the IPA into the supply line 75 and return line 76 increases compared to standby. Therefore, the processing fluid supply source 70 can remove many foreign objects from the IPA using the filter 92 installed on the supply line 75. The processing fluid supply source 70 can rapidly improve the cleanliness of the IPA during initial operation, allowing for earlier initiation of wafer W processing. In other words, the processing fluid supply source 70 can shorten the initial operation time.

[0080] Control device 4 determines whether a predetermined time has elapsed since the flow rate of IPA flowing into supply line 75 and return line 76 increased compared to the standby time (S103). The predetermined time is a pre-set time, which is the time it takes for the cleanliness of the IPA to reach the predetermined cleanliness level. The predetermined time can be set according to the type of initial action.

[0081] Before a predetermined time has elapsed since the flow rate of IPA flowing into the supply line 75 and the return line 76 has increased compared to the standby time (S103: No), the control device 4 continuously increases the flow rate of IPA flowing into the return line 76 (S102).

[0082] When a predetermined time has elapsed since the flow rate of IPA flowing into the supply line 75 and the return line 76 has increased compared to the standby time (S103: Yes), the control device 4 reduces the flow rate of IPA back to the standby flow rate (S104).

[0083] <Effect>

[0084] The substrate processing system 1 (an example of a liquid processing apparatus) includes a tank 71 (an example of a storage tank), a circulation line 74, a supply line 75, a return line 76, and a filter 92. The tank 71 is used to store IPA (an example of a processing liquid). The circulation line 74 is used to return IPA supplied from the tank 71 back to the tank 71. The supply line 75 connects the circulation line 74 to a processing liquid supply unit 40 (an example of a supply unit) that supplies IPA to the wafer W (an example of a substrate). The return line 76 is connected to the supply line 75 and is used to return IPA from the supply line 75 to the tank 71. The filter 92 is located upstream of the connection point 75a between the return line 76 and the supply line 75 on the supply line 75, and is used to remove foreign matter from the IPA.

[0085] Therefore, the substrate processing system 1 can remove foreign matter from the IPA using the filter 92, thereby improving the cleanliness of the IPA. For example, the substrate processing system 1 can remove foreign matter from the IPA during standby and supply a highly clean IPA to the wafer W during supply. By providing the filter 92 near the processing liquid supply section 40, the substrate processing system 1 can supply a highly clean IPA to the wafer W.

[0086] The substrate processing system 1 includes a constant pressure valve 91. The constant pressure valve 91 is disposed on the supply line 75. The filter 92 is disposed downstream of the constant pressure valve 91 on the supply line 75.

[0087] As a result, the substrate processing system 1 can reduce the number of components arranged on the supply line 75 from the filter 92 to the processing liquid supply section 40, and supply the wafer W with a high degree of cleanliness of IPA.

[0088] The supply line 75 and return line 76 can be provided in multiple ways corresponding to multiple processing liquid supply units 40 (an example of a supply unit). As a result, the substrate processing system 1 can remove foreign matter from the IPA by using the filter 92 provided on each supply line 75, and can remove foreign matter from the IPA as early as possible.

[0089] The substrate processing system 1 includes a heater 81 (an example of a temperature control unit). The heater 81 is disposed on the circulation line 74 and is used to regulate the temperature of the IPA (an example of a processing liquid).

[0090] Thus, the substrate processing system 1 can use the heater 81 to regulate the temperature of the IPA, thereby stabilizing the temperature of the IPA supplied to the wafer W through the filter 92 and from the processing liquid supply unit 40.

[0091] The substrate processing system 1 includes switching valves 93 and 100 (switching units) and a control device 4. Each switching valve 93 and 100 is used to switch the flow of IPA (an example of a processing liquid) to a position on the return line 76 or the supply line 75 closer to the processing liquid supply section 40 (an example of a supply section) than the connection portion 75a. The control device 4 can control each switching valve 93 and 100. In standby mode, when IPA is not supplied from the processing liquid supply section 40 to the wafer W (an example of a substrate), the control device 4 controls the switching valves 93 and 100 to allow IPA to flow into the return line 76. During supply of IPA from the processing liquid supply section 40 to the wafer W, the control device 4 controls the switching valves 93 and 100 to allow IPA to flow into the processing liquid supply section 40.

[0092] Therefore, the substrate processing system 1 can remove foreign matter from the IPA using the filter 92 during standby and supply, thereby improving the cleanliness of the IPA. The substrate processing system 1 can remove foreign matter from the IPA using the filter 92 during standby, thereby supplying a highly clean IPA to the wafer W during supply.

[0093] During initial operation, the control device 4 controls each switching valve 93, 100 (an example of a switching unit) to allow IPA (an example of a processing fluid) to flow into the return line 76, and increases the flow rate of IPA (an example of a processing fluid) into the return line 76 compared to standby.

[0094] Therefore, the substrate processing system 1 can remove foreign objects from the IPA as early as possible during the initial operation, which can shorten the initial operation time and start the processing of the chip W as early as possible.

[0095] During initial operation, the control device 4 controls the constant pressure valve 91 to increase the flow rate of IPA (an example of a processing fluid) flowing into the return line 76 compared to the standby state.

[0096] Therefore, the substrate processing system 1 can increase the flow rate of the IPA flowing into the filter 92 installed on the supply line 75 using a simple structure, thereby removing foreign matter from the IPA as early as possible. As a result, the substrate processing system 1 can shorten the initial operation time and start processing of the wafer W earlier.

[0097] The substrate processing system 1 includes a back pressure valve 85 (an example of a flow regulation unit). The back pressure valve 85 is installed on the circulation line 74 and is used to regulate the flow rate of IPA returning from the circulation line 74 to the tank 71 (an example of a storage tank). During initial operation, the control device 4 controls the back pressure valve 85 to reduce the flow rate of IPA returning from the circulation line 74 to the tank 71 compared to standby time, and to increase the flow rate of IPA flowing into the return line 76 compared to standby time.

[0098] Therefore, the substrate processing system 1 can increase the flow rate of the IPA flowing into the filter 92 installed on the supply line 75 using a simple structure, thereby removing foreign matter from the IPA as early as possible. As a result, the substrate processing system 1 can shorten the initial operation time and start processing of the wafer W earlier.

[0099] <Variation Example>

[0100] In the treatment fluid supply source 70, it can also be as follows: Figure 7 As shown, filter 92 is located upstream of constant pressure valve 91 in supply line 75. Figure 7 This diagram shows a schematic configuration of the processing fluid supply source 70 in a modified embodiment. By placing the filter 92 upstream of the constant pressure valve 91 in the supply line 75, the flow rate of IPA flowing from the constant pressure valve 91 to the processing fluid supply unit 40 can be stabilized. That is, the substrate processing system 1 can stabilize the flow rate of IPA discharged from the nozzle of the processing fluid supply unit 40 during supply.

[0101] Alternatively, filter 92 can be installed on return line 76. Filter 92 installed on return line 76 can be located upstream of switch valve 100 or downstream of switch valve 100.

[0102] Multiple filters 92 can be installed. For example, filters 92 can be installed on the supply line 75 and the return line 76. Alternatively, multiple filters 92 can be installed on the supply line 75. For example, filters 92 can be installed upstream of the connection 75a between the return line 75 and the supply line 75, and downstream of the on / off valve 93 on the supply line 75. Furthermore, multiple filters 92 can be installed on the supply line 75, and a filter 92 can also be installed on the return line 76.

[0103] At least one filter 92 for removing foreign matter from the IPA is disposed on at least one of the supply line 75 and the return line 76 at a position upstream of the connection 75a between the supply line 75 and the return line 76.

[0104] Therefore, the substrate processing system 1 can remove foreign matter from the IPA using the filter 92, thereby improving the cleanliness of the IPA. The substrate processing system 1 can remove foreign matter from the IPA during standby and can supply a highly clean IPA to the wafer W during supply. In addition, the substrate processing system 1 can remove foreign matter from the IPA as early as possible during initial operation, thereby shortening the initial operation time and starting the processing of the wafer W earlier.

[0105] Alternatively, during initial operation, the control device 4 may not heat the IPA (a processing liquid) with the heater 81 (an example of a temperature control unit) for a predetermined non-heating time. After the IPA flows into the return line 76, the control device 4 may begin heating the IPA with the heater 81. Specifically, during initial operation, the control device 4 may not heat the IPA with the heater 81, but instead allow the IPA to flow from the supply line 75 into the return line 76. As a result, the IPA passes through the filter 92 at a low temperature. Therefore, the substrate processing system 1 can improve the efficiency of the filter 92 in capturing foreign matter in the IPA, remove foreign matter from the IPA earlier, and shorten the initial operation time. The predetermined non-heating time is a pre-set time, representing the time during which foreign matter in the IPA is sufficiently removed. After the predetermined non-heating time has elapsed, the control device 4 heats the IPA with the heater 81, adjusting the IPA temperature to the predetermined temperature.

[0106] Alternatively, during initial operation, the control device 4 may prevent the IPA (an example of the processing liquid) from flowing into the supply line 75 and return line 76, and instead use the heater 81 (an example of a temperature regulating unit) to bring the temperature of the IPA flowing in the circulation line 74 to a predetermined heating temperature. After bringing the IPA to the predetermined heating temperature, the control device 4 allows the IPA to flow into the supply line 75 and return line 76. The predetermined heating temperature is a pre-set temperature. When the IPA flows into the supply line 75 and return line 76, the predetermined heating temperature can be set considering the temperature of the IPA reduced by heat absorption by the filter 92, etc. The predetermined heating temperature is higher than the predetermined temperature. As a result, the substrate processing system 1 can adjust the temperature of the IPA to the predetermined temperature as early as possible, and can supply the temperature-regulated IPA to the wafer W from the nozzle of the processing liquid supply unit 40 as early as possible.

[0107] Alternatively, a temperature sensor can be installed on the circulation line 74, downstream of the back pressure valve 85. Alternatively, during initial operation, the control device 4 can allow the processing fluid to flow into the supply line 75 and the return line 76 when the temperature difference between the IPA temperature detected by the temperature sensor 84 and the IPA temperature downstream of the back pressure valve 85 falls below a predetermined first temperature difference. The predetermined first temperature difference is a pre-set temperature difference. This predetermined first temperature difference is the temperature difference at which it can be determined that the temperature of the IPA flowing in the circulation line 74 has stabilized. Therefore, the substrate processing system 1 can remove foreign matter from the IPA after its temperature has stabilized, improving the cleanliness of the IPA.

[0108] Alternatively, after initial operation, the control device 4 may allow the IPA to flow into the processing liquid supply unit 40 based on the temperature difference between the temperature of the IPA flowing in the circulation line 74 and the temperature of the IPA flowing in the return line 76. Specifically, after allowing the IPA to flow into the supply line 75 and the return line 76, the control device 4 may discharge the IPA from the nozzle of the processing liquid supply unit 40 to the wafer W if the temperature difference is below a predetermined second temperature difference. The predetermined second temperature difference is, for example, a temperature difference that can be determined to indicate that the temperature of the IPA that has passed through the filter 92, etc., has stabilized. Thus, the substrate processing system 1 can remove foreign matter from the IPA and supply the wafer W with temperature-stabilized IPA.

[0109] Furthermore, temperature sensors 101 can be installed on each return line 76. This allows the substrate processing system 1 to accurately detect the temperature of the IPA in each return line 76, i.e., the temperature of the IPA in each processing unit 16. Based on the detected IPA temperature, the control device 4 regulates the flow rate of the IPA flowing into each supply line 75. The control device 4, for example, controls a back pressure valve 85 and a constant pressure valve 91 installed on each supply line 75 to regulate the flow rate of the IPA flowing into each supply line 75. Thus, the substrate processing system 1 can appropriately control the temperature and flow rate of the IPA flowing into each supply line 75.

[0110] The embodiments disclosed herein should be considered illustrative rather than limiting in all respects. In fact, the above embodiments can be implemented in various ways. Furthermore, the above embodiments can be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

Claims

1. A liquid treatment device, characterized in that, include: Storage tanks for storing processed liquids; A circulation pipeline for returning the processed liquid delivered from the storage tank to the storage tank; A supply line for connecting the circulation line and the supply unit for supplying the processing liquid to the substrate; A return line connected to the supply line is used to return the processed liquid from the supply line to the storage tank; At least one filter is disposed on the supply line upstream of the connection between the return line and the supply line, for removing foreign matter from the treatment fluid; A first temperature sensor is installed on the circulation pipeline, which is capable of detecting the first temperature of the treatment liquid flowing in the circulation pipeline. A second temperature sensor is installed on the return pipeline, which is capable of detecting the second temperature of the processing liquid flowing in the return pipeline; A switching unit is used to switch the flow of the processing liquid to the return pipeline or the supply pipeline at a position closer to the supply unit than the connection part. and A control device that controls the switching unit to allow the processing liquid to flow into the supply unit based on the temperature difference between the first temperature and the second temperature.

2. The liquid treatment apparatus according to claim 1, characterized in that: This includes a constant pressure valve installed on the supply pipeline. The filter is located downstream of the constant pressure valve on the supply line.

3. The liquid treatment apparatus according to claim 1, characterized in that: This includes a constant pressure valve installed on the supply pipeline. The filter is located upstream of the constant pressure valve on the supply line.

4. The liquid treatment apparatus according to any one of claims 1 to 3, characterized in that: Multiple supply lines and multiple return lines are provided corresponding to multiple supply departments.

5. The liquid treatment apparatus according to any one of claims 1 to 3, characterized in that: It includes a temperature regulating unit installed on the circulation pipeline for regulating the temperature of the treatment liquid.

6. The liquid treatment apparatus according to any one of claims 1 to 3, characterized in that: When the processing fluid is not supplied from the supply unit to the substrate during standby, the control device controls the switching unit to allow the processing fluid to flow into the return line. When the processing fluid is supplied from the supply unit to the substrate, the control device controls the switching unit to allow the processing fluid to flow into the supply unit.

7. The liquid treatment apparatus according to claim 6, characterized in that: During initial operation, the control device controls the switching unit to allow the processing fluid to flow into the return line, and increases the flow rate of the processing fluid flowing into the return line compared to the standby state.

8. The liquid treatment apparatus according to claim 7, characterized in that: This includes a constant pressure valve installed on the supply pipeline. During the initial operation, the control device controls the constant pressure valve to increase the flow rate of the processed fluid flowing into the return pipeline compared to the standby state.

9. The liquid treatment apparatus according to claim 7 or 8, characterized in that: Includes a flow regulating unit installed on the circulation pipeline for regulating the flow rate of the processed liquid returning from the circulation pipeline to the storage tank. During the initial operation, the control device controls the flow regulating unit to reduce the flow rate of the processed liquid returning from the circulation pipeline to the storage tank compared to the standby state, and to increase the flow rate of the processed liquid flowing into the return pipeline compared to the standby state.

10. The liquid treatment apparatus according to claim 6, characterized in that: This includes a temperature regulating unit installed on the circulation pipeline for regulating the temperature of the treatment liquid. When the control device is initially activated, it does not heat the processing liquid with the temperature regulating unit during a specified non-heating time. After the processing liquid flows into the return pipeline, it begins to heat the processing liquid with the temperature regulating unit.

11. The liquid treatment apparatus according to claim 6, characterized in that: This includes a temperature regulating unit installed on the circulation pipeline for regulating the temperature of the treatment liquid. During initial operation, the control device prevents the processing liquid from flowing into the supply line and the return line. After the temperature regulating unit brings the temperature of the processing liquid flowing in the circulation line to a predetermined heating temperature, the processing liquid is then allowed to flow into the supply line and the return line.

12. A liquid treatment method, characterized in that, include: The circulation step involves circulating the treatment liquid stored in the storage tank through circulation pipelines. In the supply step, the processing liquid is supplied from the supply section to the substrate via a supply line connected to the circulation line; In the return step, the processed liquid is returned from the supply line to the storage tank via a return line connected to the supply line. In the removal step, foreign matter in the treatment fluid is removed by at least one filter, the filter being located upstream of the supply line from the connection point between the return line and the supply line. The switching step involves the switching unit switching the flow of the processing liquid to the return pipeline or the supply pipeline at a position closer to the supply unit than the connection point. and The control step involves controlling the switching unit to allow the processing liquid to flow into the supply unit based on the temperature difference between a first temperature of the processing liquid detected by a first temperature sensor installed on the circulation pipeline and a second temperature of the processing liquid detected by a second temperature sensor installed on the return pipeline.

Images