Packaging structure and packaging method of high-power radio frequency device

Abstract

The application discloses a packaging structure of a high-power radio frequency device, which comprises multiple parallel radio frequency power chips and a packaging flange, the multiple radio frequency power chips are arranged in a packaging inner cavity of the packaging flange in an inclined mode, the number of input leads of the radio frequency power chips is reduced, and the input leads and output leads are not overlapped in space. The multiple chips are arranged on the packaging flange in an inclined mode, the utilization rate of the packaging space is obviously improved, and the purpose of higher power output is achieved. By reducing the number of input leads of the intermediate radio frequency power chips in a small amount, the output leads can not be reduced, the reliability of the high-power application process can be ensured, the large-area overlapping of the input leads and the output leads in space is avoided, mutual inductance is reduced, and the radio frequency power device is effectively prevented from oscillating.

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