A recovery device, recovery method, and recovery system

Abstract

The application discloses a recovery device, a recovery method and a recovery system, and relates to the technical field of semiconductor device manufacturing. The recovery device ensures continuous recovery of by-products, and improves the efficiency of semiconductor manufacturing. The recovery device comprises a main recovery branch and an auxiliary recovery branch. The main recovery branch is communicated with a processing cavity generating by-products. The auxiliary recovery branch is connected in parallel with the main recovery branch. The application further provides a recovery method and a recovery system using the above recovery device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing technology, and in particular to a recycling apparatus, recycling method and recycling system. Background Technology

[0002] The manufacturing process of semiconductor devices generates some flammable, explosive, and / or toxic byproducts. To avoid pollution and reduce safety hazards, existing technologies typically require the installation of recycling devices in semiconductor manufacturing equipment to recover these byproducts.

[0003] When the recycling unit malfunctions or needs to be replaced, the semiconductor manufacturing equipment that utilizes the aforementioned recycling unit will become unusable. This will reduce the efficiency of semiconductor manufacturing. Summary of the Invention

[0004] The purpose of this invention is to provide a recycling device, recycling method, and recycling system that improves the efficiency of semiconductor manufacturing while ensuring continuous recycling of by-products.

[0005] In a first aspect, the present invention provides a recycling apparatus. The recycling apparatus includes a main recycling branch and an auxiliary recycling branch. The main recycling branch is connected to a process chamber where by-products are generated. The auxiliary recycling branch is connected in parallel with the main recycling branch.

[0006] Compared to existing technologies, the main recovery branch is connected to the process chamber where by-products are generated, allowing these by-products to be recovered through the main recovery branch. Furthermore, an auxiliary recovery branch is connected in parallel with the main recovery branch in the recovery device. In the event of a failure or replacement of the main recovery branch—that is, when the main recovery branch cannot properly recover by-products—the auxiliary recovery branch can continue to recover by-products generated in the process chamber. Therefore, the recovery device provided by this invention can effectively avoid interruptions in the by-product recovery process due to main recovery branch failure or replacement. Based on this, when the recovery device provided by this invention is applied to semiconductor manufacturing equipment, it can recover by-products in real time without interruption. This reduces the pollution and safety hazards of by-products to the working environment and equipment, while also reducing downtime for semiconductor manufacturing equipment, thereby improving semiconductor manufacturing efficiency.

[0007] Secondly, the present invention also provides a recycling method, comprising:

[0008] The byproducts generated in the process chamber should be recovered using at least the main recovery branch included in the recovery unit.

[0009] When the main recovery branch fails, the byproducts generated in the process chamber are recovered using the auxiliary recovery branch.

[0010] Compared with the prior art, the beneficial effects of the recycling method provided in the second aspect can be seen from the beneficial effects of the recycling apparatus described in the implementation of the first aspect.

[0011] Thirdly, the present invention also provides a recycling system, which includes at least one process chamber and at least one recycling device.

[0012] Compared with the prior art, the beneficial effects of the recycling system provided by the third aspect can be seen from the beneficial effects of the recycling device described in the implementation method of the first aspect. Attached Figure Description

[0013] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0014] Figure 1 A schematic diagram of a recycling device provided for related technologies;

[0015] Figure 2 This is a schematic diagram of the structure of a recycling device provided in an embodiment of the present invention;

[0016] Figure 3 A schematic flowchart of a recycling method provided in an embodiment of the present invention;

[0017] Figures 4 to 7 This is a schematic diagram of the structure of the recycling system provided in an embodiment of the present invention.

[0018] in:

[0019] 10-Recovery pipeline, 11-Valve, 12-Recovery chamber, 13-Recovery pump;

[0020] 20 - Process cavity;

[0021] 3-Main recovery branch, 30-First pipeline, 31-First recovery chamber, 32-First recovery pump,

[0022] 33 - First valve; 34 - Second valve;

[0023] 4-Auxiliary recovery branch, 40-Second pipeline, 41-Second recovery chamber, 42-Second recovery pump,

[0024] 43 - Third valve, 44 - Fourth valve. Detailed Implementation

[0025] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0028] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0030] In the manufacturing of semiconductor devices, such as during the formation of films using chemical vapor deposition (CVD), byproducts are generated in the process chambers of the CVD equipment. These byproducts are generally flammable, explosive, and / or toxic. Improper handling of these byproducts can not only pollute the working environment and equipment but also pose safety hazards.

[0031] Figure 1 A schematic diagram of a recycling device provided by related technologies is shown. For example... Figure 1 As shown, the aforementioned recovery device includes a recovery pipeline 10, a valve 11, a recovery chamber 12, and a recovery pump 13. The recovery pipeline 10 can be a hollow pipe structure with an inlet and an outlet. The inlet of the recovery pipeline 10 is connected to the process chamber 20 (which can be a process chamber included in a film-forming device or an etching device, without specific limitation here), used to transport byproducts generated in the process chamber 20. The outlet of the recovery pipeline 10 is connected to the recovery pump 13. Under the action of the recovery pump 13, the byproducts in the process chamber 20 can be smoothly transferred through the recovery pipeline 10 to the byproduct processing device. The byproduct processing device (not shown in the figure) can be used to burn and clean the byproducts. A recovery chamber 12 can also be provided on the recovery pipeline 10 between the process chamber 20 and the recovery pump 13. The recovery chamber 12 can be used to pre-treat the byproducts to prevent them from being directly drawn into the recovery pump 13, causing corrosion or blockage. Of course, valves 11 can be installed on the recovery pipeline 10 between the process chamber 20 and the recovery chamber 12, and on the recovery pipeline 10 between the recovery chamber 12 and the recovery pump 13. In this case, the flow rate from the process chamber 20 to the recovery chamber 12, and from the recovery chamber 12 to the recovery pump 13, can be controlled by adjusting the opening of the valves 11. Based on this, overload of the recovery chamber 12 and / or the recovery pump 13 can be avoided, thereby reducing the frequency of maintenance and replacement of the recovery chamber 12 and / or the recovery pump 13 and improving recovery efficiency.

[0032] In practical applications, it has been found that, for example, the formation of films using chemical vapor deposition processes requires a large amount of gas. The discharge of large quantities of unreacted gases and byproducts can exceed the recovery capacity of the recovery unit. This can lead to malfunctions in the recovery unit, or even its replacement.

[0033] In the event of a malfunction or replacement of the recycling device, the semiconductor manufacturing equipment that uses the recycling device provided by the relevant technology also needs to be shut down, which will reduce the manufacturing efficiency of semiconductor devices.

[0034] To address the aforementioned technical problems, embodiments of the present invention provide a recycling device. Figure 2 A schematic diagram of a recycling device provided in an embodiment of the present invention is shown. Figure 2 As shown, the above-mentioned recycling device includes a main recycling branch 3 and an auxiliary recycling branch 4. The main recycling branch 3 is connected to the process chamber 20 where by-products are generated. The auxiliary recycling branch 4 is connected in parallel with the main recycling branch 3. It should be understood that in practical applications, one main recycling branch 3 can be provided for one process chamber 20, or multiple process chambers 20 can share one main recycling branch 3. Corresponding to the main recycling branch 3, an auxiliary recycling branch 4 connected to the main recycling branch 3 can be arranged in parallel, or multiple auxiliary recycling branches 4 connected to the main recycling branch 3 can be arranged in parallel.

[0035] See Figure 2 The aforementioned recovery device can be applied to film-forming equipment used in chemical vapor deposition processes, or to etching equipment used in plasma etching processes. In this case, the main recovery branch 3 of the recovery device can be connected to the process chamber 20 of the aforementioned equipment. During the film-forming or etching stage, the main recovery branch 3 of the recovery device is activated to recover byproducts generated in the process chamber 20. At this time, the auxiliary recovery branch 4 of the recovery device can be either closed or open. That is, under normal operating conditions, byproducts from the process chamber 20 can be recovered solely using the main recovery branch 3, or simultaneously using both the main recovery branch 3 and the auxiliary recovery branch 4. Alternatively, byproducts from the process chamber 20 can be recovered solely using the auxiliary recovery branch 4. When the main recovery branch 3 malfunctions or needs replacement, the auxiliary recovery branch 4 is activated when it is closed, and remains open when it is already open. At this point, the byproducts from the process chamber 20 are recovered using the auxiliary recovery branch 4.

[0036] See Figure 2 Compared to existing technologies, the main recovery branch 3 is connected to the process chamber 20 where by-products are generated, allowing the by-products generated in the process chamber 20 to be recovered using the main recovery branch 3. Furthermore, an auxiliary recovery branch 4 connected to the main recovery branch 3 is provided in the recovery device. In the event of a failure or need for replacement of the main recovery branch 3, the auxiliary recovery branch 4 can be used to continue recovering the by-products generated in the process chamber 20. Therefore, interruptions in the recovery process due to a failure or replacement of the main recovery branch 3 can be avoided. Based on this, when the recovery device provided by this invention is applied to semiconductor manufacturing equipment, it can recover by-products in real time without interruption. This reduces pollution and safety hazards caused by by-products to the working environment and equipment, while also reducing downtime of semiconductor manufacturing equipment, thereby improving the efficiency of semiconductor manufacturing.

[0037] See Figure 2 The aforementioned main recovery branch 3 may include a first pipeline 30, a first recovery chamber 31, and a first recovery pump 32. The first pipeline 30 has an inlet and an outlet. The inlet of the first pipeline 30 is connected to the process chamber 20. The outlet of the first pipeline 30 is connected to the first recovery pump 32. The first recovery chamber 31 is disposed on the first pipeline 30 between the process chamber 20 and the first recovery pump 32.

[0038] See Figure 2The aforementioned first pipeline 30 can be a hollow tube structure with an inlet and an outlet, serving as a transport channel for by-products. Since the by-products from the process chamber 20 possess a certain degree of corrosiveness and pressure, the first pipeline 30 can be a hollow tube made of a material with certain corrosion and pressure resistance. The diameter, wall thickness, and length of the hollow tube can be selected based on actual conditions and are not specifically limited here.

[0039] See Figure 2 The connection method between the inlet of the first pipeline 30 and the process chamber 20, and the connection method between the outlet of the first pipeline 30 and the first recovery pump 32, can be varied. For example, a flange can be used to connect the inlet of the first pipeline 30 to the outlet of the process chamber 20, and similarly, a flange can be used to connect the outlet of the first pipeline 30 to the inlet of the first recovery pump 32. Alternatively, a socket joint can be used to connect the inlet of the first pipeline 30 to the outlet of the process chamber 20, and similarly, a socket joint can be used to connect the outlet of the first pipeline 30 to the inlet of the first recovery pump 32. Of course, to ensure the sealing of the connection points, sealing rings or similar devices can be added.

[0040] See Figure 2 The aforementioned first recovery chamber 31 is used to pre-treat byproducts from the process chamber 20. For example, if the byproducts output from the process chamber 20 are at high temperatures, a first recovery chamber 31 with a cooling function can be provided. When the byproducts are gaseous at high temperatures and become solid or liquid after cooling, the cooling effect of the first recovery chamber 31 can be used to cool the gaseous byproducts into solid or liquid states. At this time, the solid or liquid byproducts can remain in the first recovery chamber 31 and then be discharged from the first recovery chamber 31. However, if the byproducts cooled to solid or liquid states during the transmission process directly enter the first recovery pump 32, it will cause corrosion or blockage of the first recovery pump 32, or even render it unusable. If the first recovery pump 32 stops working due to corrosion or blockage, the byproducts in the first pipeline 30 will flow back into the process chamber 20, causing contamination to the process chamber 20. Based on this, the first recovery chamber 31 can effectively prevent the first recovery pump 32 from being corroded or blocked, thus avoiding contamination of the process chamber 20 caused by the backflow of byproducts.

[0041] See Figure 2 The aforementioned first recovery pump 32 is used to draw byproducts from the process chamber 20 through the first pipeline 30 and the first recovery chamber 31 provided on the first pipeline 30 into the first recovery pump 32. Of course, the outlet of the first recovery pump 32 can be connected to a byproduct processing device (not shown in the figure) to continue transporting the byproducts to the byproduct processing device. The byproduct processing device can perform combustion and cleaning treatment on the byproducts.

[0042] See Figure 2A first valve 33 can be installed on the first pipeline 30 between the process chamber 20 and the first recovery chamber 31, and a second valve 34 can be installed on the first pipeline 30 between the first recovery chamber 31 and the first recovery pump 32. In this case, the flow rate from the process chamber 20 to the first recovery chamber 31 can be controlled by adjusting the opening of the first valve 33, and the flow rate from the first recovery chamber 31 to the first recovery pump 32 can be controlled by adjusting the opening of the second valve 34. Based on this, overload of the first recovery chamber 31 and / or the first recovery pump 32 can be avoided, thereby reducing the frequency of maintenance and replacement of the first recovery chamber 31 and / or the first recovery pump 32 and improving recovery efficiency. The number of the first valve 33 and the second valve 34 can be set according to actual needs and is not limited here.

[0043] See Figure 2 The structure of the auxiliary recovery branch 4 can be the same as that of the main recovery branch 3. That is, the auxiliary recovery branch 4 may include a second pipeline 40, a second recovery chamber 41, and a second recovery pump 42. The second pipeline 40 has an inlet and an outlet. The inlet of the second pipeline 40 communicates with the first pipeline 30 between the process chamber 20 and the first recovery chamber 31. The outlet of the second pipeline 40 communicates with the second recovery pump 42. The second recovery chamber 41 is located on the second pipeline 40 between the process chamber 20 and the second recovery pump 42.

[0044] See Figure 2 The specific structure and function of the second pipeline 40, the second recovery chamber 41 and the second recovery pump 42 included in the auxiliary recovery branch 4 can be found in the specific structure and function of the first pipeline 30, the first recovery chamber 31 and the first recovery pump 32 included in the main recovery branch 3, and will not be repeated here.

[0045] See Figure 2 A third valve 43 and / or a fourth valve 44 can also be installed on the aforementioned auxiliary recovery branch 4. That is, a third valve 43 can be installed on the second pipeline 40 between the process chamber 20 and the second recovery chamber 41, and a fourth valve 44 can be installed on the second pipeline 40 between the second recovery chamber 41 and the second recovery pump 42. Alternatively, a third valve 43 can be installed only on the second pipeline 40 between the process chamber 20 and the second recovery chamber 41. Or, a fourth valve 44 can be installed only on the second pipeline 40 between the second recovery chamber 41 and the second recovery pump 42. The number of third valves 43 and fourth valves 44 can be set according to specific needs. For example, two third valves 43 can be installed on the second pipeline 40 between the process chamber 20 and the second recovery chamber 41, and one fourth valve 44 can be installed on the second pipeline 40 between the second recovery chamber 41 and the second recovery pump 42.

[0046] See Figure 2The functions of the third valve 43 and the fourth valve 44 in the auxiliary recovery branch 4 are the same as those of the first valve 33 and the second valve 34 in the main recovery branch 3, and will not be repeated here.

[0047] This invention also provides a recycling method. Figure 3 A schematic flowchart of a recycling method provided by an embodiment of the present invention is shown. Figure 3 As shown, the recycling method includes:

[0048] At least the main recovery branch included in the recovery device should be used to recover byproducts generated in the process chamber. That is, when the recovery device is in normal operation, only the main recovery branch can be activated to recover byproducts generated in the process chamber. Alternatively, both the main recovery branch and the auxiliary recovery branch can be activated simultaneously, in which case both are used to recover byproducts generated in the process chamber. Of course, only the auxiliary recovery branch can be activated to recover byproducts generated in the process chamber; in this case, the auxiliary recovery branch can be used as the main recovery branch, and vice versa.

[0049] When the main recovery branch fails, the auxiliary recovery branch is used to recover byproducts generated in the process chamber. That is, when the recovery unit is operating normally, it only uses the main recovery branch to recover byproducts generated in the process chamber; if the main recovery branch fails, the auxiliary recovery branch is activated to recover byproducts generated in the process chamber. Alternatively, when the recovery unit is operating normally, it uses both the main and auxiliary recovery branches to recover byproducts generated in the process chamber; if the main recovery branch fails, the auxiliary recovery branch remains open to recover byproducts generated in the process chamber. Finally, when the recovery unit is operating normally, it only uses the auxiliary recovery branch to recover byproducts generated in the process chamber; if the auxiliary recovery branch fails, the auxiliary recovery branch is closed, and the main recovery branch is activated to recover byproducts generated in the process chamber.

[0050] The recycling method and the recycling device provided in this embodiment of the invention have the same beneficial effects, and will not be described again here.

[0051] This invention also provides a recycling system. The recycling system includes at least one process chamber and at least one recycling device.

[0052] To facilitate understanding of the recycling system provided in the embodiments of the present invention, several specific examples will be provided below. It should be understood that the following examples are for illustrative purposes only and are not intended to be limiting.

[0053] See Figure 2As an example, the recycling system includes a process chamber 20 and a recycling device, which includes a main recycling branch 3 and an auxiliary recycling branch 4 connected in parallel with the main recycling branch 3.

[0054] See Figure 4 As a second example, the recycling system includes four process chambers 20, each of which is independently equipped with a recycling device.

[0055] See Figure 5 As a third example, the recycling system includes two process chambers 20, each of which has an independent main recycling branch 3, and the two process chambers 20 share an auxiliary recycling branch 4. In this case, the second pipeline 40, the second recycling pump 42, and the second recycling chamber 41 located between the two process chambers 20 and the second recycling pump 42 included in the auxiliary recycling branch 4 are all shared.

[0056] See Figure 6 As a fourth example, the recycling system includes four process chambers 20, each with an independent main recycling branch 3. Adjacent process chambers 20 share an auxiliary recycling branch 4. For example, the process chambers 20 can be defined from left to right as a first process chamber, a second process chamber, a third process chamber, and a fourth process chamber. The first and second process chambers share an auxiliary recycling branch 4. In this case, the second pipeline 40, the second recycling pump 42, and the second recycling chamber 41 located between the (first and second) process chambers 20 and the second recycling pump 42, all included in the auxiliary recycling branch 4, are shared. The third and fourth process chambers share another auxiliary recycling branch 4. In this case, the second pipeline 40, the second recycling pump 42, and the second recycling chamber 41 located between the (third and fourth) process chambers 20 and the second recycling pump 42, also share the auxiliary recycling branch 4.

[0057] See Figure 7 As a fifth example, the recycling system includes four process chambers 20, each of which has an independent main recycling branch 3. The four process chambers 20 share an auxiliary recycling branch 4. In this case, the second pipeline 40, the second recycling pump 42, and the second recycling chamber 41 located between the four process chambers 20 and the second recycling pump 42 in the auxiliary recycling branch 4 are all shared.

[0058] The recycling system provided in this embodiment of the invention has the same beneficial effects as the recycling device provided in this embodiment of the invention, and will not be described again here.

[0059] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A recycling device, applied to semiconductor manufacturing equipment, characterized in that, The recycling device includes a main recycling branch and an auxiliary recycling branch; The main recovery branch is connected to the process chamber where by-products are generated. The auxiliary recovery branch has the same structure as the main recovery branch. The main recovery branch includes a first pipeline, a first recovery chamber, and a first recovery pump. The first pipeline has an inlet and an outlet. The inlet of the first pipeline is connected to the process chamber, and the outlet of the first pipeline is connected to the first recovery pump. The first recovery chamber is located on the first pipeline between the process chamber and the first recovery pump. The first recovery chamber is used to pre-treat the by-products generated in the process chamber. The main recovery branch is activated during the film formation stage or the etching stage to recover the by-products generated in the process chamber. The auxiliary recovery branch is connected in parallel with the main recovery branch. The auxiliary recovery branch is activated when the main recovery branch fails or needs to be replaced to continue recovering the by-products from the process chamber. The auxiliary recovery branch includes a second pipeline, a second recovery chamber, and a second recovery pump, wherein the second pipeline has an inlet and an outlet; The inlet of the second pipeline is connected to the first pipeline between the process chamber and the first recovery chamber; The outlet of the second pipeline is connected to the second recovery pump; The second recovery chamber is disposed on the second pipeline between the process chamber and the second recovery pump.

2. The recycling device according to claim 1, characterized in that, A first valve is installed on the pipeline between the process chamber and the first recovery chamber; and / or, A second valve is installed on the pipeline between the first recovery chamber and the first recovery pump.

3. The recycling device according to claim 2, characterized in that, A third valve is installed on the second pipeline between the process chamber and the second recovery chamber; and / or, A fourth valve is installed on the second pipeline between the second recovery chamber and the second recovery pump.

4. A recycling method, characterized in that, The recycling apparatus applicable to any one of claims 1-3, the recycling method comprising: At least the byproducts generated in the process chamber are recovered using the main recovery branch included in the recovery unit; When the main recovery branch fails, the byproducts generated in the process chamber are recovered using the auxiliary recovery branch.

5. A recycling system, characterized in that, The recycling system includes at least one process chamber and at least one recycling device as described in any one of claims 1 to 3.

6. The recycling system according to claim 5, characterized in that, The recycling system includes at least two process chambers, each of which is independently equipped with a recycling device.

7. The recycling system according to claim 5, characterized in that, The recycling system includes at least two process chambers, wherein the outlets of the second pipelines configured in the at least two process chambers are common and connected to a common second recycling pump.

8. The recycling system according to claim 7, characterized in that, A common second recovery chamber is provided on a common second pipeline between at least two of the process chambers and the common second recovery pump.

Images