A method, apparatus, device and storage medium for cutting a wafer

Abstract

The application relates to the field of cutting workpieces, in particular to a method, device, equipment and storage medium for cutting a wafer, wherein the method comprises the following steps: establishing a coordinate axis according to a working center of a workbench; acquiring a first image of a circle where an outer edge of the wafer is located, and mapping the first image onto the coordinate axis; acquiring first coordinates of not less than three points on the first image, and acquiring a first equation of the first image according to the first coordinates; acquiring a cutting angle of the wafer; determining a cutting starting point coordinate and a cutting ending point coordinate according to the first equation and the cutting angle; and cutting the wafer according to the cutting starting point coordinate and the cutting ending point coordinate. The application is convenient for cutting the wafer into a polygon close to a circle when the wafer center and the working center of the workbench do not coincide.

Description

Technical Field

[0001] This application relates to the field of workpiece cutting, and more particularly to a method, apparatus, equipment, and storage medium for cutting wafers. Background Technology

[0002] To obtain further derivative products from the wafer, the circular wafer needs to be further diced.

[0003] Currently, the ideal process for further dicing a circular wafer is as follows: the wafer is placed on a worktable with its center aligned with the worktable's center, and then the worktable dices the wafer, resulting in a wafer that is an equilateral polygon that is very close to a circle.

[0004] In the process of realizing this application, the inventors discovered that the above-mentioned technology has at least the following problems: in the actual cutting process, it is difficult to make the center of the wafer and the working center of the worktable accurately coincide, so the wafer cut out is not an equilateral polygon close to a circle. Summary of the Invention

[0005] To facilitate the cutting of wafers into near-circular polygons when the wafer center and the worktable center do not coincide, this application provides a method, apparatus, device, and storage medium for cutting wafers.

[0006] Firstly, this application provides a method for dicing wafers, employing the following technical solution: A method for dicing a wafer includes: A coordinate axis is established based on the working center of the worktable, which is used to cut the wafer; Acquire a first image of the outer edge of the wafer and map the first image onto the coordinate axis; Obtain the first coordinates of at least three points on the first image, and obtain the first equation of the first image based on the first coordinates; Obtain the dicing angle of the wafer, wherein the dicing angle is the angle of each part after the wafer is equally divided; The coordinates of the starting point and the ending point of the cut are determined based on the first equation and the cutting angle. The wafer is cut according to the starting point coordinates and the ending point coordinates.

[0007] By adopting the above technical solution, a coordinate system is first established with the working center of the workbench as the coordinate axis. Then, the image of the circle where the outer edge of the wafer is located is mapped onto the established coordinate system. The equation of the circle where the outer edge of the wafer is located is established by using the method of determining the equation of the circle by three points. From this equation, the coordinates of the center of the circle where the outer edge of the wafer is located and the radius of the circle can be obtained. Furthermore, by combining the angle information of each part after the single wafer is divided equally, the cutting start position and cutting end position of each part after the wafer is divided equally through the center can be calculated in sequence. In this way, the wafer can be cut according to the cutting start position and cutting end position of each part, which makes it easy to cut the wafer into an equilateral polygon that is close to a circle.

[0008] Preferably, establishing the coordinate axis based on the work center of the workbench includes: Obtain a planar image of the worktable; The working center position of the workbench is obtained based on the planar image; The coordinate axes are established based on the location of the work center.

[0009] By adopting the above technical solution, it is easy to find the position of the working center of the worktable by first obtaining a planar image of the worktable. Furthermore, a coordinate system can be established based on the position of the working center of the worktable. The purpose of establishing the coordinate system is to facilitate the subsequent knowledge of the center coordinates of the wafer and to facilitate the acquisition of the point coordinates of several points on the circle where the outer edge of the wafer is located.

[0010] Preferably, acquiring a first image of the outer edge of the wafer and mapping the first image onto the coordinate axis includes: The wafer is irradiated to generate an irradiated image; The first image is obtained based on the illumination image; Map the first image onto the coordinate axis.

[0011] By adopting the above technical solution, a light source can be used on the worktable to illuminate the wafer from the bottom. This will create areas of varying brightness when viewed from above the wafer, with the wafer itself appearing as a black circular area. First, an image of this area of ​​varying brightness is acquired. Then, image processing technology is used to obtain the shape of the circle containing the outer edge of the black circular area, and this is recorded as the first image. A point on the coordinate axis corresponds to the working center of the worktable, and this point is recorded as the image working center. Further, the first image is mapped onto the coordinate axis, ensuring that the center of the black circular area relative to the working center of the worktable corresponds to the center of the first image relative to the image working center. That is, in terms of position, the center of the black circular area corresponds to the center of the first image, and the working center of the worktable corresponds to the image working center.

[0012] Preferably, obtaining the first coordinates of at least three points on the first image and obtaining the first equation of the first image based on the first coordinates includes: Select at least three selection points from the first image, obtain the coordinates of each selection point, and record them as the first coordinates; The equation of the first image is obtained based on no less than three of the first coordinates, and is denoted as the first equation.

[0013] By adopting the above technical solution, the first image is mapped onto the coordinate axis. However, at this time, the image of the first image alone on the coordinate axis cannot reveal important information such as the equation, center, and radius of the first image. Next, it is necessary to solve the equation corresponding to the first image. In this technical solution, the method of determining a circle by three points is adopted. First, the computer randomly selects no less than three points on the first image and obtains the coordinates of each point on the coordinate axis. Then, the coordinates of these three points are substituted into the formula of the standard equation of the circle to solve and obtain the equation of the circle corresponding to the first image. The equation of the circle corresponding to the first image is recorded as the first equation.

[0014] Preferably, obtaining the dicing angle of the wafer includes: The number of equal parts of the wafer is preset; The cutting angle is determined based on the number of equal parts.

[0015] By adopting the above technical solution, the wafer is divided into several sectors by passing through the center. First, the number of equal divisions must be determined. It is known that the radian of a circle is 2π rad. Since the number of equal divisions has been determined, the angle between the two straight sides of each sector wafer can be obtained by simple division calculation, and it is recorded as the cutting angle.

[0016] Preferably, determining the coordinates of the cutting start point and the cutting end point based on the first equation and the cutting angle includes: The coordinates of the center of the first image circle and the radius of the first image are obtained according to the first equation; Obtain the work center coordinates and the cutting angle of the work center position; The coordinates of the cutting start point and the coordinates of the cutting end point are calculated based on the coordinates of the center of the first image, the radius of the first image, the coordinates of the working center, and the cutting angle.

[0017] By adopting the above technical solution, the coordinates of the center of the first image circle and the radius of the first image can be solved by the first equation. Furthermore, the offsets on the horizontal and vertical axes of each point on the first image caused by the first image circle not coinciding with the working center can be calculated by the coordinates of the center of the first image circle and the working center coordinates. Furthermore, the starting point coordinates and ending point coordinates of the cutting of each sector wafer can be determined by the offsets on the horizontal and vertical axes, the radius of the first image, and the cutting angle. It should be noted that the cutting starting point is the intersection of one right-angled side and the arc side of each sector, and the cutting ending point is the intersection of the other right-angled side and the arc side of each sector.

[0018] Preferably, the step of cutting the wafer based on the starting point coordinates and the ending point coordinates includes: The cutting line is determined based on the coordinates of the starting point and the ending point of the cutting. The worktable is controlled to cut the wafer according to the cutting line.

[0019] By adopting the above technical solution, the workbench can only cut wafers in a straight line. The starting point coordinates and ending point coordinates of each sector wafer are determined. Then, the straight line that the cutting component on the workbench travels when cutting each sector wafer can be determined. Then, the cutting component is controlled to cut the corresponding sector wafer according to the straight line corresponding to each sector wafer. This makes it easier to make the shape of the cut wafer an equilateral polygon that is close to a circle.

[0020] Secondly, this application provides a wafer dicing apparatus, which adopts the following technical solution: An apparatus for dicing wafers, comprising: A coordinate system establishment module (100) is used to establish coordinate axes based on the working center of the worktable, which is used to cut the wafer; The first image acquisition module (200) is used to acquire a first image of the outer edge of the wafer. And map the first image onto the coordinate axes; The first equation acquisition module (300) is used to acquire the first coordinates of no less than three points on the first image, and to acquire the first equation of the first image based on the first coordinates; The dicing angle acquisition module (400) is used to acquire the dicing angle of the wafer, wherein the dicing angle is the angle of each part after the single wafer is equally divided; The cutting point acquisition module (500) is used to determine the coordinates of the cutting start point and the cutting end point based on the first equation and the cutting angle. A wafer dicing module (600) is used to dice the wafer according to the dicing start coordinates and the dicing end coordinates.

[0021] By adopting the above technical solution, a coordinate system is first established with the working center of the workbench as the coordinate axis. Then, the image of the circle where the outer edge of the wafer is located is mapped onto the established coordinate system. The equation of the circle where the outer edge of the wafer is located is established by using the method of determining the equation of the circle by three points. From this equation, the coordinates of the center of the circle where the outer edge of the wafer is located and the radius of the circle can be obtained. Furthermore, by combining the angle information of each part after the single wafer is divided equally, the cutting start point and cutting end point of each part after the wafer is divided equally through the center can be calculated in turn. In this way, the wafer can be cut according to the cutting start point and cutting end point of each part, which makes it easier to cut the shape of the wafer into a polygon that is close to a circle.

[0022] Thirdly, this application provides a computer device that adopts the following technical solution: it includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as any of the wafer dicing methods described above.

[0023] By adopting the above technical solution, a coordinate system is first established with the working center of the workbench as the coordinate axis. Then, the image of the circle where the outer edge of the wafer is located is mapped onto the established coordinate system. The equation of the circle where the outer edge of the wafer is located is established by using the method of determining the equation of the circle by three points. From this equation, the coordinates of the center of the circle where the outer edge of the wafer is located and the radius of the circle can be obtained. Furthermore, by combining the angle information of each part after the single wafer is divided equally, the cutting start point and cutting end point of each part after the wafer is divided equally through the center can be calculated in turn. In this way, the wafer can be cut according to the cutting start point and cutting end point of each part, which makes it easier to cut the shape of the wafer into a polygon that is close to a circle.

[0024] Fourthly, this application provides a computer-readable storage medium that stores a computer program capable of being loaded by a processor and executing any of the above-described wafer dicing methods.

[0025] By adopting the above technical solution, a coordinate system is first established with the working center of the workbench as the coordinate axis. Then, the image of the circle where the outer edge of the wafer is located is mapped onto the established coordinate system. The equation of the circle where the outer edge of the wafer is located is established by using the method of determining the equation of the circle by three points. From this equation, the coordinates of the center of the circle where the outer edge of the wafer is located and the radius of the circle can be obtained. Furthermore, by combining the angle information of each part after the single wafer is divided equally, the cutting start point and cutting end point of each part after the wafer is divided equally through the center can be calculated in turn. In this way, the wafer can be cut according to the cutting start point and cutting end point of each part, which makes it easier to cut the shape of the wafer into a polygon that is close to a circle.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. Even if the center of the wafer does not coincide with the working center of the worktable, the equation of the corresponding circle can be obtained by first determining the circle where the outer edge of the wafer is located, and then the starting and ending points of each cut on the circle where the outer edge of the wafer is located can be determined to achieve the cutting of the wafer and cut the wafer into an equilateral polygon that is close to a circle.

[0027] 2. Illuminating the wafer from one side will produce areas of different brightness when viewed from the other side. This makes it easier to capture the shadowed areas of the wafer, thus facilitating the acquisition of an image of the outer edge of the wafer through image processing techniques.

[0028] 3. Since the cutting component on the worktable can only perform straight-line cutting, determining the cutting start point and the cutting end point makes it easier for the computer to control the cutting component to cut the wafer based on the cutting start point and the cutting end point. Attached Figure Description

[0029] Figure 1 This is a schematic flowchart of a wafer cutting method according to an embodiment of this application.

[0030] Figure 2 This is a flowchart of the sub-steps of S100 in the embodiments of this application.

[0031] Figure 3 This is a flowchart of the sub-steps of S200 in the embodiments of this application.

[0032] Figure 4 This is a flowchart of the sub-steps of S300 in the embodiments of this application.

[0033] Figure 5 This is a flowchart of the sub-steps of S400 in the embodiments of this application.

[0034] Figure 6 This is a flowchart of the sub-steps of S500 in the embodiments of this application.

[0035] Figure 7 This is a flowchart of the sub-steps of S600 in the embodiments of this application.

[0036] Figure 8 This is a block diagram of a wafer cutting system according to an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures: 100, Coordinate system establishment module; 200, First image acquisition module; 300, First equation acquisition module; 400, Cutting angle acquisition module; 500, Cutting point acquisition module; 600, Wafer cutting module. Detailed Implementation

[0038] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0039] In production, when cutting the outer edge of a circular wafer, the desired goal is to transform the outer edge shape of the wafer into an equilateral polygon that approximates a circle.

[0040] This application discloses a method for dicing a wafer. (Refer to...) Figure 1 Methods for dicing wafers include: S100. Establish coordinate axes based on the work center of the workbench.

[0041] In one embodiment, refer to Figure 2 S100 includes the following three steps: S101. Obtain a planar image of the workbench.

[0042] An industrial camera is used to take a picture of the workbench from directly above, thus obtaining a planar image of the workbench, which is then transmitted to a computer.

[0043] S102. Obtain the working center position of the workbench based on the planar image.

[0044] The computer acquires a planar image of the workbench and further uses image processing technology to determine the position of the work center on the planar image based on the characteristics of the work center.

[0045] In other embodiments, the user can also mark the position of the work center on the planar image by himself using a computer, so that the computer can obtain the position of the work center of the workbench.

[0046] S103. Establish coordinate axes based on the work center position.

[0047] After determining the working center position on the planar image, a planar coordinate system is established based on the working center position, and the working center position is set as a coordinate point on the planar coordinate system. Preferably, the coordinate point is the origin of the planar coordinate system.

[0048] S200: Obtain a first image of the outer edge of the wafer and map the first image onto the coordinate axis.

[0049] In one embodiment, refer to Figure 3 S200 includes the following three steps: S201. Irradiate the wafer to generate an irradiation image.

[0050] The wafer is placed on a workbench, and several point light sources are set up in the area below the wafer to illuminate it from directly below. Then, an industrial camera is used to take a picture of the wafer from directly above. Since the wafer above the point light sources blocks some of the light entering the industrial camera, a circular dark area will be generated in the imaging area of ​​the industrial camera corresponding to the wafer position, while other areas will be relatively bright. The industrial camera then generates a corresponding alternating bright and dark illumination image. The industrial camera then sends the illumination image to a computer.

[0051] S202. Obtain the first image based on the illumination image.

[0052] The computer acquires the illumination image sent by the industrial camera, further extracts the image of the edge of the circular dark area in the illumination image based on image processing technology, and further processes the image of the edge of the circular dark area to make it into a circular image, and records this circular image as the first image.

[0053] S203. Map the first image onto the coordinate axes.

[0054] After the planar image of the workbench and the image of the wafer taken by the industrial camera are transmitted to the computer, the computer processes the images to determine the distance and direction of the wafer's center relative to the workbench's working center.

[0055] Furthermore, the computer aligns the location of the work center with its coordinates on the plane coordinate system, and aligns the center of the wafer with the center of the first image; that is, it aligns the distance and direction of the center of the first image relative to the coordinates of the work center on the plane coordinate system with the distance and direction of the center of the wafer relative to the work center of the worktable.

[0056] Furthermore, the computer maps the first image onto the coordinate axes based on the aforementioned correspondence.

[0057] S300. Obtain the first coordinates of at least three points on the first image, and obtain the first equation of the first image based on the first coordinates.

[0058] In one embodiment, refer to Figure 4 The S300 process includes the following two steps: S301. Select at least three selection points from the first image, obtain the coordinates of each selection point, and record them as the first coordinates.

[0059] After displaying the first image on the coordinate axis, the equation corresponding to the first image on the coordinate axis is not yet obtained. Since the first image is a circle, the equation corresponding to the first image can be obtained by determining a circle by three points.

[0060] The computer has the function of capturing points on the first image. The computer randomly captures no less than 3 selected points on the first image and further obtains the coordinates of each selected point, and the coordinates of the selected points are marked as the first coordinates. Preferably, the number of selected points is set to 4. During the calculation, 3 of the first coordinates are randomly selected to obtain the equation of the circle corresponding to the first image, and the remaining 1 first coordinate is used to verify whether the calculated equation of the circle corresponding to the first image is correct.

[0061] S302. Obtain the equation of the first image based on no less than three first coordinates, denoted as the first equation.

[0062] Four coordinates are randomly selected by the computer. Three of these coordinates are then substituted into the standard equation of a circle to derive the equation of the circle corresponding to the first image. This equation is denoted as the first equation. The first equation is expressed as: (xa)² + (yb)² = r²; Where a is the x-coordinate of the center of the first image circle, b is the y-coordinate of the center of the first image circle, and r is the radius of the first image.

[0063] Furthermore, the fourth first coordinate is substituted into the first equation to determine if the first equation is true. If it is not true, four new first coordinates are selected and the corresponding first equation is calculated until the correct first equation is obtained; if it is true, then the first equation is the equation of the circle corresponding to the first image.

[0064] S400: Obtain the wafer cutting angle.

[0065] In one embodiment, refer to Figure 5 The S400 includes the following two steps: S401, Preset the number of equal parts of the wafer.

[0066] The wafer has been divided into circular sections. This division does not mean cutting the wafer through the center, but rather dividing the circular wafer into several sector-shaped wafers of equal size and shape.

[0067] To facilitate the subsequent dicing of the wafer into an equilateral polygon, the number of equal parts of the wafer needs to be pre-set. Preferably, in one embodiment, the number of equal parts of the wafer is set to 1080.

[0068] S402. Determine the cutting angle based on the number of equal parts.

[0069] It is known that the radian of a circle is 2π rad. After determining the number of equal divisions according to S401, the cutting angle of each sector wafer can be further determined. Here, the cutting angle refers to the angle between the two right-angled sides of the sector, and this angle is acute. The mathematical expression for this cutting angle is θ. The cutting angle θ can be calculated using the following formula: θ = 2π / number of equal parts; If the wafer is divided into 1080 equal parts as described in S401 above, then the corresponding cutting angle θ = 2π / number of equal parts = 2π / 1080 = π / 540.

[0070] S500. Determine the coordinates of the starting point and ending point of the cutting based on the first equation and the cutting angle.

[0071] In one embodiment, refer to Figure 6 The S500 includes the following three steps: S501. Obtain the coordinates of the center of the first image and the radius of the first image according to the first equation.

[0072] From S302, we can obtain the first equation as: (xa)² + (yb)² = r², then: The center coordinates of the first image are (a, b), and (a, b) are denoted as the center coordinates of the first image. Let r be the radius of the first image, and denote r as the radius of the first image.

[0073] S502. Obtain the work center coordinates and cutting angle of the work center position.

[0074] The coordinates of the work center on the coordinate axis can be obtained through S103, and the coordinates of the work center on the coordinate axis are called the work center coordinates, which are denoted as (m,n) in the mathematical plane coordinate system.

[0075] The cutting angle θ can be obtained through S402.

[0076] S503. Calculate the starting point coordinates and ending point coordinates of the cutting process based on the center coordinates of the first image, the radius of the first image, the working center coordinates, and the cutting angle.

[0077] Taking one of the fan-shaped wafers as an example: The starting point coordinates of the cut on the sector-shaped wafer are marked as (X1, Y1), and the ending point coordinates are marked as (X2, Y2).

[0078] To solve for X1 and Y1, use the following formulas: X1 = rcosθ + (am); Y1 = rsinθ + (bn); To solve for X² and Y², use the following formulas: X2 = rcos2θ + (am); Y2=rsin2θ+(bn); By finding (X1,Y1) and (X2,Y2), the coordinates of the starting point and the ending point of a sector wafer cutting can be determined.

[0079] Similarly, the starting and ending coordinates of the next sector wafer cut are (X2, Y2) and (X2, Y3). The solution process for X2 and Y2 is the same as above. To solve for X3 and Y3, use the following formula: X3 = rcos3θ + (am); Y3 = rsin3θ + (bn); Similarly, the coordinates of the starting point and ending point of the cutting of all the following sector wafers can be calculated by computer until the coordinates of the starting point and ending point of the cutting of all sector wafers are calculated.

[0080] S600: Obtain the wafer cutting angle.

[0081] In one embodiment, refer to Figure 7 The S600 includes the following two steps: S601. Determine the cutting line based on the coordinates of the starting point and the ending point of the cutting.

[0082] The S503 can obtain the starting and ending coordinates of each sector wafer cut. Then, the computer can calculate the equation of the straight line containing the starting and ending coordinates of each sector wafer cut based on these coordinates.

[0083] Taking the first sector-shaped wafer as an example: The starting coordinates of the first sector wafer cut are (X1, Y1), and the ending coordinates of the cut are (X2, Y2). The linear equation for the first sector wafer is: (Y-Y2) / (Y1-Y2) = (X-X2) / (X1-X2); S602. The wafer is cut according to the cutting line control table.

[0084] Given the starting and ending coordinates of each sector wafer, and the linear equation of the sector wafer obtained from the starting and ending coordinates, the computer controls the cutting component to start cutting from the position on the wafer corresponding to the starting coordinate, based on the starting coordinate. Then, based on the obtained linear equation, the computer performs linear cutting along the line on the wafer corresponding to the linear equation, until the cutting reaches the position on the wafer corresponding to the ending coordinate.

[0085] Each sector-shaped wafer is cut using the method described above, and each sector-shaped wafer is cut into identical isosceles triangles. Originally, each sector-shaped wafer is connected together; the term "each sector-shaped wafer" is used for ease of describing the starting and ending coordinates of the cut. Thus, after the wafers are cut, they form equilateral polygonal wafers. Preferably, when the number of sides of the equilateral polygon is 1080, the cut equilateral polygonal wafers appear close to circular wafers.

[0086] Figure 1 This is a schematic flowchart of a wafer dicing method in one embodiment. It should be understood that, although... Figure 1 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows; unless explicitly stated otherwise, there is no strict order requirement for the execution of these steps, and they can be executed in other orders; and Figure 1 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0087] This application discloses a system for dicing wafers. (Refer to...) Figure 8 The system includes: The coordinate system establishment module 100 establishes coordinate axes based on the working center of the worktable, which is used for cutting wafers.

[0088] Specifically, the coordinate system establishment module 100 is used to first acquire a planar image of the workbench, then use image processing technology to determine the position of the work center on the planar image based on the characteristics of the work center of the workbench, and then establish a planar coordinate system based on the position of the work center, and set the position of the work center as a coordinate point on the planar coordinate system. Preferably, the coordinate point is the origin of the planar coordinate system.

[0089] The first image acquisition module 200 is used to acquire a first image of the circle where the outer edge of the wafer is located, and to map the first image onto the coordinate axis.

[0090] Specifically, the first image acquisition module 200 first illuminates the wafer from directly below, and then takes a picture of the wafer from directly above, thereby acquiring the corresponding illuminated image. Further, it selects the edge image of the circular dark area in the illuminated image using image processing techniques, and further processes the edge image of the circular dark area to make it a circular image, which is then recorded as the first image. Finally, it makes the distance and direction of the center of the first image relative to the work center in the planar coordinate system correspond to the distance and direction of the center of the wafer relative to the work center of the worktable.

[0091] The first equation acquisition module 300 is used to acquire the first coordinates of no less than three points on the first image, and to acquire the first equation of the first image based on the first coordinates.

[0092] Specifically, the first equation acquisition module 300 first randomly selects no fewer than three points on the first image and then obtains the coordinates of each point. Then, it randomly selects three of these points and substitutes them into the known standard equation of a circle to obtain the equation of the circle corresponding to the first image, which is then denoted as the first equation.

[0093] The dicing angle acquisition module 400 is used to acquire the dicing angle of the wafer, wherein the dicing angle is the angle of each part after the single wafer is equally divided.

[0094] Specifically, the cutting angle acquisition module 400 is used to first preset the number of equal parts of the wafer, and then calculate and obtain the cutting angle according to the formula of the cutting angle.

[0095] The cutting point acquisition module 500 is used to determine the coordinates of the starting point and the ending point of the cutting based on the first equation and the cutting angle.

[0096] Specifically, the cutting point acquisition module 500 first obtains the coordinates of the center of the first image circle and the radius of the first image according to the first equation. Then, it obtains the coordinates of the working center of the worktable and the cutting angle. Finally, it calculates the coordinates of the cutting start point and the cutting end point based on the coordinates of the center of the first image circle, the radius of the first image, the coordinates of the working center, and the cutting angle.

[0097] The wafer dicing module 600 is used to dice wafers based on the starting and ending coordinates of the dicing.

[0098] Specifically, the wafer dicing module 600 first determines the dicing line based on the coordinates of the dicing start point and the dicing end point. Then, it controls the worktable to dic the wafer according to the dicing line.

[0099] In one embodiment, a computer device is provided, including a memory and a processor. The memory stores a computer program, which, when executed by the processor, causes the processor to perform the steps of the wafer dicing method described above. The steps of the wafer dicing method described here can be steps from the wafer dicing methods of the various embodiments described above.

[0100] In one embodiment, a computer-readable storage medium is provided that stores a computer program capable of being loaded by a processor and executed as described above in a wafer dicing method. The computer-readable storage medium includes, for example, various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0101] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A method for dicing a wafer, characterized in that: include: A coordinate axis is established based on the working center of the worktable, which is used to cut the wafer; Acquire a first image of the outer edge of the wafer and map the first image onto the coordinate axis; Obtain the first coordinates of at least three points on the first image, and obtain the first equation of the first image based on the first coordinates; obtain the cutting angle of the wafer, wherein the cutting angle is the angle of each part after the wafer is equally divided; determine the cutting start point coordinates and the cutting end point coordinates based on the first equation and the cutting angle; cut the wafer based on the cutting start point coordinates and the cutting end point coordinates. The step of determining the starting point coordinates and ending point coordinates of the cut based on the first equation and the cutting angle includes: obtaining the first image center coordinates and the first image radius of the first image based on the first equation; obtaining the working center coordinates and the cutting angle of the working center position; and calculating the starting point coordinates and ending point coordinates of the cut based on the first image center coordinates, the first image radius, the working center coordinates, and the cutting angle. The step of cutting the wafer based on the starting point coordinates and the ending point coordinates includes: determining a cutting line based on the starting point coordinates and the ending point coordinates; and controlling the worktable to cut the wafer based on the cutting line.

2. The method for dicing a wafer according to claim 1, characterized in that: The step of establishing coordinate axes based on the work center of the workbench includes: acquiring a planar image of the workbench; acquiring the work center position of the workbench based on the planar image; and establishing coordinate axes based on the work center position.

3. The method for dicing a wafer according to claim 2, characterized in that: The step of acquiring a first image of the outer edge of the wafer and mapping the first image onto the coordinate axis includes: irradiating the wafer to generate an irradiated image; acquiring the first image based on the irradiated image; and mapping the first image onto the coordinate axis.

4. The method for dicing a wafer according to claim 3, characterized in that: The step of obtaining the first coordinates of at least three points on the first image and obtaining the first equation of the first image based on the first coordinates includes: selecting at least three points from the first image, obtaining the coordinates of each selected point and recording them as the first coordinates; and obtaining the equation of the first image based on at least three first coordinates and recording it as the first equation.

5. A method for dicing a wafer according to claim 4, characterized in that: The step of obtaining the cutting angle of the wafer includes: presetting the number of equal parts of the wafer; and determining the cutting angle based on the number of equal parts.

6. An apparatus for dicing wafers, characterized in that: include: A coordinate system establishment module (100) is used to establish coordinate axes based on the working center of the worktable, which is used to cut the wafer; A first image acquisition module (200) is used to acquire a first image of the outer edge of the wafer and map the first image onto the coordinate axis; a first equation acquisition module (300) is used to acquire the first coordinates of at least three points on the first image and acquire the first equation of the first image based on the first coordinates; a cutting angle acquisition module (400) is used to acquire the cutting angle of the wafer, wherein the cutting angle is the angle of each part after the single wafer is equally divided; a cutting point acquisition module (500) is used to determine the cutting start point coordinates and the cutting end point coordinates based on the first equation and the cutting angle; A wafer dicing module (600) is used to dice the wafer according to the dicing start coordinates and the dicing end coordinates; The step of determining the starting point coordinates and ending point coordinates of the cut based on the first equation and the cutting angle includes: obtaining the first image center coordinates and the first image radius of the first image based on the first equation; obtaining the working center coordinates and the cutting angle of the working center position; and calculating the starting point coordinates and ending point coordinates of the cut based on the first image center coordinates, the first image radius, the working center coordinates, and the cutting angle. The step of cutting the wafer based on the starting point coordinates and the ending point coordinates includes: determining a cutting line based on the starting point coordinates and the ending point coordinates; and controlling the worktable to cut the wafer based on the cutting line.

7. A computer device, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that, The computer program is stored that can be loaded by a processor and executed according to any one of claims 1 to 5.

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