Bonding apparatus and bonding method using the same

Abstract

An adhesive bonding apparatus is disclosed, comprising a welding head and a laser section. The welding head is used to transmit vibration waves to the objects to be bonded and includes: a light-transmitting section comprising a first material as a light-transmitting substance; and a support section disposed on one side of the light-transmitting section in a first direction and comprising a second material with a light transmittance lower than that of the light-transmitting substance. The laser section is used to irradiate the objects to be bonded with a laser, wherein the laser irradiated by the laser section is transmitted to the objects to be bonded through the light-transmitting section.

Description

Technical Field

[0001] This invention relates to an adhesive device and an adhesive method using the same. Background Technology

[0002] A display device is a device for displaying data in a visual manner. The display device includes a substrate divided into a display area and a non-display area. Multiple pixels are arranged in the display area of ​​the substrate, and pads, etc., are arranged in the non-display area. Driver components, including driving circuitry, are mounted on the pads to transmit driving signals to the pixels. The driver components can be provided as driver chips and can be bonded to the pads using an adhesive device. Summary of the Invention

[0003] Technical problems to be solved

[0004] The problem to be solved by the present invention is to provide an adhesive device that can easily adjust the heating rate of the contact portion between the display device and the driving component.

[0005] Another problem to be solved by the present invention is to provide a bonding method that allows for easy adjustment of the heating rate of the contact portion between the display device and the external device.

[0006] The problems to be solved by the present invention are not limited to the technical problems mentioned above, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0007] Solution

[0008] An adhesive bonding apparatus according to one embodiment for solving the above-mentioned problems includes a welding head and a laser section, wherein the welding head is used to transmit vibration waves to the bonding object and includes: a light transmission section including a first material as a light-transmitting material; and a support section disposed on one side of the light transmission section in a first direction and including a second material with a light transmittance lower than that of the light-transmitting material, and the laser section is used to irradiate the bonding object with a laser, wherein the laser irradiated by the laser section is transmitted to the bonding object through the light transmission section.

[0009] The light-transmitting part and the supporting part can be integrated as one unit.

[0010] The light-transmitting part and the supporting part can be directly joined.

[0011] The welding head may also include a diffuser, which is arranged between the light-transmitting part and the support part, and is composed of a first material of the light-transmitting part and a second material of the support part.

[0012] The first substance may include ceramics, and the second substance may include metals or metal alloys.

[0013] The support portion can also be arranged on the other side of the light-transmitting portion in the first direction, and in a plane, the light-transmitting portion can be completely surrounded by the support portion.

[0014] The light-transmitting part can be located on the outermost side of the welding head.

[0015] The welding head may also include a reflector located inside the light transmission section, and the laser irradiated by the laser section can be transmitted to the bonding object through the reflector via the light transmission section.

[0016] The light-transmitting portion may include: an inner portion, the upper surface of which and the bottom surface of which are located at the same level as the support portion; and a pointed head that protrudes from the inner portion along the thickness direction, wherein the thickness of the pointed head may be less than the length of the pointed head in the first direction.

[0017] The cross-sectional shape of the inner part can be an inverted trapezoid with the upper side longer than the lower side.

[0018] The length of the lower side can be 50% to 90% of the length of the upper side.

[0019] The light-transmitting part and the supporting part can be integrated by fastening.

[0020] The support portion may include a main support portion formed of a second material and a sub-support portion formed of a first material, and the fastening portion may fasten the main support portion and the sub-support portion.

[0021] On a plane, the length of the short side of the light-transmitting part and the length of the short side of the main support part can be the same as the length of the short side of the welding head.

[0022] An adhesive bonding method according to one embodiment for solving the other problem mentioned above includes: the step of arranging a display panel including a first conductive pattern on a table; the step of bringing a second conductive pattern of a driving member into close contact with the first conductive pattern on the display panel; and the step of vibrating the second conductive pattern and irradiating a laser onto the contact portion between the first and second conductive patterns to bond the first and second conductive patterns, wherein the vibration of the second conductive pattern is generated by the vibration of a welding head on the upper surface of the driving member, the welding head including a light-transmitting portion formed of a first material as a light-transmitting material, and the laser reaches the contact portion through the light-transmitting portion.

[0023] In the step of bonding the first conductive pattern to the second conductive pattern, the vibration of the second conductive pattern can generate frictional heat at the contact portion, and the laser irradiated onto the contact portion can be converted into heat energy at the contact portion.

[0024] The welding head may also include a support portion located on one side of the light-transmitting portion, and the support portion may be formed of a second material with lower light transmittance than the first material.

[0025] The light-transmitting part and the support part can be directly joined, and the welding head can also include a diffusion part, which is arranged between the light-transmitting part and the support part, and is composed of a first material of the light-transmitting part and a second material of the support part.

[0026] A bonding method according to another embodiment for solving the aforementioned other problem includes: the step of arranging a display panel including a first conductive pattern on a stage; the step of bringing a second conductive pattern of a drive member into close contact with the first conductive pattern on the display panel; and the step of vibrating the second conductive pattern and irradiating a laser onto the contact portion between the first and second conductive patterns to bond the first and second conductive patterns, wherein the vibration of the second conductive pattern is generated by the vibration of a welding head on the upper surface of the drive member, the stage is formed of a first material that is a light-transmitting material, and the laser reaches the contact portion through the stage.

[0027] The welding head can be formed from a second substance with lower light transmittance than the first substance.

[0028] The details of other embodiments are included in the detailed description and accompanying drawings.

[0029] Beneficial effects

[0030] The heating rate of the contact portion between the display device and the driving member can be easily adjusted using the bonding device according to the embodiment.

[0031] The effects of the embodiments are not limited to those illustrated above, and many more effects are included in this specification. Attached Figure Description

[0032] Figure 1 This is a block diagram of an adhesive device according to one embodiment.

[0033] Figure 2 This is a cross-sectional view of a process step of an adhesive method according to an embodiment, utilizing an adhesive apparatus according to an embodiment.

[0034] Figure 3 This is a perspective view showing the welding head of an adhesive device according to one embodiment.

[0035] Figure 4 It is along Figure 3 A sectional view taken from line I-I'.

[0036] Figure 5 It is Figure 4 An enlarged sectional view of region A.

[0037] Figure 6 This is a plan view of the welding head according to one embodiment.

[0038] Figure 7 This is a graph showing the amplitude (X-axis direction) of the bonding device in the longitudinal vibration mode according to an embodiment.

[0039] Figure 8 It is a chart comparing the heating rates of the contact areas of each sample.

[0040] Figure 9 This is a perspective view of the welding head according to another embodiment.

[0041] Figure 10 It is along Figure 9 A sectional view taken from line II-II'.

[0042] Figure 11 This is a plan view of the welding head according to another embodiment.

[0043] Figure 12 It is based on Figure 11 A variation of the plan view of the welding head.

[0044] Figure 13 This is a cross-sectional view of the welding head according to yet another embodiment.

[0045] Figure 14 This is a cross-sectional view of the welding head according to yet another embodiment.

[0046] Figure 15 This is a cross-sectional view of the welding head according to yet another embodiment.

[0047] Figure 16 This is a cross-sectional view of the welding head according to yet another embodiment.

[0048] Figure 17 This is a cross-sectional view of the welding head according to yet another embodiment.

[0049] Figure 18 This is a cross-sectional view showing one process step of an bonding method according to another embodiment.

[0050] Explanation of reference numerals in the attached figures

[0051] 100: Display panel

[0052] 1: Adhesive bonding device

[0053] 10: Ultrasonic bonding section

[0054] 20: Laser Department Detailed Implementation

[0055] The advantages and features of the present invention, as well as the methods for achieving these advantages and features, will become clear from the following detailed description of embodiments in conjunction with the accompanying drawings. However, the present invention can also be implemented in other forms and is not limited to the embodiments disclosed below. That is, the present invention is defined only by the scope of the claims.

[0056] When referring to elements or layers "on" or "above" other elements or layers, it includes both cases where the element is directly on the other element or layer and cases where other layers or elements are inserted in between. Conversely, when referring to an element "directly on" or "directly above," it means that there are no other elements or layers inserted in between.

[0057] Throughout the specification, the same reference numerals are used for the same or similar parts.

[0058] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0059] Figure 1 This is a block diagram of an adhesive device according to one embodiment.

[0060] Reference Figure 1 The bonding device 1 is a device for bonding conductive patterns that are different from each other.

[0061] The bonding device 1 can be used in the manufacturing process of a display device. A display device is a device used to display moving or still images. It can be portable electronic devices such as mobile phones, smartphones, tablet computers, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigators, and ultra-mobile PCs (UMPCs), as well as devices with display screens in various products such as televisions, laptops, monitors, billboards, and the Internet of Things. A display device can include a display panel that implements the display screen and a driver chip mounted on the display panel. The bonding device 1 can be used to mount the driver chip on the display panel of the display device. For example, the bonding device 1 can bond the driver chip to the display panel by joining a first conductive pattern (or panel pad) of the display panel with a second conductive pattern (or bump) of the driver chip.

[0062] The bonding via the bonding device 1 can be performed by ultrasonic means or by contact heating. In one embodiment, the bonding device 1 can employ both ultrasonic means and contact heating, which will be described in detail below.

[0063] like Figure 1As shown, the bonding device 1 may include: an ultrasonic bonding part 10, which provides frictional heat to the contact part in an ultrasonic manner; a laser part 20, which provides heat energy to the contact part by laser irradiation; and a stage 30, which is used to place the bonding object BO.

[0064] The ultrasonic bonding part 10 functions to generate frictional heat through ultrasonic vibration, thereby melting the conductive pattern in contact. The ultrasonic bonding part 10 may include a horn part 11, a first power supply part 13, a transducer 15, an amplifier part 17, and a pressure application part 19.

[0065] The function of the first power supply unit 13 is to provide a first power supply to the oscillator 15. The first power supply can be an AC power supply or a DC power supply.

[0066] The function of the oscillator 15 is to convert the electrical energy supplied by the first power source 13 into vibrational energy. That is, the oscillator 15 can generate a vibrational wave with a predetermined vibrational energy (or kinetic energy) from the first power source. The vibrational wave can occur in a direction parallel to the bonding surface of the conductive pattern (i.e., Figure 1 The vibration occurs in the direction of amplitude (left-right). The vibration wave can vibrate at a frequency within the ultrasonic frequency band.

[0067] The amplifier section 17 functions to increase the amplitude of the vibration wave generated by the oscillator 15. The vibration wave with increased amplitude via the amplifier section 17 can possess greater vibrational energy. For example... Figure 1 As shown, the amplifier section 17 can be arranged on one side and the other side of the welding head 11, but the arrangement of the amplifier section 17 is not limited to this. The vibration wave with increased amplitude by the amplifier section 17 can be transmitted to the adjacent welding head 11 and cause the welding head 11 to vibrate.

[0068] The pressure-applying part 19 can be arranged above the welding head 11, and its function is to apply pressure to the welding head 11 in the vertical direction.

[0069] The welding head 11 can be amplified by the vibration wave amplified by the amplifier section 17 and by the pressure applied in the lower direction according to the pressure application section 19, thus having a horizontal direction ( Figure 1 Vibrational energy with a specified amplitude in the left-right direction and in the vertical direction (in the middle) Figure 1 The pressure energy (in the lower direction of the middle). When the welding head 11 comes into contact with the object to be bonded BO, the vibration energy and pressure energy of the welding head can be transmitted to the object to be bonded BO.

[0070] The laser unit 20 irradiates the contact portion of the bonding object BO with a laser to provide heat energy to the contact portion. The laser unit 20 may include a focusing lens unit 21, a second power supply unit 23, a laser source unit 25, and a beam transmission unit 27.

[0071] The function of the second power supply unit 23 of the laser unit 20 is to provide a second power supply to the laser source unit 25. The second power supply can be an AC power supply or a DC power supply.

[0072] The laser source unit 25 generates laser light through a second power supply provided by the second power supply unit 23.

[0073] The beam transmission unit 27 functions to transmit the laser light provided by the laser source unit 25 to the focusing lens unit 21. The beam transmission unit 27 alters the path of the laser light to transmit it from the laser source unit 25 to the focusing lens unit 21. The beam transmission unit 27 may include an optical lens and / or a mirror. The optical lens may be a convex lens, a concave lens, a Fresnel lens, a prism lens, etc. The mirror may be a reflective mirror, a semi-transparent mirror, etc.

[0074] The focusing lens section 21 can adjust the focal length of the laser transmitted by the beam transmission section 27 so that the laser irradiates the vicinity of the contact portion of the bonding object BO. The focusing lens section 21 can control the laser irradiation area of ​​the bonding object BO, the energy density of the laser irradiating the bonding object BO, and other parameters. In some embodiments, the focusing lens section 21 may be included in the beam transmission section 27, or an additional optical lens and / or mirror may be arranged between the focusing lens section 21 and the bonding object BO.

[0075] The stage 30 provides space for arranging the bonding object BO. The bonding object BO can be arranged on the upper surface of the stage 30. On the stage 30, the second conductive pattern of the bonding object BO, which is in direct contact with the welding head 11, can vibrate in the amplitude direction by the vibration energy provided by the welding head 11, and the second conductive pattern can be tightly bonded to the first conductive pattern by the pressure energy applied in the downward direction. When the second conductive pattern vibrates at a predetermined amplitude in the amplitude direction through the welding head 11, the first conductive pattern, which is tightly bonded to the second conductive pattern, can vibrate at an amplitude smaller than that of the second conductive pattern, or it may not vibrate at all. On the mating surface of the tightly bonded second conductive pattern and the first conductive pattern, the first conductive pattern and the second conductive pattern, which are separate from each other, can be bonded to each other by the generated frictional heat and the heat energy provided by the laser unit 20.

[0076] The bonding method using the above-described bonding device 1 will be described below. Figure 2 This is a cross-sectional view showing one process step of an adhesive bonding method according to an embodiment. Figure 2 An example is shown of an adhesive object formed by bonding a display panel 100 and a driver chip 200.

[0077] First, refer to Figure 2The adhesive object according to one embodiment will be described.

[0078] The display panel 100 may be, for example, an organic light-emitting display panel. In the following embodiments, an organic light-emitting display panel will be used as the display panel 100, but it is not limited thereto. Other types of display devices such as liquid crystal display (LCD), organic light-emitting display (OLED), quantum dot organic light-emitting display (QD-OLED), quantum dot liquid crystal display (QD-LCD), quantum dot nano-light-emitting display (QNED), and micro light-emitting diode (Micro LED) panels may also be used.

[0079] The display panel 100 may include a substrate 110 and panel pads 120 on the substrate 110.

[0080] The substrate 110 serves to support a plurality of components disposed thereon. In one embodiment, the substrate 110 may be a rigid substrate comprising a rigid material such as glass or quartz. However, it is not limited thereto, and the substrate 110 may also be a flexible substrate comprising a flexible material such as polyimide (PI).

[0081] Panel pads 120 may be disposed on the substrate 110. The panel pads 120 may be formed to include a first conductive material. The first conductive material may be, for example, molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), manganese (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), ITO, IZO, etc., but is not limited thereto. The panel pads 120 may be a single-layer film using only or in combination with the first conductive materials exemplified above, or a stacked film formed by stacking two or more dissimilar or identical single-layer films. In some embodiments, the panel pads 120 may be formed as a stacked structure of titanium-aluminum-titanium (Ti / Al / Ti), molybdenum-aluminum-molybdenum (Mo / Al / Mo), Mo / AlGe / Mo, Ti / Cu, etc. The panel pads 120 may be electrically connected to signal wiring and / or electrodes inside the display panel 100.

[0082] The driving chip 200 bonded to the display panel 100 may include a main body 210 and bumps 220 protruding from the main body 210 along its thickness direction. The main body 210 may include a driving circuit for generating various driving signals, such as data signals, power signals, control signals, and / or gate signals transmitted to the display panel 100. The bumps 220 may include a second conductive material. The second conductive material may be, for example, molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), manganese (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), ITO, IZO, etc., but is not limited thereto. The bumps 220 may be a single-layer film using only or in combination with the second conductive materials exemplified above, or a stacked film formed by stacking two or more dissimilar or identical single-layer films. The first conductive material and the second conductive material may be the same or different.

[0083] Reference Figure 1 and Figure 2 The bonding method using the bonding apparatus 1 will be described, wherein a display panel 100 and a driver chip 200, which are the objects to be bonded, are arranged on a stage 30. Specifically, the display panel 100 is arranged on the upper surface of the stage 30 such that the panel pads 120 face upwards. With the main body 210 of the driver chip 200 facing upwards and the bumps 220 facing downwards, the bumps 220 are arranged on the upper part of the panel pads 120 such that the bumps 220 are in direct contact with the panel pads 120.

[0084] Next, the soldering head 11 is brought into contact with the object to be bonded. The soldering head 11 can make contact from the upper side of the object to be bonded. For example, the soldering head 11 can make contact with the upper surface of the main body 210 of the driver chip 200.

[0085] As described above, the welding head 11 receives a horizontally vibrating vibration wave generated by the oscillator 15 and amplified by the amplifier section 17. Furthermore, the welding head 11 is pressurized in the vertical direction by the pressure application section 19. Through the pressure application section 19, at least a portion of the welding head 11 (e.g., the pointed tip (see reference 19)) is subjected to pressure. Figure 3The "11a2" is tightly bonded to the driver chip 200, which is one of the bonding objects according to the embodiment. The driver chip 200, which is tightly bonded to the solder head 11, can receive vibration waves in the horizontal direction from the solder head 11 and vibrate together. That is, the bump 220 of the driver chip 200 can vibrate on the panel pad 120 of the display panel 100 at a predetermined frequency and amplitude corresponding to the received vibration waves, and thereby, frictional heat can be generated between the lower surface of the bump 220 and the upper surface of the panel pad 120. When the frictional heat is sufficient to melt the bump 220 and / or the panel pad 120, the first conductive material and / or the second conductive material can melt from their interface, and the bump 220 can be directly bonded to the panel pad 120.

[0086] As described above, the laser unit 20 irradiates the driver chip 200 with laser light. The laser can be irradiated while the solder head 11 is in contact with the driver chip 200, which is the object to be bonded. In one embodiment, light can be irradiated simultaneously with vibrations of the solder head 11 while the solder head 11 is in contact with the driver chip 200. In some embodiments, light can also be irradiated before vibrations of the solder head 11 are applied to the driver chip 200.

[0087] Laser light can be transmitted through the focusing lens 21 to the main body 210, bumps 220, and / or panel pads 120 of the driver chip 200, and converted into heat energy at the transmission point. The converted heat energy can locally raise the temperature of the contact area (the interface between the bumps 220 and the panel pads 120). When the contact area is locally heated due to heat energy, the conductive material of the contact area can be rapidly melted, either alone or with the aid of frictional heat from the vibration of the solder head 11. This improves the bonding speed between the bumps 220 and the panel pads 120.

[0088] Compared to heat transfer via the welding head 11 through heat conduction, the method of converting laser energy into heat energy, as in the embodiment, is advantageous in terms of heating rate and localized heating. Furthermore, it is also more advantageous than heat conduction in rapidly cooling the temperature rise caused by the heat energy as needed. Therefore, the heating rate and heating range can be precisely adjusted, and the bonding process control becomes easier.

[0089] Furthermore, when a heat supply part (e.g., a heater) is inserted into the welding head 11 of the ultrasonic bonding part 10 using heat conduction, the heat supply part may additionally generate vibrations in the direction of the welding head 11 (e.g., referring to...). Figure 3Vibration in different directions (DR1) of the first direction. When vibration occurs in directions other than the vibration direction of the solder head 11, it may cause abnormal operation of the solder head 11, resulting in reduced bonding efficiency and reliability. In the case of the embodiment, even without inserting a heat supply part into the solder head 11, the contact part can be locally heated by the external laser part 20 that is physically spaced apart from the solder head 11, thereby improving the bonding efficiency and bonding reliability between the bump 220 and the panel pad 120.

[0090] Furthermore, when the driver chip 200 is subjected to a vibration wave, the driver chip 200 and the display panel 100, which are the objects to be bonded, are sandwiched between the upper solder head 11 and the lower platform 30. When a laser irradiates from above the driver chip 200 toward the contact portion, the solder head 11 is located in the laser path. When located in the laser path, the solder head 11 may also include a light-transmitting portion (see reference). Figure 3 The "11a" is designed not to obstruct laser propagation. Hereinafter, various embodiments of the welding head 11, including the light-transmitting section, will be described in detail.

[0091] Figure 3 This is a perspective view showing the welding head of an adhesive device according to one embodiment. Figure 4 It is along Figure 3 A sectional view taken from line I-I'. Figure 5 It is Figure 4 An enlarged sectional view of region A. Figure 6 This is a plan view of the welding head according to one embodiment.

[0092] In the following embodiments, the first direction DR1, the second direction DR2, and the third direction DR3 are different intersecting directions, and may also represent directions that are orthogonal to each other. Figure 3 In the perspective view, for ease of explanation, it is illustrated that the long side of the welding head 11 extends along the first direction DR1, the short side of the welding head 11 extends along the second direction DR2, and the thickness direction of the welding head 11 extends along the third direction DR3. However, it should be understood that the directions mentioned in the embodiment are relative directions, and the embodiment is not limited to the mentioned directions.

[0093] Reference Figures 3 to 6 The welding head 11 can generally be rectangular in shape. Specifically, in a plan view, the welding head 11 can be a rectangle with a long side extending along the first direction DR1 and a short side extending along the second direction DR2. The length W33 of the welding head 11 in the third direction DR3 (the height of the welding head 11 represents the height from the reference plane Bs to the upper surface 11s1, described later) can be less than the length W11 of the long side and the length W22 of the short side, but is not limited thereto. Figure 1The oscillator 15 of the bonding device 1 receives the vibration wave of the welding head 11, which can vibrate along a first direction DR1, which is the direction of the relatively long side. The length W11 of the long side, the length W22 of the short side, and the length W33 of the welding head 11 are transmitted through the bonding device ( Figure 1 When performing the bonding process of “1”, it can affect the vibration amplitude, vibration speed, vibration frequency, etc. of the welding head 11, and can be appropriately determined according to the desired process conditions.

[0094] The entire area of ​​the upper surface 11s1 of the welding head 11 can be flat. Conversely, the bottom surface 11s2 of the welding head 11 can have a three-dimensional structure that is generally flat but with some areas protruding from other peripheral areas. Specifically, the welding head 11 may include a pointed tip 11a2 protruding from the reference plane Bs along a third direction DR3 on its bottom surface 11s2. The pointed tip 11a2 serves to transmit the vibrational energy of the welding head 11 to the bonding object BO. The protruding bottom surface 11a2s2 of the pointed tip 11a2 is flat and can be generally parallel to the bottom surface 11s2 of the welding head 11 or the reference plane Bs. During the bonding process, the protruding bottom surface 11a2s2 of the pointed tip 11a2 vibrates in close contact with the bonding object BO, and thus, a portion of the tightly bonded bonding object BO can vibrate together.

[0095] The pointed tip 11a2 may be located in the central portion of the bottom surface 11s2 of the weld head 11 in the first direction DR1, but is not limited thereto. The pointed tip 11a2 may be a shape extending along the second direction DR2. That is, with the protruding bottom surface 11a2s2 as a reference, the width W2 of the pointed tip 11a2 in the first direction DR1 is less than the length Wp in the second direction DR2. The width W2 of the pointed tip 11a2 in the first direction DR1 may be less than half or less than 30% of the length Wp in the second direction DR2, and further may be less than 20%.

[0096] In one embodiment, the length Wp of the pointed tip 11a2 in the second direction DR2 can be less than the length W22 of the short side of the weld head 11. That is, as Figure 6As shown, the ends 11a2_SS1 and 11a2_SS2 on the second direction DR2 of the pointed head 11a2 can be located on the inner side, respectively spaced from the long side of the welding head 11. The distance between the ends 11a2_SS1 and 11a2_SS2 on the second direction DR2 of the pointed head 11a2 and the long side of the welding head 11 is much smaller than the length W22 on the second direction DR2 of the welding head 11, and for example, it can be less than half or less than 10%. However, it is not limited to this, and the ends 11a2_SS1 and 11a2_SS2 on the second direction DR2 of the pointed head 11a2 can be aligned with the long side of the welding head 11, or they can protrude further outward from the long side of the welding head 11.

[0097] Furthermore, when the welding head 11 vibrates, in order to effectively generate frictional heat, the bottom surface 11s2 (i.e., the reference surface Bs) of the welding head 11, excluding the tip 11a2, is preferably spaced apart from the bonding object BO (and of course, from the platform 30 or other structures) and does not contact it. Additionally, when the welding head 11 vibrates while in contact with the bonding object BO, if there is sufficient space between the bonding object BO and the reference surface Bs of the welding head 11, this space can be used for fluid flow or to provide other processing fluids. During bonding by vibration, the distance between the reference surface Bs of the welding head 11 and the bonding object BO can be adjusted by the length of the tip 11a2 protruding from the reference surface Bs of the bottom surface 11s2 of the welding head 11 in the third direction DR3 (in other words, the height WT of the tip 11a2). Therefore, the height WT of the tip 11a2 can be determined considering the above-described process conditions. However, if the height WT of the pointed tip 11a2 is too large, it will be detrimental to mechanical stability, and depending on the circumstances, there is also a risk of damage to the pointed tip 11a2. Considering mechanical stability, the height WT of the pointed tip 11a2 can be less than not only the length Wp in the second direction DR2 of the pointed tip 11a2, but also less than the width W2 in the first direction DR1 of the pointed tip 11a2. However, the relationship between the width W2, length Wp, and height WT of the pointed tip 11a2 is not limited to the example described.

[0098] In one embodiment, such as Figure 4As shown, the cross-sectional shape of the pointed head 11a2 cut along the first direction DR1 can be rectangular. When the portion of the pointed head 11a2 that contacts the reference plane Bs of the bottom surface 11s2 of the weld head 11 and is at the same level as it is defined as the base 11a2s1 of the pointed head 11a2, the width W2_BS of the base 11a2s1 of the pointed head 11a2 can be the same as the width W2 of the bottom surface 11a2s2 of the pointed head 11a2. The inclination angle θ2 of the sidewall 11a2s3 of the pointed head 11a2 relative to the base 11a2s1 can be a right angle. In some other embodiments, the cross-sectional shape of the pointed head 11a2 cut along the first direction DR1 can be an isosceles inverted trapezoid with the upper side (base 11a2s1) larger than the lower side (bottom surface 11a2s2). In this case, the inclination angle θ2 of the sidewall 11a2s3 of the pointed head 11a2 relative to the base 11a2s1 can be an acute angle.

[0099] Furthermore, as described above, the welding head 11 is located in the area formed by the laser section ( Figure 1 While the laser beam ("20") is irradiated along the path of the laser, it also has a structure that does not impede laser propagation. This will be explained in detail below.

[0100] like Figure 4 As shown, the welding head 11 may include: a light-transmitting portion 11a, which is located at the central portion of the welding head 11 with reference to a first direction DR1; and a support portion 11b, which is located around the light-transmitting portion 11a. A laser portion (see reference) is arranged above the central portion of the welding head 11. Figure 1 The laser irradiated by the laser unit 20 can reach the bonded object BO via the central portion of the welding head 11. That is, since the central portion of the welding head 11 is located in the path of the laser, it includes a material that does not obstruct laser propagation. The light-transmitting portion 11a located at the central portion of the welding head 11 can be formed of a light-transmitting material (or a first material). The first material can be formed of a material such as ceramic. The ceramic may include, for example, quartz, sapphire, or glass. The light-transmitting portion 11a may include an inner portion 11a1 and a pointed head 11a2 protruding from the inner portion 11a1 toward the other side of the third direction DR3. The inner portion 11a1 and the pointed head 11a2 include the same material and are directly connected to each other.

[0101] Furthermore, taking the first direction DR1 as a reference, the outer portion of the periphery of the central part of the welding head 11 is not actually located on the laser path. Therefore, unlike the light-transmitting portion 11a of the welding head 11, the necessity for it to be formed of a light-transmitting material can be reduced. In the bonding process, in order to provide stable support for the pointed head 11a2, which is substantially in close contact with the bonding object BO to transmit vibrational energy and pressure energy to the bonding object BO, and the inner portion 11a1 directly connected to the pointed head 11a2, and to increase the rigidity of the light-transmitting portion 11a, the support portion 11b can be formed of a material that is rigid relative to the light-transmitting portion 11a. For example, the support portion 11b may include a second material. The second material may include a material that is rigid but has low light transmittance, such as a metal or metal alloy.

[0102] The arrangement and shape of the light transmission part 11a and the support part 11b will be described in detail below.

[0103] The cross-sectional shape of the light-transmitting part 11a can be a shape that combines the cross-sectional shape of the inner part 11a1 with the cross-sectional shape of the pointed head 11a2. The upper surface 11a1s1 of the inner part 11a1 can contact the upper surface 11s1 of the welding head 11 and be at the same level. The bottom surface 11a1s2 of the inner part 11a1 can contact the base 11a2s1 of the pointed head 11a2 and be at the same level. The sidewall 11a1s3 of the inner part 11a1 can directly contact the support part 11b.

[0104] The upper surface 11bs1 of the support portion 11b can contact the upper surface 11s1 of the welding head 11 and be at the same level, and can also be at the same level as the upper surface 11a1s1 of the inner side portion 11a1. The bottom surface 11bs2 of the support portion 11b can contact the bottom surface 11s2 of the welding head 11 and be at the same level, and can also be at the same level as the bottom surface 11a1s2 of the inner side portion 11a1 and the base bottom 11a2s1 of the tip 11a2.

[0105] The cross-sectional shape of the inner portion 11a1 along the first direction DR1 can be an isosceles inverted trapezoid where the width W1 of the upper side (upper surface 11a1s1) is greater than the width W2_BS of the lower side (bottom surface 11a1s2), and the inclination angle θ1 of the sidewall 11a1s3 relative to the upper surface 11a1s1 is an acute angle. In this case, the width of the inner portion 11a1 can decrease from the upper surface 11a1s1 to the lower surface 11a1s2. The inclination angle θ1 of the sidewall 11a1s3 of the inner portion 11a1 relative to the upper surface 11a1s1 can have one value, but is not limited to this; it can also have multiple different values. When the inclination angle θ1 of the sidewall 11a1s3 of the inner portion 11a1 relative to the upper surface 11a1s1 has one value, the width of the inner portion 11a1 can gradually decrease proportionally from the upper surface 11a1s1 to the lower surface 11a1s2.

[0106] In one embodiment, since the inner portion 11a1 of the light-transmitting portion 11a has an isosceles inverted trapezoidal shape with its width decreasing from the upper surface 11a1s1 to the lower surface 11a1s2, the inner portion 11a1 and the support portion 11b can overlap in the thickness direction. Furthermore, since the sidewall 11a1s3 of the inner portion 11a1 is inclined relative to the upper surface 11a1s1, the area where the sidewall 11a1s3 of the inner portion 11a1 and the support portion 11b are combined can be further increased. Therefore, when light is transmitted through… Figure 1 When the welding head 11 provides compressive energy to the ultrasonically bonded object BO in the lower direction, the support portion 11b, which overlaps with the inner portion 11a1 in the lower direction, can support the inner portion 11a1 and further increase the bonding force between the inner portion 11a1 and the support portion 11b, thereby preventing the inner portion 11a1 from separating from the support portion 11b.

[0107] Furthermore, regarding the width of the inner portion 11a1 in the first direction DR1, since the width W1 of the upper surface 11a1s1 of the inner portion 11a1 where the laser first enters the welding head 11 is the largest, the light reception rate of the laser provided by the laser unit 20 can be improved.

[0108] The width W2_BS of the bottom surface 11a1s2 can be about 50% to about 90% of the width W1 of the upper surface 11a1s1. When the width W2_BS of the bottom surface 11a1s2 is more than about 50% of the width W1 of the upper surface 11a1s1, the laser irradiated by the laser section 20 can be transmitted to the tip 11a2 in sufficient quantity. And when the width W2_BS of the bottom surface 11a1s2 is less than about 90% of the width W1 of the upper surface 11a1s1, the overlap area of ​​the inner side portion 11a1 and the support portion 11b in the thickness direction and the bonding area of ​​the sidewall 11a1s3 of the inner side portion 11a1 and the support portion 11b are increased, thereby improving the bonding force between the inner side portion 11a1 and the support portion 11b. Therefore, this is desirable in terms of mechanical stability.

[0109] Furthermore, as described above, the welding head 11 vibrates with a predetermined amplitude along the vibration direction (e.g., the first direction DR1). However, when the materials of the light-transmitting portion 11a and the support portion 11b are different, and empty spaces appear due to poor bonding between the light-transmitting portion 11a and the support portion 11b, the welding head 11 not only vibrates normally (e.g., vibrates in the first direction DR1) but also vibrates in other directions, resulting in reduced efficiency. To prevent this, according to one embodiment, the welding head 11 can be designed for direct bonding based on diffusion between the light-transmitting portion 11a and the support portion 11b. By using a direct bonding method based on diffusion, the inner portion 11a1 of the light-transmitting portion 11a and the support portion 11b can be directly bonded without empty spaces such as air gaps. For this, refer to... Figure 5 Please provide an explanation.

[0110] Reference Figure 5 In a welding head 11 according to one embodiment, the light-transmitting portion 11a and the support portion 11b can be integrally joined. The welding head 11 according to one embodiment may also include a diffusion portion 11c between the inner side portion 11a1 of the light-transmitting portion 11a and the support portion 11b. This diffusion portion 11c is formed by a mixture of the material forming the light-transmitting portion 11a and the material forming the support portion 11b. The inner side portion 11a1 and the support portion 11b can be joined through the diffusion portion 11c. The diffusion portion 11c can be a region formed by the diffusion of the material forming the inner side portion 11a1 and the material forming the support portion 11b, respectively. As in one embodiment, the welding head 11 can directly join the inner side portion 11a1 of the light-transmitting portion 11a and the support portion 11b without any gap between them, thereby preventing efficiency reduction due to the welding head 11 vibrating in other directions (e.g., vibration in the first direction DR1) and failing to vibrate normally.

[0111] Reference Figure 6The inner portion 11a1 can be larger than the tip 11a2 on the plane. For example, the inner portion 11a1 can completely cover the tip 11a2 on the plane. The outer contour of the inner portion 11a1 on the plane can be substantially the same as the outer contour of the light-transmitting portion 11a on the plane. The ends 11a1_SS1 and 11a1_SS2 of the inner portion 11a1 can be connected to the ends 11a2_SS1 and 11a2_SS2 of the tip 11a2, respectively, and are located on the same line. In the first direction DR1, the length of the ends 11a1_SS1 and 11a1_SS2 of the inner portion 11a1 can be greater than the length of the ends 11a2_SS1 and 11a2_SS2 of the tip 11a2.

[0112] The ends 11a1_LS1 and 11a1_LS2 of the inner portion 11a1 are located outside the ends 11a2_LS1 and 11a2_LS2 of the pointed head 11a2, respectively, and are parallel to the ends 11a2_LS1 and 11a2_LS2 of the pointed head 11a2. In the second direction DR2, the lengths of the ends 11a1_LS1 and 11a1_LS2 of the inner portion 11a1 are the same as the lengths of the ends 11a2_LS1 and 11a2_LS2 of the pointed head 11a2, respectively.

[0113] In this embodiment, the length Wp of the inner portion 11a1 in the second direction DR2 can be less than the length W22 of the short side of the welding head 11. That is, the ends 11a1_SS1 and 11a1_SS2 on the second direction DR2 of the inner portion 11a1 can be located on the inner side, respectively spaced from the long side of the welding head 11. However, this is not a limitation, and the ends 11a1_SS1 and 11a1_SS2 on the second direction DR2 of the inner portion 11a1 can be aligned with the long side of the welding head 11, or they can protrude further outward from the long side of the welding head 11.

[0114] Figure 7 This is a graph showing the amplitude (X-axis direction) of the bonding device in the longitudinal vibration mode according to an embodiment. Figure 7 This illustration shows the amplitude of the ultrasonic bonding object when bonding an ultrasonically bonded object is bonded using a bonding apparatus 1 including a laser unit 20 and an ultrasonic bonding unit 10, according to one embodiment. (See also:) Figure 7 As confirmed in the study, according to one embodiment, since the inner side 11a1 of the light-transmitting part 11a and the support part 11b are directly joined to each other without any gap space between them, the welding head 11 vibrates normally.

[0115] Figure 8This is a graph comparing the heating rates of the contact areas of different samples. Figure 8 In the sample, the first sample (sample #1) corresponds to the case where the contact portion is heated using a heat supply unit (e.g., a heater), the second sample (sample #2) corresponds to the case where the contact portion is heated using a low-power laser unit, and the third sample (sample #3) corresponds to the case where the contact portion is heated using a high-power laser unit. Figure 8 The charts shown confirm that utilizing the laser unit 20 for heating the contact area is advantageous in terms of heating rate. The second sample (sample #2) and the third sample (sample #3) both utilize the laser unit 20. Although the focused object (contact area) of the laser irradiated by the laser unit 20 is the same, the amount of laser light irradiating the same area of ​​the contact area in the same time period differs because the power used to output the laser is different. Since the first sample (sample #1) differs from the other samples in its contact area heating method, it is difficult to make an absolute comparison. Therefore, it is assumed that the total amount of laser light irradiated by the laser unit 20 of the third sample (sample #3) in the same time period is the same as the total amount of heat energy radiated to the surroundings by the heater of the first sample (sample #1). Figure 8 In the diagram, the horizontal axis represents the time for heating the contact area, while the vertical axis represents the temperature of the contact area.

[0116] By comparison Figure 8 It can be confirmed from the second sample (sample #2) and the third sample (sample #3) that, in the same amount of laser light irradiating the same area of ​​the contact portion within the same time, the third sample (sample #3) is easier to adjust in terms of heating and cooling rates compared to the smaller second sample (sample #2). However, comparing the first sample (sample #1) with the samples (sample #2, sample #3) using the laser unit 20, since the first sample (sample #1) heats the contact portion through heat conduction, the heat released by the heater takes a relatively longer time to reach the contact portion separated from the heater compared to the other samples (sample #2, sample #3). Furthermore, although the total amount of laser light irradiated by the laser unit 20 of the third sample (sample #3) is the same as the total amount of heat energy radiated by the heater of the first sample (sample #1) to the surrounding area within the same time period, the laser light of the third sample (sample #3) is focused on the contact area for concentrated heating, while the heat from the first sample (sample #1) reaches the contact area while simultaneously heating the periphery of the heater. Therefore, the heating efficiency of the first sample (sample #1) on the contact area is lower than that of the third sample (sample #3). Consequently, the heating rate of the first sample (sample #1) may be lower than that of the other samples (sample #2, sample #3).

[0117] Furthermore, during the cooling process, the laser focus of the third sample (sample #3) is set on the contact portion, so the surrounding parts outside the contact portion are hardly heated during the heating process. In contrast, the first sample (sample #1) uses heat conduction, so the surrounding parts, including the contact portion, are also heated. Therefore, the cooling rate of the first sample (sample #1) may be lower than that of the other samples (sample #2, sample #3).

[0118] Hereinafter, a display device according to another embodiment will be described. In the following embodiments, the same reference numerals will be used to denote the embodiments already described and the same configurations, and the description thereof will be omitted or simplified.

[0119] Figure 9 This is a perspective view of the welding head according to another embodiment. Figure 10 It is along Figure 9 A sectional view taken from line II-II'. Figure 11 This is a plan view of the welding head according to another embodiment.

[0120] Reference Figures 9 to 11 According to this embodiment, the welding head 11_1 and according to Figures 3 to 6 The difference between the welding head 11 and the support part 11b_1 is that the area adjacent to the light transmission part 11a is formed by a light-transmitting material.

[0121] More specifically, the portion of the weld head 11_1 formed by the light-transmitting material is based on... Figures 3 to 6 The welding head 11 can be made larger. For example... Figure 10 As shown, the support portion 11b_1 is based on... Figures 3 to 6 The material-formed portion (or main support portion) of the support portion 11b and the material-formed portion (or sub-support portion) of the support portion 11b_1 can be joined to each other at a boundary line extending along the thickness direction. Figure 10 The example illustrates a case where the boundary line between the portion formed by the material of the support portion 11b and the portion formed by the light-transmitting material of the support portion 11b_1 extends along the thickness direction, but it is not limited to this, and the boundary line may also extend at an angle relative to the upper surface of the welding head 11_1, as is the boundary between the support portion 11b and the light-transmitting portion 11a.

[0122] The portion formed of the material of the support part 11b and the portion formed of the light-transmitting material of the support part 11b_1 can be fastened by a male-female fastening method. This differs from the method described above. Figures 3 to 6The welding head 11, where the portion formed by the material of the support portion 11b does not directly engage with the portion formed by the light-transmitting material of the support portion 11b_1, may have empty spaces in other portions besides the male-female fastening portion, but still has the advantage of easy engagement / crossing. Male-female fastening can be achieved through a fastening portion 11CN. The fastening portion 11CN can be arranged between the main support portion and the sub-support portion. The fastening portion 11CN can engage the main support portion and the sub-support portion. The fastening portion 11CN may include: a female screw 11CN1, which connects to the portion formed by the light-transmitting material of the support portion 11b_1; and a male screw 11CN2, which connects to the portion formed by the material of the support portion 11b. In some embodiments, the female screw 11CN1 can connect to the portion formed by the material of the support portion 11b, while the male screw 11CN2 can connect to the portion formed by the light-transmitting material of the support portion 11b_1.

[0123] Considering that the fastening part 11CN is difficult to transmit through the laser part (refer to) Figure 1 The light provided by 20) and the fastening part 11CN can be compared with the light provided by 20) and the fastening part 11CN. Figures 3 to 6 The welding head 11 is arranged further away from the light transmission part 11a. As a result, the area of ​​the portion of the welding head 11_1 where the light-transmitting material is arranged can be larger than the area of ​​the portion of the welding head 11 where the light-transmitting material is arranged (the same portion as the light transmission part 11a).

[0124] Reference Figure 11 In this embodiment, the ends 11a_SS1, 11a_SS2, 11a_LS1, and 11a_LS2 of the light transmission section 11a can be connected to... Figure 6 The end of the light-transmitting portion 11a described herein (which is the same as the end of the inner portion 11a1) is identical. On a plane, the portion on which the light-transmitting material is disposed may have a side end BL1 on the first direction DR1, a side end BL2 on the first direction DR1, a side end BL3 on the second direction DR2, and a side end BL4 on the second direction DR2. The ends 11a_SS1 and 11a_SS2 of the light-transmitting portion 11a on the second direction DR2 may respectively connect to the ends BL3 and BL4 on the second direction DR2 of the portion on which the light-transmitting material is disposed, and are located on the same line. The ends 11a_LS1 and 11a_LS2 of the light-transmitting portion 11a on the first direction DR1 may be located inside the ends BL1 and BL2 on the first direction DR1 of the portion on which the light-transmitting material is disposed, and extend parallel to each other.

[0125] On the plane, the length of the portion containing the translucent material in the second direction DR2 can be less than the length W22 of the short side of the weld head 11_1. That is, as... Figure 11As shown, on the plane, the ends BL3 and BL4 on the second direction DR2 of the portion where the light-transmitting material is arranged can be located on the inner side, spaced apart from the long side of the welding head 11_1, respectively. The distance between the ends BL3 and BL4 on the second direction DR2 of the portion where the light-transmitting material is arranged and the long side of the welding head 11_1 can be much smaller than the length W22 on the second direction DR2 of the welding head 11_1, for example, less than half or less than 10%. On the plane, the portion where the light-transmitting material is arranged can be completely surrounded by the portion of the support 11b_1 where the material of the support 11b is arranged.

[0126] Figure 12 It is based on Figure 11 A variation of the plan view of the welding head.

[0127] Reference Figure 12 The ends BL3 and BL4 on the second direction DR2 of the portion containing the translucent material can be aligned with the long side of the welding head 11_1. That is, the length of the portion containing the translucent material on the second direction DR2 can be the same as the length of the short side of the welding head 11_1. Using the welding head 11_1 according to this modified example, the portion containing the translucent material can be... Figures 9 to 11 The insertion process shown in the diagram, where the material with support portion 11b is inserted into the portion and fastened together, is omitted. Specifically, portions with support portions 11b can be arranged on one side and the other side of the portion with the translucent material in the first direction DR1, and fastened easily by fastening them together. Furthermore, the portion with the translucent material can be easily replaced.

[0128] Figure 13 This is a cross-sectional view of the welding head according to yet another embodiment.

[0129] Reference Figure 13 According to this embodiment, the welding head 11_2 and according to Figure 4 The difference between the welding head 11 and the support part 11b_2 is that the support part 11b_2 is made entirely of the same material as the light transmission part 11a.

[0130] The welding head 11_2 is formed only of a light-transmitting material, therefore the requirement for [the specific material] can be omitted. Figure 3 The dissimilar material bonding process of the welding head 11 or according to Figure 9 Additional bonding processes, such as the male and female fastening process of the welding head 11_1.

[0131] Figure 14 This is a cross-sectional view of the welding head according to yet another embodiment.

[0132] Reference Figure 14 According to this embodiment, the welding head 11_3 and according to Figure 4 The difference between the welding head 11 and the welding head 11_3 is that the length W11_1 of the welding head 11_3 in the first direction DR1 is less than that according to Figure 4 11. Welding head.

[0133] More specifically, the length W11_1 of the long side of the welding head 11_3 according to this embodiment can be based on... Figure 4 The welding head 11 is half the length of the long side W11 of the welding head 11. According to this embodiment, the welding head 11_3 can be equivalent to welding the welding head 11_3 in the first direction DR1 according to... Figure 4 The welding head 11 is structured with the imaginary line on the third direction DR3, which is divided in half, as a reference, located on one side of the first direction DR1. That is, the light-transmitting part 11a_1 and the support part 11b_3 of the welding head 11_3 are composed of... Figure 4 The welding head 11 is divided in half based on the imaginary line, and the light transmission part 11a_1 has a first width W1' that is equivalent to half of the first width W1.

[0134] In this embodiment, the pointed tip can be located on the other side (outer edge) of the bottom surface of the welding head 11_3 in the first direction DR1 in the plan view.

[0135] Figure 15 This is a cross-sectional view of the welding head according to yet another embodiment.

[0136] Reference Figure 15 According to this embodiment, the welding head 11_4 and according to Figure 10 The difference between the welding head 11_1 and the welding head is that, as according to Figure 14 Like the welding head 11_3, the width of the welding head 11_4 in the first direction DR1 is smaller than that according to Figure 10 The welding head 11_1.

[0137] More specifically, the width of the long side of the welding head 11_4 in the first direction DR1 according to this embodiment can be based on... Figure 9 The weld head 11_1 is half the width of its long side in the first direction DR1. According to this embodiment, the weld head 11_4 can be equivalent to [a weld head] being [a weld head] in the first direction DR1 [a weld head] according to [a weld head]. Figure 9 The structure is located on one side of the first direction DR1, with the imaginary line on the third direction DR3 as the reference, which is divided in half by the welding head 11_1.

[0138] Figure 16 This is a cross-sectional view of the welding head according to yet another embodiment.

[0139] Reference Figure 16 According to this embodiment, the welding head 11_5 and according to Figure 13 The difference between the welding head 11_2 and the welding head 11_2 is that, as according to Figure 14Like the welding head 11_3, the width of the welding head 11_5 in the first direction DR1 is smaller than that according to Figure 13 The welding head 11_2.

[0140] More specifically, the width of the long side of the welding head 11_5 in the first direction DR1 according to this embodiment can be based on... Figure 13 The weld head 11_2 is half the width of its long side in the first direction DR1. According to this embodiment, the weld head 11_5 can be equivalent to [a weld head] being [a weld head] in the first direction DR1 [a weld head] according to [a weld head]. Figure 13 The structure is located on one side of the first direction DR1, with the imaginary line on the third direction DR3 as the reference, which is divided in half by the welding head 11_2.

[0141] Figure 17 This is a cross-sectional view of the welding head according to yet another embodiment.

[0142] Reference Figure 17 According to this embodiment, the welding head 11_6 and according to Figure 14 The difference between the welding head 11_3 and the welding head 11_3 is that a reflector is arranged inside the light transmission part 11a_2 to reflect the light L (laser) incident on the welding head 11_6 toward the tip.

[0143] More specifically, the reflector can be a reflective mirror, but it is not limited to any type of component that can change the propagation path of light L. Taking the reflector of the light transmission part 11a_2 as a reference, the lower part of the reflector is formed of a light-transmitting material, while the upper part of the reflector is formed of the same material as the support part 11b_3, but is not limited to this.

[0144] Figure 18 This is a cross-sectional view showing one process step of an bonding method according to another embodiment.

[0145] Reference Figure 18 The bonding method according to this embodiment is the same as that described above. Figure 2 , Figure 3 and Figure 4 The difference in the bonding method according to one embodiment described herein is that the stage 30_1 is formed of a light-transmitting material, and the welding head 11_7 is made of a material with lower light transmittance than the light-transmitting material of the stage 30_1 (e.g., Figure 4 The material of the support portion 11b is formed.

[0146] The bonding method according to this embodiment is different from... Figure 2 As shown, the laser section (refer to) Figure 1 The laser unit 20 can be arranged below the stage 30_1, and the light L generated by the laser unit 20 can pass through the stage 30_1 and reach the bonding object BO.

[0147] This embodiment allows for the direct use of a material with low light transmittance, typically used in forming the weld head 11_7. Therefore, it not only saves costs but also eliminates the need for materials that... Figure 3 The dissimilar material bonding process in the welding head 11 or according to Figure 9 Additional bonding processes, such as the male and female fastening process in the welding head 11_1.

[0148] The foregoing has described embodiments of the present invention, but these are merely examples and are not intended to limit the invention. Those skilled in the art will understand that various modifications and applications not illustrated above can be implemented without departing from the essential characteristics of the embodiments of the invention. For example, the constituent elements specifically shown in the embodiments of the invention can be implemented through modifications. Furthermore, distinctions related to such modifications and applications should be interpreted as including within the scope of the invention as defined in the appended claims.

Claims

1. An adhesive bonding device, comprising: A welding head for transmitting vibrational waves to the objects being bonded, and includes: The light-transmitting part includes a first material that is a light-transmitting substance; and A support portion, disposed on one side in the first direction of the light-transmitting portion, and comprising a second material with a light transmittance lower than that of the light-transmitting material; and The laser unit is used to irradiate the bonded object with a laser. The laser light irradiated by the laser unit is transmitted to the bonding object through the light transmission unit.

2. The bonding device according to claim 1, wherein, The light-transmitting part is integrally combined with the support part.

3. The bonding device according to claim 2, wherein, The light-transmitting part is directly connected to the supporting part.

4. The bonding device according to claim 3, wherein, The welding head further includes a diffusion section disposed between the light-transmitting section and the support section, and is composed of a mixture of the first material of the light-transmitting section and the second material of the support section.

5. The bonding device according to claim 4, wherein, The first substance includes ceramics, and The second substance includes metals or metal alloys.

6. The bonding device according to claim 3, wherein, The support portion is also arranged on the other side of the light-transmitting portion in the first direction, and On a plane, the light-transmitting part is completely surrounded by the supporting part.

7. The bonding device according to claim 3, wherein, The light-transmitting part is located on the outermost side of the welding head.

8. Bonding methods, including: The step of arranging a display panel including a first conductive pattern on the stage; On the display panel, the step of making the second conductive pattern of the driving element in close contact with the first conductive pattern; as well as The steps include vibrating the second conductive pattern and irradiating the contact area between the first and second conductive patterns with a laser to bond the first and second conductive patterns together. The vibration of the second conductive pattern is generated by the vibration of the welding head on the upper surface of the driving member. The welding head includes a light-transmitting portion formed of a first material that is a light-transmitting substance, and The laser light reaches the contact portion through the light transmission portion.

9. The bonding method according to claim 8, wherein, In the step of bonding the first conductive pattern to the second conductive pattern, the vibration of the second conductive pattern causes frictional heat to be generated at the contact portion, and The laser light irradiating the contact portion is converted into heat energy at the contact portion.

10. The bonding method according to claim 9, wherein, The welding head also includes a support portion located on one side of the light-transmitting portion, and The support portion is formed of a second material with lower light transmittance than the first material.

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