A Frit packaging method and device

Abstract

The present invention discloses a Frit packaging method and device, including the following steps: S1: loading a mold on a glass cover plate and positioning the mold; S2: after the mold is positioned, position accuracy needs to be determined; S3: dripping Frit glue or screen printing Frit glue on the glass cover plate; S4: heating the heating component to a temperature between room temperature and 550°C to complete the heating and shaping of the Frit glue; S5: evacuating the mold; S6: applying UV glue around the glass cover plate; S7: aligning and pressing the evaporated TFT substrate with the glass cover plate coated with UV glue; S8: curing the UV glue; S9: laser sintering the Frit glue. The present invention limits the fluidity of the Frit glue in a wet glue state by setting a mold with a hydrophobic coating on the contact surface of the Frit glue and a heating component arranged around the inside, and at the same time, the Frit glue in a wet glue state under an ideal morphology can be shaped in time, so that it can obtain the ideal morphology we want, solving the problem of saddle shape.

Description

Technical Field

[0001] The invention belongs to the technical field of Frit packaging, and in particular relates to a Frit packaging method and a device thereof. Background Art

[0002] Organic Light-Emitting Diode (OLED) has a series of advantages such as high brightness, full viewing angle, fast response speed, wide operating temperature range, and flexible display. It has become a new display technology with great competitiveness and development prospects. The cathode materials and organic light-emitting materials used in OLED devices are particularly sensitive to water vapor and oxygen. If the designed service life of 10,000 hours is to be achieved, the permeability of water and oxygen must be less than 5×10-6g / m 2 ·Daily and 10-3g / m 2 ·day. Water permeability is equal to 10-6g / m 2 ·day is equivalent to allowing only one drop of water to penetrate into an area the size of 6 football fields within 24 hours. In order to effectively block the influence of water and oxygen on OLED devices, the existing OLED packaging includes Getter & Dispenser packaging, Frit packaging, TFE packaging and other packaging technologies. Among them, the Frit packaging process is specifically: using coating (Dispenser) or screen printing (Screen Printer) process to make glass glue on the packaging glass, and baking the packaging glass at high temperature (Frit Seal Bake) to evaporate the solvent in the glass glue, leaving only solid glass powder. After that, the solid glass powder needs to be sintered by laser, re-melted and then solidified to achieve water and oxygen barrier capabilities similar to glass.

[0003] The existing Frit glue drip coating or screen printing process is usually directly coated or screen-printed on the glass cover plate, without a fence around the Frit position. After the glue falls, it often presents a "saddle shape" due to its own viscosity and fluidity. At the same time, since it is drip coated or printed and then baked at high temperature, there is a certain waiting time in between, which is also one of the reasons why the Frit glue presents a "saddle shape" in the wet glue state. And after the next step of high-temperature baking to dry glue, the saddle shape still has no improvement effect, which leads to an unsatisfactory packaging effect and cannot meet the packaging effect requirements of commercially available products. Therefore, it is urgent to develop a Frit packaging method and device that can completely eliminate the saddle shape to improve the packaging effect and meet product requirements. Summary of the invention

[0004] The object of the present invention is to provide a Frit packaging method and device thereof to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a Frit packaging method, comprising the following steps:

[0006] S1: Load the mold on the glass cover plate and position the mold. The contact surface between the mold and the Frit glue is provided with a hydrophobic coating;

[0007] S2: After the mold is positioned, the position accuracy needs to be judged. If the accuracy does not meet the requirements, return to step S1 and reposition the mold until the mold position accuracy meets the requirements;

[0008] S3: drip Frit glue or screen print Frit glue on the glass cover;

[0009] S4: A heating component is arranged around the inner periphery of the mold near the Frit glue coating area, and the heating temperature of the heating component is between room temperature and 550°C to complete the heating and shaping of the Frit glue;

[0010] S5: evacuate the mold;

[0011] S6: Apply UV glue around the glass cover;

[0012] S7: Align and press the evaporated TFT substrate with the glass cover plate coated with UV glue;

[0013] S8: UV glue curing;

[0014] S9: Laser sintering Frit glue is enough.

[0015] The mold positioning uses CCD to measure the position accuracy of the mold, and the accuracy is controlled within 50um.

[0016] The hollowed-out area on the glass cover corresponds to the Frit glue coating area.

[0017] The side of the mold is blocked to prevent the wet Frit glue from flowing to the side to form a saddle shape. At the same time, heating components are arranged around the inner periphery of the mold near the Frit glue coating area, which can be heating wires but are not limited thereto, and the heating temperature is between room temperature and 550°C. When the Frit glue falls on the hollow area of ​​the mold by coating or screen printing, the heating component immediately works to heat the Frit glue immediately to remove the solvent and shape it, avoiding the morphological changes caused by the long static time in the middle.

[0018] The contact surface between the mold and the Frit glue has a hydrophobic coating, which is a hydrophobic material to prevent the Frit glue from sticking to the mold and destroying the morphology of the Frit glue when the mold is removed later. After the heating component shapes the Frit glue, it is also easier to remove the mold.

[0019] The present invention provides a Frit packaging device, comprising a glass cover plate, a mold and a heating component, wherein the mold is mounted on the glass cover plate, a hydrophobic coating is provided on the contact surface of the mold with Frit glue, a plurality of groups of hollow portions are provided on the mold, Frit glue is dripped on the hollow portions or Frit glue is screen-printed, UV glue is provided on the outer side of the Frit glue, and the heating component is arranged on the inner side of the mold.

[0020] A mold is set on the glass cover to limit the position where the Frit glue falls, and heating components are set on the four walls inside the mold. The limiting device is used to prevent the Frit glue from flowing around due to fluidity to form a saddle shape. Then, a scraper is used to scrape off the remaining Frit glue. At the same time, the heating component is immediately started after the Frit glue falls on the glass cover, and high-temperature baking is performed to volatilize the internal flux and fix it, so as to achieve the purpose of completely eliminating its saddle shape.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention provides a Frit packaging method and device thereof, which limits the fluidity of the Frit glue in a wet glue state by setting a mold having a hydrophobic coating on the contact surface with the Frit glue and heating components arranged around the inside, and at the same time can shape the Frit glue in a wet glue state under an ideal morphology in time, so that it can obtain the ideal morphology we want, solving the problem of saddle shape; the mold proposed in this patent can also control the position accuracy of the Frit glue to prevent the Frit glue from falling outside the design range. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the saddle shape of Frit glue;

[0023] Figure 2 It is a three-dimensional schematic diagram of the glass cover plate of the present invention;

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of setting up a mold on the glass cover plate of the present invention;

[0025] Figure 4 It is a schematic diagram of the structure of the mold in the top view of the present invention;

[0026] Figure 5 For the present invention Figure 4 Schematic diagram of the cross-sectional structure at AA in the middle;

[0027] Figure 6 The figure is a flow chart of a Frit packaging method of the present invention.

[0028] In the figure: 1. Frit glue; 2. Glass cover; 3. Mold; 4. Heating component; 5. Hydrophobic coating. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The present invention provides Figure 6 A Frit packaging method comprises the following steps:

[0031] S1: Loading a mold 3 on the glass cover plate 2 and positioning the mold 3. The contact surface between the mold 3 and the Frit glue 1 is provided with a hydrophobic coating 5. When the Frit glue 1 is removed from the mold 3 after being heated and shaped at a high temperature, it will not adhere to produce residual glue, so it will not affect subsequent use;

[0032] S2: After the mold 3 is positioned, the position accuracy needs to be judged. If the accuracy does not meet the requirements, return to step S1 and reposition the mold 3 until the position accuracy of the mold 3 meets the requirements;

[0033] S3: drop-coat Frit glue 1 on the glass cover plate 2 or screen-print Frit glue 1;

[0034] S4: A heating component 4 is arranged around the inner periphery of the mold 3 near the coating area of ​​the Frit glue 1. The heating temperature of the heating component 4 varies according to the requirements of different glue properties, generally 400-550°C, to complete the heating and shaping of the Frit glue 1;

[0035] S5: evacuate the mold 3;

[0036] S6: Apply UV glue around the glass cover plate 2;

[0037] The purpose of this step is: because the Frit glue 1 is only high-temperature fixed at this stage, it needs to be laser sintered later (temperature is generally above 800 degrees Celsius, atmospheric environment) to instantly melt the Frit glue 1 and crystallize it again, so that the glass cover plate 2 and the TFT substrate are bonded together to avoid water vapor penetration. Because OLED devices are very sensitive to water and oxygen, step S7 is completed in an inert gas environment (N2 / Ar). In this process, UV glue needs to be applied first to fix and support the glass cover plate 2 and the TFT substrate, and also protect the [inert gas environment: alignment and pressing → UV] → [atmospheric environment: laser sintering] process from contacting as little water and oxygen in the air as possible in a short period of time;

[0038] S7: Align and press the evaporated TFT substrate with the glass cover plate 2 coated with UV glue;

[0039] S8: UV glue curing;

[0040] S9: Laser sintering Frit glue 1 is enough.

[0041] In the step S1 , the mold 3 is positioned by using CCD to measure the position accuracy of the mold 3 , and the accuracy is controlled within 50 um.

[0042] The hollowed-out area on the glass cover plate 2 in step S3 corresponds to the Frit glue 1 coating area.

[0043] The side of the mold 3 is blocked to prevent the wet Frit glue 1 from flowing to the side to form a saddle shape. At the same time, a heating component 4 is arranged around the inner periphery of the mold 3 near the coating area of ​​the Frit glue 1. The heating component 4 can be a heating wire but is not limited thereto. The heating temperature is between room temperature and 550°C. When the Frit glue 1 falls on the hollow area of ​​the mold by coating or screen printing, the heating component 4 immediately takes effect to heat the Frit glue 1 immediately to remove the solvent and shape it, thereby avoiding the morphological changes caused by the long standing time in the middle.

[0044] The contact surface of the mold 3 and the Frit glue 1 has a hydrophobic coating, and its material is hydrophobic to prevent the mold 3 from sticking to the Frit glue 1 and destroying the morphology of the Frit glue 1 when the mold 3 is subsequently removed. After the heating component 4 shapes the Frit glue 1, it is also more convenient to remove the mold 3.

[0045] The width of the hollowed-out area on the mold 3 (i.e., the area where Frit coating or screen printing is defined) is defined as: 0.2-2mm; the height of the mold 3 (i.e., the height of the Frit glue 1) is defined as: 3-10um.

[0046] The present invention provides Figure 1-5 A Frit packaging device comprises a glass cover plate 2, a mold 3 and a heating component 4, wherein the mold 3 is mounted on the glass cover plate 2, and a plurality of hollow portions are provided on the mold 3, and Frit glue 1 is dripped or screen-printed on the hollow portions, UV glue is provided on the outer side of the Frit glue 1, and the heating component 4 is arranged on the inner side of the mold 3.

[0047] A mold 3 is set on the glass cover plate 2 to limit the falling position of the Frit glue 1, and a heating component 4 is set on the four walls inside the mold 3. The limiting device is used to limit the Frit glue 1 from flowing around due to fluidity to form a saddle shape. Then, the residual Frit glue 1 is scraped off with a scraper. At the same time, the heating component 4 is immediately started after the Frit glue 1 falls on the glass cover plate 2, and the internal flux is volatilized and fixed by high-temperature baking, so as to achieve the purpose of completely eliminating its saddle shape.

[0048] In summary, compared with the prior art, the present invention limits the fluidity of the Frit glue 1 in a wet glue state by providing a mold 3 having a hydrophobic coating on the contact surface with the Frit glue 1 and heating components 4 arranged around the inside, and at the same time, the Frit glue 1 in a wet glue state with an ideal morphology can be shaped in time to obtain the ideal morphology we want, thus solving the saddle shape problem; the mold 3 proposed in this patent can also control the position accuracy of the Frit glue 1 to prevent the Frit glue 1 from falling outside the design range.

[0049] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A Frit packaging method, characterized in that: A packaging device for a Frit packaging method, comprising a glass cover plate (2), a mold (3) and a heating component (4), wherein the mold (3) is mounted on the glass cover plate (2), a plurality of hollow portions are provided on the mold (3), Frit glue (1) is dripped onto the hollow portions or the Frit glue (1) is screen-printed, UV glue is provided on the outer side of the Frit glue (1), and the heating component (4) is arranged on the inner side of the mold (3); The Frit packaging method includes the following steps: S1: loading a mold (3) on a glass cover plate (2) and positioning the mold (3), wherein a hydrophobic coating (5) is provided on a contact surface between the mold (3) and the Frit glue (1); S2: After the mold (3) is positioned, the position accuracy needs to be judged. If the accuracy does not meet the requirements, return to step S1 and reposition the mold (3) until the position accuracy of the mold (3) meets the requirements; S3: applying Frit glue (1) by drop coating or screen printing Frit glue (1) on the glass cover plate (2); S4: A heating component (4) is arranged around the inner periphery of the mold (3) near the coating area of ​​the Frit glue (1). The heating temperature of the heating component (4) is between room temperature and 550° C. After the Frit glue (1) falls onto the glass cover plate (2), the heating component (4) is immediately started to complete the heating and shaping of the Frit glue (1); S5: evacuate the mold (3); S6: Apply UV glue around the glass cover plate (2); S7: Align and press the evaporated TFT substrate and the glass cover plate (2) coated with UV glue; S8: UV glue curing; S9: Laser sintering Frit glue (1) is enough.

2. A Frit packaging method according to claim 1, characterized in that: In the step S1, the mold (3) is positioned using a CCD to measure the position accuracy of the mold (3), and the accuracy is controlled within 50 um.

3. A Frit packaging method according to claim 1, characterized in that: The hollowed-out portion on the glass cover plate (2) in step S3 corresponds to the Frit glue (1) coating area, and the width of the hollowed-out portion is 0.2-2 mm.

4. A Frit packaging method according to claim 1, characterized in that: The heating component (4) is a heating wire.

5. A Frit packaging method according to claim 1, characterized in that: The height of the mold (3) is consistent with the height of the Frit glue (1), both of which are 3-10 um.

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