An automatic positioning and assembling device for ceramic package shell

Abstract

This invention relates to the field of electronic component processing technology, specifically to an automatic positioning and assembly device for ceramic packaging shells. The device includes a base plate, a central block located at the center of the base plate, and side blocks distributed around the central block. The central block is used to fit the bottom shell of the ceramic packaging shell. The side blocks are slidably distributed around the central block. Each side block has a slot on its top facing the central block for positioning the pins of the ceramic packaging shell. Support mechanisms are installed on the side walls of the central block for positioning the bottom shell. An adjustment mechanism for synchronously adjusting the sliding of the side blocks is provided on the lower end face of the base plate. By setting support mechanisms on the central base, the inner and outer walls of the ceramic packaging shell can be switched for support. This allows the ceramic packaging shell to be supported and fixed by the inner support plate of the support mechanism during mounting, and during sintering, the outer support plate can be switched to provide limiting support for the exterior of the ceramic packaging shell.

Description

Technical Field

[0001] This invention relates to the field of electronic component processing technology, specifically to an automatic positioning and assembly device for ceramic packaging shells. Background Technology

[0002] The packaging shell of a semiconductor chip is a major component of the integrated circuit. It not only provides mechanical protection for the chip and facilitates the external connection of the chip electrodes, but also plays a fundamental role in ensuring the correct implementation of various functional parameters of the chip, the environmental conditions required for circuit use, and the manifestation of circuit characteristics.

[0003] Semiconductor chip packaging includes metal packaging, plastic packaging, and ceramic packaging. Ceramic packaging is extremely stable in terms of thermal, electrical, and mechanical properties, providing high hermeticity protection for the chip and giving it high operational reliability. Therefore, ceramic packaging is widely used in the field of semiconductor chip packaging.

[0004] The encapsulation shell sintering mainly involves sealing the metal ring frame, lead wire, and glass insulator. First, the glass insulator is fitted onto the outside of the lead wire. Then, the glass insulator is fitted into the first mounting hole on the surface of the metal ring frame to form a semi-finished product. The semi-finished product is then placed horizontally into a sintering mold, and the sintering mold is sent into a sintering furnace for sintering at high temperature. The sintering mold is generally made of graphite, which does not wet the glass insulator or adhere to the metal ring frame, making it a relatively ideal glass-metal sealing mold.

[0005] Patent application number CN201610969273.6 discloses a method for sintering microwave metal packaging shells using a graphite mold, relating to the field of metal packaging shells. The graphite mold is an integral structure with positioning grooves and recesses for positioning leads. Using this integral graphite mold to pre-position the chassis and leads ensures the dimensional accuracy of the leads after sintering the microwave metal packaging shell, while also improving the production efficiency of microwave metal packaging shell sintering.

[0006] However, existing graphite sintering molds have a simple structure and limited functions, which cannot meet the processing requirements of existing ceramic packaging shells. Summary of the Invention

[0007] To address the above problems, this invention provides an automatic positioning and assembly device for ceramic packaging shells. By setting a support mechanism on the central seat, the support mechanism can switch between supporting the inner and outer walls of the ceramic packaging shell. When the ceramic packaging shell is fixed, it can be supported and fixed by the inner support plate of the support mechanism. During sintering, it can be switched to the outer support plate to limit and support the exterior of the ceramic packaging shell, thus preventing the bottom shell from deforming due to excessive thermal expansion.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] An automatic positioning and assembly device for ceramic encapsulation shells includes a base plate, a central block located at the center of the base plate, and side blocks distributed around the central block. The central block is used to fit the bottom shell of the ceramic encapsulation shell. The side blocks are slidably distributed around the central block. Each side block has a slot for positioning the pins of the ceramic encapsulation shell opposite the top of the central block. Support mechanisms are installed on the side walls of the central block for positioning the bottom shell. An adjustment mechanism for driving the side blocks to slide synchronously is provided on the lower end face of the base plate.

[0010] As an improvement, the support mechanism includes:

[0011] A support assembly, which is installed in a groove on the side wall of the central block, is used to provide limiting support for the inner or outer wall of the bottom shell; and

[0012] A switching component is mounted on the base plate and is used to switch the support state of the support component on the bottom shell.

[0013] As an improvement, the support component includes:

[0014] An inner support plate, vertically installed inside the groove, has positioning slots on its top that correspond one-to-one with the slots; and

[0015] An outer support plate is vertically installed outside the groove. The outer support plate is hinged to the inner support plate at both ends of the lever, and the lever is rotatably mounted on the center block.

[0016] As an improvement, when the inner support plate swings upward, it limits and supports the inner sidewall of the bottom shell; when the outer support plate swings upward, it limits and supports the outer wall of the bottom shell.

[0017] As an improvement, when the outer support plate limits and supports the outer wall of the bottom shell, the distance from the outer support plate to the corresponding outer wall of the bottom shell is 0.4 mm.

[0018] As an improvement, the switching component includes:

[0019] A top rod, which is installed below the corresponding outer support plate and slides through the base plate; and

[0020] The ejector pin is mounted on the base plate and is located at the four corners of the center block, and is arranged in an L-shape.

[0021] As an improvement, the bottoms of the grooves are interconnected, the side blocks are provided with guide grooves, and the lower part of the inner support plate is provided with several guide holes.

[0022] As an improvement, the adjustment mechanism includes:

[0023] A turntable, which is rotatably mounted on the lower end surface of the base plate;

[0024] A guide block, which penetrates the base plate and is integrally connected to the corresponding side block, is disposed in a guide groove on the base plate;

[0025] A connecting rod, the two ends of which are respectively hinged to the turntable and the guide block; and

[0026] A locking nut is installed on the corresponding side block through the base plate, and the locking nut is used to lock the side block to the base plate.

[0027] As an improvement, the top of the side block is provided with a positioning pin that corresponds to the hexagonal groove on the locking nut.

[0028] As an improvement, the lower end face of the base plate is fitted with support legs for support.

[0029] The beneficial effects of this invention are as follows:

[0030] (1) The present invention provides a support mechanism on the center seat, and uses the support mechanism to switch the support between the inner wall and the outer wall of the ceramic packaging shell. When the ceramic packaging shell is fixed, it can be supported and fixed by the inner support plate of the support mechanism. During sintering, it can be switched to the outer support plate to limit the external support of the ceramic packaging shell, so as to avoid the bottom shell from being deformed due to excessive thermal expansion.

[0031] (2) By switching between the inner support plate and the outer support plate, the sintering part of the pin and the bottom shell is released without obstruction, allowing the hot air in the sintering furnace to flow smoothly in this part, so that the sintering of the pin and the bottom shell is more complete and the sintering quality is improved.

[0032] (3) The present invention utilizes an adjustment mechanism to allow the distance between the side block and the center block to be adjusted, and the entire device can be adjusted according to the length of the pins. It is suitable for positioning and assembling various specifications of packaged shells, has good applicability, and a wider range of applications.

[0033] (4) The present invention utilizes the engagement of the hexagonal grooves on the positioning pins and the locking screws to achieve stacking and engagement between multiple sets of positioning assembly devices. At the same time, the positioning assembly device of the next set can switch the inner support plate and outer support plate of the positioning device of the previous set without the need for additional drive devices.

[0034] In summary, this invention has advantages such as better positioning of electronic components, faster assembly steps, and better sintering effect, and is especially suitable for the field of electronic component sintering processing technology. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0036] Figure 2 This is a schematic diagram of the three-dimensional structure of the ceramic encapsulation shell of the present invention;

[0037] Figure 3 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0038] Figure 4 This is a schematic diagram of the bottom three-dimensional structure of the present invention;

[0039] Figure 5 This is a three-dimensional structural diagram of the support mechanism of the present invention;

[0040] Figure 6 This is a schematic diagram of the three-dimensional structure of the support component of the present invention;

[0041] Figure 7 This is a schematic diagram of the three-dimensional structure of the central block of the present invention;

[0042] Figure 8 This is a schematic diagram of the three-dimensional structure of the inner support plate of the present invention;

[0043] Figure 9 This is a schematic diagram of the three-dimensional structure of the edge block of the present invention;

[0044] Figure 10 This is a schematic diagram of the support mechanism of the present invention in use. Figure 1 ;

[0045] Figure 11 This is a schematic diagram of the support mechanism of the present invention in use. Figure 2 ;

[0046] Figure 12 This is a schematic diagram of the switching state of the support mechanism of the present invention. Detailed Implementation

[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0050] Example:

[0051] like Figures 1 to 12 As shown, an automatic positioning and assembly device for ceramic encapsulation shells includes a base plate 1, a central block 2 located at the center of the base plate 1, and side blocks 3 distributed around the central block 2. The central block 2 is used to fit the bottom shell 100 of the ceramic encapsulation shell. The side blocks 3 are slidably distributed around the central block 2. The side blocks 3 have slots 31 for positioning the pins 101 of the ceramic encapsulation shell, which are opened on the top of the central block 2. Support mechanisms 4 are installed on the side walls of the central block 2. The support mechanisms 4 are used to position the bottom shell 100. The lower end face of the base plate 1 is provided with an adjustment mechanism 5 for driving the side blocks 3 to slide synchronously.

[0052] The support mechanism 4 includes:

[0053] Support component 41, which is installed in a groove 21 on the side wall of the central block 2, is used to provide limiting support for the inner or outer wall of the bottom shell 100; and

[0054] Switching component 42 is installed on the base plate 1 and is used to switch the support state of the support component 41 on the bottom shell 100.

[0055] Furthermore, the support component 41 includes:

[0056] An inner support plate 411 is vertically installed inside the groove 21, and its top is equipped with positioning grooves 412 that correspond one-to-one with the slots 31; and

[0057] An outer support plate 413 is vertically installed outside the groove 21. The outer support plate 413 and the inner support plate 411 are hinged to the two ends of the lever 414, which is rotatably installed on the center block 2.

[0058] Furthermore, when the inner support plate 411 swings upward, it limits and supports the inner sidewall of the bottom shell 100; when the outer support plate 413 swings upward, it limits and supports the outer wall of the bottom shell 100.

[0059] Furthermore, when the outer support plate 413 limits and supports the outer wall of the bottom shell 100, the distance from the outer support plate 413 to the corresponding outer wall of the bottom shell 100 is 0.4 mm.

[0060] It should be noted that when the ceramic encapsulation shell is installed on the automatic positioning and assembly device for the ceramic encapsulation shell, the inner support plate 411 and the center block 2 are assembled to support and limit the inner side wall of the bottom shell 100, so that the bottom shell 100 is just fitted on the center block 2, and the two ends of the pin 101 are just engaged in the slot 31 and the positioning slot 412 respectively, thereby realizing the positioning and installation of the ceramic encapsulation shell.

[0061] To further explain, during sintering, the inner support plate 411 descends while the outer support plate 413 swings and rises, providing limiting support for the outer wall of the bottom shell 100. It should be emphasized that the outer support plate 413 does not contact the outer wall of the bottom shell 100, but is at a distance of 0.4 mm. This allows the bottom shell 100 to contact the outer support plate 413 after it expands due to heat during sintering. The outer support plate 413 then limits the expansion of the bottom shell, preventing it from shifting.

[0062] In a preferred embodiment, the switching component 42 includes:

[0063] A top rod 421 is installed below the corresponding outer support plate 413, and the top rod 421 slides through the base plate 1; and

[0064] Ejector pin 422 is mounted on the base plate 1. The ejector pin 422 is distributed at the four corners of the center block 2 and is arranged in an L-shape.

[0065] Furthermore, the bottoms of the grooves 21 are interconnected, the side block 3 is provided with a flow guide groove 30, and the lower part of the inner support plate 411 is provided with a plurality of flow guide holes 415.

[0066] It should be noted that after the ceramic encapsulation shell is installed, the automatic positioning and assembly devices of the ceramic encapsulation shell are stacked together. The ejector pins 422 on the lower set of automatic positioning and assembly devices of the ceramic encapsulation shell lift the ejector rods 421 of the upper set of automatic positioning and assembly devices of the ceramic encapsulation shell, so that the inner support plate 411 and the outer support plate 413 of the upper set are switched. Since it is already placed in the sintering furnace, the support limit of the inner support plate 411 is released, and the bottom shell 100 will not move or deviate. It should be specifically noted that during stacking, the bottom set of automatic positioning and assembly devices of the ceramic encapsulation shell can be unloaded, or another base plate can be set with ejector pins 422 to switch the bottom set of automatic positioning and assembly devices of the ceramic encapsulation shell.

[0067] To further explain, during the sintering process, the heat in the sintering furnace enters the groove 21 through the guide channel 30 and the guide hole 415. Since the inner support plate 411 has been removed at this time, there is no obstruction at the mounting part of the pin 101 and the bottom shell 100. The heat directly heats the mounting part of the pin 101 and the bottom shell 100, effectively improving the sintering quality of the sintering part. In addition, the grooves 21 are interconnected, which can ensure the heat balance inside the grooves 21.

[0068] In a preferred embodiment, the adjustment mechanism 5 includes:

[0069] Turntable 51, which is rotatably mounted on the lower end surface of the base plate 1;

[0070] Guide block 52, the guide block 52 penetrates the base plate 1 and is integrally connected with the corresponding side block 3, the guide block 52 is disposed in the guide groove 11 on the base plate 1;

[0071] Linkage 53, with its two ends hinged to the turntable 51 and the guide block 52 respectively; and

[0072] A locking nut 54 is installed on the corresponding side block 3 through the base plate 1. The locking nut 54 is used to lock the side block 3 onto the base plate 1.

[0073] It should be noted that ceramic package shells of different specifications may have the same bottom shell but different pin lengths. The adjustment mechanism 5 can be used to adjust the side block 3 to make it suitable for processing ceramic package shells with different pin lengths.

[0074] Furthermore, all edge blocks 3 can be adjusted synchronously through the adjustment mechanism 5.

[0075] In a preferred embodiment, the top of the side block 3 is provided with a positioning pin 32 that corresponds to the hexagonal groove 541 on the locking nut 54.

[0076] Furthermore, the lower end face of the base plate 1 is equipped with a support leg 12 for support.

[0077] It should be noted that during the automatic positioning and assembly of stacked ceramic packaging shells, the positioning of the automatic positioning and assembly of ceramic packaging shells is achieved by the engagement of the positioning pins 32 of the two sets of automatic positioning and assembly devices with the hexagonal grooves 541 on the locking nut 54.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic positioning and assembling apparatus for ceramic package shells, characterized by comprising: The device includes a base plate (1), a central block (2) located at the center of the base plate (1), and side blocks (3) distributed around the central block (2). The central block (2) is used to fit the bottom shell (100) of the ceramic encapsulation shell. The side blocks (3) are slidably distributed around the central block (2). The side blocks (3) have a slot (31) for positioning the ceramic encapsulation shell pins (101) on the top of the central block (2). Support mechanisms (4) are installed on the side walls of the central block (2). The support mechanisms (4) are used to position the bottom shell (100). The lower end face of the base plate (1) is provided with an adjustment mechanism (5) for driving the side blocks (3) to slide synchronously. The support mechanism (4) includes a support component (41), which is installed in a groove (21) on the side wall of the central block (2). The support component (41) is used to provide limiting support for the inner or outer wall of the bottom shell (100); and A switching component (42) is mounted on the base plate (1) and is used to switch the support state of the support component (41) on the bottom shell (100). The support assembly (41) includes an inner support plate (411), which is vertically installed inside the groove (21). The top of the inner support plate (411) is provided with positioning grooves (412) corresponding to the slots (31). An outer support plate (413) is vertically installed outside the groove (21). The outer support plate (413) is hinged to the inner support plate (411) at both ends of a lever (414). The lever (414) is rotatably installed on the center block (2). When the inner support plate (411) swings upward, it limits and supports the inner wall of the bottom shell (100). When the outer support plate (413) swings upward, it limits and supports the outer wall of the bottom shell (100).

2. The apparatus according to claim 1, wherein When the outer support plate (413) limits and supports the outer wall of the bottom shell (100), the distance from the outer support plate (413) to the corresponding outer wall of the bottom shell (100) is 0.4 mm.

3. The apparatus of claim 1, wherein The switching component (42) includes: A top rod (421) is installed below the corresponding outer support plate (413) and slides through the base plate (1); and Ejector pin (422), the ejector pin (422) is installed on the base plate (1), the ejector pin (422) is distributed at the four corners of the center block (2), and the ejector pin (422) is arranged in an L shape.

4. The apparatus of claim 1, wherein The bottoms of the grooves (21) are interconnected, the side block (3) is provided with a guide groove (30), and the lower part of the inner support plate (411) is provided with a plurality of guide holes (415).

5. The apparatus of claim 1, wherein The adjustment mechanism (5) includes: Turntable (51), which is rotatably mounted on the lower end surface of the base plate (1); Guide block (52), the guide block (52) penetrates the base plate (1) and is integrally connected with the corresponding side block (3), the guide block (52) is disposed in the guide groove (11) on the base plate (1); Linkage (53), the two ends of which are respectively hinged to the turntable (51) and the guide block (52); and A locking nut (54) is installed on the corresponding side block (3) through the base plate (1). The locking nut (54) is used to lock the side block (3) onto the base plate (1).

6. The apparatus of claim 5, wherein the ceramic package housing is a ceramic package housing for a light emitting diode (LED) chip. The top of the side block (3) is provided with a positioning pin (32) that corresponds to the hexagonal groove (541) on the locking nut (54).

7. The apparatus of claim 1, wherein The lower end face of the base plate (1) is equipped with a support leg (12) for support.

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