Camera module and imaging device comprising the same

Abstract

A camera module is provided. The camera module includes a substrate, a first camera disposed on the substrate and configured to generate a first image based on a first light signal, a second camera disposed on the substrate and configured to generate a second image based on a second light signal, a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and to provide the plurality of voltages to the first camera and the second camera, a metal fixing member coupled to the first camera and the second camera, and a thermal interface material disposed between the power management integrated circuit and the metal fixing member in a direction perpendicular to an upper surface of the substrate.

Description

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2020-0086978, filed on July 14, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The methods, apparatus, and systems consistent with the example embodiments relate to a camera module and an imaging device including the camera module. Background Technology

[0004] In recent years, with the continuous improvement of camera capabilities in electronic devices such as smartphones, electronic devices incorporating multiple cameras have been developed, each including an image sensor. This has led to increased complexity in power lines and a more diverse and variable power supply environment, resulting in inconsistent power quality. Furthermore, the power consumption of image sensors has increased due to higher resolution and a greater number of functions. To mitigate power quality variability, a power management integrated circuit (IC) supplying power to the image sensor can be mounted on the printed circuit board (PCB) of the camera module. However, when the power management IC is mounted on the camera module, image quality may degrade due to heat emitted from the IC. Summary of the Invention

[0005] An example embodiment provides a camera module with improved radiation performance and image quality, as well as an imaging device including the camera module.

[0006] According to one or more example embodiments, a camera module includes: a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power supply voltage received from an external power source and to provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member in a direction perpendicular to the upper surface of the substrate.

[0007] According to one or more example embodiments, a camera module includes: a first substrate; a first camera disposed on the first substrate and configured to generate a first image based on a first optical signal; a first power management integrated circuit disposed on the first substrate and configured to generate a first power supply voltage based on a first external power supply voltage received from an external power source and to provide the first power supply voltage to the first camera; a metal fixing member coupled to the first camera; and a first thermal interface material disposed between the first power management integrated circuit and the metal fixing member in a direction perpendicular to the upper surface of the first substrate.

[0008] According to one or more example embodiments, an imaging device includes: a first camera module configured to generate a first image; a power supply configured to provide a power supply voltage to the first camera module; and a processor configured to receive the first image from the first camera module. The first camera module includes: a substrate; a first camera disposed on the substrate and including a first lens and a first image sensor; a connector electrically connected to the substrate and configured to receive the power supply voltage from the power supply and transmit the first image to the processor; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on the power supply voltage and provide the plurality of voltages to the first image sensor; a metal frame surrounding and coupled to the first camera; and a thermal interface material disposed between the power management integrated circuit and the metal frame along a direction perpendicular to the upper surface of the substrate. Attached Figure Description

[0009] The above and other objects and features will become more apparent from the following description of exemplary embodiments with reference to the accompanying drawings, in which:

[0010] Figure 1A This is a perspective view of a camera module according to an example embodiment, and Figure 1B This is an exploded perspective view of the camera module according to an example embodiment;

[0011] Figure 2A This is a front view of the camera module according to an example embodiment, and Figure 2B This is a cross-sectional view of the camera module according to an example embodiment;

[0012] Figure 3 This is a schematic block diagram of a camera module according to an example embodiment;

[0013] Figure 4 This is a schematic block diagram of an imaging device including a camera module according to an example embodiment;

[0014] Figure 5A and Figure 5BThis is a cross-sectional view of another camera module according to an example embodiment;

[0015] Figure 6A This is a front view of the camera module according to an example embodiment, and Figure 6B This is a cross-sectional view of the camera module according to an example embodiment;

[0016] Figure 7A This is a front view of the camera module according to an example embodiment, and Figure 7B This is a cross-sectional view of the camera module according to an example embodiment;

[0017] Figure 8A , Figure 8B , Figure 8C and Figure 8D This is a front view of the camera module according to the example embodiment;

[0018] Figure 9A and Figure 9B This is a schematic diagram of a camera module according to an example embodiment;

[0019] Figure 10 This is a schematic diagram of a camera module according to an example embodiment;

[0020] Figure 11 This is a block diagram of an electronic device including a camera module according to an example embodiment;

[0021] and

[0022] Figure 12 yes Figure 11 Detailed block diagram of the camera module. Detailed Implementation

[0023] In the following description, exemplary embodiments will be described in detail with reference to the accompanying drawings.

[0024] Figure 1A This is a perspective view of a camera module according to an example embodiment, and Figure 1B This is an exploded perspective view of the camera module according to an example embodiment.

[0025] The camera module 100 according to the example embodiment can be included in an electronic device that captures images or has optical sensing capabilities. For example, the camera module 100 can be included in an electronic device such as a digital still camera, digital video camera, smartphone, wearable device, Internet of Things (IoT) device, tablet PC, personal digital assistant (PDA), portable multimedia player (PMP), or navigation device. Furthermore, the camera module 100 can be a component of a vehicle, furniture, manufacturing equipment, door, various measuring devices, etc., and can be included in an electronic device. As used in this specification, the term "module" can refer to an integrally formed component or the smallest unit or part of a component that performs one or more functions.

[0026] Reference Figure 1A and Figure 1B The camera module 100 may include a substrate 110, at least one camera 120 (e.g., a first camera 120a and a second camera 120b), a fixing member 130, a power management integrated circuit 140, a connecting member 150, and a connector 160. Furthermore, at least one camera 120 (e.g., the first camera 120a) may include an image sensor 121, an IR filter 122 (infrared shielding filter), a lens 123 (optical lens), a lens barrel 124, and an actuator 125. In this specification, camera 120 may refer to an assembly including the lens 123 and the image sensor 121, and may be referred to as an imaging unit.

[0027] Reference Figure 1A and Figure 1B The camera module 100 may include a first camera 120a and a second camera 120b mounted on a substrate 110, and a camera module 100 including multiple cameras may be referred to as a multi-camera module. However, the example embodiment is not limited thereto. The camera module 100 may include one camera or at least three cameras, and the multiple cameras may be mounted on different substrates.

[0028] The image sensor 121 of each of the first camera 120a and the second camera 120b can receive light signals collected by the lens 123, and the image sensor 121 can generate an image (or image data) based on the received light signals. For example, the light signals may include light incident on the image sensor 121. The features of the first image generated by the first camera 120a may differ from the features of the second image generated by the second camera 120b. For example, the angle of view of the lens 123 included in the first camera 120a may differ from the angle of view of the lens 123 included in the second camera 120b. For example, the angle of view of the lens 123 of the second camera 120b may be relatively larger than the angle of view of the lens 123 (wide-angle lens) of the first camera 120a. The first camera 120a can generate an image with a first angle of view, and the second camera 120b can generate an image with a second angle of view greater than the first angle of view. As another example, the features of the image sensor 121 of the first camera 120a (e.g., color filter array structure, resolution, etc.) may be different from the features of the image sensor 121 of the second camera 120b, and the features of the first image may be different from the features of the second image accordingly.

[0029] The lens barrel 124 may include a lens 123. In an example embodiment, the lens barrel 124 may include a plurality of lenses. The lens barrel 124 may be substantially cylindrical in shape and the lens 123 may be arranged along the optical axis.

[0030] The light signal collected by lens 123 that passes through IR filter 122 can be incident on image sensor 121. IR filter 122 can block the infrared component in the received light signal. Therefore, noise caused by the infrared component in the image data can be removed.

[0031] Image sensor 121 can convert received optical signals into electrical signals. Image sensor 121 can convert electrical signals from analog to digital image signals. Image sensor 121 can be implemented as a charge-coupled device (CCD) or complementary metal-oxide-semiconductor (CMOS).

[0032] Image sensor 121 may include a pixel array for receiving light signals. The pixel array may include pixels arranged in a matrix, and each pixel may include a photoelectric conversion device. For example, the photoelectric conversion device may include a photodiode, a phototransistor, a photogate, a pinned photodiode, etc.

[0033] Actuator 125 can be connected to lens barrel 124 and can move lens barrel 124 (i.e., lens 123) on the optical axis and / or a surface perpendicular to the optical axis of lens 123. Therefore, the first camera 120a can provide additional functions, such as autofocus (AF), optical image stabilization (OIS), IRIS, etc., to improve image quality.

[0034] In an example embodiment, the first camera 120a may further include a housing forming the shape, and the actuator 125 may be integrally formed with the housing. Figure 1B Each of the first camera 120a and the second camera 120b is shown to include an actuator 125, but any one or any combination of the first camera 120a and the second camera 120b may not include an actuator 125.

[0035] Image sensor 121 and actuator 125 can be mounted on substrate 110. For example, image sensor 121 can be mounted in receiving groove 115 in substrate 110. In an example embodiment, image sensor 121 can be mounted on substrate 110 via wire bonding.

[0036] Furthermore, the power management integrated circuit 140 can be mounted on the substrate 110. The power management integrated circuit 140 can be implemented as a semiconductor chip including power control circuitry. The power management integrated circuit 140 can generate voltages used in the first camera 120a and the second camera 120b based on a power supply voltage (hereinafter referred to as the reference power supply voltage) received from an external source via connector 160, and can provide the generated voltages to the first camera 120a and the second camera 120b. For example, the voltages can include power supply voltages provided to digital blocks (e.g., digital circuitry of image sensor 121) included in each of the first camera 120a and the second camera 120b, and power supply voltages provided to analog blocks (e.g., analog circuitry of image sensor 121) included in each of the first camera 120a and the second camera 120b. The power management integrated circuit 140 can also receive a ground voltage via connector 160 and can provide the ground voltage to the first camera 120a and the second camera 120b.

[0037] In an example embodiment, the power management integrated circuit 140 can be encapsulated using a protective component. For example, at least one surface of the power management integrated circuit 140 (e.g., the upper surface) can be covered by a shield. The shield may comprise a metallic material. Therefore, the power management integrated circuit 140 can be protected from static electricity, physical shock, and the like.

[0038] Connector 160 can electrically connect camera module 100 to the motherboard of an electronic device including camera module 100. Connector 160 can also be electrically connected to substrate 110. In an example embodiment, connector 160 of FIG1 can be connected to substrate 110 via connecting member 150, and for example, connecting member 150 can be implemented as a flexible printed circuit board (FPCB). However, the example embodiment is not limited thereto, and in another example embodiment, connector 160 can be directly connected to substrate 110.

[0039] Connector 160 may include pins (or pads) for receiving / transmitting signals or voltages (e.g., power supply voltages). A reference power supply voltage may be received via some of the pins, and connector 160 may provide the reference power supply voltage to power management integrated circuit 140 via wire lines patterned to substrate 110 and connection member 150. Control signals may be received via other pins to control camera module 100.

[0040] The wires used to transmit signals exchanged between the first camera 120a, the second camera 120b, the power management integrated circuit 140, and the connector 160 can be patterned on the substrate 110. The substrate 110 can be implemented as a PCB.

[0041] The fixing member 130 (or the frame of the camera module) can be connected (coupled) to the first camera 120a and the second camera 120b, and can align the first camera 120a and the second camera 120b. For example, the fixing member 130 can fix the first camera 120a and the second camera 120b to specific points on the substrate (or main substrate) of the electronic device on which the camera module 100 is mounted. The fixing member 130 may include metal or a metallic material. Figure 1A and Figure 1B As shown, the fixing member 130 can surround each of the first camera 120a and the second camera 120b. Figure 1A and Figure 1B A portion of the fixing member 130 is shown disposed between the first camera 120a and the second camera 120b, but the example embodiment is not limited thereto. The fixing member 130 may surround the first camera 120a and the second camera 120b.

[0042] The power management integrated circuit 140 and the fixing member 130 (e.g., a portion of the fixing member 130) may be stacked in a direction perpendicular to the substrate 110, and in this case, as described below, the thermal interface material (e.g., Figure 2B The TIM (Transformer Integrated Circuit) can be positioned between the power management integrated circuit 140 and the fixed component 130.

[0043] Figure 2A This is a front view of the camera module according to an example embodiment, and Figure 2B This is a cross-sectional view of the camera module according to an example embodiment. Figure 2B It can be along Figure 2A A cross-sectional view taken from line A-A'.

[0044] Reference Figure 2A and Figure 2B The camera module 100 may include a substrate 110, a first camera 120a, a second camera 120b, a fixing member 130, a power management integrated circuit 140, a connecting member 150, and a connector 160.

[0045] The first camera 120a and the second camera 120b can be arranged side by side on the substrate 110, and the connecting member 150 can be connected to the side surface of the substrate 110 (e.g., the side surface facing the first camera 120a and the second camera 120b). Figure 2A The example shows the connecting member 150 connected to the central portion of the aforementioned side surface of the substrate 110, but the example embodiment is not limited thereto. The connecting member 150 may be connected to the right portion (relatively closer to the first camera 120a) or the left portion (relatively closer to the second camera 120b) of the side surface of the substrate 110.

[0046] The power management integrated circuit 140 can be disposed on the substrate 110, close to one of the first camera 120a and the second camera 120b. For example, the size of the first camera 120a can be smaller than the size of the second camera 120b, and the power management integrated circuit 140 can be close to the first camera 120a.

[0047] like Figure 2B As shown, the upper surface of the power management integrated circuit 140 can be covered by the fixing member 130. In other words, a portion of the fixing member 130 can be stacked on the upper part of the power management integrated circuit 140 in a direction perpendicular to the substrate 110. A thermal interface material (TIM) can be disposed between the power management integrated circuit 140 and the fixing member 130. In the example embodiment, the TIM can directly contact the power management integrated circuit 140 and / or the fixing member 130.

[0048] TIM can be implemented as thermal paste, reactive compound, elastomer, adhesive film, etc. The adhesive film may include conductive material, such as a polymer in which aluminum, copper, etc. are mixed. For example, TIM can be distributed on the upper surface of power management integrated circuit 140 or a portion of fixing member 130 (i.e., the portion facing the upper surface of power management integrated circuit 140), or film-type TIM can be attached to the upper surface of power management integrated circuit 140 or a portion of fixing member 130 (i.e., the portion facing the upper surface of power management integrated circuit 140).

[0049] The thermal interface material (TIM) can reduce thermal resistance and enhance the thermal bond between the power management integrated circuit 140 and the mounting member 130. Therefore, the heat generated in the power management integrated circuit 140 can be easily transferred to the mounting member 130 through the TIM and can be dissipated to the outside through the mounting member 130.

[0050] As described above, the camera module 100 according to the example embodiment may include a power management integrated circuit 140. When the heat generated in the power management integrated circuit 140 raises the internal temperature of the camera module 100, the quality of the image generated in the image sensor 121 may degrade. For example, dark shadows may be generated in the image due to differences in dark current locally generated in the array of the image sensor 121.

[0051] However, in the camera module 100 according to the example embodiment, the TIM can be disposed between the power management integrated circuit 140 and the fixing member 130, and the heat generated in the power management integrated circuit 140 can be quickly dissipated to the outside. Therefore, temperature rise of the camera module 100 and image quality degradation can be prevented.

[0052] Figure 3 This is a schematic block diagram of a camera module according to an example embodiment. Figure 3 Some components included in the camera and driven according to the received voltage are shown.

[0053] Reference Figure 3 The camera module 100 includes a first camera 120a, a second camera 120b, and a power management integrated circuit (PMIC) 140 disposed on a substrate 110.

[0054] The first camera 120a may include an image sensor 121a and an actuator 125a, and the second camera 120b may include an image sensor 121b and an actuator 125b. In an example embodiment, the second camera 120b may not include the actuator 125b.

[0055] The power management integrated circuit 140 can generate, for example, a first voltage V1 to a sixth voltage V6 based on an external power supply voltage VDDe received from the outside, and can provide the power supply voltage to the first camera 120a and the second camera 120b. The power management integrated circuit 140 can provide the first voltage V1 to the sixth voltage V6 to the first camera 120a and the second camera 120b through wires patterned on the substrate 110.

[0056] For example, the power management integrated circuit 140 can provide a first voltage V1 to a third voltage V3 to a first camera 120a, and a fourth voltage V4 to a sixth voltage V6 to a second camera 120b. However, this is just an example. The type and amount of voltage generated by the power management integrated circuit 140 can vary, and one or more of the first voltage V1 to the sixth voltage V6 can be provided together to both the first camera 120a and the second camera 120b.

[0057] The image sensor 121a of the first camera 120a can use a first voltage V1 and a second voltage V2 as power supply voltages, and the actuator 125a can use a third voltage V3 as power supply voltages. In an example embodiment, one of the first voltage V1 and the second voltage V2 can be provided to the digital circuitry of the image sensor 121a, while the other can be provided to the analog circuitry of the image sensor 121a.

[0058] The image sensor 121b of the second camera 120b can use a fifth voltage V5 and a sixth voltage V6 as power supply voltages, and the actuator 125b can use a fourth voltage V4 as power supply voltage. In the example embodiment, one of the fifth voltage V5 and the sixth voltage V6 can be provided to the digital circuitry of the image sensor 121b, while the other can be provided to the analog circuitry of the image sensor 121b.

[0059] Figure 4 This is a schematic block diagram of an imaging device including a camera module according to an example embodiment.

[0060] Reference Figure 4 The imaging device 1000 may include a camera module 100, a processor 200, and a power supply 300. The processor 200 and power supply 300 may be mounted on the motherboard 400 of the imaging device 1000. The camera module 100 may be mounted on the motherboard 400 or connected to the motherboard 400 via a connector 160. In an example embodiment, a fixing member ( Figure 1A , Figure 1B , Figure 2A and Figure 2B (130) can fix the camera module 100 to a specific position on the motherboard 400.

[0061] Processor 200 may be a central processing unit (CPU), a microprocessor, an ARM processor, an x86 processor, a microprocessor without interlocked pipeline stages (MIPS), a graphics processing unit (GPU), a general-purpose GPU, or any other processor configured to execute program commands stored in memory.

[0062] The processor 200 can provide control signals to the camera module 100 for controlling the camera module 100. The control signals can be received by the camera module 100 through the connector 160. For example, the control signals may include enable signals, etc., for controlling the configuration registers or their operation of the first camera 120a, the second camera 120b, and the power management integrated circuit 140.

[0063] The power supply 300 can be a battery or the main power control circuit (main power management integrated circuit) of the imaging device 1000. The power supply voltage (e.g., the external power supply voltage VDDe output from the power supply 300) can be supplied to the power management integrated circuit 140 through connector 160.

[0064] The camera module 100 can be connected to other components of the imaging device 1000 (e.g., power supply 300 and processor 200) via connector 160, and can receive / send signals or voltages via pins 161 of connector 160.

[0065] The power management integrated circuit 140 can generate power voltages VDD1, VDD2, and VDD3 used in the first camera 120a and the second camera 120b based on the external power supply voltage VDDe received from the outside via connector 160, and can provide the generated power voltages VDD1, VDD2, and VDD3 to the first camera 120a and the second camera 120b. In an example embodiment, a third power supply voltage VDD3 can be provided to both the first camera 120a and the second camera 120b. For example, the third power supply voltage VDD3 can be a power supply voltage applied to digital circuitry.

[0066] When the power management integrated circuit 140 is disposed outside the camera module 100 (e.g., on the motherboard 400), the power supply voltages VDD1, VDD2, and VDD3 generated in the power management integrated circuit 140 can be received by the camera module 100 through the connector 160. However, as the path for transmitting the power supply voltages VDD1, VDD2, and VDD3 via it increases and the power supply voltages VDD1, VDD2, and VDD3 are transmitted, noise may be generated in the power supply voltages VDD1, VDD2, and VDD3. However, in another camera module 100 according to an example embodiment, since the power management integrated circuit 140 is included within the camera module 100, the path for transmitting the power supply voltages VDD1, VDD2, and VDD3 via it can be reduced, and the noise can be reduced while transmitting the power supply voltages VDD1, VDD2, and VDD3.

[0067] Figure 5A and Figure 5B This is a cross-sectional view of the camera module according to an example embodiment. Figure 5A and Figure 5B It can be Figure 2A Example of modifying the camera module.

[0068] Reference Figure 5A The power management integrated circuit 140 may be covered by a protective component (e.g., a shield SC), and the TIM may be disposed between the shield SC and the fixing component 130. The TIM may directly contact the upper surface of the shield SC and / or the fixing component 130.

[0069] Reference Figure 5B The radiation film 170 (or radiation sheet) may be attached to the lower surface of the substrate 110 and may extend to the lower surface of the connector 160. The radiation film 170 may include graphite, a copper-containing alloy, etc. However, the exemplary embodiments are not limited thereto. The radiation film 170 may include various materials with strong radiation properties.

[0070] The heat generated in the power management integrated circuit 140 can be dissipated through the fixing member 130, transferred through the substrate 110 to the radiation film 170, and discharged through the radiation film 170.

[0071] Reference Figure 5A and Figure 5B The provided description can be applied to references Figures 1A to 4 The camera module 100 described herein, and camera modules 100a, 100b, 100c, 100d, 100e and 100f according to one or more example embodiments described below.

[0072] Figure 6A This is a front view of the camera module according to an example embodiment, and Figure 6B This is a cross-sectional view of the camera module according to an example embodiment. Figure 6B It can be along Figure 6A The cross-sectional view taken by line B-B'.

[0073] Reference Figure 6A and Figure 6B The camera module 100a may include a substrate 110, a first camera 120a, a second camera 120b, a fixing member 130, a power management integrated circuit 140, a connecting member 150, and a connector 160.

[0074] On substrate 110, power management integrated circuit 140 can be disposed between the first camera 120a and the second camera 120b. TIM can be disposed on the upper surface of power management integrated circuit 140.

[0075] The fixing member 130 may surround each of the first camera 120a and the second camera 120b, and the TIM may be disposed between the power management integrated circuit 140 and a portion of the fixing member 130 (e.g., the portion between the first camera 120a and the second camera 120b). In an example embodiment, the TIM may directly contact the upper surface of the power management integrated circuit 140 and / or a portion of the fixing member 130. In an example embodiment, refer to... Figure 5A The power management integrated circuit 140 can be covered by a protective member, and the TIM can be disposed between the protective member and a portion of the fixing member 130.

[0076] Figure 7A This is a front view of the camera module 100b according to an example embodiment, and Figure 7B This is a cross-sectional view of the camera module according to an example embodiment. Figure 7B It can be along Figure 7A A cross-sectional view taken from line C-C'.

[0077] Reference Figure 7A and Figure 7B The camera module 100b may include a substrate 110, a first camera 120a, a second camera 120b, a fixing member 130, a power management integrated circuit 140, a connecting member 150, and a connector 160.

[0078] The first camera 120a and the second camera 120b can be arranged side by side on the substrate 110, and the connecting member 150 can be connected to the side surface of the substrate 110 (e.g., the side surface opposite to the side surface of the first camera 120a).

[0079] The power management integrated circuit 140 can be disposed on the substrate 110, for example, it can be disposed adjacent to one of the first camera 120a and the second camera 120b, which has a relatively small size. In an example embodiment, such as Figure 7A and Figure 7B As shown, the power management integrated circuit 140 can be configured to be adjacent to the side surface of the substrate 110.

[0080] Figure 8A , Figure 8B , Figure 8C and Figure 8D This is the front view of the camera module according to the example embodiment. Figure 8A , Figure 8B , Figure 8C and Figure 8D The camera modules 100c, 100d, 100e, and 100f can be Figure 2A Example of modification of camera module 100.

[0081] Reference Figure 8AThe camera module 100c may include a substrate 110, a camera 120, a fixing member 130, a power management integrated circuit 140, a connecting member 150, and a connector 160.

[0082] As shown in the figure, a camera 120 and a power management integrated circuit 140 can be disposed on the substrate 110. As described above, ( Figure 2B The TIM can be set between the power management integrated circuit 140 and the fixed component 130.

[0083] Reference Figure 8B The camera module 100d may include a first substrate 110a, a second substrate 110b, a first camera 120a, a second camera 120b, a fixing member 130, a power management integrated circuit 140, a first connecting member 150a, a second connecting member 150b, a first connector 160a, and a second connector 160b.

[0084] The first camera 120a and the power management integrated circuit 140 can be mounted on the first substrate 110a, and the first substrate 110a can be connected to the first connector 160a through the first connecting member 150a.

[0085] The second camera 120b can be mounted on the second substrate 110b, and the second substrate 110b can be connected to the second connector 160b via the second connecting member 150b.

[0086] For example, the first substrate 110a, the first camera 120a, the power management integrated circuit 140, the first connecting member 150a, and the first connector 160a can form a camera module unit, and the second substrate 110b, the second camera 120b, the second connecting member 150b, and the second connector 160b can form another camera module unit.

[0087] The fixing member 130 can be coupled to the first camera 120a and the second camera 120b, and ( Figure 2B The TIM can be set between the power management integrated circuit 140 and the fixed component 130.

[0088] In an example embodiment, a power management integrated circuit separate from the power management integrated circuit 140 mounted on the first substrate 110a may be mounted on the second substrate 110b, and ( Figure 2B The TIM can be set between the power management integrated circuit and the fixed component 130.

[0089] Reference Figure 8CThe camera module 100e may include a first substrate 110a, a second substrate 110b, a first camera 120a, a second camera 120b, a third camera 120c, a fixing member 130, a first power management integrated circuit 140a, a second power management integrated circuit 140b, a first connecting member 150a, a second connecting member 150b, a first connector 160a, and a second connector 160b.

[0090] The first camera 120a, the second camera 120b, and the first power management integrated circuit 140a can be mounted on the first substrate 110a, and the first substrate 110a can be connected to the first connector 160a through the first connecting member 150a.

[0091] The third camera 120c can be mounted on the second substrate 110b, and the second substrate 110b can be connected to the second connector 160b via the second connecting member 150b.

[0092] For example, the first substrate 110a, the first camera 120a, the second camera 120b, the first power management integrated circuit 140a, the first connecting member 150a, and the first connector 160a can form a camera module unit (e.g., a multi-camera module including multiple cameras), and the second substrate 110b, the third camera 120c, the second power management integrated circuit 140b, the second connecting member 150b, and the second connector 160b can form another camera module unit (e.g., a single-camera module including one camera).

[0093] The first camera 120a, the second camera 120b, and the third camera 120c can be arranged side by side on the first substrate 110a and the second substrate 110b, and the fixing member 130 can be coupled to the first camera 120a, the second camera 120b, and the third camera 120c. Figure 2B The TIM can be disposed between the first power management integrated circuit 140a and the fixing member 130 (e.g., a portion of the fixing member 130 stacked on the upper part of the first power management integrated circuit 140a), and furthermore, the TIM can be disposed between the second power management integrated circuit 140b and the fixing member 130 (e.g., another portion of the fixing member 130 stacked on the upper part of the second power management integrated circuit 140b).

[0094] Figure 8D The camera module 100f can be Figure 8C A modified example of camera module 100e is provided. First camera 120a and second camera 120b can be arranged side-by-side, and as shown, third camera 120c can be mounted on first camera 120a and / or second camera 120b. However, the example embodiment is not limited to this, and the layout of camera module 100f can be changed.

[0095] Figure 9A and Figure 9B This is a schematic diagram of a camera module according to an example embodiment.

[0096] Reference Figure 9A The camera module 200a may include a substrate 210, an image sensor 221, a power management integrated circuit 140, a connecting member 150, and a connector 160.

[0097] Image sensor 221 may include a digital block DB and an analog block AB. For example, the digital block DB may include digital circuitry (e.g., logic circuitry, data buffers, etc.), and the analog block AB may include analog circuitry (e.g., amplifiers, digital-to-analog converters, etc. included in the image sensor).

[0098] The first conductor W1 to the fifth conductor W5 can be patterned on the substrate 210. A first power supply voltage VDD1 and a first ground voltage GND1 can be applied to the digital block DB from the power management integrated circuit 140 via the first conductor W1 and the second conductor W2, respectively. For example, the first power supply voltage VDD1 can be a digital power supply voltage, the first ground voltage GND1 can be a digital ground voltage, the first conductor W1 can be a digital power line, and the second conductor W2 can be a digital ground line. A second power supply voltage VDD2 can be applied to the analog block AB from the power management integrated circuit 140 via the third conductor W3. For example, the second power supply voltage VDD2 can be an analog power supply voltage, and the third conductor W3 can be an analog power line.

[0099] The third ground voltage GND3 can be applied externally to the power management integrated circuit 140 via connector 160 and the fifth conductor W5. The third ground voltage GND3 can be a reference ground voltage, and the fifth conductor W5 can be a ground wire. The second ground voltage GND2 (e.g., a simulated ground voltage) can be connected to a point P on the fifth conductor W5 via its fourth conductor W4, which is used to transmit the voltage to the simulation block AB. Therefore, the third ground voltage GND3 from the outside can be applied to the simulation block AB as the second ground voltage GND2 via the fifth conductor W5 and the fourth conductor W4.

[0100] As described above, because the fourth conductor W4 is connected to point P of the fifth conductor W5, ground noise can be prevented from being introduced into the second ground voltage GND2 due to the operation of the power management integrated circuit 140 or the digital block DB.

[0101] Figure 9B The camera module 200b can be Figure 9A A modification example for the camera module 200a. Refer to... Figure 9BThe fourth conductor W4 can be connected to the fifth conductor W5 through a resistor element RZ with zero resistance. For example, the resistor element RZ can include a zero-ohm resistor, a zero-ohm bead, etc.

[0102] In the example embodiment, Figure 9A point P or Figure 9B The resistor element RZ can be positioned adjacent to the power management integrated circuit 140 to reduce the path of introduced noise (i.e., the length of the fourth conductor W4).

[0103] In the example embodiment, Figure 9A point P or Figure 9B The resistor element RZ can be positioned further away from the power management integrated circuit 140. Therefore, although operating noise from the power management integrated circuit 140 is introduced into the fifth conductor W5, noise can be prevented from being introduced into the fourth conductor W4.

[0104] Noise supplied to the second ground voltage GND2 (i.e., the analog ground voltage) of the analog block AB can affect the quality of the image generated in the image sensor 221. When a large amount of noise is introduced into the analog ground voltage, the image quality may degrade. However, as referenced... Figure 9A and Figure 9B In the camera modules 200a and 200b according to the example embodiments, the second ground voltage GND2 is connected to the fifth conductor W5 via the fourth conductor W4 point provided to the analog block AB. Therefore, grounding noise from the digital block DB or the power management integrated circuit 140 can be prevented from being introduced into the second ground voltage GND2. Consequently, the quality of the image generated in the image sensor 221 can be improved.

[0105] Figure 9A and Figure 9B The illustration shows a power management integrated circuit 140 providing a power supply voltage and a ground voltage to an image sensor 221, but the example embodiment is not limited thereto. Camera modules 200a and 200b may include multiple image sensors, and the power management integrated circuit 140 may provide a power supply voltage and a ground voltage to each of the image sensors separately. In this case, as shown in the reference... Figure 9A and Figure 9B The analog ground voltage can be provided to each image sensor through each wire that is point-connected to a conductor (e.g., fifth conductor W5), and a reference ground voltage (e.g., third ground voltage GND3) can be provided from the outside to the power management integrated circuit 140 through the same conductor (e.g., fifth conductor W5).

[0106] Figure 10 This is a schematic diagram of a camera module according to an example embodiment.

[0107] Reference Figure 10 The camera module 200c may include a substrate 210, an image sensor 221, a power management integrated circuit 140, a connecting member 150, and a connector 160.

[0108] Image sensor 221 may include a digital block DB and an analog block AB. For example, the digital block DB may include digital circuitry (e.g., logic circuitry, data buffers, etc.), and the analog block AB may include analog circuitry (e.g., amplifiers, analog-to-digital converters, etc. included in the image sensor).

[0109] The first conductor W1 to the sixth conductor W6 can be patterned on the substrate 210. The first power supply voltage VDD1 and the first ground voltage GND1 can be applied to the digital block DB from the power management integrated circuit 140 through the first conductor W1 and the second conductor W2, respectively. For example, the first power supply voltage VDD1 can be a digital power supply voltage, and the first ground voltage GND1 can be a digital ground voltage.

[0110] The second power supply voltage VDD2 and the second ground voltage GND2 can be applied to the analog block AB from the power management integrated circuit 140 via the third conductor W3 and the fourth conductor W4, respectively. For example, the second power supply voltage VDD2 can be an analog power supply voltage, and the third conductor W3 can be an analog power line. For example, the second power supply voltage VDD2 can be an analog power supply voltage, and the second ground voltage GND2 can be an analog ground voltage.

[0111] A third ground voltage GND3 and a fourth ground voltage GND4 can be provided externally through connector 160, and can be applied to power management integrated circuit 140 through fifth conductor W5 and sixth conductor W6 respectively. Power management integrated circuit 140 can provide the third ground voltage GND3 to digital block DB as first ground voltage GND1, and provide the fourth ground voltage GND4 to analog block AB as second ground voltage GND2.

[0112] As described above, the paths through which digital ground voltage and analog ground voltage are supplied from the outside are separate, thus preventing noise (e.g., noise generated due to the operation of the digital block DB) from being introduced into the analog ground voltage.

[0113] Figure 11 This is a block diagram of an electronic device including a camera module according to an example embodiment. Figure 12 yes Figure 11 Detailed block diagram of the camera module.

[0114] Reference Figure 11The electronic device 1000' may include a camera module group 1100, an application processor 1200, a power management integrated circuit 1300, and an external memory 1400 (or storage).

[0115] Camera module group 1100 may include camera modules 1100a, 1100b, and 1100c. Although the accompanying drawings show three camera modules 1100a, 1100b, and 1100c arranged, the exemplary embodiments are not limited thereto. In some exemplary embodiments, camera module group 1100 may be modified to include only two camera modules. Furthermore, in some exemplary embodiments, camera module group 1100 may be modified to include n camera modules (where n is a natural number equal to or greater than 4).

[0116] Each of camera modules 1100a, 1100b and 1100c may include a camera (or image sensing device), and the camera may include a lens and an image sensor.

[0117] According to reference Figures 1A to 10 The camera module described in the example embodiments can be applied as at least one of camera modules 1100a, 1100b, and 1100c. For example, camera module 1100a may include a power management integrated circuit. In other words, the image sensor and the power management integrated circuit can be mounted on the substrate of camera module 1100a. In the example embodiments, camera module 1100a can be implemented as a multi-camera module in which a first camera and a second camera are mounted on a substrate, and on this substrate, a power management integrated circuit for generating the voltages used in the first and second cameras can be mounted.

[0118] ( Figures 1A to 2B The fixing member 130 can be coupled to the cameras included in camera modules 1100a, 1100b and 1100c, and ( Figure 2B The TIM can be set between the power management integrated circuit and the fixed component of the camera module 1100a.

[0119] In an example embodiment, one of camera modules 1100a, 1100b, and 1100c (e.g., camera module 1100c) may include an optical path folding element (OPFE). Figure 12 (1110). Other camera modules (e.g., camera modules 1100a and 1100b) may be vertical camera modules that do not include the OPFE, but the example embodiments are not limited thereto.

[0120] Reference Figure 12 The detailed structure of the camera module 1100c will be described in detail.

[0121] Reference Figure 12The camera module 1100c may include a prism 1105, an OPFE 1110, an actuator 1130, an image sensing device 1140, and a storage device 1150.

[0122] The prism 1105 may include a reflective surface 1107 with a light-reflecting material and may change the path of light L incident from the outside.

[0123] In the example embodiment, prism 1105 can alter the path of light L incident upon it. For example, prism 1105 can change the path of light L from a first direction X to a second direction Y perpendicular to the first direction X. Furthermore, prism 1105 can rotate the reflective surface 1107 of the light-reflecting material along direction A on its central axis 1106, or it can rotate the central axis 1106 along direction B, thereby changing the path of light L incident along the first direction X to the second direction Y perpendicular to the first direction X. OPFE 1110 can also move along a third direction Z perpendicular to both the first and second directions X and Y.

[0124] In example embodiments, such as Figure 12 As shown, the maximum rotation of prism 1105 can be less than or equal to 15 degrees in the +A direction and greater than 15 degrees in the -A direction. However, the example embodiment is not limited to this.

[0125] In the example embodiment, the prism 1105 can be moved in the +B or -B direction within a range of approximately 20 degrees, between approximately 10 degrees and approximately 20 degrees, or between approximately 15 degrees and approximately 20 degrees.

[0126] In an example embodiment, the prism 1105 can move the reflective surface 1107 of the light-reflecting material in a third direction (e.g., the Z direction) parallel to the extension direction of the central axis 1106.

[0127] OPFE 1110 may include, for example, an optical lens group comprising m lenses (where m is a natural number). The m lenses can be moved along a second direction Y, and can change the optical zoom ratio of camera module 1100c. For example, when the basic optical zoom ratio of camera module 1100c is Z, and when the m optical lenses included in OPFE 1110 are moved, the optical zoom ratio of camera module 1100c can be changed to 3Z, 5Z, or greater.

[0128] Actuator 1130 can move OPFE 1110 or optical lens (hereinafter referred to as optical lens) to a specific position. For example, actuator 1130 can adjust the position of optical lens to allow image sensor 1142 to be within the focal length of optical lens for accurate sensing.

[0129] Image sensing device 1140 may include image sensor 1142, control logic 1144, and memory 1146. Image sensor 1142 can generate image data corresponding to an image of the sensed target by using light L provided through an optical lens.

[0130] Control logic 1144 can control all operations of the third camera module 1100c. For example, control logic 1144 can control the operation of the third camera module 1100c in response to control signals provided via control signal line CSLc.

[0131] The memory 1146 may store information required for operating the third camera module 1100c, such as calibration data 1147. Calibration data 1147 may include information required for the third camera module 1100c to generate image data using externally supplied light L. Calibration data 1147 may include, for example, information about the aforementioned rotation, information about the focal length, information about the optical axis, etc. When the third camera module 1100c is a multi-state camera whose focal length changes according to the position of the optical lens, calibration data 1147 may include the focal length value and information about autofocus at each position (or each state) of the optical lens.

[0132] The memory 1150 can store image data generated by the image sensor 1142. The memory 1150 can be disposed externally to the image sensing device 1140 and can be stacked with the sensor chip forming the image sensing device 1140. In some example embodiments, the memory 1150 can be implemented as an electrically erasable programmable read-only memory (EEPROM), but the example embodiments are not limited thereto.

[0133] Reference Figure 11 and Figure 12 In the example embodiment, camera modules 1100a, 1100b, and 1100c may each include an actuator 1130. Therefore, each of camera modules 1100a, 1100b, and 1100c may include the same or different multiple calibration data 1147 depending on the operation of the actuator 1130 included in each of the camera modules 1100a, 1100b, and 1100c.

[0134] Return to reference Figure 11 One of the camera modules 1100a, 1100b, and 1100c (e.g., camera module 1100a) can be, for example, a vertical depth camera used to extract depth information by using IR light. In this case, the application processor 1200 can merge image data received from the depth camera with image data provided from another camera module (e.g., camera module 1100b or 1100c) to generate a 3D depth image.

[0135] In the example embodiment, at least two of camera modules 1100a, 1100b, and 1100c (e.g., camera modules 1100a and 1100b) may have different fields of view (angles of view). In this case, for example, at least two of camera modules 1100a, 1100b, and 1100c (e.g., camera modules 1100a and 1100b) may have different optical lenses, but the example embodiment is not limited thereto.

[0136] Furthermore, in the example embodiment, camera modules 1100a, 1100b, and 1100c may have different viewing angles. In this case, camera modules 1100a, 1100b, and 1100c may have different optical lenses, but the example embodiment is not limited to this.

[0137] In the example embodiment, camera modules 1100a, 1100b, and 1100c can be physically separated from each other. That is, camera modules 1100a, 1100b, and 1100c do not divide and share the sensing area of ​​an image sensor 1142, but can each include an image sensor 1142.

[0138] Application processor 1200 may include image processor 1210, memory controller 1220, and internal memory 1230. Application processor 1200 may be separate from camera modules 1100a, 1100b, and 1100c. For example, application processor 1200 and camera modules 1100a, 1100b, and 1100c may be implemented as separate semiconductor chips.

[0139] Image processor 1210 may include sub-image processors 1212a, 1212b and 1212c, image generator 1214, and camera module controller 1216.

[0140] The number of sub-image processors 1212a, 1212b and 1212c can correspond to the number of camera modules 1100a, 1100b and 1100c.

[0141] Image data generated by each of camera modules 1100a, 1100b, and 1100c can be provided to the corresponding sub-image processors 1212a, 1212b, and 1212c via image signal lines ISLa, ISLb, and ISLc, which are separate from each other. For example, image data generated from camera module 1100a can be provided to sub-image processor 1212a via image signal line ISLa, image data generated from camera module 1100b can be provided to sub-image processor 1212b via image signal line ISLb, and image data generated from camera module 1100c can be provided to sub-image processor 1212c via image signal line ISLc. Image data transmission can be performed using, for example, a Camera Serial Interface (CSI) based on the Mobile Industry Processor Interface (MIPI), but the example embodiment is not limited thereto.

[0142] In an example embodiment, a sub-image processor can be provided for multiple camera modules. For example, sub-image processors 1212a and 1212c can be integrated into a single sub-image processor. Image data provided from camera modules 1100a and 1100c can be selected by a selection device (e.g., a multiplexer) and then provided to the integrated sub-image processor.

[0143] Image data provided to each of the sub-image processors 1212a, 1212b, and 1212c can be provided to the image generator 1214. The image generator 1214 can generate an output image by using image data provided from each of the sub-image processors 1212a, 1212b, and 1212c, based on image generation information or pattern signals.

[0144] In detail, the image generator 1214 can combine at least some of the image data generated by camera modules 1100a, 1100b, and 1100c with different viewpoints based on image generation information or a mode signal, and then generate an output image. Furthermore, the image generator 1214 can select image data generated from one of the camera modules 1100a, 1100b, and 1100c with different viewpoints based on image generation information or a mode signal, thereby generating an output image.

[0145] In an example embodiment, the image generation information may include a zoom signal or a zoom factor. Furthermore, in an example embodiment, the mode signal may be, for example, a signal based on a mode selected by the user.

[0146] When the image generation information includes a zoom signal (zoom factor) and camera modules 1100a, 1100b, and 1100c have different fields of view (angles of view), the image generator 1214 can perform different operations depending on the type of zoom signal. For example, when the zoom signal is a first signal, after merging the image data output from camera module 1100a and the image data output from camera module 1100c, an output image can be generated using the merged image data, and the image data output from camera module 1100b may not be used during the above data merging. When the zoom signal is a second signal different from the first signal, the image generator 1214 can select any image data output from one of camera modules 1100a, 1100b, and 1100c instead of performing image data merging, and can generate an output image. However, the example embodiment is not limited to this, and the method of processing image data can vary as needed.

[0147] In an example embodiment, image generator 1214 may receive multiple image data with different exposure times from at least one of sub-image processors 1212a, 1212b and 1212c, and may perform high dynamic range (HDR) processing on these image data to generate merged image data with increased dynamic range.

[0148] The camera module controller 1216 can provide control signals to camera modules 1100a, 1100b, and 1100c respectively. The control signals generated from the camera module controller 1216 can be provided to the respective camera modules 1100a, 1100b, and 1100c through separate control signal lines CSLa, CSLb, and CSLc.

[0149] Based on image generation information or mode signals including zoom signals, any one of camera modules 1100a, 1100b, and 1100c (e.g., camera module 1100b) can be designated as the master camera, and other camera modules in camera modules 1100a, 1100b, and 1100c (e.g., camera modules 1100a and 1100c) can be designated as slave cameras. Such information can be included in control signals and can be provided to the respective camera modules 1100a, 1100b, and 1100c via control signal lines CSLa, CSLb, and CSLc, which are separate from each other.

[0150] Depending on the zoom factor or operating mode signal, the camera module used as the master camera and the slave camera can be changed. For example, when the field of view of camera module 1100a is greater than that of camera module 1100b and the zoom factor indicates a low zoom ratio, camera module 1100b can be used as the master camera, and camera module 1100a can be used as the slave camera. Conversely, when the zoom factor indicates a high zoom ratio, camera module 1100a can be used as the master camera, and camera module 1100b can be used as the slave camera.

[0151] In an example embodiment, control signals provided from camera module controller 1216 to each of camera modules 1100a, 1100b, and 1100c may include a synchronization enable signal. For example, when camera module 1100b is the main camera and camera modules 1100a and 1100c are the slave cameras, camera module controller 1216 may transmit a synchronization enable signal to camera module 1100b. Camera module 1100b, receiving the synchronization enable signal, may generate a synchronization signal in response to the received synchronization enable signal and may provide the generated synchronization signal to camera modules 1100a and 1100c via synchronization signal line SSL. Camera modules 1100b, 1100a, and 1100c may transmit image data to application processor 1200 in synchronization with the synchronization signal.

[0152] In an example embodiment, control signals provided from camera module controller 1216 to camera modules 1100a, 1100b, and 1100c may include mode information based on mode signals. Based on the mode information, camera modules 1100a, 1100b, and 1100c may operate in a first operating mode or a second operating mode with respect to sensing speed.

[0153] In the first operating mode, camera modules 1100a, 1100b, and 1100c can generate image signals at a first speed (e.g., generate image signals at a first frame rate), encode the image signals at a second speed greater than the first speed (e.g., encode image signals at a second frame rate greater than the first frame rate), and transmit the encoded image signals to application processor 1200. In this case, the second speed can be, for example, less than or equal to 30 times the first speed.

[0154] Application processor 1200 can store received image signals, or encoded image signals, in internal memory 1230 within application processor 1200 or in external memory 1400 outside application processor 1200. Then, application processor 1200 can read the encoded image signals from internal memory 1230 or external memory 1400 to decode the encoded image signals and can display image data generated based on the decoded image signals. For example, a corresponding sub-image processor 1212a, 1212b, and 1212c of image processor 1210 can perform decoding and image processing on the decoded image signals.

[0155] In the second operating mode, camera modules 1100a, 1100b, and 1100c can generate image signals at a third speed lower than the first speed (e.g., generate image signals at a third frame rate lower than the first frame rate), and can transmit the image signals to application processor 1200. The image signals provided to application processor 1200 can be unencoded signals. Application processor 1200 can perform image processing on the received image signals, or can store the image signals in internal memory 1230 or external memory 1400.

[0156] The power management integrated circuit 1300 can supply power (e.g., supply a power supply voltage) to each of the camera modules 1100a, 1100b, and 1100c. For example, under the control of the application processor 1200, the power management integrated circuit 1300 can supply a first power to camera module 1100a via power signal line PSLa, a second power to camera module 1100b via power signal line PSLb, and a third power to camera module 1100c via power signal line PSLc. As described above, camera module 1100c may include the power management integrated circuit, and the power management integrated circuit can generate a power supply voltage based on the power supply voltage supplied from the power management integrated circuit 1300.

[0157] In response to a power control signal PCON from the application processor 1200, the power management integrated circuit 1300 can generate power corresponding to each of the camera modules 1100a, 1100b, and 1100c, and can adjust the power level. The power control signal PCON can include a power regulation signal for the operating mode of each of the camera modules 1100a, 1100b, and 1100c. For example, the operating mode can include a low-power mode, and in this case, the power control signal PCON can include information about the camera module operating in the low-power mode and the set power level. The power levels of the camera modules 1100a, 1100b, and 1100c can be the same or different from each other. Furthermore, the power level can change dynamically.

[0158] Although various aspects of the exemplary embodiments have been specifically shown and described, it will be understood that various changes in form and detail may be made therein without departing from the spirit and scope of the appended claims.

Claims

1. A camera module, comprising: substrate; A first camera is mounted on the substrate and configured to generate a first image based on a first light signal; A second camera is mounted on the substrate and configured to generate a second image based on a second light signal; A power management integrated circuit is disposed on the substrate and configured to generate multiple voltages based on an external power supply voltage received from an external power source and to provide the multiple voltages to the first camera and the second camera; A metal fixing member, coupled to the first camera and the second camera, is stacked on the power management integrated circuit in a direction perpendicular to the upper surface of the substrate; as well as A thermal interface material is disposed between the power management integrated circuit and the metal fixing member in a direction perpendicular to the upper surface of the substrate. The power management integrated circuit, the thermal interface material, and the metal fixing member overlap each other in a direction perpendicular to the upper surface of the substrate.

2. The camera module according to claim 1, wherein, The thermal interface material is in direct contact with the power management integrated circuit and the metal fixing component.

3. The camera module according to claim 1, wherein, The size of the first camera is smaller than the size of the second camera, and The power management integrated circuit is disposed on the substrate and adjacent to the first camera.

4. The camera module according to claim 1, wherein, The power management integrated circuit is disposed on the substrate between the first camera and the second camera.

5. The camera module according to claim 1, wherein, The power management integrated circuit is disposed inside the shielding cover, and the thermal interface material is disposed on the shielding cover and in direct contact with the shielding cover.

6. The camera module according to claim 1, wherein, The first camera includes: A first lens, configured to collect the first optical signal; and A first image sensor is configured to convert the first optical signal into a first image signal. The second camera includes: A second lens, configured to collect the second optical signal; and A second image sensor is configured to convert the second optical signal into a second image signal, and The first camera and any combination of the second camera further include an actuator configured to move the corresponding lens.

7. The camera module of claim 6 further includes a connector electrically connected to the substrate and configured to receive the external power supply voltage from the external power supply.

8. The camera module of claim 7 further includes a radiation film attached to the lower surface of the substrate and the lower surface of the connector.

9. The camera module according to claim 8, wherein, The substrate includes: A reference ground wire is formed between the power management integrated circuit and the connector; A first grounding wire is formed between the first image sensor and the power management integrated circuit; A second grounding wire extends from the first image sensor and connects to the reference grounding wire at a point; A third grounding wire is formed between the second image sensor and the power management integrated circuit; and A fourth grounding wire extends from the second image sensor and is connected to the point on the reference grounding wire.

10. The camera module according to claim 9, wherein, The second grounding wire is connected to the reference grounding wire via a resistive element with zero resistance.

11. A camera module, comprising: First substrate; A first camera is disposed on the first substrate and configured to generate a first image based on a first light signal; A first power management integrated circuit is disposed on the first substrate and configured to generate a first power supply voltage based on a first external power supply voltage received from an external power source and to provide the first power supply voltage to the first camera; A metal fixing member, coupled to the first camera, is stacked on the first power management integrated circuit in a direction perpendicular to the upper surface of the first substrate; as well as A first thermal interface material is disposed between the first power management integrated circuit and the metal fixing member along a direction perpendicular to the upper surface of the first substrate. The first power management integrated circuit, the first thermal interface material, and the metal fixing member overlap each other in a direction perpendicular to the upper surface of the first substrate.

12. The camera module according to claim 11, further comprising: A connector configured to receive the external power supply; A connecting member that connects between the connector and the first substrate; as well as A radiation film is attached to the lower surface of the first substrate and the lower surface of the connector, and extends from the lower surface of the first substrate to the lower surface of the connector.

13. The camera module of claim 11, further comprising a second camera disposed on the first substrate and configured to generate a second image based on a second optical signal. in, The metal fixing member is coupled to the first camera and the second camera.

14. The camera module according to claim 13, further comprising: The second substrate is separate from the first substrate; as well as A third camera is mounted on the second substrate and configured to generate a third image based on a third optical signal. The metal fixing member is coupled to the first camera, the second camera and the third camera.

15. The camera module according to claim 11, further comprising: The second substrate is separate from the first substrate; as well as A second camera, disposed on the second substrate, is configured to generate a second image based on a second optical signal. The metal fixing member is coupled to the first camera and the second camera.

16. An imaging device, comprising: A first camera module, configured to generate a first image; A power supply configured to provide a power supply voltage to the first camera module; as well as A processor configured to receive the first image from the first camera module. The first camera module includes: substrate; A first camera is mounted on the substrate and includes a first lens and a first image sensor; A connector electrically connected to the substrate and configured to receive the power supply voltage from the power source and transmit the first image to the processor; A power management integrated circuit is disposed on the substrate and configured to generate a plurality of voltages based on the power supply voltage and provide the plurality of voltages to the first image sensor; A metal frame, which surrounds and is coupled to the first camera, and is stacked on the power management integrated circuit in a direction perpendicular to the upper surface of the substrate; and A thermal interface material is disposed between the power management integrated circuit and the metal frame along a direction perpendicular to the upper surface of the substrate. The power management integrated circuit, the thermal interface material, and the metal frame overlap each other in a direction perpendicular to the upper surface of the substrate.

17. The imaging device according to claim 16, wherein, The metal frame is configured to couple the first camera module to the main substrate of the imaging device.

18. The imaging device according to claim 16, wherein, The thermal interface material is in direct contact with the power management integrated circuit and the metal frame.

19. The imaging device according to claim 16, wherein, The first camera module includes a plurality of cameras, each of which is disposed on the substrate and includes a lens and an image sensor.

20. The imaging device according to claim 16, further comprising: Optical path folding element, which is configured to change the path of optical signals; The second lens is configured to collect the refracted light signal refracted by the optical path folding element; as well as The second camera module includes a second image sensor configured to receive collected light signals.

Images