processing device

Abstract

The present application provides a processing device which easily performs the work of sticking a tape on the back surface of a wafer having a reinforcing portion formed on the back surface to integrate the wafer and a frame, and cutting the reinforcing portion to remove it from the wafer. The processing device includes: a wafer carrying-out mechanism which carries out the wafer; a wafer stage which supports the wafer; a frame carrying-out mechanism which carries out the frame; a frame stage which supports the frame; a tape sticking mechanism which sticks the tape on the frame; a frame-with-tape carrying mechanism which carries the frame with the tape to the wafer stage; a tape pressing mechanism which presses the tape of the frame with the tape on the back surface of the wafer; a frame unit carrying-out mechanism which carries out the frame unit in which the tape of the frame with the tape and the back surface of the wafer are pressed from the wafer stage; a reinforcing portion removing mechanism which cuts and removes the annular reinforcing portion from the wafer of the frame unit; a frame unit without ring carrying-out mechanism which carries out the frame unit without the ring from the reinforcing portion removing mechanism; and a frame cassette stage which loads the frame cassette in which the frame unit without the ring is accommodated.

Description

Technical Field

[0001] The present invention relates to a processing apparatus for removing a convex reinforcing portion from a wafer having a convex annular reinforcing portion formed in the outer peripheral region on the back side. Background Technology

[0002] After a wafer with multiple devices such as ICs and LSIs formed on the front side is divided into device areas by predetermined lines and the remaining area around the device areas is ground on the back side to form the desired thickness, it is divided into individual device chips by a cutting device and a laser processing device. The divided device chips are used in electronic devices such as mobile phones and personal computers.

[0003] To facilitate the transport of the ground wafer, the applicant has proposed the following technique: after performing a prescribed process on the back side corresponding to the remaining peripheral area, a tape (dicing tape) is attached to the back side of the wafer, and the wafer is supported by a frame to remove the annular reinforcement from the wafer (see, for example, Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Publication No. 2010-62375

[0005] However, the following problems exist: it is difficult to attach tape to the back of a wafer with a convex ring-shaped reinforcement on the back corresponding to the remaining peripheral area to make the wafer and the frame an integral unit; it is also difficult to cut the ring-shaped reinforcement and remove it from the wafer, resulting in poor productivity. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide a processing apparatus that facilitates the bonding of a tape to the back surface of a wafer on which an annular reinforcing portion is formed in a convex shape corresponding to the remaining peripheral area, thereby making the wafer and the frame integral, and facilitates the cutting and removal of the annular reinforcing portion from the wafer.

[0007] According to one aspect of the present invention, a processing apparatus is provided for removing a convex reinforcing portion from a wafer on a back surface corresponding to a peripheral remaining area, wherein the processing apparatus comprises: a wafer cassette stage for holding a wafer cassette containing a plurality of wafers; a wafer removal mechanism for removing wafers from the wafer cassette stage; a wafer stage for supporting the front side of the wafer removed by the wafer removal mechanism; a frame holder for holding a plurality of annular frames having openings for holding wafers; a frame removal mechanism for removing frames from the frame holder; a frame stage for supporting the frames removed by the frame removal mechanism; and a tape attaching mechanism disposed above the frame stage for attaching tape to the frames. The device includes: a frame conveying mechanism that transports a frame with a attached strap to the wafer stage and positions the opening of the frame against the back of the wafer supported by the wafer stage, thereby placing the frame with the strap on the wafer stage; a strap pressing mechanism that presses the strap with the frame onto the back of the wafer; a frame unit removal mechanism that removes the frame unit from the wafer stage after the strap with the frame has been pressed against the back of the wafer by the strap pressing mechanism; a reinforcement removal mechanism that cuts off and removes the annular reinforcement from the wafer of the frame unit removed by the frame unit removal mechanism; a ringless unit removal mechanism that removes the ringless unit from the reinforcement removal mechanism; and a frame box stage that holds a frame box that houses the ringless unit removed by the ringless unit removal mechanism.

[0008] Preferably, the wafer removal mechanism has a conveying arm and a hand, the hand being disposed at the front end of the conveying arm to support the back side of the wafer stored in the wafer cassette and to flip the front and back sides of the wafer.

[0009] Alternatively, the preferred hand is a Bernoulli pad that supports the wafer in a non-contact manner by generating negative pressure through air ejection.

[0010] In addition, the wafer stage preferably has: an annular support portion that supports the remaining outer periphery of the wafer and does not contact the portion that is inside the remaining outer periphery; and a frame support portion disposed on the outer periphery of the annular support portion to support the frame.

[0011] In addition, the tape pasting mechanism preferably includes: a tape support portion that supports a tape wound with a tape to be used; a tape winding portion that winds a used tape; a tape pull-out portion that pulls the tape out of the tape; a crimping portion that crimps the pulled-out tape onto a frame; and a cutting portion that cuts the tape protruding to the outer periphery of the frame along the frame.

[0012] Furthermore, the preferred tape pressing mechanism includes: an upper chamber disposed above the wafer stage; a lower chamber housing the wafer stage; a lifting mechanism that raises and lowers the upper chamber to create a closed state where the upper chamber contacts the lower chamber and an open state where the upper chamber separates from the lower chamber; a vacuum section that creates a vacuum in the upper and lower chambers during the closed state; and an atmospheric opening section that opens the upper and lower chambers to the atmosphere. When the framed tape is positioned on the back side of the wafer supported by the wafer stage, the lifting mechanism is activated to maintain the closed state and create a vacuum in the upper and lower chambers, and the framed tape is pressed onto the back side of the wafer using a pressing roller disposed in the upper chamber.

[0013] In addition, the frame unit removal mechanism preferably includes: a frame unit holding section, which includes a wafer holding section for holding the wafer and a frame holding section for holding the frame; and a transport section that transports the frame unit holding section to a temporary stage.

[0014] In addition, the frame unit removal mechanism preferably includes: a two-dimensional moving mechanism that moves the frame unit holding part two-dimensionally in the horizontal direction; and an imaging part that takes pictures of the outer periphery of the wafer of the frame unit held by the frame unit holding part, so that the two-dimensional moving mechanism is activated and the imaging part takes pictures of at least three parts of the outer periphery of the wafer to determine the center coordinates of the wafer, so that the center of the wafer is consistent with the center of the temporary stage.

[0015] Preferably, the reinforcement removal mechanism includes: a laser beam irradiation unit that irradiates a laser beam toward the base of the annular reinforcement formed on the outer periphery of the wafer to form a cutting groove; a first lifting platform that holds and raises a frame unit temporarily placed on the platform and positions the frame unit at the laser beam irradiation unit; and a separation section that separates the annular reinforcement from the cutting groove, the separation section including: an ultraviolet irradiation section that irradiates ultraviolet light onto the strip corresponding to the cutting groove to reduce the adhesive force of the strip; a second lifting platform that exposes the annular reinforcement to the outer periphery to attract and hold the inner side of the wafer and supports the frame; a separator that acts on the outer periphery of the annular reinforcement to separate the annular reinforcement; and a discard section that discards the separated annular reinforcement. The first lifting platform temporarily places the frame unit with the cutting groove on the platform, the platform is positioned at the separation section by the platform conveyor, and the second lifting platform supports the frame unit temporarily placed on the platform.

[0016] In addition, the temporary platform preferably has a heater, and the first lifting platform holds the frame unit, in which the belt is heated by the heater and is tightly attached to the base of the annular reinforcement, from the temporary platform.

[0017] In addition, the temporary stage preferably has: an annular support portion that supports the remaining area of ​​the outer periphery of the wafer and does not contact the portion that is inside the remaining area of ​​the outer periphery; and a frame support portion disposed on the outer periphery of the annular support portion to support the frame.

[0018] In addition, the acyclic unit removal mechanism preferably includes: a flipping mechanism having a frame holding portion that faces the acyclic unit supported by the second lifting platform and holds the frame, the flipping mechanism moving toward the frame box stage and flipping the frame holding portion; an acyclic unit support portion that supports the acyclic unit with the wafer face up after being flipped by the flipping mechanism; and a pushing portion that allows the acyclic unit supported by the acyclic unit support portion to enter the frame box placed on the frame box stage for storage.

[0019] According to one aspect of the processing apparatus, it is easy to perform the operation of attaching tape to the back side of a wafer in which an annular reinforcing portion is formed in a convex shape on the back side corresponding to the remaining peripheral area, thereby making the wafer and the frame integral, and it is easy to cut off the annular reinforcing portion and remove it from the wafer, resulting in good productivity. Attached Figure Description

[0020] Figure 1 This is a perspective view of the processing apparatus of this embodiment.

[0021] Figure 2 Through Figure 1 A perspective view of the wafer being processed by the processing apparatus shown.

[0022] Figure 3 yes Figure 1 A three-dimensional view of the wafer cassette, etc. shown.

[0023] Figure 4 yes Figure 1 The image shown is a three-dimensional representation of the hand.

[0024] Figure 5 yes Figure 1 A three-dimensional view of the frame organizer, etc. shown.

[0025] Figure 6 (a) is Figure 1 The diagram shown is a perspective view of the frame platform in its lowered position, including the adhesive mechanism and other components. Figure 6 (b) is Figure 1 The diagram shows a perspective view of the frame platform in its raised position, including the adhesive mechanism and other components.

[0026] Figure 7 yes Figure 1 The exploded perspective view shown is of the crimping mechanism.

[0027] Figure 8This is a cross-sectional view showing the state of the belt being pressed by the pressing rollers at the beginning of the belt crimping process.

[0028] Figure 9 This is a cross-sectional view showing the state of the belt after the pressing roller has finished pressing the belt during the belt pressing process.

[0029] Figure 10 yes Figure 1 A perspective view of the reinforcement removal mechanism shown.

[0030] Figure 11 This is a schematic diagram showing the state of irradiating the base of the wafer with a laser beam during the reinforcement removal process.

[0031] Figure 12 yes Figure 1 A perspective view of the first lifting platform of the reinforcement removal mechanism shown.

[0032] Figure 13 yes Figure 1 A perspective view of the separation section of the reinforcement removal mechanism shown.

[0033] Figure 14 This is a schematic diagram showing the state of the reinforcement being separated from the wafer during the reinforcement removal process.

[0034] Figure 15 yes Figure 1 A perspective view of the waste section of the reinforcement removal mechanism shown.

[0035] Figure 16 yes Figure 1 A perspective view of the flipping mechanism of the acyclic unit removal mechanism shown.

[0036] Figure 17 yes Figure 1 A perspective view of the acyclic unit support and push-in portion of the acyclic unit transfer mechanism shown.

[0037] Figure 18 This is a three-dimensional view showing the state of the acyclic unit storage process.

[0038] Label Explanation

[0039] 2: Processing apparatus; 4: Wafer; 4a: Front side of wafer; 4b: Back side of wafer; 6: Wafer cassette; 8: Wafer cassette stage; 10: Wafer removal mechanism; 12: Wafer stage; 20: Remaining peripheral area; 24: Reinforcing section; 56: Annular support section (wafer stage); 58: Frame support section (wafer stage); 64: Frame; 64a: Opening; 64': Frame with strap; 66: Frame receiver; 68: Frame removal mechanism; 70: Frame stage; 96: Strap; 96R: Strap winding; 98: Strap pasting mechanism; 100: Strap frame conveying mechanism; 102: Strap crimping mechanism; 104: Strap winding support section; 106: Strap winding section; 108: Strap pulling section; 110: Crimping section; 112: Cutting section; 160: Upper chamber; 162: Lower chamber; 164: Lifting mechanism; 1 66: Vacuum section; 168: Atmosphere opening section; 192: Frame unit removal mechanism; 194: Reinforcement removal mechanism; 196: Acyclic unit removal mechanism; 198: Frame box; 200: Frame box stage; 202: Frame unit holding section; 202a: Wafer holding section; 202b: Frame holding section; 204: Temporary stage; 206: Transport section; 224: Imaging section; 232: Temporary stage transport section; 244: Laser beam irradiation unit; 246: First lifting stage; 248: Separation section; 256: Cutting groove; 270: Ultraviolet irradiation section; 272: Second lifting stage; 274: Separator; 276: Waste section; 306: Frame holding section; 308: Flipping mechanism; 310: Acyclic unit support section; 312: Push-in section; U: Frame unit; U': Acyclic unit. Detailed Implementation

[0040] Hereinafter, an embodiment of one aspect of the present invention will be described with reference to the accompanying drawings.

[0041] Reference Figure 1 The processing apparatus, indicated by reference numeral 2, includes: a wafer cassette stage 8 which holds a wafer cassette 6 containing a plurality of wafers; a wafer removal mechanism 10 which removes wafers from the wafer cassette 6 placed on the wafer cassette stage 8; and a wafer stage 12 which supports the front side of the wafers removed by the wafer removal mechanism 10.

[0042] Figure 2 A wafer 4 processed by the processing apparatus 2 is shown. On the front side 4a of the wafer 4, multiple devices 14, such as ICs and LSIs, are formed in device regions 18 divided by grid-like predetermined dividing lines 16, and a remaining peripheral region 20 surrounding the device regions 18. Figure 2For convenience, a double-dotted line is used to represent the boundary 22 between the device region 18 and the peripheral remaining region 20, but in reality, there is no line representing the boundary 22. On the back side 4b of the wafer 4, a convex annular reinforcement 24 is formed in the peripheral remaining region 20, and the thickness of the peripheral remaining region 20 is greater than the thickness of the device region 18. In addition, a notch 26 indicating crystal orientation is formed at the periphery of the wafer 4.

[0043] like Figure 3 As shown, with the front side 4a facing upwards, multiple wafers 4 are spaced apart in the wafer cassette 6 along the vertical direction. The wafer cassette stage 8 of the illustrated embodiment includes: a top plate 28 on which the wafer cassette 6 is placed; and a support plate 30 that supports the top plate 28. In addition, the top plate 28 can be raised and lowered freely, and a lifting mechanism is provided to raise and lower the top plate 28 to position it at any height.

[0044] Reference Figure 3 Continuing the explanation, the wafer removal mechanism 10 has: a Y-axis movable component 32, which in Figure 3 The movable part 32 is freely movable in the Y-axis direction indicated by the middle arrow Y; and a Y-axis feed mechanism 34, which moves the Y-axis movable part 32 along the Y-axis direction. The Y-axis feed mechanism 34 includes: a ball screw 36, which is connected to the lower end of the Y-axis movable part 32 and extends along the Y-axis direction; and a motor 38, which rotates the ball screw 36. The Y-axis feed mechanism 34 converts the rotational motion of the motor 38 into linear motion and transmits it to the Y-axis movable part 32 via the ball screw 36, causing the Y-axis movable part 32 to move along a pair of guide rails 40 extending in the Y-axis direction. In addition, Figure 3 The X-axis direction indicated by the middle arrow X is perpendicular to the Y-axis direction. Figure 3 The Z-axis, indicated by the middle arrow Z, is a vertical direction perpendicular to both the X-axis and Y-axis. The XY plane defined by the X-axis and Y-axis is essentially horizontal.

[0045] like Figure 3 As shown, the wafer unloading mechanism 10 of the illustrated embodiment includes: a conveying arm 42; and a hand 44 disposed at the front end of the conveying arm 42, which supports the back side 4b of the wafer 4 housed in the wafer cassette 6, causing the front and back sides of the wafer 4 to flip. The conveying arm 42 is disposed on the upper surface of the Y-axis movable member 32 and is driven by a suitable drive source (not shown) such as an air drive source or an electric drive source. This drive source drives the conveying arm 42, positioning the hand 44 at arbitrary positions in various directions of the X-axis, Y-axis, and Z-axis, and causing the hand 44 to flip up and down.

[0046] Reference Figure 4To illustrate, the preferred hand portion 44 is a Bernoulli pad that supports the wafer 4 in a non-contact manner by generating negative pressure through air ejection. In the illustrated embodiment, the hand portion 44 is generally C-shaped, with multiple air outlets 46 formed on one surface of the hand portion 44, connected to a compressed air supply source (not shown). Multiple guide pins 48 are circumferentially spaced along the outer periphery of the hand portion 44. Each guide pin 48 is configured to move freely in the radial direction of the hand portion 44.

[0047] like Figure 3 and Figure 4 As shown, after positioning the hand part 44 on the back side 4b (lower side) of the wafer 4 placed in the wafer cassette 6 of the wafer stage 8, the wafer removal mechanism 10 ejects compressed air from the air outlet 46 of the hand part 44 to generate a negative pressure on one side of the hand part 44 using the Bernoulli effect, thereby attracting and supporting the wafer 4 from the back side 4b side through the hand part 44 in a non-contact manner. The horizontal movement of the wafer 4 attracted and supported by the hand part 44 is restricted by the guide pins 48. Then, the wafer removal mechanism 10 moves the Y-axis movable member 32 and the conveying arm 42 to remove the wafer 4 attracted and supported by the hand part 44 from the wafer cassette 6.

[0048] like Figure 4 As shown, the wafer unloading mechanism 10 of the illustrated embodiment has a cut detection unit 50 for detecting the position of the cut 26 on the wafer 4. The cut detection unit 50 may be, for example, a structure comprising a light-emitting element 52 and a light-receiving element 54 arranged spaced apart from each other in the vertical direction, and a drive source (not shown) for rotating at least one of the guide pins 48 of the hand 44.

[0049] The light-emitting element 52 and the light-receiving element 54 can be attached to the Y-axis movable member 32 or the transport path by means of a suitable bracket (not shown). Furthermore, when the guide pin 48 rotates via the aforementioned drive source, the wafer 4, which is held by the hand 44, rotates due to the rotation of the guide pin 48. To ensure reliable transmission of rotation from the guide pin 48 to the wafer 4, it is preferable that the outer peripheral surface of the guide pin 48, which rotates via the drive source, is formed of a suitable synthetic rubber.

[0050] With the wafer 4 held in place by the hand 44 and its outer periphery positioned between the light-emitting element 52 and the light-receiving element 54, the cut detection unit 50 rotates the wafer 4 via the guide pin 48 using a drive source, thereby detecting the position of the cut 26. This allows the orientation of the wafer 4 to be adjusted to any desired orientation.

[0051] like Figure 3As shown, the wafer stage 12 is arranged adjacent to the wafer unloading mechanism 10. The wafer stage 12 of the illustrated embodiment includes: an annular support portion 56 that supports the remaining outer periphery region 20 of the wafer 4 and does not contact the portion further inward than the remaining outer periphery region 20; and a frame support portion 58 disposed around the annular support portion 56, supporting the frame 64 (described later) Figure 5 The annular support portion 56 is supported by a plurality of suction holes 60 arranged at circumferential intervals on its upper surface. Each suction hole 60 is connected to a suction source (not shown) such as a vacuum pump. The portion of the wafer stage 12 that is radially inward from the annular support portion 56 forms a downwardly recessed circular recess 62.

[0052] When the hand 44 is rotated 180° to flip the front and back sides of the wafer 4, and the wafer 4 is placed on the wafer stage 12 with the front side 4a facing down, the remaining peripheral region 20 of the wafer 4 is supported by the annular support portion 56, and the device region 18 of the wafer 4 is located in the recess 62. Therefore, even when the wafer 4 is placed on the wafer stage 12 with the front side 4a of the device 14 facing down, the device 14 will not come into contact with the wafer stage 12, thus preventing damage to the device 14. In addition, after the wafer stage 12 supports the remaining peripheral region 20 with the annular support portion 56, the suction source is activated to generate a suction force in each suction hole 60 to attract and hold the remaining peripheral region 20, thereby preventing the wafer 4 from shifting position.

[0053] Reference Figure 5 To explain, the processing apparatus 2 also includes: a frame receiver 66 that receives a plurality of annular frames 64 having openings 64a for receiving wafers 4; a frame removal mechanism 68 that removes the frames 64 from the frame receiver 66; and a frame stage 70 that supports the frames 64 removed by the frame removal mechanism 68.

[0054] like Figure 5 As shown, the frame organizer 66 of the illustrated embodiment has a housing 72, a lifting plate 74 that is vertically and flexibly disposed within the housing 72, and a lifting mechanism (not shown) for raising and lowering the lifting plate 74. Figure 5 In this housing 72, a Z-axis guide member 78 extending along the Z-axis direction is disposed on the inner side in the X-axis direction. The lifting plate 74 is supported by the Z-axis guide member 78 for free lifting, and a lifting mechanism for raising and lowering the lifting plate 74 is disposed inside the Z-axis guide member 78. The lifting mechanism may, for example, have a ball screw connected to the lifting plate 74 and extending along the Z-axis direction, and an electric motor for rotating the ball screw. Figure 5In the housing 72, a door 76 with a handle 76a is provided on the side near the front in the X-axis direction. The frame 64 can be stored inside the housing 72 by holding the handle 76a and opening the door 76. In addition, an opening 80 is provided at the upper end of the housing 72.

[0055] like Figure 5 As shown, the frames 64 are stacked inside the housing 72 and housed on the upper surface of the lifting plate 74. The uppermost frame 64 of the stacked frames 64 is removed from the opening 80 of the housing 72 via the frame removal mechanism 68. Furthermore, when the frame 64 is removed from the opening 80, the frame holder 66 raises the lifting plate 74 appropriately via the lifting mechanism, positioning the uppermost frame 64 in a position where it can be removed via the frame removal mechanism 68.

[0056] Reference Figure 5 Continuing the description, the frame removal mechanism 68 includes: an X-axis guide member 82, which is fixed to a suitable bracket (not shown) and extends along the X-axis direction; an X-axis movable member 84, which is supported by the X-axis guide member 82 and is movable freely in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 84 along the X-axis direction; a Z-axis movable member 86, which is supported by the X-axis movable member 84 and is movable freely in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 86 along the Z-axis direction. The X-axis feed mechanism of the frame removal mechanism 68 may be a structure having a ball screw connected to the X-axis movable member 84 and extending along the X-axis direction and an electric motor that rotates the ball screw; the Z-axis feed mechanism may be a structure having a ball screw connected to the Z-axis movable member 86 and extending along the Z-axis direction and an electric motor that rotates the ball screw.

[0057] The Z-axis movable member 86 of the frame removal mechanism 68 has a holding portion 88 for holding the frame 64. The holding portion 88 of the illustrated embodiment has a rectangular base plate 90 and a plurality of suction pads 92 provided on the lower surface of the base plate 90, each suction pad 92 being connected to a suction source (not shown).

[0058] After the frame removal mechanism 68 uses the suction pad 92 of the holding part 88 to attract and hold the uppermost frame 64 stored in the frame holder 66, it moves the X-axis movable part 84 and the Z-axis movable part 86, thereby removing the attracted and held uppermost frame 64 from the frame holder 66.

[0059] like Figure 5As shown, the frame platform 70 is supported by the Z-axis guide member 94 to move freely between the lowered position (shown by the solid line) and the raised position (shown by the double-dotted line). A suitable drive source (e.g., an air-driven or electric drive source) is attached to the Z-axis guide member 94 to move the frame platform 70 between the lowered and raised positions. In the lowered position, the frame 64 is received by the frame removal mechanism 68.

[0060] like Figure 1 and Figure 5 As shown, the processing device 2 includes: a pasting mechanism 98 (see reference). Figure 1 It is mounted above the frame platform 70, and the strap 96 is attached to the frame 64; there is a frame conveying mechanism 100 (see reference). Figure 5 The frame 64 with the tape 96 attached (hereinafter, sometimes referred to as "the frame with tape 64") is transported to the wafer stage 12, the opening 64a of the frame 64 is positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, and the frame with tape 64' is placed on the wafer stage 12; and the tape pressing mechanism 102 (see reference) Figure 1 The strip 96 with frame 64' will be pressed onto the back side 4b of the chip 4.

[0061] Reference Figure 6 As illustrated, the tape-attaching mechanism 98 of the embodiment includes: a tape support portion 104 that supports a tape 96R wound with a tape 96 before use; a tape winding portion 106 that winds the used tape 96; a tape pull-out portion 108 that pulls the tape 96 out of the tape 96R; a crimping portion 110 that crimps the pulled-out tape 96 onto a frame 64; and a cutting portion 112 that cuts the tape 96 protruding to the outer periphery of the frame 64 along the frame 64.

[0062] like Figure 6 As shown, the tape support portion 104 includes a support roller 114 that is rotatably supported on a suitable bracket (not shown) about an axis extending in the X-axis direction. A tape 96R, wound into a cylindrical shape, is supported on the support roller 114. A release paper 116 for protecting the adhesive surface of the tape 96 is attached to the adhesive surface of the tape 96.

[0063] The winding section 106 includes: a winding roller 118, which is rotatably supported on a suitable bracket (not shown) about an axis extending in the X-axis direction; and a motor (not shown) that rotates the winding roller 118. Figure 6 As shown, the winding section 106 rotates the winding roller 118 via an electric motor, thereby winding the used tape 96, which has a circular opening 120 that abuts against the portion attached to the frame 64.

[0064] Reference Figure 6Continuing the description, the tape pull-out section 108 includes: a pull-out roller 122 disposed below the support roller 114 of the tape support section 104; an electric motor (not shown) that rotates the pull-out roller 122; and a driven roller 124 that rotates in conjunction with the rotation of the pull-out roller 122. The tape pull-out section 108 rotates the driven roller 124 together with the pull-out roller 122 via the electric motor, thereby pulling the tape 96 clamped between the pull-out roller 122 and the driven roller 124 out of the tape 96R.

[0065] The release paper 116 is peeled off from the belt 96 that has passed between the pull-out roller 122 and the driven roller 124, and the peeled release paper 116 is wound by the release paper winding section 126. The release paper winding section 126 of the illustrated embodiment includes a release paper winding roller 128 disposed above the driven roller 124 and an electric motor (not shown) for rotating the release paper winding roller 128. Furthermore, the belt 96 with the release paper 116 peeled off is guided to the winding roller 118 by guide rollers 130 disposed at intervals from the pull-out roller 122 along the Y-axis direction.

[0066] The crimping section 110 includes a pressing roller 132 that is movably disposed along the Y-axis direction and a Y-axis feed mechanism (not shown) for moving the pressing roller 132 along the Y-axis direction. The Y-axis feed mechanism of the crimping section 110 may be constituted by a suitable drive source (e.g., an air drive source or an electric drive source).

[0067] like Figure 6 As shown, the cutting section 112 includes: a Z-axis guide member 134, which is fixed to a suitable bracket (not shown) and extends along the Z-axis direction; a Z-axis movable member 136, which is supported by the Z-axis guide member 134 and is movable in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 136 along the Z-axis direction. The Z-axis feed mechanism of the cutting section 112 may be a structure having a ball screw connected to the Z-axis movable member 136 and extending along the Z-axis direction, and an electric motor for rotating the ball screw.

[0068] Additionally, the cutting section 112 includes: a motor 138 fixed to the lower surface of the front end of the Z-axis movable member 136; and an arm 140 that rotates about an axis extending along the Z-axis direction via the motor 138. First and second drooping plates 142a and 142b are attached to the lower surface of the arm 140 at intervals. A circular cutter 144 is rotatably supported on the first drooping plate 142a about an axis perpendicular to the Z-axis direction, and a pressing roller 146 is rotatably supported on the second drooping plate 142b about an axis perpendicular to the Z-axis direction.

[0069] The frame platform 70, which received the frame 64 from the frame removal mechanism 68, descended from its lowered position. Figure 6The position shown in (a) is positioned in the ascending position. Figure 6 Before the position shown in (b), the tape bonding mechanism 98 pulls out the unused tape 96 via the pull-out roller 122 and the driven roller 124. Then, the frame platform 70 is positioned in the raised position to the extent that the tape 96 can be pressed onto the frame 64 by the pressing roller 132 of the pressing section 110, so that the frame 64 contacts the pressing roller 132 with respect to the tape 96. Then, while pressing the bonding surface of the tape 96 onto the frame 64 using the pressing roller 132, the pressing roller 132 is rolled in the Y-axis direction. Thus, the tape 96 pulled out from the reel 96R by the tape pull-out section 108 can be pressed onto the frame 64.

[0070] After the tape 96 is pressed onto the frame 64, the tape bonding mechanism 98 lowers the Z-axis movable member 136 of the cutting section 112 via the Z-axis feed mechanism, pushing the cutter 144 against the tape 96 on the frame 64, and pressing the frame 64 from above the tape 96 using the pressing roller 146. Next, the arm 140 is rotated by the motor 138, causing the cutter 144 and the pressing roller 146 to move in a circular motion along the frame 64. This allows the tape 96, which protrudes to the outer periphery of the frame 64, to be cut along the frame 64. Furthermore, since the pressing roller 146 presses the frame 64 from above the tape 96, positional misalignment between the frame 64 and the tape 96 is prevented when cutting the tape 96. Then, after the frame table 70 is lowered, the used tape 96, with its circular opening 120 abutting against the portion bonded to the frame 64, is wound around using the tape winding section 106.

[0071] like Figure 5 As shown, the framed conveying mechanism 100 includes: a Y-axis guide member 148, which is fixed to a suitable bracket (not shown) and extends along the Y-axis direction; a Y-axis movable member 150, which is supported by the Y-axis guide member 148 and is movable in the Y-axis direction; a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 150 along the Y-axis direction; a Z-axis movable member 152, which is supported by the Y-axis movable member 150 and is movable in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 152 along the Z-axis direction. The Y-axis feed mechanism of the framed conveying mechanism 100 may have a structure having a ball screw connected to the Y-axis movable member 150 and extending along the Y-axis direction and an electric motor that rotates the ball screw; the Z-axis feed mechanism may have a structure having a ball screw connected to the Z-axis movable member 152 and extending along the Z-axis direction and an electric motor that rotates the ball screw.

[0072] The Z-axis movable member 152 of the frame conveying mechanism 100 has a holding part 154 for holding the frame 64'. The holding part 154 of the illustrated embodiment has a rectangular base plate 156 and a plurality of suction pads 158 provided on the lower surface of the base plate 156, each suction pad 158 being connected to a suction source (not shown).

[0073] The frame conveying mechanism 100 uses the suction pads 158 of the holding part 154 to attract and hold the frame 64' supported on the upper surface of the frame stage 70 with the adhesive side of the strap 96 facing down. This allows the Y-axis movable part 150 and the Z-axis movable part 152 to move, thereby transporting the frame 64' held by the holding part 154 from the frame stage 70 to the wafer stage 12. The opening 64a of the frame 64 is positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, and the frame 64' is placed on the wafer stage 12.

[0074] Reference Figures 7 to 9 The crimping mechanism 102 will be described below. Figure 7 As shown, the crimping mechanism 102 includes: an upper chamber 160 disposed above the wafer stage 12; a lower chamber 162 housing the wafer stage 12; a lifting mechanism 164 that raises and lowers the upper chamber 160 to create a closed state where the upper chamber 160 is in contact with the lower chamber 162 and an open state where the upper chamber 160 is separated from the lower chamber 162; a vacuum section 166 that creates a vacuum in the closed state between the upper chamber 160 and the lower chamber 162; and an atmospheric opening section 168 that opens the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0075] like Figure 7 As shown, the upper chamber 160 of the illustrated embodiment includes a circular top plate 170 and a cylindrical sidewall 172 hanging from the periphery of the top plate 170. A lifting mechanism 164, which can be constructed by a suitable actuator such as a cylinder, is mounted on the upper surface of the top plate 170. A pressing roller 174, a support plate 176, and a Y-axis feed mechanism 178 are arranged in the storage space defined by the lower surface of the top plate 170 and the inner peripheral surface of the sidewall 172. The pressing roller 174 is used to press the strip 96 with a frame 64' against the back surface 4b of the wafer 4 supported by the wafer stage 12. The support plate 176 supports the pressing roller 174 so that it can rotate freely. The Y-axis feed mechanism 178 moves the support plate 176 along the Y-axis direction.

[0076] The Y-axis feed mechanism 178 includes: a ball screw 180 connected to a support plate 176 and extending along the Y-axis direction; and a motor 182 that rotates the ball screw 180. Furthermore, the Y-axis feed mechanism 178 converts the rotational motion of the motor 182 into linear motion via the ball screw 180 and transmits it to the support plate 176, causing the support plate 176 to move along a pair of guide rails 184 extending in the Y-axis direction.

[0077] like Figure 7 As shown, the lower chamber 162 has a cylindrical sidewall 186, with the upper part of the sidewall 186 open and the lower part closed. A connection opening 188 is formed on the sidewall 186. The connection opening 188 is connected to a vacuum section 166, which can be constructed by a suitable vacuum pump, via a flow path 190. An atmospheric opening 168 is provided on the flow path 190, which can be constructed by a suitable valve that allows the flow path 190 to be opened to the atmosphere.

[0078] With the tape 96 with the tape frame 64' positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, the tape pressing mechanism 102 lowers the upper chamber 160 via the lifting mechanism 164, so that the lower end of the side wall 172 of the upper chamber 160 contacts the upper end of the side wall 186 of the lower chamber 162, thereby closing the upper chamber 160 and the lower chamber 162, and bringing the pressing roller 174 into contact with the tape frame 64'.

[0079] Next, with the pressure-fitting mechanism 102 in the state of closing the valve constituting the atmospheric opening section 168, the vacuum pump constituting the vacuum section 166 is activated, making the interiors of the upper chamber 160 and the lower chamber 162 a vacuum. Then, as... Figure 8 and Figure 9 As shown, the pressing roller 174 is rolled along the Y-axis direction by the Y-axis feeding mechanism 178, thereby pressing the belt 96 onto the back surface 4b of the wafer 4 to form the frame unit U.

[0080] When the tape 96 is pressed onto the back surface 4b of the wafer 4 using the pressing roller 174, a tiny gap is formed between the wafer 4 and the tape 96 at the base of the annular reinforcing portion 24. However, since the wafer 4 and the tape 96 are pressed together while the upper chamber 160 and the lower chamber 162 are in a vacuum state, the pressure in the tiny gap between the wafer 4 and the tape 96 is lower than atmospheric pressure. When the atmospheric opening portion 168 is opened after pressing the tape 96, the tape 96 is pressed against the wafer 4 by atmospheric pressure. As a result, the gap between the wafer 4 and the tape 96 at the base of the reinforcing portion 24 disappears, and the tape 96 adheres tightly to the back surface 4b of the wafer 4 along the base of the reinforcing portion 24.

[0081] like Figure 1 and Figure 10As shown, the processing apparatus 2 further includes: a frame unit removal mechanism 192, which removes the frame unit U, which has been pressed together with the back surface 4b of the wafer 4 by the pressing mechanism 102, from the wafer stage 12; a reinforcement removal mechanism 194, which cuts off and removes the annular reinforcement 24 from the wafer 4 of the frame unit U removed by the frame unit removal mechanism 192; and a ringless unit removal mechanism 196 (see reference). Figure 1 The ringless unit, from which the annular reinforcement 24 has been removed, is moved out of the reinforcement removal mechanism 194; and the frame box platform 200 (see reference) Figure 1 The frame box 198 that houses the acyclic unit moved out by the acyclic unit moving mechanism 196.

[0082] like Figure 10 As shown, the frame unit removal mechanism 192 of the illustrated embodiment includes: a frame unit holding part 202, which includes a wafer holding part 202a for holding the wafer 4 and a frame holding part 202b for holding the frame 64; and a transport part 206 that transports the frame unit holding part 202 to the temporary stage 204.

[0083] The wafer holding portion 202a of the frame unit holding portion 202 includes a circular substrate 208 and a circular suction plate 210 mounted on the lower surface of the substrate 208. A plurality of suction holes (not shown) are formed on the lower surface of the suction plate 210, and each suction hole is connected to a suction source (not shown). The frame holding portion 202b includes a plurality of (four in the illustrated embodiment) protruding pieces 212 that protrude radially outward from the periphery of the substrate 208 of the wafer holding portion 202a at circumferential intervals, and suction pads 214 attached to the lower surface of the protruding pieces 212, each suction pad 214 being connected to a suction source (not shown).

[0084] The transport unit 206 includes: an X-axis guide member 216, which is fixed to a suitable bracket (not shown) and extends along the X-axis direction; an X-axis movable member 218, which is supported by the X-axis guide member 216 and is movable freely in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 218 along the X-axis direction; a Z-axis movable member 220, which is supported by the X-axis movable member 218 and is movable freely in the Z-axis direction; a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 220 along the Z-axis direction; a Y-axis movable member 222, which is supported by the Z-axis movable member 220 and is movable freely in the Y-axis direction; and a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 222 along the Y-axis direction. A substrate 208 of the wafer holding unit 202a is connected to the front end of the Y-axis movable member 222. The X-axis, Y-axis, and Z-axis feed mechanisms of the conveying unit 206 can be structures with ball screws and electric motors that rotate the ball screws, respectively.

[0085] The preferred frame unit removal mechanism 192 includes a two-dimensional movement mechanism for moving the frame unit holding part 202 two-dimensionally in the horizontal direction and an imaging part 224 for photographing the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202. In the illustrated embodiment, the frame unit holding part 202 is moved two-dimensionally in the horizontal direction in the XY plane by the X-axis feed mechanism and the Y-axis feed mechanism of the transport part 206, and the transport part 206 constitutes the two-dimensional movement mechanism. In addition, the imaging part 224 of the illustrated embodiment is arranged between the wafer stage 12 and the temporary stage 204, and photographs the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202 from below the wafer 4.

[0086] The frame unit removal mechanism 192 uses the suction plate 210 of the wafer holding part 202a to attract and hold the wafer 4 from the back side 4b side (band 96 side), and the transport part 206 is operated to remove the frame unit U held by the frame unit holding part 202 from the wafer stage 12 while the frame 64 is attracted and held by the suction pad 214 of the frame holding part 202b.

[0087] Furthermore, in the illustrated embodiment, the frame unit removal mechanism 192 operates the transport section 206, which constitutes the two-dimensional movement mechanism. The imaging section 224 captures images of at least three locations on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding section 202, thereby measuring the coordinates of at least three points on the outer periphery of the wafer 4. The center coordinates of the wafer 4 are then determined based on the measured coordinates of these three points. Finally, the frame unit removal mechanism 192 aligns the center of the wafer 4 with the center of the temporary stage 204, temporarily placing the frame unit U on the temporary stage 204.

[0088] like Figure 10 As shown, the temporary stage 204 and the wafer stage 12 are arranged at a distance from each other in the X-axis direction. The temporary stage 204 of the illustrated embodiment has: an annular support portion 226, which supports the outer peripheral remaining region 20 of the wafer 4 of the frame unit U and does not contact the portion inside the outer peripheral remaining region 20; and a frame support portion 228, which is disposed on the outer periphery of the annular support portion 226 and supports the frame 64.

[0089] The portion radially inward of the annular support portion 226 becomes a downwardly recessed circular recess 230. The frame support portion 228 of the temporary platform 204 has a heater (not shown), and preferably the belt 96 of the frame unit U temporarily placed on the temporary platform 204 is softened by heating it with the heater, so that the belt 96 is further pressed tightly against the base of the annular reinforcement portion 24 by atmospheric pressure.

[0090] The processing apparatus 2 of the illustrated embodiment includes a temporary stage conveying section 232 that conveys a temporary stage 204 along the Y-axis direction. The temporary stage conveying section 232 includes: a Y-axis guide member 234 extending along the Y-axis direction; a Y-axis movable member 236 supported by the Y-axis guide member 234 and movable freely in the Y-axis direction; and a Y-axis feed mechanism 238 that moves the Y-axis movable member 236 along the Y-axis direction. The temporary stage 204 is fixed to the upper part of the Y-axis movable member 236. The Y-axis feed mechanism 238 includes: a ball screw 240 connected to the Y-axis movable member 236 and extending along the Y-axis direction; and a motor 242 that rotates the ball screw 240. Furthermore, the temporary platform conveying unit 232 converts the rotational motion of the motor 242 into linear motion through the ball screw 240 and transmits it to the Y-axis movable component 236, and together with the Y-axis movable component 236, conveys the temporary platform 204 along the Y-axis direction.

[0091] like Figure 1 and Figure 10 As shown, the reinforcement removal mechanism 194 includes: a laser beam irradiation unit 244, which irradiates a laser beam toward the base of the annular reinforcement 24 formed on the outer periphery of the wafer 4 to form a cutting groove; a first lifting platform 246 (see reference 244). Figure 1 The frame unit 244 is held and raised on the temporary stage 204 and moved along the X-axis to be positioned on the laser beam irradiation unit 244; and the separation part 248 separates the annular reinforcing part 24 from the cutting groove.

[0092] like Figure 10 As shown, the laser beam irradiation unit 244 includes: a housing 250 disposed adjacent to the temporary stage 204 in the X-axis direction; a laser oscillator (not shown) housed in the housing 250 and performing laser oscillation; a concentrator 252 that focuses the laser beam generated by the laser oscillation of the laser oscillator to irradiate the base of the annular reinforcement 24 formed on the outer periphery of the wafer 4; an attraction nozzle 254 that attracts debris generated when the laser beam is irradiated onto the wafer 4; and an attraction source (not shown) connected to the attraction nozzle 254.

[0093] The concentrator 252 extends obliquely upward from the upper surface of the housing 250 toward the suction nozzle 254, thereby suppressing debris generated during laser beam irradiation from falling onto the concentrator 252. Additionally, the suction nozzle 254 extends obliquely upward from the upper surface of the housing 250 toward the concentrator 252.

[0094] like Figure 11As shown, the laser beam irradiation unit 244 rotates the frame unit U held by the first lifting platform 246 while irradiating a laser beam LB toward the base of the annular reinforcement 24 formed on the outer periphery of the wafer 4, forming an annular cutting groove 256 along the base of the reinforcement 24 through an ablation process. Furthermore, the laser beam irradiation unit 244 uses an suction nozzle 254 to attract debris generated during the ablation process.

[0095] like Figure 1 As shown, the first lifting platform 246 is positioned above the temporary platform 204, freely movable along the X-axis and Z-axis. (Refer to...) Figure 12 The first lifting platform 246 includes: an X-axis guide member 258 fixed to a suitable bracket (not shown) and extending along the X-axis direction; an X-axis movable member 260 supported by the X-axis guide member 258 and movable in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 260 along the X-axis direction; a Z-axis movable member 262 supported by the X-axis movable member 260 and movable in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 262 along the Z-axis direction. The X-axis and Z-axis feed mechanisms of the first lifting platform 246 may each be structures having a ball screw and an electric motor that rotates the ball screw, respectively.

[0096] A downwardly extending support shaft 264 is rotatably supported on the lower front surface of the Z-axis movable component 262. A motor 266 is mounted on the upper front surface of the Z-axis movable component 262, which rotates the support shaft 264 about an axis extending along the Z-axis direction. A circular suction plate 268 is fixed to the lower end of the support shaft 264. On the lower surface of the suction plate 268, a plurality of suction holes (not shown) are formed circumferentially at intervals on a circumference corresponding to the size of the frame 64, and each suction hole is connected to a suction source.

[0097] After the first lifting platform 246 uses the adsorption plate 268 to attract and hold the frame 64 portion of the frame unit U, whose belt 96 is heated by the heater of the frame support portion 228 of the temporary stage 204 and is in close contact with the base of the annular reinforcement portion 24, the Z-axis movable member 262 and the X-axis movable member 260 are moved, causing the frame unit U held by the adsorption plate 268 to rise and move along the X-axis direction to be positioned in the laser beam irradiation unit 244. Alternatively, if the frame 64 is made of a magnetic material, an electromagnet (not shown) can be attached to the lower surface of the adsorption plate 268, and the adsorption plate 268 can attract the frame 64 by magnetic force.

[0098] Furthermore, when the first lifting platform 246 irradiates the wafer 4 with a laser beam LB through the laser beam irradiation unit 244, it activates the motor 266 to rotate the frame unit U held by the adsorption plate 268. Then, the first lifting platform 246 moves the frame unit U, which has a cutting groove 256 formed at the base of the reinforcing part 24, along the X-axis and Z-axis directions and temporarily places it on the temporary placement stage 204.

[0099] like Figure 1 As shown, the separation section 248 is arranged at a distance from the first lifting platform 246 along the Y-axis within the movable range of the temporary platform 204 in the Y-axis direction. (Refer to...) Figure 13 and Figure 15 As explained, the separation section 248 includes: an ultraviolet irradiation section 270 (see reference). Figure 13 The second lifting platform 272 (refer to the section 256) irradiates the strip 96 with ultraviolet light, thereby reducing the adhesion of the strip 96; Figure 13 The ring-shaped reinforcing portion 24 is exposed on the outer periphery to attract and hold the inner side of the wafer 4, and to support the frame 64; the separator 274 (see reference) Figure 13 ), which acts on the outer periphery of the annular reinforcing part 24 to separate the annular reinforcing part 24; and the discarded part 276 (see Figure 15 The separated annular reinforcing part 24 is discarded.

[0100] like Figure 13 As shown, the separation section 248 of the illustrated embodiment includes: a Z-axis guide member 278, which is fixed to a suitable bracket (not shown) and extends along the Z-axis direction; a Z-axis movable member 280, which is supported by the Z-axis guide member 278 and is movable freely in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 280 along the Z-axis direction. The Z-axis feed mechanism may be a structure having a ball screw connected to the Z-axis movable member 280 and extending along the Z-axis direction, and an electric motor for rotating the ball screw.

[0101] A support plate 282 is supported on the lower front surface of the Z-axis movable member 280, and a support shaft 286 is rotatably supported thereon. The second lifting platform 272 is connected to the support shaft 286. A motor 284 is mounted on the upper front surface of the Z-axis movable member 280 to rotate the second lifting platform 272 together with the support shaft 286. In the illustrated embodiment, a pair of ultraviolet irradiation sections 270 are attached to the support plate 282 at intervals in the Y-axis direction.

[0102] The second lifting platform 272 is circular, and its diameter is slightly smaller than that of the device region 18 of the wafer 4 (the portion inside the annular reinforcement 24). Multiple suction holes (not shown) are formed on the lower surface of the second lifting platform 272, and each suction hole is connected to a suction source.

[0103] Additionally, the aforementioned separator 274 is mounted on the support plate 282. The separator 274 includes a pair of movable plates 288 spaced apart on the lower surface of the support plate 282 and movable along the length of the support plate 282, and a pair of feed mechanisms 290 for moving the pair of movable plates 288. The pair of feed mechanisms 290 can each be configured with a suitable actuator such as a cylinder or an electric cylinder.

[0104] Separator 274 includes: a pair of clamping rollers 292a and 292b, which are supported on each movable piece 288 at a distance in the vertical direction; and a Z-axis feed mechanism 294, which moves the upper clamping roller 292a along the Z-axis direction. The Z-axis feed mechanism 294 may be constituted by a suitable actuator such as a cylinder or an electric cylinder. Each clamping roller 292a and 292b is rotatably supported on the movable piece 288 about an axis extending in the Y-axis direction. A pressing roller 298 is mounted on the upper clamping roller 292a via a support shaft 296.

[0105] Reference Figure 15 As described, the waste section 276 includes: a belt conveyor 300 that conveys the separated annular reinforcing section 24; and a dust collection box 302 that houses the annular reinforcing section 24 conveyed by the belt conveyor 300. The belt conveyor 300 is positioned at a substantially horizontally extending recycling location by means of a suitable actuator (not shown). Figure 15 The position shown by the solid line) and the standby position that is essentially vertically extended ( Figure 15 (The position indicated by the double-dotted line). Figure 15 In the dust collection box 302, a door 304 with a handle 304a is provided on the side near the front in the X-axis direction. Inside the dust collection box 302, a crusher (not shown) is installed to crush the collected annular reinforcing part 24. In the dust collection box 302, by holding the handle 304a and opening the door 304, the crushed debris collected in the annular reinforcing part 24 can be removed.

[0106] When the temporary placement table 204, on which the frame unit U, in which the cutting groove 256 is formed at the base of the reinforcing part 24, is temporarily placed, is positioned below the separating part 248 by the temporary placement table conveying part 232, as follows: Figure 14As shown, the separation unit 248 uses the second lifting platform 272 to attract and hold the back side 4b of the wafer 4 of the frame unit U. After the frame 64 is clamped by the clamping rollers 292a and 292b of the separator 274, ultraviolet light is irradiated from a pair of ultraviolet irradiation units 270 to reduce the adhesive force of the tape 96 attached to the annular reinforcement 24. While pressing the annular reinforcement 24 downward with the pressing roller 298, the frame unit U, together with the support shaft 286 and the second lifting platform 272, is rotated relative to the separator 274 by the motor 284, thereby separating the annular reinforcement 24 from the frame unit U. The separated reinforcement 24 is transported to the dust collection box 302 by the belt conveyor 300 for recycling. Alternatively, the separator 274 can be rotated relative to the frame unit U during the separation of the reinforcement 24.

[0107] like Figure 1 As shown, the acyclic unit removal mechanism 196 and the reinforcement removal mechanism 194 are arranged adjacent to each other. (Refer to...) Figure 16 and Figure 17 As explained, the acyclic unit transfer mechanism 196 of the illustrated embodiment includes: a flipping mechanism 308 (see reference). Figure 16 It has a frame holding portion 306 that faces the ringless unit supported by the second lifting platform 272 and holds the frame 64, and moves toward the frame box platform 200 to flip the frame holding portion 306; the ringless unit support portion 310 (see reference) Figure 17 ), which supports the ringless unit with the front side 4a of the wafer 4 facing upwards, which is flipped by the flipping mechanism 308; and the push-in part 312 (see reference) Figure 17 The acyclic unit supported by the acyclic unit support 310 is placed into the frame box 198 on the frame box platform 200 for storage.

[0108] like Figure 16 As shown, the flipping mechanism 308 includes: a Y-axis guide member 314 extending along the Y-axis direction; a Y-axis movable member 316 supported by the Y-axis guide member 314 and movable freely in the Y-axis direction; a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 316 along the Y-axis direction; an arm 318 supported by the Y-axis movable member 316 and movable freely in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the arm 318 along the Z-axis direction. The Y-axis and Z-axis feed mechanisms of the flipping mechanism 308 can each be structures having a ball screw and an electric motor that rotates the ball screw, respectively.

[0109] The frame holding portion 306 is supported on the arm 318 in a manner that allows it to rotate freely up and down, and a motor 320 is mounted on it to rotate the frame holding portion 306 up and down. The frame holding portion 306 in the illustrated embodiment includes a base plate 324 rotatably supported on the arm 318 via a pair of rotating shafts 322, and a plurality of suction pads 326 attached to one surface of the base plate 324. Each suction pad 326 is connected to a suction source (not shown). Additionally, one rotating shaft 322 is connected to the motor 320.

[0110] With the suction pad 326 facing upwards, the flipping mechanism 308 uses the suction pad 326 to attract and hold the lower surface of the frame 64 of the acyclic unit U' supported by the second lifting platform 272, and receives the acyclic unit U' from the second lifting platform 272. Furthermore, after the frame holding part 306 is flipped by the motor 320 so that the front surface 4a of the wafer 4 faces upwards, the flipping mechanism 308 moves the Y-axis movable member 316, thereby moving the acyclic unit U' held by the frame holding part 306 toward the frame cassette stage 200.

[0111] like Figure 17 As shown, the acyclic unit support 310 of the illustrated embodiment includes: a pair of support plates 328, which are supported by suitable brackets (not shown) to be movable in the X-axis direction; and a spacing adjustment mechanism (not shown) that adjusts the spacing of the pair of support plates 328 in the X-axis direction. The spacing adjustment mechanism may be constituted by a suitable actuator such as a cylinder or an electric cylinder.

[0112] Heaters (not shown) are mounted on a pair of support plates 328 that support the acyclic unit U'. When the gap between the pair of support plates 328 narrows, the pair of support plates 328 heat the belt 96 of the acyclic unit U' through the heaters, thereby causing the belt 96, which is loosened and wrinkled due to the removal of the reinforcing part 24, to stretch.

[0113] Reference Figure 17 Continuing the description, the push-in portion 312 of the illustrated embodiment includes: a Y-axis guide member 330 extending along the Y-axis direction; a Y-axis movable member 332 supported by the Y-axis guide member 330 and movable freely in the Y-axis direction; and a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 332 along the Y-axis direction. The Y-axis movable member 332 has: a base 334 supported by the Y-axis guide member 330; a support column 336 extending upward from the upper surface of the base 334; and a pressing plate 338 attached to the upper end of the support column 336. The Y-axis feed mechanism of the push-in portion 312 may have a structure having a ball screw connected to the Y-axis movable member 332 and extending along the Y-axis direction, and an electric motor for rotating the ball screw.

[0114] like Figure 18As shown, the acyclic unit support 310 widens the gap between a pair of support plates 328 via a gap adjustment mechanism before receiving the acyclic unit U', and then receives the acyclic unit U' held by the suction pad 326. Then, the push-in part 312 moves the Y-axis movable member 332 along the Y-axis direction via the Y-axis feed mechanism, thereby pushing the acyclic unit U' supported by the acyclic unit support 310 into the frame box 198 placed on the frame box platform 200 for storage via the push plate 338.

[0115] exist Figure 1 and Figure 18 In the frame box 198 shown, with the front side 4a of the wafer 4 facing upwards, multiple acyclic units U' are arranged at intervals in the vertical direction. For example... Figure 17 and Figure 18 As shown, the frame box platform 200 includes: a mounting section 340 on which the frame box 198 is mounted; and a lifting section 342 which raises and lowers the mounting section 340 to a position at any height. The lifting section 342 may have a structure having a ball screw connected to the mounting section 340 and extending along the Z-axis and an electric motor for rotating the ball screw.

[0116] Next, the following processing method will be described: Using the processing apparatus 2 as described above, a tape (dicing tape) 96 is attached to the back surface 4b of the wafer 4, on which a ring-shaped reinforcing portion 24 is formed in a convex shape on the back surface 4b corresponding to the outer peripheral remaining area 20, so that the wafer 4 and the frame 64 become one piece, and the ring-shaped reinforcing portion 24 is cut off and removed from the wafer 4.

[0117] In the illustrated implementation, firstly, as shown in the figure... Figure 1 and Figure 3 As shown, a wafer cassette 6 containing multiple wafers 4 is placed on a wafer cassette stage 8. In the wafer cassette 6, multiple wafers 4 are arranged at intervals in the vertical direction with the front side 4a facing upwards.

[0118] In addition, such as Figure 1 and Figure 5 As shown, a frame storage process is performed in a frame receiver 66 to store multiple annular frames 64 having openings 64a for storing wafers 4. The frame storage process can be performed before or after the wafer cassette loading process.

[0119] In the frame storage process, after lowering the lifting plate 74 of the frame storage unit 66 to any position, hold the handle 76a and open the door 76 to stack and store multiple frames 64 on the upper surface of the lifting plate 74. In addition, adjust the height of the lifting plate 74 appropriately to position the topmost frame 64 so that it can be moved out by the frame removal mechanism 68.

[0120] After the wafer cassette placement process and the frame storage process are performed, a wafer removal process is performed to remove the wafer 4 from the wafer cassette 6 placed on the wafer cassette stage 8.

[0121] Reference Figure 3 To explain, in the wafer unloading process, firstly, the Y-axis feed mechanism 34 of the wafer unloading mechanism 10 is activated, positioning the Y-axis movable part 32 near the wafer cassette 8. Next, the transfer arm 42 is driven, positioning the hand 44 with the air nozzle 46 facing upwards on the back side 4b (lower side) of the wafer 4 inside the wafer cassette 6. When the hand 44 is positioned on the back side 4b of the wafer 4, there is a gap between the back side 4b of the wafer 4 and the hand 44, and each guide pin 48 is positioned radially outwards.

[0122] Next, compressed air is ejected from the air outlet 46 of the hand 44, generating a negative pressure on one side of the hand 44 using the Bernoulli effect. The hand 44 then non-contactly attracts and supports the wafer 4 from the back side 4b. Next, each guide pin 48 is moved radially inward, restricting the horizontal movement of the wafer 4 supported by the hand 44. Then, the Y-axis movable member 32 and the conveying arm 42 of the wafer removal mechanism 10 are moved to remove the wafer 4 supported by the hand 44 from the wafer cassette 6.

[0123] Preferably, a cut detection process is performed after the wafer removal process to detect the position of the cut 26 on the wafer 4. In the cut detection process, such as... Figure 4 As shown, the outer periphery of the wafer 4, which is attracted and supported by the hand 44, is positioned between the light-emitting element 52 and the light-receiving element 54 of the cut detection unit 50. Next, the wafer 4 is rotated via the guide pin 48 using a drive source, thereby detecting the position of the cut 26 on the wafer 4. This allows the orientation of the wafer 4 to be adjusted to any desired orientation.

[0124] After the cut detection process is performed, a wafer support process is performed in which the front side 4a of the wafer 4 moved out by the wafer removal mechanism 10 is supported by the wafer stage 12.

[0125] Reference Figure 3 To explain, in the wafer support process, firstly, the hand 44 of the wafer removal mechanism 10 is flipped up and down so that the front surface 4a of the wafer 4 faces downwards. Next, the Y-axis movable part 32 and the conveying arm 42 of the wafer removal mechanism 10 are moved so that the remaining peripheral area 20 of the front surface 4a of the wafer 4, which is held by the hand 44, comes into contact with the annular support portion 56 of the wafer stage 12. At this time, the device area 18 of the front surface 4a of the wafer 4 is located in the recess 62 of the wafer stage 12, therefore the device 14 does not come into contact with the wafer stage 12, preventing damage to the device 14.

[0126] Next, the suction source of the wafer stage 12 is activated to generate suction in each suction hole 60, thereby attracting and holding the remaining peripheral area 20 of the front side 4a of the wafer 4. Then, the suction support of the hand 44 on the wafer 4 is released, and the hand 44 is separated from the wafer stage 12. In this way, the wafer 4 is transferred from the wafer unloading mechanism 10 to the wafer stage 12. The wafer 4 transferred to the wafer stage 12 is attracted and held through each suction hole 60, so the position of the wafer 4 does not shift.

[0127] In addition, after the wafer cassette placement process and the frame storage process are performed, a frame removal process is performed in parallel with the wafer removal process or the wafer support process to remove the frame 64 from the frame storage unit 66.

[0128] Reference Figure 5 To explain, in the frame removal process, firstly, the X-axis movable member 84 and the Z-axis movable member 86 of the frame removal mechanism 68 are moved, causing the suction pad 92 of the holding part 88 to contact the upper surface of the uppermost frame 64 stored in the frame receiver 66. Next, the suction source of the frame removal mechanism 68 is activated, generating a suction force on the suction pad 92, thereby using the suction pad 92 to attract and hold the uppermost frame 64. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame removal mechanism 68 are moved, removing the uppermost frame 64, which is attracted and held by the suction pad 92 of the holding part 88, from the frame receiver 66.

[0129] After the frame removal process is carried out, a frame support process is carried out by using the frame platform 70 to support the frame 64 that is moved out by the frame removal mechanism 68.

[0130] Reference Figure 5 Continuing the explanation, in the frame support process, firstly, the X-axis movable part 84 and the Z-axis movable part 86 of the frame removal mechanism 68 are moved, causing the frame 64, held by the suction pad 92, to contact the upper surface of the frame table 70. At this time, the frame table 70 is positioned in the lowered position. Figure 5 (The position is shown by the solid line in the middle). Next, release the attraction of the suction pad 92 of the frame removal mechanism 68 and place the frame 64 on the frame table 70. Then, move the X-axis movable part 84 and the Z-axis movable part 86 of the frame removal mechanism 68 to separate the holding part 88 from the top of the frame table 70.

[0131] After the frame support process is performed, the tape 96 is pasted onto the frame 64.

[0132] Reference Figure 6 To explain, in the pasting process, firstly, the frame platform 70 is lowered from the lowered position ( Figure 6The position shown in (a) is moved to the rising position where the tape 96 can be pasted onto the frame 64. Figure 6 Before the position shown in (b), pull the tape 96 out of the roll tape 96R and position the tape 96 with the release paper 116 peeled off above the frame table 70. Also, the adhesive side of the tape 96 positioned above the frame table 70 faces down.

[0133] Next, the frame platform 70 is raised to the extent that the pressing roller 132 of the pressing part 110 with the adhesive mechanism 98 can press the tape 96 against the frame 64 from above. Then, while pressing the adhesive surface of the tape 96 against the frame 64 with the pressing roller 132, the pressing roller 132 is rolled in the Y-axis direction. As a result, the tape 96 pulled out from the coil 96R by the tape pull-out part 108 can be pressed onto the frame 64.

[0134] Next, the cutter 144 and pressing roller 146 of the cutting section 112 of the adhesive mechanism 98 are lowered, pushing the cutter 144 against the strip 96 on the frame 64, and pressing the frame 64 from above the strip 96 using the pressing roller 146. Then, the arm 140 is rotated by the motor 138, causing the cutter 144 and pressing roller 146 to move in a circular motion along the frame 64. This allows the strip 96, which protrudes to the outer periphery of the frame 64, to be cut along the frame 64. Furthermore, since the pressing roller 146 presses the frame 64 from above the strip 96, positional misalignment between the frame 64 and the strip 96 is prevented when cutting the strip 96. Finally, the used strip 96, which has a circular opening 120, is wound by the strip winding section 106.

[0135] After the tape bonding process is performed, the following tape frame transfer process is performed: the frame 64 with the tape 96 bonded is transferred to the wafer stage 12, the opening 64a of the frame 64 is positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, and the tape frame 64' is placed on the wafer stage 12.

[0136] In the conveying process with a frame, firstly, the frame table 70 is moved from the rising position to the falling position. Next, the conveying mechanism 100 with the frame (see reference)... Figure 5 The Y-axis movable member 150 and Z-axis movable member 152 of the frame conveying mechanism 100 move, causing each suction pad 158 of the holding part 154 of the frame conveying mechanism 100 to move with the frame 64' (see reference) supported by the frame table 70 in the state where the adhesive surface of the belt 96 is facing down. Figure 7 The upper surface of the ) is in contact.

[0137] Next, the attraction source of the frame conveying mechanism 100 is activated to generate an attraction force on the attraction pad 158, thereby attracting and holding the upper surface of the frame 64' using the attraction pad 158. Then, the Y-axis movable part 150 and the Z-axis movable part 152 of the frame conveying mechanism 100 are moved to remove the frame 64' held by the attraction pad 158 from the frame table 70.

[0138] Next, the strapped frame 64', held by the suction pad 158 of the strapped frame conveyor 100, is conveyed to the wafer stage 12, as follows: Figure 7 As shown, the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported by the wafer stage 12, so that the frame 64' with the strap is in contact with the frame support portion 58 of the wafer stage 12. At this time, the adhesive surface of the strap 96 of the frame 64' is facing down, and the back surface 4b of the wafer 4 is facing up and is facing the adhesive surface of the strap 96.

[0139] Next, the attraction of the suction pad 158 of the frame conveying mechanism 100 is released, and the frame 64' is placed on the frame support 58 of the wafer stage 12. Then, the Y-axis movable member 150 and the Z-axis movable member 152 of the frame conveying mechanism 100 are moved, so that the holding part 154 is separated from the top of the wafer stage 12.

[0140] After the conveying process with the frame is performed, a pressing process is performed to press the tape 96 of the frame 64' onto the back side 4b of the wafer 4.

[0141] Reference Figures 7 to 9 To explain, in the belt pressing process, firstly, the upper chamber 160 is lowered by the lifting mechanism 164 of the belt pressing mechanism 102, causing the lower end of the side wall 172 of the upper chamber 160 to contact the upper end of the side wall 186 of the lower chamber 162. This closes the upper and lower chambers 160, and brings the pressing roller 174 into contact with the belt frame 64'. Thus, as... Figure 8 As shown, the upper end of the annular reinforcing part 24 of the chip 4 is attached to the adhesive surface of the strip 96 with the frame 64'.

[0142] Next, with the atmospheric opening 168 of the pressing mechanism 102 closed, the vacuum section 166 is activated, creating a vacuum inside the upper chamber 160 and the lower chamber 162. Then, as... Figure 8 and Figure 9As shown, by rolling the pressing roller 174 of the tape pressing mechanism 102 along the Y-axis, the tape 96 is pressed onto the back surface 4b of the wafer 4. This creates a frame unit U formed by pressing the back surface 4b of the wafer 4 with the tape 96. Next, the atmospheric opening 168 is opened, and atmospheric pressure forces the tape 96 to adhere tightly to the back surface 4b of the wafer 4 along the base of the annular reinforcement 24. Then, the upper chamber 160 is raised by the lifting mechanism 164. Furthermore, by creating a vacuum inside the upper chamber 160 and the lower chamber 162, the attraction of the wafer stage 12 to the wafer 4 disappears. However, when the upper chamber 160 and the lower chamber 162 are closed, the upper end of the annular reinforcement 24 of the wafer 4 adheres to the bonding surface of the tape 96 with the tape frame 64', thus preventing the wafer 4 from shifting position during the tape pressing process.

[0143] After the pressing process is performed, a frame unit removal process is performed, in which the frame unit U obtained by pressing the strip 96 with the frame 64' to the back surface 4b of the wafer 4 is removed from the wafer stage 12.

[0144] Reference Figure 5 To explain, in the frame unit removal process, firstly, the conveying part 206 of the frame unit removal mechanism 192 is activated, so that the lower surface of the adsorption sheet 210 of the wafer holding part 202a of the frame unit holding part 202 contacts the strip 96 on the back side 4b of the wafer 4, and the suction pad 214 of the frame holding part 202b contacts the frame 64.

[0145] Next, an attractive force is generated on the suction plate 210 of the wafer holding section 202a and the suction pad 214 of the frame holding section 202b. The wafer 4 is held from the back side 4b side (band 96 side) by the suction plate 210 of the wafer holding section 202a, and the frame 64 is held by the suction pad 214 of the frame holding section 202b. Next, the wafer stage 12 releases its grip on the wafer 4. Then, the transport section 206 is activated to remove the frame unit U held by the frame unit holding section 202 from the wafer stage 12.

[0146] After the frame unit removal process is performed, the following temporary placement process is performed: the center of the wafer 4 is aligned with the center of the temporary placement stage 204 and the frame unit U is temporarily placed on the temporary placement stage 204.

[0147] Reference Figure 10To explain, in the temporary placement process, firstly, the frame unit U held by the frame unit holding section 202 is positioned above the imaging section 224. Next, the transport section 206 of the two-dimensional moving mechanism constituting the frame unit removal mechanism 192 is activated, and the imaging section 224 captures images of at least three locations on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding section 202. As a result, the coordinates of at least three points on the outer periphery of the wafer 4 are measured. Then, the center coordinates of the wafer 4 are determined based on the measured coordinates of the three points.

[0148] Next, the transport unit 206 is activated to position the center of the wafer 4 at the center of the annular support portion 226 of the temporary stage 204, so that the remaining peripheral area 20 of the front surface 4a of the wafer 4 contacts the upper surface of the annular support portion 226 of the temporary stage 204, and the lower surface of the frame 64 contacts the upper surface of the frame support portion 228 of the temporary stage 204. At this time, the front surface 4a of the wafer 4 faces downward, but the device region 18 is located in the recess 230 of the temporary stage 204, so the device 14 will not contact the temporary stage 204, thus preventing damage to the device 14.

[0149] Next, the wafer holding part 202a releases its attraction and holding of the wafer 4, and the frame holding part 202b releases its attraction and holding of the frame 64, transferring the frame unit U from the frame unit removal mechanism 192 to the temporary stage 204. Then, the heater of the frame support part 228 is activated, heating the strip 96 of the frame unit U temporarily placed on the temporary stage 204. This softens the strip 96, causing it to adhere tightly to the base of the annular reinforcement part 24 of the wafer 4.

[0150] After the temporary placement process, a reinforcement removal process is performed to cut the wafer 4 of the frame unit U that has been moved out by the frame unit removal mechanism 192 and remove the annular reinforcement 24.

[0151] Reference Figure 1 , Figure 10 as well as Figure 12 To explain, in the reinforcement removal process, firstly, the X-axis movable component 260 and the Z-axis movable component 262 of the first lifting platform 246 of the reinforcement removal mechanism 194 are moved, causing the lower surface of the adsorption sheet 268 to contact the upper surface of the frame 64 of the frame unit U, which is temporarily placed on the temporary stage 204. Next, an attractive force is generated in each suction hole of the adsorption sheet 268 of the first lifting platform 246, attracting and holding the frame 64 portion of the frame unit U.

[0152] Next, the X-axis movable component 260 and Z-axis movable component 262 of the first lifting platform 246 are moved, such as... Figure 11As shown, the frame unit U, held by the adsorption sheet 268, is positioned above the laser beam irradiation unit 244. Next, the focusing point of the laser beam LB is positioned at the base of the annular reinforcing portion 24 of the wafer 4 of the frame unit U.

[0153] Next, while rotating the adsorption plate 268 and the frame unit U via the motor 266 of the first lifting platform 246, a laser beam LB is irradiated onto the base of the annular reinforcing portion 24 of the wafer 4. This allows for ablation of the base of the annular reinforcing portion 24 of the wafer 4, thereby forming an annular cutting groove 256. Furthermore, while the laser beam LB is irradiated onto the wafer 4, the attraction source of the laser beam irradiation unit 244 is activated to generate an attraction force in the attraction nozzle 254, which then attracts debris generated during the ablation process.

[0154] Next, the X-axis movable component 260 and Z-axis movable component 262 of the first lifting platform 246 are moved so that the remaining peripheral region 20 of the front surface 4a of the wafer 4 of the frame unit U, which is held by the suction plate 268, comes into contact with the upper surface of the annular support portion 226 of the temporary stage 204, and the lower surface of the frame 64 comes into contact with the upper surface of the frame support portion 228 of the temporary stage 204. Then, the suction force of the suction plate 268 of the first lifting platform 246 is released, and the frame unit U is transferred from the first lifting platform 246 to the temporary stage 204.

[0155] Next, the temporary platform 204, which received the frame unit U, is positioned below the separation section 248 of the reinforcement removal mechanism 194 via the temporary platform transport section 232 (see reference). Figure 10 Additionally, at this time, the belt conveyor 300 of the waste section 276 is positioned in a standby position. Next, the second lifting platform 272 of the separation section 248 is lowered, so that the lower surface of the second lifting platform 272 contacts the belt 96 of the back side 4b portion of the wafer 4. Then, an attractive force is generated on the lower surface of the second lifting platform 272, and the back side 4b side of the wafer 4 of the frame unit U is attracted and held by the second lifting platform 272.

[0156] Next, the second lifting platform 272, which holds the wafer 4 in the frame unit U, is raised, causing the frame unit U to separate from the temporary stage 204, and the temporary stage 204 is moved downwards from the first lifting platform 246. Then, as... Figure 14 As shown, the pair of feed mechanisms 290 and the Z-axis feed mechanism 294 of the separator 274 are activated to clamp the frame 64 in the vertical direction using the upper and lower clamping rollers 292a and 292b. In addition, the belt conveyor 300 of the waste section 276 is positioned from the standby position to the recycling position.

[0157] Next, ultraviolet light is irradiated from a pair of ultraviolet irradiation sections 270 to reduce the adhesive force of the tape 96 attached to the annular reinforcement 24. While pressing the annular reinforcement 24 downward using the pressing roller 298, the frame unit U, support shaft 286, and second lifting platform 272 are rotated relative to the separator 274 by the motor 284. This allows the annular reinforcement 24 to be separated from the frame unit U. The reinforcement 24 falling from the frame unit U is transported to the dust collection box 302 by the belt conveyor 300 for recycling. Alternatively, the separator 274 can be rotated relative to the frame unit U during the separation of the reinforcement 24.

[0158] After the reinforcement removal process is performed, a process is performed to remove the acyclic unit U' from the reinforcement removal mechanism 194, which removes the ring-shaped reinforcement 24.

[0159] In the acyclic unit removal process, firstly, the belt conveyor 300 of the waste section 276 of the reinforcing section removal mechanism 194 is positioned from the recycling position to the standby position. Next, the flipping mechanism 308 of the acyclic unit removal mechanism 196 (see reference...) Figure 16 The frame holding part 306 is positioned below the ringless unit U' attracted and held by the second lifting platform 272.

[0160] Next, with the suction pad 326 of the frame holding part 306 facing upward, the arm 318 is raised, so that the suction pad 326 of the frame holding part 306 contacts the lower surface side of the frame 64 of the ringless unit U', which is supported by the second lifting platform 272 and has the front side 4a of the wafer 4 facing downward.

[0161] Next, an attractive force is generated on the attraction pad 326 of the frame holding section 306, and the frame 64 of the acyclic unit U' is held in place by the attraction pad 326. Then, the attraction holding of the acyclic unit U' by the second lifting platform 272 is released. As a result, the acyclic unit U' is transferred from the second lifting platform 272 of the reinforcing removal mechanism 194 to the frame holding section 306 of the acyclic unit transfer mechanism 196.

[0162] After the acyclic unit removal process is performed, an acyclic unit storage process is performed to store the acyclic unit U' removed by the acyclic unit removal mechanism 196.

[0163] In the acyclic cell storage process, firstly, the flipping mechanism 308 of the acyclic cell removal mechanism 196 is flipped up and down, causing the acyclic cell U' held by the frame holding part 306 to flip up and down. As a result, the acyclic cell U' is located below the frame holding part 306, with the front side 4a of the wafer 4 facing upwards.

[0164] Next, the Y-axis movable part 316 and arm 318 of the flipping mechanism 308 are moved, so that the acyclic unit U' contacts the upper surfaces of the pair of support plates 328 of the acyclic unit support 310. At this time, the spacing between the pair of support plates 328 is narrowed by the spacing adjustment mechanism, and the pair of support plates 328 are pressed tightly against each other. Next, the frame holding part 306 releases the attraction holding of the acyclic unit U', and the acyclic unit U' is placed on the pair of support plates 328. Next, the heaters mounted on each support plate 328 are activated to heat the belt 96 of the acyclic unit U', thereby stretching the deflection and wrinkles of the belt 96 caused by the removal of the reinforcing part 24. Then, the frame holding part 306 is used again to attract and hold the acyclic unit U' and raise it.

[0165] Next, after widening the gap between the pair of support plates 328 via the gap adjustment mechanism, the ringless unit U' is placed on the upper surface of the support plate 328. Then, as... Figure 18 As shown, the push plate 338 of the push-in part 312 pushes the acyclic unit U' supported by the acyclic unit support part 310, so that the acyclic unit U' enters the frame box 198 placed on the frame box platform 200 for storage.

[0166] As described above, in the processing apparatus 2 of the illustrated embodiment, it is easy to perform the operation of attaching tape 96 to the back surface 4b of the wafer 4, on which a ring-shaped reinforcing portion 24 is formed in a convex shape on the back surface 4b corresponding to the outer peripheral remaining area 20, so as to integrate the wafer 4 with the frame 64, and it is easy to cut off the ring-shaped reinforcing portion 24 and remove it from the wafer 4, resulting in good productivity.

Claims

1. A processing apparatus for removing a convex reinforcing portion from a wafer on a back surface corresponding to a peripheral remaining region, wherein... The processing apparatus includes: A wafer cassette platform that holds wafer cassettes containing multiple wafers; A wafer removal mechanism that removes wafers from a wafer cassette placed on the wafer cassette stage; A wafer stage that supports the front side of the wafer being moved out by the wafer handling mechanism; A frame organizer that houses multiple annular frames, each annular frame having an opening for housing a wafer. A frame removal mechanism that removes the frame from the frame receiver; A frame platform that supports the frame that is moved out by the frame moving mechanism; It has an adhesive mechanism, which is installed above the frame platform to attach the tape to the frame; A frame-carrying mechanism is provided, which transports the frame with the attached strap to the wafer stage and positions the opening of the frame on the back of the wafer supported by the wafer stage, thereby placing the frame with the strap on the wafer stage. A pressing mechanism is used to press a framed strip onto the back side of a wafer with annular reinforcement. The frame unit removal mechanism removes the frame unit, which has been pressed between the frame and the back of the wafer using the pressing mechanism, from the wafer stage. The reinforcement removal mechanism cuts off and removes the annular reinforcement from the wafer of the frame unit that has been removed by the frame unit removal mechanism; A ringless unit removal mechanism removes the ringless unit from the reinforcement removal mechanism; as well as A frame box platform holds frame boxes that house acyclic units moved out by the acyclic unit removal mechanism. The belt pressing mechanism includes a pressing roller for pressing the framed belt onto the back side of the wafer. The tape pressing mechanism, with its interior in a vacuum state, uses the pressing roller to press the tape with the tape frame onto the back side of the wafer with the annular reinforcing portion. After pressing, the interior of the tape pressing mechanism is opened to the atmosphere, and the tape with the tape frame is pressed onto the wafer by atmospheric pressure.

2. The processing apparatus according to claim 1, wherein, The wafer unloading mechanism has a conveying arm and a hand. The hand is located at the front end of the conveying arm and supports the back side of the wafer stored in the wafer cassette, and flips the front and back sides of the wafer.

3. The processing apparatus according to claim 2, wherein, The hand is a Bernoulli pad that supports the wafer in a non-contact manner by generating negative pressure through the ejection of air.

4. The processing apparatus according to claim 1, wherein, The wafer stage has: An annular support portion that supports the remaining outer periphery of the wafer and does not contact the portion further inward than the remaining outer periphery; and A frame support portion is disposed on the outer periphery of the annular support portion to support the frame.

5. The processing apparatus according to claim 1, wherein, The adhesive tape mechanism has the following features: A tape support section that supports the tape wound with the tape to be used; The belt winding section is used to wind up the belt that has been used up. The belt pull-out section pulls the belt out from the tape reel; The crimping section, which crimps the pulled-out strip onto the frame; and The cutting section cuts off the strip that extends outward from the frame along the frame.

6. The processing apparatus according to claim 1, wherein, The crimping mechanism has the following features: The upper chamber is located above the wafer stage; The lower chamber houses the wafer stage; A lifting mechanism that raises and lowers the upper chamber to create a closed state where the upper chamber is in contact with the lower chamber and an open state where the upper chamber is separated from the lower chamber; A vacuum section that, in its closed state, makes the upper chamber and the lower chamber a vacuum; as well as An atmospheric opening section that opens the upper and lower chambers to the atmosphere. With the framed strip positioned on the back side of the wafer supported by the wafer stage, the lifting mechanism is activated to maintain the closed state, and the upper and lower chambers are made into a vacuum. The framed strip is then pressed onto the back side of the wafer using the pressing rollers disposed in the upper chamber.

7. The processing apparatus according to claim 1, wherein, The frame unit removal mechanism has the following features: A frame unit holding section includes a wafer holding section for holding a wafer and a frame holding section for holding a frame; and The transport department moves the frame unit holding part to the temporary storage table.

8. The processing apparatus according to claim 7, wherein, The frame unit removal mechanism has the following features: A two-dimensional moving mechanism that allows the frame unit to move two-dimensionally in the horizontal direction; and The imaging unit takes pictures of the outer periphery of the wafer of the frame unit held by the frame unit holding unit. The two-dimensional moving mechanism is activated to capture images of at least three parts of the outer periphery of the wafer using the imaging unit, thereby determining the center coordinates of the wafer and aligning the center of the wafer with the center of the temporary stage.

9. The processing apparatus according to claim 7, wherein, The reinforcement removal mechanism has the following features: A laser beam irradiation unit irradiates a laser beam toward the base of a ring-shaped reinforcement formed on the outer periphery of a wafer to form a cutting groove; The first lifting platform holds the frame unit temporarily placed on the platform and raises the frame unit, and positions the frame unit at the laser beam irradiation unit. as well as The separating section separates the annular reinforcing section from the cutting groove. The separation section has: The ultraviolet irradiation section irradiates the strip corresponding to the cutting groove with ultraviolet light, thereby reducing the adhesive force of the strip. The second lifting platform exposes the annular reinforcing part to the outer periphery to attract and hold the inner side of the wafer, and supports the frame. A separator that acts on the outer periphery of the annular reinforcing portion to separate the annular reinforcing portion; and The discarded part discards the separated annular reinforcing part. The first lifting platform temporarily places the frame unit with the cutting groove on the temporary platform, which is positioned at the separation section by the temporary platform conveying part, and the second lifting platform supports the frame unit temporarily placed on the temporary platform.

10. The processing apparatus according to claim 9, wherein, The temporary platform has a heater, and the first lifting platform holds the frame unit, which is attached to the base of the annular reinforcement, by means of the heater heating the belt.

11. The processing apparatus according to claim 9, wherein, The temporary storage platform has the following features: An annular support portion that supports the remaining outer periphery of the wafer and does not contact the portion further inward than the remaining outer periphery; and A frame support portion is disposed on the outer periphery of the annular support portion to support the frame.

12. The processing apparatus according to claim 10, wherein, The acyclic unit removal mechanism has the following features: A flipping mechanism having a frame holding portion that faces and holds the frame against the ringless unit supported by the second lifting platform, the flipping mechanism moving toward the frame box platform and flipping the frame holding portion. A ringless cell support section supports the ringless cell with the front side of the wafer facing upwards, which is flipped by the flipping mechanism. as well as The push-in section allows the acyclic unit, supported by the acyclic unit support section, to enter the frame box placed on the frame box platform for storage.

Images