antenna module

Abstract

An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers, an antenna disposed on an upper surface of the wiring structure, a heat dissipation structure disposed on the upper surface of the wiring structure around the antenna, and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2020-0084613, filed on July 9, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to an antenna module. Background Technology

[0003] With the advent of 5G, the increased bandwidth has made antenna modules for transmitting / receiving signals within that bandwidth even more crucial. Antenna modules can take the form of surface-mounted patch antennas that can be soldered onto an antenna substrate. However, reducing the size of these types of antenna modules can be challenging, and antenna performance may degrade due to signal loss when soldered. Furthermore, antenna modules may be susceptible to heat dissipation issues. Summary of the Invention

[0004] One aspect of this disclosure is to provide an antenna module that can have a reduced size by reducing thickness, etc.

[0005] Another aspect of this disclosure is to provide an antenna module that can improve antenna performance.

[0006] Another aspect of this disclosure is to provide an antenna module that can have improved heat dissipation.

[0007] According to one aspect of this disclosure, an antenna module in which an antenna is embedded may be provided.

[0008] According to another aspect of this disclosure, the antenna can be connected to the wiring structure via plating technology (rather than solder bonding).

[0009] According to another aspect of this disclosure, the heat dissipation structure can also be embedded in the antenna module together with another antenna.

[0010] For example, according to one aspect of this disclosure, an antenna module includes: a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; a heat dissipation structure disposed around the antenna on the upper surface of the wiring structure; and an encapsulation disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure, wherein at least a portion of the uppermost wiring layer of the plurality of wiring layers is connected to the antenna through a first connection via of the uppermost via layer of the plurality of via layers, and wherein the first connection via passes through at least a portion of the encapsulation.

[0011] For example, according to one aspect of this disclosure, an antenna module includes: a wiring structure; an antenna disposed on an upper surface of the wiring structure; a plurality of conductor blocks disposed on the upper surface of the wiring structure, spaced apart from the antenna and surrounding at least a portion of a side surface of the antenna; and an encapsulation disposed on the upper surface of the wiring structure and covering at least a portion of the antenna and each of the plurality of conductor blocks.

[0012] For example, according to one aspect of this disclosure, an antenna module includes: an antenna having a connection pad disposed on a first surface of the antenna; an encapsulation disposed around the antenna and contacting at least a portion of the first surface of the antenna, a second surface of the antenna opposite to the first surface being exposed through the encapsulation; an insulating structure surrounding the encapsulation and having a through-hole, the insulating structure including a heat dissipation structure disposed around the antenna; a first connection via connecting to the connection pad and passing through the encapsulation; and a wiring structure disposed on the encapsulation and having a first surface facing the first surface of the antenna, the wiring structure including a first wiring layer disposed on the first surface of the wiring structure and connected to the first connection via and the heat dissipation structure. Attached Figure Description

[0013] The above and other aspects, features, and advantages of this disclosure will be more clearly understood from the following specific embodiments, taken in conjunction with the accompanying drawings, in which:

[0014] Figure 1 This is a block diagram illustrating an example of an electronic device system;

[0015] Figure 2 This is a diagram illustrating an example of an electronic device;

[0016] Figure 3 This is a cross-sectional view showing an example of an antenna module;

[0017] Figures 4 to 6 It shows the manufacturing process. Figure 3 A cross-sectional view of an example of the fabrication process of the antenna module shown;

[0018] Figure 7 This is a cross-sectional view showing another example of an antenna module;

[0019] Figures 8 to 10 It shows the manufacturing process. Figure 7 A cross-sectional view of an example of the fabrication process of the antenna module shown;

[0020] Figure 11 This is a cross-sectional view showing another example of an antenna module;

[0021] Figure 12This is a cross-sectional view showing another example of an antenna module;

[0022] Figure 13 This is a cross-sectional view showing another example of an antenna module;

[0023] Figure 14 This is a cross-sectional view showing another example of an antenna module;

[0024] Figure 15 This is a cross-sectional view showing another example of an antenna module; and

[0025] Figure 16 This is a cross-sectional view showing another example of an antenna module. Detailed Implementation

[0026] In the following description, exemplary embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. In the drawings, for clarity of description, the shape, size, etc., of the elements may be exaggerated or simplified.

[0027] Figure 1 This is a block diagram illustrating an example of an electronic device system.

[0028] Reference Figure 1 The electronic device 1000 can accommodate a motherboard 1010. Chip-related components 1020, network-related components 1030, and other components 1040 can be physically or electrically connected to the motherboard 1010. These components can be connected to other parts described below via various signal lines 1090.

[0029] Chip-related components 1020 may include: memory chips, such as volatile memory (e.g., dynamic random access memory (DRAM)), non-volatile memory (e.g., read-only memory (ROM)), flash memory, etc.; application processor chips, such as central processing units (e.g., central processing units (CPU)), graphics processing units (e.g., graphics processing units (GPUs)), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips, such as analog-to-digital converters (ADCs), application-specific integrated circuits (ASICs), etc. However, chip-related components 1020 are not limited to these, and may also include other types of chip-related components. Furthermore, chip-related components 1020 can be combined with each other. Chip-related components 1020 may have a package form including the aforementioned chips.

[0030] Network-related components 1030 may include components operating based on protocols such as: Wi-Fi (IEEE 802.11 series, etc.), WiMAX (IEEE 802.16 series, etc.), IEEE 802.20, LTE, Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM+, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, and 5G protocols, as well as any other wireless and wired protocols specified after those mentioned above. However, network-related components 1030 are not limited to these protocols and may also include components operating based on various other wireless or wired standards or protocols. In addition, the network-related component 1030 can be combined with the aforementioned chip-related component 1020.

[0031] Other components 1040 may include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, low-temperature co-fired ceramic (LTCC) components, electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCCs), etc. However, other components 1040 are not limited to these, and may also include passive components for various other purposes. Furthermore, other components 1040 may be combined with the aforementioned chip-related components 1020 and / or network-related components 1030.

[0032] Depending on the type of electronic device 1000, it may include other components that are physically or electrically connected to the motherboard 1010 or not physically or electrically connected to the motherboard 1010. These other components may include, for example, a camera 1050, an antenna 1060, a display 1070, a battery 1080, an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage unit (e.g., a hard disk drive), an optical disc (CD) drive, a digital versatile disc (DVD) drive, etc. However, these other components are not limited to these, and may include other components for various purposes depending on the type of electronic device 1000, etc.

[0033] Electronic device 1000 can be a smartphone, personal digital assistant (PDA), digital video camera, digital camera, network system, computer, monitor, tablet PC, laptop PC, netbook PC, television, video game console, smartwatch, automotive component, etc. However, electronic device 1000 is not limited to these, and can be any other electronic device that processes data.

[0034] Figure 2 This is a diagram showing an example of an electronic device.

[0035] Reference Figure 2 The electronic device can be implemented by a smartphone 1100. A modem 1101 and various types of antenna modules 1102, 1103, 1104, 1105, and 1106 connected to the modem 1101 via rigid printed circuit boards, flexible printed circuit boards, and / or rigid-flex printed circuit boards can be provided in the smartphone 1100. A Wi-Fi module 1107 may also be provided if desired. Antenna modules 1102, 1103, 1104, 1105, and 1106 may include antenna modules 1102, 1103, 1104, and 1105 for various frequency bands of 5G mobile communication (such as antenna module 1102 for the 3.5 GHz band, antenna module 1103 for the 5 GHz band, antenna module 1104 for the 28 GHz band, antenna module 1105 for the 39 GHz band, etc.), and may also include an antenna module 1106 for 4G, but exemplary embodiments are not limited thereto. The electronic device is not limited to the smartphone 1100, and can be implemented by the other electronic devices mentioned above.

[0036] Figure 3 This is a cross-sectional view showing an example of an antenna module.

[0037] Referring to the figure, the antenna module 800A in the example embodiment may include: a wiring structure 300 including a plurality of insulating layers 310, a plurality of wiring layers 320, and a plurality of via layers 330; an antenna 100 disposed on the upper surface of the wiring structure 300; a heat dissipation structure 500 disposed around the antenna 100 on the upper surface of the wiring structure 300; and an encapsulation member 400 disposed on the upper surface of the wiring structure 300 and covering at least a portion of each of the antenna 100 and the heat dissipation structure 500. If desired, the antenna module 800A in the example embodiment may include: a passivation layer 600 disposed on the lower surface of the wiring structure 300, covering the lowest insulating layer 310 of the plurality of insulating layers 310, and having an opening that exposes at least a portion of the lowest wiring layer 320; and / or an electrical connection metal member 650 disposed on the opening of the passivation layer 600 and connected to the exposed portion of the lowest wiring layer 320.

[0038] At least a portion of the uppermost wiring layer 320 of the plurality of wiring layers 320 can be connected to the antenna 100 via a first connection via 335 of the uppermost via layer 330 of the plurality of via layers 330, and can be connected to the heat dissipation structure 500 via a second connection via 337 of the uppermost via layer 330. For example, the encapsulation 400 can fill at least a portion of region G1 between the upper surface of the uppermost insulating layer 310 of the plurality of insulating layers 310 and the lower surface of the antenna 100 (i.e., the encapsulation 400 covers at least a portion of the lower surface of the antenna), and at least a portion of region G2 between the upper surface of the uppermost insulating layer 310 and the lower surface of the heat dissipation structure 500. The first connection via 335 can pass through at least a portion of the encapsulation 400 and can be connected to the pad pattern 100P of the antenna 100, and the second connection via 337 can pass through at least a portion of the encapsulation 400 and can be connected to at least a portion of the first metal pattern layer 520 disposed on the lower side of the heat dissipation structure 500.

[0039] Therefore, the antenna module 800A in the example embodiment can be such that the antenna 100 and the heat dissipation structure 500 can be embedded in the antenna module 800A, and the antenna 100 can be electrically connected to the wiring layer 320 in the wiring structure 300 (i.e., the antenna substrate) via a first connection via 335 (instead of soldering). Therefore, even with the inclusion of the antenna 100 and the heat dissipation structure 500, the thickness of the antenna module 800A can be reduced, thus allowing for a smaller size. Furthermore, signal loss can be reduced by using the electrical connection via the first connection via 335, thereby improving antenna performance. Additionally, the heat generated by the antenna 100 can be effectively dissipated through the heat dissipation structure 500. Moreover, since the heat dissipation structure 500 is electrically connected to the wiring layer 320 in the wiring structure 300 via a second connection via 337, an effective heat dissipation path is provided.

[0040] Furthermore, the upper surface of the uppermost insulating layer 310 may be disposed at the same height level as the upper surface of the uppermost wiring layer 320, that is, the uppermost insulating layer 310 may have an upper surface that is substantially coplanar with the upper surface of the uppermost wiring layer 320. Furthermore, the upper surface of the encapsulation 400 may be disposed at the same height level as the upper surface of the antenna 100 (i.e., for example, the upper surface of the uppermost antenna pattern 100A, which is the uppermost element of the antenna 100). Furthermore, the upper surface of the encapsulation 400 may be located at the same height level as the upper surface of the heat dissipation structure 500 (i.e., for example, the upper surface of the first metal pattern layer 520, which is the uppermost element of the heat dissipation structure 500). Configurations where elements can be disposed at the same height level include configurations where elements can be disposed at exactly the same height level or substantially the same height level. The antenna 100 and the heat dissipation structure 500 can be easily embedded in the encapsulation 400 by means of a carrier, after which the wiring structure 300 can be easily formed on the encapsulation 400. Therefore, the antenna 100 and the heat dissipation structure 500 can be embedded in the encapsulation 400, such that the upper surface of each of the uppermost components of the antenna 100 and the heat dissipation structure 500 can be exposed from the upper surface of the encapsulation 400. Furthermore, the uppermost wiring layer 320 can be embedded in the upper side of the uppermost insulating layer 310, and at least a portion of the upper surface of the uppermost wiring layer 320 can contact the encapsulation 400.

[0041] In the following description, each element of the antenna module 800A according to an exemplary embodiment will be described in more detail with reference to the accompanying drawings.

[0042] Antenna 100 can be configured as a patch antenna. For example, antenna 100 can be one of various types of patch antennas. For instance, antenna 100 can essentially include a dielectric body and antenna patterns 100A and pad patterns 100P that can be respectively disposed on the upper and lower surfaces of the dielectric body. Only a single antenna 100 may be provided, but the exemplary embodiments are not limited thereto, and multiple antennas 100 may be arranged side by side on the wiring structure 300. For example, antennas 100 may be arranged in various forms (such as 1×2 arrays, 1×4 arrays, and 2×2 arrays).

[0043] The dielectric body of antenna 100 may include a material having a high dielectric constant (Dk). For example, the dielectric body may include a ceramic layer and / or a ceramic-polymer composite layer. Optionally, the dielectric body may include an insulating layer comprising an insulating material having a high dielectric constant (Dk) (such as polytetrafluoroethylene (PTFE)). The ceramic-polymer composite layer can be obtained by dispersing a ceramic filler in an organic binder. Polymers (such as PTFE or epoxy resin) can be used as the organic binder. Fillers including SiO2, TiO2, Al2O3, etc., can be used as ceramic fillers. The ceramic filler can have various shapes, such as angular or circular shapes. The diameter of the ceramic filler can be 50 μm or less. If desired, the ceramic-polymer composite layer may include glass fiber as a reinforcing material.

[0044] Each of the antenna pattern 100A and the pad pattern 100P may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as said metallic material. The antenna pattern 100A may be a coupling pattern, and a patch pattern coupled to the antenna pattern 100A may also be provided in the dielectric body. The antenna pattern 100A may be arranged in the thickness direction (…). Figure 3 It transmits and receives RF (radio frequency) signals in the vertical direction. Pad pattern 100P connects antenna 100 to wiring structure 300. At least one of pad patterns 100P can be connected to a patch pattern disposed in the dielectric body via a feed via disposed in the dielectric body, and can also be connected to a feed pattern of wiring structure 300. At least another pad pattern 100P can be connected to a ground pattern of wiring structure 300.

[0045] The wiring structure 300 may include multiple insulating layers 310, multiple wiring layers 320, and multiple via layers 330. The multiple wiring layers 320 may be disposed on and / or within the multiple insulating layers 310. The multiple via layers 330 may pass through the multiple insulating layers 310, and the uppermost via layer 330 may pass through at least a portion of the encapsulation 400. The number of multiple insulating layers 310, the number of multiple wiring layers 320, and the number of multiple via layers 330 are not limited to any specific number and may be greater than or less than [a certain number]. Figure 3 The examples in the text show the quantities.

[0046] Multiple insulating layers 310 may include insulating materials. The insulating material may be a thermosetting resin (such as epoxy resin), a thermoplastic resin (such as polyimide), or a material prepared by impregnating reinforcing materials (such as glass fiber, glass cloth, glass fabric) and / or inorganic fillers in a thermosetting or thermoplastic resin (such as prepreg, Ajinomoto build-up film, ABF, etc.). However, the exemplary embodiments of the insulating materials for the multiple insulating layers 310 are not limited thereto; if desired, each insulating layer 310 may include a thermoplastic resin layer and a thermosetting resin layer. For example, the multiple insulating layers 310 may include a laminate of alternating thermoplastic and thermosetting resin layers. The thermoplastic resin layers may include materials that effectively transmit high-frequency signals, and the thermosetting resin layers may include materials that facilitate high-frequency signal transmission and have good bonding properties. Such a multilayered resin structure provides an insulating body that facilitates high-frequency signal transmission and has excellent adhesive properties.

[0047] For easy high-frequency signal transmission, materials such as liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), polyphenylene ether (PPE), and polyimide (PI) can be used as the materials for the thermoplastic resin layer. The dielectric loss factor (Df) can be adjusted according to the type of resin included in the thermoplastic resin layer, the type of filler included in the resin, and the filler content. The dielectric loss factor (Df) is a value used for dielectric loss, and dielectric loss refers to the power loss generated when an alternating current (AC) electric field is formed in the resin layer (dielectric). The dielectric loss factor (Df) is proportional to the dielectric loss, and the lower the dielectric loss factor (Df), the lower the dielectric loss. Thermoplastic resin layers with low dielectric loss characteristics are advantageous in reducing losses in high-frequency signal transmission. The dielectric loss factor (Df) of the thermoplastic resin layer can be 0.003 or less, for example, 0.002 or less. The thermoplastic resin layer may also have low dielectric constant properties, and the dielectric constant (Dk) may be, for example, 3.5 or less.

[0048] To facilitate high-frequency signal transmission, modified polyimide (PI), polyphenylene ether (PPE), modified epoxy resin, etc., can be used as materials for the thermosetting resin layer. The dielectric loss factor (Df) can be adjusted according to the type of resin, the type of filler included in the resin, and the filler content. Thermosetting resin layers with low dielectric loss characteristics are advantageous in reducing losses during high-frequency signal transmission. The dielectric loss factor (Df) of the thermosetting resin layer can be 0.003 or less, for example, 0.002 or less. The dielectric constant (Dk) of the thermosetting resin layer can be 3.5 or less.

[0049] Multiple wiring layers 320 may include metallic materials. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as said metallic materials. The multiple wiring layers 320 may be formed by plating processes (such as addition process (AP), semi-AP (SAP), modified SAP (MSAP), via sealing (TT), etc.), and thus may include a seed layer (electroplated layer) and an electrolytic plating layer formed on top of the seed layer. Primer copper foil may also be included if desired. The multiple wiring layers 320 may perform various functions depending on the design of the respective layers. For example, the multiple wiring layers 320 may include feed patterns connected to antenna 100, and may also include ground patterns and power patterns. If desired, the multiple wiring layers 320 may include other signal transmission patterns besides feed patterns. Each of these patterns may include line patterns, surface patterns, and / or pad patterns.

[0050] Multiple via layers 330 may comprise a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. The multiple via layers 330 may be formed by a plating process (such as AP, SAP, MSAP, or TT processes), and thus may comprise a seed layer (electroplated layer) and an electroplated layer formed on top of the seed layer. The multiple via layers 330 may perform various functions depending on the design. For example, the multiple via layers 330 may comprise connection vias for connecting feed patterns, connection vias for ground connections, connection vias for power connections, and connection vias for other signal connections. For example, the uppermost via layer 330 may comprise the aforementioned first connection via 335 and second connection via 337, and the first connection via 335 may comprise a connection via for power feeding and / or a connection via for grounding, and the second connection via 337 may comprise a connection via for grounding. Each connection via can be formed by completely filling the via with metallic material, or by using metallic material along the wall surface of the via. Furthermore, connection vias can have various shapes, such as tapered shapes.

[0051] The encapsulation 400 may include an insulating material. The insulating material may be a thermosetting resin (such as epoxy resin), a thermoplastic resin (such as polyimide), or a resin prepared by impregnating a reinforcing material (such as inorganic filler) in a thermosetting or thermoplastic resin (such as ABF). However, exemplary embodiments of the insulating material for the encapsulation 400 are not limited thereto, and other types of insulating resins having a low dielectric loss factor (Df) may be used. The encapsulation 400 may cover the entire side of the antenna 100 and may cover at least a portion of each of the upper and lower surfaces of the antenna 100.

[0052] The heat dissipation structure 500 effectively dissipates heat generated by the antenna 100. The heat dissipation structure 500 can further improve the rigidity of the antenna module 800A depending on the specific material, and can help ensure the uniformity of the thickness of the encapsulation 400. The heat dissipation structure 500 may have a through-hole 500H, and the antenna 100 may be disposed in the through-hole 500H. Because the heat dissipation structure 500 has a through-hole 500H and the antenna 100 is disposed in the through-hole 500H, the antenna 100 can be more easily mounted and embedded. The through-hole 500H of the heat dissipation structure 500 may have an inner wall continuously surrounding the side surface of the antenna 100, but its exemplary embodiments are not limited thereto. If desired, the heat dissipation structure 500 may include a plurality of units spaced apart from each other.

[0053] The heat dissipation structure 500 may include: an insulating substrate 510 having a through hole 500H in which the antenna 100 is disposed; a first metal pattern layer 520 disposed on each of the upper and lower surfaces of the insulating substrate 510; and a second metal pattern layer 550 disposed on the wall surface of the through hole 500H. Furthermore, for better heat dissipation, a metal via layer 530 may be included, which can pass through the insulating substrate 510 and can connect at least a portion of the first metal pattern layer 520 disposed on the upper surface of the insulating substrate 510 to at least a portion of the first metal pattern layer 520 disposed on the lower surface of the insulating substrate 510.

[0054] The insulating substrate 510 may include an insulating material. Materials comprising glass fibers and reinforcing materials, copper-clad laminates (CCLs), or prepregs may be used as the insulating material. However, exemplary embodiments of the insulating material for the insulating substrate 510 are not limited thereto, and glass, ceramics, plastics, etc., may be used.

[0055] The first metal pattern layer 520 and the second metal pattern layer 550 may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. The first metal pattern layer 520 and the second metal pattern layer 550 may be formed by a plating process (such as AP, SAP, MSAP, or TT processes), and therefore may include a seed layer (electroplated layer) and an electrolytic plating layer formed on top of the seed layer. If desired, a primer copper foil may also be included. The first metal pattern layer 520 and the second metal pattern layer 550 may include ground patterns. Each of the ground patterns may include a line pattern, a surface pattern, and / or a pad pattern.

[0056] The metal via layer 530 may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. The metal via layer 530 may be formed by a plating process (such as AP, SAP, MSAP, or TT processes), and therefore may include a seed layer (electroplated layer) and an electrolytic plating layer formed on top of the seed layer. The metal via layer 530 may include metal vias for grounding connections. Each via of the metal via layer 530 may be formed by completely filling the via with metallic material, or by using metallic material along the wall surface of the via. Furthermore, the vias may have various shapes, such as cylindrical shapes, hourglass shapes, etc.

[0057] The passivation layer 600 may include an insulating material. The insulating material may be a thermosetting resin (such as epoxy resin), a thermoplastic resin (such as polyimide), or a resin (such as ABF) prepared by impregnating a reinforcing material (such as an inorganic filler) in a thermosetting or thermoplastic resin. However, exemplary embodiments of the insulating material for the passivation layer 600 are not limited thereto, and a solder resist (SR) including a photosensitive material may be used. The passivation layer 600 may cover the lowermost insulating layer 310 and may have openings for exposing at least a portion of the lowermost wiring layer 320.

[0058] Electrical connection metal element 650 may be disposed on an opening in passivation layer 600 and may be connected to an exposed portion of the lowest wiring layer 320. Electrical connection metal element 650 provides a path for physically connecting and / or electrically connecting antenna module 800A to external components. For example, electrical connection metal element 650 may be formed using a low-melting-point metal (such as tin (Sn) or an alloy including tin (Sn)) having a melting point lower than that of copper (Cu). For example, electrical connection metal element 650 may be formed using solder, but exemplary embodiments are not limited thereto. Electrical connection metal element 650 may be configured as pads, solder balls, pins, etc., and may be formed as a multilayer or a single layer. When electrical connection metal element 650 comprises a multilayer, it may include copper pillars and solder, while when it comprises a single layer, it may include tin-silver solder, but exemplary embodiments are not limited thereto.

[0059] Figures 4 to 6 It shows the manufacturing process. Figure 3 A cross-sectional view of an example of the fabrication process of the antenna module shown.

[0060] Reference Figure 4 An insulating substrate 510 can be fabricated using CCL or similar methods, with copper foil M stacked on both surfaces of the insulating substrate 510. Subsequently, through-holes 500H and vias 530V penetrating the insulating substrate 510 can be formed using laser processing or mechanical drilling. Afterward, a metal via layer 530 is formed by filling the vias 530V using a plating process, and a first metal pattern layer 520 and a second metal pattern layer 550 can be formed on both surfaces of the insulating substrate 510 and the wall surface of the through-holes 500H. Through a series of processes, a heat dissipation structure 500 in which the through-holes 500H are formed can be fabricated.

[0061] Reference Figure 5 A carrier 900 can be fabricated. A glass substrate, metal substrate, insulating substrate, etc., can be used as the carrier 900. Then, an adhesive film 910 (such as a bare die attachment film (DAF)) can be attached to the upper and / or lower surface of the carrier 900. The fabricated heat dissipation structure 500 can be attached to the adhesive film 910. Then, a patch antenna 100 can be attached to the adhesive film 910 disposed in the through-hole 500H of the heat dissipation structure 500, facing upwards and / or downwards. Then, an encapsulation 400 for burying the antenna 100 and the heat dissipation structure 500 can be formed by stacking ABFs.

[0062] Reference Figure 6The wiring structure 300 can be formed on the encapsulation 400 through a stacking process. For example, vias for exposing the pad patterns of the antenna 100 and the first metal pattern layer of the heat dissipation structure 500 can be formed in the encapsulation 400 through a laser process. The wiring layer and via layer can be formed through a plating process. Insulating material can be stacked on the encapsulation 400. The vias can be formed in the insulating material through a laser process. The wiring layer and via layer can be repeatedly formed through a plating process to form the wiring structure 300. Subsequently, if necessary, a passivation layer 600 can be formed on the wiring structure 300. Subsequently, the manufactured structure can be separated from the carrier 900, and the adhesive film 910 can be removed. If necessary, electrical connection metal parts 650 can be further formed on the openings of the passivation layer 600. Through a series of processes, the antenna module 800A according to the above example embodiment can be manufactured.

[0063] Since the other descriptions are essentially the same as the corresponding descriptions above, repeated descriptions will not be repeated.

[0064] Figure 7 This is a cross-sectional view showing another example of an antenna module.

[0065] Referring to the figure, unlike the antenna module 800A described in the foregoing example embodiment, in the antenna module 800B of another example embodiment, a plurality of conductor blocks 580 may be configured as a heat dissipation structure. The plurality of conductor blocks 580 may be disposed on the upper surface of the wiring structure 300, spaced apart from the antenna 100, and surrounding at least a portion of the side surface of the antenna 100. An encapsulation 400 may cover at least a portion of each of the plurality of conductor blocks 580. Each of the plurality of conductor blocks 580 may include a conductive material. For example, each of the plurality of conductor blocks 580 may include a metallic material (such as copper (Cu)) having excellent thermal conductivity.

[0066] The upper surface of each of the plurality of conductor blocks 580 may be positioned at the same height level as the upper surface of the encapsulation 400. As described above, the antenna 100 can be easily embedded in the encapsulation 400 by means of a carrier, and the plurality of conductor blocks 580 may also be embedded in the encapsulation 400 together with the antenna 100. Therefore, the upper surfaces of the plurality of conductor blocks 580 may be embedded in the encapsulation 400, such that the upper surfaces of the antenna 100 and each of the plurality of conductor blocks 580 may be exposed from the upper surface of the encapsulation 400. Furthermore, the encapsulation 400 may fill the region G1 between the upper surface of the uppermost insulating layer 310 and the lower surface of the antenna 100, and may also fill at least a portion of the region G2 between the upper surface of the uppermost insulating layer 310 and the lower surface of each of the plurality of conductor blocks 580.

[0067] Other descriptions are essentially the same as the corresponding descriptions above, and repeated descriptions will not be repeated.

[0068] Figures 8 to 10 It shows the manufacturing process. Figure 7 A cross-sectional view of an example of the fabrication process of the antenna module shown.

[0069] Reference Figure 8 The carrier 900 can be fabricated. Glass substrates, metal substrates, insulating substrates, etc., can be used as the carrier 900. An adhesive film 910 (such as DAF) can be attached to the upper and / or lower surface of the carrier 900. The antenna 100 and multiple conductor blocks 580 can be attached to the adhesive film 910. The antenna 100 can be a patch antenna and can be attached facing upwards and / or downwards.

[0070] Reference Figure 9 An encapsulation 400 for burying the antenna 100 and multiple conductor blocks 580 can be formed by stacking ABF (Alternating Base Layer) materials. A wiring structure 300 can be formed on the encapsulation 400 by a deposition process. For example, a pad pattern for exposing the antenna 100 and vias for at least a portion of at least one of the conductor blocks 580 can be formed in the encapsulation 400 by a laser process. Wiring layers and via layers can be formed. Insulating material can be stacked on the encapsulation 400. Vias can be formed in the insulating material by a laser process, and wiring layers and via layers can be repeatedly formed by a plating process to form the wiring structure 300.

[0071] Reference Figure 10 If necessary, a passivation layer 600 can be formed on the wiring structure 300. This allows the manufactured structure to be separated from the carrier 900, and the adhesive film 910 can be removed. If necessary, electrical connection metal parts 650 can be further formed on the openings of the passivation layer 600. Through a series of processes, the antenna module 800B according to the above example embodiment can be manufactured.

[0072] Since the other descriptions are essentially the same as the corresponding descriptions above, repeated descriptions will not be repeated.

[0073] Figure 11 This is a cross-sectional view showing another example of an antenna module.

[0074] Figure 12 This is a cross-sectional view showing another example of an antenna module.

[0075] Referring to these figures, in antenna modules 800C and 800D in another example, wiring structure 300 may include: a first region 150 including a plurality of first insulating layers 160, a plurality of first wiring layers 170, and a plurality of first via layers 180; and a second region 200 disposed below the first region 150 and including a plurality of second insulating layers 210, a plurality of second wiring layers 220, and a plurality of second via layers 230. The first region 150 may primarily serve as an antenna component, and the second region 200 may primarily serve as a redistribution component. For example, at least a portion of the plurality of first insulating layers 160 may include a material having a lower dielectric loss factor (Df) than at least a portion of the plurality of second insulating layers 210.

[0076] The plurality of first insulating layers 160 may be a laminate of alternating thermoplastic resin layers 161 and thermosetting resin layers 162. The thermoplastic resin layers 161 may include a material that effectively transmits high-frequency signals, and the thermosetting resin layers 162 may include a material that facilitates high-frequency signal transmission and has excellent bonding properties. Through the multiple resin layers 161 and 162, an insulating body that facilitates high-frequency signal transmission and has excellent adhesive properties can be provided. Each of the plurality of first wiring layers 170 may be disposed on the thermoplastic resin layer 161 and may be embedded in the thermosetting resin layer 162, and may be interconnected through a plurality of first via layers 180. Each of the plurality of first via layers 180 may include a connecting via that simultaneously passes through adjacent thermoplastic resin layers 161 and thermosetting resin layers 162.

[0077] For high-frequency signal transmission, liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), polyphenylene ether (PPE), and polyimide (PI) can be used as materials for the thermoplastic resin layer 161. The dielectric loss factor (Df) can be adjusted according to the type of resin in the thermoplastic resin layer 161, the type of filler contained in the resin, and the filler content. The dielectric loss factor (Df) is a value used for dielectric loss, and dielectric loss refers to the power loss generated when an alternating current (AC) electric field is formed in the resin layer (dielectric). The dielectric loss factor (Df) is proportional to the dielectric loss, and the smaller the dielectric loss factor (Df), the smaller the dielectric loss. Thermoplastic resin layer 161 with low dielectric loss characteristics is advantageous in reducing losses in high-frequency signal transmission. The dielectric loss factor (Df) of each of the thermoplastic resin layers 161 can be 0.003 or less, for example, 0.002 or less. The dielectric constant (Dk) of the thermoplastic resin layer 161 can be 3.5 or less.

[0078] For high-frequency signal transmission, polyphenylene oxide (PPE), modified polyimide (PI), modified epoxy resin, etc., can be used as materials for the thermosetting resin layer 162. The dielectric loss factor (Df) can be adjusted according to the type of resin in the thermosetting resin layer 162, the type of filler included in the resin, and the filler content. Thermosetting resin layer 162 with low dielectric loss characteristics is advantageous in reducing losses in high-frequency signal transmission. The dielectric loss factor (Df) of thermosetting resin layer 162 can be 0.003 or less, for example, 0.002 or less. The dielectric constant (Dk) of thermosetting resin layer 162 can be 3.5 or less.

[0079] The thickness of the thermoplastic resin layer 161 may be greater than the thickness of the thermosetting resin layer 162. This thickness relationship may be desirable for high-frequency signal transmission. The interface between the thermoplastic resin layer 161 and the thermosetting resin layer 162, which are adjacent to each other in the vertical direction, may include a rough surface. A rough surface refers to a surface that has been roughened to have serrations. The rough surface can ensure the adhesion between the thermoplastic resin layer 161 and the thermosetting resin layer 162, which are adjacent to each other vertically.

[0080] The plurality of first wiring layers 170 may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. The plurality of first wiring layers 170 may be formed by a plating process (such as AP, SAP, MSAP, or TT processes), and may therefore include a seed layer (electroplated layer) and an electrolytic plating layer formed on top of the seed layer. If desired, a primer copper foil may be further included. The plurality of first wiring layers 170 may perform various functions depending on the design of the respective layers. For example, the plurality of first wiring layers 170 may include a feed pattern connected to the antenna 100, and may also include a ground pattern disposed around the feed pattern, and may also include a power pattern. Each of these patterns may include a line pattern, a surface pattern, and / or a pad pattern.

[0081] The plurality of first via layers 180 may comprise a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. The plurality of first via layers 180 may be formed by a plating process (such as AP, SAP, MSAP, or TT processes), and may therefore comprise a seed layer (electroplated layer) and an electroplated layer formed on top of the seed layer. The plurality of first via layers 180 may perform various functions depending on the design. For example, the plurality of first via layers 180 may comprise connection vias for connecting feed patterns, connection vias for ground connections, connection vias for power connections, and connection vias for other signal connections. The uppermost via layer of the plurality of first via layers 180 may comprise the aforementioned connection vias 335 and 337, and connection vias 335 and 337 may comprise connection vias for power feeding and / or connection vias for grounding. Each connection via can be formed by completely filling the via with metallic material, or by using metallic material along the wall surface of the via. Furthermore, connection vias can have various shapes, such as tapered shapes.

[0082] The plurality of second insulating layers 210 may include an insulating material. The insulating material may be a thermosetting resin (such as epoxy resin), a thermoplastic resin (such as polyimide), or a material prepared by impregnating a reinforcing material (such as glass fiber) and / or an inorganic filler into a thermosetting or thermoplastic resin (such as a prepreg, ABF, or photosensitive dielectric (PID)).

[0083] Multiple second wiring layers 220 may include metallic materials. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as said metallic materials. The multiple second wiring layers 220 may be formed by plating processes (such as AP, SAP, MSAP, or TT processes), and thus may include a seed layer (electroplated layer) and an electrolytic plating layer formed on top of the seed layer. If desired, a primer copper foil may be further included. The multiple second wiring layers 220 may perform various functions depending on the design of the respective layers. For example, the multiple second wiring layers 220 may include ground patterns, power patterns, and signal patterns. Signal patterns may include various signal patterns (such as antenna signal patterns, data signal patterns, etc.) other than ground patterns, power patterns, etc. Each of these patterns may include line patterns, surface patterns, and / or pad patterns.

[0084] Multiple second via layers 230 may comprise a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. The multiple second via layers 230 may be formed by a plating process (such as AP, SAP, MSAP, or TT processes), and thus may comprise a seed layer (electroplated layer) and an electrolytic plating layer formed on top of the seed layer. The multiple second via layers 230 may perform various functions depending on the design. For example, the multiple second via layers 230 may comprise connection vias for signal connections, connection vias for ground connections, and connection vias for power connections. Each connection via may be formed by completely filling the via with metallic material, or by utilizing metallic material along the wall surface of the via. Furthermore, the connection vias may have various shapes, such as a tapered shape.

[0085] Furthermore, unlike the antenna modules 800A and 800B described in the aforementioned example embodiments, in the antenna modules 800C and 800D of the example embodiments, the antenna 100' can be a patch antenna including a dielectric portion 110 and an antenna pattern 120, wherein the antenna pattern 120 is formed within or on the dielectric portion 110. Multiple patch antennas can be independently disposed on the wiring structure 300. The multiple antennas 100' can be arranged in various forms (such as a 1×2 array, a 1×4 array, and a 2×2 array).

[0086] The dielectric portion 110 may include dielectric layers 111 and 112, and a bonding layer 113 disposed between dielectric layers 111 and 112 and bonding dielectric layers 111 and 112 together. Specifically, the antenna 100' may include: a first dielectric layer 111; a bonding layer 113 disposed on the upper surface of the first dielectric layer 111; a second dielectric layer 112 disposed on the upper surface of the bonding layer 113; a first antenna pattern 121 disposed on the lower surface of the bonding layer 113 and embedded in the first dielectric layer 111; a second antenna pattern 122 disposed on the upper surface of the second dielectric layer 112 and having at least a portion overlapping the first antenna pattern 121 in the thickness direction; pad patterns 123 and 124 disposed on the lower surface of the first dielectric layer 111; and a feed via 130 passing through the first dielectric layer 111 and connecting the first antenna pattern 121 to the pad patterns 123 and 124. Each of dielectric layers 111 and 112 may include a material having a high dielectric constant (Dk). For example, each of dielectric layers 111 and 112 may be a ceramic layer and / or a ceramic-polymer composite layer. However, the example embodiments are not limited thereto, and dielectric layers 111 and 112 may include an insulating material having a high dielectric constant (Dk), such as PTFE. The ceramic-polymer composite layer can be obtained by dispersing a ceramic filler in an organic binder. Polymers such as PTFE or epoxy resin can be used as organic binders. Fillers including SiO2, TiO2, Al2O3, etc., can be used as ceramic fillers. The ceramic filler can have various shapes, such as angular or circular shapes. The diameter of the ceramic filler can be 50 μm or less. If desired, the ceramic-polymer composite layer may include glass fiber as a reinforcing material. The dielectric constant (Dk) of bonding layer 113 may be smaller than that of dielectric layers 111 and 112, and bonding layer 113 may include a material with good bonding strength. For example, bonding layer 113 may comprise a polymer, such as PTFE or epoxy resin, having a lower dielectric constant (Dk) than the materials of dielectric layers 111 and 112. The thickness of bonding layer 113 may be less than the thickness of each of dielectric layers 111 and 112.

[0087] Antenna pattern 120 may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. Antenna pattern 120 may be formed by a plating process (such as AP, SAP, MSAP, or TT processes), and may therefore include a seed layer (electroplating-free layer) and an electroplated layer formed on top of the seed layer. Antenna pattern 120 may include patch pattern 121 (i.e., the first antenna pattern), coupling pattern 122 (i.e., the second antenna pattern), and pad patterns 123 and 124.

[0088] The patch pattern 121 can receive RF signals and transmit signals in the thickness direction via feed patterns and feed vias provided in the wiring structure 300. The patch pattern 121 can also transmit the received RF signals in the thickness direction to the electronic component 700 (e.g., RFIC 710) via feed patterns and feed vias provided in the wiring structure 300. The patch pattern 121 may have an inherent resonant frequency (such as 28 GHz or 39 GHz), which depends on inherent factors such as shape, size, and height. For example, the patch pattern 121 can be electrically connected to the electronic component 700 (e.g., RFIC 710) via feed patterns and feed vias provided in the wiring structure 300, allowing the patch pattern 121 to transmit and receive horizontal (H-pole) and vertical (V-pole) RF signals.

[0089] For example, coupling pattern 122 may be disposed above patch pattern 121, such as along the thickness direction. Coupling pattern 122 may be configured such that at least a portion of coupling pattern 122 is in the thickness direction (e.g., based on...). Figure 11 or Figure 12 The cross section (from top to bottom) overlaps with at least a portion of the patch pattern 121. Due to the electromagnetic coupling between the coupling pattern 122 and the patch pattern 121, an additional resonant frequency adjacent to the aforementioned inherent resonant frequency can be obtained, thus achieving a wider bandwidth.

[0090] Pad patterns 123 and 124 can connect antenna 100' to wiring structure 300. For example, pad pattern 123 can be connected to patch pattern 121 via feed via 130 through first dielectric layer 111, and can be connected to feed patterns of multiple first wiring layers 170 disposed in first region 150 of wiring structure 300 via first connection via 335. Furthermore, pad pattern 124 can be disposed around pad pattern 123, and if necessary, pad pattern 124 can be connected to ground patterns of multiple first wiring layers 170 disposed in first region 150 of wiring structure 300 via connection vias.

[0091] The feed via 130 may comprise a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. The feed via 130 may be formed by a plating process (such as AP, SAP, MSAP, or TT processes), and therefore may comprise a seed layer (electroplated layer) and an electrolytic plating layer formed on top of the seed layer. The feed via 130 may be formed by completely filling the via with metallic material, or by forming the via with metallic material along the wall surface of the via. Furthermore, the feed via 130 may have various shapes, such as cylindrical, hourglass, etc.

[0092] Furthermore, unlike the antenna modules 800A and 800B described in the foregoing example embodiments, antenna modules 800C and 800D in another example may also include electronic components 700 surface-mounted on the lower surface of the wiring structure 300. Electronic components 700 may include various types of active and / or passive components. For example, electronic components 700 may include an RFIC 710, a power management IC (PMIC) 720, etc. For example, electronic components 700 may also include chip passive components, such as chip capacitors or chip inductors. Electronic components 700 can be connected to at least a portion of a plurality of second wiring layers 220 disposed in a second region 200 of the wiring structure 300 via connecting metals 715 and 725. For example, connecting metals 715 and 725 may be formed using low-melting-point metals (such as tin (Sn) or tin-containing alloys) having a melting point lower than that of copper (Cu). For example, connecting metals 715 and 725 may be formed using solder, but examples of such materials are not limited thereto.

[0093] Since the other descriptions are essentially the same as the corresponding descriptions above, repeated descriptions will not be repeated.

[0094] Figure 13 This is a cross-sectional view showing another example of an antenna module.

[0095] Figure 14 This is a cross-sectional view showing another example of an antenna module.

[0096] Referring to these figures, unlike the antenna modules 800C and 800D described in the foregoing example embodiments, in the antenna modules 800E and 800F of another example, the semiconductor chip 730 and passive component 740 can be surface-mounted as electronic components on the lower surface of the wiring structure 300. The semiconductor chip 730 may include an RFIC, PMIC, etc. The passive component 740 may include a chip capacitor, a chip inductor, etc. The semiconductor chip 730 can be surface-mounted via a connecting metal part 735. The passive component 740 can also be surface-mounted and disposed via a connecting metal part (such as solder). The semiconductor chip 730 can be secured by an underfill resin 750a disposed on the lower surface of the wiring structure 300. The underfill resin 750a may include a conventional insulating resin with adhesive properties, such as epoxy resin.

[0097] Furthermore, unlike the antenna modules 800C and 800D described in the aforementioned example embodiments, in the antenna modules 800E and 800F of another example, a molding material 791 covering the semiconductor chip 730 and passive component 740 may be provided on the lower surface of the wiring structure 300. The electronic components can be protected by the molding material 791. The molding material 791 can be a conventional epoxy molding compound (EMC). However, the example embodiments of the molding material 791 are not limited to this, and ABF, etc., can be used as the molding material 791.

[0098] Furthermore, unlike the antenna modules 800C and 800D described in the aforementioned example embodiments, in the antenna modules 800E and 800F of another example, the insert 780 may be disposed on the lower surface of the wiring structure 300. The insert 780 may be disposed side-by-side with electronic components such as semiconductor chip 730 and passive component 740. The insert 780 may be connected to at least a portion of a plurality of second wiring layers 220 disposed in the second region 200 of the wiring structure 300 via a connecting metal piece 785 disposed on the upper part. In addition, the insert 780 may be connected to another type of printed circuit board, such as a motherboard, via a connecting metal piece 787 on the lower side. The insert 780 may be fixed by a bottom filling resin 750b. The insert 780 may be an organic insert using insulating resin as the insulating body. However, the example embodiments of the insert 780 are not limited to this and may be silicon inserts using silicon as the insulating body. The insert 780 may be an annular single substrate having a through portion (in which electronic components are disposed), or may include a plurality of units spaced apart from each other.

[0099] Since the other descriptions are essentially the same as the corresponding descriptions above, repeated descriptions will not be repeated.

[0100] Figure 15 This is a cross-sectional view showing another example of an antenna module.

[0101] Figure 16 This is a cross-sectional view showing another example of an antenna module.

[0102] Referring to these figures, in another example, antenna modules 800G and 800H may also include a shield 792 disposed on the lower surface of wiring structure 300 and surrounding electronic components (such as semiconductor chip 730 and passive component 740), without including molding material 791. Electromagnetic interference (EMI) can be shielded by shield 792. Shield 792 may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as said metallic material. However, the material of shield 792 is not limited to metal and may be, for example, a synthetic resin material comprising metal powder.

[0103] Furthermore, unlike the antenna modules 800E and 800F described in the foregoing example embodiments, in the antenna modules 800G and 800H of another example, connectors 795 and 797 may also be disposed on the lower surface of the wiring structure 300, without the insert 780. The left connector 795 may be an RF socket and may be connected to at least a portion of a plurality of second wiring layers 220 disposed in the second region 200 of the wiring structure 300. The right connector 797 may be a connector for signal and / or power and may be connected to at least a portion of a plurality of second wiring layers 220 disposed in the second region 200 of the wiring structure 300. Antenna modules 800G and 800H may be connected to other types of printed circuit boards, such as motherboards, via connectors 795 and 797.

[0104] Since the other descriptions are essentially the same as the corresponding descriptions above, repeated descriptions will not be repeated.

[0105] According to the foregoing example embodiments, an antenna module with a reduced size can be provided by reducing its thickness.

[0106] In addition, an antenna module that improves antenna performance can be provided.

[0107] In addition, an antenna module with improved heat dissipation can be provided.

[0108] In the example embodiments, for ease of description, the terms "side," "side surface," etc., may be used to refer to a portion or surface of the cross-section in the right / left direction in the reference drawings; the terms "upper side," "upper part," "upper surface," etc., may be used to refer to a side, portion, or surface of the cross-section in the upward direction in the reference drawings; and the terms "lower side," "lower part," "lower surface," etc., may be used to refer to a side, portion, or surface of the cross-section in the downward direction in the reference drawings. The concept of an element being disposed in a side region, upper side, lower side, upper region, or lower region may include a configuration in which the element is in direct contact with the element configured for reference in the corresponding direction, and a configuration in which the element is not in direct contact with the element configured for reference. However, for ease of description, these terms may be defined as described above, and the scope of the example embodiments is not particularly limited to the terms described above.

[0109] In the example embodiments, the term "connection" may not only mean "direct connection" but also include "indirect connection" via adhesive layers, etc. Furthermore, the term "electrical connection" can include cases where elements are "physically connected" and cases where elements are "not physically connected." Additionally, the terms "first," "second," etc., can be used to distinguish one element from another and do not limit the order and / or importance associated with the elements. In some cases, without departing from the scope of the example embodiments, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0110] In the example embodiments, the term "example embodiment" may not refer to the same example embodiment, but may be provided to describe and highlight the distinct features of each example embodiment. The example embodiments presented above may be implemented without excluding the possibility of combining features with those of other example embodiments. For example, unless otherwise stated, even if a feature described in one example embodiment is not described in another example embodiment, the description may be understood to be relevant to that other example embodiment.

[0111] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. An antenna module, comprising: The wiring structure includes multiple insulating layers, multiple wiring layers, and multiple via layers; An antenna is disposed on the upper surface of the wiring structure and includes a dielectric body and a pad pattern disposed on the lower surface of the dielectric body. A heat dissipation structure is disposed around the antenna on the upper surface of the wiring structure; as well as An encapsulation element is disposed on the upper surface of the wiring structure and covers at least a portion of each of the antenna and the heat dissipation structure. In this configuration, a portion of the uppermost wiring layer is connected to the pad pattern of the antenna via a first connection via of the uppermost via layer; another portion of the uppermost wiring layer is connected to the lower surface of the heat dissipation structure via a second connection via of the uppermost via layer; and the portion of the uppermost wiring layer connected to the pad pattern via the first connection via is directly connected to the other portion of the uppermost wiring layer connected to the lower surface of the heat dissipation structure via the second connection via. Both the first connection via and the second connection via pass through at least a portion of the encapsulation.

2. The antenna module according to claim 1, wherein, The antenna further includes an antenna pattern disposed on the upper surface of the dielectric body, the heat dissipation structure has a side surface facing the antenna, and in the direction in which the surface of the heat dissipation structure and the side surface of the antenna face each other, the side surface of each of the dielectric body and the antenna pattern overlaps with and is spaced apart from the surface of the heat dissipation structure, wherein the encapsulation is formed in the space between the side surface of each of the dielectric body and the antenna pattern and the surface of the heat dissipation structure.

3. The antenna module according to claim 1, wherein, The encapsulation fills at least a portion of the region between the upper surface of the uppermost insulating layer and the lower surface of the antenna, and at least a portion of the region between the upper surface of the uppermost insulating layer and the lower surface of the heat dissipation structure.

4. The antenna module according to claim 3, wherein, The uppermost wiring layer is embedded in the upper side of the uppermost insulating layer, and at least a portion of the upper surface of the uppermost wiring layer is in contact with the encapsulation.

5. The antenna module according to claim 1, wherein, The heat dissipation structure includes: an insulating substrate having a through hole, in which the antenna is disposed; a first metal pattern layer disposed on each of the upper and lower surfaces of the insulating substrate, the second connecting via connecting to the first metal pattern layer disposed on the lower surface of the insulating substrate; and a second metal pattern layer disposed on the wall surface of the through hole.

6. The antenna module according to claim 5, wherein, The heat dissipation structure further includes a metal via layer that passes through the insulating substrate and connects at least a portion of the first metal pattern layer disposed on the upper surface of the insulating substrate to at least a portion of the first metal pattern layer disposed on the lower surface of the insulating substrate.

7. The antenna module according to claim 5, wherein, The upper surface of the encapsulation is positioned at the same height level as the upper surface of the first metal pattern layer disposed on the upper surface of the insulating substrate.

8. The antenna module according to claim 1, wherein, The heat dissipation structure includes multiple conductor blocks, and the second connection via is connected to the lower surface of at least one of the multiple conductor blocks.

9. The antenna module according to claim 8, wherein, The upper surface of the encapsulation is positioned at the same height level as the upper surface of each of the plurality of conductor blocks.

10. The antenna module according to claim 1, wherein, The antenna also includes an antenna pattern disposed on the upper surface of the dielectric body.

11. The antenna module according to claim 10, wherein, The upper surface of the encapsulation is positioned at the same height level as the upper surface of the antenna pattern.

12. The antenna module according to claim 1, wherein, The dielectric body includes: a first dielectric layer; a bonding layer disposed on the upper surface of the first dielectric layer; and a second dielectric layer disposed on the upper surface of the bonding layer. The antenna further includes: a first antenna pattern disposed on the lower surface of the bonding layer and embedded in the first dielectric layer; a second antenna pattern disposed on the upper surface of the second dielectric layer and having at least a portion overlapping the first antenna pattern in the thickness direction; and a feed via passing through the first dielectric layer and connecting the first antenna pattern to the pad pattern, wherein the pad pattern is disposed on the lower surface of the first dielectric layer.

13. The antenna module according to claim 1, further comprising: An electronic component is disposed on the lower surface of the wiring structure and connected to at least a portion of the lowest wiring layer among the plurality of wiring layers. The electronic components include at least one of power management integrated circuits, radio frequency integrated circuits, and passive components.

14. The antenna module according to claim 1, in, The wiring structure includes: a first region comprising a plurality of first insulating layers, a plurality of first wiring layers, and a plurality of first via layers; and a second region disposed below the first region and comprising a plurality of second insulating layers, a plurality of second wiring layers, and a plurality of second via layers. The plurality of first insulating layers comprises a laminate of alternating thermoplastic resin layers and thermosetting resin layers.

15. An antenna module, comprising: The wiring structure includes multiple insulating layers, multiple wiring layers, and multiple via layers; An antenna is disposed on the upper surface of the wiring structure and includes a dielectric body and a pad pattern disposed on the lower surface of the dielectric body. Multiple conductor blocks are disposed on the upper surface of the wiring structure, spaced apart from the antenna, and surrounding at least a portion of the side surface of the antenna; as well as An encapsulation element is disposed on the upper surface of the wiring structure and covers at least a portion of the antenna and each of the plurality of conductor blocks. Wherein, a portion of the uppermost wiring layer of the plurality of wiring layers is connected to the pad pattern of the antenna through a first connection via of the uppermost via layer of the plurality of via layers, another portion of the uppermost wiring layer is connected to the lower surface of at least one of the plurality of conductor blocks through a second connection via of the uppermost via layer, and the portion of the uppermost wiring layer connected to the pad pattern through the first connection via is directly connected to the other portion of the uppermost wiring layer connected to the lower surface of at least one of the plurality of conductor blocks through the second connection via.

16. The antenna module according to claim 15, wherein, Each of the plurality of conductor blocks includes copper (Cu).

17. An antenna module, comprising: An antenna having connection pads disposed on a first surface of the antenna; An encapsulation is disposed around the antenna and in contact with at least a portion of the first surface of the antenna, and a second surface of the antenna opposite to the first surface is exposed through the encapsulation; An insulating structure surrounding the encapsulation and having through-holes, the insulating structure including a heat dissipation structure disposed around the antenna; as well as A wiring structure is disposed on the encapsulation and has a first surface facing the first surface of the antenna. The wiring structure includes multiple insulating layers, multiple wiring layers, and multiple via layers. The uppermost via layer of the multiple via layers passes through the encapsulation. The first wiring layer of the multiple wiring layers is disposed on the first surface of the wiring structure and connected to the uppermost via layer and the heat dissipation structure. Wherein, the first wiring layer is the uppermost wiring layer among the plurality of wiring layers, and a portion of the first wiring layer is connected to the connection pad of the antenna through a first connection via of the uppermost via layer, another portion of the first wiring layer is connected to the heat dissipation structure through a second connection via of the uppermost via layer, and the portion of the first wiring layer connected to the connection pad through the first connection via is directly connected to the other portion of the first wiring layer connected to the heat dissipation structure through the second connection via.

18. The antenna module according to claim 17, wherein, The wiring structure further includes: a second wiring layer disposed on a second surface of the wiring structure opposite to the first surface of the wiring structure; and at least one insulating layer disposed between the first wiring layer and the second wiring layer.

19. The antenna module according to claim 18, further comprising: Electronic components are disposed on the second surface of the wiring structure and connected to the second wiring layer. The electronic components include at least one of power management integrated circuits, radio frequency integrated circuits, and passive components.

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