Method of reducing chamber residue

Abstract

The present disclosure relates to systems and methods for reducing formation of hardware residues and minimizing secondary plasma formation during substrate processing in a processing chamber. The processing chamber can include a gas distribution member configured to flow a first gas into a processing volume and generate a plasma from the first gas. A second gas is supplied into a lower region of the processing volume. Further, an exhaust port is disposed in the lower region to remove excess gas or byproducts from the processing volume during or after processing.

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