A film mold, its manufacturing method and usage method

Abstract

This invention discloses a film mold, comprising a transparent PC board. The transparent PC board has, in sequence, a first ink layer, a base ink layer, a UV undercoat layer, a UV texture layer, a silica layer, and an AF film layer. The thickness of the AF film layer is 30±3nm, so that the water droplet angle on the surface of the AF film layer is 60±10°. This invention also discloses a method for manufacturing and using the film mold. The structure and method steps of this invention are rationally designed. By adjusting the thickness of the AF film layer to 30±3nm, the water droplet angle on the surface of the AF film layer is within the range of 60±10°, thereby increasing the hydrophilicity and wettability of the AF film layer. This effectively reduces the defect rate of bubbles generated during UV transfer of the film mold from over 80% with conventional surface treatment to less than 15%. Simultaneously, by coating the UV texture layer with a silica layer, the corrosive effect of adhesive on the film mold is effectively reduced, thereby increasing the service life of the film mold from 100 cycles to 200 cycles.

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