Exposure apparatus and display device manufacturing method using the same

Abstract

Disclosed are an exposure apparatus and a display device manufacturing method using the same. The exposure apparatus according to an embodiment includes a stage including a plurality of pin holes; a light source portion that emits light toward the stage; a plurality of lift pins configured to respectively penetrate the plurality of pin holes of the stage; a lift pin moving portion that lifts the plurality of lift pins; and a plurality of pin cooling sleeves that are disposed below the stage at each of the plurality of lift pins and each include a lift pin accommodating hole that communicates with the plurality of pin holes and into which at least a portion of the lift pin is inserted, and a gas supply hole that communicates with the lift pin accommodating hole.

Description

Technical Field

[0001] This invention relates to an exposure apparatus and a method for manufacturing a display device using the same. Background Technology

[0002] With the development of multimedia, the importance of display devices is increasing. Therefore, various display devices are used, such as Liquid Crystal Display (LCD) and Organic Light Emitting Display (OLED).

[0003] In the manufacturing process of a display device as described above, a process can be performed to harden monomers coated on a substrate by ultraviolet exposure. The monomer layer has different diffusivity depending on temperature; therefore, to prevent spots caused by temperature deviations, it is important to properly adjust the temperature of the apparatus performing the exposure and hardening process, as well as the temperature of the chamber containing it. Summary of the Invention

[0004] The problem to be solved by the present invention is to provide an exposure apparatus capable of reducing spots generated in the exposure and curing processes, and a method for manufacturing a display device using the same.

[0005] The subject matter of this invention is not limited to the subject matter mentioned above, and other technical subject matter not mentioned above will be clearly understood by those skilled in the art through the following description.

[0006] An exposure apparatus according to one embodiment for solving the aforementioned problem includes: a worktable including a plurality of pin holes; a light source unit that emits light onto the worktable; a plurality of lifting pins configured to pass through the plurality of pin holes of the worktable respectively; a lifting pin moving unit that moves the plurality of lifting pins; and a plurality of pin cooling sleeves disposed below the worktable for each of the plurality of lifting pins, and each including a lifting pin receiving hole communicating with the plurality of pin holes and inserted into at least a portion of the lifting pin, and a gas supply hole communicating with the lifting pin receiving hole.

[0007] Alternatively, when the object substrate is loaded on the worktable, the plurality of lifting pins rise to protrude from the top of the worktable, thereby supporting the bottom of the object substrate. When the light source exposes the object substrate, the plurality of lifting pins descend and are respectively housed in the plurality of pin holes.

[0008] Alternatively, when the plurality of lifting pins descend, gas can be injected into the lifting pin receiving hole through the gas supply hole.

[0009] Yes, the gas can be nitrogen.

[0010] Alternatively, when the plurality of lifting pins descend, each end of the plurality of lifting pins may be accommodated within the lifting pin accommodating hole.

[0011] The object substrate may include a base substrate and a hardened layer disposed on the base substrate and comprising monomers.

[0012] The target substrate may include: a substrate; a thin-film transistor layer on the substrate; a light-emitting element layer on the thin-film transistor layer; an inorganic film on the light-emitting element layer; and an organic film composition coated on the inorganic film and comprising monomers.

[0013] Alternatively, the worktable may include a plurality of gas jet holes that spray gas upwards, and the target substrate rises through the gas sprayed from the plurality of gas jet holes during exposure of the target substrate.

[0014] The pin cooling sleeve may include: a cylinder portion surrounding the lifting pin receiving hole, one side of the cylinder portion being inserted into the pin hole; and an extension portion protruding from the outer periphery of the cylinder portion toward the center to limit the insertion depth of the side of the cylinder portion.

[0015] Alternatively, the exposure apparatus may further include: a gas supply path connected to the gas supply holes of the plurality of pin cooling sleeves; and a gas supply section connected to the gas supply path.

[0016] The gas supply path may include: a main flow path, one end of which is connected to the gas supply unit; a plurality of first sub-flow paths branching from the main flow path; and a plurality of second sub-flow paths branching from the plurality of first sub-flow paths and respectively connected to the plurality of pin cooling sleeves.

[0017] Alternatively, the plurality of pin cooling sleeves may be configured in a matrix form, and each of the plurality of first sub-flow paths may be connected to the second sub-flow path of the plurality of second sub-flow paths that is connected to the pin cooling sleeve in the same row.

[0018] Alternatively, the number of rows of the plurality of pin cooling sleeves may be less than the number of columns of the plurality of pin cooling sleeves.

[0019] Alternatively, the exposure apparatus may further include: a first control valve disposed in the main flow path; a plurality of second control valves disposed in each of the plurality of first sub-flow paths; and a plurality of third control valves disposed in each of the plurality of second sub-flow paths.

[0020] Alternatively, the first control valve can be a regulator, and the second and third control valves can be speed controllers.

[0021] A method for manufacturing a display device according to one embodiment, used to solve the aforementioned problem, includes the steps of: loading a target substrate onto a worktable; lowering a plurality of lifting pins supporting the underside of the target substrate; and spraying gas onto the plurality of lifting pins to cool them.

[0022] Alternatively, the display device manufacturing method may further include a step of irradiating the target substrate with ultraviolet light after the plurality of lifting pins have descended, wherein the cooling of the plurality of lifting pins and the irradiation with ultraviolet light are performed simultaneously.

[0023] The display device manufacturing method may further include: raising the cooled plurality of lifting pins to support the target substrate after irradiating the ultraviolet light; and unloading the target substrate from the worktable.

[0024] Alternatively, the step of cooling the plurality of lifting pins may include the step of injecting the gas into at least one hole that houses the plurality of lifting pins.

[0025] Alternatively, the display device manufacturing method may further include: a step of coating a monomer layer onto the target substrate before loading the target substrate; and a step of transferring the target substrate, after the monomer layer coating has been completed, to any one of a plurality of exposure devices in a pre-given order.

[0026] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0027] (Invention Effects)

[0028] An exposure apparatus according to one embodiment and a method for manufacturing a display device using the same can provide a suitable temperature environment for exposure and curing, and reduce spots caused by temperature rise and / or temperature deviation.

[0029] The effects of the embodiments are not limited to those illustrated above, and many more effects are included in this specification. Attached Figure Description

[0030] Figure 1 This is a diagram showing a display device related to a display device manufacturing apparatus according to an embodiment.

[0031] Figure 2 It is along Figure 1 The cross-sectional view taken from II′.

[0032] Figure 3 This is a perspective view of a display device manufacturing apparatus according to an embodiment.

[0033] Figure 4 This is an exploded perspective view of a display device manufacturing apparatus according to an embodiment.

[0034] Figure 5 yes Figure 3 A cross-sectional view of part "A".

[0035] Figure 6 It is magnification Figure 3 A 3D view of the workbench below section "A".

[0036] Figure 7a as well as Figure 7b These are top and side views of the pin cooling sleeve of a display device manufacturing apparatus according to an embodiment.

[0037] Figure 8 This is a top view of the cooling flow path of a display device manufacturing apparatus according to an embodiment.

[0038] Figure 9 This is a schematic configuration diagram of a display device manufacturing system according to one embodiment.

[0039] Figure 10 This is a perspective view of a coating apparatus of a display device manufacturing system according to an embodiment.

[0040] Figure 11 This is a flowchart of a method for manufacturing a display device according to one embodiment.

[0041] Figures 12 to 14 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment.

[0042] Figure 15 This is a table showing the temperature and temperature deviation of the exposure apparatus stage, the air inside the exposure chamber, and the lifting pin of the exposure apparatus when using the display device manufacturing system according to an embodiment and when not in use.

[0043] Figure 16a as well as Figure 16b The results are experimental results comparing the outlines of spots when using a display device manufacturing system according to an embodiment and when not in use.

[0044] Figure 17 These are experimental results comparing the intensity of spots when using a display device manufacturing system according to an embodiment and when not in use.

[0045] (Explanation of reference numerals in the attached diagram)

[0046] 1: Display device

[0047] 10: Exposure device

[0048] 100: Light Source Section

[0049] 200: Workbench

[0050] 300: Multiple lifting pins

[0051] 400: Lifting Pin Moving Part

[0052] 500: Pin cooling sleeve

[0053] 600: Gas supply flow path

[0054] 700: Gas Supply Department

[0055] 800: Support section

[0056] 900: Control Department

[0057] 1000: Display Device Manufacturing System Detailed Implementation

[0058] The advantages, features, and methods of implementing the present invention are described in conjunction with the appended document. Figure 1 The detailed embodiments described below will become clear. However, the invention is not limited to the embodiments disclosed below and can be implemented in various forms that differ from each other. These embodiments are provided only to make the disclosure of the invention complete and to fully inform those skilled in the art of the invention of the scope of the invention. The invention is defined only by the scope of the claims.

[0059] The term "elements" or "layers" being referred to as "on" other elements or layers encompasses all cases where an element is directly on top of another element or has other layers or elements sandwiched in between. Throughout this specification, the same reference numerals refer to the same constituent elements. The shapes, sizes, ratios, angles, quantities, etc., disclosed in the figures used to illustrate embodiments are merely illustrative, and therefore the invention is not limited to the illustrated items.

[0060] The following describes specific embodiments with reference to the accompanying drawings.

[0061] Figure 1 This is a diagram showing a display device related to a display device manufacturing apparatus according to an embodiment. Figure 2 It is along Figure 1 The cross-sectional view taken from II′.

[0062] Hereinafter, the display device manufacturing apparatus and / or the display device 1 manufactured by the display device manufacturing system described later will be illustrated, but are not limited thereto.

[0063] Reference Figure 1 as well as Figure 2Display device 1 can refer to all electronic devices that provide a display screen. For example, it includes not only portable electronic devices that provide a display screen, such as mobile phones, smartphones, tablet PCs, electronic watches, smartwatches, smartwatch phones, mobile communication terminals, electronic manuals, e-books, PMPs (Portable Multimedia Players), navigators, game consoles, and digital cameras, but also televisions, laptops, monitors, billboards, and the Internet of Things (IoT). Display device 1 can include foldable display devices, rollable display devices, and flexible display devices.

[0064] The display device 1 can be formed into a substantially rectangular shape on a plane. The display device 1 can be a rectangle with perpendicular corners or a rectangle with rounded corners. The display device 1 can include four sides or edges. The display device 1 can include a long side and a short side.

[0065] The display device 1 may include a display area DA for displaying a screen and a non-display area NDA for not displaying a screen. When the display device 1 has a touch function, the display area DA and / or the non-display area NDA may include a touch area for sensing touch input.

[0066] The display area DA can include multiple pixels PX. The multiple pixels PX can be arranged in rows and columns. The shape of each pixel PX can be rectangular, square, or rhomboid in top view (i.e., when viewed from above).

[0067] The non-display area NDA is configured around the display area DA. The non-display area NDA may surround at least a portion of the display area DA. The non-display area NDA may be a border area. Signal wiring or driving circuitry for applying signals to the display area DA may be configured in the non-display area NDA.

[0068] The display device 1 may include a display panel 10.

[0069] Display panel 10 may include organic light-emitting display panels, micro LED display panels, nano LED display panels, quantum dot light-emitting display panels, liquid crystal display panels, plasma display panels, field emission display panels, electrophoretic display panels, electrowetting display panels, etc. Hereinafter, as an example of display panel 10, an organic light-emitting display panel will be shown, but it is not limited to this.

[0070] The display panel 10 may include a substrate SUB, a thin-film transistor layer (TFTL) on the substrate SUB, a light-emitting element layer (EL) on the TFTL, and a thin-film encapsulation layer (TFE) on the EL. In some embodiments, the display panel 10 may also include a touch layer disposed on the TFE and including a plurality of electrodes for sensing touch input.

[0071] The substrate SUB can be made of glass or plastic materials such as polyimide. The substrate SUB is flexible and can be bent.

[0072] The thin-film transistor layer (TFTL) can control the current supplied to each pixel PX of the display device 1 to control the brightness of each pixel PX. The TFTL may include, for example, an active layer capable of carrying current and gate, source, and drain electrodes for driving the active layer.

[0073] The light-emitting element layer EL may include a positive electrode, a negative electrode, and an organic light-emitting layer. The organic light-emitting layer is disposed between the positive electrode and the negative electrode and is composed of an organic compound that emits light by recombination of charges and holes moving through the positive electrode and the negative electrode.

[0074] The thin-film encapsulation layer TFE can cover the light-emitting element layer EL to prevent moisture and air from penetrating into the light-emitting element layer EL.

[0075] A thin-film encapsulation layer (TFE) can be formed by alternating multiple inorganic films and at least one organic film (OL). For example, the thin-film encapsulation layer (TFE) may include a first inorganic film (IOL1), a second inorganic film (IOL2), and an organic film (OL) between the first inorganic film (IOL1) and the second inorganic film (IOL2). For example, the organic film (OL) can be formed by ultraviolet exposure of a monomer coated on a substrate (SUB).

[0076] Reference Figure 1 as well as Figure 3 In the exposure process of curing the organic film OL of the thin-film encapsulation layer TFE by ultraviolet exposure, spot STNs may be generated on the organic film OL of the thin-film encapsulation layer TFE. These spot STNs may be caused by the temperature rise of the lifting pin 300 on the back of the support substrate SUB during the exposure process and / or by the temperature rise of the substrate SUB caused by conduction during the curing of the organic film OL. These spot STNs are visible to the naked eye and affect the aesthetics, and may cause malfunctions or incorrect operation of the display device 1.

[0077] To remove or reduce the STN spots, adjustments can be made to the temperature rise and deviation of the exposure apparatus and the exposure chamber in which the exposure apparatus is installed. The adjustment of the temperature rise and deviation of the exposure chamber can be achieved through the manufacturing methods of the exposure apparatus and display device described later.

[0078] The following is for reference Figures 3 to 8 Detailed description of the display device manufacturing apparatus.

[0079] Figure 3 This is a perspective view of a display device manufacturing apparatus according to an embodiment. Figure 4 This is an exploded perspective view of a display device manufacturing apparatus according to an embodiment. Figure 5 yes Figure 3 A cross-sectional view of part "A". Figure 6 It is magnification Figure 3 A 3D view of the workbench below section "A". Figure 7a as well as Figure 7b These are top and side views of the pin cooling sleeve of a display device manufacturing apparatus according to an embodiment. Figure 8 This is a top view of the cooling flow path of a display device manufacturing apparatus according to an embodiment.

[0080] Hereinafter, the first direction DR1, the second direction DR2, and the third direction DR3 intersect each other in different directions. The first direction DR1 can be a horizontal direction. The second direction DR2 can be a vertical direction. The third direction DR3 can be a thickness direction. The first direction DR1, the second direction DR2, and / or the third direction DR3 can include more than two directions. For example, the third direction DR3 can include an upper direction towards the upper side of the figure and a lower direction towards the lower side of the figure. Thus, one side of a component configured to face the upper direction can refer to the top, and the other side of a component configured to face the lower direction can refer to the bottom. However, the directions are illustrative and relative, and are not limited to the cases mentioned above.

[0081] The object substrate T described below includes a base substrate T_SUB and a curing layer T_MN. The curing layer T_MN is stacked on the base substrate T_SUB and includes monomers cured by exposure. The exposure apparatus 10 can be an apparatus that processes at least one layer of the object substrate T by exposure. In some embodiments, the base substrate T_SUB of the object substrate T may include... Figure 2 The example includes a substrate SUB, a thin film transistor layer (TFTL) on the substrate SUB, a light-emitting element layer (EL) on the thin film transistor layer (TFTL), a first inorganic film (IOL1) on the light-emitting element layer (EL), and an organic film composition comprising monomers coated for forming an organic film (OL) on the first inorganic film (IOL1).

[0082] Reference Figures 3 to 5 The exposure apparatus 10 includes a light source unit 100, a worktable 200, multiple lifting pins 300, a lifting pin moving part 400, and multiple pin cooling sleeves 500. The exposure apparatus 10 may also include a gas supply path 600, a gas supply part 700, a support part 800, and a control part 900.

[0083] The light source 100 emits light with a specific wavelength range. For example, the light source 100 may emit ultraviolet light with a wavelength range of 10 nm to 400 nm. In one embodiment, the light source 100 may be disposed on the stage 200 and emit light downwards to expose the object substrate T mounted on the stage 200. In several embodiments, the exposure apparatus 10 may further include a light source moving part 110 for moving the light source 100 in at least one direction. In several embodiments, the light source 100 may also be disposed within the interior space of the exposure chamber housing the exposure apparatus 10. In several embodiments, the light source 100 may be fixed while the stage 200 (described later) moves.

[0084] The worktable 200 is used to load the object substrate T. In one embodiment, the worktable 200 may be an air-floating worktable including a plurality of gas injection holes 210. The plurality of gas injection holes 210 may be arranged on the top of the worktable 200 and inject gas upward, thereby causing the object substrate T to rise and be spaced away from the top of the worktable 200. The worktable 200 may also include a plurality of pin holes 220 through which a plurality of lifting pins 300 described later pass. In one embodiment, the worktable 200 may be supported at a predetermined height by support portions 800 supporting both sides of the worktable 200 extending in a first direction DR1, but is not limited thereto.

[0085] Multiple lifting pins 300 are composed of rod-shaped components and are configured to pass through multiple pin holes 220 of the worktable 200. The multiple lifting pins 300 can be raised and lowered via the lifting pin moving part 400 described later. The multiple lifting pins 300 can rise to protrude from the top of the worktable 200 and support the underside of the target substrate T. Specifically, when the target substrate T is transferred from the outside and / or when the target substrate T after the exposure process is completed is transferred to the outside, the multiple lifting pins 300 can rise to support the underside of the target substrate T. When the target substrate T floats due to the pressure of the gas ejected from the worktable 200, the multiple lifting pins 300 can descend. In this case, the ends of the multiple lifting pins 300 are received within the multiple pin holes 220 of the worktable 200 and do not protrude from the top of the worktable 200. In one embodiment, the 16 lifting pins 300 are configured in a matrix shape with 4 rows and 4 columns, but are not limited thereto.

[0086] like Figure 5As shown, when the multiple lifting pins 300 rise, the ends of the multiple lifting pins 300 can contact the underside of the target substrate T. In this case, the temperature of the multiple lifting pins 300 may be higher than that of other components of the adjacent exposure apparatus 10, such as the stage 200 and / or the air temperature inside the chamber where the exposure apparatus 10 is located, due to the absorption of ultraviolet light and / or the heat generated during monomer curing. As a result, the temperature of a portion of the target substrate T in contact with the ends of the lifting pins 300 may be higher than the temperature of the remaining portion. The temperature rise and / or temperature deviation as described above may cause a thickness deviation of the curing layer T_MN disposed in the portion of the target substrate T, resulting in spot STN. For example, a portion of the curing layer T_MN located on the upper side of the lifting pins 300 may become more diffusive due to the temperature rise and may be recessed compared to the surrounding area, while the edge region of the portion of the curing layer T_MN may be more convex than the surrounding area. The generation of spot STN caused by the temperature rise and / or temperature deviation of the lifting pins 300 as described above can be reduced by the pin cooling sleeve 500 described later.

[0087] Refer again Figures 3 to 5 The lifting pin moving part 400 causes multiple lifting pins 300 to rise and fall. The lifting pin moving part 400 can be implemented, for example, by a hydraulically or pneumatically driven cylinder and / or by a servo motor driven linear moving guide. In one embodiment, multiple lifting pin moving parts 400 can be arranged below the worktable 200 and are constituted as rod-shaped members that connect to and support a portion of multiple lifting pins 300 arranged in the second direction DR2, but are not limited thereto.

[0088] Multiple pin cooling sleeves 500 may be disposed below the worktable 200 for each of the multiple lifting pins 300. In one embodiment, the multiple pin cooling sleeves 500 may be disposed between the lifting pin moving part 400 and the worktable 200. The multiple lifting pins 300 may be configured to pass through the multiple pin cooling sleeves 500 and the multiple pin holes 220.

[0089] Further reference Figure 6 , Figure 7a as well as Figure 7b The multiple pin cooling sleeves 500 may include a cylinder section 510, a lifting pin receiving hole 520, a gas injection hole 530, and an extension section 540.

[0090] The cylinder section 510 may be constructed as a tubular component having an inner diameter and an outer diameter. In one embodiment, the upper end 510_1 of the cylinder section 510 may be inserted into the pin hole 220 of the worktable 200, and the lower end 510_2 of the cylinder section 510 may be supported by the lifting pin moving part 400.

[0091] A lifting pin receiving hole 520 may be formed through the cylinder portion 510 to receive at least a portion of the lifting pin 300. The lifting pin receiving hole 520 may be formed to extend in the same direction as the pin hole 220 of the worktable 200, for example, in a vertical direction, with one end connected to and communicating with the pin hole 220 of the worktable 200.

[0092] The gas injection hole 530 may be formed through the cylinder portion 510 in a direction intersecting the direction extending from the lifting pin receiving hole 520, for example, horizontally. The gas injection hole 530 may be formed to penetrate the inner circumferential surface of the cylinder portion 510 forming the lifting pin receiving hole 520 and the outer circumferential surface of the cylinder portion 510 surrounding the inner circumferential surface. One end of the gas injection hole 530 may be connected to the lifting pin receiving hole 520 for communication with it.

[0093] The extension 540 can be formed by protruding from the outer periphery of the cylinder portion 510 in the direction of the center. The upper surface of the extension 540 can be in close contact with the lower surface of the worktable 200 to limit the insertion depth of the cylinder portion 510.

[0094] The gas supply path 600 connects the gas injection holes 530 of a plurality of pin cooling sleeves 500 and the gas supply section 700. In one embodiment, the gas supply path 600 may provide space between the underside of the worktable 200 and the lifting pin moving section 400, but is not limited thereto. Specifically, the plurality of pin cooling sleeves 500 may be arranged in a matrix configuration for each of a plurality of lifting pins 300 arranged between the underside of the worktable 200 and the lifting pin moving section 400, with the gas supply path 600 connected in series and / or in parallel to the gas injection holes 530 of each pin cooling sleeve 500. Gas transmitted through the gas supply path 600 may be supplied to the lifting pin receiving holes 520 of each pin cooling sleeve 500 through the gas injection holes 530.

[0095] Further reference Figure 8 The gas supply path 600 may include: a main flow path 610, one end of which is connected to the gas supply unit 700; a plurality of first sub-flow paths 620, which branch off from the main flow path 610; and a plurality of second sub-flow paths 630, which branch off from the plurality of first sub-flow paths 620 and are respectively connected to the plurality of pin cooling sleeves 500.

[0096] As described above, the plurality of lifting pins 300 and the plurality of pin cooling sleeves 500 can be configured in a matrix form having a plurality of rows R1, R2, R3, Rn extending in one direction and a plurality of rows C1, C2, C3, Cn extending in another direction intersecting the first direction. The first direction may be a first direction DR1, and the other direction may be a second direction DR2, but this is not a limitation. In one embodiment, the plurality of lifting pins 300 and the plurality of pin cooling sleeves 500 can be configured in a matrix form having M columns and N rows. In this case, the gas supply flow path 600 can be configured between the M columns and / or N rows. The plurality of pin cooling sleeves 500 are disposed on each of the plurality of lifting pins 300; therefore, the following description focuses on the plurality of pin cooling sleeves 500.

[0097] The multiple second sub-flow paths 630 can be configured differently depending on the number of rows and columns of the multiple pin cooling sleeves 500. Specifically, the multiple second sub-flow paths 630 can be connected to the pin cooling sleeves 500 located in the multiple rows R1, R2, R3, Rn and the multiple rows C1, C2, C3, Cn with smaller numbers. This allows for a reduction in piping quantity and / or efficient configuration of the control valves, as described later. For example, when M is greater than N, the multiple second sub-flow paths 630 can be configured in the column direction among the multiple rows R1, R2, R3, Rn. As another example, when M is less than N, the multiple second sub-flow paths 630 can be configured in the row direction among the multiple rows C1, C2, C3, Cn.

[0098] The display device manufacturing apparatus may further include: a first control valve RT disposed in the main flow path 610; a plurality of second control valves SC1 disposed in each of a plurality of first sub-flow paths 620; and a plurality of third control valves SC2 disposed in each of a plurality of second sub-flow paths 630.

[0099] The first control valve RT can be configured between the node where the first branch of the first sub-flow path 620 connects to the main flow path 610 and the node where it connects to the gas supply unit 700. Multiple second control valves SC1 can be configured respectively between the node where the main flow path 610 connects to the first sub-flow path 620 and the node where the first sub-flow path 620 connects to the second sub-flow path 630, which branches off from the first sub-flow path 620. Multiple third control valves SC2 can be configured respectively between one end of the pin cooling sleeve 500 connected to the second sub-flow path 630 and the other end connected to the first sub-flow path 620.

[0100] The first control valve RT controls the flow rate of gas through the main flow path 610. The second control valve SC1 controls the flow rate of gas through the first sub-flow path 620, and the third control valve SC2 controls the flow rate of gas through the second sub-flow path 630. Specifically, the second control valve SC1 controls the flow branch ratio from the main flow path 610 in the first sub-flow path 620, and the third control valve SC2 controls the flow branch ratio from the first sub-flow path 620 in the second sub-flow path 630.

[0101] Multiple first sub-flow paths 620 may each have the same flow rate. Specifically, the flow rate branch ratio of the second sub-flow path 630 supplying gas to the pin cooling sleeve 500 of the first row R1 may be 1, the flow rate branch ratio of the second sub-flow path 630 supplying gas to the pin cooling sleeve 500 of the second row R2 may be 1 / (N-(N-1)), the flow rate branch ratio of the second sub-flow path 630 supplying gas to the pin cooling sleeve 500 of the third row R3 may be 1 / (N-(N-2)), and the flow rate branch ratio of the second sub-flow path 630 supplying gas to the pin cooling sleeve 500 of the nth row Rn may be 1 / (N-1). In some embodiments, the multiple first sub-flow paths 620 may also have different flow rates from each other.

[0102] Multiple second sub-flow paths 630 may each have the same flow rate. Specifically, the flow rate branch ratio of the second sub-flow path 630 supplying gas to the pin cooling sleeve 500 of the first column C1 may be 1, the flow rate branch ratio of the second sub-flow path 630 supplying gas to the pin cooling sleeve 500 of the second column C2 may be 1 / (M-(M-1)), the flow rate branch ratio of the second sub-flow path 630 supplying gas to the pin cooling sleeve 500 of the third column C3 may be 1 / (M-(M-2)), and the flow rate branch ratio of the second sub-flow path 630 supplying gas to the pin cooling sleeve 500 of the m-th column Cm may be 1 / (M-1). In some embodiments, the multiple second sub-flow paths 630 may also have different flow rates from each other.

[0103] For example, assuming that multiple pin cooling sleeves 500 are arranged in a 4×4 matrix and the flow rate supplied from the gas supply unit 700 is 100, it is possible to distribute 25 flow rate to each of the four first sub-flow paths 620 and distribute 6.25 flow rate to each of the 16 second sub-flow paths 630.

[0104] In one embodiment, the first control valve RT may be a regulator, and the second control valve SC1 and the third control valve SC2 may be speed controllers. Different flow regulation units are configured according to their positions, thereby simplifying assembly, saving costs, and effectively utilizing the space between the worktable 200 and the lifting pin moving part 400. The regulator and / or speed controller can be controlled by the control unit 900 or operated manually. For example, the flow rates of the first sub-flow path 620 and the second sub-flow path 630 can be adjusted by appropriately adjusting the pointer and / or the rotation speed of the speed controller's handle.

[0105] The gas supply unit 700 supplies gas to the gas injection ports 530 of a plurality of pin cooling sleeves 500 through the gas supply flow path 600. The gas supplied by the gas supply unit 700 may have a temperature lower than that of the exposure apparatus 10 and / or the internal space of the chamber surrounding the exposure apparatus 10. That is, the gas may be a cooling gas. In one embodiment, the gas may be nitrogen (N2), but is not limited thereto. In several embodiments, the gas supply unit 700 may include at least one pump and a regulator for controlling the pressure and / or flow rate of the gas.

[0106] Refer again Figure 3 as well as Figure 4 The control unit 900 can control the overall operation of the exposure apparatus 10. The control unit 900 can control at least one of the light source unit 100, the worktable 200, the lifting pin moving part 400, the first control valve RT, the second control valve SC1, the third control valve SC2, and the gas supply unit 700.

[0107] In several embodiments, the exposure apparatus 10 may be provided within a chamber. In several embodiments, the chamber may be maintained with a nitrogen atmosphere.

[0108] Figure 5 The temperature rise and / or temperature deviation of the multiple lifting pins 300 described in detail are not only through... Figure 4 The cooling sleeve 500 of the exposure device 10 can also be cooled by the following Figure 9 as well as Figure 10 The display device manufacturing system is reduced to 1000.

[0109] Figure 9 This is a schematic configuration diagram of a display device manufacturing system according to one embodiment. Figure 10 This is a perspective view of a coating apparatus of a display device manufacturing system according to an embodiment.

[0110] Reference Figure 9 as well as Figure 10The display device manufacturing system 1000 may include: a plurality of coating chambers PC for performing coating processes, a plurality of exposure chambers UC for performing exposure processes, a transfer robot RBT for transferring a target substrate T between the coating chambers PC and the exposure chambers UC, and a control unit 9000.

[0111] Multiple coating chambers (PCs) and multiple exposure chambers (UCs) can be configured to centrally position the channel for the transfer robot (RBT) to move through. In one embodiment, a first coating chamber (PC1), a fourth exposure chamber (UC4), a fifth exposure chamber (UC5), and a sixth exposure chamber (UC6) may be configured on one side of the channel, while a second coating chamber (PC2), a first exposure chamber (UC1), a second exposure chamber (UC2), and a third exposure chamber (UC3) may be configured on the other side of the channel, but this is not a limitation.

[0112] Multiple coating apparatuses 20 can be configured in multiple coating chambers PC. In the multiple coating chambers PC, a hardened layer T_MN comprising monomers and cured by ultraviolet light can be coated on the target substrate T.

[0113] like Figure 10 As shown, the coating apparatus 20 may be, for example, an inkjet printer including a worktable 21, a support portion 24 supporting the worktable 21, an inkjet head 22 disposed on the worktable 21 and printing an ink composition including monomers onto the target substrate T, and an inkjet head moving portion 23 that moves the inkjet head 22 in at least one direction, but is not limited thereto.

[0114] Multiple exposure devices 10 can be configured within multiple exposure chambers UC. The exposure device 10 can be... Figure 4 The exposure apparatus 10. In one embodiment, the number of exposure chambers UC may be greater than the number of coating chambers PC. This is because the coating process may take less time than the exposure process.

[0115] A transfer robot RBT transports a substrate T. The transfer robot RBT can receive the substrate T from the entrance gate GT_IN at one end of the channel and transfer it to one of multiple exposure chambers UC. The transfer robot RBT can transfer the coated substrate T from the coating chamber PC to the exposure chamber UC. After the exposure process is complete, the transfer robot RBT can move the substrate T from the exposure chamber UC to the exit gate GT_OUT. Multiple transfer robots RBTs can be configured.

[0116] The control unit 9000 can control at least one of the coating chamber PC, the exposure chamber UC, the coating device 20, the exposure device 10, and the transfer robot RBT.

[0117] The control unit 9000 can control the transfer robot RBT to transfer the target substrate T from the coating chamber PC to the exposure chamber UC in a preset sequence. Specifically, the control unit 9000 can assign a sequence to each of the multiple exposure chambers UC, and after the coating process is completed, transfer the target substrate T to any one of the multiple exposure chambers UC in the specified sequence. For example, the transfer robot RBT can transfer the target substrate T in the sequence of first exposure chamber UC1, second exposure chamber UC2, third exposure chamber UC3, fourth exposure chamber UC4, fifth exposure chamber UC5, and sixth exposure chamber UC6. Specifically, when coating is completed in the first coating chamber PC1, the transfer robot RBT transfers the target substrate T to the first exposure chamber UC1; when coating is completed in the second coating chamber PC2, the transfer robot RBT transfers the target substrate T to the second exposure chamber UC2 instead of the adjacent fourth exposure chamber UC4. Therefore, multiple exposure chambers (UC) can be used evenly, preventing congestion in specific exposure chambers and ensuring sufficient cooling time for each exposure chamber.

[0118] The control unit 9000 can control the transfer robot RBT to sequentially transfer the target substrate T to multiple exposure chambers UC, and transfer the next target substrate T to each exposure chamber UC based on whether a preset time has elapsed. This ensures sufficient cooling time for the exposure chambers UC before inserting subsequent target substrates T.

[0119] In one embodiment, the preset time can be calculated from the moment the previous substrate T is inserted into the exposure chamber UC. The preset time can be approximately 220 seconds. In several embodiments, the preset time can be calculated from the moment a substrate T is ejected. In several embodiments, the preset time can be calculated from the moment the lifting pin 300 of the exposure apparatus 10 rises again after exposure is completed.

[0120] Figure 11 This is a flowchart of a method for manufacturing a display device according to one embodiment. Figures 12 to 14 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment.

[0121] The following display device manufacturing method can be achieved through Figure 4 Coating apparatus 20 and / or Figure 9 The display device manufacturing system 1000 is executed.

[0122] Reference Figure 11The method for manufacturing a display device may include: a step of loading a target substrate T onto a worktable 200 (S101); a step of lowering a plurality of lifting pins 300 supporting the target substrate T below (S102); and a step of spraying gas onto the plurality of lifting pins 300 to cool the plurality of lifting pins 300 (S103).

[0123] The method for manufacturing a display device may further include the step of irradiating the target substrate T with ultraviolet light after the plurality of lifting pins 300 have descended. In some embodiments, cooling of the plurality of lifting pins 300 and irradiation with ultraviolet light may be performed simultaneously.

[0124] The method for manufacturing a display device may further include at least one of the steps of raising a plurality of cooling lifting pins 300 after irradiation with ultraviolet light to support the target substrate T and unloading the target substrate T from the worktable 200.

[0125] The step of cooling the plurality of lifting pins 300 may include the step of injecting gas into at least one hole that houses the plurality of lifting pins 300.

[0126] The method for manufacturing a display device may further include at least one of the following steps: coating a monomer layer onto the target substrate T before loading the target substrate T; and transferring the target substrate T, after the monomer layer coating has been applied, to any one of a plurality of exposure apparatuses 10 in a pre-given order.

[0127] The method for manufacturing a display device is not limited to the example described above; at least some of the steps may be omitted, or reference may be made to... Figures 1 to 10 It also includes at least one other step.

[0128] The following is for reference Figures 12 to 14 Detailed explanation of the manufacturing method of the display device.

[0129] Reference Figure 12 The object substrate T can be transferred from the outside and loaded onto the worktable 200. In several embodiments, the object substrate T can be... Figure 9 The transfer robot RBT moves the object substrate T onto the worktable 200. At this time, the bottom of the object substrate T can be supported by the ends of the plurality of lifting pins 300, which are in an elevated state, and separated from the top of the worktable 200. In some embodiments, before loading the object substrate T, the plurality of lifting pins 300 are respectively housed in a plurality of pin cooling sleeves 500, and gas supplied from the gas supply unit 700, such as nitrogen, is injected into the lifting pin receiving holes 520 of the plurality of pin cooling sleeves 500, thereby cooling the plurality of lifting pins 300.

[0130] Reference Figure 13After the object substrate T is placed on the ends of multiple lifting pins 300, it is sprayed upwards from the worktable 200, thereby raising the object substrate T. As a result, the object substrate T can float above the worktable 200. (See reference...) Figure 5 as well as Figure 13 When sufficient gas pressure is provided to raise the target substrate T, a plurality of lifting pins 300 descend, and the ends of the plurality of lifting pins 300 can be received within a plurality of pin holes 220 of the worktable 200. In one embodiment, the ends of the plurality of lifting pins 300 may be located within pin receiving holes of a pin cooling sleeve 500. In several embodiments, the ends of the plurality of lifting pins 300 may also be located within pin holes 220 of the worktable 200. In several embodiments, when the plurality of lifting pins 300 descend, leveling can be performed by adjusting the pressure of the gas ejected from the worktable 200 to ensure that the target substrate T is configured flat.

[0131] When the multiple lifting pins 300 descend, gas can be injected from the gas injection port 530 of the pin cooling sleeve 500. The gas can have a temperature lower than the ambient temperature to cool the lifting pins 300. In one embodiment, the gas can be nitrogen, but is not limited thereto.

[0132] After the target substrate T floats, the light source unit 100 can irradiate the target substrate T with ultraviolet light. The hardening layer T_MN of the target substrate T can be hardened by ultraviolet light exposure.

[0133] Reference Figure 14 After exposure is complete, the light source 100 stops irradiating ultraviolet light, and the multiple lifting pins 300 rise again to support the bottom of the object substrate T. The object substrate T, supported by the multiple lifting pins 300, can be unloaded from the worktable 200. For example, the object substrate T can be... Figure 9 The transfer robot RBT delivers the material to the outside of the exposure device 10.

[0134] Figure 15 This is a table showing the temperature and temperature deviation of the exposure apparatus stage, the air inside the exposure chamber, and the lifting pin of the exposure apparatus when using the display device manufacturing system according to an embodiment and when not in use.

[0135] Reference Figure 15The display device manufacturing system 1000 sequentially feeds the target substrate T into multiple exposure chambers UC. By cooling the lifting pin 300 with gas injected into the pin cooling sleeve 500 of the exposure apparatus 10, the temperature and / or temperature deviation of the stage 200 of the exposure apparatus 10, the air in the exposure chambers UC, and the lifting pin 300 of the exposure apparatus 10 can be reduced. For example, according to one embodiment, the display device manufacturing system 1000 can reduce the temperature of the stage 200 of the exposure apparatus 10, the air in the exposure chambers UC, and the lifting pin 300 of the exposure apparatus 10 by approximately 0.1° and 1.6° respectively, and reduce the temperature deviation by approximately 1.2°.

[0136] Figure 16a as well as Figure 16b The results are experimental results comparing the outlines of spots when using a display device manufacturing system according to an embodiment and when not in use.

[0137] Figure 16a It is a graph showing the outline of the spot STN when the display device manufacturing system 1000 according to an embodiment is not used. Figure 16b This is a graph showing the outline of a dot STN when using a display device manufacturing system 1000 according to an embodiment.

[0138] The horizontal axis of the graph represents the distance from any measurement point, and the vertical axis represents the thickness of the hardened layer T_MN.

[0139] Reference Figure 1 , Figure 16a as well as Figure 16b When the substrate T is not sequentially transferred to multiple exposure chambers UC and the multiple lifting pins 300 are not cooled, the size S of the spot STN is approximately 9 mm to 10 mm, and the spacing W between the first peak point P1 and the second peak point P2 of the spot STN is approximately 5 mm to 6 mm. Additionally, the step difference D of the spot STN is approximately 1.2 μm to 1.7 μm.

[0140] When the substrate T is sequentially moved to multiple exposure chambers UC and multiple lifting pins 300 are cooled, the size S′ of the spot STN is approximately 9 mm to 10 mm, and the spacing W′ between the first peak point P1′ and the second peak point P2′ of the spot STN is approximately 4 mm to 5 mm. Additionally, the step difference D′ of the spot STN is approximately 1.2 μm to 1.7 μm.

[0141] That is, when the display device 1 is manufactured using the display device manufacturing system 1000 according to an embodiment, the spacing between the first peak point P1′ and the second peak point P2′ of the spot STN of the display device 1 and the step difference of the spot STN can be reduced.

[0142] Figure 17These are experimental results comparing the intensity of spots when using a display device manufacturing system according to an embodiment and when not in use.

[0143] Figure 17 The graph illustrates the intensity of the STN spots on display device 1 measured using an Auto Optical Inspection Device. The horizontal axis of the graph represents the time period, and the vertical axis represents the intensity of the STN spots.

[0144] The first time period R1 represents the intensity of the STN spots on the display device 1 when the substrate T is not sequentially moved to multiple exposure chambers UC and the multiple lifting pins 300 are not cooled. The second time period R2 represents... Figure 9 The intensity of the STN spot is as follows, where the target substrate T is sequentially moved to multiple exposure chambers UC as in the embodiment. The third time period R3 represents the period when the target substrate T is sequentially moved to multiple exposure chambers UC and as... Figure 5 as well as Figure 13 The intensity of the STN spot when multiple lifting pins 300 are cooled by gas injected from the gas injection port 530 of the pin cooling sleeve 500, as in the embodiment.

[0145] Reference Figure 1 as well as Figure 17 In the first time period R1, the intensity of the spot STN of the display device 1 is approximately 44, which is relatively high compared to other time periods. Conversely, in the second time period R2, the intensity of the spot STN of the display device 1 is approximately 16, which is lower than that in the first time period R1. That is, the intensity of the spot STN decreases as the target substrate T is sequentially transferred to the plurality of exposure chambers UC. Furthermore, in the third time period R3, the intensity of the spot STN of the display device 1 is approximately 11, which is lower than that in both the first time period R1 and the second time period R2. That is, the intensity of the spot STN can be further reduced when the plurality of lifting pins 300 are cooled by gas. In other words, when the display device 1 is manufactured using the display device manufacturing system 1000 according to an embodiment, the intensity of the spot STN of the display device 1 is significantly reduced to approximately 1 / 4.

[0146] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that the invention can be implemented in other specific forms without altering its technical concept or essential features. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not intended to limit the scope of the invention.

Claims

1. An exposure apparatus, wherein, include: The worktable includes multiple pin holes; The light source emits light onto the worktable; Multiple lifting pins are configured to pass through the multiple pin holes of the worktable respectively; The lifting pin moving part raises and lowers the plurality of lifting pins; Multiple pin cooling sleeves are disposed below the worktable for each of the multiple lifting pins, and each includes a lifting pin receiving hole that communicates with the multiple pin holes and is inserted into at least a portion of the lifting pin, and a gas supply hole that communicates with the lifting pin receiving hole and is used to supply gas for cooling the multiple lifting pins. A gas supply path is connected to the gas supply holes of the plurality of pin cooling sleeves; as well as The gas supply unit is connected to the gas supply flow path. Furthermore, the gas supply unit is configured to inject gas when the plurality of lifting pins descend, and the injected gas is supplied to the space inside the lifting pin receiving hole and outside the lifting pin through the gas supply flow path and the gas supply hole, thereby contacting the outside of the lifting pin.

2. The exposure apparatus according to claim 1, wherein, When the substrate is loaded onto the worktable, the plurality of lifting pins rise to protrude from the top of the worktable, thereby supporting the bottom of the substrate. When the light source exposes the substrate, the plurality of lifting pins descend and are respectively housed in the plurality of pin holes.

3. The exposure apparatus according to claim 2, wherein, As the plurality of lifting pins descend, gas is injected into the lifting pin receiving hole through the gas supply hole.

4. The exposure apparatus according to claim 2, wherein, When the plurality of lifting pins descend, each end of the plurality of lifting pins is accommodated in the lifting pin accommodating hole.

5. The exposure apparatus according to claim 2, wherein, The target substrate includes a base substrate and a hardened layer disposed on the base substrate and comprising monomers.

6. The exposure apparatus according to claim 2, wherein, The worktable includes a plurality of gas jet holes that spray gas upwards, and the target substrate rises through the gas sprayed from the plurality of gas jet holes during exposure.

7. The exposure apparatus according to claim 1, wherein, The pin cooling sleeve includes: a cylinder portion surrounding the lifting pin receiving hole, one side of the cylinder portion being inserted into the pin hole; and an extension portion protruding from the outer periphery of the cylinder portion toward the center to limit the insertion depth of the side of the cylinder portion.

8. The exposure apparatus according to claim 1, wherein, The gas supply path includes: a main flow path, one end of which is connected to the gas supply unit; a plurality of first sub-flow paths branching from the main flow path; and a plurality of second sub-flow paths branching from the plurality of first sub-flow paths and respectively connected to the plurality of pin cooling sleeves.

9. The exposure apparatus according to claim 8, wherein, The plurality of pin cooling sleeves are configured in a matrix form, and each of the plurality of first sub-flow paths is connected to the second sub-flow path of the plurality of second sub-flow paths that is connected to the pin cooling sleeve in the same row. The number of rows of the plurality of pin cooling sleeves is less than the number of columns of the plurality of pin cooling sleeves.

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