Superconducting computing system in a liquid hydrogen environment

Abstract

A superconducting computing system and related aspects contained in a liquid hydrogen environment are described. An example superconducting computing system includes a housing disposed within the liquid hydrogen environment, wherein the pressure inside the housing is maintained lower than the pressure outside the housing. The superconducting computing system also includes a substrate with a surface disposed within the housing, wherein a plurality of components attached to the surface are configured to provide at least one of computing or storage functions, and the substrate further includes multiple circuit traces for interconnecting at least a subset of the plurality of components. The housing is configured such that each of the plurality of components is configured to operate at a first temperature, wherein the first temperature is below 4.2 Kelvin, although the liquid hydrogen environment has a second temperature greater than 4.2 Kelvin.

Description

Background Technology

[0001] Semiconductor-based integrated circuits used in electronic devices such as digital processors include digital circuits based on complementary metal-oxide-semiconductor (CMOS) technology. However, CMOS technology is reaching its limits in terms of device size. Furthermore, the power consumption of CMOS-based digital circuits at high clock speeds is increasingly becoming a limiting factor for high-performance digital circuits and systems. For example, servers in data centers consume increasingly larger amounts of power. Even when CMOS circuits are inactive, power consumption is partly due to power loss caused by energy dissipation. This is because, even when such circuits are inactive and do not consume any dynamic power, they still consume power because CMOS transistors need to be kept in a state.

[0002] Besides using CMOS-based processors and related components, another approach is to use components and devices based on superconducting logic. Superconducting logic-based components and devices can also be used to process quantum information, such as qubits. However, even superconducting logic-based devices, such as superconducting memories, consume significant amounts of power due to the need to operate at low temperatures (e.g., 4.2K or lower). Summary of the Invention

[0003] In one aspect of this disclosure, a superconducting computing system includes a housing disposed within a liquid hydrogen environment, wherein a lower pressure is maintained inside the housing than outside the housing. The superconducting computing system may also include a substrate disposed within the housing, having a surface, wherein a plurality of components attached to the surface are configured to provide at least one of computing or storage functions, and wherein the substrate further includes a plurality of circuit traces for interconnecting at least a subset of the plurality of components, wherein the housing is configured such that each of the plurality of components is configured to operate at a first temperature below 4.2 Kelvin, although the liquid hydrogen environment has a second temperature greater than 4.2 Kelvin.

[0004] In another aspect of this disclosure, a superconducting computing system is provided, comprising: a housing disposed within a liquid hydrogen environment, wherein a pressure is maintained inside the housing at a lower level than that outside the housing. The superconducting computing system may further include a first substrate disposed within the housing in a first plane, the first substrate having a first surface parallel to the first plane, wherein a first plurality of components attached to the first surface are configured to provide at least one of computing or storage functions. The superconducting computing system may further include a second substrate disposed within the housing in a second plane parallel to the first plane, the second substrate having a second surface parallel to the second plane, wherein a second plurality of components attached to the second surface are configured to provide at least one of computing or storage functions, and wherein the first substrate further includes a first plurality of circuit traces for interconnecting at least a subset of the first plurality of components, and wherein the second substrate further includes a second plurality of circuit traces for interconnecting at least a subset of the second plurality of components, wherein liquid helium inside the housing is configured to cool the environment inside the housing such that each of the first plurality of components and the second plurality of components is configured to operate at a first temperature, wherein the first temperature is below 4.2 Kelvin, although the liquid hydrogen environment has a second temperature greater than 4.2 Kelvin.

[0005] In another aspect, this disclosure relates to a superconducting computing system including a first storage tank. The superconducting computing system may further include a second storage tank containing liquid hydrogen, wherein the second storage tank is disposed inside the first storage tank. The superconducting computing system may further include a cryostat wall disposed inside the second storage tank, wherein the space enclosed by the cryostat wall is maintained under vacuum. The superconducting computing system may further include a substrate inside the cryostat wall, wherein a plurality of components coupled to the substrate are configured to provide at least one of computing or storage functions. The superconducting computing system may further include a cooling system configured to maintain the temperature inside the housing below 4.2 Kelvin.

[0006] This summary is provided to introduce, in a simplified form, a series of concepts further described in the detailed description below. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Attached Figure Description

[0007] This disclosure is illustrated by way of example and is not limited to the accompanying drawings, wherein similar reference numerals indicate similar elements. The elements in the drawings are illustrated for simplicity and clarity and are not necessarily drawn to scale.

[0008] Figure 1A A superconducting computational system is shown inside an example liquid hydrogen environment;

[0009] Figure 1BA superconducting computational system is shown inside an example liquid hydrogen environment;

[0010] Figure 2 A detailed view of a portion of the superconducting computing system according to an example of Figure 1 is shown;

[0011] Figure 3 A detailed view of a portion of a superconducting computing system according to an example of Figure 1 is shown; and

[0012] Figure 4 A superconducting computational system is shown inside an example liquid hydrogen environment. Detailed Implementation

[0013] The examples described in this disclosure relate to computing systems that include superconducting components and devices. Some examples of this disclosure relate to computing systems that include components that operate at low temperatures (e.g., at or below 4.2 Kelvin). In one example, the superconducting system is housed in a vacuum assembly enclosed in a liquid hydrogen environment. In this example, the superconducting system may include one or more superconducting components formed on a substrate. The superconducting components may include an integrated circuit chip mounted on the substrate. Superconducting components and devices may use Josephson junctions to implement circuit-related functions. An exemplary Josephson junction may include two superconductors coupled via regions that impede current. The regions that impede current may be a physical narrowing of the superconductor itself, a metallic region, or a thin insulating barrier. As an example, a superconductor-insulator-superconductor (SIS) type Josephson junction may be implemented as part of a superconducting circuit. As an example, a superconductor is a material that can carry direct current (DC) without an electric field. Superconductors have a critical temperature (Tc) below which they have zero resistance. Niobium is one such superconductor with a critical temperature (Tc) of 9.3 Kelvin. Below the temperature Tc, niobium is superconducting; however, above Tc, niobium behaves as a common metal with electrical resistance. Therefore, in a Josephson junction of the SIS type, the superconductor can be a niobium superconductor, and the insulator can be an Al₂O₃ barrier. In SIS-type junctions, superconducting electrons are described by quantum mechanical wave functions. The phase difference over time of the superconducting electron wave function between two superconductors corresponds to the potential difference between the two superconductors.

[0014] As needed, various superconducting circuits, including transmission lines, can be formed by coupling multiple Josephson junctions with inductors or other components. Microwave pulses can travel through these transmission lines under the control of at least one clock. Microwave pulses can be positive or negative, or a combination thereof. Microwave pulses can have frequencies up to 10 GHz or higher. Any circuit board or other type of structure, such as an insert with this superconducting circuit, can be required to support not only high-frequency microwave signals but also direct current (DC) signals.

[0015] While superconductivity offers several advantages, including lower electrical resistance and better bandwidth characteristics, superconducting materials require operation at cryogenic temperatures (e.g., 4K). In data-intensive, large-scale computing systems, a 4K environment could require hundreds of megawatts of power. This disclosure describes a computing system that advantageously consumes less power by confining the cryogenic computing environment within a liquid hydrogen environment maintained at approximately 20 Kelvin, thereby limiting thermal parasitic effects. Furthermore, the operational efficiency of such a system can be further enhanced by using additional features that reduce thermal parasitic effects. The cryogenic computing environment can be formed using conduction, convection, or immersion.

[0016] Figure 1A This is a view 100 of a superconducting computing system 110 within an example liquid hydrogen environment. In this example, the liquid hydrogen environment may include a storage tank 102, which may include a liquid hydrogen container 104. The liquid hydrogen container 104 may include liquefied hydrogen, which may be at a temperature between 20 Kelvin and 22 Kelvin. Related to Figure 4 To provide additional details regarding the example liquid hydrogen environment. Liquid hydrogen container 104 may include a superconducting computing system 110. Superconducting computing system 110 may include a housing 112. Housing 112 may be configured to maintain a vacuum inside the housing. Components corresponding to the superconducting computing system 110 (e.g., processors and memory) are located inside the vacuum-maintaining housing 112. Housing 112 may include a heat shield 114, which may further enclose superconducting components that may be arranged as part of two superconducting component sets (a first superconducting component set 116 and a second superconducting component set 118). The superconducting components may be included in only one set or in multiple sets. The superconducting components may be configured to operate in a cryogenic environment (e.g., in a vacuum and at temperatures below 4.2 Kelvin).

[0017] Continue to refer to Figure 1AIn this example, housing 112 can be configured as a cylindrical container disposed inside liquid hydrogen container 104, facing the bottom of liquid hydrogen container 104. In this example, housing 112 can be disposed on supports 122 and 124 inside liquid hydrogen container 104. Supports 122 and 124 can be configured to minimize contact with liquid hydrogen container 104, and thus minimize any heat conduction through the supports. In operating mode, liquid hydrogen surrounds the cryogenic computing environment, with only the supports touching the inner surface of liquid hydrogen container 104. A retractable ring can drop out of housing 110 to seal the "airlock" from the external environment, through which robots, new equipment, etc., can be transferred and installed into housing 110. Airlock 120 can be a full ring or can be reduced to a smaller size to save cost and liquid helium. In this example, airlock 120 is shown in the open position. The combination of the retractable ring and airlock can be used as a transfer system to allow access to housing 112. Figure 1B The same superconducting computing system 110 as described in Figure 1 is shown, and the liquid hydrogen environment previously described is also illustrated. However, in Figure 1B In the diagram, airlock 120 is shown in its closed position 152. Although Figure 1A and Figure 1B The superconducting computing system 110 is shown as having a certain form and arrangement, but the superconducting computing system 110 can have different forms and arrangements. Similarly, although Figure 1A and Figure 1B A liquid hydrogen environment including a spherical storage container is shown, but the liquid hydrogen container 104 can have different shapes, including cylindrical shapes.

[0018] Figure 2A superconducting computing system 210 is illustrated within an example liquid hydrogen environment 200. The superconducting computing system 210 may include a housing 220. The housing 220 may be configured to maintain a vacuum within its interior. Therefore, components corresponding to the superconducting computing system 210 (e.g., processors and memory) are located within the vacuum-maintaining housing 220. The housing 220 may include one or more substrates (e.g., substrates 224, 226, and 228). Each of these substrates may be formed using glass or other suitable materials; for example, various types of polymers. In one example, the glass material may be borosilicate glass. The housing 220 may also include a heat shield 230, which may be configured to thermally insulate portions of each substrate located within the heat shield 230. Although not shown, the heat shield 230 may be cooled via liquid helium (or other suitable coolant) flowing through conduits or tubes coupled to the heat shield 230. In one example, the heat shield 230 may be formed using a nickel-iron alloy (e.g., Mu metal). The heat shield 230 may also be encased as a multilayer insulator (not shown). Thus, the thermal shield 230 can provide thermal isolation between the 4K space and the 20K liquid hydrogen environment surrounding the housing 220. In one example, superconducting components (e.g., central processing unit (CPU), graphics processing unit (GPU), artificial intelligence processor, field-programmable gate array (FPGA), application-specific integrated circuit (ASIC), application-specific standard product (ASSP), system-on-a-chip (SOC), complex programmable logic device (CPLD)) can be located on a substrate (e.g., 224, 226, and 228). The superconducting components can be configured to provide any functionality required to implement computing or storage functions. By way of example and not limitation, computing functions can include at least one (or any suitable combination) of the following: central processing function, graphics processing function, artificial intelligence function, gate array function, memory function, or bus interface management function. The superconducting components can also provide storage functions and can include memory components, including any non-volatile or volatile memory components. Volatile memory components can include any of a variety of types of random access memory components, including dynamic random access memory (DRAM) components. Non-volatile memory components can include any of a variety of memory components that can store information even when no power is applied, including flash memory components. Superconducting components can also include field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-chips (SoCs), and complex programmable logic devices (CPLDs).

[0019] Continue to refer to Figure 2The heat shield 230 helps maintain a temperature suitable for allowing the superconducting device to operate according to superconducting principles. Therefore, the superconducting component can be kept at a low temperature (e.g., a few milliklvin to 4.2kJ). This can be achieved via a combination of thermal isolation and cooling via liquid helium or other such coolants. As an example, a copper sidewall 240 can be mounted near the superconducting component. The copper sidewall 240 can also be cooled via liquid helium flowing through conduits (e.g., conduits 242, 244, 246, and 248), such as... Figure 2 As shown in the example. In one example, a system operating in a cryogenic environment may require a vacuum to function properly. In one example, a vacuum can be associated with 10... -3 drag it up to 10 -10 The pressure range is related to the temperature range. It should be understood that the temperature range referred to herein relates to the ambient temperature in which these components operate, and not to the temperature of the components themselves. Therefore, references such as “operating in” or “held in” refer to the temperature of the environment in which these components operate or are held.

[0020] Continue to refer to Figure 2 Superconducting components can be interconnected using circuit traces formed on the top or bottom surface of each of the common substrates (e.g., 224, 226, and 228). Suitable fabrication processes can be used to form the circuit traces, including but not limited to selective laser sintering, fused deposition modeling, direct metal laser sintering, stereolithography, cladding, electron beam melting, direct electron beam fabrication, aerosol jetting, inkjet printing, semi-solid freeform fabrication, digital light processing, laminated object fabrication, 3D printing, or other similar processes. In one example, the circuit traces can be made of niobium (or another suitable superconducting material) in the substrate region including the superconducting component. Although Figure 2 The diagram shows one arrangement of components, substrates, and other components, but these can be arranged in different ways. Furthermore, fewer or more components, substrates, and other components may be present.

[0021] Figure 3 A detailed view of a portion 300 of a superconducting computing system according to an example of Figure 1 is shown. Portion 300 may include a cryostat wall 302 surrounding a cryogenic computing environment (CCE) 304. The cryostat wall 302 may be used to isolate the CCE 304 from a liquid hydrogen environment. In this example, the CCE 304 may include superconducting components disposed within a vacuum. The CCE 304 may include a superconducting substrate 310, a qubit wafer 320, a liquid helium heat transfer element 330, and a 20 mK cold plate 340. An AC / DC power cable 350 may be used to provide AC and / or DC power to the superconducting components. A data cable 352 may be used to allow microwave signals or other signals to communicate to / from the superconducting components in the CCE 304.

[0022] See also Figure 3 In this example, chips 321, 322, 323, 324, and 325 can be arranged as a two-dimensional array on (or near) the top surface of a single monolithic wafer of silicon or sapphire (e.g., qubit wafer 320). A 20 mK cold plate 340 can be thermally bonded to the mixing chamber of a dilution refrigerator (e.g., a sealed helium (He) heat transfer bath). Although not explicitly stated... Figure 3 As shown, however, a dilution refrigerator and cold plates or other thermal couplings can be used to maintain the thermal hierarchy. The dilution refrigerator can be a wet or dry dilution refrigerator. As an example, a wet dilution refrigerator can use a combination of pumps and heat exchangers to generate different temperature levels from 4.2 K to 20 mK. A circulation pump (not shown) can be pumped via a return line to circulate liquid helium through the various stages of the dilution refrigerator. The liquid helium can be a mixture of two isotopes (He-4 and He-3). Another pump can draw liquid helium from a storage tank and can collect any condensate formed due to heat exchange with the circulating liquid helium. An additional heat exchanger can be used to cool the circulating helium to a temperature at which the liquid helium can undergo phase separation to produce a concentrated phase and a diluted phase of helium. Since these two phases can enter a mixing chamber (not shown), the concentrated phase can be diluted, producing additional cooling. As the cooled diluted helium circulates from the mixing chamber to the still, the cooled diluted helium can be used to cool the helium flowing downwards (towards the mixing chamber) until it reaches the still. As liquid helium continues to circulate, thermally coupled cold plates can be used to maintain superconducting components and qubit wafers at the desired cryogenic temperatures.

[0023] Continue to refer to Figure 3 Some basic interface circuitry can reside on the qubit wafer itself; more complex interface circuitry can reside on chips 321, 322, 323, 324, and 325, which are flip-chip bonded (circuit side down) to the qubit wafer 320. Cables (e.g., cable 328) can be routed via radiation shielding to chips 311, 312, 313, 314, and 315 mounted on the superconducting substrate 310. In this example, chips 311, 312, 313, 314, and 315 can operate at approximately 4.2 Kelvin. Cables (e.g., cable 328) can be thermally clamped as needed to maintain thermal hierarchy. Although Figure 3 A certain number of components are shown arranged in a certain way, but there may be more or fewer components arranged differently.

[0024] In one example, a superconducting component can be formed to support signals ranging from DC to frequencies greater than 10 GHz. In this example, the superconducting component can be fabricated on a large silicon substrate, such as a 200 mm wafer, a 300 mm wafer, or even larger wafer, which can be divided into multiple dies. In one example, the substrate can be made of silicon or any other thermally insulating or thermally conductive material. Furthermore, in this example, the signal traces and ground plane can be formed by sputtering niobium or similar superconducting materials. As an example, niobium compounds, such as niobium nitride (NbN) or niobium titanium nitride (NbTiN), can also be used. Other physical vapor deposition (PVD) methods, such as molecular beam epitaxy (MBE), can also be used. Depending on the type of material used for the traces, sputtering processes, chemical vapor deposition (CVD) processes, plasma-enhanced chemical vapor deposition (PECVD) processes, evaporation processes, or atomic layer deposition (ALD) processes can also be used. Therefore, for example, CVD processes can be used to form niobium compounds such as NbN and NbTiN.

[0025] Figure 4 A superconducting computing system 410 is shown within an example liquid hydrogen environment 400. The liquid hydrogen environment 400 may include a storage tank 402. The storage tank 402 may include a liquid hydrogen container 404. The liquid hydrogen container 404 may include the superconducting computing system 410, including supports 414 and 416. The superconducting computing system 410 may also include a gaslock 412, which may also be coupled to a cable assembly 418. The superconducting computing system 410 may be similar to a previously described superconducting computing system. Liquid hydrogen supply may be provided by a gas supply line 422. Valves 424 and 426 may be used to control and regulate the supply. Any vaporized gas formed due to the boiling of the liquid hydrogen may be removed from the liquid hydrogen container 404 via a vaporized gas discharge line 430. The discharge of vaporized gas may be controlled and regulated using valves 432 and 434. If desired, a liquefier 440 may be used to process some of the vaporized gas to generate liquefied hydrogen. Liquefied hydrogen can be returned to liquid hydrogen container 404 via gas return line 446. The return gas can be controlled and regulated via valves 442 and 444. Although Figure 4 The specific shapes and arrangements of various components are shown, but they can have other shapes and they can be arranged differently.

[0026] In summary, in one aspect of this disclosure, a superconducting computing system includes a housing disposed within a liquid hydrogen environment, wherein the pressure inside the housing is maintained at a lower pressure than the pressure outside the housing. The superconducting computing system may further include a substrate having a surface disposed within the housing, wherein a plurality of components attached to the surface are configured to provide at least one of computing or storage functions, and wherein the substrate further includes a plurality of circuit traces for interconnecting at least a subset of the plurality of components, wherein the housing is configured such that each of the plurality of components is configured to operate at a first temperature, wherein the first temperature is below 4.2 Kelvin, although the liquid hydrogen environment has a second temperature greater than 4.2 Kelvin.

[0027] In superconducting computing systems, lower pressures can be achieved at 10... -3 drag it up to 10 -10 The temperature can be within the range of 20 Kelvin to 24 Kelvin. The liquid hydrogen environment may include a structure containing liquid hydrogen and may use at least one cold plate coupled to liquid helium to cool multiple components.

[0028] The substrate can be accessed via a transfer system configured to allow access to the substrate. Each of the multiple components may include at least one of the following: a central processing unit, a graphics processing unit, an artificial intelligence processor, a field-programmable gate array, an application-specific integrated circuit, a dedicated standard product, a system-on-a-chip, a complex programmable logic device, static random access memory, dynamic random access memory, or Josephson magnetic random access memory.

[0029] The computing functionality may include at least one of the following: central processing functionality, graphics processing functionality, artificial intelligence functionality, gate array functionality, memory functionality, or bus interface management functionality, and wherein the memory functionality includes at least one of the following: memory functionality, gate array functionality, memory controller functionality, or bus interface management functionality. The substrate may include multiple circuit traces, and each of the multiple circuit traces may include a superconducting metal.

[0030] In another aspect of this disclosure, a superconducting computing system is provided, comprising: a housing disposed within a liquid hydrogen environment, wherein a pressure is maintained inside the housing at a lower level than that outside the housing. The superconducting computing system may further include a first substrate disposed within the housing in a first plane, the first substrate having a first surface parallel to the first plane, wherein a first plurality of components attached to the first surface are configured to provide at least one of computing or storage functions. The superconducting computing system may further include a second substrate disposed within the housing in a second plane parallel to the first plane, the second substrate having a second surface parallel to the second plane, wherein a second plurality of components attached to the second surface are configured to provide at least one of computing or storage functions, and wherein the first substrate further includes a first plurality of circuit traces for interconnecting at least a subset of the first plurality of components, and wherein the second substrate further includes a second plurality of circuit traces for interconnecting at least a subset of the second plurality of components, wherein liquid helium inside the housing is configured to cool the environment inside the housing such that each of the first plurality of components and the second plurality of components is configured to operate at a first temperature, wherein the first temperature is below 4.2 Kelvin, although the liquid hydrogen environment has a second temperature greater than 4.2 Kelvin.

[0031] In superconducting computing systems, lower pressures can be achieved at 10... -3 drag it up to 10 -10 The temperature can be within the range of 20 Kelvin to 24 Kelvin. The liquid hydrogen environment may include a structure containing liquid hydrogen and may use at least one cold plate coupled to liquid helium to cool multiple components.

[0032] Each of the first and second substrates can be accessed via a transfer system configured to allow access to each of the first and second substrates. Each of the first plurality of components and the second plurality of components may include at least one of the following: a central processing unit, a graphics processing unit, an artificial intelligence processor, a field-programmable gate array, an application-specific integrated circuit, an application-specific standard product, a system-on-a-chip, a complex programmable logic device, a static random access memory, a dynamic random access memory, or a Josephson magnetic random access memory.

[0033] The computing functionality may include at least one of the following: central processing functionality, graphics processing functionality, artificial intelligence functionality, gate array functionality, memory functionality, or bus interface management functionality, and wherein the memory functionality includes at least one of the following: memory functionality, gate array functionality, memory controller functionality, or bus interface management functionality. Each of the first plurality of circuit traces and the second plurality of circuit traces may include a superconducting metal.

[0034] In another aspect, this disclosure relates to a superconducting computing system including a first storage tank. The superconducting computing system may further include a second storage tank containing liquid hydrogen, wherein the second storage tank is disposed inside the first storage tank. The superconducting computing system may further include a cryostat wall disposed inside the second storage tank, wherein the space enclosed by the cryostat wall is maintained under vacuum. The superconducting computing system may further include a substrate inside the cryostat wall, wherein a plurality of components coupled to the substrate are configured to provide at least one of computing or storage functions. The superconducting computing system may further include a cooling system configured to maintain the temperature inside the housing below 4.2 Kelvin.

[0035] Vacuum can correspond to 10 -3 drag it up to 10 -10 The pressure range is between 20 Kelvin and 24 Kelvin, and the liquid hydrogen can be maintained at a second temperature in the range between 20 Kelvin and 24 Kelvin.

[0036] The substrate can be accessed via a transfer system configured to allow access to the substrate. Each of the multiple components may include at least one of the following: a central processing unit, a graphics processing unit, an artificial intelligence processor, a field-programmable gate array, an application-specific integrated circuit, an application-specific standard product, a system-on-a-chip, a complex programmable logic device, static random access memory, dynamic random access memory, or Josephson magnetic random access memory.

[0037] The computing functionality may include at least one of the following: central processing functionality, graphics processing functionality, artificial intelligence functionality, gate array functionality, memory functionality, or bus interface management functionality, and wherein the memory functionality includes at least one of the following: memory functionality, gate array functionality, memory controller functionality, or bus interface management functionality. The substrate may include multiple circuit traces, and each of the multiple circuit traces may include a superconducting metal.

[0038] It should be understood that the methods, modules, and components described herein are merely exemplary. For example, and not as a limitation, illustrative types of superconducting devices may include field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-chips (SoCs), complex programmable logic devices (CPLDs), etc.

[0039] Furthermore, in an abstract yet still explicit sense, any arrangement of components that achieve the same functionality is effectively “associated” to achieve the desired function. Therefore, any two components combined in this paper to achieve a specific function can be considered “associated” with each other to achieve the desired function, regardless of the architecture or intermediate components. Similarly, any two such associated components can also be considered “operably connected” or “coupled” with each other to achieve the desired function.

[0040] Furthermore, those skilled in the art will recognize that the boundaries between the functions of the above operations are merely illustrative. The functions of multiple operations can be combined into a single operation, and / or the functions of a single operation can be distributed among additional operations. Moreover, alternative embodiments may include multiple instances of a particular operation, and the order of operations may be varied in various other embodiments.

[0041] While specific examples are provided in this disclosure, various modifications and alterations may be made without departing from the scope of this disclosure as set forth in the following claims. Therefore, the specification and drawings are to be considered illustrative rather than restrictive, and all such modifications are intended to be included within the scope of this disclosure. Any benefits, advantages, or solutions to problems described herein with respect to specific examples should not be construed as key, essential, or necessary features or elements of any or all claims.

[0042] Furthermore, the terms “a” or “an” as used herein are defined as one or more. Additionally, the use of introductory phrases such as “at least one” and “one or more” in claims should not be construed as implying that another claim element introduced by the indefinite article “a” or “an” limits any particular claim containing such an introduced claim element to an invention containing only one such element, even when the same claim includes the introductory phrase “one or more” or “at least one” along with indefinite articles such as “a” or “an.” The same applies to the use of definite articles.

[0043] Unless otherwise stated, terms such as “first” and “second” are used to arbitrarily distinguish between the elements described by such terms. Therefore, these terms are not necessarily intended to indicate the time or other priority of such elements.

Claims

1. A superconducting computing system, comprising: a housing arranged inside a liquid hydrogen environment, wherein a lower pressure than the pressure outside the housing is maintained inside the housing, wherein the lower pressure is in the range of 10 -3 Torr to 10 -10 Torr, and wherein the inside of the housing is accessible via a transfer system; A substrate, disposed inside the housing, has a surface wherein a plurality of superconducting components attached to the surface are configured to provide at least one of computing or storage functions, and wherein the substrate further includes a plurality of circuit traces for interconnecting at least a subset of the plurality of superconducting components, wherein the housing is configured such that each of the plurality of superconducting components is configured to operate at a first temperature, wherein the first temperature is below 4.2 Kelvin, although the liquid hydrogen environment has a second temperature greater than 4.2 Kelvin; as well as Thermal shielding is configured to provide thermal isolation between at least the plurality of superconducting components arranged inside the housing and the liquid hydrogen environment.

2. The superconducting computing system according to claim 1, wherein the second temperature is in the range of 20 Kelvin to 24 Kelvin.

3. The superconducting computing system of claim 1, wherein the liquid hydrogen environment includes a structure containing liquid hydrogen, and wherein at least one cold plate coupled to liquid helium is used to cool the plurality of superconducting components.

4. The superconducting computing system according to claim 1, wherein each of the plurality of superconducting components comprises at least one of the following: a central processing unit, a graphics processing unit, an artificial intelligence processor, a field-programmable gate array, an application-specific integrated circuit, a dedicated standard product, a system-on-a-chip, a complex programmable logic device, a static random access memory, a dynamic random access memory, or a Josephson magnetic random access memory.

5. The superconducting computing system according to claim 1, wherein the computing function includes at least one of the following: central processing function, graphics processing function, artificial intelligence function, gate array function, memory function, or bus interface management function, and wherein the storage function includes at least one of the following: memory function, gate array function, memory controller function, or bus interface management function.

6. The superconducting computing system of claim 1, wherein each of the plurality of circuit traces comprises a superconducting metal.

7. A superconducting computing system, comprising: A housing is disposed within a liquid hydrogen environment, wherein a lower pressure is maintained inside the housing than outside the housing, wherein the lower pressure is 10. -3 drag it up to 10 -10 Within the range between the trays, and wherein the interior of the housing is accessible via a transfer system; A first substrate, inside the housing, is arranged in a first plane, the first substrate having a first surface parallel to the first plane, wherein a first plurality of superconducting components attached to the first surface are configured to provide at least one of computing or storage functions; A second substrate, inside the housing, is arranged in a second plane parallel to the first plane, the second substrate having a second surface parallel to the second plane, wherein a second plurality of superconducting components attached to the second surface are configured to provide at least one of computing or storage functions, and wherein the first substrate further includes a first plurality of circuit traces for interconnecting at least a subset of the first plurality of superconducting components, and wherein the second substrate further includes a second plurality of circuit traces for interconnecting at least a subset of the second plurality of superconducting components, wherein liquid helium inside the housing is configured to cool the environment inside the housing such that each of the first plurality of superconducting components and the second plurality of superconducting components is configured to operate at a first temperature, wherein the first temperature is below 4.2 Kelvin, although the liquid hydrogen environment has a second temperature greater than 4.2 Kelvin; as well as Thermal shielding is configured to provide thermal isolation between at least the first plurality of superconducting components and at least the second plurality of superconducting components arranged inside the housing and the liquid hydrogen environment.

8. The superconducting computing system of claim 7, wherein the second temperature is in the range of 20 Kelvin to 24 Kelvin.

9. The superconducting computing system of claim 7, wherein the liquid hydrogen environment includes a structure containing the liquid hydrogen.

10. The superconducting computing system of claim 7, wherein each of the first plurality of superconducting components and the second plurality of superconducting components comprises at least one of the following: a central processing unit, a graphics processing unit, an artificial intelligence processor, a field-programmable gate array, an application-specific integrated circuit, a dedicated standard product, a system-on-a-chip, a complex programmable logic device, a static random access memory, a dynamic random access memory, or a Josephson magnetic random access memory.

11. The superconducting computing system of claim 7, wherein the computing function includes at least one of the following: central processing function, graphics processing function, artificial intelligence function, gate array function, memory function, or bus interface management function, and wherein the memory function includes at least one of the following: memory function, gate array function, memory controller function, or bus interface management function.

12. The superconducting computing system of claim 7, wherein each of the first plurality of circuit traces and the second plurality of circuit traces comprises a superconducting metal.

13. A superconducting computing system, comprising: First storage tank; A second storage tank containing liquid hydrogen is disposed inside the first storage tank; A supply pipeline for supplying hydrogen to the second storage tank; An evaporation gas discharge line is used to remove evaporation gas from the second storage tank; A cryostat wall is arranged inside the second storage tank, wherein the space surrounded by the cryostat wall is maintained under vacuum, wherein the vacuum corresponds to 10. -3 drag it up to 10 -10 Pressure within the range between the supports; A substrate, inside the wall of the cryostat, wherein a plurality of superconducting components coupled to the substrate are configured to provide at least one of computing or storage functions; and A cooling system is configured to maintain the temperature inside the walls of the cryostat below 4.2 Kelvin, wherein the liquid hydrogen has a second temperature greater than 4.2 Kelvin.

14. The superconducting computing system of claim 13, wherein the liquid hydrogen is maintained at the second temperature in the range of 20 Kelvin to 24 Kelvin.

15. The superconducting computing system of claim 13, wherein each of the plurality of superconducting components comprises at least one of the following: a central processing unit, a graphics processing unit, an artificial intelligence processor, a field-programmable gate array, an application-specific integrated circuit, a dedicated standard product, a system-on-a-chip, a complex programmable logic device, a static random access memory, a dynamic random access memory, or a Josephson magnetic random access memory.

16. The superconducting computing system of claim 13, wherein the computing function includes at least one of the following: central processing function, graphics processing function, artificial intelligence function, gate array function, memory function, or bus interface management function, and wherein the memory function includes at least one of the following: memory function, gate array function, memory controller function, or bus interface management function.

17. The superconducting computing system of claim 13, wherein the substrate includes a plurality of circuit traces configured to interconnect at least a subset of the plurality of superconducting components, and wherein each of the plurality of circuit traces includes a superconducting metal.

18. The superconducting computing system of claim 17, wherein the substrate is coupled to a qubit wafer, and wherein a quantum information processing component is disposed on at least one surface of the qubit wafer.

19. The superconducting computing system of claim 18, wherein the qubit wafer is coupled to a liquid helium heat transfer element.

20. The superconducting computing system of claim 19, wherein at least one set of data cables is coupled to the substrate, and at least one set of alternating current (AC) power cables or direct current (DC) power cables is coupled to power the plurality of superconducting components.

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