Inspection apparatus and substrate transport method

Abstract

Provided is an inspection device and a substrate transport method that can increase the throughput of an inspection device that inspects a substrate. The inspection device includes: first and second placement sections that each place a container that houses a substrate; first and second inspection sections that each have a photographing unit that photographs a substrate; a first transport region that has a first transport mechanism that performs a first transport operation that transports a substrate between a container that is placed on the first placement section and the first inspection section; and a second transport region that has a second transport mechanism that performs a second transport operation that transports a substrate between a container that is placed on the second placement section and the second inspection section, the first and second placement sections are disposed at positions that do not overlap each other in plan view, the first and second inspection sections are disposed at positions that do not overlap each other in plan view, and the first and second transport regions are disposed at positions that are different from each other in plan view so that the first and second transport operations can be performed in parallel.

Description

Technical Field

[0001] This invention relates to an inspection apparatus and a substrate transport method. Background Technology

[0002] Patent Document 1 discloses a method for inspecting a substrate in a substrate processing system. This substrate processing system includes multiple processing devices that perform predetermined processing on the substrate. In this inspection method, a first substrate image is obtained by photographing the surface of the substrate before processing by the processing devices. Predetermined feature quantities are extracted from the first substrate image. A storage unit stores multiple storage schemes corresponding to feature quantities of different ranges. An inspection scheme corresponding to the feature quantities extracted from the first substrate image is selected. Then, in this inspection method, a second substrate image is obtained by photographing the surface of the substrate after processing by the processing devices. Based on the selected inspection scheme and the second substrate image, it is determined whether the substrate has defects.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-212008 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] The technology of this invention improves the throughput of inspection apparatus for inspecting substrates.

[0008] Technical solutions for solving technical problems

[0009] One aspect of the present invention is an inspection apparatus for inspecting a substrate, comprising: a first placement portion and a second placement portion, which respectively place a storage container for storing a substrate; a first inspection portion and a second inspection portion, which each have an imaging unit for imaging the substrate for inspecting the substrate; a first transport area provided with a first transport mechanism, wherein the first transport mechanism performs a first transport operation to transport the substrate between the storage container placed on the first placement portion and the first inspection portion; and a second transport area provided with a second transport mechanism, wherein the second transport mechanism performs a second transport operation to transport the substrate between the storage container placed on the second placement portion and the second inspection portion, wherein the first placement portion and the second placement portion are positioned in a position that does not overlap with each other when viewed from above, the first inspection portion and the second inspection portion are positioned in a position that does not overlap with each other when viewed from above, and the first transport area and the second transport area are positioned in different positions when viewed from above, so that the first transport operation and the second transport operation can be performed in parallel.

[0010] Invention Effects

[0011] According to the present invention, the throughput of an inspection apparatus for inspecting substrates can be increased. Attached Figure Description

[0012] Figure 1 This is a top view showing an outline of the structure of the inspection device according to this embodiment.

[0013] Figure 2 This is a side view showing an outline of the structure of the inspection warehouse in this embodiment.

[0014] Figure 3 This is a rear view showing an outline of the structure of the inspection device according to this embodiment.

[0015] Figure 4 This is a cross-sectional view showing the general structure of the first inspection section.

[0016] Figure 5 This is a longitudinal cross-sectional view showing the general structure of the first inspection section.

[0017] Explanation of reference numerals in the attached figures

[0018] 131 boxes of mounting plates

[0019] 132 boxes of mounting plates

[0020] 133 boxes of mounting plates

[0021] 134 boxes of mounting plates

[0022] 201 First Inspection Department

[0023] 202 Second Inspection Department

[0024] 110 camera unit

[0025] Box C

[0026] R1 First Transportation Area

[0027] R2 Second Transport Area

[0028] W chip. Detailed Implementation

[0029] In the manufacturing process of semiconductor devices, for example, a resist coating process is performed sequentially, in which a resist solution is applied to a semiconductor wafer (hereinafter referred to as "wafer") to form a resist film; an exposure process is performed, in which the resist film is exposed; and a development process is performed, in which the exposed resist film is developed, thereby forming a resist pattern on the wafer. The aforementioned resist coating process and development process are performed in a coating and development system having a processing apparatus for performing the aforementioned processes and a transport mechanism for transporting the wafer.

[0030] Furthermore, when forming the resist pattern as described above, the wafer is sometimes inspected after or before various processing steps. This inspection includes, for example, checking whether the resist pattern has been properly formed and whether any foreign matter is attached to the wafer. Such inspection can be performed, for example, using an image taken of the surface of the wafer being inspected.

[0031] Traditionally, coating and developing systems have included an inspection unit with an imaging unit for taking images for inspection (see Patent Document 1). However, in recent years, there has been a consideration of mounting this inspection unit in a separate device that performs inspection essentially without resist coating or developing processes, thus creating a standalone inspection device. However, the standalone inspection device currently being considered has room for improvement in terms of throughput.

[0032] Therefore, the technology of the present invention improves the throughput in the inspection apparatus for inspecting substrates.

[0033] Hereinafter, the inspection apparatus and substrate transport method of this embodiment will be described with reference to the accompanying drawings. Furthermore, in this specification and the accompanying drawings, elements having substantially the same functional structure are labeled with the same reference numerals, thus omitting repeated descriptions.

[0034] Figures 1-3 These are top, side, and rear views, respectively, showing an outline of the structure of the inspection device 1 of this embodiment.

[0035] Inspection device 1 is a device for inspecting the wafer W, which serves as a substrate. For example... Figure 1 As shown, the inspection device 1 includes: a box block 2 for feeding and feeding the box C; and an inspection block 3 equipped with an inspection unit, wherein the inspection unit has an imaging unit for taking pictures for inspection. Furthermore, the inspection device 1 includes a control unit 4 for controlling the inspection device 1.

[0036] The cassette section 2 is divided into two parts, for example, a cassette loading / unloading section 10 and a wafer transport section 11. For example, the cassette loading / unloading section 10 is located at the front side of the inspection apparatus 1 in the device depth direction. Figure 1 (Y-direction negative direction side).

[0037] A box loading platform 12 is provided in the box feeding / discharging section 10. On one side of the box loading platform 12 in the device width direction (the positive side in the X direction), for example, a box loading plate 131, 132 serving as a first loading section is provided; on the other side in the device width direction (… Figure 1 On the negative X-direction side), box mounting plates 133 and 134 are provided as second mounting parts. Box mounting plates 131, 132, 133, and 134 are positioned so as not to overlap when viewed from above. Specifically, in the same plane, from one side of the mounting width direction (… Figure 1 The X-direction positive side) are arranged side by side at equal intervals in the width direction of the device. In addition, in the following text, the box mounting plates 131, 132, 133 and 134 are sometimes referred to as box mounting plate 13.

[0038] The cassette mounting plate 13 can hold a cassette C, which serves as a storage container. Cassette C is a transportable container capable of holding multiple wafers and transportable by a cassette transport device (not shown) such as an OHT (Overhead Hoist Transfer) located outside the inspection device 1. Cassette C has multiple slits (not shown) for holding wafers W.

[0039] The wafer transport section 11 is provided with a wafer transport mechanism 141 as a first transport mechanism and a wafer transport mechanism 142 as a second transport mechanism. In the inspection apparatus 1, the transport of wafer W by wafer transport mechanism 141 and the transport of wafer W by wafer transport mechanism 142 can be performed in parallel. Hereinafter, wafer transport mechanisms 141 and 142 will be collectively referred to as wafer transport mechanism 14. Details about the wafer transport section 11 will be explained later.

[0040] Check that block 3 is inside block 2 () Figure 1 The inspection section 3 is arranged adjacent to the cassette block 2 (on the positive side of the Y direction), specifically, adjacent to the wafer transport section 11 of the cassette block 2. The inspection section 3 is provided with a first inspection section 201 and a second inspection section 202, each having an imaging unit for photographing the wafer W for inspection. The first inspection section 201 and the second inspection section 202 are positioned so as not to overlap when viewed from above; specifically, in the same plane, in the device width direction (… Figure 1 They are set side by side in the X direction.

[0041] The first inspection unit 201 is used to inspect the wafers W housed in the cassettes C on the cassette mounts 131 and 132, and is located opposite to the cassette mounts 131 and 132. The second inspection unit 202 is used to inspect the wafers W housed in the cassettes C on the cassette mounts 133 and 134, and is located opposite to the cassette mounts 133 and 134. Furthermore, in the following text, the first inspection unit 201 and the second inspection unit 202 will be collectively referred to as inspection unit 20.

[0042] The area occupied by the inspection section 20 is rectangular when viewed from above. The inspection section 20 is configured such that the long axis of the area occupied by the inspection section 20 is perpendicular to the width of the device. Figure 1 Parallel to the X direction. In addition, the inspection section 20 is positioned at approximately the same height as the box C placed on the box mounting plate 13.

[0043] Additionally, in the width direction of the device ( Figure 1 In the X direction, a space is provided between the first inspection section 201 and the second inspection section 202 that allows the operator to enter.

[0044] In addition, such as Figure 2 and Figure 3 As shown, a buffer section 21 is provided in the inspection block 3. The buffer section 21 can temporarily hold the wafer W delivered from the cassette C on the cassette mounting plate 13 until it returns to the cassette C via the inspection section 20. The number of buffer sections 21 is, for example, the same as the number of cassette mounting plates 13. In addition, the buffer sections 21 are, for example, above the inspection section 20, in the device width direction ( Figure 3 They are set side by side in the X direction.

[0045] The control unit 4 is, for example, a computer with a CPU, memory, etc., and has a program storage unit (not shown). The program storage unit stores programs that control the operation of the drive system of the aforementioned wafer transport mechanism 14, and programs that control the inspection processing of the wafer W performed by the inspection device 1. Furthermore, the aforementioned programs can also be stored on a computer-readable storage medium and installed from that storage medium onto the control unit 4. Part or all of the program can be implemented using dedicated hardware (circuit board).

[0046] Next, the chip delivery unit 11 will be explained.

[0047] like Figure 1 As shown, the wafer transport unit 11 includes a first transport area R1 provided with a wafer transport mechanism 141 and a second transport area R2 provided with a wafer transport mechanism 142. The wafer transport mechanism 141 in the first transport area R1 performs a first transport operation, transporting the wafer W between the cassette C placed on cassette mounts 131 and 132 and the first inspection unit 201. The wafer transport mechanism 142 in the second transport area R2 performs a second transport operation, transporting the wafer W between the cassette C placed on cassette mounts 133 and 134 and the second inspection unit 202.

[0048] The wafer transport mechanism 14 includes, for example, a guide frame 14a, a track component 14b, a moving body 14c, a rotating body 14d, and a transport arm 14e serving as a substrate holding part. The guide frame 14a guides the track component 14b in the vertical direction. The track component 14b is arranged along the width direction of the device ( Figure 1 The moving body 14c extends along the X direction and rises and falls along the guide frame 11a. The moving body 14c extends along the track component 14b, i.e., along the width direction of the device. Figure 1 The rotating body 14d rotates on the moving body 14c. The transport arm 14e is a component that holds the wafer W and is mounted on the rotating body 14d via a retractable component (not shown). According to the structure described above, the transport arm 14e can move in the width direction (X direction). Figure 1(X direction) and depth direction ( Figure 1 It moves in the Y direction, θ direction and vertical direction.

[0049] The first transport region R1 and the second transport region R2 are positioned differently from each other when viewed from above, so that the first transport action performed by the wafer transport mechanism 141 and the second transport action performed by the wafer transport mechanism 142 can be performed in parallel. The position where the first and second transport actions can be performed in parallel, and which is different from each other when viewed from above, is a position where the first transport region R1 and the second transport region R2 do not completely overlap when viewed from above. Furthermore, the aforementioned position where the first and second transport actions can be performed in parallel, and which is different from each other when viewed from above, can also be the following position: For example, it can be a position where the first transport region R1 and the second transport region R2 partially overlap when viewed from above, to the extent that interference between the transport arms 14e can be avoided by adjusting the movement of the transport arms 14e in the first or second transport action. In this embodiment, as described above, the first transport region R1 and the second transport region R2 are positioned where they partially overlap when viewed from above. Furthermore, the first transport area R1 includes: the area where the non-movable parts such as the guide frame 14a of the wafer transport mechanism 141 are located; and the area through which the movable parts such as the transport arm 14e of the wafer transport mechanism 141 and the wafer W held by the transport arm 14e of the wafer transport mechanism 141 can pass. Additionally, the second transport area R2 includes: the area where the non-movable parts of the wafer transport mechanism 142 are located; and the area through which the movable parts of the wafer transport mechanism 142 and the transport arm 14e of the wafer transport mechanism 142 can pass.

[0050] The first transport area R1 and the second transport area R2 are arranged side-by-side in the device width direction (X direction in the figure) between the box mounting plates 131, 132, 133, 134 and the first inspection section 201 and the second inspection section 202. The first transport area R1 is located between the box mounting plates 131, 132 and the first inspection section 201, and the second transport area R2 is located between the box mounting plates 133, 134 and the second inspection section 202. Moreover, in this embodiment, when viewed from above, a portion of the other side of the device width direction of the first transport area R1 (the negative side of the X direction in the figure) overlaps with a portion of the other side of the device width direction of the second transport area R2 (the positive side of the X direction in the figure).

[0051] Furthermore, the first transport area R1 and the second transport area R2 are rectangular when viewed from above, with their major axis aligning with the width direction of the device. Figure 1 (parallel in the X direction).

[0052] Furthermore, the inspection device 1 configured as described above is, in other words, a device that arranges the combination of the cassette mounting plate 13, the wafer transport mechanism 14, and the inspection unit 20 in a horizontal direction.

[0053] Next, the structure of the first inspection unit 201 will be described. Figure 4 and Figure 5 These are cross-sectional and longitudinal cross-sectional views, respectively, showing the general structure of the first inspection unit 201. The first inspection unit 201 is as follows... Figure 4 The diagram shows a housing 100. On the front side of the housing 100 ( Figure 4 The width direction of the device on the other side of the sidewall in the negative Y direction (the other side) Figure 4 On the negative X-direction side, an infeed / outfeed port 100a is formed for feeding and unloading wafers W into and out of the housing 100. The infeed / outfeed port 100a is located at a position farther from the second transport area R2 than the cassette mounting plate 132. Therefore, when transporting wafers W between the cassette C on the cassette mounting plate 132 and the first inspection section 201, it is not necessary to move the transport arm 14e towards the second transport area R2, and it is intentionally possible to prevent the transport arm 14e from interfering with each other between the first inspection section 201 and the second inspection section 202.

[0054] Additionally, within the housing 100, such as Figure 5 The diagram shows a wafer chuck 101 for holding the wafer W. On the bottom surface of the housing 100, a flange extending from one end inside the housing 100 is provided. Figure 4 The X-direction negative direction side extends to the other end side ( Figure 4 The guide rail 102 (on the positive X-direction side) is provided on the guide rail 102. A drive unit 103 is provided on the guide rail 102, which enables the wafer chuck 101 to rotate and move along the guide rail 102. The drive unit 103 is equivalent to the "rotation mechanism" of the present invention. With this structure, the wafer W held by the wafer chuck 101 can move.

[0055] In addition, a shooting unit 110 is provided inside the housing 100.

[0056] The imaging unit 110 includes a camera 111 and an illumination module 112. The camera 111 is located on the other end side of the housing 100. Figure 4Above the X-direction positive side of the housing 110, there are imaging elements (not shown) such as a lens (not shown) and a CMOS image sensor. The illumination module 112 is located in the upper center of the housing 100, and includes a semi-transparent mirror 113 and a light source 114. The semi-transparent mirror 113 is positioned opposite the camera 111, tilted upwards at a 45-degree angle towards the camera 111 from a mirror surface facing vertically downwards. The light source 114 is located above the semi-transparent mirror 113. Light from the light source 114 shines downwards through the semi-transparent mirror 113. Furthermore, light passing through the semi-transparent mirror 113 is reflected by an object below the semi-transparent mirror 113, and then reflected by the semi-transparent mirror 113 before being captured by the camera 111. That is, the camera 111 can capture images of objects within the illumination area of ​​the light source 114. Therefore, as the wafer chuck 101 holding the wafer W moves along the guide rail 102, the camera 111 can capture images of the entire surface of the wafer W through the illumination area of ​​the light source 114. Then, the data of the image captured by the camera 111 is input into the control unit 4.

[0057] Furthermore, the structure of the second inspection section 202 is basically the same as that of the first inspection section 201 described above. Each element of the second inspection section 202 is arranged symmetrically with respect to the central axis line in the device width direction, as is the case with respect to the same elements in the first inspection section 201. Therefore, regarding the feed-outlet 100a of the second inspection section 202, a feed-outlet 100a for feeding and unloading the wafer W into and out of the housing 100 is formed on the device width direction side (positive X direction side) of the sidewall of the housing 100 on the front side (negative Y direction side in the figure).

[0058] Next, the processing of the wafer W performed by the inspection device 1 configured as described above will be explained.

[0059] (1. Determine the delivery route)

[0060] First, when placing the cassette C on the cassette mounting plate 13, the control unit 4 determines a transport path for each wafer W within the cassette C. When determining the transport path, the control unit 4 acquires a transport plan that serves as the transport path for the specified substrate, specifically, a transport plan where the inspection section in the transport path of the wafer W includes both the first inspection section 201 and the second inspection section 202. More specifically, the control unit 4 acquires a transport plan where the information of the inspection section in the transport path of the wafer W, which only passes through one inspection section, is "first inspection section 201 or second inspection section 202".

[0061] Next, the control unit 4 removes the inspection unit 20 associated with the cassette mounting plate 13 containing the wafer W to be transported, i.e., the wafer W whose transport path is determined, from the first inspection unit 201 and the second inspection unit 202 in the transport plan. For example, if the cassette mounting plate 131, which is the first mounting unit, contains the wafer C, the control unit 4 removes the second inspection unit 202 associated with the cassette mounting plate 131 from the transport plan, so that the first inspection unit 201 can be used to take an inspection image of the wafer W in the cassette C. As a result, the transport path of the wafer W can be determined. Information associating the cassette mounting plate 13 containing the wafer C with the inspection unit 20 to be removed is pre-stored in the storage unit (not shown). In addition, information about whether the cassette containing the wafer W to be transported is placed in either cassette mounting unit L3 is determined by the control unit 4, an external control device (e.g., a host computer), etc., and stored in the storage unit (not shown).

[0062] Then, the control unit 4 controls the transport of the chip W based on the determined transport path, i.e., the transport scheme after deletion, as described below.

[0063] (2. Transport to Inspection Department 20)

[0064] After determining the transport path of the wafer W, based on the information of that transport path, the wafer W is transported to the inspection section 20 corresponding to the cassette mounting plate 13 of the cassette C in which the wafer W is placed. For example, the wafer W placed in the cassette C of the cassette mounting plate 131 or cassette mounting plate 132 is transported by the wafer transport mechanism 141 to the first inspection section 201 corresponding to the cassette mounting plate 131 or cassette mounting plate 132. The wafer W placed in the cassette C of the cassette mounting plate 133 or cassette mounting plate 134 is transported by the wafer transport mechanism 142 to the second inspection section 202 corresponding to the cassette mounting plate 133 or cassette mounting plate 134.

[0065] (3. Inspection)

[0066] After the wafer W is transported to the inspection unit 20, the surface of the wafer W is photographed by the imaging unit 110 under the control of the control unit 4. Then, the control unit 4 inspects the wafer W based on the imaging results of the imaging unit 110.

[0067] (4. Sent out from Inspection Department 20)

[0068] After the imaging unit 110 finishes imaging, the wafer W is returned to its original cassette C based on the aforementioned transport path information. For example, a wafer W inspected in the first inspection unit 201 is transported by the wafer transport mechanism 141 to its original cassette C, which is placed on the cassette mounting plate 131 or cassette mounting plate 132. Similarly, a wafer W inspected in the second inspection unit 202 is transported by the wafer transport mechanism 142 to its original cassette C, which is placed on the cassette mounting plate 133 or cassette mounting plate 134.

[0069] During the transport to the inspection unit 20 (2) and the delivery from the inspection unit 20 (4), the transport arm 14e of the wafer transport mechanism 14 rotates, specifically the rotating body 14d. Furthermore, as described above, when viewed from above, a portion of the other side of the device width direction of the first transport region R1 (the negative side in the X direction of the figure) overlaps with a portion of the other side of the device width direction of the second transport region R2 (the positive side in the X direction of the figure). Therefore, due to the rotation of the rotating body 14d of the wafer transport mechanism 141 included in the transport operation of the cassette C placed on the cassette mounting plate 132 and the rotation of the rotating body 14d of the wafer transport mechanism 142 included in the transport operation of the cassette C placed on the cassette mounting plate 133, the rotating bodies 14d may interfere with each other.

[0070] To avoid such a situation, the start time of the rotation of the rotating body 14d is adjusted during the transport to the inspection unit 20 in step 2 and during the delivery from the inspection unit 20 in step 4.

[0071] Specifically, when transporting wafer W from cassette C, which is placed on cassette mounting plate 132, to the first inspection unit 201, after the moving body 14c of the wafer transport mechanism 141, which receives wafer W from cassette C, moves a predetermined distance in the device width direction (positive side of the X direction in the figure), the rotating body 14d of the wafer transport mechanism 141 begins to rotate. When transporting wafer W from cassette C, which is placed on cassette mounting plate 133, to the second inspection unit 202, after the moving body 14c of the wafer transport mechanism 142, which receives wafer W from cassette C, moves a predetermined distance in the other side of the device width direction (negative side of the X direction in the figure), the rotating body 14d of the wafer transport mechanism 142 begins to rotate. The amount of movement of the moving body 14c in the device width direction (X direction in the figure) until the rotating body 14d begins to rotate is the amount by which the rotating bodies 14d do not interfere with each other when rotating after this movement.

[0072] Furthermore, when a wafer W is delivered from the first inspection unit 201 to the cassette C placed on the cassette mounting plate 132, after the rotating body 14d of the wafer transport mechanism 141, which received the wafer W from the first inspection unit 201, is rotated by a predetermined angle, the moving body 14c of the wafer transport mechanism 141 begins to move to the other side in the device width direction (the negative side of the X direction in the figure). When a wafer W is delivered from the second inspection unit 202 to the cassette C placed on the cassette mounting plate 133, after the rotating body 14d of the wafer transport mechanism 14s, which received the wafer W from the second inspection unit 202, is rotated by a predetermined angle, the moving body 14c of the wafer transport mechanism 142 begins to move to one side in the device width direction (the positive side of the X direction in the figure). The amount of rotation of the rotating body 14d until the moving body 14c begins to move is the amount by which the rotating bodies 14d do not interfere with each other when the moving body 14c moves after this rotation, for example, 120°.

[0073] As described above, in this embodiment, the inspection apparatus 1 includes: cassette mounting plates 131-134 that respectively hold cassettes C; and a first inspection unit 201 and a second inspection unit 202, each having an imaging unit 110 for imaging wafers W. Furthermore, the inspection apparatus 1 includes: a first transport area R1 provided with a wafer transport mechanism 141, which performs a first transport operation to transport wafers W between the cassettes C placed on the cassette mounting plates 131 and 132 and the first inspection unit 201; and a second transport area R2 provided with a wafer transport mechanism 142, which performs a second transport operation to transport wafers W between the cassettes C placed on the cassette mounting plates 133 and 134 and the second inspection unit 202. Moreover, the cassette mounting plates 131 and 132 and the cassette mounting plates 133 and 134 are positioned so as not to overlap when viewed from above. Furthermore, in the inspection device 1, the first transport area R1 and the second transport area R2 are positioned at different locations when viewed from above, so that the first transport operation and the second transport operation can be performed in parallel. Therefore, the transport operation of the wafer transport mechanism 141 and the transport operation of the wafer transport mechanism 142 can be performed in parallel, thereby increasing throughput.

[0074] Furthermore, in this embodiment, the first transport area R1 and the second transport area R2 partially overlap each other when viewed from above. Therefore, the space occupied by the inspection device 1 can be reduced.

[0075] Furthermore, the inspection apparatus 1 of this embodiment is a combination of the wafer carrier plate 13, the wafer transport mechanism 14, and the inspection unit 20 arranged side by side in the horizontal direction. This horizontally arranged structure has the following advantages compared to a vertically arranged structure. When the components are arranged vertically, the maintenance operability of the upper inspection unit 20 is poor. However, when the components are arranged horizontally, there is no problem with the maintenance operability of any of the inspection units 20.

[0076] In addition, unlike this embodiment, we consider a structure in which the box-mounted plate 13 is arranged side by side in the horizontal direction and the inspection section 20 is arranged side by side in the vertical direction. However, compared with this structure, the structure in this embodiment in which the box-mounted plate 13 and the inspection section 20 are arranged side by side in the horizontal direction has the following effects (1) and (2).

[0077] (1) In the case of a structure in which the cassette mounting plate 13 is arranged side by side in the horizontal direction and the inspection unit 20 is arranged side by side in the vertical direction, the wafer transport mechanism 14 corresponding to one inspection unit 20 must be a low-level structure and the wafer transport mechanism 14 corresponding to the other inspection unit 20 must be a high-level structure, which makes the design complicated. In contrast, in the structure in this embodiment where the cassette mounting plate 13 and the inspection unit 20 are arranged side by side in the horizontal direction, the design of the wafer transport mechanism 14 does not become as complicated as described above.

[0078] (2) In the case of a structure in which the cassette mounting plate 13 is arranged side by side in the horizontal direction and the inspection unit 20 is arranged side by side in the vertical direction, the movement distance of the transport arm 14e differs between the wafer transport mechanism 14 corresponding to one inspection unit 20 and the wafer transport mechanism 14 corresponding to the other inspection unit 20, making wafer transport control complicated. In contrast, in the structure in this embodiment where the cassette mounting plate 13 and the inspection unit 20 are arranged side by side in the horizontal direction, there is no difference in the movement distance of the transport arm 14e between the wafer transport mechanisms 14, and therefore, wafer transport control does not become complicated.

[0079] In this embodiment, the box feeding and discharging section 10 is in the width direction of the device when viewed from above. Figure 1 It has a rectangular shape (length in the X direction). Furthermore, the inspection section 20 is configured such that the long axis of the area occupied by the inspection section 20, which appears rectangular when viewed from above, is perpendicular to the width direction of the device. Figure 1 The first transport area R1 and the second transport area R2 are rectangular when viewed from above, with their major axis direction parallel to the width direction of the device. Figure 1 The X direction is parallel to the X direction. Therefore, according to this embodiment, the magnitude of the depth direction (Y direction in the figure) of the inspection device can be suppressed.

[0080] Furthermore, in this embodiment, in the width direction of the device ( Figure 1 A space for operator access is provided between the first inspection section 201 and the second inspection section 202 in the X direction. By entering this space for maintenance or other purposes, the operator can access the equipment from the other side in the width direction (...). Figure 1 The operation of the first inspection unit 201 from the negative side of the X direction, from the width side of the device ( Figure 1 The operation of the second inspection unit 202 from the X-direction positive side and the operation of the wafer transport unit 11 from the inside (Y-direction positive side of the figure).

[0081] Furthermore, in this embodiment, a buffer section 21 is provided. Alternatively, the control section 4 may use the buffer section 21 to control the transport of the wafer W as follows: That is, the control section 4 controls the transport of the wafer W so that the wafer W can be temporarily placed in the buffer section 21 and returned to a gap different from the gap where the wafer W was previously received. This makes it easy to determine if a process with a product defect has occurred.

[0082] Alternatively, a detection unit (not shown) can be provided in the inspection unit 20 to detect notches that serve as a reference for the orientation of the wafer W. The detection unit may include, for example, a light-emitting part consisting of an LED (Light Emitting Diode) positioned opposite the front side of the periphery of the wafer W; and a light-receiving part consisting of a PD (Photo Diode) positioned opposite the back side of the light-emitting part and the periphery of the wafer W. The detection unit then detects the notch in the wafer W based on changes in the amount of light incident on the light-receiving part. Alternatively, the notch can be detected based on the imaging results of the imaging unit 110. Then, the control unit 4 can perform a process (wafer orientation adjustment process) based on the notch detection results of the detection unit, by controlling the drive unit 103 of the inspection unit 20 to adjust the orientation of the wafer W. The wafer orientation adjustment process, for example, allows the wafer W to return to the cartridge C in a predetermined orientation. Furthermore, the wafer orientation adjustment process allows all wafers W in the cartridge C to have the same orientation, or allows the orientations of multiple wafers W to be different from each other.

[0083] Alternatively, the inspection device 1 may include a box transfer section (not shown) that transfers boxes C between a box transport device such as an OHT located outside the inspection device 1 and a box mounting plate 13. The box transfer section may include, for example, a standby section capable of holding boxes C received from or transferred to the box transport device; and an internal transport mechanism for transporting boxes C between the standby section and the box mounting plate 13.

[0084] Furthermore, it should be understood that the embodiments disclosed herein are illustrative rather than restrictive in all respects. The above embodiments can be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

Claims

1. An inspection apparatus for inspecting substrates, characterized in that, include: The first placement part and the second placement part respectively place the storage container for storing the substrate; The first inspection section and the second inspection section each have a photographing unit for photographing the substrate for inspecting the substrate; A first transport area is provided with a first transport mechanism, wherein the first transport mechanism performs a first transport action of transporting a substrate between the storage container placed on the first placement part and the first inspection part; and A second transport area is provided with a second transport mechanism, wherein the second transport mechanism performs a second transport operation to transport the substrate between the storage container placed on the second placement part and the second inspection part. The first and second mounting portions are arranged side-by-side in the width direction of the device, in a position where they do not overlap when viewed from above. The width direction of the device is parallel to the major axis of the rectangular first and second transport areas. The first inspection section and the second inspection section are arranged side by side in the width direction of the device, on the inner side of the first mounting section and the second mounting section, respectively, in a position that does not overlap when viewed from above. The inner side refers to a side in the depth direction orthogonal to the width direction of the device. The first transport area and the second transport area are arranged side-by-side in the width direction of the device, at different positions when viewed from above, between the first and second mounting portions and the first and second inspection portions, so that the first transport action and the second transport action can be performed in parallel. The first transport area and the second transport area are arranged such that a portion of the width direction of the device overlaps when viewed from above. The first transport mechanism and the second transport mechanism each have a substrate holding portion for holding the substrate. The start time of the rotation of the substrate holding part is adjusted so that when the rotation of the substrate holding part begins at that start time, the first transport mechanism and the second transport mechanism will not interfere with each other.

2. The inspection device as described in claim 1, characterized in that: The first mounting section and the second mounting section are provided in multiples.

3. The inspection device as described in claim 1 or 2, characterized in that: It includes a buffer section that temporarily holds the substrate until the substrate delivered from the receiving container is returned to the receiving container.

4. The inspection device as described in claim 3, characterized in that: The storage container has multiple slots for storing substrates. The inspection device also includes a control unit that controls the transport of the substrate, enabling the substrate to be temporarily placed in the buffer section and returned to a gap different from the gap where the substrate was previously received.

5. The inspection device as described in claim 1 or 2, characterized in that: It also includes a control unit, which controls the transport of the substrate based on the transport plan of the specified substrate transport path. The control department: Obtain the transportation plan that includes both the first inspection unit and the second inspection unit as the transportation destination in the transportation route. The inspection section associated with the placement section containing the storage container is removed from the first inspection section and the second inspection section of the transportation plan, wherein the storage container is a storage container for the substrate of the transported object. Based on the deleted delivery scheme, the delivery of the substrate is controlled.

6. The inspection device as described in claim 1 or 2, characterized in that: The first inspection section and the second inspection section each have a rotation mechanism for rotating the substrate. The inspection device also includes a control unit that controls the rotation mechanism so that the substrate is returned to the storage container in a predetermined orientation.

7. A substrate transport method, characterized in that: The substrate transport method is a method of transporting a substrate in the inspection apparatus according to any one of claims 1 to 6, including a transport scheme based on a specified substrate transport path, and steps for transporting the substrate. The transportation steps include: The step of obtaining the transportation plan that includes both the first inspection unit and the second inspection unit as the transportation destination of the transportation route; When transporting the substrate inside the storage container, a step is taken to determine which of the first and second mounting portions does not contain the storage container, wherein the storage container contains the substrate to be transported. The step of removing the inspection unit corresponding to the determined placement unit from the first inspection unit and the second inspection unit in the transportation scheme; and Based on the deleted delivery scheme, the steps for delivering the substrate.

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