Wafer cleaning device dynamically adjusting scrubbing friction

Abstract

The application discloses a wafer cleaning device capable of dynamically adjusting brushing friction, which comprises a wafer rotating assembly for supporting and driving the wafer to rotate, two cleaning brushes arranged on the two sides of the wafer and rolling around their own axes to brush the surface of the wafer, a cleaning brush moving assembly for driving the cleaning brush to move, a cleaning brush rotating assembly provided with a driving motor for driving the cleaning brush to rotate, and a controller for acquiring the load torque of the driving motor in the process that the cleaning brush moves from a starting position to contact the wafer for brushing, and controlling the cleaning brush moving assembly to adjust the moving and clamping stroke of the cleaning brush so as to keep the friction during brushing stable, wherein the controller is used for determining the adjustment amount of the moving and clamping stroke according to the type of consumables of the cleaning brush, and / or determining the adjustment amount of the moving and clamping stroke according to the cumulative running amount of the cleaning brush.

Description

Technical Field

[0001] This invention belongs to the field of post-chemical mechanical polishing cleaning technology, and particularly relates to a wafer cleaning device that dynamically adjusts the brushing friction force. Background Technology

[0002] Chemical mechanical polishing (CMP) is an ultra-precision surface finishing process that achieves global planarization. However, the large amounts of chemical reagents and abrasives used in CMP leave significant residues of abrasive particles and byproducts on the wafer surface after polishing. These contaminants can negatively impact subsequent processes and potentially lead to wafer yield losses. Therefore, multiple surface cleaning processes are required during wafer manufacturing to remove contaminants such as metal ions, atoms, organic matter, and particles adhering to the wafer surface.

[0003] In existing technologies, during actual operation, two cleaning brushes clamp the wafer at a set spacing for cleaning. The zero point of this spacing is set at the position where the cleaning brush just contacts the wafer. However, due to factors such as the precision of the mechanical structure, this zero point is not a stable value. Therefore, when cleaning the wafer at the set spacing, the wafer clamping tightness is unstable, and the friction between the cleaning brush and the wafer is also unstable. Furthermore, issues such as brush wear and variations in wafer thickness can also cause changes in the friction between the cleaning brush and the wafer, ultimately leading to unstable wafer cleaning results. Summary of the Invention

[0004] This invention provides a wafer cleaning device that dynamically adjusts the brushing friction force, aiming to at least solve one of the technical problems existing in the prior art.

[0005] This invention provides a wafer cleaning device for dynamically adjusting the friction force of brushing, comprising: a wafer rotation assembly for supporting and driving the wafer to rotate; two cleaning brushes disposed on both sides of the wafer and rolling around their own axes to clean the wafer surface; a cleaning brush moving assembly for driving the cleaning brushes to move; the cleaning brush rotation assembly being provided with a drive motor for driving the cleaning brushes to rotate; and a controller for acquiring the load torque of the drive motor during the process of the cleaning brushes moving from a starting position to contacting the wafer for cleaning; and controlling the cleaning brush moving assembly to adjust the moving clamping stroke of the cleaning brushes according to the load torque to keep the friction force stable during cleaning; wherein, the controller is used to determine the adjustment amount of the moving clamping stroke according to the type of consumables of the cleaning brushes, and / or, to determine the adjustment amount of the moving clamping stroke according to the cumulative running amount of the cleaning brushes.

[0006] In one embodiment, the controller includes:

[0007] The first calculation module is used to calculate the difference ΔT between the load torque and the torque set value;

[0008] The second calculation module is used to calculate the moving clamping stroke S by utilizing the functional relationship between the difference ΔT and the strain σ of the cleaning brush, the elastic modulus E of the cleaning brush, the friction coefficient f of brushing, and the moving clamping stroke S.

[0009] In one embodiment, the strain σ of the cleaning brush is a function of (SS′), where S is the moving clamping stroke and S′ is the fixed clamping stroke when the cleaning brush just contacts the wafer.

[0010] In one embodiment, the elastic modulus E of the cleaning brush is a function of the cleaning brush hardness K and the liquid flow rate V.

[0011] In one embodiment, the friction coefficient f of the brushing is a function of the brush usage time T and the liquid flow rate V.

[0012] In one embodiment, the controller calculates the moving clamping stroke according to the following formula:

[0013] ΔT=σ(SS′)*E(K,V)*f(T,V)*(R+S′-S)

[0014] Wherein, ΔT is the difference between the load torque and the torque setting value, σ(SS′) is the strain of the cleaning brush, S is the moving clamping stroke, S′ is the fixed clamping stroke when the cleaning brush just contacts the wafer, E(K,V) is the elastic modulus of the cleaning brush, K is the hardness of the cleaning brush, V is the liquid flow rate supplied to the surface of the cleaning brush during brushing, f(T,V) is the friction coefficient of the brushing, T is the usage time of the cleaning brush, and R is the cylindrical radius of the cleaning brush.

[0015] In one embodiment, the wafer rotation assembly includes a fixed base, a pair of driving rollers and driven rollers, wherein the driven rollers are disposed in the middle of the fixed base, and the driving rollers are symmetrically disposed on both sides of the driven rollers.

[0016] In one embodiment, the driving roller and the driven roller are configured with slots for supporting the wafer.

[0017] In one embodiment, the cleaning brush moving assembly includes a guide rail, a lead screw, and a drive component. The guide rail and the lead screw are respectively connected to the cleaning brush support assembly so that the cleaning brush support assembly moves along the guide rail under the drive of the lead screw. The drive component is disposed at the end of the lead screw and drives the lead screw to move, thereby moving the cleaning brush support assembly and the cleaning brush as a whole, so that both ends of the cleaning brush simultaneously contact or move away from the wafer.

[0018] The beneficial effects of the embodiments of the present invention include: maintaining the friction between the cleaning brush and the wafer within the required range during the wafer cleaning process, thereby ensuring the stability of the wafer cleaning process and improving the cleaning effect. Attached Figure Description

[0019] The advantages of the present invention will become clearer and easier to understand through the detailed description taken in conjunction with the following accompanying drawings, but these drawings are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0020] Figure 1 A schematic diagram of a wafer cleaning apparatus provided in one embodiment of the present invention;

[0021] Figure 2 A schematic flowchart of a wafer cleaning operation method provided in one embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of a cleaning process provided for one embodiment of the present invention. Detailed Implementation

[0023] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation of the present invention or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein. It should be understood that, unless specifically stated otherwise, for ease of understanding, the following description of specific embodiments of the present invention is based on the premise that the relevant equipment, devices, components, etc., are in their original static state and are not given external control signals or driving forces.

[0024] Furthermore, it should be noted that the terms used in this application to indicate orientation, such as front, back, up, down, left, right, top, bottom, front, back, horizontal, and vertical, are merely for ease of explanation and to aid in the understanding of relative position or direction, and are not intended to limit the orientation of any device or structure.

[0025] To illustrate the technical solution described in this invention, specific embodiments are described below.

[0026] In this application, chemical mechanical polishing is also referred to as chemical mechanical planarization. The substrate is also referred to as a wafer, with the same meaning and practical function.

[0027] Figure 1 This is a schematic diagram of the structure of a wafer cleaning device 1 with dynamically adjustable brushing friction provided in an embodiment of the present invention. The wafer cleaning device 1 includes a base 10, a wafer rotation assembly 20, two cleaning brushes 30, a cleaning brush support assembly 40, a cleaning brush moving assembly 50, a cleaning brush rotating assembly 60, and a controller (not shown). The controller is used to control the moving clamping stroke of the cleaning brushes 30.

[0028] like Figure 1 As shown, the wafer rotation assembly 20 is disposed on the upper part of the base 10, and the wafer W to be cleaned is supported by the wafer rotation assembly 20 and rotates around the axis of the wafer W.

[0029] The wafer rotation assembly 20 includes a fixed base, a pair of driving rollers and a driven roller. The driving and driven rollers are equipped with slots for supporting the wafer, and these slots are arranged around the outer periphery of the rollers. The driving and driven rollers are located on the fixed base, and the slots are in the same plane. The driven roller is located in the center of the fixed base, and the driving roller is symmetrically arranged on both sides of the driven roller. The pair of driving and driven rollers are arranged along the outer edge contour of the wafer. The wafer W placed in the wafer rotation assembly 20 is limited by the slots, and the outer edge of the wafer is tangent to the bottom surface of the slots. The driving roller is equipped with a roller drive motor, which drives the driving roller to rotate. The friction between the outer edge of the wafer and the roller causes the wafer to rotate around its axis.

[0030] like Figure 1 As shown, the cleaning brush 30 has a cylindrical structure and is made of a material with good water absorption, such as polyvinyl alcohol. The two cleaning brushes 30 are the first cleaning brush and the second cleaning brush, respectively, and are disposed on both sides of the wafer W to be cleaned. They can roll around their own axis to contact the surface of the wafer W to be cleaned.

[0031] like Figure 1 As shown, the cleaning brush support assembly 40 is used to support two cleaning brushes 30 located on both sides of the wafer W to be cleaned. The cleaning brush support assembly 40 includes a support plate, which is arranged perpendicular to the axis of the cleaning brush 30 at both ends of the cleaning brush 30. The support plate is fixed to the base 10 to support the cleaning brush 30 on the base 10.

[0032] like Figure 1As shown, the cleaning brush moving assembly 50 is connected to the cleaning brush support assembly 40 to drive the cleaning brush support assembly 40 and the cleaning brush 30 thereon to move as a whole, thereby enabling the two cleaning brushes to move towards each other and clamp the wafer at a certain angle for cleaning. The cleaning brush moving assembly 50 includes a guide rail, a lead screw, and a driving component. The guide rail and the lead screw are respectively connected to the cleaning brush support assembly 40 so that the cleaning brush support assembly 40 moves along the guide rail under the drive of the lead screw. The driving component is located at the end of the lead screw and drives the lead screw to move, thereby driving the cleaning brush support assembly 40 and the cleaning brush 30 to move as a whole, so that both ends of the cleaning brush 30 simultaneously contact or move away from the wafer. Furthermore, lead screws are respectively provided at both ends of the cleaning brush, so that the moving distance of the two ends of the cleaning brush can be adjusted separately.

[0033] During wafer cleaning, maintaining the friction between the cleaning brush 30 and the wafer within the required range is crucial for ensuring stable and effective cleaning. However, in actual operation, the two cleaning brushes 30 hold the wafer at a set interval, with the zero point of the interval set at the point where the brush 30 just contacts the wafer. The zero point is typically determined by the set torque of the cleaning brush 30. However, due to limitations in torque detection accuracy and mechanical precision, the zero point is not a stable value. This results in inconsistent wafer clamping and friction between the cleaning brush 30 and the wafer, even when held at the set interval. Furthermore, wear on the cleaning brush 30 and variations in wafer thickness also cause changes in the friction between the brush 30 and the wafer, ultimately leading to inconsistent wafer cleaning results.

[0034] To address the above problems, embodiments of the present invention provide a solution for dynamically adjusting the scrubbing friction force. For example... Figure 1 As shown, the cleaning brush rotation assembly 60 includes a drive motor disposed at the end of the cleaning brush 30 for driving the cleaning brush 30 to rotate. The drive motor drives the cleaning brush 30 to roll along its axis. The drive motor has a torque monitoring module that can monitor the load torque of the drive motor. This load torque is related to the distance between the cleaning brush 30 and the wafer. The closer the cleaning brush 30 is to the wafer, the greater the friction between them, and the greater the load torque of the drive motor; conversely, the farther the cleaning brush 30 is from the wafer, the less friction between them, and the smaller the load torque of the drive motor. Therefore, by monitoring the load torque of the drive motor, the moving position of the cleaning brush 30 can be indirectly controlled. During the wafer cleaning process, the contact state between the cleaning brush 30 and the wafer can be accurately monitored by the load torque of the drive motor, achieving a good wafer cleaning effect.

[0035] An embodiment of the present invention provides a controller for acquiring the load torque of the drive motor that drives the cleaning brush to rotate during the process of the cleaning brush moving from the starting position to contacting the wafer for cleaning; and controlling the cleaning brush moving assembly to adjust the moving clamping stroke of the cleaning brush according to the load torque to keep the frictional force during cleaning stable. In addition, the controller determines the adjustment amount of the moving clamping stroke according to the type of consumables used in the cleaning brush, and / or, according to the cumulative amount of operation of the cleaning brush.

[0036] In this embodiment, the frictional force between the cleaning brush and the wafer is proportional to the load torque of the drive motor that drives the cleaning brush to rotate. The load torque can be used to characterize the frictional force during brushing. The frictional force can be controlled by adjusting the moving clamping stroke of the cleaning brush to control the load torque.

[0037] In one embodiment, the controller compares the load torque with the torque setpoint; when the load torque reaches the torque setpoint, the moving clamping stroke remains unchanged, so that the two cleaning brushes maintain the current clamping distance; when the load torque is less than the torque setpoint, the moving clamping stroke is increased to reduce the clamping distance between the two cleaning brushes; when the load torque is greater than the torque setpoint, the moving clamping stroke is decreased to increase the clamping distance between the two cleaning brushes.

[0038] The embodiments of the present invention can maintain the friction between the cleaning brush and the wafer within the required range during the wafer cleaning process, thereby ensuring the stability of the wafer cleaning process and improving the cleaning effect.

[0039] Specifically, the controller can control the moving clamping stroke by adjusting the amount of movement of the lead screw through the drive component of the cleaning brush moving assembly 50.

[0040] In one embodiment of the present invention, the controller includes:

[0041] The first calculation module is used to calculate the difference ΔT between the load torque and the torque set value;

[0042] The second calculation module is used to calculate the moving clamping stroke S by utilizing the functional relationship between the difference ΔT and the strain σ of the cleaning brush, the elastic modulus E of the cleaning brush, the friction coefficient f of brushing, and the moving clamping stroke S.

[0043] In one embodiment, the strain σ of the cleaning brush is a function of (SS′), where S is the moving clamping stroke and S′ is the fixed clamping stroke when the cleaning brush just contacts the wafer.

[0044] Understandably, the moving clamping stroke S refers to the stroke of the cleaning brush as it moves from the starting position toward the wafer, and it is a variable. The fixed clamping stroke S′ is a fixed empirical value, which can be the stroke of the cleaning brush from the starting position to when it just contacts the wafer.

[0045] Furthermore, the strain σ of the cleaning brush is a function corresponding to the relationship curve with (SS′) as the variable, which is obtained by fitting experimental data obtained from test measurements of cleaning brushes of different types of consumables.

[0046] In one embodiment, the elastic modulus E of the cleaning brush is a function of the cleaning brush hardness K and the liquid flow rate V.

[0047] Furthermore, the elastic modulus E of the cleaning brush is a function corresponding to the relationship curve between the cleaning brush hardness K and the liquid flow rate V, which is obtained by fitting experimental data obtained from test measurements of cleaning brushes of different types of consumables.

[0048] In one embodiment, the friction coefficient f of the brushing is a function of the brush usage time T and the liquid flow rate V.

[0049] Furthermore, the friction coefficient f of the brushing is a function corresponding to the relationship curve with the brush usage time T and liquid flow rate V as variables, which is obtained by fitting experimental data obtained from test measurements of different types of cleaning brushes.

[0050] In one embodiment, the controller can calculate the moving clamping stroke according to the following formula:

[0051] ΔT=σ(SS′)*E(K,V)*f(T,V)*(R+S′-S)

[0052] Wherein, ΔT is the difference between the load torque and the torque setting value, σ(SS′) is the strain of the cleaning brush, S is the moving clamping stroke, S′ is the fixed clamping stroke when the cleaning brush just contacts the wafer, E(K,V) is the elastic modulus of the cleaning brush, K is the hardness of the cleaning brush, V is the liquid flow rate supplied to the surface of the cleaning brush during brushing, f(T,V) is the friction coefficient of the brushing, T is the usage time of the cleaning brush, and R is the cylindrical radius of the cleaning brush.

[0053] In another embodiment of the invention, the controller is used to determine the adjustment amount of the moving clamping stroke according to the type of consumables for the cleaning brush. Further, the controller sets the initial moving clamping stroke of the cleaning brush accordingly based on the type of consumables for the cleaning brush. The initial moving clamping stroke of the cleaning brush is a preset distance the cleaning brush moves from the starting position to the wafer clamping position.

[0054] In another embodiment of the invention, the controller further includes:

[0055] The storage module is used to record the cumulative number of cleaning brush cycles, where the cumulative number of cleaning brush cycles is the cumulative usage time of the cleaning brush or the cumulative number of wafers cleaned by the cleaning brush.

[0056] The pre-control module is used to determine the adjustment amount of the moving clamping stroke when the cumulative running amount of the cleaning brush reaches a preset amount, and can also adjust the initial moving clamping stroke of the cleaning brush. For example, when the cleaning brush processes 100 wafers, the initial moving clamping stroke of the cleaning brush is adjusted so that the distance between the two cleaning brushes is reduced but the friction force on the wafer remains stable.

[0057] like Figure 2 As shown, combined with Figure 1 Briefly describe the wafer cleaning process.

[0058] The first step is for the robotic arm to place the wafer W to be cleaned onto the wafer rotation assembly 20. At this time, a certain distance is reserved between the cleaning brush 30 and the side of the wafer W to provide working space for the robotic arm.

[0059] In the second step, the wafer rotation assembly 20 drives the wafer W to rotate around its axis, and the fluid jetting device (not shown) sprays cleaning fluid, such as acidic or alkaline cleaning fluid, toward the rotating wafer W.

[0060] Third, the two cleaning brushes 30 roll around their axes and move toward the wafer W, so that the cleaning brushes 30 contact the surface of the wafer W, and the first and second cleaning brushes are not completely parallel, but have a certain angle between them. For example, the first end of the first cleaning brush and the first end of the second cleaning brush press against the wafer, and the second end of the first cleaning brush and the second end of the second cleaning brush slightly contact the wafer. In other words, the distance between the first end of the first cleaning brush and the first end of the second cleaning brush is smaller than the distance between the second end of the first cleaning brush and the second end of the second cleaning brush.

[0061] The fourth step is to use a 30-rolling cleaning brush to clean the surface of the wafer W, removing contaminants from the wafer surface and achieving surface cleaning of the wafer.

[0062] Fifth step: After the wafer is cleaned, the cleaning brush 30 moves toward the outside of the wafer W and separates from the surface of the wafer W.

[0063] In the sixth step, the fluid jetting device (not shown) continues to spray cleaning fluid toward the rotating wafer W. After rinsing for a period of time, the wafer rotation is stopped, and the robot arm transfers the cleaned wafer W to the next process.

[0064] As can be seen from the wafer cleaning operation method, the position of the cleaning brush 30 needs to be moved at the beginning and end of the wafer cleaning process. Since the distance between the cleaning brush 30 and the wafer W determines their contact state, and this contact state is directly related to the effectiveness of the wafer surface cleaning, it is necessary to precisely control the movement and clamping stroke of the two cleaning brushes 30.

[0065] For ease of understanding, such as Figure 3 As shown, the wafer cleaning solution provided by the embodiments of the present invention is illustrated using a specific application scenario as an example.

[0066] 1) After starting, the wafer rotates, and the two cleaning brushes move toward the wafer to clamp it;

[0067] 2) Determine if the cleaning time has reached its end time;

[0068] 3) If the end time has not arrived, record the cleaning duration and compare the load torque with the torque setting value;

[0069] 4) If the load torque reaches the torque setting value, the moving clamping stroke remains unchanged, and the two cleaning brushes remain in their current positions;

[0070] 5) If the load torque is less than the torque setting value, increase the moving clamping stroke and reduce the clamping distance between the two cleaning brushes;

[0071] 6) If the load torque is greater than the torque setting value, reduce the moving clamping stroke and increase the clamping distance between the two cleaning brushes;

[0072] 7) If the cleaning end time is reached, drive the cleaning brush to open, and stop rotating after the wafer is rinsed to complete the cleaning.

[0073] In summary, the embodiments of the present invention can avoid the problem of unstable brushing friction caused by the error in the zero point determination of the clamping distance, and can avoid the problem of unstable brushing friction caused by factors such as brush wear and wafer thickness changes, thus ensuring the stability of the wafer cleaning process and improving the cleaning effect.

[0074] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of the invention and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of the invention, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer cleaning device for dynamically adjusting the scrubbing friction force, characterized in that, include: Wafer rotation assembly, used to support and drive the wafer to rotate; Two cleaning brushes are positioned on both sides of the wafer and roll around their own axis to clean the wafer surface. A cleaning brush moving assembly is used to drive the cleaning brush to move; The cleaning brush rotating assembly is equipped with a drive motor for driving the cleaning brush to rotate; The controller is used to acquire the load torque of the drive motor during the process of the cleaning brush moving from the starting position to contacting the wafer for brushing; and to control the cleaning brush moving assembly to adjust the moving clamping stroke of the cleaning brush according to the load torque so that the friction force during brushing remains stable. The controller is configured to determine the adjustment amount of the moving clamping stroke based on the type of consumables used in the cleaning brush, and / or, based on the cumulative operating time of the cleaning brush. The controller sets the initial moving clamping stroke of the cleaning brush according to the type of consumables used in the cleaning brush. The controller includes a storage module and a pre-control module. The storage module is configured to record the cumulative operating time of the cleaning brush, which is the cumulative usage time of the cleaning brush or the cumulative number of wafers cleaned by the cleaning brush. The pre-control module is configured to determine the adjustment amount of the moving clamping stroke when the cumulative operating time of the cleaning brush reaches a preset amount, and to adjust the initial moving clamping stroke of the cleaning brush every 100 wafers processed by the cleaning brush, so that the distance between the two cleaning brushes is reduced but the friction force on the wafer remains stable.

2. The wafer cleaning apparatus as described in claim 1, characterized in that, The controller includes: The first calculation module is used to calculate the difference ΔT between the load torque and the torque set value; The second calculation module is used to calculate the moving clamping stroke S by utilizing the functional relationship between the difference ΔT and the strain σ of the cleaning brush, the elastic modulus E of the cleaning brush, the friction coefficient f of brushing, and the moving clamping stroke S.

3. The wafer cleaning apparatus as described in claim 2, characterized in that, The strain σ of the cleaning brush is a function of (S-S'), where S is the moving clamping stroke and S' is the fixed clamping stroke when the cleaning brush just contacts the wafer.

4. The wafer cleaning apparatus as described in claim 2, characterized in that, The elastic modulus E of the cleaning brush is a function of the cleaning brush hardness K and the liquid flow rate V.

5. The wafer cleaning apparatus as described in claim 2, characterized in that, The friction coefficient f of the brushing is a function of the brush usage time T and the liquid flow rate V.

6. The wafer cleaning apparatus as described in claim 2, characterized in that, The controller calculates the moving clamping stroke according to the following formula: ΔT=σ(S-S')×E(K,V)×f(T,V)×(R+S'-S) Wherein, ΔT is the difference between the load torque and the torque setting value, σ(S-S') is the strain of the cleaning brush, S is the moving clamping stroke, S' is the fixed clamping stroke when the cleaning brush just contacts the wafer, E(K,V) is the elastic modulus of the cleaning brush, K is the hardness of the cleaning brush, V is the liquid flow rate supplied to the surface of the cleaning brush during brushing, f(T,V) is the friction coefficient of the brushing, T is the usage time of the cleaning brush, and R is the cylindrical radius of the cleaning brush.

7. The wafer cleaning apparatus as described in claim 1, characterized in that, The cleaning brush moving assembly includes a guide rail, a lead screw, and a driving component. The guide rail and the lead screw are respectively connected to the cleaning brush support assembly so that the cleaning brush support assembly moves along the guide rail under the drive of the lead screw. The driving component is located at the end of the lead screw and drives the lead screw to move, thereby moving the cleaning brush support assembly and the entire cleaning brush so that both ends of the cleaning brush simultaneously contact or move away from the wafer.

Images